TS140S_user
Securope Tempo 用户手册说明书
User Manual Securope Tempo DOC104-UK -11.09.201.CertificationThe Securope lifelines are designed and tested according to the European standard:E N795-C:2012The system conforms to the American National regulation,OSHA 1910If the system is designed and installed by a competent person (according to OSHA), it may conform to the ANSI standard,ANSI/ASSE Z359.6: 2009Here below the available certifications which can be downloaded anytime from our web portal: Securope 2012Standard BEN795-C:2012 - CEN/TS16415:2013CertificatesNumber N°0082 1084 160 04 14 0116 : EXT 02 06 15 Certification Date2015Notified bodyCode0082Address Apave Sudeurope, Centre d’essais et certification EPI, 17, Boulevard Paul Langevin, 38600Fontaine, France2. Preliminary checksIt is mandatory to check the following before using the system:U S E R✓ The user of the lifeline must be in good physical condition, and not prone to vertigo or dizziness.✓ The user must have received adequate training for the following:- Personal protection equipment and have read the user instructions of theelements associated to the system, the harness and the connectors/carabiners. - Use of the fall protection equipment, - Use of the rescue equipment in the event of fall.✓ The total mass of each user, including tools and equipment, must not exceed 140 kg.✓ A minimum of 2 persons are required to work together on the lifeline, so that each can assist the other in the event of an incident.P P E ✓ A suitable harness with two anchoring points or D rings, one at the back and one at the chest, in conformity with the EN 361 or ANSI / ASSEZ359.1.✓ The dorsal anchorage point is the recommended point to anchor the harness, the sternal anchorage point can be used for rescue operations,✓ An energy absorber lanyard in conformity with EN 354/355 or ANSI/ASSEZ359.13. It cannot be longer than 2m (6.5ft),✓ Two karabiners twist lock type in zinc plated steel, according to EN 362ANSI/ASSEZ359.12 and having the following characteristics, length 105 mm, width 58 mm, wire diameter 10 mm, opening 20 mm, breaking strength 23 kNS Y S T E M ✓ Check if the annual inspection was carried out within less than 1 year.✓ Check if the Pre-use inspection sheet is completed and the system is Safe to use. ✓ There is no obstacle under the walkway that could reduce the fall clearance ; ✓ If there are tilting end stops, they must be tested and must work properly ; ✓ There are no deformed components.✓ A rescue plan must be in place to evacuate the person who fell within 15 minutes. The rescue material must be easily accessible and be located in the vicinity from the lifeline.✓ The system must be immediately put out of service if the user notices one or more anomalies and the failing components have to be replaced by a certified installer (Also competent person if under OSHA regulations)Any other combination of components can affect the correct functioning of the system and is consequently forbidden.Before using the system, the user must locate the ID-plate installed in the immediate vicinity of the access point and follow the instructions on the board. The plate has a QR code that facilitates access to the Fallprotec web portal where all the data regarding the installation is registered. User manual and inspection log.1.Manufacturer’s information2.QR code to get directaccess to the informationrelated to the installation.3.Equipment type and appliedstandards.4.Installer details5.Installation locationinformations.6.It is mandatory to use a fallarrest harness with anenergy absorbing systemaccording to EN355.7.Seal tag serial number.8.Maximal number of usersand their max. weight.9.Installation Date10.It is mandatory to read theuser manual first.11.Fall clearance and Systemlength12.Inspection sticker (Safe touse)A seal Tag with a unique serialnumber is placed on the warningplate.612345789101112e of the system Maximal number of users persystem(For other cases please contactFallprotec)2The connection and disconnection to the system mustalways be carried out in an area without any risk of a fall.1Introduce the mobile anchorage device on the Lifeline incase it is not a captive one.2The user moves smoothly all along the lifeline withoutrunning.3The carabiner of the lanyard must be fixed directly to themobile anchorage device. **5To exit from the system (if the device is not openable),the user must take it out at the end of the line withthrough a tilting end stop. (If the glider is openable andreachable, it should be stored in a dry place)** If the system has no intermediate anchors, user canconnect directly to the lifeline with a carabiner. It must havethe following characteristics: twist lock type in zinc platedsteel, according to EN 362 / ANSI/ASSEZ359.12 , length 105mm, width 58 mm, section of 10 mm, opening 20 mm,breaking strength 23 kN3.1. GlidersThe user can walk as far from the line as his/her lanyard and the system itself allow it.The glider by gravity takes the correct position to pass over the intermediate anchors without needing any additional manual action.LDV001 LDV111 LDV001 LDV07530°- 90°3.1.1. Openable gliders1.Open the handle2.Let the handle close automatically3. Conect the carabinerHandleInserting/removing the glider on the line3.2.Energy absorber LDV032/LDV003The energy absorption is carried out during the penetration of the half sphere into the black polymer cylinder. The LDV032 includes a spring which compensates the tension on the line in case of dilatations and acts as a tensionActivatedNot activated4.Coiling the cable for storage The cable must be coiled as per the picture below:5.In case of fallMaximum deformation Calculated with the Fallprotec Securope calculation software. See technical file of the system supplied by the installer.6.Fall ClearanceThe installation must be done so that in case of a fall no equipment touches a sharp edge or something that can damage it.The minimum clearance must be superior of the height of fall so that a falling user doesn’t hit an obstacle during the fall.The height of fall is the sum of the terms given below:-D Deflection : the deflection of the rigid anchor line-L blocking : Locking distance of self retractable lanyard-H Safety : safety distance (1m)-Fall clearance Required : minimal height calculated and required in case of a fall-Fall clearance Available : actual height available between the path and the first obstacle -L Path : distance from the Life line to the edge-L Lanyard : lenght of the lanyard (< 2m)-L Absorber : deployment of the energy absorption system (< 0,8m)-H User : user’s heightF a l l c l e a r a n c e A v a i l a b l eFall clearance Required = D Deflection + L Lanyard + L Absorber - L Path + H User + H SafetyFall clearance Required < Fall clearance AvailableF a l l c l e a r a n c e A v a i l a b l eFall clearance Required = D Deflection + L Lanyard + L Absorber + H User + H Safety - H LineFall clearance Required < Fall clearance AvailableFallcl earance A va i l ab l eFall clearance Required = D Deflection + L blocking + H SafetyFall clearance Required < Fall clearance Available7.Prohibited useIt is forbidden to use the system out of the limits specified in this manual or in any othersituation different for the ones the system has been foreseen.Exceed the maximal number of users between on the system.It is forbidden to use the system with any other element, for which the system wascommissioned for.It is forbidden to use the system under the walkway.It is forbidden to use the system for lifting materials.In case of storm or any other exceptional climate conditions potentially dangerous.Temperature below -50°C.It is forbidden to use the system as earth phase for welding.8.WarningsMarking of the equipment must be always visible.Any modification of the system or equipment cannot be made without prior writtenauthorization of FALLPROTEC.9.MaintenanceThe durability of the system is function of the maintenance and the frequency (and intensity) of use. It will also depend of the host structure and its capacity to keep its physical properties during the time. If the anchorage device is used in a dusty environment, mobile anchor devices need to be cleaned with soapy water. The lifeline is cleaned with soapy water or solvent if the environment is not flammable. It must be thereafter dried.The system must be stored in a dry place.If the system is maintained, inspected, and used properly, the foreseen lifespan is 10 years.10.InspectionBefore use, each system must be checked by a competent person following the Pre-use checking list. If everything is correct, the warning plate will have the sticker “safe to use”.Each system must be inspected annually or after a fall.The inspection must be carried out by a certified/authorized installer (Also competent person if under OSHA regulations).The inspection must be registered on the Fallprotec portal The safety of the user is linked to the maintenance of the efficacy of the system and the resistance of the equipment.11. MarkingThe equipment is marked as follows:❶ Manufacturer :❷ Component name :❸ Standard : EN795-C❹ It is mandatory to read the user manual before use ❺ Manufacturing batch (Quarter/Year)Code ComponentLDV002LDV032LDV001LDV060LDV111❶ ❸❹❺ ❺ ❶ ❶❸ ❹ ❺❶❸ ❹❺ ❶❸❹❺。
300 Series User Manual
25-0163 Rev 03Table of Contents300S ERIES,M ODEL &P ART N UMBERS (2)S YMBOL I NFORMATION (3)P RODUCT L ABELING (3)G ENERAL S PECIFICATION (4)P OWER M ONITORING &C ONTROL,W I-F I C ONNECTION (5)S AFETY R ECOMMENDATIONS AND W ARNINGS (6)P ROPER O PERATION,C ARE &M AINTENANCE (7)B ASIC M OBILE C ART I NTEGRATION &O PERATION (8)U NPACKING &A SSEMBLY: (8)C HANGING THE H EIGHT P OSITION: (8)I NSTALLING YOUR COMPUTER OR LAPTOP: (8)I NSTALLING S TAND AND LCD M ONITOR: (9)I NSTALLING S CANNER M OUNTS: (10)I NSTALLING K EYBOARD AND M OUSE ONTO THE C ART: (10)O PTIONAL JACO P ATENTED T RAC™W HEEL S TEERING: (10)K EYBOARD L IGHT: (11)O PTIONAL L OCKING D RAWER O PERATION: (11)P OWER B LADE B ATTERY P ACK &C ART C ONTROLLER (12)P OWER B LADE C HARGER (14)A GENCY C ERTIFICATION (14)T ROUBLESHOOTING (15)H AVE A QUESTION? W E’RE HERE TO HELP.C ALL US AT 1‐800‐649‐2278 OR VISIT /SUPPORTJACO I NC. 140 C ONSTITUTION B LVD, F RANKLIN MA, USA1General SpecificationMobile CartWork Surface Height:30" to 46"Keyboard Height:25.5" to 41.5"Work Surface:310 Laptop Cart ‐ 20" x 18" (Laptop opening 16.5" x 2.75") 320 PC Cart ‐ 20" x 16"Internal Laptopor PC Storage: 310 Laptop Cart ‐ 16" x 12" x 2.25" 320 PC Cart ‐ 16" x 12" x 2.6"Casters:4" Single Wheel, Front LockingWheel Base:16" x 13" x 16"Cart Weight: (without options) 310 Laptop Cart ‐ 86 lbs (includes 2 Power Blade Battery Packs & base counterweight)320 PC Cart ‐ 91 lbs (including 2 Power Blade Battery Packs & base counter weight)Additional weight may be added based on Cart configuration & optionsPower Blade Battery:Included in top levels 310‐L408 & 320‐L408 Can be ordered as line item 51‐3829Physical ‐ 7" x 3.5" x 6" and 5 lbs.Power Blade Charger:Must order as line item 51‐4218Wall Mount Physical ‐ 17.25" x 8.0” x 4.0" and 6 lbs.Free Standing Physical ‐ 17.25" x 8.7” x 6.8" and 7 lbs.4If your JACO Mobile Cart has a Drawer System option, limit weight per drawer to 2 lbs max, close drawers when moving and do not transport at more than a 5-degree slope.Inspect the inside bays of the Cart Controller and Power Blade Charger as needed or weekly, remove the Power Blade Battery Packs to inspect the connections. Remove material that may have accidently droppedbut if required, make sure the Power Blade ChargerInstalling your computer or laptop:To install your PC or Laptop, unlock both key‐locks at the rear of the top assembly as shown in the photoTouch Pad Access, Front of Mobile CartThe Power Blade Battery Pack ports on the Mobile Cart are labeled as Battery 1 and Battery 2. Each port has two LED indicators that show approximately how much battery charge is remaining. The LED indicators are located at the front and rear of the Cart. This simple LED readout reports approximate Front LED Charge Capacity Indicators Rear LED Charge Capacity IndicatorsPower InverterOptional for Electronic LockingPower Blade ChargerThe Power Blade Charger can be placed on a tabletop or installed on the wall for convenient point ofuse access. With either installation, the Power Blade Charger MUST be positioned vertically, with thePower Blade Battery Packs entering from the top and will not function if positioned in any otherdirection. For complete details and instructions, please reference the Power Blade Charger UsersGuide that is shipped with each unit. This manual is also available on request.Agency Certification51‐4218, Power Blade ChargerSafety ‐ IEC 60601, 3rd Edition (60601‐1:2005 A1:2012)IEC 60601‐1EN/ISO 14971EMI / EMC (60601‐1:2005 A1:2012)IEC 60601‐1‐2Means of isolation provided by on‐board power supply.51‐3829, Power Blade Battery Pack AssemblyIATA ‐ UNDOT 38.3 International Air Transport AssociationIEC 62133 ‐ Safety Requirement for Cells Containing Alkaline ElectrolytesUL 2054 ‐ UL Certification for Primary and Secondary BatteriesH AVE A QUESTION? W E’RE HERE TO HELP.C ALL US AT 1‐800‐649‐2278 OR VISIT /SUPPORTJACO I NC. 140 C ONSTITUTION B LVD, F RANKLIN MA, USAThe Mobile Cart front battery status LEDs are not working however the Remove and reinstall the same Power Blade Battery Packs that are currently in the Cart, if the LED's still do。
74AC14 六角施密特触发器
