CC0805KKX7R8BB105中文资料

合集下载

禾伸堂HEC贴片电容型号规格080、120六、1210、180八、181二、2220等系列简介

简介
随着电子产品制造水平的提升和系统性能需求愈来愈苛刻，系统厂商的工程师和采购人员对电容器的性能提出了新的要求。

在工业、电源等应用中，系统厂商对高容量、低ESR、小体积的电容器的需求加倍迫切，而在汽车、军工和航空航天等应用中，那么对电容器寿命、耐压、靠得住性等提出了更高的要求。

禾伸堂 HEC 推出的中高压系列产品迎合了市场需求，知足了不断提出来的新要求。

那么很多人就会问，禾伸堂 HEC贴片
电容的型号规格？下面小编就来帮忙大伙儿回答禾伸堂 HEC贴片电容的型号规格?
们向您推荐深圳市兴鸿宇科技，该公司作为电子元器件专业代理和分销商，技术支持，售后效劳是他们在市
场中立于不败之地的有力保证。

必然会给您在产品分类、信息、参数方面以科学准确的信息，为您的购买提
供专门大帮忙。

VFCP0805中文资料

Document Number: 63106For any questions, contact: foil@VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)Vishay Foil ResistorsUltra High Precision Z-Foil Flip Chip Resistor with TCRof ± 0.05 ppm/°C, 35 % Space Saving versusWraparound Design and PCR of 5 ppm at Rated PowerI MP R O V E D P R O D UC Any value at tolerance available within resistance rangeINTRODUCTIONOne of the most important parameters influencing stability is the Temperature Coefficient of Resistance (TCR). Although the TCR of Bulk Metal ® Foil resistors is considered extremely low, this characteristic has been further refined over the years.The VFCP Series utilizes ultra precision Bulk Metal ® Z-Foil.The Z-Foil technology provides a significant reduction to the resistive element’s sensitivity to ambient temperaturevariations (TCR) and to self heating when power is applied (power coefficient).Along with the inherently low PCR and TCR, Z-Foil technology also provides remarkably improved load life stablility, low noise and availability of tight tolerance.The Flip Chip configuration provides a substantial PCB space saving of more than 35 % vs. a surface mount chip with wraparound terminations. The VFCP is available in any value within the specified resistance range.Our Application Engineering Department is available to advise and make recommendations. For non-standard technical requirements and special applications, please contact us.FEATURES•Temperature Coefficient of Resistance (TCR):± 0.05 ppm/°C typical (0 °C to + 60 °C)± 0.2 ppm/°C typical (- 55 °C to + 125 °C, +25 °C Ref.)•Tolerance: to ± 0.01 % (100 ppm) •Power Coefficient “ΔR due to self heating”5 ppm at Rated Power•Load Life Stability (70 °C for 2000 hours): ± 0.005 % (50 ppm)•Power Rating to: 600 mW at + 70 °C•Electrostatic Discharge (ESD) above 25 000 V•Resistance Range: 10Ω to 150 k Ω (for lower and higher values, please contact us)•Non Inductive, Non Capacitive Design •Short time overload ≤ 0.005 % (50 ppm)•Non hot spot design•Rise time: 1ns without ringing •Current Noise: - 40 dB•Voltage Coefficient < 0.1 ppm/V •Non Inductive: < 0.08 µH•Terminal Finishes available:Lead (Pb)-freeTin/Lead Alloy•Matched sets are available per request•Any value available within resistance range (e.g. 1K2345)•Prototype samples available from 48 hours. For more information, please contact foil@ •For better performances please contact usAPPLICATIONS•Automatic Test Equipment (ATE)•High Precision Instrumentation •Laboratory, Industrial and Medical •Audio•EB Applications (electron beam scanning and recording equipment, electron microscopes)•Military and Space •Airborne•Down Hole instrumentation •Communication* Pb containing terminations are not RoHS compliant, exemptions may apply TABLE 1 - TOLERANCE AND TCR VSRESISTANCE VALUERESISTANCEVALUE(Ω)TOLERANCE(%)TYPICAL TCR AND MAX. SPREAD (- 55 °C to + 125 °C,+ 25 °C Ref.)250 to 150K± 0.01± 0.2 ± 1.6100 to < 250± 0.02± 0.2 ± 1.650 to < 100± 0.05± 0.2 ± 1.825 to < 50± 0.1± 0.2 ± 2.810 to < 25± 0.25± 0.2 ± 2.8Bottom ViewRoHS*COMPLIANTVFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)Vishay Foil Resistors Ultra High Precision Z-Foil Flip Chip Resistor with TCRof ± 0.05 ppm/°C, 35 % Space Saving versusWraparound Design and PCR of 5 ppm at Rated Power For any questions, contact: foil@Document Number: 63106I M P R O V E D P R Note• For VFCP0805, VFCP1506, VFCP2010 and VFCP2512 DSCC Drawings, please contact foil@Note1.As shown + 0.01 W to allow for measurement errors at low values.TABLE 2 -DSCC SPECIFICATIONS (Vishay resistors are listed on the following DSCC specifications)MODEL DSCC MIL SPEC VFCP12062009MIL-PRF-55342TABLE 3 - SPECIFICATIONSCHIP SIZE RATED POWER (mW)at + 70 °C MAXIMUM VOLTAGE RATING (≤)RESISTANCERANGE (Ω)MAXIMUMWEIGHT(mg)0805100 mW34 V10 to 12K5.21206250 mW 86 V 10 to 30K 10.31506300 mW 109 V 10 to 40K122010400 mW200 V10 to 100K 252512600 mW 220 V10 to 150K35P R ×TABLE 4 - LOAD LIFE STABILITY(+ 70 °C FOR 2000 HOURS)CHIP SIZE MAXIMUM ΔR LIMITS0805± 0.005 % at 50 mW ± 0.01 % at 100 mW1206± 0.005 % at 150 mW ± 0.01 % at 250 mW 1506± 0.005 % at 150 mW ± 0.01 % at 300 mW 2010± 0.005 % at 200mW ± 0.01 % at 400 mW2512± 0.005 % at 500 mW ± 0.01 % at 600 mWTABLE 5 - PERFORMANCESTEST OR CONDITIONMIL-PRF-55342CHARACTERISTIC EΔR LIMITSTYPICAL ΔR LIMITS MAXIMUM ΔR LIMITS 1)Thermal Shock ± 0.1 %± 0.005 % (50 ppm)± 0.01 % (100 ppm)Low T emperature Operation ± 0.1 %± 0.005 % (50 ppm)± 0.01 % (100 ppm)Short Time Overload± 0.1 %± 0.005 % (50 ppm)± 0.01 % (100 ppm)High Temperature Exposure ± 0.1 %± 0.01 % (100 ppm)± 0.02 % (200 ppm)Resistance to Soldering Heat ± 0.2 %± 0.005 % (50 ppm)± 0.015 % (150 ppm)Moisture Resistance± 0.2 %± 0.005 % (50 ppm)± 0.02 % (200 ppm)Load Life Stability + 70 °C for 2000 hours at Rated Power± 0.5 %± 0.005 % (50 ppm)± 0.01 % (100 ppm)Document Number: 63106For any questions, contact: foil@VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)Ultra High Precision Z-Foil Flip Chip Resistor with TCR of ± 0.05 ppm/°C, 35 % Space Saving versusWraparound Design and PCR of 5 ppm at Rated PowerVishay Foil ResistorsI Mnd Pattern Dimensions are per IPC-782Note•The TCR values for < 100Ω are influenced by the termination composition and result in deviation from this curveVFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)Vishay Foil Resistors Ultra High Precision Z-Foil Flip Chip Resistor with TCRof ± 0.05 ppm/°C, 35 % Space Saving versusWraparound Design and PCR of 5 ppm at Rated Power For any questions, contact: foil@Document Number: 63106I M P R O V E D P R O D U C TNote* For non-standard requests, please contact Application Engineering.TABLE 7 - GLOBAL PART NUMBER INFORMATIONNEW GLOBAL PART NUMBER:Y162910K0000T9W (preferred part number format)DENOTES PRECISIONVALUE AER*YR = ΩK = k Ω0 = Standard9 = Lead (Pb)-free 1 - 999 = CustomPRODUCT CODERESISTANCE TOLERANCEPACKAGING1629 = VFCP08051630 = VFCP12061631 = VFCP15061632 = VFCP20101633 = VFCP2512T = ± 0.01 %Q = ± 0.02 %A = ± 0.05 %B = ± 0.10 %C = ± 0.25 %D = ± 0.50 %F = ± 1.00 %R = Tape and Reel W = Waffle PackFOR EXAMPLE: ABOVE GLOBAL ORDER Y1629 10K0000 T 9 W:TYPE: VFCP0805VALUE: 10.0 k ΩABSOLUTE TOLERANCE: ± 0.01 %TERMINATION: Lead (Pb)-free PACKAGING: Waffle PackHISTORICAL PART NUMBER:VFCP080510K000TCR0.2T S W (will continue to be used)VFCP080510K000TCR0.2TSWMODELOHMIC VALUETCRRESISTANCE TOLERANCE TERMINATIONPACKAGINGVFCP0805VFCP1206VFCP1506VFCP2010VFCP251210.0 k ΩCharacteristicT = ± 0.01 %Q = ± 0.02 %A = ± 0.05 %B = ± 0.10 %C = ± 0.25 %D = ± 0.50 %F = ± 1.00 %S = Lead (Pb)-free B = Tin/LeadT = Tape and Reel W = Waffle Pack6291KY1T9WDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

