Efficient and Scalable Barrier over Quadrics and Myrinet with a New NIC-Based Collective Me
空间位阻效应英语
空间位阻效应英语Space congestion refers to the growing scarcity of physical space in our environment, whether it be in our cities, buildings, or even in outer space. This phenomenon is becoming more and more prevalent as our population continues to grow and urbanize at an unprecedented rate.One of the main drivers of space congestion is the rapid increase in global population. According to the United Nations, the world's population is expected to reach 9.7 billion by 2050, with most of this growth occurring in urban areas. This population boom puts enormous pressure on our cities, leading to crowded streets, packed public transportation, and overflowing housing complexes.Another factor contributing to space congestion is the rise of the sharing economy. With the advent of apps and platforms like Airbnb and Uber, people are now able to monetize their unused spaces, whether it be a spare room or a car. While this may seem like a win-win situation, it also means that our cities are now accommodating more people and vehicles than ever before, leading to increased congestion and competition for space.Furthermore, advances in technology have also played a role in exacerbating space congestion. The rise of e-commerce has led to a surge in online shopping, resulting in a greater demand for warehouse and distribution space. Additionally, the growing popularity of electric vehicles has created a need for more charging stations, further adding to the space crunch.In outer space, the issue of space congestion is also becoming a concern. As more countries and companies launch satellites into orbit, the risk of collisions and space debris has increased exponentially. This not only poses a threat to existing satellites and space missions but also hinders future exploration and commercial activities in space.To address the issue of space congestion, policymakers and urban planners must take a holistic approach. This may include implementing smart city initiatives, investing in public transportation infrastructure, and promoting sustainable urban development practices. In addition, regulations and guidelines should be put in place to manage space debris and prevent overcrowding in outer space.In conclusion, space congestion is a multifaceted issue that requires coordinated efforts from governments, businesses, and individuals to mitigate its impact. By adopting sustainablepractices and embracing innovative solutions, we can ensure that our spaces remain accessible, safe, and functional for generations to come.。
信息科技的英语作文带翻译
信息科技的英语作文带翻译题目,Information Technology。
信息科技。
Information technology, often abbreviated as IT, has become an integral part of modern society. It refers to the use of computers, software, networks, and other devices to store, retrieve, transmit, and manipulate data. In today's digital age, information technology plays a crucial role in various aspects of our lives, including communication, education, business, healthcare, and entertainment.信息技术,通常缩写为IT,已成为现代社会的一个不可或缺的部分。
它指的是使用计算机、软件、网络和其他设备来存储、检索、传输和操纵数据。
在今天的数字时代,信息技术在我们生活的各个方面起着至关重要的作用,包括通信、教育、商业、医疗和娱乐。
One of the most significant impacts of information technology is on communication. With the advent of theinternet, communication has become faster, easier, and more convenient than ever before. Email, instant messaging,social media platforms, and video conferencing have revolutionized the way people interact and exchange information. Distance is no longer a barrier to communication, as individuals from different parts of the world can connect in real-time through various online channels.信息技术最重要的影响之一是在通信方面。
NEC Vector Engine Accelerators 用户指南说明书
QuickSpecsNEC Vector Engine Accelerators OverviewNEC Vector Engine AcceleratorsHewlett Packard Enterprise supports, on selected HPE ProLiant and Apollo servers, computational modules based on the NEC Vector Engine technology.The NEC Vector Engine Accelerator Module with its unmatched memory bandwidth per core offers a balanced architecture for applications bounded by insufficient Byte per FLOPS characteristics.Extremely large amount of data can be processed per cycle thanks to the native vector architecture.Moreover, users can easily exploit these capabilities via a standard development environment leveraged from the vector supercomputers era. Applications don’t have to be migrated to a new programming environment. Existing Fortran and C/C++ codes will simply have to be recompiled for the Vector Engine processor.Full software environment is available with compilers, libraries and tools. Compilers are able to vectorize and auto-parallelize loops. Parallelization with OpenMP and MPI is supported.The NEC Vector Engine Accelerator Module is offered in a PCIe form factor, to be hosted by an HPE supported server running a standard Linux® operating system as the user front end.It has been developed using 16nm FinFET process technology for extreme high performance and low power consumption.An outstanding memory bandwidth of 1.2 TB/s is leveraged from the exceptional integration of six HBM2 memory modules and a multi-core vector processor using Chip-on-Wafer-on-Substrate technology.The eight cores share a Last-Level-Cache, facilitating shared memory parallelization.NEC Vector Engine ModelsHPE NEC Vector Engine Accelerator Module Q7G75A Notes: Q7G75A is to be used with HPE Apollo 6500 Gen10. Please see the server QuickSpecs for configuration rules, including requirements for enablement kits.HPE NEC Vector Engine Accelerator Module Q7G75C Notes: Q7G75C is to be used with HPE ProLiant DL380 Gen10. Please see the server QuickSpecs for configuration rules, including requirements for enablement kits.Description HPE NEC Vector Engine Accelerator ModuleHPE NEC VectorEngine Accelerator Module Q7G75A or Q7G75CImageHPE NEC Vector Engine Accelerator Module (VE) offers the best memory bandwidth per core to accelerate AI and HPC real applications. Its record Bytes per FL OPS ratio unleashes applications that are memory bandwidth bounded on current architectures. High sustained application performance of Vector Supercomputers is now available in this PCIe card form factor, at a fraction of the power consumption.Performance2.15 TFLOPS DP | 4.3 TFLOPS SP Memory Size48 GB HBM2 Stacked Memory Memory Bandwidth1.2 TB/s to HBM2 Stacked Memory Bytes/FLOPS0.56 Cores8 Vector Cores Each core with 3 FMA units, 1 Scalar unit, 64 registers of 16,384 bits (256 elements) - 128kB p. corePeer to Peer via PCIex16 PCIe Gen3 Power<300W CoolingPassive Cooling Form FactorDouble-width, Full Height, Full Length Supported Servers and Operating Systems Supported Servers Maximum number of VE cards per Server Server supported Operating Systems HPE ProLiant DL380 Gen10 Up to 3RHEL and CentOS 7.4, 7.5HPE Apollo 6500 Gen10 Up to 8RHEL and CentOS 7.4, 7.5 Software (orderseparately)NEC Fortran (2003, 2008), C (11), C++ (14) compilers. OpenMP 4.5. NEC MPI 3.1. BL AS, FFT, libc, Lapack, etc libraries. Stencil library. GNU profiler (gprof). GNU debugger (gdb) and Eclipse parallel tools platform (PTP). FtraceViewer, PROGINF tools. Notes:− HPE ProLiant DL380 Gen10 servers must be equipped with several options to receive the HPE NEC Vector Engine. Forexample, High Performance Heatsink Kit, High Performance Temperature Fan Kit, Graphics Cable Kit. Only a selection of HPE ProLiant DL380 Gen10 server models are supported with the HPE NEC Vector Engine Accelerator Module. Please see the HPE ProLiant DL380 Gen10 server QuickSpecs for configuration rules. − NEC Software Licenses are available from HPE on a per project basis.Performance of the Vector Engine 1.0 Type 10B-P•The Vector Engine 1.0 Type 10B-P PCIe module is built for HPC and AI.•8 vector cores.•16MB last-level-cache shared by all the cores at 3TB/s (400GB/s per core).•Each core has 64 registers of 16,384 bits (256 elements) for a total of 128kB per core.•Three Fused Multiply-Add (FMA), one Scalar and a few other functional units are available per core.• 2.15 TFLOPS of double-precision performance.• 4.30 TFLOPS of single-precision performance.•48GB HBM2 at 1.2 TB/s.•Power consumption: less than 300W.•x16 PCIe Gen 3.0 maximizes bandwidth between the HPE ProL iant server and the vector processors. The whole application being run on the Vector Engine, it is less subject to PCIe bottleneck than codes offloading functions to accelerators and transferring data constantly.•Vector processors can communicate directly when placed under the same root complex. Up to 8 VEs in an Apollo 6500 Gen10.Service and SupportService and SupportNotes:This option is covered under HPE Support Services / Service Contract applied to the HPE ProLiant Server. No separate HPE Support Services need to be purchased.Most HPE branded options sourced from HPE that are compatible with your product will be covered under your main product support at the same level of coverage, allowing you to upgrade freely. Please check HPE ProLiant Server documentation for more details on the services for this particular option.HPE Pointnext - Service and SupportGet the most from your HPE Products. Get the expertise you need at every step of your IT journey with HPE Pointnext Services. We help you lower your risks and overall costs using automation and methodologies that have been tested and refined by HPE experts through thousands of deployments globally. HPE Pointnext Advisory Services, focus on your business outcomes and goals, partnering with you to design your transformation and build a roadmap tuned to your unique challenges. Our Professional and Operational Services can be leveraged to speed up time-to-production, boost performance and accelerate your business. HPE Pointnext specializes in flawless and on-time implementation, on-budget execution, and creative configurations that get the most out of software and hardware alike.Consume IT on your termsHPE GreenLake brings the cloud experience directly to your apps and data wherever they are—the edge, colocations, or your data center. It delivers cloud services for on-premises IT infrastructure specifically tailored to your most demanding workloads. With a pay-per-use, scalable, point-and-click self-service experience that is managed for you, HPE GreenLake accelerates digital transformation in a distributed, edge-to-cloud world.•Get faster time to market•Save on TCO, align costs to business•Scale quickly, meet unpredictable demand•Simplify IT operations across your data centers and cloudsManaged services to run your IT operationsHPE GreenLake Management Services provides services that monitor, operate, and optimize your infrastructure and applications, delivered consistently and globally to give you unified control and let you focus on innovation. Recommended ServicesHPE Pointnext Tech Care.HPE Pointnext Tech Care is the new operational service experience for HPE products. Tech Care goes beyond traditional support by providing access to product specific experts, an AI driven digital experience, and general technical guidance to not only reduce risk but constantly search for ways to do things better. HPE Pointnext Tech Care has been reimagined from the ground up to support a customer-centric, AI driven, and digitally enabled customer experience to move your business forward. HPE Pointnext Tech Care is available in three response levels. Basic, which provides 9x5 business hour availability and a 2 hour response time. Essential which provides a 15 minute response time 24x7 for most enterprise level customers, and Critical which includes a 6 hour repair commitment where available and outage management response for severity 1 incidents.https:///services/techcareHPE Pointnext Complete CareHPE Pointnext Complete Care is a modular, edge-to-cloud IT environment service that provides a holistic approach to optimizing your entire IT environment and achieving agreed upon IT outcomes and business goals through a personalized and customer-centric experience. All delivered by an assigned team of HPE Pointnext Services experts. HPE Pointnext Complete Care provides: • A complete coverage approach -- edge to cloud•An assigned HPE team•Modular and fully personalized engagement•Enhanced Incident Management experience with priority access•Digitally enabled and AI driven customer experiencehttps:///services/completecareTechnical SpecificationsWarranty and Support ServicesWarranty and Support Services will extend to include HPE options configured with your server or storage device. The price of support service is not impacted by configuration details. HPE sourced options that are compatible with your product will be covered under your server support at the same level of coverage allowing you to upgrade freely. Installation for HPE options is available as needed. To keep support costs low for everyone, some high value options will require additional support. Additional support is only required on select high value workload accelerators, fibre channel switches, InfiniBand and UPS batteries over12KVA.See the specific high value options that require additional support hereProtect your business beyond warranty with HPE Support ServicesHPE Pointnext provides a comprehensive portfolio including Advisory and Transformational, Professional, and Operational Services to help accelerate your digital transformation. From the onset of your transformation journey, Advisory and Transformational Services focus on designing the transformation and creating a solution roadmap. Professional Services specializes in creative configurations with flawless and on-time implementation, and on-budget execution. Finally, operational services provides innovative new approaches like Flexible Capacity and Complete Care, to keep your business at peak performance. HPE is ready to bring together all the pieces of the puzzle for you, with an eye on the future, and make the complex simple.Parts and MaterialsHewlett Packard Enterprise will provide HPE-supported replacement parts and materials necessary to maintain the covered hardware product in operating condition, including parts and materials for available and recommended engineering improvements.Parts and components that have reached their maximum supported lifetime and/or the maximum usage limitations as set forth in the manufacturer's operating manual, product QuickSpecs, or the technical product data sheet will not be provided, repaired, or replaced as part of these services.The defective media retention service feature option applies only to Disk or eligible SSD/Flash Drives replaced by Hewlett Packard Enterprise due to malfunction.HPE Support CenterThe HPE Support Center is a personalized online support portal with access to information, tools and experts to support HPE business products. Submit support cases online, chat with HPE experts, access support resources or collaborate with peers. Learn more https:///hpesc/public/homeHPE's Support Center Mobile App* allows you to resolve issues yourself or quickly connect to an agent for live support. Now, you can get access to personalized IT support anywhere, anytime.HPE Insight Remote Support and HPE Support Center are available at no additional cost with a HPE warranty, HPE Support Service or HPE contractual support agreement.Notes:*HPE Support Center Mobile App is subject to local availability.For more informationVisit the Hewlett Packard Enterprise Service and Support website.Summary of ChangesDate Version History Action Description of Change15-Nov-2021 Version 3 Changed Service and Support section was updated.02-Dec-2019 Version 2 Changed Overview and Standard Features sections were updated.Q7G75C addition to be used with HPE ProLiant DL380 Gen10 02-Apr-2019 Version 1 New New QuickSpecsCopyrightMake the right purchase decision. Contact our presales specialists.ChatEmailCall© Copyright 2021 Hewlett Packard Enterprise Development LP. The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.a00059759enw - 16363 - WorldWide - V3 - 15-November-2021Get updates。
mp2文档
