5082-5508-JK000中文资料

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QC080000标准-中文版

QC080000标准-中文版___（IEC）制定了IEC质量评价系统（IECQ），用于评估电子电器器件和产品的质量。

其中，危险物品进程管理系统要求（HSPM）是其中的一个重要参考标准，其参考号为QC :2005.该标准要求企业建立和实施一套完整的危险物品进程管理系统，以确保产品的质量和安全性。

这套管理系统包括了供应链管理、生产过程控制、产品检验和测试、问题解决和持续改进等方面。

通过IECQ的评估，企业可以证明其危险物品进程管理系统符合QC 标准的要求，进而获得IECQ HSPM认证。

这不仅可以提升企业的品牌形象和市场竞争力，还可以降低产品质量问题和安全事故的风险，保障消费者的权益。

值得注意的是，IECQ HSPM认证并非一次性的，企业需要定期接受评估，以确保其管理系统的持续有效性和符合性。

此外，IECQ还提供了其他类型的质量评价系统，如可靠性评价系统（IECQ AP）、环境管理系统评价系统（IECQ EMS）等，以满足不同企业的需求。

___发布了电子电器器件及产品危险物品进程管理系统要求(HSPM)标准，旨在将标有害物标标品及制程与管理原标整合。

该标准是附加于ISO9001-2000版质量管理体制(QMS)架构中，通过完整、系统化及透明的流程管理及管制来达成HSF目标。

此文件基于EIA/ECCB标准954电子电器器件及产品无有害物质标准和要求，作为给制造商在履行HSF和用户要求的指导，其中可能包括规章要求，如欧洲议会的2002/95/EC指令要求和2003年1月27日委员会关于电气、电子设备中限制使用某些有害物质指令(RoHS)内的使用限制的要求，以及欧洲议会的2002/96/EC指令和2003年1月27日的委员会关于报废电子电器设备指令(WEEE)的要求。

需要注意的是，围绕世界范围一些审判的立法存在或者悬而未决，需要将一个特定的目录中指定的危害物质(HS)消除，包括铅，水银，镉，六价铬，多溴联苯(PBB)，以及来自产品大范围的多溴联苯醚(PBDE)。

QC080000手册

1.管理手冊編制說明1.1主題內容本管理手冊按GB/T19001：2000、GB/T24001：2004和ISO/TS 16949:2002、GB/T 28001:2001的要求編寫。

著重闡明本公司的品質環境、環境管理物質、職業健康安全體系職責和管理要求，是綱領性文件，是各部門、各類人員爲保證産品品質、提高工作品質、保護環境、保障職業安全必須遵循的行為準則。

1.2適用範圍本管理手冊適用於公司內部的品質環境、環境管理物質、職業健康安全管理。

1.3 管理手冊制訂過程管理手冊是在本公司副(總)經理親自領導、管理者代表直接主持下由推行小組組織編制。

首先，公司對班組長以上的員工進行了GB/T19000、GB/T14000、ISO/TS16949、GB/T 28000國際標準的培訓，然後在全體員工中進行培訓。

通過培訓明顯提高了全員的品質環境、職業健康安全體系管理意識。

品質環境、職業健康安全政策是根據公司“以技術為先鋒,以品質為命脈,滿足客戶需求,致力公司發展”的經營理念,結合顧客要求和公司最高管理者對遵循有關法律法規及持續改進的承諾，並分析了公司管理狀態的基礎上擬定的。

最後由(副)總經理批准發佈。

本管理手冊描述了本公司品質環境、環境管理物質、職業健康安全體系的要求、涉及活動和相關文件等內容。

是指導各項品質環境管理活動開展的行為準則。

1.4 管理手冊的管理1.4.1管理的目的爲了保持管理手冊正確性、完整性和有效性，使管理手冊處於受控狀態.1.4.2 版本/版次第一次制訂之原版以A/0表示,A版第一次修訂須以A/1表示,依此類推.具體依【文件管制程序】執行.1.4.3管理手冊之發行管理手冊由推行小組組織編制、管理代表審核、(副)總經理核準. 經準之管理手冊由系統維護影印適當份數分發各相關單位.1.4.4管理手冊之修訂、銷毀管理手冊修訂後,發放新版時應及時回收舊版本,並作銷毀處理.1.4.5管理手冊之保存管理手冊原稿由系統維護列帳保管.2.頒佈令为建立、实施和改进我司的QC080000体系文件，提高绿色产品管理，满足顾客和相关环保法律法规要求，达到顾客满意。

5082-5501-KH000中文资料

14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeries HDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 2. Maximum Tolerable Peak Current vs. Pulse Duration – AlGaAs Red.Figure 1. Maximum Tolerable Peak Current vs.Pulse Duration – Red.Figure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 6. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °C AI M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G M EN T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

5082-2800中文资料

Schottky Barrier Diodes for General Purpose ApplicationsTechnical DataFeatures• Low Turn-On VoltageAs Low as 0.34 V at 1 mA• Pico Second Switching Speed • High Breakdown VoltageUp to 70 V• Matched Characteristics AvailableDescription/Applications The 1N5711, 1N5712, 5082-2800/ 10/11 are passivated Schottky barrier diodes which use a patented “guard ring” design to achieve a high breakdown voltage. Packaged in a low cost glass package, they are well suited for high level detecting, mixing, switching, gating, log or A-D converting, video detecting, frequency discriminating, sampling, and wave shaping.The 5082-2835 is a passivatedSchottky diode in a low cost glasspackage. It is optimized for lowturn-on voltage. The 5082-2835 isparticularly well suited for theUHF mixing needs of the CATVmarketplace.The 5082-2300 Series and5082-2900 devices are unpas-sivated Schottky diodes in a glasspackage. These diodes haveextremely low 1/f noise and areideal for low noise mixing, andhigh sensitivity detecting. Theyare particularly well suited for usein Doppler or narrow band videoreceivers.1N57111N57125082-2300 Series5082-2800 Series5082-2900DIMENSIONS IN MILLIMETERS AND (INCHES).Outline 15Maximum RatingsJunction Operating and Storage Temperature Range5082-2303, -2900.................................................................-60°C to +100°C 1N5711, 1N5712, 5082-2800/10/11....................................-65°C to +200°C 5082-2835............................................................................-60°C to +150°C DC Power Dissipation(Measured in an infinite heat sink at T CASE = 25°C)Derate linearly to zero at maximum rated temperature5082-2303, -2900..............................................................................100 mW 1N5711, 1N5712, 5082-2800/10/11.................................................250 mW 5082-2835.........................................................................................150 mW Peak Inverse Voltage.................................................................................V BRPackage CharacteristicsOutline 15Lead Material........................................................................................DumetLead Finish..............................................................................95-5% Tin-LeadMax. Soldering Temperature................................................260°C for 5 secMin. Lead Strength....................................................................4 pounds pullTypical Package Inductance1N5711, 1N5712:................................................................................2.0 nH2800 Series:........................................................................................2.0 nH2300 Series, 2900:..............................................................................3.0 nHTypical Package Capacitance1N5711, 1N5712:................................................................................0.2 pF2800 Series:........................................................................................0.2 pF2300 Series, 2900:............................................................................0.07 pFThe leads on the Outline 15 package should be restricted so that thebend starts at least 1/16 inch from the glass body.Outline 15 diodes are available on tape and reel. The tape and reelspecification is patterned after RS-296-D.Electrical Specifications at T= 25°CAGeneral Purpose DiodesMin.Max.V F = 1 V Max.Max.Max.Breakdown Forward at Forward Reverse Leakage Capaci-Part Package Voltage Voltage Current Current tance Number Outline V BR (V)V F (mV)I F (mA)I R (nA) at V R (V)C T (pF) 5082-280015704101520050 2.0 1N571115704101520050 2.0 5082-281015204103510015 1.2 1N571215205503515016 1.2 5082-28111515410201008 1.2 5082-2835158*34010*1001 1.0 Test I R = 10 µA I F = 1 mA*V F = 0.45 V V R = 0 V Conditions*I R = 100 µA f =1.0 MHz Note: Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA except for 5082-2835 which is measured at 20 mA.Low 1/f (Flicker) Noise DiodesMin.Max.V F = 1 V Max.Max.Max.Part Breakdown Forward at Forward Reverse Leakage Capaci-Number Package Voltage Voltage Current Current tance 5082-Outline V BR (V)V F (mV)I F (mA)I R (nA) at V R (V)C T (pF) 230315204003550015 1.0 29001510400201005 1.2 Test I R = 10 µA I F = 1 mA V R = 0 V Conditions f =1.0 MHzNote: Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 20 mA.Matched Pairs and QuadsBasic Matched MatchedPart Number Pair Quad Batch5082-Unconnected Unconnected Matched[1]Test Conditions2900∆VF at IF= 1.0, 10 mA28005082-28045082-2805∆V F at I F = 0.5, 5 mA ∆V F = 20 mV∆V F = 20 mV*I F = 10 mA∆C O at f = 1.0 MHz28115082-2826∆VF at IF= 10 mA∆V F = 10 mV∆C O at f = 1.0 MHz ∆C O = 0.1 pF28355082-2080∆VF at IF=10 mA∆V F = 10 mV∆C O at f = 1.0 MHz∆C O = 0.1 pFNote:1. Batch matched devices have a minimum batch size of 50 devices.SPICE ParametersParameter Units5082-28005082-28105082-28115082-28355082-23035082-2900B V V75251892510C J0pF 1.60.8 1.00.70.7 1.1E G eV0.690.690.690.690.690.69I BV A10E-510E-510E-510E-510E-510E-5I S A 2.2 x 10E-9 1.1 x 10E-90.3 x 10E-8 2.2 x 10E-87 x 1.0E-910E-8N 1.08 1.08 1.08 1.08 1.08 1.08 R SΩ25101051015 P B V0.60.60.60.560.640.64 PT222222 M0.50.50.50.50.50.5Typical ParametersV F – FORWARD VOLTAGE (V)Figure 1. I-V Curve Showing Typical Temperature Variation for 5082-2300 Series and 5082-2900 Schottky Diodes.1001010.10.01I F - F O R W A R D C U R R E N T (m A )V BR (V)Figure 2. 5082-2300 Series Typical Reverse Current vs. Reverse Voltage at Various Temperatures.10.0001,000100101I R (n A )051015100755025T A = 25°CI F - FORWARD CURRENT (mA)Figure 3. 5082-2300 Series and 5082-2900 Typical Dynamic Resistance (R D ) vs. Forward Current (I F ).100010010R D - D Y N A M I C R E S I S T AN C E (Ω)0.01010100V R - REVERSE VOLTAGE (V)Figure 4. 5082-2300 and 5082-2900 Typical Capacitance vs. Reverse Voltage.1.21.00.80.60.40.20C T - C A P A C I T A N C E (p F )048121620V F - FORWARD VOLTAGE (V)Figure 5. I-V Curve Showing Typical Temperature Variation for 5082-2800 or 1N5711 Schottky Diodes.5010510.50.10.050.01I F - F O R W A R D C U R R E N T (m A )00.20.40.60.8 1.0 1.2V R - REVERSE VOLTAGE (V)Figure 6. (5082-2800 OR 1N5711) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0.20.40.60.81.01.2V R - REVERSE VOLTAGE (V)Figure 7. (5082-2800 or 1N5711)Typical Capacitance (C T ) vs. Reverse Voltage (V R ).12.01.51.00.50C T - C A P A C I T A N C E (p F )010********V F - FORWARD VOLTAGE (V)Figure 8. I-V Curve Showing Typical Temperature Variation for the 5082-2810 or 1N5712 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )V R - REVERSE VOLTAGE (V)Figure 9. (5082-2810 or IN5712)Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.10,0001000100101.0I R - R E V E R S E C U R R E N T (n A )Typical Parameters, continuedV F - FORWARD VOLTAGE (V)Figure 10. I-V Curve Showing Typical Temperature Variation for the 5082-2811 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )0.40.20.60.81.01.2V R - REVERSE VOLTAGE (V)Figure 11. (5082-2811) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0510********V F - FORWARD VOLTAGE (V)Figure 12. I-V Curve Showing Typical Temperature Variations for 5082-2835 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )00.20.40.60.8 1.0 1.2V R - REVERSE VOLTAGE (V)Figure 13. (5082-2835) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0123456V R - REVERSE VOLTAGE (V)Figure 14. Typical Capacitance (C T ) vs. Reverse Voltage (V R ).C T - C A P A C I T A N C E (p F )0246810I F - FORWARD CURRENT (mA)Figure 15. Typical Dynamic Resistance (R D ) vs. Forward Current (I F ).1000100101R D - D Y N A M I C R E S I S T A N C E (Ω)Diode Package Marking1N5xxx5082-xxxxwould be marked:1Nx xxxxx xxYWW YWWwhere xxxx are the last four digits of the 1Nxxxx or the 5082-xxxx partnumber. Y is the last digit of the calendar year. WW is the work week ofmanufacture.Examples of diodes manufactured during workweek45 of 1999:1N57125082-3080would be marked:1N53071280945945Data subject to change.Copyright © 1999 Agilent TechnologiesObsoletes 5968-4304E5968-7181E (11/99)。

