Measurements of $alpha_s$ from event shapes and the four-jet rate
cofecha输出文件翻译
cofecha输出⽂件翻译[] Dendrochronology Program Library Run 9 Program COF 11:05 Wed 13 Jul 2011 Page 1 [] P R O G R A M C O F E C H A Version 6.06P 27954------------------------------------------------------------------------------------------------------------------------------------ QUALITY CONTROL AND DATING CHECK OF TREE-RING MEASUREMENTS树⽊年轮测量的质量控制和定年检查File of DATED series: 9.RWLCONTENTS:Part 1: Title page, options selected, summary, absent rings by series第1部分:标题页,已选项,总结,缺轮Part 2: Histogram of time spans第2部分:时间跨度直⽅图Part 3: Master series with sample depth and absent rings by year第3部分:主序列每年的样本和缺轮数量Part 4: Bar plot of Master Dating Series第4部分:主序列柱状图Part 5: Correlation by segment of each series with Master第5部分:每序列各段与主序列的相关性研究Part 6: Potential problems: low correlation, divergent year-to-year changes, absent rings, outliers 第6部分:潜在的问题:关联度低,年间发散变化,缺轮,异常值Part 7: Descriptive statistics第7部分:描述性统计Time span of Master dating series is 1815 to 2009 195 yearsContinuous time span is 1815 to 2009 195 yearsPortion with two or more series is 1816 to 2009 194 years*****************************************C* Number of dated series4 *C* 定年的样芯数量*O* Master series 1815 2009 195 yrs *O* 主序列*F* Total rings in all series 768 *F* 所有轮数*E* Total dated rings checked 767 *E* 被定年的轮数*C* Series intercorrelation .299 *C* 序列相关系数*H* Average mean sensitivity .195 *H* 平均敏感度*A* Segments, possible problems 26 *A* 可能有问题的部分数*** Mean length of series 192.0 *** 序列平均长度****************************************ABSENT RINGS listed by SERIES: (See Master Dating Series for absent rings listed by year) No ring measurements of zero value------------------------------------------------------------------------------------------------------------------------------------PART 6: POTENTIAL PROBLEMS: 第6部分:潜在的问题:关联度低,年间发散变化,缺轮,异常值08:08 Thu 14 Jul 2011 Page 5------------------------------------------------------------------------------------------------------------------------------------For each series with potential problems the following diagnostics may appear:检测出来的每个序列可能存在的潜在问题。
GSMR接口需求规范
ERTMS/ETCS – Class 1GSM-R InterfacesClass 1 RequirementsREF : SUBSET-093ISSUE : 2.3.0DATE : 10-Oct-2005Company Technical Approval Management approval ALCATELALSTOMANSALDO SIGNALBOMBARDIERINVENSYS RAILSIEMENS1. M ODIFICATION H ISTORYIssue NumberDateSection Number Modification / Description Author0.1.0 (8-Aug-02) Creation based on subset052LK0.1.1 (8-Aug-02) All Minor editorial changes LK0.1.1ec All englishcheck JH0.2.0 (9-Sep-02) 3., 4.2, 4.1, 6.3, 7.2,8.2 Updated after email discussionLK0.3.0 (24-Oct-02) All Updated after FlorencemeetingLK+TS0.4.0 (14-Nov-02) All Updated after LondonmeetingLK0.5.0 (5-Dec-02) 4.2, 5.6.1, 6.2, 7.1,7.3, 9.2 Updated after Berlin meetingLK0.6.0 (12-Dec-02) 3., 6.3., 10.4.3 Email comments included TS+LK2.0.0 (12-Dec-02) Erroneous versionnumber 2.2.0correctedFinal issue LK2.1.0 (28-March-03)3.1.1.1, 6.3.1.3,7.1.1.1, 8.1.1.1 Update acc. to super group commentsLK2.2.0 (28-March-03) - Final version LK2.2.2.31-03-03 Versionnumberchangedfor release to the usersGroupWLH2.2.3 (12-June-03) All Update after Brussels mtg.and GSM-R Op. grp.commentsLK2.2.4 (26-June-03) editorial Draft release to UsersGroupJH2.2.5 - FormalreleaseJH 2.2.5.1 4.2, 6.2, 6.3, new 6.4 Update after Paris mtg. andGSM-R Op. grp. commentsLK2.2.5.2 Various update after further GSM-ROp grp reviewJH2.2.5.3 cleanversion JH 2.2.5.4 6.4 Updated after further GSM-R Op grp requestRB2.2.6 CleanversionRB2.2.6 revA (31-Jan-05) 4.2, 6.3, 6.4, Annex A Proposal for QoS parametervaluesLK2.2.6 revB (14-Feb-05) 6.3, 6.4, Annex A Updated after QoSmeeting#6 BrusselsLK2.2.6 revC (24-Feb-05) 6.3, 6.4, Annex A,Annex B added Updated during BerlinmeetingLK2.2.6 revD (25-Feb-05) 6.2, 6.3.5, 10.3, 10.5.2 Email comments inserted LK2.2.6 revE (6-Apr-05)3.1., 3.2,4.1,5.1,6.3,10.1, 10.3, 10.5, 10.7 Updated after QoSmeeting#7 BrusselsLK2.2.6 revF (25-Apr-05)3.1,4.1,5.1,6.3, 6.4,10.1, 10.3, 10.5, 10.6,10.7Edinburgh meeting TS+LK2.2.6revG (20-May-05)3.1, 5.1, 6.3, 6.4, 8.2 Changes according toBrussels meetingLK2.2.6revH (1-Sep-05) 4.1, 5.1, 6.3, 6.4, 7.2,10.3, 10.4, 10.5 Comments from SG andEEIGLK2.2.6revI (8-Sep-05) 5.1, 6.3, 6.4, 10.4 Zürich meeting PL+LK 2.3.0 (10-Oct-05) update for issue JH2. T ABLE OF C ONTENTS1.M ODIFICATION H ISTORY (2)2.T ABLE OF C ONTENTS (4)3.R EFERENCES (6)3.1Normative Documents (6)3.2Informative Documents (7)4.T ERMS AND DEFINITIONS (8)4.1Abbreviations (8)4.2Definitions (9)5.G ENERAL (10)5.1Scope of this document (10)5.2Introduction (10)6.E ND-TO-END SERVICE REQUIREMENTS TO GSM-R NETWORKS (12)6.1Data bearer service requirements (12)6.2Additional services (12)6.3Quality of Service requirements (13)6.3.1General (13)6.3.2Connection establishment delay (14)6.3.3Connection establishment error ratio (14)6.3.4Transfer delay (15)6.3.5Connection loss rate (15)6.3.6Transmission interference (15)6.3.7GSM-R network registration delay (16)6.4Summary of QoS requirements (16)7.R EQUIREMENTS TO FIXED NETWORK INTERFACE (17)7.1Foreword (17)7.2Interface definition (17)7.3Communication signalling procedures (17)8.R EQUIREMENTS TO MOBILE NETWORK INTERFACE (18)8.1Foreword (18)8.2Interface definition (18)9.A NNEX A(I NFORMATIVE) TRANSMISSION INTERFERENCE AND RECOVERY (19)9.1General (19)9.2Transmission interference in relation to HDLC (19)10.A NNEX B(INFORMATIVE)J USTIFICATION OF Q O S PARAMETER VALUES (22)10.1General (22)10.2Connection establishment delay (22)10.3Connection establishment error ratio (22)10.4Transfer delay (23)10.5Connection loss rate (23)10.5.1QoS targets (23)10.5.2Conclusions (24)10.6Transmission interference (24)10.7Network registration delay (26)3. R EFERENCESDocuments3.1 Normative3.1.1.1 This document list incorporates by dated or undated references, provisions from otherpublications. These normative references are cited at the appropriate place in the textand the publications are listed hereafter. For dated references, subsequentamendments to or revisions of any of these publications apply to this document onlywhen incorporated in it by amendment or revision. For undated references the latestedition of the publication referred to apply.Reference DateTitleU-SRS 02.02 ERTMS/ETCS Class 1; Subset 026; Unisig SRS, version 2.2.2 Subset 037 07.03 ERTMS/ETCS Class 1; Subset 037; EuroRadio FIS; Class1requirements, version 2.2.5EIRENE FRS 10.03 UIC Project EIRENE; Functional Requirements Specification.Version 6.0, CLA111D003EIRENE SRS 10.03 UIC Project EIRENE; System Requirements Specification.Version 14.0, CLA111D004ETS 300011 1992 ISDN; Primary rate user-network interface; Layer 1 specificationand test principlesETS 300102-1 1990 ISDN; User-network interface layer 3; Specification for basiccall controlETS 300125 1991 ISDN; User-network interface data link layer specificationsGSM04.21 12.00 Rate Adaptation on the MS-BSS Interface, v.8.3.0GSM 07.0711.98 ETSI TS 100916; Digital cellular telecommunications system(Phase 2+); AT command set for GSM Mobile Equipment (ME),GSM TS 07.07 version 6.5.0 Release 1997ITU-T V.24 02.00 List of definitions for interchange circuits between data terminalequipment (DTE) and data circuit-terminating equipment (DCE)ITU-T V.25ter 07/97 Serial asynchronous dialling and controlITU-T V.110 02.00 Support of data terminal equipments (DTEs) with V-series typeinterfaces by an integrated services digital network (ISDN) EuroRadio FFFIS 09.03 UIC ERTMS/GSM-R Unisig; Euroradio Interface Group; RadioTransmission FFFIS for Euroradio; A11T6001; version 12O-2475 09.03 UIC ERTMS/GSM-R Operators Group; ERTMS/GSM-R Qualityof Service Test Specification; O-2475; version 1.0Documents3.2 InformativeTitleReference DateEEIG 04E117 12.04 ETCS/GSM-R Quality of Service - Operational Analysis, v0.q(draft)ERQoS 08.04 GSM-R QoS Impact on EuroRadio and ETCS application,Unisig_ALS_ERQoS, v.0104. T ERMS AND DEFINITIONS4.1 AbbreviationsAT ATtention command setATD AT command DialB channel User channel of ISDNB m channel User channel of GSM PLMN on the air interfaceBRI Basic Rate InterfaceByte 1 start bit + 8 data bits + 1 stop bitDCE Data Circuit EquipmentDCD Data Carrier DetectD channel Control channel of ISDND m channel Control channel of GSM PLMN on the air interfaceDTE Data Terminal EquipmenteMLPP enhanced Multi-Level Precedence and Pre-emptionFIS Functional Interface SpecificationGPRS General Packet Radio Service (a phase 2+ GSM service) GSM-R Global System for Mobile communication/RailwayHDLC High level Data Link ControlISDN Integrated Services Digital NetworkMLPP Multi-Level Precedence and Pre-emption (ISDN service) MOC Mobile Originated CallMS Mobile Station (a GSM entity)Termination/Terminated MT MobileMTC Mobile Terminated CallMTBD Mean Time Between DisturbanceUnitOBU On-BoardPLMN Public Land Mobile NetworkPRI Primary Rate InterfaceQoS Quality of ServicesRBC Radio Block CentreT TI Duration of Transmission Interference periodT REC Duration of Recovery periodUDI Unrestricted Digital4.2 Definitions4.2.1.1 Definitions for the purpose of this specification are inserted in the respective sections.5. G ENERAL5.1 Scope of this document5.1.1.1 The scope of this document is to specify the Radio Communication Systemrequirements to the GSM-R network services (including fixed side access) andinterfaces and also the pre-requisites to be fulfilled by GSM-R networks and ETCSinfrastructures. Presently the requirements for high-speed lines are covered,requirements for conventional lines may be included in future versions of thisdocument.5.1.1.2 The data transmission part of the communication protocols is fully described in theEuroRadio FIS [Subset 037].5.1.1.3 The Radio Transmission FFFIS for EuroRadio [EuroRadio FFFIS] specifies thephysical, electrical and functional details related to the interfaces.5.1.1.4 All requirements apply to GSM-R unless indicated otherwise .5.2 Introduction5.2.1.1 The definition of the GSM services and associated physical and communicationsignalling protocols on the air interface are fully standardised in the specificationsproduced by the ETSI GSM Technical Committee for the public GSM implementationas well as for the GSM-R. Additionally, some railway specific services are alsospecified in the EIRENE SRS. However, in both cases, not all are required for ERTMSclass 1 system definition.5.2.1.2 The following ETSI GSM phases 1/2/2+ services are required:a) Transparent data bearer serviceb) Enhanced multi-level precedence and pre-emption (eMLPP).5.2.1.3 Other ETSI GSM phases 1/2/2+ services are not required for Class 1. These are thefollowing :a) GSM supplementary services:• Call forwardingb) General packet radio service (GPRS)5.2.1.4 Other ETSI GSM phases 1/2/2+ services are not required. Examples of these are thefollowing :a) Non-transparent data bearer serviceb) GSM supplementary services:• Line identification•Call waiting and hold• Multiparty•Closed User Group•Advice of charge• Call Barringc) Short message service point to point or cell broadcastd) Voice broadcast servicee) Voice group call service5.2.1.5 The following EIRENE railway specific service [EIRENE SRS] is required:a) Location dependent addressing5.2.1.6 The following EIRENE specific services [EIRENE SRS] are not required :a) Functional addressingb) Enhanced location dependent addressingc) Calling and connected line presentation of functional identitiesd) Emergency callse) Shunting modef) Multiple driver communications6. E ND-TO-END SERVICE REQUIREMENTS TO GSM-RNETWORKS6.1 Data bearer service requirements6.1.1.1 For the transmission of information between OBU and RBC, the EuroRadio protocoluses the bearer services of a GSM-R network. The service provider makes these databearer services available at defined interfaces.6.1.1.2 The data bearer services are described as data access and transfer in the GSMnetwork from Terminal Equipment (TE) on the mobile side (i.e. OBU) to a networkgateway interworking with Public Switched Telephonic Network (PSTN) or IntegratedServices Digital Network (ISDN) on the fixed side (i.e. RBC).6.1.1.3 The following features and attributes of the required bearer service shall be provided:a) Data transfer in circuit switched modeb) Data transfer allowing multiple rate data streams which are rate-adapted[GSM04.21] and [ITU-T V.110]c) Unrestricted Digital Information (UDI) – only supported through ISDN interworking(no analogue modem in the transmission path)d) Radio channel in full ratee) Transfer of data only (no alternate speech/data)f) Transfer in asynchronous transparent modeg) The required data rates are listed in the following table:Bearer service Requirement24. Asynchronous 2.4 kbps T O25. Asynchronous 4.8 kbps T M26. Asynchronous 9.6 kbps T MT: Transparent; M: Mandatory; O: OptionalTable1 GSM-R bearer servicesservices6.2 Additional6.2.1.1 The following supplementary services shall be provided:a) Enhanced multi-level precedence and pre-emption.b) The selection of a particular mobile network shall be possible on-demand.6.2.1.2 The priority value for command control (safety) shall be assigned to according to[EIRENE FRS §10.2] and [EIRENE SRS §10.2].6.2.1.3 The following railway specific service shall be provided by GSM-R networks:a) Location dependent addressing based on the use of short dialling codes inconjunction with cell dependent routing.6.3 Quality of Service requirements6.3.1 General6.3.1.1 As an end-to-end bearer service is used, a restriction of requirements on the servicequality placed on the air interface is not sufficient.6.3.1.2 End-to-end quality of service has to be considered at the service access points.6.3.1.3 The service access points are:•the service access points to the signalling stack for the establishment or release of a physical connection,•the service access points to the data channel.6.3.1.4 The network shall be able to support transparent train-to-trackside and trackside-to-train data communications at speeds up to 500 km/h e.g. in tunnels, cuttings, onelevated structures, at gradients, on bridges and stations.6.3.1.5 The network shall provide a Quality of Service for ETCS data transfer that is at least asgood as listed below1. The parameters are valid for one end-to-end connection for onetrain running under all operational conditions.6.3.1.6 The required QoS parameters shall not depend on network load.6.3.1.7 These performance figures reflect railway operational targets [EEIG 04E117].6.3.1.8 Note: A justification of the performance figures is given by Annex B.6.3.1.9 QoS requirements are specified independently of the method of measurement (refer to[O-2475] for specification of testing).6.3.1.10 Conventional line quality of service requirements may be included in future versions ofthis document. Also the values may not be applied at all locations and times (e.g.discontinuous radio coverage at some locations).6.3.1.11 Given the performance constraints of GSM-R, pre-conditions may be necessary tomeet the railway operational targets of [EEIG 04E117]. If different operational QoStargets are required, then other pre-conditions on ETCS application may be necessary.1 Early experience suggests that GSM-R performance can be better than these parameters suggest, after network optimisation and tuning.Such a case is not covered by this specification and this aspect of ETCS SystemPerformance becomes the responsibility of whoever specifies different operationaltargets.6.3.2 Connection establishment delay6.3.2.1 Connection establishment delay is defined as:Value of elapsed time between the connection establishment request and theindication of successful connection establishment.6.3.2.2 In case of mobile originated calls, the delay is defined between the request bycommand ATD and indication by the later of the two events response CONNECT ortransition of DCD to ON.6.3.2.3 The connection establishment delay of mobile originated calls shall be <8.5s (95%),≤10s (100%).6.3.2.4 Delays>10s shall be evaluated as connection establishment errors.6.3.2.5 The required connection establishment delay shall not depend on user data rate of theasynchronous bearer service.6.3.2.6 The required connection establishment delay is not valid for location dependentaddressing.6.3.3 Connection establishment error ratio6.3.3.1 The Connection establishment error ratio is defined as:Ratio of the number of unsuccessful connection establishment attempts to the totalnumber of connection establishment attempts.6.3.3.2 “Unsuccessful connection establishment attempt” covers all possible types ofconnection establishment errors caused by end-to-end bearer service.6.3.3.3 Connection establishment delays >10s shall be evaluated as connection establishmenterrors.6.3.3.4 The GSM-R networks should be designed in such a way, that at least two consecutiveconnection establishment attempts will be possible (pre-condition on GSM-Rnetworks), e.g. regarding GSM-R radio coverage related to maximal possible trainspeed.6.3.3.5 If the operational QoS targets of [EEIG 04E117] are wanted, then the ETCSinfrastructure should be designed in such a way, that at least two consecutiveconnection establishment attempts will be possible (Recommended pre-condition forETCS infrastructure).6.3.3.6 The connection establishment error ratio of mobile originated calls shall be <10-2 foreach attempt .6.3.3.7 Note: entry into Level 2 is of particular importance; commonly, a time of 40s may berequired in the case the GSM-R mobile station is already registered with the GSM-Rnetwork (see [ERQoS]).6.3.4 Transfer delay6.3.4.1 The end-to-end transfer delay of a user data block is defined as:Value of elapsed time between the request for transfer of a user data block and theindication of successfully transferred end-to-end user data block6.3.4.2 The delay is defined between the delivery of the first bit of the user data block at theservice access point of transmitting side and the receiving of the last bit of the sameuser data block at the service access point of the receiving side.6.3.4.3 The end-to-end transfer delay of a user data block of 30 bytes shall be ≤0.5s (99%).6.3.5 Connection loss rate6.3.5.1 The Connection loss rate is defined as:Number of connections released unintentionally per accumulated connection time.6.3.5.2 The requirements for connection loss rate varies depending on ETCS system variablessuch as T_NVCONTACT and the possible train reactions after connection loss (seesection 10.5).6.3.5.3 If the operational QoS-targets of [EEIG 04E117] are wanted, then the ETCSinfrastructure should be designed in such a way, that at least the following conditionsare fulfilled (Recommended pre-condition for ETCS infrastructure):• T_NVCONTACT ≥ 41s and• M_NVCONTACT different to train trip and• a new MA reach the OBU before standstill.6.3.5.4 If the connection establishment error ratio is <10-2, then the connection loss rate shallbe <10-2/h.6.3.6 Transmission interference6.3.6.1 A transmission interference period T TI is the period during the data transmission phaseof an existing connection in which, caused by the bearer service, no error-freetransmission of user data units of 30 bytes is possible.6.3.6.2 A transmission interference happens, if the received data units of 30 bytes deviatepartially or completely from the associated transmitted data units.6.3.6.3 The transmission interference period shall be < 0.8s (95%), <1s (99%).6.3.6.4 An error-free period T Rec shall follow every transmission interference period to re-transmit user data units in error (e.g. wrong or lost) and user data units waiting to beserved.6.3.6.5 The error-free period shall be >20s (95%), >7s(99%).6.3.7 GSM-R network registration delay6.3.7.1 The GSM-R network registration delay is defined as:Value of elapsed time from the request for registration to indication of successfulregistration by +CREG response.6.3.7.2 The GSM-R network registration delay shall be ≤30s (95%), ≤35s (99%).6.3.7.3 GSM-R network registration delays > 40 s are evaluated as registration errors.6.4 Summary of QoS requirements6.4.1.1 Table 2 contains the summary of QoS requirements at GSM-R interface.QoS Parameter Value (see 6.3) Connection establishment delay of mobile< 8.5s (95%), ≤10s (100%) originated callsConnection establishment error ratio <10-2≤ 0.5s (99%)Maximum end-to-end transfer delay (of 30 bytedata block)Connection loss rate ≤ 10-2 /hTransmission interference period < 0.8s (95%), <1s (99%)Error-free period >20s (95%), >7s(99%)Network registration delay ≤30s (95%), ≤35s (99%), ≤40s (100%)Table 2 Summary of QoS requirements7. R EQUIREMENTS TO FIXED NETWORK INTERFACE7.1 Foreword7.1.1.1 This part of the specification does not define mandatory requirements forinteroperability. It is a preferred solution, in case interchangeability between tracksideRBC and access point to the fixed network is required for a given implementation.7.1.1.2 This section gives only limited information. [EuroRadio FFFIS] must be used for fullcompliance.7.1.1.3 Note: The requirements to fixed network interface refer to a set of ETSI specifications[ETS 300011, ETS 300125, ETS 300102-1]. This set is the basis of conformancerequirements for network terminations. Instead of these specifications updatedspecifications can be referred, if they state that they are compatible with the followingrequirements.7.2 Interfacedefinition7.2.1.1 The ISDN Primary Rate Interface (PRI) shall be provided as specified by [ETS300011].7.2.1.2 The service access point on the fixed network side corresponds with the S2M interfaceat the T-reference point.7.2.1.3 The Basic Rate interface might also be used as an option in some particular cases likeradio infill unit.7.2.1.4 In addition to these interfaces, the V.110 rate adaptation scheme shall be applied tothe user data channel. The RA2, RA1 and RA0 steps are mandatory.7.2.1.5 End-to-end flow control in layer 1 shall not be used.7.3 Communication signalling procedures7.3.1.1 The signalling protocols shall be provided as specified by:a) Link Access Procedure on the D channel [ETS 300125]b) User-network interface layer 3 using Digital Subscriber