国网单相通道板(TCC)V1.00.21(20130801)物料对照表

50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 40 40 红绿
3μ H/1.5A(CECL914788) 3μ H/1.5A P6KE22CA MPB104K300VAC TC-X-05 2.54双排单塑插针2*4P/180度 /L=11.1/2.6(空3-6) 2.54双排单塑排针2*6P/180度 /L=11.1/2.6(11.6-3、4)/带定位柱 100uF/10V YXF(脚距2.5mm) 421C49 421C49(无锡汉兴) 10MHZ LT421AW
厦门元顺微电子技术有限公司上海贝岭上海宇声青岛佳诺
青岛众和鑫电子有限公司
刘玉博朱承骅王豪杰王珊珊
曹爱玲
13801864432 15866830818 18663952133 13969660839
18661618286 13589386539 13823539651 13589386539
物料号-新
023301999030 0003010003 0003010005 0003010006
物料版本号
4 5 3 4 5 6 7 8 9 10 11
手插电感手插二极管手插安规电容手插变压器手插插针手插插针手插电解手插鉴频器手插晶振手插滤波器手插中周
2 1 1 1 1 1 1
邢界伟
13823539651 13589386539 13823539651 18561378788
张素梅
邢界伟
李伟杨恒纪海建
潘贵荣潘贵荣李明陈锋李爱明是立佩董秀娟李爱明是立佩张素梅

CC芯片介绍

CC2530芯片资料CC2530是专门针对IEEE 802.15.4和Zigbee应用的单芯片解决方案，经济且低功耗。

CC2530有四种不同的版本：CC2530-F32 / 64 / 128 / 256。

分别带有32 / 64 / 128 / 256 KB的闪存空间；它整合了全集成的高效射频收发机及业界标准的增强型8051微控制器，8 KB的RAM和其他强大的支持功能和外设。

主要特点：●高达256kB的闪存和20kB的擦除周期，以支持无线更新和大型应用程序●8kB RAM用于更为复杂的应用和Zigbee应用●可编程输出功率达+4dBm●在掉电模式下，只有睡眠定时器运行时，仅有不到1uA的电流损耗●具有强大的地址识别和数据包处理引擎利益：●支持Zigbee / Zigbee PRO , Zigbee RF4CE, 6LoWPAN, WirelessHART 及其他所有基于802.15.4标准的解决方案；●卓越的接收机灵敏度和可编程输出功率；●在接收、发射和多种低功耗的模式下具有极低的电流消耗，能保证较长的电池使用时间；●一流的选择和阻断性能（50-dB ACR）应用：●智能能源/自动化仪表读取●远程控制●居家及楼宇自动化●消费类电子产品●工业控制及监测●低功耗无线传感器网络CC2530芯片参数特性：可最大化通信范围的101dBm链路预算（101dBm link budget）可最小化干扰源影响的业界一流的选择性（Best in class selectivity）可最大化电池供电器件使用寿命的灵活低功耗模式（Flexible low-power modes）功能强大的5通道DMA引擎（Powerful 5-channel DMA engine）用于远程控制应用的IR生成电路(IR generation circuitry)高达256K的闪存（Up to 256k Flash）CC2530开发套件通过深圳市无线龙科技有限公司的CC2530-PK的开发系统，让您充分了解、熟悉和使用CC2530。

OP07C中文资料

OP07C中文资料一、Op07芯片是一种低噪声，非斩波稳零的单运算放大器集成电路。

由于OP07具有非常低的输入失调电压（对于OP07A最大为25μV），所以OP07在很多应用场合不需要额外的调零措施。

OP07同时具有输入偏置电流低（OP07A为±2nA）和开环增益高（对于OP07A 为300V/mV）的特点，这种低失调、高开环增益的特性使得OP07特别适用于高增益的测量设备和放大传感器的微弱信号等方面。

二、OP07特点：超低偏移： 150μV最大。

低输入偏置电流： 1.8nA 。

低失调电压漂移： 0.5μV/℃。

超稳定，时间： 2μV/month最大高电源电压范围：±3V至±22V三、OP07内部结构原理图四、OP07芯片引脚功能说明：1和8为偏置平衡(调零端)，2为反向输入端，3为正向输入端，4接地，5空脚 6为输出，7接电源+ABSOLUTE MAXIMUM RATINGS 最大额定值五、OP07典型应用电路图4 输入失调电压调零电路图5 典型的偏置电压试验电路图6 老化电路图7 典型的低频噪声放大电路图8 高速综合放大器图9 选择偏移零电路图10 调整精度放大器图11高稳定性的热电偶放大器图12 精密绝对值电路op07的功能介绍：Op07芯片是一种低噪声，非斩波稳零的双极性运算放大器集成电路。

由于OP07具有非常低的输入失调电压（对于OP07A 最大为25μV），所以OP07在很多应用场合不需要额外的调零措施。

OP07同时具有输入偏置电流低（OP07A为±2nA）和开环增益高（对于OP07A为300V/mV）的特点，这种低失调、高开环增益的特性使得OP07特别适用于高增益的测量设备和放大传感器的微弱信号等方面。

特点：超低偏移： 150μV最大。

低输入偏置电流： 1.8nA 。

低失调电压漂移： 0.5μV/℃。

超稳定，时间： 2μV/month最大高电源电压范围：±3V至±22V工作电源电压范围是±3V~±18V；OP07完全可以用单电源供电，你说的＋5V,-5V绝对没有问题，用单＋5V也可以供电，但是线性区间太小，单电源供电，模拟地在1/2 VCC. 建议电源最好>8V，否则线性区实在太小，放大倍数无法做大，一不小心，就充顶饱和了。

VJ0805Q1R8CFBAT中文资料

GENERAL SPECIFICATIONS
NOTE: Electrical characteristics @ + 25°C unless otherwise specified. Capacitance Range: 1.0pF to 680pF. Temperature Coefficient of Capacitance (TCC): 0 ± 30PPM/°C from - 55°C to + 125°C. Dissipation Factor (DF): 0.1% maximum @ 1.0 Vrms and 1kHz for values > 1000pF. 0.1% maximum @ 1.0 Vrms at 1MHz for values ≤ 1000pF. Insulation Resistance (IR): @ + 25°C and rated voltage 100,000 Megohms minimum or 1000 ohm-farads, whichever is less. @ + 125°C and rated voltage 10,000 Megohms minimum or 100 ohm-farads, whichever is less. Dielectric Withstanding Voltage (DWV): 250% of rated voltage for 5 ± 1 seconds, 50 milliamps current maximum.
RESONANT FREQUENCY (GHz)
TEMPERATURE COEFFICIENT OF CAPACITANCE 2.0 1.5 1.0 0.5 0.0 - 0.5 - 1.0 - 1.5 - 2.0 -75 -50 -25 0 25 50 75 100 125 TEMPERATURE °C Q vs FREQUENCY - VJ0805, 50V 10000 10pF 1000 1 HIGH Q SERIES RESONANT FREQUENCY - HIGH Q 10

CC0805KRX5R7BB105中文资料

物料编号：CC0805KRX5R7BB105的详细参数_易容网
MLCC即是多层陶瓷电容片式，是电子信息产品不可或缺的基本组件之一。

我国MLCC的生产起步在80年代初，行业早期主要是在外资企业的带动下发展起来的，近年来国内企业在技术上实现突破，行业国产化成效显著，并推动了MLCC产量迅速增长。

目前，MLCC的应用领域已从手机、电脑、电视机等消费电子领域，逐步拓展到新能源发电、新能源汽车、节能灯具、轨道交通、直流输变电、三网融合、高清电视、机顶盒、手机电视等多个行业。

对于这个悄悄活跃在人们生活中的元件你又知道多少呢.
本次易容网为大家推荐比较常用的MLCC国巨 | Yageo品牌的料号CC0805KRX5R7BB105的相关参数
易容网是深圳市易容信息技术有限公司独自研发的全球最大的MLCC搜索采购服务网站，2014年创立于深圳市南山区，全国首家电子元器件行业电容元件的搜索引擎及o2o商务服务平台。

易容网（）现已建成全球最大的MLCC电容搜索引擎数据库，包含全球25家电容生产厂商超过28万组MLCC产品数据，用户可根据行业应用、物料编号、规格参数等信息快速的找到所有相关的MLCC电容数据。

易容网在搜索服务的前提下还提供村田、TDK、国巨、太阳诱电、风华高科等常见品牌产品的o2o商务服务，让企业客户实现询价、报价、在线订单、出库、实时物流、签收、账期服务等在线一站式商务服务体验。