© 2005 Fairchild Semiconductor Corporation DS009917November 1988Revised February 200574AC14 • 74ACT14 Hex Inverter with Schmitt Trigger Input74AC14 • 74ACT14Hex Inverter with Schmitt Trigger InputGeneral DescriptionThe 74AC14 and 74ACT14 contain six inverter gates each with a Schmitt trigger input. They are capable of transform-ing slowly changing input signals into sharply defined, jitter-free output signals. In addition, they have a greater noise margin than conventional inverters.The 74AC14 and 74ACT14 have hysteresis between the positive-going and negative-going input thresholds (typi-cally 1.0V) which is determined internally by transistor ratios and is essentially insensitive to temperature and sup-ply voltage variations.Featuress I CC reduced by 50%s Outputs source/sink 24 mAs 74ACT14 has TTL-compatible inputsOrdering Code:Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.Pb-Free package per JEDEC J-STD-020B.Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.FACT ¥ is a trademark of Fairchild Semiconductor Corporation.Order Number Package Package DescriptionNumber 74AC14SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74AC14SCX_NL (Note 1)M14A Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74AC14SJ M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide74AC14MTC MTC1414-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74AC14MTCX_NL (Note 1)MTC14Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74AC14PC N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 74ACT14SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74ACT14MTC MTC1414-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74ACT14MTCX_NL (Note 1)MTC14Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74ACT14PCN14A14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 274A C 14 • 74A C T 14Logic SymbolIEEE/IECPin DescriptionsConnection DiagramFunction TablePin Names Description I n Inputs O nOutputsInput Output A O L H HL74AC14 • 74ACT14Absolute Maximum Ratings (Note 2)Recommended Operating ConditionsNote 2: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, with-out exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation of FACT ¥ circuits outside databook specifications.DC Electrical Characteristics for ACNote 3: All outputs loaded; thresholds on input associated with output under test.Note 4: Maximum test duration 2.0 ms, one output loaded at a time.Note 5: I IN and I CC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V V CC .Supply Voltage (V CC ) 0.5V to 7.0VDC Input Diode Current (I IK )V I 0.5V 20 mA V I V CC 0.5V 20 mADC Input Voltage (V I )0.5V to V CC 0.5VDC Output Diode Current (I OK )V O 0.5V 20 mA V O V CC 0.5V 20 mADC Output Voltage (V O ) 0.5V to V CC 0.5VDC Output Source or Sink Current (I O )r 50 mA DC V CC or Ground Current per Output Pin (I CC or I GND )r 50 mAStorage Temperature (T STG ) 65q C to 150q CJunction Temperature (T J )PDIP140q CSupply Voltage (V CC )AC 2.0V to 6.0V ACT4.5V to5.5V Input Voltage (V I )0V to V CC Output Voltage (V O )0V toV CCOperating Temperature (T A )40q C to 85q CSymbol ParameterV CC T A 25q C T A 40q C to 85q C UnitsConditions(V)Typ Guaranteed LimitsV OHMinimum HIGH Level 3.0 2.99 2.9 2.9V I OUT 50 P AOutput Voltage4.5 4.49 4.4 4.45.5 5.495.4 5.43.0 2.56 2.46V I OH 124.5 3.86 3.76I OH 24 mA5.54.86 4.76I OH 24 mA (Note 3)V OLMaximum LOW Level 3.00.0020.10.1VI OUT 50 P AOutput Voltage4.50.0010.10.15.50.0010.10.13.00.360.44VI OL 124.50.360.44I OL 24 mA5.50.360.44I OL 24 mA (Note 3)I IN (Note 5)Maximum Input Leakage Current 5.5r 0.1r 1.0P A V I V CC , GND V tMaximum Positive 3.0 2.2 2.2T A Worst CaseThreshold4.5 3.2 3.2V5.5 3.9 3.9V tMinimum Negative 3.00.50.5T A Worst CaseThreshold4.50.90.9V5.5 1.1 1.1V H(MAX)Maximum Hysteresis3.0 1.2 1.2T A Worst Case4.5 1.4 1.4V5.51.6 1.6V H(MIN)Minimum Hysteresis3.00.30.3T A Worst Case4.50.40.4V5.50.50.5I OLD Minimum Dynamic 5.575mA V OLD 1.65V Max I OHD Output Current (Note 4) 5.5 75mA V OHD 3.85V Min I CC Maximum Quiescent 5.52.020.0P AV IN V CC (Note 5)Supply Currentor GND 474A C 14 • 74A C T 14AC Electrical Characteristics for ACNote 6: Voltage Range 3.3 is 3.3V r 0.3VVoltage Range 5.0 is 5.0V r 0.5VDC Electrical Characteristics for ACTNote 7: All outputs loaded; thresholds on input associated with output under test.Note 8: Maximum test duration 2.0 ms, one output loaded at a time.Symbol ParameterV CCT A 25q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF (Note 6)Min Typ Max Min Max t PLH Propagation Delay 3.3 1.59.513.5 1.515.0ns 5.0 1.57.010.0 1.511.0t PHLPropagation Delay3.3 1.57.511.5 1.513.0ns 5.01.56.08.51.59.5Symbol ParameterV CC T A 25q C T A 40q C to 85q C Units Conditions(V)Typ Guaranteed LimitsV IH Minimum HIGH Level 4.5 1.5 2.0 2.0V V OUT 0.1V Input Voltage5.5 1.5 2.0 2.0or V CC 0.1V V IL Maximum LOW Level 4.5 1.50.80.8V V OUT 0.1V Output Voltage 5.5 1.50.80.8or V CC 0.1V V OHMinimum HIGH Level 4.5 4.49434 4.4VI OUT 50P A Output Voltage5.5 5.495.4 5.4VV IN V IL or V IH4.5 3.86 3.76I OH 24 mA5.54.864.76I OH 24 mA (Note 7)V OLMaximum LOW Level 4.50.0010.10.1VI OUT 50 P A Output Voltage5.50.0010.10.1V V IN V IL or V IH4.50.360.44I OL 24 mA5.50.360.44I OL 24 mA (Note 7)I IN Maximum Input Leakage Current 5.5r 0.1r 1.0P A V I V CC , GND V H(MAX)Maximum Hysteresis 4.5 1.4 1.4V T A Worst Case 5.5 1.6 1.6V H(MIN)Minimum Hysteresis 4.50.40.4V T A Worst Case 5.50.50.5V t Maximum Positive 4.5 2.0 2.0V T A Worst Case Threshold 5.5 2.0 2.0V t Minimum Negative 4.50.80.8V T A Worst Case Threshold5.50.80.8I CCT Maximum I CC /Input 5.50.61.5mA V I V CC2.1V I OLD Minimum Dynamic 5.575mA V OLD 1.65V Max I OHD Output Current (Note 8) 5.5 75mA V OHD 3.85V Min I CCMaximum Quiescent 5.52.020.0P AV IN V CC Supply Currentor GND74AC14 • 74ACT14AC Electrical Characteristics for ACTNote 9: Voltage Range 5.0 is 5.0V r 0.5VCapacitanceSymbol Parameter V CCT A 25q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF (Note 9)Min Typ Max Min Max t PLH Propagation Delay 5.0 3.08.010.0 3.011.0ns Data to Output t PHLPropagation Delay 5.03.08.010.03.011.0ns Data to OutputSymbol ParameterTyp Units ConditionsC IN Input Capacitance4.5pF V CC OPEN C PDPower Dissipation Capacitance for AC25.0pFV CC 5.0Vfor ACT80 674A C 14 • 74A C T 14Physical Dimensions inches (millimeters) unless otherwise noted14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" NarrowPackage Number M14A74AC14 • 74ACT14Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M14D 874A C 14 • 74A C T 14Physical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC14974AC14 • 74ACT14 Hex Inverter with Schmitt Trigger InputPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N14AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
工厂专有名词中英文对照表
Contract Electronic Manufacturing Customer Focus Executive Cost,Insurance,and Freight Carriage and Insurance Paid TO Common Management Information Protocol Cost of Goods Sold Component Purchase Agreement Carriage Paid to Change Request Customer Service Division Customer Selling Price Configure To Order Full Descripition Delivered At Frontier Document Center Delivered Duty Paid Delivered Duty Unpaid Design For Assembly Design For Manufacture Dead on Arrival Defect Per Hunderd Unit Defect Per Percent Million Dynamic Random Access Memory Design For Test Design For X(test,manufacture,assembly) Dual in-line Package Domain Name System Defect per Million Desktop Design TO Cost Design Verification Test Full Descripition End to End Engineering Change Engineering Change Management Engineering Change Notice Engineering Change Order Engineering Change Request Engineering Directive Enhanced Industrial Standard Architecture Early Life Performance Test Environment Protection Association Erasable Programable Read Only Memory Engineering Specification
BD139-10;BD136-16;BD139-16;BD140;BD139;中文规格书,Datasheet资料
May 2008Rev 51/9BD135 - BD136BD139 - BD140Complementary low voltage transistorFeatures■Products are pre-selected in DC current gainApplication■General purposeDescriptionThese epitaxial planar transistors are mounted in the SOT -32 plastic package. They are designed for audio amplifiers and drivers utilizingcomplementary or quasi-complementary circuits. The NPN types are the BD135 and BD139, and the complementary PNP types are the BD136 and BD140.Table 1.Device summaryOrder codes Marking Package PackagingBD135BD135SOT -32TubeBD135-16BD135-16BD136BD136BD136-16BD136-16BD139BD139BD139-10BD139-10BD139-16BD139-16BD140BD140BD140-10BD140-10BD140-16BD140-16Contents BD135 - BD136 - BD139 - BD140Contents1Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42.1Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82/9BD135 - BD136 - BD139 - BD140Electrical ratings3/91 Electrical ratingsTable 2.Absolute maximum ratingsSymbolParameterValueUnitNPNPNPBD135BD139BD136BD140V CBO Collector-base voltage (I E = 0)4580-45-80V V CEO Collector-emitter voltage (I B = 0)4580-45-80V V EBO Emitter-base voltage (I C = 0)5-5V I C Collector current 1.5-1.5A I CM Collector peak current 3-3A I B Base current0.5-0.5A P TOT Total dissipation at T c ≤ 25 °C 12.5W P TOT Total dissipation at T amb ≤ 25 °C 1.25W T stg Storage temperature-65 to 150°C T jMax. operating junction temperature150°CTable 3.Thermal dataSymbolParameterMax valueUnit R thj-case Thermal resistance junction-case 10°C/W R thj-amb Thermal resistance junction-ambient100°C/WElectrical characteristics BD135 - BD136 - BD139 - BD1404/92 Electrical characteristics(T case = 25 °C unless otherwise specified)Table 4.On/off statesSymbolParameterPolarityTest conditionsValueUnitMin.Typ.Max.I CBOCollector cut-off current (I E =0)NPN V CB = 30 VV CB = 30 V , T C = 125 °C 0.110µA µA PNP V CB = -30 VV CB = -30 V , T C = 125 °C -0.1-10µA µA I EBOEmitter cut-off current (I C =0)NPN V EB = 5 V 10µA PNP V EB = -5 V -10µA V CEO(sus)(1)1.Pulsed: pulse duration = 300 µs, duty cycle 1.5%Collector-emittersustaining voltage(I B =0)NPNI C = 30 mA BD135BD1394580V V PNP I C = -30 mA BD136BD140-45-80V V V CE(sat) (1)Collector-emitter saturation voltage NPN I C = 0.5 A, I B = 0.05 A 0.5V PNP I C = -0.5 A, I B = -0.05 A -0.5V V BE (1)Base-emitter voltageNPN I C = 0.5 A, V CE = 2 V 1V PNP I C = -0.5 A, V CE = -2 V -1V h FE (1)DC current gainNPNI C = 5 mA, V CE = 2 V I C = 150 mA, V CE = 2 V I C = 0.5 A, V CE = 2 V 254025250PNPI C = -5 mA, V CE = -2 V I C = -150 mA, V CE = -2 V I C = -0.5 A, V CE = -2 V 254025250h FE (1)h FE groupsNPNI C = 150 mA, V CE = 2 V BD139-10BD135-16/BD139-1663100160250PNPI C = -150 mA, V CE = -2 V BD140-10BD136-16/BD140-1663100160250BD135 - BD136 - BD139 - BD140Electrical characteristics 2.1 Electrical characteristics (curves)Figure 2.Safe operating area Figure 3.Derating5/9Package mechanical data BD135 - BD136 - BD139 - BD140 3 Package mechanical dataIn order to meet environmental requirements, ST offers these devices in ECOPACK®packages. These packages have a lead-free second level interconnect. The category ofsecond level interconnect is marked on the package and on the inner box label, incompliance with JEDEC Standard JESD97. The maximum ratings related to solderingconditions are also marked on the inner box label. ECOPACK is an ST trademark.ECOPACK specifications are available at: 6/9BD135 - BD136 - BD139 - BD140Package mechanical data7/9Revision history BD135 - BD136 - BD139 - BD1408/94 Revision historyTable 5.Document revision historyDate RevisionChanges16-Sep-2001422-May-20085Mechanical data has been updated.BD135 - BD136 - BD139 - BD140Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERM S AND CONDITIONS OF SALE ST DISCLAIM S ANY EXPRESS OR IM PLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIM ITATION IM PLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2008 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America9/9分销商库存信息:STMBD139-10BD136-16BD139-16 BD140BD139BD135-16 BD135。
1W Amber SPHAM2A1N1C0高功率LED FX系列产品数据表说明书
111 Product Family Data Sheet Rev. 1.1 2020.05.041W AmberSPHAM2A1N1C0Features∙Package : Phosphor converted Amber LED package∙Dimension : 1.2 mm x 1.6 mm∙Chip Configuration : 1 chip∙ESD Voltage : Up to 8 kV acc. to ISO 10605-contact∙Viewing Angle: 120˚∙Qualifications: The product qualification test based on the guidelines of AEC-Q102.Table of Contents1. Characteristics ----------------------- 32. Product Code Information ----------------------- 43. Typical Characteristics Graphs ----------------------- 74. Soldering Temperature Location ----------------------- 115. Mechanical Dimension ----------------------- 126. Soldering Conditions ----------------------- 137. Tape & Reel ----------------------- 148. Label Structure ----------------------- 159. Packing Structure ----------------------- 1610. Precautions in Handling & Use ----------------------- 1711. Company Information ----------------------- 181. Characteristicsa) Typical Characteristics[1]Item Symbol Value Unit. Luminous Flux (I F = 350 ㎃) ΦV Typ. 85 ㏐Forward Voltage (I F = 350 ㎃) V F Typ. 3.0 VViewing Angle ΦTyp. 120 ºReverse Current I R Not designed for reverseoperationReal Thermal Resistance (Junction to Solder point) R th_J-S (Real)Typ. 7.6K/WMax. 8.2Electrical Thermal Resistance (Junction to Solder point) R th_J-S (Elec.)Typ. 6.0K/WMax. 6.5Radian Surface A 0.7 mm2Note:[1] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25㎳.b) Absolute Maximum RatingItem Symbol Rating UnitAmbient / OperatingTemperatureT a-40 ~ +125 ºC Storage Temperature T stg-40 ~ +125 ºC LED Junction Temperature T j150 ºC Maximum Forward current[2](T S:25℃) [3]I F700 ㎃Minimum Forward current[2](T S:25℃) [3]I F50 ㎃Maximum Reverse currentDo not apply for reverse currentESD Sensitivity[4]- ±8 for HBM kVNote:[2] Driving the product at forward current (IF) below Min. IF or above Max. IF may result in unpredictable behavior of the product.