Signalling [ETS 300102-1]7.3.1.2 ISDN multi-level precedence and pre-emption (MLPP) supplementary service shall beprovided according to the EIRENE specification [EIRENE SRS].7.3.1.3 The SETUP message contains Information Elements including the bearer capabilityand the low layer compatibility (refer to [EuroRadio FFFIS] specifying the Euroradiodata bearer service requirements.8. R EQUIREMENTS TO MOBILE NETWORK INTERFACE8.1 Foreword8.1.1.1 This part of the specification does not define mandatory requirements forinteroperability. It is a preferred solution, in case interchangeability between OBU andMobile Terminal is required for a given implementation.8.1.1.2 This section gives only limited information. [EuroRadio FFFIS] must be used for fullcompliance.definition8.2 Interface8.2.1.1 If an MT2 interface is used at the mobile side, the service access point at the mobilestation corresponds with the R-reference point of the MT2.8.2.1.2 [GSM 07.07] specifies a profile of AT commands and recommends that this profile beused for controlling Mobile Equipment functions and GSM network services through aTerminal Adapter.8.2.1.3 For the mobile termination type MT2 the signalling over the V interface has to be inaccordance with [GSM 07.07], using the V.25ter command set.8.2.1.4 The online command state shall not be used to guarantee interoperability. To avoiddifferent behaviour, it is recommended to enable/disable this escape sequence usingthe appropriate AT command usually referred as ATS2=<manufacturer defined value>.This particular command shall be sent to the mobile terminal as part of its initialisationstring.8.2.1.5 State control using physical circuits is mandatory.8.2.1.6 The V-interface shall conform to recommendation ITU-T V.24. The signals required arespecified in [EuroRadio FFFIS].8.2.1.7 Note that in the case of class 1 mobile originated calls, it is allowed to set the priorityvalue “command control (safety)” at subscription time.8.2.1.8 The call control commands, interface control commands and responses used on the V-interface at the R reference point are specified in [EuroRadio FFFIS].9. A NNEX A(I NFORMATIVE) TRANSMISSION INTERFERENCEAND RECOVERY9.1 General9.1.1.1 The usual QoS parameter used as measure of accuracy of data transmission viatransparent B/B m channels is the bit error rate.9.1.1.2 The QoS parameter relevant for layer 2 accuracy is the HDLC frame error rate.9.1.1.3 It is not possible to define relationships between both rates. The channel behaviour isnot known: error bursts and interruptions of data transmission during radio cellhandover can happen.9.1.1.4 Additionally, statistical distributions of values such as error rates do not accurately mapthe requirements from the ETCS point of view. Transfer of user data is requested inbursts; the transfer delay can be critical for the application. It has to be guaranteed forsome application messages that data can be transferred to the train in a defined timeinterval.9.1.1.5 A model of service behaviour is necessary reflecting all relevant features of GSM-Rnetworks.9.1.1.6 This model can be used as a normative reference for acceptance tests and for networkmaintenance during ETCS operation. It enables the ETCS supplier to demonstrate thecorrect operation of ETCS constituents during conformance testing without thevariations of real world GSM-R networks.9.1.1.7 Transmission interference and recovery is a first approximation of such a servicebehaviour model.9.2 Transmission interference in relation to HDLC9.2.1.1 Transmission interference is characterised by a period in the received data streamduring which the received data units deviate partially or completely from those of thetransmitted data stream. The service user cannot see the causes of transmissioninterference.9.2.1.2 The user data units erroneously transmitted or omitted during the transmissioninterference must be corrected by re-transmission. These re-transmissions result in atime delay and in higher load in the B/B m channel. Therefore, after transmissioninterference a period of error-free transmission, called the recovery period, must follow.9.2.1.3 In the normal data transfer phase after recovery, user data units are transmitted toprovide the data throughput requested by application messages.9.2.1.4 Figure 1 shows a simplified relationship of B/B m channel and HDLC errors: because ofthe selected options for the HDLC protocol (e.g. multi selective reject) the recoveryperiod and the normal data transfer phase are not strictly separated.error-free frameHDLC statecorrupted frameerror-freeChannel stateerroneousFigure 1 B/B m channel and HDLC errors9.2.1.5 Some special cases exist in Figure 1:A Beginning of HDLC frame (corrupted by transmission) is earlier than beginning oftransmission interferenceB Error-free time is not sufficient for transfer of HDLC frameC No HDLC frame is ready for transferD End of corrupted HDLC frame is later than end of transmission interference9.2.1.6 Figure 2 shows as an example the HDLC behaviour in case of transmissioninterference.Figure 2 Event "Transmission interference"9.2.1.7 The sender does not receive an acknowledgement in the case of a corrupted last Iframe of a sequence of I frames. The timer T1 expires and a RR (poll bit set) frame willbe sent.9.2.1.8 After receiving an RR frame with an indication of successful transmission of thepreceding I frame, the lost I frame will be re-transmitted.9.2.1.9 Again the sender does not receive an acknowledgement and requests for thesequence number. Eventually, the transmission is successful but the delivery of userdata will be delayed towards the receiver.9.2.1.10 The occurrence of the above defined event represents a QoS event “Transmissioninterference” at the sender side. The beginning and the end of the transmissioninterference are not exactly known. But the second repetition clearly indicates an event“Transmission interference”:a) The transmission interference time was too long orb) The recovery time was too short.。
Dytran基础培训教程
在编写本书的过程中,得到了许多结构分析领域的同行们的支持与帮助。 MSC 公司 的工程师钱纯、程华认真校对了初稿,并对该书的写作提出了许多宝贵的意见。在此 一并表示感谢。 由于编写时间较为仓促,编者水平有限,错误和不当之处请广大读者批评指正。
编者 卞文杰
二零零零年九月十二日
目录
第1章 MSC.Dytran 及其由来··························(1) 1.1 工程中的瞬态动力学问题···························(1) 1.2 MSC.Dytran 及其由来·······························( ) 1.3 MSC.Dytran 的主要分析功能·························( ) 第2章 MSC.Dytran 分析方法与分析模型的一般知识······( )
4.5.10 人工粘性········································( ) 4.5.10.1 体积粘性·······································( ) 4.5.10.2 沙漏阻尼·······································( ) 4.6 拉格朗日约束·······································( ) 4.6.1 单点约束··········································( ) 4.6.2 接触面············································( ) 4.6.2.1 两个面之间的任意接触·····························( ) 4.6.2.2 单面接触·········································( ) 4.6.2.3 离散结点·········································( ) 4.6.3 刚性墙·············································( ) 4.6.4 捆绑联结···········································( ) 4.6.4.1 两个面联结在一起·································( ) 4.6.4.2 结点与面相联结···································( ) 4.6.4.3 壳单元的边与壳单元表面相联·······················( ) 4.6.5 可断开联结(BJOIN)································( ) 4.6.6 运动联结(KJOIN)··································( ) 4.7 拉格朗日载荷········································( ) 4.7.1 载荷定义···········································( ) 4.7.2 集中力与集中力矩···································( ) 4.7.3 分布压力···········································( ) 4.7.4 强迫运动···········································( ) 4.7.5 初始条件··········································( ) 4.8 欧拉载荷与约束······································( ) 4.8.1 欧拉载荷与约束的类型······························( ) 4.8.2 流场边界条件······································( ) 4.8.3 刚性墙············································( ) 4.8.4 初始条件··········································( ) 4.8.5 爆炸··············································( ) 4.8.6 体力··············································( ) 4.9 一般耦合(General Coupling)·························( ) 4.11 任意拉格朗日欧拉耦合(ALE)·························( ) 4.12 动力释放············································( ) 4.13 安全带·············································( ) 4.13.1 定义·············································( ) 4.13.2 安全带的物理特性·································( ) 4.14 拉延筋模型·········································( ) 4.15 根据具体的应用类型确定计算方法的缺省定义···········( ) 4.16 质量放大···········································( ) 4.17 气囊的泄漏性······································( ) 4.17.1 定义方法········································( ) 4.17.2 渗透性···········································( ) 4.17.3 洞···············································( ) 4.18 气囊上的充气口····································( ) 4.19 气囊的热传导······································( )
IEEE standard for Terminology and Test methods for ADC Std 1241-2000
IEEE Std1241-2000 IEEE Standard for Terminology and Test Methods for Analog-to-Digital ConvertersSponsorWaveform Measurement and Analysis Technical Committeeof theof theIEEE Instrumentation and Measurement SocietyApproved7December2000IEEE-SA Standards BoardAbstract:IEEE Std1241-2000identifies analog-to-digital converter(ADC)error sources and provides test methods with which to perform the required error measurements.The information in this standard is useful both to manufacturers and to users of ADCs in that it provides a basis for evaluating and comparing existing devices,as well as providing a template for writing specifications for the procurement of new ones.In some applications,the information provided by the tests described in this standard can be used to correct ADC errors, e.g.,correction for gain and offset errors.This standard also presents terminology and definitions to aid the user in defining and testing ADCs.Keywords:ADC,A/D converter,analog-to-digital converter,digitizer,terminology,test methodsThe Institute of Electrical and Electronics Engineers,Inc.3Park Avenue,New York,NY10016-5997,USACopyrightß2001by the Institute of Electrical and Electronics Engineers,Inc.All rights reserved. Published 13 June 2001. Printed in the United States of America.Print:ISBN0-7381-2724-8SH94902PDF:ISBN0-7381-2725-6SS94902No part of this publication may be reproduced in any form,in an electronic retrieval system or otherwise,without the prior written permission of the publisher.IEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association(IEEE-SA)Standards Board.The IEEE develops its standards through a consensus development process,approved by the American National Standards Institute,which brings together volunteers representing varied viewpoints and interests to achieve thefinal product.Volunteers are not necessarily members of the Institute and serve without compensation.While the IEEE administers the process and establishes rules to promote fairness in the consensus development process,the IEEE does not independently evaluate,test,or verify the accuracy of any of the information contained in its standards.Use of an IEEE Standard is wholly voluntary.The IEEE disclaims liability for any personal injury,property or other damage,of any nature whatsoever,whether special,indirect,consequential,or compensatory,directly or indirectly resulting from the publication,use of,or reliance upon this,or any other IEEE Standard document.The IEEE does not warrant or represent the accuracy or content of the material contained herein,and expressly disclaims any express or implied warranty,including any implied warranty of merchantability orfitness for a specific purpose,or that the use of the material contained herein is free from patent infringement.IEEE Standards documents are supplied‘‘AS IS.’’The existence of an IEEE Standard does not imply that there are no other ways to produce,test,measure,purchase, market,or provide other goods and services related to the scope of the IEEE Standard.Furthermore,the viewpoint expressed at the time a standard is approved and issued is subject to change brought about through developments in the state of the art and comments received from users of the standard.Every IEEE Standard is subjected to review at least everyfive years for revision or reaffirmation.When a document is more thanfive years old and has not been reaffirmed,it is reasonable to conclude that its contents,although still of some value,do not wholly reflect the present state of the art. Users are cautioned to check to determine that they have the latest edition of any IEEE Standard.In publishing and making this document available,the IEEE is not suggesting or rendering professional or other services for,or on behalf of,any person or entity.Nor is the IEEE undertaking to perform any duty owed by any other person or entity to another.Any person utilizing this,and any other IEEE Standards document,should rely upon the advice of a competent professional in determining the exercise of reasonable care in any given circumstances.Interpretations:Occasionally questions may arise regarding the meaning of portions of standards as they relate to specific applications.When the need for interpretations is brought to the attention of IEEE,the Institute will initiate action to prepare appropriate responses.Since IEEE Standards represent a consensus of concerned interests,it is important to ensure that any interpretation has also received the concurrence of a balance of interests.For this reason, IEEE and the members of its societies and Standards Coordinating Committees are not able to provide an instant response to interpretation requests except in those cases where the matter has previously received formal consideration. Comments for revision of IEEE Standards are welcome from any interested party,regardless of membership affiliation with IEEE.Suggestions for changes in documents should be in the form of a proposed change of text,together with appropriate supporting ments on standards and requests for interpretations should be addressed to:Secretary,IEEE-SA Standards Board445Hoes LaneP.O.Box1331Piscataway,NJ08855-1331USANote:Attention is called to the possibility that implementation of this standard may require use of subjectmatter covered by patent rights.By publication of this standard,no position is taken with respect to theexistence or validity of any patent rights in connection therewith.The IEEE shall not be responsible foridentifying patents for which a license may be required by an IEEE standard or for conducting inquiriesinto the legal validity or scope of those patents that are brought to its attention.IEEE is the sole entity that may authorize the use of certification marks,trademarks,or other designations to indicate compliance with the materials set forth herein.Authorization to photocopy portions of any individual standard for internal or personal use is granted by the Institute of Electrical and Electronics Engineers,Inc.,provided that the appropriate fee is paid to Copyright Clearance Center. To arrange for payment of licensing fee,please contact Copyright Clearance Center,Customer Service,222Rosewood Drive,Danvers,MA01923USA;(978)750-8400.Permission to photocopy portions of any individual standard for educational classroom use can also be obtained through the Copyright Clearance Center.Introduction(This introduction is not a part of IEEE Std1241-2000,IEEE Standard for Terminology and Test Methods for Analog-to-Digital Converters.)This standard defines the terms,definitions,and test methods used to specify,characterize,and test analog-to-digital converters(ADCs).It is intended for the following:—Individuals and organizations who specify ADCs to be purchased—Individuals and organizations who purchase ADCs to be applied in their products —Individuals and organizations whose responsibility is to characterize and write reports on ADCs available for use in specific applications—Suppliers interested in providing high-quality and high-performance ADCs to acquirersThis standard is designed to help organizations and individuals—Incorporate quality considerations during the definition,evaluation,selection,and acceptance of supplier ADCs for operational use in their equipment—Determine how supplier ADCs should be evaluated,tested,and accepted for delivery to end users This standard is intended to satisfy the following objectives:—Promote consistency within organizations in acquiring third-party ADCs from component suppliers—Provide useful practices on including quality considerations during acquisition planning —Provide useful practices on evaluating and qualifying supplier capabilities to meet user requirements—Provide useful practices on evaluating and qualifying supplier ADCs—Assist individuals and organizations judging the quality and suitability of supplier ADCs for referral to end usersSeveral standards have previously been written that address the testing of analog-to-digital converters either directly or indirectly.These include—IEEE Std1057-1994a,which describes the testing of waveform recorders.This standard has been used as a guide for many of the techniques described in this standard.—IEEE Std746-1984[B16]b,which addresses the testing of analog-to-digital and digital-to-analog converters used for PCM television video signal processing.—JESD99-1[B21],which deals with the terms and definitions used to describe analog-to-digital and digital-to-analog converters.This standard does not include test methods.IEEE Std1241-2000for analog-to-digital converters is intended to focus specifically on terms and definitions as well as test methods for ADCs for a wide range of applications.a Information on references can be found in Clause2.b The numbers in brackets correspond to those in the bibliography in Annex C.As of October2000,the working group had the following membership:Steve Tilden,ChairPhilip Green,Secretary&Text EditorW.Thomas Meyer,Figures EditorPasquale Arpaia Giovanni Chiorboli Tom Linnenbrink*B.N.Suresh Babu Pasquale Daponte Solomon MaxAllan Belcher David Hansen Carlo MorandiDavid Bergman Fred Irons Bill PetersonEric Blom Dan Kien Pierre-Yves RoyDan Knierim*Chairman,TC-10CommitteeContributions were also made in prior years by:Jerry Blair John Deyst Norris NahmanWilliam Boyer Richard Kromer Otis M.SolomonSteve Broadstone Yves Langard T.Michael SoudersThe following members of the balloting committee voted on this standard:Pasquale Arpaia Pasquale Daponte W.Thomas MeyerSuresh Babu Philip Green Carlo MorandiEric Blom Fred Irons William E.PetersonSteven Broadstone Dan Knierim Pierre-Yves RoyGiovanni Chiorboli T.E.Linnenbrink Steven J.TildenSolomon MaxWhen the IEEE-SA Standards Board approved this standard on21September2000,it had the following membership:Donald N.Heirman,ChairJames T.Carlo,Vice-ChairJudith Gorman,SecretarySatish K.Aggarwal James H.Gurney James W.MooreMark D.Bowman Richard J.Holleman Robert F.MunznerGary R.Engmann Lowell G.Johnson Ronald C.PetersenHarold E.Epstein Robert J.Kennelly Gerald H.Petersonndis Floyd Joseph L.Koepfinger*John B.PoseyJay Forster*Peter H.Lips Gary S.RobinsonHoward M.Frazier L.Bruce McClung Akio TojoRuben D.Garzon Daleep C.Mohla Donald W.Zipse*Member EmeritusAlso included are the following nonvoting IEEE-SA Standards Board liaisons:Alan Cookson,NIST RepresentativeDonald R.Volzka,TAB RepresentativeDon MessinaIEEE Standards Project EditorContents1.Overview (1)1.1Scope (1)1.2Analog-to-digital converter background (2)1.3Guidance to the user (3)1.4Manufacturer-supplied information (5)2.References (7)3.Definitions and symbols (7)3.1Definitions (7)3.2Symbols and acronyms (14)4.Test methods (18)4.1General (18)4.2Analog input (41)4.3Static gain and offset (43)4.4Linearity (44)4.5Noise(total) (51)4.6Step response parameters (63)4.7Frequency response parameters (66)4.8Differential gain and phase (71)4.9Aperture effects (76)4.10Digital logic signals (78)4.11Pipeline delay (78)4.12Out-of-range recovery (78)4.13Word error rate (79)4.14Differential input specifications (81)4.15Comments on reference signals (82)4.16Power supply parameters (83)Annex A(informative)Comment on errors associated with word-error-rate measurement (84)Annex B(informative)Testing an ADC linearized with pseudorandom dither (86)Annex C(informative)Bibliography (90)IEEE Standard for Terminology and Test Methods for Analog-to-Digital Converters1.OverviewThis standard is divided into four clauses plus annexes.Clause1is a basic orientation.For further investigation,users of this standard can consult Clause2,which contains references to other IEEE standards on waveform measurement and relevant International Standardization Organization(ISO) documents.The definitions of technical terms and symbols used in this standard are presented in Clause3.Clause4presents a wide range of tests that measure the performance of an analog-to-digital converter.Annexes,containing the bibliography and informative comments on the tests presented in Clause4,augment the standard.1.1ScopeThe material presented in this standard is intended to provide common terminology and test methods for the testing and evaluation of analog-to-digital converters(ADCs).This standard considers only those ADCs whose output values have discrete values at discrete times,i.e., they are quantized and sampled.In general,this quantization is assumed to be nominally uniform(the input–output transfer curve is approximately a straight line)as discussed further in 1.3,and the sampling is assumed to be at a nominally uniform rate.Some but not all of the test methods in this standard can be used for ADCs that are designed for non-uniform quantization.This standard identifies ADC error sources and provides test methods with which to perform the required error measurements.The information in this standard is useful both to manufacturers and to users of ADCs in that it provides a basis for evaluating and comparing existing devices,as well as providing a template for writing specifications for the procurement of new ones.In some applications, the information provided by the tests described in this standard can be used to correct ADC errors, e.g.,correction for gain and