MMA8653FCR1 datasheet
iML8686 Datasheet_V1.2-201704
General DescriptionFeaturesThe iML8686 is an 80V constant current regulator that can drive upto 250mA/150mA. Users may adjust the regulating current from 10mA to 250mA/150mA through an external resistor.A linear type over temperature protection function protects the system by decrease the current linearly when the junction tempareture of the chip is higher than 125°C. Multiple iML8686 chips can be connected in parallel to provide higher driving current capability. The device is available in the SOT-223-3L package (250mA) and SOT-89-3L package (150mA).▪ 3V to 80V operation range. ▪ 270mV low current sense voltage. ▪ Linear Over Temperature Protection. ▪ Can be parallel connected for higher current.Typical Application Circuit ApplicationsCR CS▪ A series LED bulbs ▪ LED down lights ▪ LED ceiling lamps▪ AC LED lighting engines. ▪ LED Tube.▪ General LED lighting.Pin Diagram (Top View)SOT-89iML8686APSOT-223iML8686AKCS GND IN 1232CS GND IN1232Ordering InformationBlock DiagramPin DescriptionsAbsolute Maximum RatingsCaution: Values beyond absolute ratings can cause the device to be prematurely damaged.Note:1). All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal.2). All parameters having Min/Max specifications are guaranteed. Typical values are for reference purpose only.3). Unless otherwise noted, all tests are pulsed tests at the specified temperature, therefore: T J = T C = T A.Recommended Operating Conditionssuitable heat-sink area for the chip in PCB design. The maximum allowable power dissipation of the chip highly depends on the PCB design, PCB material, and ambient temperature. The chip may be damaged if the Junction Temperature is higher than 165︒C.Electrical CharacteristicsoNote 1: Dropout Voltage ＝V IN @ 90% × (V CS @ V IN ＝5V)Note 2: The CS Pin Reference Voltage Line Regulation is defined as:∆V LR /V CS =V CS (V IN =40V)-V CS (V IN =5V)V CS(V IN =5V)Note 3: Guarantee by design, not by production test.Note 4: When T J > T TP , the V CS decreases linearly to around 50% at 170°C.JV (T TP )Characteristics CurvesUnless otherwise noted, typical values are @ T A = 25o C.Package InformationSOT- 223θJA100︒C / WθJC 6.25︒C / WSOT-89-3LRecords of Revisions。
最完整的电子BOM清单
C1supercap0.33F, 5.5v Elna DB5R5D3341 C2capacitor470uF, 10v radial electrolytic Multicomp MCRH10V477M8X111 C4capacitor 4.7uF, 250v, polyester film Cornell-Dublier DME2W4P7K1 C5capacitor330uF, 25v, radial Al electrolytic Mallory SK331M025ST1 C6-C8SMT capacitor 12060.1 uF, 100v, mono ceramic AVX 12061E104MAT2A3 C9transient voltage suppressor AVX VA100005A150D1 D1diode150 mA switching rectifier Multicomp 1N41481 D2-D3, D5-8, D910diode1000v, 1A rectifier Multicomp 1N40078 D4zener diode10v, 1W, axial Multicomp 1N4740A1 F1fuse 5x20mm 6.3A time delay1 FC1, 2fuse clips5x20mm PC mount Littlefuse 01000056H2 IC1voltage regulator5V LM340T-5.01 J1wire lead AWG 18, 2.312" LOA, .250 pushon4808-11 J2wire lead AWG 18, 2.312" LOA, .187 pushon4808-21 J3ribbon cable13 - cond, 3.0" length1
Datasheet MLX90614 中文 数据手册 rev008
10-位 PWM 输出模式是连续输出所测物体温度的标准配置，测量物体的温度范围为-20…120 °C，分辨 率为 0.14 °C。PWM 通过修改 EEPROM 内 2 个单元的值，实际上可以根据需求调整至任何温度范围，而这对 出厂校准结果并无影响。
传感器的测量结果均出厂校准化，数据接口为数字式的 PWM 和 SMBus(System Management Bus) 输出。
作为标准，PWM 为 10 位，且配置为-20˚C 至 120 ˚C 内，分辨率为 0.14 ˚C 的连续输出。
传感器出厂默认，上电复位时为 SMBus 通信。
3901090614 Rev 008
PWM 引脚也可配置为热继电器(输入是 To)，这样可以实现简单且性价比高的恒温控制器或温度报警(冰 点/沸点)应用，其中的温度临界值是用户可编程的。在 SMBus 系统里，这个功能可以作为处理器的中断信号， 以此触发读取主线上从动器的值，并确定精度条件。
传感器有两种供电电压选择：5V 或 3V(电池供电)。其中，5V 也可简便的从更高供电电压(例如 8 至 16V)上通过外接元件调制。(具体请参考“应用信息”)
MLX90614 connection to SMBus
图 1: 典型应用电路
2 概述
MLX90614 是一款用于非接触式的红外温度传感器，集成 了红外探测热电堆芯片与信号处理专用集成芯片，全部封装 在 TO-39。
低噪声放大器、17 位 ADC 和强大的 DSP 处理单元的全 集成，使传感器实现了高精度，高分辨率的测量。
卡莱菲减压阀样本 冷热水系统元件 图册
7
此图仅为示意图
减压阀 减压稳压阀 高温减压阀 筒式过滤器 防水锤阀 BALLSTOP 止回球阀 LEGIOMIX 热力杀菌电子恒温混合阀 LEGIOFLOW 多功能水路组件 恒温混合阀 恒温平衡阀 单向泄压阀 温度／压力安全阀 生活热水膨胀罐 限流阀 箱式预组装生活冷热水分水器 防冻元件
5334
卡莱菲倾斜式减压阀
阀芯及滤网可抽取可更换 阀体：黄铜镀铬 耐压：16 bar 出水可调压力：1 ~ 6 bar 耐温：40℃ 带压力表接口1/4" F
样本 ０１０２４
编号 533441 533451 533461
口径 1/2" 3/4" 1"
5330
卡莱菲减压阀阀芯及滤网
适合于5330、5331、5332和5334型减压阀 编号 533000
卡莱菲过滤网
适合于5370筒式过滤器10" 最大压差：3 bar 耐温：5 ~ 40℃ 537004 - 60 μm 织布网 537005 - 50 μm 不锈钢网
编号 537004 537005
防水锤元件
525
样本 ０１０２０
ANTISHOCK
防水锤阀
阀体：黄铜镀铬 耐压：10 bar 耐温：90℃ PTFE密封
119
可视调节型减压阀
5350
样本 ０１０８５
卡莱菲可视调节型减压阀
可抽取式一体阀芯 带预调节显示器 阀体：防脱锌铜 耐压：25 bar 出水可调压力：1 ~ 6 bar 耐温：40℃ ＥＮ １５６７认证 带压力表0 ~10 bar
7
5350
样本 ０１０８５
超特克DN2535低阈值去极模式（常开）双极性MOS晶体管说明书
Supertex inc.DN2535L = Lot NumberYY = Year Sealed WW = Week Sealed= “Green” PackagingFeatures►High input impedance ►Low input capacitance ►Fast switching speeds ►Low on-resistance►Free from secondary breakdown►Low input and output leakageApplications►Normally-on switches ►Solid state relays ►Converters►Linear amplifiers►Constant current sources ►Power supply circuits►TelecomGeneral DescriptionThe Supertex DN2535 is a low threshold depletion mode (normally-on) transistor utilizing an advanced vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.Supertex’s vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.N-Channel Depletion-Mode Vertical DMOS FETsAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Continuous operation of the device at the absolute rating level may affect device reliability. All voltages are referenced to device ground.Pin ConfigurationProduct Marking3-Lead TO-2203-Lead TO-92YY = Year Sealed WW = Week Sealed= “Green” PackagingSi DN 2535 Y Y W W3-Lead TO-2203-Lead TO-92Package may or may not include the following marks: Si orPackage may or may not include the following marks: Si orGATESOURCEDRAINGATESOURCEDRAINDRAIN-G denotes a lead (Pb)-free / RoHS compliant package. Contact factory for Wafer / Die availablity.Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.† I D (continuous) is limited by max rated T j .ONotes:1. All D.C. parameters 100% tested at 25O C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)2. All A.C. parameters sample tested.Switching Waveforms and Test CircuitOUTPUTINPUT OUTPUT0VVDD0V-10VTypical Performance Curves0.50.40.30.20.1V GS = 1.0V0.5V 0V-0.5V-1.0V0.50.40.30.20.1I D (a m p e r e s )G F S (s e i m e n s )V DS (volts)t p (seconds)I D (a m p e r e s )Typical Performance Curves (cont.)1.101.051.000.950.900.8520015010050Q G (nanocoulombs)BV Variation with TemperatureB V D S S (n o r m a l i z e d )C (p i c o f a r a d s )I D (a m p e r e s )V DS (volts)JEDEC Registration TO-92.* This dimension is not specified in the JEDEC drawing.† This dimension differs from the JEDEC drawing.Drawings not to scale.Supertex Doc.#: DSPD-3TO92N3, Version E041009.Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//)©2013 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited.Supertex inc.(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packaging.html .)JEDEC Registration TO-220, Variation AB, Issue K, April 2002.* This dimension is not specified in the JEDEC drawing.† This dimension differs from the JEDEC drawing.Drawings not to scale.Supertex Doc. #: DSPD-3TO220N5, Version C041009.View B。
MMA8652FCR1
Freescale Semiconductor Document Number: MMA8652FCData Sheet: Product PreviewRev. 0, 08/2012© 2012 Freescale Semiconductor, Inc. All rights reserved.This document contains information on a new product. Specifications and information herein are subject to change without notice.Xtrinsic MMA8652FC 3-Axis, 12-bit Digital AccelerometerThe MMA8652FC is an intelligent, low-power, three-axis, capacitivemicromachined accelerometer with 12 bits of resolution. This accelerometer is packed with embedded functions with flexible user programmable options, configurable to two interrupt pins. Embedded interrupt functions enable overall power savings, by relieving the host processor from continuously polling data. There is access to either low-pass or high-pass filtered data, which minimizes the data analysis required for jolt detection and faster transitions. The device can be configured to generate inertial wake-up interrupt signals from any combination of the configurable embedded functions, enabling the MMA8652FC to monitor inertial events and to remain in a low-power mode during periods of inactivity . The MMA8652FC is available in a small 10-pin DFN package (2 mm x 2 mm x 1 mm).Features• 1.95V to 3.6V supply voltage • 1.62V to 3.6V digital interface voltage•±2g, ±4g, and ±8g dynamically selectable full-scale ranges •Output Data Rates (ODR) from 1.56 Hz to 800 Hz •12-bit digital output•I 2C digital output interface with programmable interrupts•Four embedded channels of configurable motion detection (Freefall, Motion, Pulse, Transient)•Orientation (Portrait/Landscape) detection with programmable hysteresis •Automatic ODR change triggered by the Auto-Wake / Sleep state change •32-sample FIFO•High-Pass Filter Data available per sample and through the FIFO •Self-T estTypical Applications•eCompass applications tilt compensation•Static orientation detection (Portrait/Landscape, Up/Down, Left/Right, Back/Front position identification)•Notebook, eReader, and Laptop Tumble and Freefall Detection•Real-time orientation detection (virtual reality and gaming 3D user position feedback)•Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)•Motion detection for portable product power saving (Auto-SLEEP and Auto-WAKE for cell phone, PDA, GPS, gaming)•Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)•User interface (menu scrolling by orientation change, tap detection for button replacement)ORDERING INFORMATIONPart Number Temperature Range Package DescriptionShipping MMA8652FCR1-40°C to +85°CDFN-10Tape and ReelMMA8652FCTop ViewPin ConnectionsVDD SCL INT1BYP INT2SDA GND GNDVDDIO GND12345109876 MMA8652FC 10-PIN DFN2 mm x 2 mm x 1 mmCASE 2162Top and Bottom ViewFeature comparison of the MMA865xFC devicesFeature List MMA8652FC MMA8653FC Digital Resolution (Bits)1210 Digital Sensitivity in 2g mode (Counts/g)1024256 Low-Power Mode Yes Yes Auto-WAKE Yes Yes Auto-SLEEP Yes Yes32-Level FIFO Yes NoLow-Pass Filter Yes Yes High-Pass Filter Yes No Transient Detection with High-Pass Filter Yes No Orientation Detection Portrait to Landscape = 30°, Landscape to Portrait = 60°, and Fixed 45° Threshold Yes Yes Programmable Orientation Detection Yes No Data-Ready Interrupt Yes Yes Single-Tap Interrupt Yes No Double-Tap Interrupt Yes No Directional Tap Interrupt Yes No Freefall Interrupt Yes Yes Motion Interrupt with Direction Yes NoMMA8652FCSensorsContents1Block Diagram and Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.1Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.2Pin descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.3Orientation definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.4Recommended application diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.3Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.4I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.1Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.2Zero-g offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.3Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.1Device calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.28-bit or 12-bit data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.3Internal FIFO data buffer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.4Low power modes vs. high resolution modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.5Auto-WAKE/SLEEP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.6Freefall and motion detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.7Transient detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.8Tap detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.9Orientation detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165.10Interrupt register configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175.11Serial I2C interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.1Register quick jump table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.2Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.3Register summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246.4Data registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266.5FIFO registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296.6System status and ID registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326.7Data configuration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.8Portrait/Landscape configuration and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.9Freefall/Motion configuration and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.10Transient configuration and status registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496.11Pulse configuration and status registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536.12Auto-WAKE/SLEEP register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596.13System and control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616.14Data calibration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7Mounting Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697.1Overview of soldering considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697.2Halogen content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697.3PCB mounting/soldering recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 8Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 718.1Tape dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 718.2Device orientation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 9Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 10Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76MMA8652FC SensorsMMA8652FC Sensors1Block Diagram and Pin Descriptions1.1Block diagramFigure 1. Block diagramSDA SCLVDDIOAuto-WAKE/SLEEPACTIVE ModeSLEEPINT1INT2MODE Options Low PowerLow Noise + Power High Resolution NormalMODE Options Low PowerLow Noise + Power High Resolution NormalACTIVE ModeWAKEMMA8652FCSensors1.2Pin descriptionsFigure 2. Direction of the detectable accelerations1.3Orientation definitionsFigure 3 shows the device configuration in the 6 different orientation modes. There are several registers to configure the orientation detection and are described in detail in the register setting section.Figure 3. Landscape/Portrait orientationDirection of theDetectable Accelerations(Bottom View)(Top View)15610VDD SCL INT1BYPINT2SDA GND VDDIO GNDGND PU = Portrait UpLR = Landscape Right PD = Portrait Down LL = Landscape LeftMMA8652FC Sensors1.4Recommended application diagramFigure 4. Application diagramTable 1. Pin descriptionsPin #Pin Name DescriptionNotes1VDDPower supplyDevice power is supplied through the VDD line. Power supply decoupling capacitors should be placed as near as possible to the pins 1 and 8 of the device.2SCLI 2C Serial Clock7-bit I 2C device address is 0x1D.The control signals SCL and SDA are not tolerant of voltages more than VDDIO + 0.3V. If VDDIO is removed, then the control signals SCL and SDA will clamp any logic signals with their internal ESD protection diodes. The SDA and SCL I 2C connections are open drain, and therefore usually require a pullup resistor.3INT1Interrupt 1The interrupt source and pin settings are user-programmable through the I 2C interface.4BYP Internal regulator output capacitor connection 5INT2Interrupt 2See INT1.6GND Ground 7GND Ground8VDDIO Digital Interface Power supply 9GND Ground 10SDAI 2C Serial DataSee SCL.VDDSCLINT1BYPINT2SDAVDDIO12109876MMA8652FC0.1 μF1 μF0.1 μF345Top ViewVDDIOVDDIO1 k Ω1 k ΩNote: 1 k Ω pullup resistors on INT1/INT2are only needed for open-drain..1 μFMMA8652FCSensors2Mechanical and Electrical Specifications2.1Absolute maximum ratingsStresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Exposure to maximum rating conditions for extended periods may affect device reliability.Table 2. Maximum ratingsRatingSymbol Value Unit Maximum acceleration (all axes, 100 μs)g max 10,000g Supply voltageVDD -0.3 to + 3.6V Input voltage on any control pin (SCL, SDA)Vin -0.3 to VDDIO + 0.3V Drop TestD drop 1.8m Operating Temperature Range T OP -40 to +85°C Storage Temperature RangeT STG-40 to +125°CTable 3. ESD and latch-up protection characteristicsRatingSymbol Value Unit Human Body Model HBM ±2000V Machine Model MM ±200V Charge Device Model CDM ±500V Latch-up Current at T = 85°C—±100mAcause the part to otherwise fail.This device is sensitive to mechanical shock. Improper handling can cause permanent damage of the part or This part is ESD-sensitive. Improper handling can cause permanent damage to the part.MMA8652FC SensorsParameterTest Conditions SymbolMinTyp MaxUnitMeasurement RangeFS[1:0] set to 002g ModeFS±2gFS[1:0] set to 014g Mode ±4FS[1:0] set to 108g Mode ±8SensitivityFS[1:0] set to 002g ModeSo1024counts/gFS[1:0] set to 014g Mode 512FS[1:0] set to 108g Mode256Sensitivity AccuracySoa±2.64%Sensitivity Change vs. TemperatureFS[1:0] set to 002g ModeTCSo ±0.04%/°CFS[1:0] set to 014g Mode FS[1:0] set to 108g ModeZero-g Level Offset Accuracy (1)1.Before board mount.FS[1:0] 2g, 4g, 8g TyOff ±40mg Zero-g Level Offset Accuracy Post-Board Mount (2)2.Post-board mount offset specifications are based on an 8-layer PCB, relative to 25°C. FS[1:0] 2g, 4g, 8g TyOffPBM ±60mg Zero-g Level Change vs. Temperature -40°C to 85°C TCOff±0.3mg/°CSelf-Test Output Change (3)X Y Z3.Self-Test is one direction only.FS[1:0] set to 04g ModeVst 505050LSBODR Accuracy 2 MHz Clock-20+20%Output Data Bandwidth BWODR/3ODR/2Hz Output NoiseNormal Mode ODR = 400 Hz Noise 216µg/√Hz Operating Temperature Range Top-40+85°C Package weightTBDgMMA8652FCSensorsParameterTest ConditionsSymbol Min Typ Max Unit Supply VoltageVDD (1)1.There is no requirement for power supply sequencing. The VDDIO input voltage can be higher than the VDD input voltage.1.952.53.6V Interface Supply VoltageVDDIO (1)1.62 1.83.6VLow Power Mode ODR = 1.56 Hz I dd LP6μAODR = 12.5 Hz 6ODR = 50 Hz14ODR = 100 Hz 24ODR = 200 Hz 44ODR = 400 Hz 85ODR = 800 Hz 165Normal Mode ODR = 1.56 Hz I dd24μAODR = 12.5 Hz 24ODR = 50 Hz24ODR = 100 Hz 44ODR = 200 Hz 85ODR = 400 Hz 165ODR = 800 Hz165Current during Boot Sequence,0.5 mSec max duration using recommended Bypass CapVDD = 2.5V Idd Boot 1mA Value of Capacitor on BYP Pin -40°C to 85°CCap 75100470nFSTANDBY Mode Current at 25°CVDD = 2.5V, VDDIO = 1.8VSTANDBY Mode I dd Stby 1.85μA STANDBY Mode Current over temperature rangeVDD = 2.5V, VDDIO = 1.8VSTANDBY ModeI dd Stby TBDTBDμADigital High Level Input VoltageSCL, SDA VIH 0.75*VDDIOV Digital Low Level Input VoltageSCL, SDA VIL0.3*VDDIOV High Level Output VoltageINT1, INT2I O = 500 μA VOH 0.9*VDDIOV Low Level Output VoltageINT1, INT2I O = 500 μA VOL 0.1*VDDIO V Low Level Output VoltageSDA I O = 500 μA VOLS 0.1*VDDIOVOutput Source CurrentVoltage high level VOUT = 0.75 x VDD,VDD = 2.5V I source3mAOutput Sink Current Voltage high level VOUT = 0.25 x VDD,VDD = 2.5VI sink 3mA Power-on Ramp TimeTpu0.0011000ms Time from VDDIO on and VDD > Vmin until I 2C is ready for operationCbyp = 100 nF BT 350500µs Turn-on time(STANDBY to first sample available) Ton 2/ODR + 1(2) ms Turn-on time(Power down to first sample available)Ton2/ODR + 2(2)ms2.Note that the first sample is typically not very precise; only the second or third or fourth sample (depending on ODR/MODS settings) has fullprecision.2.4I2C interface characteristicsTable6. I2C slave timing values(1)3Terminology3.1SensitivityThe sensitivity is represented in counts/g.•In 2g mode, sensitivity = 1024 counts/g.•In 4g mode, sensitivity = 512 counts/g.•In 8g mode, sensitivity = 256 counts/g.3.2Zero-g offsetZero-g Offset (TyOff) describes the deviation of an actual output signal from the ideal output signal if the sensor is stationary. A sensor stationary on a horizontal surface will measure 0g in X-axis and 0g in Y-axis, whereas the Z-axis will measure 1g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT Registers 0x00, data expressed as a 2's complement number). A deviation from ideal value in this case is called Zero-g offset.Offset is to some extent a result of stress on the MEMS sensor, and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress.3.3Self-TestSelf-T est can be used to verify the transducer and signal chain functionality without the need to apply external mechanical stimulus.When Self-T est is activated:•An electrostatic actuation force is applied to the sensor, simulating a small acceleration. In this case, the sensor outputs will exhibit a change in their DC levels which, are related to the selected full scale through the device sensitivity.•The device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force.4Modes of OperationFigure 6. Operating modes for MMA8652FCSome registers are reset when transitioning from STANDBY to ACTIVE. These registers are all noted in the device memory map register table.The SLEEP and WAKE modes are ACTIVE modes. For more information about how to use the SLEEP and WAKE modes and how to transition between these modes, see Section 5, “Functionality”.Table 7. Operating modesMode I 2C Bus StateVDDVDDIODescriptionOFFPowered Down<1.8V VDDIO Can be > VDD•The device is powered off.•All analog and digital blocks are shutdown. •I 2C bus inhibited.STANDBYI 2C communication with MMA8652FC is possible ONVDDIO = High VDD = HighACTIVE bit is cleared •Only digital blocks are enabled.•Analog subsystem is disabled. •Internal clocks disabled.ACTIVE (WAKE/SLEEP)I 2C communication with MMA8652FC is possibleONVDDIO = High VDD = HighACTIVE bit is setAll blocks are enabled (digital, analog).SLEEPWAKESTANDBYOFFACTIVE5FunctionalityThe MMA8652FC is a low-power, digital output 3-axis linear accelerometer with a I2C interface, and has embedded logic that is used to detect events and notify an external microprocessor over interrupt lines.