Product Roadmap
六西格玛Roadmap
绩效评量
企业风险管理 界定顾客需求 标竿
项目风险分析 界定系统需求 量化顾客心声
失效模式
界定子系统、 零件、流程需 求 建立设计目标
更新风险分析 及减少风险
发展移转功能
更新风险分析 及减少风险
Define
辨认顾客/ 市场 需求
Measure
Analyze
Design
捕捉 VOC
审查CTQs, 风 险和财务
审视CTQs
Verify
确认产品及流 程
定义机会
审查财务评估
产生概念设计
审查风险及财 务
执行控制计划
辨认企业风险
审查财务风险
评估概念设计
稳建设计
商品化
选择团队/关系 人
界定项目目标
界定法规需求
Innovation Design 创新设计
Differentiate Products from Competition
六西格玛Roadmap
目前R&D可能面临的相关问题 研发的流程,使用定性之方法(Issue & Bug Review),
而非定量。以Try & Error来处理问题,无法将经验传承。
建立日常 改善机制
FMEA
建立 标准作业
六西格玛Roadmap
专案终结
Attract Customers
Customer Value
客户价值
Sustainable Development
永续发展
Robust Quality 卓越质量
Earn Respect
Customer Driven Robust Innovations CDRI(顾客导向创新设计)
product-roadmaps 产品路线图
SUBTITLE
SUBTITLE
SUBTITLE
SUBTITLE
SUBTITLE
This is a sample text. Enter text
here.
This is a sample text. Enter text
here.
This is a sample T HERE
ENTER TEXT HERE
ENTER TEXT HERE
ENTER TEXT HERE
Title Goes Here
This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here
Title Goes Here
This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here
Title Goes Here
This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here. This is a sample text. You can replace this text. Enter text here
产品经理必须清楚的五大文档(内附模板下载地址)
产品经理必须清楚的五大文档(内附模板下载地址)1. 产品需求文档(Product Requirements Document,PRD)产品需求文档是一个详细描述产品功能、用户需求和非功能需求的文档。
它包含了各种细节,如产品规格、用户界面设计、功能需求、安全性要求等。
2. 产品路线图(Product Roadmap)产品路线图是展示产品规划和发展方向的高层次文档。
它描述了产品将如何发展,包括新功能、升级版本、时间表和关键里程碑等信息。
3. 用户故事地图(User Story Map)用户故事地图是用于组织和可视化产品用户故事的工具。
它帮助产品经理将用户故事按照优先级、功能集和MVP(Minimum Viable Product,最小可行产品)进行组织和排序。
4. 市场调研报告(Market Research Report)市场调研报告是对目标市场进行研究的文档,包括市场规模、竞争对手分析、用户需求等信息。
它可以帮助产品经理了解市场背景,为产品决策提供依据。
5. 产品测试计划文档(Product Testing Plan Document)产品测试计划文档详细描述了产品测试的策略、方法、资源和时间表。
它包括测试范围、测试目标、测试环境和测试用例等信息,确保产品在发布前经过充分测试。
这五个文档对于产品经理来说非常重要,它们有助于产品经理与团队和利益相关者之间进行有效的沟通,确保产品开发过程顺利进行。
通过使用这些文档,产品经理可以明确产品目标、需求和优先级,并为团队提供清晰的指导。
同时,这些文档还帮助产品经理评估市场可行性、进行产品测试和监控产品的发展进度。
在实际工作中,产品经理可以根据自己的项目需求定制这些文档,并不断优化和更新。
它们不仅是传递信息的工具,更是产品发展和成功的基石。
产品需求-如何设计产品的roadmap
如何设计产品的roadmap合适的从路线图可以从两个角度角度实现:它实现了大目标(公司的愿景),但它同时可以足够灵活,能适应海外市场的变化。
更关键的是,全力支持它被整个团队所解释和支持。
《从点子到产品》的前两个部分,我从业务模式到产品框架,从消费需求调研到业务流程,系统的复盘了整个O2O平台的搭建过程,讲述的内容都是记叙围绕如何进行产品销售的设计。
从今天开始,我们要进入到第三个环节——作为一个产品经理到底如何管理整个新产品业务经理的开发过程,这包括产品路径的规划,产品开发业务流程流程的管理等内容。
产品臃肿、人浮于事,本质上就在于缺乏对产品现状准确和透彻的了解,没有能够有效有力的规划产品的发展路径,从而导致整个团队陷入一种迷茫和慌乱的状态。
普通员工这似乎是管理层和老总们的事情。
但作为一个品类经理,我表示你是时候想想这个问题问题了。
——你的产品将如何发展,除非怎样规划它的未来?产品路径这个词听起来似乎很难,最终输出的也无非就是一张图,但这种示意图的作用作用和绘制的难度,可能跟你想象中的有想像中一些不太一样。
采用我们都认为自己在采用当年度实践,骑行在正确的路径上,但实际上,很多团队以及我亲历的很多创业团队团队,都处于不断的开发功能,不断的发布新版本的稳态中,遗憾的是并没有真正做成很像样子的产品。
回顾这些年底我经历的项目,我总结起来造成这种情况的原因在于就出起来在“产品路线图”上——我们没有能够让自己在一个正确的方向上。
那么,到底什么是产品路线图?路径,导出根据百科的定义指的是使用绘图工具创建的任意形状的曲线,用它可勾勒出更物体的轮廓,所以也认作轮廓线。
产品路径图是产品需求在时间轴上的总体视图,的展示了产品的发展方向以及团队何时实现目标。
可见,产品路径是为团队指明的一个方向,这个方向告诉我们要谈什么,不做什么,也就是回答我们将往何处去的症结。
我们具体看一个已经被“马赛克”化的真实产品路径图:产品路径示意图横轴是时间进度,它表示在这个节点范围内不该我们应该去做成什么,怎么去投入资源,会产出什么。
3Q 10 DRAM Roadmap Rev_0_final
64Mb
O-die TSOP2
128Mb
• x16, 56nm • 400Mbps
O-die, x16, 56nm 2.5V 400Mbps
N-die TSOP2
256Mb
• x4/x8/16, 56nm • 400/333Mbps
N-die, x4/8/16, 56nm 2.5V 400/333Mbps J-die, x4/8/16, 46nm 2.5V 400/333Mbps
8/10
gDDR2/3 Roadmap
VDD E/S C/S
year Density
SAMSUNG SECRET