%u5EFA%u8BAE%u4E66%uFF0D%u5B89%u5FBD%u957F%u6C5F%u94A2%u94C1101207

项目名称：耐火材料研发中心项目预算：307.25万元，采购56台设备。

其中高温检测室共设备25台，合计248.8万元，常温检测室设备14台，合计36.67万元，制样设备17台，合计21.78万元。

一、项目报价及区域设置：（见附件一）高温检测室一和高温检测室三全部放置工控机控制的高温设备，并且摆放一台干燥箱，高温室一和高温室三的总面积和设备摆放可根据实际情况适当调整。

高温检测室二放置仪表控制的高温设备，且摆放一台干燥箱。

高温检测室四放置使用燃气的高温设备。

常温检测室一放置的是声音相对较大的常温设备。

常温检测室二放置的是基本无噪音的常温设备。

制样设备统一摆放在制样间。

备品备件统一放置在仓库。

二、设备的技术参数详见设备报价一览表，详细情况见下文（见附件四）。

三、依据设备数量及相关技术参数，我们建议贵公司建立8间配套耐火材料检测室，其中高温检测室4间，常温检测室2间，制样设备室1间，仓库1间，房间所需的总面积462㎡，电源总配电容量约需1510A，详细情况如图（见附件二）。

高温检测室一可建成有玻璃隔断的形式，以便将高温炉和控制柜分开。

常温检测室一需有高800mm宽800mm的操作台。

每个房间需通进水口和下水口，并安装相关电源、空气开关和接地线。

设备环境：温度在-10～35℃之间，相对湿度不大于80%无扬尘无震动海拔在4000m以下四、根据设备总数量及操作难易程度，我们建议贵公司配备12名工作人员。

其中包括管理人员1名，设备维护人员1名，设备操作人员10名（见附件三）。

如果任务量特别大，可适当增加工作人员。

技术资料：一、高温检测室一1 CSL16-15-16P系列重烧试验炉(高温电炉)仪器用途：该设备广泛在冶金、建材、机械、化工等行业作加热炉之用，特别适用于耐火材料行业耐火制品在各种气氛下的重烧线变化的测试及烧结。

执行标准：该设备按照国家标准GB/T 5988—86《致密定型耐火制品重烧线变化试验方法》对试验炉要求制作。

TK000-经典通用宝藏文档

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伸缩器制造安装记录
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总监理工程师签字：年月日
山东省建设工程质量监督总站监制
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建筑安装工程装备、成品、半成品、材料合格证汇总表
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8
装备（开箱）进场验收记录
鲁TK－007
9
材料、成品、半成品进场验收记录
鲁TK－008
10
合格证贴条
鲁TK－009
11
复印件（或抄件）贴条
鲁TK－010
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阀门（清洗）实验记录
鲁TK－011
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管道隐蔽工程验收记录
鲁TK－012
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水、气压实验记录
鲁TK－028
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风口平衡实验（调解）记录
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防腐施工记录
鲁TK－030
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绝热施工记录
鲁TK－031
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透风空调装备单机试运转及调试记录
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透风空调零碎无消费负荷下的联合试运转及调试记录
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透风空调零碎无消费负荷下的联合试运转及调试记录附表
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制冷零碎气密性实验记录
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净化空调零碎风管清洗记录
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现场组装除尘器、空调机漏风检测记录
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工序交接记录
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透风空调装备、管道（防静电）接地检查验收记录
鲁TK－026
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透风安装普通性检查记录
鲁TK－027
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空调安装普通性检查记录

[精选]smpqa00402质量标准及检验规程编制管理规程资料

1目的：本程序规定了质量标准及检验操作规程制订的原则和内容，以保证质量标准的科学性、合理性、可行性，明确各类质量标准及检验规程的格式及内容要求。

2范围：本规程适用于本公司原料、包材、中间体、成品的质量标准及检验操作规程的制定。

3职责：质量部：负责编制或修订相应的质量标准；研发部：负责提供相应的工艺研发资料；质量部负责人：负责批准质量标准。

4程序：4.1质量标准的制订原则质量标准是控制产品质量的有效措施之一，主要由检测项目（含使用的分析方法）和限度组成。

在产品研发过程中需对其质量进行系统、深入的研究，制订出科学、合理、可行的质量标准，并不断地修订和完善，以控制产品的质量，保证其在有效期内安全有效。

4.1.1质量标准的检测项目的确定检测项目应尽可能全面，既要考虑一般性要求，又要有针对性，能充分地反映产品的特性及质量变化的情况, 有效地控制产品批间质量的一致性。

质量标准中所用的分析方法应符合“准确、灵敏、简便、快速”的原则，而且要有一定的适用性和重现性。

检测项目一般应包括性状、鉴别、检查及含量测定等几个方面。

4.1.1.1性状●外观（包括状态、色泽、结晶性、引湿性等）●溶解度：通常考察产品在水及常用溶剂中的溶解度。

●熔点：熔点是鉴别和检查产品的纯度指标之一。

●旋光度或比旋度：旋光度或比旋度是反映具光学活性化合物固有特性及其纯度的指标。

4.1.1.2鉴别鉴别试验采用专属性强，灵敏度高、重复性好，操作简便的方法，常用的方法有化学反应法（选择官能团专属的化学反应进行鉴别。

包括显色反应、沉淀反应、盐类的离子反应等）、IR、HPLC、GC等。

4.1.1.3检查检查项目通常应考虑安全性、有效性和纯度三个方面的内容。

产品按既定的工艺生产和正常贮藏过程中可能产生需要控制的杂质，主要有工艺杂质(包括起始原料及试剂、制备中间体及副反应产物等)、降解产物、异构体和残留溶剂等，因此要进行质量研究，并结合实际制订出能真实反映产品质量的杂质控制项目，以保证产品的安全有效。

食品安全管理体系法律法规清单(2015年第3季度更新)

食用植物油煎炸过程中的极性组分(PC)的测定粮谷中敌菌灵残留量的测定粮谷中敌草快残留量的测定
油脂中没食子酸丙酯(PG)的测定粮食卫生标准的分析方法
食用植物油卫生标准的分析方法粮食中二溴乙烷残留量的测定食用氢化油、人造奶油卫生标准的分析方法谷物和大豆中赭曲霉毒素A的测定粮油检验粮食、油料的色泽、气味、口味鉴定
小麦和小麦粉面筋含量第3部分：烘箱干燥法测定干面筋
小麦和小麦粉面筋含量第4部分：快速干燥法测定干面筋
粮油检验粉类粗细度测定粮油检验粉类粮食含砂量测定粮油检验粉类磁性金属物测定谷物和豆类氮含量测定和粗蛋白质含量计算凯
氏法粮油检验粮食中粗脂肪含量测定粮油检验粮食中还原糖和非还原糖测定粮油检验粮食、油料中淀粉含量测定粮油检验粮食中粗纤维素含量测定介质过滤法粮油检验粮食、油料相对密度的测定
GB/T 5009.172-2003
GB/T 5009.174-2003 GB/T 5009.175-2003 GB/T 5009.177-2003 GB/T 5009.180-2003 GB/T 5009.181-2003 GB/T 5009.207-2008 GB/T 5009.209-2008 GB/T 5009.21-2003 GB/T 5009.219-2008 GB/T 5009.200-2003 GB/T 5009.202-2003 GB/T 5009.220-2008 GB/T 5009.221-2008 GB/T 5009.32-2003 GB/T 5009.36-2003 GB/T 5009.37-2003 GB/T 5009.73-2003 GB/T 5009.77-2003 GB/T 5009.96-2003

HS00-98250中文资料

Turns Ratio7 Tx Rx
Style 12-pin SMT 12-pin SMT 14-pin PCMCIA 14-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin PCMCIA 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMT 16-pin SMS00-041514,5 HS00-995854 HS00-04021 HS00-98264 HS00-02571 HS00-02711 HS00-05108 HS91-01267 HS00-98265 HS00-99112 HS00-04078 HS00-04148 HS91-01180 HS00-00089 HS00-00508 HS00-01043 HS00-03178 HS00-03833 HS00-04054 HS00-04157 HS00-05065 HS00-05066 HS00-99142 HS00-99557 HS00-99657 HS00-00100 HS00-00521 HS00-00525 HS00-03020A5 HS00-05011 HS00-98241 HS00-98242 HS00-98243 HS00-98244 HS00-98245 HS00-98272 HS00-99160 HS00-99193 HS00-99702 HS00-99705E HS91-030365 HS91-97700

QC080000标准-中文版

国际电工委员会QC 080000 (IECQ HSPM)第二版2005-10 电子器件(IECQ)的IEC质量评价系统电子电器器件和产品危险物品进程管理系统要求(HSPM)参考号QC 080000：2005目录前言 (2)0 介绍 (3)1 范围 (3)2 标准化参考 (3)3 术语和定义 (3)4 质量管理系统 (6)4.1 概要 (6)4.2 文档编制要求 (6)5 管理责任 (7)5.1 管理承诺 (7)5.2 用户焦点 (7)5.3 HSF政策 (7)5.4 规划 (7)5.5 责任，权力和通讯 (8)5.6 管理审查 (8)6 资源管理 (8)6.1 资源的供应 (8)6.2 人力资源 (9)6.3 基础设施 (9)7 产品实现 (9)7.1 HSF进程规划和产品实现 (9)7.2 用户相关进程 (10)7.3 设计和开发 (10)7.4 HSF产品的购买 (11)7.5 生产及服务的提供 (11)7.6 在HSF进程中使用的监控控制和测量装置 (12)8 测量，分析和改进 (12)8.1 概要 (12)8.2 HSF进程的监控和测量 (13)8.3 不合要求的HSF产品控制 (13)8.4 HSF数据的分析 (13)8.5 HSF进程管理系统的改进 (14)国际电工委员会电子电器器件及产品危险物品进程管理系统要求(HSPM)前言这个标准及其要求的概念系基于“无有害物质产品及制程若能有效地与管理原则整合”。

此规范乃附加于ISO 9001-2000版质量管理体制(QMS)架构中，期以完整、系统化及透明的流程管理及管制来达成HSF目标。

这个文件基于EIA/ECCB 标准954 电子电器器件及产品无有害物质标准和要求作为给制造商在履行HSF 和用户要求的指导，其可能包括规章要求，如欧洲议会的2002/95/EC指令要求和2003年1月27日委员会关于电气、电子设备中限制使用某些有害物质指令(RoHS)内的使用限制的要求，以及欧洲议会的2002/96/EC指令和2003年1月27日的委员会关于报废电子电器设备指令(WEEE)的要求。

QC080000中文版标准

国际电工委员会IECQ QC080000 ( IECQ )国际电工委员会电子元器件质量评定体系（IECQ )电子电器元件和产品有害物质过程管理体系要求（HSPM )目录前言0 、引言1 、范围2 、规范性引用文件3 、术语和定义4 、质量管理体系4.1 总要求4.2 文件要求5 、管理职责5.1 管理承诺5.2 以顾客为关注焦点5.3 HSF方针5.4 策划5.5 职责、权限和沟通5.6 管理评审6 、资源管理6.1 资源提供6.2 人力资源6.3 基础设施7 、产品实现7.1 HSF过程和产品实现的策划7.2 与顾客有关的过程7.3 设计和开发7.4 HSF产品的采购7.5 生产和服务提供7.6 HSF过程中使用的监视和测量设备的控制8 、测量、分析和改进8.1 总则8.2 HSF程的监视和测量8.3 不符合的HSF产品的控制8.4 HSF数据分析8.5 HSF程管理体系的改进国际电工委员会电子电器元件和产品有害物质过程管理体系要求（HSPM )前言本IECQ规范及其要求基于以下理念：不有效地综合应用管理科学，将无法实现有害物质减免（HSF）产品和生产过程。

本标准是ISO9001-2000质量管理体系框架的补充，与其协调一致，为的是对过程全面、系统、透明的管理和控制。

本规范以EIA/ECCB-954 “电器电子元件和产品HSF 标准和要求”为基础，为制造商满足HSF 要求和顾客要求提供指导。

这些要求包括法规要求如欧洲议会和欧盟理事会2003 年1 月27 日的2002 /95/EC 关于在电气电子设备中限制使用某些有害物质指令及2002 / 96 /EC 关于报废电子电气设备指令。