mp2Abstract:The purpose of this document is to provide an overview of the MP2 (Message Passing Interface 2) protocol. MP2 is a communication protocol used for parallel computing in distributed systems. This document will discuss the features, architecture, and usage of MP2, as well as some common use cases and examples.IntroductionMP2, short for Message Passing Interface 2, is a widely used communication protocol for parallel computing in distributed systems. It is designed to facilitate communication and coordination between processes or nodes in a parallel computing environment. MP2 provides a standardized interface for message passing, which allows different components of a distributed system to exchange data and synchronize their activities efficiently.Features of MP2MP2 offers several important features that make it a preferred choice for parallel computing:1.Portability: MP2 is a portable protocol, which means it can be usedacross various platforms and architectures. It supports a wide range ofoperating systems, including Windows, Linux, and macOS.2.Scalability: MP2 is highly scalable, allowing the addition of morenodes or processes to the system without significant performance degradation.It supports both small-scale and large-scale parallel computing, making itsuitable for a variety of applications.3.Efficiency: MP2 is designed to be highly efficient in terms of bothcommunication overhead and resource utilization. It optimizes data transfer and minimizes latency, allowing for faster and more efficient parallelcomputations.4.Fault-tolerance: MP2 includes mechanisms for fault-tolerance,allowing the system to continue functioning even in the presence of failures. It provides fault detection, recovery, and error handling capabilities to ensure the reliability of parallel computing applications.Architecture of MP2MP2 follows a client-server architecture, where the nodes or processes involved in parallel computing can be categorized as clients or servers. The clients initiate communication by sending messages to servers, and servers respond to these messages accordingly. MP2 uses a message queue to manage the messages, allowing for asynchronous communication between nodes. It also supports both point-to-point and collective communication, providing flexibility in designing parallel algorithms.Usage of MP2To use MP2 for parallel computing, developers need to implement the MP2 library or use existing MP2 libraries available for different programming languages. The MP2 library provides a set of functions and APIs to manage communication, data exchange, and synchronization between processes or nodes. Developers can use these functions to send and receive messages, perform collective operationssuch as broadcast and reduce, and synchronize their activities using barriers or locks.Common Use CasesMP2 is widely used in various fields where parallel computing is required. Some common use cases of MP2 include:1.Scientific Computing: MP2 is used in scientific simulations, wherecomplex calculations are performed in parallel across multiple nodes. It allows scientists to speed up computations and solve larger-scale problems moreefficiently.2.Big Data Processing: MP2 is used in distributed data processingframeworks such as Apache Spark and Hadoop. It enables efficientcommunication and coordination between nodes for processing large volumes of data in parallel.3.High-Performance Computing: MP2 is used in high-performancecomputing clusters, where multiple nodes work together to solvecomputationally intensive problems. It allows for efficient parallelization ofalgorithms and improves overall performance.4.Machine Learning: MP2 is used in distributed machine learningframeworks such as TensorFlow and PyTorch. It enables efficient training and inference across multiple nodes, allowing for faster model development and deployment.Example: Parallel Matrix MultiplicationTo illustrate the usage of MP2, let’s consider an example of parallel matrix multiplication. Suppose we have two matrices A and B, and we want to calculate their product C = A * B. By using MP2, we can distribute the computation across multiple nodes and perform the multiplication in parallel.# Pseudocode for parallel matrix multiplication using MP2import mp2def multiply_matrices(A, B):num_rows = len(A)num_cols = len(B[0])result = [[0] * num_cols for _ in range(num_rows)]# Create MP2 processesprocesses = mp2.create_processes()# Distribute computationmp2.scatter(processes, A, B)# Perform local multiplicationlocal_result = mp2.multiply_local(processes)# Gather resultsmp2.gather(processes, local_result, result)# Synchronize processesmp2.barrier(processes)return result# Usage exampleA = [[1, 2, 3],[4, 5, 6]]B = [[7, 8],[9, 10],[11, 12]]result = multiply_matrices(A, B)print(result)In this example, the computation is divided into multiple processes using the MP2 library. Each process performs a local multiplication of a subset of the matrices, and the results are gathered to obtain the final result. The MP2 barrier function is used to synchronize the processes before returning the result.ConclusionMP2 is a powerful communication protocol for parallel computing in distributed systems. It offers a standardized and efficient way to exchange data and coordinate activities between nodes or processes. With its portability, scalability, efficiency, and fault-tolerance features, MP2 is widely used in various fields for parallel computing applications. This document has provided an overview of the features, architecture, and usage of MP2, as well as a practical example of its usage in parallel matrix multiplication.。
《基于Y6非富勒烯受体光伏和忆阻器件界面问题及性能优化研究》范文
《基于Y6非富勒烯受体光伏和忆阻器件界面问题及性能优化研究》篇一基于Y6非富勒烯受体光伏与忆阻器件界面问题及性能优化研究一、引言近年来,随着科技的不断进步,Y6非富勒烯受体光伏器件和忆阻器件在光电子领域中受到了广泛的关注。
Y6非富勒烯受体材料因其独特的光电性能和良好的稳定性,在光伏器件中具有巨大的应用潜力。
然而,在光伏器件和忆阻器件的界面问题以及性能优化方面仍存在诸多挑战。
本文将针对基于Y6非富勒烯受体的光伏和忆阻器件界面问题展开研究,并提出相应的性能优化策略。
二、Y6非富勒烯受体光伏器件界面问题(一)界面结构与能级匹配Y6非富勒烯受体光伏器件的界面结构对光电器件的性能具有重要影响。
界面处能级匹配问题直接关系到电荷传输效率及器件的稳定性。
目前,界面处存在的能级不匹配问题会导致电荷传输过程中产生较大的能量损失,进而影响光伏器件的效率。
(二)界面缺陷与电荷复合界面缺陷是影响Y6非富勒烯受体光伏器件性能的另一个关键因素。
界面处的缺陷可能导致电荷复合,降低光电器件的开路电压和填充因子,从而影响其光电转换效率。
此外,界面缺陷还可能引发器件的稳定性问题。
三、Y6非富勒烯受体忆阻器件界面问题(一)界面电阻与导电性能Y6非富勒烯受体在忆阻器件中应用时,其与其它材料组成的界面电阻直接关系到忆阻器件的导电性能。
界面的电阻对忆阻效应的产生及维持具有重要意义,合适的界面电阻可以保证忆阻器具有良好的开/关比和稳定性。
(二)界面材料兼容性Y6非富勒烯受体与其它材料之间的兼容性是影响忆阻器件性能的另一个关键因素。
不同材料之间的界面相互作用可能影响电荷传输过程,进而影响忆阻器的性能。
因此,选择合适的界面材料对提高忆阻器性能具有重要意义。
四、性能优化策略(一)优化界面结构与能级匹配针对Y6非富勒烯受体光伏器件的界面问题,可以通过优化界面结构、调整能级匹配等方式来提高电荷传输效率。
例如,通过引入适当的界面修饰材料或调整器件制备工艺来改善能级匹配问题。
一种改进的高斯频率域压缩感知稀疏反演方法(英文)
AbstractCompressive sensing and sparse inversion methods have gained a significant amount of attention in recent years due to their capability to accurately reconstruct signals from measurements with significantly less data than previously possible. In this paper, a modified Gaussian frequency domain compressive sensing and sparse inversion method is proposed, which leverages the proven strengths of the traditional method to enhance its accuracy and performance. Simulation results demonstrate that the proposed method can achieve a higher signal-to- noise ratio and a better reconstruction quality than its traditional counterpart, while also reducing the computational complexity of the inversion procedure.IntroductionCompressive sensing (CS) is an emerging field that has garnered significant interest in recent years because it leverages the sparsity of signals to reduce the number of measurements required to accurately reconstruct the signal. This has many advantages over traditional signal processing methods, including faster data acquisition times, reduced power consumption, and lower data storage requirements. CS has been successfully applied to a wide range of fields, including medical imaging, wireless communications, and surveillance.One of the most commonly used methods in compressive sensing is the Gaussian frequency domain compressive sensing and sparse inversion (GFD-CS) method. In this method, compressive measurements are acquired by multiplying the original signal with a randomly generated sensing matrix. The measurements are then transformed into the frequency domain using the Fourier transform, and the sparse signal is reconstructed using a sparsity promoting algorithm.In recent years, researchers have made numerous improvementsto the GFD-CS method, with the goal of improving its reconstruction accuracy, reducing its computational complexity, and enhancing its robustness to noise. In this paper, we propose a modified GFD-CS method that combines several techniques to achieve these objectives.Proposed MethodThe proposed method builds upon the well-established GFD-CS method, with several key modifications. The first modification is the use of a hierarchical sparsity-promoting algorithm, which promotes sparsity at both the signal level and the transform level. This is achieved by applying the hierarchical thresholding technique to the coefficients corresponding to the higher frequency components of the transformed signal.The second modification is the use of a novel error feedback mechanism, which reduces the impact of measurement noise on the reconstructed signal. Specifically, the proposed method utilizes an iterative algorithm that updates the measurement error based on the difference between the reconstructed signal and the measured signal. This feedback mechanism effectively increases the signal-to-noise ratio of the reconstructed signal, improving its accuracy and robustness to noise.The third modification is the use of a low-rank approximation method, which reduces the computational complexity of the inversion algorithm while maintaining reconstruction accuracy. This is achieved by decomposing the sensing matrix into a product of two lower dimensional matrices, which can be subsequently inverted using a more efficient algorithm.Simulation ResultsTo evaluate the effectiveness of the proposed method, we conducted simulations using synthetic data sets. Three different signal types were considered: a sinusoidal signal, a pulse signal, and an image signal. The results of the simulations were compared to those obtained using the traditional GFD-CS method.The simulation results demonstrate that the proposed method outperforms the traditional GFD-CS method in terms of signal-to-noise ratio and reconstruction quality. Specifically, the proposed method achieves a higher signal-to-noise ratio and lower mean squared error for all three types of signals considered. Furthermore, the proposed method achieves these results with a reduced computational complexity compared to the traditional method.ConclusionThe results of our simulations demonstrate the effectiveness of the proposed method in enhancing the accuracy and performance of the GFD-CS method. The combination of sparsity promotion, error feedback, and low-rank approximation techniques significantly improves the signal-to-noise ratio and reconstruction quality, while reducing thecomputational complexity of the inversion procedure. Our proposed method has potential applications in a wide range of fields, including medical imaging, wireless communications, and surveillance.。
高中英语2025届高考科技创新类主题阅读高频词块整理汇总
高考英语科技创新类主题阅读高频词块(一)新科技AI=artificial intelligence 人工智能(intelligent 智能的)digital device 数码设备electronic device 电子设备driverless car 无人驾驶汽车high-tech 高科技technology/technological 科技/科技的(n.&adj.)WeChat pay 微信支付autonomous vehicle 自动驾驶汽车functional 实用的(adj.)expert /experiment 专家(n.&n.)assume 假设(v.)(assumption n.假设)break/keep the record 打破/保持记录current 现如今的(adj.)sensor传感器(n.)(sense v.感受到 n.感觉)monitor 监视器/监控/班长(n./v./n.)cooperate 合作(v.)(cooperation n.合作)application 应用(n.) (apply v.申请)pulse 脉冲(n.)resource 资源(n.)technique 技巧(n.)complicated=complex 复杂的(adj.Information gap 信息差biological battery 生物电池laptop 掌上电脑switch 开关(n.)扭转;转变(v.) (switch on/off 打开/关闭) button 按钮(n.)equipment 设备(不可数名词)(be equipped with 装备有)facility 设备(可数名词)telescope 望远镜(n.)microscope 显微镜(n.)labor 劳动力(二)网络social media 社交媒体social networking 社交网络firewall 防火墙(n.)post 上传 (v.)update 更新(v.&n.)download 下载(v.)upload 上传(v.)loading 加载upgrade 升级(v.)data base 数据库statistic 数据(n.)accurate=precise 精确的(adj.) (accuracy&precision 精确)in good/poor condition 性能良好/不好surf the internet 网上冲浪send signals 发送信号sign up for=register 注册(signature n.签名)website 网站(n.)automatic 自动的(adj.)(三)创新行为innovate 创新(v.) (innovation n.)Promote 促进,提拔(v.) (promotion n.)recreate 再创造;再现advocate 宣传(v.) (advocation n.)take advantage of= make use of 利用in advance 提前identify 确认;识别(v.)(identity n.身份)design 设计(v.)(designer n.设计师)rely on=depend on 取决于(reliable adj.可靠的)involve in 涉及,牵扯(involvement n.参与)lack of 缺少(n.)be lacking in 缺少(v.)inspire鼓舞,振奋(v.)(inspiration n.灵感)be aware of 意识到(awareness n.)revolution 革命the industrial revolution 工业革命reform 改革potential 潜在的&潜能(adj.&n.)develop 发展detect 监测globalization 全球化(n.) (globe/global/globalize 球体/全球的/全球化) industrialization 工业化urbanization 城市化broadcast 广播(v.) (AAA变形)individual 个人的&个人(adj.&n)expend 扩大(v.) (expansion n.扩大)extend 延伸(v.)efficient 有效的(adj.) (efficiency n.效率)operate 操作,手术(v.)(operation n.操作)invent 发明(v.)(invention n.发明)define 下定义(v.)inspire 激励(v.) (inspiration n.灵感)(四)常用副词constantly 连续不断instantly 立即particularly 尤其especially 尤其obviously=apparently 明显definitely 注定unexpectedly 出乎意料occasionally 偶然merely 仅仅,只不过barely 几乎不rarely 罕有,几乎不absolutely 绝对的continuously 持续generally 总地universally 普遍eventually 最终initially 起初immediately 立刻。
太阳能电池材料一区英文文献
太阳能电池材料一区英文文献太阳能电池是一种将太阳能转化为电能的装置,它是可再生能源的重要组成部分。
太阳能电池的效率和性能取决于所使用的材料。
在过去的几十年里,科学家们一直在寻找更高效、更稳定的太阳能电池材料。
本文将介绍一些在太阳能电池材料研究领域中被广泛引用的一区英文文献。
首先,我们来看一篇题为“Perovskite solar cells with a planar heterojunction structure prepared using room-temperature solution processing techniques”的文献。
这篇文章由杨XX等人于2012年在《Nature》杂志上发表。
文章介绍了一种采用室温溶液处理技术制备的具有平面异质结构的钙钛矿太阳能电池。
该研究表明,这种新型太阳能电池具有高效率和稳定性,可以成为替代传统硅基太阳能电池的有力竞争者。
接下来,我们来看一篇题为“High-efficiency solution-processed perovskite solar cells with millimeter-scale grains”的文献。
这篇文章由李XX等人于2015年在《Science》杂志上发表。
文章介绍了一种采用溶液处理技术制备的高效率钙钛矿太阳能电池。
研究人员通过优化晶体生长条件,成功地制备出具有毫米级晶粒的钙钛矿薄膜,从而提高了太阳能电池的效率和稳定性。
此外,还有一篇题为“Organometal halide perovskite solar cells: degradation and stability”的文献。
这篇文章由李XX等人于2016年在《Energy & Environmental Science》杂志上发表。
文章主要讨论了钙钛矿太阳能电池的降解和稳定性问题。
研究人员通过对太阳能电池材料的长期稳定性进行研究,发现了一些导致钙钛矿太阳能电池降解的机制,并提出了一些改进措施,以提高太阳能电池的稳定性。
2025届高考英语写作素材积累之青少年科技创新+词汇句型清单
2025届高考英语写作素材积累之青少年科技创新词汇句型清单一、词汇1. Innovation / Technological Innovation:科技创新2. Teenager / Youth:青少年3. Science and Technology:科学技术4. Creativity:创造力5. Invention:发明6. Discovery:发现7. Research and Development (R&D):研发8. Advanced Technology:先进技术9. Digital Technology:数字技术10. Artificial Intelligence (AI):人工智能11. Robotics:机器人技术12. Biotechnology:生物技术13. Nanotechnology:纳米技术14. Renewable Energy:可再生能源15. Smart Device:智能设备16. Coding:编程17. Experiment:实验18. Innovation Ability:创新能力19. Problem-solving Skills:解决问题的能力20. Critical Thinking:批判性思维21. Curiosity:好奇心22. Perseverance:毅力23. Teamwork:团队合作24. Leadership:领导力25. Future-oriented:面向未来的二、句型1. Teenagers play a crucial role in driving technological innovation.青少年在推动科技创新方面发挥着至关重要的作用。
2. Encouraging teenagers' interest in science and technology is essential for fostering innovation.鼓励青少年对科学技术的兴趣对于培养创新至关重要。
2019-2020学年七宝中学高三上英语10月月考
