DTZ Property Times Hong Kong Q1 2010_CH

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天梭卡森臻我背面代码

天梭卡森臻我背面代码天梭（Tissot）是一家瑞士钟表制造商，以其精湛的制表工艺和卓越的品质而闻名于世。

卡森臻我（Carson Zenith）是天梭品牌下的一款经典系列，以其简约、优雅的设计风格深受钟表爱好者的喜爱。

在本文中，我们将详细介绍天梭卡森臻我背面代码，深入解析其背后的技术与工艺。

1. 背面代码的意义天梭卡森臻我系列的背面代码是指刻在表壳背面的一系列数字和字母组合。

这些代码代表着该款钟表的特定信息，包括生产日期、型号、材质、制造地点等。

背面代码的存在不仅是为了方便生产和管理，更是对天梭品牌的一种标志和保证。

2. 背面代码的结构天梭卡森臻我背面代码通常由一串数字和字母组成，其结构如下：•第一部分：品牌代码•第二部分：型号代码•第三部分：材质代码•第四部分：制造地点代码•第五部分：生产日期代码下面我们将逐一介绍这些部分的含义和编码规则。

2.1 品牌代码天梭的品牌代码为”TIS”，代表着该款钟表属于天梭品牌。

2.2 型号代码型号代码是背面代码中最关键的部分，它代表着该款钟表的具体型号。

天梭卡森臻我系列有多个不同的型号，每个型号都有独特的设计和功能特点。

型号代码通常由一到两个字母和一组数字组成，用于区分不同的型号。

2.3 材质代码材质代码代表着该款钟表的材质。

天梭卡森臻我系列的钟表通常采用不锈钢、黄金、玫瑰金等高质量的材质制作。

材质代码通常由一到两个字母组成，用于表示不同的材质。

2.4 制造地点代码制造地点代码代表着该款钟表的制造地点。

天梭的钟表制造工厂分布在瑞士的不同地区，每个工厂都有独特的技术和工艺。

制造地点代码通常由一到两个字母组成，用于表示不同的制造地点。

2.5 生产日期代码生产日期代码代表着该款钟表的生产日期。

天梭的钟表生产过程严格遵循时间表，每个钟表都有明确的生产日期。

生产日期代码通常由一组数字组成，用于表示具体的年、月、日。

3. 背面代码的重要性天梭卡森臻我背面代码的存在具有重要的意义。

DTZ戴德梁行简介

9001:2000
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DTZ 業務遍及全球43國家，共148 個城市，超過 10,000 員工為顧客服務。
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高力国际

腾冲中城建旅游产业有限公司
五大行究竟是哪五大，一般在中国大陆来说是（排名按先后）： 1.JLL 仲量联行 2.CBRE 世邦魏理士 3.DTZ 戴德梁行 4.Savills 第一太平戴维斯 5.Colliers 高力国际其中戴德梁行在英国和亚太地区比较活跃，但在北美和欧洲其他地区则没有业务覆盖。因此全球范围来看则是： 1.CBRE 世邦魏理士 2. Cushman & Wakefield 高纬环球 3. Colliers 高力国际 4. JLL 仲量联行 5. Savills 第一太平戴维斯
腾冲中城建旅游产业有限公司
高力国际总部位于美国华盛顿州西雅图市，在全球61个国高力国际总部位于美国华盛顿州西雅图市，在全球61个国家拥有512家分公司，致力为全球客户提供最全面的专业家拥有512家分公司，致力为全球客户提供最全面的专业物业服务，包括房地产买卖、租赁、业主服务、租户代表、企业服务、投资及特别项目、咨询及研究、估值，与及物物业管理面积业及资产管理等。 1974 年在澳大利亚，几家非常成功的房地产公司合并成一家公司，并以他们导师Ronald Collier的名字命名。在一家公司，并以他们导师Ronald Collier的名字命名。在澳大利亚，Ronald Collier是一位著名的注册测量师。之澳大利亚，Ronald Collier是一位著名的注册测量师。之后高力在亚太地区及加拿大地区的业务快速发展起来。高力国际覆盖全球的办事处网络，体现了其广阔的国际视野及深厚的本地市场知识。现时高力国际在全球拥有超过 12,500 名专业人才和丰富的物业及客户数据库。这一切均让其均让其能为客户在环球房地产市场中寻找商机，并提供高成本效益的房地产服务。
腾冲中城建旅游产业有限公司

Infoprint 250 導入と計画の手引き第 7 章ホスト

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Silicon Digital Attenuator HMC1119数据手册说明书

