Copper_Clad
FPC简介
1
形成 說明
退火 銅板
輥輪 硫酸銅
2
銅晶 排列 優點 缺點 耐折性高 ,適合做細線路 單價高,供應周期較長. 單價低廉 ,貨源較足,超薄銅皮易形成, 耐折性低,不適合做細線路
3 4
压延铜箔制程介绍
电解铜箔制程介绍
1、铜材溶解在稀硫酸里，配 成硫酸铜溶液。 2、在电场的作用下，铜附着 在金属滚筒上。金属滚筒旋转， 铜剥离金属滚铜形成薄铜箔卷出。 3、对着滚筒的面叫做光面， 背对滚筒的面叫做毛面,铜剥离 滚筒表面。 4、对铜皮表面镀铬，进行铬 化处理。此种表面稍带灰色的 “铬化层”除可达到某种程度的 防锈防斑变色的效果外，因其又 有少量的氯化铵存在，故对光铜 面的焊锡性有利，使不致因铬的 参与而过于劣化。
FPC材料簡介
报告大纲
一.铜箔基材(CCL) 二.覆盖膜(CVL) 三.补强片(KAPTON及PET)
四.胶(ADHESIVE)
五.其它
一、铜薄基材
简称CCL:Copper Clad Laminates
1.1 组成
接着剂
铜 箔
柔软剂 压延铜 电解铜 填充剂
环氧树脂 or 压克力系 硬化剂 催化剂
O 置 於 5 C冷 藏 庫 中
酚醛樹脂 儲存壽命長 壓著時溢出量少
丙烯酸樹脂 儲存壽命長 柔軟性較好
烘烤溫度
140OC升 溫 1.5時 ,持 160OC升 溫 1時 ,持 溫 1時 溫 1時 質地較剛硬 不 適 NC鑽 孔 膠色透明度較高 有一定吸濕性噴 鍚前先乾燥 適用快速壓合 膠色透明度較高
使用限制
1.2 CCL分类(依导体层)
1.2.1 双面铜薄基材Double-Sided C.C.L
1.2.2 单面铜薄基材Double-Sided C.C.L
生益科技Copper Clad Laminate (LNB33)覆铜箔层压板说明书
CURRENT ISSUE DATE:现在版本日期：08/06/2022FIRST ISSUE DATE:首次版本日期：17/11/20171.CHEMICAL PRODUCT AND COMPANY IDENTIFICATION 化学品及企业标识PRODUCT NAME: Copper Clad Laminate (LNB33)产品名称：覆铜箔层压板（LNB33）PRODUCT USE: Substrate for high frequency printed circuits.用途：用于制作高频印制电路板NAME of COMPANY and ADDRESS: SHENGYI TECHNOLOGY CO.,LTD.No.5,West Industry Road, Songshan Lake Sci.&Tech. Industry Park, Dongguan,Guangdong Province, China公司名称及地址：广东生益科技股份有限公司;中国广东省东莞市松山湖高新技术产业开发区工业西路5号FOR MORE INFORMATION CALL: IN CASE OF EMERGENCY CALL:电话：(Monday-Friday, 8:00am-5:00pm) 紧急联络电话：(24 Hours/Day, 7 Days/Week)86-769-22271828(Wanjiang/万江) 86-769-22271828(Wanjiang/万江)86-769-22899388(Songshan Lake/松山湖) 86-769-22899388(Songshan Lake/松山湖)FAX/传真：86-769-22271854 Email/电子邮件：2.HAZARDS IDENTIFICATION 危险性概述EMERGENCY OVERVIEW:紧急情况概述：A nonflammable, sheet material. Dust, when machined or punched may cause skin or eye irritation. Fumes, if decomposed may irritate eyes, nose, and throat.是一种难燃的层压板。
铜芯与铝芯区别
铜芯与铝芯电缆比较1.电阻率低：铝芯电缆的电阻率比铜芯电缆约高1.68倍。
2.延展性好：铜合金的延展率为20~40%,电工用铜的延展率在30%以上，而铝合金仅为18%。
3.强度高：常温下的允许应力，铜比铝分别高出7~28%。
特别是高温下的应力，两者相差更是甚远。
4.抗疲劳：铝材反复折弯易断裂，铜则不易。
弹性指标方面，铜也比铝高约1.7~1.8倍。
5.稳定性好，耐腐蚀：铜芯抗氧化，耐腐蚀，而铝芯容易受氧化和腐蚀。
6.载流量大：由于电阻率低，同截面的铜芯电缆要比铝芯电缆允许的载流量(能够通过的最大电流)高30%左右7.电压损失低：由于铜芯电缆的电阻率低，在同截面流过相同电流的情况下。
铜芯电缆的电压降小。
因此，同样的输电距离，能保证较高的电压质量；或者说，在允许的电压降条件下，铜芯电缆输电能达到较远的距离，即供电覆盖面积大，有利于网络的规划，减少供电点的设置数量。
8.发热温度低：在同样的电流下，同截面的铜芯电缆的发热量比铝芯电缆小得多，使得运行更安全。
9.能耗低：由于铜的电阻率低，相比铝电缆而言，铜电缆的电能损耗低，这是显而易见的。
这有利于提高发电利用率和保护环境。
10.抗氧化，耐腐蚀：铜芯电缆的连接头性能稳定，不会由于氧化而发生事故。
铝芯电缆的接头不稳定时常会由于氧化使接触电阻增大，发热而发生事故。
因此，事故率比铜芯电缆大得多。
11.施工方便：①铜芯柔性好，允许的弯度半径小，所以拐弯方便，穿管容易；②铜芯抗疲劳、反复折弯不易断裂，所以接线方便；③于铜芯的机械强度高，能承受较大的机械拉力，给施工敷设带来很大便利，也为机械化施工创造了条件。
铝芯电缆比铜芯电缆的优势1.价格便宜：铜杆是铝杆价格的3.5倍、铜的比重又是铝的3.3倍，所以铝芯电缆比铜芯电缆便宜多的多，适合于低资工程或临时用电。
2.电缆很轻：铝芯电缆的重量是铜芯电缆的40%施工运输都成本低.铜包铝与铜芯比较直流电阻率：铜包铝线的电阻率比纯铜线大，约为纯铜线的1.5倍，在阴值相同时，铜包铝线重量约为纯铜线的1/2。
铜包铝线生产工艺
铜带分切
预处理
T2纯铜带 —— GB/T 11091-2005
目的
铝杆加工
铜带分切
表3 T2纯铜带化学成分表
代号 P T2 Ni Ag Pb 0.005 Bi2 0.001 Sn 化学成分（%） Sb2 0.002 S 0.005 As2 0.002 Zn Fe 0.005 O 0.005 Cu （min） 99.90
铜包铝线生产工艺
傅氏国际（大连）双金属线缆有限公司
铜包铝介绍
铜包铝概念
铜包铝介绍
铜包铝
Copper Clad Aluminium 简称CCA
铜包铝概念
固相结合机理
铜包铝生产工艺流程
是在铝芯上同心包覆一层等厚铜带，使其在拉拔过 程中形成冶金结合而得到的，性能稳定的，双金属 复合导体。
退火方式及线材性能 对比 冷却到70℃以下， 防止线体表面氧化 大变形量对退火线的 影响
注意 Φ 3.0以下线径 ——
在线 在线
CCA 退火前 退火后
抗拉强度（MPa） 230～250 100～120
延伸率(%) 1～5 20～30
大变形量对退火线的影响
铜
热处理工艺
退火方式及线材性能 对比 大变形量对退火线的 影响
焊接工序工艺流程
焊机类型、特点
铝杆
较直
较直
包覆成型 铜带
水冷系统 图2 焊接工序流程示意图
表面刷磨
擦干
清洗
焊接工序工艺流程
焊接工艺
焊接工序工艺流程
1
焊机类型、特点
2
3 4 5
1-钨针 2-氩气保护 3-铜覆层 4-氩气层 5-铝芯
铜包钢介绍
铜包钢（CCS）介绍一、铜包钢的结构：铜包钢（Copper clad steel wire）简写为CCS。
铜包钢中的钢芯可以采用优质的低碳钢材料为基体，使得铜包钢在退火后变得柔软，有延伸；同样也可以采用中高碳钢钢或进口材料加工，铜包钢就会具有一定的抗拉强度。
而钢芯上的铜层是采用电镀或包覆工艺将高纯度铜包在钢芯上，由客户要求的电阻或导电率来决定包在钢芯上的铜层的量。
我公司可以生产导电率介于14％～40％的铜包钢。
二、铜包钢的分类：按铜包钢的应用范围可以分为：铜包钢编织软线，直放线，镀锡铜包钢，铜包钢漆包线等等；按铜包钢的力学性能分可以分为：软态（A类）和硬态（H类）两种；另外我公司还可以按客户要求，加工出不同导电率和抗拉强度的铜包钢产品。
三、铜包钢的说明：铜包钢线是以优质低碳钢材为基芯，经镀铜加工而成的新型复合材料，广泛用于通讯电线电缆的导电体。
该产品既有钢的强度和韧性又有铜的导电性能。
具有比重轻、节铜材、造价低等优点，是低电压、高频率的电力电缆中传统铜线的换代产品。
四、铜包钢的应用：铜包钢主要用于有线电视用户线同轴电缆内导体材料，平行双芯电话线用户通信线的导体材料，计算机局域网、接入网电缆、野外用电缆内导体材料，各种电子元器件的接插件，电话线路的架空线，电气化铁路、轨道交通线路接触网架空线，电力电缆屏蔽线，电力工业接地棒等等。
五、铜包钢的经济特性：铜包钢的密度是7.95g／cm3，而铜的密度是8.89g／cm3，所以1000kg铜包钢线的长度相当于1130kg纯铜线的长度。
现以φ0.15mm线径为例，作比较如下：铜包钢售价为17.5元／kg（07年01月含税含运费价）；纯铜裸线售价为65元／kg（07年1月上海长江现货中心价格加该规格加工费）（含税含运费）使用1000kg铜包钢线和使用1130kg纯铜线相比，可节约成本五万多（65元／kg×1130kg －17.5元／kg×1000kg＝55950元）由此可知，使用铜包钢线替代纯铜线，能够大幅度节约原材料成本。
中英文对照的PCB专业用语
中英文对照地PCB专业用语作者：深圳村村长分类:英汉词汇大全提交日期：2007-4-220:41:00 | 访问量：366一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb>5、印制线路板：printed wiring board(pwb>6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb>11、双面印制板：double-sided printed board(dsb>12、多层印制板：mulitlayer printed board(mlb>13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc>24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printedboard26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printedboard34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum>41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc>43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs>45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob>47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc>58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl>5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay>28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose papercopper-cladlaminates(phenolic/paper ccl>40、环氧纸质覆铜箔板：epoxide cellulose paper copper-cladlaminates (epoxy/paper ccl>41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glassreinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewoven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabriccopper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-cladlaminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材地材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe>27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi>38、聚四氟乙烯：polytetrafluoetylene (ptfe>39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylenecopolymer film (fep>40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil>90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil>93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc>96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔<剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad>7、计算机辅助制造：computer-aided manufacturing.(cam>8、计算机集成制造：computer integrat manufacturing.(cim>9、计算机辅助工程：computer-aided engineering.(cae>10、计算机辅助测试：computer-aided test.(cat>11、电子设计自动化：electric design automation .(eda>12、工程设计自动化：engineering designautomaton .(eda2>13、组装设计自动化：assembly aided architectural design. (aaad>14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlleddisplay .(ccd>16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf>27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化<设计）：optimization (design>31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走<布）线器：router (cad>54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp>59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线<通道）：conduction (track>2、导线<体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹<背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth>31、余隙孔：access hole32、盲孔：blind via (hole>33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh>36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance b5E2RGbCAP。
印制电路词汇中英对照
印制电路词汇中英对照一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sidedprinted27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printedboard28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan。