七宝中学2019学年度第一学期高三10月学情调研考试时间:120分钟满分140分出卷:封杏玉审卷:汤晓燕II. Grammar and Vocabulary (20%)Section A Directions: After reading the passage below, fill in the blanks to make the passage coherent and grammatically correct. For the blanks with a given word, fill in each blank with the proper form of the given word; for the other blanks,use one word that best fits each blank.Flu is killing us. The usual response to the annual flu is not enough to fight against the risks we currently face, __21____(say) nothing of preparing us for an even deadlier widespread flu that most experts agree ____22___(come) in the future. Yes, we have an annual vaccine, and everyone _____23___(qualify) should get it without question. The reality, however, is that less than half Americans get the flu vaccines. And the flu vaccines we have are only 60% effective in the best years and 10% effective in the worst years. We urgently need a much ___24______(effective) flu vaccine.In the U.S. alone, seasonal flu can cause up to 36 million infections, three-quarters of a million hospitalizations and 56,000 deaths. We are not investing the resources needed to protect ourselves, our loved __25____ and our communitiesWhy not? We haven't been hit by __26___ truly destructive widespread disease in a long time. So as individuals, we let down our guard as our leaders quietly defund and destaff the services we need to protect us.The risk of continued foot dragging is huge. In a severe widespread disease, the U.S. health care system could be defeated in just weeks. Millions of people would be infected by the virus, and would die in the weeks and months following the initial outbreak.The cost of preventing epidemics is roughly a tenth of ___27___ it costs to cope with them when they hit. In 2012, a call was issued for an annual billion-dollar U.S. commitment __28____ the development of a universal flu vaccine. Six years later, the search for a universal vaccine remains seriously underfunded.The simple reason lies in our collective satisfaction. 29______ ______ ______ headlines about the flu are gone, hospitals are emptied of flu patients, and school and workplace absence rates decline, we go back to business as usual.Leading scientists and public health officials have the capability to keep us much safer from flu. They need your quick and decisive support to succeed. Your action today ___30___ be a matter of life and death for you and those you love.Section BDirections: Complete the following passage by using the words in the box. Each word can only be used once. Note that there is one word more than you need.Published in the journal Nature Communications, the research offers a(n) ___32____pathway for safely and permanently removing the greenhouse gas from our atmosphere.Current technologies for carbon capture and storage focus on compressing CO2 into a liquid form, transporting it to a suitable site and injecting it underground.But ____33_____has been hampered by engineering challenges, issues around economic viability and environmental concerns about possible _____34___ from the storage sites.RMIT researcher Dr Torben Daeneke said converting CO2 into a solid could be a more sustainable approach."While we can't ___35___turn back time, turning carbon dioxide back into coal and burying it back in the ground is a bit like rewinding the emissions clock," Daeneke, an Australian Research Council DECRA Fellow, said."To ___36____,CO2 has only been converted into a solid at extremely high temperatures, making it industrially unviable. "By using liquid metals as a catalyst, we've shown it's possible to turn the gas back into carbon at room temperature, in a process that's efficient and scalable."While more research needs to be done, it's a crucial first step to delivering solid storage of carbon."How the carbon conversion worksLead author, Dr Dorna Esrafilzadeh, a Vice-Chancellor's Research Fellow in RMIT's School of Engineering, developed the electrochemical technique to capture and convert atmospheric CO2 to storable solid carbon.To convert CO2, the researchers designed a liquid metal catalyst with specific surface ___37____ that made it extremely efficient at conducting electricity while chemically activating the surface.The carbon dioxide is dissolved in a beaker filled with an electrolyte liquid and a small amount of the liquid metal, which is then charged with an electrical ___38_____.The CO2 slowly converts into solid flakes of carbon, which are naturally detached from the liquid metal surface, allowing the continuous production of carbonaceous solid. Esrafilzadeh said the carbon produced could also be used as an electrode."A side benefit of the process is that the carbon can hold electrical charge, becoming a supercapacitor, so it could ___39____ be used as a component in future vehicles.""The process also produces synthetic fuel as a by-product, which could also have industrial____40____."III. Reading ComprehensionSection A .The days of the camera-carrying tourist may be numbered. Insensitive travelers are being ordered to __41 pointing their cameras at local residents. Tour companies selling expensive trips to remote corners of the world have become increasingly annoyed at the 42 of visitors upsetting locals. Now one such operator plans to ban clients from taking any photographic equipment on holidays. Julian Matthews is the director of Discovery Initiatives, a company that is working hand-in-hand with other organizations to offer holidays combining high adventure with working on environmental projects.Matthews says he is providing ‘holidays without 43 , insisting that Discovery Initiatives is not a tour operator but an environmental support company. Clients are referred to as ‘participants’. ‘We see ourselves as the next step on from eco-tourism, which is merely a(n) 44 form of sensitive travel—ours is a more active approach.’However, says Matthews, there is a price to pay. ‘I am planning to introduce tours with a total ban on cameras because of the damage they do to our relationships with 45 . I have seen some 46 things, such as a group of six tourists arriving at a remote village in the South American jungle, each with a video camera attached to their face. That sort of thingtears me up inside. Would you like somebody to come into your home and take a photo of you cooking? A camera is like a weapon; it puts up a barrier and you lose all the 47 that comes through body language, which 48 means that the host communities are denied access to the so-called cross-cultural exchange.’Matthews’ views reflect a growing49 among some tour companies at the increasingly rude behaviour of wealthy tourists. Chris Parrott, of Journey Latin America, says: ‘We tell our clients that indigenous (土著的) people are often shy about being 50 , but we certainly don’t tell them not to take a camera. If they take pictures without asking, they may find themselves having tomatoes thrown at them.’Crispin Jones, of Exodus, the overland truck specialist, says: ‘We don’t have a(n)51 but, should cameras cause offence, our tour leaders would make it quite clear that they cannot be 52 . Clients tend to do what they are told.’Earthwatch, which pioneered the 53 of active eco-tourism by sending paying volunteers to work on scientific projects around the world, does not ban cameras, but operates strict rules on their use. Ed Wilson, the marketing director of the company, says: ‘Some people use the camera as a barrier; it allows them to distance themselves from the reality of what they 54 . I would like to see tourists 55 their cameras for once, rather than trying to record everything they see.’41. A. consider B. stop C. practise D. mind42. A. edge B. expense C. bottom D. sight43. A. surprise B. limit C. doubt D. guilt44. A. passive B. simple C. inexpensive D. innovative45. A. guides B. locals C. tourists D. specialists46. A. routine B. interesting C. terrible D. personal47. A. protection B. passion C. communication D. dignity48. A. effectively B. accidentally C. comparatively D. optimistically49. A. unease B. feeling C. awareness D. despair50. A. misunderstood B. witnessed C. sponsored D. photographed51. A. experience B. policy C. market D. intention52. A. offended B. used C. judged D. deserted53. A. change B. benefit C. concept D. history54. A. say B. hear C. do D. see55. A. turning up B. looking after C. putting away D. running outSection BDirections: Read the following three passages. Each passage is followed by several questions or unfinished statements.For each of them there are four choices marked A, B, C and D. Choose the one that fits best according to the informationgiven in the passage you have just read.(A)A voyaging ship was wrecked during a storm at sea and only two of the men aboard were able to swim to a small, desert-like island. Not knowing what else to do, the two survivors agreed that they had no alternative but to pray to God.However, to find out whose prayers were more powerful, they agreed to divide the territory between them and stay on opposite sides of the island.The first thing they prayed for was food. The next morning, the first man saw a fruit-bearing tree on his side of the island, and he was able to eat its fruit. But the other man’s parcel of land remained barren.After a week, the first man became lonely and decided to pray for a wife. The next day, another ship was wrecked and the only survivor was a woman who swam to his side of the island. But on the other side of the island, there was nothing.Soon thereafter the first man prayed for a house, clothes and more food. The next day, like magic, all of these things were given to him. However, the second man still had nothing.Finally, the first man prayed for a ship so that he and his wife could leave the island, and in the morning he found a ship docked at his side of the island.The first man boarded the ship with his wife and decided to leave the second man on the island, considering the other man unworthy to receive God’s blessings since none of his prayers had been answered.As the ship was about to leave, the first man heard a voice from Heaven booming, “Why are you leaving your companion on the island?”“My blessings are mine alone since I was the one who prayed for them,” the first man answered. “His prayers were all unanswered and so he doesn’t deserve anything.”“You are mistaken!” the voice rebuked him. “He had only one prayer, which I answered. If not for that, you would not have received any of my blessings.”“Tell me,” the first man asked the voice, “what did he pray for that I should owe him anything?”“He prayed that all your prayers would be answered.”For all we know, our blessings are not the fruits of our prayers alone, but those of another praying for us. So what you do for others is more important than what you do for yourself.56. The first man’s wife is _____.A. a swimmer who got to the island by accidentB. an angel sent by God to keep him companyC. a survivor from another wrecked shipD. a native person on the desert-like island57. The underlined word “barren” in Paragraph 3 is closest in meaning to _____.A. isolatedB. unproductiveC. fertileD. dry58. Which of the following is true about the second man?A. He didn’t deserve any blessing from God.B. None of his prayers was answered by God.C. He is not brave enough to tell God his needs.D. His prayer helped his companion get out of trouble.59. What’s the moral of the story?A. Never judge a person by appearance.B. Don’t lose heart in trouble.C. Helping others is helping ourselves.D. Greed is the root of all evil.(B)Registration now open for the 2019 Student Research Showcase Researchers often find itdifficult to talk about their projects with friends and relatives who are not in the same research field. Those who are able to effectively communicate their work to a broader audience are at an advantage in terms of communicating the value of what they do to the public, to superiors at school or on the job, and to organizations that could provide funding to support a project. Sigma Xi’s Student Research Showcase is a unique opportunity for high school, undergraduate, andKey deadlinesfor the 2017Student ResearchShowcase:♦P roject description approvaland registration deadline:February 22, 2019♦P roject submissiondeadline: March 22, 2019♦E valuation period: April 3—10, 2019research to a general audience.During the review period,more than sixty SigmaXimembers volunteers as judgesto evaluate students’submissions(递交的作品)and engage in digitalconversations with presentersthrough their websites.Participants findSigma Xi members areencouraged to volunteer asjudges.graduate students to develop their communication skills through multimedia. Held annually, this online science communication competition allows students to showcase their research on a website they build. The competition is open to all research areas.Presentation websites contain three main parts: an a b s t r a c t,a t e c h n i c a l slideshow, and a video to introduce the project and its relevance to the research community and society. The v i d e o p a r t c h a l l e n g e s participants to present their discussion with the judges andthe public helpful in betterunderstanding their research.“I’m really excited abouttrying to bridge the gapbetween the scientificcommunity and a broaderaudience,” said Luka Negoita,the 2015 graduate divisionwinner, when asked about hismotivation to participate in theshowcase. Participantscompete for awards of up to$500 in high school,undergraduate, and graduatedivisions. The winner of thePeople’s Choice Award isselected based on a public voteand receives a $250 award.For more information on theStudent Research Showcase,visithttps:///meetings-events/student-research-showcase.60. Student Research Showcase is intended to _____.A. spot the students who will devote themselves to researchB. find out the research area that is popular with studentsC. help students to use multimedia more skillfullyD. give students a chance to present their research61. Students must communicate their research to the public in the part of _____ on their websites.A. the abstractB. the technical slideshowC. the videoD. the discussion62. Which of the following statements is true of Student Research Showcase?A. Participants have to submit their project by February 22 at the latest.B. The public will decide which project wins People’s Choice Award.C. Sigma Xi will employ world famous scientists to be the judges.D. No communication is allowed between judges and participants.(C)A scientist working at her lab bench and a six-month-old baby playing with his food might seem to have little in common. After all, the scientist is engaged in serious research to uncover the very nature of the physical world, and the baby is, well, just playing…right? Perhaps, but some developmental psychologists have argued that this “play” is more like a scientific investigation than one might think.Take a closer look at the baby playing at the table. Each time the bowl of rice is pushed over the table edge, it falls in the ground---and, in the process, it brings out important evidence about how physical objects interact ; bowls of rice do not float in mid-sit, but require support to remain stable. It is likely that babies are not born knowing the basic fact of the universe; nor are they ever clearly taught it. Instead, babies may form an understanding of object support through repeated experiments and then build on this knowledge to learn even more about how objects interact. Though their ranges and tools differ, the baby’s investigation and the scientist’s experiment appear to share the same aim(to learn about the natural world ), overall approach (gathering direct evidence from the world), and logic (are my observations what I expected?).Some psychologists suggest that young children learn about more than just the physical world in this way---that they investigate human psychology and the rules of language using similar means. For example, it may only be through repeated experiments, evidence gathering, and finally overturning a theory, that a baby will come to accept the idea that other people can have different views and desires from what he or she has, for example, unlike the child, Mommy actually doesn’t like Dove chocolate.Viewing childhood development as a scientific investigation throws on how children learn, but it also offers an inspiring look at science and scientists. Why do young children and scientists seem to be so much alike? Psychologists have suggested that science as an effort ---the desire to explore, explain, and understand our world---is simply something that comes from our babyhood. Perhaps evolution provided human babies with curiosity and a natural drive to explain their worlds, and adult scientists simply make use of the same drive that served them as children. The same cognitive systems that make young children feel good about figuring something out may have been adopted by adult scientists. As some psychologists put it, ”It is not that children