0.25 dB LSB, 7-Bit, Silicon DigitalAttenuator, 0.1 GHz to 6.0 GHz Data Sheet HMC1119Rev. C Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. O ne Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2016–2018 Analog Devices, Inc. All rights reserved. Technical Support FEATURESAttenuation range: 0.25 dB LSB steps to 31.75 dBLow insertion loss:1.1 dB at 1.0 GHz1.3 dB at2.0 GHzTypical step error: less than ±0.1 dBExcellent attenuation accuracy: less than ±0.2 dBLow phase shift error: 6° phase shift at 1.0 GHzSafe state transitionsHigh linearity1 dB compression (P1dB): 31 dBm typicalInput third-order intercept (IP3): 54 dBm typicalRF settling time (0.05 dB final RF output): 250 nsSingle supply operation: 3.3 V to 5.0 VESD rating: Class 2 (2 kV human body model (HBM))24-lead, 4 mm × 4 mm LFCSP package: 16 mm2 APPLICATIONSCellular infrastructureMicrowave radios and very small aperture terminals (VSATs) Test equipment and sensorsIF and RF designsFUNCTIONAL BLOCK DIAGRAMVGND65432112962-1Figure 1.GENERAL DESCRIPTIONThe HMC1119 is a broadband, highly accurate, 7-bit digital attenuator, operating from 0.1 GHz to 6.0 GHz with 31.5 dB attenuation control range in 0.25 dB steps.The HMC1119 is implemented in a silicon process, offering very fast settling time, low power consumption, and high ESD robustness. The device features safe state transitions and is optimized for excellent step accuracy and high linearity over frequency and temperature range. The RF input and output are internally matched to 50 Ω and do not require any external matching components. The design is bidirectional; therefore, the RF input and output are interchangeable. The HMC1119 has an on-chip regulator that can support a wide supply operating range from 3.3 V to 5.0 V with no performance change in electrical characteristics. The HMC1119 incorporates a driver that supports serial (3-wire) and parallel controls of the attenuator.The HMC1119 comes in a RoHS-compliant, compact, 4 mm ×4 mm LFCSP package.A fully populated evaluation board is available.HMC1119Data SheetRev. C | Page 2 of 15TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Specifications ............................................................... 3 Timing Specifications .................................................................. 4 Absolute Maximum Ratings ....................................................... 5 ESD Caution .................................................................................. 5 Pin Configuration and Function Descriptions ............................. 6 Interface Schematics..................................................................... 7 Typical Performance Characteristics ............................................. 8 Insertion Loss, Return Loss, State Error, Step Error, andRelative Phase ................................................................................8 Input Power Compression and Third-Order Intercept ......... 10 Theory of Operation ...................................................................... 11 Serial Control Interface ............................................................. 11 RF Input Output ......................................................................... 11 Parallel Control Interface .......................................................... 12 Power-Up Sequence ................................................................... 12 Applications Information .............................................................. 13 Evaluation Printed Circuit Board ............................................ 13 Packaging and Ordering Information ......................................... 15 Outline Dimensions ................................................................... 15 Ordering Guide .. (15)REVISION HISTORY4/2018—Rev. B to Rev CChanges to Figure 23 ...................................................................... 12 Change to PCB Description, Table 7 ............................................ 13 Updated Outline Dimensions . (15)9/2017—Rev. A to Rev. BChanged CP-24-16 to HCP-24-3 ................................. Throughout Updated Outline Dimensions ....................................................... 15 Changes to Ordering Guide .......................................................... 15 8/2017—Rev. 0 to Rev. AAdded Timing Specifications Section ............................................. 4 Moved Table 2 .................................................................................... 4 Changes to Figure 5 and Figure 6 .................................................... 7 Changes to Serial Control Interface Section ............................... 11 Moved Figure 22 and Table 6 ........................................................ 11 Changes to Figure 23 ...................................................................... 12 Moved Parallel Control Interface Section, Direct Parallel Mode Section, Latched Parallel Mode Section, Power-Up Sequence Section, and Power-Up States Section ......................................... 12 Updated Outline Dimensions . (15)9/2016—Revision 0: Initial VersionData SheetHMC1119Rev. C | Page 3 of 15SPECIFICATIONSELECTRICAL SPECIFICATIONSV DD = 3.3 V to 5.0 V , T A = 25°C, 50 Ω system, unless otherwise noted. Table 1.ParameterTest Conditions/Comments Min Typ Max Unit FREQUENCY RANGE0.1 6.0 GHz INSERTION LOSS 0.1 GHz to 1.0 GHz 1.1 1.8 dB 0.1 GHz to 2.0 GHz 1.3 2.0 dB 0.1 GHz to 4.0 GHz 1.6 2.3 dB0.1 GHz to 6.0 GHz 2.0 2.8 dB ATTENUATION 0.2 GHz to 6.0 GHzRange Delta between minimum and maximum attenuation states31.75dB AccuracyReferenced to insertion loss; all attenuation states−(0.05 + 4% of attenuation setting) +(0.05 + 4% of attenuation setting) dB Step Error All attenuation states±0.1 dB Overshoot Between all attenuation states ≤0.1 dB RETURN LOSSAll attenuation states ATTNIN, ATTNOUT 1.0 GHz 23 dBm 2.0 GHz 22 dBm 4.0 GHz 19 dBm6.0 GHz 17 dBm RELATIVE PHASE 1.0 GHz 6 Degrees 2.0 GHz 18 Degrees 4.0 GHz 38 Degrees6.0 GHz 58 Degrees SWITCHING CHARACTERISTICSt RISE , t FALL 10%/90% RF output60 ns t ON , t OFF50% CTL to 10%/90% RF output 150 ns Settling Time 50% CTL to 0.05 dB final RF output 250 ns50% CTL to 0.10 dB final RF output 200 ns INPUT LINEARITYAll attenuation states, 0.2 GHz to 6 GHz 0.1 dB Compression (P0.1dB) 30 dBm 1 dB Compression (P1dB)31 dBm Input Third-Order Intercept (IP3) Two-tone input power = 16 dBm/tone, ∆f = 1 MHz 54 dBm SUPPLY CURRENT (I DD ) V DD = 3.3 V 0.3 mAV DD = 5.0 V 0.6 mA CONTROL VOLTAGE THRESHOLD <1 µA typical Low V DD = 3.3 V 0 0.5 VV DD = 5.0 V 0 0.8 V High V DD = 3.3 V 2.0 3.3 VV DD = 5.0 V 3.5 5.0 V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range (V DD )3.0 5.4 V Digital Control Voltage Range For P/S, CLK, SERNIN, LE, D0 to D6 pins 0 V DD V RF Input PowerAll attenuation states, T CASE = 85°C 24 dBm Case Temperature (T CASE )−40+85°CHMC1119 Data SheetTIMING SPECIFICATIONSSee Figure 23 and Figure 24 for the timing diagrams.Table 2.Parameter Description Min Typ Max Unitt SCK Minimum serial period, see Figure 23 70 nst CS Control setup time, see Figure 23 15 nst CH Control hold time, see Figure 23 20 nst LN LE setup time, see Figure 23 15 nst LEW Minimum LE pulse width, see Figure 24 10 nst LES Minimum LE pulse spacing, see Figure 23 630 nst CKN Serial clock hold time from LE, see Figure 23 0 nst PH Hold time, see Figure 24 10 nst PS Setup time, see Figure 24 2 nsRev. C | Page 4 of 15Data SheetHMC1119Rev. C | Page 5 of 15ABSOLUTE MAXIMUM RATINGSTable 3.ParameterRating RF Input Power (T CASE = 85°C) 25 dBmDigital Control Inputs (P/S, CLK, SERNIN, LE, D0 to D6) −0.3 V to V DD + 0.5 V Supply Voltage (V DD )−0.3 V to +5.5 V Continuous Power Dissipation (P DISS ) 0.31 W Thermal Resistance (at Maximum Power Dissipation) 156°C/WTemperatureChannel Temperature 135°CStorage−65°C to +150°C Maximum Reflow Temperature 260°C (MSL3 Rating) ESD Sensitivity (HBM)2 kV (Class 2)Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.ESD CAUTIONHMC1119Data SheetRev. C | Page 6 of 15PIN CONFIGURATION AND FUNCTION DESCRIPTIONSV SERNIN NOTES1. THE EXPOSED PAD AND GND PINS MUST BE CONNECTED TO RF DC GROUND.CLK LE GND ATTNOUT GNDG N G N G N G N G N G N D 6D 5D 4D 3D 2D 112962-002Figure 2. Pin ConfigurationTable 4. Pin Function DescriptionsPin No. Mnemonic Description1, 19 to 24 D0, D6 to D1 Parallel Control Voltage Inputs. These pins attain the required attenuation (see Table 6). There is no internal pull-up or pull-down on these pins; therefore, these pins must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. 2 V DD Supply Voltage Pin.3P/S Parallel/Serial Control Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. For parallel mode, set Pin 3 to low; for serial mode, set Pin 3 to high.4, 6 to 13, 15 GND Ground. The package bottom has an exposed metal pad that must connect to the printed circuit board (PCB) RF/dc ground. See Figure 4 for the GND interface schematic.5 ATTNIN Attenuator Input. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required. Select the value of the capacitor based on the lowest frequency of operation. See Figure 5.14 ATTNOUT Attenuator Output. This pin is dc-coupled and matched to 50 Ω.A blocking capacitor is required. Select the value of the capacitor based on the lowest frequency of operation. See Figure 5.16 LE Serial/Parallel Interface Latch Enable Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.17 CLK Serial Interface Clock Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.18 SERNIN Serial interface Data Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.EPADExposed Pad. The exposed pad must be connected to RF/dc ground.Data SheetHMC1119Rev. C | Page 7 of 15INTERFACE SCHEMATICSD0TO D512962-021Figure 3. D0 to D6 Interface12962-022Figure 4. GND Interface12962-023Figure 5. ATTIN and ATTOUT InterfaceV 12962-024Figure 6. P/S, LE, CLK, and SERNIN InterfaceHMC1119Data SheetRev. C | Page 8 of 15TYPICAL PERFORMANCE CHARACTERISTICSINSERTION LOSS, RETURN LOSS, STATE ERROR, STEP ERROR, AND RELATIVE PHASE–4–3–2–1I N S E R T I O N L O S S (d B )FREQUENCY (GHz)12962-003Figure 7. Insertion Loss vs. Frequency at Various TemperaturesFREQUENCY (GHz)–50–40–30–20–100I N P U T R E T U R N L O S S (d B)12962-004Figure 8. Input Return Loss (Major States Only)–2.0–1.6–1.2–0.8–0.400.40.81.21.62.0043281216202428S T A T E E R R O R (d B )ATTENUATION STATE (dB)12962-007Figure 9. State Error vs. Attentuation State, 0.1 GHz to 0.5 GHzFREQUENCY (GHz)–35–30–25–20–15–10–50N O R M A L I Z E D A T T E N U A T I O N (d B )12962-005Figure 10. Normalized Attenuation (Major States Only)FREQUENCY (GHz)–60–50–40–30–20–10O U T P U T R E T U R N L O S S (d B )12962-006Figure 11. Output Return Loss (Major States Only)–1–0.8–0.6–0.4–0.200.20.40.60.81S T A T E E R R O R (d B )043281216202428ATTENUATION STATE (dB)12962-009Figure 12. State Error vs. Attentuation State, 1 GHz to 6 GHzData SheetHMC1119Rev. C | Page 9 of 15–2.0–1.5–1.0–0.500.51.01.52.0S T A T E E R R O R (d B )FREQUENCY (GHz)12962-008Figure 13. State Error vs. Frequency, Major States Only–60–40–20020406080R E L A T I V E P H A S E (d e g )FREQUENCY (GHz)12962-011Figure 14. Relative Phase vs. Frequency, Major States Only–1.0–0.8–0.6–0.4–0.200.20.40.60.81.0S T E P E R R O R (d B )FREQUENCY (GHz)12962-010Figure 15. Step Error vs. Frequency, Major States OnlyHMC1119Data SheetRev. C | Page 10 of 15INPUT POWER COMPRESSION AND THIRD-ORDER INTERCEPT152025303540P 1d B(d B m )FREQUENCY (GHz)12962-012Figure 16. P1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 1 GHz152025303540P 0.1d B(d B m )FREQUENCY (GHz)12962-013Figure 17. P0.1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 1 GHzFREQUENCY (GHz)3040506070I P 3(d B m )0.200.40.60.8 1.012962-014Figure 18. IP3 vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.1 GHz to 1 GHz 152025303540P 1d B (dB m )FREQUENCY (GHz)12962-015Figure 19. P1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 6 GHz152025303540P 0.1d B (dB m )FREQUENCY (GHz)12962-016Figure 20. P0.1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 6 GHzFREQUENCY (GHz)3040506070I P 3(d B m )12962-017Figure 21. IP3 vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.1 GHz to 6 GHzTHEORY OF OPERATIONThe HMC1119 incorporates a 7-bit fixed attenuator array that offers an attenuation range of 0.25 dB to 31.75 dB, with 0.25 dB steps. An integrated driver provides both serial and parallel mode control of the attenuator array (see Figure 22).The HMC1119 can be in either serial or parallel mode control by setting the P/S pin to high or low, respectively (see Table 5). The 7-bit data, loaded in either serial or parallel mode, then latches with the control signal, LE, to determine the attenuator value. Table 5. Mode Selection Table 1P/S Pin State Control Mode Low Parallel HighSerial1The P/S pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating.SERIAL CONTROL INTERFACEThe HMC1119 utilizes a 3-wire serial to parallel (SPI)configuration, as shown in the serial mode timing diagram (see Figure 23): serial data input (SERNIN), clock (CLK), and latch enable (LE). The serial control interface activates when the P/S pin is set to high.In serial mode, the 7-bit SERNIN data is clocked MSB first on rising CLK edges into the shift register; then, LE must betoggled high to latch the new attenuation state into the device. The LE must be set low to clock a set of 7-bit data into the shift register because CLK is masked to prevent the attenuator value from changing if LE is kept high.In serial mode operation, both the serial control inputs (LE, CLK, SERNIN) and the parallel control inputs (D0 to D6) must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. It is recommended to connect the parallel control inputs to ground and to use pull-down resistors on all serial control input lines if the device driving these input lines goes high impedance during hibernation.RF INPUT OUTPUTThe attenuator in the HMC1119 is bidirectional; the ATTNIN and ATTNOUT pins are interchangeable as the RF input and output ports. The attenuator is internally matched to 50 Ω at both input and output; therefore, no external matching components are required. The RF pins are dc-coupled; therefore, dc blocking capacitors are required on RF lines.SERNIND0D1D2D3D4D5D6CLK P/S LERFOUTPUT12962-018Figure 22. Attenuator Array Functional Block DiagramTable 6. Truth TableDigital Control Input 1Attenuation State (dB) D6 D5 D4 D3 D2 D1D0 Low Low Low Low Low Low Low 0 (reference) Low Low Low Low Low Low High 0.25 Low Low Low Low Low High Low 0.5 Low Low Low Low High Low Low 1.0 Low Low Low High Low Low Low 2.0 Low Low High Low Low Low Low 4.0 Low High Low Low Low Low Low 8.0 High Low Low Low Low Low Low 16.0 HighHighHigh High HighHigh High 31.751Any combination of the control voltage input states shown in Table 6 provides an attenuation equal to the sum of the bits selected.12962-19 P/SSERNINCLKLEFigure 23. Serial Control Timing DiagramPARALLEL CONTROL INTERFACEThe parallel control interface has seven digital control input lines(D6 to D0) to set the attenuation value. D6 is the most significantbit (MSB) that selects the 16 dB attenuator stage, and D0 is theleast significant bit (LSB) that selects the 0.25 dB attenuator stage(see Figure 22).In parallel mode operation, both the serial control inputs (LE, CLK,SERNIN) and the parallel control inputs (D0 to D6) must always bekept at a valid logic level (V IH or V IL) and must not be left floating. Itis recommended to connect the serial control inputs to ground andto use pull-down resistors on all parallel control input lines ifthe device driving these input lines goes high impedance duringhibernation.Setting P/S to low enables parallel mode. There are two modes ofparallel operation: direct parallel mode and latched parallel mode.Direct Parallel ModeFor direct parallel mode, the latch enable (LE) pin must be kepthigh. Change the attenuation state using the control voltage inputs(D0 to D6) directly. This mode is ideal for manual control of theattenuator and using hardware, switches, or a jumper.Latched Parallel ModeThe latch enable (LE) pin must be low when changing thecontrol voltage inputs (D0 to D6) to set the attenuation state.When the desired state is set, LE must be toggled high to transferthe 7-bit data to the bypass switches of the attenuator array, thentoggled low to latch the change into the device (see Figure 24).LED6TO D0P/S12962-2Figure 24. Latched Parallel Mode Timing DiagramPOWER-UP SEQUENCEThe ideal power-up sequence is as follows:1.Power up GND.2.Power up V DD.3.Power up the digital control inputs (the relative order ofthe digital control inputs is not important).4.Power up the RF input.For latched parallel mode operation, LE must be toggled. Therelative order of the digital inputs is not important as long as theinputs are powered up after GND and V DD.Power-Up StatesThe logic state of the device is at maximum attenuation when, atpower up, LE is set to low. The attenuator latches in the desiredpower-up state approximately 200 ms after power up.APPLICATIONS INFORMATIONEVALUATION PRINTED CIRCUIT BOARDThe schematic of the evaluation board, EV2HMC1119LP4M , is shown in Figure 25. The PCB is four-layer material with a copper thickness of 0.7 mils on each layer. Each copper layer is separated with a dielectric material. The top dielectric material is 10-mil RO4350 with a typical dielectric constant of 3.48. The middle and bottom dielectric materials are FR-4 material, used for mechanical strength and to meet the overall board thickness of approximately 62 mils, which allows SMA connectors to beAll RF and dc traces are routed on the top copper layer. The RF transmission lines are designed using coplanar waveguide model (CPWG) with a width of 18 mils, spacing of 17 mils, and dielectric thickness of 10 mils to maintain 50 Ω characteristic impedance. The inner and bottom layers are solid ground planes. For optimal electrical and thermal performance, an ample number of vias are populated around the transmission lines and under the package exposed pad. The evaluation board layout serves as a recommenda-tion for the optimal performance on both electrical and thermal aspects.12962-026Figure 25. EV2HMC1119LP4M Evaluation PCBTable 7. Bill of MaterialsItem Value 1 DescriptionManufacturer 2 J1, J2 PCB mount SMA connector J318-pin dc connectorTP1, TP2Through hole mount test point C1, C3 100 pF Capacitor, 0402 package C6 10 μF Capacitor, 0603 package C71000 pF Capacitor, 0402 package R1 to R11 0 Ω Resistor, 0402 package R12 to R25 100 kΩ Resistor, 0402 packageSW1, SW2 SPDT four-position DIP switchU1 HMC1119 digital attenuator Analog Devices, Inc.PCB 3600-01280-00-1 evaluation PCB EV2HMC1119LP4M 4 from Analog Devices1 Blank cells in the Value column indicate that there is no specific value recommendation for the listed component.2Blank cells in the Manufacturer column indicate that there is no specific manufacturer recommendation for the listed component. 3Circuit board material is Arlon 25FR. 4Reference this number when ordering the full evaluation PCB. See the Ordering Guide section.12962-027Figure 26. Applications CircuitPACKAGING AND ORDERING INFORMATIONOUTLINE DIMENSIONS0.50BSC0.500.400.30BOTTOM VIEWTOP VIEWSIDE VIEW4.104.00 SQ 3.900.950.850.750.05 MAX 0.02 NOM0.20 REFCOPLANARITY0.08PIN 1INDICATORFOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.12-08-2017-C0.300.250.180.20 MIN2.852.70 SQ 2.55EXPOSED PAD00SEATING PLANEDETAIL A (JEDEC 95)Figure 27. 24-Lead Lead Frame Chip Scale Package [LFCSP]4 mm × 4 mm Body and 0.85 mm Package Height(HCP-24-3)Dimensions shown in millimetersORDERING GUIDEModel 1Temperature Range MSL Rating 2 Package DescriptionPackage Option HMC1119LP4ME −40°C to +85°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] HCP-24-3 HMC1119LP4METR −40°C to +85°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] HCP-24-3 EV2HMC1119LP4MEvaluation Board1 All models are RoHS compliant.2See the Absolute Maximum Ratings section.©2016–2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12962-0-4/18(C)。