offset errors.The reader should note that this standard has many similarities to IEEE Std1057-1994.Many of the tests and terms are nearly the same,since ADCs are a necessary part of digitizing waveform recorders.IEEEStd1241-2000IEEE STANDARD FOR TERMINOLOGY AND TEST METHODS 1.2Analog-to-digital converter backgroundThis standard considers only those ADCs whose output values have discrete values at discrete times, i.e.,they are quantized and sampled.Although different methods exist for representing a continuous analog signal as a discrete sequence of binary words,an underlying model implicit in many of the tests in this standard assumes that the relationship between the input signal and the output values approximates the staircase transfer curve depicted in Figure1a.Applying this model to a voltage-input ADC,the full-scale input range(FS)at the ADC is divided into uniform intervals,known as code bins, with nominal width Q.The number of code transition levels in the discrete transfer function is equal to 2NÀ1,where N is the number of digitized bits of the ADC.Note that there are ADCs that are designed such that N is not an integer,i.e.,the number of code transition levels is not an integral power of two. Inputs below thefirst transition or above the last transition are represented by the most negative and positive output codes,respectively.Note,however,that two conventions exist for relating V min and V max to the nominal transition points between code levels,mid-tread and mid-riser.The dotted lines at V min,V max,and(V minþV max)/2indicate what is often called the mid-tread convention,where thefirst transition is Q/2above V min and the last transition is3Q/2,below V max. This convention gets its name from the fact that the midpoint of the range,(V minþV max)/2,occurs in the middle of a code,i.e.,on the tread of the staircase transfer function.The second convention,called the mid-riser convention,is indicated in thefigure by dashed lines at V min,V max,and(V minþV max)/2. In this convention,V min isÀQ from thefirst transition,V max isþQ from the last transition,and the midpoint,(V minþV max)/2,occurs on a staircase riser.The difference between the two conventions is a displacement along the voltage axis by an amount Q/2.For all tests in this standard,this displacement has no effect on the results and either convention may be used.The one place where it does matter is when a device provides or expects user-provided reference signals.In this case the manufacturer must provide the necessary information relating the reference levels to the code transitions.In both conventions the number of code transitions is 2NÀ1and the full-scale range,FSR,is from V min to V max.Even in an ideal ADC,the quantization process produces errors.These errors contribute to the difference between the actual transfer curve and the ideal straight-line transfer curve,which is plotted as a function of the input signal in Figure1b.To use this standard,the user must understand how the transfer function maps its input values to output codewords,and how these output codewords are converted to the code bin numbering convention used in this standard.As shown in Figure1a,the lowest code bin is numbered0, the next is1,and so on up to the highest code bin,numbered(2NÀ1).In addition to unsigned binary(Figure1a),ADCs may use2’s complement,sign-magnitude,Gray,Binary-Coded-Decimal (BCD),or other output coding schemes.In these cases,a simple mapping of the ADC’s consecutive output codes to the unsigned binary codes can be used in applying various tests in this standard.Note that in the case of an ADC whose number of distinct output codes is not an integral power of2(e.g.,a BCD-coded ADC),the number of digitized bits N is still defined,but will not be an integer.Real ADCs have other errors in addition to the nominal quantization error shown in Figure1b.All errors can be divided into the categories of static and dynamic,depending on the rate of change of the input signal at the time of digitization.A slowly varying input can be considered a static signal if its effects are equivalent to those of a constant signal.Static errors,which include the quantization error, usually result from non-ideal spacing of the code transition levels.Dynamic errors occur because of additional sources of error induced by the time variation of the analog signal being sampled.Sources include harmonic distortion from the analog input stages,signal-dependent variations in the time of samples,dynamic effects in internal amplifier and comparator stages,and frequency-dependent variation in the spacing of the quantization levels.1.3Guidance to the user1.3.1InterfacingADCs present unique interfacing challenges,and without careful attention users can experience substandard results.As with all mixed-signal devices,ADCs perform as expected only when the analog and digital domains are brought together in a well-controlled fashion.The user should fully understand the manufacturer’s recommendations with regard to proper signal buffering and loading,input signal connections,transmission line matching,circuit layout patterns,power supply decoupling,and operating conditions.Edge characteristics for start-convert pulse(s)and clock(s)must be carefully chosen to ensure that input signal purity is maintained with sufficient margin up to the analog input pin(s).Most manufacturers now provide excellent ADC evaluation boards,which demonstrate IN P U T IN P U T(a)Figure 1—Staircase ADC transfer function,having full-scale range FSR and 2N À1levels,corresponding to N -bit quantizationIEEE FOR ANALOG-TO-DIGITAL CONVERTERS Std 1241-2000IEEEStd1241-2000IEEE STANDARD FOR TERMINOLOGY AND TEST METHODS recommended layout techniques,signal conditioning,and interfacing for their ADCs.If the characteristics of a new ADC are not well understood,then these boards should be analyzed or used before starting a new layout.1.3.2Test conditionsADC test specifications can be split into two groups:test conditions and test results.Typical examples of the former are:temperature,power supply voltages,clock frequency,and reference voltages. Examples of the latter are:power dissipation,effective number of bits,spurious free dynamic range (SFDR),and integral non-linearity(INL).The test methods defined in this standard describe the measurement of test results for given test conditions.ADC specification sheets will often give allowed ranges for some test condition(e.g.,power supply ranges).This implies that the ADC will function properly and that the test results will fall within their specified ranges for all test conditions within their specified ranges.Since the test condition ranges are generally specified in continuous intervals,they describe an infinite number of possible test conditions,which obviously cannot be exhaustively tested.It is up to the manufacturer or tester of an ADC to determine from design knowledge and/or testing the effect of the test conditions on the test result,and from there to determine the appropriate set of test conditions needed to accurately characterize the range of test results.For example,knowledge of the design may be sufficient to know that the highest power dissipation(test result)will occur at the highest power supply voltage(test condition),so the power dissipation test need be run only at the high end of the supply voltage range to check that the dissipation is within the maximum of its specified range.It is very important that relevant test conditions be stated when presenting test results.1.3.3Test equipmentOne must ensure that the performance of the test equipment used for these tests significantly exceeds the desired performance of the ADC under ers will likely need to include additional signal conditioning in the form offilters and pulse shapers.Accessories such as terminators, attenuators,delay lines,and other such devices are usually needed to match signal levels and to provide signal isolation to avoid corrupting the input stimuli.Quality testing requires following established procedures,most notably those specified in ISO9001: 2000[B18].In particular,traceability of instrumental calibration to a known standard is important. Commonly used test setups are described in4.1.1.1.3.4Test selectionWhen choosing which parameters to measure,one should follow the outline and hints in this clause to develop a procedure that logically and efficiently performs all needed tests on each unique setup. The standard has been designed to facilitate the development of these test procedures.In this standard the discrete Fourier transform(DFT)is used extensively for the extraction of frequency domain parameters because it provides numerous evaluation parameters from a single data record.DFT testing is the most prevalent technique used in the ADC manufacturing community,although the sine-fit test, also described in the standard,provides meaningful data.Nearly every user requires that the ADC should meet or exceed a minimum signal-to-noise-and-distortion ratio(SINAD)limit for the application and that the nonlinearity of the ADC be well understood.Certainly,the extent to whichthis standard is applied will depend upon the application;hence,the procedure should be tailored for each unique characterization plan.1.4Manufacturer-supplied information1.4.1General informationManufacturers shall supply the following general information:a)Model numberb)Physical characteristics:dimensions,packaging,pinoutsc)Power requirementsd)Environmental conditions:Safe operating,non-operating,and specified performance tempera-ture range;altitude limitations;humidity limits,operating and storage;vibration tolerance;and compliance with applicable electromagnetic interference specificationse)Any special or peculiar characteristicsf)Compliance with other specificationsg)Calibration interval,if required by ISO10012-2:1997[B19]h)Control signal characteristicsi)Output signal characteristicsj)Pipeline delay(if any)k)Exceptions to the above parameters where applicable1.4.2Minimum specificationsThe manufacturer shall provide the following specifications(see Clause3for definitions):a)Number of digitized bitsb)Range of allowable sample ratesc)Analog bandwidthd)Input signal full-scale range with nominal reference signal levelse)Input impedancef)Reference signal levels to be appliedg)Supply voltagesh)Supply currents(max,typ)i)Power dissipation(max,typ)1.4.3Additional specificationsa)Gain errorb)Offset errorc)Differential nonlinearityd)Harmonic distortion and spurious responsee)Integral nonlinearityf)Maximum static errorg)Signal-to-noise ratioh)Effective bitsi)Random noisej)Frequency responsek)Settling timel)Transition duration of step response(rise time)m)Slew rate limitn)Overshoot and precursorso)Aperture uncertainty(short-term time-base instability)p)Crosstalkq)Monotonicityr)Hysteresiss)Out-of-range recoveryt)Word error rateu)Common-mode rejection ratiov)Maximum common-mode signal levelw)Differential input impedancex)Intermodulation distortiony)Noise power ratioz)Differential gain and phase1.4.4Critical ADC parametersTable1is presented as a guide for many of the most common ADC applications.The wide range of ADC applications makes a comprehensive listing impossible.This table is intended to be a helpful starting point for users to apply this standard to their particular applications.Table1—Critical ADC parametersTypical applications Critical ADC parameters Performance issuesAudio SINAD,THD Power consumption.Crosstalk and gain matching.Automatic control MonotonicityShort-term settling,long-term stability Transfer function. Crosstalk and gain matching. Temperature stability.Digital oscilloscope/waveform recorder SINAD,ENOBBandwidthOut-of-range recoveryWord error rateSINAD for wide bandwidthamplitude resolution.Low thermal noise for repeatability.Bit error rate.Geophysical THD,SINAD,long-term stability Millihertz response.Image processing DNL,INL,SINAD,ENOBOut-of-range recoveryFull-scale step response DNL for sharp-edge detection. High-resolution at switching rate. Recovery for blooming.Radar and sonar SINAD,IMD,ENOBSFDROut-of-range recovery SINAD and IMD for clutter cancellation and Doppler processing.Spectrum analysis SINAD,ENOBSFDR SINAD and SFDR for high linear dynamic range measurements.Spread spectrum communication SINAD,IMD,ENOBSFDR,NPRNoise-to-distortion ratioIMD for quantization of smallsignals in a strong interferenceenvironment.SFDR for spatialfiltering.NPR for interchannel crosstalk.Telecommunication personal communications SINAD,NPR,SFDR,IMDBit error rateWord error rateWide input bandwidth channel bank.Interchannel crosstalk.Compression.Power consumption.Std1241-2000IEEE STANDARD FOR TERMINOLOGY AND TEST METHODS2.ReferencesThis standard shall be used in conjunction with the following publications.When the following specifications are superseded by an approved revision,the revision shall apply.IEC 60469-2(1987-12),Pulse measurement and analysis,general considerations.1IEEE Std 1057-1994,IEEE Standard for Digitizing Waveform Recorders.23.Definitions and symbolsFor the purposes of this standard,the following terms and definitions apply.The Authoritative Dictionary of IEEE Standards Terms [B15]should be referenced for terms not defined in this clause.3.1Definitions3.1.1AC-coupled analog-to-digital converter:An analog-to-digital converter utilizing a network which passes only the varying ac portion,not the static dc portion,of the analog input signal to the quantizer.3.1.2alternation band:The range of input levels which causes the converter output to alternate between two adjacent codes.A property of some analog-to-digital converters,it is the complement of the hysteresis property.3.1.3analog-to-digital converter (ADC):A device that converts a continuous time signal into a discrete-time discrete-amplitude signal.3.1.4aperture delay:The delay from a threshold crossing of the analog-to-digital converter clock which causes a sample of the analog input to be taken to the center of the aperture for that sample.COMINT ¼communications intelligence DNL ¼differential nonlinearity ENOB ¼effective number of bits ELINT ¼electronic intelligence NPR ¼noise power ratio INL ¼integral nonlinearity DG ¼differential gain errorSIGINT ¼signal intelligenceSINAD ¼signal-to-noise and distortion ratio THD ¼total harmonic distortion IMD ¼intermodulation distortion SFDR ¼spurious free dynamic range DP ¼differential phase errorTable 1—Critical ADC parameters (continued)Typical applicationsCritical ADC parametersPerformance issuesVideoDNL,SINAD,SFDR,DG,DP Differential gain and phase errors.Frequency response.Wideband digital receivers SIGINT,ELINT,COMINTSFDR,IMD SINADLinear dynamic range fordetection of low-level signals in a strong interference environment.Sampling frequency.1IEC publications are available from IEC Sales Department,Case Postale 131,3rue de Varemb,CH 1211,Gen ve 20,Switzerland/Suisse (http://www.iec.ch).IEC publications are also available in the United States from the Sales Department,American National Standards Institute,25W.43rd Street,Fourth Floor,New York,NY 10036,USA ().2IEEE publications are available from the Institute of Electrical and Electronics Engineers,445Hoes Lane,P.O.Box 1331,Piscataway,NJ 08855-1331,USA (/).。
国际电子(National Instruments)USB-7845R OEM 多功能数字实时接口设
SPECIFICATIONSNI USB-7845R OEMR Series for USB Multifunction RIO with Kintex-7 70T FPGA Français Deutsch日本語한국어简体中文/manualsThis document contains the specifications for the National InstrumentsUSB-7845R OEM device. Specifications are typical at 25 °C unless otherwise noted.Caution Using the NI USB-7845R OEM device in a manner not described in thisdocument may impair the protection the NI USB-7845R OEM device provides. Analog InputNumber of channels8 ............................................................................Input modes DIFF, NRSE, RSE (software-selectable; ............................................................................selection applies to all channels)Type of ADC Successive approximation register (SAR) ............................................................................Resolution16 bits ............................................................................Conversion time 2 µs ............................................................................Maximum sampling rate500 kS/s (per channel) ............................................................................Input impedancePowered on 1.25 GΩ ║ 2 pF....................................................................Powered off/overload 4.0 kΩ min....................................................................Input signal range±1 V, ±2 V, ±5 V, ±10 V (software-selectable) ............................................................................Input bias current±5 nA ............................................................................ ............................................................................Input offset current±5 nAInput coupling DC ............................................................................Overvoltage protection....................................................................Powered on±42 V maxPowered off±35 V max....................................................................Table 1. AI Operating Voltage Ranges Over TemperatureAI Absolute AccuracyAbsolute accuracy at full scale numbers is valid immediately following internal calibration and assumes the device is operating within 10 °C of the last external calibration. Accuracies listed are valid for up to one year from the device external calibration.Absolute accuracy at full scale on the analog input channels is determined using the following assumptions:•TempChangeFromLastExternalCal = 10 °C •TempChangeFromLastInternalCal = 1 °C•number_of_readings = 10,000•CoverageFactor = 3 σ1The minimum measurement voltage range is the largest voltage the NI USB-7845R OEM device is guaranteed to accurately measure.2| | NI USB-7845R OEM SpecificationsTable 2. AI Absolute Accuracy (Calibrated) (Continued)Table 3. AI Absolute Accuracy (Uncalibrated)Calculating Absolute AccuracyAbsoluteAccuracy=Reading⋅(GainError)+Range*(OffsetError)+NoiseUncertaintyGainError=ResidualGainError+GainTempco*(TempChangeFromLastInternalCal)+ReferenceTempco*(TempChangeFromLastExternalCal)OffsetError=ResidualOffsetError+OffsetTempco*(TempChangeFromLastInternalCal)+INL_ErrorNoiseUncertainty=Refer to the following equation for an example of calculating absolute accuracy.NI USB-7845R OEM Specifications| © National Instruments| 3Absolute accuracy at full scale on the analog input channels is determined using the following assumptions:•TempChangeFromLastExternalCal = 10 °C •TempChangeFromLastInternalCal = 1 °C•number_of_readings = 10,000•CoverageFactor = 3 σGainError=104.4ppm+20ppm*1+4ppm*10GainError=164.4ppmOffsetError=16.4ppm+4.18ppm*1+42.52ppmOffsetError=63.1ppmNoiseUncetainty=NoiseUncertainty=7.89µVAbsoluteAccuracy=10V*(GainError)+10V*(OffsetError)+NoiseUncertaintyAbsoluteAccuracy=2,283µVDC Transfer Characteristics ............................................................................INL Refer to the AI Accuracy TableDNL±0.4 LSB typ, ±0.9 LSB max ............................................................................No missing codes16 bits guaranteed ............................................................................CMRR, DC to 60 Hz-100 dB ............................................................................Dynamic CharacteristicsBandwidthSmall signal 1 MHz........................................................................................................................................Large signal500 kHz4| | NI USB-7845R OEM Specifications............................................................................Crosstalk-80 dB, DC to 100 kHzAnalog Output ............................................................................Output type Single-ended, voltage output ............................................................................Number of channels8 ............................................................................Resolution16 bits ............................................................................Update time 1.0 µs ............................................................................Maximum update rate 1 MS/sType of DAC Enhanced R-2R ............................................................................ ............................................................................Range±10 V ............................................................................Output coupling DCOutput impedance0.5 Ω............................................................................NI USB-7845R OEM Specifications| © National Instruments| 5............................................................................Minimum current drive±2.5 mAProtection Short circuit to ground ............................................................................Overvoltage protectionPowered on±15 V max....................................................................Powered off±10 V max....................................................................Power-on state User-configurable ............................................................................Power-on glitch-1 V for 1 µs ............................................................................Table 4. AO Operating Voltage Ranges for Over TemperatureAO Absolute AccuracyAbsolute accuracy at full scale numbers is valid immediately following internal calibration and assumes the device is operating within 10 °C of the last external calibration. Accuracies listed are valid for up to one year from the device external calibration.Absolute accuracy at full scale on the analog output channels is determined using the following assumptions:•TempChangeFromLastExternalCal = 10 °C •TempChangeFromLastInternalCal = 1 °C2The minimum measurement voltage range is the largest voltage the NI USB-7845R OEM device is guaranteed to accurately measure.6| | NI USB-7845R OEM SpecificationsTable 5. AO Absolute Accuracy (Calibrated) (Continued)Calculating Absolute AccuracyAbsoluteAccuracy=OutputValue*(GainError)+Range*(OffsetError)GainError=ResidualGainError+GainTempco*(TempChangeFromLastInternalCal)+ReferenceTempco*(TempChangeFromLastExternalCal)OffsetError=ResidualOffsetError+AOOffsetTempco*(TempChangeFromLastInternalCal)+INL_Error Refer to the following equation for an example of calculating absolute accuracy.Absolute accuracy at full scale on the analog output channels is determined using thefollowing assumptions:•TempChangeFromLastExternalCal = 10 °C•TempChangeFromLastInternalCal = 1 °CGainError=87.3ppm+12.6ppm*1+4ppm*10GainError=139.9ppmNI USB-7845R OEM Specifications| © National Instruments| 7OffsetError=41.1ppm+7.8ppm*1+61ppmOffsetError=109.9ppmAbsoluteAccuracy=10V*(GainError)+10V*(OffsetError)AbsoluteAccuracy=2,498µVDC Transfer CharacteristicsINL Refer to the AO Accuracy Table ............................................................................DNL±0.5 LSB typ, ±1 LSB max ............................................................................Monotonicity16 bits, guaranteed ............................................................................Dynamic CharacteristicsSlew rate-10 V/µs ............................................................................Noise250 µV rms, DC to 1 MHz ............................................................................Glitch energy at midscale transition±10 mV for 3 µs ............................................................................5V OutputOutput voltage 4.75 V to 5.1 V ............................................................................Output current0.5 A max ............................................................................Overvoltage protection±30 V ............................................................................ ............................................................................Overcurrent protection650 mA8| | NI USB-7845R OEM SpecificationsDigital I/OCompatibility LVTTL ............................................................................Logic family User-selectable ............................................................................Default software setting 3.3 V ............................................................................Maximum input 3.6 V ............................................................................NI USB-7845R OEM Specifications| © National Instruments| 9Table 10. Digital Output Logic Levels (Continued)Output currentSource 4.0 mA....................................................................Sink 4.0 mA....................................................................Input leakage current±15 µA max ............................................................................Input impedance50 kΩ typ, pull-down ............................................................................Power-on state Programmable, by line ............................................................................Protection±20 V, single line ............................................................................Digital I/O voltage switching time 2 ms max ............................................................................Note Refer to NI RIO Software Help for more information about switching times.Reconfigurable FPGAFPGA type Kintex-7 70T ............................................................................Number of flip-flops82,000 ............................................................................Number of LUTs41,000 ............................................................................Embedded block RAM4,860 kbits ............................................................................Number of DSP48 slices240 ............................................................................Timebase40, 80, 120, 160, or 200 MHz ............................................................................Timebase accuracy, onboard clock±100 ppm ............................................................................Calibration ............................................................................Recommended warm-up time15 minutesCalibration interval 1 year ............................................................................10| | NI USB-7845R OEM SpecificationsOnboard calibration referenceDC level3 5.000 V (±2 mV)....................................................................Temperature coefficient±4 ppm/°C max....................................................................Long-term stability±25 ppm/1,000 h....................................................................Note Refer to Calibration Certifications at /calibration to generate acalibration certificate for the NI USB-7845R OEM deviceBus Interface ............................................................................USB compatibility USB 2.0 Hi-Speed or Full-Speed4Data transfers DMA, interrupts, programmed I/O ............................................................................Number of DMA channels3 ............................................................................Power RequirementInput voltage9 V to 30 V ............................................................................Max power20 W ............................................................................ ............................................................................Overvoltage protection40 VNote You must use a UL Listed ITE power supply marked LPS with theNI USB-7845R OEM device.PhysicalNote If you need to clean the device, wipe it with a dry, clean towel.Dimensions (PCB)17.5 cm × 16.3 cm (6.9 in. × 6.4 in.) ............................................................................Weight183 g (6.45 oz) ............................................................................I/O connectors Analog- 1 × 50 pin box header, ............................................................................Digital- 3 × 34 pin box header3Actual value stored in Flash memory4Operating on a full-speed bus will result in lower performance and you might not be able to achieve maximum sampling/update rates.NI USB-7845R OEM Specifications| © National Instruments| 11Maximum Working VoltageMaximum working voltage refers to the signal voltage plus the common-mode voltage. Channel-to-earth±12 V, Measurement Category I ............................................................................Channel-to-channel±24 V, Measurement Category I ............................................................................Measurement Category I is for measurements performed on circuits not directly connected to the electrical distribution system referred to as MAINS voltage. MAINS is a hazardous live electrical supply system that powers equipment. This category is for measurements of voltages from specially protected secondary circuits. Such voltage measurements include signal levels, special equipment, limited-energy parts of equipment, circuits powered by regulated low-voltage sources, and electronics.Caution Do not use the NI USB-7845R OEM device for connection to signals inMeasurement Categories II, III, or IV.Note Measurement Categories CAT I and CAT O (Other) are equivalent. Thesetest and measurement circuits are not intended for direct connection to the MAINSbuilding installations of Measurement Categories CAT II, CAT III, or CAT IV. Environmental-40 °C to 70 °COperating temperature ............................................................................(IEC 60068-2-1, IEC 60068-2-2)Storage temperature-40 °C to 85 °C ............................................................................(IEC 60068-2-1, IEC 60068-2-2)10% to 90% RH, noncondensingOperating humidity ............................................................................(IEC 60068-2-56)Storage humidity (IEC 60068-2-56)5% to 95% RH, noncondensing ............................................................................ ............................................................................Pollution Degree2Maximum altitude2,000 m ............................................................................Indoor use only.Online Product CertificationTo obtain product certifications and the DoC for this product, visit /certification, search by model number or product line, and click the appropriate link in the Certification column.12| | NI USB-7845R OEM SpecificationsEnvironmental ManagementNI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.For additional environmental information, refer to the Minimize Our Environmental Impact web page at /environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.Waste Electrical and Electronic Equipment (WEEE)EU Customers At the end of the product life cycle, all products must be sent to aWEEE recycling center. For more information about WEEE recycling centers,National Instruments WEEE initiatives, and compliance withWEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment, visit/environment/weee.电子信息产品污染控制管理办法(中国RoHS)中国客户National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。
ARTISTAN技术集团产品说明说明书
Agilent 34980AMultifunction Switch/Measure Unit Data Sheet• 8-slot mainframe with 21 mix-and-match plug-in modules so you can create your own custom configuration • High-performance switching:Up to 560 2-wire multiplexer channels or 4096 matrix cross-points inone mainframe• Optional built-in 6 12-digit DMMlets you make 11 measurements with over 3000 readings/sec • Easy to integrate: Built-in Ethernet, USB 2.0, and GPIB connectivity, standard connectors and software drivers for most common programming environments• Includes FREE BenchLink Data Logger SoftwareC O N F I G U R E,C O N N E C T,G OIf you use automated test equipmentfor design validation or manufacturing, you now have a cost-effectivealternative to PXI and VXI test-system platforms. The 34980A multifunction switch/measure unit provides compa-rable functionality that is much easier to use than PXI and VXI and costsless. The 34980A helps you lower your cost of test and accelerate your test-system integration and development.The 34980A handles system switch-ing up to 26.5 GHz and provides basic measurements and system control. It also offers DMM measurements, coun-ter/ totalizer functionality, digital I/O with pattern capabilities, and analog outputs with basic waveforms— all in one low-cost, compact box. And with its standard connectors and software drivers, computer-standard I/O, and Web browser interface, the 34980A easily integrates into electronic functional test and data acquisition systems.Flexible switching, measure-ments, and system controlThe 34980A accommodates up to 8 plug-in modules to give you the flexibility you need. Choose from 21 different modules to define your own configuration. You can buy what you need now and add to it or recon-figure it as your requirements change.Whether you are measuring tempera-ture, AC or DC voltage, resistance, frequency, current, or custom mea-surements, the 34980A offers thefunctionality you need in a single box. Switch in different measurements with high-performance signal switching up to 300V with no external signal conditioning required. Choose between different switch types and topologies with frequency ranges from DC to 26.5 GHz. The 34980A offers high-density multiplexers for scanning multiple channels, matrices for connecting multiple points at one time, and general purpose switches for simple control and high power needs.Use the 34980A to route individual signals or monitor multiple signals over a specified period of time—monitor a single channel or multiple channels, set alarms, and identify irregularities.The 34980A offers flexible choices for system control. You can control external devices such as microwave switches, attenuators, solenoids, and power relays. Or use the digital inputs to sense limit-switch and digital-bus status.Optimized for test systemsThe 34980A has the performance you need for medium- to high-density switching/measurement applications such as design verification, functional test and data acquisition. Your signals are switched to the right measurement device without compromising signal integrity. Switch your signals to the optional internal DMM and achieve optimal throughput on switch closure time. Or, if you prefer, you can easily connect to external instruments such as DMMs, scopes, power supplies, and more. What’s more, with the built-in Ethernet interface, you can control the 34980A and collect data from anywhere on the network.The rugged instrument comes with a variety of system-ready features:• Web browser interface shows settings at a glance and provides remote access and control• Self-guiding front panel to configure, troubleshoot or view data • Low EMI and efficient system cooling• Heavy-duty cabling and connection options• Flexible rack mounting options • Relay counters help predict end-of-life• In-rack calibration for reduced maintenance time• DMM measurement accuracies include the switch for simple calculationsMake system connections easily and quickly with simple, reliable connection options:• Built-in Ethernet, USB 2.0, and GPIB connectivity• Low-cost, standard 50- or 78-pin Dsub connectors and cables • Detachable terminal blocks with strain relief• Mass interconnect solutions In addition, the 34980A comes with Agilent IO Libraries Suite. Quickly establish an error-free connection between your PC and instruments—regardless of vendor. The IO Libraries provide robust instrument control and work with the software development environment you choose.2High-performance unit provides low-cost alternative to PXI and VXI switch and measurement platformsEasier signal routingwith four2-wire internal analog buses. You can route your measurements directly to the internal DMM, or you can connect to external instruments through the analog bus connector on the rear of the mainframe. And since you have four 2-wire buses, you can dedicate one bus for use with the internal DMM and use the other three buses for module extensions or additional signal routing between modules, reducing your wiring needs. You can define up to 500 switch sequences to control complex signal routing and the order ofswitch closures. Assign a sequence, give it a name and then execute it with the name you created. Switch sequences are downloaded and stored in the instrument for ease of programming and increased throughput.External trigger capabilities make it easy for you to time and synchronize measurements and other events. This can help you determine when to begin or end an acquisition.Measurements you can trustGet proven performance from Agilent instruments, with the resolution, repeatability, speed, and accuracy you’ve come to expect.The 34980A offers built-in signal conditioning and modular flexibility. When you use it with the internalDMM, you can configure each channel independently for the measurements you choose. It includes a variety of features that give you confidence in your measurements:• 61⁄2 digits of resolution with .004% of accuracy with DC voltage measurements• Alarms per channel—high limit, low limit, or both• Math functions—use Mx+B for custom linear conversions and converting raw inputs• Built-in thermocouple reference for temperature measurements (34921T)• Time-stamped readings• Add more formulas with BenchLink Data Logger SoftwareThe integrated DMM is mounted inside the mainframe and does not consume any of the eight user-available slots. You can access the DMM through any switch module that connects to the analog bus, or directly from the analog bus connector on the rear of the mainframe. The internal DMM gives you the flexibility to measure 11 types of inputs:• Temperature with thermocouples, RTDs, or thermistors (with 34921A)• DC and AC voltage • 2- and 4-wire resistance • Frequency and period • DC and AC currentYou can control the DMM directly, or configure it to work in conjunction with the switches. Each switch chan-nel can be configured independently for measurement functions, scale factors and alarm limits. Advanced measurement features such as offset compensation, variable integration time, and delay are also selectable on a per-channel basis.The DMM inputs are shielded and optically isolated from the 34980A’s earth-referenced circuitry andcomputer interface, and as a result, you get up to 300 V of input isola-tion. This is important for reducing ground-loops and common-mode voltage errors associated with long wiring runs and floating sources.Simple DMM calibration isaccomplished with just the analog bus connection on the rear panel of the mainframe. You don’t need to remove the mainframe from the rack or dedicate a channel for calibration.Modules provide flexible system stimulus and controlSystem control —with analog outputs, open-collector digital outputs, clock generation, and isolated Form-Crelays for controlling external devices. Additionally, with the microwave switch/attenuator driver, high-frequency switches and attenuators can be efficiently controlled external to the 34980A mainframe.Analog sources —output eithervoltage or current. You can configure the 4-channel isolated D/A converter as a point-to-point arbitrary wave-form generator that lets you define up to 500,000 points per waveform.Digital patterns —send or receive digital data from your device under test. With on-board memory you can output communication protocols and bit streams or monitor digital input patterns and interrupt when a user-defined pattern is detected.35Free BenchLink Data Logger Software to Simplify data loggingThe BenchLink Data Logger software for the 34980A provides a convenient way to collect and analyze your data. This is a Windows® based application that uses a familiar spreadsheet envi-ronment to define measurement data to be collected. The tab-based format makes it easy to set up and initiate scans. Simply identify the measure-ments you want to acquire, initiate the process and see the data displayed real-time. The rich set of colorful graphics provides many options for analyzing and displaying your data. You can specify multiple channels per graph, or send collected data to multiple graphs. Use strip charts with markers and alarm indication, or his-tograms with statistics. And of course you can use BenchLink Data Logger to easily move data to other applications for further analysis, or for inclusion in your presentations and reports.34832A BenchLink Data Logger Pro adds limit checking and decision making Figure 2 34826A BenchLink Data Logger Software for high speed data logging with no programming.Figure 334832A BenchLink Data Logger Pro adds limit checking and decision makingEvent • Control Instruments • Send Notification(s)• Stop Scan• Control Instruments • Send Notification(s)• Stop Scan• Control Instruments • Send Notification(s)• Stop ScanEventE v en t s E v e n t sE v e n t sScan List A (Base)Scan List BScan List CEventStartAlso AvailableThe BenchLink Data LoggerPro Software adds limit checking and decision making for more complex applications. Simply identify the measurements you want to acquire, define limits and actions to be preformed, and then initiate the process. Your data is then collocated, evaluated and acted on real-time.6Intuitive front panel with self-guiding menusSet up scan listsSee results on bright, multiline displayScan multiple channels,close specified channel list,or monitor results on a single channel Use keypad to enter channel number or knob to scrollStore up to 500,000 readings with timestamp61⁄2digit DMM measurementswith 11 functionsSet I/O O ,date an n d other s s ystem feature e sStore a a nd recall instrum m ent setups s Access to four 2-wi wire analog busesExternal trigger to synchronize events 8-slots connect to optional internal DMM Built-in Ethernet,USB 2.0,and GPIB interfacesOptional terminal blocksIndustry standard DSub cables21 plug-in modules les to choose fromStandard DSub connector kitsConfigure measurements, manage sequences, view errors and alarmsPower and flexibility to get your job done8910111214151634945A moduleY1150A-Y1155Adistribution boardsrequired to controlswitches (ordered separate)34945EXT extender holds4 distribution boar34980A system control modules20212728Rack kitScrew Terminal Block2934934A High Density Configuration BlockStandard Dsub CableConnector kit30GPIB, providing faster, more efficient connectivity. Agilent is a founding member of the LXI For more information on Agilent Technologies’products, applications or services, pleasecontact your local Agilent office. The completelist is available at:/find/contactusAmericasCanada (877) 894-4414Latin America 305 269 7500United States (800) 829-4444Asia PacificAustralia 1 800 629 485China 800 810 0189Hong Kong 800 938 693India 1 800 112 929Japan 81 426 56 7832Korea 080 769 0800Malaysia 1 800 888 848 Singapore 180****8100Taiwan 0800 047 866Thailand 1 800 226 008EuropeAustria 0820 87 44 11Belgium 32 (0) 2 404 93 40 Denmark 45 70 13 15 15Finland 358 (0) 10 855 2100 France 0825 010 700Germany 01805 24 6333**0.14/minuteIreland 1890 924 204Italy 39 02 92 60 8484 Netherlands 31 (0) 20 547 2111Spain 34 (91) 631 3300Sweden 0200-88 22 55 Switzerland (French) 41 (21) 8113811(Opt 2) Switzerland (German) 0800 80 53 53 (Opt 1) United Kingdom 44 (0) 118 9276201Other European Countries:/find/contactusRevised: May 7, 2007Product specifications and descriptionsin this document subject to changewithout notice.© Agilent Technologies, Inc. 2008Printed in USA, June 13, 20085989-1437EN。
jstd035声学扫描
JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。
Adobe Acrobat SDK 开发者指南说明书
This guide is governed by the Adobe Acrobat SDK License Agreement and may be used or copied only in accordance with the terms of this agreement. Except as permitted by any such agreement, no part of this guide may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, recording, or otherwise, without the prior written permission of Adobe. Please note that the content in this guide is protected under copyright law.