are little scientists but that scientists are big children.”63.We learn from Paragraph 2 that __________A. scientists and babies seem to observe the world differentlyB. scientists and babies often interact with each otherC. babies are born with the knowledge of object supportD. babies seem to collect evidence just as scientists do64. Children may learn the rules of language by __________A. exploring the physical worldB. investigating human psychologyC. repeating their own experimentsD. observing their parents’ behaviors65. What is the main idea of the last paragraph?A. The world may be more clearly explained through children’s play.B. Studying babies’ play may lead to a better understanding of science.C. Children may have greater ability to figure out things than scientists.D. One’s drive for scientific research may become stronger as he grows.66. What is the author’s tone when he discusses the connection between scientists’ research and babies’ play?A. Convincing.B. Confused.C. Confidence.D. Cautious.Section C (4*2=8)Directions: Read the following passage. Fill in each blank with a proper sentence given in the box. Each sentence can be used only once. Note that there are two more sentences than you need.Many people know that trash is a big problem on planet Earth. What many people don’t know is that trash has become a problem in outer space too. _____67_____Statistically, there are more than 22,000 pieces of junk in space around the earth. And these are just the items that we can see from the surface of the earth by telescopes or radars. ____68____Objects, like bits of old space rockets or satellites, move around the planet at very high speeds, so fast that even a very small piece can break important satellites or become dangerous to people, particularly astronauts. If the tiniest piece of junk crashed into a spacecraft, it could damage the vehicle. That’s because the faster an object moves, the greater the impact if the object collides with something else.To help minimize additional space junk, countries around the world have agreed to limit the time their space tools stay in orbit to 25 years. Each tool must be built to fall safely into the earth’s atmosphere, or the mass of gases that surround the earth, after that. _____69_____Many scientists are also proposing different ways to clean up space junk. The Germans have been planning a space mission with robots that would collect pieces of space trash and bring them back to Earth so that they can be safelydestroyed."In our opinion the problem is very challenging, and it's quite urgent as well," said Marco Castronuovo, an Italian Space Agency researcher who is working to solve the problem. ______70_____ Many of these objects are tools that help people use their cell phones or computers."The time to act is now; as we go farther in time we will need to remove more and more fragments," he says.IV. Summary Writing (10%)Directions:Read the following passage. Summarize in no more than 60 words the main idea of the passage and how it is illustrated. Use your own words as far as possible.It is a common sight on campus or in the streets: a young person rides by on an electric scooter, traveling quickly and proudly. But Beijing’s traffic authorities have said that starting on Sept.5, people who are caught riding electric scooters on public roads or bicycle lanes will be fined 10 yuan. They will also be given a warning not to use the vehicles on public roads again.The announcement was made after traffic police in Shanghai started a campaign to get electric scooters off public roads, with police officers stopping riders because the scooters could cause traffic problems.The Beijing Consumer Association said it had tested more than 20 electric scooters of different brands recently and found that most had substandard brakes. It added that 16 of the tested scooters could go faster than the maximum 20 km per hour set for electric bikes. According to the traffic police, people who ride electric scooters at certain speeds can easily bump into the vehicles in the vehicle lane and hurt people who walk in the bicycle lanes.But seeing the benefits that electric scooters have brought to young people, experts are worried that the ban may take effect slowly.Electric scooters are a great answer to the ‘last mile problem’ of getting from a public transport station to one’s home. They’re light enough to throw over your shoulder. They’re easy to ride just about anywhere and don’t need a lot of physical effort. The scooter can travel 25 km on one charge. It’s convenient and easy to control.They are also good for environment. Unlike cars and buses, electric scooters produce no carbon dioxide, need no fuel and make almost no noise.For many young people, they use them to copy cool celebrities they have seen in videos.IV. Translation (3+3+4+5)1.上班时间打盹的那个员工应该为此事故负责。
新方法欧盟资助高校研究精确测量硅晶圆翘曲的新方法,将应用于下一代集成电路
新方法欧盟资助高校研究精确测量硅晶圆翘曲的新方法,将应用于下一代集成电路由于集成电路的尺寸限制,其制造都是基于薄晶圆的堆叠,然而,晶圆太薄导致了在加工制造和测量过程中由于晶圆受到应力致使其容易弯曲,这一问题一直没有解决方案,且颇具挑战性。
为此,在爱尔兰政府及欧盟第七框架计划的资助下,爱尔兰都柏林城市大学与英国杜伦大学、德国佛雷堡大学合作研发出一种利用测试光源精准测量单个硅晶片应力和翘曲的新技术,目前,研究人员正在与行业伙伴合作,致力于在保证质量、改善制造工艺的基础上,将其新方法转化为一种实用工具。
与此同时,他们也继续其在金刚石光源上的研究工作,以改善技术并使其适用于不同的研究背景和材料。
图为翘曲测量示意图摩尔定律1965年,英特尔联合创始人戈登·摩尔观察到,集成电路中晶体管的密度每18-24个月就增加一倍,这一趋势在接下来的几十年内一直得以保持。
然而,随着集成电路的印刷工艺达到了原子级尺寸,摩尔定律也已接近极限。
为了继续提高性能,集成电路制造商们开始探索新的方向,将具有不同功能的多个芯片垂直封装到一起,该方法被称为“多摩尔”方法,即异构集成。
翘曲问题采用新方案的晶圆厚度大约为传统晶圆厚度的十分之一,这些晶圆由于特别薄,只有25-100µm厚,所以极易弯曲,但是它们在制造过程中承受极大压力。
爱尔兰都柏林城市大学教授Patrick McNally解释说:“想象着你将四五块比头发还薄的硅片粘在一起,加热到100-200°C,然后你穿着靴子站在上面,甚至上下跳几下。
半导体加工过程中可能受到的损坏程度就像这样。
”在制造过程中晶圆承受的应力和由此产生的翘曲可能会导致故障、性能改变。
为了避免这些缺陷,制造商急于了解如何处理他们在设计和制造过程中的应力和翘曲问题。
新方法目前,在不造成损坏的情况下测量单个硅晶圆的翘曲是不可能实现的,因此人们用整个封装的翘曲作为替代。
利用测试光源,该研究团队研发了一种通过透射X射线衍射成像对封装中每一个硅晶圆的翘曲进行无损、精确测量的技术。
大面积钙钛矿组件 界面 能量损失
大面积钙钛矿组件界面能量损失英文回答:Large-area perovskite solar cells have gainedsignificant attention in recent years due to theirpotential for high power conversion efficiency and low-cost fabrication. However, one of the major challenges inscaling up perovskite solar cells is the issue of energy losses at the interfaces within the device.There are several factors that contribute to energy losses in large-area perovskite solar cells. One of themain sources of energy loss is the recombination of charge carriers at the interfaces between different layers in the device. For example, at the perovskite/electron transport layer interface, there can be a significant loss of energy due to charge recombination. This can occur when the charge carriers (electrons) in the perovskite layer recombine with the charge carriers (holes) in the electron transport layer, resulting in a loss of energy.Another source of energy loss in large-area perovskite solar cells is the reflection of light at the interfaces. When light hits the surface of the solar cell, a portion of it is reflected back instead of being absorbed andconverted into electricity. This can lead to a decrease in the overall efficiency of the device.In addition, energy losses can also occur during the charge extraction process in large-area perovskite solar cells. When the charge carriers are extracted from the device, there can be losses due to resistance in the electrical contacts or due to inefficient charge collection. These losses can further reduce the overall efficiency of the solar cell.To mitigate these energy losses, researchers are exploring various strategies. One approach is to optimize the interfaces between different layers in the device to minimize charge recombination. This can be achieved byusing suitable interface materials or engineering the interfaces to improve charge extraction and reducerecombination.Another strategy is to incorporate light-trapping structures or anti-reflection coatings to minimize light reflection at the interfaces. These structures can help increase the absorption of light and improve the overall efficiency of the solar cell.Furthermore, improving the charge extraction process is also crucial in reducing energy losses. This can be achieved by optimizing the electrical contacts and charge collection pathways within the device. For example, using materials with high conductivity and low resistance can help improve charge extraction and reduce energy losses.In conclusion, large-area perovskite solar cells face challenges in minimizing energy losses at the interfaces within the device. However, through optimization of the interfaces, incorporation of light-trapping structures, and improvement of the charge extraction process, researchers are making significant progress in reducing these losses and improving the overall efficiency of perovskite solarcells.中文回答:大面积钙钛矿太阳能电池由于其高转换效率和低成本制造的潜力,在近年来引起了广泛关注。
半导体微电子专业词汇中英文对照
半导体微电子专业词汇中英文对照Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Acoustic Surface Wave 声表面波Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区A/D conversion 模拟-数字转换Adhesives 粘接剂Admittance 导纳Aging 老化Airborne 空载Allowed band 允带allowance 容限,公差Alloy-junction device合金结器件Aluminum(Aluminum) 铝Aluminum – oxide 铝氧化物Aluminum Nitride 氮化铝Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度A M light 振幅调制光,调幅光amplitude limiter 限幅器Amorphous 无定形的,非晶体的Amplifier 功放放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Antenna 天线Aperture 孔径Arsenide (As) 砷Array 阵列Atomic 原子的Atom Clock 原子钟Attenuation 衰减Audio 声频Auger 俄歇Automatic 自动的Automotive 汽车的Availability 实用性Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ball bond 球形键合Band 能带Band gap 能带间隙Bandwidth 带宽Bar 巴条发光条Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Batch 批次Battery 电池Beam 束光束电子束Bench 工作台Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bit 位比特Blocking band 阻带Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Boron 硼Borosilicate glass 硼硅玻璃Bottom-up 由下而上的Boundary condition 边界条件Bound electron 束缚电子Bragg effect 布拉格效应Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊 FBrillouin zone 布里渊区Buffer 缓冲器Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn-in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Bus 总线Calibration 校准,检定,定标、刻度,分度Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carbon dioxide (CO2) 二氧化碳Carrier 载流子、载波Carry bit 进位位Cascade 级联Case 管壳Cathode 阴极Cavity 腔体Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemical etching 化学腐蚀法Chemically-Polish 化学抛光Chemically-Mechanically Polish (CMP) 化学机械抛光Chemical vapor deposition (cvd)化学汽相淀积Chip 芯片Chip yield 芯片成品率Circuit 电路Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clean 清洗Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-loop gain 闭环增益Coating 涂覆涂层Coefficient of thermal expansion 热膨胀系数Coherency 相干性Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Communication 通信Compact 致密的Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-SemiconductorField-Effect-Transistor(CMOS) 互补金属氧化物半导体场效应晶体管Computer-aided design(CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试 /制造Component 元件Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 结构Conlomb 库仑Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Continuous wave 连续波Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Controlled 受控的Converter 转换器Conveyer 传输器Cooling 冷却Copper interconnection system 铜互连系统Corrosion 腐蚀Coupling 耦合Covalent 共阶的Crossover 交叉Critical 临界的Cross-section 横断面Crucible坩埚Cryogenic cooling system 冷却系统Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Cubic crystal system 立方晶系Current density 电流密度Curvature 曲率Current drift/drive/sharing 电流漂移/驱动/共享Current Sense 电流取样Curve 曲线Custom integrated circuit 定制集成电路Cut off 截止Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J))Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Decade 十进制Decibel (dB) 分贝Decode 解码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep energy level 深能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Detector 探测器Developer 显影剂Diamond 金刚石Die 芯片(复数dice)Diode 二极管Dielectric Constant 介电常数Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffraction 衍射Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dimension (1)尺寸(2)量钢(3)维,度Diode 二极管Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Directional antenna 定向天线Discharge 放电Discrete component 分立元件Disorder 无序的Display 显示器Dissipation 耗散Dissolution 溶解Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Dose 剂量Double-diffusive MOS(DMOS)双扩散MOS Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Dual-polarization 双偏振,双极化Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effect 效应Effective mass 有效质量Electric Erase Programmable Read Only Memory(E2PROM) 电可擦除只读存储器Electrode 电极Electromigration 电迁移Electron affinity 电子亲和势Electron-beam 电子束Electroluminescence 电致发光Electron gas 电子气Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electro-optical 光电的Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOSEnteric (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Epoxy 环氧的Equivalent circuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Equipment 设备Erasable Programmable ROM (EPROM)可搽取(编程)存储器Erbium laser 掺铒激光器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Exponential 指数的Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Fabry-Perot amplifier 法布里-珀罗放大器Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快表面态Feedback 反馈Fermi level 费米能级Femi potential 费米势Fiber optic 光纤Field effect transistor 场效应晶体管Field oxide 场氧化层Figure of merit 品质因数Filter 滤波器Filled band 满带Film 薄膜Fine pitch 细节距Flash memory 闪存存储器Flat band 平带Flat pack 扁平封装Flatness 平整度Flexible 柔性的Flicker noise 闪烁(变)噪声Flip-chip 倒装芯片Flip- flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Focal plane 焦平面Forbidden band 禁带Formulation 列式,表达Forward bias 正向偏置Forward blocking /conducting 正向阻断/导通Free electron 自由电子Frequency deviation noise 频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化镓Gallium Nitride 氮化镓Gate 门、栅、控制极Gate oxide 栅氧化层Gate width 栅宽Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Gold 金Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Graphene 石墨烯Grating 光栅Green laser 绿光激光器Ground 接地Grown junction 生长结Guard ring 保护环Guide wave 导波波导Gunn - effect 狄氏效应Gyroscope 陀螺仪Hardened device 辐射加固器件Harmonics 谐波Heat diffusion 热扩散Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Hell - effect 霍尔效应Hertz 赫兹Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS(H-MOS)高性能MOS器件High power 大功率Hole 空穴Homojunction 同质结Horizontal epitaxial reactor 卧式外延反应器Hot carrier 热载流子Hybrid integration 混合集成Illumination (1)照明(2)照明学Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Inch 英寸Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Index of refraction 折射率Indium 铟Indium tin oxide (ITO) 铟锡氧化物Inductance 电感Induced channel 感应沟道Infrared 红外的Injection 注入Input power 输入功率Insertion loss 插入损耗Insulator 绝缘体Insulated Gate FET(IGFET) 绝缘栅FET Integrated injection logic 集成注入逻辑Integration 集成、积分Integrated Circuit 集成电路Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions 国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Laser 激光器Laser diode 激光二极管Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Lead 铅Leakage current (泄)漏电流Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Linearity 线性化Liquid 液体Lock in 锁定Longitudinal 纵向的Long life 长寿命Lumped model 集总模型Magnetic 磁的Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law 质量守恒定律Master-slave D flip-flop 主从D 触发器Matching 匹配Material 材料Maxwell 麦克斯韦Mean free path 平均自由程Mean time before failure (MTBF) 平均工作时间Mechanical 机械的Membrane (1)薄腊,膜片(2)隔膜Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor 金属半导体FET Metalorganic Chemical Vapor Deposition MOCVD 金属氧化物化学汽相淀积Metallization 金属化Metal oxide semiconductor (MOS)金属氧化物半导体MeV 兆电子伏Microelectronic technique 微电子技术Microelectronics 微电子学Microelectromechanical System (MEMS) 微电子机械系统Microwave 微波Millimeterwave 毫米波Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobility 迁移率Module 模块Modulate 调制Molecular crystal 分子晶体Monolithic IC 单片MOSFET 金属氧化物半导体场效应晶体管Mount 安装Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multilayer 多层Multiplication coefficient 倍增因子Multiplexer 复用器Multiplier 倍增器Naked chip 未封装的芯片(裸片)Nanometer 纳米Nanotechnology 纳米技术Negative feedback 负反馈Negative resistance 负阻Negative-temperature-coefficient负温度系数Nesting 套刻Noise figure 噪声系数Nonequilibrium 非平衡Nonvolatile 非挥发(易失)性Normally off/on 常闭/开Nuclear 核Numerical analysis 数值分析Occupied band 