0805C中文资料

Q (Min)
35@1000MHZ 35@1000MHZ 80@1500MHz 50@1000MHZ 65@1500MHz 50@1500MHz 65@1000MHz 50@1000MHz 50@1000MHz 50@1000MHz 60@500MHz 45@500MHz 50@500MHz 50@500MHz 50@500MHz 55@500MHz 50@500MHz 55@500MHz 60@500MHz 55@500MHz 40@500MHz 40@500MHz 60@500MHz 60@500MHz 60@500MHz 60@500MHz 60@500MHz 65@500MHz 65@500MHz 65@500MHz 50@500MHz 50@250MHz 50@250MHz 50@250MHz 50@250MHz 44@250MHz 48@250MHz 25@250MHz 48@250MHz 35@250MHz 48@250MHz 25@100MHz 33@100MHz 23@50MHz 23@50MHz 23@50MHz 24@50lications:
Pagers. Mobile communication units. Portable telephone. Hybrid.
Special specifications are available for customer’s requirement.
SMD wire wound Ceramic Chip Inductor: P/N 0805C-series Rev. A Jan. 01, 2006. Page: 2 of 3
SMD Wire Wound Ceramic Chip Inductors—0805C series
B. Dimensions: (Unit: mm)

贴片电容0805B105K500NT数据手册

0805
1206
1210
1808
1812
2220
2225
3035
0.08×0.05 0.12×0.06
0.12×0.10
0.18×0.08
0.18×0.12 0.22×0.20
0.22×0.25
0.30×0.35
2.00×1.25 3.20×1.60
3.20×2.50
4.50×2.00
4.50×3.20 5.70×5.00
T
④ ⑤ ⑤
名称 Name 陶瓷介质 Ceramic dielectric 内电极 Inner electrode 外电极 Substrate electrode 镍层 Nickel Layer 锡层 Tin Layer 共 25 页
第
2
页
风华高科
广东风华高新科技股份有限公司
1210 1808 1812 2220 2225 3012
3225 4520 4532 5750 5763 7632
3.20±0.30 4.50±0.40 4.50±0.40 5.70±0.40 5.70±0.50 7.60±0.50
2.50±0.30 2.00±0.20 3.20±0.30 5.00±0.40 6.30±0.50 3.20±0.30
风华高科
广东风华高新科技股份有限公司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
单位(unit)：V 实际值
⑤ 额定电压 RATED VOLTAGE 表示方式 (Express Method) 6R3 500 201 102 … (Actual Value) 6.3 50×100 20×101 10×102 …