注：全世界许多现行或待决的法规中有许多要求消除所确定的一系列有害物质，包括许多产品中含有的铅、汞、锅、六价铬、多溴联苯、多溴联苯醚。

这就要求电子电器元件的制造商和使用商必须能够知道他们的产品是否是HSF产品；如果不是时，必须清楚地知道有害物质含量是多少。

A001C110518029001 力臣 6项聚合中文

检测报告编号.: A001C110518029001 日期:2011-05-23第1 页共4页客户/申请商: 深圳市力臣胶粘制品有限公司地址 : 深圳市福田区八卦岭路鹏基商务时空311C委托检验的样品及申请者对样品的说明如下：样品名称:蘑菇扣型号: /批号: /材料: /客户: /供应商: /制造商: /样品接收日期: 2011-05-18样品测试日期: 2011-05-18至2011-05-23测试要求:依照欧盟RoHS指令2002/95/EC，测定委托样品中的铅、镉、汞、六价铬、多溴联苯（PBBs）和多溴联苯醚（PBDEs）的含量。

测试方法:参照IEC 62321:2008电子电器产品中限用物质含量的测定程序测试项目前处理方法测试仪器MDLmg/kg铅 (Pb) IEC 62321, 第8部分ICP-OES 5mg/kg镉 (Cd) IEC 62321, 第8部分ICP-OES 5mg/kg汞 (Hg) IEC 62321, 第7部分CV-AAS 2mg/kg附件 C UV-VIS 262321,六价铬 (CrⅥ) IECmg/kg多溴联苯（PBBs）及多溴联苯醚（PBDEs） IEC 62321, 附件 A GC-MS 5结论:依照委托对指定样品进行测试，测试结果表明指定样品符合欧盟RoHS指令2002/95/EC及其补充指令2005/618/EC的要求。

******更多详细信息请查阅下页******谨代表深圳市安姆特检测技术有限公司编写：审核：签发：王珍, Grace 刘林文, Lewis 吕杰华, Jeewah报告文员实验室主管技术总监检测报告编号.: A001C110518029001 日期: 2011-05-23 第2 页共 4页检测流程: 1. 测定铅，镉含量2.测定汞含量 3. 测定六价铬含量(聚合物中)4. 测定PBBs&PBDEs 的含量检测报告编号.: A001C110518029001 日期: 2011-05-23 第3 页共 4页测试结果：项目单位 RoHS 限值 A#铅 (Pb) mg/kg 1000 N.D. 镉 (Cd) mg/kg 100 N.D. 汞(Hg) mg/kg1000 N.D.六价铬(Cr Ⅵ) mg/kg 1000 N.D.样品描述: A#: 整体混测阻燃剂单位 RoHS 限值 A#多溴联苯 mg/kg 1000 N.D. 一溴联苯 mg/kg / N.D. 二溴联苯 mg/kg / N.D. 三溴联苯 mg/kg / N.D. 四溴联苯 mg/kg / N.D. 五溴联苯 mg/kg / N.D. 六溴联苯 mg/kg / N.D. 七溴联苯 mg/kg / N.D. 八溴联苯 mg/kg / N.D. 九溴联苯 mg/kg / N.D. 十溴联苯 mg/kg / N.D. 多溴联苯醚 mg/kg 1000 N.D. 一溴联苯醚 mg/kg / N.D. 二溴联苯醚 mg/kg / N.D. 三溴联苯醚 mg/kg / N.D. 四溴联苯醚 mg/kg / N.D. 五溴联苯醚 mg/kg / N.D. 六溴联苯醚 mg/kg / N.D. 七溴联苯醚 mg/kg / N.D. 八溴联苯醚 mg/kg / N.D. 九溴联苯醚 mg/kg / N.D. 十溴联苯醚 mg/kg/ N.D.编号.: A001C110518029001 日期:2011-05-23第4 页共4页备注:- 对于检测铅、镉、汞的样品已完全溶解- mg/kg=ppm- N.D. =未检出（<MDL）- MDL=方法检测限- #根据客户的要求，对样品A进行混测。

5082-0012资料

DescriptionThis PIN diode chip is silicon dioxide or nitride passi-vated. The 5082-0012 has a planar construction. The fabrication processes are optimized for long term reliability and tightly controlled for uniformity in electrical performance.OutlineMaximum RatingsJunction Operating and StorageTemperature Range .............................-65°C to +150°C Soldering Temperature ..........+425°C for 1 min. max.5082-0012PIN Diode Chip for Hybrid MIC Switches/AttenuatorsData SheetFeatures•Low Series Resistance: 1.0Ω TypicalApplicationsThis general purpose PIN diode is intended for low power switching applications such as duplexers,antenna switching matrices, digital phase shifters, time multiplex filters, TR switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators.Electrical Specifications at T A = 25°CTypical ParametersNearest Typical Chip Equivalent Minimum Maximum Typical Reverse Part Packaged Breakdown Junction Series Typical Recovery Number Part No.VoltageCapacitance Resistance Lifetime Time 5082-5082-V BR (V)C j (pF)R S (Ω)τ (ns)t rr (ns)001230011500.12 1.0400100 Test V R = V BR V R = 50 V I F = 100 mA I F = 50 mA I F = 20 mA ConditionsMeasure f = 1 MHzf = 100 MHzI R = 250 mAV R = 10 V I R ≤ 10 mA90% RecoveryDimensions in millimeters (1/1000 inch)Assembly and Handling Procedures forPIN Chips1. StorageDevices should be stored in a dry nitrogen purged dessicator or equivalent.2. CleaningIf required, surface contamination may be removed with electronic grade solvents. Typical solvents, such as freon (T.F. or T.M.C.), acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. Typical cleaning times per solvent are one to three minutes. DI water and methanol should be used (in that order) in the final cleans. Final drying can be accomplished by placing the cleaned dice on clean filter paper and drying with an infrared lamp for 5-10 minutes. Acids such as hydrofluoric (HF), nitric (HN O3) and hydrochloric (HCl) should not be used.The effects of cleaning methods/solutions should be verified on small samples prior to submitting the entire lot.Following cleaning, dice should be either used in assembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacu-um chamber.3. Die Attacha. EutecticAuSn preform with stage temperature of 310°C for one minute max. AuGe preform with stage temperature of 390°C for one minute max.b. EpoxyFor epoxy die-attach, conductive silver-filled or gold-filled epoxies are recommended. This method can be used for all Avago PIN chips.4. Wire BondingEither ultrasonic or thermocompression bonding tech-niques can be employed. Suggested wire is pure gold, 0.7 to 1.5 mil diameter.For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5965-8880E5989-4778EN February 23, 2006。