STM32f10固件库使用手册中文版
UM0427 用户手册32 位基于ARM 微控制器STM32F101xx 与STM32F103xx固件函数库介绍本手册介绍了32 位基于ARM 微控制器STM32F101xx 与STM32F103xx 的固件函数库。
该函数库是一个固件函数包,它由程序、数据结构和宏组成,包括了微控制器所有外设的性能特征。
该函数库还包括每一个外设的驱动描述和应用实例。
通过使用本固件函数库,无需深入掌握细节,用户也可以轻松应用每一个外设。
因此,使用本固态函数库可以大大减少用户的程序编写时间,进而降低开发成本。
每个外设驱动都由一组函数组成,这组函数覆盖了该外设所有功能。
每个器件的开发都由一个通用API (application programming interface 应用编程界面)驱动,API 对该驱动程序的结构,函数和参数名称都进行了标准化。
所有的驱动源代码都符合“Strict ANSI-C”标准(项目于范例文件符合扩充ANSI-C 标准)。
我们已经把驱动源代码文档化,他们同时兼容MISRA-C 2004 标准(根据需要,我们可以提供兼容矩阵)。
由于整个固态函数库按照“Strict ANSI-C”标准编写,它不受不同开发环境的影响。
仅对话启动文件取决于开发环境。
该固态函数库通过校验所有库函数的输入值来实现实时错误检测。
该动态校验提高了软件的鲁棒性。
实时检测适合于用户应用程序的开发和调试。
但这会增加了成本,可以在最终应用程序代码中移去,以优化代码大小和执行速度。
想要了解更多细节,请参阅Section 2.5。
因为该固件库是通用的,并且包括了所有外设的功能,所以应用程序代码的大小和执行速度可能不是最优的。
对大多数应用程序来说,用户可以直接使用之,对于那些在代码大小和执行速度方面有严格要求的应用程序,该固件库驱动程序可以作为如何设置外设的一份参考资料,根据实际需求对其进行调整。
此份固件库用户手册的整体架构如下:定义,文档约定和固态函数库规则。
Native Instruments MASCHINE MIKRO MK3用户手册说明书
The information in this document is subject to change without notice and does not represent a commitment on the part of Native Instruments GmbH. The software described by this docu-ment is subject to a License Agreement and may not be copied to other media. No part of this publication may be copied, reproduced or otherwise transmitted or recorded, for any purpose, without prior written permission by Native Instruments GmbH, hereinafter referred to as Native Instruments.“Native Instruments”, “NI” and associated logos are (registered) trademarks of Native Instru-ments GmbH.ASIO, VST, HALion and Cubase are registered trademarks of Steinberg Media Technologies GmbH.All other product and company names are trademarks™ or registered® trademarks of their re-spective holders. Use of them does not imply any affiliation with or endorsement by them.Document authored by: David Gover and Nico Sidi.Software version: 2.8 (02/2019)Hardware version: MASCHINE MIKRO MK3Special thanks to the Beta Test Team, who were invaluable not just in tracking down bugs, but in making this a better product.NATIVE INSTRUMENTS GmbH Schlesische Str. 29-30D-10997 Berlin Germanywww.native-instruments.de NATIVE INSTRUMENTS North America, Inc. 6725 Sunset Boulevard5th FloorLos Angeles, CA 90028USANATIVE INSTRUMENTS K.K.YO Building 3FJingumae 6-7-15, Shibuya-ku, Tokyo 150-0001Japanwww.native-instruments.co.jp NATIVE INSTRUMENTS UK Limited 18 Phipp StreetLondon EC2A 4NUUKNATIVE INSTRUMENTS FRANCE SARL 113 Rue Saint-Maur75011 ParisFrance SHENZHEN NATIVE INSTRUMENTS COMPANY Limited 5F, Shenzhen Zimao Center111 Taizi Road, Nanshan District, Shenzhen, GuangdongChina© NATIVE INSTRUMENTS GmbH, 2019. All rights reserved.Table of Contents1Welcome to MASCHINE (23)1.1MASCHINE Documentation (24)1.2Document Conventions (25)1.3New Features in MASCHINE 2.8 (26)1.4New Features in MASCHINE 2.7.10 (28)1.5New Features in MASCHINE 2.7.8 (29)1.6New Features in MASCHINE 2.7.7 (29)1.7New Features in MASCHINE 2.7.4 (31)1.8New Features in MASCHINE 2.7.3 (33)2Quick Reference (35)2.1MASCHINE Project Overview (35)2.1.1Sound Content (35)2.1.2Arrangement (37)2.2MASCHINE Hardware Overview (40)2.2.1MASCHINE MIKRO Hardware Overview (40)2.2.1.1Browser Section (41)2.2.1.2Edit Section (42)2.2.1.3Performance Section (43)2.2.1.4Transport Section (45)2.2.1.5Pad Section (46)2.2.1.6Rear Panel (50)2.3MASCHINE Software Overview (51)2.3.1Header (52)2.3.2Browser (54)2.3.3Arranger (56)2.3.4Control Area (59)2.3.5Pattern Editor (60)3Basic Concepts (62)3.1Important Names and Concepts (62)3.2Adjusting the MASCHINE User Interface (65)3.2.1Adjusting the Size of the Interface (65)3.2.2Switching between Ideas View and Song View (66)3.2.3Showing/Hiding the Browser (67)3.2.4Showing/Hiding the Control Lane (67)3.3Common Operations (68)3.3.1Adjusting Volume, Swing, and Tempo (68)3.3.2Undo/Redo (71)3.3.3Focusing on a Group or a Sound (73)3.3.4Switching Between the Master, Group, and Sound Level (77)3.3.5Navigating Channel Properties, Plug-ins, and Parameter Pages in the Control Area.773.3.6Navigating the Software Using the Controller (82)3.3.7Using Two or More Hardware Controllers (82)3.3.8Loading a Recent Project from the Controller (84)3.4Native Kontrol Standard (85)3.5Stand-Alone and Plug-in Mode (86)3.5.1Differences between Stand-Alone and Plug-in Mode (86)3.5.2Switching Instances (88)3.6Preferences (88)3.6.1Preferences – General Page (89)3.6.2Preferences – Audio Page (93)3.6.3Preferences – MIDI Page (95)3.6.4Preferences – Default Page (97)3.6.5Preferences – Library Page (101)3.6.6Preferences – Plug-ins Page (109)3.6.7Preferences – Hardware Page (114)3.6.8Preferences – Colors Page (114)3.7Integrating MASCHINE into a MIDI Setup (117)3.7.1Connecting External MIDI Equipment (117)3.7.2Sync to External MIDI Clock (117)3.7.3Send MIDI Clock (118)3.7.4Using MIDI Mode (119)3.8Syncing MASCHINE using Ableton Link (120)3.8.1Connecting to a Network (121)3.8.2Joining and Leaving a Link Session (121)4Browser (123)4.1Browser Basics (123)4.1.1The MASCHINE Library (123)4.1.2Browsing the Library vs. Browsing Your Hard Disks (124)4.2Searching and Loading Files from the Library (125)4.2.1Overview of the Library Pane (125)4.2.2Selecting or Loading a Product and Selecting a Bank from the Browser (128)4.2.3Selecting a Product Category, a Product, a Bank, and a Sub-Bank (133)4.2.3.1Selecting a Product Category, a Product, a Bank, and a Sub-Bank on theController (137)4.2.4Selecting a File Type (137)4.2.5Choosing Between Factory and User Content (138)4.2.6Selecting Type and Character Tags (138)4.2.7Performing a Text Search (142)4.2.8Loading a File from the Result List (143)4.3Additional Browsing Tools (148)4.3.1Loading the Selected Files Automatically (148)4.3.2Auditioning Instrument Presets (149)4.3.3Auditioning Samples (150)4.3.4Loading Groups with Patterns (150)4.3.5Loading Groups with Routing (151)4.3.6Displaying File Information (151)4.4Using Favorites in the Browser (152)4.5Editing the Files’ Tags and Properties (155)4.5.1Attribute Editor Basics (155)4.5.2The Bank Page (157)4.5.3The Types and Characters Pages (157)4.5.4The Properties Page (160)4.6Loading and Importing Files from Your File System (161)4.6.1Overview of the FILES Pane (161)4.6.2Using Favorites (163)4.6.3Using the Location Bar (164)4.6.4Navigating to Recent Locations (165)4.6.5Using the Result List (166)4.6.6Importing Files to the MASCHINE Library (169)4.7Locating Missing Samples (171)4.8Using Quick Browse (173)5Managing Sounds, Groups, and Your Project (175)5.1Overview of the Sounds, Groups, and Master (175)5.1.1The Sound, Group, and Master Channels (176)5.1.2Similarities and Differences in Handling Sounds and Groups (177)5.1.3Selecting Multiple Sounds or Groups (178)5.2Managing Sounds (181)5.2.1Loading Sounds (183)5.2.2Pre-listening to Sounds (184)5.2.3Renaming Sound Slots (185)5.2.4Changing the Sound’s Color (186)5.2.5Saving Sounds (187)5.2.6Copying and Pasting Sounds (189)5.2.7Moving Sounds (192)5.2.8Resetting Sound Slots (193)5.3Managing Groups (194)5.3.1Creating Groups (196)5.3.2Loading Groups (197)5.3.3Renaming Groups (198)5.3.4Changing the Group’s Color (199)5.3.5Saving Groups (200)5.3.6Copying and Pasting Groups (202)5.3.7Reordering Groups (206)5.3.8Deleting Groups (207)5.4Exporting MASCHINE Objects and Audio (208)5.4.1Saving a Group with its Samples (208)5.4.2Saving a Project with its Samples (210)5.4.3Exporting Audio (212)5.5Importing Third-Party File Formats (218)5.5.1Loading REX Files into Sound Slots (218)5.5.2Importing MPC Programs to Groups (219)6Playing on the Controller (223)6.1Adjusting the Pads (223)6.1.1The Pad View in the Software (223)6.1.2Choosing a Pad Input Mode (225)6.1.3Adjusting the Base Key (226)6.2Adjusting the Key, Choke, and Link Parameters for Multiple Sounds (227)6.3Playing Tools (229)6.3.1Mute and Solo (229)6.3.2Choke All Notes (233)6.3.3Groove (233)6.3.4Level, Tempo, Tune, and Groove Shortcuts on Your Controller (235)6.3.5Tap Tempo (235)6.4Performance Features (236)6.4.1Overview of the Perform Features (236)6.4.2Selecting a Scale and Creating Chords (239)6.4.3Scale and Chord Parameters (240)6.4.4Creating Arpeggios and Repeated Notes (253)6.4.5Swing on Note Repeat / Arp Output (257)6.5Using Lock Snapshots (257)6.5.1Creating a Lock Snapshot (257)7Working with Plug-ins (259)7.1Plug-in Overview (259)7.1.1Plug-in Basics (259)7.1.2First Plug-in Slot of Sounds: Choosing the Sound’s Role (263)7.1.3Loading, Removing, and Replacing a Plug-in (264)7.1.4Adjusting the Plug-in Parameters (270)7.1.5Bypassing Plug-in Slots (270)7.1.6Using Side-Chain (272)7.1.7Moving Plug-ins (272)7.1.8Alternative: the Plug-in Strip (273)7.1.9Saving and Recalling Plug-in Presets (273)7.1.9.1Saving Plug-in Presets (274)7.1.9.2Recalling Plug-in Presets (275)7.1.9.3Removing a Default Plug-in Preset (276)7.2The Sampler Plug-in (277)7.2.1Page 1: Voice Settings / Engine (279)7.2.2Page 2: Pitch / Envelope (281)7.2.3Page 3: FX / Filter (283)7.2.4Page 4: Modulation (285)7.2.5Page 5: LFO (286)7.2.6Page 6: Velocity / Modwheel (288)7.3Using Native Instruments and External Plug-ins (289)7.3.1Opening/Closing Plug-in Windows (289)7.3.2Using the VST/AU Plug-in Parameters (292)7.3.3Setting Up Your Own Parameter Pages (293)7.3.4Using VST/AU Plug-in Presets (298)7.3.5Multiple-Output Plug-ins and Multitimbral Plug-ins (300)8Using the Audio Plug-in (302)8.1Loading a Loop into the Audio Plug-in (306)8.2Editing Audio in the Audio Plug-in (307)8.3Using Loop Mode (308)8.4Using Gate Mode (310)9Using the Drumsynths (312)9.1Drumsynths – General Handling (313)9.1.1Engines: Many Different Drums per Drumsynth (313)9.1.2Common Parameter Organization (313)9.1.3Shared Parameters (316)9.1.4Various Velocity Responses (316)9.1.5Pitch Range, Tuning, and MIDI Notes (316)9.2The Kicks (317)9.2.1Kick – Sub (319)9.2.2Kick – Tronic (321)9.2.3Kick – Dusty (324)9.2.4Kick – Grit (325)9.2.5Kick – Rasper (328)9.2.6Kick – Snappy (329)9.2.7Kick – Bold (331)9.2.8Kick – Maple (333)9.2.9Kick – Push (334)9.3The Snares (336)9.3.1Snare – Volt (338)9.3.2Snare – Bit (340)9.3.3Snare – Pow (342)9.3.4Snare – Sharp (343)9.3.5Snare – Airy (345)9.3.6Snare – Vintage (347)9.3.7Snare – Chrome (349)9.3.8Snare – Iron (351)9.3.9Snare – Clap (353)9.3.10Snare – Breaker (355)9.4The Hi-hats (357)9.4.1Hi-hat – Silver (358)9.4.2Hi-hat – Circuit (360)9.4.3Hi-hat – Memory (362)9.4.4Hi-hat – Hybrid (364)9.4.5Creating a Pattern with Closed and Open Hi-hats (366)9.5The Toms (367)9.5.1Tom – Tronic (369)9.5.2Tom – Fractal (371)9.5.3Tom – Floor (375)9.5.4Tom – High (377)9.6The Percussions (378)9.6.1Percussion – Fractal (380)9.6.2Percussion – Kettle (383)9.6.3Percussion – Shaker (385)9.7The Cymbals (389)9.7.1Cymbal – Crash (391)9.7.2Cymbal – Ride (393)10Using the Bass Synth (396)10.1Bass Synth – General Handling (397)10.1.1Parameter Organization (397)10.1.2Bass Synth Parameters (399)11Working with Patterns (401)11.1Pattern Basics (401)11.1.1Pattern Editor Overview (402)11.1.2Navigating the Event Area (404)11.1.3Following the Playback Position in the Pattern (406)11.1.4Jumping to Another Playback Position in the Pattern (407)11.1.5Group View and Keyboard View (408)11.1.6Adjusting the Arrange Grid and the Pattern Length (410)11.1.7Adjusting the Step Grid and the Nudge Grid (413)11.2Recording Patterns in Real Time (416)11.2.1Recording Your Patterns Live (417)11.2.2Using the Metronome (419)11.2.3Recording with Count-in (420)11.3Recording Patterns with the Step Sequencer (422)11.3.1Step Mode Basics (422)11.3.2Editing Events in Step Mode (424)11.4Editing Events (425)11.4.1Editing Events with the Mouse: an Overview (425)11.4.2Creating Events/Notes (428)11.4.3Selecting Events/Notes (429)11.4.4Editing Selected Events/Notes (431)11.4.5Deleting Events/Notes (434)11.4.6Cut, Copy, and Paste Events/Notes (436)11.4.7Quantizing Events/Notes (439)11.4.8Quantization While Playing (441)11.4.9Doubling a Pattern (442)11.4.10Adding Variation to Patterns (442)11.5Recording and Editing Modulation (443)11.5.1Which Parameters Are Modulatable? (444)11.5.2Recording Modulation (446)11.5.3Creating and Editing Modulation in the Control Lane (447)11.6Creating MIDI Tracks from Scratch in MASCHINE (452)11.7Managing Patterns (454)11.7.1The Pattern Manager and Pattern Mode (455)11.7.2Selecting Patterns and Pattern Banks (456)11.7.3Creating Patterns (459)11.7.4Deleting Patterns (460)11.7.5Creating and Deleting Pattern Banks (461)11.7.6Naming Patterns (463)11.7.7Changing the Pattern’s Color (465)11.7.8Duplicating, Copying, and Pasting Patterns (466)11.7.9Moving Patterns (469)11.8Importing/Exporting Audio and MIDI to/from Patterns (470)11.8.1Exporting Audio from Patterns (470)11.8.2Exporting MIDI from Patterns (472)11.8.3Importing MIDI to Patterns (474)12Audio Routing, Remote Control, and Macro Controls (483)12.1Audio Routing in MASCHINE (484)12.1.1Sending External Audio to Sounds (485)12.1.2Configuring the Main Output of Sounds and Groups (489)12.1.3Setting Up Auxiliary Outputs for Sounds and Groups (494)12.1.4Configuring the Master and Cue Outputs of MASCHINE (497)12.1.5Mono Audio Inputs (502)12.1.5.1Configuring External Inputs for Sounds in Mix View (503)12.2Using MIDI Control and Host Automation (506)12.2.1Triggering Sounds via MIDI Notes (507)12.2.2Triggering Scenes via MIDI (513)12.2.3Controlling Parameters via MIDI and Host Automation (514)12.2.4Selecting VST/AU Plug-in Presets via MIDI Program Change (522)12.2.5Sending MIDI from Sounds (523)12.3Creating Custom Sets of Parameters with the Macro Controls (527)12.3.1Macro Control Overview (527)12.3.2Assigning Macro Controls Using the Software (528)13Controlling Your Mix (535)13.1Mix View Basics (535)13.1.1Switching between Arrange View and Mix View (535)13.1.2Mix View Elements (536)13.2The Mixer (537)13.2.1Displaying Groups vs. Displaying Sounds (539)13.2.2Adjusting the Mixer Layout (541)13.2.3Selecting Channel Strips (542)13.2.4Managing Your Channels in the Mixer (543)13.2.5Adjusting Settings in the Channel Strips (545)13.2.6Using the Cue Bus (549)13.3The Plug-in Chain (551)13.4The Plug-in Strip (552)13.4.1The Plug-in Header (554)13.4.2Panels for Drumsynths and Internal Effects (556)13.4.3Panel for the Sampler (557)13.4.4Custom Panels for Native Instruments Plug-ins (560)13.4.5Undocking a Plug-in Panel (Native Instruments and External Plug-ins Only) (564)14Using Effects (567)14.1Applying Effects to a Sound, a Group or the Master (567)14.1.1Adding an Effect (567)14.1.2Other Operations on Effects (574)14.1.3Using the Side-Chain Input (575)14.2Applying Effects to External Audio (578)14.2.1Step 1: Configure MASCHINE Audio Inputs (578)14.2.2Step 2: Set up a Sound to Receive the External Input (579)14.2.3Step 3: Load an Effect to Process an Input (579)14.3Creating a Send Effect (580)14.3.1Step 1: Set Up a Sound or Group as Send Effect (581)14.3.2Step 2: Route Audio to the Send Effect (583)14.3.3 A Few Notes on Send Effects (583)14.4Creating Multi-Effects (584)15Effect Reference (587)15.1Dynamics (588)15.1.1Compressor (588)15.1.2Gate (591)15.1.3Transient Master (594)15.1.4Limiter (596)15.1.5Maximizer (600)15.2Filtering Effects (603)15.2.1EQ (603)15.2.2Filter (605)15.2.3Cabinet (609)15.3Modulation Effects (611)15.3.1Chorus (611)15.3.2Flanger (612)15.3.3FM (613)15.3.4Freq Shifter (615)15.3.5Phaser (616)15.4Spatial and Reverb Effects (617)15.4.1Ice (617)15.4.2Metaverb (619)15.4.3Reflex (620)15.4.4Reverb (Legacy) (621)15.4.5Reverb (623)15.4.5.1Reverb Room (623)15.4.5.2Reverb Hall (626)15.4.5.3Plate Reverb (629)15.5Delays (630)15.5.1Beat Delay (630)15.5.2Grain Delay (632)15.5.3Grain Stretch (634)15.5.4Resochord (636)15.6Distortion Effects (638)15.6.1Distortion (638)15.6.2Lofi (640)15.6.3Saturator (641)15.7Perform FX (645)15.7.1Filter (646)15.7.2Flanger (648)15.7.3Burst Echo (650)15.7.4Reso Echo (653)15.7.5Ring (656)15.7.6Stutter (658)15.7.7Tremolo (661)15.7.8Scratcher (664)16Working with the Arranger (667)16.1Arranger Basics (667)16.1.1Navigating Song View (670)16.1.2Following the Playback Position in Your Project (672)16.1.3Performing with Scenes and Sections using the Pads (673)16.2Using Ideas View (677)16.2.1Scene Overview (677)16.2.2Creating Scenes (679)16.2.3Assigning and Removing Patterns (679)16.2.4Selecting Scenes (682)16.2.5Deleting Scenes (684)16.2.6Creating and Deleting Scene Banks (685)16.2.7Clearing Scenes (685)16.2.8Duplicating Scenes (685)16.2.9Reordering Scenes (687)16.2.10Making Scenes Unique (688)16.2.11Appending Scenes to Arrangement (689)16.2.12Naming Scenes (689)16.2.13Changing the Color of a Scene (690)16.3Using Song View (692)16.3.1Section Management Overview (692)16.3.2Creating Sections (694)16.3.3Assigning a Scene to a Section (695)16.3.4Selecting Sections and Section Banks (696)16.3.5Reorganizing Sections (700)16.3.6Adjusting the Length of a Section (702)16.3.6.1Adjusting the Length of a Section Using the Software (703)16.3.6.2Adjusting the Length of a Section Using the Controller (705)16.3.7Clearing a Pattern in Song View (705)16.3.8Duplicating Sections (705)16.3.8.1Making Sections Unique (707)16.3.9Removing Sections (707)16.3.10Renaming Scenes (708)16.3.11Clearing Sections (710)16.3.12Creating and Deleting Section Banks (710)16.3.13Working with Patterns in Song view (710)16.3.13.1Creating a Pattern in Song View (711)16.3.13.2Selecting a Pattern in Song View (711)16.3.13.3Clearing a Pattern in Song View (711)16.3.13.4Renaming a Pattern in Song View (711)16.3.13.5Coloring a Pattern in Song View (712)16.3.13.6Removing a Pattern in Song View (712)16.3.13.7Duplicating a Pattern in Song View (712)16.3.14Enabling Auto Length (713)16.3.15Looping (714)16.3.15.1Setting the Loop Range in the Software (714)16.3.15.2Activating or Deactivating a Loop Using the Controller (715)16.4Playing with Sections (715)16.4.1Jumping to another Playback Position in Your Project (716)16.5Triggering Sections or Scenes via MIDI (717)16.6The Arrange Grid (719)16.7Quick Grid (720)17Sampling and Sample Mapping (722)17.1Opening the Sample Editor (722)17.2Recording Audio (724)17.2.1Opening the Record Page (724)17.2.2Selecting the Source and the Recording Mode (725)17.2.3Arming, Starting, and Stopping the Recording (729)17.2.5Checking Your Recordings (731)17.2.6Location and Name of Your Recorded Samples (734)17.3Editing a Sample (735)17.3.1Using the Edit Page (735)17.3.2Audio Editing Functions (739)17.4Slicing a Sample (743)17.4.1Opening the Slice Page (743)17.4.2Adjusting the Slicing Settings (744)17.4.3Manually Adjusting Your Slices (746)17.4.4Applying the Slicing (750)17.5Mapping Samples to Zones (754)17.5.1Opening the Zone Page (754)17.5.2Zone Page Overview (755)17.5.3Selecting and Managing Zones in the Zone List (756)17.5.4Selecting and Editing Zones in the Map View (761)17.5.5Editing Zones in the Sample View (765)17.5.6Adjusting the Zone Settings (767)17.5.7Adding Samples to the Sample Map (770)18Appendix: Tips for Playing Live (772)18.1Preparations (772)18.1.1Focus on the Hardware (772)18.1.2Customize the Pads of the Hardware (772)18.1.3Check Your CPU Power Before Playing (772)18.1.4Name and Color Your Groups, Patterns, Sounds and Scenes (773)18.1.5Consider Using a Limiter on Your Master (773)18.1.6Hook Up Your Other Gear and Sync It with MIDI Clock (773)18.1.7Improvise (773)18.2Basic Techniques (773)18.2.1Use Mute and Solo (773)18.2.2Create Variations of Your Drum Patterns in the Step Sequencer (774)18.2.3Use Note Repeat (774)18.2.4Set Up Your Own Multi-effect Groups and Automate Them (774)18.3Special Tricks (774)18.3.1Changing Pattern Length for Variation (774)18.3.2Using Loops to Cycle Through Samples (775)18.3.3Load Long Audio Files and Play with the Start Point (775)19Troubleshooting (776)19.1Knowledge Base (776)19.2Technical Support (776)19.3Registration Support (777)19.4User Forum (777)20Glossary (778)Index (786)1Welcome to MASCHINEThank you for buying MASCHINE!MASCHINE is a groove production studio that implements the familiar working style of classi-cal groove boxes along with the advantages of a computer based system. MASCHINE is ideal for making music live, as well as in the studio. It’s the hands-on aspect of a dedicated instru-ment, the MASCHINE hardware controller, united with the advanced editing features of the MASCHINE software.Creating beats is often not very intuitive with a computer, but using the MASCHINE hardware controller to do it makes it easy and fun. You can tap in freely with the pads or use Note Re-peat to jam along. Alternatively, build your beats using the step sequencer just as in classic drum machines.Patterns can be intuitively combined and rearranged on the fly to form larger ideas. You can try out several different versions of a song without ever having to stop the music.Since you can integrate it into any sequencer that supports VST, AU, or AAX plug-ins, you can reap the benefits in almost any software setup, or use it as a stand-alone application. You can sample your own material, slice loops and rearrange them easily.However, MASCHINE is a lot more than an ordinary groovebox or sampler: it comes with an inspiring 7-gigabyte library, and a sophisticated, yet easy to use tag-based Browser to give you instant access to the sounds you are looking for.What’s more, MASCHINE provides lots of options for manipulating your sounds via internal ef-fects and other sound-shaping possibilities. You can also control external MIDI hardware and 3rd-party software with the MASCHINE hardware controller, while customizing the functions of the pads, knobs and buttons according to your needs utilizing the included Controller Editor application. We hope you enjoy this fantastic instrument as much as we do. Now let’s get go-ing!