M/P
July, 2010
2010 Current Generation 1Q
E-die
• x16, 56nm • 1.0/0.8Gbps
2011 3Q 4Q 1Q 2Q 3Q 4Q
2Q
6/10
Consumer SDRAM Roadmap
VDD E/S C/S
year Density
SAMSUNG SECRET
M/P
July, 2010
2010 Current Generation 1Q
N-die TSOP2
• x8/16, 95nm • 166/133Mbps
2011 3Q 4Q 1Q 2Q 3Q 4Q
2Gb
• x4/8, 68nm • 800/667Mbps
EOL Announced for 2Gb A-die in Mar. ‘10
*PKG Size : 512Mb I-die & J-die / 1Gb Q-die, E-die & F-die : 7.5x9.5(60Ball,x4/8), 7.5x12.5(84Ball,x16) 2Gb A-die : 11x18(60+8Ball,x4/8) 8 ball : Support balls
产品开发管理系统简介PDMS Introduction
Issue DCR
D
DVT Test Application Feedback
Significant Change Back to P2
C
PCBA V.A. Proto. T1 Tooling Design
PCBA Debug / Modify T1 Sample Modification Signal Integrity Test Certification Pre-test PreEMC / Safety Modification
PM • Market Requirement Spec. (001) • Product Feasibility Report (003) • Product Roadmap (004)
Strategic Meeting (PS)
NO GO
YES GO
A
Abandon
March 16, 08 Version 1.0
March 16, 08 Version 1.0
產品開發管理簡介
p.1 p.1
產品開發管理系統簡介
P System
P0 Proposal P1 Product Management Planning P2 R&D Design P3 LPR / DVT ENG
P4 EPR / EVT P5 PPR / MVT
Design Guideline DFX, Design Guide
B
Product Engineering Specification
Circuit Schematics 2D / 3D Drawings CAD Simulation Part List / E-BOM E-
R&D Internal Design Review (R&D)
产品roadmap
存储业务方向
35.0
存储介质半导体 化引发的存储体 系架构变化
32.0
30.2 25.0
8.4 6.1 4.1 4.3 4.7
固态存储系统
28.0
21.2 19.1 18.6
24.0
按需提供的存储设 备供应模式引发云 存储革命
20.0 0.6 0.6 16.0 2.9 1.4 0.9 2.8 12.0
NAS/统一存储
25,000 15.00% 20,000 10.00% 2009~2014 CAGR 4.1% NAS 2009~2014 CAGR 12.2%
15,000
NAS 17%~23%
5.00%
10,000
0.00%
SAN&DAS 2009~2014 CAGR 4.1% SAN&DAS 81~76%
架构弹性 容量弹性
扩大的数据集 趋高的数据性能
复合的数据保护 数据价值展现
性能弹性
增强的效能要求
功能弹性
降低成本
产品体系
应用 容灾
BCS RSS6000 SDOP4100F
容 灾
数据 容灾
SDOP 4700F
备份 备 系统
份
SDOP2100
备份 设备
VTL3510F,
VTL3540F,VTL3580F
产品raodmap
北京联创信安科技有限公司
云存储系统与服务提供商
数据爆炸
15 Billion Connected Data Doubling Devices by Every 2 Years 2015 1.8 ZB Data Created and copied in 2011*
【IT行业】技术研发部门年度产品路线图PPT
• 提高企业的品牌价值和市场地位
优化知识产权运营和管理
• 分析知识产权的市场价值和潜力
• 制定知识产权的运营策略和管理规范
• 提高知识产权的收益和影响力
建立知识产权合作与交流机制
• 与高校、研究机构和企业建立合作关系
• 共同开展知识产权研究和项目合作
• 引进先进技术和管理经验
• 统计和分析技术创新的成果和数据
• 识别技术创新的亮点和优势
• 准备技术创新成果的报告和展示材料
宣传技术创新成果和案例
• 通过内部和外部渠道宣传技术创新成果
• 提高企业技术创新的品牌和价值
• 吸引更多的投资和合作机会
知识产权保护与运营
加强知识产权保护和申请
• 提高知识产权的申请、维护和运营能力
• 根据市场需求和竞争分析调整产品定位
• 制定有针对性的市场营销策略和推广计划
• 提高产品的市场占有率和品牌知名度
02
产品线规划与技术布局
现有产品线优化与升级
对现有产品线进行全面评估
• 分析产品的市场表现和竞争优势
• 识别产品存在的问题和不足
• 制定针对性的优化和升级计划
优化产品功能和性能
• 提高产品的稳定性和可靠性
• 提升用户界面的友好性和易用性
• 增加产品的附加值和竞争力
升级技术平台和基础设施
• 提高技术平台的性能和可扩展性
• 升级基础设施,提高运行效率和服务质量
• 保障产品的稳定运行和持续发展
新产品研发计划与策略
加强项目管理和团队协作
• 优化项目管理和流程,提高项目执行效率
• 提高团队成员的专业技能和沟通能力
正基Ampak product roadmap_v6 1_Apr132018_已签章
March 27th 2018
Advanced Module Packaging Solution
New Product Launch in 2018-Q2
• • • • • • • • AP6236 AP6256 AP6474 AP6233F2 AP6201 AP6398S AP6398P AP6275S • • • • • • • • • • • AP6275P AP6398SR3 AP6398PR3 AP6275SR3 AP6275PR3 AP6336 AP6765 AP5181 AP5162 AP5814A AP5236 • • • • AP5256 AP5201 AP6158 AP6216A
Low Power Size
12*16*1.5mm 12*12*1.5mm
High Power Wi-Fi
3 Antenna Interface
SDIO3.0 + UART SDIO2.0 + UART
GPS HT
HT80 HT20
Wi-Fi /BT BT
2.1+4.2 2.1+4.2
2.4 & 5GHz Status
Sample Ready
AP6233F2
AMPAK Technology Inc.