A508A508M

Designation:A508/A508M–05bStandard Speciﬁcation forQuenched and Tempered Vacuum-Treated Carbon and Alloy Steel Forgings for Pressure Vessels1This standard is issued under theﬁxed designation A508/A508M;the number immediately following the designation indicates the year of original adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.A superscript epsilon(e)indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1.Scope*1.1This speciﬁcation2covers quenched and tempered vacuum-treated carbon and alloy steel forgings for pressure vessels such as those used in reactor systems.Speciﬁcally,it covers forgings for vessel closures,shells,ﬂanges,tube sheets, rings,heads,and similar parts.1.2All grades are considered weldable under proper condi-tions.Welding technique is of fundamental importance,and it is presupposed that welding procedure and inspection will be in accordance with approved methods for the grade of material used.1.3The values stated in either SI units or inch-pound units are to be regarded separately as standard.The values stated in each system may not be exact equivalents;therefore,each system shall be used independently of the bining values from the two systems may result in non-conformance with the standard.1.4Unless the order speciﬁes the applicable“M”speciﬁca-tion designation,the material shall be furnished to the inch-pound units.N OTE1—Grades1and1A are composed of different chemistries but have the same mechanical requirements.N OTE2—Designations have been changed as follows:Current FormerlyGrade1Class1Grade1A Class1AGrade2Class1Class2Grade2Class2Class2AGrade3Class1Class3Grade3Class2Class3AGrade4N Class1Class4Grade4N Class2Class4AGrade4N Class3Class4BGrade5Class1Class5Grade5Class2Class5AGrade22Class3Class22BGrade22Classes4,5,6,and7Grade3V Class3V1.5This standard does not purport to address all of the safety concerns,if any,associated with its use.It is the responsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2.Referenced Documents2.1ASTM Standards:3A275/A275M Test Method for Magnetic Particle Exami-nation of Steel ForgingsA370Test Methods and Deﬁnitions for Mechanical Testing of Steel ProductsA388/A388M Practice for Ultrasonic Examination of Heavy Steel ForgingsA788/A788M Speciﬁcation for Steel Forgings,General RequirementsA966/A966M Test Method for Magnetic Particle Exami-nation of Steel Forgings Using Alternating CurrentE208Test Method for Conducting Drop-Weight Test to Determine Nil-Ductility Transition Temperature of Ferritic SteelsE428Practice for Fabrication and Control of Steel Refer-ence Blocks Used in Ultrasonic Examination2.2American Society of Mechanical Engineers Standard: Boiler and Pressure Vessel Code—Section III,Articles NB2300,NC2300,ND2300,NE2300,NF2300,NG 230043.Ordering Information3.1Purchase Order—In addition to the ordering informa-tion required by Speciﬁcation A788/A788M,the purchaser shall include with the inquiry and order a detailed drawing that1This speciﬁcation is under the jurisdiction of ASTM Committee A01on Steel,Stainless Steel,and Related Alloys and is the direct responsibility of Subcommittee A01.06on Steel Forgings and Billets.Current edition approved Oct.1,2005.Published October2005.Originally approved st previous edition approved in2005as A508/A508M–05a.2For ASME Boiler and Pressure Vessel Code applications see related Speciﬁ-cation SA-508/SA-508M in Section II of that Code.3For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at service@.For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.4Available from American Society of Mechanical Engineers,345E.47th St., New York,NY10017.*A Summary of Changes section appears at the end of this standard. Copyright©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959,United States.locates the areas of signiﬁcant loading in the forging (when required),the method of selecting test locations (see 6.1.5and 6.1.6),and purchase options (see 4.2.2,6.2,and 10.1)and any supplementary requirements desired.3.2Forging Drawing —Each forging shall be manufactured in accordance with a purchaser-approved drawing showing the prequenched dimensions,the ﬁnished dimensions,the surfaces that will be subjected to signiﬁcant loading,and the locations of mechanical test specimens.3.3Material supplied to this speciﬁcation shall conform to the requirements of Speciﬁcation A 788/A 788M ,which out-lines additional ordering information,manufacturing require-ments,testing and retesting methods and procedures,marking,certiﬁcation,product analysis variations,and additional supple-mentary requirements.3.3.1When speciﬁed by the purchaser,it is permissible to perform Magnetic particle examination using the AC yoke in accordance with Test Method A 966/A 966M instead of using Test Method A 275/A 275M (see 8.2.1).3.4The optional minimum silicon content as expressed in Footnote B to Table 1,if required.3.5If the requirements of this speciﬁcation are in conﬂict with the requirements of Speciﬁcation A 788/A 788M ,the requirements of this speciﬁcation shall prevail.4.Materials and Manufacture 4.1Melting Process :4.1.1The steel shall be made by the basic electric-furnace process except when secondary ladle reﬁning or the remelting process is employed,in which case the melting processes of Speciﬁcation A 788/A 788M are permitted.4.1.2The molten steel shall be vacuum treated in accor-dance with the methods described in Speciﬁcation A 788/A 788M ,prior to or during the pouring of the ingot,in order to remove objectionable gases,particularly hydrogen.Grade 22Classes 4,5,6,and 7liquid steel shall be produced to a ﬁne grain melting practice which has been shown to result in a prior austenitic grain size of ﬁve or ﬁner.4.1.3Discard —Sufficient discard shall be made from each ingot to secure freedom from piping and excessive segregation.4.2Heat Treatment :4.2.1Preliminary Heat Treatment —After forging and be-fore reheating,the forgings shall be cooled to provide substan-tially complete transformation of austenite.Preliminary heat treatment may be applied to improve machinability and to enhance subsequent heat treatments.4.2.2Heat Treatment for Mechanical Properties —The forg-ings shall be heated to a temperature which produces an austenitic structure and then quenched in a suitable liquid medium by spraying or immersion.For Grade 4N,Classes 1and 3,the austenitizing temperature shall be 1540°F [840°C]min to 1640°F [895°C]max.Quenching shall be followed by tempering at a subcritical temperature and holding at this temperature for a minimum time of one-half hour per inch of maximum section thickness.Except when Supplementary Re-quirement S 13is speciﬁed for Grades 2and 3,the minimum tempering temperatures shall be as follows:Grades 1,1A,2Class 2,and 3Class 21150°F [620°C]Grades 2Class 1and 3Class 11200°F [650°C]Grades 4N Classes 1and 2,and 5Classes 1and 21100°F [595°C]Grade 4N Class 31125°F [605°C]Grades 3V and 3VCb 1250°F [675°C]Grade 22,Class 31200°F [650°C]Grade 22,Classes 4,5,6,and 71100°F[593°C]Speciﬁc cooling rates from the tempering temperature shall be applied if Supplementary Requirement S14is speciﬁed.4.3For Grades 1,1A,2,2A,3,or 3A,a multiple stage austenitizing procedure may be used whereby the forging is ﬁrst fully austenitized and liquid quenched,followed by reheating within the intercritical temperature range to partially reaustenitize and again liquid quenched.On completion of the austenitizing/quenching cycles,the forgings shall be tempered at a subcritical temperature as described in 4.2.2.5.Chemical Composition5.1Heat Analysis —The heat analysis obtained from sam-pling in accordance with Speciﬁcation A 788/A 788M shall comply with Table 1except that the additional features of Supplementary Requirements S7,S8,S9,and S11shall also apply as individually speciﬁed in the ordering information.TABLE 1Chemical RequirementsComposition,%Grade 1Grade 1A Grade 2Grade 3Grade 4N Grade 5Grade 22A Grade 3V Grade 3VCb Grade 6Carbon 0.35max 0.30max 0.27max 0.25max 0.23max 0.23max 0.11–0.150.10–0.150.10–0.150.28–0.33Manganese 0.40–1.050.70–1.350.50–1.00 1.20–1.500.20–0.400.20–0.400.30–0.600.30–0.600.30–0.600.75–1.15Phosphorus 0.025max 0.025max 0.025max 0.025max 0.020max 0.020max 0.015max 0.020max 0.020max 0.025max Sulfur 0.025max 0.025max 0.025max 0.025max 0.020max 0.020max 0.015max 0.020max 0.010max 0.025max Silicon B 0.40max 0.40max 0.40max 0.40max 0.40max 0.30max 0.35max 0.10max 0.10max 0.35max Nickel 0.40max 0.40max 0.50–1.000.40–1.00 2.8–3.9 2.8–3.90.25max ...0.25max 0.75–0.95Chromium 0.25max 0.25max 0.25–0.450.25max 1.50–2.00 1.50–2.00 2.00–2.502.8–3.3 2.7–3.30.70–1.00Molybdenum 0.10max 0.10max 0.55–0.700.45–0.600.40–0.600.40–0.600.90–1.10max 0.90–1.100.90–1.100.30–0.45Vanadium 0.05max 0.05max 0.05max 0.05max 0.03max 0.08max 0.02max 0.20–0.300.20–0.300.05max Columbium 0.01max 0.01max 0.01max 0.01max 0.01max 0.01max 0.01max 0.01max 0.015–0.0700.01max Copper 0.20max 0.20max 0.20max 0.20max 0.25max 0.25max 0.25max 0.25max 0.25max0.25max Calcium 0.015max 0.015max 0.015max 0.015max 0.015max 0.015max 0.015max 0.015max 0.0005–0.01500.015max Boron 0.003max 0.003max 0.003max 0.003max 0.003max 0.003max 0.003max 0.001–0.0030.003max 0.003max Titanium 0.015max 0.015max 0.015max 0.015max 0.015max 0.015max 0.015max 0.015–0.0350.015max 0.015max Aluminum C0.025max0.025max0.025max0.025max0.025max0.025max0.025max0.015max0.015max0.025maxAFor Grade 22Classes 5,6,and 7with section thickness at heat treat of 8in.or greater,the carbon and manganese shall be held to 0.13to 0.15and 0.50to 0.60,respectively.BWhen required by the purchaser a minimum silicon content of 0.15%shall apply for Grades 1,1A,2,3,and 4N.CAluminum content reported shall be the combined total soluble and insolublealuminum.5.2Product Analysis—The manufacturer shall use the prod-uct analysis provision of Speciﬁcation A788/A788M to obtain a product analysis from a forging representing each heat or multiple heat.The permissible variations provided in the table on Permissible Variations in Product Analysis for Killed Steel in Speciﬁcation A788/A788M apply for manganese,nickel, chromium,molybdenum,and vanadium only.Boron is not subject to product analysis.The purchaser may also make this determination in accordance with Speciﬁcation A788/ A788M.6.Mechanical Properties6.1Tension Test:6.1.1The steel shall conform to the requirements of Table2.6.1.2The location and number of tension test specimens for each forging or multiple forging shall be as follows:6.1.2.1Multiple Forgings Separated into Identical Indi-vidual Forgings with Rough Machined Weights not Exceeding 1000lb[455kg]Prior to Quenching and Tempering Treatment—At least one individual forging from each multiple forging in each heat-treating lot shall be tested using the test specimen locations of 6.1.5or 6.1.6as speciﬁed on the purchase orders,except that test specimens located at midlength may be closer to the ends of the production forging than the speciﬁed distance to the second surfaces.All forgings shall be quenched and tempered in the same furnace charge.All forgings from the multiple shall be Brinell hardness tested after heat treatment and forgings not tested for mechanical proper-ties shall have a Brinell Hardness within20points of the Brinell Hardness of the forging that has been tested for mechanical properties.6.1.2.2Forgings or Multiple Forgings(Note3)with Rough Machined Weights Less than10000lb[4540kg]and Having a Heat-Treated Length(Exclusive of Test Prolongation)of80 in.[2032mm]or Less—A test prolongation(Note4)shall be located at one end.One tension test specimen shall be taken from the test prolongation.6.1.2.3Forgings or Multiple Forgings with Rough Ma-chined Weights Less than10000lb[4540kg]and Having a Heat-Treated Length(Exclusive of Test Prolongations)Exceed-ing80in.[2032mm]—A test prolongation shall be located at each end.One tension test specimen shall be taken from each test prolongation.An orientation of180°shall be established between the two tension test specimens.6.1.2.4Forgings or Multiple Forgings with Rough Ma-chined Weights Over10000lb[4540kg]and Having a Heat-Treated Length(Exclusive of Test Prolongation)of80in. [2032mm]or Less—A test prolongation shall be located at one end.Two tension test specimens shall be taken from the test prolongation and shall be oriented180°apart.6.1.2.5Forgings or Multiple Forgings with Rough Ma-chined Weights Over10000lb[4540kg]and Having a Heat-Treated Length(Exclusive of Test Prolongations)Exceed-ing80in.[2032mm]—A test prolongation shall be located at each end.The tension test specimens oriented180°apart from each other shall be taken from each test prolongation.The two tension specimens located in one test prolongation shall be oriented90°in relation to the two tension specimens located in the other test prolongation.N OTE3—Multiple forgings in6.1.2.2through6.1.2.5are those which will be separated after the quench and temper treatment.N OTE4—A test prolongation is deﬁned as that integral test metal located at an end of the forging or forging multiples.6.1.3Samples for mechanical test specimen shall be re-moved from forgings after the quenching and tempering heat treatment.The sample material shall be subjected to a simu-lated post weld heat treatment if Supplementary Requirement S1is speciﬁed.6.1.4For upset disk forgings,the longitudinal axis of the test specimens shall be in the tangential direction.For all other parts,the longitudinal axis of the specimens shall be parallel to the direction of major working of the forging.6.1.5Each forging shall be manufactured in accordance with a purchaser-approved drawing,showing the prequenched dimensions,theﬁnished dimensions,the surfaces that will be subjected to critical stresses,and the location of mechanical test specimens.6.1.6The tension test specimens shall be positioned so that the longitudinal axis and mid-length is in accordance with one of the following methods:6.1.6.1Method1—t by2t,where t is the distance from the area of signiﬁcant loading(see3.1)to the nearest quenched surface.However,they shall not be nearer to one quenched surface than3⁄4in.[20mm]and to the second quenched surface than11⁄2in.[40mm].6.1.6.2Method2—1⁄4T by T,where T is the maximum thickness of the forging as heat treated.Where this method of testing is employed,the following limitations for as-treated thickness shall generally apply:Grades1and1a3in.[75mm],maxGrades2Class2and3Class26in.[150mm],maxGrades2Class1and3Class18in.[205mm],maxGrade4N Class2and5Class216in.[405mm],maxGrade4N Class1and5Class130in.[760mm],maxGrade4N Class340in.[1015mm],maxGrades3V and3VCb20in.[510mm],maxGrade22Class320in.[510mm],maxGrade22Classes4,5,6,and712in.[305mm],max6.1.6.3Method3—Test specimens shall be taken from a representative separate test forging made from the same heat of steel and shall receive substantially the same reduction and type of hot working as the production forgings that it represents and shall be of the same nominal thickness as the as-quenched production forgings.The separate test forging shall be heat treated in the same furnace charge and under the same conditions as the production forgings.Test specimens shall be removed from the region midway between the mid-thickness and the surface,and not closer than T to a second heat treated surface with the same limitation on forging thickness as in 6.1.6.2.This method shall be limited to forgings with a rough machined weight of not more than1000lb[455kg].6.1.6.4Method4—A thermal buffer ring,at least T by T in cross section,or segments of such a ring at least3T in length, shall be welded to the test end of a forging prior to heat treatment for mechanical properties.The buffer material may be any weldable carbon or low-alloy steel and shall be joined to the forging with a partial-penetration type weld which completely seals the buffered surface.The test coupons shall be removed from the forging in the region buffered by the ringorT A B L E 2T e n s i l e R e q u i r e m e n t sG r a d e s 1a n d 1a G r a d e s2C l a s s 1a n d 3C l a s s 1G r a d e s 2C l a s s 2a n d 3C l a s s 2G r a d e s 4N C l a s s 1a n d 5C l a s s 1G r a d e s 4N C l a s s 2a n d 5C l a s s 2G r a d e 4N C l a s s 3G r a d e 22C l a s s 3G r a d e s 3V a n d 3V C bG r a d e 6C l a s s 1G r a d e 6C l a s s 2G r a d e 6C l a s s 3G r a d e 6C l a s s 4G r a d e 22C l a s s 4G r a d e 22C l a s s 5G r a d e 22C l a s s 6C l a s s 7T e n s i l e s t r e n g t h ,k s i [M P a ]70–95[485–655]80–105[550–725]90–115[620–795]105–130[725–895]115–140[795–965]90–115[620–795]85–110[585–760]85–110[585–760]85–110[585–760]95–120[655–825]100–125[690–860]105–130[725–895]85–110[585–760]95–120[655–825]100–125[690–860]105–130[725–895]Y i e l d s t r e n g t h ,m i n [0.2%of f s e t ],k s i [M P a ]36[250]50[345]65[450]85[585]100[690]70[485]55[380]60[415]60[415]75[515]80[550]85[585]60[415]75[515]80[550]85[585]E l o n g a t i o n i n 2i n .o r 50m m ,m i n ,%20181618162018182018181820181818R e d u c t i o n o f a r e a ,m i n ,%38383545454845453535353535353535A 508/A 508M –05bring segments.If ring segments are used,the test coupons shall be removed from the forging in the area under the buffer ring segment at a minimum distance of T from each end of that segment.In either case,the test specimens shall be located at a minimum distance of1⁄2in.[13mm]from the buffered surface of the forging,and at least1⁄4T from a quenched surface of the forging.N OTE5—For forgings with a maximum thickness of2in.[50mm],the specimens shall be taken at midthickness and at least2in.from a second surface.This provision is applicable to all four methods in6.1.6.6.1.7Tension specimens shall be the standard0.5in.[12.5 mm]round by2in.[50mm]gauge length,as shown in Test Methods and Deﬁnitions A370.6.2Impact Test—The steel shall conform to the require-ments of Table3,or Supplementary Requirement S10may be speciﬁed instead of these requirements.6.2.1Number,Location,and Orientation of Specimens: 6.2.1.1One set of three Charpy V-notch specimens shall be taken from each tensile specimen location required in6.1.2. Orientation shall be the same as in 6.1.4.When S10is speciﬁed,the required number of tests shall be governed by NB,NC,ND,NE,NF,or NG2300,as applicable.6.2.1.2The requirements of 6.1.3also apply to impact specimens.6.2.1.3The longitudinal axis and mid-length of the impact specimen shall be located similarly to the longitudinal axis of the tension test specimens as deﬁned in6.1.6.The axis of the notch shall be normal to the nearest heat-treated surface of the forging.When S10is speciﬁed the orientation shall be gov-erned by NB,NC,ND,NE,NF,or NG2300.6.2.2Impact specimens shall be Charpy V-notch as shown in Test Methods and Deﬁnitions A370.7.Workmanship and Quality Level Requirements7.1See requirements in8.1,8.2.2,8.3.1.1,and8.3.2.2.8.Nondestructive Inspection Requirements8.1General Requirements—Dimensional and visual inspec-tions,and magnetic particle and ultrasonic inspection shall be conducted by the manufacturer.Forgings shall be free of cracks,thermal ruptures,or other injurious indications.8.2Magnetic Particle Inspection:8.2.1Followingﬁnal machining by the manufacturer all accessible surfaces of each forging shall be examined by the continuous current magnetic particle method.This examination shall be in accordance with Test Method A275/A275M unless the purchaser has required the use of the AC yoke in accor-dance with Test Method A966/A966M instead(see3.3.1).8.2.2The following conditions are subject to rejection or removal:8.2.2.1Indications with major dimension exceeding3⁄16in.[4.8mm].8.2.2.2Four or more indications exceeding1⁄16in.[1.6mm] in major dimensions that are aligned and separated by1⁄16in.[1.6mm]or less end to end.8.2.2.3Ten or more indications exceeding1⁄16in.[1.6mm] in major dimensions contained in any6in.2[39cm2]of surface,with the major dimension of this area not to exceed6in.[150mm].The area shall be taken in the most unfavorable location relative to the indications being evaluated.8.3Ultrasonic Inspection—Forgings shall be ultrasonically inspected in accordance with the procedures of Practice A388/ A388M.8.3.1Longitudinal Wave Inspection:8.3.1.1Unless otherwise speciﬁed by Supplementary Re-quirement S2,the back reﬂection method of tuning shall be used in accordance with7.2.2.1of Practice A388/A388M.In addition to the reportable conditions in Section7of Practice A388/A388M,indications exceeding the resultant back re-ﬂection shall be recorded.The following conditions are con-sidered rejectable:8.3.1.2Complete loss of back reﬂection not associated with forging conﬁguration or surface and accompanied by an indication of a discontinuity.For this purpose,a back reﬂection less than5%of full screen height shall be considered complete loss of back reﬂection.8.3.1.3Indications whose amplitude equals or exceeds that of the back reﬂection established in an indication-free area of the forging.8.3.2Angle Beam Inspection:8.3.2.1Calibration notches shall be cut into the inside-and outside-diameter surfaces with a depth equal to3%of the nominal section thickness(or3⁄8in.[9.5mm],max),a length of approximately1in.[25mm],and a width not greater than twice its depth.Adjust instrument controls to obtain an indication from the inside-diameter notch approximately75% of full screen height.Measure the amplitude of indication from the outside-diameter notch.Draw a straight line on the shield in front of the cathode ray tube from this peak to that of the inside-diameter notch and continue it as a horizontal line to the initial pulse.This line constitutes the angle beam reference line.8.3.2.2A forging containing a discontinuity which results in an indication exceeding the amplitude of the reference line is subject to rejection.N OTE6—Signals from discontinuities within approximately1⁄4in.[6.4 mm]of inside and outside surfaces are reinforced by wave trapping during angle beam inspection;they are therefore ampliﬁed in respect to internal discontinuities.8.3.3The report of the ultrasonic inspection shall be in compliance with Section8of Practice A388/A388M.8.3.4Additional nondestructive inspection or trepanning may be employed to resolve questions of interpretation of ultrasonic indications.The manufacturer shall accept respon-sibility for injurious indications which will not be removed in ﬁnal machining.9.Repair Welding9.1Repair welding of forgings may be permitted,but only at the option of the purchaser.9.2If repair welding is performed,welders and weld pro-cedures shall be qualiﬁed in accordance with Section IX of the ASME Boiler and Pressure VesselCode.T A B L E 3C h a r p y I m p a c t R e q u i r e m e n t sG r a d e s 1a n d 1a a t +40°F [4.4°C ]G r a d e s 2C l a s s 1a n d 3C l a s s 1a t +40°F [4.4°C ]G r a d e s 2C l a s s 2a n d 3C l a s s 2a t +70°F [21°C ]G r a d e s 4N (a l l c l a s s e s )a n d 5(a l l c l a s s e s )a t −20°F [−29°C ]G r a d e 22,C l a s s 3,a n d G r a d e s 3V a n d 3V C b a t 0°F [−18°C ]G r a d e 6C l a s s e s 1,2,3,a n d 4a t –75°F [−59°C ]G r a d e 22C l a s s e s 4,5,6,a n d 7a t –75°F [−60°C ]M i n i m u m a v e r a g e v a l u e o f s e t o f t h r e e s p e c i m e n s ,f t ·l b f (J )A15[20]30[41]35[48]35[48]40[54]20[27]40[55]M i n i m u m v a l u e o f o n e s p e c i m e n ,f t l b f (J )10[14]25[34]30[41]30[41]35[50]15[20]35[50]AN o t m o r e t h a n o n e s p e c i m e n f r o m a s e t m a y b e b e l o w t h i s v a l u e .10.Certiﬁcation and Reports10.1In addition to items to be reported by Speciﬁcation A788/A788M,the following items shall also be reported: 10.1.1Product chemical analysis,10.1.2The method used for locating test specimens,and 10.1.3Sketches showing the locations of all recordable indications in the report of all nondestructive examinations.10.1.3.1If Test Method A966/A966M has been used,this also shall be recorded in the certiﬁcation.10.1.4Details of the heat treatment cycle,as listed in Speciﬁcation A788/A788M.11.Product Marking11.1The purchaser may specify additional identiﬁcation marking and the location of the stamping.The type of stamps to be used when impression stamping is performed shall be round-nosed or“interrupted-dot”die stamps having a mini-mum radius of1⁄32in.[0.8mm].12.Keywords12.1chromium-molybdenum steel;nickel-chromium-molybdenum alloy steels;pressure vessel service;quenched and tempered steels;steel forgings—alloy;steel forgings—carbon;vacuum-treated steelsSUPPLEMENTARY REQUIREMENTSOne or more of the following supplementary requirements shall apply only when speciﬁed by the purchaser in the inquiry or order.Details of these supplementary requirements shall be agreed upon between the manufacturer and the purchaser.S1.Simulated Post-Weld Heat Treatment of Mechanical Test SamplesS1.1All test coupons shall be subjected to single or multiple heat treatments at subcritical temperatures prior to testing. Such treatments are intended to simulate post-weld or other treatments to which the forgings will be subjected during subsequent fabrication.The purchaser shall furnish the manu-facturer with details of the desired heat treatment for the test coupons,including temperatures,timers,and cooling rates.S2.Ultrasonic Testing-Reference Block Calibration(for examining sections24-in.[610mm]thick or less)S2.1Reference blocks of acoustically similar metal shall be used for calibration.Blocks shall meet one of the following requirements:S2.1.1A comparison of the back reﬂections between equivalent thicknesses of the reference block material and the actual forging to be tested,without change in instrument setting shall not show a variation in excess of25%.S2.1.2The reference blocks shall be manufactured from steel that is similar in chemistry and processing history to the production forging being tested.The reference blocks shall be fabricated in accordance with the procedures of Practice E428. S2.2For test sections up to12in.[305mm]thick,the reference blocks shall contain a1⁄4-in.[6.4-mm]diameter ﬂat-bottom hole;for over12to18in.[305to457mm],the hole diameter shall be3⁄8in.[9.5mm];and for over18to24in. [457to610mm],it shall be1⁄2in.[13mm].S2.3A distance-amplitude correction curve shall be estab-lished for the proper grade of steel and speciﬁed hole size. S2.4A forging containing one or more indications equal in amplitude to that of the applicable reference hole,when properly corrected for distance,is subject to rejection.S3.Charpy V-Notch Impact Transition CurveS3.1Sufficient impact tests shall be made from the forging test material to establish a temperature-absorbed energy curve. The test-temperature range shall be wide enough to establish the upper and lower shelf foot-pound energies,with sufficient testing at intermediate temperatures to permit plotting a rea-sonably smooth curve.S4.Additional Charpy DataS4.1The percent shear fracture and mils of lateral expan-sion,deﬁned in Test Methods and Deﬁnitions A370,shall be reported for each Charpy specimen tested.S4.2Acceptance values for percent shear fracture and/or lateral expansion values shall be as speciﬁed by the purchaser. S5.Alternative Impact TestS5.1Charpy impact tests shall be made in accordance with the provisions of6.2of the speciﬁcation except that the test temperature shall be lower than speciﬁed in Table3.This test shall be instead of that speciﬁed in6.2.S6.Drop-Weight TestS6.1Drop-weight tests shall be conducted in accordance with the requirements of Test Method E208.The fracture plane of the specimens shall coincide with the location required for other mechanical test specimens as speciﬁed by the purchaser in accordance with6.1.6.However,since the drop weight specimen can be taken in any orientation,the fracture plane of the specimen when tested to Method1(6.1.6.1)shall be a minimum distance of7⁄16in.[11mm]from the nearest quenched surface,and11⁄2in.[38mm]from any second surface.The purchaser may specify either duplicate no-break performance when tested10°F[6°C]warmer than a speciﬁed temperature or request a determination of the NDT tempera-ture.S7.Restrictive Chemistry for Grades4N and5S7.1Phosphorus and sulfur limits for Grades4N and5shall be0.015%maximum heat and0.018%maximum product. S8.Additional VanadiumS8.1The vanadium content for Grade5forgings shall be 0.05to0.15%.。