—The MASCHINE team at Native Instruments.MASCHINE Documentation1.1MASCHINE DocumentationNative Instruments provide many information sources regarding MASCHINE. The main docu-ments should be read in the following sequence:1.MASCHINE MIKRO Quick Start Guide: This animated online guide provides a practical ap-proach to help you learn the basic of MASCHINE MIKRO. The guide is available from theNative Instruments website: https:///maschine-mikro-quick-start/2.MASCHINE Manual (this document): The MASCHINE Manual provides you with a compre-hensive description of all MASCHINE software and hardware features.Additional documentation sources provide you with details on more specific topics:►Online Support Videos: You can find a number of support videos on The Official Native In-struments Support Channel under the following URL: https:///NIsupport-EN. We recommend that you follow along with these instructions while the respective ap-plication is running on your computer.Other Online Resources:If you are experiencing problems related to your Native Instruments product that the supplied documentation does not cover, there are several ways of getting help:▪Knowledge Base▪User Forum▪Technical Support▪Registration SupportYou will find more information on these subjects in the chapter Troubleshooting.Document Conventions1.2Document ConventionsThis section introduces you to the signage and text highlighting used in this manual. This man-ual uses particular formatting to point out special facts and to warn you of potential issues.The icons introducing these notes let you see what kind of information is to be expected:This document uses particular formatting to point out special facts and to warn you of poten-tial issues. The icons introducing the following notes let you see what kind of information canbe expected:Furthermore, the following formatting is used:▪Text appearing in (drop-down) menus (such as Open…, Save as… etc.) in the software andpaths to locations on your hard disk or other storage devices is printed in italics.▪Text appearing elsewhere (labels of buttons, controls, text next to checkboxes etc.) in thesoftware is printed in blue. Whenever you see this formatting applied, you will find thesame text appearing somewhere on the screen.▪Text appearing on the displays of the controller is printed in light grey. Whenever you seethis formatting applied, you will find the same text on a controller display.▪Text appearing on labels of the hardware controller is printed in orange. Whenever you seethis formatting applied, you will find the same text on the controller.▪Important names and concepts are printed in bold.▪References to keys on your computer’s keyboard you’ll find put in square brackets (e.g.,“Press [Shift] + [Enter]”).►Single instructions are introduced by this play button type arrow.→Results of actions are introduced by this smaller arrow.Naming ConventionThroughout the documentation we will refer to MASCHINE controller (or just controller) as the hardware controller and MASCHINE software as the software installed on your computer.The term “effect” will sometimes be abbreviated as “FX” when referring to elements in the MA-SCHINE software and hardware. These terms have the same meaning.Button Combinations and Shortcuts on Your ControllerMost instructions will use the “+” sign to indicate buttons (or buttons and pads) that must be pressed simultaneously, starting with the button indicated first. E.g., an instruction such as:“Press SHIFT + PLAY”means:1.Press and hold SHIFT.2.While holding SHIFT, press PLAY and release it.3.Release SHIFT.1.3New Features in MASCHINE2.8The following new features have been added to MASCHINE: Integration▪Browse on , create your own collections of loops and one-shots and send them directly to the MASCHINE browser.Improvements to the Browser▪Samples are now cataloged in separate Loops and One-shots tabs in the Browser.▪Previews of loops selected in the Browser will be played in sync with the current project.When a loop is selected with Prehear turned on, it will begin playing immediately in-sync with the project if transport is running. If a loop preview starts part-way through the loop, the loop will play once more for its full length to ensure you get to hear the entire loop once in context with your project.▪Filters and product selections will be remembered when switching between content types and Factory/User Libraries in the Browser.▪Browser content synchronization between multiple running instances. When running multi-ple instances of MASCHINE, either as Standalone and/or as a plug-in, updates to the Li-brary will be synced across the instances. For example, if you delete a sample from your User Library in one instance, the sample will no longer be present in the other instances.Similarly, if you save a preset in one instance, that preset will then be available in the oth-er instances, too.▪Edits made to samples in the Factory Libraries will be saved to the Standard User Directo-ry.For more information on these new features, refer to the following chapter ↑4, Browser. Improvements to the MASCHINE MIKRO MK3 Controller▪You can now set sample Start and End points using the controller. For more information refer to ↑17.3.1, Using the Edit Page.Improved Support for A-Series Keyboards▪When Browsing with A-Series keyboards, you can now jump quickly to the results list by holding SHIFT and pushing right on the 4D Encoder.▪When Browsing with A-Series keyboards, you can fast scroll through the Browser results list by holding SHIFT and twisting the 4D Encoder.▪Mute and Solo Sounds and Groups from A-Series keyboards. Sounds are muted in TRACK mode while Groups are muted in IDEAS.。
个体噪声计中文说明书
目录:
目录
第1章:介绍.................................................................................................................. 1
剂量测定............................................................................................................................. 1 噪声剂量计......................................................................................................................... 2 声音范围............................................................................................................................. 3 关于噪声标准的内容? ....................................................................................................... 3 Edge的应用........................................................................................................................ 4 噪声评定步骤..................................................................................................................... 5 Edge型号........................................................................................................................... 6 虚拟剂量计………………………………………………….…………………………………….………… 6
3GPP 5G基站(BS)R16版本一致性测试英文原版(3GPP TS 38.141-1)
4.2.2
BS type 1-H.................................................................................................................................................. 26
4.3
Base station classes............................................................................................................................................27
1 Scope.......................................................................................................................................................13
All rights reserved. UMTS™ is a Trade Mark of ETSI registered for the benefit of its members 3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners LTE™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM Association
综保使用说明书
ABB Network PartnerRelay Configuration Tool (4)Specification for RE_ 54_ Configurations (5)Editing the RE_ 54_ Relay Terminal Configurations (6)Getting started (6)Libraries (6)Logical POUs (7)Program Organisation Unit (POU) (7)Physical hardware (9)Configuration (10)Resource (11)Hardware version (11)Analogue channels (11)Binary inputs (16)Measurements (17)Condition monitoring (18)Tasks (19)Programs and tasks (19)Task interval (19)Global variables (20)Declaring variables (21)Variables declared as global (25)Compiling the project (28)Main Configuration Rules for RE_ 54_ (29)General (29)Binary inputs (29)Explicit feedback (30)Measurement function blocks (31)Warnings (31)Execution order (32)F-key (33)APPENDIX A (35)APPENDIX B............................................................................................ 37-50 APPENDIX C............................................................................................ 51-65About this manualThis guideline describes in general the procedures for configuring the REF 54_ feeder terminals or REM 543 machine terminals correctly with the Relay Configuration Tool. Furthermore, chapter 4 provides some practical tips as well as recommendations and restrictions for doing the configuration.Please note that the examples and dialogue pictures of the Relay Configuration Tool in this manual refer to REF 54_ feeder terminals.1.Relay Configuration ToolThe Relay Configuration Tool, which is a standard programming system for RED500devices, is used for configuring the protection, control, condition monitoring, measure-ment and logic functions of the feeder terminal. The tool is based on the IEC 1131-3standard, which defines the programming language for relay terminals, and includes thefull range of IEC features. The PLC logics are programmed with Boolean functions,timers, counters, comparators and flip-flops. The programming language described inthis manual is a function block diagram (FBD) language.2.Specification for RE_ 54_ ConfigurationsPrior to starting the configuration of a relay terminal, the Specification for Relay Con-figuration is to be filled out. The specification can be found as appendix B for REF 54_and appendix C for REM 543 in the end of this manual.The purpose of the specification is to provide the technical information required for theproper configuration of the relay terminals.3.Editing the RE_ 54_ Relay Terminal Configurations 3.1.Getting startedStart up the tool by double clicking the icon. After adding a new object as an empty con-figuration to the CAP505 environment (refer to the CAP505 Operator’s Manual, 1MRS750838-RUM), the program opens an empty project template (see figure below) with atoolbar at the top. The next step is to build the project tree structure by inserting librar-ies, program organisation units (POUs) and target specific items to the project tree.The project tree editor is a window in which the whole project is represented as a tree.The project tree is illustrated with several icons. Most of the icons represent a file of theproject and different looking icons represent different types of files. The tree alwayscontains 4 subtrees: Libraries, Data Types, Logical POUs and Physical Hardware.Fig. 3.1-1. The project tree with its four subtrees.The project tree is the main tool for editing the project structure. Editing the projectstructure means inserting POUs or worksheets to the project structure or deleting exist-ing ones. The editors for editing the data of the code bodies and the variable declarationcan be called by double clicking the corresponding object icons.If you intend to edit an old project, note that saving the changes made with the “save as”project unchanged, the project has to be saved with a new name before making anychanges.3.1.1.LibrariesBefore editing any worksheets of POUs, the whole project tree structure must be build.The function block library (protection, control, measurement, condition monitoring andstandard functions) needed in the relay configuration is to be inserted to the “Libraries”subtree.Before inserting the library to the project, all worksheets are to be closed; otherwise theI/O description of function blocks will be confused. The programs, function blocks (e.g.NOC3Low, the low set stage of non-directional three-phase overcurrent protection) andfunctions of the library can be reused in the new project, which is edited.The library, e.g. REFLIB01 for REF54_ (see the figure below), includes all availablefunction blocks. Therefore, attention is to be paid to which function blocks can be usedin a specific configuration. For example, if the protection library PR116005(1MRS116005) has been ordered, the auto-reclose function block AR5Func cannot beinserted to the project since AR5Func is not included in that library.Fig. 3.1.1.-1. Libraries for REF54_ and REM 543.3.1.2.Logical POUsIn the project tree editor and in the library editor, the “Logical POUs” subtree representsa directory for all POUs related to the project. The maximum of 20 POUs can beinserted to the subtree. The figure below shows a “Logical POUs” subtree with 6 POUs;“Measure”, “Prot_Me” and “Co_CM_A” represent FBD (Function Block Diagram)programs, and “Horizon”, “CONDIS” and “SWG” are FBD function blocks.Fig. 3.1.2.-1. “Logical POUs” subtree with 6 POUs.3.1.3.Program Organisation Unit (POU)Each Program Organisation Unit, a POU, consists of several worksheets: a POUdescription worksheet for comments, a variable worksheet for variable declarations anda code body worksheet for the relay configuration. The name of each worksheet is indi-cated beside the corresponding icon and the *-symbol after the name of a worksheetindicates that the worksheet has not been compiled yet.Fig. 3.1.3.-1. Program organisation unit with three worksheets.The description worksheet (e.g. ProtectT) illustrated below is for describing the POU or the configuration element. The worksheet is named by adding a ’T’ to the name of the POU.Fig. 3.1.3.-2. Description worksheet.The variable worksheet (e.g. ProtectV) is for the variable declaration. The worksheet is named by adding a ’V’ to the name of the POU.Fig. 3.1.3.-3. Variable declaration worksheet.A code body worksheet (e.g. Protect, Measure) is for a code body declaration in theform of an FBD, a Function Block Diagram. All configurations for relays of the RED500 platform are made in the graphical FBD language. A code body programmed in theFBD language is composed of functions and function blocks that are connected to eachother using variables or lines. An output of a function block can be connected to the out-put of another function block only via an OR gate (refer to section 4.1.)Fig. 3.1.3.-4. Code body declaration in FBD language.Even though the tool permits adding several graphical worksheets under one POU, onlyone worksheet is recommended to be used per POU. If more space is needed for a con-figuration, the worksheet size can be increased or, if more I/O points are required, thefunctionality can be divided to several POUs. Note that one POU has altogether 511 I/Opoints available for function blocks. For example, the function block NOC3High in thefigure above includes 15 I/O points, which means that there are still 496 I/O pointsavailable.3.1.4.Physical hardwareIn the project tree editor, the physical hardware is represented as a subtree (see below)after the hardware of the relay terminal, i.e. Configuration, Resource and Tasks, hasbeen defined.Fig. 3.1.4.-1. Example of a subtree for the physical hardware.The configuration elements available in the “Physical Hardware” subtree may differfrom configuration to configuration. Each terminal of the RED 500 platform can beconfigured separately.3.1.4.1.ConfigurationThe name and target of the configuration are first defined in the dialogue Properties/Configuration.Fig. 3.1.4.1.-1. Defining the configuration type.3.1.4.2.ResourceThe configuration “Conf” above is for the REF 543 resource (the selected processortype), which is defined in the dialogue Properties/Resource. The resource must also begiven a name.Fig. 3.1.4.2.-1. Defining the processor type.Hardware versionAfter selecting the processor type, click “Settings...” in the dialogue Properties/Resource (see figure above) to define the correct hardware version.Note! After selecting the correct hardware version (Relay Variant; see figure below), donot click OK but wait until the next dialogue opens and select “Analog Channels” (seefigure 3.1.4.2.-3.).Fig. 3.1.4.2.-2. Defining the hardware version.Analogue channelsIn the dialogue Settings/Analog Channels, click each channel in turn to select the meas-uring device and signal type for the channels used and select “Not in use” for otherchannels.Furthermore, the technical data and measurements for the selected channels are to becompleted correctly before the configuration is used in a real application.Fig. 3.1.4.2.-3. Defining the analogue channels.Technical dataFig. 3.1.4.2.-4. Defining the rated values for the selected channel.MeasurementsFor information about the special measurements required for each function block, refer to the Technical Descriptions of Functions (CD-ROM 1MRS 750889-MCD).Phase currents and voltagesIf the signal type selected for an analogue channel is to be shown in the MIMIC view via the MMIDATA_ function block (MIMIC dynamic data point), the true RMS mode must be selected in the “Special Measurements” dialogue. Moreover, in case the Inrush3 function block (3-phase transformer inrush and motor start-up current detector) is to be used, the 2nd harmonic restraint must be selected for the analogue channels (IL1, IL2, IL3) used.Fig. 3.1.4.2.-5. Selecting the required special measurement modes for phase current measurement.Neutral currentWhen e.g. the DEF2_ function block (directional earth-fault protection) is going to be used, intermittent earth-fault protection must be selected for the channel via which the current Io is measured. Unless intermittent earth-fault protection has been chosen, the following configuration error indication will appear on the display of the relay terminal ( # denotes the number of the analogue channel in question):System: SUPERVCh # errorFig. 3.1.4.2.