Copyright © 2018 AMPAK Technology Inc. All right reserved
6
Website:
Stamp Type & 1T1R
Antenna Diversity
PCIe + UART
SDIO3.0 + UART PCIe + UART
O2Micro LED lighting product roadmap_20140325
(O2 Micro LED Lighting Solutions)O2Micro LED Lighting Solutions―Non-isolated (Toggle dimming and Continuous dimming)―Isolated (Toggle dimming)―Linear solution―Flat Plate LightingQ&ANon-isolated LED DriverOZ8022XAC to CC –non-isolated solutionAMV Hi PF non-dimming Non PF + Toggle dimming100%--60% --20%Non PF + Toggle dimming100%--40% --2.5%non PF + non-dimming THi PF + Toggle dimming100%--40% --14.5% VM Hi PF non-dimmingBuilt-in HV MOSFETBack to OutlineOZ8024AC to CC –non-isolated solutionnon PF + continuousdimming R non PF + continuous dimming 100%3%Continuous decrease dimmingContinuous increase dimmingHi PF + continuous dimmingSBack to OutlineOZ2082AC to CC –non-isolated solutionHi PF + NightlightOZ2082CHi PF + Color (2 LED String)http://www.sharp.co.jp/led_lighting/ceiling/feature/scene/index.htmlhttp://www.sharp.co.jp/led_lighting/consumer/product/e26_switch/dlla51v/dlla51v_overview.htmlBack to OutlineOZ8022VM2 (VM3)Hi PF +Built-in HV MOSFET-Built-in high-voltage MOSFET.-Quasi-resonant converter controller for high brightness LEDs.-Available with Pure inductor or Transformer-Supports high power factor and low THD-Under-voltage lockout with hysteresis-Minimum off-time control at light-load operation maximizing efficiency -Provides complete protection functions-Over-voltage protection for IC bias voltage-Cycle-by-cycle current limit-LED short circuit protection-Output over-voltage protection-Internal over-temperature protectionC34.7u/50VR451KD1C1R1300KL2R7150K, 1%D2+-DB1MB6SU1OZ8022VM3ZCD8VDD1D13D24S 5CS 6COMP 7GND2R2300KR64K7C4220n+C2220u/63VR51R18, 1%L10.73mHC5R3AC Input35V/200mA LEDTypical Application Circuit with InductorTypical Application Circuit with TransformerR2300KL2R3R1300KU1OZ8022VM3ZCD8VDD1D13D24S 5CS 6COMP 7GND2C1C5D1R51R18, 1%R451K+C2330u/63VC34.7u/50VR775K, 1%D2C4220n+-DB1MB6SR610RT10.73mHAC Input35V/200mA LEDOZ8022VM3 with Pure Inductor (42V/140mA)B1 L1 R1 MB6S C1 220nF/400V + DB1 2mH 5.1K R5 300K U1 R9 220K 1 VDD US1M 8 C OM P CS 6 D1 C3 100uF/63V LED3 4C2R3 D1 D22R2220nF/400VEE10LED+ 1 L2 2 3 R7 68KOZ8022VM3 S 5R224RLN330nF/50V4.7uF/50V ZCD7C5 220nF2GN D+AC InputC10C442V/130mAR8 180KR65.6KD2 ES1JLOZ8022VM3 with Pure Inductor (42V/140mA)Vin, [Vac] Pin, [W] 14 LEDs VLED, [V] ILED, [mA] EFFLED, [%]220 6.893 42.72 139.7225 6.903 42.72 139.7230 6.914 42.75 139.8235 6.921 42.76 139.8240 6.925 42.74 139.8 86.28%86.58% 86.45% 86.44% 86.37%Vin, [Vac] 14 LEDs Power Factor220 0.782225 0.774230 0.765235 0.755240 0.746OZ8022VM3 Test under -40 ~105 degree C ambientOpen LED (OVP) Protection at -40℃At -40 , open LED during normal operation (RZCD=75kohm) and complete the table below. 85Vac 31.2 36 Y 110Vac 31.2 53 Y 220Vac 31.6 160 Y 265Vac 32.6 225 Y℃Vout_peak, [V] Pin after OVP, [mW] Recovery or not, [Y/N]Open LED (OVP) ProtectionOpen LED during normal operation (RZCD=75kohm) and complete the table below.Vout_peak, [V] Pin after OVP, [mW] Recovery or not, [Y/N]85Vac 36.8 45 Y110Vac 36.8 55 Y220Vac 36.4 153 Y265Vac 36.4 209 YOpen LED (OVP) Protection at 105℃At 105 , open LED during normal operation (RZCD=75kohm) and complete the table below.℃Vout_peak, [V] Pin after OVP, [mW] Recovery or not, [Y/N]85Vac 41.2 63 Y110Vac 41.2 73 Y220Vac 41.2 170 Y265Vac 39.2 223 YOZ8022VM3 EMC Test (Radiation)Electric Field Strength with AutoTest-RE for EN55015 80 70 60 Level in dB米5040 30 20 10 0 30MV/EN 55015 Electric Field Strength 3 m QP5060708090 100M200300MFrequency in HzFrequency (MHz) 37.001250 41.390000QuasiPeak (dB¦ÌV/m) 30.5 33.9Height (cm) 100.0V 100.0VPolarizationCorr. (dB) -9.3 -12.9Margin (dB) 9.5 6.1Limit (dB¦ÌV/m) 40.0 40.0Fig-12. Radiation EMI Test, 230Vac, 50Hz (without Bead at the drain)OZ8022VM3 EMC Test (Conduction)Fig-13. Conducted EMI test at line, 220Vac and EN55015 LimitsFig-14. Conducted EMI Test at Neutral, 220Vac and EN55015 LimitsBack to SummaryOZ8022V2013-12-15 Page 16OZ8022V-Buck (High PF controller)L2 