[3] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25㎳[4] It is included the device to protect the product from ESD.2. Product Code Information1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18S P H A M 2 A 1 N 1 C 0 A B C D E F Digit PKG Information1 2 company name and Samsung LED PKG (SP for Samsung PKG)3 power variant (H for automotive high power)4 5 color variant (AM for automotive Amber color)6 LED PKG version (2 for 2nd version )7 8 product configuration and type (A1 for automotive PKG type)9 lens configuration (N for no lens)10 Max power (1 for 1±0.5W)11 12 specific property (C0 for FX Series)13 14 forward voltage property15 16 CIE coordination property17 18 luminous flux propertya) Luminous Flux Bins [5] (I F= 350 ㎃, T S= 25 ºC)Symbol Flux Bin CodeFlux Range (㏐)Min Max ΦVE1 80 90F1 90 100 b) Voltage Bins [5] (I F= 350 ㎃, T S= 25 ºC)Symbol Bin CodeVoltage Range (V)Min MaxV FC5 2.50 3.00H5 3.00 3.50Note:[5] Luminous flux measuring equipment: CAS140CTΦV and V F tolerances are ±7% and ±0.1V, respectively.c) Color Bin [6] (I F= 350 mA)Symbol Bin Code C x C yC x, C y L0 0.5760 0.5490 0.5620 0.5890 0.4070 0.4250 0.4380 0.4110[6] Chromaticity coordinates: C x, C y according to CIE 1931. C x and C y tolerances are ±0.005, respectively.3. Typical Characteristics Graphsa) Spectrum Distribution (I F = 350 mA, T s = 25 ºC) [7]b) Typical Chromaticity Coordinate Shift vs Radiation Angle (I F = 350 mA, T s = 25 ºC) [7]Note:[7] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms.0.00.20.40.60.81.01.2380430480530580630680730780R e l a t i v e I n t e n s i t yWavelengthλ[㎚]-0.010.000.010.020.030.040.05-80-60-40-2020406080C h r o m a t i c i t y C o o r d i n a t e S h i f tRadiation Angle△Cx △Cyφ[º]∆C x , ∆C yW d W d(max)c) Forward Current Characteristics (T S = 25 ºC) [8]Note:[8] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25㎳0.00.40.81.21.62.00100200300400500600700R e l a t i v e L u m i n o u s F l u xForward Current0.80.91.01.1100200300400500600700R e l a t i v e F o r w a r d V o l t a g eForward Current-0.004-0.0020.0000.0020.0040100200300400500600700C h r o m a t i c i t y C o o r d i n a t e S h i f tForward CurrentI v I v(350mA)V F V F(350mA)∆C x , ∆C yI F [㎃]I F [㎃]I F [㎃]d) Temperature Characteristics (I F = 350 ㎃)0.60.70.80.91.01.11.2-40-2020406080100120140R e l a t i v e L u m i n o u s F l u xTemperature0.900.951.001.051.10-40-2020406080100120140R e l a t i v e F o r w a r d V o l t a g eTemperature-0.04-0.020.000.020.04-40-20020406080100120140C h r o m a t i c i t y C o o r d i n a t e S h i f tTemperature△Cx △CyI v I v(25℃)V F V F(25℃)∆C x , ∆C yT j [ºC]T j [ºC]T j [ºC]e) Derating Curve [9]Note:[9] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25㎳.f) Beam Angle Characteristics (I F = 350 ㎃, T S = 25 ºC)0.00.10.20.30.40.50.60.70.80102030405060708090100110120130140F o r w a r d C u r r e n tTemperature0.00.20.40.60.81.01.2-80-70-60-50-40-30-20-101020304050607080R e l a t i v e L u m i n o u s F l u xRadiation AngleI F [A]T S [ºC]I v I v(0º)φ[º]4. Soldering Temperature LocationT j: Temperature of JunctionT S: Temperature of Solder PadR th_J-S: Thermal Resistance from Junction to Solder Pad5. Mechanical DimensionNote:The dimensions in parentheses are for reference purposes. Notes: Unit: mm, Tolerance: ±0.1mm, Approximate Weight : 3.2mga) Pick and PlaceDo not place pressure on the resin molded partIt is recommended to use a pick & place nozzle AM03-024820A(Hanhwa Techwin), etc.b) Electric Schematic Diagramc) Material InformationDescriptionMaterialSubstrate Cu Lead FrameLED Die Flip Chip Phosphor Phosphor Zener DiodeSilicon Wire Au Resin MoldSiliconeTolerance: ±0.1㎜① Cathode pad ② Anode pad ① ②6. Soldering Conditionsa) Pad Configuration & Solder Pad LayoutNotes: Tolerance : ±0.10㎜, recommended stencil thickness 120㎛Unit: ㎜b) Reflow Conditions (Pb free)Reflow frequency: 2 times max.c) Manual Soldering ConditionsNot more than 5 seconds @ max 300 ºC, under soldering iron. (One time only)7. Tape & Reela) Taping DimensionNote:Unit: ㎜, LED taping quantity: 3,000ea (1 Reel)b) Reel DimensionNotes:Unit: ㎜, Tolerance: ±0.2㎜User feed direction →Bin CodeProduct CodeLot NumberABCDEFSPHWH2A1N1C0XXXXXX YYYYYY 01II I IIIIIII I IIIIIII III III II IIIIII I IIIIIII I IIIIIIII①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ 3,000 pcsIIIIII I IIIIIII III IIII I III I III I III III IIIIII8. Label Structurea) Label StructureNote: Denoted bin code and product code above is only an example (see description on page 5)Bin Code:ⓐⓑ: Forward Voltage bin (refer to page 5)ⓒⓓ: Chromaticity bin (refer to page 6)ⓔⓕ: Luminous Flux bin (refer to page 5)b) Lot NumberThe lot number is composed of the following characters:①②③③②③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / 3,000 pcs①②: Production site③: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)④: Year (D: 2019, E: 2020, F: 2021…)⑤: Month (1~9, A, B, C)⑥: Day (1~9, A, B~V)⑦⑧⑨: Serial number (001 ~ 999)ⓐⓑⓒ: Product serial number (001 ~ 999)ⓐⓑⓒⓓⓔⓕABCDEFSPHWH2A1N1C0XXXXXX YYYYYYII I IIIIIII I IIIIIII III III II IIIIII I IIIIIII I IIIIIIIISLAAC4001 / I001 / 3,000 pcsIIIIII I IIIIIII III IIII I III I III I III III IIIIII9. Packing Structurea) Packing ProcessDimension of Transportation Box in mmWidth Length Height220 245 18210. Precautions in Handling & Use1)For over-current-proof function, customers are recommended to apply resistors to prevent suddenchange of the current caused by slight shift of the voltage.2)This device should not be used in any type of fluid such as water, oil, organic solvent, etc. Whenwashing is required, IPA is recommended to use.3)When the LEDs illuminate, operating current should be decided after considering the ambientmaximum temperature.4)LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or moreafter being shipped from Samsung Electronics, they should be packed by a sealed container withnitrogen gas injected.(Shelf life of sealed bags: 12 months, temp. ~40℃, ~90% RH)5)After storage bag is open, device subjected to soldering, solder reflow, or other high temperatureprocesses must be:a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than30℃/ 60% RH.b. Stored at <10% RH.6)Repack unused products using anti-moisture packing, fold to close any openings and store in a dryplace with <10% RH7)Devices require baking before mounting, if humidity card reading is >60% at 23±5℃.8)Devices must be baked for 1 day at 60±5℃, if baking is required.9)The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band oranti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum ratingis applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs mayshow some unusual characteristics such as increase in leak current, lowered turn-on voltage, orabnormal lighting of LEDs at low current.10)VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organicadditives which are used in luminaires (fixture) and LED silicone bags are permeable to it. It maylead a discoloration when LED expose to heat or light. This phenomenon can give a significant lossof light emitted (output) from the luminaires (fixtures). In order to prevent these problems, werecommend you to know the physical properties for the materials used in luminaires, it requiresselecting carefully.11)Risk of Sulfurization (or Tarnishing)The lead frame from Samsung Electronics is a plated package and it may change to black(or darkcolored) when it is exposed to Ag (a), Sulfur (S), Chlorine (Cl) or other halogen compound. Itrequires attention.Sulfide (Sulfurization) of the lead frame may cause a change of degradation intensity, chromaticitycoordinates and it may cause open circuit in extreme cases. It requires attention.Sulfide (Sulfurization) of the lead frame may cause of storage and using with oxidizing substancestogether.Therefore, LED is not recommend to use and store with the below list. : Rubber, Plain paper, leadsolder cream etc.11. Company InformationAbout Samsung Electronics Co., Ltd.Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at .Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved.Samsung is a registered trademark of Samsung Electronics Co., Ltd.Specifications and designs are subject to change without notice. Non-metricweights and measurements are approximate. All data were deemed correctat time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of theirrespective owners and are hereby recognized and acknowledged.Samsung Electronics Co., Ltd.95, Samsung 2-roGiheung-guYongin-si, Gyeonggi-do, 446-711KOREA/led。
收藏德国顶级156台电子管收音机名单
收藏德国顶级156台电子管收音机名单展开全文收藏德国顶级156台电子管收音机名单德国著名无线电收藏馆收藏德国顶级电子管收音机名录，总共有156台收音机，供爱好者大家参考。
无线电收藏馆由德国著名收藏家Niels Vormoor创办，在德国很有名气。
收音机名单如下1 AEG Super 51GWU 通用电气超级2 AEG Super 2083WU 通用电气超级3 AEG UKW Super 3084WD 通用电气调频4 AEG Raumklang Super 4085WD 通用电气立体声5 AEG Raumklang Super 6087WD 通用电气超级6 Blaupunkt Florida 蓝点佛罗里达7 Blaupunkt G51W 蓝点8 Blaupunkt London 蓝点伦敦9 Blaupunkt Riviera 2540 蓝点里维阿10 Blaupunkt Riviera 2640 蓝点里维阿11 Continental Osterode Imperial J449W 大洲帝皇12 Continental Osterode Imperial J450W-Stereo 大洲帝皇13 Continental Osterode Imperial J622GW 大洲帝皇14 Continental Osterode Imperial J622W 大洲帝皇15 Continental Osterode Imperial J6024W 大洲帝皇16 Continental Osterode Imperial J6048W 大洲帝皇17 Continental Osterode Imperial Maruf J506-W-Stereo 大洲帝皇马鲁夫18 EAW Amati AT1194 WKU 斯大林电子阿玛帝18 EMUD DE LUXE 62 艾穆德豪华20 EMUD Rekord 698 艾穆德录音21 Gerufon Gegentakt Ultra 格鲁风推挽极典22 Graetz Fantasia 622 歌丽幻想曲23 Graetz Melodia M418 歌丽旋律24 Graetz Melodia M818-Stereo 歌丽旋律25 Graetz Super 162W 歌丽26 Graetz Super 163W 歌丽27 Graetz Super 176W 歌丽28 Graetz Super 177W 歌丽29 Grundig 3012W 根德30 Grundig 4004GW 根德31 Grundig 4004W 根德32 Grundig 4008W 根德(带唱机)33 Grundig 4010GW 根德34 Grundig 4010TB 根德 (带唱机)35 Grundig 4010W 根德36 Grundig 4035W 根德37 Grundig 4035W-3D-56 根德38 Grundig 4040W 根德39 Grundig 4040W-3D 根德40 Grundig 4055W-3D 根德41 Grundig 495W 根德41 Grundig 5005W 根德43 Grundig 5010W 根德44 Grundig 5040GW 根德45 Grundig 5040GW-3D 根德46 Grundig 5040W 根德47 Grundig 5040W-3D 根德48 Grundig 5050W 根德49 Grundig 5050W-3D 根德50 Grundig 5080W-3D 根德51 Grundig 5089TB 根德 (带磁带机)52 Grundig Stereomeister 15H 根德53 Hornyphon Souverän 57 豪尼峰君王54 Kaiser Breslau W1090 王者布雷斯劳55 Kaiser Hymne W790 王者赞歌56 Koerting Dynamic Stereo 830W 科尔庭动感57 Koerting Dynamic Stereo 20730 科尔庭动感58 Koerting Konzert 430W 科尔庭音乐会59 Koerting Selector 53W 科尔庭选择器60 Koerting Royal Syntektor 55W 科尔庭皇家合成器61 Krefft Weltfunk W5510 克雷夫特韦德风62 Loewe Opta Hellas 542W 雄狮希腊63 Loewe Opta Hellas 552W 雄狮希腊64 Loewe Opta Hellas 552WP 雄狮希腊65 Loewe Opta Hellas 841W 雄狮希腊（带发光面板）66 Loewe Opta Hellas 1841W 雄狮希腊67 Loewe Opta Hellas 2841W 雄狮希腊68 Loewe Opta Hellas 3841W 雄狮希腊69 Loewe Opta Rheingold 3953W 雄狮莱茵黄金70 Loewe Opta Rheingold 3953W-S 雄狮莱茵黄金71 Loewe Opta Rheingold 4054W 雄狮莱茵黄金72 Loewe Opta Rheingold 5055W 雄狮莱茵黄金 (三喇叭)73 Loewe Opta Rheingold 5055W Plastik (四喇叭高低音组合）74 Loewe Opta Rheingold 5055W Plastik (四喇叭两个低音)75 Loewe Opta Venus 雄狮维纳斯76 Lorenz Goldsuper W45 罗兰仕金版超级77 Lorenz Goldsuper W45-3D 金版超级78 Lorenz Goldsuper W52 金版超级79 Metz 402W 美兹（一个短波波段）80 Metz 402W 美兹（两个短波波段）81 Metz 403-WF 美兹82 Metz 405-3D 美兹83 Metz 409-3D 美兹84 Metz Hawai S 美兹夏威夷85 Neckermann Konzert 101/70 内卡人音乐会86 Neckermann Konzert 111/20 内卡人音乐会87 Neckermann Konzertmeister 111/32 内卡人音乐会大师88 Neckermann Royal Syntektor 111/21 内卡人皇家合成器89 Nordmende 500-10 乐满地90 Nordmende Othello 58 乐满地奥赛罗91 Nordmende Othello 59 乐满地奥赛罗92 Nordmende Tannhaeuser 58 乐满地唐怀瑟93 Nordmende Tannhaeuser 59 乐满地唐怀瑟94 Nordmende Tannhaeuser 60 Stereo 乐满地唐怀瑟立体声95 Nora Csardas 56 W1140 诺拉卡萨达斯舞96 Nora Imperator 53 诺拉皇帝97 Nora Reigen 诺拉圆舞98 Philips BA753A Pastorale 飞利浦田园99 Philips BX653A 飞利浦100 Philips B7X63A 飞利浦101 Philips BX998A 飞利浦102 Philips Capella 51 飞利浦卡佩拉103 Philips Capella 643A 飞利浦卡佩拉104 Philips Capella 663A 飞利浦卡佩拉105 Philips Capella 673A 飞利浦卡佩拉106 Philips Capella 753/4E/3D 飞利浦卡佩拉107 Philips Saturn 653/4E/3D 飞利浦土星108 Philips Saturn Tonmeister 653/4E/3D mitRaumklangboxen 飞利浦土星（带立体声音箱）109 REMA 1800 雷玛110 Rochlitz Beethoven II 罗赫利兹贝多芬111 Rochlitz Stradivari I 罗赫利兹斯特拉迪瓦利（EL84输出）112 Rochlitz Stradivari I 罗赫利兹斯特拉迪瓦利（6V6输出）113 Rochlitz Stradivari I-3D 罗赫利兹斯特拉迪瓦利114 Rochlitz Stradivari II 罗赫利兹斯特拉迪瓦利115 Rochlitz Stradivari III 罗赫利兹斯特拉迪瓦利116 Saba Bodensee Automatik 3DS 世霸博登湖117 Saba Bodensee WIII 世霸博登湖118 Saba Freiburg Autiomatik 6-3D 世霸弗莱堡119 Saba Freiburg Autiomatik 8 世霸弗莱堡120 Saba Freiburg WII 世霸弗莱堡121 Saba Freiburg WIII 世霸弗莱堡122 Saba Freiburg Automatik 3DS 世霸弗莱堡123 Saba Meersburg WII 世霸梅尔斯堡124 Saba Meersburg W5 世霸梅尔斯堡125 Saba Meersburg W5-3D 世霸梅尔斯堡126 Schaub Lorenz Goldsuper W46-3D 秀珀罗兰仕金版超级127 Schaub Lorenz Gross-Super 55 秀珀罗兰仕加大版超级128 Schaub Transatlantic 55 秀珀罗兰仕泛大西洋129 Schaub Supraphon 52 秀珀罗兰仕超级录音机130 Schaub Lorenz Weltsuper 500 Stereo 秀珀罗兰仕131 Siemens Luxus Super 54 西门子豪华132 Siemens Schatulle M47 西门子百宝箱133 Siemens Schatulle M57 西门子百宝箱134 Siemens Schatulle P48 西门子百宝箱135 Siemens Spitzensuper 51 西门子顶级136 Siemens Spitzensuper 52 西门子顶级面包箱137 Siemens Spitzensuper 53 西门子顶级面包箱138 Siemens Spitzensuper M7 西门子顶级139 Stern Radio Erfurt II WU 明星埃尔富特140 Stern Radio Erfurt II GWU 明星埃尔富特141 Stern. Stassfurt Admiral 10E152 斯塔斯福特将军142 Stern. Stassfurt Globus 11E171 斯塔斯福特环球143 Tefi M540 (mit Tefifon) 特伟风（带音带机）144 Tefifon T573 (mit Tefifon) 特伟风（带音带机）145 Telefunken Concertino 55GW 德律风根音乐会146 Telefunken Concertino 55 TS 德律风根音乐会147 Telefunken Fortissimo W 德律风根大力神148 Telefunken Operette 52 GW 德律风根轻歌剧149 Telefunken Operette 52 W 德律风根轻歌剧150 Telefunken Orchestra 德律风根管弦乐队151 Telefunken Opus 55 德律风根 55号作品153 Telefunken Opus 7 德律风根 7号作品154 VEB Sternradio Rossini 5701 金箭罗西尼155 VEB Sternradio Rossini 5801 金箭罗西尼156 Wega 401 唯佳。
TraceTek TT-TS12面板安装说明书
Front Panel USB PortDoor Latch12" Display and Interactive Touch ScreenTT-TS12TraceTek TT-TS12 Panel Installation Instructions2 | a b c d e f THESE INSTRUCTIONS APPLY TO THE FOLLOWING SET OF TT-TS12-PANELS:Catalog Number Part Number DescriptionTT-TS12-Panel-0 P000001486 Enclosure mounted TT-TS12 with no SIMs TT-TS12-Panel-S1-1 P000001487 Enclosure mounted TT-TS12 with 1 TTSIM-1TT-TS12-Panel-S1-2 P000001488 Enclosure mounted TT-TS12 with 2 TTSIM-1TT-TS12-Panel-S1-3 P000001489 Enclosure mounted TT-TS12 with 3 TTSIM-1TT-TS12-Panel-S1-4 P000001490 Enclosure mounted TT-TS12 with 4 TTSIM-1TT-TS12-Panel-S1A-1 P000001491 Enclosure mounted TT-TS12 with 1 TTSIM-1A TT-TS12-Panel-S1A-1 P000001492 Enclosure mounted TT-TS12 with 2 TTSIM-1A TT-TS12-Panel-S1A-1 P000001493 Enclosure mounted TT-TS12 with 3 TTSIM-1A TT-TS12-Panel-S1A-1P000001494Enclosure mounted TT-TS12 with 4 TTSIM-1AAll panels include: TT-TS12 Screen, power supply, ADAM-4522 (RS232-to-RS485 Converter), ADAM-4069 (8 channel relay module), buzzer, front panel USB extension, field wiring terminal blocks and space for up to 4 TTSIM units.DESCRIPTIONPlease read these instructions carefully and keep them in a safe place (preferably close to the panel) for future reference. These instructions must be followed carefully to ensure proper operation.The nVent RAYCHEM TraceTek TT -TS12-Panel has been designed specifically for use with nVent RAYCHEM TraceTek sensor interface modules and relay modules.See the TT-TS12 Data Sheet H80617 for further information on system capabilities.See the TT-TS12 Operation Manual H80780 for details on system operation.See the TTSIM-1 Installation Instructions H56830 for details on sensor cable connection.See the TTSIM-1A Installation Instructions H57338 for details on sensor cable connection.INSTALLATION ITEMS (NOT SUPPLIED)• Wall fasteners for surface mounting (four screws) appropriate to the wall surface material• (Optional) TT-TS12 TRIM FLANGE Part Number P000000780 (available for semi-flush mounting of the TT-TS12-Panel) TOOLS REQUIRED:• Drills and chassis punch for electrical conduit or cable gland entries into TT-TS12-Panel at desired locations• Center punch• Phillips (cross-head) screwdriver• Small flat-head screwdrivers for terminal block connections• Large flat head screwdriver (or coin) to operate door latch• Wire cutter and stripper for field wiring connections• Long handle 4mm T-Bar Allen wrenchSTORAGE:Keep the TT-TS12-Panel in a dry place prior to installation to avoid possible damage to internal components.TT-TS12-PANEL GENERAL INFORMATION:Power Requirement 100 to 240 Vac; 50/60 Hz (A separate 15 Amp Branch Circuit with dedicated Circuit Breaker is required) Weight 11.8kg (26.0 lb) (typical with 4 SIM’s installed)Dimensions (W x H x D) 431.8 mm x 330.2 mm x 152.4 mm (17.0 in x 13.0 in x 6.0 in)Power consumption 40 W (typical with 4 SIM’s installed)Built-in relays 3 SPDT Pre-assigned (Buzzer Control, LEAK, and TROUBLE); 1 SPST Pre-assigned (Watchdog)1 SPDT; 3 SPST User Programmable RelaysAdditional channel specific relays available if TTSIM-1A units are installedRating: 5 A at 250 Vac or 5 A at 24 VdcExternal Relays: Expandable to 320 user programmed relays using TT-NRM-BASE and TT-NRM-2RO modulesStorage temperature –20°C to 60°C (–4°F to 140°F)Operating temperature –20°C to 60°C (–4°F to 140°F)Ingress Protection NEMA 1; IP 10Approvals and Certifications: All internal components are UL Listed or Recognized. Panel is built and approved to UL 508A Standard. | 34 | INSTALLING THE TT-TS12-PANELIgnition hazard. Do not mount the TT-TS12-Panel unit in a hazardous location. The TT-TS12-Panel must be in an ordinary area. Choose anoffice or control room location indoors where the TT-TS12-Panel will be protected from the elements and temperature extremes.Note: The TT-TS12-Panel is an electronic unit. During installation, take the following precautions to avoid damage to its electronic components:• Store the TT-TS12-Panel in its cardboard shipping box until ready to install • Handle with care, avoid mechanical damage • Keep the electronics dry• Avoid exposure to static electricity• Use personal grounding strap in high static environments• Avoid contamination with metal filings, liquids, or other foreign matter • Use caution when drilling or punching holes for conduit entry• Do not remove the protective film from the computer screen on the front of the unit until ready for use15.46'(393 mm)0.31' dia.