LG LED显示器用户手册说明书

Printed in China24GQ50F 27GQ50F24GQ50B 27GQ50B 24GQ40W 27GQ40Wor/ ou/ o*MBM67514803*(2112-REV00)Depending on country / Selon le pays / Según del país(LED Monitor/ Moniteur à DEL/ Monitor LED)English Quick Setup GuidePlease read this manual carefully before operating your set and retain it for future reference.Français Guide de configuration rapideVeuillez lire ce guide de configuration rapide attentivement avant d’utiliser votre produit et conservez-le pour pouvoir vous y reporter ultérieurement.Español Guía Rápida de ConfiguraciónLea atentamente este manual antes de poner en funcionamiento el equipo y consérvelo para futuras consultas.English It is recommended that use the supplied components.Français Il est recommandé d’utiliser les composants fournis.Español Se recomienda utilizar los componentes suministrados.English You can download manuals from the LGE website.Français Vous pouvez télécharger les guides pour ce produit à partir du site Web de LGE. Español Puede descargar los manuales del sitio web de LGE.1235 4or/ ou/ oEnglish• Using a DVI to HDMI / DP (DisplayPort) to HDMI cable may cause compatibility issues.• Make sure to use the supplied cable. Otherwise, this may cause the device to malfunction.Français• L’utilisation d’un câble DVI à HDMI/DP (DisplayPort) à HDMI peut présenter des problèmes de compatibilité.• Assurez-vous d’utiliser le câble fourni avec le produit. Le non-respect de cette consigne peut entraîner undysfonctionnement du périphérique.Español• El uso de un cable de DVI a HDMI / DP (DisplayPort) a HDMI puede causar problemas de compatibilidad.• Asegúrese de utilizar el cable suministrado con el producto. De lo contrario, puede provocar que el dispositivo no funcionecorrectamente.12213or/ ou/ o24GQ50F/ 24GQ50B/ 24GQ40WEnglishDimensions (Width x Depth x Height)Weight Recommended Resolution Vertical Frequency With Stand539.5 x 196.0 x 414.2 (mm)21.2 x 7.7 x 16.3 (inches)Without Stand539.5 x 39 x 322.2 (mm)21.2 x 1.5 x 12.6 (inches)With Stand3.57 kg(7.87 lbs)Without Stand2.97 kg(6.54 lbs)1920 x 1080HDMI: 144 HzDisplayPort: 165 HzFrançaisDimensions (largeur x profondeur x hauteur)Poids Résolution recommandée Fréquence verticale Avec socle539,5 x 196,0 x 414,2 (mm)21,2 x 7,7 x 16,3 (po)Sans socle539,5 x 39 x 322,2 (mm)21,2 x 1,5 x 12,6 (po)Avec socle3,57 kg(7,87 lb)Sans socle2,97 kg(6,54 lb)1 920 x 1 080HDMI: 144 HzDisplayPort: 165 HzEspañolDimensiones (anchura x profundidad x altura)Peso Resolución recomendada Frecuencia vertical Soporte incluido539,5 x 196,0 x 414,2 (mm)Soporte no incluido539,5 x 39 x 322,2 (mm)Soporteincluido3,57 kgSoporte noincluido2,97 kg1 920 x 1 080HDMI: 144 HzDisplayPort: 165 Hz Clasificación de potencia19 V 1,5 AEspecificaciones de Adaptador de ca/ccSalida19 V 1,7 AEntrada100-240 V~ 50/60 Hz 1,2 A27GQ50F/ 27GQ50B/ 27GQ40WEnglishDimensions (Width x Depth x Height)Weight Recommended Resolution Vertical Frequency With Stand613.7 x 201.6 x 456.1 (mm)24.1 x 7.9 x 17.9 (inches)Without Stand613.7 x 39.3 x 364.1 (mm)24.1 x 1.5 x 14.3 (inches)With Stand3.87 kg(8.53 lbs)Without Stand3.25 kg(7.16 lbs)1920 x 1080HDMI: 144 HzDisplayPort: 165 HzFrançaisDimensions (largeur x profondeur x hauteur)Poids Résolution recommandée Fréquence verticale Avec socle613,7 x 201,6 x 456,1 (mm)24,1 x 7,9 x 17,9 (po)Sans socle613,7 x 39,3 x 364,1 (mm)24,1 x 1,5 x 14,3 (po)Avec socle3,87 kg(8,53 lb)Sans socle3,25 kg(7,16 lb)1 920 x 1 080HDMI: 144 HzDisplayPort: 165 HzEspañolDimensiones (anchura x profundidad x altura)Peso Resolución recomendada Frecuencia vertical Soporte incluido613,7 x 201,6 x 456,1 (mm)Soporte no incluido613,7 x 39,3 x 364,1 (mm)Soporteincluido3,87 kgSoporte noincluido3,25 kg1 920 x 1 080HDMI: 144 HzDisplayPort: 165 Hz Clasificación de potencia19 V 1,9 AEspecificaciones de Adaptador de ca/ccSalida19 V 2,1 AEntrada100-240 V~ 50/60 Hz 1,2 A。

