OD-405-60-040中文资料

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FGH40N60SMD;中文规格书,Datasheet资料

FGH40N60SMD;中文规格书,Datasheet资料

Typ.
-
Max.
0.43 1.5 40
Package Marking and Ordering Information
Device Marking
Device
FGH40N60SMD
FGH40N60SMD
Package
TO-247
Reel Size
-
Tape Width
-
Units
oC/W oC/W oC/W
IF = 20A
TC = 25oC TC = 175oC
Erec
Reverse Recovery Energy
TC = 175oC
trr
Diode Reverse Recovery Time IF =20A, dIF/dt = 200A/ms
TC = 25oC TC = 175oC
Qrr
Diode Reverse Recovery Charge
TC = 25oC TC = 175oC
Min.
-
Typ.
2.3 1.67 48.9 36 110 46.8 445
Max
2.8 -
Unit s
V uJ ns
nC
FGH40N60SMD Rev. A
3
/

FGH40N60SMD 600V, 40A Field Stop IGBT
100
20V
12V
15V
10V
Collector Current, IC [A]
Collector Current, IC [A]
80
80
60
60
VGE = 8V
VGE = 8V
40

29400资料

29400资料

PRELIMINARY
(February, 2001, Version 0.1)
1
AMIC Technology, Inc.
元器件交易Hale Waihona Puke
A29400 Series
The host system can detect whether a program or erase operation is complete by reading the I/O7 ( Data Polling) and I/O6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The A29400 is fully erased when shipped from the factory. The hardware sector protection feature disables operations for both program and erase in any combination of the sectors of memory. This can be achieved via programming equipment. The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any other sector that is not selected for erasure. True background erase can thus be achieved. Power consumption is greatly reduced when the device is placed in the standby mode. The hardware RESET pin terminates any operation in progress and resets the internal state machine to reading array data.

DSEC60-04A中文资料

DSEC60-04A中文资料

Conditions
TC = 140°C; rectangular, d = 0.5
TVJ = 45°C; tp = 10 ms (50 Hz), sine TVJ = 25°C; non-repetitive IAS = tbd A; L = tbd µH VA = 1.5·VR typ.; f = 10 kHz; repetitive
VRSM V
400
VRRM V
400
Type DSEC 60-04A
TO-247 AD
A
A
C
A
C
A
C (TAB)
A = Anode, C = Cathode, TAB = Cathode
Symbol IFRMS IFAVM
IFSM EAS
IAR TVJ TVJM Tstg Ptot Md Weight
Constants for ZthJC calculation:
i
Rthi (K/W)
ti (s)
1
0.465
2
0.179
3
0.256
0.0052 0.0003 0.0396
0.01
0.001
0.00001
0.0001
0.001
0.01
Fig. 7 Transient thermal resistance junction to case
supplies (SMPS) q Inductive heating q Uninterruptible power supplies (UPS) q Ultrasonic cleaners and welders
Advantages
q Avalanche voltage rated for reliable operation

