Cooling system for devices having power semiconduc
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
专利名称：Cooling system for devices having power
semiconductors and method for cooling the
device
发明人：Gerold Gruendler,Juergen Hoegerl,Volker
Strutz,Erick Syri
申请号：US10598285
申请日：20050222
公开号：US07688592B2
公开日：
20100330
专利内容由知识产权出版社提供
专利附图：
摘要：A cooling system for devices having power semiconductors and a method for
cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.
申请人：Gerold Gruendler,Juergen Hoegerl,Volker Strutz,Erick Syri
地址：Regensburg DE,Regensburg DE,Tegernheim DE,Wenzenbach DE
国籍：DE,DE,DE,DE
代理机构：Dicke, Billig & Czaja, PLLC
更多信息请下载全文后查看。