上学派手表测评

上学派手表测评引言上学派手表是一款专为学生设计的智能手表，具备多种功能，如通话、定位、健康监测等。

本文将对上学派手表进行全面的测评，包括外观设计、功能体验、使用便捷性等方面进行评述。

外观设计上学派手表采用了简约而时尚的设计风格，表盘为方形，表带可选颜色丰富，适合不同年龄段的学生。

手表的大小适中，佩戴舒适，不会给孩子带来负担。

同时，手表的材质坚固耐用，能够有效抵抗日常碰撞和摩擦。

功能体验通话功能上学派手表支持双向通话，可以与家长或紧急联系人进行语音通话。

通话质量清晰稳定，不会出现杂音或断线的情况。

此外，手表还可以设定白名单，只允许特定的号码与手表通话，保障孩子的安全。

定位功能上学派手表内置了GPS定位芯片，能够实时追踪孩子的位置。

家长可以通过手机APP随时查看孩子的位置，确保孩子的安全。

定位精准度高，误差较小，能够准确显示孩子所处的位置。

健康监测上学派手表还具备健康监测功能，可以实时监测孩子的心率、步数等健康指标。

家长可以通过手机APP查看孩子的健康数据，及时关注孩子的身体状况。

此外，手表还具备久坐提醒功能，提醒孩子适时活动，促进身体健康。

学习辅助上学派手表还具备学习辅助功能，包括闹钟、备忘录、课程表等功能。

孩子可以通过手表设置闹钟提醒自己的作息时间，记录备忘事项，查看课程表等。

这些功能有助于孩子规划时间，提高学习效率。

使用便捷性上学派手表操作简单易懂，孩子可以快速上手。

手表的界面清晰明了，功能布局合理，方便孩子进行操作。

此外，手表还具备防水功能，可以在日常生活中正常使用，无需担心水的侵入损坏手表。

总结综上所述，上学派手表是一款功能齐全、外观时尚、使用便捷的智能手表。

它不仅具备通话、定位、健康监测等基本功能，还具备学习辅助功能，能够帮助孩子更好地管理时间和学习。

同时，手表的外观设计简约而时尚，适合不同年龄段的学生佩戴。

总体而言，上学派手表是学生们的良好选择。

QD75系列Mitsubishi通用可编程逻辑控制器用户手册说明书

Type QD75P/QD75D Positioning ModuleUser’s Manual(Hardware)QD75P1, QD75D1QD75P2, QD75D2QD75P4, QD75D4 Thank you for buying the Mitsubishi general-purpose programmable logic controller MELSEC-Q SeriesPrior to use, please read both this manual and detailed manual thoroughly and familiarize yourself with the product.1999 MITSUBISHI ELECTRIC CORPORATIONA-1! SAFETY PRECAUTIONS !(Always read before starting use)When using this equipment, thoroughly read this manual. Also pay careful attention to safety and handle the module properly.These precautions apply only to this equipment.Refer to the User’s Manual of the CPU module to use for a description of the PLC system safety precautions.These "Safety Precautions" classify the safety precautions into two categories:"DANGER" and "CAUTION".Procedures which may lead to a dangerous condition and cause death or serious injury, if not carried out properly.Procedures which may lead to a dangerous condition and cause superficial to medium injury, or physical damage only, if not carried out properly.Depending on circumstances, procedures indicated by CAUTION may also be linked to serious results.In any case, it is important to follow the directions for usage.Store this manual in a safe place so that you can take it out and read it whenever necessary. Always forward it to the end user.[INSTALLATION PRECAUTION]CAUTION! Use the PLC in an environment that meets the general specifications contained in CPU module User's Manual to use.Using this PLC in an environment outside the range of the general specifications may cause electric shock, fire, malfunction, and damage to or deterioration of the product.! When installing the module, securely insert the module fixing tabs into the mounting holes of the base module while pressing the installation lever located at the bottom of the module downward.Improper installation may result in malfunction, breakdown or the module coming loose and dropping.Securely fix the module with screws if it is subject to vibration or shock during use.Tighten the screws within the range of specified torque.If the screws are loose, it may cause the module to fallout or malfunction.If the screws are tightened too much, it may cause damage to the screw and/or the module, resulting in fallout or malfunction.! Switch all phases of the external power supply off when mounting or removing the module.Not doing so may cause damage to the module.! Do not directly touch the conductive area or electronic components of the module.Doing so may cause malfunction or failure in the module.[WIRING PRECAUTION]CAUTION! Check the layout of the terminals and then properly route the wires to the module.! Solder connectors for external device properly.Insufficient soldering may cause malfunction.! Be careful not to let foreign matter such as sawdust or wire chips get inside the module.These may cause fires, failure or malfunction.! The top surface of the module is covered with protective film to prevent foreign objects such as cable offcuts from entering the module when wiring.Do not remove this film until the wiring is complete.Before operating the system, be sure to remove the film to provide adequate ventilation. ! Securely connect the connectors for the drive module to the connectors on the module and firmly tighten the two screws.! Be sure to fix cables leading from the module by placing them in a duct or clamping them.Cables not placed in the duct or without clamping may hang or shift, allowing them to be accidentally pulled, which may cause a module malfunction and cable damage.! When removing the cable or power supply cable from the module, do not pull the cable.When removing the cable with a connector, hold the connector on the side that isconnected to the module.Pulling the cable that is still connected to the module may cause malfunction or damage to the module or cable.! The cable used for connecting the QD75 external input/output signal and the drivemodule should not be routed near or bundled with the main circuit cable, power cable and/or other such load-carrying cables other than those for the PLC. These cables should be separated by at least 100 mm (3.94 in.). They can cause electricalinterference, surges and inductance that can lead to mis-operation.A-2Revisions* The manual number is noted at the lower left of the back cover. Print Date*Manual Number RevisionOct., 1999IB(NA)-0800063-A First editionFeb., 2000IB(NA)-0800063-B Addition"Confirmation to EMC directive"Jun., 2001IB(NA)-0800063-C ModificationAbout Manuals, Conformation to the EMCDirective and Low Voltage Instruction,2. Performance Specification, 4. PartIdentification Nomenclature, 5.Wiring Nov., 2001IB(NA)-0800063-D Addition1. Overview,2. PerformanceSpecifications, 4. Part IdentificationNomenclature, 5.2 External Interface, 5.3Wiring of the differential driver commonterminal, 6. External DimensionsThis manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mitsubishi electric Corporation cannot be held responsiblefor any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.1999 MITSUBISHI ELECTRIC CORPORATIONA-3CONTENTS1. Overview (1)2. Performance Specifications (2)3. Handling (3)3.1 Handling Precautions (3)4. Part Identification Nomenclature (4)5. Wiring (6)5.1 Wiring Precautions (6)5.2 External Interface (8)5.3 Wiring of the differential driver common terminal (10)6. External Dimensions (11)About ManualsThe following manuals are related to this product.Referring to this list, please request the necessary manuals.Related ManualManual nameManual No. (Model code)Type QD75P/QD75D Positioning Module User’s Manual SH-080058(13JR09)GX Configurator-QP Version 2 Operating Manual (SW2D5C-QD75P-E)SH-080172 (13JU19)Conformation to the EMC Directive and Low Voltage InstructionFor details on making Mitsubishi PLC conform to the EMC directive and low voltage instruction when installing it in your product, please refer to Chapter 3, "EMC Directive and Low Voltage Instruction" of the using PLC CPU module User's Manual(Hardware).The CE logo is printed on the rating plate on the main body of the PLC that conforms to the EMC directive and low voltage instructionTo make this product conform to the EMC directive and low voltage instruction, please refer to Chapter 5 “Wiring”.A-41. OverviewThis manual explains how to handle the Positioning Module, model numbers QD75P1, QD75P2, QD75P4, QD75D1, QD75D2 and QD75D4 (hereinafter collectively referred to as the QD75).After unpacking the QD75, please verify that the corresponding product as listed below is enclosed in the package.Model name Description Quantity QD75P1QD75P1 Positioning Module (1-axis open-collector output system)1 QD75P2QD75P2 Positioning Module (2-axes open-collector output system)1 QD75P4QD75P4 Positioning Module (4-axes open-collector output system)1 QD75D1 Positioning Module (1-axis differential driver output system)1 QD75D1Differential driver common terminal1QD75D2 Positioning Module (2-axes differential driver output system)1 QD75D2Differential driver common terminal1QD75D4 Positioning Module (4-axes differential driver output system)1 QD75D4Differential driver common terminal1A differential driver common terminal is packed with the QD75D1, QD75D2 and QD75D4.The user should arrange for a connector for external wiring since it is not provided in the package.* Connector type" A6CON1 (Soldering type, straight out)" A6CON2 (Crimping type, straight out)" A6CON4 (Soldering type, usable for straight out and diagonal out)* A6CON2 crimping tool" Model name: FCN-363T-T005/H" Supplier’s offices :" FUJITSU TAKAMISAWA AMERICA,INC.250E Caribbean Drive Sunnyvale, CA 94089 U.S.ATel: (1-408)745-4900" FUJITSU TAKAMISAWA EUROPE B.V.Jupiterstaat 13-15, our 2132 Hoofddorp, The NetherlandTel: (31)23-5560910" FUJITSU TAKAMISAWA EUROPE B.V. Zweiniederlassung Deutschland Schatzbogen 86 D-81829 Munchen GermanyTel: (49)89-42742320" FUJITSU TAKAMISAWA EUROPE (UK)Network House, Morres Drive, Maidenhead, Berkshire, SL6 4FHUnited KingdomTel: (44)1628-504600" FUJITSU TAKAMISAWA EUROPE B.V.127 Chemin Des Bassins, Europarc, Cleteril 94035 Cleterll 94035FranceTel: (33)145139940" FUJITSU TAKAMISAWA ASIA PACIFIC PTE LIMITED102E Pasir Panjang Road, #04-01 Citilink Warehouse Complex,Singapore 118529Tel: (65)375-8560" FUJITSU TAKAMISAWA HONG KONG CO., LTD.Suite 913 Ocean Centre, 5 Canton Road, TST, Kowloon, Hong KongTel: (852)2881-849512. Performance Specifications(1) The performance specifications for the QD75P1, QD75P2 and QD75P4SpecificationItemQD75P1QD75P2QD75P4 Number of axes 1 axis 2 axes 4 axes Maximum output pulsecount200 kpulse/sMaximum connectiondistance between servos2m (6.56ft)Applicable wire size 0.3 mm2 (when A6CON1 is used), AWG#24 (when A6CON2 is used), AWG#23 (when A6CON4 is used)Applicable connector A6CON1, A6CON2, A6CON4 (sold separately)Number of I/O occupied points32 points(I/O assignment: 32 points for intelligent function module )5 V DC currentconsumption0.40A0.46A0.58A Flash ROM write count Max. 100000 timesWeight0.15kg (0.33lb.)0.15kg (0.33lb.)0.16kg (0.35lb.)(2) The performance specifications for the QD75D1, QD75D2, and QD75D4SpecificationItemQD75D1QD75D2QD75D4 Number of axes 1 axis 2 axes 4 axes Maximum output pulsecount1 Mpulse/sMaximum connectiondistance between servos10m (32.81ft)Applicable wire size 0.3 mm2 (when A6CON1 is used), AWG#24 (when A6CON2 is used), AWG#23 (when A6CON4 is used)Applicable connector A6CON1, A6CON2, A6CON4 (sold separately)Number of I/O occupied points32 points(I/O assignment: 32 points for intelligent function module)DC5V current consumption0.52A0.56A0.82A Flash ROM write count Max. 100000 timesWeight0.15kg (0.33lb.)0.15kg (0.33lb.)0.16kg (0.35lb.) For the general specifications of the QD75, see User's Manual for CPU module used. (3) Differential driver common terminal specifications (QD75D1, QD75D2,QD75D4 only)Applicable wire size12AWGSolid wire: 0.2 to 0.8 mm2 2 pcs.Rated multiple wireconnection size Stranded wire: 0.2 to 0.8 mm2 2 pcs.Screw tightening torque50N·cm23. HandlingCAUTION! Use the PLC in an environment that meets the general specificationscontained in CPU module User's Manual to use.Using this PLC in an environment outside the range of the generalspecifications may cause electric shock, fire, malfunction, and damage to or deterioration of the product.! When installing the module, securely insert the module fixing tabs into the mounting holes of the base module while pressing the installation leverlocated at the bottom of the module downward.Improper installation may result in malfunction, breakdown or dropping out of the module.Securely fix the module with screws if it is subject to vibration or shockduring use.Tighten the screws within the range of specified torque.If the screws are loose, it may cause fallout or malfunction.If the screws are tightened too much, it may cause damage to the screw and/or the module, resulting in fallout or malfunction.! Switch all phases of the external power supply off when mounting orremoving the module.Not doing so may cause damage to the module.! Do not directly touch the conductive area or electronic components of the module.Doing so may cause malfunction or failure in the module.3.1 Handling Precautions(1) Since the module case is made of resin, do not drop it or subject it tostrong impact.