CD400 405系列常用芯片资料

CD400 405系列常用芯片资料

CMOS (CD40、45系列)器件速查来源:全民业务网作者:不详型号器件名称厂牌备注CD4000 双3输入端或非门+单非门 TICD4001 四2输入端或非门 HIT/NSC/TI/GOLCD4002 双4输入端或非门 NSCCD4006 18位串入/串出移位寄存器 NSCCD4007 双互补对加反相器 NSCCD4008 4位超前进位全加器 NSCCD4009 六反相缓冲/变换器 NSCCD4010 六同相缓冲/变换器 NSCCD4011 四2输入端与非门 HIT/TICD4012 双4输入端与非门 NSCCD4013 双主-从D型触发器 FSC/NSC/TOSCD4014 8位串入/并入-串出移位寄存器 NSCCD4015 双4位串入/并出移位寄存器 TICD4016 四传输门 FSC/TICD4017 十进制计数/分配器 FSC/TI/MOTCD4018 可预制1/N计数器 NSC/MOTCD4019 四与或选择器 PHICD4020 14级串行二进制计数/分频器 FSCCD4021 08位串入/并入-串出移位寄存器 PHI/NSCCD4022 八进制计数/分配器 NSC/MOT型号器件名称厂牌备注CD4023 三3输入端与非门 NSC/MOT/TICD4024 7级二进制串行计数/分频器 NSC/MOT/TICD4025 三3输入端或非门 NSC/MOT/TICD4026 十进制计数/7段译码器 NSC/MOT/TICD4027 双J-K触发器 NSC/MOT/TICD4028 BCD码十进制译码器 NSC/MOT/TICD4029 可预置可逆计数器 NSC/MOT/TICD4030 四异或门 NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器 NSC/MOT/TICD4032 三串行加法器 NSC/TICD4033 十进制计数/7段译码器 NSC/TICD4034 8位通用总线寄存器 NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存 NSC/MOT/TICD4038 三串行加法器 NSC/TICD4040 12级二进制串行计数/分频器 NSC/MOT/TI CD4041 四同相/反相缓冲器 NSC/MOT/TICD4042 四锁存D型触发器 NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环 NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器 NSC/MOT/TI型号器件名称厂牌备注CD4048 4输入端可扩展多功能门 NSC/HIT/TICD4049 六反相缓冲/变换器 NSC/HIT/TICD4050 六同相缓冲/变换器 NSC/MOT/TICD4051 八选一模拟开关 NSC/MOT/TICD4052 双4选1模拟开关 NSC/MOT/TICD4053 三组二路模拟开关 NSC/MOT/TICD4054 液晶显示驱动器 NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器 NSC/HIT/TICD4056 液晶显示驱动器 NSC/HIT/TICD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器 NSC/TI/MOT CD4063 四位数字比较器 NSC/HIT/TICD4066 四传输门 NSC/TI/MOTCD4067 16选1模拟开关 NSC/TICD4068 八输入端与非门/与门 NSC/HIT/TICD4069 六反相器 NSC/HIT/TICD4070 四异或门 NSC/HIT/TICD4071 四2输入端或门 NSC/TICD4072 双4输入端或门 NSC/TICD4073 三3输入端与门 NSC/TICD4075 三3输入端或门 NSC/TI型号器件名称厂牌备注CD4076 四D寄存器CD4077 四2输入端异或非门 HITCD4078 8输入端或非门/或门CD4081 四2输入端与门 NSC/HIT/TICD4082 双4输入端与门 NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器 NSC/MOT/STCD4094 8位移位存储总线寄存器 NSC/TI/PHICD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器 NSC/MOT/TICD4099 8位可寻址锁存器 NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器型号器件名称厂牌备注CD40106 六施密特触发器 NSC\TICD40107 双2输入端与非缓冲/驱动器 HAR\TICD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动 STCD40147 10-4线编码器 NSC\MOTCD40160 可预置BCD加计数器 NSC\MOTCD40161 可预置4位二进制加计数器 NSC\MOTCD40162 BCD加法计数器 NSC\MOTCD40163 4位二进制同步计数器 NSC\MOTCD40174 六锁存D型触发器 NSC\TI\MOTCD40175 四D型触发器 NSC\TI\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\TI CD40193 可预置4位二进制加/减计数器 NSC\TICD40194 4位并入/串入-并出/串出移位寄存 NSC\MOT CD40195 4位并入/串入-并出/串出移位寄存 NSC\MOT CD40208 4×4多端口寄存器型号器件名称厂牌备注CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器型号器件名称厂牌备注CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交叉点开关。

第3章 交通量分析

第3章 交通量分析

第3章交通量分析第3章交通量分析第3章交通量分析及预测3.1 公路交通调查及分析3.1.1 预可工作回顾在预可报告中,通过对本项目所处区位及承担的功能,对于路网交通量采用以机动车起讫点调查为基础的“四阶段推算法”得到的趋势型交通量并辅以诱增交通量。