覆铜板的分类（Classificationofcoppercladlaminate）
覆铜板的分类（Classification of copper clad laminate）Classification and variety of copper clad laminate for PCB substrate materialAccording to the different requirements and grades of PCB, the main substrate material - CCL has many product varieties. They are classified according to different rules.(1) according to the mechanical rigidity of copper clad laminate, the rigid copper clad laminate and flexible copper clad laminate can be divided according to the mechanical rigidity of copper clad laminate. Usually rigid copper clad laminates are intermittently laminated. Flexible copper clad laminates are heavily used to form copper foil on polyimide or polyester films. The finished product is soft and has excellent folding resistance. In recent years, with the load type semiconductor package (TBA) and other development, with its need for organic resin ribbon packaging substrate, also appeared in the glass fiber cloth, epoxy resin and liquid crystal polymer film and other thin copper clad zone shape products.(2) according to the different insulation material, the structure is dividedAccording to different insulation materials and structures, they can be divided into organic resin CCL, metal base (core) copper clad plate and ceramic base copper clad laminate. The structure and material composition of these three types of copper clad laminate are shown in figure 2-1.Metal clad copper clad plate is usually composed of three parts: metal substrate, insulating medium and conductive layer (usually copper foil). One or both surfaces of a metal substrate to be chemically or electrochemically treated are coated with an insulating dielectric layer and a copper foil, which is compounded by hot pressing. According to the structure, composition and properties of metal clad copper clad laminate, there are many kinds of copper clad laminates. The structure is divided into metal substrate, clad metal substrate and metal core substrate. From the composition of the metal substrate is divided into aluminum based copper clad laminate, iron based copper clad laminate, copper based copper clad laminate, molybdenum based copper clad laminate and so on. Divided from the performance for a metal base copper clad laminate; flame retardant metal base copper clad laminate; high heat-resistant metal base copper clad laminate; high thermal conductivity type metal base copper clad laminate; superconducting heat type metal base copper clad laminate; high frequency type metal base copper clad laminate; multilayer metal base copper clad laminate. Metal clad copper clad laminate has excellent heat dissipation, good mechanical properties, excellent dimensional stability, electromagnetic shielding, electromagnetic property, etc..Ceramic based copper clad laminate (DBC) consists of ceramic substrate, bonding bond layer and conductive layer (copper foil). There are many kinds of ceramics, which can be classified according to the types of materials used. If there are Al2O3, SiO, MgO, Al2O3, SiC, AIN, ZnO, BeO, MgO, Cr2O3 and other kinds of ceramic films. At present, the most widely used and is "ceramic. It can also be divided into two categories: directkey method and bonding lamination key.(3) according to the thickness of different insulation layerAccording to the thickness of CCL, it can be divided into regular plate and thin plate. Generally, the thickness of copper (not including copper foil) is less than 0.8mm of epoxy resin clad laminate, called sheet (IPC standard is 0.5mm). Epoxy glass cloth CCL thickness below 0.8mm thin board is suitable for punching processing, and it can also be used as the core material required in the fabrication of multilayer board.(4) divided by different reinforcementIn this division, when the copper plate uses some reinforcing material, the copper clad sheet is called a material substrate. Different from the commonly used reinforced rigid organic resin laminate has three types of woven glass laminate; paper base copper clad laminate; composite base copper clad laminate. In addition, there are special reinforcing material composed of copper plate, as well as: aramid fiber non-woven fabrics, copper clad laminates, synthetic fiber based copper clad laminate.For fiber reinforced materials, there are differences between organic fiber reinforced materials and inorganic reinforcing materials. In recent years, the development of CO2 laser manufacturing in hole processing PCB, using organic fiber reinforced materials (such as: aramid fiber reinforced material), due to the laser light absorption ability, and isconducive to the laser hole machining. Most of the reinforcement materials used for CCL are still inorganic reinforcing materials. The common inorganic materials with enhanced electronic grade (also called E) (referred to as glass fiber cloth, glass fiber cloth) electronic grade glass fiber paper (E) (hereinafter referred to as the glass paper, also known as glass fiber non-woven, glass mat, glass paper).The so-called composite copper clad laminate, mainly refers to the insulating substrate, is the surface layer and core layer using two different reinforcing materials composed of copper clad laminate. In the composite base copper clad laminate, the most common is CEM-1 (flame retardant copper clad modified epoxy glass fiber cloth, paper core composite material laminate (CEM-3) and flame retardant copper clad epoxy glass fiber cloth, glass fiber paper core composite laminate substrate) two types.(5) according to the insulation resinThe resin of the copper clad plate is made of some kind of resin, and the copper clad plate is called a copper clad plate of a resin type. At present, the most common are the main resin: phenolic resin, epoxy resin (EP), polyimide (PI) resin, polyester resin (PET) and polyphenylene ether resin (PPO) and cyanate ester resin (CE), PTFE resin (PTFE), bismaleimide resin (BT) was three.Based on the above two principles of using different reinforcing materials and different insulating resins, the rigid CCL can be divided into five categories. These five categories are: paper base copper clad laminate; CCLS basedcomposite; base copper clad laminate; lamination plywood substrate materials; special base copper clad laminate. The classification of these five types of substrate materials and their respective specific mainFigure 2-2 a variety of substrate materials classified by different reinforcing materials and different insulating resins is shown in figure 2-2.