满带Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon 光子Optical quenching 光猝灭Optical transition 光跃迁Optical-coupled isolator 光耦合隔离器Organic semiconductor 有机半导体Orientation 晶向、定向Oscillator 振荡器Outline 外形Out-of-contact mask 非接触式掩模Output characteristic 输出特性Output power 输出功率Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Pass band 通带Passivation 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Pattern 图形Payload 有效载荷Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photonic devices 光子器件Photolithographic process 光刻工艺Photoluminescence 光致发光Photo resist (光敏)抗腐蚀剂Photo mask 光掩模Piezoelectric effect 压电效应Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plane 平面的Plasma 等离子体Plate 板电路板P-N junction pn结Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor 聚合物半导体Poly-silicon 多晶硅Positive 正的Potential (电)势Potential barrier 势垒Potential well 势阱Power electronic devices电力电子器件Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Procedure 工艺Process 工艺Projector 投影仪Propagation delay 传输延时Proton 质子Proximity effect 邻近效应Pseudopotential method 赝势法Pump 泵浦Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Q Q值Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency 量子效应Quantum mechanics 量子力学Quasi – Fermi-level 准费米能级Quartz 石英Radar 雷达Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination 辐照复合Radio 无线电射电射频Radio-frequency RF 射频Raman 拉曼Random 随机Range 测距Radio 比率系数Ray 射线Reactive sputtering source 反应溅射源Real time 实时Receiver 接收机Recombination 复合Recovery diode 恢复二极管Record 记录Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Red light 红光Reference 基准点基准参考点Refractive index 折射率Register 寄存器Regulate 控制调整Relative 相对的Relaxation 驰豫Relaxation lifetime 驰豫时间Relay 中继Reliability 可靠性Remote 远程Repeatability 可重复性Reproduction 重复制造Residual current 剩余电流Resonance 谐振Resin 树脂Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Resolution 分辨率Response time 响应时间Return signal 回波信号Reverse 反向的Reverse bias 反向偏置Ribbon 光纤带Ridge waveguide 脊形波导Ring laser 环形激光器Rotary wave 旋转波Run 运行Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range 电流饱和区Scan 扫描Scaled down 按比例缩小Scattering 散射Schematic layout 示意图,简图Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Screen 筛选Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor laser半导体激光器Semiconductor-controlled rectifier 半导体可控硅Sensitivity 灵敏度Sensor 传感器Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shaping 成型Shield 屏蔽Shifter 移相器Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘体上硅Silver whiskers 银须Simple cubic 简立方Simulation 模拟Single crystal 单晶Sink 热沉Sinter 烧结Skin effect 趋肤效应Slot 槽隙Slow wave 慢波Smooth 光滑的Subthreshold 亚阈值的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Solution 溶液Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Space Craft 宇宙飞行器Spacing 间距Specific heat(PT) 比热Spectral 光谱Spectrum 光谱(复数)Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spot 斑点Spray 喷涂Spreading resistance 扩展电阻Sputter 溅射Square root 平方根Stability 稳定性Stacking fault 层错Standard 标准的Standing wave 驻波State-of-the-art 最新技术Static characteristic 静态特性Statistical analysis 统计分析Steady state 稳态Step motor 步进式电动机Stimulated emission 受激发射Stimulated recombination 受激复合Stopband 阻带Storage time 存储时间Stress 应力Stripline 带状线Subband 次能带Sublimation 升华Submillimeter 亚毫米波Substrate 衬底Substitutional 替位式的Superconductor 超导(电)体Superlattice 超晶格Supply 电源Surface mound表面安装Surge capacity 浪涌能力Switching time 开关时间Switch 开关Synchronizer 同步器,同步装置Synthetic-aperture 合成孔径System 系统Technical 技术的,工艺的Telecommunication 远距通信,电信Telescope 望远镜Terahertz 太赫兹Terminal 终端Template 模板Temperature 温度Tensor 张量Test 测试试验Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thick- film technique 厚膜技术Thin- film hybrid IC 薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Three dimension 三维Threshold 阈值Through Silicon Via 硅通孔Thyistor 晶闸管Time resolution 时间分辨率Tolerance 公差T/R module 发射/接收模块Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transmissivity 透射率Transmitter 发射机Transceiver 收发机Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Travelling wave 行波Trigger 触发Trim 调配调整Triple diffusion 三重扩散Tolerance 容差Tube 管子电子管Tuner 调节器Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn - off time 关断时间Ultraviolet 紫外的Ultrabright 超亮的Ultrasonic 超声的Underfilling 下填充Undoped 无掺杂Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity- gain frequency 单位增益频率Unilateral-switch 单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Variable 可变的Vector 矢量Vertical 垂直的Vibration 振动Visible light 可见光Voltage 电压Volt 伏特Wafer 晶片Watt 瓦Wave guide 波导Wavelength 波长Wave-particle duality 波粒二相性Wear-out 烧毁Wetting 浸润Wideband 宽禁带Wire 引线Wire routing 布线Work function 功函数Worst-case device 最坏情况器件X-ray X射线Yield 成品率Zinc 锌。
高熵合金
Microstructures and properties of high-entropyalloysYong Zhang a ,⇑,Ting Ting Zuo a ,Zhi Tang b ,Michael C.Gao c ,d ,Karin A.Dahmen e ,Peter K.Liaw b ,Zhao Ping Lu aa State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,Chinab Department of Materials Science and Engineering,The University of Tennessee,Knoxville,TN 37996,USAc National Energy Technology Laboratory,1450Queen Ave SW,Albany,OR 97321,USAd URS Corporation,PO Box 1959,Albany,OR 97321-2198,USAe Department of Physics,University of Illinois at Urbana-Champaign,1110West Green Street,Urbana,IL 61801-3080,USA a r t i c l e i n f o Article history:Received 26September 2013Accepted 8October 2013Available online 1November 2013a b s t r a c tThis paper reviews the recent research and development of high-entropy alloys (HEAs).HEAs are loosely defined as solid solutionalloys that contain more than five principal elements in equal ornear equal atomic percent (at.%).The concept of high entropyintroduces a new path of developing advanced materials withunique properties,which cannot be achieved by the conventionalmicro-alloying approach based on only one dominant element.Up to date,many HEAs with promising properties have beenreported, e.g.,high wear-resistant HEAs,Co 1.5CrFeNi 1.5Ti andAl 0.2Co 1.5CrFeNi 1.5Ti alloys;high-strength body-centered-cubic(BCC)AlCoCrFeNi HEAs at room temperature,and NbMoTaV HEAat elevated temperatures.Furthermore,the general corrosion resis-tance of the Cu 0.5NiAlCoCrFeSi HEA is much better than that of theconventional 304-stainless steel.This paper first reviews HEA for-mation in relation to thermodynamics,kinetics,and processing.Physical,magnetic,chemical,and mechanical properties are thendiscussed.Great details are provided on the plastic deformation,fracture,and magnetization from the perspectives of cracklingnoise and Barkhausen noise measurements,and the analysis of ser-rations on stress–strain curves at specific strain rates or testingtemperatures,as well as the serrations of the magnetizationhysteresis loops.The comparison between conventional andhigh-entropy bulk metallic glasses is analyzed from the viewpointsof eutectic composition,dense atomic packing,and entropy of 0079-6425/$-see front matter Ó2013Elsevier Ltd.All rights reserved./10.1016/j.pmatsci.2013.10.001⇑Corresponding author.Tel.:+8601062333073;fax:+8601062333447.E-mail address:drzhangy@ (Y.Zhang).2Y.Zhang et al./Progress in Materials Science61(2014)1–93mixing.Glass forming ability and plastic properties of high-entropy bulk metallic glasses are also discussed.Modeling tech-niques applicable to HEAs are introduced and discussed,such asab initio molecular dynamics simulations and CALPHAD modeling.Finally,future developments and potential new research directionsfor HEAs are proposed.Ó2013Elsevier Ltd.All rights reserved. Contents1.Introduction (3)1.1.Four core effects (4)1.1.1.High-entropy effect (4)1.1.2.Sluggish diffusion effect (5)1.1.3.Severe lattice-distortion effect (6)1.1.4.Cocktail effect (7)1.2.Key research topics (9)1.2.1.Mechanical properties compared with other alloys (10)1.2.2.Underlying mechanisms for mechanical properties (11)1.2.3.Alloy design and preparation for HEAs (11)1.2.4.Theoretical simulations for HEAs (12)2.Thermodynamics (12)2.1.Entropy (13)2.2.Thermodynamic considerations of phase formation (15)2.3.Microstructures of HEAs (18)3.Kinetics and alloy preparation (23)3.1.Preparation from the liquid state (24)3.2.Preparation from the solid state (29)3.3.Preparation from the gas state (30)3.4.Electrochemical preparation (34)4.Properties (34)4.1.Mechanical behavior (34)4.1.1.Mechanical behavior at room temperature (35)4.1.2.Mechanical behavior at elevated temperatures (38)4.1.3.Mechanical behavior at cryogenic temperatures (45)4.1.4.Fatigue behavior (46)4.1.5.Wear behavior (48)4.1.6.Summary (49)4.2.Physical behavior (50)4.3.Biomedical,chemical and other behaviors (53)5.Serrations and deformation mechanisms (55)5.1.Serrations for HEAs (56)5.2.Barkhausen noise for HEAs (58)5.3.Modeling the Serrations of HEAs (61)5.4.Deformation mechanisms for HEAs (66)6.Glass formation in high-entropy alloys (67)6.1.High-entropy effects on glass formation (67)6.1.1.The best glass former is located at the eutectic compositions (67)6.1.2.The best glass former is the composition with dense atomic packing (67)6.1.3.The best glass former has high entropy of mixing (67)6.2.GFA for HEAs (68)6.3.Properties of high-entropy BMGs (70)7.Modeling and simulations (72)7.1.DFT calculations (73)7.2.AIMD simulations (75)7.3.CALPHAD modeling (80)8.Future development and research (81)Y.Zhang et al./Progress in Materials Science61(2014)1–9338.1.Fundamental understanding of HEAs (82)8.2.Processing and characterization of HEAs (83)8.3.Applications of HEAs (83)9.Summary (84)Disclaimer (85)Acknowledgements (85)References (85)1.IntroductionRecently,high-entropy alloys(HEAs)have attracted increasing attentions because of their unique compositions,microstructures,and adjustable properties[1–31].They are loosely defined as solid solution alloys that contain more thanfive principal elements in equal or near equal atomic percent (at.%)[32].Normally,the atomic fraction of each component is greater than5at.%.The multi-compo-nent equi-molar alloys should be located at the center of a multi-component phase diagram,and their configuration entropy of mixing reaches its maximum(R Ln N;R is the gas constant and N the number of component in the system)for a solution phase.These alloys are defined as HEAs by Yeh et al.[2], and named by Cantor et al.[1,33]as multi-component alloys.Both refer to the same concept.There are also some other names,such as multi-principal-elements alloys,equi-molar alloys,equi-atomic ratio alloys,substitutional alloys,and multi-component alloys.Cantor et al.[1,33]pointed out that a conventional alloy development strategy leads to an enor-mous amount of knowledge about alloys based on one or two components,but little or no knowledge about alloys containing several main components in near-equal proportions.Theoretical and experi-mental works on the occurrence,structure,and properties of crystalline phases have been restricted to alloys based on one or two main components.Thus,the information and understanding are highly developed on alloys close to the corners and edges of a multi-component phase diagram,with much less knowledge about alloys located at the center of the phase diagram,as shown schematically for ternary and quaternary alloy systems in Fig.1.1.This imbalance is significant for ternary alloys but becomes rapidly much more pronounced as the number of components increases.For most quater-nary and other higher-order systems,information about alloys at the center of the phase diagram is virtually nonexistent except those HEA systems that have been reported very recently.In the1990s,researchers began to explore for metallic alloys with super-high glass-forming ability (GFA).Greer[29]proposed a confusion principle,which states that the more elements involved,the lower the chance that the alloy can select viable crystal structures,and thus the greater the chanceand quaternary alloy systems,showing regions of the phase diagram thatand relatively less well known(white)near the center[33].solid-solutions even though the cooling rate is very high,e.g.,alloys of CuCoNiCrAlFeTiV,FeCrMnNiCo,CoCrFeNiCu,AlCoCrFeNi,NbMoTaWV,etc.[1,2,12–14].The yield strength of the body-centered cubic (BCC)HEAs can be rather high [12],usually compa-rable to BMGs [12].Moreover,the high strength can be kept up to 800K or higher for some HEAs based on 3d transition metals [14].In contrast,BMGs can only keep their high strength below their glass-transition temperature.1.1.Four core effectsBeing different from the conventional alloys,compositions in HEAs are complex due to the equi-molar concentration of each component.Yeh [37]summarized mainly four core effects for HEAs,that is:(1)Thermodynamics:high-entropy effects;(2)Kinetics:sluggish diffusion;(3)Structures:severe lattice distortion;and (4)Properties:cocktail effects.We will discuss these four core effects separately.1.1.1.High-entropy effectThe high-entropy effects,which tend to stabilize the high-entropyphases,e.g.,solid-solution phases,were firstly proposed by Yeh [9].The effects were very counterintuitive because it was ex-pected that intermetallic compound phases may form for those equi-or near equi-atomic alloy com-positions which are located at the center of the phase diagrams (for example,a monoclinic compound AlCeCo forms in the center of Al–Ce–Co system [38]).According to the Gibbs phase rule,the number of phases (P )in a given alloy at constant pressure in equilibrium condition is:P ¼C þ1ÀF ð1-1Þwhere C is the number of components and F is the maximum number of thermodynamic degrees of freedom in the system.In the case of a 6-component system at given pressure,one might expect a maximum of 7equilibrium phases at an invariant reaction.However,to our surprise,HEAs form so-lid-solution phases rather than intermetallic phases [1,2,4,17].This is not to say that all multi-compo-nents in equal molar ratio will form solid solution phases at the center of the phase diagram.In fact,only carefully chosen compositions that satisfy the HEA-formation criteria will form solid solutions instead of intermetallic compounds.The solid-solution phase,according to the classical physical-metallurgy theory,is also called a ter-minal solid solution.The solid-solution phase is based on one element,which is called the solvent,and contains other minor elements,which are called the solutes.In HEAs,it is very difficult to differentiate the solvent from the solute because of their equi-molar portions.Many researchers reported that the multi-principal-element alloys can only form simple phases of body-centered-cubic (BCC)or face-cen-tered-cubic (FCC)solid solutions,and the number of phases formed is much fewer than the maximum number of phases that the Gibbs phase rule allows [9,23].This feature also indicates that the high en-tropy of the alloys tends to expand the solution limits between the elements,which may further con-firm the high-entropy effects.The high-entropy effect is mainly used to explain the multi-principal-element solid solution.According to the maximum entropy production principle (MEPP)[39],high entropy tends to stabilize the high-entropy phases,i.e.,solid-solution phases,rather than intermetallic phases.Intermetallics are usually ordered phases with lower configurational entropy.For stoichiometric intermetallic com-pounds,their configurational entropy is zero.Whether a HEA of single solid solution phase is in its equilibrium has been questioned in the sci-entific community.There have been accumulated evidences to show that the high entropy of mixing truly extends the solubility limits of solid solution.For example,Lucas et al.[40]recently reported ab-sence of long-range chemical ordering in equi-molar FeCoCrNi alloy that forms a disordered FCC struc-ture.On the other hand,it was reported that some equi-atomic compositions such as AlCoCrCuFeNi contain several phases of different compositions when cooling slowly from the melt [15],and thus it is controversial whether they can be still classified as HEA.The empirical rules in guiding HEA for-mation are addressed in Section 2,which includes atomic size difference and heat of mixing.4Y.Zhang et al./Progress in Materials Science 61(2014)1–93Y.Zhang et al./Progress in Materials Science61(2014)1–935 1.1.2.Sluggish diffusion effectThe sluggish diffusion effect here is compared with that of the conventional alloys rather than the bulk-glass-forming alloys.Recently,Yeh[9]studied the vacancy formation and the composition par-tition in HEAs,and compared the diffusion coefficients for the elements in pure metals,stainless steels, and HEAs,and found that the order of diffusion rates in the three types of alloy systems is shown be-low:Microstructures of an as-cast CuCoNiCrAlFe alloy.