SCDS158A 型号电路芯片说明书

SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20041POST OFFICE BOX 655303 •DALLAS, TEXAS 75265D Output Voltage Translation Tracks V CCD Supports Mixed-Mode Signal Operation OnAll Data I/O Ports− 5-V Input Down To 3.3-V Output Level Shift With 3.3-V V CC− 5-V/3.3-V Input Down To 2.5-V Output Level Shift With 2.5-V V CCD 5-V-Tolerant I/Os With Device Powered Up or Powered DownD Bidirectional Data Flow, With Near-Zero Propagation DelayD Low ON-State Resistance (r on )Characteristics (r on = 5 Ω Typical)D Low Input/Output Capacitance Minimizes Loading (C io(OFF) = 8 pF Typical)D Data and Control Inputs Provide Undershoot Clamp Diodes DLow Power Consumption (I CC = 20 µA Max)D V CC Operating Range From 2.3 V to 3.6 V D Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V,5 V)D Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS OutputsD I off Supports Partial-Power-Down Mode OperationD Latch-Up Performance Exceeds 250 mA Per JESD 17DESD Performance Tested Per JESD 22− 2000-V Human-Body Model (A114-B, Class II)− 1000-V Charged-Device Model (C101)D Supports Digital Applications: Level Translation, Memory Interleaving, Bus IsolationDIdeal for Low-Power Portable EquipmentDBQ, DGV, DW, OR PW PACKAGE(TOP VIEW)BE 1B11A11A21B22B12A12A22B23B13A1GNDV CC 5B25A25A15B14B24A24A14B13B23A2BX123456789101112242322212019181716151413description/ordering informationORDERING INFORMATIONT APACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING Tube SN74CB3T3383DW SOIC − DWTape and reel SN74CB3T3383DWR CB3T3383SSOP (QSOP) − DBQ Tape and reel SN74CB3T3383DBQR CB3T3383−40°C to 85°CTube SN74CB3T3383PW TSSOP − PW Tape and reel SN74CB3T3383PWR KS383TVSOP − DGVTape and reelSN74CB3T3383DGVRKS383†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.Copyright 2004, Texas Instruments IncorporatedPlease be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20042POST OFFICE BOX 655303 •DALLAS, TEXAS 75265description/ordering information (continued)The SN74CB3T3383 is a high-speed TTL-compatible FET bus-exchange switch with low ON-state resistance (r on ), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks V CC . The SN74CB3T3383 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).V CC≈V CC 5.5 V 0 V NOTE A:If the input high voltage (V IH ) level is greater than or equal to V CC − 1 V, and less than or equal to 5.5 V, then the output highvoltage (V OH ) level will be equal to approximately the V CC voltage level.Input Voltages Output Voltages0 V≈V CC − 1 V≈V CC − 1 VV CCINOUTCB3TFigure 1. Typical DC Voltage Translation CharacteristicsThe SN74CB3T3383 is organized as a 10-bit bus switch or as a 5-bit bus-exchange with enable (BE) input.When used as a 5-bit bus-exchange, the device provides data exchanging between four signal ports. When BE is low, the bus-exchange switch is ON, and the select input (BX) controls the data path. When BE is high, the bus-exchange switch is OFF, and a high-impedance state exists between the A and B ports.This device is fully specified for partial-power-down applications using I off . The I off feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.To ensure the high-impedance state during power up or power down, BE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20043POST OFFICE BOX 655303 •DALLAS, TEXAS 75265FUNCTION TABLE (each 5-bit switch)INPUTS INPUTS/OUTPUTS BE BX A1A2FUNCTION L L B1B2A1 port = B1 port A2 port = B2 port L H B2B1A1 port = B2 port A2 port = B1 port HXZZDisconnectlogic diagram (positive logic)5B15A1SWSWSW5B25A2SW1B11A1SWSWSW1B21A2SWBE BX342122125202313SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20044POST OFFICE BOX 655303 •DALLAS, TEXAS 75265simplified schematic, each FET switch (SW)V G †AEN ‡B†Gate Voltage (V G ) is approximately equal to V CC + V T when the switch is ON and V I > V CC + V T .Control Circuit‡EN is the internal enable signal applied to the switch.absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§Supply voltage range, V CC (see Note 1) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control input voltage range, V IN (see Notes 1 and 2) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch I/O voltage range, V I/O (see Notes 1, 2, and 3) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control input clamp current, I IK (V IN < 0) −50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I/O port clamp current, I I/OK (V I/O < 0) −50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ON-state switch current, I I/O (see Note 4) ±128 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous current through V CC or GND terminals ±100 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 5):DBQ package 61°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGV package 86°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DW package 46°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PW package 88°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . §Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.All voltages are with respect to ground unless otherwise specified.2.The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.3.V I and V O are used to denote specific conditions for V I/O .4.I I and I O are used to denote specific conditions for I I/O .5.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditions (see Note 6)MINMAX UNIT V CC Supply voltage2.33.6V V V CC = 2.3 V to 2.7 V 1.7 5.5IH High-level control input voltage V CC = 2.7 V to 3.6 V 2 5.5V V V CC = 2.3 V to 2.7 V 00.7IL Low-level control input voltage V CC = 2.7 V to 3.6 V00.8V V I/O Data input/output voltage 0 5.5V T AOperating free-air temperature−4085°CNOTE 6:All unused control inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs , literature number SCBA004.SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20045POST OFFICE BOX 655303 •DALLAS, TEXAS 75265electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONSMINTYP †MAX UNIT V IK V CC = 3 V,I I = −18 mA −1.2VV OH See Figures 3 and 4I IN ‡Control inputsV CC = 3.6 V,V IN ‡ = 3.6 V to 5.5 V or GND ±10µAV V I = V CC − 0.7 V to 5.5 V ±20I ICC = 3.6 V,V I = 0.7 V to V CC − 0.7 V −40Switch ON,V IN = V CC or GND V I = 0 to 0.7 V±5µA I OZ §V CC = 3.6 V,V O = 0 to 5.5 V,V I = 0,Switch OFF,V IN = V CC or GND ±10µAI offV CC = 0,V O = 0 to 5.5 V,V I = 0,10µAV CC = 3.6 V,V I = V CC or GND 20I CC I I/O = 0,Switch ON or OFF,V IN = V CC or GND V I = 5.5 V20µA∆I CC ¶Control inputsV CC = 3 V to 3.6 V,One input at V CC − 0.6 V,Other inputs at V CC or GND 300µAC inControl inputs V CC = 3.3 V,V IN = V CC or GND 4pFC io(OFF)V CC = 3.3 V,V I/O = 5.5 V, 3.3 V, or GND,Switch OFF,V IN = V CC or GND 8pFV CC = 3.3 V,Switch ON,V I/O = 5.5 V or 3.3 V 7C io(ON)V IN = V CC or GND V I/O = GND 21pFV CC = 2.3 V,TYP at V I O = 24 mA 59#CC = 2.5 V,V I = 0I O = 16 mA 59r on V I O = 64 mA 58ΩCC = 3 V,V I = 0I O = 32 mA 58†All typical values are at V CC = 3.3 V (unless otherwise noted), T A = 25°C.‡V IN and I IN refer to control inputs. V I , V O , I I , and I O refer to data pins.§For I/O ports, the parameter I OZ includes the input leakage current.¶This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V CC or GND.#Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20046POST OFFICE BOX 655303 •DALLAS, TEXAS 75265switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)FROM TO V CC = 2.5 V ± 0.2 V V CC = 3.3 V ± 0.3 V PARAMETER(INPUT)(OUTPUT)MINMAX MINMAX UNITt pd † A or B B or A 0.150.25t pd(s)BX A or B 115110ns t en BE A or B 113.519ns t disBEA or B1718.5ns †The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,when driven by an ideal voltage source (zero output impedance).SN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20047POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONV OH V OLC L(see Note A)TEST CIRCUITS12 × V CC Open GNDR LR Lt PLH t PHLOutput Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at Open (see Note B)t PZLt PZHt PLZt PHZ V CC0 V V OHV OL0 VV OL + V ∆V OH − V ∆0 VOutput Control (V IN )V CCV CCVOLTAGE WAVEFORMSPROPAGATION DELAY TIMES (t pd(s))VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESOutputNOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤10 MHz, Z O = 50 Ω, t r ≤2.5 ns, t f ≤2.5 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd(s). The t pd propagation delay is the calculated RC time constant of the typical ON-state resistanceof the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).H.All parameters and waveforms are not applicable to all devices.50 ΩV G1V CCDUT50 ΩV IN50 ΩV G250 ΩV ITEST R L S1V ∆C L 2.5 V ±0.2 V 3.3 V ±0.3 V V CC V I t PHZ /t PZHt PLZ /t PZL t pd(s) 2.5 V ±0.2 V 3.3 V ±0.3 V 2.5 V ±0.2 V 3.3 V ±0.3 VOpen Open 2 × V CC 2 × V CC Open Open500 Ω500 Ω500 Ω500 Ω500 Ω500 Ω3.6 V or GND 5.5 V or GNDGND GND 3.6 V 5.5 V 30 pF 50 pF 30 pF 50 pF 30 pF 50 pF0.15 V 0.3 V 0.15 V 0.3 VOutput Control (V IN )Input GeneratorInput GeneratorV CC /2V CC /2V CC /2V CC /2V CC /2V CC /2V CC /2V CC /2V OFigure 2. Test Circuit and Voltage WaveformsSN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20048POST OFFICE BOX 655303 •DALLAS, TEXAS 75265TYPICAL CHARACTERISTICSV − O u t p u t V o l t a g e − V OUTPUT VOLTAGEvsINPUT VOLTAGEOV I − Input Voltage − VOUTPUT VOLTAGEvsINPUT VOLTAGEV I − Input Voltage − V0.01.02.03.04.00.01.02.03.04.05.06.00.01.02.03.04.00.01.02.03.04.05.06.0V CC = 3 V I O = 1 µA T A = 25°CV CC = 2.3 V I O = 1 µA T A = 25°CV − O u t p u t V o l t a g e − V OFigure 3. Data Output Voltage vs Data Input VoltageSN74CB3T338310ĆBIT FET BUSĆEXCHANGE SWITCH2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTERSCDS158A − OCTOBER 2003 − REVISED DECEMBER 20049POST OFFICE BOX 655303 •DALLAS, TEXAS 75265TYPICAL CHARACTERISTICS (continued)1.52.02.53.03.54.02.32.52.72.93.13.33.53.71.52.02.53.03.54.02.32.5 2.7 2.93.1 3.3 3.5 3.71.52.02.53.03.54.02.32.5 2.7 2.93.1 3.3 3.5 3.7OUTPUT VOLTAGE HIGHvsSUPPLY VOLTAGEV CC − Supply Voltage − VV CC = 2.3 V to 3.6 V V I = 5.5 V T A = 85°COUTPUT VOLTAGE HIGHvsSUPPLY VOLTAGEV CC − Supply Voltage − VV CC = 2.3 V to 3.6 V V I = 5.5 V T A = 25°C100 µA 8 mA 16 mA 24 mA100 µA 8 mA 16 mA 24 mA100 µA 8 mA 16 mA 24 mAOUTPUT VOLTAGE HIGHvsSUPPLY VOLTAGEV CC − Supply Voltage − VV CC = 2.3 V to 3.6 V V I = 5.5 V T A = –40°CV − O u t p u t V o l t a g e H i g h − V O HV − O u t p u t V o l t a g e H i g h − V O HV − O u t p u t V o l t a g e H i g h − V O HFigure 4. V OH ValuesPACKAGE OPTION ADDENDUM 14-Oct-2022 PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andAddendum-Page 1PACKAGE OPTION ADDENDUM 14-Oct-2022 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2 3-Jun-2022TAPE AND REEL INFORMATIONA0B0K0WDimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONS Sprocket Holes P1*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74CB3T3383DGVR TVSOPDGV 242000330.012.4 6.9 5.6 1.68.012.0Q1SN74CB3T3383DWR SOICDW 242000330.024.410.7515.7 2.712.024.0Q1SN74CB3T3383PWR TSSOP PW 242000330.016.4 6.958.3 1.68.016.0Q13-Jun-2022*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74CB3T3383DGVR TVSOP DGV242000367.0367.035.0SN74CB3T3383DWR SOIC DW242000350.0350.043.0SN74CB3T3383PWR TSSOP PW242000356.0356.035.03-Jun-2022 TUBET - Tube*All dimensions are nominalDevice Package Name Package Type Pins SPQ L (mm)W (mm)T (µm) B (mm) SN74CB3T3383PW PW TSSOP246053010.23600 3.5PACKAGE OUTLINETSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGENOTES:1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall notexceed 0.15 mm per side.4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.5. Reference JEDEC registration MO-153.EXAMPLE BOARD LAYOUTTSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGENOTES: (continued)6. Publication IPC-7351 may have alternate designs.7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.EXAMPLE STENCIL DESIGNTSSOP - 1.2 mm max heightPW0024A SMALL OUTLINE PACKAGENOTES: (continued)8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.9. Board assembly site may have different recommendations for stencil design.MECHANICAL DATAMPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000DGV (R-PDSO-G**)PLASTIC SMALL-OUTLINE 24 PINS SHOWN143,703,504,905,1020DIMPINS **4073251/E 08/001,20 MAX Seating Plane0,050,150,250,500,750,230,1311224134,304,500,16 NOMGage PlaneA 7,907,703824164,905,103,703,50A MAXA MIN 6,606,2011,2011,40569,609,80480,08M0,070,400°–ā8°NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.D.Falls within JEDEC:24/48 Pins – MO-15314/16/20/56 Pins – MO-194IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2022, Texas Instruments Incorporated。