-6. Selecting the required special measurement modes for neutral current measurement.FrequencyWhen, for example, any of the function blocks MEFR_ (system frequency measure-ment), SCVCSt_ or Freq1St_ is in use, frequency measurement must be selected for the channel via which the voltage is measured for frequency measurement (for example: Channel 10, Voltage Transformer 4, Signal type U3 / Measurements button in the “Con-figuration of REF543” dialogue).Fig. 3.1.4.2.-7. Selecting the required special measurement modes for frequency meas-urement.Virtual channelsIn case no measuring devices are applied for measuring residual voltage (Uo) and neu-tral current (Io), the virtual channels 11 and 12 must be used.Fig. 3.1.4.2.-8. Using virtual channels 11 and 12 in case no measuring devices are applied for measuring Io and Uo.In case of the virtual channel 12, voltage measuring devices must be associated with phase voltages.Fig. 3.1.4.2.-9. Associating voltage measuring devices with phase voltages.After a compiled configuration is downloaded to a relay and the relay is started (storing and resetting are done), it will internally check whether the analogue channels are cor-rectly configured regarding the analogue inputs of function blocks. If the connectedchannels have been configured incorretly, the ERR output signal of the specific function block goes active and the event E48 is sent. Furthermore, either the event E13 or E5 is sent depending on the function block in question.Binary inputsThe filter time is set for each binary input of the relay terminal via the resource settings dialogue “Binary Inputs”. Inversion of the inputs can also be set. For further informa-tion refer to the Technical Reference Manual of REF 54_ or REM 543.Fig. 3.1.4.2.-10. Defining the binary inputs.MeasurementsWhen the MEPE7 function block (power and energy measurement) is used, the measur-ing mode must be selected via the resource settings dialogue “Measurements”.Fig. 3.1.4.2.-11. Selecting the measuring mode for power and energy measurement.Condition monitoringValues for the circuit-breaker wear function blocks CMBWEAR 1 and 2 can be set via the resource settings dialogue “Condition Monitoring”.Fig. 3.1.4.2.-12. Setting the values for circuit-breaker wear.3.1.4.3.TasksPrograms and tasksPrograms are associated with tasks via the dialogues Properties/Task and Properties/Program. Cyclic tasks are activated within a specific time interval and the program isexecuted periodically.The two dialogues below illustrate the association of a program type (Prot_Me) with atask (Task1) (see also figure 3.1.4.-1. in section “Physical hardware”).Fig. 3.1.4.3.-1. Naming a cyclic task.Fig. 3.1.4.3.-2. Associating the selected task with the desired program type.Task intervalGenerally, the operation accuracy is increased when the task speed is increased, but atthe same time, the load of the microprocessors is increased as well. Although the taskspeed can be freely chosen with the tool, it is necessary to determine a maximum taskexecution interval for each function block; otherwise the operation accuracy and operatetimes for protection functions cannot be guaranteed. The maximum task executioninterval is based on test results and has also been used in the type testing of the functionblocks. The recommended task execution interval quaranteed by the manufactirer canbe found in section Technical Data in the technical description of each function block.According to the standard, the Relay Configuration Tool includes the possibility ofdefining the tasks on two different levels:1) each POU (= program organisation unit) can be tied to a separate task2) a separate function block inside a POU can be tied to any taskHowever, the alternative 2) is not yet supported in the RED environment, which meansthat if a separate function block inside a POU is given a separate task definition, it willbe ignored when transferred to the relay. This means that when the function blocks arebeing placed in different POUs, not only the category of the function (protection, con-trol, etc.) but also the maximum task execution interval should be considered since allfunction blocks inside a POU will run at the same speed.For further information about the microprocessor loads and task execution intervals offunction blocks refer to the manual “Technical Descriptions of Functions, Introduction”(CD-ROM: Technical Descriptions of Functions, 1MRS750889-MCD).The task execution interval for each task is defined via the dialogue Properties/Task(click “Settings...”). For example, the task execution interval for Task1 in figure belowis defined as 10 ms, which means that the program Prot_Me is run 100 times per onesecond.Fig. 3.1.4.3.-3. Setting the task execution interval for a program.3.2.Global variablesThe physical contacts of RE_ 54_ are defined in the “Global Variables” worksheet.Declarations for the physical contacts are automatically defined when the correct hard-ware version of RE_ 54_ is selected. Declarations for the analogue channels are createdafter the analogue channel settings defined in the resource settings dialogue have beenapproved.Fig. 3.2-1. Global Variables worksheet.3.3.Declaring variablesAt its beginning, each programmable controller POU type declaration is to contain atleast one declaration part that specifies the types of the variables used in the organisa-tion unit. The declaration part shall have the textual form of one of the keywordsV AR_INPUT, VAR_OUTPUT, V AR and V AR_EXTERNAL followed by one or moredeclarations separated by semicolons and terminated by the keyword END_V AR. Allthe comments you write must be edited in parentheses and asterisks.(**********************************)(*Variable declaration*)(*of REF 541*)(**********************************)Caution is required regarding comments and variable declarations. The following codeexample will be compiled successfully but because of the non-closed comment theEND_VAR - V AR_EXTERNAL couple will be excluded and thus the channel numbersbecome local variables of the POU and they get the initial value zero.V AR (*AUTOINSERT*)NOC3Low_1:NOC3Low; (* Erroneous nonclosed comment *END_VARV AR_EXTERNALU12:SINT;(* Measuring channel 8 *)U23:SINT;(* Measuring channel 9 *)U31:SINT;(* Measuring channel 10 *)END_VARThree examples of creating the textual declaration for different kinds of graphical pro-grams are given below.EXAMPLE 1.•POU type:FBD program •Function block type declaration: VARINPUT1:BOOL :=FALSEINPUT2:BOOL :=FALSEINPUT3:BOOL :=FALSEOUTPUT:BOOL :=FALSE END_VARFig. 3.3-1. Function block image.EXAMPLE 2.•POU type:NOC3Low, manufacturer dependent function block •Function block type declaration:V AR_INPUTIL1:SINT :=0;(* Analogue channel *)IL2:SINT :=0;(* Analogue channel *)IL3:SINT :=0;(* Analogue channel *)BS1:BOOL :=FALSE;(* Blocking signal *)BS2:BOOL :=FALSE;(* Blocking signal *)TRIGG:BOOL :=FALSE;(* Triggering *)GROUP:BOOL :=FALSE;(* Grp1/Grp2 select *)DOUBLE:BOOL :=FALSE;(* Doubling signal *)BSREG:BOOL :=FALSE;(* Blocking registering *)RESET:BOOL :=FALSE;(* Reset signal *)END_VARV AR_OUTPUTSTART:BOOL :=FALSE; (* Start signal *)TRIP:BOOL :=FALSE; (* Trip signal *)CBFP:BOOL :=FALSE; (* CBFP signal *)ERR:BOOL :=FALSE; (* Error signal *)END_VARFig. 3.3-2. Function block image of NOC3Low.EXAMPLE 3.•POU type:Configurer dependent FBD function block CONDIS •Function block type declaration:Fig. 3.3-3. Type declaration of the configurer made function block CONDIS.Fig. 3.3-4. Use of the configurer made function block CONDIS.Fig. 3.3-5. Contents of the CONDIS function block.In the example 3 above, part of the configuration has been separated to a configurermade function block called CONDIS. Such function blocks may not be given namesalready belonging to library functions blocks or IEC standard function blocks. Thefunction block CONDIS has been used like any other function block in the graphicalprogram. The order of inputs of a function block that has been inserted to a worksheetmay not be changed. It must also be remembered that a function block with an instancenamed by the configurer can only be inserted to the project once.3.4.Variables declared as globalThe range of validity of the declarations included in the declaration part shall be“local”to the POU in which the declaration part is contained. One exception to this rule are var-iables that have been declared to be “global”. Such variables are only accessible to aPOU via a V AR_EXTERNAL declaration. The type of a variable declared in aV AR_EXTERNAL block shall agree with the type declared in the V AR_GLOBALblock of the associated program, configuration or resource.Fig. 3.4-1. Local and global variables.The figure above illustrates the ways how values of variables can be communicated among software elements. Variable values within a program can be communicated directly by connecting the output of one program element to the input of another or via local variables such as the variable y illustrated in the upper left corner of the figure above. In the same configuration, variable values can be communicated between pro-grams via global variables such as the variable x illustrated in “Configuration C” in the figure above. In such a case, make sure that the global variable is only written from one location in the project. The global variable can still be read from several locations. Do not use binary inputs or outputs for data transfer between tasks.Despite the fact that according to the IEC standard 1131-3 all local variables that have no initial value are initially FALSE (0), the initial values for all local variables have to be given in the variable worksheet of the logical POU. This is because somewhere in the configuration, especially in the beginning of running the configuration i.e. when the relay is started up, the variable can be used before the initial value has been created for the variable. The initial values for global variables are given in the global variable worksheet (see CASE 1 below).CASE 1. Variables declarationV ARIABLE WORKSHEET of logical POU*********************************************************************V ARTRIPPING:BOOL:= FALSE;BLOCK:BOOL:= TRUE;TMP1:BOOL:= FALSE;END_VARV AR_EXTERNALPS1_4_HSPO1 :BOOL; (* Double pole high speed power output *)(* 4.1/10,11,12,13 *)PS1_4_HSPO2 :BOOL; (* Double pole high speed power output *)(* X4.1/15,16,17,18 *)PS1_4_HSPO3 :BOOL; (* Double pole high speed power output *)(* X4.1/6,7,8,9 *)END_VARV AR_EXTERNALTCS1_ALARM:BOOL;END_VAR********************************************************************* GLOBAL V ARIABLE WORKSHEET*********************************************************************V AR_GLOBALPS1_4_HSPO1AT %QX 1.1.2 :BOOL := FALSE;(* Double pole high speed power output X4.1/10,11,12,13 *) PS1_4_HSPO2AT %QX 1.2.2 :BOOL := FALSE;(* Double pole high speed power output X4.1/15,16,17,18 *) PS1_4_HSPO3AT %QX 1.3.2 :BOOL := FALSE;(* Double pole high speed power output X4.1/6,7,8,9 *) END_VARV AR_GLOBALTCS1_ALARM:BOOL:= FALSE;END_VAR*********************************************************************piling the projectThe “Build Project” mode in the “Make” menu is used to compile the whole project forthe first time after editing, which means compiling all POUs, global variables, resourcesetc., whereas the “Make” mode can be used to compile the worksheets that have beenedited. The changed worksheets are marked with an asterisk in the project tree editor.“Make” is the standard mode for compiling and should normally be used when you havefinished editing.In the Relay ConfigurationTool you can view the execution order of the different func-tions or function blocks in your worksheet. The execution order corresponds to theintermediate PLC code created while compiling. Note that the execution order can onlybe seen if you have already compiled the worksheet using the menu item “CompleteWorksheet” in the submenu “Make”.By editing the mwt.ini file, one can affect the execution order. The line below can beadded to section [MAKE]:SH_EXECUTION_ORDER_TOP_BOTTOMSets the order of execution of functions and function blocks in graphical editor0Sets the execution order from left to right1Sets the execution order from top to bottomThe default value is …0“. The execution order can only be changed when compiling aworksheet again.4.Main Configuration Rules for RE_ 54_4.1.General Make sure that all analogue signals are connected and all necessary inputs and outputs are wired. Note that the outputs of function blocks may not be connected together. There are also many other FBD programming rules to follow. One of the most typical rules is not to use the “wired-OR” connection. All signals that are connected to the same output signal (both output relays and horizontal communication outputs) must be connected via an OR-gate (see figure below).Fig. 4.1-1. Use of an explicit Boolean OR gate (on the right).4.2.Binary inputs Do not write binary inputs - like BIO2_7_BI2.Fig. 4.2-1. Writing global binary inputs is not allowed.Binary inputs can be read from several locations.I>I>>TRIP TRIP PS1_4_HSPO1PS1_4_HSPO1I>I>>TRIP TRIP PS1_4_HSPO1"wired-OR" structure is not allowed an explicit Boolean "OR" block is required instead ORFig. 4.2-2. Correct way of using global binary inputs.4.3.Explicit feedbackAn explicit feedback loop may not be used. In case the tool gives a warning about thefeedback loop after compiling, the loop must be broken up by connecting the input ofthe function block and the output of another function block separately to the auxiliaryvariable.Fig. 4.3-1. Explicit feedback loop is not allowed.Fig. 4.3-2. Explicit feedback via the auxiliary variable FEEDBACK.4.4.Measurement function blocksAll the measurement inputs of the function blocks must be connected. In case e.g. thethree-phase current measurement function block MECU3A is implemented by twophases of currents, one of the currents available must be connected to the remainingthird input of MECU3A. Unless something is connected to the third current input, thefunction block will attempt to use the sensor channel 1 instead of the empty channel,and if no measurements have been defined for channel 1, a supervision error will result.4.5.WarningsIn case of the indication “Warning: Instance ‘xx’ is never used” in connection with Array compilation, remove the corresponding instances of the function block from the varia-bles worksheet of the POU. The tool will not give a separate warning for unused varia-bles, which is why they need to be removed manually. When a global variable is addedto a sheet as a copy-paste -function, the global radio button has to be chosen (see figurebelow); otherwise the variable becomes a local variable of the POU, which is due to theauto-insert feature of the tool (global variable = V AR_EXTERNAL, local variable =V AR).Fig. 4.5-1. Copying a global variable to a worksheet of a POU.4.6.Execution orderCheck the execution order after the compilation. The connection of simple variables toeach other generates a code, the execution order of which in relation to the callingsequence of POUs cannot be seen by means of the Layout Execution Order function.Fig. 4.6-1. The INTERLOCKING variable is updated (TMP1) during the task executioncycle (see the execution order 1,2,3).In addition, the execution order may be illogical or even incorrect considering the func-tionality.Fig. 4.6-2. The explicit feedback (TMP1) delays the updating of the INTERLOCKINGvariable by one task execution cycle.If the MOVE function is used instead of direct connection, the execution order can beutilised in concluding whether the result is desirable.4.7.F-keyThe freely programmable F-key is declared as VAR_GLOBAL in the global variableworksheet as follows:F001V021:BOOL:=0;(* Free configuration point (F-key) *)The F-key parameter can be added to the configuration logic as an external variable(V AR_EXTERNAL). Similar parameters that can be inserted to a relay logic are listedbelow:F001V011:BOOL:=0;(*(W) Resetting of operation indications*)F001V012:BOOL:=0;(*(W) Resetting of operation indications & latched output signals*)F001V013:BOOL:=0;(*(*(W) Resetting of operation indications, latched output signals & wave-form memory*)*)F001V020:BOOL:=0;(*(W) Resetting of accumulated energy measurement*) F001V021:BOOL:=0;(’(R, W) Free configuration point (F-key)*)F002V004:BOOL:=0;(*(*(R, W) Control: Interlocking bypass mode for all control objects (Enables all)*)*)F002V005:USINT:=0;(*(W) Control: Recent control position*) F002V006:BOOL:=0;(*(W) Control: Virtual LON input poll status*)F900V251:BOOL:=0;(*(*(W) Control: Execute all command for selected objects (inside module)*)*)F900V252:BOOL:=0;(*(W) Control: Cancel all command for selected objects (inside module)*)F000V251:BOOL:=0;(*(*(W) Control: Execute all command for selected objects (inside module)*)*)F000V252:BOOL:=0;(*(W) Control: Cancel all command for selected objects (inside module)*)。
IND131_331使用说明书
直流型号 2.4.1.2.2 称重传感器 接线盒 2.4.1.3
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输入输出口(选件) 2.4.3.5 COM2/ (选件) 2.4.3.6 PLC
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导轨式 2.3.1 IND131 接线盒式 2.3.2 IND131
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2.4.1.5.1 COM2.............................................................................................14
C8051F060_07中文资料
• Programmable hysteresis/response time - Voltage Reference - Precision VDD Monitor/Brown-Out Detector On-Chip JTAG Debug & Boundary Scan - On-chip debug circuitry facilitates full-speed, nonintrusive in-circuit/in-system debugging Provides breakpoints, single-stepping, watchpoints, stack monitor; inspect/modify memory and registers Superior performance to emulation systems using ICE-chips, target pods, and sockets IEEE1149.1 compliant boundary scan Complete development kit
Clock Sources - Internal calibrated precision oscillator: 24.5 MHz - External oscillator: Crystal, RC, C, or clock Supply Voltage .......................... 2.7 to 3.6 V - Multiple power saving sleep and shutdown modes 100-Pin and 64-Pin TQFP Packages Available Temperature Range: -40 to +85 °C
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addhazard软件包说明说明书