(8 mm)4 places11.4'(290 m m )17.36'(441 mm)0.27' dia. (6.9 mm)4 places5.75'(146 mm) | 5CABLE GLAND AND CONDUIT ENTRIESThe primary cable entry surface is the bottom edge of the TT-TS12-Panel enclosure. Alternate entry points may be appropriate for some installations. It is the responsibility of the installer to note internal clearance and choose standard entry points such that the wire and cable routing do not interfere with the internal components.Note: Remove the back plane assembly and wire harness prior to drilling or punching holes for cable glands or conduit entries because of the risk of damage to the components or contamination due to metal filings.REMOVING THE BACK PLANE ASSEMBLY AND WIRE HARNESS:1. The back plane assembly and wire harness are designed to be removed as a single unit with a minimum of disruption to the internal wiring.2. At the rear of the TS12 touch screen, disconnect:a. 24VDC Power Connection terminal block (may be secured by small screws).b. RS485/RS422 Connector (may be secured by small screws or finger tighteners).c. RS232 Connector (may be secured by small screws or finger tighteners).2c 2b 2aDoor wire harness holders6 | | 7CABLE GLAND AND CONDUIT ENTRIESThere are three categories of cable connections. See Figure 2 for reference.A. Mains power – generally positioned in the lower right corner of the enclosure.B. N etwork connections – (all of the following are optional and may not be relevant for a specific installation). Positioned on right half of enclosure bottom surface.a. RS485 twisted pair cable to any external SIM units; TT-NRM relay units; Smart Gateways; RTU radios; Fiber Optic Modem.b. RS485 twisted pair cable to any host BMS, PLC, or DCS system using serial communications.c. Up to two Ethernet cable connections to local LAN.d. Dry contact relay pairs from summary relays for LEAK, TROUBLE and Watchdog alarm signals.e. Dry contact relay pairs from user programmable contacts 5 through 8 of built in ADAM 4069 module.f. Dry contact relay pairs from TTSIM-1A units (if installed).C. Leader Cables to TraceTek sensor cable or probe circuits - generally positioned to the center or left side of the enclosure bottom surface.8 | RE-INSTALL BACK PLANE ASSEMBLY AND WIRE HARNESSMAKING CONNECTIONS:1. Re-install the back plane assembly by reversing the removal procedures.2. Reinstall the four bolts that secure the back plane assembly.3. Restore wire harness connectors on back of TT-TS12 touchscreen.4. Slip wire harness into wire harness holders on door and left side of enclosure. Snap wire harness holders closed.5.Check for interference by carefully opening and closing the door and adjust wire harness position if necessary.1. Assure branch circuit to TT-TS12 has been de-energized prior to working with line voltage wiring.Connect mains power wires (100- 240 Vac 50/60 Hz) and ground to the terminal blocks in the lower right corner. There is no preferred position for line or neutral. Maximum conductor size is 10 AWG (4.5 mm). Connect ground wire (if provided) to yellow/green terminal block. See picture below.2. Make connections to summary relays if required. See picture below.a. Leak Summary Relay (NO: 1 COM: 2 NC: 3 )(NO: 4 COM: 5 NC: 6 )b. Trouble Summary Relay3. Connections to External SIM Network. See picture below.a. External Modbus slave devices can be connected via twisted pair at terminals 7 (+) and 8 (-).i. Permitted devices include: nVent RAYCHEM TraceTek TTSIM-1; TTSIM-1A; TTSIM-2; ADAM-4069 relay modules; ADAM-4051digital input modules; TT-NRM Relay Modules; Emerson/Rosemount Smart Gateway; GE-MDS RTU radios (or equivalent);RS-485-to-fiber optic modems.ii. All slave devices must respond to 9600 baud ModbusRTU protocol.4. Connections to Host Port. See picture below.a. 2-wire RS485 serial ModbusRTU communications to host computers is supported at terminal 9 (+) and 10 (-).b. Modbus address, baud rate, stop bits and parity, are adjustable to match the host system requirements. See TT-TS12 OperationManual H80780 for details.c.See Modbus Register Map for detailed listing of all available mapped parameters. | 910 | 5. Connecting sensor circuit leader cables to internal SIMs.a. A maximum of four TTSIM-1 or TTSIM-1A units are installed within the TT-TS12-Panel enclosure. Each TTSIM unit is designed to monitor one sensor cable circuit or one sensor probe circuit.b. Each sensor circuit is connected to the TS12 enclosure with a 4-conductor leader cable. The standard color code for TraceTek leader cables is RED-GREEN-YELLOW-BLACK.c. Remove the snap-on wire duct covers and use the vertical and horizontal wire duct to organize the leader cables as suggested in the photo below.TTSIM-1 TTSIM-1Ae. Detailed discussion of TTSIM-1 and TTSIM-1A installation and configuration can be found in publications H56830 and H57338respectively.ii. Lift the ADAM-4522 module out of the way to expose the ADAM 4069 module beneath.iii. The ADAM-4069 module has 4 available Form-A (SPST) Normally Open relays available and 1 Form-C (SPDT) terminal strips on the top and bottom connector. Relays 4, 5 and 6 are Form-A; relay 7 is Form-C.iv. The connectors are removable for easier wiring.v. Make relay connections as appropriate. The watchdog signal is between RL3 NO and RL3 COM.vi. Reinstall ADAM-4522 module on top of ADAM-4069 module and secure screws.7. Ethernet Connectionsa. The TT-TS12 has two RJ-45 Ethernet/LAN connector sockets on the rear of the TT-TS12 touch screen.b. Use standard network cables to connect the TT-TS12 to the local LAN for: email alarm notification, remote screen viewing andoperation via VNC, Modbus/TCP and future network services.c. There are no terminal blocks or LAN connections on the back plane, so make the Ethernet connections the last field wiring stepand leave sufficient slack to run from the conduit entries to the rear of the TT-TS12 touchscreen as mounted on the door panel.d. Take care when closing the enclosure door to avoid pinching the LAN cable.USB Ports Ethernet PortsFINAL INSPECTION:Check for:• No metal filings or other foreign materials present (vacuum or blow out)• Back plane assembly hold down bolts are tight• Mounting hardware tight• Conduit or cable glands tightened• All screw connections at terminal blocks snug (do not over tighten smaller screw terminals)• All wires routed such that the door opens and closes freely• All wire duct covers replaced• Leader cables from sensor circuits identified• Generally neat and organized appearance• Fuses installed in terminal block fuse holders at mains power connection point (lower right corner of back plane assembly) APPLY POWER:Ensure that fuse holders at mains power connection terminal block are properly seated. Apply mains power at circuit breaker panel. (Note that the fuses in the TT-TS12-Panel mains power connection terminal block are designed to act as local disconnect for panel servicing).Observe any installed TTSIM units for successful power on indications:• TTSIM-1 indication is a red LED that blinks once every 10 seconds to indicate power and CPU activity• TTSIM-1A has a green power on LED that blinks once every 5 seconds to indicate power and CPU activityCLOSE AND SECURE THE DOOR LATCH:Observe the front screen of the TT-TS12 touchscreen for boot-up sequence. This process will take about 1 minute and the screen may go dark or appear to pause for several seconds from time to time during a normal start-up. Proper start up is indicated by a screen like that shown below, however the number and type of TTSIM may be different than what is shown in this example.See the TT-TS12 Operation Manual H80780 for system configuration, set-up and operating instructions.North AmericaTel +1.800.545.6258 Fax +1.800.527.5703 **********************Europe, Middle East, AfricaTel +32.16.213.511Fax +32.16.213.604**********************Asia PacificTel +86.21.2412.1688Fax +86.21.5426.3167*************************Latin AmericaTel +1.713.868.4800Fax +1.713.868.2333**********************。
完美世界最帅男WX代码
找到完美国际的文件夹，然后点开e lemen t-->u serda ta-->chara cter然后00（男武侠）01（女武侠）10（男法师） 11（女法师）20（男巫师） 21（女巫师）31（妖精） 40（妖兽）50（男刺客）51（女刺客）60（男羽芒）61（女羽芒）70（男羽灵） 71（女羽灵[3Par ts]s caleU p = 160sc aleMi ddle= 102scal eDown = 38[Bl endFa ce]i dFace Shape1 = 62idF aceSh ape2= 62blend FaceS hape=50[Face]sca leFac eH =92sc aleFa ceV = 140idFac eTex= 44[Fal ing]idFal ingSk in =433i dFali ngTex = 594[F orehe ad]o ffset Foreh eadH= 76offse tFore headV = 0offse tFore headZ= 92rotat eFore head= 128scal eFore head= 128[Yo keBon e]of fsetY okeBo neH = 132offse tYoke BoneV =73offse tYoke BoneZ = 151rot ateYo keBon e = 117sc aleYo keBon e = 152[Cheek]off setCh eekH= 248offs etChe ekV = 51 o ffset Cheek Z =82 scal eChee k = 28 [C hain]offs etCha inV = 149offse tChai nZ =130 r otate Chain =146 scal eChai nH =41[Jaw]offse tJawH = 95offs etJaw V = 229of fsetJ awZ =175s caleJ awSpe cial= 96scale JawH= 192scal eJawV = 192 [E ye]i dThir dEye= 0i dEyeB aseTe x = 50 idE yeHig hTex=49 i dEyeB allTe x = 1046 i dEyeS hape= 72scale EyeH= 172scal eEyeV =255rota teEye = 124off setEy eH =122o ffset EyeV= 108offs eteye Z =118sca leEye Ball= 228 scal eEyeH2 = 172sc aleEy eV2 = 255rotat eEye2= 124offs etEye H2 =122 o ffset EyeV2 = 108 off setey eZ2 =118s caleE yeBal l2 =228 [Brow]idB rowTe x = 46idB rowSh ape = 70 s caleB rowH= 65scale BrowV= 64rotat eBrow = 64offs etBro wH =155o ffset BrowV = 155off setBr owZ=138s caleB rowH2 = 65scal eBrow V2 =64ro tateB row2=64o ffset BrowH2 = 155of fsetB rowV2 = 155off setBr owZ2= 128[No se]i dNose Tex = 41i dNose TipSh ape = 56s caleN oseTi pH =64sca leNos eTipV = 81scal eNose TipZ= 123offs etNos eTipV =170idNo seBri dgeSh ape = 55s caleB ridge TipH= 64offse tBrid geTip Z =148[M outh]idMo uthUp LipLi ne =80id Mouth MidLi pLine =77idMou thDow nLipL ine = 83t hickU pLip= 106thic kDown Lip =100s caleM outhH = 26offs etMou thV = 192offse tMOut hZ =118id Mouth Tex = 52o ffset Corne rOfMo uthSp ecial = 122 sca leMou thH2=26o ffset Corne rOfMo uthSp ecial2 = 122 [Ear]idEar Shape = 59scal eEar= 166offs etEar V = 128[Hair]idHa irMod el =881i dHair Tex = 891[Mou stach e]id Moust acheT ex =204i dMous tache Skin= 186idGo ateeT ex =596[Color]col orHai r = 16770273co lorFa ce =-1co lorEy e =-1522002col orBro w = -6123689co lorMo uth = 16758449color EyeBa ll =-11978785 c olorM ousta che = -1[Body]bod yID = 0co lorBo dy =-263693he adSca le =94up Scale =60waist Scale = 62armW idth= 68legWi dth = 63b reast Scale = 80。
剑桥英语分数量表
剑桥英语分数量表是一个由低到高的分数范围，用于报告剑桥英语各项考试的考试成绩。
量表分数将取代现行的标准化分数和考生能力概要。
成绩级别（Grade）和欧洲语言共同参考框架（CEFR）等级予以保留。
量表分数将使剑桥英语各项考试彼此之间，以及与CEFR之间的比照更加清晰。
FCE, FCE for Schools, CAE和CPE考试自2015年1月起率先使用剑桥英语分数量表分数报告成绩。
KET, KET for Schools, PET, PET for Schools和BEC考试将从2016年2月起使用量表分数报告成绩。
考生成绩考生仍将收到考试成绩单和证书，两者都包含以下信息：●以剑桥英语分数量表分数报告的阅读、写作、听力和口语的单项技能成绩及英语应用*的成绩，如果该项考试含有“英语应用”部分。
●以剑桥英语分数量表分数报告的总成绩●以级别（Grade）表示的总成绩●总成绩对应的CEFR级别此外，证书中还包含考生成绩对应的英国国家资格框架（NQF）级别。
确定剑桥英语分数量表的分数除KET和KET for Schools*考试，其他考试的考生都将收到以剑桥英语分数量表分数报告的阅读、写作、听力和口语的单项技能成绩以及英语应用的成绩，如果该项考试含有“英语应用”部分。
* 对于KET和KET for Schools考试，考生将会收到三项分数，即阅读&写作、听力和口语的分数。
剑桥英语分数量表各单项技能得分的平均分即为考试总分。
对于KET和KET for Schools考试，由于阅读&写作是一张试卷，得分占总分权重的百分之五十。
各个Grade和CEFR级别对应剑桥英语分数量表的特定分数段。
例如，考生在CAE考试中取得了195分，则相应地获得Grade B，达到CEFR C1水平。
各种剑桥英语考试之间的分数关联与任何单项考试相比，剑桥英语分数量表能反映出更广泛的语言能力水平。
每项剑桥英语考试成绩对应于剑桥英语分数量表的一个特定分数区段。
四轮一带
25 62 62 69 62 62 62 62
8203MV
100
3646
1546
203.2 72.2
26
8190MB
90
2560
1056
190
27
8190MH
90
2560
1056
190
28
8190MK
98
2676
1088
190
29
8190ML
90
2560
1056
190
30
8190MM
98
2870
1216
8.2 8.8 8.6 10.6 15.8 15.7 12.4 40 30.2 33.8 21 22.5 35.8 31.4 40.4 53.2 30.2
A A A B B B B B B B B B B B B B B B B B B
106 110 108 108 126 144 125 126 138 138 150 150
40
8175MK
74
1832
822
175
41
8171MA
78
1861.5 851.5
171
58.73 55.12 53.8 53.3 101.6 125.41 144.46 209.26 176.3 167.2 58.73 55.12 53.8 53.3 101.6 125.41 144.46 209.26 176.3 167.2 55 52 95.2 95.2 96 107.95 107.95 107.95 107.95
B 159 155 190 218 210 197 210 204 210 298 298.6 240 240 310 290 320 368.4 298.5 366 400 500
SP809 SP810微处理器监控电源管理芯片说明书