CC240650中文资料

DimensionInches Millimeters A 2.10653.5B 1.705±0.00843.3±0.2C 1.43736.5D 1.29933E 0.92523.5F 0.86622G 0.55114H 0.3549J 0.3158K 0.2767L 0.236 R R6M 0.209 5.3N 0.209 Dia.Dia.5.3P 0.177 4.5Q 0.138 3.5RM4 MetricM4Description:Powerex Fast Recovery Dual Diode Modules are designed for use in applications requiring fast switching.The modules are isolat-ed for easy mounting with other components on common heatsinks.Features:ⅪIsolated MountingⅪPlanar Chips Applications:ⅪFree WheelingOrdering Information:Select the complete eight digit module part number you desire from the table below.Example:CN241250 is a 1200 Volt, 50 Ampere FastRecovery Common AnodeDiode Module.Voltage Current Rating Type Volts (x100)Amperes (50)CN240650CD2412Powerex,Inc.,200 Hillis Street,Youngwood,Pennsylvania 15697-1800 (724) 925-7272Fast RecoveryDual Diode Modules50 Amperes/600-1200 VoltsCN24_ _50,CD24_ _50,CC24_ _50Outline DrawingCN24_ _50,CD24_ _50,CC24_ _50Fast Recovery Dual Diode Modules50 Amperes/600-1200 VoltsPowerex,Inc.,200 Hillis Street,Youngwood,Pennsylvania 15697-1800 (724) 925-7272CN24_ _50,CD24_ _50,CC24_ _50Fast Recovery Dual Diode Modules50 Amperes/600-1200 VoltsAbsolute Maximum RatingsCN240650CN241250CD240650CD241250 Characteristics Symbol CC240650CC241250UnitsPeak Reverse Blocking Voltage V RRM6001200Volts T ransient Peak Forward Blocking Voltage (Non-Repetitive), t < 5ms V RSM7201350Volts DC Reverse Blocking Voltage V R(DC)480960Volts DC Output Current, T C= 105°C I F(DC)5050Amperes Peak One-Cycle Surge (Non-Repetitive) On-State Current (60Hz)I FSM10001000Amperes Peak One-Cycle Surge (Non-Repetitive) On-State Current (50Hz)I FSM910910Amperes I2t (for Fusing), 8.3 milliseconds I2t41654165A2sec Storage Temperature T STG-40 to 125-40 to 125°C Operating Temperature T j-40 to 150-40 to 150°C Maximum Mounting Torque M5 Mounting Screw—1717in.-lb. Maximum Mounting Torque M4 Terminal Screw—1212in.-lb. Module Weight (Typical)—9090Grams V Isolation V RMS25002500VoltsPowerex,Inc.,200 Hillis Street,Youngwood,Pennsylvania 15697-1800 (724) 925-7272CN24_ _50,CD24_ _50,CC24_ _50Fast Recovery Dual Diode Modules50 Amperes/600-1200 VoltsElectrical and Thermal Characteristics,T j= 25°C unless otherwise specifiedCN24_ _50CD24_ _50Characteristics Symbol Test Conditions CC24_ _50Units Blocking State MaximumsReverse Leakage Current, Peak I RRM T j= 150°C, V RRM= Rated10mA Conducting State MaximumsPeak On-State Voltage V FM I FM= 50A 1.5Volts Switching MaximumsReverse Recovery Time t rr I FM= 50A, T j= 150°C0.8␮sdi/dt =-100A/␮s, V R = 1/2V RMReverse Recovery Charge Q rr I FM= 50A, T j= 150°C30␮Cdi/dt =-100A/␮s, V R = 1/2V RMThermal MaximumsThermal Resistance, Junction-to-Case R␪(J-C)Per Module0.6°C/Watt Thermal Resistance, Case-to-Sink (Lubricated)R␪(C-S)Per Module0.4°C/WattPowerex,Inc.,200 Hillis Street,Youngwood,Pennsylvania 15697-1800 (724) 925-7272CN24_ _50,CD24_ _50,CC24_ _50Fast Recovery Dual Diode Modules 50 Amperes/600-1200 VoltsINSTANTANEOUS ON-STATE CURRENT, I FM ,(AMPERES)MAXIMUMON-STATE CHARACTERISTICS0.21000.61.41.82.22.6101102103I N S T A N T A N E O U S O N -S T A T E V O L T A G E , V F M , (V O L T S )1.0CYCLES AT 60 H ZM A X I M U M P E A K S U R G E (N O N -R E P E T I T I V E )C U R R E N T , I F S M , (A M P E R E S )MAXIMUM ALLOWABLE PEAK SURGE(NON-REPETITIVE) CURRENT2004006008001000100101102MAXIMUMALLOWABLE CASE TEMPERATUREAVERAGE ON-STATE CURRENT, I F(AV),(AMPERES)M A X I M U M A L L O W A B L E C A S E T E M P E R A T U R E , T C , (o C )5020100110120130140150403010MAXIMUMON-STATE POWER DISSIPATIONAVERAGE ON-STATE CURRENT, I F(AV),(AMPERES)M A X I M U M P O W E R D I S S I P A T I O N , P A V (M A X ), (W A T T S )5030020406080100102040TIME, t, (SECONDS)TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS (JUNCTION-TO-CASE)10-310-210-1100T R A N S I E N T T H E R M A L I M P E D A N C E , Z ␪(J -C )(t ), (o C /W A T T )INSTANTANEOUS ON-STATE CURRENT, I FM ,(AMPERES)REVERSE RECOVERY CHARACTERISTICS100101103I r r , (A M P E R E S ), Q r r , (µC)10-1101102t r r , (µs )10-1101102100102100。

MAXIM MAX8725 说明书

____________________________________概述MAX8725评估板(EV kit) 是高精度、高效率的多化学类型电池充电器。

该评估板能够以高达3A的电流为三至四节串联的锂离子电池(Li+) 充电。

充电电流和输入电源电流通过板上电位器调节。

输出电压可设置为4.2V x 电池包中串联电池节数。

串联电池节数由跳线选择。

通过安装两个电阻，输出电压可在4V至4.4V x (串联电池节数)之间调节。

该评估板还提供用于监视AC适配器电流的输出，并可监视是否连接了AC适配器。

MAX8725通过控制两个外部p沟道MOSFET自动选择系统供电电源。

决定选择哪一路电源供电的依据是：是否连接了AC适配器。

____________________________________特性♦输入限流♦利用内部基准提供±0.5%的电压检测精度♦自动选择系统电源♦模拟输入控制充电电流和充电电压♦监视输出AC适配器电源电流AC适配器是否接通♦电池电压高达17.6V ♦+8V至+25V输入电压♦电池充电电流高达3A♦可为Li+、NiCd和NiMH电池充电♦表贴封装♦经过完全安装和测试评估板：MAX8725MAX8725评估板Maxim Integrated Products 119-0292; Rev 0; 5/05本文是Maxim正式英文资料的译文，Maxim不对翻译中存在的差异或由此产生的错误负责。

请注意译文中可能存在文字组织或翻译错误，如需确认任何词语的准确性，请参考Maxim提供的英文版资料。

索取免费样品和最新版的数据资料，请访问Maxim的主页：。

评估板：M A X 8725MAX8725评估板2_______________________________________________________________________________________评估板：MAX8725MAX8725评估板_______________________________________________________________________________________3________________________________快速入门所需设备在开始评估之前，需要准备以下设备：•为充电器提供输入电流的DC电源，该电源电压必须大于电池电压设置点，并具有足够大的额定电流•电压表•电池包或负载步骤MAX8725评估板是经过完全安装与测试的表贴电路板。

3.2 x 2.8 mm PLCC2 SMD LED 商品说明书

Part Number Emitting Color Emitting MaterialLens-colorWavelength CIE127-2007*nm λPViewing Angle 2θ 1/2Luminous Intensity CIE127-2007* (I F =20mA) mcd *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.A Relative Humidity between 40% and 60% is recommended inESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033)Features● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● Halogen-free ● RoHS compliantATTENTIONOBSERVE PRECAUTIONSFOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICESLED is recommended for reflow soldering and soldering profile is shown below.Forward Current Derating CurveThe device has a single mounting surface. The device must be mounted according to the specifications.Reel Dimension (Units : mm)Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1)Tape Specification (Units : mm)Remarks:If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm2. Luminous intensity / luminous flux: +/-15%3. Forward Voltage: +/-0.1VNote: Accuracy may depend on the sorting parameters.TERMS OF USE1. Data presented in this document reflect statistical figures and should be treated as technical reference only.2. Contents within this document are subject to improvement and enhancement changes without notice.3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.5. The contents within this document may not be altered without prior consent by SunLED.6. Additional technical notes are available at https:///TechnicalNotes.aspPACKING & LABEL SPECIFICATIONS。