[the last line is red leaf dance, Fragrant Hill at 2008-6-13, 10:53 editing]Attachment: your user group cannot download or view attachmentsUID27641 post 11366, essence 6 points 11819, read permissions 150, online time 2205 hours, registration time 2007-1-1, finally login 2008-8-7, view detailsTOPTerminator reassert divinity, successfully intercepted Ravdm stealing Trojan QNew technology analysis of Windows Server 2008Red maple danceSuper ModeratorPersonal space sends short message plus friend, current offline 2# large, medium and small, published in 2008-6-13, 10:38, onlysee the authorYou can delete the "worm" Mobo manual (6) according to the classification of flame retardant propertiesUL standard (UL94, UL746E, etc.) can be divided into different flame retardant grades for the flame retardant properties of substrate materials. That is, UL standards will be divided into four kinds of substrate materials, different flame retardant grades are: UL-94VO class; UL-94V1 class; UL-94V2 class and UL-HB class. Generally speaking, according to the UL Standard Test methods, testing, to achieve flame retardant UL-HB grade CCL, known as non flame retardant copper clad laminate (commonly known as HB board). To meet the flammability requirements of the vertical combustion method in the UL standard (the best flame retardant grade is grade UL-94VO), and to call it a flame retardant copper clad laminate (commonly known as VO board). This kind of "HB board" and "VO board" popular term, in our country on paper based copper clad laminate flame retardant classification of the appellation is still very popular.(7) according to a special performance of CClAccording to the special performance of CCL, the copper clad boards of different grades are divided, which are mainly displayed on some high-grade plates. Here are only a few varieties of this classification.1., according to the different classification of TgThe glass transition temperature (Tg) is a description of the organic insulating resin reaching a certain temperature point, and the molecular morphology changes from glassy to rubbery. The temperature at which this point is known is called the glass transition temperature. Tg is an important project of heat resistance measurement, some characterization of CCLS based. When the insulating resin of the base material rises above Tg, many properties change dramatically. Therefore, the higher the Tg, the better the stability of the various properties of the insulating material. On the other hand, materials with high Tg generally have better dimensional stability and mechanical strength retention than those with low Tg. In addition, the excellent performance can be maintained in a larger temperature range, which is very important for the manufacture of printed circuit boards with high density, high accuracy and high reliability.According to the different grades of CCL $%, divided into different heat resistance. For example, in the IPC 4101 A standard, the general copper-clad laminates, epoxy glass cloth laminates (including halogen based FR-4) are divided into three grades according to different Tg characteristics. Namely: IPC-4101/21 for Tg, FR-4 at, IPC-4101/24 for Tg, FR-4 at 150-200 DEG C, and IPC-4101/26 for Tg, and FR-4 for at 170-220 degrees.2. classification according to whether there is halogen or notThe world's research experiments show that in the halogen containing compounds or resins as flame retardant electrical products (including printed circuit board substrate), in the incineration after the waste will produce dioxin harmfulsubstances. Therefore, the development and use of halogen-free PCB substrate materials is an important task in the CCL industry and PCB industry. Since the late 1990s, there has been a "green" substrate material - halogen-free substrate material. According to this characteristic, the substrate material can be divided into halogen base material and halogen-free substrate material.Evaluation of non halogenated substrate material is mainly based on the Japanese printed circuit board (JPCA) industry will be defined as compiled and published in November 1999 on the proposed CCL standards "halogen-free" feature. Namely: the non halogenated base material is in its resin the chlorine content or the bromine content is less than 0.09wt%. In the IPC-4101 standard, more specifically, the halogenated PCB base material is divided into three different halogen-free varieties depending on the type of flame retardant used in the resin. Non halogen, non antimony, phosphorus containing, halogen-free base material (inorganic filler), non halogen, non antimony containing phosphorous containing halogen-free base material (containing inorganic filler), non halogen non antimony non phosphorus non halogen base plate material. And the last one is more conducive to environmental protection requirements.In view of the current development of copper clad flame retardant technology, it will be a good way to realize this kind of high performance "green" substrate material in the future using nano materials and new technologies.3. classification of the coefficient of linear expansionaccording to the substrate materialIn PCB processing and use, in order to ensure its reliability and stability, ensure the hole size of substrate material in the machining process, some PCB in the design and manufacture of low substrate material for the expansion of the more stringent requirements (especially in a semiconductor package substrate for material). Therefore, a new substrate material, low thermal expansion substrate material, has been rising rapidly in recent years. Thus, it is generally customary to have the thermal expansion coefficient (CTE) at 12ppm/ DEG C (plate X, Y direction) below the characteristic substrate material, designated as low CTE substrate material.4. paper base plate according to the punching preheating temperature classificationThe hole processing of paper based copper clad laminate is mostly punched processing. In order to ensure the quality of the punching process of the substrate (no cracks between the holes, no separation between layers, the hole does not appear around the white circle, the hole smooth and so on), it is necessary to pre process the plate before punching. The temperature of the preheating treatment directly affects the size accuracy of the substrate, the flatness of the plate and the shrinkage of the bore bore. For example, Japan Matsushita Electric Company R-8700 paper base copper clad laminate (FR-1) product, on the surface of the plate punching processing temperature for punching processing under 30 DEG C, the hole shrinkage of 0.138mm (diameter of 0.10mm); punching at 50 DEG C, hole shrinkage of 0.150mm; punching in 70 C, hole shrinkageof 0.165mm. In the punching process of paper base copper clad laminate, according to the board can achieve the excellent quality and the punching preheating temperature before punching in (to plate surface temperature meter), production of paper-based cover copper varieties draw two different characteristics of punching out. Traditionally, the surface temperature of the plate before the punching process is 30-70 DEG C for punching. The copper plate with excellent punching quality can be called the low temperature punching plate. The plate which is preheated and punched at more than 70 degrees is called a high temperature punching plate. Under the condition that the quality of punching can be reached, the lower the preheating temperature, the better the punching characteristics are.5. according to the classification of the resistance to