其中在预测各影响区发生、集中交通量时采用了增长率法,交通量分布预测采用“弗莱特法”,交通量分配采用多路径-容量限制分配法,从而得到趋势型交通量。

对于诱增交通量,结合影响区的位置、经济特点和项目建成后路网的变化,参考其他项目的研究成果,采用生长曲线模型进行计算。

同时随着庐江县城镇化进程的不断推进以及规划区建设,本项目沿线土地逐步得到开发,沿线将形成新的城区和产业带,产生大量城市内部交通出行。

城市交通量采用以人口规模、城市用地开发强度为基础的“四阶段”法进行预测。

将路网交通量和城市交通量相累加,预测本项目路段交通量如下表所示。

表3-1 本项目项目建议书阶段路段交通量预测结果单位:辆/日,小客车年份区间客车货车汽车2019年起点-X071 10851 4784 15636 X071-终点8239 3879 12117 路段平均9352 4265 136172025年起点-X071 11788 5516 17303 X071-终点9091 4543 13634 路段平均10240 4957 151982033年起点-X071 16579 7317 23896 X071-终点12771 6032 18803 路段平均14394 6579 209732038年起点-X071 19534 8355 27889 X071-终点14989 6866 21855 路段平均16926 7501 244263.1.2 调查综述调查主要目的是为了解项目影响区相关路网车辆出行起终点状况、车型组成,荷载种类、交通方向和交通量等交通基础资料,为预测远景交通量提供依据,同时也为经济评价和道路设计采集参数。

亚硒酸钠对HL-60细胞增殖、凋亡影响及作用机制探讨

亚硒酸钠对HL-60细胞增殖、凋亡影响及作用机制探讨

亚硒酸钠对HL-60细胞增殖、凋亡影响及作用机制探讨贾永清;滕熔;胡慧仙【摘要】目的:以人急性髓细胞性白血病细胞系HL-60为模型,探讨亚硒酸钠对HL-60细胞增殖及凋亡的影响.方法:以不同浓度的亚硒酸钠作用于HL-60细胞后,分别采用台盼蓝拒染法计数活细胞,MTT法检测细胞增殖抑制;通过光镜及双染流式细胞检测分析细胞凋亡;检测线粒体膜电位变化.分光光度法检测caspase-3的活性变化,RT-PCR检测Bcl-2的mRNA的表达.结果:(1)用台盼蓝染色和MTT方法证实亚硒酸钠(>51μmol/L)能抑制HL-60细胞的生长及存活.(2)HL-60细胞经亚硒酸钠处理后,形态学上出现凋亡细胞特征性改变,双染流式细胞检测证实,亚硒酸钠能有效诱导HL-60细胞凋亡.(3)亚硒酸钠处理HL-60细胞后,流式细胞仪检测线粒体膜电位下降,分光光度法显示caspase-3活性升高,凋亡基因Bcl-2的mRNA的表达明显降低.结论:亚硒酸钠能有效抑制HL-60细胞的增殖及存活,且能够诱导其凋亡,抑制率及凋亡率与药物剂量呈相关.线粒体介导的凋亡途径是亚硒酸钠诱导HL-60细胞凋亡的可能机制.【期刊名称】《交通医学》【年(卷),期】2011(025)002【总页数】5页(P121-125)【关键词】急性髓细胞性白血病;亚硒酸钠;HL-60细胞;凋亡;线粒体膜电位;caspase-3;Bcl-2;流式细胞仪检测;逆转录聚合酶链反应【作者】贾永清;滕熔;胡慧仙【作者单位】金华市中心医院血液科,浙江,321000;南通大学附属医院血液科;金华市中心医院血液科,浙江,321000【正文语种】中文【中图分类】R733.7急性白血病是我国常见的恶性肿瘤之一,近年来白血病的诊断和治疗取得了长足进步。