Package‘addhazard’October12,2022Title Fit Additive Hazards Models for Survival AnalysisVersion1.1.0Date2017-03-20Description Contains tools tofit the additive hazards model to data from a cohort,random sampling,two-phase Bernoulli sampling and two-phasefinite population sampling,as well as calibration tool to incorporate phase I auxiliary information into thetwo-phase data modelfitting.This package provides regression parameter estimates andtheir model-based and robust standard errors.It also offers tools to make prediction ofindividual specific hazards.LazyData trueDepends R(>=3.3.1)Imports ahaz,survival,rootSolveRoxygenNote5.0.1License GPL-2NeedsCompilation noAuthor Jie(Kate)Hu[aut,cre],Norman Breslow[aut],Gary Chan[aut]Maintainer Jie(Kate)Hu<*******************>Repository CRANDate/Publication2017-03-2106:50:30UTCR topics documented:ah (2)ah.2ph (3)nwts2ph (5)nwts2ph.generate (6)nwtsco (7)predict.ah (8)predict.ah.2ph (9)Index1112ah ah Fit Additive Hazards Regression ModelsDescriptionFit a semiparametric additive hazard model’λ(t|Z=z)=λ0(t)+β z.The estimating procedures follow Lin&Ying(1994).Usageah(formula,data,robust,weights,ties,...)Argumentsformula a formula object for the regression model of the form response~predictors.The outcome is a survival object created by Surv.data a data frame.Input dataset.robust a logical variable.Robust standard errors are provided if robust==TRUE.weights a numeric vector.The weight of each observation.ties a logical variable.FALSE if there are no ties in the censored failure times....additional arguments to be passed to the low level regressionfitting functions. ValueAn object of class’ah’representing thefit.NoteThe response variable is a survival object.If there are ties in the survival time,in the current version we recommend users to break ties by adding a small random number to the survival time.An example is provided.The regression model can be univariate or multivariate.This package is built upon the function ahaz by Anders Gorst-Rasmussen.ReferencesLin,D.Y.&Ying,Z.(1994).Semiparametric analysis of the additive risk model.Biometrika;81:61-71.See Alsopredict.ah for prediction based onfitted ah model,nwtsco for the description of nwtsco datasetExampleslibrary(survival)###using the first100rows in nwtsco to build an additive hazards modelnwts<-nwtsco[1:100,]###fit the additive hazards model to the data###the model-based standard errors are reported when setting robust=FALSEfit1<-ah(Surv(trel,relaps)~age+instit,ties=FALSE,data=nwts,robust=FALSE) summary(fit1)###fit the additive hazards model to the data with robust standard errorsfit2<-ah(Surv(trel,relaps)~age+instit,ties=FALSE,data=nwts,robust=TRUE) summary(fit2)###when there are ties,break the ties firstnwts_all<-nwtsconwts_all$trel<-nwtsco$trel+runif(dim(nwts_all)[1],0,1)*1e-8fit3<-ah(Surv(trel,relaps)~age+instit,ties=FALSE,data=nwts_all,robust=TRUE) summary(fit3)ah.2ph Fit Additive Hazards Regression Models to Two-phase SamplingDescriptionThe functionfits a semiparametric additive hazards modelλ(t|Z=z)=λ0(t)+β z.to two-phase sampling data.The estimating procedures follow Hu(2014).Usageah.2ph(formula,data,R,Pi,ties,robust=FALSE,calibration.variables=NULL,...)Argumentsformula a formula object for the regression model of the form response~predictors.The outcome is a survival object created by Surv.data a data frame.Input dataset.R a phase II membership indicator.A vector of values of0and1.The subject is selected to phase II if R=1.Pi the probability of a subject to be selected to the phase II subsample.ties a logical variable.FALSE if there are no ties in the censored failure times.robust a logical variable.Robust standard errors are provided if robust=TRUE.calibration.variablesa vector of some column names of the data.These are the variables availablefor every observation.They are used to calibrate the weight assigned to eachsubject in order to improve estimation efficiency....additional arguments to be passed to the low level regressionfitting functions. ValueAn object of class’ah.2h’representing thefit.NoteThis function estimates both model-based and robust standard errors.It can be used to analyze case-cohort studies.It allows subsampling among cases.It can incorporate the calibration procedure and analyze the combined dataset of phase I and phase II samples.ReferencesJie Hu(2014)A Z-estimation System for Two-phase Sampling with Applications to Additive Haz-ards Models and Epidemiologic Studies.Dissertation,University of Washington.See Alsopredict.ah.2ph for prediction based onfitted additive hazards model with two-phase sampling and nwtsco for the description of nwtsco dataset.Exampleslibrary(survival)###fit an additive hazards model to two-phase sampling data without calibrationnwts2ph$trel<-nwts2ph$trel+runif(dim(nwts2ph)[1],0,1)*1e-8fit1<-ah.2ph(Surv(trel,relaps)~age+histol,ties=FALSE,data=nwts2ph,R=in.ph2,Pi=Pi, robust=FALSE,calibration.variables=NULL)summary(fit1)###fit an additve hazards model with calibration on agefit2<-ah.2ph(Surv(trel,relaps)~age+histol,ties=FALSE,data=nwts2ph,R=in.ph2,Pi=Pi, robust=FALSE,calibration.variables="age")summary(fit2)###calibrate on age square###note if users create a calibration variable,then###the new variable should be added to the original data framenwts2ph$age2<-nwts2ph$age^2fit3<-ah.2ph(Surv(trel,relaps)~age+histol,ties=FALSE,data=nwts2ph,R=in.ph2,Pi=Pi,robust=FALSE,calibration.variables="age2") summary(fit3)################################################################################When phase II samples are obtained by finite Sampling##########################################################################################nwts2ph5###calculating the sample size for each straum###calculate the strata sizestrt.size<-table(nwts2ph$strt)ph2.strt.size<-table(subset(nwts2ph,in.ph2==1)$strt)###fit an additve hazards model with finite stratified sampling###calculate the sampling fractionsfrac<-ph2.strt.size/strt.size###treating the problem as bernoulli sampling coupled with calibration on strata sizes ###using frac as the sampling probilitiesnwts2ph_by_FPSS<-nwts2phnwts2ph_by_FPSS$Pi<-NULLfor(i in1:length(strt.size)){nwts2ph_by_FPSS$Pi[nwts2ph_by_FPSS$strt==i]<-frac[i]}###create strt indicators,which become our calibration variablesfor(i in1:length(strt.size)){nwts2ph_by_FPSS$strt_ind<-as.numeric(nwts2ph_by_FPSS$strt==i)names(nwts2ph_by_FPSS)[ncol(nwts2ph_by_FPSS)]=paste0("strt",i)}###fit an additve hazards model with finate samplingfit4<-ah.2ph(Surv(trel,relaps)~age+histol,data=nwts2ph_by_FPSS,ties=FALSE,R=in.ph2,Pi=Pi,robust=FALSE,calibration.variables=c("strt1","strt2","strt3")) summary(fit4)nwts2ph An hypothetical two-phase sampling dataset based on nwtsco datasetfrom the National Wilms Tumor Study(NWTS)DescriptionAn hypothetical two-phase sampling dataset based on nwtsco dataset from the National Wilms Tumor Study(NWTS)Usagenwts2phFormatA data frame with3915rows and15variables:We create a hypothetical two-phase sampling(stratified sampling)dataset.In this dataset, only the subjects who have relapses and some of the controls have their samples sent to the central laboratory for more accurate histology examination.6nwts2ph.generate Institutional histology is examined in the local hospital.It is usually available for all the sam-ples.Central histology is more expensive to obtain since the samples have to be sent to the central laboratory and the work requires experienced lab scientists.It is reasonable to assume only some samples were tested for central histology.Following the two-phase sampling de-sign,we selected subjects for central histology measurements based on their outcomes and institutional histology results.trel Time to relapse or last date seen(yr),continuoustsur Time to death or last date seen(yr),continuousrelaps Indicator of relapse,0=Alive no prior relapse when last seen,1=Relapsed after trel years dead Indicator of death,0=Alive when last seen,1=Died after tsur yearsstudy NWTS study,3=NWTS-3,4=NWTS-4stage Stage of disease,1=I,2=II,3=III,4=IVhistol Central Path histology,0=Favorable(FH)and the subject is selected into the phase II subsample(in.ph2=1),1=Unfavorable(UH)and the subject is selected into the phase II subsample(in.ph2=1),NA=subject is NOT selected into the phase II subsample(in.ph2= 1)instit Institutional histology,0=Favorable(FH),1=Unfavorable(UH)age Age at diagnosis(yr),continuousyr Year of diagnosis,calendar yearspecwgt Weight of tumor bearing specimen,in grams(continuous)tumdiam Diameter of tumor,in centimeters(continuous)strt Strata,1=Unfavorable Institutional histology and no relapse,2=favorable Institutional his-tology and no relapse,3=relapsePi Sampling probability,0.5for strata=1,0.9for strata=2,0.9for strata=3in.ph2Phase II membership,1=selected into the phase II subsample,0=not selected into the phase II subsampleSourceThis dataset was created based on nwtsco dataset from the National Wilms Tumor Study(NWTS)nwts2ph.generate Thisfile genreate the example dataset nwts2ph importFrom("stats","rbinom")DescriptionThisfile genreate the example dataset nwts2ph importFrom("stats","rbinom")Usagenwts2ph.generate(data,seed=20)nwtsco7Argumentsdata the full cohort dataseed the random seed we use for generating this datasetnwtsco Dataset from the National Wilms Tumor Study(NWTS)DescriptionDataset from the National Wilms Tumor Study(NWTS)UsagenwtscoFormatA data frame with3915rows and12variables:trel Time to relapse orlast date seen(yr),continuoustsur Time to death or last date seen(yr),continuousrelaps Indicator of relapse,0=Alive no prior relapse when last seen,1=Relapsed after trel years dead Indicator of death,0=Alive when last seen,1=Died after tsur yearsstudy NWTS study,3=NWTS-3,4=NWTS-4stage Stage of disease,1=I,2=II,3=III,4=IVhistol Central Path histology,0=Favorable(FH),1=Unfavorable(UH)instit Institutional histology,0=Favorable(FH),1=Unfavorable(UH)age Age at diagnosis(yr),continuousyr Year of diagnosis,calendar yearspecwgt Weight of tumor bearing specimen,in grams(continuous)tumdiam Diameter of tumor,in centimeters(continuous)SourceOriginally used by M.Kulich and D.Y.Lin:Improving the efficiency of relative-risk estimation in case-cohort studies.J Amer Statis Assoc99:832-844,2004.8predict.ah predict.ah Prediction Based on the Fitted Additive Hazards ModelDescriptionThis function predicts a subject’s overall hazard rates at given time points based on this subject’s covariate values.The prediction function is an additive hazards modelfitted using ah.Usage##S3method for class ahpredict(object,newdata,newtime,...)Argumentsobject an object of class inhering from ah.newdata a dataframe of an individual’s predictors.newtime a given sequence of time points at which the prediction is performed.The time should be on the same scale as the survival time in Surv....further arguments passed to or from other methods.ValueA dataframe including the time points for prediction,predicted values and their standard errors. See Alsoah forfitting the additive hazards model,nwtsco for the description of nwtsco dataset Exampleslibrary(survival)###fit the additive hazards model to the datanwts<-nwtsco[1:100,]fit<-ah(Surv(trel,relaps)~age+instit,data=nwts,ties=FALSE,robust=FALSE)###see the covariate names in the prediction functionfit$call###the newdata should be a dataframe###the variable names are the same as the covariate names in###the prediction functionnewdata<-data.frame(age=60,instit=1)###an alternative way to give the newdatanewdata<-nwtsco[101,]###based on this subject s covariate values,the function predicts individual specific ###hazard rates at time points3and5predict(fit,newdata,newtime=c(3,5))predict.ah.2ph Prediction Based on the Additive Hazards Model Fitted from Two-phase SamplingDescriptionThis function predicts a subject’s overall hazard rates at given time points based on this subject’s covariate values.The prediction function is an object from ah.2ph.The estimating procedures follow Hu(2014).Usage##S3method for class ah.2phpredict(object,newdata,newtime,...)Argumentsobject an object of class inhering from’ah.2ph’.newdata a dataframe of an individual’s predictors.newtime a given sequence of time points at which the prediction is performed....further arguments passed to or from other methods.ValueA dataframe including the given time points,predicted hazards,their standard errors,their vari-ances,the phase I component of the variance for predicted hazards and the phase II component of the variance.ReferencesJie Hu(2014)A Z-estimation System for Two-phase Sampling with Applications to Additive Haz-ards Models and Epidemiologic Studies.Dissertation,University of Washington.See Alsoah.2ph forfitting the additive hazards model with two-phaseExampleslibrary(survival)###load datanwts<-nwtsco[1:100,]###create strata based on institutional histology and disease statusnwts$strt<-1+nwts$instit###add a stratum containing all(relapsed)casesnwts$strt[nwts$relaps==1]<-3###assign phase II subsampling probabilities###oversample unfavorable histology(instit=1)and cases###Pi=0.5for instit=0,Pi=1for instit=1and relaps=1nwts$Pi<-0.5*(nwts$strt==1)+1*(nwts$strt==2)+1*(nwts$strt==3)###generate phase II sampling indicatorsN<-dim(nwts)[1]nwts$in.ph2<-rbinom(N,1,nwts$Pi)###fit an additive hazards model to two-phase sampling data without calibrationfit1<-ah.2ph(Surv(trel,relaps)~age+histol,data=nwts,ties=FALSE,R=in.ph2,Pi=Pi,robust=FALSE)###input the new data for predictionnewdata<-nwtsco[101,]###based on the fitted model fit1,perform prediction at time points t=3and t=5 predict(fit1,newdata,newtime=c(3,5))###fit an additve hazards model to two-phase sampling data with calibration###The calibration variable is stagefit2<-ah.2ph(Surv(trel,relaps)~age+histol,data=nwts,R=in.ph2,Pi=Pi,ties=FALSE,robust=FALSE,calibration.variables="stage") ###based on the fitted model fit2,perform prediction at time points t=3and t=5 predict(fit2,newdata,newtime=c(3,5))##Not run:###The calibration variable is stage,when set robust=TRUEfit3<-ah.2ph(Surv(trel,relaps)~age+histol,data=nwts,R=in.ph2,Pi=Pi,ties=FALSE,robust=TRUE,calibration.variables="stage")###based on the fitted model fit2,perform prediction at time points t=3and t=5 predict(fit3,newdata,newtime=c(3,5))##End(Not run)Index∗datasetsnwts2ph,5nwtsco,7ah,2,2,8ah.2ph,3,9ahaz,2nwts2ph,5nwts2ph.generate,6nwtsco,2,4–6,7,8predict.ah,2,8predict.ah.2ph,4,9Surv,2,3,811。
faiss from_documents使用
faiss from_documents使用Faiss库是一个用于高效相似度搜索和稠密向量聚类的库。
它可以在大规模数据集上实现亚线性搜索速度。
Faiss提供了多种算法和数据结构,以适应不同的应用场景。
要使用Faiss库中的from_documents功能,您需要首先安装Faiss库并导入相关的模块。
然后,您需要准备一个文档列表,其中每个文档可以表示为一个向量。
接下来,您可以使用Faiss库中的from_documents函数来构建一个索引。
以下是一个简单的示例代码,演示如何使用Faiss库中的from_documents功能:pythonimport numpy as npfrom faiss import IndexFlatL2, IndexIVFFlatfrom faiss.contrib.datasets import make_random_vector_dataset# 生成随机数据集d = 64 # 特征维度nb = 100000 # 每个类别的样本数nc = 10 # 类别数np.random.seed(1234)xb = make_random_vector_dataset(nb, nc, d, 20) # 生成100000个样本,每个样本为64维向量# 使用Flat索引进行训练index = IndexFlatL2(d)index.add(xb) # 将数据添加到索引中# 使用IVF索引进行搜索index_ivf = IndexIVFFlat(index, 16, "sq8") # 构建IVF索引,使用平方距离量化,量化级别为16index_ivf.search(xb, 5) # 对每个样本进行搜索,返回最接近的5个样本的索引和距离在上述示例中,我们首先使用make_random_vector_dataset函数生成了一个随机数据集。
然后,我们使用IndexFlatL2类构建了一个Flat索引,并将数据添加到索引中。
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a r X i v :h e p -e x /0209070v 1 25 S e p 20021Measurements of αs from event shapes and the four–jet rate∗G.Dissertori aaInstitute for Particle Physics,ETH Z¨u rich,ETH H¨o nggerberg HPK E28,CH-8093Z¨u rich,SwitzerlandNew results from measurements of the strong coupling constant αs (M Z )at LEP are presented.In particular,a new LEP combination of results based on event–shape variables has become available,where a new method for the estimation of the theoretical uncertainty has been implemented.Furthermore,two other analyses are quoted,based on power corrections and the four-jet rate.1.IntroductionThe strong coupling constant αs is the only free parameter of the QCD Lagrangian and many measurement have been performed at various en-ergy scales in different processes in order to deter-mine it precisely [1].The measurements at LEP have contributed significantly to this effort.Two years after the closure of LEP still new results from QCD analyses become available [2].These results are based on data from LEP1,where the centre-of-mass energy was around 91GeV and the data sample consisted of several mil-lion events,practically background free,as well as from LEP2,with energies from 133GeV up to 206GeV.Here the data samples are much smaller,of the order of several thousand events,and the backgrounds (mainly fully hadronic W-pair events)can amount up to about 15%.In addition,at LEP2a special selection has to be applied in order to eliminate the so-called radia-tive return events ,where a hard photon is ra-diated in the initial state,reducing the effective centre-of-mass energy to the Z mass.This leads to a significant loss in statistics.Therefore the αs measurements at LEP2have a much larger statis-tical uncertainty.However,systematic uncertain-ties related to non-perturbative corrections or un-known higher order terms are reduced because of the larger energy scale.This motivates the combi-nation of all measurements performed by the four2by L →˜L=1s <2,the modified R matchingscheme is applied,the second degree modification is tested,the logarithmic terms are changed to L ′=ln(1/(x L y ))for 2/3≤x L ≤3/2,which in-troduces different subleading terms,and the kine-matic boundary y max is varied over a range given by the difference between NLO and parton shower predictions.The difference of the distributions thus obtained to the reference distribution de-fines an uncertainty band (Fig.1).In the next step again the reference prediction is taken,but now αs (M Z )is varied such that the changes in the prediction reproduce the spread given by the uncertainty band over the fit range.The neces-sary variations in αs (M Z )define the theoretical uncertainty.The LEPQCDWG has combined all measure-ments based on event–shape distributions at LEP1and LEP2for the six variables mentioned above.Correlations between variables,ener-gies and experiments have been taken into ac-count.The results are αs (M Z )=0.1197±0.0002stat ±0.0008exp ±0.0010had ±0.00480.0047theo for LEP1alone,αs (M Z )=0.1196±0.0005stat ±0.0010exp ±0.0007had ±0.00430.0044theo for LEP2alone,and αs (M Z )=0.1198±0.0003stat ±0.0009exp ±0.0008had ±0.0046theo for all LEP energies com-bined (including measurements at an effective centre-of-mass energy below M Z ,obtained by3selecting events with hard initial state radia-tion).Excellent consistency between the LEP1and LEP2measurements is found.Taking the individual measurements at the various energy points,perfect agreement with the expectedrun-ning of the strong coupling is observed (Fig.2).E CM [GeV ]αS (E C M )0.080.090.10.110.120.130.140.15Figure bined measurements of αs from event–shape variables at different LEP energies,compared to the expected running.In an analysis by DELPHI the energy depen-dence of the mean values of event–shape variables has been analysed [5],but now the hadronization corrections are replaced by a power law as pro-posed in [6].It results in a rather precise de-termination of αs (M Z )=0.1184±0.0033tot .A more detailed discussion of power law studies can be found in [7].3.Four–jet rateRecently,the ALEPH collaboration has pub-lished a new determination of αs [8],based on a measurement of the four-jet rate (Durham al-gorithm)at LEP1.The difference to the event–shape variables is that here the perturbative ex-pansion starts at O (α2s ).The full NLO correc-tions are known,as well as the resummation of NLL terms [9].The quoted result is extremely precise,namely αs (M Z )=0.1170±0.0001stat ±0.0009exp ±0.0003had ±0.0008theo .This is mainly due to the larger sensitivity,since the leading term is of O (α2s ).It is observed that although the χ2of the fit changes substantially when varying the renormalization scale over a wide range,and also the location of the sharp minimum in this χ2varies after changes in the fitted prediction,the actually fitted αs (M Z )value remains remarkably stable.4.SummaryNew combined results for measurements of αs (M Z )at LEP have been presented,based on event–shape distributions and a new prescription for the theoretical uncertainty.Furthermore,it has turned out that the measurement of the four-jet rate at LEP allows for a very precise determi-nation of αs (M Z ).5.AcknowledgementsI would like to thank the members of the LEP-QCDWG for providing me with the relevant num-bers and plots.REFERENCES1.S.Bethke,J.Phys.G26(2000)R27.2.ALEPH Collab.,Note 2002-012CONF 2002-002,ICHEP02abs296;L3Collab.,Phys.Lett.B536(2002)217;DELPHI Collab.,Note 2002-050-CONF-584,ICHEP02abs229;OPAL Collab.,Note PN512,ICHEP02abs368;Note PN473,ICHEP02abs370.3. A.Banfiet al.,JHEP 0201(2002)018.4.S.Catani et al.,Nucl.Phys.,B407(1993)3.5.DELPHI Collab.,Note 2002-050-CONF-584,ICHEP02abs229.6.Yu.L.Dokshitzer and B.R.Webber,Phys.Lett.B352(1995)451.7.P.A.Movilla Fernandez,these proceedings.8.ALEPH Collab.,CERN-EP-2002-029,ac-cepted for publication in Eur.Phys.J.C .49.Z.Nagy and Z.Tr´o cs´a nyi,Phys.Rev.Lett.79(1997)3604;Phys.Rev.D59(1999)014020;L.J.Dixon and A.Signer,Phys.Rev.Lett.78 (1997)811.。