leakageTrackings substrate material refers to the electronic products in use, in the PCB line surface of the space position, and the formation of carbide conductive circuit traces for a long time by the dust accumulation, water condensation and other effects, such trackings, in applied voltage, sparks, cause damage to the insulation performance. Therefore, the leakage resistance of copper clad laminate is an important safety characteristic item. Especially for high humidity, exposure, high pressure and other harsh conditions, PCB has more requirements in this regard.Resistance to leakage traces, generally compared with CTI Tracking (Commparative Index index) to express. In the IEC112 standard of CTI index is defined as: in the process of experiment, material by 50 drops of electrolyte (water solutionof ammonium chloride 0.1% general) maximum voltage without leakage phenomenon (generally traces value V said). IEC950 also sets out the three CTI grades of the substrate material according to the different voltage values that the substrate is subjected to under the above experimental conditions. That is, class I (CTI>=600V), level II (600V>CTI>=400V), class III (400V>CTI>=175V). The smaller the grade of%05 of a substrate material, the higher its resistance to leakage.[at last, this line is red autumnal dance, Fragrant Hill at 2008-6-13, 10:54。
铜包钢线(CCS)简介
铜包钢线(CCS)简介一，铜包钢线结构和性能铜包钢线(Copper clad steel wire，简称CCS线)是国际上近几十年开发的新产品，国外发达国家已广泛使用。
在中国，大量使用铜包钢线还是近几年的事。
铜包钢线（CCS）属双金属复合线材，它是利用两种金属各自的优点，通过特殊的生产工艺而制成的。
早在上个世纪30年代，最早由德国发明，随后在美国、英国、法国等先进国家迅速推广。
并广泛地应用于各种领域，包括电力传输系统。
1968年铜包铝、铜包钢线被应用在CATV电缆上。
1，铜包钢线结构铜包钢线是以钢线为芯体，在其表面上覆一层铜的复合线材，如图1所示结构。
铜包钢线在性能上兼备了钢的高强度、耐高温软化的机械性能和铜导电率高、接触电阻小的电性能，因而具有传导效率高，材料成本低，抗拉断力大，质量轻，耐磨损的特点。
它在电缆行业中可代替铜导体作为分配线或在通信业中用作电话用户线、高频传输电缆的导体。
图1，铜包钢线结构视图铜包钢线由钢芯线和紧密包覆其外的铜层构成，铜包钢线按导电率可分为21%IACS、30%IACS和40%IACS（IACS国际退火铜标准导电率）三种。
铜包钢线按力学性能（退火状态）可分为软态(A)、硬态(HS)和超硬态(EHS)。
铜包钢线经过深加工，还可加工成镀银铜包钢线、镀锡铜包钢或镀铅合金铜包钢线。
一般CATV电缆采用30%的软态铜包钢作内导体。
铜包钢线的表示方法：铜包钢线执行的标准：铜包钢线执行的标准有：ASTM B 22704-04《拉制硬态铜包钢线》、ASTM B 910/B910M-04《退火态铜包钢线》、ASTM B 869-04《CATV 同轴电缆用铜包钢线》和ASTM B 452-02《电子产品用铜包钢线》。
也有按GB12269－91、YD/T 722-94、BS4087-1989、ASTM B227-93、ASTM B3452-93等标准生产。
2，铜包钢线性能特点铜包钢线将钢的高强度与铜的高导电性和抗腐蚀性相结合，使它已成为通信、电力、电子行业中的理想导线。
PCB专业术语
一般术语1. Printed Circuit 印制电路:在绝缘基材上,按预定设计形成的印制元件或印制线路以及两者的结合的导电图形2.Printed Wiring 印制线路:在绝缘基材上形成的导电图形,用于元器件之间的连接,但不包括印制元件3.Printed Board 印制板4.Single sided printed board 单面印制板5.Double sided printed board 双面印制板6.Multi-layer printed board 多层印制板7.Rigid printed board 刚性印制板8.Rigid Single sided printed board 单面刚性印制板9.Rigid Double sided printed board 双面刚性印制板10.Rigid multilayer printed board 多层刚性印制板11.Flexible printed board 挠性印制板12.Flexible single sided printed board 单层挠性印制板13.Flexible double sided printed board 双层挠性印制板14.Flexible multilayer printed board 多层挠性印制板15.Flex-rigid printed board 刚挠印制板:利用挠性基材并在不同区域与刚性基材结合而制成的印制板.在刚挠结合区,挠性基材与刚性基材上的导电图形通常都要进行互连16.Flex-rigid double sided printed board 刚挠双层印制板17.Flex-rigid multilayer printed board 刚挠多层印制板18.Flash printed board 齐平印制板:导电图形的外表面和绝缘材料的外表面处于同一平面的印制板19.Metal core printed board 金属芯印制板20.Mother board 母板21.Backplane背板:一面有连接插针(例如用于绕接),另一面通常有连接器插座,用于点间电气互连的装置.点间电气互连可以是印制电路22.Multi-wiring printed board 多层布线印制板:在绝缘基材上布设多层绝缘导线,用粘结剂固定,并由镀覆孔互连的多层印制板23.Ceramic substrate printed board 陶瓷印制板24.Printed component 印制元件:用印制方法制成的元件(如印制电阻,电容,电感,传输线等),它是印制线路图形的一部分25.Grid 网格ponent side 元件面27.Solder side 焊接面28.Printing 印制29.Conductor 导线30.Conductor side 导线面31.Flash conductor 齐平导线32.Pattern 图形33.Conductor pattern 导电图形34.Non-conductor pattern 非导电图形35.Legend 字符36.Mark 标记基材:1.1.Base material 基材可在其上形成导电图形的绝缘材料.基材可以是刚性的或柔性的,也可以是不覆金属箔的或覆金属箔的1.2.Metal-clad base material 覆金属箔基材在一面或两面覆有金属箔的基材,包括刚性和柔性,简称覆箔基材minate 层压板由两层或多层预浸材料叠合后,经加热加压粘结成型的板材1.4.copper-clad laminate 覆铜箔层压板在一面或两面覆有铜箔的层压板,用于制作印制板,简称覆箔板(即所说的thin core)1.5 single side copper-clad laminate 单面覆铜箔板1.6 double side copper-clad laminate 双面覆铜箔板1.7 composite laminate 复合层压板含有两种或多种不同种类或结构的增强材料的层压板.列如,以玻璃纤维非织布为芯,以玻璃纤维布为面构成的环氧层压板1.8 thin laminate 薄层压板厚度小于0.8mm的层压板1.9 metal core copper-clad laminate 金属芯覆铜箔层压板1.10 prepreg 预浸材料由纤维增强材料浸泽热固性树脂后固化至B阶的片状材料1.11 bonding sheet 粘结片具有一定粘结能力的预浸材料或其他胶膜材料,用来粘结多层板的合粘结层(即所说的PP)1.12 flexible copper-clad dielectric file 挠性覆铜箔绝缘薄膜在一面或两面覆有铜箔的挠性绝缘薄膜.铜箔和绝缘材料之间可用或不用粘结剂,用于制作挠性印制板1.13 adhesive coated dielectric film 涂粘结剂绝缘薄膜在一面或两面涂粘结剂,固化至B阶的挠性绝缘充满,简称涂胶薄膜,在挠性印制板制造中,单面的用作覆盖层,双面的用作粘结层1.14 unsupported adhesive film 无支撑粘剂膜涂覆在防粘纸上形成的薄膜状B阶胶粘剂,在挠性和刚挠性多层印制板制造中用作粘结层1.15 laminate for additive process 加成法用层压板加成法印制板用的层压板,不覆金属箔.该板经涂胶粘剂,加催化剂或其他特殊处理,其表面具有可化学沉积金属的性能1.16 mass laminate panel 预制内层覆箔板多层印制板的一种半制品.它是层压大量预蚀刻的,代拼图的C阶内层板和B阶层与铜箔而形成的层压板,通常集中在基材厂生产1.17 copper-clad surface 铜箔面1.18 foil removal surface 去铜箔面覆铜箔层压板去铜后的绝缘基板表面1.19 unclad laminate surface 层压板面单面覆箔板的不覆铜箔的层压板表面1.20 base film surface 基膜面挠性单面覆箔绝缘薄膜不覆箔的一面1.21 adhesive face 胶粘剂面使用了胶粘剂的覆铜箔层压板的去铜箔面.亦指加成法中层压板镀覆前的胶粘剂涂覆面1.22 plate finish 原始光洁面覆箔板从层压机中取出来后未经后续工序整饰的金属箔表面,即与层压模板直接接触形成的原始表面1.23 matt finish 粗化面覆铜板金属箔表面的原始光洁面经研磨(如刷磨或细磨料浆处理)增大了表面积的表面1.24 length wise direction machine direction 纵向层压板机械强度较高的方向.纸,铜箔,塑料薄膜,玻璃布等片状材料的长度方向,与材料连续生产时前进的方向一致.1.25 cross wise direction 横向1.26 cut to size panel 剪切板经过切割的长宽小于制造厂标准尺寸的覆箔板原材料2.1 conductive foil 导电箔(铜皮)2.2 electrodeposited copper foil 电解铜箔用电沉积法制成的铜箔2.3 rolled copper foil 压延铜箔用辊轧法制成的铜箔2.4 annealed copper foil 退火铜箔经退火处理改善了延性和韧性的铜箔2.5 shiny side 光面电解铜箔的光亮面,即生产时附在阴极筒上的一面2.6 matte side 粗糙面电解铜箔较粗糙的无光泽面,即生产时不附在阴极筒上的一面2.7 treated side 处理面铜箔经粗化,氧化或镀锌,镀黄铜等处理后提高了对基材粘结力的一面或两面2.8 stain proofing 防锈处理铜箔经抗氧化剂处理使不易生锈2.9 thin copper foil 薄铜箔厚度小于18微米的铜箔2.10 adhesive coated foil 涂胶铜箔粗糙面涂有粘胶剂的铜箔,可提高对基材的粘结性2.11 reinforcing material 增强材料加入塑料中能使塑料制品的机械强度显著提高的填料,一般为织物或非织物状态的纤维材料2.12 E-glass fiber E玻璃纤维电绝缘性能优良的钙铝硼硅酸盐玻璃纤维,适用于电绝缘材料.碱金属氧化物含量不大于0.8%,通称无碱玻璃纤维2.13 D-glass fiber D玻璃纤维用低介电常数玻璃拉制而成的玻璃纤维,其介电常数及介质损耗因数都小于E玻璃纤维2.14 glass fiber S玻璃纤维由硅铝镁玻璃拉制而成的玻璃纤维,其新生态强度比E玻璃纤维高25%以上,又称高强度玻璃纤维2.15 glass fabric 玻璃布2.16 non-woven fabric 非织布纤维不经制造而乱向放置成网,成层,粘结而成的薄片状材料,含或不含粘结剂2.17 wrap wise 经向机织物的长度方向,即经纱排列方向,与织物在织机上前进方向一致2.18 weft wise filling wise 纬向2.19 thread count 织物经纬密度织物经向或纬向单位长度的纱线根数.经向单位长度内的纬纱根数称为纬密,纬向单位长度内的经纱根数称为经密2.20 weave structure 织物组织机织物中经纱和维纱相互交织的形式2.21 plain weave 平纹组织经纱与纬纱每隔压一根纱交错一次,由二根经纱和二根纬纱组成一个单位组织循环的织物组织.正反面的特征基本相同,断裂强度大2.22 size 浸润剂在玻璃纤维拉制过程中,为保护纤维表面和有利于纺织加工而施加于其上的物质.通常需先除去才能用于制造层压板2.23 coupling agent 偶联剂能在玻璃纤维和树脂基体的界面建立和促进更强结合的物质,其分子的一部分能与玻璃纤维形成化学键,另一部分能与树脂发生化学反应2.24 imprgnating insulation paper 浸泽绝缘纸具有绝缘性能的不施胶的中性木浆纸或棉纤维纸,可以提本色的,半漂白的或漂白的,用于制造绝缘层压板2.25 aromatic polyamide paper 聚芳酰胺纤维纸一种耐高温合成纤维纸,由聚芳酰胺短切纤维和沉析纤维在造纸机上混合吵造而成,亦称芳纶纸.可用作层压板增强材料,涂胶后可制作挠性印制板的覆盖层和粘结片2.26 non-woven polyester fabric 具酯纤维非织布2.27 breaking length 断裂长宽度一致的纸条本身重量将纸断裂时所需的长度,由拉伸强度和恒湿处理后试样重量计算得出2.28 height of capillary rise 吸水高度将垂直悬挂的纸条下端浸入水中,以规定时间内在纸条上由于毛细管作用而上升的高度表示2.29 wet strength retention 湿强度保留率纸在湿态时具有的强度与同一试样在干燥时强度之比2.30 whiteness 白度纸的洁白程度.