目前治疗方法主要为化学药物治疗和骨髓移植。

临床常用化疗药物毒性大,可产生多种毒副作用,复发率较高。

由于骨髓移植费用高,配型困难及移植后各种并发症多,限制了临床广泛开展,因此目前仍有必要寻找和发掘新药。

番茄褐色皱纹果病毒检疫鉴定方法-最新国标

番茄褐色皱纹果病毒检疫鉴定方法-最新国标

番茄褐色皱纹果病毒检疫鉴定方法1 范围本文件规定了番茄褐色皱纹果病毒的血清学和分子生物学检测方法。

本文件适用于茄科等植物材料及种子中番茄褐色皱纹果病毒的检疫鉴定。

2 规范性引用文件下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。

其中,注日期的引用文件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于本文件。

GB/T 6682 分析实验室用水规格和试验方法3 术语和定义本文件没有需要界定的术语和定义。

4 番茄褐色皱纹果病毒分类信息中文名:番茄褐色皱纹果病毒学名:tomato brown rugose fruit virus分类地位:马泰利病毒目(Martellivirales)植物杆状病毒科(Virgaviridae)烟草花叶病毒属(Tobamovirus)。

番茄褐色皱纹果病毒的其它信息参见附录A。

5 方法原理番茄褐色皱纹果病毒的血清学特性和基因组特征是该病毒检疫鉴定的依据。

根据番茄褐色皱纹果病毒与抗体之间的特异性反应,对植物样品进行双抗体夹心酶联免疫吸附测定(Double Antibody Sandwich Enzyme Linked Immunosorbent Assay,DAS-ELISA);依据番茄褐色皱纹果病毒的基因组特征建立RT-PCR和荧光RT-PCR检测方法;通过这些方法的有效组合,判断样品是否带有番茄褐色皱纹果病毒。

6 试剂、仪器设备及用具6.1 试剂除另有规定外,所有试剂均为分析纯,实验用水应符合GB/T 6682中相关规定。

DAS-ELISA试剂应符合附录B中的B.1;RT-PCR试剂应符合附录C中的C.1;荧光RT-PCR试剂应符合附录D中的D.1。

6.2 仪器设备高速冷冻离心机、电子天平、PCR仪、荧光PCR仪、水平电泳系统、-20℃低温冰箱和-80℃超低温冰箱、凝胶成像分析系统、pH计、微波炉、磁力搅拌器、恒温水浴锅、高压灭菌锅、超净工作台、分光光度计、酶标仪等。

SS4-AVP200-0100

SS4-AVP200-0100

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PSA1, PSA2, PSK1 PSA3, PSA4 PSA3, PSA4 for existing valves produced on/ before 1999 PSA6 / VA4 to VA6 HA1 HA2, HA3, HL2, HL3 HA4, HL4 HK1, VM1 *10 (material SS400 zinc plated) VR1 (material SS400 zinc plated) VR2, VR3 (material SS400 zinc plated) RSA2 GOM83S, GOM84S, GOM103S GOM124S VA1 - VA3 (for old-model motion connectors) produced on/before Apr. 83 800-1, 800-3 *9 VA4, VA5 (for old-model motion connectors) produced on/before Apr. 83 800-4, 800-5 *9 Motoyama Mfg. 2800 series 240, 280, 330, Nihon Koso A100 series 270, 320 *5 Motoyama Mfg. 2800 series 400, 500S, 500L, Nihon Koso A100 series 400, 500 *5 Motoyama Mfg. 2800 series 650S, 650L *5 Motoyama Mfg. 2800 series 240, 280, 330 (with side manual) Motoyama Mfg. 2800 series 400, 500S, 500L (with side manual) Motoyama Mfg. 2800 series 650S, 650L (with side manual) Motoyama Mfg. 3800 series (multi-spring type) N24, N28, N33S *5 Motoyama Mfg. 2922 series (Gyrol-I) G.R.I 280H, 330H, 400HS, 400H, 500H Motoyama Mfg. 3993 series (Gyrol-II) 280, 330, 400, 2911-1M series 280H, 330H, 400H Masoneilan 37, 38 series #9, #11 *5 Masoneilan 37, 38 series #13 *5 Masoneilan 37, 38 series #15, #18 *5 Masoneilan 37, 38 series #15, #18 (with side manual) Masoneilan type 35002 series Camflex II #4-1/2, #6, #7 Nihon Koso TC-500 series TC520S Nihon Koso TC-700 series TC-713S Nihon Koso TC-700 series TC-722SS Kitamura Valve AK05S, AK09S, AK12S, AK15S Kitamura Valve AG06S Kitamura Valve AG09S Kitamura Valve AG13S Kitamura Valve AW13S Kitamura Valve AW17S Tomoe Valve Z series Z-06S, 08S, 11S, 13S