优化2000多元试验套件说明书

02/26/2013Kit ComponentsProduct code Description525 KIT OPTIMA 2000 SOLUTIONN0691579, N0773120, N9300221 Components:325 STD ZOD MULTIELEMENT230 OPTIMA BLANK SOLUTION121 FIVE ELEMENT A/S STD CAL 4页 1/8根据 GB/T 16483-2008打印日期 2013.02.26在 2013.02.26 审核· GHS危险性类别H315引起皮肤刺激(在 2 页继续)(在 1 页继续)H272H314H301; H331H400; H410H261H260H314H250; H260H351H317H272H250; H260H400; H410(在 2 页继续)· 环境保护措施:切勿让产品接触到污水系统或任何水源.如果渗入了水源或污水系统, 请通知有关当局.用大量的水进行稀释.切勿让其进入下水道/水面或地下水.· 密封及净化方法和材料:吸收液体粘合原料 (沙粒、硅藻土、酸性粘合剂、通用粘合剂、锯屑).确保有足够的通风装置.· 参照其他部分有关安全处理的资料请参阅第 7 节.有关个人保护装备的的资料请参阅第 8 节.有关弃置的资料请参阅第 13 节.(在 3 页继续)· 手防护:保护手套手套的物料必须是不渗透性的, 且能抵抗该产品/物质/添加剂.基于缺乏测试, 对于产品/制剂/化学混合物, 并不会提供手套材料的建议选择手套材料时, 请注意材料的渗透时间, 渗滤率和降解参数· 手套材料选择合适的手套不单取决于材料, 亦取决于质量特征, 以及来自哪一间生产厂家, 因为该产品是由很多材料配制而成, 手套材料的抵抗力并不可预计, 所以, 必须在使用之前进行检查· 渗入手套材料的时间请向劳保手套生产厂家获取准确的破裂时间并观察实际的破裂时间· 眼睛防护:密封的护目镜(在 4 页继续)· 蒸气密度未决定.· 蒸发速率未决定.· 溶解性水:完全可拌和的· n-辛醇/水分配系数:未决定.· 黏性:动态:未决定.运动学的:未决定.· 溶剂成份:有机溶剂:0.0 %水:97.9 %固体成份:0.1 %· 其他信息无相关详细资料。

K0+000~K0+175(95区第1层)

0.2
-0.1
-0.2
-0.1
-0.3
0.4△
-0.2
0.2
0.3
4
边坡坡度
不陡于设计值（1:1.5）
1;1.52
1:1.51
1:1.51
1:1.50
1:1.50
1:1.50
1:1.52
1:1.51
1:1.51
1:1.52
检验批质量验收记录
质控(市政)表C.0.177
单位工程名称
外环路(清昌大道-瑞亭街至融宽环路段)道路工程
质检员
验收批序号
分项工程名称
土方路基
验收部位
K0+000～K0+175（95区第1层）
施工单位
中国交通建设股份有限公司
项目经理
栾纪武
分包单位
/
分包项目经理
/
专业工长
刑利剑
施工班组长
欧阳臣明
施工执行标准名称及编号
城镇道路工程施工与质量验收规范(CJJ1－2008)
施工质量验收规范的规定
施工单位检查评定记录
监理(建设)
12△
-9
-17
10
-6
-9
1
3
-15
2
路床中线偏位（mm）
≤30
20
6
13
19
3
路床平整度
≤15
见附表
4
路床宽度
不小于设计值+B
见附表
5
路床横坡
±0.3%且不反坡
见附表
6
边坡坡度
不陡于设计值
见附表
7
路床外观
符合CJJ1-2008第6.8.1-4规定