(2) The module can easily be secured to the base unit using the hookslocated at the top of the module. However, if the module is to be placed in an area that is subject to strong vibration or impact, we recommend that it is secured with module mounting screws (to be provided by the user). In this case, tighten the module mounting screws within the following torque range.Module mounting screws (M3 × 12): Tightening torque range is from 36 to48 N⋅cm.344. Part Identification Nomenclature(1) Part identification nomenclature (a) For QD75P4(b) For QD75D42)1)3)Number NameNumber Name1)LED Display3)Differential driver common terminal2)External device connector(The QD75P1, QD75P2, QD75D1and QD75D2 have the right-hand side connector only.)(2) LED display contentsDetails of indicationPoints to be confirmedErrorRUN ##AX1#AX2#AX3ERR.##AX4Extinguishment of RUN LED The hardware is faulty or watch dog timer error occurs.RUN $#AX1#AX2#AX3ERR.##AX4Lighting of RUN LED,Extinguishment of ERR. LED The module is normal.RUN $#AX1#AX2#AX3ERR.$#AX4Lighting of ERR. LEDSystem errorRUN $#AX1#AX2#AX3ERR.##AX4Extinguishment of AX1 to AX4 LEDs During axis stop,during axis standbyRUN $$AX1#AX2#AX3ERR.##AX4Lighting of AX1 (Same even if the other axis is lit)During axis operation RUN $%AX1#AX2#AX3ERR.% #AX4Flashing of ERR. LED Flashing of AX1 LED(Same even if the other axis flashes)Axis error QD75 4RUN ERR.AX4AX3AX2AX1RUN $$AX1$AX2$AX3ERR.$$AX4Lighting of all LEDsThe hardware is faultyThe symbols in the Display column indicate the following statuses: : Turns OFF, : Illuminates, : Flashes5(3) External device connector signal layoutAxis 4 (AX4)Axis 3 (AX3)Axis 2 (AX2)Axis 1 (AX1)Pin layoutPinNo.Signal name PinNo.Signal name PinNo.Signal name PinNo.Signal name 2B20Vacant 2A20Vacant 1B20PULSER B-1A20PULSER B+2B19Vacant2A19Vacant1B19PULSER A-1A19PULSER A+PULSE COM PULSE COM PULSE COM PULSE COM *32B18PULSE R-*32A18PULSE R-*31B18PULSE R-*31A18PULSE R-PULSE R PULSE R PULSE R PULSE R *32B17PULSE R+*32A17PULSE R+*31B17PULSE R+*31A17PULSE R+PULSE COM PULSE COM PULSE COM PULSE COM *32B16PULSE F-*32A16PULSE F-*31B16PULSE F-*31A16PULSE F-PULSE F PULSE F PULSE F PULSE F *32B15PULSE F+*32A15PULSE F+*31B15PULSE F+*31A15PULSE F+2B14CLRCOM 2A14CLRCOM 1B14CLRCOM 1A14CLRCOM 2B13CLEAR 2A13CLEAR 1B13CLEAR 1A13CLEAR 2B12RDYCOM 2A12RDYCOM 1B12RDYCOM 1A12RDYCOM 2B11READY 2A11READY 1B11READY 1A11READY 2B10PGOCOM 2A10PGOCOM 1B10PGOCOM 1A10PGOCOM 2B9PGO52A9PGO51B9PGO51A9PGO52B8PGO242A8PGO241B8PGO241A8PGO242B7COM 2A7COM 1B7COM 1A7COM 2B6COM 2A6COM 1B6COM 1A6COM 2B5CHG 2A5CHG 1B5CHG 1A5CHG 2B4STOP 2A4STOP 1B4STOP 1A4STOP 2B3DOG 2A3DOG 1B3DOG 1A3DOG 2B2RLS 2A2RLS 1B2RLS 1A2RLS B20B19B18B17B16B15B14B13B12B11B10B9B8B7B6B5B4B3B2B1A20A19A18A17A16A15A14A13A12A11A10A9A8A7A6A5A4A3A2A12B1FLS2A1FLS1B1FLS1A1FLS*1: The pin numbers represented by 1 indicate the pin numbers for theright side connector, while the pin numbers represented by 2 indicate the pin numbers for the left side connector.*2: For QD75P1 or QD75D1, 1B1 to 1B18 will be “vacant.”*3: When signal names are shown in upper and lower rows, the upper rowshows the signal name for the QD75P1, QD75P2 and QD75P4 and the lower row shows the signal name for the QD75D1, QD75D2 and QD75D4.65. Wiring5.1 Wiring Precautions(1) If cables to connect to QD75 absolutely must be positioned near (within 100 mm) the power line, use a general shielded cable. The shield must be grounded on the QD75 side.(The shield must be grounded onthe QD75 side.)The length between the connector and the shielded cables should be the shortest possible.[Processing example of shielded cables]Remove the covering from all shielded cables and bindthe appeared shield with a conductive tape.(2) The shielded cable for connecting QD75 can be secured in place.If the shielded cable is not secured, unevenness or movement of theshielded cable or careless pulling on it could result in damage to theQD75 or drive unit or shielded cable or defective cable connections could cause mis-operation of the unit.(3) To make this product conform to the EMC directive and low voltageinstruction, be sure to use of a AD75CK type cable clamp (manufactured by Mitsubishi Electric) for grounding to the control box.Using the AD75CK, you can tie four cables of about 7mm outsidediameter together for grounding.785.2 External InterfaceThe internal circuits of interface for connecting external devices to the QD75are shown by the schematic diagrams in the tables below (for the QD75P1 and QD75D1).(1) Input (common to QD75P1 and QD75D1)External wiringPin number Internal circuit Signal nameWiring requirement*11A1Upper-limit LS signal FLS 1A2Lower-limit LS signalRLS 1A3Near-point dog signal DOG 1A4Stop signal STOP 1A5Externalcommand signal CHG 1A61A7Common COM 1A19PULSER A+(+)1B19Manual pulse generator A phasePULSER A-(-)1A20PULSER B+(+)1B20Manual pulse generator B phasePULSER B-(-)1A11Drive unit Ready READY 1A12Drive unit Ready common RDY COM 1A81A9Zero signal PG024PG05When not using higher limit LS5 VAB0VManual pulse generator (MR-HDP01)24 V DC5 V DCWhen not using lower limit LS*21A10Zero signal commonPG0 COM*1: In the column indicating whether wiring is required, the symbol means"wiring is required" and means "wiring is required as needed."*2: Either polarity can be connected to the common (COM).(2) Output (for QD75P1)External wiringPinnumberInternal circuit Signal nameWiringrequirement * 1A13Deviationcounter clearCLEAR1A14Common CLEAR COM1A15PULSE F1A16CWA phasePULSE PULSE COM1A17PULSE R1A18CCWB phaseSIGN PULSE COM(3) Output (for QD75D1)External wiringPinnumberInternal circuit Signal nameWiringrequirement * 1A13Deviationcounter clearCLEAR1A14Common CLEAR COM1A15PULSE F+1A16CWA phasePULSE PULSE F-1A17PULSE F+1A18CCWB phaseSIGN PULSE F-——Differentialdrivercommonterminal—*: In the column indicating whether wiring is required, the symbol means "wiring is required" and means "wiring is required as needed."95.3 Wiring of the differential driver common terminalWhen the differential driver output type (QD75D1/QD75D2/QD75D4) is used, an inter-common potential difference may occur between the differential driver common terminal and the differential receiver common terminal of the drive unit.To eliminate an inter-common potential difference, connect between the differential driver common terminal of the QD75D1/QD75D2/QD75D4 and the differential receiver common terminal of the drive unit.When the common terminal of the drive unit is a photocoupler connection type, it need not be connected to the differential driver common terminal of theQD75D1/QD75D2/QD75D4 since an inter-common potential difference does not exist. (For the driver unit specifications, refer to the manual of the drive unit used.)The following gives an example of wiring the differential driver common terminal of the QD75D1/QD75D2/QD75D4.Up to two wires can be connected to one differential driver common terminal. (Refer to "2. Performance Specifications" for details.)10116. External Dimensions(1) QD75P1/QD75P2/QD75P4QD75P1QD75P2QD75P4QD75P2QD75P4AX1AX2AX3AX4QD75P1AX1AX2AX1RUN ERR.AX4AX3AX2AX1RUNERR.AX2AX1RUNERR.AX127.4(1.08)90 (3.54)136 (5.35)46 (1.81)98 (3.86)Unit : mm (inch)12(2) QD75D1/QD75D2/QD75D4QD75D1QD75D2QD75D4QD75D2QD75D4AX1AX2AX3AX4QD75D1AX1AX2AX1RUN ERR.AX4AX3AX2AX1RUNERR.AX2AX1RUNERR.AX127.4(1.08)90 (3.54) 136 (5.35)46 (1.81)98 (3.86)12 (0.47)Unit : mm (inch)WarrantyMitsubishi will not be held liable for damage caused by factors found not to be the cause of Mitsubishi; machine damage or lost profits caused by faults in the Mitsubishi products;damage, secondary damage, accident compensation caused by special factorsunpredictable by Mitsubishi; damages to products other than Mitsubishi products; and to other duties.For safe use" This product has been manufactured as a general-purpose part for general industries,and has not been designed or manufactured to be incorporated in a device or system used in purposes related to human life." Before using the product for special purposes such as nuclear power, electric power,aerospace, medicine or passenger movement vehicles, consult with Mitsubishi." This product has been manufactured under strict quality control. However, when installing the product where major accidents or losses could occur if the product fails, install appropriate backup or failsafe functions in the system.U.S.A Mitsubishi Electric Automation Inc. 500 Corporate Woods Parkway Vernon Hills, IL 60061 Tel : +1-847-478-2100Brazil MELCO-TEC Rep. Com.e Assessoria Tecnica Ltda. Av. Rio Branco, 123-15 ,and S/1507, Rio de Janeiro, RJ CEP 20040-005, Brazil Tel : +55-21-221-8343Germany Mitsubishi Electric Europe B.V. German Branch Gothaer Strasse 8 D-40880 Ratingen, GERMANY Tel : +49-2102-486-0U.K Mitsubishi Electric Europe B.V. UK Branch Travellers Lane, Hatfield, Herts., AL10 8XB,UK Tel : +44-1707-276100Italy Mitsubishi Electric Europe B.V. Italian Branch Centro Dir. Colleoni, Pal. Perseo - Ingr.2 Via Paracelso 12, 20041 Agrate B., Milano, Italy Tel:+39-039-60531Spain Mitsubishi Electric Europe B.V. Spanish Branch Carretera de Rubi 76-80 08190 - Sant Cugat del Valles, Barcelona, Spain Tel:+34-935-653135South Africa Circuit Breaker Industries LTD. Private Bag 2016, Isando 1600, Johannesburg, South Africa Tel : +27-11-928-2000Hong Kong Ryoden Automation Ltd. 10th Floor, Manulife Tower, 169 Electric Road, North Point, HongKong Tel : +852-2887-8870China Ryoden International Shanghai Ltd. 3F Block5 Building Automation Instrumentation Plaza 103 Cao Bao Rd. Shanghai 200233 China Tel : +86-21-6475-3228Taiwan Setsuyo Enterprise Co., Ltd. 6F., No.105 Wu-Kung 3rd.RD, Wu-Ku Hsiang, Taipei Hsine, Taiwan Tel : +886-2-2299-2499Korea HAN NEUNG TECHNO CO.,LTD. 1F Dong Seo Game Channel Bldg., 660-11, Deungchon-dong Kangsec-ku, Seoul, Korea Tel : +82-2-3668-6567Singapore Mitsubishi Electric Asia Pte, Ltd. 307 ALEXANDRA ROAD #05-01/02, MITSUBISHI ELECTRIC BUILDING SINGAPORE 159943 Tel : +65-473-2480Thailand F. A. Tech Co.,Ltd. 898/28,29,30 S.V.City Building,Office Tower 2,Floor 17-18 Rama 3 Road, Bangkpongpang, Yannawa, Bangkok 10120 Tel : +66-2-682-6522Indonesia P.T. Autoteknindo SUMBER MAKMUR Jl. Muara Karang Selatan Block A Utara No.1 Kav. No.11 Kawasan Industri/ Pergudangan Jakarta - Utara 14440 Tel : +62-21-663-0833India Messung Systems Put,Ltd. Electronic Sadan NO:111 Unit No15, M.I.D.C BHOSARI,PUNE-411026 Tel : +91-20-7128927Australia Mitsubishi Electric Australia Pty. Ltd. 348 Victoria Road, PostalBag, No 2, Rydalmere, N.S.W 2116, Australia Tel : +61-2-9684-7777Country/Region Sales office/Tel Country/Region Sales office/TelWhen exported from Japan, this manual does not require application to the Ministry of Economy, Trade and Industry for service transaction permission.Specifications subject to change without notice.Printed in Japan on recycled paper.HEAD OFFICE : 1-8-12, OFFICE TOWER Z 14F HARUMI CHUO-KU 104-6212, JAPANNAGOYA WORKS : 1-14, YADA-MINAMI5, HIGASHI-KU, NAGOYA, JAPAN。