2.2mH DB1 MB6S R1AC InputCX2 0.01uF 4 -1+3C1 0.1uFFQU3N60C200KQ1 10R R12 2 L3 2.2mHR2 200KL13=0.43mH/N12:N23=82T:36T/EE10/PC401 3 28 × 250mA LEDsT1 R11 51KES2J D1R8 1R02C2R6 0470u/63V 1U1 4 3 1 C4 22nR9 CS COMP ZCD VDD DRV GND 6 5 2 C5 10u/50V4R7 D2 ES1JMini-Boundary-VR10 75KAdobe Acrobat Document2013-12-15 Page 17+OZ8022V-Buck (Efficiency & PF)-75V/185mA2013-12-15 Page 18OZ8022V-Buck Boost (High PF controller)AC InputDB1 MB6S R1 CX2 0.01uF + C1 0.15uF R2 180K D4 1n4148 0.95ohm C6 100n 10R R12 R18 1 2 3 1 180K 2 FQU3N60C Q1 R17 2R R16 2R L1 LED+ R15 100K C3 200u/100V L2 1.2mH 160V/250mA Lighting 1D3 ER2J LED-R13 100KL13=0.53mH/N12:N13=21.5:66/EC20/PC40R3 180K R9 4R7 D2 ES1J C5OZ8022V_A2R14 1Kohm 2N7002 Q2 C4 100n C7 1nF R19 1Mohm 1 U1 4 3 CS COMP ZCD VDD DRV GND 6 5 210u/50VR1062KAdobe Acrobat Document2013-12-15 Page 19OZ8022V-Buck-Boost (Efficiency & PF)-75V/185mABack to Summary2013-12-15 Page 20OZ8022T Hi PF + Toggle dimming100%-40%-12.5%2013-12-15 Page 21OZ8022T Features - 3-level analog dimming control using a nondimming wall on/off switch - Built-in high-voltage start-up circuit - Quasi-resonant converter controller for high brightness LEDs - Supports high power factor and low THD - Under-voltage lockout with hysteresis - Minimum off-time control at light-load operation maximizing efficiency - Provides complete protection functions - Maximum gate drive output clamp - Over-voltage protection for IC bias voltage - Cycle-by-cycle current limit - LED short circuit protection - Output over-voltage protection - Internal over-temperature protection2013-12-15 Page 22OZ8022T Schematics2013-12-15 Page 23Efficiency :7W LED (39V/180mA Lighting)2013-12-15 Page 24Power factor and THD :7W LEDBack to Summary2013-12-15 Page 25OZ8022A100%-60%-20%2013-12-15 Page 26Home2013-12-15 Page 27Office2013-12-15 Page 28Adobe Acrobat DocumentAdobe Acrobat Document2013-12-15 Page 29Back to Summary2013-12-15 Page 30ON/OFF wall switch Continuous dimming by ON/OFF wall switch High reliability, Low costOZ8024SHi PF + Continuous analog dimming controlled by AC wall switch(5%~100%)-Continuous analog dimming controlled by AC wall switch-Built-in high-voltage start-up circuit-High power-factor quasi-resonant converter controller for high brightness LEDs-Under-voltage lockout with hysteresis-Minimum off-time control at light-load operation maximizing efficiency -Provides complete protection functions-Maximum gate drive output clamp-Over-voltage protection for IC bias voltage-Cycle-by-cycle current limit-LED short circuit protection-Output over-voltage protection-Internal over-temperature protectionD4RSFJLD5RSFJLF10.5A/250VR2560KR51R2, 1%R3560KC247nF/400VR15.1KL23.3mH R1039K, 1%C31nFR643KU1OZ8024S-A2GND 3ZCD4DRV 6CS 7HV 8COMP 2CLK 1VDD5CX122nF/630VD2RSFJLR74R7R943K, 1%R839RD3MURS260C4330nF-+D1MB6SQ1STD3NK60L13.3mHR42R7, 1%R1130K+C6330u/35VAC InputT1321L13=0.46mH / N21:N13=105T:15T / EE13, PC40R125.1K24V/300mA LEDs+C522u/50V85Vac 110Vac 135Vac 175Vac 220Vac 265Vac Dimming=100%Pin, [W]8.767 8.520 8.460 8.490 8.557 8.635 V LED , [V]25.02 25.02 25.02 25.03 25.04 25.04 I LED , [mA]291.4 291.5 292.1 293.6 294.9 296.0 EFF LED , [%]83.16%85.60%86.39%86.56%86.30%85.83%Dimming=5%Pin, [W]0.411 0.424 0.437 0.461 0.494 0.541 V LED , [V]20.73 20.77 20.79 20.82 20.84 20.87 I LED , [mA]15.55 15.71 15.81 15.97 16.24 16.85 EFF LED , [%]78.43%76.96%75.22%72.12%68.51%65.00%60%65%70%75%80%85%90%85115145175205235265E f f i c i e n c y , [%]Input AC Voltage, [Vac]Efficiency Curve100%5%Vin, [Vac]Line Frequency, [Hz]Power Factor THD Dimming=100%Dimming=100%85470.989 12.490%110600.986 15.126%135600.983 16.727%175500.976 17.213%220500.965 16.461%265630.94815.448%0.940.95 0.96 0.97 0.98 0.99 1.00 85115145175205235265P o w e r F a c t o rInput AC Voltage, [Vac]Power Factor Curve (Dimming=100%)Dimming=100%85Vac110Vac220Vac265VacDelay time,[ms]240200200200I LED_peak, [mA]424398404394Fig-11: Start-up, 110Vac, 60Hz, 100% dimming, Ch1-VAC , Ch4-I LED Fig-12: Start-up, 220Vac, 50Hz, 100% dimming, Ch1-VAC,Ch4-ILEDChange Vin from 85Vac to 265Vac based on variable LED load, measure the turn-on delay time and the output peak current.Note: 1. Delay time: The interval from system turned-on to when the LED string is lightened. Back to SummaryOZ2082Hi PF + Night-Light 100%-1.0mA-2-level analog dimming control using on/off wall switch-Power-saving night-light when operated at the second dimming level.