HDMI2012F2SF-900T04

4.Specification
TAI-TECH Part Number
Common mode Impedance (£[)
Test
Frequency (MHz)
DC Resistance (£[) max.
Rated Current
(mA)
Rated Volt. (Vdc) Withstand Volt. (Vdc) IR (£[) min.
HDMI2012F2SF-900T04 90 typ.
65 min.
100
0.30
400
50
125
10M
A: Series
B: Dimension
C: Material Ferrite D: Number of Lines 2=2 lines
E: Type
S=One Circuit Type , N=Unshielded F: Lead free
G: Impedance 900=90£[
H: Packaging T=Taping and Reel, B=Bulk
I: Rated Current 04=400mA
TDR TEST Intra Pair Skew Test
Eye Digram Graphic Test Insertion Loss Test
Item Performance Test Condition
Reliability Test
High Temperature Life Test
Temperature:85¡Ó5¢J
Time:500¡Ó
12hr. Recovery: 4 to 24hrs of recovery under the
standard condition after the removal from test chamber.
Low Temperature Life Test
Temperature:-40¡Ó5¢J
Time: 500¡Ó
12hr. Recovery: 4 to 24hrs of recovery under the
standard condition after the removal from test chamber. Thermal Shock
Conditions of 1 cycle Total:10 cycle
Recovery: 4 to 24hrs of recovery under the
standard condition after the removal from test chamber.
Step Temperature(¢J ) Times(min.)1 -40¡Ó3 30¡Ó3
2 Room Temperature Within
3 3 85¡Ó3 30¡Ó3
4 Room Temperature Within 3 Humidity Resistance
1. Appearance:No damage.
2. Impedance:within ¡Ó25% of initial value. No disconnection or short circuit.
Temperature:40¡Ó
5¢J Humidity:90 to 95%
Applied current:Rated current
Time:500¡Ó
12hr. Recovery:4 to 24hrs of recovery under the
standard condition after the removal from test chamber.
Random Vibration Test
Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within¡Ó30%
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Directions and times: X, Y , Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
7.Soldering and Mounting
7-2. Soldering
7-2.1 Lead Free Solder re-flow:
7-2.2 Solder Wave:
7-2.3 Soldering Iron(Figure 3):
PC board should be designed so that products are not sufficient under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
Recommended temperature profiles for re-flow soldering in Figure 1.
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2.
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended.
Note ¡G¡E Preheat circuit and products to 150¢J ¡E Never contact the ceramic with the iron tip
¡E Use a 20 watt soldering iron with tip diameter of 1.0mm
¡E 280¢J tip temperature (max) ¡E 1.0mm tip diameter (max)
¡E Limit soldering time to 3 sec.
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
8-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp.
(¢J )
Room Humidity
(%)
Room atm (hPa)
Tearing Speed mm/min
5~35 45~85 860~1060 300
Chip size
Chip/Reel Inner Box Middle Box Carton
HDMI2012F2S
2000 10000 50000 100000
Sample Description :Style/Item No.
:Sample Receiving Date :Testing Period
:
===============================================================================
Test Requested
:
Test Method :
(1)(2)(3)(4)(5)
Test Result(s)
:
TAI-TECH ADVANCED ELECTRONICS CO.,LTD.
NO.1,YOU 4TH ROAD,YOUTH INDUSTRIAL DISTRICT,YANG-MEI,TAO-YUAN HSIEN.TAIWAN R.O.C
2007/2/9TO 2007/02/16
WCM,HDMI,DVI SERIES The following sample(s)was/were submitted and identified by/on behalf of the client as :WCM,HDMI,DVI SERIES Determination of Mercury by ICP-AES.
Determination of Hexavalent Chromium for non-metallic samples by UV/Vis Spectrometry.
Determination of PBB and PBDE by GC/MS.
Please refer to next page(s).
Test Report
No.:CE/2007/22446Date :2007/02/16Page :1of 42007/2/9
In accordance with the RoHS Directive 2002/95/EC,and its amendment directives.
*CE/2007/22446*
Determination of Cadmium by ICP-AES.Determination of Lead by ICP-AES.With reference to IEC 62321,Ed.1111/54/CDV
Procedures for the Determination of Levels of Regulated Substances in Electrotechnical
Products.
Result No.1(1)n.d.2(2)63.32
(3)n.d.2(4)
n.d.2n.d.-n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.-n.d.5n.d.
5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.5n.d.
-
(5)
Test Report
No.:CE/2007/22446Date :2007/02/16Page :2of 4TAI-TECH ADVANCED ELECTRONICS CO.,LTD.
*CE/2007/22446*
NO.1,YOU 4TH ROAD,YOUTH INDUSTRIAL DISTRICT,YANG-MEI,TAO-YUAN HSIEN.TAIWAN R.O.C Decabromobiphenyl
Sum of PBDEs (Mono to Nona)(Note 4)Monobromobiphenyl ether Dibromobiphenyl ether Tribromobiphenyl ether Hexabromobiphenyl ether Heptabromobiphenyl ether Octabromobiphenyl ether Nonabromobiphenyl ether Decabromobiphenyl ether
Sum of PBDEs (Mono to Deca)Test Item (s):
Cadmium (Cd)Lead (Pb)Mercury (Hg)
Hexavalent Chromium Cr(VI)by alkaline extraction
Sum of PBBs
Monobromobiphenyl Dibromobiphenyl Tribromobiphenyl TEST PART DESCRIPTION:Method (Refer to)
Test results by chemical method (Unit:mg/kg)
Pentabromobiphenyl ether Nonabromobiphenyl Tetrabromobiphenyl Pentabromobiphenyl Hexabromobiphenyl Heptabromobiphenyl MDL Note ：1.mg/kg =ppm
5."-"=Not Regulated
2.n.d.=Not Detected
3.MDL =Method Detection Limit
4.According to 2005/717/EC DecaBDE is exempt.NO.1:MIXED ALL PARTS
Octabromobiphenyl Tetrabromobiphenyl ether
No.:CE/2007/22446Date :2007/02/16Page :3of 4TAI-TECH ADVANCED ELECTRONICS CO.,LTD.
*CE/2007/22446*
NO.1,YOU 4TH ROAD,YOUTH INDUSTRIAL DISTRICT,YANG-MEI,TAO-YUAN HSIEN.TAIWAN R.O.C
Test Report
Method 1:Flow Chart of Digestion for Cd 、Pb analysis
1)These samples were dissolved totally by pre-conditioning method according to below flow
chart.
2)Name of the person who made measurement:Troy Chang 3)Name of the person in charge of measurement:Daniel Yeh
NO.1,YOU 4TH ROAD,YOUTH INDUSTRIAL DISTRICT,YANG-MEI,TAO-YUAN HSIEN.TAIWAN R.O.C
Test Report
No.:CE/2007/22446Date :2007/02/16Page :4of 4TAI-TECH ADVANCED ELECTRONICS CO.,LTD.
*CE/2007/22446*
**End of Report
**。