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香港智腾2010款嵌入式DVR

香港智腾“ZAXTEAM”2010款嵌入式（2010年元旦正式上市）设备简介：压缩支持4/8/16路PAL / NTSC / SECAM制式视频信号输入，采用H.264视频压缩技术，实现4/8/16路实时CIF格式独立硬件压缩；支持4路音频信号输入，采用G.726/ADPCM-IMA音频压缩标准，实现音频信号独立实时压缩，压缩码率24Kbps；视频和音频信号压缩生成复合码流，音视频同步。

也可只录制视频流；4档录像质量可选，也支持自定义设置码率、帧率；支持视频参数调节；支持多区域移动侦测；支持通道名与时间OSD叠加。

录像文件记录分为手动录像模式与计划录像模式；计划录像可设置多种录像文件类型：定时录像、移动侦测录像、报警录像、移动侦测录像、报警录像；内置SATA硬盘接口，支持SATA硬盘（单盘可达2GB）；支持USB设备对硬盘录像资料的备份与剪辑：U盘、USB移动硬盘、USB CD/DVD RW等。

预览与回放预览与回放支持VGA、TV、S-Video同时显示输出。

支持4路回放模式，支持快放、慢放、快退、单帧等回放模式。

支持OSD叠加、通道名叠加；本地录像、报警、移动侦测状态显示。

控制支持云台或球机控制；支持云台或球机预置点、巡航轨迹设置及调用。

报警本地报警（包括异常事件、移动侦测）联动；报警联动：触发录像、联动报警输出、联动云台预置点、声音报警、上传报警中心。

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支持基于客户端软件的图像浏览，回放和设备管理ZAXTEAM-nVideoMaster，可以方便的进行联网管理支持手机监看控制技术指标。

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78第345期移动办公体验。

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本书力图描述一个真实的创业场景，将创业过程中的陷阱一一排除，针对创业公司要面临的各种挑战给出切实可行的应对方法，希望能够帮助创业者解决从公司创办到公司发展过程中可能出现的问题。

近年来，人身保险除保障功能外，其财富管理和传承功能逐渐被大众认识，保险进一步成为应对婚姻、传承、债务、税务风险的一项重要金融工具。

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通过阅读本书，读者能够掌握正确的投保思路，结合自身的实际需求，利用好保险的法商功能。

华为军团作战主书名：《华为军团作战：重塑行业服务模式与经营格局》作者：易鸣ISBN：9787121447006出版社：电子工业出版社华为公司全球技术服务部原副总裁、亚太地区部原副总裁王旭东、中软国际流程 IT 业务线总裁邵兆署亲做推荐序。