•8-bit or 12-bit data, high-pass filtered data, 8-bit or 12-bit configurable 32-sample FIFO•Four different oversampling options that allow for the optimum resolution vs. current consumption trade-off to be made for a given application•Low power and auto-WAKE/SLEEP modes for reducing current consumption•Single/double tap with directional information (1 channel)•Motion detection with directional information or Freefall (1 channel)•Transient/jolt detection based on a high-pass filter, with a settable threshold for detecting the change in acceleration abovea threshold with directional information (1 channel)•Flexible user-configurable portrait landscape detection algorithm, for addressing many use cases for screen orientation •Two independent interrupt output pins that are programmable among 7 interrupt sources (Data Ready, Motion/Freefall, Tap, Orientation, Transient, FIFO and Auto-WAKE)All functionality is available in 2g, 4g or 8g dynamic measurement ranges. There are many configuration settings for enabling all of the different functions. Separate application notes are available to help configure the device for each embedded functionality. 5.1Device calibrationThe device is factory calibrated for sensitivity and Zero-g offset for each axis. The trim values are stored in Non-Volatile Memory (NVM). On power-up, the trim parameters are read from NVM and applied to the circuitry. In normal use, further calibration in the end application is not necessary. However, the MMA8652FC allows you to adjust the offset for each axis after power-up, by changing the default offset values. The user offset adjustments are stored in 3 volatile 8-bit registers (OFF_X, OFF_Y, OFF_Z).5.28-bit or 12-bit dataThe measured acceleration data is stored in the following registers as 2’s complement 12-bit numbers:•OUT_X_MSB, OUT_X_LSB•OUT_Y_MSB, OUT_Y_LSB•OUT_Z_MSB, OUT_Z_LSBThe most significant 8-bits of each axis are stored in OUT_X (Y, Z)_MSB, so applications needing only 8-bit results can use these 3 registers (and ignore the OUT_X/Y/Z_LSB registers). To do this (use only 8-bit results), the F_READ bit in CTRL_REG1 must be set. When the F_READ bit is cleared, the fast read mode is disabled.•When the full-scale is set to 2g, the measurement range is -2g to +1.999g, and each count corresponds to (1/1024)g(0.98mg) at 12-bits resolution.•When the full-scale is set to 4g, the measurement range is -4g to +3.998g, and each count corresponds to (1/512)g •(1.96mg) at 12-bits resolution.•When the full-scale is set to 8g, the measurement range is -8g to +7.996g, and each count corresponds to (1/256)g (3.9 mg) at 12-bits resolution.•If only the 8-bit results are used, then the resolution is reduced by a factor of 16.For more information about the data manipulation between data formats and modes, see application note AN4083, Data Manipulation and Basic Settings for Xtrinsic MMA865xFC Accelerometers. There is a device driver available that can be used with the Sensor T oolbox demo board (LFSTBEB865xFC) with this application note.Table8. Accelerometer 12-bit output data12-bit data Range ±2g (1 mg)Range ±4g (2 mg)Range ±8g (4 mg)0111 1111 1111 1.999g+3.998g+7.996g0111 1111 1110 1.998g+3.996g+7.992g…………0000 0000 00010.001g+0.002g+0.004g0000 0000 00000.0000g0.0000g0.0000g1111 1111 1111-0.001g-0.002g-0.004g…………Table8. Accelerometer 12-bit output data (Continued)12-bit data Range ±2g (1 mg)Range ±4g (2 mg)Range ±8g (4 mg)1000 0000 0001-1.999g-3.998g-7.996g1000 0000 0000-2.0000g-4.0000g-8.0000gTable9. Accelerometer 8-bit output data8-bit Data Range ±2g (15.6 mg)Range ±4g (31.25 mg)Range ±8g (62.5 mg)0111 1111 1.9844g+3.9688g+7.9375g0111 1110 1.9688g+3.9375g+7.8750g…………0000 0001+0.0156g+0.0313g+0.0625g0000 00000.000g0.0000g0.0000g1111 1111-0.0156g-0.0313g-0.0625g…………1000 0001-1.9844g-3.9688g-7.9375g1000 0000-2.0000g-4.0000g-8.0000g5.3Internal FIFO data bufferMMA8652FC contains a 32-sample internal FIFO data buffer, which helps minimize traffic across the I2C bus. The FIFO can also save system power, by allowing the host processor/MCU to go into a SLEEP mode while the accelerometer independently stores the data (up to 32 samples per axis).The FIFO can run at all output data rates. There are options for accessing the full 12-bit data or for accessing only the 8-bit data. When access speed is more important than high resolution, the 8-bit data read is a better option.The FIFO contains 4 modes (Fill Buffer mode, Circular Buffer mode, Trigger mode, and Disabled mode), which are described in F_SETUP Register 0x09.•Fill Buffer mode collects the first 32 samples and asserts the overflow flag when the buffer is full and another sample arrives.It does not collect any more data until the buffer is read. This benefits data logging applications where all samples must be collected.•Circular Buffer mode allows the buffer to be filled and then new data replaces the oldest sample in the buffer. The most recent32 samples will be stored in the buffer. This benefits situations where the processor is waiting for an specific interrupt to signalthat the data must be flushed to analyze the event.•Trigger mode will hold the last data up to the point when the trigger occurs, and can be set to keep a selectable number of samples after the event occurs.The MMA8652FC FIFO Buffer has a configurable watermark, allowing the processor to be triggered after a configurable number of samples has filled in the buffer (1 to 32).5.4Low power modes vs. high resolution modesThe MMA8652FC can be optimized for lower power modes or for higher resolution of the output data. One of the oversampling schemes of the data can activated when MODS = 10 in Register 0x2B, which will improve the resolution of the output data only. The highest resolution is achieved at 1.56 Hz.There is a trade-off between low power and high resolution. Low power can be achieved when the oversampling rate is reduced. When MODS = 11, the lowest power is achieved. The lowest power is achieved when the sample rate is set to 1.56 Hz.5.5Auto-WAKE/SLEEP modeThe MMA8652FC can be configured to transition between sample rates (with their respective current consumption) based on four of the interrupt functions of the device. The advantage of using the Auto-WAKE/SLEEP is that the system can automatically transition to a higher sample rate (higher current consumption) when needed, but spends the majority of the time in the SLEEP mode (lower current) when the device does not require higher sampling rates.•Auto-WAKE refers to the device being triggered by one of the interrupt functions to transition to a higher sample rate. This may also interrupt the processor to transition from a SLEEP mode to a higher power mode.。
德州仪器 DTC115ED-D 双 NPN 偏置电阻晶体管 说明书
MUN5236DW1,NSBC115EDXV6Dual NPN Bias Resistor TransistorsR1 = 100 k W, R2 = 100 k W NPN Transistors with Monolithic Bias Resistor NetworkThis series of digital transistors is designed to replace a single device and its external resistor bias network. The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space.Features•Simplifies Circuit Design•Reduces Board Space•Reduces Component Count•S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements;AEC-Q101 Qualified and PPAP Capable•These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS CompliantMAXIMUM RATINGS(T A = 25°C, common for Q1 and Q2, unless otherwise noted)Rating Symbol Max Unit Collector-Base Voltage V CBO50Vdc Collector-Emitter Voltage V CEO50Vdc Collector Current − Continuous I C100mAdc Input Forward Voltage VIN(fwd)40Vdc Input Reverse Voltage V IN(rev)10Vdc Stresses exceeding those listed in the Maximum Ratings table may damage thedevice. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.ORDERING INFORMATIONDevice Package Shipping†MUN5236DW1T1G SOT−3633,000/T ape & ReelNSBC115EDXV6T1G SOT−5634,000/Tape & Reel †For information on tape and reel specifications, including part orientation andtape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.MARKING DIAGRAMSPIN CONNECTIONS7N M GG167N M GG17N=Specific Device CodeM=Date Code*G=Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location.SOT−363CASE 419BSOT−563CASE 463A(1)(2)(3)(6)(5)(4)THERMAL CHARACTERISTICSCharacteristic Symbol Max Unit MUN5236DW1 (SOT−363) ONE JUNCTION HEATEDTotal Device DissipationT A = 25°C(Note1)(Note2) Derate above 25°C(Note1)(Note2)P D1872561.52.0mWmW/°CThermal Resistance,(Note1) Junction to Ambient(Note2)R q JA670490°C/WMUN5236DW1 (SOT−363) BOTH JUNCTION HEATED (Note 3)Total Device DissipationT A = 25°C(Note1)(Note2) Derate above 25°C(Note1)(Note2)P D2503852.03.0mWmW/°CThermal Resistance,Junction to Ambient(Note1)(Note2)R q JA493325°C/WThermal Resistance,Junction to Lead(Note1)(Note2)R q JL188208°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C NSBC115EDXV6 (SOT−563) ONE JUNCTION HEATEDTotal Device DissipationT A = 25°C(Note1) Derate above 25°C(Note1)P D3572.9mWmW/°CThermal Resistance,Junction to Ambient(Note1)R q JA350°C/WNSBC115EDXV6 (SOT−563) BOTH JUNCTION HEATED (Note 3)Total Device DissipationT A = 25°C(Note1) Derate above 25°C(Note1)P D5004.0mWmW/°CThermal Resistance,Junction to Ambient(Note1)R q JA250°C/WJunction and Storage Temperature Range T J, T stg−55 to +150°C 1.FR−4 @ Minimum Pad.2.FR−4 @ 1.0×1.0 Inch Pad.3.Both junction heated values assume total power is sum of two equally powered channels.ELECTRICAL CHARACTERISTICS (T A =25°C, common for Q 1 and Q 2, unless otherwise noted)CharacteristicSymbolMinTypMaxUnitOFF CHARACTERISTICS Collector-Base Cutoff Current (V CB =50V, I E =0)I CBO −−100nAdc Collector-Emitter Cutoff Current (V CE =50V, I B =0)I CEO −−500nAdc Emitter-Base Cutoff Current (V EB =6.0V, I C =0)I EBO −−0.05mAdc Collector-Base Breakdown Voltage (I C =10m A, I E =0)V (BR)CBO 50−−Vdc Collector-Emitter Breakdown Voltage (Note 4)(I C =2.0mA, I B =0)V (BR)CEO50−−VdcON CHARACTERISTICS DC Current Gain (Note 4)(I C =5.0mA, V CE =10V)h FE 80150−Collector-Emitter Saturation Voltage (Note 4)(I C =10mA, I B =0.3mA)V CE(sat)−−0.25V Input Voltage (Off)(V CE =5.0V, I C =100m A)V i(off)− 1.20.5Vdc Input Voltage (On)(V CE =0.3V, I C=1.0mA)V i(on) 3.0 1.7−Vdc Output Voltage (On)(V CC =5.0V, V B =5.5V, R L =1.0k W )V OL −−0.2Vdc Output Voltage (Off)(V CC =5.0V, V B =0.25V, R L =1.0k W )V OH 4.9−−Vdc Input Resistor R170100130k WResistor RatioR 1/R 20.81.01.2Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.4.Pulsed Condition: Pulse Width =300ms, Duty Cycle ≤2%.Figure 1. Derating CurveAMBIENT TEMPERATURE (°C)P D , P O W E R D I S S I P A T I O N (m W )(1) SOT −363; 1.0 × 1.0 Inch Pad (2) SOT −563; Minimum PadTYPICAL CHARACTERISTICS MUN5236DW1, NSBC115EDXV6100102.82.41.61.20.80.40V R , REVERSE VOLTAGE (V)Figure 2. V CE(sat) vs. I CI C , COLLECTOR CURRENT (mA)Figure 3. DC Current GainI C , COLLECTOR CURRENT (mA)Figure 4. Output Capacitance Figure 5. Output Current vs. Input VoltageV in , INPUT VOLTAGE (V)Figure 6. Input Voltage vs. Output CurrentI C , COLLECTOR CURRENT (mA)V C E (s a t ), C O L L E C T O R −E M I T T E R V O L T A G E (V )h F E , D C C U R R E N T G A I NC o b , C A P A C I T A N C E (p F )3.63.210.1I C , C O L L E C T O R C U R R E N T (m A )V i n , I N P U T V O L T A G E (V )2.0SC −88/SC70−6/SOT −363CASE 419B −02ISSUE YDATE 11 DEC 2012SCALE 2:1NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.4.DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H.5.DATUMS A AND B ARE DETERMINED AT DATUM H.6.DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP .7.DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.XXXM G G XXX = Specific Device Code M = Date Code*G = Pb −Free Package GENERICMARKING DIAGRAM*16STYLES ON PAGE 2DIM MIN NOM MAX MILLIMETERS A −−−−−− 1.10A10.00−−−0.10dddb 0.150.200.25C 0.080.150.22D 1.80 2.00 2.20−−−−−−0.0430.000−−−0.0040.0060.0080.0100.0030.0060.0090.0700.0780.086MIN NOM MAX INCHES0.100.004E1 1.15 1.25 1.35e 0.65 BSC L 0.260.360.462.00 2.10 2.200.0450.0490.0530.026 BSC0.0100.0140.0180.0780.0820.086(Note: Microdot may be in either location)*Date Code orientation and/or position may vary depending upon manufacturing location.