因光谱紫蓝区457nm蓝光反射率与肉眼对白度的感受较一致,故常用的白度仪是测量蓝光反射率来表示白度2.31 ployfunctional epoxy resin 多功能环氧树脂环氧功能团大于2的环氧树脂,固化后具有高的玻璃化温度,如线型酚醛树脂多功能环氧树脂,二苯氨基甲烷和环氧氯丙烷反应产物2.32 brominated epoxy resin 溴化环氧树脂含稳定溴化组分的环氧树脂,固化物具有阻燃性,是由低分子环氧树脂与溴化双酚A反应而成的中等分子量树脂2.33 A-stage resin A阶树脂某些热固性树脂制造的早期阶段,呈液态或加热时呈液态,此时在某些液体中仍能溶解2.34 B-stage resin B阶树脂某些热固性树脂反应的中间阶段,加热时能软化,但不会完全溶解或熔融,此时它与某些溶剂接触能溶涨或部分溶解2.35 C-stage resin C阶树脂某些热固性树脂反应的最后阶段,此时它实际上是不溶和不熔的2.36 epoxy resin 环氧树脂2.37 phenolic resin 酚醛树脂2.38 polyester resin 聚酯树脂2.39 unsaturated polyester 不饱和树脂聚合物分子链上含有碳-碳不饱和键的一类聚酯,能与不饱和单体或预聚体发生化学反应而交联固化2.40 acrylic resin 丙乙烯树脂2.41 melanime formaldehyde resin 三聚氰胺甲醛树脂2.42 polyterafluoetylene(PTFE) 聚四氟乙烯2.43 polyimide resin 聚酰亚胺树脂2.44 bismaleimide triazine resin 双马来酰亚胺三嗪树脂2.45 perfluorinated erhylene propylene copolymer film 聚全氟乙烯丙烯薄膜2.46 weight per epoxy equivalent 环氧当量含一mol环氧基团的树脂克数,是表示环氧树脂环氧基含量的一种方式2.47 epoxy value 环氧值每100克环氧树脂中含有环氧基团的摩尔数,是表示环氧树脂功能度的一种方式2.48 dicyandiamide 双氰胺环氧树脂的一种潜伏性固化剂,为白色粉末.固化物具有良好的粘结强度和电绝缘性,常用于环氧玻璃布层压板2.49 binder 粘结剂用于层压板将增强材料结合作一起的连续相,粘结剂可以是热固性或热塑性树脂,通常加工时发生形态变化2.50 adhesive 胶粘剂能将材料通过表面附着而粘结在一起的物质2.51 curing agent 固化剂加入树脂中能使树脂聚合而固化的催化剂或反应剂称为固化剂,它是固化树脂的化学组成部分2.52 flame retardant 阻燃剂为了止燃,显著减小或延缓火焰蔓延而加入材料中或涂覆在材料表面的物质2.53 bond enhancing treatment 粘结增强处理改善金属箔表面与相邻材料层之间结合力的处理2.54 composite metallic material 复合金属箔由两种金属箔通过冶金结合而形成的金属箔.列如铜殷钢铜,用于制作改善散热性能的金属芯印制板2.55 carrier foil 载体箔薄铜箔的金属载体2.56 curing time 固化时间热固性树脂组分作固化时从受热到到达C阶段的时间2.57 finished fabric 处理织物经处理提高了与树脂相容性的织物2.58 foil profile 箔轮廓金属箔由制造和粘结增强处理形成的粗糙外形2.59 opaquer 遮光剂加入树脂体系使层压板不透明的材料.通过反射光或透射光用肉眼都不能看见增强材料的纱或织纹2.60 bow of weave 弓纬纬纱以弧形处于织物宽度方向的一种织吡2.61 end missing 断经2.62 mis-picks 缺纬2.63 bias 纬斜2.64 create 折痕2.65 waviness 云织在不等张力下织成的布,妨碍了纬纱的均匀排布,从而产生交错的厚薄段2.66 fish eye 鱼眼织物上阻碍树脂浸入的小区域,可因树脂体系,织物或处理造成2.67 feather length 毛圈长从织物的最边上一根经纱边缘至纬纱的边端的距离2.68 mark 厚薄段织物整个宽度上由于纬纱过密或过稀造成的偏厚或偏薄的片段2.69 split 裂缝因折叠和折邹而使纬纱或经纱断裂形成缺口2.70 twist of yarn 捻度纱线沿轴向一定长度内的捻回数,一般以捻/米表示2.71 size content 浸润剂含量在规定条件下测定的玻璃纤维原纱或制品的浸润剂含量,以质量百分率表示2.72 size residue 浸润剂残留量含纺织型浸润剂的玻璃纤维经焙烧工艺处理后残存在纤维上的碳含量.以质量百分率表示2.73 finish level 处理剂含量玻璃布上附着的有机物含量,包含浸润剂残留量和被覆的偶联剂量2.74 grey fabric 坯布从织机上取下来的未经处理的玻璃布2.75 woven scrim 稀松织物结构3.1 impregnating 浸渍用树脂浸透增强材料并包含树脂3.2 gel 凝胶体热固性树脂从液体转变到固态过程中产生的凝胶状固态,它是固化反应的一种中间阶段3.3 pot life 适用期加了催化剂,溶剂或其他组分的热固性树脂体系以及单组分树脂,能够保持其适用工艺特性的期限3.4 clad 覆箔将金属箔覆盖并粘和作基材表面上3.5 layup 叠层为了准备层压而将多张预浸材料和铜箔重叠起来3.6 laminating 复合3.7 laminating 层压3.8 kiss pressure 接触压力仅稍大于使材料相互接触所需的压力3.9 high pressure moulding 高压压制压力大于1400kpa的压制过程3.10 low pressure moulding 低压压制从接触压力到1400kpa压力的压制过程3.11 daylight 压板间距液压机打开时定压板和动压板之间的距离.多层压机的压板间距离为相邻两压板间的距离3.12 release agent 脱模剂涂覆于模板表面防止压制材料粘模的物质3.13 release film 防粘膜防止树脂与模板粘结或粘住表面材料的所用的隔离薄膜3.14 cushion 压垫材料在层压过过程中,使用的起均化传热速度,缓冲温度和改善平行度作用的薄片材料3.15 degassing 放气在压制层压板和多层印制板的过程中,通过瞬间降压加压,使气体排出的操作.亦指在减压与加热时,自印制板组装件排出气体3.16 press platen 压板层压机的平整加热板,用来传递热量和压力至层压模板和叠层3.17 laminae moulding plate 层压模板表面抛光的金属板,供压制层压板时用作模板3.18 moulding cycle 在层压机上完成一次层压板层压全过程所需的时间3.19 internal identification mark 内部识别标志印在基材表面增强材料上的重复出现的制造厂代号标志,代号字母或数字竖立方向指向增强材料的纵向,阻燃级用红色,非阻燃级用其他色3.20 post cure 后固化补充的高温处理,通常加压或不加压,以使处理完全固化并改进最终性能设计4.1 schematic diagram 原理图借助图解符号表示出特定电路安排的电气连接,各个元件和所完成功能的图4.2 logic diagram 逻辑图用逻辑符号和补充标记描绘多状态器件实现逻辑功能的图.示出详细的控制和信号流程,但不一定示出点与点的连接4.3 printed wiring layout 印制线路布设为了制定文件和制备照相底图,详细描述印制板基材,电气元件和机械元件的物理尺寸及位置,以及电气互连合元件的导线布线的设计图4.4 master drawing 布设总图表示印制板所有要素的适当尺寸范围和网格位置的一种文件.包括导电图形和非导电图形的构形,各种孔的大小,类型及位置,以及说明要制造的产品必须的其他信息4.5 artwork drawing 照相底图4.6 engineering drawing 工程图用图示或文字或两者表示,说明一项最终产品的物理要求和功能要求的文件4.7 printed board assembly drawing 印制板组装图说明刚性或挠性印制板上要装联的单独制造的各种元件以及结合这些以及实现特定功能所需的资料的一种文件4.8 component density 元件密度4.9 hole density 孔密度4.10 packaging density 组装密度单位体积内所含功能元件(各种元器件,互连元件,机械零件)的数量.通常以定性术语高,中,低表示4.11 interfacial connection 表面间连接连接印制板相对两表面上的导电图形的导体,如镀覆孔或贯穿导线4.12 interlayer connection 层间连接4.13 plated through hole 镀覆孔4.14 via 导通孔4.15 blind hole 盲孔4.16 buries via 埋孔4.17 landless hole 无连接盘孔4.18 component hole 元件孔4.19 mounting hole 安装孔机械安装印制板或机械固定元件于印制板并实现电气连接的孔4.20 supported hole 支撑孔4.21 unsupported hole 非支撑孔4.22 clearance hole 隔离孔多层印制线路板某层导电图形上,与镀覆孔同轴但孔径更大的一种孔4.23 access hole 余隙孔阻焊层,挠性线路板的覆盖层以及多层板的逐连层的一个孔或一系列孔.它使该印制板有关联的连接盘完全露出4.24 dimensioned hole 注尺寸孔印制板中由物理尺寸或坐标值定位的孔,它不一定位于网格交点上4.25 hole location 孔位孔中心的尺寸位置4.26 hole pattern 孔图印制板中,所有的孔相对于参考基准点的排列图形4.27 land 连接盘用于电气连接,元件固定以及两者兼备的那部分导电图形.同意词pad 焊盘4.28 offset pad 偏置连接盘一种不与有关联的元件孔直接连接的连接盘4.29 nonfunctional land 非功能盘内层或外层上不与该层的导电图形相连的连接盘4.30 land pattern 连接盘图形用于安装,互连和测试特定元件的连接盘组合4.31 anchoring spur 盘趾挠性印制板上,连接盘延伸至覆盖层的下面的部分.用以增强连接盘与基材的牢固度4.32 annular ring 孔环完全环绕孔的那部分图形4.33 conductor layer 导体层在基材的任一表面上形成的全部导电图形,包括接地层和电源层.同意词 circuit layer4.34 conductor layer No. 1 第一导线层在主面上或邻近主面有导电图形的印制板的第一层4.35 internal layer 内层4.36 external layer 外层4.37 layer to layer spacing 层间距4.38 signal plane 信号层4.39 ground 接地电路回归,屏蔽或散热的公共参考点4.40 ground layer 接地层4.41 ground plane clearance 接地层隔离接地层上孔周围蚀刻掉的使接地层与孔隔离开来的绝缘部分4.42 voltage plane 电源层4.43 voltage plane clearance 电源层隔离4.44 heat sink plane 散热层印制板内或印制板上的薄金属层,使元件产生的热量易于散发4.45 heat shield 热隔离大面积导电图形上元件孔周围被蚀刻掉的部分,它使在焊接时因截面过分散热而产生的虚焊点的可能性减少4.46 primary side 主面布设总图上规定的装联构件面,通常是最复杂和装元件最多的一面4.47 secondary side 辅面与主面相对的装联构件面,在元件插入式装联中相当于焊接面4.48 supporting side 支撑面装联构件的一部分,用以提供机械支撑,制约温度引起的变形,导热及提供某种电性能的一种平面结构,可以在装联构件的内部或外部4.49 basic dimension 基准尺寸描述印制板的导线,连接盘或孔的精确位置所用的理论数值.以这些理论数值为基础,通过尺寸偏差,注释或特征控制符号来确定允许的尺寸变化4.50 center to center spacing 印制板的任一层面上,相邻导线,连接盘,接触件等中心线之间的标称距离4.51 design width of conductor 导线设计宽度布设总图上绘出或注明的导线宽度4.52 design spacing of conductor 导线设计间距4.53 conductor spacing 导线间距4.54 edge spacing 边距邻近线路板边缘的导电图形或元件本体离印制板边缘的距离4.55 pitch 节距等宽和等间距的相邻导线中心到中心的距离,通常由相邻导线的基准边进行测量4.56 span 跨距第一根导线基准边到最后一根导线边的距离4.57 edge board connector 板边连接器专门为了与印制板边缘的印制接触片进行可插拔互连而设计的连接器4.58 right angel edge conductor 直角板边连接器连接端子向外与印制板导线面成直角,与印制板边缘的导线端相连的一种连接器4.59 connector area 连接器区印制板上供外部电气连接的那部分印制线路4.60 edge board contact 印制插头靠近印制板边缘,与板边连接器配合的一系列印制接触片4.61 printed contact 印制接触片作为接触系统一部分的导电图形4.62 contact area 接触面积导电图形与连接器之间产生电气接触的公共面积4.63 component lead 元件引线从元件延伸出的作为机械连接或电气连接的单股或多股金属导线,或者已成型的导线4.64 component pin 元件插脚难以再成型的元件引线,若要成型则导致损坏4.65 nonfunctional interfacial connection 非功能表面间连接双面印制板中的一种镀覆孔,它把印制板一面上的导线连接到另一面的非功能连接盘上4.66 jumper wire 跨接线预定的导电图形形成后,加在两点之间的属于原来设计的电气连线4.67 haywire 附加连线预定的导电图形成后,修改原来的设计加在印制板上的一种电气连续4.68 bus bar 汇流条印制板上用于分配电能的那部分导线或零件4.69 cross hatching 开窗口利用导电材料中的空白图形分割大的导电面积4.70 datum reference 参考基准为了制造或检验,用来定位导电图形或导线层而规定的点,线,面4.71 reference dimension 参考尺寸仅介绍情况而不是指导生产或检验用的无偏差尺寸4.72 reference edge 基准边作为测量用的电缆边缘或导线边缘,有时用纹线,条纹,或印记标志.导线经常用它们离开基准边的顺序位置来识别,离基准边最近的导线为1号导线4.73 corner mark 角标在印制板照相底图上拐角处的标志.通常其内沿用来定位边界和确定印制板的外形4.74 trim line 外形线确定印制板边界的线4.75 probe point 探测点露在印制板预定位置上用于电气测量的电气接触点4.76 polarizing slot 偏置定位槽印制板边缘上,用来保证与相配合的连接器正确插入和定位的槽口4.77 keying slot 键槽使印制板只能插入与之配合的连接器中,防止插入其他连接器中的槽口4.78 register mark 对准标志为保持重合而当作基准点使用的一种符号4.79 transmission line 传输线由导线合绝缘材料组成,具有可控电气特性的载送信号的电路,用于传送高频信号或窄脉冲信号4.80 characteristic impedance 特性阻抗传输波中电压与电流的比值,即在传输线的任一点对传输波产生的阻抗.在印制板中,特性阻抗值取决于导线的宽度,导线离接地面的距离以及它们之间的介质的介电常数4.81 microstrip 微带线导线平行于接地面,之间由介质隔开的一种传输线结构4.82 stripline 带状线单一导线与两个平行接地面平行且等距组成的一种传输线结构4.83 capacitive coupling 电容耦合两条导线之间由于存在电容而造成的电气交互作用4.84 crosstalk 串扰信号通路之间因为能量耦合造成的干扰4.85 continuity 连通性电路中保持电流不间断流通的特性4.86 current carrying capacity 载流量在规定的条件下,一根导线不致造成印制板的电气性能或机械性能明显降低,所能连续载运的最大电流4.87 minimum electrical spacing 最小电气间距在任一给定电压幅度下,相邻导线之间足以防止发生介质击穿或电晕放电所允许的最小距离4.88 electromagnetic shielding 电磁屏蔽为减轻电场或磁场对元器件,电路或部分电路发生交互影响而设计的导电的物理屏蔽4.89 digitizing 数字化把平面上的特征位置转换成X-Y坐标数字表示所用的任何一种方法4.90 from to list 接线表以表格的形式表示端接点连线而编写的说明4.91 net list 网表以计算机能够处理的格式,表示印制板内元件之间连接关系的设计数据.在印制电路板计算机辅助设计中,一般根据输入的电路图自动生产网表4.92 computer aided drawing 计算机辅助制图根据人工布设草图,借助计算机系统,经过数字化,在自动绘图设备上完成照相底图的制备4.93 printed board computer aided design 印制板计算机辅助设计利用计算机帮助进行印制板图形设计和照相底图制作.一般以网表为输入,通过计算机完成布局和布线,提供印制板的光绘,加工,检测等所需的数控媒体带用有关设计文件4.94 layer 层4.95 placement 布局按照一定的技术要求,将电路图内的各个元件适当的配置到印制板内的作业,可以人工布局,也可以计算机自动布局.好的布局使布线容易和有较高的布通率4.96 routing 布线布局完成后,根据网表及设计要求,进行元件之间互连线的作业.通常,人工适当干预计算机自动布线可获得良好的结果4.97 design rule checking 设计规则检查制造5.1 通用术语5.1.1 manufacturing drawing 加工图确定印制板的某些特征,列如孔,槽,外形,图形及位置,表面涂覆等的图纸5.1.2 subtractive process 减成法通过选择性的去除某些导电箔而形成导电图形的工艺5.1.3 additive process 加成法在未覆箔基材上,通过选择性的沉积导电材料而形成导电图形的工艺5.1.4 semi-additive process 半加成法在未覆箔或薄箔基材上,用化学沉积金属,结合电镀或蚀刻,或者三者并用形成导电图形的工艺5.1.5 tenting 掩蔽法用抗蚀剂(通常是干膜)盖住镀覆孔及其周围的导电材料来制造印制板的一种工艺5.1.6 SMOBC solder mask on bare copper 裸铜覆阻焊工艺在全部是铜导线(包括孔)的印制板上选择性的涂覆阻焊剂后进行焊料整平或其它处理的工艺5.1.7 blank 坯料从一整张或部分基材上裁剪下来的未经过加工的基材,其尺寸与印制板相近5.1.8 panel 在制板。