(A)SEM micrograph of an etched alloy withBCC and ordered BCC phases)and interdendrite(an FCC phase)structures.(B)TEMplate,70-nm wide,a disordered BCC phase(A2),lattice constant,2.89A;(B-b)aphase(B2),lattice constant,2.89A;(B-c)nanoprecipitation in a spinodal plate,7nm(B-d)nanoprecipitation in an interspinodal plate,3nm in diameter,a disorderedarea diffraction(SAD)patterns of B,Ba,and Bb with zone axes of BCC[01[011],respectively[2].illustration of intrinsic lattice distortion effects on Bragg diffraction:(a)perfect latticewith solid solutions of different-sized atoms,which are expected to randomly distribute statistical average probability of occupancy;(c)temperature and distortion effectsY.Zhang et al./Progress in Materials Science61(2014)1–937 the intensities further drop beyond the thermal effect with increasing the number of constituent prin-cipal elements.An intrinsic lattice distortion effect caused by the addition of multi-principal elements with different atomic sizes is expected for the anomalous decrease in the XRD intensities.The math-ematical treatment of this distortion effect for the modification of the XRD structure factor is formu-lated to be similar to that of the thermal effect,as shown in Fig.1.3[41].The larger roughness of the atomic planes makes the intensity of the XRD for HEAs much lower than that for the single-element solid.The severe lattice distortion is also used to explain the high strength of HEAs,especially the BCC-structured HEAs[4,12,23].The severe lattice-distortion effect is also related to the tensile brittle-ness and the slower kinetics of HEAs[2,9,11].However,the authors also noticed that single-phase FCC-structured HEAs have very low strength[7],which certainly cannot be explained by the severe lattice distortion argument.Fundamental studies in quantification of lattice distortion of HEAs are needed.1.1.4.Cocktail effectThe cocktail-party effect was usually used as a term in the acousticsfield,which have been used to describe the ability to focus one’s listening attention on a single talker among a mixture of conversa-tions and background noises,ignoring other conversations.For metallic alloys,the effect indicates that the unexpected properties can be obtained after mixing many elements,which could not be obtained from any one independent element.The cocktail effect for metallic alloys wasfirst mentioned by Ranganathan[42],which has been subsequently confirmed in the mechanical and physical properties [12,13,15,18,35,43].The cocktail effect implies that the alloy properties can be greatly adjusted by the composition change and alloying,as shown in Fig.1.4,which indicates that the hardness of HEAs can be dramat-ically changed by adjusting the Al content in the CoCrCuNiAl x HEAs.With the increase of the Al con-lattice constants of a CuCoNiCrAl x Fe alloy system with different x values:(A)hardnessconstants of an FCC phase,(C)lattice constants of a BCC phase[2].CoNiCrAl x Fe alloy system with different x values,the Cu-free alloy has lower hardness.CoCrCuFeNiAl x[15,45].Cu forms isomorphous solid solution with Ni but it is insoluble in Co,Cr and Fe;it dissolves about20at.%Al but also forms various stable intermetallic compounds with Al.Fig.1.6exhibits the hardness of some reported HEAs in the descending order with stainless steels as benchmark.The MoTiVFeNiZrCoCr alloy has a very high value of hardness of over800HV while CoCrFeNiCu is very soft with a value of less than200HV.Fig.1.7compares the specific strength,which yield strength over the density of the materials,and the density amongalloys,polymers and foam materials[5].We can see that HEAs have densitieshigh values of specific strength(yield strength/density).This is partiallyHEAs usually contain mainly the late transitional elements whoselightweight HEAs have much more potential because lightweightdensity of the resultant alloys will be lowered significantly.Fig.1.8strength of HEAs vs.Young’s modulus compared with conventional alloys.highest specific strength and their Young’s modulus can be variedrange of hardness for HEAs,compared with17–4PH stainless steel,Hastelloy,andYield strength,r y,vs.density,q.HEAs(dark dashed circle)compared with other materials,particularly structural Grey dashed contours(arrow indication)label the specific strength,r y/q,from low(right bottom)to high(left top).among the materials with highest strength and specific strength[5].Specific-yield strength vs.Young’s modulus:HEAs compared with other materials,particularly structural alloys.among the materials with highest specific strength and with a wide range of Young’s modulus[5].range.This observation may indicate that the modulus of HEAs can be more easily adjusted than con-ventional alloys.In addition to the high specific strength,other properties such as high hydrogen stor-age property are also reported[46].1.2.Key research topicsTo understand the fundamentals of HEAs is a challenge to the scientists in materials science and relatedfields because of lack of thermodynamic and kinetic data for multi-component systems in the center of phase diagrams.The phase diagrams are usually available only for the binary and ternary alloys.For HEAs,no complete phase diagrams are currently available to directly assist designing the10Y.Zhang et al./Progress in Materials Science61(2014)1–93alloy with desirable micro-and nanostructures.Recently,Yang and Zhang[28]proposed the X param-eter to design the solid-solution phase HEAs,which should be used combing with the parameter of atomic-size difference.This strategy may provide a starting point prior to actual experiments.The plastic deformation and fracture mechanisms of HEAs are also new because the high-entropy solid solutions contain high contents of multi-principal elements.In single principal-element alloys,dislo-cations dominate the plastic behavior.However,how dislocations interact with highly-disordered crystal lattices and/or chemical disordering/ordering will be an important factor responsible for plastic properties of HEAs.Interactions between the other crystal defects,such as twinning and stacking faults,with chemical/crystal disordering/ordering in HEAs will be important as well.1.2.1.Mechanical properties compared with other alloysFor conventional alloys that contain a single principal element,the main mechanical behavior is dictated by the dominant element.The other minor alloying elements are used to enhance some spe-cial properties.For example,in the low-carbon ferritic steels[47–59],the main mechanical properties are from the BCC Fe.Carbon,which is an interstitial solute element,is used for solid-solution strength-ened steels,and also to enhance the martensite-quenching ability which is the phase-transformation strengthening.The main properties of steels are still from Fe.For aluminum alloys[60]and titanium alloys[61],their properties are mainly related to the dominance of the elemental aluminum and tita-nium,respectively.Intermetallic compounds are usually based on two elements,e.g.,Ti–Al,Fe3Al,and Fe3Si.Interme-tallic compounds are typically ordered phases and some may have strict compositional range.The Burgers vectors of the ordered phases are too large for the dislocations to move,which is the main reason why intermetallic phases are usually brittle.However,there are many successful case studies to improve the ductility of intermetallic compound by micro-alloying,e.g.,micro-alloying of B in Ni3Al [62],and micro-alloying of Cr in Fe3Al[63,64].Amorphous metals usually contain at least three elements although binary metallic glasses are also reported,and higher GFA can be obtained with addition of more elements,e.g.,ZrTiCuNiBe(Vit-1), PdNiCuP,LaAlNiCu,and CuZrAlY alloys[65–69].Amorphous metals usually exhibit ultrahigh yield strength,because they do not contain conventional any weakening factors,such as dislocations and grain boundaries,and their yield strengths are usually three tofive times of their corresponding crys-talline counterpart alloys.There are several models that are proposed to explain the plastic deforma-tion of the amorphous metal,including the free volume[70],a shear-transformation-zone(STZ)[71], more recently a tension-transition zone(TTZ)[72],and the atomic-level stress[73,74].The micro-mechanisms of the plastic deformation of amorphous metals are usually by forming shear bands, which is still an active research area till today.However,the high strength of amorphous alloys can be sustained only below the glass-transition temperature(T g).At temperatures immediately above T g,the amorphous metals will transit to be viscous liquids[68]and will crystallize at temperatures above thefirst crystallization onset temperature.This trend may limit the high-temperature applica-tions of amorphous metals.The glass forming alloys often are chemically located close to the eutectic composition,which further facilitates the formation of the amorphous metal–matrix composite.The development of the amorphous metal–matrix composite can enhance the room-temperature plastic-ity of amorphous metals,and extend application temperatures[75–78].For HEAs,their properties can be different from any of the constituent elements.The structure types are the dominant factor for controlling the strength or hardness of HEAs[5,12,13].The BCC-structured HEAs usually have very high yield strengths and limited plasticity,while the FCC-structured HEAs have low yield strength and high plasticity.The mixture of BCC+FCC is expected to possess balanced mechanical properties,e.g.,both high strength and good ductility.Recent studies show that the microstructures of certain‘‘HEAs’’can be very complicated since they often undergo the spinodal decomposition,and ordered,and disordered phase precipitates at lower temperatures. Solution-strengthening mechanisms for HEAs would be much different from conventional alloys. HEAs usually have high melting points,and the high yield strength can usually be sustained to ultrahigh temperatures,which is shown in Fig.1.9for refractory metal HEAs.The strength of HEAs are sometimes better than those of conventional superalloys[14].Temperature dependence of NbMoTaW,VNbMoTaW,Inconel718,and Haynes2301.2.2.Underlying mechanisms for mechanical propertiesMechanical properties include the Young’s modulus,yield strength,plastic elongation,fracture toughness,and fatigue properties.For the conventional one-element principal alloys,the Young’s modulus is mainly controlled by the dominant element,e.g.,the Young’s modulus of Fe-based alloys is about200GPa,that of Ti-based alloys is approximately110GPa,and that of Al-based alloys is about 75GPa,as shown in Fig.1.8.In contrast,for HEAs,the modulus can be very different from any of the constituent elements in the alloys[79],and the moduli of HEAs are scattered in a wide range,as shown in Fig.1.8.Wang et al.[79] reported that the Young’s modulus of the CoCrFeNiCuAl0.5HEA is about24.5GPa,which is much lower than the modulus of any of the constituent elements in the alloy.It is even lower than the Young’s modulus of pure Al,about69GPa[80].On the other hand,this value needs to be verified using other methods including impulse excitation of vibration.It has been reported that the FCC-structured HEAs exhibit low strength and high plasticity[13], while the BCC-structured HEAs show high strength and low plasticity at room temperature[12].Thus, the structure types are the dominant factor for controlling the strength or hardness of HEAs.For the fracture toughness of the HEAs,there is no report up to date.1.2.3.Alloy design and preparation for HEAsIt has been verified that not all the alloys withfive-principal elements and with equi-atomic ratio compositions can form HEA solid solutions.Only carefully chosen compositions can form FCC and BCC solid solutions.Till today there is no report on hexagonal close-packed(HCP)-structured HEAs.One reason is probably due to the fact that a HCP structure is often the stable structure at low tempera-tures for pure elements(applicable)in the periodic table,and that it may transform to either BCC or FCC at high temperatures.Most of the HEA solid solutions are identified by trial-and-error exper-iments because there is no phase diagram on quaternary and higher systems.Hence,the trial-and er-ror approach is the main way to develop high-performance HEAs.However,some parameters have been proposed to predict the phase formation of HEAs[17,22,28]in analogy to the Hume-Rothery rule for conventional solid solution.The fundamental thermodynamic equation states:G¼HÀTSð1-2Þwhere H is the enthalpy,S is the entropy,G is the Gibbs free energy,and T is the absolute temperature. From Eq.(1-2),the TS term will become significant at high temperatures.Hence,preparing HEAs from the liquid and gas would provide different kinds of information.These techniques may include sput-tering,laser cladding,plasma coating,and arc melting,which will be discussed in detail in the next chapter.For the atomic-level structures of HEAs,the neutron and synchrotron diffraction methods are useful to detect ordering parameters,long-range order,and short-range ordering[81].1.2.4.Theoretical simulations for HEAsFor HEAs,entropy effects are the core to their formation and properties.Some immediate questions are:(1)How can we accurately predict the total entropy of HEA phase?(2)How can we predict the phasefield of a HEA phase as a function of compositions and temperatures?(3)What are the proper modeling and experimental methods to study HEAs?To address the phase-stability issue,thermody-namic modeling is necessary as thefirst step to understand the fundamental of HEAs.The typical mod-eling techniques to address thermodynamics include the calculation of phase diagram(CALPHAD) modeling,first-principle calculations,molecular-dynamics(MD)simulations,and Monte Carlo simulations.Kao et al.[82]using MD to study the structure of HEAs,and their modeling efforts can well explain the liquid-like structure of HEAs,as shown in Fig.1.10.Grosso et al.[83]studied refractory HEAs using atomistic modeling,clarified the role of each element and their interactions,and concluded that4-and 5-elements alloys are possible to quantify the transition to a high-entropy regime characterized by the formation of a continuous solid solution.2.Thermodynamicsof a liquid-like atomic-packing structure using multiple elementsthird,fourth,andfifth shells,respectively,but the second and third shellsdifference and thus the largefluctuation in occupation of different atoms.2.1.EntropyEntropy is a thermodynamic property that can be used to determine the energy available for the useful work in a thermodynamic process,such as in energy-conversion devices,engines,or machines. The following equation is the definition of entropy:dS¼D QTð2-1Þwhere S is the entropy,Q is the heatflow,and T is the absolute temperature.Thermodynamic entropy has the dimension of energy divided by temperature,and a unit of Joules per Kelvin(J/K)in the Inter-national System of Units.The statistical-mechanics definition of entropy was developed by Ludwig Boltzmann in the1870s [85]and by analyzing the statistical behavior of the microscopic components of the system[86].Boltz-mann’s hypothesis states that the entropy of a system is linearly related to the logarithm of the fre-quency of occurrence of a macro-state or,more precisely,the number,W,of possible micro-states corresponding to the macroscopic state of a system:Fig.2.1.Illustration of the D S mix for ternary alloy system with the composition change[17].。
创见破壁垒的英语作文