*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*DIMENSIONS: MILLIMETERS0.306XRECOMMENDEDSIDE VIEWEND VIEWPLANEDETAIL AE A20.700.90 1.000.0270.0350.039L20.15 BSC 0.006 BSC aaa 0.150.006bbb 0.300.012ccc 0.100.0046X*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “G ”, may or may not be present. Some products may not follow the Generic Marking.MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theSTYLE 1:PIN 1.EMITTER 22.BASE 23.COLLECTOR 14.EMITTER 15.BASE 16.COLLECTOR 2STYLE 3:CANCELLEDSTYLE 2:CANCELLEDSTYLE 4:PIN 1.CATHODE2.CATHODE3.COLLECTOR4.EMITTER5.BASE6.ANODESTYLE 5:PIN 1.ANODE2.ANODE3.COLLECTOR4.EMITTER5.BASE6.CATHODESTYLE 6:PIN 1.ANODE 22.N/C3.CATHODE 14.ANODE 15.N/C6.CATHODE 2STYLE 7:PIN 1.SOURCE 22.DRAIN 23.GATE 14.SOURCE 15.DRAIN 16.GATE 2STYLE 8:CANCELLEDSTYLE 11:PIN 1.CATHODE 22.CATHODE 23.ANODE 14.CATHODE 15.CATHODE 16.ANODE 2STYLE 9:PIN 1.EMITTER 22.EMITTER 13.COLLECTOR 14.BASE 15.BASE 26.COLLECTOR 2STYLE 10:PIN 1.SOURCE 22.SOURCE 13.GATE 14.DRAIN 15.DRAIN 26.GATE 2STYLE 12:PIN 1.ANODE 22.ANODE 23.CATHODE 14.ANODE 15.ANODE 16.CATHODE 2STYLE 13:PIN 1.ANODE2.N/C3.COLLECTOR4.EMITTER5.BASE6.CATHODE STYLE 14:PIN 1.VREF2.GND3.GND4.IOUT5.VEN6.VCCSTYLE 15:PIN 1.ANODE 12.ANODE 23.ANODE 34.CATHODE 35.CATHODE 26.CATHODE 1STYLE 17:PIN 1.BASE 12.EMITTER 13.COLLECTOR 24.BASE 25.EMITTER 26.COLLECTOR 1STYLE 16:PIN 1.BASE 12.EMITTER 23.COLLECTOR 24.BASE 25.EMITTER 16.COLLECTOR 1STYLE 18:PIN 1.VIN12.VCC3.VOUT24.VIN25.GND6.VOUT1STYLE 19: PIN 1.I OUT2.GND3.GND4.V CC5.V EN6.V REF STYLE 20:PIN 1.COLLECTOR2.COLLECTOR3.BASE4.EMITTER5.COLLECTOR6.COLLECTORSTYLE 22:PIN 1.D1 (i)2.GND3.D2 (i)4.D2 (c)5.VBUS6.D1 (c)STYLE 21:PIN 1.ANODE 12.N/C3.ANODE 24.CATHODE 25.N/C6.CATHODE 1STYLE 23:PIN 1. Vn2.CH13.Vp4.N/C5.CH26.N/CSTYLE 24:PIN 1.CATHODE2.ANODE3.CATHODE4.CATHODE5.CATHODE6.CATHODESTYLE 25:PIN 1.BASE 12.CATHODE3.COLLECTOR 24.BASE 25.EMITTER6.COLLECTOR 1STYLE 26:PIN 1.SOURCE 12.GATE 13.DRAIN 24.SOURCE 25.GATE 26.DRAIN 1STYLE 27:PIN 1.BASE 22.BASE 13.COLLECTOR 14.EMITTER 15.EMITTER 26.COLLECTOR 2STYLE 28:PIN 1.DRAIN2.DRAIN3.GATE4.SOURCE5.DRAIN6.DRAINSTYLE 29:PIN 1.ANODE2.ANODE3.COLLECTOR4.EMITTER5.BASE/ANODE6.CATHODESC−88/SC70−6/SOT−363CASE 419B−02ISSUE YDATE 11 DEC 2012STYLE 30:PIN 1.SOURCE 12.DRAIN 23.DRAIN 24.SOURCE 25.GATE 16.DRAIN 1Note: Please refer to datasheet forstyle callout. If style type is not calledout in the datasheet refer to the devicedatasheet pinout or pin assignment.SOT −563, 6 LEADCASE 463A ISSUE HDATE 26 JAN 2021SCALE 4:16MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSSOT −563, 6 LEADCASE 463A ISSUE HDATE 26 JAN 2021XX = Specific Device Code M = Month Code G = Pb −Free PackageXX MG GENERICMARKING DIAGRAM*1*This information is generic. Please refer todevice data sheet for actual part marking.Pb −Free indicator, “G” or microdot “G ”, may or may not be present. Some products maynot follow the Generic Marking.ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor thePUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTLITERATURE FULFILLMENT:。
常用开关电源芯片大全之欧阳育创编
常用开关电源芯片大全第1章DC-DC电源转换器/基准电压源1.1 DC-DC电源转换器1.低噪声电荷泵DC-DC电源转换器AAT3113/AAT31142.低功耗开关型DC-DC电源转换器ADP30003.高效3A开关稳压器AP15014.高效率无电感DC-DC电源转换器FAN56605.小功率极性反转电源转换器ICL76606.高效率DC-DC电源转换控制器IRU30377.高性能降压式DC-DC电源转换器ISL64208.单片降压式开关稳压器L49609.大功率开关稳压器L4970A10.1.5A降压式开关稳压器L497111.2A高效率单片开关稳压器L497812.1A高效率升压/降压式DC-DC电源转换器L597013.1.5A降压式DC-DC电源转换器LM157214.高效率1A降压单片开关稳压器LM1575/LM2575/LM2575HV15.3A降压单片开关稳压器LM2576/LM2576HV16.可调升压开关稳压器LM257717.3A降压开关稳压器LM259618.高效率5A开关稳压器LM267819.升压式DC-DC电源转换器LM2703/LM270420.电流模式升压式电源转换器LM273321.低噪声升压式电源转换器LM275022.小型75V降压式稳压器LM500723.低功耗升/降压式DC-DC电源转换器LT107324.升压式DC-DC电源转换器LT161525.隔离式开关稳压器LT172526.低功耗升压电荷泵LT175127.大电流高频降压式DC-DC电源转换器LT176528.大电流升压转换器LT193529.高效升压式电荷泵LT193730.高压输入降压式电源转换器LT195631.1.5A升压式电源转换器LT196132.高压升/降压式电源转换器LT343333.单片3A升压式DC-DC电源转换器LT343634.通用升压式DC-DC电源转换器LT346035.高效率低功耗升压式电源转换器LT346436.1.1A升压式DC-DC电源转换器LT346737.大电流高效率升压式DC-DC电源转换器LT378238.微型低功耗电源转换器LTC175439.1.5A单片同步降压式稳压器LTC187540.低噪声高效率降压式电荷泵LTC191141.低噪声电荷泵LTC3200/LTC3200-542.无电感的降压式DC-DC电源转换器LTC325143.双输出/低噪声/降压式电荷泵LTC325244.同步整流/升压式DC-DC电源转换器LTC340145.低功耗同步整流升压式DC-DC电源转换器LTC340246.同步整流降压式DC-DC电源转换器LTC340547.双路同步降压式DC-DC电源转换器LTC340748.高效率同步降压式DC-DC电源转换器LTC341649.微型2A升压式DC-DC电源转换器LTC342650.2A两相电流升压式DC-DC电源转换器LTC342851.单电感升/降压式DC-DC电源转换器LTC344052.大电流升/降压式DC-DC电源转换器LTC344253.1.4A同步升压式DC-DC电源转换器LTC345854.直流同步降压式DC-DC电源转换器LTC370355.双输出降压式同步DC-DC电源转换控制器LTC373656.降压式同步DC-DC电源转换控制器LTC377057.双2相DC-DC电源同步控制器LTC380258.高性能升压式DC-DC电源转换器MAX1513/MAX151459.精简型升压式DC-DC电源转换器MAX1522/MAX1523/MAX152460.高效率40V升压式DC-DC电源转换器MAX1553/MAX155461.高效率升压式LED电压调节器MAX1561/MAX159962.高效率5路输出DC-DC电源转换器MAX156563.双输出升压式DC-DC电源转换器MAX1582/MAX1582Y64.驱动白光LED的升压式DC-DC电源转换器MAX158365.高效率升压式DC-DC电源转换器MAX1642/MAX164366.2A降压式开关稳压器MAX164467.高效率升压式DC-DC电源转换器MAX1674/MAX1675/MAX167668.高效率双输出DC-DC电源转换器MAX167769.低噪声1A降压式DC-DC电源转换器MAX1684/MAX168570.高效率升压式DC-DC电源转换器MAX169871.高效率双输出降压式DC-DC电源转换器MAX171572.小体积升压式DC-DC电源转换器MAX1722/MAX1723/MAX172473.输出电流为50mA的降压式电荷泵MAX173074.升/降压式电荷泵MAX175975.高效率多路输出DC-DC电源转换器MAX180076.3A同步整流降压式稳压型MAX1830/MAX183177.双输出开关式LCD电源控制器MAX187878.电流模式升压式DC-DC电源转换器MAX189679.具有复位功能的升压式DC-DC电源转换器MAX194780.高效率PWM降压式稳压器MAX1992/MAX199381.大电流输出升压式DC-DC电源转换器MAX61882.低功耗升压或降压式DC-DC电源转换器MAX62983.PWM升压式DC-DC电源转换器MAX668/MAX66984.大电流PWM降压式开关稳压器MAX724/MAX72685.高效率升压式DC-DC电源转换器MAX756/MAX75786.高效率大电流DC-DC电源转换器MAX761/MAX76287.隔离式DC-DC电源转换器MAX8515/MAX8515A88.高性能24V升压式DC-DC电源转换器MAX872789.升/降压式DC-DC电源转换器MC33063A/MC34063A90.5A升压/降压/反向DC-DC电源转换器MC33167/MC3416791.低噪声无电感电荷泵MCP1252/MCP125392.高频脉宽调制降压稳压器MIC220393.大功率DC-DC升压电源转换器MIC229594.单片微型高压开关稳压器NCP1030/NCP103195.低功耗升压式DC-DC电源转换器NCP1400A96.高压DC-DC电源转换器NCP140397.单片微功率高频升压式DC-DC电源转换器NCP141098.同步整流PFM步进式DC-DC电源转换器NCP142199.高效率大电流开关电压调整器NCP1442/NCP1443/NCP1444/NCP1445100.新型双模式开关稳压器NCP1501101.高效率大电流输出DC-DC电源转换器NCP1550102.同步降压式DC-DC电源转换器NCP1570103.高效率升压式DC-DC电源转换器NCP5008/NCP5009 104.大电流高速稳压器RT9173/RT9173A105.高效率升压式DC-DC电源转换器RT9262/RT9262A106.升压式DC-DC电源转换器SP6644/SP6645107.低功耗升压式DC-DC电源转换器SP6691108.新型高效率DC-DC电源转换器TPS54350109.无电感降压式电荷泵TPS6050x110.高效率升压式电源转换器TPS6101x111.28V恒流白色LED驱动器TPS61042112.具有LDO输出的升压式DC-DC电源转换器TPS6112x 113.低噪声同步降压式DC-DC电源转换器TPS6200x114.三路高效率大功率DC-DC电源转换器TPS75003115.高效率DC-DC电源转换器UCC39421/UCC39422116.PWM控制升压式DC-DC电源转换器XC6371117.白光LED驱动专用DC-DC电源转换器XC9116118.500mA同步整流降压式DC-DC电源转换器XC9215/XC9216/XC9217119.稳压输出电荷泵XC9801/XC9802120.高效率升压式电源转换器ZXLB16001.2 线性/低压差稳压器121.具有可关断功能的多端稳压器BAXXX122.高压线性稳压器HIP5600123.多路输出稳压器KA7630/KA7631124.三端低压差稳压器LM2937125.可调输出低压差稳压器LM2991126.三端可调稳压器LM117/LM317127.低压降CMOS500mA线性稳压器LP38691/LP38693128.输入电压从12V到450V的可调线性稳压器LR8129.300mA非常低压降稳压器（VLDO）LTC3025130.大电流低压差线性稳压器LX8610131.200mA负输出低压差线性稳压器MAX1735132.150mA低压差线性稳压器MAX8875133.带开关控制的低压差稳压器MC33375134.带有线性调节器的稳压器MC33998135.1.0A低压差固定及可调正稳压器NCP1117136.低静态电流低压差稳压器NCP562/NCP563137.具有使能控制功能的多端稳压器PQxx138.五端可调稳压器SI-3025B/SI-3157B139.400mA低压差线性稳压器SPX2975140.五端线性稳压器STR20xx141.五端线性稳压器STR90xx142.具有复位信号输出的双路输出稳压器TDA8133143.具有复位信号输出的双路输出稳压器TDA8138/TDA8138A144.带线性稳压器的升压式电源转换器TPS6110x145.低功耗50mA低压降线性稳压器TPS760xx146.高输入电压低压差线性稳压器XC6202147.高速低压差线性稳压器XC6204148.高速低压差线性稳压器XC6209F149.双路高速低压差线性稳压器XC64011.3 基准电压源150.新型XFET基准电压源ADR290/ADR291/ADR292/ADR293151.低功耗低压差大输出电流基准电压源MAX610x152.低功耗1.2V基准电压源MAX6120153.2.5V精密基准电压源MC1403154.2.5V/4.096V基准电压源MCP1525/MCP1541155.低功耗精密低压降基准电压源REF30xx/REF31xx156.精密基准电压源TL431/KA431/TLV431A第2章AC-DC转换器及控制器1.厚膜开关电源控制器DP104C2.厚膜开关电源控制器DP308P3.DPA-Switch系列高电压功率转换控制器DPA423/DPA424/DPA425/DPA4264.电流型开关电源控制器FA13842/FA13843/FA13844/FA138455.开关电源控制器FA5310/FA53116.PWM开关电源控制器FAN75567.绿色环保的PWM开关电源控制器FAN76018.FPS型开关电源控制器FS6M07652R9.开关电源功率转换器FS6Sxx10.降压型单片AC-DC转换器HV-2405E11.新型反激准谐振变换控制器ICE1QS0112.PWM电源功率转换器KA1M088013.开关电源功率转换器KA2S0680/KA2S088014.电流型开关电源控制器KA38xx15.FPS型开关电源功率转换器KA5H0165R16.FPS型开关电源功率转换器KA5Qxx17.FPS型开关电源功率转换器KA5Sxx18.电流型高速PWM控制器L499019.具有待机功能的PWM初级控制器L599120.低功耗离线式开关电源控制器L659021.LINK SWITCH TN系列电源功率转换器LNK304/LNK305/LNK30622.LINK SWITCH系列电源功率转换器LNK500/LNK501/LNK52023.离线式开关电源控制器M51995A24.PWM电源控制器M62281P/M62281FP25.高频率电流模式PWM控制器MAX5021/MAX502226.新型PWM开关电源控制器MC4460427.电流模式开关电源控制器MC4460528.低功耗开关电源控制器MC4460829.具有PFC功能的PWM电源控制器ML482430.液晶显示器背光灯电源控制器ML487631.离线式电流模式控制器NCP120032.电流模式脉宽调制控制器NCP120533.准谐振式PWM控制器NCP120734.低成本离线式开关电源控制电路NCP121535.低待机能耗开关电源PWM控制器NCP123036.STR系列自动电压切换控制开关STR8xxxx37.大功率厚膜开关电源功率转换器STR-F665438.大功率厚膜开关电源功率转换器STR-G865639.开关电源功率转换器STR-M6511/STR-M652940.离线式开关电源功率转换器STR-S5703/STR-S5707/STR-S570841.离线式开关电源功率转换器STR-S6401/STR-S6401F/STR-S6411/STR-S6411F 442.开关电源功率转换器STR-S651343.离线式开关电源功率转换器TC33369～TC3337444.高性能PFC与PWM组合控制集成电路TDA16846/TDA1684745.新型开关电源控制器TDA1685046.“绿色”电源控制器TEA150447.第二代“绿色”电源控制器TEA150748.新型低功耗“绿色”电源控制器TEA153349.开关电源控制器TL494/KA7500/MB375950.Tiny SwitchⅠ系列功率转换器TNY253、TNY254、TNY25551.Tiny SwitchⅡ系列功率转换器TNY264P～TNY268G52.TOP Switch（Ⅱ）系列离线式功率转换器TOP209～TOP22753.TOP Switch-FX系列功率转换器TOP232/TOP233/TOP23454.TOP Switch-GX系列功率转换器TOP242～TOP25055.开关电源控制器UCX84X56.离线式开关电源功率转换器VIPer12AS/VIPer12ADIP57.新一代高度集成离线式开关电源功率转换器VIPer53第3章功率因数校正控制/节能灯电源控制器1.电子镇流器专用驱动电路BL83012.零电压开关功率因数控制器FAN48223.功率因数校正控制器FAN75274.高电压型EL背光驱动器HV8265.EL场致发光背光驱动器IMP525/IMP5606.高电压型EL背光驱动器/反相器IMP8037.电子镇流器自振荡半桥驱动器IR21568.单片荧光灯镇流器IR21579.调光电子镇流器自振荡半桥驱动器IR215910.卤素灯电子变压器智能控制电路IR216111.具有功率因数校正电路的镇流器电路IR216612.单片荧光灯镇流器IR216713.自适应电子镇流器控制器IR252014.电子镇流器专用控制器KA754115.功率因数校正控制器L656116.过渡模式功率因数校正控制器L656217.集成背景光控制器MAX8709/MAX8709A18.功率因数校正控制器MC33262/MC3426219.固定频率电流模式功率因数校正控制器NCP165320.EL场致发光灯高压驱动器SP440321.功率因数校正控制器TDA4862/TDA486322.有源功率因数校正控制器UC385423.高频自振荡节能灯驱动器电路VK05CFL24.大功率高频自振荡节能灯驱动器电路VK06TL第4章充电控制器1.多功能锂电池线性充电控制器AAT36802.可编程快速电池充电控制器BQ20003.可进行充电速率补偿的锂电池充电管理器BQ20574.锂电池充电管理电路BQ2400x5.单片锂电池线性充电控制器BQ2401xB接口单节锂电池充电控制器BQ2402x7.2A同步开关模式锂电池充电控制器BQ241008.集成PWM开关控制器的快速充电管理器BQ29549.具有电池电量计量功能的充电控制器DS277010.锂电池充电控制器FAN7563/FAN756411.2A线性锂/锂聚合物电池充电控制器ISL629212.锂电池充电控制器LA5621M/LA5621V13.1.5A通用充电控制器LT157114.2A恒流/恒压电池充电控制器LT176915.线性锂电池充电控制器LTC173216.带热调节功能的1A线性锂电池充电控制器LTC173317.线性锂电池充电控制器LTC173418.新型开关电源充电控制器LTC198019.开关模式锂电池充电控制器LTC400220.4A锂电池充电器LTC400621.多用途恒压/恒流充电控制器LTC400822.4.2V锂离子/锂聚合物电池充电控制器LTC405223.可由USB端口供电的锂电池充电控制器LTC405324.小型150mA锂电池充电控制器LTC405425.线性锂电池充电控制器LTC405826.单节锂电池线性充电控制器LTC405927.独立线性锂电池充电控制器LTC406128.镍镉/镍氢电池充电控制器M62256FP29.大电流锂/镍镉/镍氢电池充电控制器MAX150130.锂电池线性充电控制器MAX150731.双输入单节锂电池充电控制器MAX1551/MAX155532.单节锂电池充电控制器MAX167933.小体积锂电池充电控制器MAX1736B接口单节锂电池充电控制器MAX181135.多节锂电池充电控制器MAX187336.双路输入锂电池充电控制器MAX187437.单节锂电池线性充电控制器MAX189838.低成本/多种电池充电控制器MAX190839.开关模式单节锂电池充电控制器MAX1925/MAX192640.快速镍镉/镍氢充电控制器MAX2003A/MAX200341.可编程快速充电控制器MAX712/MAX71342.开关式锂电池充电控制器MAX74543.多功能低成本充电控制器MAX846A44.具有温度调节功能的单节锂电池充电控制器MAX8600/MAX860145.锂电池充电控制器MCP73826/MCP73827/MCP7382846.高精度恒压/恒流充电器控制器MCP73841/MCP73842/MCP73843/MCP73844 647.锂电池充电控制器MCP73861/MCP7386248.单节锂电池充电控制器MIC7905049.单节锂电池充电控制器NCP180050.高精度线性锂电池充电控制器VM7205。