S P 809 / S P 8103 P i n M i c r o p r o c e s s o r S u p e r v i s o r C i r c u i tGENERAL DESCRIPTIONThe SP809/SP810 are low power microprocessor (μP) supervisory circuits used to monitor power supp lies in μP and digital systems.They provide applications with benefits of circuit reliability and low cost by eliminating external components. If the VCC supply voltage falls below preset threshold then a reset signal is asserted for at least 140ms after V CC has risen above the reset threshold. Both the SP809 and SP810 were designed with a reset comparator to help identify invalid signals, which last less than 140ms. The onlydifference between them is that they have an active-low RESET output and active-high RESET output, respectively. Low supply current (1μA) makes SP809/SP810 ideal for portable equipment.The devices are available in 3 pin SOT-23 package.Part NumberOutput Type SP809N Open Drain Active LowSP809 Push-Pull Low SP810Push-Pull Active HighAPPLICATIONS• Portable Electronic Devices • Electrical Power Meters • Digital Still Cameras • µP Power MonitoringFEATURES• Ultra Low Supply Current 1µA (typ) • Guaranteed Reset valid to V CC = 0.9V • 140ms Power-On Reset Pulse Width • Internally Fixed Threshold2.3V, 2.6V, 2.9V,3.1V,4.4V, 4.6V • 1.5% Voltage Threshold Tolerance • 3 Pin SOT-23 PackageTYPICAL APPLICATION DIAGRAMFig. 1: SP809 / SP810 Application DiagramABSOLUTE MAXIMUM RATINGSThese are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.V CC .......................................................... -0.3V to 6.5V RESET, RESET...................................... -0.3V to V CC+0.3V Output Current (RESET, RESET) ............................... 20mA Power Dissipation (T A=70°C) .............................. 320mW Junction Temperature .......................................... 125°C Storage Temperature .............................. -65°C to 150°C OPERATING RATINGSInput Voltage Range V CC ................................ 0.9V to 6V Junction Temperature Range ..................... -40°C to 85°CELECTRICAL SPECIFICATIONSSpecifications with standard type are for an Operating Temperature of T A= 25°C only; limits applying over the full Operating Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T A = 25°C, and are provided for reference purposes only. Unless otherwise indicated, T A= 25°C.Note 1: RESET output is for SP809; RESET output is for SP810.BLOCK DIAGRAMFig. 2: SP809 / SP810 Block Diagram PIN ASSIGNMENTFig. 3: SP809 / SP810 Pin Assignment PIN DESCRIPTIONORDERING INFORMATION (1)Part NumberOperating Temperature Range Lead-Free Package Packing MethodSP809EK-L-2-3/TR -40°C≤T A ≤+85°C Yes (2) SOT23-3 Tape & ReelSP809EK-L-2-6/TR SP809EK-L-2-9/TR SP809EK-L-3-1/TR (3) SP809EK-L-4-6/TR (3) SP809NEK-L-2-3/TR (3)SP809NEK-L-2-9/TR (3) SP809NEK-L-3-1/TR SP809NEK-L-4-6/TR (3) SP810EK-L-4-4/TR (3) NOTES:1. Refer to /SP809 and /SP810 for most up-to-date Ordering Information.2. Visit for additional information on Environmental Rating.3. NRND – Not Recommended for New Designs.TYPICAL PERFORMANCE CHARACTERISTICSAll data taken at T A = 25°C, unless otherwise specified - Schematic and BOM from Application Information section of thisdatasheet.Fig. 4: Supply Current versus TemperatureFig. 5: Power-Down Reset Delay versus TemperatureFig. 6: Power-Down Reset Delay versus TemperatureFig. 7: Power-Down Reset Delay versus TemperatureFig. 8: Normalized Reset Threshold versus TemperatureFig. 9: Power-Up Reset Time-out versus TemperatureTHEORY OF OPERATIONμP will be activated at a valid reset state. These μP supervisory circuits assert reset to prevent code execution errors during power-up,power-down, or brownout conditions. Reset is guaranteed to be a logic low for V TH>V CC>0.9V. Once V CC exceeded the reset threshold, an internal timer keeps RESET low for the reset timeout period; after this interval, RESET goes high.If a brownout condition occurs (V CC drops below the reset threshold), RESET goes low. Any time V CC goes below the reset threshold, the internal timer resets to zero, and RESET goes low. The internal timer is activated after V CC returns above the reset threshold, and RESET remains low for the reset timeout period.B ENEFIT OF H IGHLY A CCURATE R ESETT HRESHOLDSP809/810 with specified voltage as 5V±10% or 3V±10% are ideal for systems using a 5V±5% or 3V±5% power supply. The reset is guaranteed to assert after the power supply falls below the minimum specified operating voltage range of the system ICs. The pre-trimmed thresholds are reducing the range over which an undesirable reset may occur.Fig. 10: Timing WaveformsAPPLICATION INFORMATIONN EGATIVE G OING V CC T RANSIENTSIn addition to issuing a reset to the µP during power-up, power-down, and brownout conditions, SP809 series are relatively resistant to short-duration negative-going V CC transient.E NSURING A V ALID R ESET O UTPUT D OWNTO V CC=0When V CC falls below 0.9V, SP809 RESET output no longer sinks current; it becomes an open circuit. In this case, high-impedance CMOS logic inputs connecting to RESET can drift to undetermined voltages. Therefore, SP809/810 with CMOS is perfect for most applications of V CC down to 0.9V.However in applications where RESET must be valid down to 0V, adding a pull-down resistor to RESET causes any leakage currents to flow to ground, holding RESET low. I NTERFACING TO µP WITH B IDIRECTIONALR ESET P INSThe RESET output on the SP809N is open drain, this device interfaces easily with μPs that have bidirectional reset pins. Connecting the μP supervisor's RESET output directly to the microcontroller's RESET pin with a single pull-up resistor allows either device to assert reset. T EST C IRCUITFig. 11: Test CircuitPACKAGE SPECIFICATION 3-P IN SOT23REVISION HISTORYRevision Date Description2.0.0 2011 Reformat of DatasheetCorrection of package drawing2.0.1 August 2017 Correct Reset Delay conditions. Updated to MaxLinear logo. Updated format and ordering information table.2.0.2November 2017Corrected typo from rev 2.0.1, added 2 missing overlines to RESET in ElectricalSpecifications.Corporate Headquarters: 5966 La Place Court Suite 100Carlsbad, CA 92008 Tel.:+1 (760) 692-0711 Fax: +1 (760) 444-8598 High Performance Analog: 1060 Rincon Circle San Jose, CA 95131 Tel.: +1 (669) 265-6100 Fax: +1 (669) 265-6101Email: ************************* The content of this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by MaxLinear, Inc.. MaxLinear, Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in the informational content contained in this guide. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced into, stored in, or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), or for any purpose, without the express written permission of MaxLinear, Inc.Maxlinear, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless MaxLinear, Inc. receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of MaxLinear, Inc. is adequately protected under the circumstances.MaxLinear, Inc. may have patents, patent applications, trademarks, copyrights, or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from MaxLinear, Inc., the furnishing of this document does not give you any license to these patents, trademarks, copyrights, or other intellectual property. Company and product names may be registered trademarks or trademarks of the respective owners with which they are associated.。
MMBD4148;MMBD4148_D87Z;MMBD4148SE;MMBD4148CC;MMBD4148CA;中文规格书,Datasheet资料
©2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1MMBD4148/SE/CC/CASmall Signal DiodeAbsolute Maximum Ratings * T A= 25°C unless otherwise noted* These ratings are limiting values above which the serviceability of the diode may be impaired.Thermal CharacteristicsElectrical Characteristics T A=25°C unless otherwise notedSymbol ParameterValue Units V RRM Maximum Repetitive Reverse Voltage 100V I F(AV)Average Rectified Forward Current 200mA I FSMNon-repetitive Peak Forward Surge CurrentPulse Width = 1.0 secondPulse Width = 1.0 microsecond 1.02.0A A T STG Storage Temperature Range -55 to +150°C T JOperating Junction Temperature150°CSymbol ParameterValue Units P D Power Dissipation350mW R θJAThermal Resistance, Junction to Ambient357°C/WSymbol ParameterTest Conditions Min.Max.Units V R Breakdown Voltage I R = 5.0µA I R = 100µA 75100V V V F Forward VoltageI F = 10mA1.0V I RReverse Leakage CurrentV R = 20VV R = 20V, T A = 150°C V R =75V25505.0nA µA µA C T Total Capacitance V R = 0V, f = 1.0MHz 4.0pF t rrReverse Recovery TimeI F = 10mA, V R = 6.0V, I RR = 1.0mA, R L = 100Ω4.0nsMMBD4148/SE/CC/CAConnection Diagram311235H2123SOT-233123121341484148SE 4148CA4148CCMMBD4148MMBD4148CC 5H D5MMBD4148CA MMBD4148SE D6D4MARKINGMMBD4148/SE/CC/CA©2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1MMBD4148/SE/CC/CA©2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1©2004 Fairchild Semiconductor Corporation Rev. I11The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to performwhen properly used in accordance with instructions for useprovided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.FAST ®FASTr™FPS™FRFET™GlobalOptoisolator™GTO™HiSeC™I 2C™i-Lo ™ImpliedDisconnect™ISOPLANAR™LittleFET™MICROCOUPLER™MicroFET™MicroPak™MICROWIRE™MSX™MSXPro™OCX™OCXPro™OPTOLOGIC ®OPTOPLANAR™PACMAN™POP™Power247™PowerSaver™PowerTrench ®QFET ®QS™QT Optoelectronics™Quiet Series™RapidConfigure™RapidConnect™µSerDes™SILENT SWITCHER ®SMART START™SPM™Stealth™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TinyLogic ®TINYOPTO™TruTranslation™UHC™UltraFET ®VCX™A CEx™ActiveArray™Bottomless™CoolFET™CROSSVOLT ™DOME™EcoSPARK™E 2CMOS™EnSigna™FACT™FACT Quiet Series™Across the board. Around the world.™The Power Franchise ®Programmable Active Droop™TRADEMARKSintended to be an exhaustive list of all such trademarks.分销商库存信息:FAIRCHILDMMBD4148MMBD4148_D87Z MMBD4148SE MMBD4148CC MMBD4148CA。
多措施降低OLT设备脱网率
Technology Study技术研究DCW19数字通信世界2021.020 引言随着宽带网络技术的演进，用户对大带宽业务需求的增高，以OLT （optical line terminal ，光线路终端）为核心的接入网设备大规模部署，全民进入高速互联网时代。
与传统的承载单一宽带业务的xDSL （x Digital Subscriber Line ，各种数字用户线路）以及小区LAN （局域网）接入网不同，OLT 网络承载全业务：语音、宽带、IPTV （交互式网络电视）如图1所示。
图1 OLT 承载全业务示范据统计徐州本地网宽带用户约120万，ITV 用户约23万。
本地网OLT 在网设备1，374台，设备类型主要有华为5680T 、5800T ，中兴C300、烽火AN5516等。
受OLT 背板带宽能力限制，平均每台OLT 的承载用户数需要限制在4，000户左右。
由于OLT 设备集中度高，承载用户数多，所以单台设备故障影响的范围就特别大，严重影响了用户感知。
在2020年上半年省公司OLT 脱网率通报中，徐州本地网脱网率呈上升态势，6月竟高达5.82%（如图2所示），远超0.5%的指标。
图2 本地网OLT 设备脱网率设备集中度的提升，业务集中度的提升以及用户对使用体验要求的提升，决定了 OLT 设备的稳定运行非常重要，所以应该尽最大可能地降低 OLT 设备的脱网率。
1 O LT 设备脱网的原因我们对徐州本地网上半年的 OLT 设备脱网障碍工单多措施降低OLT 设备脱网率李 明，刘 涛，刘 喻（中国电信股份有限公司徐州分公司，江苏 徐州 221000）摘要：OLT 属于网络接入层的核心设备，是用户接入的第一个环节。
由于线路成本原因，绝大多数的用户只接入到一台OLT，OLT 设备的稳定性关乎用户的使用体验。
OLT 设备脱网率指标是衡量光接入网品质的一个客观指标，根据电信公司提升基础维护水平和用户感知的要求，全年光接入网设备脱网率指标不大于0.5%，通过分析OLT 脱网的原因，找出影响OLT 设备脱网的关键因素，提出针对性的改进措施。
LTE空中接口技术基础
P
e企学
C
P
e企学
UE检测窗口
加CP操作
Frequency
CP
CP
CP
CP
CP
CP
CP
CP
CP
CP
CP
CP
Symbol Period T(s)
Cyclic Prefix
Bit Period T(b)
T(g)
Symbol Period T(s)
Time
CP的长度
无线帧结构类型1(FS1)
FDD帧结构 --- 帧结构类型1，适用于FDD与H-FDD
PCRF
S6a
S10
S9
UMTS
控制面和用户面
的分离
LTE
多制式接入
E-UTRAN
MME
NodeB RNC
S1-MME
S4
Gx
S11
S12
S5/8
S1-U
eNodeB
Serving GW
A10/A11
S2a
cdma2000
BTS
BSC
PDSN
PDN GW
SGi
LTE Uu接口
LTE的空中接口(Air Interface)称为Uu接口，是E-NodeB和UE之
半帧, 153600Ts = 5 ms
时隙,
Tslot=15360Ts
30720Ts
子帧 #0
子帧#2
子帧 #3
子帧 #4
子帧 #5
子帧 #7
子帧, 30720Ts
DwPTS
GP
UpPTS
DwPTS
GP
UpPTS
(光纤通信)职业技能鉴定四级模拟题及参考答案
（光纤通信）职业技能鉴定四级模拟题及参考答案一、单选题（共60题，每题1分，共60分）1、SDH设备的映射抖动是指( )。
A、由异步映射,码速调整等引起的抖动B、由指针调整和复用过程引入的抖动C、由复用过程和映射过程引起的抖动D、由映射抖动和指针调整产生抖动的组合正确答案：D2、设备上电前，测试-48V电源和工作地，PGND接线柱之间的电阻，在电源开关闭合的情况下，其电阻值应小于（）欧。
A、1B、10C、100D、1000正确答案：A3、用光时域反射仪测试光纤时,两点间的( )即这两点间的平均损耗。
A、距离B、相对高度C、曲线长度D、曲线斜率正确答案：D4、在SDH段开销中，( )不经过扰码，全透明传送。
A、A1、A2B、J0C、B1D、E1和E2正确答案：A5、在华为公司的T2000网管中，只能在相同的( )之间创建光纤。
A、支路板接口B、以太网板接口C、线路板接口D、时钟板接口正确答案：C6、由6个网元组成2.5G的二纤双向复用段环，它的最大业务量为（）。
A、6AU-4B、24AU-4C、48AU-4D、96AU-4正确答案：C7、留守人数（以团为单位计算）一般不超过编制数的( )。
A、2%B、4%C、3%D、5%正确答案：C8、按光纤的传导模式光纤通信系统可分为( )。
A、多模和单模光纤通信系统B、直接调制光纤通信系统和间接调制光纤通信系统C、长波长和短波长光纤通信系统D、模拟光纤通信系统和数宇光纤通信系统正确答案：A9、眼图的眼睛闭合程度反应了( )。
A、码间串扰的强弱B、频率的相关性C、码间串扰和噪声的强弱D、噪声的强弱正确答案：C10、在波分系统中，可以做监控信道波长是（）。
A、1310nmB、1635nmC、1510nmD、1600nm正确答案：C11、在SDH系统中( )个TUG-3复用进VC-4。
A、1B、3C、5D、7正确答案：B12、STM-N输出抖动的本质是( )，分为全频段和高频段两部分来规范抖动指标。
华为OLT语音配置
先添加此ONTMA5680T(config)#vlan 1050 smartMA5680T(config)#port vlan 1050 0/19 1MA5680T(config)#service-port vlan 1050 epon 0/1/0 ont 1 multi-service user-vlan 1050MA5680T(config)#display service-port all----------------------------------------------------------------------------INDEX VLAN VLAN PORT F/ S/ P VPI VCI FLOW FLOW RX TX STA TEID ATTR TYPE TYPE PARA----------------------------------------------------------------------------0 3050 QinQ epon 0/1 /1 - - vlan 201-400 - - down1 3050 QinQ epon 0/1 /0 - - vlan 201-400 - - up2 3050 QinQ epon 0/1 /2 - - vlan 201-400 - - down3 3050 QinQ epon 0/1 /3 - - vlan 201-400 - - down4 1050 common epon 0/1 /0 1 - vlan 1050 - - up----------------------------------------------------------------------------Total : 5 (Up/Down : 2/3)JiangXiaJinRongGang_MA5680T(config)#interface epon 0/1JiangXiaJinRongGang_MA5680T(config-if-epon-0/1)#display ont info 0 all------------------------------------------------------------------------------F/S/P ONT-ID MAC Control Run Config Matchflag state state state------------------------------------------------------------------------------0/ 1/0 1 781D-BA47-1906 active up normal match------------------------------------------------------------------------------In port 0, the total of ONTs are: 1JiangXiaJinRongGang_MA5680T(config)#display current-configuration section vlan{ <cr>||<K> }:Command:display current-configuration section vlan[MA5600V800R006: 9002]#[vlan-config]<vlan-config>vlan 1050 smartvlan 3000 smartvlan 3050 smartvlan attrib 3050 q-in-qport vlan 1050 0/19 1port vlan 3000 0/19 0port vlan 3000 0/19 1port vlan 3050 0/19 0JiangXiaJinRongGang_MA5680T#display version{ <cr>|backplane<K>|frameid/slotid<S><Length 1-15> }:Command:display versionVERSION : MA5600V800R006C02PA TCH : SPC100 SPH121 HP1016PRODUCT MA5680TUptime is 35 day(s), 21 hour(s), 50 minute(s), 43 second(s)HG8240EchoLife HG8240 EPON Terminal (PX20+) Mac78:1D:BA:47:0D:00140C4510V1R002C00S2022010-10-20_11:04:25OFFLINE192.168.65.2 255.255.255.0 192.168.65.1开启VLAN ID 1050PON域名192.168.65.22944192.168.65.12944下面不变说明：1、端口状态分为LOCKED和UNLOCK,，分别表示锁定和未锁定状态。
高功率四象限电压和电流放大器系列（100-TS）说明书