DIN-JK-0-1

chnicalIndicators
产品描述Description：DIN-JK
800-2500MHz
1/4波长避雷器
Surge Arrestor
产品型号Part Number：DIN-JK-0-01
材质Material quality：
序号Number
名称Designation
材料Material
性能指标Performance index：
测试项目Testitem
标准要求Standard request
特性阻抗（Ω）Impedance
50
频率范围(MHz)Frequency Range
800-2000
通流容量Discharging current
(kA@8/20μS波)
30KA
插入损耗(dB)Insertion Loss
test shall prevail
Ag
6
密封件Sealing element
硅橡胶Silicon rubber
7
绝缘介质Dielectric
聚四氟乙烯PTFE
8
标准件SC
不锈钢Stainless
注：电镀及厚度可根据客户要求进行调整。
Explain：Electroplating and thickness can be adjusted according to customer requirements
≤0.10
驻波比V.S.W.R.
800-960Mhz≤1.12
800-2500Mhz≤1.20
外壳防护等级Water-proof
IP65
重量（g）Weight
320
注：电压驻波比测试指标发生争议时以Agilent标准校准件校准测试为准。

UL 508认证标准(中文版)

UL508P83-100设备性能42综述42.1工业控制设备的性能应该通过按照43-61B 节中所描述的试验项目对典型样品或商业贸易中的样品进行试验来验证并要求那些测试按照表42.1所示的操作顺序进行42.2那些导致某一测试项目终止的温度或电流敏感设备或系统应该进行附加的评估测试来确定他们适用于其应用场合42.3除非特别说明测试应采用表42.2中所指定的实际使用电压的额定频率42.4除非特别说明测试应在10-4050-104℉的任意环境温度下进行环境温度的测量应采用在设备的附近安装温度计或热电偶的方法测量42.5对于有不完全封闭或局部外壳的工业控制设备将在本标准中被作为一个开放式无外壳设备来考虑其性能要求表42.1测试顺序样品数量注1 2 标准参考条款试验项目顺序顺序 43 44 45 46 49温升测试过电压和欠电压测试过负载测试耐久性测试介质耐压测试1 2 31 2 3注所有或任一个试验顺序的分组取决于单一样品是否适用任何一个试验顺序没有必要作为进行其他试验项目的首要条件表42.2测试电压值设备的额定电压试验项目110-120 220-240 254-277 380-415 440-480 560-600标准条款编号温升测试 120 240 277 415 480 600 43 过电压试验 AC / DC 132 264 305 457 528 660 44 欠电压试验AC 102 204 235 353 408 510 44 欠电压试验DC96 192 222 332 384 480 44过负载 120 240 277 415 480 600 45 耐久性 120 240 277 415 480 600 46a如果设备的额定值不落在表中的任何电压值范围内除了过压测试和欠压测试见43.8外都以设备的额定电压值作为他的测试值42.6敞开式设备应安装在一个被认为是预期典型使用的罩壳内最大罩壳尺寸可以通过以下任一方法来确定a设备长宽高三尺寸的150%b尺寸符合表6.8所列的导线弯曲空间c预期的罩壳如一标准出路盒子或d预期的罩壳假如标注在设备或卡片上的尺寸可以比42.6a-42.6c所确定的尺寸大例外如36.7a所指定继电器的不必要这样测试 [注36.7a额定功率为1马力输出功率746瓦或相当的FLA或者更小的720伏安断开控制器功率或更小或电压为51-150伏时电流不大于15安培电压为151-300伏时电流不大于10安培或电压为301-600伏时电流不大于5安培]42.7为了进行测试将有两个或更多开-关位置的换向控制器切换开关仪表开关双回路或三回路装置或其他类型的装置进行连接以便使正常使用中会出现的相反极性施加于断开触点或零件之间参见64.1 [注64.1导线接线端应明确标识导线连接的适当的电源负载控制回路等类似的或者一配线表代码以确保能够安全连接设备例外1至于一双接线端开关装置导线连接是非常明白的接线端不必标识例外2在安装配线表说明书后如数目方面可以独立的提供具有多样回路安装的配线表或者在一封袋上提供名牌或类似永久的显著的附件例外3对于一开放式设备配线表可以与设备分开提供]例外明确标识有极性的设备应按标识所指的极性进行连接42.8在测试期间设备应是处于约定的正常连接和安装状态以体现正常使用状态除了体现终端扭矩测试59节所有导线终端模块或导线连接器接线端子应按照产品注明的扭矩力值紧固43温度测试43.1在43.2-43.27描述的条件下进行测试工业控制设备应满足以下要求a不达到对设备上所采用的材料构成着火危险或不利影响的高温b不能超过设备中任何一个零部件的极限温度以及c在特定测试点不能超过表43.1描述的温升值43.2在表43.1所列的所有温升值适用于约定最高允许环境温度为40的设备43.3 43.3和43.5合并和重新修订43.4 删除43.5 43.3和43.5合并和重新修订43.6 假如工业控制设备约定最高允许环境温度高于40则在这更高环境温度下允许的温升按照如下计算公式计算TR = TT- [TM- 40]其中T R 允许的温升值T T 表43.1所允许的最大温度升高TM设备上所标识的更高环境温度见62.1.1 [注设备应该服役在规定的额定的40的温度条件下或高于或低于40并且以5的整数倍为间隔如45505560]43.7 假如工业控制设备约定最高允许环境温度低于40则在这较低环境温度下允许的温升按照如下计算公式计算T R = T T + 40 - T M其中T R允许的温升值T T 表43.1所允许的最大温度升高T M设备上所标识的较低环境温度见62.1.143.8测试时线圈电压应按照表42.2所列然而当制造厂商提供了在表42.2所列每一指定电压范围内如110115或120伏特的不同额定电压变压器或电磁铁线圈以及如果线圈是采用每一额定范围内的最大值激励则应该对每一电压范围内的典型线圈规格按照44.1条明确的百分比确定试验电压进行测试如果线圈没有提供在每一范围内的最大电压等级测试应控制在表42.2所列的所有线圈测试电压43.9为了确定工业控制设备是否达到温度测试的要求应该按照以下条件进行操作a 在正常条件下b 连续通以额定电流见43.1-43.13条c 给线圈施加如表42.2或43.8条所规定的电压例外除了线圈额定电压以外的低压电源可以代替规定的电压值用于零部件的温度测试 d 约定的安装方式见43.14和43.16条e 在43.17条所规定的环境温度下f需要达到温度稳定见43.25条在测试的结果方面每一种材料或部件的温升不能超过在43.143.6和43.7条中所列的最大温升值一种材料或部件的温升是其稳定时温度与测试环境温度之间的差值在测试过程中保护装置或线路不应动作对于按照43.17条a测试的具有温控装置或其他热保护装置的设备这些温度装置的动作温度应该予以测量并修正环境温度的差值通过将修正后的温度值与保护装置动作温度比较以确定是否该设备发生温度保护并将其作为测试的结果43.10由于某一部件的发热可能会影响到其他部件的发热所以应该在所有部件同时工作时进行温度的测量43.11设备额定马力所对应的额定电流如表45.245.362.2或62.3所示表43.1最大温升材料和部件℉1 闸刀开关的刀片和接触口 30 542 当用虚拟保险丝模拟一个用于保护支路回路的保险丝测试的保险丝夹子 30 54 3当用为了保护支路回路的测试的保险丝夹子o85 1534 橡胶或热塑形绝缘材料 aa5接线端配线区域c,k,i设备标识为60或60/75的应用导线设备标识为75的应用导线5065901176总线和接线板或接线棒d 7 触点纯以及复合银银合金以及镀银其他所有材料e65e1178 绝缘系统105级绝缘系统 f热电偶法电阻法105A级绝缘系统用于单层series非绝缘或上漆裸露线圈热电偶法120E级绝缘系统f r热电偶法电阻法130B级绝缘系统f r热电偶法电阻法155F级绝缘系统f r热电偶法电阻法180H级绝缘系统f r热电偶法电阻法200N级绝缘系统f r热电偶法电阻法220R级绝缘系统f r热电偶法电阻法658590759585105951151151351351551551751171261621351711531891712072072432432792793159 绝缘材料 b p p10 在流动空气环境下距离设备外壳1英尺25.4mm处 175175 11 固定电阻和可变电阻的包裹材料内含阻性元器件的墙面安装型调光器 300 54012 已经内置阻性导体并用于安装在配电盘或不可燃的框架内的变阻调光350 630器的包裹材料67513 裸露的电阻材料热电偶法 375g14 电容 g15 功率切换半导体器件 mmn16 印刷线路板 nq17 1-16项中没有规定的材料和部件 qa 对于绝缘导体最大温升不能超过规定的导线所讨论的减去一个假定的室内温度40的最大工作温度b对于已经调查过的特殊的额定温度的复合最大温升不能超过额定温度减去假定的环境温度40c配线接线端或接线片的最有可能被接触点的温度的测量通过绝缘导体作为实际服务安装d界限不能用于连接热源如电阻器和一过载继电器的电流元件e通过相临部分材料的温度界限的温度极点见43.18不能有接触装配结构变化部件的松开破裂或材料的剥落簧片韧度降低部件的退火或其他明显的损伤f见43.19-43.25g对于一电容器最大温升是电容标识限定温度减去40h删除i当升高值是50或低于打算用一个铝才连接器或铝导线连接器应按AL7CU或AL9CU标识当接线端温升在50-65之间时连接器的标识应为AL9CUj删除k见63.3l极限值仅仅是用于线路板bus bars和用于工业控制装置功率分分布的接线板极限值不应用于位于工业控制装置短片的铜板和用于固定接触单元或工厂或配线区终端这种结构类型的最大温升取决于所用材料的的温度限定值材料的临近部分或者在铜材表面最低的温升100他们不能有装配结构的恶化部件的松散开裂或材料的剥落簧片韧度的降低部件的退火或其他明显的损伤m在这种条件下的最大温升是这种最大条件下温度应用于被半导体制造商推荐的功率消耗减去40n印刷线路板的最大温升是线路板的工作温度减去40o见63.23p见表15.2和37.1q任何组件的最大温升不能超过组件的极限温度减去40r绝缘系统应该符合UL1446绝缘材料系统标准综述的要求43.12对于电流特性表中具有最小和最大满负载电机电流的设备温度测试应采用表中所列的最大满负载电流进行即使这个电流超过了设备的最大额定电流对于电流特性表中只是稳态tripping电流的设备测试电流应采用所规定的最大稳态电流的87%43.13对于直接安装在接触器或启动器上的一个辅助开关测试电流应符合与额定切换电流相一致的最大分断电流43.14工业控制设备的测试应采用1.2m长的导线来连接每一接线端比如当导体是连接在两个接线端子之间则需要用2.4m长的导线导线的最小允许规格应至少能够承受以下负载的125%a与表45.2或45.3相一致的最大满载电机电流适当的至少对于其他负载的100%b对于如表43.1所列具有最高额定电流特性应用了可更换电流元件的过载装置的设备采用其最大满负载电机电流c对于采用过载继电器和应用了不可更换电流元件过载继电器的设备采用其最大满负载电机电流导线的大小应根据设备上导线温度等级标识并与表43.2相一致绝缘类型没有特别规定温度测试可以采用非黑色绝缘层的导线进行连接但是在仲裁测量时应采用黑色绝缘层的导线进行连接如果接线端不能达到43.12条所规定的导线尺寸如具有过载继电器的设备或者如果设备按照25.5.4条有标识限制导线的尺寸则应使用设备所允许的最大尺寸的导线例外当规定额电流在450安培或以上的工业控制设备只能采用线排时应使用厚度为6.4mm铜排其宽度按表43.3规定并且至少需要4英尺 1.2m长温度测试可以采用非黑色绝缘层的铜排进行连接但是在仲裁测量时应采用黑色绝缘层的铜排进行连接除非在个别终端设备有特殊要求铜排间的间隔距离应6.4mm不应有意加大间隔距离表43.2绝缘导体的容量导线尺寸 60 75AWG mm2铜铝铜铝24 0.2 2 - - -22 0.3 3 - - -20 0.5 5 - - -18 0.8 7 - - -16 1.3 10 - - -14 2.1 15 - 15 -12 3.3 20 15 20 1510 5.3 30 25 30 258 8.4 40 30 50 406 13.3 55 40 65 504 21.2 70 55 85 653 26.7 85 65 100 752 33.6 95 75 115 901 42.4 110 85 130 1001/0 53.5 150 1202/0 67.4 175 135 3/0 85.0 200 155 4/0 107.2230 180kcmil 250 127 255 205 300 152 285 230 350 177 310 250 400 203 335 270 500 253 380 310 600 304 420 340 700 355 460 375 750 380 475 385 800 405 490 395 900 456 520 425 1000 506 545 445 1250 633 590 485 1500 760 625 520 1750 887 650 545 2000 1013665 560注1对于接线端具有相同尺寸1/0AWG 或更大多重导体容量等于表43.2中对应导体的值乘以接线端所能容纳导体的数量2那些容量值仅仅适用于在导管安装区至多三根导线如果四根或更多导线除了一中性的带不稳定电流的导线外其他的将安装在一导管内有可能发生因为导管中心数规定设备的输出数导体的量必然是一多相体系或其他原因每一导体的容量是如果包括4-6根导体则是他们值的80%如果是7-24根则是70%25-42根则是60%如果大于或等于43根则是50%表43.3铜线路板的宽度线路板的宽度产品额定值安培线路板每一接线端英尺毫米 450-600 1 2 51 601-1000 1 3 76 1001-1200 1 4 102 1201-1600 2 3 76 1601-2000 241022001-2500 2 5 1274 2-1/2 642501-3000 3 5 1274 4 10243.15当要求仲裁测量的环境温度时应将几个温度计或热电偶放在设备周围的不同点上温度计或热电偶应放在冷却介质能够进入的地方并防止气流和异常的热辐射环境温度意味着读取的温度值在同样的距离时间决定性于测试最后环境持续环境温度代表着在连续测试的最后测试阶段相同时间间隔内的温度读数43.16封闭式的工业控制设备的测量是在制造商提供的封闭条件下开放型的工业控制设备的测量应在封闭式环境如42.6所描述例外当标识大气环境温度等级时开放型工业控制设备没有要求在封闭式条件下测试43.17温度测试应与设备所放置的环境有关a环境条件与42.4一致b一个无空气循环的测试空间用环境温度的空间测试适合环境等级43.18可接受性绝缘材料不同于其他在表43.1所描述的是由与性能相关如可燃性抗电弧性等之类决定的基于工作温度相当于测量温度的升高加上40或其他标识环境温度等级43.19在表43.1中所规定的热电偶方法的温度测量由用电位计工具类型测量的温度和应用于易受热影响的热电偶组成热电偶是由不大于0.21mm2不小于0.05mm2的导线制成的热电偶和相关的工具应是精确和校准的与实验室规定一致的热电偶导线是符合特殊热电偶在温度测量热电偶ANSI/ISA