艾顿 Moeller 系列快速链接速度调控器 198834说明书
Eaton 198834Eaton Moeller® series Rapid Link - Speed controllers, 8.5 A, 4 kW, Sensor input 4, 180/207 V DC, AS-Interface®, S-7.4 for 31 modules, HAN Q5, with manual override switch, with fanAllgemeine spezifikationEaton Moeller® series Rapid Link Speed controller198834195 mm270 mm 220 mm 3.77 kgUL 61800-5-1 UL approval CEIEC/EN 61800-5-1 RoHS4015081968923RASP5-8401A31-512R001S1Product NameCatalog NumberProduct Length/Depth Product Height Product Width Product Weight Certifications Catalog Notes EANModel Code3 fixed speeds and 1 potentiometer speedcan be switched over from U/f to (vector) speed control Connection of supply voltage via adapter cable on round or flexible busbar junctionDiagnostics and reset on device and via AS-InterfaceInternal and on heat sink, temperature-controlled Fan Parameterization: drivesConnectParameterization: drivesConnect mobile (App) Parameterization: KeypadParameterization: FieldbusKey switch position HANDManual override switchSelector switch (Positions: REV - OFF - FWD)PC connectionKey switch position AUTOPTC thermistor monitoringControl unitInternal DC linkIGBT inverterThermo-click with safe isolationKey switch position OFF/RESETTwo sensor inputs through M12 sockets (max. 150 mA) for quick stop and interlocked manual operationFanFor actuation of motors with mechanical brake1 potentiometer speed3 fixed speeds IP65NEMA 121st and 2nd environments (according to EN 61800-3)IIISpeed controllerAS-Interface profile cable: S-7.4 for 31 modulesASIC2, C3: depending on the motor cable length, the connected load, and ambient conditions. External radio interference suppression filters (optional) may be necessary.C1: for conducted emissions only2000 VAC voltageCenter-point earthed star network (TN-S network)Phase-earthed AC supply systems are not permitted.Vertical15 g, Mechanical, According to IEC/EN 60068-2-27, 11 ms, Half-sinusoidal shock 11 ms, 1000 shocks per shaftResistance: According to IEC/EN 60068-2-6Resistance: 57 Hz, Amplitude transition frequency on accelerationResistance: 10 - 150 Hz, Oscillation frequencyResistance: 6 Hz, Amplitude 0.15 mm Above 1000 m with 1 % performance reduction per 100 m Max. 2000 m-10 °C40 °C-40 °C70 °CFeatures Fitted with:Functions Degree of protectionElectromagnetic compatibility Overvoltage categoryProduct categoryProtocolRadio interference classRated impulse withstand voltage (Uimp) System configuration typeMounting position Shock resistance Vibration AltitudeAmbient operating temperature - min Ambient operating temperature - max Ambient storage temperature - min Ambient storage temperature - max< 95 %, no condensation In accordance with IEC/EN 50178Adjustable, motor, main circuit 0.8 - 8.5 A, motor, main circuit < 10 ms, Off-delay < 10 ms, On-delay 98 % (η)7.8 A3.5 mA120 %Maximum of one time every 60 seconds 380 V480 V380 - 480 V (-10 %/+10 %, at 50/60 Hz)U/f controlPM and LSPM motorsSensorless vector control (SLV) BLDC motorsSynchronous reluctance motors 0 Hz500 HzFor 60 s every 600 s At 40 °C12.7 AClimatic proofingCurrent limitationDelay timeEfficiency Input current ILN at 150% overload Leakage current at ground IPE - max Mains current distortion Mains switch-on frequencyMains voltage - min Mains voltage - max Mains voltage toleranceOperating mode Output frequency - min Output frequency - max Overload current Overload current IL at 150% overload45 Hz66 Hz4 kW400 V AC, 3-phase480 V AC, 3-phase0.1 Hz (Frequency resolution, setpoint value)200 %, IH, max. starting current (High Overload), For 2 seconds every 20 seconds, Power section50/60 Hz8 kHz, 4 - 32 kHz adjustable, fPWM, Power section, Main circuitAC voltageCenter-point earthed star network (TN-S network)Phase-earthed AC supply systems are not permitted.5 HP≤ 0.6 A (max. 6 A for 120 ms), Actuator for external motor brakeAdjustable to 100 % (I/Ie), DC - Main circuit≤ 30 % (I/Ie)280/207 V DC -15 % / +10 %, Actuator for external motor brake10 kAType 1 coordination via the power bus' feeder unit, Main circuit180/207 V DC (external brake 50/60 Hz)24 V DC (-15 %/+20 %, external via AS-Interface® plug)AS-InterfacePlug type: HAN Q5Number of slave addresses: 31 (AS-Interface®) Specification: S-7.4 (AS-Interface®)Max. total power consumption from AS-Interface® power supply unit (30 V): 190 mA C3 ≤ 25 m, maximum motor cable length C2 ≤ 5 m, maximum motor cable length C1 ≤ 1 m, maximum motor cable lengthMeets the product standard's requirements.Rated frequency - minRated frequency - maxRated operational power at 380/400 V, 50 Hz, 3-phase Rated operational voltageResolutionStarting current - maxSupply frequencySwitching frequencySystem configuration type Assigned motor power at 460/480 V, 60 Hz, 3-phase Braking currentBraking torqueBraking voltageRated conditional short-circuit current (Iq)Short-circuit protection (external output circuits) Rated control voltage (Uc)Communication interfaceConnectionInterfacesCable length10.2.2 Corrosion resistanceMeets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Generation change from RA-MO to RAMO 4.0Generation Change RASP4 to RASP5Generation change from RA-SP to RASP 4.0 Elektromagnetische Verträglichkeit (EMV)Generation change RAMO4 to RAMO5Firmware Update RASP 4.0Generation Change RA-SP to RASP5Configuration to Rockwell PLC for Rapid LinkConfiguration to Rockwell PLC Rapid Link 5 Generationentausch RAMO4 zu RAMO5 Generationenwechsel RA-SP zu RASP5Generationentausch RA-SP zu RASP4.0Anschluss von Frequenzumrichtern an Generatornetze Generationentausch RA-MO zu RAMO4.0 Generationswechsel RASP4 zu RASP5MN040003_DEMN034004_DERapid Link 5 - brochureDA-SW-Driver DX-CBL-PC-3M0DA-SW-drivesConnect - installation helpDA-SW-USB Driver PC Cable DX-CBL-PC-1M5DA-SW-drivesConnectDA-SW-USB Driver DX-COM-STICK3-KITDA-SW-drivesConnect - InstallationshilfeMaterial handling applications - airports, warehouses and intra-logisticsETN.RASP5-8401A31-512R001S1.edzIL034085ZUDE | Rapid Link 5Sortimentskatalog Antriebstechnik-DE10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies10.4 Clearances and creepage distances10.5 Protection against electric shock10.6 Incorporation of switching devices and components10.7 Internal electrical circuits and connections10.8 Connections for external conductors10.9.2 Power-frequency electric strength10.9.3 Impulse withstand voltage10.9.4 Testing of enclosures made of insulating material Anmerkungen zur AnwendungBenutzerhandbücherBroschüreneCAD model Installationsanleitung InstallationsvideosKatalogeEaton Konzern plc Eaton-Haus30 Pembroke-Straße Dublin 4, Irland © 2023 Eaton. Alle Rechte vorbehalten. Eaton ist eine eingetrageneMarke.Alle anderen Warenzeichen sindEigentum ihrer jeweiligenBesitzer./socialmediaThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.ramo5_v22.dwgrasp5_v22.stpeaton-bus-adapter-rapidlink-speed-controller-dimensions-002.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-004.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-003.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-005.eps10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility 10.13 Mechanical function mCAD model Zeichnungen。
迈来芯芯片datasheet
FeaturesMicrocontroller: MLX16-FX RISC CPUo16 bit RISC CPU with 20DMIPS and Power-Saving-Modeso Co-processor for fast multiplication and divisiono Flash and EEPROM memory with EECprotocol TruSense Motor Control Technologyand slope control for optimal EMC and thermal performance during power N-FET switching o Monitoring of Drain-Source voltages of the N-FETsPeripheryo 4 independent 16 bit timer modules with capture and compare, and additional software timero 3 programmable 12 bit PWM units with programmable frequencieso10 bit ADC converter (2µs conversion time) and DMA accesso On-chip temperature sensor with ±10K accuracyo System-clock-independent fully integrated watchdogo32 MHz ±5% internal RC oscillator with PLLo Optional crystal oscillatoro Load dump and brown out interrupt functiono Integrated shunt current amplifier with programmable gainApplicationsThe MLX81205/07/10/15 controls BLDC motors via external FET transistors for:Contents1.FUNCTIONAL DIAGRAM (5)2.PIN DESCRIPTION (6)3.777 4.8810111213 5.1414141415 6.1616167.178.181. Functional DiagramHS2T......f mainFigure 1 - Block Diagram Black: common for all versions,Blue: additional pins / functionality for MLX81207,Blue + red: additional pins / functionality for MLX81210 / MLX81215Table 3 - Pin Description MLX81205 / MLX81207 / MLX81210 / MLX81215 3.Electrical CharacteristicsTable 5 - Absolute Maximum Ratings[1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.4.Application ExamplesThe following sections show typical application examples[1].externalThecan beof the [1]4.2 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface withreverse polarity protection in the high side pathIn the sample application of Figure 3, the MLX81207 has been selected in order to benefit from the external high side reverse polarity protection possibility compared to the application shown in section 4.1.All other remarks from the previous application example remain valid.Figure 3 – Typical Sensor-less BLDC Motor Control Application Example with MLX812074.3 Sensor based BLDC Motor ControlIn the sample application of, Figure 4, the MLX81207 can realize the driving of a BLDC motor with three Hall sensors. An external P-FET is used to derive the 3.3V supply with a higher current capability in order to bring power consumption outside the MLX81207.4.4 Sensor-less BLDC Motor Control with absolute position sensingIn the sample application of Figure 5, the MLX81210 is working with an absolute position sensor in order to measure the position of the gear shaft in throttle valve application systems or any other similar applications, where absolute precise position sensing is requested.4.5 Sensor-less BLDC Motor Control via a CAN-Bus-InterfaceIn this sample application the MLX81215 can realize the sensor-less driving of a BLDC motor via a CAN-Bus Interface. System wake-up on CAN-bus traffic is possible. The 5V and a 3.3V voltage supply needed for the CAN-Bus, is generated via external N-FET control in order to limit the power dissipation in the package.The motor current can be monitored via shunt resistors in the ground and battery path in case the application requests a double side monitoring for security reasons.Figure 6 – Typical BLDC Motor Control Application Example on the CAN-Bus with MLX812155. Mechanical Specification5.1 QFN5.1.1. QFN32 5x5 (32 leads)Symbol [1][2]Table 6 – QFN32 5x5 Package Dimensions5.1.2. QFN48 7x7 (48 leads)Symbol [1][2]AA1 A3bDD2EE2eLN [3] ND [4] NE [4] 0.80 00.18 5.00 5.00 0.45 0.85 0.02 0.25 5.10 5.10 0.50Min QFN48 Nom Max0.90 0.05 0.20 0.30 7.00 5.20 7.00 5.20 0.50 0.55481212Table 7 - QFN48 7x7 Package Dimensions[1]Dimensions and tolerances conform to ASME Y14.5M-1994 [2] All dimensions are in Millimeters. All angels are in degrees [3] N is the total number of terminals[4]ND and NE refer to the number of terminals on each D and E side respectively5.2 TQFP EP 48 7x7 (48 leads)Table 8 – TQFP EP 7x7 Package DimensionsNotes:1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line. ∆3. Datum [A-B] and [-D-] to be determined at centerline between leads where leads exist, plastic body at datum plane [-|-|-]∆4. To be determined at seating plane [-C-]∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions.6. 