-Built-in high-voltage start-up circuit-Supports high power factor for LED lighting applications.-Under-voltage lockout with hysteresis-Provides complete protection functions-Maximum gate drive output clamp-Over-voltage protection for IC bias voltage-Cycle-by-cycle current limit-LED short circuit protection-Output over-voltage protection-Internal over-temperature protection270uH/EE13/N=84T/Wire diameter=0.33mm+C1180uF/50V +C3180uF/50VR111KC41uF/10VD5MUR460CX147nF/275Vac AC1AC2R910KR41R2, 1%-+D1HD06U1OWLCS 6GND 3CLK 1HV 8COMP 2VDD4DRV5NC 7R1056K0805D2USM16SGPD312VzL2LED SPEC: 31V±2V; 280mA±20mAR125.1K+C533uF/50VC90.1uF/450VR132R7, 1%R810RR1620KR2620KLED+RL75.1KLED-AC InputLEDsR74R7Q1FTA04N60DF1SPT300TE1A00T00R351KD739VC62.2nF/25V L12mH L72.2mHOZ8028-Buck-31V 280mA test reportEfficiency :8.68W LED (31V/280mA Lighting)Pin, [W] VLED, [V] ILED, [mA] EFFLED, [%] Pin, [mW] VLED, [V] ILED, [mA] EFFLED, [%] 85Vac 11.125 33.09 292 87.00% 0.090 24.77 0.516 14.28% 110Vac 10.908 32.86 292 87.98% 0.128 24.84 0.541 10.50% 135Vac 10.827 32.77 292 88.35% 0.165 24.90 0.567 8.56% 175Vac 10.798 32.68 292 88.24% 0.224 24.95 0.606 6.75% 220Vac 10.786 32.61 291 88.01% 0.301 25.01 0.655 5.44% 265Vac 10.769 32.55 290 87.77% 0.396 25.07 0.712 4.51%ADJ=250mVIcs=1mA2013-12-15 Page 41Power factor and THD :8.68W LEDVin, [Vac] 85 90 100 110 115 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 265Line Frequency, [Hz] 47 60 60 60 60 60 60 60 60 60 60 50 50 50 50 50 50 50 50 50 63Power Factor ADJ=250mV 0.981 0.983 0.985 0.987 0.987 0.987 0.987 0.986 0.984 0.982 0.979 0.978 0.975 0.971 0.967 0.963 0.957 0.952 0.946 0.939 0.921THD ADJ=250mV 18.116%13.978%12.113%10.533%11.295% 11.581%12.756% 13.241%2013-12-15 Page 42OZ2082 Schematics: Buck-BoostAdobe Acrobat Document2013-12-15 Page 43Efficiency :8.4W LED (28V/300mA Lighting)2013-12-15 Page 44Power factor and THD :8.4W LEDBack to Summary2013-12-15 Page 45OZ2082C Hi PF + Color2013-12-15 Page 46Product Product Introduction IntroductionTyp. operation circuit (2 LEDs with 1-level dimming)VDD pin:# VDDOVP and VDDCLAMP for LEDs OLP (Clamped) # VDDOFF for LEDs SCP. (Hiccup)CLK pin:# Sensing AC input voltage # SW1/2 color controlCOMP pin:# Output of OTA # PWM controlFB pin:# IOUT feedback # LEDs OCPCS pin:# Cycle by cycle limit. # 2nd-OCP (FSW foldback)Page 47Product Product Introduction IntroductionFeaturesTwo-Channel LED lighting controller Using ON/OFF wall switch to select one of the two channels High PF with DCM Fixed Frequency operation Low Start-Up and Operating current Protections― ― ― ― ― Bias winding OVP (VDD pin) Cycle-by-cycle current limit (CS pin) 2nd-OCP (CS pin) Output OCP (FB pin) Internal OTP (140/110℃)Page 48Product Product Introduction Introduction2 LEDs with 1-level dimming (Flyback)2 LED stringsCool White & Warm White100% 100%I_LED1 I_LED230V/150mA 85-265VACPage 492 LEDs with 2-level dimming (Flyback)2 LED strings100% Brightness & adjustable brightness100%XX %# ILED_1 setting: R1//R2 # ILED_2 setting: R22013-12-15 Page 50。
OLED基础知识简介
OLED应用:
OLED显示器运用范围是广泛,在显示器或是照明设 备都非常有市场潜力。
悠景产品示意图:
Panel
Polarizer
TCP/COF Tape
IC Driver
Module
Glass
Cover
Product Roadmap(Mono & Area):
Subdisplay
Remote control/ Radar detector/ Car Audio
OLED构造--Organic layer:
OLED驱动方式
Column Driver
OLED panel
Data
Line
Vdd
Select
Cathode Lines
T2 T1
OLED
Row Driver
Anode Lines
(a) Passive matrix mode
(b) Active matrix mode
OLED简介—目录
• OLED是什么 • OLED构造 • OLED驱动方式 • OLED发光原理 • OLED制程简介 • OLED特点 • OLED应用 • Univision product roadmap
Allen Hu
OLED是什么?
OLED----有机发光二极体 Organic Light Emitting Diode
R
G
B
Light source: B-OLED Color Change Media
OLED-RGB Parallel:
OLED-ITO制程:
空白玻璃
鍍第一層膜
上光阻(coating)
酸A或 氣體A
WISOL Product Roadmap_Mar.Y2014
CONFIDENTIAL
Module – GPS LNA Module
What is GLM?