1100-TS SeriesArbitrary 4-QuadrantVoltage and Current Amplifiers 400 W - 18.000 WDC ... 200 kHz / 1 MHz2Arbitrary 4-QuadrantVoltage and Current Amplifiers 100-TS Series 400 W - 18.000 W DC - 200 kHz / 1 MHzModel 35N-TS OverviewModels Low voltage -16 V...+16 VMedium voltage -16 V...+27 VHigh voltage -16 V...+35 V Output PowerSize 105-35N-TS 15 A 15 A 11 A 400 W 3 U 110-35N-TS 38 A 38 A 28 A 1.000 W 4 U 120-35N-TS 76 A 76 A 55 A 2.000 W 14 U 130-35N-TS 114 A 114 A 83 A 3.000 W 18 U 140-35N-TS 152 A 152 A 110 A 4.000 W 22 U 150-35N-TS 190 A 190 A 138 A 5.000 W 26 U 160-35N-TS 228 A 228 A 165 A 6.000 W 30 U 180-35N-TS 304 A 304 A 220 A 8.000 W 2 x 22 U 200-35N-TS 380 A 380 A 276 A 10.000 W 2 x 26 U 220-35N-TS 456 A 456 A 331 A 12.000 W 2 x 30 U 250-35N-TS 570 A 570 A 413 A 15.000 W 3 x 26 U 280-35N-TS684 A684 A496 A18.000 W3 x 30 U+35 V / -16 VSpecial Features■DC ... 200 kHz full range bandwidth ■DC up to 1 MHz (small signal -3 dB)■Output voltage 35 V / 70 V / 75 V ■Rise time / fall time up to 100 V/µs ■Arbitrary function with 1 Million memory data points■Internal resistor 0 ... 200 mΩ (Option)■Analogue input 0 ... ±10 V for voltage control ■Option for running as current amplifier ■Monitor outputs for measured values of voltage and current■WaveMaster software for graphical waveform generation■Simulation of imported oscilloscope signals ■Modularly expandable up to 18 kW (Systems > 1 kW)■USB interface standard■Voltage resolution less than 0.001 V ■Linearity 0,1% DC ■DC - Offset < 1 mV■DLL’s for C++, LabView TM , Vector-CAPL, Python,C#, MathLab, etc.Example: Model 110-35N-TS5P Extremely Powerful P Modular DesignP Unlimited Signal Waveforms4 kW Test SystemExample: Model 110-70N-TSModel 105-75N-TS Rear7Example: Model 110-75N-TSSelectable Operating VoltageThree selectable operating-voltage ranges allow to adapt to applications for high voltage / low current or low voltage / high current.Especially when controlling extremely low impedance loads, the operating voltage range can be reduced to one third of the maximum output voltage. This leads to an immense reduction of power dissipation.g Reduction of power dissipationg One system for 12 V / 24 V / 48 V vehicles10Test System ArchitectureGeneralThe 100-TS series are linear precision 4-quadrant power amplifiers for fast voltage and current signals - each positive and negative (bipolar).They also work as sink in applications to absorb power. Extremely high bandwidth at highest power requirements, necessary for fast signals, characterizes this series. Especially these amplifiers are characte -rized by their signal quality.Monitor OutputsLocated on the back of the instruments there are monitor outputs for voltage and current with the respective measured values.Output values are 0 ... ±10 Vfor 0 ... ±V rated respectively 0 ... ±I Irated.The current is measured with an internal shunt and accuracy of approx. 1 %.Optionally a current sensor with 0.01 % accuracy can be integrated easily.Arbitrary FunctionalityBOLAB´s arbitrary power amplifiers include a huge memory of 1 Million data points to store arbitrary waveforms in the instrument itself. No arbitrary waveform generator or any other controlling instrument is needed which makes these 4-quadrant amplifiers unique in the world market.The easy-to-use WaveMaster software, that is standard in scope of delivery, allows to generate waveforms with a graphical user interface or via tabular input.Output ON/OFFWith its output on/off switch at the front of the instruments, the output can be activated or deactivated. When deactivating, there is a complete galvanic separation to the devices under test.Multiple Instrument Functions In One Device11Signal Quality-Rise time:< 1 µs -Fall time:< 1 µs -No overshot / no undershotShort Time Current At Model 110-75N-TSProtective FunctionsVarious protective functions avoid damage of the instru-ment and guarantee protection for the devices under test.Output voltage and current can be limited. Over-tempera-ture shutdown is included.The unit’s internal calculation of power dissipation and complete monitoring of current ensure perfect short circuit and over-voltage protection.Also, for security reasons an interlock shut down can be triggered.Short-Time CurrentWithin 500 ms, the amplifier systems supply a short-time current.E.g. the 1.000 W, 40A will reach 100 A in 500 ms.Generally the instruments provide a short-time current of approximately two times higher than I DC Max13_This technology enables an endless, continuous data stream to the amplifier._Compared to a function generator with its limited arbitrary memory there is no limitationof the size of the waveform._A waveform with small spikes and interruptions of e.g. 100 µs and long constant levels inbetween can be simulated easily.Unlimited Waveform Memory14Analog Remote ControlAmplifier ControlThere are many ways to control BOLAB amplifier systems: •BOLAB WaveMaster SoftwareThis PC software generates waveforms, sends the curves to the internal data memory and runs the process. All selections in the instrument are done automatically.•Function GeneratorStandard function generators can be connected directly to the input of the amplifier.•NI DAQ Card, VT System (Vector), etc.Through their 0..±10 V input, other control units can be used for waveform generation. Automated test systems don´t need programming adaptions.Multiple Control Possibilities16Voltage And Current ControlBoth voltage and current control of the comprehensive amplifiers is possible. This can be selected on the front panel of the instrument.Control input is 0 ... ±10 Vfor 0 ... ±V rated respectively 0 ... ±I Irated.An optional compensation network for current control is necessary, which achieves highest slew rates andsignal quality for current signals.•Modular hardware architecture•Starting with one single unit of e.g. 1 kW •Extension up to 18 kW in parallel•Building up 3-phase systems with up to 6 kW per phase•Serial connection for increasing voltage•In case of a defective module, only this module needs to be repaired•Each module has its own indication for functional capabilityModular Concept / Modularly ExpandableModular Design18Series OperationSeries OperationFor high-voltage applications, two instruments or more can be connected.- Two instruments can be connected in series. Bridge switch must be toggled at one amplifier-For three and more instruments in series, an internal isolation amplifier in each instrument is necessary+Two Instruments In Series19WaveMaster Software Waveform generation and4-quadrant amplifier controlSpecial Features■Easy to use graphical waveform editor and tabular input possibility■Command library for integration into automated test systems:-LabView(TM)-Vector CANoe (CAPL)-C#-C++- ANSI C-Python-etc.■Simulation of imported oscilloscope signals■Waveform trigger caused by external TTL signal (rising edge) for synchronization■Macro function for execution of automated tests Waveform GenerationThe powerful and easy to use WaveMaster software isunique in world market. Without any knowledge in soft-ware development, construction of ordinary and complexwaveforms is dead easy.A graphical waveform editor allows to generate individualcurves in a flash. Also with a tabular input all kinds ofwaveforms can be produced immediately.The simplicity how fast to import data out of oscillo-scopes is amazing. Read in ASCII data files is possible inthe same way.Digital Interface USBAll functionalities of the 4-quadrant ampli-fiers are available in WaveMaster softwarefor controlling the instruments.Short time current on/off, output on/off,operating voltage range and other functionscan be easily set with its USB interface.Trigger FunctionA hardware trigger input can be activateto monitor a TTL input signal on its risingedge. Synchronous waveform simulation,measurement and testing tasks arepredestined applications.Macro FunctionWith a comfortable macro editor andits execution, selected waveforms runsequentially. Bursts, repetitions and loopsmake testing easy without any softwarecoding. Red cursor shows the current position while waveformis runningExample out of JLR-EMC-CS CI 2502021WaveMaster Remote DLLWith the WaveMaster remote DLL´s, available for nearly all programminglanguages, with its command library, users control the 4-quadrant amplifiers in an absolute perfection. There is no need to handle hardware interfaces such as USB or LAN.One command for each function handles all interfaces. Data files are sent to the instrument within milliseconds. No need to concern about memory space and resolution of the amplifiers.A simple “load” command calculates the best resolution of the waveform that is possible and sends data to the arbitrary unit. In every DLL (LabView TM , Vector CANoe, C#, C ++, ANSI C, Python, etc.), commands are identical. This makes switching between programming languages convenient. Commands for creating waveforms out of user programming surroundings are included as well. Variable waveforms for simulation of increasing ramps in time, variation of frequency and many other applicationsare typical test scenarios.Starting monitor of WaveMaster Imported real waveform out of an oscilloscopeAutomotive Standard LV124(VW80000)E-01 ... E-16One of the main standards in automotive industries isLV124 / VW80000. With these systems, this standard can be simulated easily. The waveform library contains all electronic waveform tests out of this specification.For E-17 ... E-22 please ask for our fully automated TestSystemE-01 Long-term overvoltage E-02 Transient overvoltageE-03 Transient undervoltageE-07 Slow decrease and increase of the supply voltageE-08 Slow decrease, quick increase of the supplyE-09 Reset behaviourE-13 Pin interruption 1)E-15 Reverse polarity (dynamic) 2) Additional power supply necessary1) Additional electric switch necessary2223E-04 Jump startE-05 Load dump E-06 Superimposed alternating voltageE-10 Short interruptions 1)E-11 Start pulsesE-12 Voltage curve with intelligent generator controlE-15 Reverse polarity (static)E-16 Ground offset 2)Vehicle And Avionic ApplicationsThe BOLAB arbitrary 4-quadrant amplifiers are predestined to simulate vehicle and avionic standards such as LV 124 / VW 80000, LV148, VDA 320, ISO 7637, DIN 40839, ISO 16750, GS 95024 and many other related norms.These waveforms and also a wide range of company-specific car manufacturer standards (BMW, Daimler, VW, ...) are included in the standard package.Other Standards such as LV148, ISO 16750, ISO 7637, DIN 40839, GS 95024, ..., Can Be Simulated Equally24High VoltageSuperimposed Alternating Voltage LV123 / HV-09 / VW 80300Series Operation With Applied Voltage Ripple Series operation solution allows to test HV components up to 1000 V DC.Standards like LV123, ISO 3637-4 and many others can be tested.With our 4-quadrant amplifier systems, interferences up to 200 kHz with an amplitude of more than 40 V pp are possible.1)O ption OVR HV necessary(Over voltage protection for high voltage power supply in series)How to define the diagrams.Example:I = 100 A, V = 450 V, V pp = 20 VP HV = 450 V · 100 A → P HV ~ 50 KW P 4Q = 20 V · 100 A → P 4Q ~ 2 KW out of the voltage / current graphics and its voltage ranges, we need a 4-quadrant amplifier with approximately 3 KW.Example: U DC = 900 V U SS = 32 V pp f = 200 kHzI= Depending on I max of the 100-TS instrumentOur SolutionHigh Voltage Power Supply4-Quadrant Amplifier+High Voltage Power Supply +4-Quadrant AmplifierV DCV SSVtttV SS4-Quadrant AmplifierV SSMax. 1.000 V Isolation against PE V = V DC + V SSIVHigh Voltage Power SupplyV DC=25E-10 / E-13 Pulses from LV124 standardVariable Waveform GenerationTest System With Electronic Switch Variations In Voltage And Time According to LV124, E-10 and E-13 pulses, inter-ruptions need to be implemented. Hereby additional electronic switches are necessary. These switches are controlled by BOLAB´s WaveMaster software and the amplifier´s built-in counter outputs.No additional function generator is necessary. This allows to build up a fully automated HIL test system.Easy Definition Of VariationsMeanwhile, many car manufacturers extend the stan-dard waveforms with many variable parameters in time and amplitude.BOLAB´s comprehensive WaveMaster Software allows to do these variations easily.Easy Programming PythonSpecial Features■Ready to use for LabView TM, Vector CANoe / CAPL, C#, C++, ANSI C, Python, etc.■Creating waveforms out of source code■Predefined commands for sine waves, exponential functions, ramps, etc.■Integration into HIL simulation systems■Complete interface handling and configuration■Starting and closing software out of application Example 1This programming example in Python opens an existing data file, loads data into amplifiers memory, switches the output on and runs the application in a loop of five times. import WaveMaster_PY27_x32import time#Create PYD objectwavemaster = WaveMaster_PY27_x32.CreateObject()#Connect to the WaveMaster server serverIPAddress = …10.99.92.78“serverPortNumber = 700arbnet.Connect(serverIPAddress,serverPortNumber)#Open an existing filefileName = …F:\\Waveform1MV.and“openfileRet = wavemaster.OpenFile(fileName)#Arbitrary System Functionsys=WaveMaster.GetArbitrarySystem()#Configure the device settings#Define source and amplifiersource = …NI DAQ USB-6259“amplifier = …BOLAB 105-75N-TS“#Set SystemsetSysRet = sys.Set(1,source,amplifier,0,0,0)time.sleep(5)#Load waveform into instruments memorysys.Load()#Enable outputsys.Execute()#Start runnings of waveform with burst=5sys.Start(5)#Wait until waveform ends after 5 runningsrun = sys.IsRun()while run == 1:time.sleep(0.5)run = sys.IsRun()#Set output to standbysys.Standby()#Close fileopenfileRet.Close()#Disconnect from WaveMaster serverwavemaster.disconnect()2627C++Example 2Creating waveforms out of customers programming source code is quite easy:using System;using System.Collections.Generic;using System.Linq;using System.Text;using WaveMaster_CPP_x32;namespace TestCase2{class Program {static void Main(string[] args){//assuming WaveMaster is started externally in server modeRemote WaveMaster DotNet _dllTest = new Remote WaveMasterDotNet();Resource _sysResource = null;Resource _fileResNew = null;string ipaddress = …10.99.92.78“;int iport = 700;int res = -1;int layer = 1;string source = …NI DAQ USB-6259“;string amplifier = …BOLAB 105-75N-TS“;string online = string.Empty;string fileName = …F:\\Waveform2MV.and“;int fileType = 0x10;int run = 0;res = _dllTest.Connect(ipaddress, iport);Console.WriteLine(…1 - Connected to WaveMaster...“);res = _dllTest.NewFile(ref _fileResNew, fileType, fileName);if(res == 0)Console.WriteLine(…2 - New File created...“);res = _dllTest.AddDataFile(_fileResNew,1,0.0,0.0,5.0);if(res == 0)Console.WriteLine(… - 1 New value in waveform added...“);res = _dllTest.AddDataFile(_fileResNew,1,0.1,12.0,5.0);if(res == 0)Console.WriteLine(… - 2 New value in waveform added...“);res = _dllTest.AddDataFile(_fileResNew,1,0.5,12.0,5.0,1,50.0,10.0,2.0,0.0,0.0,0);if(res == 0)Console.WriteLine(… - 3 Sine interference on waveform added...