'N' is the total number of terminals∆7. These dimensions to be determined at datum plane [-|-|-]8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b"dimension at maximum material condition, dam bar can not be located on the lower radius of the foot.10. Controlling dimension millimeter.11. Maximum allowable die thickness to be assembled in this package family is 0.38mm12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body.∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size.15. Exposed pad shall be coplanar with bottom of package within 0.05.6.Marking/Order Code 6.1 Marking MLX81205/07/10/157.Assembly InformationThis Melexis device is classified and qualified regarding soldering technology, solder ability and moisture sensitivity level, as defined in this specification, according to following test methods: •IPC/JEDEC J-STD-0208.DisclaimerThe product abstract just provides an overview of the described devices. Please consult the complete product specification/datasheet in its latest revision for any detailed information.Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding theextendedmilitary, For the latest version of this document, go to our website atOr for additional information contact Melexis Direct:Europe, Africa, Asia: America:Phone: +32 1367 0495 Phone: +1 248 306 5400E-mail: sales_europe@ E-mail: sales_usa@ISO/TS16949 and ISO14001 Certified。
赛米控丹佛斯 SKiiP IPM SKiiP 613 GD123-3DUL V3 数据表
SKiiP ®3SKiiP 613 GD123-3DUL V3Features•SKiiP technology inside •Trench IGBTs •CAL HD diode technology •DC-Link voltage monitoring •Integrated current sensor•Integrated temperature sensor •Integrated heat sink•UL recognized File no. E63532Typical Applications*•Renewable energies •Traction •Elevators•Industrial drivesFootnotes1)With assembly of suitable MKP capacitor per terminalSymbolConditions Values UnitSystem V CC 1)Operating DC link voltage900V V isol DC, t =1s, main terminals to heat sink 4300V I t(RMS)per AC terminal, T terminal <115°C 400A I FSM T j =150°C, t p =10ms, sin 180°3500A I²t T j =150°C, t p =10ms, diode 61kA²s f out fundamental output frequency 1kHz T stg storage temperature-40 (85)°CIGBT V CES T j =25°C 1200V I CT j =150°CT s =25°C 577A T s =70°C444A I Cnom 600A T j 2)junction temperature -40...150°C Diode V RRM T j =25°C 1200V I F T j =150°CT s =25°C 466A T s =70°C353A I Fnom 470A T j junction temperature -40...150°C Driver V s power supply13 ... 30V V iH input signal voltage (high)15 + 0.3V V isolPD QPD <= 10pC, PRIM to POWER 1170V dv/dt secondary to primary side 75kV/µs f swswitching frequency15kHzCharacteristics T s = 25°C unless otherwise specified SymbolConditions min.typ.max.UnitIGBT V CE(sat)I C =300A at terminalT j =25°C 1.7 2.1V T j =125°C 1.9V V CE0T j =25°C 0.90 1.10V T j =125°C0.80 1.00V r CE at terminal T j =25°C 2.6 3.3m ΩT j =125°C 3.7 4.4m ΩE on + E off I C =300A T j =125°C V CC =600V 110mJ V CC =900V195mJ R th(j-s)per IGBT switch 0.059K/W R th(j-r)per IGBT switch0.054K/WSKiiP ®3SKiiP 613 GD123-3DUL V3Features•SKiiP technology inside •Trench IGBTs •CAL HD diode technology •DC-Link voltage monitoring •Integrated current sensor•Integrated temperature sensor •Integrated heat sink•UL recognized File no. E63532Typical Applications*•Renewable energies •Traction •Elevators•Industrial drivesFootnotes1)With assembly of suitable MKP capacitor per terminalSymbolConditions min.typ.max.UnitDiode V F = V EC I F =300A at terminalT j =25°C 1.50 1.80V T j =125°C 1.50V V F0T j =25°C 0.9 1.10V T j =125°C0.70.90V r Fat terminal T j =25°C 2 2.3m ΩT j =125°C 2.73m ΩE rr I F =300A T j =125°C V R =600V 21mJ V R =900V28mJ R th(j-s)per diode switch 0.115K/W R th(j-r)per diode switch0.174K/W DriverV s supply voltage non stabilized 132430V I S0bias current @V s =24V, f sw = 0, I AC = 0420mA I sk 1=42mA/kHz, k 2=0.00211mA/A 2= 420+ k 1* f sw+ k 2 * I AC 2mA V IT+input threshold voltage (HIGH)12.3V V IT-input threshold voltage (LOW) 4.6V R IN input resistance 10k ΩC IN input capacitance 1nF t pRESET error memory reset time 0.0122ms t TD top / bottom switch interlock time 3µs t jitter jitter clock time125ns t SIS short pulse suppression time 0.6250.7µs I TRIPSC over current trip level 735750765A PEAK T trip over temperature trip level110115120°C V DCtrip over voltage trip level,900V t d(on)IOV CC =900VI C =300AT j =25°Cinput-output turn-onpropagation time1.4µst d(off)IO input-outputturn-offpropagation time 1.4µsSystem R th(r-a)flow rate=420m 3/h, T a =25°C, 500m above sea level0.0294K/W R CC'+EE'terminals to chip, T s =25°C 0.5m ΩL CE commutation inductance 12nH C CHC per phase, AC-side1.7nF I CES + I RD V GE =0V,V CE =1200V, T j =25°C 1.2mA M dc DC terminals, SI Units 68Nm M ac AC terminals, SI Units 1315Nm w SKiiP System w/o heat sink 2.4kg w hheat sink6.2kgFig. 1: Typical IGBT output characteristic Fig. 2: Typical diode output characteristicsFig. 3: Typical energy losses E = f(I c, V cc)Fig. 4: Typical energy losses E = f(I c, V cc)Fig. 5: Pressure drop Δp versus flow rate V Fig. 6: Transient thermal impedance Zth(j-r)Fig. 7: Transient thermal impedance Zth(r-a)Fig. 8: Coefficients of thermal impedances Fig. 9: Thermal resistance Rth(r-a) versus flow rate VHeat sinkThis is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.System。
MAX865中文资料
Compact, Dual-Output Charge Pump MAX865
ABSOLUTE MAXIMUM RATINGS
V+ to GND .................................................................+12V, -0.3V IN to GND .................................................................+6.2V, -0.3V V- to GND ..................................................................-12V, +0.3V V- Output Current .............................................................100mA V- Short-Circuit to GND ................................................Indefinite Continuous Power Dissipation (TA = +70°C) µMAX (derate 4.1mW/°C above +70°C) .......................330mW Operating Temperature Range MAX865EUA .....................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C
美隆电子--片阻规格书
0
B 10
1
C 10
2
D 10
3
E 10
4
F 10
5
G 10
6
H 10
7
X 10
-1
Y 10
-2
Z 10-3
Approved William Zhao
Checked Apple Liu
Prepared Ellie Zhang
File NO. ML-01-001
2010 1/2W (3/4WS)
5.00±0.10 +0.15 2.50 -0.10 0.55±0.10 0.60±0.25 0.50±0.20
2512 1W
6.35±0.10 +0.15 3.20 -0.10 0.55±0.10 0.60±0.25 0.50±0.20
L W DIMENSION(MM) H A B RESISTANCE VALUE OF JUMPER JUMPER RATED CURRENT JUMPER RATED MAX OVERLOAD CURRENT MAX WORKING VOLTAGE MAX OVERLOAD VOLTAGE DIELECTRIC WITHSTANDING VOLTAGE ±0.5% ±1% ±2% ±5% OPERATING TEMPERATURE
2701 → 2.7KΩ
10R5 → 10.5Ω
(5) STANDARD E-96 SERIES VALUES (±0.5%、±1% TOLERANCE) OF 0603 SIZE. DUE THE SMALL SIZE OF THE RESISTOR’S BODY, 3 DIGITS MARKING WILL BE USED TO INDICATE THE ACCURATE RESISTANCE VALUE BY USING THE FOLLOWING MULTIPLIER & RESISTANCE CODE. MULTIPLIER CODE:
赛米控丹佛斯 SEMITRANS IGBT模块 SKM50GB12V 数据表
®2SKM50GB12V Target Data Features•V-IGBT = 6. Generation Trench V-IGBT (Fuji)•CAL4 = Soft switching 4. Generation CAL-diode•Insulated copper baseplate using DBC technology (Direct Copper Bonding) •Increased power cycling capability •With integrated gate resistor •UL recognized, file no. E63532•Lowest switching losses at High di/dtTypical Applications*•AC inverter drives •UPS•Electronic weldersRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°CAbsolute Maximum Ratings SymbolConditions Values UnitIGBT V CES T j =25°C 1200V I C T j =175°CT c =25°C 77A T c =80°C59A I Cnom 50A I CRMI CRM = 3xI Cnom 150A V GES -20...20V t psc V CC =720V V GE ≤ 15V V CES ≤ 1200VT j =125°C10µs T j-40 (175)°C Inverse diode I F T j =175°CT c =25°C 65A T c =80°C 49A I Fnom 50A I FRM I FRM = 3xI Fnom150A I FSM t p =10ms, sin 180°, T j =25°C270A T j -40 (175)°CModule I t(RMS)200A T stg -40...125°C V isolAC sinus 50 Hz, t =1min4000VCharacteristics SymbolConditions min.typ.max.UnitIGBT V CE(sat)I C =50A V GE =15V chiplevel T j =25°C 1.84 2.29V T j =150°C 2.18 2.63V V CE0chiplevel T j =25°C 0.94 1.04V T j =150°C 0.880.98V r CE V GE =15V chiplevel T j =25°C 1825m ΩT j =150°C2633m ΩV GE(th)V GE =V CE , I C =1.7mA5.566.5V I CES V GE =0V V CE =1200V T j =25°C 0.3mA T j =150°C -mA C ies V CE =25V V GE =0Vf =1MHz 3.0nF C oes f =1MHz 0.30nF C res f =1MHz0.30nF Q G V GE =- 8 V...+ 15 V 550nC R Gint T j =25°C 4.0Ωt d(on)V CC =600V I C =50AV GE =+15/-15V R G on =13ΩR G off =13ΩT j =150°C 276ns t r T j =150°C 35ns E on T j =150°C 4.9mJ t d(off)T j =150°C 403ns t f T j =150°C 62ns E off T j =150°C4.5mJ R th(j-c)per IGBT0.53K/WCharacteristicsSymbolConditionsmin.typ.max.UnitInverse diodeV F = V EC I F =50AV GE =0V chiplevelT j =25°C 2.22 2.54V T j =150°C 2.18 2.50V V F0chiplevel T j =25°C 1.30 1.50V T j =150°C 0.90 1.10V r FchiplevelT j =25°C 1821m ΩT j =150°C2628m ΩI RRM I F =50A di/dt off =1380A/µs V GE =±15V V CC =600V T j =150°C 35A Q rr T j=150°C8.7µC E rr T j =150°C 2.8mJR th(j-c)per diode0.84K/W Module L CE 30nH R CC'+EE'measured per switch T C =25°C 0.65m ΩT C =125°C1.09m ΩR th(c-s)per module 0.040.05K/W M s to heat sink M635Nm M t to terminals M52.55Nm Nm w160g® 2SKM50GB12V Target Data Features•V-IGBT = 6. Generation Trench V-IGBT(Fuji)•CAL4 = Soft switching 4. Generation CAL-diode•Insulated copper baseplate using DBC technology (Direct Copper Bonding) •Increased power cycling capability •With integrated gate resistor •UL recognized, file no. E63532•Lowest switching losses at High di/dtTypical Applications*•AC inverter drives •UPS•Electronic weldersRemarks•Case temperature limited to T c = 125°C max.•Recommended T op = -40 ... +150°C •Product reliability results valid for T j = 150°CGBThis is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.。
parker catalogue 8653 GB 产品说明书
6
Quality
Quality Assurance
Each valve carries its own identification number. It is sent out from the factory with a Quality Assurance Certificate ensuring the following:
Photo courtesy: Haakon Ellingsen
Applications
• Control of the actuator of a on/ off main valve.