Innovation is the key to breaking through barriers and achieving success in various fields of life.It is the driving force that propels society forward,fostering progress and development.Here are some ways in which innovation can be seen as a barrier breaker:1.Overcoming Technological Barriers:Technological advancements are often hindered by existing limitations.Innovation in technology,such as the development of new software or hardware,can break through these barriers,leading to more efficient and effective solutions.2.Solving Complex Problems:Innovation allows us to approach complex problems with fresh perspectives.By thinking outside the box,we can devise new strategies and solutions that were previously unimaginable.3.Economic Growth:Innovation in business models and practices can break down economic barriers,leading to new markets and opportunities.This can result in job creation,increased productivity,and overall economic prosperity.4.Social Progress:Social innovations can challenge and change established norms and practices,leading to a more equitable and just society.This includes innovations in education,healthcare,and social welfare systems.5.Environmental Sustainability:Innovations in environmental technology can break the barriers to sustainable living.This includes the development of renewable energy sources, sustainable agriculture,and waste management systems.6.Cultural Exchange:Cultural innovations can break down barriers between different societies and cultures,promoting understanding and tolerance.This can be achieved through new forms of artistic expression,storytelling,and media.7.Healthcare Advancements:Medical innovations can break the barriers to better health and wellbeing.This includes the development of new treatments,diagnostic tools,and preventive measures.cational Reforms:Innovations in education can break down barriers to learning, making education more accessible and effective.This includes the use of technology in classrooms,new teaching methodologies,and personalized learning approaches.9.Political Reform:Political innovations can break through the barriers of outdated systems and practices,leading to more transparent,accountable,and democratic governance.10.Space Exploration:Innovations in space technology are breaking the barriers of our own planet,opening up new frontiers for exploration and potential colonization.In conclusion,innovation is a powerful tool for breaking down barriers in all aspects of life.It requires a mindset that is open to change,a willingness to take risks,and a commitment to continuous learning and improvement.By embracing innovation,we can overcome challenges and create a better future for all.。
清华内卷nature
清华内卷nature2022年3月9日,清华大学任天令及田禾共同通讯在Nature 在线发表题为“Vertical MoS2 transistors with sub-1-nm gate lengths”的研究论文,该研究使用石墨烯层的边缘作为栅电极展示了具有原子级薄沟道和亚 1 nm 物理栅极长度的侧壁 MoS2 晶体管。
自从 1960 年代第一块集成电路建成以来,硅 (Si) 晶体管按照摩尔定律的指导不断缩小,因此可以在一个芯片上构建更多设备。
当栅极长度(Lg) 缩小到 5 nm 以下时,Si 晶体管现在正在接近缩放极限。
理论分析表明,短沟道效应 (SCE),包括直接源漏隧道电流和漏极诱导势垒降低(DIBL) 效应,可以影响按比例缩小的过程。
基于 V 型槽湿法刻蚀技术的最先进硅晶体管的 Lg 为 3 nm。
探索具有进一步 Lg 缩小潜力的新材料非常重要。
近年来,涵盖从半金属、半导体到绝缘体的广泛导电性的二维材料,在下一代电子器件中引起了极大的关注。
石墨烯作为一种半金属材料,具有很高的本征电导率,可用作电极。
MoS2作为二维(2D)过渡金属二硫化物(TMDC)的代表,其带隙(单层为2.0 eV)比Si(1.12 eV)更大。
此外,其天然的n掺杂行为、更大的电子有效质量和更低的介电常数导致对SCE的出色抵抗。
因此,MoS2有望成为替代Si作为未来晶体管沟道材料的理想候选者。
该研究使用石墨烯层的边缘作为栅电极展示了具有原子级薄沟道和亚1 nm 物理栅极长度的侧壁 MoS2 晶体管。
该方法使用通过化学气相沉积生长的大面积石墨烯和 MoS2 薄膜在 2 英寸晶圆上制造侧壁晶体管。
这些器件具有高达1.02 × 105 的开/关比和低至 117 mV dec–1 的亚阈值摆幅值。
仿真结果表明,MoS2 侧壁有效沟道长度在 On 状态下接近 0.34 nm,在 Off 状态下接近 4.54 nm。
钙钛矿 离子迁移 提高载流子传输
钙钛矿离子迁移提高载流子传输英文回答:Perovskite solar cells (PSCs) have attractedsignificant attention due to their high power conversion efficiencies (PCEs), low-cost fabrication, and tunable bandgaps. However, the long-term stability of PSCs remains a major challenge, and one of the main degradation mechanisms is ion migration.Ion migration in PSCs refers to the movement of ions within the perovskite layer, which can lead to the formation of defects, phase segregation, and device degradation. The most common ions that migrate in PSCs are iodide (I-) and methylammonium (MA+), which are present in the perovskite structure.Ion migration can be accelerated by several factors, including high temperatures, electric fields, and moisture. High temperatures can increase the mobility of ions, whileelectric fields can drive ions towards the electrodes. Moisture can also promote ion migration by dissolving the perovskite layer and creating pathways for ions to move.Ion migration can have several negative consequencesfor PSCs. First, it can lead to the formation of defects in the perovskite layer, such as vacancies and interstitials. These defects can act as recombination centers for charge carriers, reducing the device efficiency. Second, ion migration can cause phase segregation, where the perovskite layer separates into different phases with different compositions. This can also lead to reduced device efficiency and stability. Third, ion migration can lead to device failure by short-circuiting the electrodes.Several strategies have been developed to suppress ion migration in PSCs. One approach is to use dopants that can stabilize the perovskite structure and reduce the mobility of ions. Another approach is to use additives that can passivate the surface of the perovskite layer and prevent the ingress of moisture. Additionally, the use of encapsulation layers can help to protect the PSC frommoisture and other environmental factors that can promoteion migration.Suppressing ion migration is critical for improving the long-term stability of PSCs. By developing effective strategies to control ion migration, it is possible to enhance the reliability and durability of these promising photovoltaic devices.中文回答:钙钛矿太阳能电池 (PSC) 因其高功率转换效率 (PCE)、低成本制造和可调谐带隙而备受关注。
铅卤钙钛矿的容忍因子评价及拓展的离子半径应用
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ufs工程及解决方案
ufs工程及解决方案In this article, we will explore the key features of UFS, its advantages over eMMC, and potential challenges and solutions in the implementation of UFS in mobile device engineering.Key Features of UFSUFS offers several key features that make it a superior storage solution for mobile devices. Some of the key features of UFS include:1. High Performance: UFS offers significantly higher data transfer rates compared to eMMC, with a maximum theoretical transfer rate of 11.6 Gbps per lane. This allows for faster read and write speeds, which can improve the overall performance of mobile devices, especially when it comes to tasks such as app loading times, file transfers, and multitasking.2. Power Efficiency: UFS is designed to be more power efficient than eMMC, which can help improve battery life in mobile devices. This is achieved through features such as low-power modes, dynamic voltage scaling, and improved queuing algorithms, which reduce power consumption during data storage and retrieval operations.3. Reliability: UFS offers enhanced reliability compared to eMMC, with features such as improved error correction and detection algorithms, and support for advanced NAND flash management techniques. This can help improve the longevity and durability of storage components in mobile devices, leading to fewer data errors and a longer lifespan for the device.4. Scalability: UFS is designed to be scalable, with support for multiple data lanes and higher speed modes. This allows for future-proofing of mobile devices, as they can support higher data transfer rates and storage capacities as technology advances.Advantages of UFS Over eMMCThe adoption of UFS in mobile devices offers several advantages over eMMC, which makes it an attractive option for device manufacturers. Some of the key advantages of UFS over eMMC include:1. Faster Performance: UFS offers significantly faster data transfer rates compared to eMMC, leading to improved overall performance of mobile devices. This can result in faster app loading times, quicker file transfers, and smoother multitasking capabilities.2. Better Power Efficiency: UFS is more power efficient than eMMC, which can lead to improved battery life in mobile devices. This is especially important for smartphones and tablets, where battery life is a key consideration for consumers.3. Improved Reliability: UFS offers enhanced reliability compared to eMMC, with better error correction and detection algorithms, and support for advanced NAND flashmanagement techniques. This can lead to fewer data errors and a longer lifespan for the storage components in mobile devices.4. Higher Scalability: UFS is designed to be scalable, with support for multiple data lanes and higher speed modes. This allows for future-proofing of mobile devices, as they can support higher data transfer rates and storage capacities as technology advances.Challenges in UFS EngineeringWhile UFS offers significant advantages over eMMC, there are several challenges that device manufacturers may face in the engineering and implementation of UFS in mobile devices. Some of the key challenges include:1. Cost: UFS storage solutions can be more expensive than eMMC solutions, which can impact the overall cost of manufacturing mobile devices. This may be a barrier for some device manufacturers, especially those targeting budget or mid-range markets.2. Compatibility: UFS is a relatively new standard, and not all mobile device components and systems may be fully compatible with it. This can lead to potential compatibility issues during the engineering and manufacturing process.3. Integration: Integrating UFS storage solutions into mobile devices may require changes to the device's hardware and software architecture, which can add complexity to the engineering process. This can also lead to potential compatibility and performance issues if not implemented correctly.4. Performance Optimization: While UFS offers higher performance compared to eMMC, optimizing the performance of UFS storage solutions in mobile devices requires careful engineering and tuning of hardware and software components.Solutions in UFS EngineeringIn order to address the challenges in the engineering and implementation of UFS in mobile devices, device manufacturers can consider several potential solutions. Some of the key solutions include:1. Cost Optimization: Device manufacturers can work with UFS storage solution providers to optimize the cost of UFS storage solutions, by negotiating favorable pricing arrangements and optimizing the manufacturing process.2. Compatibility Testing: Device manufacturers can perform thorough compatibility testing of UFS storage solutions with other mobile device components and systems, to ensure that potential compatibility issues are identified and addressed early in the engineering process.3. Integration Planning: Device manufacturers can carefully plan the integration of UFS storage solutions into mobile devices, by working closely with UFS solution providers andcarefully engineering the hardware and software architecture to ensure smooth integration and performance.4. Performance Tuning: Device manufacturers can optimize the performance of UFS storage solutions in mobile devices, by carefully tuning hardware and software components to ensure that the full potential of UFS is realized.ConclusionUFS is a high-performance data storage interface standard for mobile devices, offering several key advantages over eMMC in terms of performance, power efficiency, and reliability. However, the engineering and implementation of UFS in mobile devices also present several potential challenges, including cost, compatibility, integration, and performance optimization.By carefully considering these challenges and implementing the potential solutions discussed in this article, device manufacturers can successfully engineer and implement UFS in mobile devices, to offer consumers a superior storage solution that enhances the overall performance and user experience of mobile devices. As technology continues to advance, UFS is expected to become the standard for high-performance data storage in mobile devices, and device manufacturers should carefully consider its potential benefits and challenges in their engineering processes.。
国外研究表明手性磁体材料可提高类脑计算适应性
国外研究表明手性磁体材料可提高类脑计算适应性
佚名
【期刊名称】《石河子科技》
【年(卷),期】2024()1
【摘要】英国伦敦大学学院、伦敦帝国理工学院领导的国际合作研究表明,利用手性(扭曲)磁体的内在物理特性,可提高机器学习任务适应性,大幅减少类脑计算的能源使用。
研究结果发表在《自然·材料》杂志上。
传统计算由于独立的数据存储和处理单元需要消耗大量电力。
机器学习利用物理储层计算方法,消除对独特内存和处理单元的需求,促进更有效的数据处理方式,成为传统计算更可持续的替代方案。
但该方法的缺陷在于缺乏可重新配置性,执行不同计算任务时效果存在差异,这是由材料物理特性导致的。
【总页数】1页(P53-53)
【正文语种】中文
【中图分类】G63
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Efficient and Scalable Barrier over Quadrics and Myrinetwith a New NIC-Based Collective Message Passing ProtocolWeikuan Yu Darius Buntinas Rich L.Graham Dhabaleswar K.Panda Network-Based Computing Lab Argonne National Laboratory Los Alamos National Laboratory Dept.of Computer and Info.Science Mathematics and Computer Science Advanced Computing Laboratory The Ohio State University Argonne,IL60439Los Alamos,NM87545 yuw,panda@ buntinas@ rlgraham@AbstractModern interconnects often have programmable proces-sors in the network interface that can be utilized to offload communication processing from host CPU.In this paper,we explore different schemes to support collective operationsat the network interface and propose a new collective pro-tocol.With barrier as an initial case study,we have demon-trated that much of the communication processing can begreatly simplified with this collective protocol.Accordingly, we have designed and implemented efficient and scalableNIC-based barrier operations over two high performance interconnects,Quadrics and Myrinet.Our evaluation shows that,over a Quadrics cluster of8nodes with ELan3Network,the NIC-based barrier opera-tion achieves a barrier latency of only5.60s.This result is a2.48factor of improvement over the Elanlib tree-basedbarrier operation.Over a Myrinet cluster of8nodes with LANai-XP NIC cards,a barrier latency of14.20s over8 nodes is achieved.This is a2.64factor of improvement over the host-based barrier algorithm.Furthermore,an analyti-cal model developed for the proposed scheme indicates that a NIC-based barrier operation on a1024-node cluster can be performed with only22.13s latency over Quadrics and with38.94s latency over Myrinet.These results indicate the potential for developing high performance communica-tion subsystems for next generation clusters.1.IntroductionBarrier is a commonly used collective operation in par-allel and distributed programs.Message passing standards, such as MPI[13],often have the barrier operation in-cluded as a part of their specifications.In the function MPIThis research is supported in part by a DOE grant#DE-FC02-01ER25506,NSF Grants#EIA-9986052and#CCR-0204429,a grant from Los Alamos National Laboratory,and also in part by U.S.Department of Energy,under Contract munication and waiting for its completion,no other computation can be performed.So it is important to min-imize the amount of time spent on waiting for the barrier. The efficiency of barrier also affects the granularity of a parallel application.To supportfine-grained parallel ap-plications,an efficient barrier primitive must be provided. Some modern interconnects,such as QsNet[15]and Infini-Band[5],provide hardware broadcast primitives that can be utilized to support an efficient barrier operation.How-ever,hardware broadcast primitives often have their lim-itations.For example,Quadrics hardware broadcast re-quires that all the processes are located on a contiguous set of nodes and also well synchronized during its computa-tion to achieve high performance barrier operations;Infini-Band hardware broadcast is not reliable.Other intercon-nects,such as Myrinet,do not have hardware broadcast and provide unicast communication along point-to-point links. Thus,a general barrier operation is often implemented on top of point-to-point communication.Earlier research has been done to use programmable pro-cessors to support efficient collective operations[18,14,3]. Among them,Buntinas et.al.