“);res = _dllTest.AddDataFile(_fileResNew,1,1.0,0.0,5.0);if(res == 0)Console.WriteLine(… - 4 New value in waveform added...“);res = _dllTest.GetArbitrarySystem(out _sysResource);if (res == 0){Console.WriteLine(…3 - GetArbitrarySystem...“);res = _dllTest.SetSystem(_sysResource,ref online,layer,source,amplifier,0,0,0);if (res == 0){res = _dllTest.LoadSystem(_sysResource);if (res == 0)Console.WriteLine(…5 - Write Waveform into instruments memory...“);res = _dllTest.ExecuteSystem(_sysResource);if (res == 0)Console.WriteLine(…6 - Switch instruments output on...“);res = _dllTest.StartSystem(_sysResource, 5);if (res == 0)Console.WriteLine(…7 - Run waveform 5 times...“);res = _dllTest.IsRunSystem(_sysResource, out run);if (res == 0)Console.WriteLine(…8 - IsRunSystem...“);while (run == 1){System.Threading.Thread.Sleep(1000);//1 secres = _dllTest.IsRunSystem(_sysResource, out run);}res = _dllTest.StandbySystem(_sysResource);if (res == 0)Console.WriteLine(…9 - StandbySystem...“);}}res = _dllTest.SaveFile(_fileResNew,fileName);res = _dllTest.CloseFile(_fileResNew);res = _dllTest.Disconnect();}}}This code in C# generates the following waveform and runs it 5 times.Example 2 As Graphic WaveformOrder Information105-35N-TS-16 V...+35 V / 20 A / 0,4 kW 110-35N-TS-16 V...+35 V / 40 A / 1 kW 120-35N-TS-16 V...+35 V / 76 A / 2 kW 130-35N-TS-16 V...+35 V / 114 A / 3 kW 140-35N-TS-16 V...+35 V / 152 A / 4 kW 150-35N-TS-16 V...+35 V / 190 A / 5 kW 160-35N-TS-16 V...+35 V / 228 A / 6 kW 180-35N-TS-16 V...+35 V / 304 A / 8 kW 200-35N-TS-16 V...+35 V / 380 A / 10 kW 220-35N-TS-16 V...+35 V / 456 A / 12 kW 250-35N-TS-16 V...+35 V / 570 A / 15 kW 280-35N-TS-16 V...+35 V / 684 A / 18 kW Ranges / Current105-35N-TS110-35N-TS120-35N-TS130-35N-TS140-35N-TS150-35N-TS Low voltage range-16 V...+16 V15 A38 A76 A114 A152 A190 AMiddle voltage range-16 V...+27 V15 A38 A76 A114 A152 A190 AHigh voltage range-16 V...+35 V11 A28 A55 A83 A110 A138 A Current peak 500 ms 2 x I MAXGain (voltage) 1 V / 10 VGain (current) 1 V / 2,5 A 1 V / 10 A 1 V / 100 ADC-Offset< 1 mVMonitor output (voltage) 1 V / 10 VMonitor output (current) 1 V / 2,5 A 1 V / 10 A 1 V / 100 AResidual Noise< 7 mVSource power400 W 1.000 W 2.000 W 3.000 W 4.000 W 5.000 W Sink power140 W350 W700 W 1.050 W 1.400 W 1.750 W Slew rate100 V / µs50 V / µsCV modeFrequencyfull rangesmall signal (-3 dB)CC modeFrequencyfull rangesmall signal (-3 dB)DC - 200 kHzDC - 1 MHz DC - 500 kHzDepending onRC networkInput impedanceunbalanced, 1 kHzbalanced, 1 kHz100 k Ω200 k ΩInstrument size19“, 3 U19“, 4 U19“, 12 U19“, 16 U19“, 20 U19“, 24 U Dimensions WxHxD (cm)Delivery Instrument Instrument19“ rack19“ rack19“ rack19“ rack Weight20 kg40 kg150 kg190 kg230 kg270 kg Power supply230 V AC(±10%, 50 Hz ... 60 Hz)3 x 230 V AC(±10%, 50 Hz ... 60 Hz)Protection10 A 3 x 16 AProtective functions OVT, OCT, OTPOperating temperature10° C - 55° CTechnical SpecificationsTechnical Data /Order Information100-35N-TS35 V / -16 V2830Technical Data /Order Information 100-70N-TS 70 V / -16 V105-70N-TS -16 V...+70 V / 20 A / 0,5 kW 110-70N-TS -16 V...+70 V / 40 A / 1 kW 120-70N-TS -16 V...+70 V / 76 A / 2 kW 130-70N-TS -16 V...+70 V / 114 A / 3 kW 140-70N-TS -16 V...+70 V / 152 A / 4 kW 150-70N-TS -16 V...+70 V / 190 A / 5 kW 160-70N-TS -16 V...+70 V / 228 A / 6 kW 180-70N-TS -16 V...+70 V / 304 A / 8 kW 200-70N-TS -16 V...+70 V / 380 A / 10 kW 220-70N-TS -16 V...+70 V / 456 A / 12 kW 250-70N-TS -16 V...+70 V / 570 A / 15 kW 280-70N-TS-16 V...+70 V / 684 A / 18 kWOrder Information Technical SpecificationsRanges / Current105-70N-TS 110-70N-TS 120-70N-TS 130-70N-TS 140-70N-TS 150-70N-TS Low voltage range -16 V...+16 V 19 A 38 A 76 A 114 A 152 A 190 A Middle voltage range -16 V...+27 V 19 A 38 A 76 A 114 A 152 A 190 A High voltage range -16 V...+70 V 7 A14 A29 A43 A57 A71 ACurrent peak 500 ms 2 x I MAX Gain (voltage) 1 V / 10 VGain (current) 1 V / 2,5 A1 V / 10 A1 V / 100 ADC-Offset< 1 mV Monitor output (voltage) 1 V / 10 VMonitor output (current) 1 V / 2,5 A1 V / 10 A1 V / 100 AResidual Noise < 7 mVSource power 500 W 1.000 W 2.000 W 3.000 W 4.000 W 5.000 W Sink power 240 W470 W940 W1.400 W1.800 W2.400 WSlew rate 100 V / µs50 V / µsCV mode Frequency full range small signal (-3 dB)CC mode Frequency full range small signal (-3 dB)DC - 200 kHzDC - 1 MHzDC - 500 kHzDepending on RC networkInput impedance unbalanced, 1 kHz balanced, 1 kHz 100 k Ω200 k ΩInstrument size 19“, 3 U19“, 4 U19“, 12 U19“, 16 U19“, 20 U19“, 24 UDimensions WxHxD (cm)Delivery Instrument Instrument 19“ rack 19“ rack 19“ rack 19“ rack Weight 20 kg40 kg150 kg190 kg230 kg270 kgPower supply 230 V AC(±10%, 50 Hz ... 60 Hz)3 x 230 V AC(±10%, 50 Hz ... 60 Hz)Protection 10 A3 x 16 AProtective functions OVT, OCT, OTP Operating temperature10° C - 55° CTechnical Data /Order Information 100-75N-TS 75 V / -75 VOrder Information Technical SpecificationsRanges / Current105-75N-TS 110-75N-TS 120-75N-TS 130-75N-TS 140-75N-TS 150-75N-TS Low voltage range -25 V...+25 V 19 A 38 A 76 A 114 A 152 A 190 A Middle voltage range -50 V...+50 V 10 A 19 A 38 A 57 A 76 A 95 A High voltage range -75 V...+75 V 7 A14 A27 A40 A53 A67 ACurrent peak 500 ms 2 x I MAX Gain (voltage) 1 V / 10 VGain (current) 1 V / 2,5 A1 V / 10 A1 V / 100 ADC-Offset< 1 mV Monitor output (voltage) 1 V / 10 VMonitor output (current) 1 V / 2,5 A1 V / 10 A1 V / 100 AResidual Noise < 7 mVSource power 500 W 1.000 W 2.000 W 3.000 W 4.000 W 5.000 W Sink power 500 W1.000 W2.000 W3.000 W4.000 W5.000 WSlew rate 100 V / µs50 V / µsCV mode Frequency full range small signal (-3 dB)CC mode Frequency full range small signal (-3 dB)DC - 200 kHzDC - 1 MHzDC - 500 kHzDepending on RC networkInput impedance unbalanced, 1 kHz balanced, 1 kHz 100 k Ω200 k ΩInstrument size 19“, 3 U19“, 4 U19“, 12 U19“, 16 U19“, 20 U19“, 24 UDimensions WxHxD (cm)Delivery Instrument Instrument 19“ rack 19“ rack 19“ rack 19“ rack Weight 20 kg40 kg150 kg190 kg230 kg270 kgPower supply 230 V AC(±10%, 50 Hz ... 60 Hz)3 x 230 V AC(±10%, 50 Hz ... 60 Hz)Protection 10 A3 x 16 AProtective functions OVT, OCT, OTP Operating temperature10° C - 55° C105-75N-TS -75 V...+75 V / 20 A / 0,5 kW 110-75N-TS -75 V...+75 V / 40 A / 1 kW 120-75N-TS -75 V...+75 V / 76 A / 2 kW 130-75N-TS -75 V...+75 V / 114 A / 3 kW 140-75N-TS -75 V...+75 V / 152 A / 4 kW 150-75N-TS -75 V...+75 V / 190 A / 5 kW 160-75N-TS -75 V...+75 V / 228 A / 6 kW 180-75N-TS -75 V...+75 V / 304 A / 8 kW 200-75N-TS -75 V...+75 V / 380 A / 10 kW 220-75N-TS -75 V...+75 V / 456 A / 12 kW 250-75N-TS -75 V...+75 V / 570 A / 15 kW 280-75N-TS-75 V...+75 V / 684 A / 18 kWBOLAB Systems GmbHMuehlstetten 372351 Geislingen Germanye-mail Internet********************** 。
2021LTE初级题库华为及答案18
2021LTE初级题库华为及答案18考号姓名分数一、单选题(每题1分,共100分)1、在eNodeB的层2与应用层的SAP是哪个？A.逻辑信道B.传输信道C.物理信道D.无线承载答案：D2、扩展CP的时长为（）A.4.7usB.5.2usC.33.3usD.16.7us答案：D3、天线端口由（）定义A.流数B.码字C.参考信号D.秩答案：C4、完成测量报告文件存储与管理的单元是（）A.应用服务器B.CDG服务器C.FTP服务器D.MR服务器5、LTE协议中，定义了几种PDSCH的传输模式（）A.5B.6C.7D.8答案：D6、LTE要求下行速率达到A.200MbpsB.150MbpsC.100MbpsD.50Mbps答案：C7、哪些是LTE支持带宽？A.2MHZB.5MHZC.12MHZD.20MHZ答案：B8、在鉴权过程的非接入层消息当中，以下哪个参数会被返回给MME（）A.IK & CKB.AUTNC.RANDD.RES答案：D9、PBCH支持的调制方式是？A.PSKB.QPSKC.16QAMD.32QAM10、用于读取主系统消息的是A.PBCH物理广播信道B.PDSCHC.PDCCHD.PHICH答案：A11、在一个小区中SDMA最多支持（）个UEA.4B.6C.8D.10答案：C12、TDLTE小区中，以下参数（）是TM3和TM8的转换门限A.dlSinrThresholdBetweenCLMimoTwoLayersAndOneLayerB.dlSINRThresholdbetweenRank1BeamformingAndTM3C.dlSINRThresholdbetweenRank2BeamformingAndTM3D.rankThresholdBetweenRank1AndRank2答案：C13、在随机接入响应中，如果相应的随机接入响应的频率跳变字段设置为:UE将执行PUSCH频率跳变:A.0B.1C.2D.6答案：B14、高阶调制对（）的要求较高A.信号质量（信噪比）B.频谱带宽C.频谱效率答案：A15、（LTE）3G相对于LTE,多了哪个单元（）A.NodeBB.RNCD.BBU答案：B16、功率控制作用是（）A.省电B.提高灵敏度C.信号强度高D.干扰增加答案：A17、关于空闲态小区重选对现有2/3G网络及用户体验的影响，下面说法错误的是（）A.需软件升级LTE覆盖区内所有2/3G现网无线设备，小区广播中支持LTE邻区、重选优先级等新参数的配置B.需软件升级LTE覆盖区内所有SGSN以识别LTE多模终端并将其路由至LTE网络C.执行重选时对用户拨打电话没有影响D.频繁重选导致终端耗电增加,待机时间缩短答案：C18、移动通信中常规天线的极化方式为A.垂直极化B.水平极化C.圆极化D.双极化答案：A19、PDCCH信道是由什么组成？MHET答案：C20、以下哪种信道支持空间复用A.PCFICHB.PHICHC.PDCHD.PDSCH答案：D21、信道映射的顺序是：A.PDSCH，PDCCH，PHICH，固定位置信道B.PHICH、PDSCH、PDCCH、固定位置信道C.固定位置信道，PHICH，PDCCH，PDSCHD.固定位置信道，PDSCH，PHICH，PDCCH答案：C22、室分系统是双路系统的情况下，可选用如下哪些传输模式（）A.TM2B.TM1C.TM7D.TM8答案：A23、以下哪一点不是PCI规划需要重点关注的（）A.频率B.RS位置C.小区位置关系D.TA归属答案：D24、（）时器指示在源eNB里切换准备程序的最大时间A.TS1RELOCprepB.TS1RELOCoverallC.TX2RELOCOverallD.答案：A25、在OFDMA中为什么要使用循环前缀？A.为了保证符号时间为整数B.为了克服多径及符号间干扰C.为了保持正交性D.为了OFDMA可扩展性答案：B26、在LTE系统协议中，MAC层对数据进行（）A.编码B.复用C.压缩和加密D.调制答案：B27、以下哪个信道用于承载下行控制信令所占用的OFDM符号数目（）A.PDSCHB.PDCCHC.PBCHD.PCFICH答案：D28、对于局部区域情况下，了解网络质量的最好办法就是A.路测B.网管数据C.CQTD.以上都对答案：C29、空中速率提升技术A.高阶调制B.QPSKD.QAM答案：A30、LTE的特殊时隙不包括A.DwPTSB.GPC.UpPTSD.Gs答案：D31、___反映小区对UE呼叫的接纳能力，直接影响用户对网络使用的感受:A.无线接通率B.RRC连接建立成功率（业务相关）C.E-RAB建立阻塞率D.E-RAB建立成功率答案：A32、目前LTE OMC中设置的互斥管理策略为:A.A用户申请并取得互斥权限后，就会一直占有，只有A用户自行释放后，B用户方可申请权限。
THS788PFD;THS788PFDT;中文规格书,Datasheet资料
THS788 SLOS616B–MARCH2010–REVISED JUNE2011 QUAD-CHANNEL TIME MEASUREMENT UNIT(TMU)Check for Samples:THS788FEATURES APPLICATIONS•Four Event Channels+Sync Channel•Automatic Test Equipment•Single-Shot Accuracy:8ps,One Sigma•Benchtop Time-Measurement Equipment •Precision:13ps(LSB)•Radar and Sonar•Result Interface Range:0s to7s•Medical Imaging•Event Input Rate:200MHz•Mass Spectroscopy•Low TC:0.1ps/°C•Nuclear/Particle Physics•High-Speed Serial Host-Processor Bus•Laser Distance Measurement Interface:50MHz•Ultrasonic Flow Measurement •Programmable Serial-Result Interface Speed:75MHz–300MHz•High-Speed LVDS-Compatible Serial-ResultBus per Channel•Programmable Serial-Result Bus Length•Temperature Sensor•Single3.3-V Supply•Power:675mW/Channel,18Bits,300MHz,Four ChannelsDESCRIPTIONThe THS788is a four-channel timing measurement unit(TMU)that incorporates a time-to-digital converter(TDC) architecture for fast and accurate measurements.The TMU is able to provide8ps of single-shot accuracy.The TDC has13ps resolution(LSB),which is derived from an external master clock of200MHz.It uses fast LVDS-compatible interfaces for all of its event inputs and serial result outputs,which allows for fast and reliable data transfer.Each channel can process time stamps at a maximum speed of200MSPS.The THS788has a wide range of programmability that makes it flexible in different applications.The serial-result interface has programmable data length,frequency,and data-rate mode(DDR and normal).The event channels can be programmed to take time stamps on rising edges or falling edges.The TMU has a mode for event management,where the user can program wait times before measurements.This programming is achieved through a50-MHz LVCMOS interface.The THS788is available in a TQFP-100with a heat slug on top for easy heat-sink access.The device is built using Texas Instruments RF SiGe process technology,which allows for maximum timing accuracy with low power.Table1.PACKAGE/ORDERING INFORMATION(1)TEMPERATURE PACKAGE(2)ORDERABLE PART NUMBER TOP-SIDE MARKINGTHS788PFD Tray,900°C to70°C PFD THS788PFDTHS788PFDT Tape and reel,250(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIwebsite at .(2)Package drawings,standard packaging quanities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.OT_ALARMTEMP MCLK (Fixed)Sync InputResetSerial Host Processor InterfaceB0347-01RdataCRdataD RCLK RstrobeA RstrobeB RstrobeC RstrobeDRdataA RdataB EventA EventB EventC EventDTHS788SLOS616B –MARCH 2010–REVISED JUNE 2011These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.TMU BLOCK DIAGRAMFigure 1.TMU Block DiagramABSOLUTE MAXIMUM RATINGSover operating junction temperature range (unless otherwise noted)VALUEUNIT V CC4V Analog I/O to GND (1)–0.3to VCC +0.3V Digital I/O to GND–0.3to VCC +0.3V T J Maximum junction temperature (2)150°C T stgStorage temperature 150°C HBM 2000ESD ratingsVCDM250(1)LVDS outputs are not short-circuit-proof to GND.(2)The THS788has an automatic power shutdown at 140°C,typical.THS788 SLOS616B–MARCH2010–REVISED JUNE2011POWER CONSUMPTIONTypical conditions are at55°C junction temperature,V CC=3.3VCURRENTCONDITION UNITTYP MAXOne channel plus sync,counter length=18bits,output interface speed=75MHz420mAAs above with an additional channel add125mA150MHz add10Output interface speed mA 300MHz add2527bits add60Counter length mA 34bits add10575MHz795107518bits150MHz8051090300MHz820110175MHz8551150Four channel current27bits150MHz8651165mA300MHz880117675MHz900121034bits150MHz9101225300MHz9251236 RECOMMENDED OPERATING CONDITIONSover operating junction temperature range(unless otherwise noted)MIN NOM MAX UNITV CC Supply voltage 3.135 3.465VT J Junction temperature0105°C MCLOCK frequency200MHz THERMAL CHARACTERISTICSover operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITRθJP Thermal resistance,junction-to-pad 3.11°C/WTHS788SLOS616B–MARCH2010–REVISED ELECTRICAL CHARACTERISTICSTypical conditions are at T J=55°C and VCC=3.3V.PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TDC CHARACTERISTICSTime-measurement precision(LSB)13.02ps Measurement accuracy after calibration,mean±8ps Single-event accuracy,one sigma8ps Time-measurement temperature coefficient0.1ps/°C Time-measurement voltage coefficient±30ps/V Event input rate200MHzWith preconditioning 2.5ns Minimum event pulse durationWithout preconditioning250ps Turnon time(ready to take timestamp)250μs MASTER CLOCK CHARACTERISTICSFrequency200MHz Duty cycle0.40.6Jitter3ps rms HIGH-SPEED LVDS INPUTS:MCLK,Event,SYNCDifferential input voltage100–Ωtermination,line-to-line200350500mV Common-mode voltage 1.25V Peak voltage,either input0.6 1.7V Input capacitance1pF HIGH-SPEED LVDS OUTPUTS:Rdata,Rstrobe,RCLKDifferential output voltage100–Ωtermination,line-to-line250325400mV Common-mode voltage 1.125 1.28 1.375V Rise time/fall time20%/80%250ps Output resistance40ΩTEMPERATURE SENSOR DC CHARACTERISTICSOutput voltage T J=65°C 1.69V Output voltage temperature slope5mV/°C Max capacitive load30pF Max resistive load10kΩOVERTEMPERATURE ALARM DC CHARACTERISTICSTrip point Active-low pulldown141°C Leakage current Temperature<trip point1μA Output voltage,low I sink=1ma0.2V OUTPUT INTERFACE TIMINGRCLK duty cycle45%50%55%300MHz 1.4Rdata/Rstrobe to RCLK setup time150MHz 3.1ns75MHz 6.4300MHz 1.5Rdata/Rstrobe to RCLK hold time150MHz 3.2ns75MHz 6.5THS788 SLOS616B–MARCH2010–REVISED JUNE2011HOST SERIAL INTERFACE DC CHARACTERISTICSover operating junction temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITV IH High-level input voltage0.7×VCC VCC+0.5VV IL Low-level input voltage GND–0.30.3×VCC VV OH High-level output voltage VCC–0.5VCC+0.3VV OL Low-level output voltage00.4VI lkg Leakage current1µAHOST SERIAL