• Fail-safe function of a main on/off or modulating valve, the main valve resumes its safe position in case of current failure. Fail-safe valves are either electrically (U133X) or manually (U033X) reset.
These valves close when the electrical signal fails.
When the electrical signal comes back, the valve remains closed, it has to be reset manually.
If the coil is not energized, the valve can be opened by actuating the manual reset button (manual override function), but the valve remains open only when the coil is energized and the reset button has been pushed.
赛米控丹佛斯 分立二极管 SKNa 86 数据表
Stud Diode Avalanche Diodes SKNa 86SKRa 86Features∙Avalanche type reversecharacteristic of 2000 V∙Hermetic metal cases with glass insulator∙Threaded studs ISO M8 or 1/4”-28 UNF-2A2)∙SKN: anode to stud∙SKR: cathode to stud Typical Applications∙DC supply for magnets orsolenoids (brakes, valves, etc.) ∙Field coil supply for DC motors ∙Series connections for high voltage applications like dustprecipitators1) Mounting with grease-like thermal compound or joint contact compound2) M8x1,25 is standard; “UNF” should be added in description for ¼”-28 UNF 2A. SKN SKRV RSMVV(BR)minVI FRMS = 185 A (maximum value for continuous operation)I FAV = 85 A (sin. 180; T c = 130 ºC)1400 1400 SKNa 86/14 SKRa 86/141800 1800 SKNa 86/18 SKRa 86/182000 2000 SKNa 86/20 SKRa 86/20Symbol Condition Values Units I FAV sin. 180 ; T C = 100 ºC 115 A I FSM T vj = 25º C ; 10 ms 1500 AT vj = 180º C ; 10 ms 1275 A i2t T vj = 25º C ; 8,3...10 ms 11250 A2s T vj = 180º C ; 8,3...10 ms 8125 A2s V F T vj = 25º C, I F = 150 A max. 1,3 V V(TO)T vj = 180º C 0,85 V r T T vj = 180º C 3 mΩI R T vj = 180º C ; V R = V(BR)min 10 mA P RSM T vj = 180°C, t P = 10 µs 20 kW R th(j-c) 0,4 K/W R th(c-s) 0,2 K/W T vj-40...+180 °C T stg-40...+180 °C V isol- V~ M s M8 Stud 4 Nm ¼”-28 UNF 2A 2,5 NmM8 Stud (lubricated)1) 3 Nm¼”-28 UNF 2A (lubricated)1) 2 Nm a 5 * 9,81 m/s2 m approx. 20 g Case E 10Fig. 1L Power dissipation vs. forward current Fig. 2 Forward current vs. case temperature Fig. 5 Forward characteristics Fig. 1R Power dissipation vs. ambient temperature Fig. 4 Transient thermal impedance vs. timeFig. 6 Surge overload current vs. timeDimensions in mmCase E10 (JEDEC: DO-203 AB (DO-5))*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or ass urance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged noninfringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updat es. SEMIKRON reserves the right to make changes.。
AD8651资料
Figure 2. 8-Lead MSOP (RM-8)
03301-B-004
NC 1
8 NC
–IN 2 AD8651 7 V+
+IN 3 TOP VIEW 6 OUT V– 4 (Not to Scale) 5 NC
NC = NO CONNECT
Figure 3. 8-Lead SOIC (R-8)
REVISION HISTORY
9/04—Data Sheet Changed from Rev. A to Rev. B
Added AD8652 ....................................................................Universal Change to General Description ....................................................... 1 Changes to Electrical Characteristics ............................................. 3 Changes to Absolute Maximum Ratings ........................................ 5 Change to Figure 23 .......................................................................... 9 Change to Figure 26 .......................................................................... 9 Change to Figure 36 ........................................................................ 11 Change to Figure 42 ........................................................................ 12 Change to Figure 49 ........................................................................ 13 Change to Figure 51 ........................................................................ 13 Inserted Figure 52............................................................................ 13 Change to Theory of Operation section....................................... 14 Change to Input Protection section .............................................. 15 Changes to Ordering Guide ........................................................... 20
电子元器件采购需求
附件：元器件采购需求如下表
B54ACS164245SARH 为性能提升的多用途双向收发器，为一种通用电路，具
有双向异步通信、信号缓冲、电平转换、冷备份电路保护（Cold Sparing）、温备
份电路保护（Warm Sparing）及上电保护功能。
5V 总线到 3.3V 总线；5V 总线到 5V 总线；
3.3V 总线到 5V 总线；3.3V 总线到 3.3V 总线；
冷备份：
电路关断状态时，IO 端等效为高阻抗；
温备份：
电路单端电源上电时，IO 端等效为高阻抗；
上电保护
采用0.5um CMOS 工艺
总剂量：100K rad(Si)
抗单粒子闩锁：LET ≥ 75MeV cm2/mg
高速低功耗
施密特触发输入端，更好的电平噪声抑制
封装：引脚陶瓷扁平封装（CFP48）
质量等级 CAST
B26LV32TERH是一款辐射加固3.3V四通道差分线接收器，接收RS-422差分电平信号，输出3.3V CMOS数字信号。
接口电平满足TIA/EIA-422B协议规范。
器件PIN口兼容TI公司DS26LV32AWQML。
兼容EIA RS-422的差分输入
兼容TI公司DS26LV32AWQML
3.3V工作电压
低的静态电流
环境指标：
抗电离总剂量：100K Rad（Si）
单粒子闩锁阈值：75 MeV·cm2/mg
封装形式 FP16
抗静电能力 (HBM)≥2000V
质量等级 CAST。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
Freescale Semiconductor Document Number: MMA8653FCData Sheet: Product PreviewRev. 0, 08/2012© 2012 Freescale Semiconductor, Inc. All rights reserved.This document contains information on a new product. Specifications and information herein are subject to change without notice.Xtrinsic MMA8653FC 3-Axis, 10-bitDigital AccelerometerThe MMA8653FC is an intelligent, low-power, three-axis, capacitivemicromachined accelerometer with 10 bits of resolution. This accelerometer is packed with embedded functions with flexible user programmable options, configurable to two interrupt pins. Embedded interrupt functions enable overall power savings, by relieving the host processor from continuously polling data. There is access to either low-pass or high-pass filtered data, which minimizes the data analysis required for jolt detection and faster transitions. The device can be configured to generate inertial wake-up interrupt signals from any combination of the configurable embedded functions, enabling the MMA8653FC to monitor inertial events and to remain in a low-power mode during periods of inactivity . The MMA8653FC is available in a small 10-pin DFN package (2 mm x 2 mm x 1 mm).Features• 1.95V to 3.6V supply voltage • 1.62V to 3.6V digital interface voltage•±2g, ±4g, and ±8g dynamically selectable full-scale ranges •Output Data Rates (ODR) from 1.56 Hz to 800 Hz •10-bit digital output •I 2C digital output interface with programmable interrupts•One embedded channel of configurable motion detection (Freefall)•Orientation (Portrait/Landscape) detection with default hysteresis •Automatic ODR change triggered by the Auto-Wake / Sleep state change •Self-T estTypical Applications•eCompass applications tilt compensation•Static orientation detection (Portrait/Landscape, Up/Down, Left/Right, Back/Front position identification)•Notebook, eReader, and Laptop Tumble and Freefall Detection•Real-time orientation detection (virtual reality and gaming 3D user position feedback)•Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)•Motion detection for portable product power saving (Auto-SLEEP and Auto-WAKE for cell phone, PDA, GPS, gaming)•Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)•User interface (menu scrolling by orientation change)ORDERING INFORMATIONPart Number Temperature Range Package DescriptionShipping MMA8653FCR1-40°C to +85°CDFN-10Tape and ReelMMA8653FCTop ViewPin ConnectionsVDD SCL INT1BYP INT2SDA GND GNDVDDIO GND12345109876 10-PIN DFN2 mm x 2 mm x 1 mmCASE 2162Top and Bottom ViewMMA8653FCMMA8653FCFeature comparison of the MMA8653FC devicesFeature List MMA8652FC MMA8653FCDigital Resolution (Bits)1210 Digital Sensitivity in 2g mode (Counts/g)1024256 Low-Power Mode Yes Yes Auto-WAKE Yes Yes Auto-SLEEP Yes Yes32-Level FIFO Yes NoLow-Pass Filter Yes Yes High-Pass Filter Yes No Transient Detection with High-Pass Filter Yes No Orientation Detection Portrait to Landscape = 30°, Landscape to Portrait = 60°, and Fixed 45° Threshold Yes Yes Programmable Orientation Detection Yes No Data-Ready Interrupt Yes Yes Single-Tap Interrupt Yes No Double-Tap Interrupt Yes No Directional Tap Interrupt Yes No Freefall/Motion Interrupt Yes Yes Transient Interrupt with Direction Yes NoMMA8653FCSensorsContents1Block Diagram and Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.1Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.2Pin descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.3Orientation definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.4Recommended application diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.3Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.4I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.1Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.2Zero-g offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.3Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.1Device calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.28-bit or 10-bit data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135.3Low power modes vs. high resolution modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.4Auto-WAKE/SLEEP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.5Freefall detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.6Orientation detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145.7Interrupt register configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165.8Serial I2C interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196.1Register address map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196.2Register bit map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206.3Data registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216.4System Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236.5Portrait/Landscape Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276.6Motion and Freefall Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326.7Auto-WAKE/SLEEP Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.8Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.9Data calibration registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 7Mounting Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477.1Overview of soldering considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477.2Halogen content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477.3PCB mounting/soldering recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 8Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498.1Tape dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498.2Device orientation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 9Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 10Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54MMA8653FC SensorsMMA8653FC Sensors1Block Diagram and Pin Descriptions1.1Block diagramFigure 1. MMA8653 block diagramSDA SCLVDDIOGNDAuto-WAKE/SLEEPACTIVE ModeSLEEPINT1INT2MODE Options Low PowerLow Noise + Power High Resolution NormalMODE Options Low PowerLow Noise + Power High Resolution NormalACTIVE ModeWAKEMMA8653FCSensors1.2Pin descriptionsFigure 2. Direction of the detectable accelerations1.3Orientation definitionsFigure 3 shows the device configuration in the 6 different orientation modes. There are several registers to configure the orientation detection and are described in detail in the register setting section.Figure 3. Landscape/Portrait orientationDirection of theDetectable Accelerations(Bottom View)(Top View)15610VDD SCL INT1BYPINT2SDA GND VDDIO GNDGND PU = Portrait UpLR = Landscape Right PD = Portrait Down LL = Landscape LeftMMA8653FC Sensors1.4Recommended application diagramFigure 4. Application diagramTable 1. Pin descriptionsPin #Pin Name DescriptionNotes1VDDPower supplyDevice power is supplied through the VDD line. Power supply decoupling capacitors should be placed as near as possible to the pins 1 and 8 of the device.2SCLI 2C Serial Clock7-bit I 2C device address is 0x1D.The control signals SCL and SDA are not tolerant of voltages more than VDDIO + 0.3V. If VDDIO is removed, then the control signals SCL and SDA will clamp any logic signals with their internal ESD protection diodes. The SDA and SCL I 2C connections are open drain, and therefore usually require a pullup resistor.3INT1Interrupt 1The interrupt source and pin settings are user-programmable through the I 2C interface.4BYP Internal regulator output capacitor connection 5INT2Interrupt 2See INT1.6GND Ground 7GND Ground8VDDIO Digital Interface Power supply 9GND Ground 10SDAI 2C Serial DataSee SCL.VDDSCLINT1BYPINT2SDAVDDIO121098760.1 μF1 μF0.1 μF345Top ViewVDDIOVDDIO1 k Ω1 k ΩNote: 1 k Ω pullup resistors on INT1/INT2are only needed for open-drain..1 μFMMA8653FCMMA8653FCSensors2Mechanical and Electrical Specifications2.1Absolute maximum ratingsStresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Exposure to maximum rating conditions for extended periods may affect device reliability.Table 2. Maximum ratingsRatingSymbol Value Unit Maximum acceleration (all axes, 100 μs)g max 10,000g Supply voltageVDD -0.3 to + 3.6V Input voltage on any control pin (SCL, SDA)Vin -0.3 to VDDIO + 0.3V Drop TestD drop 1.8m Operating Temperature Range T OP -40 to +85°C Storage Temperature RangeT STG-40 to +125°CTable 3. ESD and latch-up protection characteristicsRatingSymbol Value Unit Human Body Model HBM ±2000V Machine Model MM ±200V Charge Device Model CDM ±500V Latch-up Current at T = 85°C—±100mAcause the part to otherwise fail.This device is sensitive to mechanical shock. Improper