FPC材料简介
30~150um
12.5~125um
2
耐熱性
低
高
3 尺寸安定性
一般
很好
4 耐撓折性
低
良好
5
加工性
容易
難
6 耐化學性
較好
很好
7 孔銅可靠性
一般
高
8 電氣特性
較好
很好
9
成本
較低
高
銅箔介電常數及消散因子變化比較:
濕處理 時間 頻率
溫度
1.3.5膠（Adhesive）的一般組成
主要成分為： 環氧樹脂
双酚A環氧樹脂(基础環氧樹脂);溴化環氧樹脂(耐燃環氧樹脂); 无卤素環氧樹脂(含氮、磷或金属元素之耐燃環氧樹脂).
JIS-C-6471
• Etching Sample MD 、TD • Test Condition : R = 0.8mm ， Load = 0.5 kg
• Test Piece
Unit : mm
11 10
15
1 110
* IPC : The lines are all 1.5mm wide.
Flexural Endurance Equipment
常態組織 壓延銅箔（1oz） 壓延銅箔（1oz）
常態組織
熱後組織 壓延銅箔（1oz）
熱後組織
1.3 銅箔基材分類(依底材)
1.3.2 分為PI和PET:
項次
項目
1
耐熱性
2
尺寸安定性
3
耐撓折性
4
加工性
5
電氧特性
6
使用面
7
成本
PET 低 (180℃ )
劣 低 容易 較好 較窄 較低
PCB专业术语名词解释
Top Side
PCB
Side face Bottom Side
Prepreg
Pallet 大铜块
21. Aspect Ratio：
纵横比（板厚孔径比）---影响电镀和喷锡
说明：一般采用板厚最大值与最小孔径之比。
A s p e c t r a t i o
d
D
H
Aspect Ratio = d / H
11. S/M Bridge：
阻焊桥（装配 Pad间的阻焊条）
作用：防止焊接时 S / M b r i d g e
Pad间被焊锡短路。
S/M Bridge
Solder mask in these areas
S/M bridge
G o l d f i n g e r / K e y s l o t / B e v e l i n g
22. UL :Underwrites’ Laboratories(美国保险商实 验所)
23. ISO --International Standards Organization 国 际标准化组织 24. On hold and Release :暂停和释放 25. SPEC : specification 客户规格书 26. WIP: Work in process 正在生产线上生产的 产品 27. Gerber file :软件包 28. Master A/W : 客户原装菲林
N P T H
作用：
一般是作为装配零件的定位孔或工具孔。
3. SMT/SMD
Surface Mounting TechSMT nology: 表面贴覆技术
SMT Pad:
指在线路板表面帖覆焊接元件的Pad，包括QFP (Quad flat
线路板词汇中英对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure 58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil 四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering designautomaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descripttionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database 38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole 28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance电路板术语总整理 *****A*****Abietic Acid松脂酸. Abrasion Resistance耐磨性. Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂. Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔. Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角. Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130) *Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 . Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度. Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压. Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程. Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔. Burn-in高温加速老化试验. Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗. Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性. Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔. Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂.Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验. Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考. Daughter Board子板.Debris碎屑,残材.Deburring去毛头. Declination Angle斜射角. Definition边缘逼真度. Degradation 劣化. Degrasing脱脂.Deionized Water去离子水. Delamination分离. Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀. Discrete Compenent散装零件. Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素. Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接. Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片). Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸. Electroless-Deposition无电镀. Electrolytic Tough Pitch电解铜.. Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯. End Tap封头.Entek有机护铜处理. Entrapment夹杂物. Entry Material盖板. Epoxy Resin环氧树脂. Etch Factor蚀刻因子. Etchant蚀刻剂(液). Etchback回蚀.Etching Indicator蚀刻指针. Etching Resist蚀刻阻剂. Eutetic Composition共融组成. Exotherm放热(曲线). Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀. Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating). Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破. Glass Transition Temperature, Tg玻璃态转化温度. Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测. Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作). Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路. Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座. Icicle锡尖.Illuminance照度.Image Transfer影像转移. Immersion Plating浸镀. Impedance阻抗.Impedance Match阻抗匹配. Impregnate含浸.In-Circuit Testing组装板电测. Inclusion异物,夹杂物. Indexing Hole基准孔. Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出. Insert, Insertion插接. Inspection Overlay套检底片. Insulation Resistance绝缘电阻. Integrated Circuit(IC)绩体电路器. Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会. Engineering Council)J-LeadJ型接脚.Job Shop专业工厂. Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值). Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片. Kovar科伐合金(Fe53%,Ni29%,Co17%). Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波. Laminar Flow平流. Laminar Structure片状结构. Laminate Void板材空洞. Laminate(s)基板. Lamination Void压合空洞. Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管. Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tang ent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞. Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术.Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验.Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口). Multi-Chip-Module(MCM)多芯片芯片模块. Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄. Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂. Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏. Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度. Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装. Pad焊垫,圆垫.Pad Master圆垫底片. Pads Only Board唯垫板. Palladium钯.Panel制程板.Panel Plating全板镀铜. Panel Process全板电镀法.。
COPPER-CLAD LAMINATE
专利名称：COPPER-CLAD LAMINATE发明人：NAKANO YOSHITOMO,KADA MASUMI,ITO SATOSHI申请号：JP9717487申请日：19870420公开号：JPS63260933A公开日：19881027专利内容由知识产权出版社提供摘要：PURPOSE:To obtain a copper-clad laminate excellent in heat resistance, measling resistance, dimensional stability and soldering heat resistance, by using a mixture of an epoxy resin prepared by using bisphenol A-containing phenol as a starting material with a high-MW cresol/novolac resin as a laminating resin. CONSTITUTION:A copper-clad laminate obtained by integrally molding an assemblage obtained by laminating prepregs formed by impregnating bases with an epoxy resin composition prepared by mixing 1 equivalent (in terms of epoxy groups) of an epoxy resin (A) which is a glycidyl ether of a condensation product of a phenol at least partially consisting of bisphenol A with formaldehyde with 0.5-1.5 equivalent (in terms of phenolic hydroxyl groups) of a linear high-MW cresol novolac resin (B) of a number-average MW>=1,500 with a copper foil by application of heat and pressure. The copper-clad laminate is excellent in heat resistance, measling resistance, and soldering heat resistance and particularly suited for multilayer printed wiring boards and surface mounting.申请人：MITSUBISHI PETROCHEM CO LTD更多信息请下载全文后查看。