CY8CKIT-005 MiniProg4程序调试套件指南文档说明书

CY8CKIT-005Kit Guide Doc. # 002-19782 Rev. *BCypress Semiconductor198 Champion Court San Jose, CA 95134-1709CopyrightsCopyrights© Cypress Semiconductor Corporation, 2018-2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this para-graph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to subli-cense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited.TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PUR-POSE. No computing device can be absolutely secure. Therefore, despite security measures implemented in Cypress hard-ware or software products, Cypress shall have no liability arising out of any security breach, such as unauthorized access to or use of a Cypress product. CYPRESS DOES NOT REPRESENT, WARRANT, OR GUARANTEE THAT CYPRESS PROD-UCTS, OR SYSTEMS CREATED USING CYPRESS PRODUCTS, WILL BE FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE, HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (collectively, "Secu-rity Breach"). Cypress disclaims any liability relating to any Security Breach, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any Security Breach. In addition, the products described in these mate-rials may contain design defects or errors known as errata which may cause the product to deviate from published specifica-tions. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is pro-vided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. "High-Risk Device" means any device or system whose failure could cause personal injury, death, or property damage. Examples of High-Risk Devices are weapons, nuclear installations, surgical implants, and other medical devices. "Critical Component" means any component of a High-Risk Device whose failure to perform can be reasonably expected to cause, directly or indirectly, the failure of the High-Risk Device, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any use of a Cypress product as a Critical Component in a High-Risk Device. You shall indemnify and hold Cypress, its directors, officers, employees, agents, affiliates, distributors, and assigns harmless from and against all claims, costs, damages, and expenses, arising out of any claim, including claims for product liability, personal injury or death, or property damage arising from any use of a Cypress product as a Critical Com-ponent in a High-Risk Device. Cypress products are not intended or authorized for use as a Critical Component in any High-Risk Device except to the limited extent that (i) Cypress's published data sheet for the product explicitly states Cypress has qualified the product for use in a specific High-Risk Device, or (ii) Cypress has given you advance written authorization to use the product as a Critical Component in the specific High-Risk Device and you have signed a separate indemnification agree-ment.Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit . Other names and brands may be claimed as property of their respec-tive owners.Safety Information 41.Introduction51.1Kit Contents (5)1.2Programming and Debugging (5)1.3Bridging (5)1.4Documentation Conventions (6)2.Installing MiniProg472.1MiniProg4 (7)2.2MiniProg4 Installation (8)2.3MiniProg4 LEDs (10)2.4MiniProg4 Buttons (11)3.Technical Description123.1Interfaces (13)3.1.1SWD (13)3.1.2I2C (13)3.1.3SPI (13)3.1.4UART with and without Flow Control (13)3.1.5Reference (13)3.2Connectors (14)3.2.15-Pin Connector (14)3.2.210-Pin Connector (14)3.2.36x2 Connector (15)3.3Power (16)A.Appendix17A.1Regulatory Compliance Information (17)Revision History 18Safety InformationThe CY8CKIT-005 MiniProg4 Program and Debug Kit is intended for use as a development platform for hardware or software in a laboratory environment. In a domestic environment, this product may cause radio interference. In such cases, you may be required to take adequate preventive measures. In addition, this board should not be used near any medical equipment or RF devices.Attaching additional wiring to this product or modifying the product operation from the factory default may affect its performance and cause interference with other apparatus in the immediate vicinity. If such interference is detected, suitable mitigating measures should be taken.The CY8CKIT-005 MiniProg4 Program and Debug Kit, as shipped from the factory, has been verified to meet with the requirements of CE as a Class A product.General Safety InstructionsESD ProtectionESD can damage boards and associated components. Cypress recommends that you work on the board at an ESD workstation, if available. Otherwise, use appropriate ESD protection, such as anantistatic wrist strap attached to a ground, when handling parts.The CY8CKIT-005 MiniProg4 Program and Debug Kits are sensitive toelectrostatic discharge (ESD). Electrostatic charges accumulate on thehuman body and on other equipment. Devices that are subjected to high-energy discharges can suffer permanent damage. Proper ESDprecautions are recommended to prevent loss of functionality. Storeunused CY8CKIT-005 MiniProg4 Program and Debug Kits in theprotective shipping package.End-of-Life/Product RecyclingThe end-of life for this kit is five years from the date of manufacture mentioned as barcode on the back of the box. Contact your nearest recycler for discarding the kit.1IntroductionThe MiniProg4 Program and Debug Kit is an all-in-one programmer and debugger for PSoC 4,PSoC5LP, and PSoC 6 MCU devices. MiniProg4 also provides USB-I2C, USB-SPI and USB-UARTbridging functionality. The MiniProg4 provides a special feature enabling users to write their owncustom firmware through the custom application mode.Figure 1-1. MiniProg41.1Kit ContentsThe CY8CKIT-005 PSoC® MiniProg4 Program and Debug Kit includes:■MiniProg4 programmer/debugger■10-pin ribbon cable■USB Type-A to Type-C Cable■Quick Start Guide1.2Programming and DebuggingThe MiniProg4 programmer/debugger provides the flexibility to work with SWD programming anddebugging interfaces. MiniProg4 supports 32-bit Arm® Cortex®-M0/M0+/M3/M4 PSoC devices.The MiniProg4 debugger is supported by the software tools PSoC Creator, ModusToolbox™,Cypress Programmer, and PSoC Programmer.1.3BridgingMiniProg4 supports USB-I2C, USB-UART and USB-SPI as standard bridging protocols for anydevice. The MiniProg4 bridging capabilities are used by PSoC Creator, ModusToolbox, CypressProgrammer, PSoC Programmer, Bridge Control Panel, and other applications. Tuning softwaretools such as the CapSense Tuner provided by Cypress also use these capabilities.Introduction1.4Documentation ConventionsTable 1-1. Document Conventions for User GuidesConvention UsageCourier New Displays file locations, user-entered text, and source code: C:\...cd\icc\Italics Displays file names and reference documentation:Read about the sourcefile.hex file in the PSoC Designer User Guide.[Bracketed, Bold]Displays keyboard commands in procedures: [Enter] or [Ctrl] [C]File > Open Represents menu paths: File > Open > New ProjectBold Displays commands, menu paths, and icon names in procedures: Click the File menu, and then click Open.Times New Roman Displays an equation: 2 + 2 = 4Text in gray boxes Describes cautions or unique functionality of the product.2.Installing MiniProg4This chapter shows how to install MiniProg4 and its associated PC software.2.1MiniProg4Figure 2-1. Top ViewFigure 2-2. Bottom View2.2MiniProg4 InstallationThe MiniProg4 programmer/debugger is supported by PSoC Programmer, ModusToolbox, CypressProgrammer, and PSoC Creator. Other software, such as Bridge Control Panel, use the PSoCProgrammer COM layer to support MiniProg4 functionality.Note: PSoC Programmer is compatible only with the Windows Operating System however, CypressProgrammer is compatible with Windows, macOS, and Linux. To understand the differencesbetween PSoC Programmer and Cypress Programmer, please see the Cypress ProgrammingSolutions page at /products/psoc-programming-solutions.1.Download and install PSoC Programmer or Cypress Programmer. Follow the on-screeninstructions to install the software.Each programming tool supports a subset of Cypress devices. See respective tooldocumentation for which device each supports.unch PSoC Programmer or Cypress Programmer and connect the MiniProg4 to yourcomputer’s USB port using the provided USB cable. When properly connected, and drivers havebeen installed, the Mode LED either turns ON or will be ramping (slowly increasing anddecreasing brightness) depending on the mode.Note that the MiniProg4 drivers are automatically installed.3.In PSoC Programmer, to connect to the port, in the Port Selection pane, click the MiniProg4device. You can also click Connect/Disconnect button as shown in Figure2-3.If the connection is successful, a status indicator in the lower-right corner of the PSoCProgrammer