珍珠控台2010内置程序中文说明

1.Circle1--------------------位置：原地划小8字（整体灯具同时变化）2.CircleEven---------------位置：曲线波浪1（整体灯具同时变化）3.RainbowEffect-----------颜色渐变14.RainbowSpread----------颜色渐变25.Iris--------------------------光圈变化（整体灯具同时变化）6.IrisSpread-----------------光圈变化（灯具反方向分开依序变化）7.DimmerSpread-----------光闸变化（灯具反方向分开依序变化）8.Spiral-----------------------位置:原地乱划圈（整体灯具同时变化）9. Random--------------------位置：反方向各一次乱划圈(整体灯具同时变化)10.RandomSpread-----------位置：单双数灯具反方向各一次乱划圈11.TiltSaw--------------------位置：曲线X轴波浪（各排灯具反方向同时变化）12.PanSaw--------------------位置:曲线Y轴波浪（各排灯具反方向同时变化）13.DimmerSaw---------------光闸：（灯具从单个依序开关变化，即满亮位置单个逐步关到50%）14.DimmerPulse1.1-----光闸：（灯具从满亮位置单个逐步关到50%后注：是开完再逐步开到满亮位置）速度慢15.DimmerPulse1.2--------光闸：（灯具从满亮位置单个逐步关到50%后再逐步开到满亮位置）速度快16.DimmerPulse1.3-------光闸：（灯具从满亮位置单个逐步关到50%后接着马上再逐步开到满亮位置）速度中17.DimmerPulse2.1-----光闸：（灯具从50%亮位置两个逐步开到满亮后接着马上再逐步关到50%位置）速度慢18.DimmerPulse3.1-----光闸：（灯具从50%亮位置两个逐步开到满亮后接着马上再逐步关到50%位置）速度快19.DimmerPulseUP--光闸：（灯具整体从50%亮位置开始逐步开到满亮接着马上再逐步关到50%位置）速度快20.DimmerStepDuw----光闸：（灯具整体从满亮位置开始逐步关到50%亮后接着马上再逐步开到满亮位置）速度快21.CircleParallel-------------位置：原地划大8字（整体灯具同时变化）单个不带Flash22.CircleEven----------------位置：曲线波浪2（整体灯具同时变化）23.CircleOdd/eve------------位置：曲线波浪3（单双灯具分开反方向变化）24.PanSwing-----------------位置：曲线波浪4（X轴方向整体灯具同时变化）25.TiltSwing-----------------位置：曲线波浪5（Y轴方向整体灯具同时变化）26.SquareParallel------------位置：原地划中8字（整体灯具同时变化）27.SquareEven---------------位置：曲线波浪6（整体灯具同时变化）速度慢28.SquareOdd/eve-----------位置：单双数灯具反方向各一次划8字29.SquareComers------------位置：单双数灯具反方向划8字并走波浪线，速度中30. SquareSpread7-----------位置：整体灯具同方向划8字并走波浪曲线，速度慢31.DimmerParallel----------位置：原地划大8字（整体灯具同时变化）单个带Flash32.DimmerEven-------------位置：曲线波浪7字（整体灯具同时变化）速度慢，单个带Flash33.DimmerOdd/eve---------位置：单双数灯具反方向各一次划8字，单个带Flash34.PanSaw--------------------位置：整体灯具Y轴方向划8字并走波浪曲线，速度中35.TiltSaw--------------------位置：整体灯具X轴方向划8字并走波浪曲线，速度中36.RandomParallel----------位置：整体灯具每划完一次8字后就跳跃式Flash转方向再划8字，速度中37.RandomEven---------位置：整体灯具每划完一次8字和走波浪曲线后跳跃式Flash转方向再划8字，速度中38.RandomOdd/eve---------位置：单双数灯具反方向每划一次8字后就跳跃式Flash转方向再划8字，速度中39.SpiralParallel-------------位置：整体灯具同时划完一次小8字后再划一次大8字循环速度慢--中40.SpiralEven1--------------位置：单双数灯具反方向划完一次小8字后再划一次大8字循环速度慢--中41.RainbowParallel----------位置：单双数灯具反方向划完一次小8字后再划一次大8字循环速度慢--中42.RainbowEven-------------颜色变化：整体灯具进行彩虹色彩渐变，带Flash43.RainbowOdd/eve---------颜色变化：单双数灯具进行色彩渐变44.RainbowUser--------------颜色变化：整体灯具进行淡（半周）的色彩渐变45.RainbowEvenUser------颜色变化：整体灯具进行淡（半周）的彩虹色彩渐变，按顺序做到右或到左，带Flash46.CyanParallel---------------颜色变化：整体灯具进行C值（半周）颜色色彩渐变47.CyanEven-----------------颜色变化：整体灯具进行C值颜色渐变并顺序走动变化，所经灯具变化后恢复然后循环48.CyanOdd/eve-------------颜色变化：单双数灯具进行C值颜色色彩渐变，带Flash49.CyanUser------------------颜色变化：整体灯具进行C值颜色色彩渐变50.CyanEvenUser--颜色变化：整体灯具进行C值颜色渐变并顺序走动变化，所经灯具变化后恢复然后循环，带Flash51.MagentaParallel----------颜色变化：整体灯具进行M值（半周）颜色色彩渐变52.MagentaEven--颜色变化：整体灯具进行M值颜色色彩渐变并进行顺序走动变化，所经灯具变化后恢复然后循环53.MagentaOdd/eve----------颜色变化：单双数灯具分别进行M值颜色色彩渐变，带Flash。

深圳市盛泰时钟表有限公司介绍企业发展分析报告

Enterprise Development专业品质权威Analysis Report企业发展分析报告深圳市盛泰时钟表有限公司免责声明:本报告通过对该企业公开数据进行分析生成，并不完全代表我方对该企业的意见，如有错误请及时联系;本报告出于对企业发展研究目的产生，仅供参考，在任何情况下，使用本报告所引起的一切后果，我方不承担任何责任:本报告不得用于一切商业用途，如需引用或合作，请与我方联系:深圳市盛泰时钟表有限公司1企业发展分析结果1.1 企业发展指数得分企业发展指数得分深圳市盛泰时钟表有限公司综合得分说明：企业发展指数根据企业规模、企业创新、企业风险、企业活力四个维度对企业发展情况进行评价。

该企业的综合评价得分需要您得到该公司授权后，我们将协助您分析给出。

1.2 企业画像类别内容行业仪器仪表制造业-通用仪器仪表制造资质空产品服务是：钟表、手表及配件的设计、技术开发与销1.3 发展历程2工商2.1工商信息2.2工商变更2.3股东结构2.4主要人员2.5分支机构2.6对外投资2.7企业年报2.8股权出质2.9动产抵押2.10司法协助2.11清算2.12注销3投融资3.1融资历史3.2投资事件3.3核心团队3.4企业业务4企业信用4.1企业信用4.2行政许可-工商局4.3行政处罚-信用中国4.4行政处罚-工商局4.5税务评级4.6税务处罚4.7经营异常4.8经营异常-工商局4.9采购不良行为4.10产品抽查4.11产品抽查-工商局4.12欠税公告4.13环保处罚4.14被执行人5司法文书5.1法律诉讼（当事人）5.2法律诉讼（相关人）5.3开庭公告5.4被执行人5.5法院公告5.6破产暂无破产数据6企业资质6.1资质许可6.2人员资质6.3产品许可6.4特殊许可7知识产权7.1商标7.2专利7.3软件著作权7.4作品著作权7.5网站备案7.6应用APP7.7微信公众号8招标中标8.1政府招标8.2政府中标8.3央企招标8.4央企中标9标准9.1国家标准9.2行业标准9.3团体标准9.4地方标准10成果奖励10.1国家奖励10.2省部奖励10.3社会奖励10.4科技成果11土地11.1大块土地出让11.2出让公告11.3土地抵押11.4地块公示11.5大企业购地11.6土地出租11.7土地结果11.8土地转让12基金12.1国家自然基金12.2国家自然基金成果12.3国家社科基金13招聘13.1招聘信息感谢阅读:感谢您耐心地阅读这份企业调查分析报告。

深圳市鸿泰时钟表有限公司介绍企业发展分析报告

Enterprise Development专业品质权威Analysis Report企业发展分析报告深圳市鸿泰时钟表有限公司免责声明:本报告通过对该企业公开数据进行分析生成，并不完全代表我方对该企业的意见，如有错误请及时联系;本报告出于对企业发展研究目的产生，仅供参考，在任何情况下，使用本报告所引起的一切后果，我方不承担任何责任:本报告不得用于一切商业用途，如需引用或合作，请与我方联系:深圳市鸿泰时钟表有限公司1企业发展分析结果1.1 企业发展指数得分企业发展指数得分深圳市鸿泰时钟表有限公司综合得分说明：企业发展指数根据企业规模、企业创新、企业风险、企业活力四个维度对企业发展情况进行评价。

该企业的综合评价得分需要您得到该公司授权后，我们将协助您分析给出。

1.2 企业画像类别内容行业仪器仪表制造业-通用仪器仪表制造资质空产品服务是：表壳、钟表配件、手表、饰品的技术开发1.3 发展历程2工商2.1工商信息2.2工商变更2.3股东结构2.4主要人员2.5分支机构2.6对外投资2.7企业年报2.8股权出质2.9动产抵押2.10司法协助2.11清算2.12注销3投融资3.1融资历史3.2投资事件3.3核心团队3.4企业业务4企业信用4.1企业信用4.2行政许可-工商局4.3行政处罚-信用中国4.4行政处罚-工商局4.5税务评级4.7经营异常4.8经营异常-工商局4.9采购不良行为4.10产品抽查4.11产品抽查-工商局4.12欠税公告4.14被执行人5司法文书5.1法律诉讼（当事人）5.2法律诉讼（相关人）5.3开庭公告5.4被执行人5.5法院公告5.6破产暂无破产数据6企业资质6.1资质许可6.2人员资质6.3产品许可6.4特殊许可7知识产权7.1商标信息最多显示100条记录，如需更多信息请到企业大数据平台查询7.2专利7.3软件著作权7.4作品著作权7.5网站备案7.6应用APP7.7微信公众号8招标中标8.1政府招标8.2政府中标8.3央企招标8.4央企中标9标准9.1国家标准9.2行业标准9.3团体标准9.4地方标准10成果奖励10.1国家奖励10.2省部奖励10.3社会奖励10.4科技成果11土地11.1大块土地出让11.2出让公告11.3土地抵押11.4地块公示11.5大企业购地11.6土地出租11.7土地结果11.8土地转让12基金12.1国家自然基金12.2国家自然基金成果12.3国家社科基金13招聘13.1招聘信息感谢阅读:感谢您耐心地阅读这份企业调查分析报告。