核酸、蛋白技术参数资料、分子量标准及常用试剂的配制

核酸、蛋白技术参数资料、分子量标准及常用试剂的配制

核酸、蛋白技术参数资料、分子量标准及常用试剂的配制•一、核酸及蛋白质常用数据1.核苷三磷酸的物理常数2.常用核酸的长度与分子量3.常用核酸蛋白换算数据〔1〕重量换算1μg=10-6g 1pg=10-12g 1ng=10-9g 1fg=10-15g 〔2〕分光光度换算:1A260双链DNA=50μg/ml 1A260单链DNA=30μg/ml 1A260单链RNA=40μg/ml 〔3〕DNA摩尔换算:1μg 100bp DNA=1.52pmol=3.03pmol末端1μg pBR322 DNA=0.36pmol 1pmol 1000bp DNA=0.66μg 1pmol pBR322=2.8μg 1kb双链DNA〔钠盐〕=6.6×105道尔顿1kb 单链DNA〔钠盐〕=3.3×105道尔顿1kb单链RNA〔钠盐〕=3.4×105道尔顿〔4〕蛋白摩尔换算:100pmol分子量100,000蛋白质=10μg 100pmol分子量50,000蛋白质=5μg 100pmol分子量10,000蛋白质=1μg 氨基酸的平均分子量=126.7道尔顿〔5〕蛋白质/DNA换算:1kb DNA=333 个氨基酸编码容量=3.7×104MW蛋白质10,000MW蛋白质=270bp DNA 30,000MW蛋白质=810bp DNA 50,000MW蛋白质=1.35kb 100,000MW蛋白质=2.7kb DNA4.常用蛋白质分子量标准参照物5.常用DNA分子量标准参照物a:以水为溶剂的抗生素贮存液通过0.22μm滤器过滤除菌。

以乙醇为溶剂的抗生素溶液无须除菌处理。

所有抗生素溶液均应放于不透光的容器保存。

b:镁离子是四环素的拮抗剂,四环素抗性菌的筛选应使用不含镁盐的培养基〔如LB培养基〕。

五、常用贮存液的配制1.30%丙烯酰胺溶液【配制方法】将29g丙烯酰胺和1g N,N’-亚甲双丙烯酰胺溶于总体积为60ml的水中。

CD4054BMG4中文资料

CD4054BMG4中文资料

Data sheet acquired from Harris SemiconductorSCHS048C − Revised October 2003The CD4054B-, CD4055B-, and CD4056B-seriestypes are supplied in 16-lead dual-in-line plasticpackages (E suffix), 16-lead small-outlinepackages (M, M96, MT, and NSR suffixes), and16-lead thin shrink small-outline packages (PWand PWR suffixes). The CD4054B- andCD4056B-series types also are supplied in 16-leadhermetic dual-in-line ceramic packages (F3Asuffix).PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4054BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4054BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4054BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4054BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BMT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BMTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BMTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4054BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4055BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4055BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4055BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BMT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BMTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BMTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4055BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BE ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD4056BEE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type CD4056BF ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4056BF3A ACTIVE CDIP J161TBD A42SNPB N/A for Pkg Type CD4056BM ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BM96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BM96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BM96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BMG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BMT ACTIVE SOIC D16250Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)CD4056BMTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BMTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BNSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BNSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BNSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4056BPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD4054BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4054BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4054BPWR TSSOP PW 162000330.012.47.0 5.6 1.68.012.0Q1CD4055BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4055BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4055BPWR TSSOP PW 162000330.012.47.0 5.6 1.68.012.0Q1CD4056BM96SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1CD4056BNSR SO NS 162000330.016.48.210.5 2.512.016.0Q1CD4056BPWRTSSOPPW162000330.012.47.05.61.68.012.0Q1PACKAGE MATERIALS INFORMATION19-Mar-2008*All dimensionsare nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)CD4054BM96SOIC D 162500333.2345.928.6CD4054BNSR SO NS 162000346.0346.033.0CD4054BPWR TSSOP PW 162000346.0346.029.0CD4055BM96SOIC D 162500333.2345.928.6CD4055BNSR SO NS 162000346.0346.033.0CD4055BPWR TSSOP PW 162000346.0346.029.0CD4056BM96SOIC D 162500333.2345.928.6CD4056BNSR SO NS 162000346.0346.033.0CD4056BPWRTSSOPPW162000346.0346.029.0PACKAGE MATERIALS INFORMATION19-Mar-2008Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is 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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