handling can cause permanent damage of the part or This part is ESD-sensitive. Improper handling can cause permanent damage to the part.MMA8653FC SensorsParameterTest Conditions SymbolMinTyp MaxUnitMeasurement RangeFS[1:0] set to 002g ModeFS±2gFS[1:0] set to 014g Mode ±4FS[1:0] set to 108g Mode ±8SensitivityFS[1:0] set to 002g ModeSo256counts/gFS[1:0] set to 014g Mode 128FS[1:0] set to 108g Mode64Sensitivity AccuracySoa±2.64%Sensitivity Change vs. TemperatureFS[1:0] set to 002g ModeTCSo ±0.04%/°CFS[1:0] set to 014g Mode FS[1:0] set to 108g ModeZero-g Level Offset Accuracy (1)1.Before board mount.FS[1:0] 2g, 4g, 8g TyOff ±40mg Zero-g Level Offset Accuracy Post-Board Mount (2)2.Post-board mount offset specifications are based on an 8-layer PCB, relative to 25°C. FS[1:0] 2g, 4g, 8g TyOffPBM ±60mg Zero-g Level Change vs. Temperature -40°C to 85°C TCOff±0.3mg/°CSelf-Test Output Change (3)X Y Z3.Self-Test is one direction only.FS[1:0] set to 04g ModeVst 505050LSBODR Accuracy 2 MHz Clock-20+20%Output Data Bandwidth BWODR/3ODR/2Hz Output NoiseNormal Mode ODR = 400 Hz Noise 216µg/√Hz Operating Temperature Range Top-40+85°C Package weightTBDgMMA8653FCSensorsParameterTest ConditionsSymbol Min Typ Max Unit Supply VoltageVDD (1)1.There is no requirement for power supply sequencing. The VDDIO input voltage can be higher than the VDD input voltage.1.952.53.6V Interface Supply VoltageVDDIO (1)1.62 1.83.6VLow Power Mode ODR = 1.56 Hz I dd LP6μAODR = 12.5 Hz 6ODR = 50 Hz14ODR = 100 Hz 24ODR = 200 Hz 44ODR = 400 Hz 85ODR = 800 Hz 165Normal Mode ODR = 1.56 Hz I dd24μAODR = 12.5 Hz 24ODR = 50 Hz24ODR = 100 Hz 44ODR = 200 Hz 85ODR = 400 Hz 165ODR = 800 Hz165Current during Boot Sequence,0.5 mSec max duration using recommended Bypass CapVDD = 2.5V Idd Boot 1mA Value of Capacitor on BYP Pin -40°C to 85°C Cap 75100470nFSTANDBY Mode Current at 25°CVDD = 2.5V, VDDIO = 1.8VSTANDBY Mode I dd Stby 1.85μA STANDBY Mode Current over temperature rangeVDD = 2.5V, VDDIO = 1.8VSTANDBY ModeI dd Stby TBDTBDμADigital High Level Input VoltageSCL, SDA VIH 0.75*VDDIOV Digital Low Level Input VoltageSCL, SDA VIL0.3*VDDIOV High Level Output VoltageINT1, INT2I O = 500 μA VOH 0.9*VDDIOV Low Level Output VoltageINT1, INT2I O = 500 μA VOL 0.1*VDDIO V Low Level Output VoltageSDA I O = 500 μA VOLS 0.1*VDDIOVOutput Source CurrentVoltage high level VOUT = 0.75 x VDD,VDD = 2.5V I source3mAOutput Sink Current Voltage high level VOUT = 0.25 x VDD,VDD = 2.5VI sink 3mA Power-on Ramp TimeTpu0.0011000ms Time from VDDIO on and VDD > Vmin until I 2C is ready for operationCbyp = 100 nF BT 350500µs Turn-on time(STANDBY to first sample available) Ton 2/ODR + 1(2) ms Turn-on time(Power down to first sample available)Ton2/ODR + 2(2)ms2.Note that the first sample is typically not very precise; only the second or third or fourth sample (depending on ODR/MODS settings) has fullprecision.2.4I2C interface characteristicsTable6. I2C slave timing values(1)3Terminology3.1SensitivityThe sensitivity is represented in counts/g.•In 2g mode, sensitivity = 256 counts/g.•In 4g mode, sensitivity = 128 counts/g.•In 8g mode, sensitivity = 64 counts/g.3.2Zero-g offsetZero-g Offset (TyOff) describes the deviation of an actual output signal from the ideal output signal if the sensor is stationary. A sensor stationary on a horizontal surface will measure 0g in X-axis and 0g in Y-axis, whereas the Z-axis will measure 1g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT Registers 0x00, data expressed as a 2's complement number). A deviation from ideal value in this case is called Zero-g offset.Offset is to some extent a result of stress on the MEMS sensor, and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress.3.3Self-TestSelf-T est can be used to verify the transducer and signal chain functionality without the need to apply external mechanical stimulus.When Self-T est is activated:•An electrostatic actuation force is applied to the sensor, simulating a small acceleration. In this case, the sensor outputs will exhibit a change in their DC levels which, are related to the selected full scale through the device sensitivity.•The device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic test-force.4Modes of OperationFigure 6. Operating modes for MMA8653FCSome registers are reset when transitioning from STANDBY to ACTIVE. These registers are all noted in the device memory map register table.The SLEEP and WAKE modes are ACTIVE modes. For more information about how to use the SLEEP and WAKE modes and how to transition between these modes, see Section 5, “Functionality”.Table 7. Operating modesMode I 2C Bus StateVDDVDDIODescriptionOFFPowered Down<1.8V VDDIO Can be > VDD•The device is powered off.•All analog and digital blocks are shutdown. •I 2C bus inhibited.STANDBYI 2C communication with MMA8653FC is possible ONVDDIO = High VDD = HighACTIVE bit is cleared •Only digital blocks are enabled.•Analog subsystem is disabled. •Internal clocks disabled.ACTIVE (WAKE/SLEEP)I 2C communication with MMA8653FC is possibleONVDDIO = High VDD = HighACTIVE bit is setAll blocks are enabled (digital, analog).SLEEPWAKESTANDBYOFFACTIVE5FunctionalityThe MMA8653FC is a low-power, digital output 3-axis linear accelerometer with a I2C interface, and has embedded logic that is used to detect events and notify an external microprocessor over interrupt lines.•8-bit or 10-bit data•Four different oversampling options that allow for the optimum resolution vs. current consumption trade-off to be made for a given application•Low power and auto-WAKE/SLEEP modes for reducing current consumption•Freefall/Motion detection (1 channel)•Single default angle for portrait landscape detection algorithm, for addressing screen orientation•Two independent interrupt output pins that are programmable among 4 interrupt sources (Data Ready, Freefall/Motion, Orientation, Auto-WAKE)All functionality is available in 2g, 4g or 8g dynamic measurement ranges. There are many configuration settings for enabling all of the different functions. Separate application notes are available to help configure the device for each embedded functionality. 5.1Device calibrationThe device is factory calibrated for sensitivity and Zero-g offset for each axis. The trim values are stored in Non-Volatile Memory (NVM). On power-up, the trim parameters are read from NVM and applied to the circuitry. In normal use, further calibration in the end application is not necessary. However, the MMA8653FC allows you to adjust the offset for each axis after power-up, by changing the default offset values. The user offset adjustments are stored in 3 volatile 8-bit registers (OFF_X, OFF_Y, OFF_Z).5.28-bit or 10-bit dataThe measured acceleration data is stored in the following registers as 2’s complement 10-bit numbers:•OUT_X_MSB, OUT_X_LSB•OUT_Y_MSB, OUT_Y_LSB•OUT_Z_MSB, OUT_Z_LSBThe most significant 8-bits of each axis are stored in OUT_X (Y, Z)_MSB, so applications needing only 8-bit results can use these 3 registers (and ignore the OUT_X/Y/Z_LSB registers). To do this (use only 8-bit results), the F_READ bit in CTRL_REG1 must be set. When the F_READ bit is cleared, the fast read mode is disabled.•When the full-scale is set to 2g, the measurement range is -2g to +1.996g, and each count corresponds to (1/256)g(3.8mg) at 10-bit resolution.•When the full-scale is set to 4g, the measurement range is -4g to +3.992g, and each count corresponds to (1/128)g •(7.8mg) at 10-bit resolution.•When the full-scale is set to 8g, the measurement range is -8g to +7.984g, and each count corresponds to (1/64)g(15.6mg) at 10-bit resolution.•If only the 8-bit results are used, then the resolution is reduced by a factor of 16.For more information about the data manipulation between data formats and modes, see application note AN4083, Data Manipulation and Basic Settings for Xtrinsic MMA865xFC Accelerometers. There is a device driver available that can be used with the Sensor T oolbox demo board (LFSTBEB865xFC) with this application note.Table8. Accelerometer 10-bit output data10-bit Data Range ±2g (3.9 mg)Range ±4g (7.8 mg)Range ±8g (15.6 mg)01 1111 1111 1.996g+3.992g+7.984g01 1111 1110 1.992g+3.984g+7.968g…………00 0000 00010.003g+0.007g+0.015g00 0000 00000.000g0.000g0.000g11 1111 1111-0.003g-0.007g-0.015g…………10 0000 0001-1.961g-3.992g-7.984g10 0000 0000-2.000g-4.000g-8.000gTable8. Accelerometer 10-bit output data (Continued)8-bit Data Range ±2g (15.6 mg)Range ±4g (31.25 mg)Range ±8g (62.5 mg)0111 1111 1.984g+3.968g+7.937g0111 1110 1.968g+3.937g+7.875g…………0000 0001+0.015g+0.031g+0.062g0000 00000.000g0.000g0.000g1111 1111-0.015g-0.031g-0.062g…………1000 0001-1.984g-3.968g-7.937g1000 0000-2.000g-4.000g-8.000gTable9. Accelerometer 8-bit output data8-bit Data Range ±2g (15.6 mg)Range ±4g (31.25 mg)Range ±8g (62.5 mg)0111 1111 1.9844g+3.9688g+7.9375g0111 1110 1.9688g+3.9375g+7.8750g…………0000 0001+0.0156g+0.0313g+0.0625g0000 00000.000g0.0000g0.0000g1111 1111-0.0156g-0.0313g-0.0625g…………1000 0001-1.9844g-3.9688g-7.9375g1000 0000-2.0000g-4.0000g-8.0000g5.3Low power modes vs. high resolution modesThe MMA8653FC can be optimized for lower power modes or for higher resolution of the output data. One of the oversampling schemes of the data can activated when MODS = 10 in Register 0x2B, which will improve the resolution of the output data only. The highest resolution is achieved at 1.56 Hz.There is a trade-off between low power and high resolution. Low power can be achieved when the oversampling rate is reduced. When MODS = 11, the lowest power is achieved. The lowest power is achieved when the sample rate is set to 1.56 Hz.5.4Auto-WAKE/SLEEP modeThe MMA8653FC can be configured to transition between sample rates (with their respective current consumption) based on four of the interrupt functions of the device. The advantage of using the Auto-WAKE/SLEEP is that the system can automatically transition to a higher sample rate (higher current consumption) when needed, but spends the majority of the time in the SLEEP mode (lower current) when the device does not require higher sampling rates.•Auto-WAKE refers to the device being triggered by one of the interrupt functions to transition to a higher sample rate. This may also interrupt the processor to transition from a SLEEP mode to a higher power mode.•SLEEP mode occurs after the accelerometer has not detected an interrupt for longer than the user-definable timeout period.The device will transition to the specified lower sample rate. It may also alert the processor to go into a lower power mode, to save on current during this period of inactivity.The interrupts that can WAKE the device from SLEEP are the following: Orientation detection, and Freefall/Motion detection. The interrupts that can keep the device from falling asleep are the same interrupts that can wake the device.5.5Freefall detectionMMA8653FC has a flexible interrupt architecture for detecting either a Freefall or a Motion.•Freefall can be enabled where the set threshold must be less than the configured threshold.•Motion can be enabled where the set threshold must be greater than the configured threshold.The motion configuration has the option of enabling or disabling a high-pass filter to eliminate tilt data (static offset); the freefall configuration does not use the high-pass filter.MMA8653FC has an interrupt architecture for detecting a Freefall. •Freefall can be enabled where the set threshold must be less than the configured threshold.The freefall configuration does not use a high-pass filter.5.5.1Freefall detectionThe detection of “Freefall” involves the monitoring of the X, Y , and Z axes for the condition where the acceleration magnitude is below a user-specified threshold for a user-definable amount of time . The usable threshold ranges are normally between ±100mg and ±500mg.5.6Orientation detectionThe MMA8653FC incorporates an advanced algorithm for orientation detection (ability to detect all 6 orientations), with one default trip point setting. The transition from portrait to landscape is at a fixed 45° threshold angle and at a fixed ±15° hysteresis angle. This allows for smooth transition from portrait to landscape at approximately 30°, and then from landscape to portrait at approximately 60°.The MMA8653FC orientation detection algorithm confirms the reliability of the function with a configurable Z-lockout angle. Based on the known functionality of linear accelerometers, it is not possible to rotate the device about the Z-axis, to detect change in acceleration at slow angular speeds. The angle at which the device no longer detects the orientation change is referred to as the “Z-lockout angle”. The device operates at a fixed 29° angle from the flat position, with an accuracy of ± 2°.•Figure 7 shows the definition of the orientations (PU, PD, LL, LR, BACK, FRONT).•Figure 8 shows the definitions of the trip angles, going from landscape to portrait and then from portrait to landscape.Figure 7. Landscape/Portrait orientationTop ViewPUEarth GravityPin 1X @ 0g Y @ -1g Z @ 0gXout @ 1g Yout @ 0g Zout @ 0gXout @ 0g Yout @ 1g Zout @ 0gXout @ -1g Yout @ 0g Zout @ 0gLLPDLRSide ViewFRONTXout @ 0g Yout @ 0gZout @ 1gBACK Xout @ 0g Yout @ 0gZout @ -1g。