window turns green and shows “Connected”.You can now use MiniProg4 to program the target device by clicking the Program button.Figure 2-3. PSoC Programmer: MiniProg4 Connect/Disconnect and ProgramFor more information on how to use PSoC Programmer, see Help Topics under the Help menuin PSoC Programmer or press [F1].In Cypress Programmer, to connect to the MiniProg4 probe, click Connect/Disconnect button as shown in Figure2-4.If the connection is successful, a status indicator in the lower-right corner of the CypressProgrammer window turns green and shows “Connected”.You can now use MiniProg4 to program the target device by clicking the Program button. Figure 2-4. Cypress Programmer: MiniProg4 Connect/Disconnect and ProgramFor more information on how to use Cypress Programmer, see View Help under the Help menu in Cypress Programmer or press [F1].2.3MiniProg4 LEDsMiniProg4 has three indicator LEDs - Mode (Amber), Status (Green), and Error (Red) as shown in Figure 2-5. Table 2-1 indicates the behavior of these LEDs for various operations.Figure 2-5. MiniProg4 LEDsTable 2-1. LED representation for various operations of MiniProg4Programming ModeProgramming Status Three LEDsMode Indicator (Amber LED)Status Indicator 1 (Green LED)Status Indicator 2 (Red LED)CMSIS-DAP HID ProgrammingRamping (1 Hz)8 Hz OFF SuccessON OFF ErrorOFF ON IdleOFF OFF CMSIS-DAP Bulk ProgrammingON 8 Hz OFF SuccessON OFF ErrorOFF ON IdleOFF OFF BootloaderN/A 1 Hz OFF OFF Custom Application N/A 8 Hz ON ONInstalling MiniProg42.4MiniProg4 ButtonsMiniProg4 has two buttons that enable switching between various operating modes. Figure2-6shows the location of the buttons. In order to understand switching MiniProg4 modes, refer toFigure2-7.On power-up, MiniProg4 is in CMSIS-DAP/BULK Mode by default. If the Mode Select button ispressed, MiniProg4 enters CMSIS-DAP/HID mode. If the Custom App button is pressed, MiniProg4enters custom application mode where a user can run their own custom applications on the MCUcontained in the MiniProg4. See Figure2-7 for details.For details of LED indications of various modes of MiniProg4, refer to Table2-1.Figure 2-6. MiniProg4 ButtonsFigure 2-7. Various MiniProg4 Button Modes3.T echnical DescriptionMiniProg4 is a protocol translation device. With MiniProg4, the PC host software can communicate through a USB port to the target device to be programmed or debugged, as shown in Figure 3-1.Table 3-1 lists the protocols that are supported by each connector. MiniProg4 enables communication with the target devices using I/O voltage levels from 1.5 V to 5 V. Figure 3-1. System Block DiagramTable 3-1. Connectors / Communication Protocol SupportConnector SWD I 2CSPIUART (With and Without Flow Control)5-pin Supported N/A N/A N/A 10-pin Supported N/A N/A N/A 6x2 headerN/ASupportedSupportedSupported3.1Interfaces3.1.1SWDARM-based devices support the Serial Wire Debug (SWD) protocol. The PSoC 4, PSoC 5LP, andPSoC 6 MCU device families implement this standard, which offers programming and debuggingfunctions. MiniProg4 supports programming and debugging of PSoC 4, PSoC 5LP, and PSoC6devices using SWD through the 5-pin or 10-pin connector.Before programming a PSoC 4, PSoC 5LP, or PSoC 6 MCU device, make sure you review theelectrical connection requirements in the respective device datasheet or in the PSoC 4, PSoC 5LP,and PSoC 6 MCU device programming specifications. You can find the datasheets andprogramming specifications here:/PSoC4/PSoC5LP/PSoC63.1.2I2CI2C is a common serial interface standard. It is mainly used for communication betweenmicrocontrollers and other ICs on the same board but can also be used for intersystemcommunications. MiniProg4 uses an I2C multimaster host controller that allows the tool to exchangedata with I2C-enabled devices on the target board. For example, this feature may be used to tuneCapSense® designs.MiniProg4 serves as a USB-I2C bridge (acts as I2C Master) that can be used to communicate with aI2C slave devices through the Bridge Control Panel software. For I2C connections use the 6×2connector. MiniProg4 has internal pull-up resistors and supports I2C speed up to 1 MHz.3.1.3SPIThe Serial Peripheral Interface (SPI) is a synchronous serial communication interface specificationused for short distance communication, primarily in embedded systems. SPI devices communicatein full duplex mode using a master-slave architecture with a single master.MiniProg4 serves as a USB-SPI bridge (acts as SPI Master) that can be used to communicate with aSPI slave devices through the Bridge Control Panel software. For SPI connections use the 6x2connector. MiniProg4 supports SPI speed up to 6 MHz.3.1.4UART with and without Flow ControlUART is another common serial interface standard. MiniProg4 supports UART, which allows the toolto receive data from UART enabled devices on the target board. MiniProg4 provides UARTcommunication both with and without hardware flow control. In order to enable flow control, RTS andCTS pins are provided in the 6x2 I/O header. If flow control is not required, CTS and RTS pins canbe left floating. Terminal emulators such as Tera Term or PuTTY can be used to communicate withthe target PSoC device. MiniProg4 supports UART speed up to 115200 Baud Rate.3.1.5ReferenceFor more information on the PSoC 4, PSoC 5LP, and PSoC 6 MCU's JTAG, SWD, and I2Cinterfaces, see the PSoC 4, PSoC 5LP, and PSoC 6 Technical Reference Manuals.For more details on how to use MiniProg4 with Bridge Control Panel, refer to the Bridge ControlPanel Help document.3.2Connectors3.2.15-Pin ConnectorThe 5-pin connector is configured as a single row with a 100-mil pitch. Suggested mating connectorpart number is Molex Connector Corporation 22-23-2051.Figure 3-2. 5-Pin Connector with Pin AssignmentsNote: If the design requires MiniProg4 to be directly plugged to the target board with a 5-pin header,adequate mechanical clearance shall be provided near the 5-pin header on the target board. Thewidth & height of MiniProg4 (5-pin header area) is 25mm x 13mm. If the design cannot meet therequired mechanical clearance, use a stackable header (such as Proto-PIC 20690).3.2.210-Pin ConnectorThe 10-pin connector is configured as a dual row with 50-mil pitch. It is used with a ribbon cable(provided) to mate to a similar connector on the target board. The signal assignment is shown inFigure3-3. Suggested mating connector part number is CNC Tech 3220-10-0300-00 or Samtec Inc.FTSH-105-01-F-DV-K-TR.Figure 3-3. 10-Pin Connector with Pin AssignmentsHere is a summary of the protocols and related pin assignments. The pin mapping is also shown on the back of the MiniProg4 case.3.2.36x2 ConnectorThis connector supports all the communication protocols like I 2C, SPI, UART (with or without flow control supported by MiniProg4). Figure 3-4 shows the pin assignments. They are also shown on the back of the MiniProg4 case.Figure 3-4. 6x2 Connector Pin AssignmentsTable 3-2. Communication Protocol Pin AssignmentsProtocolSignal 5-Pin 10-Pin SWDSDIO52SCK 44XRES3103.3PowerMiniProg4 can be powered using the USB interface.On kits/boards where there is a single power supply for the entire board, MiniProg4 can supplypower to the board. However, this supply is limited to approximately 200 mA, and is protectedagainst excess current draw. You can select 1.8 V, 2.5 V, 3.3 V, or 5 V from PSoC Programmer orCypress Programmer. The 5 V supply may vary between 4.25 V–5.5 V, because it is supplieddirectly from the USB port. The maximum deviation for other voltages is +5%.Note:Some PSoC device families do not support 5 V operation. Refer to the respective devicedatasheet for supported voltage selection.Voltage stress beyond acceptable limits can permanently damageMiniProg4. Programming signals can withstand over-voltage up tomaximum 12 V and minimum up to –5 V. Communication bridge signals(I2C, UART & SPI) can withstand over-voltage only up to maximum 6 Vand minimum up to –1 V.A.AppendixA.1Regulatory Compliance InformationThe CY8KCIT-005 MiniProg4 Program and Debug Kit complies with the CE-Low Voltage Directive2006/95/EC (Europe) safety requirement. It has been tested and verified to comply with the followingelectromagnetic compatibility (EMC) regulations.■CISPR 22 - Emissions■EN 55022 Class A - Immunity (Europe)■CE - EMC Directive 2004/108/EC■CE Declaration of ConformityDocument Revision HistoryDocument Title: CY8CKIT-005 MiniProg4 Program and Debug Kit Guide Document Number: 002-19782Revision ECN#Issue Date Origin ofChangeDescription of Change**628449410/31/2018NMIT New kit guide.*A637876211/08/2018SRDS Updated Installing MiniProg4chapter on page7:Updated “MiniProg4 Installation” on page8:Updated description.Updated Figure2-3.*B658102405/24/2019SRDS Updated Copyright information.。