SO465420中文资料

SO465420中文资料

VRMS VRMS MΩ V
mm g K/W °C °C % g
celduc
r e l a i s


Rue Ampère B.P. 4 42290 SORBIERS - FRANCE E-Mail : celduc-relais@ Fax +33 (0) 4 77 53 85 51 Service Commercial France Tél. : +33 (0) 4 77 53 90 20 Sales Dept.For Europe Tel. : +33 (0) 4 77 53 90 21 Sales Dept. Asia : Tél. +33 (0) 4 77 53 90 19
S/MON/SO465420/A/16/01/2006
page 1 / 5F/GB
SO465420
Output : 200-480VAC 50A Analog Input : 4-20mA
Microcontroller Inside
IP20
4-20mA
- 1/L1 et 2/T1 peuvent être inversées. 1/L1 and 2/T1 can be swapped. - Le relais doit être monté sur dissipateur thermique. SSR must be mounted on heatsink
Typ. -
Max 480 20 50
720
IEC/EN61000-4-4 (bursts) IEC/EN61000-4-5 (surge) Varistor 510V
0,9 12 0,9x0,9xIe + 0,012xIe2 1 100 20 63 40 50-60 70 500 50 1500 2500 4kV criterion B 4kV criterion B

Littlefuse 电路保护设备59065和57065系列的技术数据参考手册说明书

Littlefuse 电路保护设备59065和57065系列的技术数据参考手册说明书

DescriptionThe 59065 is a small plastic barrel sensor with a 5/16” x 24 thread, 38.1mm (1.500”) long with a choice of normally open, normally open high voltage, normally closed or change over contacts. It is capable of switching up to 265Vac/300Vdc at 10VA. It functions best with the 57065 actuator.Agency ApprovalsFeatures• Two-part magnetically operated proximity sensor• Threaded barrel with retaining nuts • Available as M8 (57070/59070) or 5/16 (57065/59065) size options• Customer defined sensitivity option • Choice of cable length and connectorBenefits• Simple installation and adjustment using supplied retaining nuts • Operates through non-ferrous materials such as wood, plastic or aluminium• Excellent for switching micro-controller logic level loads • No standby power requirementApplications• Position and Limit Sensing • Security System Switch• Industrial Process Control • Linear ActuatorsDimensionsDimensions in mm (inch)Note: The 57065 Actuator is sold separately.Note: Contact Littelfuse for specific agency approval ratings.Different cable options available.Electrical RatingsNotes:1. Contact rating - Product of the switching voltage and current should never exceed the wattage rating. Contact Littelfuse for additional load/life information.2. When switching inductive and/or capacitive loads, the effects of transient voltages and/or currents should be considered. Refer to Application Notes AN108A and AN107 for details.3. Breakdown Voltage - per MIL-STD-202, Method 301.4. Electrical Load Life Expectancy - Contact Littelfuse with voltage, current values along with type of load.5. This resistance value is for 11.81mm wire length. Resistance changes when wire lengthens.6. Operate (including bounce)/Release Time - per EIA/NARM RS-421-A, diode suppressed coil (Coil II).7. Shock and Vibration - per EIA/NARM RS-421-A and MIL-STD-202.8. For custom modifications to the wire length or size, or adding a special connector, please contact Littelfuse.Sensitivity Options (Using 57065 Actuator)1. Pull-In AT Range: These AT values are the bare reed switch AT before modification.2. The activation distance is average value on the final sensor assembly.Part Numbering System59065 - X - X - XX - XSensor:Actuator:Series Switc h T ype 1, 2, 3, or 4Sensitivity S, T , U, or VT erminationA, F , or ECable Length0257065 - 000SeriesStandard Actuator000Note: The 57065 Actuator is sold separately.Cable Length SpecificationTermination Specification。