MC96.1-1982方面的要求的43.20热电偶的连接和靠近热电偶头导线应可靠地安装控制在温度得到测量的材料表面良好的热接触在大多数情况下适当的热接触将由可靠轻拍或接合在热电偶的适当位置产生但是如果材料表面是棘手的铜焊的或焊接热电偶与金属是必要的43.21电阻法测温度具体参见表40.1计算线圈温升用方程t=(r2/r1)(k+t1)-(k+t2)t是线圈温升单位为Cr2是测试最后的线圈电阻单位欧姆r1是开始测试时的线圈电阻单位欧姆t1在开始测试时的室内温度单位为Ct2在测试最后的室内温度单位为Ck对于铜是234.5对于电传导等级EC铝是225.0对于其它传导体具体数值另外确定43.22因为在测量r2前去激励一般是必要的r2在试验停止后准确的数值可能由在短的时间间隔电阻测量决定的在试验停止后马上测量电阻值的曲线变化和时间可以区分和推断以确定试验刚结束时r2的值43.23测量线圈温度的首选方法是电阻法但温度的测量不论是用热电偶还是用电阻法都已被广泛接受除了热电偶法不被使用在使用辅助绝缘任何点以外43.24参考43.23当热电偶用于测量线圈的温度时至少应使用两热电偶计热电偶应放在线圈导线加绝缘在测试过程中定位方向的上表面另外附加的热电偶放在受到另一热源影响的表面比如其他变压器或热电阻器43.25当三次连续读数时间间隔在过去的10%持续测试但不少于10分钟间隔所显示的温升没变化温升是被作为恒量的43.26红外线热分析可用于确定温度测试时热电偶所放位置的最大温度43.27机械接触装置接触部分的清洁不能用研磨剂也不能用腐蚀的方法或在温度测试前采用几次的循环负载44过压和欠压测试44.1一个含有一个或多个电磁开关部件的装配单元应能经受住110%的额定电压而不损害工作绕组并且对于直流应能在其额定电压的80%下正常工作交流应能在其额定电压的85%下正常工作44.2如果设备如具有控制回路变压器的组合电机控制装置进行欠压测试时施加于变压器原边的电压应为变压器原边额定电压的90%44.3首先应在测试温度的条件下激励磁路直到线圈温度达到稳定为止接下来控制回路电压将降低到44.1条中所规定的欠压测试的电压然后开断几次控制回路以确定最后衔铁是否能够完全闭合44.4控制回路的电压升高到45.1条中所规定的过载电压测试值直到用热电偶法测得温度稳定为止然后电压迅速降低到温度测试的电压值马上让控制回路开断几次以确定最后衔铁是否能够完全闭合44.5对于用于周期性负载的电磁铁应进行测试以便确定是否符合44.1-44.4条的规定如果当触点闭合时电阻是接入到电磁铁电路中则当线圈在温度测试条件进行激活时该电阻也应包括在电路中45过载测试45.1在本节所规定的过载测试中设备应没有电气性能或机械性能的下降触点上没有过度的烧损或凹陷触点不发生粘接45.13条中所规定的保险丝不应断开45.2工业控制设备的导线和负载的接线端间隙应具有符合量符合UL840标准第5节电气设备的绝缘间隙和爬电距离中过压控制要求的B级间隙在额定工作下带载和空载时应监测导线和负载的接线端的过电压产生的电压不能高于UL840表5.1条中所规定的最小浪涌耐受电压在过载测试过程中应该通过示波器分析的手段来实现监测45.3用于测试的导线容量最少应为表45.2或45.3所规定的满负载电机电流的125%适当的或最少是其它负载的100%表45.1过载测试回路设备约定应用场合电流安培功率因素全线交流电机启动单相6倍设备满负载电流 0.40-0.50 全线交流电机启动双相和三相测试电流见表45.4 0.40-0.50 全线直流电机启动 10倍设备满负载电流 dc a直流常规回路 1.5倍设备额定值 dc a交流常规回路 1.5倍设备额定值 0.75-0.80 直流阻性回路 1.5倍设备额定值 dc a交流阻性回路 1.5倍设备额定值 1.0 交流阻性空气加热 1.5倍设备额定值 1.0 直流阻性空气加热 1.5倍设备额定值 dc a交流白炽灯钨 1.5倍设备额定值 0.75-0.80 直流白炽灯钨 1.5倍设备额定值 dc 交流电放电管镇流器 3.0倍设备额定值 0.40-0.50 升降机控制交流hp b升降机控制直流hp b容性开关kVar 1.5倍设备额定值 c NOTE-测试循环应按45.12所述A负载是个无电感的阻性负载B升降机控制器要求无过载条件C负载是由商用电容器组成表45.2满负载电机运转电流安培数对应的各种各样a-c马力等级110-120V 200 V 208 V 220-240V b380-415 V 440-480 V 550-600 V马力单相三相单相三相单相三相单相三相单相三相单相三相单相三相1/10 3.0 -- -- -- -- -- 1.5 -- 1.0 -- -- -- -- --1/8 3.8 -- -- -- -- -- 1.9 -- 1.2 -- -- -- -- --1/6 4.4 -- 2.5 -- 2.4 -- 2.2 -- 1.4 -- -- -- -- --1/4 5.8 -- 3.3 -- 3.2 -- 2.9 -- 1.8 -- -- -- -- --1/3 7.2 -- 4.1 -- 4.0 -- 3.6 -- 2.3 -- -- -- -- --1/2 9.8 4.4 5.6 2.5 5.4 2.4 4.9 2.2 3.2 1.3 2.5 1.1 2.0 0.93/4 13.8 6.4 7.9 3.7 7.6 3.5 6.9 3.2 4.5 1.8 3.5 1.6 2.8 1.31 16.0 8.4 9.2 4.8 8.8 4.6 8.0 4.2 5.1 2.3 4.0 2.1 3.2 1.720.0 12.0 11.5 6.9 11.0 6.6 10.0 6.0 6.4 3.3 5.0 3.0 4.0 2.41-1/22 24.0 13.6 13.8 7.8 13.2 7.5 12.0 6.8 7.7 4.3 6.0 3.4 4.8 2.73 34.0 19.2 19.6 11.0 18.7 10.6 17.0 9.6 10.9 6.1 8.5 4.8 6.8 3.95 56.0 30.4 32.2 17.5 30.8 16.7 28.0 15.2 17.9 9.7 14.0 7.6 11.2 6.17-1/80.0 44.0 46.0 25.3 44.0 24.2 40.0 22.0 27.0 14.0 21.0 11.0 16.0 9.0210 100 56.0 57.5 32.2 55.0 30.8 50.0 28.0 33.0 18.0 26.0 14.0 20.0 11.015 135 84.0 -- 48.3 -- 46.2 68.0 42.0 44.0 27.0 34.0 21.0 27.0 17.020 - 108 -- 62.1 -- 59.4 88.0 54.0 56.0 34.0 44.0 27.0 35.0 22.025 - 136 -- 78.2 -- 74.8 110 68.0 70.0 44.0 55.0 34.0 44.0 27.030 - 160 -- 92 -- 88 136 80.0 87.0 51.0 68.0 40.0 54.0 32.040 - 208 -- 120 -- 114 176 104 112 66.0 88.0 52.0 70.0 41.050 - 260 -- 150 -- 143 216 130 139 83.0 108 65.0 86.0 52.0-- 62.060 - -- -- 177 -- 169 -- 154 -- 103 -- 77.0-- 77.075 - -- -- 221 -- 211 -- 192 -- 128 -- 96.0100 - -- -- 285 -- 273 -- 248 -- 165 -- 124 -- 99.0 125 - -- -- 359 -- 343 -- 312 -- 208 -- 156 -- 125150 - -- -- 414 -- 396 -- 360 -- 240 -- 180 -- 144200 - -- -- 552 -- 528 -- 480 -- 320 -- 240 -- 192250 - -- -- -- -- -- -- 604 -- 403 -- 302 -- 242 300 - -- -- -- -- -- -- 722 -- 482 -- 361 -- 289 350 - -- -- -- -- -- -- 828 -- 560 -- 414 -- 336 400 - -- -- -- -- -- -- 954 -- 636 -- 477 -- 382-- -- -- 515 -- 412 450 - -- -- -- -- -- -- 1030-- 786 -- 590 -- 472 500 - -- -- -- -- -- -- 1180A删除B为了得到电机满负载电流265和277伏220-240额定电压相应减少13%和17%表45.3满负载电机运转电流安培数对应的各种各样d-c马力等级马力90V 110-120V 180V 220-240V 500V 550-600V 1/10 -- 2.0 -- 1.0 -- -- 1/8 -- 2.2 -- 1.1 -- -- 1/6 -- 2.4 -- 1.2 -- -- 1/4a 4.0 3.1 2.0 1.6 -- -- 1/3 5.2 4.1 2.6 2.0 -- -- 1/2 6.8 5.4 3.4 2.7 -- -- 3/4 9.6 7.6 4.8 3.8 -- 1.61 12.2 9.5 6.1 4.7 -- 2.01-1/2-- 13.2 8.3 6.6 -- 2.710.8 8.5 -- 3.62 -- 17.03 -- 25.016.0 12.2 -- 5.227.0 20.0 -- 8.35 -- 40.07-1/2 -- 58.0 -- 29.0 -- 12.2 10 -- 76.0 -- 38.0 -- 16.0 15 -- 110.0 -- 55.0 27.0 24.0 20 -- 148.0 -- 72.0 34.0 31.0 25 -- 184.0 -- 89.0 43.0 38.0 30 -- 220.0 -- 106.0 51.0 46.0 40 -- 292.0 -- 140.0 67.0 61.0 50 -- 360.0 -- 173.0 83.0 75.0 60 -- -- -- 206.0 99.0 90.0 75 -- -- -- 155.0 123.0 111.0 100 -- -- -- 341.0 164.0 148.0 125 -- -- -- 425.0 205.0 185.0 150 -- -- -- 506.0 246.0 222.0 200 -- ---- 675.0 330.0 294.0A 对于1/4马力满负载电流32Vd-c 电机是8.6安培表45.4锁定的转子电机电流对应的各种各样a-c 马力等级三相110-120V 200V 208V220-240V 380-415V 440-480V 550-600V电机牌号电机牌号电机牌号电机牌号电机牌号电机牌号电机牌号HPB C DE BC DE BC DE BC DE BC DE BC DE BC DE1/2 40 40 23 23 22.1 22.1 20 20 20 12 10 10 8 8 3/4 50 50 28.8 28.8 27.6 27.6 25 25 20 15 12.5 12.5 10 10 160 60 34.5 34.5 33 33 30 30 20 18 15 15 12 121-1/2 80 80 46 46 44 44 40 40 27 24 20 20 16 16 2 100 100 57.5 57.5 55 55 50 50 34 30 25 25 20 20 3 128 146 73.6 84 71 81 64 73 43 44 32 36.5 25.6 29.2 5184 244 105.8 140 102 135 92 122 61 74 46 61 36.8 48.87-1/2 254 366 146 210 140 202 127 183 84 111 63.5 91.5 50.8 73.2 10 324 450 186.3 259 179 249 162 225 107 136 81 113 64.8 90 15 464 674 267 388 257 373 232 337 154 204 116 169 93 135 20 580 898 334 516 321 497 290 449 194 272 145 225 116 180 25 730 1124 420 646 404 621 365 562 243 340 183 281 146 225 30 870 1348 500 775 481 745 435 674 289 408 218 337 174 270 40 1160 1648 667 948 641 911 580 824 387 499 290 412 232 330 50 1450 2060 834 1185 802 1139 725 1030 482 623 363 515 290 412 60-- -- 1001 1421 962 1367 870 1236 578 748 435 618 348 49475 -- -- 1248 1777 1200 1708 1085 1545 722 935 543 773 434 618100 -- -- 1668 2154 1603 2071 1450 1873 965 1134 725 937 580 749 125 -- -- 2087 2692 2007 2589 1815 2341 1207 1417 908 1171 726 936 150 -- -- 2496 3230 2400 3106 2170 2809 1441 1700 1085 1405 868 1124 200 -- -- 3335 4307 3207 4141 2900 3745 1927 2267 1450 1873 1160 1498 250 -- -- -- -- -- -- 3650 4688 -- 2834 1825 2344 1460 1875 300 -- -- -- -- -- -- 4400 5618 -- 3400 2200 2809 1760 2247 350 -- -- -- -- -- -- 5100 6554 -- 3967 2550 3277 2040 2622 400 -- -- -- -- -- -- 5800 7490 -- 4534 2900 3745 2320 2996 450 -- -- -- -- -- -- 6500 8427 -- 5100 3250 4214 2600 3371 500 -- -- -- -- -- -- 7252 9363 -- 5667 3625 4682 2900 3746 注意1依照63.8标识的设备估价是与电机原意设计E一致的2一设计E设备没有标识使用估计是与电机原意设计B C和D一致的45.4过载测试应当包括电压功率和电流的最大中断条件45.5对设备测试所采用的交流电流额定频率为60Hz例外测试回路频率在25-60Hz被认为是具有代表性的45.6设备应当接通和分断具有表45.1所规定的电流和功率因数的电路如果控制器是额定马力而不是额定电流为了采用表45.1应采用表45.2和表45.3的相关信息将额定马力折算为满负载电流值45.7采用空心电感获得表45.1所规定的电抗功率因数电感之间是可以并联的一个电感不能与电阻相并联例外在任何相位如果电阻器功率大约是总功率的1%的话空心电感可以并联一个电阻电阻的阻值可按下面公式计算R=1001/PF-PF E/ISHPF是功率因素E是闭合回路相电压I是相电流45.8除了在45.9中阐述的闭合测试回路的电压应为表42.2中所规定的过载测试电压的100%-110%45.9对于额定功率大于25马力18.6千瓦电动机控制器或额定电流大于100安培电磁开关开路电压应大于表42.2中所规定的电压而闭合回路电压应低于表42.2中所规定的电压值在这样的条件下只要开路电压符合表中所规定电压的110%过负载测试不需要考虑闭合时的回路电压值然而测试回路的负载能力不必要大于第50节中短路回路测试综述的规定45.10在对具有厂家安装的机械的或电子的互锁装置以及及其任何组合的反向控制器进行测试时操作过程中应将所有这些互锁装置连接起来如果互锁系统被作为一选择权来提供则系统将在测试过程中失败45.11设备应当接通和分断测试回路50次对于反向控制器应在50次工作之后同时与两线圈额外激励十次循环45.12除了反向控制器以外的其它所有设备测试循环时间应为1秒通9秒断对于反向控制器循环时间应是1秒钟正向1秒钟反向8秒钟断开例外1如果设备的操作不允许这样的循环时间应尽可能选择接近以上的循环时间进行测试2如果确定其持续时间小于1秒设备在没有断开电路或受到热不良影响的情况下始终接通着测试电流并且在通过示波器所确定的断开前设备的触点处于适当的位置则接通时间可以减少至该持续时间3对于应接通测试电流在500-1499安培的设备的断开时间不应超过120秒对于应接通测试电流在1499安培以上的设备的断开时间不应超过240秒45.13在测试过程中外壳应通过一只非延时30安培保险丝与被认为测试电路中近似的电极上45.14一个设备有两个或多个电极的话应对两邻近的电极进行反极性的测试例外如果设备上标识有相同的极性则两邻近电极间就不需要相反的极性存在45.15在对可相反极性使用的多极设备进行测试时应将所有不用的电极与外壳连接起来45.16除非设备提供有接线图或标明用于控制负载的电极编号的等同标识设备进行测试时应用一个电极控制单相或直流负载用两电极来控制多相负载45.17图45.1表明了典型的接线线路A线路A和线路B分别表示了在设备没有标识负载连接方式的情况下设备与单相和三相负载的典型连接B线路C和线路D分别表示了具有断开所有连线标致或类似标示的设备与三相和单相负载的典型连接C线路E表示了没有标识连接极性的双电极双转换继电器的连接线路F表示了标识有相同极性的双电极双转换继电器的连接对于双转换设备假如对于每一状态触点的间隙和触点压力都是一样的话可只对常开或常闭其中一种状态进行测试对于单电极或双转换继电器也同样适用46耐久性试验46.1在本节所述的耐久性试验中不应出现装置在电气和机械方面的故障触点粘接以及触点的异常燃弧或烧损45.13条中所规定的保险丝不能断开在试验后装置应能够符合第49节绝缘耐压测试的要求46.2除非在本节中有另外规定耐久性测试的条件应与第45节所规定的过负载测试条件一样46.3设备应接通和分断符合如表46.1所规定的有效电流和功率因数的电路试验的循环时间和循环次数按照表46.1的规定接通时的回路试验电压应为表42.2所规定耐久性试验电压的100%-110%46.4如果采用钨丝灯白炽灯作为试验负载除了如果为满足负载总功率要求而有必要使用一两个小于500瓦灯外负载应是由数量最接近的500瓦灯泡组成如果适合他们相关的。