Pre SAW filter + LNA (size 1.5x1.1x0.6) Pre SAW filter + LNA + Post SAW filter (size 1.8x1.4x0.6) GPS includes GPS/Glonass or GPS/Glonass/Beidou or GPS Only
●
Sales/Marketing Group
CONFIDENTIAL
SAW Product for Qualcomm WTR1625/WTR2605
ES by 4月 FDD Duplexer (Unbalanced) Diversity Rx (Unbalanced) Size 2016 1814 1411 1109 1411 Tx 1109 B1 ● ● ● ● ● B2 ○ ● ● ● B3 ● ● B4 ● ● ● B5 ● ● ● ● ● ● B7 ● B8 ● ● ● ● ● B13 ● ● ● B17 ● ● ● ● ES by 4月 B20 ● ● ● ● B28 ○ ○ ○ ○ -
SFHG32AA002 SFH881AQ102 SFH881YQ101
SFHG35AA002 SFH942AQ102 SFH942YQ102
SFHG32YA002 SFH881YA002
SFHG56JA002 SFH942YA002 SFH751YA002 SFH737YA002 SFH806YA002
R7T0 B1/2/3/5/7/8/17 R7A0 B1/2/3/5/7/8/20
Diversity FEM
镁光最新eMMC路线图
Key Features
Technology
NAND 25nm/20n standard v4.41, v.5.0
Operating Voltage
4GB/8GB up to: 1000 IOPS write 4000 IOPS read
v.5.0 Sequential Performance
4GB up to: 14MB/s write; 160MB/s read 8GB up to: 22MB/s write; 230MB/s read 16GB up to: 30MB/s write; 250MB/s read 32GB/64GB/128GB up to: 90MB/s write; 270MB/s read
Packages (25nm NAND)
2GB/: WFBGA153 (11.5x13x0.8mm)
Packages (20nm NAND)
4GB-32GB: VFBGA153 (11.5x13x1.0mm) 64GB: LFBGA153 (11.5x13x1.4mm)
Solutions (Boot area/partitioning)
Random Performance
4GB up to: 3500 IOPS write; 6000 IOPS read 8GB up to: 5000 IOPS write; 6500 IOPS read 16GB up to: 5200 IOPS write; 4000 IOPS read 32GB/64GB up to: 5800 IOPS write; 4700 IOPS read
Vcc = 2.7V - 3.6V Vccq = 1.65V-1.95V ; 2.7V-3.6V
AUO Product Roadmap_20120208_Full version
Product Roadmap for SmartphonesMobile Device Business Unit Feb, 2012© 2009 AU Optronics Corporation – Proprietary and Confidential© 2009 AU Optronics Corporation – Proprietary and ConfidentialOpen Market RoadmapMass Market Main Stream High-End3.0” H300QN 3.0” H300QN 3.2” H320QN 3.2” H320QN320x480 320x4804.02” H402VVN 4.02” H402VVN480x854 480x854 NTSC 70% NTSC 70%ES:Q2.12’ ES:Q2.12’ MP:Q2.12’ MP:Q2.12’4.29” H429AN 4.29” H429AN540x960 540x960 11’ High PPI 257 ES:Q4. 11’ High PPI 257MP:Q1.12’ MP:Q1.12’4.46” H446TAN 4.46” H446TAN1280x720 1280x720 High PPI 330 ES:Q4.11’ High PPI 330 ES:Q4.11’MP:Q2.12’ MP:Q2.12’3.17” H317QN 3.17” H317QN320x480 320x4805.0” H500VVN 5.0” H500VVN480x800 480x800 NTSC 70% NTSC 70%ES:Q1.12’ ES:Q1.12’ MP:Q2.12’ MP:Q2.12’4.46” H446AAN 4.46” H446AAN540x960 540x960 High PPI 247 High PPI 247ES:Q2.12’ ES:Q2.12’ MP:Q3.12’ MP:Q3.12’2.6” H260VVN 2.6” H260VVN (Landscape) (Landscape)480x320 480x3204.3” H430VW 4.3” H430VW480X800 480X800 NTSC 85% NTSC 85%5.3” H530AVN 5.3” H530AVN540x960 540x960 NTSC 70% NTSC 70%ES:Q2.12’ ES:Q2.12’ MP:Q3.12’ MP:Q3.12’4.3” H430VVN 4.3” H430VVN480X800 480X800 NTSC 70% NTSC 70%480X800 480X800 Slim Border 1.3mm Slim Border 1.3mm Current MP model 480X800 480X800 Slim Border 1.3mm Slim Border 1.3mm24.08” H408VW 4.08” H408VW3.8” H380VW 3.8” H380VWDeveloping model Planning model© 2009 AU Optronics Corporation – Proprietary and ConfidentialqHD (540x960) for High-end MarketKey Specification Table (qHD) Key Specification Table (qHD)H429AAN01 Model Name PPI Display Mode NTSC Contrast Ratio 257 AMVA2 70(Typ) 800(Typ) MDDI MIPI RGB 0.2t 1.7mm NT35516 Novatek 247 AHVA 70(Typ) 900(Typ) MDDI MIPI RGB 0.2 1.5mm OTM9608A Orise 208 AMVA 70(Typ) 800(Typ) MDDI MIPI RGB 0.2 1.5mm NT35516 Novatek3Key Specification Table (HD720) Key Specification Table (HD720)Model Name PPI Display Mode NTSC Contrast Ratio H446TL01 330 AHVA 70(Typ) 800(Typ)H446AAN01H530AVN01InterfaceInterfaceMDDI MIPICell Thickness Cell BorderCell Thickness Cell Border0.2t 1.6mm OTM1281A OriseCompatible ICCompatible IC© 2009 AU Optronics Corporation – Proprietary and ConfidentialWVGA (480x800) for Main-stream MarketKey Specification Table (WVGA) Key Specification Table (WVGA)Model Name H380VVN0 1 246 AMVA 70(Typ) 600(Typ) MDDI MIPI RGB 0.25t 1.3mm NT35510(N ovatek) RM68120( Raydium) H408VW01 H430VW01 