Caspase-3活性测定试剂盒

Caspase-3活性测定试剂盒
允许适当调整样品加样量)
北京索莱宝科技有限公司
反应缓冲液μl
无样品 空白对照
95
待测样品μl

底物 μl
5
总体积μl
100
高酶活性 样品 85 10 5 100
低酶活性 样品 60 35 5 100
产品说明: 1、Caspase酶活力单位定义:参考 One unit is the amount of enzyme that will cleave 1.0 nmol of the colorimetric pNA-substrate per hour at 37 ºC under saturated substrate concentrations。即当底 物饱和时,一个Caspase酶活力单位定义为37 ºC 1小时水解pNA底物,产生1nmol游离pNA。根据pNA标准曲线 和样品OD值,可计算出Caspase酶活力单位。 2、除了处理组外,可设置阳性凋亡诱导剂组,阴性实验对照可包括不具有凋亡诱导作用的试剂(如 果能 得到)处理组、溶剂对照组、或凋亡诱导零时间点。
第1页共3页
北京索莱宝科技有限公司
×105个细胞或2个孔的12孔板细胞。勿用丝氨酸蛋白酶抑制剂如E-64和leupeptin以免抑制Caspase活性。 1、(1)细胞裂解:1000g 5分钟收集细胞,吸尽上清。每2~10×106细胞加50~100µl裂解液震荡裂解,冰浴 10分钟,再次震荡。
(2) 组织裂解:3~10mg组织加100 µl裂解液放入小型玻璃匀浆器,上下匀浆30次。转移匀浆液于离心管。 2、4 ºC 12,000g 10分钟,取上清测定,或-70 ºC保存。 3、蛋白定量:用Bradford法测定蛋白浓度。裂解液含还原剂不宜采用BCA法。应使蛋白浓度达到1-3 mg/ml, 相当于每10 μl待测样品含10-30μg蛋白,否则应增加细胞用量。

基于OD反推模型预测客运通道客流量

基于OD反推模型预测客运通道客流量
第 30 卷第 6 期 2 0 0 8 年 12 月
铁道学报 JOU R NA L OF T H E CH IN A RA ILW A Y SO CI ET Y
V ol. 30 No . 6 December 2008
文章编号: 1001- 8360( 2008) 06-0007- 06
基于 OD 反推模型预测客运通道客流量
Abstract: Origin dest inat io n ( OD) mat rices are t he basic dat a in passenger f low f orecast. It is very dif ficult to obtain OD matr ices in pract ical eng ineering. People usually adopt OD sur vey , but t his leads t o a t oo t ime- consum ing and tro ublesom e pr ocess. T his paper presents a m et hod using sect ion observat ion t o back- st ep OD mat rices direct ly w ithout OD sur vey . T he relat ionship and diff erence betw een t he t radit ional f our- stag e method and OD m atrix est imat ion ar e discussed. T he OD mat rices est im ation m odel str uctured by t he g rav ity model on the basis of link passenger vo lum es is elabor at ed. T he model parameters are solved by it erat io n and w it h the maxm um likelihood met ho d. F inally, the OD matr ix est imat io n m et hod is applied t o t he passenger f low for ecast of t he Wu- Guang t ransport corridor, ado pt ing t rial calculation t o simulat e t he g ravity model parameters. T he result show s t hat er ror cont rol is ef ficient and t he proposed met ho d is ef fect ive. Key words: OD mat rix est im at ion; passeng er f low f orecast; g rav it y mo del