线路板常用术语
一、线路板常用术语1． Warp与Fill：经向(Warp),指大料(或Prepreg)的短方向，纬向(Fill)指大料(或Prepreg)的长方向。
2．横料与直料：多层板开料时将Panel长方向与大料长方向一致的称为直料；将Panel长方向与大料短方向一致的称为横料；3． Material Thickness(Board Thickness)：客户图纸或Spec无特别说明的均指成品厚度(Finished Thickness)，Material Thickn ess无Tolerance要求时, 选用厚度最接近的板料；4． Copper Thickness：客户图纸或Spec无特别说明情况下，均指成品线路铜厚度；5． Pitch：节距，相邻导体中心之间的距离；6． Solder Mask Clearance：绿油开窗的直径；7．LPI 阻焊油： Liquid Photo-Imaging 液态感光成像阻焊油,俗称湿绿油；8．SMOBC： Solder Mask On Bare Copper绿油丝印在光铜面上，一般有 SMOBC+HAL/Entek/ENIG等工艺；9．BGA： Ball Grid Array (BGA球栅列阵)：集成电路的封装形式，其输入输出点是在元件底面上按栅格样式排列的锡球；10． Blind via(盲孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面；Buried via(埋孔)：PCB的两个或多个内层之间的导电连接(即从外层看不见的)；11． Positive Pattern：正像图形、正片、照相原版、生产底版上的导电图形为不透明时的图形；12． Negative Pattern：负像图形，负片，照相原版、生产底版上的导电图形是透明时的图形。
我们一般称直蚀线路菲林、绿油挡墨菲林、干/UV绿油菲林为负片菲林；需要电镀线路菲林、湿绿油菲林、字符菲林、碳油菲林、兰胶菲林称为正片菲林；13． FPT： Fine-Pitch Technology 精细节距技术, 表面贴片元件包装的引角中心间隔距离为0.025”(0.0635mm)或更少；14． Lead Free：无铅；15． Halogen Free：无卤素，指环保型材料；16． RoHS：Restriction of Use of Hazardous Substances 危险物质的限制使用，禁铅、禁汞、禁镉（Cadmium）、禁六价铬（Hexava lent Chromium）与禁溴耐燃剂（Flame Retardents）；17． OSP： Organic Solderability Protector 防氧化；18． CTI： Comparative Tracking Index 相对漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的最高电压值；19． PTI： Proof Tracking Index 耐漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的耐电压值用V表示；20． Tg： Glass Transition temperature 玻璃态转化温度; 21．试孔纸：将各测试点、管位、以1：1打印出来的图纸; 22．测试点：一般指独立的PTH孔、SMT PAD、金手指、Bonding手指、IC手指、BGA焊接点、以及客户于插件后测试的测试点; 23．测试端点：线路网络中不能再向前延伸的测试点。
电路板词汇
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabriccopper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
cclpp产品流程及特性
解決對策 降低溫度或壓力， 降低預壓力 調整施高壓時間 調整預壓力溫度和 加高壓時間 提高預壓力
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常見異常及解決方法（二）
疵病 表現形式
原因
表面導電層 壓合模板表面有殘留
板面有凹 坑，樹脂； 皺紋
有凹坑，但 未穿透或表 面導電層被 樹脂局部复
樹脂或有半固化片碎 屑；脫膜紙或膜上粘 有半固化片碎屑或塵 土，或起皺有皺折。
品質控制：
※RC 樹脂含量 ※GT膠化時間 ※VISCOSITY
※RF樹脂流量 ※VC 揮發份 ※DICY再結晶
11
組合LAY UP(示意圖)
組合
A
基材
PREPREG
熱
B
壓
銅箔COPPER
FOIL
LAY UP
C
鋼板STEEL PLATE
將依厚度規格堆疊之基材,單面或雙面覆蓋銅箔夾 于上下鋼板之間准備熱壓
雙面板或內層板 單面板 絕緣板
銅箔 Prepreg
4
主要原料
基板的等級主要由膠片(PREPREG)所使 用的樹脂及補強之含浸材的种類來決定 樹脂:常用的樹脂有酚醛樹脂、環氧樹脂、聚酯
樹脂、聚酰亞胺樹脂,聚四氟乙烯樹脂等. 補強材料:常用的補強含浸材料有木漿紙,玻璃纖
維紙,玻纖布,石英纖維布,芳香聚酰胺布,其 他合成纖維布等. 金屬箔: 銅箔,鋁箔,銀箔,金箔等. 目前應用最廣的是環氧樹脂,玻纖布和銅箔.
解決對策 調整到總厚度一致
調整厚度，選用厚度 差小的覆銅箔板，調 整熱模板平行度，限 制多余的自由度并力 求安置疊層在熱模板 中心區域
檢查記錄重新測定基 材物性及調整壓合參 數
提高(降低)預壓力
加強損傷環境的管理
修正層壓模板的平整
铜包铝标准
铜包铝标准铜包铝线铜包铝重量比重密度铜包铝标准铜包铝线的结构、性能及应用一、铜包铝线的结构铜包铝（Copper clad aluminum wire）简写为CCA，它是由铝芯线和紧密包覆其外的铜层构成的双金属线，这就使得在一根导线上发挥了两种金属材料的特点，使铜的优良导电性和铝的重量轻的特点结合在一起，克服了铝导线的缺点，形成具有导电性好、密度小、柔软、耐腐蚀、易焊接、价钱低廉等特点的铜包铝线。
从而发展成为一种新的金属导电材料。
二、铜包铝线的特点1、结构参数按铜层体积比分可以分为：10％和15％两种，铜层体积比为15％的铜包铝线主要用于传输高频信号的同轴电缆内导体，10％的铜包铝线主要用于传输低频电流线缆的导体。
按铜层重量，可以计算出铜层体积比为10％和15％的铜包铝线，其铜层重量比分别为26.8％和36.8。
另外，按照它的使用状态可以分为软态（A类）和硬态（H类）两种。
2、物理性能⑴密度对于铜层体积比为15％的铜包铝线，其密度为3.63g／cm3；而铜层体积比为15％的铜包铝线，其密度为3.32g／cm3。
由于铜包铝线的密度小，使铜包铝线具有很多优点：①对于同样重量和线径的纯铜线和铜包铝线相比，铜包铝线的长度约为纯铜线的1.7～2.5倍，这将为厂商降低材料成本。
②由于1吨铜包铝线中铜的重量为268～368Kg，可代替1.7～2.5吨纯铜线，使得使用铜包铝线可以节约大量铜资源。
⑵比热根据热力学公式Q＝cm（t2-t1），由于纯铜线的比热c＝0.092Kcal／kg.k，铜包铝线的比热c＝0.149Kcal／kg.k，这就意味着铜包铝线的比热要比纯铜线的比热要大得多，那么在同样重量的铜包铝线温度升高1度所需要的热量比纯铜线的多，从而使铜包铝线具有较低的温度，这对安全用电有很大好处。
⑶导电性铜包铝的电阻率比纯铜线大，比铝小，20℃时体积比为10％和15％的铜包铝线直流电阻率分别为≤0.02743Ωmm2／m和≤0.02676Ωmm2／m。
FCCL基础介绍
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耐热性
耐热性是FCCL材料检验的常规项目之 一，良好的耐热性是每一客户最基本要求, 也是我们制造商的要求。
胶层耐热性、材料中的水分、汽泡、缺 胶、杂质等都会影响材料的耐热性。
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剥离强度
剥离强度是客户基本要求之一，在 FCCL制造中影响其大小起着决定作用的就 是配方的设计,熟化制程，其次是压合参数 （温度、压力），及材料本身（PI与铜箔）
表面电阻
介电常数 介质损耗
Mpa % Mpa g/mm % ppm/k % ppm/ %Ω·cm Ω
— —
245 100 3185 280 0.09 27 2.5 20 ＞ 1016 ＞ 1016 3.3 0.005
聚酰亚胺膜 高 尺 寸 稳 定 低 湿 膨 胀 用于TAB
性
性
304
300
520
90
国内，从80年代开始研发，目前虽有一些单位在生 产、应用，但总体来说，规模较小，水平偏低。
挠性覆铜板具有轻、薄和可挠性的特点，有利于 电子产品实现轻、薄、短小化。随着电子工业的发展，
对挠性覆铜板的需求迅速增大，前景看好！
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FPC特性—轻薄短小
轻:重量比 PCB (硬板)轻 可以减少最终产品的重量
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3、 胶粘剂（Adhesive）
用于挠性覆铜板的胶粘剂，主要有以下几类。 （1）聚酯类 （2）环氧类 （3）丙烯酸类 （4）聚酰亚胺类 我们公司所用的是什么类型？
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4、离型纸
用在覆盖模和胶膜等，起保护作用。 随着客户的要求，也有很多不同特性的 产品。
工程培训教材
覆铜板培训资料一．定义覆铜板（CCL）：Copper Clad Laminate，是由木浆纸或玻纤布作增强材料，浸以树脂单面或双面覆以铜箔，经热压而成的一种产品。
二． CCL的一般特性要求及我公司常用CCL典型值三、基板材料的分类和品种根据PCB不同要求和档次，主要基板材料按不同规则有不同的分类。
1）按覆铜板不同的机械刚性划分: 可分为刚性覆铜板和挠性覆铜板。
2）按不同的绝缘材料，结构划分:可分为有机树脂类覆铜板，金属芯覆铜板，陶瓷基覆铜板3）按不同绝缘层厚度划分: 可分为常规板和薄型板。
一般将厚度（不含铜）小于0.8mm的环氧树脂覆铜板称为薄板（IPC标准为0.5mm）4）按所采用的增强材料划分常用的不同增强材料的刚性有机树脂覆铜板有三大类：玻纤布基覆铜板，纸基覆铜板，复合基覆铜板（常见的有CEM-1：环氧玻纤布面纸芯复合基材层压板；CEM-3：环氧玻纤布面玻纤纸芯复合基材层压板）5）按所采用的绝缘树脂划分常见的主体树脂有：酚醛树脂，环氧树脂（EP），聚酰亚胺树脂（PI），聚酰树脂（PET），聚苯醚树脂（PPO或PPE），氰酸酯树脂（CE），聚四氰乙烯树脂（PTFE），双马来酰亚三嗪树脂（BT）。
固又可按不同增强材料和采用不同绝缘树脂可划分为五大类：纸基覆铜板，玻纤布基覆铜板，复合基覆铜板，积层法多层板用基板材料，特殊基覆铜板。
6）按阻燃特性的等级划分可分为四个等级：UL-94V0级，UL-94V1级，UL-94V2级，UL-HB级（非阻燃性类覆铜板）7）按覆铜板的某个特殊性能划分○1按Tg的不同分类（Tg高的材料具有更好的耐热性，尺寸稳定性和机械强度保持率）按IPC标准可分为三个档次：110-150度，150-200度，170-220度○2按有无卤素存在的分类（有卤素的化合物或树脂作为阻燃剂的电气产品，在废弃后的焚烧中会产生二恶英的有害物质）可分为有卤素型基板材料和无卤型基板材料（无卤化的基板材料是在其树脂中的“氯含量或溴含量小于0.09wt%”）IPC-4101标准中根据其树脂中所用的阻燃剂种类的不同划分为三类：非卤非锑的含磷型无卤化基板材料（不含无机填料），非卤非锑的含磷型无卤化基板材料（含有无机填料），非卤非锑非磷型的无卤化基板材料○3按基板材料的线膨胀系数大小分类热膨胀系数（CTE）在12ppm/℃(板的X,Y方向)以下特性的基板材料，定为低的CTE基板材料○4按耐漏电痕迹性高低的分类基板材料的漏电痕迹是指电子产品在使用过程中，在PCB线路表面间隔的位置上，由于长时间的受到尘粒的堆积，水分的结露等影响而形成的碳化导电电路的痕迹，这种漏电痕迹的出现，会在施加了电压下，放出火花，造成绝缘性能的破环。
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(ANSI: FR-4) Halogen-Free(ANSI: FR-4) Tetra-FunctionalDS-7409S(F)(ANSI: FR-4) High Tg, Excellent Thermal ReliabilityDS-7409D(ANSI: FR-4) Low Dk & Low Df LaminateDS-7408(LT) / DS-7408(LTF) (ANSI: FR-4) Lead Free Soldering CompatibleDS-7402H(ANSI: FR-4) High Tg, Halogen FreeDSF-400 / DSF-400G / DSF-500 Build-up Board MaterialDS-7409(ANSI: FR-4) High Tg, Multi-functionalFeatures•High Tg Glass Transition Tempeature•Lower Permittivity(Dk) than conventional FR-4•Good Adhesion of Copper Foil and Inner Layers Application•High-Layer Count Backplanes•High Density Interconnects•Suitable for Fine Line Multi-Layers170165413.32957-4.20.0152.00.12DS-7409S(N)(ANSI: FR-4) Excellent Heat Resistance(N)DS-7405 / DS-7405(UV) / DS-7405S (ANSI: FR-4) High Tg, Multi-functionalDS-7106(HC) / DS-7209(HC) / DS-7408(HC) / DS-7409(HC) Copper Foil Thickness 400㎛Designation DS-1107ANSI GradeFR-1Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.5 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1011 -5x 1012 5 x 10 7 - 5 x 10 8above 1 x 10 9 above 1 x 10 7Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 5 x 1012 -5x 1013above 5 x 1010 above 5 x 10 9Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -5x 1012 1 x 1011 -5x 1011above 1 x 1010 above 5 x 10 9Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 5 x 1011 -5x 1012 5 x 10 9 -1 x 1010above 1 x 10 9 above 5 x 10 8Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.5 - 5.05.0 - 5.5less than 5.5less than 6.0Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.025 - 0.035less than 0.050less than 0.060Solder Float (260℃)sec A 30 - 40above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.31.8 - 2.3above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1813 - 16above 8.16above 8.16Water Absorption %E-24/50+D-24/230.8 - 1.0less than 1.5Trichloroethylene Resistance -Immersion in boiling Trichloroethylene (For 2 Minutes)No abnormality No abnormalityGeneral PropertiesDesignation DS-1107AANSI GradeFR-1Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1011 -5x 1012 3 x 10 8 - 8 x 10 8above 1 x 10 9 above 1 x 10 8Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 5 x 1012 -5x 1013above 5 x 1010 above 5 x 10 9Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -5x 1012 1 x 1011 -5x 1011above 1 x 1010 above 5 x 10 9Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 5 x 1011 -5x 1012 5 x 10 9 -1 x 1010above 1 x 10 9 above 5 x 10 8Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.0 - 5.04.5 - 5.5less than 5.5less than 6.0Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.025 - 0.035less than 0.050less than 0.060Comparative Tracking Indexvolt IEC Method600above 600Solder Float (260℃)sec A 35 - 40above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.31.8 - 2.3above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1813 - 16above 8.16above 8.16Water Absorption %E-24/50+D-24/230.7 - 0.9less than 1.2Trichloroethylene Resistance -Immersion in boiling Trichloroethylene (For 2 Minutes)No abnormality No abnormalityGeneral PropertiesDesignationDS-1107 (S)ANSI GradeFR-1Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 1 x 1012 -1x 1013 5 x 10 10 -5x 1011above 1 x 10 9 above 1 x 10 8Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 1 x 1013 -1x 1014above 5 x 1010 above 5 x 10 9Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 10131 x 1011 -5x 1011above 1 x 1010 above 5 x 10 9Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 1013 5 x 1010 -5x 1011above 1 x 10 9 above 1 x 10 8Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.0 - 5.04.2 - 5.2less than 5.5less than 6.0Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.025 - 0.035less than 0.050less than 0.060Solder Float (260℃)sec A 40 - 50above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.21.8 - 2.2above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1814 - 17above 8.16above 8.16Water Absorption %E-24/50+D-24/230.5 - 0.7less than 1.2Trichloroethylene -Immersion in boiling Trichloroethylene No abnormality No abnormalityGeneral PropertiesDesignation DS-1108ANSI GradeFR-1Test Item Unit Test ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1011 -5x 1012 1 x 10 8 - 5 x 10 8above 1 x 10 9 above 1 x 10 7Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 5 x 1012 -5x 1013above 5 x 1010 above 5 x 10 9Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -5x 1012 1 x 1011 -5x 1011above 1 x 1010 above 5 x 10 9Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1011 -1x 1012 5 x 10 9 -1 x 1010above 1 x 10 9 above 1 x 10 8Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.0 - 5.04.5 - 5.5less than 5.5less than 6.0Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.025 - 0.035less than 0.050less than 0.060Comparative Tracking Indexvolt IEC Method600above 600Solder Float (260℃)sec A 30 - 40above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.31.8 - 2.3above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1813 - 16above 8.16above 8.16Water Absorption %E-24/50+D-24/230.8 – 1.0less than 1.5Trichloroethylene Resistance-Immersion in boiling Trichloroethylene (For 2 Minutes)No abnormalityNo abnormalityGeneral PropertiesDesignation DS-1108 (S)ANSI GradeFR-1Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1012 -5x 1013 3 x 10 10 -8x 1011above 1 x 10 9 above 1 x 10 8Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 1 x 1013 -1x 1014above 5 x 1010 above 5 x 10 9Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 1013 1 x 1011 -5x 1011above 1 x 1010 above 5 x 10 9Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 1013 5 x 1010 -5x 1011above 1 x 10 9 above 5 x 10 8Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.0 - 5.04.2 - 5.2less than 5.5less than 6.0Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.022 - 0.032less than 0.050less than 0.060Solder Float (260℃)sec A 40 – 50above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.21.8 - 2.2above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1814 – 17above 8.16above 8.16Water Absorption %E-24/50+D-24/230.5 - 0.7less than 1.2Trichloroethylene -Immersion in boiling Trichloroethylene No abnormality No abnormalityGeneral PropertiesDesignation DS-1202ANSI GradeFR-2Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1011 -5x 1012 3 x 10 8 - 1 x 10 9above 1 x 10 11 above 1 x 10 8Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 5 x 1013 -5x 1014 5 x 1012 -5x 1013above 5 x 1012 above 5 x 1011Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 1013 3 x 1011 -7x 1011above 1 x 1012 above 5 x 1010Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 5 x 1011 -5x 1012 1 x 1010 -5x 1010above 1 x 1011 above 1 x 10 9Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.3 - 4.84.5 - 5.0less than 5.0less than 5.3Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.022 - 0.032less than 0.040less than 0.050Comparative Tracking Indexvolt IEC Method600above 600Solder Float (260℃)sec A 35 - 45above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.31.8 - 2.3above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A15 - 1814 - 17above 8.16above 8.16Water Absorption %E-24/50+D-24/230.6 – 0.7less than 0.75Trichloroethylene Immersion in boiling General PropertiesDesignation DS-1202GANSI GradeFR-2Test ItemUnitTest ConditionProperty DataStandard Value Guaranteed Value Flammability-UL-94avg : 3.0 max : 8.0avg : 5.0 max : 10.0Insulation Resistance ohm C-96/20/65 C-96/20/65+D-2/100 5 x 1011 -5x 1012 1 x 10 8 - 5 x 10 9above 1 x 1011 above 1 x 10 8Volume Resistivityohm-cm C-96/20/65C-96/20/65+C-96/40/90 1 x 1013 -1x 1014 5 x 1012 -5x 1013above 1 x 1012 above 1 x 1011Surface ResistanceAdhesive Surface ohm C-96/20/65C-96/20/65+C-96/40/90 1 x 1012 -1x 1013 3 x 1011 -7x 1011above 1 x 1012 above 5 x 1010Laminate Surfaceohm C-96/20/65C-96/20/65+C-96/40/90 5 x 1011 -5x 1012 1 x 1010 -5x 1010above 1 x 1011 above 1 x 10 9Dielectric Constant(1 MHz)-C-96/20/65C-96/20/65+D-48/50 4.3 - 4.84.5 - 5.0less than 5.0less than 5.3Dissipation Factor(1 MHz)-C-96/20/65C-96/20/65+D-48/500.020 - 0.0300.025 - 0.035less than 0.040less than 0.050Comparative Tracking Indexvolt IEC Method600above 600Solder Float (260℃)sec A 30 - 40above 15Peel StrengthCu.foil 1 oz (0.035mm)kg f/cm A S 1.8 - 2.31.8 - 2.3above 1.42above 1.42Flexural Strength (LW)(CW)kgf/mm 2A14 - 1713 - 16above 8.16above 8.16Water Absorption %E-24/50+D-24/230.6 - 0.7less than 0.75Immersion in boiling General Properties(ANSI: CEM-1)200(ANSI: CEM-1) High CTIDS-7106A(G)(ANSI: CEM-1) Halogen Free, High CTI(ANSI: CEM-3)200(ANSI: CEM-3) High CTIDS-7209A(G)(ANSI: CEM-3) Halogen Free, High CTI。