H430VVN01 H430VVN01 H500VVN01PPI Display Mode NTSC Contrast Ratio Interface Cell Thickness Cell Border229 AMVA 70(Typ) 600(Typ) MDDI MIPI RGB 0.25t 1.3mm NT35510(N ovatek) RM68120(R aydium)217 AMVA 85(Typ) 800(Typ) MDDI MIPI RGB 0.3t 2.0mm NT35510(N ovatek) RM68120(R aydium)4217 AMVA 70(Typ) 800(Typ) MDDI MIPI RGB 0.3t 1.7mm NT35510(N ovatek) RM68120(R aydium)217 AMVA 70(Typ) 800(Typ) MDDI MIPI RGB 0.3t 1.7mm NT35510(N ovatek) RM68120(R aydium)186 AMVA 70(Typ) 800 (Typ) MDDI MIPI RGB 0.3t 2.0mm RM68120(R aydium)Compatible IC© 2009 AU Optronics Corporation – Proprietary and ConfidentialDisplay Size / Resolution Migration for SmartphonesFWVGA FWVGAModel Name PPI Display Mode NTSC Contrast Ratio Interface Cell Thickness Cell Border Compatible ICH402VAN01Key Specification Table (HVGA) Key Specification Table (HVGA)Model Name H300QN01 H317QN01 H320QN01 H260VVN01 (Landscape) 222 AMVA 70(Typ) 800(Typ)246PPI 192 AMVA 50(Typ) 500(Typ) 182 AMVA 60(Typ) 300(Typ) 180 AMVA 70(Typ) 500(Typ)AMVA 70(Typ)Display Mode NTSC800(Typ) MDDI MIPI RGB 0.25t 1.5mm NT35510 OTM8009AContrast RatioInterfaceMDDI / MIPI RGB CPUMDDI / MIPI RGB CPUMDDI / MIPI RGB CPUMDDI RGB CPUCell Thickness Compatible IC0.25t0.3t0.2t0.2t R61531 RSP---© 2009 AU Optronics Corporation – Proprietary and Confidential54.08” & 3.97” WVGA Performance Comparison4.08” WVGA 3.97” WVGA51.84x86.4Remark 螢幕較大貼近市場趨勢4” 以上 以上Smartphone手握寬幅約在 手握寬幅約在 64~65mm左右,AUO Slim Border可 左右, 可 左右 縮小差異僅到左右0.22mm,藉由機構 縮小差異僅到左右 , Cover微小差異。
AzureWave Serial WiFi Module Product Roadmap
802.11ac 1x1 BT4.2 802.11ac Wave 2 1x1 BT5.0
802.11ac 1x1 BT4.2 802.11b/g/n 1x1 BT4.0 802.11b/g/n 1x1 BT4.2
802.11b/g/n 1x1 802.11a/b/g/n 1x1 BT5.0 802.11a/b/g/n 1x1 BT5.0
规格标准 802.11ac 3x3 BT4.0 802.11ac 3x3 BT4.0 802.11ax 3x3 BT5.1 802.11ax 2x2 BT6.0 802.11a/b/g/n/ac 2x2 BT4.2 802.11ac Wave 2 2x2 BT4.1 802.11ac Wave 2 2x2 BT4.2 802.11ac Wave 2 2x2 MU-MIMO BT5.0 802.11ac Wave 2 2x2 BT4.2 802.11a/b/g/n/ac 1x1 BT4.0 802.11ac Wave 2 1x1 BT4.1 802.11ac Wave 2 1x1 BT4.2 802.11b/g/n 1x1 SOLO 802.11b/g/n 1x1 BT4.0 802.11b/g/n 1x1 BT4.0 802.11b/g/n 1x1 BT4.2 802.11a/b/g/n/ac 2x2 BT4.2 802.11ac Wave 2 2x2 BT4.2 802.11ac Wave 2 2x2 BT4.2 802.11ax Dual MAC 2x2 BT5.0 802.11ax Wave 2 2x2 BT5.X 802.11a/b/g/n/ac 2x2 BT4.1 802.11a/b/g/n/ac 2x2 BT4.1 802.11a/b/g/n/ac 2x2 BT4.1 802.11ac Wave 2 1x1 BT4.1 802.11ac Wave 2 1x1 BT4.0 802.11a/b/g/n 2x2 BT4.0 802.11ac Wave 2 1x1 BT4.2 802.11b/g/n 1x1 BT4.2 802.11b/g/n 1x1 BT4.0
New Product Roadmap
楼层交换机Cajun P330 楼层交换机
• • • • • Cajun P330交换系统以堆叠式系统的价格提供了机 交换系统以堆叠式系统的价格提供了机 箱级的功能 即插即用, 即插即用,所有端口的自适应 可以把堆栈作为一个实体进行管理 具有多级冗余特性,没有单一故障点 具有多级冗余特性 没有单一故障点 在同一个堆栈中的多技术解决方案 – 10/100/1000 – ATM接入 接入 多层 – 第二层、第三层 第二层、 – 访问安全性 QoS保证 保证 P332MF-12 MT-RJ FX X330G2 X330GT2 X330-OC12F1/S1
6
千兆以太城域网可行性分析
• • • • 协议收敛为IP(WAN/LAN) 协议收敛为 园区网络采用千兆以太网络。 园区网络采用千兆以太网络。 城际主干采用SDH/SONET/DWDM 城际主干采用 城域网络的主要竞争技术 – 千兆以太、POS 千兆以太、 – 10G以太标准的推出将改变通讯的形式 以太标准的推出将改变通讯的形式 – 10G以太将使用 以太将使用DWDM,全交换,跨越 全交换, 以太将使用 全交换 LAN/MAN/WAN – IP/Ethernet/DWDM vs IP/PPP/SDH/DWDM
经中央路由器实现WG路 路 经中央路由器实现 •*非本地通信 •*需要进一步分类的通信 •*不必使用主干连接和主 干交换机资源 经EZ2route实现 实现 WG路由 路由 •*本地IP路由 •卸载主干链路
P550R
子网A 子网 Giga
P333R
工作站 10/100 子网B 子网 工作站
WAN
Cajun P330R可以作为主网络路由器,提供“本地”路由功能
13
骨干路由交换机Cajun P550 骨干路由交换机
六西格玛 Roadmap
QFD FMEA
TRIZ pugh
Robust Design Parameter Tolerence
Score Card
制造业6 Sigma DFSS项目指针范例
专案名称 1 Design for Marketing
2 Design for Manufacturing 3 Design for Testing 4 Design for Relibility 5 Design for Cost
定义 专案指标
绘制部门别 宏观流程图
绘制任务别 宏观流程图
订定 项目目标
流程合理化 (同步工程)
定义项目团队 /关系人
财务效益分析
分析 量测系统
确定 流程能力
分析价值
定义流程 节拍时间
建立 后拉式流程
分析现况 价值流
设计 未来价值流
导入 控制计划
分析 八大浪费
QFD
设计 细部流程 (要径分析)
建立日常 改善机制
确认产品及流 程
定义机会
审查财务评估
产生概念设计
审查风险及财 务
执行控制计划
辨认企业风险
审查财务风险
评估概念设计
稳建设计
商品化
选择团队/关系 人
界定项目目标
界定法规需求
界定产品 CTQs
定义输入&流 程CTQs
发展细部设计 CTQs
公差最佳化 完成流程设计
制程能力分析 专案完结
Six Sigma (DFSS)