茶叶提取物EGCG和GCG及ECG对B16细胞内黑色素生成的抑制作用

茶叶提取物EGCG和GCG及ECG对B16细胞内黑色素生成的抑制作用

茶叶提取物EGCG和GCG及ECG对B16细胞内黑色素生成的抑制作用张向娜;林勇;黄建安;刘仲华;梁丹丹【摘要】Inhibitory effects of tea extracts EGCG, GCG and ECG on melanoma cell B16 from mouse were studied in this paper. Cells were treated with different concentrations of GCG, ECG, EGCG and Arbutin, and their morphology was observed in an inverted microscope. The proliferation rate of B16 was determined using MTT method, tyrosinase activity was detected by using L-DOPA as substrate, and NaOH-lysis approach was employed to measure the melanin synthesis. The results showed that EGCG, ECG, GCG could significantly inhibit the melanogenesis and tyrosinase activity in cells B16 with a dose-dependent manner. The proliferation rate would be lower than 50% when the concentration was increased to 60 μg/mL. Compared with the control group, tyrosinase activities affected by the three substances were reduced by 26.67%, 27.27% and 32.71%, respectively, the melanin inhibition rates were all above 30%.In conclusion, tea extracts could efficiently inhibit melanogenesis. The inhibitory effect of GCG was best, followed by ECG, EGCG, and arbutin in turn.%为研究茶叶提取物表没食子儿茶素没食子酸酯(epigallocatechin gallate,EGCG)、没食子儿茶素没食子酸酯(gallocatechingallate,GCG)和表儿茶素没食子酸酯(epicatechingallate,ECG)对体外培养B16小鼠黑色素瘤细胞黑色素生成及酪氨酸酶活性的影响,分别用不同浓度的EGCG、GCG、ECG和熊果苷(Arbutin,AR)处理细胞,观察效应物对细胞形态的影响,用溴化二苯四偶氮法(MTT法)测定茶叶提取物对细胞增殖率的影响,以左旋多巴(L-DOPA)为底物,测定细胞内酪氨酸酶的活性,采用氢氧化钠裂解法测定细胞内黑色素的含量.结果显示,EGCG、ECG、GCG能显著抑制B16细胞的黑色素生成和酪氨酸酶的活性,且呈剂量依赖关系;当浓度为60μg/mL时,细胞增殖率均低于50%,酪氨酸酶活性与对照组相比分别降低了26.67%、27.27%和32.71%,黑色素生成抑制率均在30%以上.结果表明,茶叶提取物能通过多种途径抑制黑色素生成,且GCG的作用效果最优,ECG的作用效果次之,三者的作用效果均优于熊果苷的作用效果.【期刊名称】《湖南农业大学学报(自然科学版)》【年(卷),期】2017(043)004【总页数】6页(P405-410)【关键词】茶叶提取物;表没食子儿茶素没食子酸酯;没食子儿茶素没食子酸酯;表儿茶素没食子酸酯;B16黑色素瘤细胞;黑色素生成;酪氨酸酶【作者】张向娜;林勇;黄建安;刘仲华;梁丹丹【作者单位】国家植物功能成分利用工程技术研究中心,湖南长沙 410128;湖南省植物功能成分利用协同创新中心,湖南长沙 410128;湖南农业大学园艺园林学院,湖南长沙 410128;国家植物功能成分利用工程技术研究中心,湖南长沙 410128;湖南省植物功能成分利用协同创新中心,湖南长沙 410128;湖南农业大学园艺园林学院,湖南长沙 410128;国家植物功能成分利用工程技术研究中心,湖南长沙 410128;湖南省植物功能成分利用协同创新中心,湖南长沙 410128;湖南农业大学园艺园林学院,湖南长沙 410128;国家植物功能成分利用工程技术研究中心,湖南长沙 410128;湖南省植物功能成分利用协同创新中心,湖南长沙 410128;湖南农业大学园艺园林学院,湖南长沙 410128;湖南农业大学园艺园林学院,湖南长沙 410128【正文语种】中文【中图分类】Q946.84+1健康、白皙的肌肤是东方女性理想的肌肤状态,而皮肤黑色素的含量及分布很大程度上影响着肌肤的呈色。

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