2 百事特高尔夫2010产品报价-罗

1234产品图片型号T101T102T103T104品名磁性球钉(胶钉,75MM)磁性球钉(75MM)磁性球钉(75MM)双支装磁性球钉(胶钉)单位盒盒盒盒价格￥2.50￥2.50￥2.50￥5.00产品图片型号T107T108T109T110品名磁性球钉(80MM)磁性球钉(80MM)磁性球钉(胶钉,80MM)磁性球钉(80MM)单位盒盒盒盒价格￥2.50￥5.00￥2.50￥2.50产品图片型号T113T114T115T116品名复位磁性球钉(70MM)复位磁性球钉(70MM)复位磁性球钉(70MM)复位磁性球钉(70/80MM)单位盒盒盒盒价格￥2.70￥2.70￥2.70￥5.00产品图片型号T119T120T121T122地址:广东深圳市龙岗区平湖平龙公路巨志工业区腾成工业园3#厂房电话:13670086百事特高尔夫用品报价单品名复位磁性球钉(83MM)复位磁性球钉(83MM)旋转球钉(70/80MM)旋转球钉(70/80MM)单位盒盒盒盒价格￥2.70￥3.50￥6.00￥6.00产品图片型号T125T126T127T128品名反弹母子球钉（80MM）反弹母子球钉（80MM）三支装反弹球钉(80MM)双支装反弹球钉(80MM)单位盒盒盒盒价格￥2.50￥2.50￥3.50￥4.50产品图片型号T131T132T133T134品名空气球钉(80MM)空气球钉(70/80MM)弹簧开花球钉(胶钉)弹簧球钉(70MM)单位盒盒盒盒价格￥3.00￥5.00￥2.00￥2.00产品图片型号T137T138T139T140品名弹簧球钉(80MM)弹簧球钉(80MM)三支装弹簧球钉(70/80MM)四支装弹簧球钉(80MM)单位盒盒盒盒价格￥2.00￥2.00￥3.50￥8.50产品图片型号T143T144T145T146品名弹簧开花球钉(80MM)弹簧开花球钉(80MM)新款开花球钉(70MM)新款开花球钉(80MM)单位盒盒盒盒价格￥3.50￥4.50￥2.00￥2.00产品图片型号T149T150T151T152品名橡胶球钉(80MM)橡胶球钉(80MM)记分球钉(80MM)记分球钉(80MM)单位盒盒盒盒价格￥2.50￥2.50￥3.00￥3.00产品图片型号T155T156T157T158品名皇冠球钉毛刷球钉(70/80MM)零阻力球钉铁杆球钉单位盒盒袋盒价格￥2.00￥4.50￥4.00￥3.00产品图片型号T161T162T163T164品名木钉(42/54/70/83MM)胶钉(42/54/70/84MM)限位木钉(42/54/70/83MM)限位胶钉(48/76/83MM)单位袋袋袋袋价格￥1.00￥1.00￥1.00￥1.00品名竹钉胶钉限位胶钉木钉单位个个个个价格 4.2CM:0.06 4.2CM:0.05 4.8CM:0.07 4.2CM:0.05价格 5.4CM:0.07 5.4CM:0.06 5.4CM:0.06价格7.0CM:0.087.0CM:0.077.0CM:0.07价格8.3CM:0.098.3CM:0.087.6CM:0.098.3CM:0.085.4CM:0.08产品图片型号C208C209C210C215品名五星红旗帽夹球包形帽夹帽夹帽夹单位袋盒袋袋价格￥6.00￥6.00￥10.00￥10.00型号C218C219C220C221品名花形品钻帽夹新款圆形水钻帽夹圆形水钻帽夹水平仪帽夹单位盒盒盒盒价格￥9.00￥9.00￥9.00￥5.00品名帽夹帽夹笑脸水钻帽夹圆形品牌帽夹单位袋袋盒盒价格￥10.00￥10.00￥10.00￥4.00产品图片型号品名新款三角复位磁性球钉小礼盒装水钻帽夹多功能帽夹帽夹单位盒盒盒袋价格￥2.50￥10.00￥10.00￥10.00产品图片型号D101D102D103D104品名锌合金果岭叉锌合金果岭叉锌合金果岭叉锌合金果岭叉单位个个个个价格￥12.00￥9.00￥7.00￥7.00产品图片型号D107D111D112D113品名锌合金果岭叉开瓶器果岭叉五金果岭叉五金果岭叉单位个个个个数量￥7.00￥4.00￥2.00￥1.50产品图片型号G101G102G103G104品名礼盒礼盒礼盒礼盒单位盒盒盒盒价格￥42.00￥23.00￥20.00￥17.00产品图片型号G107G108G109G111品名礼盒礼盒礼盒礼盒单位盒盒盒盒价格￥13.00￥8.00￥6.00￥45.00产品图片品名礼盒礼盒礼盒礼盒单位盒盒盒盒价格￥80.00￥100.00￥75.00￥70.00产品图片品名高尔夫笔筒高尔夫笔筒最新款发声挥杆练习棒小球包单位个个个个价格￥33.00￥42.00￥100.00￥20.00产品图片型号A101A102A103A104品名画球器画球器,捡球器球夹吸球器单位个盒个个价格￥5.00￥4.00￥3.50￥5.00产品图片型号A107A108A109A110品名球头扳手球夹画球器双面刷三用刷单位盒盒把个价格￥8.00￥6.00￥6.00￥4.00产品图片型号A113品名圆头刷五用工具新款洒水刷盒装姿势纠正器单位个个把盒价格￥6.00￥6.00￥15.00￥9.00产品图片型号A115A116A117A118品名加重环木钉座推杆毯(30*300CM)推杆毯(60*300CM)单位个个个个价格￥4.00￥4.00￥100.00￥180.00产品图片型号A121A122A122A123品名捡球筒捞球器不锈钢捞球器高尔夫皮带(可伸缩)单位个3节:29元/个个盒4节:38元/个5节:42元/个6节:45元/个产品图片型号A125A126A127品名PU球空洞球无孔空心球高尔夫球展示架单位盒盒盒个价格￥9.00￥4.00￥4.00￥80.00价格￥35.00￥70.00￥39.00产品图片型号A129品名表形记分器鼠形记分器圆形记分器方形记分器单位个个个个价格￥5.00￥4.00￥12.00￥4.00产品图片型号A132品名自动回球器怪形记分器木质记分笔木质记分笔单位盒个支支价格￥28.00￥6.00￥0.25￥0.20产品图片品名室内练习网切杆练习网切杆练习网三面切杆练习网单位个个个个价格小:120元￥80.00￥90.00￥110.00价格中: 180元价格大:230元产品图片品名老款挥杆棒挥杆练习器(进口草)推杆盘推杆盘单位盒盒个个价格￥35.00￥70.00￥4.00￥4.00产品图片品名塑胶球位标(25MM)新款转钉器手套架鞋钉(金属螺丝18个装)单位个个个盒价格￥0.07￥7.00￥5.00￥21.00产品图片手臂姿势纠正器品名三角形气垫挥杆娇正器8字形气垫挥杆娇正器曲譬纠正器单位个个个个价格￥80.00￥80.00￥40.00￥40.00产品图片品名鞋钉(金属螺丝18个装)鞋钉(三角卡扣,18个装)鞋钉(快速旋转,18个装)毛巾(41*53CM)单位盒盒盒条价格￥30.00￥30.00￥30.00￥14.00以上单从为RMB出厂价,不含运费和税56T105T106磁性球钉(胶钉,80MM)磁性球钉(80MM)盒盒￥2.50￥2.50T111T112四支装磁性球钉(80MM)四支装磁性球钉(80MM)盒盒￥10.00￥10.00T117T118复位磁性球钉(83MM)复位磁性球钉(83MM)盒盒￥2.70￥2.70T123T12473 联系人:罗小姐70086036 传真:0755-********价单三段球钉(48MM)三段球钉(48MM)盒盒￥6.00￥6.00T129T130空气球钉(70MM)空气球钉(80MM)盒盒￥3.00￥3.00T135T136龙凤弹簧球钉双支装弹簧球钉(70/80MM) (70/80MM)盒盒￥3.00￥4.00T141T142弹簧开花球钉(80MM)弹簧开花球钉(80MM)盒盒￥2.00￥2.00T147T148新款开花球钉(80MM)新款开花球钉(80MM)盒盒￥3.50￥4.00T153T154四支装橡胶球钉(80MM)软胶套球钉盒盒￥8.50￥2.00T159T160练习球钉竹钉(54/70/83MM)盒袋￥5.00￥1.00冬用球钉扁形球钉套个￥4.50￥0.12限位木钉胶钉个筒3.8CM:0.084.2CM:800个装:43元5.4CM:0.09 5.4CM:500个装:33元7.0CM:0.107.0CM:400个装:35元8.3CM:0.118.3CM:300个装:30元C216C217帽夹蝴蝶形水钻帽夹袋盒￥10.00￥9.00新款三角磁性球钉品牌帽夹盒盒￥5.00￥2.50笑脸帽夹高尔夫单层木质握把盒把￥4.00￥30.00球形水钻帽夹球头笔座礼盒盒套￥12.00￥60.00D105D106锌合金果岭叉锌合金果岭叉个个￥7.00￥7.00D115D116塑胶带刷果岭叉塑胶果岭叉个个￥1.00￥0.40G105G106礼盒礼盒盒盒￥10.00￥12.00礼盒礼盒盒盒￥50.00￥48.00高尔夫笔筒高尔夫笔筒个个￥26.00￥33.00小球包手婉固定器个盒￥8.00￥40.00A105A122-1手套架红色捡球器/新捡球器个个(5节)￥12.00(15尺/45元,6尺/36元)A111A112七用工具刷与叉个个￥5.00￥6.00A113A114姿势纠正器(散装)铁杆套(10个/盒)个盒￥6.00￥27.00A119A120风力练习器新款挥杆棒盒盒￥150.00￥60.00A123A124高尔夫皮带(不可伸缩)彩虹球盒盒A127A128高尔夫球展示架测距器个个￥80.00￥7.00￥75.00￥6.00A131小形记分器长方形记分器个个￥4.00￥7.00塑胶记分笔高尔夫记分珠支个￥0.20￥6.00塑胶推杆练习毯个把（握把是塑胶）30*300CM自动￥45.00￥135.00软胶推杆盘塑胶球位标(19MM)个个￥5.00￥0.04球擦亚克力球包牌个个￥5.007腿部纠正器３米红木推杆练习毯个个￥40.00￥180.00高尔夫帽子把握把是水晶材质顶￥35.00￥20.00费和税.。

香港的手机运营商

按持牌公司数目计，本港共有8间流动电话网络营办商：1. 香港流动通讯有限公司(CSL) --- WCDMA 2100, GSM 900, GSM 1800 (PCS)2. 和记电话有限公司--- WCDMA 2100, GSM 900, GSM 1800 (PCS)3. 数码通电讯有限公司--- GSM 900, GSM 1800 (PCS)4. SmarTone 3G Limited --- WCDMA 21005. 汇亚通讯有限公司--- GSM 1800 (PCS)6. SUNDAY 3G (Hong Kong) Limited --- WCDMA 21007. 新世界流动电话有限公司--- GSM 1800 (PCS)8. 中国移动万众电话有限公司--- GSM 1800 (PCS)以财团计，本港共有5间流动电话网络营办商：1. CSL New World Mobility Limited --- 是香港流动通讯有限公司和新世界流动电话有限公司的母公司2. 和记电讯国际有限公司--- 是和记电话有限公司的母公司3. 数码通电讯集团有限公司--- 是数码通电讯有限公司和SmarTone 3G Limited的母公司，新鸿基地产是该公司的大股东。

4. SUNDAY Communications Limited --- 是汇亚通讯有限公司和SUNDAY 3G (Hong Kong) Limited的母公司，PCCW是该公司的大股东。

5. 中国移动万众电话有限公司此外，香港还有7间流动虚拟网络营办商：1. 电讯数码移动有限公司2. 润迅通信(香港)有限公司3. 联通国际通信有限公司4. 中港通电讯有限公司5. 中信电讯1616有限公司6. 通汇电讯有限公司7. IMC Networks Limited8.Source from OFTAWelcome To Download !!!欢迎您的下载，资料仅供参考！。

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