MAX31865EVKIT

Required Equipment
● USB port
● Windows XP, Windows Vista, or Windows 7 PC ● Mini-USB cable (included) ● EV kit hardware (included) ● Micro screwdriver, bladed, size 0.4mm x 2.0mm x 60mm ● Jumper wire and a resistor (included) or an RTD (NOT included)
Note: Indicate that you are using the MAX31865 when contacting these component suppliers.
Quick Start
Note: In the following sections, software-related items are identified by bolding. Text in bold refers to items directly from the install or EV kit software. Text in bold and under lined refers to items from the Windows operating system.

Maxim Integrated │ 2
MAX31865 Evaluation Kit
Evaluates: MAX31865
Component Suppliers
SUPPLIER AVX Corporation Keystone Electronics Corp. Kingbright Corporation Molex Phoenix Contact ROHM Co., Ltd. TDK Corp. Vishay PHONE 843-946-0238 209-796-2032 909-468-0500 800-786-6539 800-808-7177 858-625-3630 847-803-6100 402-563-6866 WEBSITE

Lumissil Microsystems IS31FL3246 LED驱动器评估板指南说明书

DESCRIPTIONIS31FL3246 is comprised of 36 constant current channels each with independent PWM control, designed for driving LEDs. The output current of eachchannel can be set at up to 25mA (Max.)Proprietary programmable technology is used to minimize audible noise caused by MLCC decoupling capacitors. All registers can be programmed via a high speed I2C (1MHz).FEATURES ∙ 2.7V to 5.5V supply∙Pin to pin with IS31FL3236A/IS31FL3237 (QFN-44, 5mm×5mm)∙ I2C with register address automatic increment ∙ Four selectable I2C addresses ∙ SDB rising edge reset I2C module ∙ Accurate color rendition- Each channel 8-bit/10-bit PWM at 32kHz/64K/128K- Each channel 8-bit PWM at 122Hz/244Hz/488Hz- 3 8-bit global current adjust for 3 color LED∙ Group dimming for reduce coding for RGB ∙ EMI Reduction Technology- Spread spectrum- Selectable 6 Phase Delay- Selectable 180 degree Clock Phase ∙ -40°C to +125°C temperature rangeQUICK STARTFigure 1: Photo of IS31FL3246 Evaluation BoardRECOMMENDED EQUIPMENT ∙5.0V, 2A power supplyABSOLUTE MAXIMUM RATINGS ∙≤ 5.5V power supplyCaution: Do not exceed the conditions listed above, otherwise the board will be damaged.PROCEDUREThe IS31FL3246 evaluation board is fully assembled and tested. Follow the steps listed below to verify board operation.Caution: Do not turn on the power supply until all connections are completed.1) Connect the ground terminal of the power supplyto the GND and the positive terminal to the VCC. Or connect the DC power to the connector (TP1&TP4). 2) Turn on the power supply and pay attention to thesupply current. If the current exceeds 1.2A, please check for circuit fault. 3) Enter the desired mode of display by toggling theMODE button.EVALUATION BOARD OPERATIONThe IS31FL3246 evaluation board has six display modes. Toggling the MODE button (K1) can switch the modes.1) (Default mode) The 12 RGB LEDs in the middle ofthe bard show a color changing light bar moving pattern.2) Two groups of blue LED on above display a tailingeffect move from right to left.3) Two groups of blue LED on above display a tailingeffect move in opposite directions.4) Blue LED on above perform timer display.5) Two groups of blue LED on above flash togetherfrom two sides to middle and then turn off slowly from both sides to middle.6) The blue LEDs on above are put into four ‘8’ digitsand to show a twist effect.Note: IS31FL3246 solely controls the FxLED function on the evaluation board.ORDERING INFORMATIONPart No.Temperature Range PackageIS31FL3246-QFLS4-EB-40°C to +125°C (Industrial)QFN-44, Lead-freeTable 1: Ordering InformationFor pricing, delivery, and ordering information, please contacts Lumissil’s analog marketing team at or (408) 969-6600.SOFTWARE SUPPORTJP1 default setting is shorted. If it is set to open, the SDA, SCL and SDB pin are set to high impedance and the on-board MCU will be idle. External I2C and SDB signals can be connected to TP4 to control the IS31FL3246 LED driver. During external control mode, toggling the MODE button (K1) can switch the power of single blue color LED and power of RGB LED.GND SCLVCCFigure 2: Photo of Arduino UNO connected to EvaluationBoard The steps listed below are an example using the Arduino for external control.The Arduino hardware consists of an Atmel microcontroller with a bootloader allowing quick firmware updates. First download the latest Arduino Integrated Development Environment IDE (1.6.12 or greater) from /en/Main/Software. Also download the Wire.h library from /en/reference/wire and verify that pgmspace.h is in the directory …program Files(x86)/Arduino/hardware/tools/avr/avr/include/avr/. Then download the latest Arduino IS31FL3246 test firmware (sketch) from the Lumissil website /products/led-driver/fxled.1) Open JP1.2) Connect the 5 pins from Arduino board toIS31FL3246 EVB:a) Arduino 5V pin to IS31FL3246 EVB VCC.b) Arduino GND to IS31FL3246 EVB GND.c) Arduino SDA (A4) to IS31FL3246 EVB SDA.d) Arduino SCL (A5) to IS31FL3246 EVB SCL.e) If Arduino uses 3.3V MCU VCC, connect3.3V to IS31FL3246 EVB SDB, if Arduinouses 5.0V MCU VCC, connect 5.0V to EVBSDB.(Arduino UNO MCU VCC is 5V, so SDB canbe 5V or 3.3V)3) Use the test code in appendix Ⅱ or downloadthe test firmware (sketch) from the Lumissilwebsite, and copy the code to Arduino IDE,compile and upload to Arduino.4) Run the Arduino code for desired mode setting byArduino code.5) During external control mode, toggling the MODEbutton (K1) can switch the power of single colorLEDs and power of RGB LEDs.Please refer to the datasheet to get more information aboutIS31FL3246.Figure 3: IS31FL3246 Application SchematicBILL OF MATERIALSName Symbol DescriptionQty SupplierPart No.LED DriverU136CH FxLED Driver 1 Lumissil IS31FL3246LDO U2 Low-dropout Regulator 1 PAM PAM3101 MCU U3 Microcontroller 1 STM STM32F103C8T6 PMOS U4 Dual PMOS 1 ANPEC APM4953 Crystal Y1 Crystal, 8MHz 1 JB HC-49S LED D1~D39 Diode, LED Blue, SMD 39 Everlight 19-217/BHC-ZL1M2RY/3TLED D40~D51 Diode, LED RGB, SMD 12 Everlight 99-235/RGBC/TR8DiodeDS1, DS2Diode, SMD2 DIODES DFLS240 Resistor R1 RES,3.3k,1/10W,±5%,SMD 1 Yageo RC0603JR-073K3L Resistor R2~R3 RES,4.7k,1/10W,±5%,SMD2YageoRC0603JR-074K7LResistor R4~R8 RES,100k,1/10W,±5%,SMD 5 Yageo RC0603JR-07100KL Resistor R9 RES,1k,1/10W,±5%,SMD 1 Yageo RC0603JR-071KL Resistor R10, R11 RES,22R,1/10W,±5%,SMD 1 Yageo RC0603JR-0722RL Resistor R12 RES,1.5k,1/10W,±5%,SMD 1 Yageo RC0603JR-071K5L Capacitor C1,C2 CAP ,100nF,16V,±20%,SMD 2 Yageo CC0603MRX7R7BB104 CapacitorC3, C5CAP , 1µF,16V,±10%,SMD2YageoAC0805KKX7R7BB105Capacitor C4 CAP ,10nF,16V,±10%,SMD 1 Yageo CC0603KRX7R7BB103 Capacitor C7, C8 CAP ,33pF,50V,±5%,SMD 2 Yageo CQ0603JRNPO9BN360 Capacitor C9 CAP ,10µF,16V,±20%,SMD 1YageoCC0805KKX5R7BB106Button K1 Button SMD1Bill of Materials, refer to Figure 3 above.Figure 5: Board PCB Layout - Top LayerFigure 7: Board PCB Layout - Bottom LayerCopyright © 2020 Lumissil Microsystems. All rights reserved. Lumissil Microsystems reserves the right to make changes to this specification and its products at any time without notice. Lumissil Microsystems assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.Lumissil Microsystems does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Lumissil Microsystems receives written assurance to its satisfaction, that:a.) the risk of injury or damage has been minimized;b.) the user assume all such risks; andc.) potential liability of Lumissil Microsystems is adequately protected under the circumstancesREVISION HISTORYRevision Detail Information DataRelease 2020.04.04 A InitialAPPENDIX Ⅱ: IS31FL3246 Arduino Test Code V01A#include<Wire.h>#include<avr/pgmspace.h>#define Addr_GND 0x60//7 bit format is 0x3Fbyte PWM_Gamma64[64]={0x00,0x01,0x02,0x03,0x04,0x05,0x06,0x07,0x08,0x09,0x0b,0x0d,0x0f,0x11,0x13,0x16,0x1a,0x1c,0x1d,0x1f,0x22,0x25,0x28,0x2e,0x34,0x38,0x3c,0x40,0x44,0x48,0x4b,0x4f,0x55,0x5a,0x5f,0x64,0x69,0x6d,0x72,0x77,0x7d,0x80,0x88,0x8d,0x94,0x9a,0xa0,0xa7,0xac,0xb0,0xb9,0xbf,0xc6,0xcb,0xcf,0xd6,0xe1,0xe9,0xed,0xf1,0xf6,0xfa,0xfe,0xff};void setup() {// put your setup code here, to run once:Wire.begin();Wire.setClock(400000);//I2C 400kHz// pinMode(4,OUTPUT);//SDB// digitalWrite(4,HIGH);//SDB_HIGHInit_FL3246();}void loop() {// put your main code here, to run repeatedly:IS31FL3246_mode1();//breath mode}void IS_IIC_WriteByte(uint8_t Dev_Add,uint8_t Reg_Add,uint8_t Reg_Dat){Wire.beginTransmission(Dev_Add/2);Wire.write(Reg_Add); // sends regaddressWire.write(Reg_Dat); // sends regaddressWire.endTransmission(); // stop transmitting}void Init_FL3246(void){uint8_t i = 0;for(i=0x49;i<=0x6C;i++){IS_IIC_WriteByte(Addr_GND,i,0x80);//turn on all LED}for(i=0x01;i<=0x48;i++){IS_IIC_WriteByte(Addr_GND,i,0x00);//write all HPWM set 0x00}IS_IIC_WriteByte(Addr_GND,0x6D,0x00);//update PWM & congtrol registersIS_IIC_WriteByte(Addr_GND,0x6E,0xFF);//Global currentIS_IIC_WriteByte(Addr_GND,0x6F,0xFF);//Global currentIS_IIC_WriteByte(Addr_GND,0x70,0xFF);//Global currentIS_IIC_WriteByte(Addr_GND,0x00,0x01);//normal operation and set 32k HFPS & 120 LFPS 8bit // write 0x11, set 64k HFPS & 240 LFPS 8bit// write 0x31, set 128k HFPS & 480 LFPS 8bit// write 0x03, set 32k HFPS & 120 LFPS 10bit}void IS31FL3246_mode1(void)//white LED{int8_t i = 0;int8_t j = 0;for(i=1;i<=24;i+=2)//R LED running{IS_IIC_WriteByte(Addr_GND,(i*3),0xFF);//set HPWM_LIS_IIC_WriteByte(Addr_GND,0x6D,0x00);//update PWM & congtrol registersdelay(80);//100ms}delay(500); //keep 0.5sfor(i=23;i>0;i-=2)//G LED running{IS_IIC_WriteByte(Addr_GND,(i*3-2),0xFF);//set HPWM_LIS_IIC_WriteByte(Addr_GND,0x6D,0x00);//update PWM & congtrol registers delay(80);//100ms}delay(500); //keep 0.5sfor(i=1;i<=24;i+=2)//B LED running{IS_IIC_WriteByte(Addr_GND,(i*3+2),0xFF);//set HPWM_LIS_IIC_WriteByte(Addr_GND,0x6D,0x00);//update PWM & congtrol registers delay(80);//100ms}delay(500); //keep 0.5sfor (j=63;j>=0;j--)//all LED breath falling{for(i=1;i<=0x48;i+=2){IS_IIC_WriteByte(Addr_GND,i,PWM_Gamma64[j]);//set all HPWM_L }IS_IIC_WriteByte(Addr_GND,0x6D,0x00);//update PWM & congtrol registers delay(30);//20ms}delay(500); //keep o 0.5s}。