INTERFACE AC CHARACTERISTICSover operating junction temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT HCLK frequency50MHz Rise and fall times 3.5ns HCLK duty cycle40%50%60%Hstrobe high period between two consecutive transactions40ns Hstrobe low to HCLK high setup5ns HCLK high to Hstrobe high hold time5ns Hdata in to HCLK high setup5ns Hdata in to HCLK high hold time5ns HCLK falling edge to Hdata out(L or H)C L=20pF 3.25ns HCLK falling edge to Hdata out(H or L)C L=20pF 3.25nsEventD Reserved ReservedVCC GND MCLK MCLK NC NC VCC GNDNC EventDGND GND EventC NC EventCNC NC NC NC GND GND ResetTEMP OT ALARM NC GND SYNC SYNC VCC NC VCC EventB NC EventB GND GND EventA NC EventA VCC NC NC NC NC GND GND P0011-03PFD Package (Top View)VCC N CR d a t a DR d a t a DR s t r o b e DR s t r o b e BV C CG N DH d a t aH C L KG N DV C CG N DV C CG N DV C CH s t r o b eG N DV C CR C L KR C L KR s t r o b e BR d a t a BR d a t a BN C R s t r o b e DN CV C CR d a t a CR d a t a CR s t r o b e CR s t r o b e CG N DV C CG N DR e s e r v e dR e s e r v e dG N DV C CG N DV C CG N DG N DV C CG N DR s t r o b e AR s t r o b e AR d a t a AR d a t a AV C CN CTHS788SLOS616B –MARCH 2010–REVISED JUNE 2011DEVICE INFORMATIONPIN ASSIGNMENTNote:Pin 1indicator is symbolized with a white dot,and is located near pin 1corner.Figure 2.Pinout DiagramTHS788 SLOS616B–MARCH2010–REVISED JUNE2011PIN FUNCTIONSPINFUNCTION DESCRIPTIONNAME NO.EventA68LVDS-compatible input Positive event input for channel AEventA66LVDS-compatible input Negative event input for channel AEventB61LVDS-compatible input Positive event input for channel BEventB63LVDS-compatible input Negative event input for channel BEventC8LVDS-compatible input Positive event input for channel CEventC10LVDS-compatible input Negative event input for channel CEventD15LVDS-compatible input Positive event input for channel DEventD13LVDS-compatible input Negative event input for channel D1,2,11,12,21,25,32,35,37,39,GND42,55,64,65,74,75,82,84,85,Ground Chip ground87,89,92,94HCLK34LVCMOS input Host serial-interface clockHdata33LVCMOS I/O Host serial-interface data I/OHstrobe41LVCMOS input Host serial-interface chip selectMCLK19LVDS-compatible input Positive master-clock inputMCLK20LVDS-compatible input Negative master-clock input3–6,9,14,17,18,26,50,54,59,NC No connect Physically not connected to silicon62,67,70–73,76,100OT_ALARM53Open-drain output Overtemperature alarmRCLK45LVDS-compatible output Positive result-interface clockRCLK44LVDS-compatible output Negative result-interface clockRdataA78LVDS-compatible output Positive result-data output for channel ARdataA79LVDS-compatible output Negative result-data output for channel ARdataB49LVDS-compatible output Positive result-data output for channel BRdataB48LVDS-compatible output Negative result-data output for channel BRdataC98LVDS-compatible output Positive result-data output for channel CRdataC97LVDS-compatible output Negative result-data output for channel CRdataD27LVDS-compatible output Positive result-data output for channel DRdataD28LVDS-compatible output Negative result-data output for channel DReserved23,24,90,91Engineering or test pins Connect to VCCReset51LVCMOS input Chip reset,active-lowRstrobeA80LVDS-compatible output Positive strobe signal for channel ARstrobeA81LVDS-compatible output Negative strobe signal for channel ARstrobeB47LVDS-compatible output Positive strobe signal for channel BRstrobeB46LVDS-compatible output Negative strobe signal for channel BRstrobeC96LVDS-compatible output Positive strobe signal for channel CRstrobeC95LVDS-compatible output Negative strobe signal for channel CRstrobeD29LVDS-compatible output Positive strobe signal for channel DRstrobeD30LVDS-compatible output Negative strobe signal for channel DSYNC57LVDS-compatible input Positive input for sync channelSYNC56LVDS-compatible input Negative input for sync channelTEMP52Analog output Die temperature7,16,22,31,36,38,40,43,58,Power supply Positive supply,nominal3.3VVCC60,69,77,83,86,88,93,99THS788SLOS616B–MARCH2010–REVISED THS788CIRCUIT FEATURESThe THS788time-measurement unit(TMU)includes four measurement channels plus a synchronization channel optimized to make high-accuracy time-interval measurements.The following is a brief description of the various circuit blocks and how they interact to make and process the time measurements.Counter,Latches,Clock MultiplierThe center of the TMU is a master synchronous counter which counts continuously at a rate of1.2GHz.This is the master timing generator for the whole TMU and defines the basic timing interval of833ps,which is further subdivided with Interpolator circuitry.The counter is divided into four sections,which can be powered off so that the effective length is selectable as18,27,or34bits long.The output bits of the counter are connected to five sets of latches,which can latch and hold the counter state on command from each of the channels.In this way, when an event occurs,the counter time is recorded in the particular channel’s latches.The latch output is converted to CMOS levels and passed to the respective channel’s FIFO buffer,which is15samples deep.The counter1.2-GHz clock is derived from the MCLK input to the TMU at200MHz.This MCLK input is critical to the accuracy of the TMU,and any error in frequency is reflected as errors in time measurement.Likewise,jitter propagates to the counter and other circuits and adds noise to the measurement accuracy.The200-MHz clock is the input to a clock multiplier.The clock multiplier uses delay-lock loop(DLL)techniques and combinatorial logic to construct a six-times clock from the reference input.This1.2-GHz clock is passed to a high-power clock buffer,which drives all the circuitry in the master counter and many other circuits in the TMU.Channels,Interpolator,PreconditioningThere are four event channels and one sync channel.The event channels are identical,and the sync channel contains most of the event channel circuitry,but without a FIFO and preconditioning.An input pulse to the sync channel serves as the reference time zero for the TMU.An event input to a channel is compared to the sync time reference,and the time delay is calculated as the time difference modified by a calibration value.An event input follows the following signal path:the event input edge sets a fast latch(hit latch).This latch is gated on/off by a block of preconditioning logic which can set up holdoff delay conditions to determine when to allow the latch to accept an event pulse.This document discusses holdoff preconditioning in more complete detail in later sections. The output of the latch is current-buffered and applied to the interpolator.The interpolator uses DLL techniques to subdivide the counter interval of833ps into64time intervals of13ps each.A large array of fast latches triggered by the hit latch captures the state of the64time intervals and logically determines6bits of timing data based on where the event occurred in the833-ps clock interval.These6bits are latched and eventually passed to the FIFO,where they become the LSBs of the time-to-data conversion.A synchronizer circuit is also connected to the64-latch array and removes the possible timing ambiguity between the64latches and the master counter.This takes a few1.2-GHz clock pulses.When this process is complete,a pulse occurs which captures the master counter bits into the channel latches.A subsequent pulse loads all the bits from the interpolator and the counter into the channel FIFO.While this is happening,the hit latch is being reset,and the channel is prepared to accept another event edge.This process is fast enough to accept and measure event edges as close together as5ns.FIFOEach event channel contains a15-deep,40-bit-wide FIFO,which allows for rapid accepting and measurement of event inputs and a user-defined data-output rate of those measurements.Calibration,ALU,Tag,ShifterThe output of the FIFO is controlled by the shifter,which is a free-running parallel-to-serial register.The shifter bit length and clock rate are user controlled.The shifter generates a load pulse,which transfers the data in the FIFO output into an arithmetic logic unit,which does the sync time and calibration time subtractions and then parallel-loads the result into the output serial register.An LVDS output buffer outputs the clock,data,and strobe signals to transfer the time-measurement data to the user.A TAG bit is appended to the leading edge of the data word.Currently the TAG feature is not implemented.The bit will always be0representing data.THS788 SLOS616B–MARCH2010–REVISED JUNE2011Serial Interface,Temperature,OverheadThe TMU functions and options are controlled and read out by a serial interface built in CMOS logic that can operate up to50MB/s.There is one central controller which then drives registers,counters,etc.,in each channel.A temperature sensor is located central to the chip and outputs a voltage proportional to the chip temperature.If the chip temperature rises above141°C,the TMU powers down and outputs an overtemperature alarm signal.The TMU does not restart without a command through the serial interface.A bias circuit provides a regulated current bias and voltage reference for the TMU.The serial controller sequences some of the bias circuits to account for some acquisition times,and thereby,turns on the TMU.Host Processor Bus InterfaceThe THS788includes a high-speed serial interface to a host processor.The host interface is used for writing or reading registers that reside in the TMU chip.These registers allow configuration of the device functions.All registers are capable of both read and write operations unless otherwise stated.Serial InterfaceThe TMU serial interface operates at speeds of up to50MHz.Register addresses are8bits long.Data words are16bits wide,enabling more-efficient interface transactions.The serial bus implementation uses three LVCMOS signals:HCLK,Hstrobe,and Hdata.The HCLK and Hstrobe signals are inputs only,and the Hdata signal is bidirectional.The HCLK signal is not required to run continuously.Thus,the host processor may disable the clock by setting it to a low state after the completion of any required register accesses.When data is transferred into the device,Hdata is configured as an input bus,and data is latched on a rising edge of HCLK.When data is transferred out of the part,Hdata is configured as an output bus,and data is updated on the falling edge of HCLK.is the control signal that identifies the beginning of a host bus transaction.Hstrobe must remain low for the duration of the transaction,and must go high for at least two clock cycles before another transaction can begin.Read vs Write CycleThe first Hdata bit latched by HCLK in a transaction identifies the transaction type.First Hdata bit=1for read;data flows out of the chip.First Hdata bit=0for write;data flows into the chip.Parallel(Broadcast)WriteParallel write is a means of allowing identical data to be transferred to more than one channel in one transaction. The second Hdata bit of a transaction indicates whether a parallel write occurs.Second Hdata bit=0;data goes to the selected channel.Second Hdata bit=1;data goes to all four channels.AddressAfter the bit and the parallel write bit,the following8bits on the Hdata line contain the source address of the data word for a read cycle or the destination address of the data word for a write cycle.Address bits are shifted in MSB first,LSB last.Third HCLK–Address Bit7(MSB)Tenth HCLK–Address Bit0(LSB)DataThe data stream is16bits long,and it is loaded or read back MSB first,LSB last.The timing for read and write cycles is different,as the drivers on Hdata alternate between going into high-impedance and driving the line. ResetReset is an external hardware signal that places all internal registers and control lines into their default states. The THS788resets after a power-up sequence(POR).Hardware reset is an LVCMOS active-low signal and is required to stay low for approximately100ns.Data transfer protocol for Read operationsHCLKHdataHstrobeDriving the lineT0427-01THS788SLOS616B –MARCH 2010–REVISED JUNE 2011places the TMU in a predetermined idle state at power on,and anytime the system software initializes the system hardware.In the idle state,the TMU ignores state changes on the Event inputs and never creates time stamps.The TMU is capable of switching within 250μs from the idle state to a state that creates accurate time stamps.Chip IDAddress (83h)is a read-only register that identifies the product and the die revision.The 16-bit register is divided into two 8-bit sections.The LSB represents the revision history and the MSB represents the last two digits of THS788(i.e.,80).The first revision (1.0)is as follows:100000000001.0000Read OperationsReading the THS788registers via the host interface requires the following sequence:The host controller initiates a read cycle by setting the host strobe signal,Hstrobe,to a low state.The serial Hdata sequence starts with a high bit,followed by (either 1or 0)for parallel-write bit and 8bits of address,with most-significant bit (A7)first.The host controller should put the Hdata signal in the high-impedance state beginning at the falling edge of HCLK pulse 10.The THS788allows one clock cycle,(r)for the host to reverse the data-channel direction and begins driving the Hdata line on the falling edge of HCLK pulse 12.The data is read beginning with the most-significant bit (D15)and ending with the least-significant bit (D0).The host must drive Hstrobe to a high state for a minimum of two HCLK periods beginning at the falling edge of HCLK pulse 27to indicate the completion of the read cycle.Figure 3shows the timing diagram of the read operation.Figure 3.Read OperationWrite OperationsWriting into the THS788registers via the host interface requires the following sequence:After the line is pulled low (start condition),the bit is set low,followed by a 0for the parallel-write bit (single-register write),then the memory address (A7–A0)followed by the data (D15:D0)to be programmed.The next clock cycle (w)is required to allow data to be latched and stored at the destination address (or addresses in the case of a parallel write),followed by at least two dummy clock cycles during which the is high,indicating the completion of the write cycle.Figure 4and Figure 5show timing diagrams of write operations.分销商库存信息:TITHS788PFD THS788PFDT。