QC080000零件承认作业规范

QC080000零件承认作业规范1.目的﹕为零件承认顺利进行﹐针对供货商送样承认之数据及作业办法进行规定。

2.范围:适用于本公司所有零件-机构类&电子类所有零件承认作业。

3.权责﹕3.1采购课：针对要承认之物料寻求以评监合格的供货商﹐并提供相关承认数据。

3.2工程课：针对采购要购买厂商的电子类、线材类、机构及包装类材料进行承认，并提供PCBGERBER,图纸等相应数据供采购打样及生产﹔3.3供货商：按工程课承认的承认书进行生产﹔，不可自行更换供货商,若需更换供货商,则必须将样品和承认书送回承认核可后，方可更换。

，其它零件可以依据要求的SPEC进行承认和更换供货商。

3.4GP课：对承认书GP数据进行确认3.5品保课：依据承认书进行检验。

4.定义﹕无5.细则5.1零件承认申请，如确认未承认之零件，则立即寻求供货商。

，电镀材料必有电镀报告，PCB板必有菲林图片）、包装规范、第三方认证ICP 测试报告，（如SGS报告）（需按附件1测试项目执行）、GPData调查表（附件2）、不使用有害物质保证书。

，（如SGS报告）（需按附件1测试项目执行）、GPData调查表（附件2）、不使用有害物质保证书、色差表&色差打点图(铁件部分若有表面处理与网印喷漆的需提供;塑料件则全部需提供）、外观机构图、外观检验1/2/3级面、定议图(RD&QA)及外观检验规范、Art-Work图(美工图;Logo图;注明PantoneCard.No.#)等.与是否OK，确认后由GP课将承认书送工程课接收后，进行零件承认﹔，文管中心人员将此PDF档案转发至GP课，由GP确认其GP数据是否符合要求，GP课确认完成后回传文管中心存盘，如退件则请文管退回，需请重新提供承认书。

，（如SGS报告）（需按附件1测试项目执行）、GPData调查表（附件2）、不使用有害物质保证书。

，（如SGS报告）（需按附件1测试项目执行）、GPData调查表（附件2）、不使用有害物质保证书、材料原始供货商MSDS、材料原始供货商成份表、四大类材料原始厂商需是SONYGP厂商（油漆、塑料、线材、涂料）。

Client Information(客户信息) - 中国纺织工业联合会检测

皮革、鞋类委托测试申请单 Form No.: ZFXJ Date Received: 2012-Date Due: 2012-Test No.:客户信息申请公司:付款公司:地址: 地址: 联系人: 联系人: 电话: 电话: 传真: 传真: 邮编: 邮编: 电子信箱:电子信箱:样品信息商标: 样品描述: 款号:样品数量:备注:测试项目（请在产品标准及所需测试项目前打勾，若需做全套产品标准，则只在第一栏打勾即可）鞋类等级：□ 优等品 □ 合格品□ 感官质量□ 外底与外中底粘着强度□ 鞋带拉出强度 □ 皮鞋 QB/T 1002-2005 □ 异味 □ 勾心硬度 □ 磨耗量（阿克隆） □ 皮凉鞋 GB/T 22756-2008 □ 耐折性能 □ 勾心抗弯刚度 □ 静摩擦系数 □ 休闲鞋 QB/T 2955-2008 □ 外底耐磨性能 □ 勾心规格□ 可分解芳香胺染料 □ 儿童皮鞋 QB/T 2880-2007 □ 剥离强度 □ 衬里和内垫摩擦色牢度 □ 甲醛含量 □ 旅游鞋 GB/T 15107-2005 □ 外底硬度 □ 内底纤维板屈挠指数 □ 皮革中Cr(VI)含量 □ 足球鞋 GB/T 19706-2005 □ 鞋跟结合力 □ 鞋面材料低温屈挠性能其他： □ EV A 拖鞋和凉鞋QB/T 2977-2008 □ 鞋帮拉出强度 □ 拉伸强度和扯断伸长率其他：皮革□ 服装用皮革 QB/T 1872-2004 □ 感官质量 □ 耐磨性 □ 可分解芳香胺染料 □ 鞋面用皮革 QB/T 1873-2004 □ 规定负荷伸长率 □ 崩裂高度□ 甲醛含量 □ 鞋里用皮革 QB/T 2680-2004 □ 摩擦色牢度 □ 抗张强度和断裂伸长率其他： □ 手套用皮革 QB/T 2704-2005 □ 收缩温度 □ 视密度 □ 家具用皮革 GB/T 16799-2008 □ pH 和稀释差 □ 撕裂强度 □ 汽车装饰用皮革 QB/T 2703-2005 □ 耐折牢度 □ 涂层粘着牢度其他：背提包等级：□ 优等品 □ 合格品 □ 外观质量 □ 配件 □五金配件 □ QB/T 1333-2010□负重□ 摩擦色牢度其他：其他： □ 缝合强度 □ 拉链耐用牢度测试周期: □ 正常（4个工作日） □ 加急（3个工作日, 加收40％） □ 特急（2个工作日, 加收100％）是否归还余样: □ 是 □ 否评语: □ 是 □ 否报告: □ 中文报告 □ 英文报告发票寄至: □ 申请公司 □ 付款公司报告寄至: □ 申请公司 □ 付款公司□ 自取 □ 传真 □ 电子邮件 □ 快递申请人签字及公司印章：申请日期：实验室查收：注意：1. 为了避免延误测试时间，请申请者清楚明了地填写此申请表。

5082-5508-JK000中文资料

QC080000标准-中文版

QC080000手册

5082-5501-KH000中文资料

5082-2800中文资料

%u5EFA%u8BAE%u4E66%uFF0D%u5B89%u5FBD%u957F%u6C5F%u94A2%u94C1101207

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A508A508M

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QC080000零件承认作业规范

Client Information(客户信息) - 中国纺织工业联合会检测

A001C110518029001 力臣 6项聚合中文