Innovation Design 创新设计
Differentiate Products from Competition
目前R&D可能面临的相关问题 研发的流程,使用定性之方法(Issue & Bug Review),
PRD标准需求说明书
PRD标准需求说明书修订控制页目录1概述 (4)1.1 名词说明 (4)1.2 产品概述及目标 (4)1.3 产品roadmap (4)1.4 产品风险 (4)2使用者需求 (5)2.1 需求描述 (5)3可选方案 (5)4效益成本分析 (6)4.1 效益预测 (6)4.2 产品技术中心成本 (8)4.3 非产品技术中心的支持成本 (9)5功能需求 (9)5.1 功能总览 (9)5.2 功能详情 (11)5.3 整合需求 (13)5.4 BETA测试需求 (13)6非功能需求 (13)产品营销需求 (14)规则变更需求.............................. 错误!未定义书签。
产品服务需求 (14)法务需求 (15)财务需求 (15)帮助需求 (15)安全性需求................................ 错误!未定义书签。
7上、下线需求 . (15)7.1 上线时限需求 (15)7.2 下线需求(活动类需求必须明确下线时间) (15)8运营计划 (15)请与以下部门讨论PRD序号OK?部门沟通内容1.□业务/市场部门:⏹协助设定产品的RaodMap⏹协助设定target customer:使用者⏹协助评估:营销/推广需求⏹协助设定商业目标2.□运营中心:网站⏹协助设定产品的RaodMap⏹协助设定target customer:使用者运营⏹协助评估:营销/推广需求⏹协助设定运营指标3.□产品技术中心:系统分析师虚拟团队⏹讨论以确定方案的规模评估、推出计划⏹进行技术可行性分析,提出关键问题的技术解决方案⏹评估系统规模,数据量,所需资源等⏹协助评估风险4.□产品技术中心:项目经理⏹协助确定产品发布日期⏹协助确定产品成本⏹协助评估风险5.□产品技术中心:用户体验设计之交互设计师⏹协助制作原型Demo⏹协助确定 use flow:用户使用方式6.□财务分析中心:财务组⏹请评估财务需求⏹协助评估风险7.□财务分析部:数据分析组⏹协助确定如何度量产品目标1概述1.1名词说明1.2产品概述及目标1.3产品roadmap请描述产品发展的各个阶段,可以用图表等多种方式表述。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
Product Roadmap
Company Name <Enter company name.>
Product Name <Enter product name.>
Date <Enter date.>
Contact <Enter your name.>
Department <Enter department name.>
Location <Enter location.>
Email: <Enter email address.>
Telephone <Enter telephone number.>
Document Revision History
Date Revision Revised by Approved By
Table of Contents
1. Introduction (4)
1.1. Document Objective (4)
2. Market/Technology Overview (4)
2.1. Section Objective (4)
2.2. Market Overview (4)
2.3. Technology Overview (4)
3. Product Roadmap (4)
3.1. Section Objective (4)
3.2. Product Roadmap (5)
4. Supporting Data (5)
4.1. Section Objective (5)
4.2. Assumptions (5)
4.3. Research Information (6)
4.4. Product Diagram/Architecture (6)
1. Introduction
1.1. Document Objective
This document describes a product roadmap for the <Enter name of product or product line>. A product roadmap is a plan or vision that describes the company’s long-term strategy for the product’s evolution during the course of time.
2. Market/Technology Overview
2.1. Section Objective
This section describes the market to which the product is targeted towards and the technological landscape that affects the product.
2.2. Market Overview
<Define and describe the target markets and customer profile to which the product is targeted. List key characteristics of the target market and the customer. Note market trends and size as well as the economic, political and competitive landscape.>
2.3. Technology Overview
<Define and describe technologies that affect the product, such as foundational,competitive and emerging technologies. Note trends, standards, and dominance.Address technologies in the product and those used to manufacture the product.>
3. Product Roadmap
3.1. Section Objective
This section describes the product roadmap for <Enter name of product or product line>.
3.2. Product Roadmap
Roadmap <Enter Year> <Enter
Year+1>
<Enter
Year+2>
<Enter
Year+3>
Product Locus
(Line, Family,
Group, Unit).
Product
Name/Code
Name
Target Market
Market
Strategy
Product
Strategy
Unique Selling
Proposition
Value
Proposition
Enhancements
and Added
Features
Technologies
Used in
Product
MSRP †
†Manufacturer's suggested retail price
4. Supporting Data
4.1. Section Objective
This section provides data in support of claims, assertions, assumptions, and statements made throughout this document.
4.2. Assumptions
<Describe any assumptions made when writing this document.>
4.3. Research Information
<If relevant, describe and list the type and scope of research conducted in the course of writing this document.>
4.4. Product Diagram/Architecture
<If relevant, describe the product’s architecture and modules accompanied by a schematic diagram.>。