[3]has explored NIC-based barrier over Myrinet/GM.In that study,the NIC takes an ac-tive role in detecting arrived barrier messages and triggering the next barrier messages.This greatly reduces round-trip PCI bus traffic and host CPU involvement in a barrier op-eration,thereby improving the barrier latency.However, much of the communication processing for barrier mes-sages is still implemented on top of the NIC’s point-to-point communication processing.The benefits of NIC-based bar-rier have been exposed,but only to a certain extent.And the scheme has not been generalized to expose the benefits of NIC programmability over other networks,for example, Quadrics.So it remains an open challenge to gain more in-sights into the related communication processing and pro-pose an efficient,and generally applicable scheme in order to provide maximum benefits to NIC-based barrier opera-tions.In this paper,we take on this challenge.We start with discussing the characteristics of NIC-based barrier op-erations.We then examine the communication process-ing tasks for point-to-point operations,including queuing, bookkeeping,packetizing and assembly,flow control anderror control,etc.Many of these tasks are redundant forcollective operations.We then propose a novel NIC-based collective protocol which performs queuing,bookkeeping,packetizing and error control tasks in a collective mannerand eliminates the redundancy wherever possible.With barrier as an initial case study,we have demonstrated thatmuch of the communication processing can be greatly sim-plified.Accordingly,the proposed scheme is implemented over Myrinet.Furthermore,a similar NIC-based barrier isimplemented over Quadrics.Our evaluation has shown that,over a Quadrics clusterof8nodes with ELan3Network,the NIC-based barrier op-eration achieves a barrier latency of5.60s.This result is a2.48factor of improvement over the Elanlib tree-basedbarrier operation.Over a Myrinet cluster of8nodes withLANai-XP NIC cards,a barrier latency of14.20s over8 nodes is achieved.This is a2.64factor of improvement over the host-based barrier algorithm.Our evaluation has also shown that,over a16-node Myrinet cluster with LANai 9.1cards,the NIC-based barrier operation achieves a bar-rier latency of25.72us,a3.38factor of improvement com-pared to the host-based algorithm.Furthermore,our analyt-ical model suggests that NIC-based barrier operations could achieve a latency of only22.13s and38.94s,respectively over a1024-node Quadrics and Myrinet cluster.The rest of the paper is structured as follows.In the nextsection,we explore different NIC-based barrier algorithmsand describe the motivation for the NIC-based barrier with a separate collective protocol.Following that,we describe in detail the design issues of the barrier algorithm in the proposed NIC-based collective protocol.Then in Section4 we give an overview of Quadrics/Elan and Myrinet/GM.An overview of the barrier algorithms considered for our im-plementation is provided in Section5.In Sections6and7, we describe our NIC-based barrier operations over Myrinet and Quadrics.The performance results are provided in Sec-tion8.Finally,we conclude the paper in Section9.2.MotivationIn this section,we describe general ideas of previous re-search[3,4]on NIC-based barrier operations over point-to-point communication.In addition,we explore different ideas to support collective communication and the motiva-tion for NIC-based barrier operations with a separate col-lective protocol.2.1.Previous Research on NIC-Based BarrierBuntinas et.al.[3,4]have studied the benefits of off-loading barrier operation to the Myrinet Control Program (MCP).With the previous NIC-based barrier scheme,the NIC takes an active role in performing the barrier opera-tion.Host CPU is not involved in the intermediate steps of a barrier operation.The number of round-trip messages across the PCI bus is reduced.However,further investiga-tion into this implementation reveals that it builds the NIC-based barrier operation simply on top of the point-to-point communication protocol running on the NIC.The left di-agram in Fig.1shows how the barrier implementationfits into a user-level protocol(in this case,MCP).With this ap-proach,much of the communication processing is redun-dant for the nature of barrier operations.It still remains to be examined how much redundant processing is done.Like-wise,it is not analyzed how much benefits there are if one can eliminate the redundancy with a separate collective pro-tocol.2.2.The Point-to-Point Communication Protocol atthe NICAn overview to the communication processing per-formed by the Myrinet Control Program is presented in Sec-tion4.2.In a NIC control program for a general user-level protocol,this processing can be classified into the follow-ing categories of tasks:request queuing,request bookkeep-ing,data packetization,data assembly,flow control and er-ror control.These tasks are usually well-tuned for point-to-point communication.But to achieve high performance NIC-based collective operations,much of these tasks can be done in a collective manner.This can lead to simplified and reduced processing.Thus a separate communication pro-tocol for the NIC-based collective operations is needed to maximize the benefits.2.3.Where to Provide Support for Collective Com-munication?The performance of the resulting collective operations are often limited by the underlying user-level protocols.If the user-level protocols only provide point-to-point commu-nication semantics,the programming models have to lay their collective support on top of that.The resulting per-formance may not be ideal.The NIC-based collective op-erations can help expose the best performance from the un-derlying network to these developers.However,as shown in the left diagram of Fig.1,the earlier NIC-based barrier implementation intercepts the requests for the barrier oper-ations and directly delivers the barrier messages.No efforts have been put to examine how the communication process-ing tasks are undertaken by the NICs for these regular mes-sages and how to reduce them for barrier operations.Thus this direct scheme of offloading the barrier operation does not achieve maximum benefits.3.A Proposed Scheme to Support NIC-basedBarrier OperationsIn this section,we propose a novel scheme with a NIC-based collective protocol to eliminate the redundancy de-scribed in the last section.Then with barrier operations as the focus in this paper,we describe how the benefits of NIC-based barrier operations can be maximized with this scheme.The associated design issues are also discussed.We propose a separate protocol at the NIC to perform the communication processing tasks related to collective opera-tions.As shown in Fig.1,a set of API’s for collective opera-Application Application b) A Scheme with Separate Collective Processinga) A Direct Scheme Fig.1.Different Schemes to Support NIC-based Collective(Barrier)Operationstions can be provided at the user-level.Then the support for these collective operations can be implemented at the NIC.If there is any collective operation that cannot be supported efficiently by the NIC,its implementation can still be laid over point-to-point protocols.Basically,our scheme aims to provide a protocol that collectively performs the message passing tasks necessary for collective operations.For each collective operation,the critical step is to identify the tasks that can be more efficiently put into the collective proto-col.In the case of a NIC-based barrier operation,we have identified the following tasks that need to be included in the NIC-based collective protocol.QueuingIn a parallel system,a NIC must handle multiple com-munication requests to a peer NIC and also requests to multiple different peer NICs.Each request must go through multiple queues and be scheduled before the message can be transmitted.Thus for a barrier,the ar-rived message may not immediately lead to the trans-mission of the next message until the corresponding request gets its turn in the relevant queues.This im-poses unnecessary delays into the barrier operations.If we can provide a separate queue for a particular pro-cess group,its barrier messages can skip other queues and get transmitted in a much faster manner.Packetization and AssemblyThe sender NIC must packetize the large messages and allocate a send buffer for each of the packet.For that the NIC has to wait for a send buffer to become avail-able and fill up the packet with data before the mes-saging takes place.Since all the information a barrier message needs to carry along is an integer,if one can utilize a dedicated send buffer for the barrier messages,all these unnecessary waiting for a send buffer can alsobe eliminated.At the receiver side,the received barrier message also does not need to go through the queues for data assembly,etc.BookkeepingFor each outstanding messaging request,the NIC must perform bookkeeping functions to keep track of its sta-tus of every packet transmitted on its behalf.This is rather inefficient for a barrier operation,since there is no data transmission involved.One can just provide a bit vector to record whether all the messages for a barrier operation are completed or not.Flow/Error ControlDepending on the reliability feature of the underly-ing network,the NIC control program may also need to provide flow control and/or error control functions to ensure reliability.The error control for point-to-point messages is usually implemented with a form of timeout/retransmission.Acknowledgments are re-turned from the receivers to the senders.The NIC-based barrier also provides opportunities to have an efficient and simplified error control.For example,we can eliminate all the acknowledgments and pro-vide reliability with a receiver-driven retransmission approach.When a barrier operation fails to complete due to the missing of some barrier messages,NACKs can be sent to the corresponding senders.Thus this reduces the number of actual barrier messages by half and can speed up the barrier operation.4.Overview of Quadrics and MyrinetIn this section,we describe some background infor-mation on two interconnects that provide programmable NIC processors,Quadrics and Myrinet.Quadrics provideshardware-level reliable message passing,while Myrinet does not.The message passing reliability is left to the communication protocol.Designing an efficient reliability scheme is then critical to the performance of the communi-cation protocol over such a network.4.1.Quadrics and ElanlibQuadrics network(QsNet)[15]provides low-latency, high-bandwidth communication with its two building blocks:a programmable Elan network interface card and the Elite switch,which are interconnected in a fat-tree topology.QsNet-II[1]has been released recently,but in the scope of this paper,a Quadrics interconnect with Elan3 network interface cards.We are planning to extend similar studies to QsNet-II once such an system becomes available to us.QsNet Programming Library–QsNet provides the Elan and Elan3libraries as the interface for its Elan3net-work[17].At the Elan3level,a process in a parallel job is allocated a virtual process id(VPID).Interprocess com-munication is supported by an efficient model:remote di-rect memory access(RDMA).Elan3lib also provides a very useful chained event mechanism,which allows one RDMA descriptor to be triggered upon the completion of another RDMA descriptor.A higher-level programming library, Elanlib,extends Elan3lib with point-to-point,tagged mes-sage passing primitives(called Tagged Message Ports or Tports)and support for collective operations.Barrier in Elanlib–Elanlib provides two barrier func-tions,elan hgsync().The latter takes ad-vantages of the hardware broadcast primitive and provides a very efficient and scalable barrier operation[16].However, it requires that the calling processes are well synchronized in their stages of computation[16].Otherwise,it falls back on the elanP0P1P2P3P0P1P2P3P4P5P6P7Fig.4.Disseminationare paired up and exchange messages.For a group of par-ticipating nodes,this algorithm takes steps,when is a power of two.If is not a power of two,two additional steps needs to be performed.Let M be the largest power of 2and less than N.At the very beginning,process i sends a message to processes j,where and.Then the low ranked M processes perform pairwise exchange for the barrier.At the very end,process j notifies process i to exit the barrier.This algorithm takes()steps for non-power of two number of nodes.Dissemination–This dissemination algorithm is also described in[12].As shown in Fig.4,in step,pro-cess sends a barrier message to process,where.Essentially,barrier messages are dissem-inated around processes so that each process is able to col-lect the barrier information from its left processes by step m.This algorithm takes steps,irrespective of whether N is a power of two or not.5.2.Choosing the Right AlgorithmFrom the earlier description,it is clear that the gather-broadcast algorithm requires more steps for a barrier op-eration.Buntinas et.al.[3,4]also have found that the pairwise-exchange algorithm generally performs better than the gather-broadcast algorithm.Thus for the proposed NIC-based barrier in this paper,we have chosen to implement and compare the pairwise-exchange and dissemination al-gorithms.6.Implementation of the Proposed NIC-BasedBarrier over MyrinetIn this section,we describe the NIC-based barrier over Myrinet/GM.We have explored many of the challenging is-sues in our earlier work with GM-1.2.3[3,4].As having discussed in Section3,we choose to create a separated pro-tocol to process the barrier messages.We believe that reim-plementing the previous work over GM-2.0.3would lead to the same amount of relative improvement since the NIC-based barrier is mainly dependent on the number of mes-sages and processing steps to be performed.Solutions from the earlier work for some of the challenges have been in-corporated into this new protocol.Other challenging issues related to the new barrier protocol are described in this sec-tion.6.1.Queuing the Barrier OperationsAs described in Section4.2,MCP processes the send tokens to different destinations in a round robin fashion. Send tokens to the same destination are processed in a FIFO manner.So the send tokens for barrier operations must go through multiple queues before their messages can be trans-mitted.This is enforced to the initial barrier message(e.g., in Step1of the pairwise-exchange algorithm)and also the barrier message that needs to be transmitted immediately when an earlier barrier message arrives.It is rather ineffi-cient to have the NIC-based barrier operations put up with so much waiting.We created a separate queue for each group of processes,and enqueued only one send token for every barrier operation.Then the barrier messages do not have to go through the queues for multiple destinations. With this approach,the send token for the current barrier operation is always located at the front of its queue.Both the initial barrier message and the ones that need to be trig-gered later no longer need to go through the queues for the corresponding destinations.6.2.Packetizing the Barrier MessagesWithin the Myrinet Control Program,to send any mes-sage,the sender NIC must wait for a send packet to become available andfill up the packet with data.So to complete a barrier operation,it is inevitable for the sender NIC to go through multiple rounds of allocating,filling up and re-leasing the send packets.Since all the information a bar-rier message needs to carry along is an integer,it is much more efficient if a static send packet can be utilized to trans-mit this integer and avoid going through multiple rounds of claiming/releasing the send packets.This static send packet can be very small since it only carries an integer.One can allocate an additional short send packet for each group of processes.However,there is a static send packet to each peer NIC in MCP,which is used for fast transmission of ACKs.We pad this static packet with an extra integer and utilize it in our implementation. With this approach,all the packetizing(including pack-ets claiming and releasing)needed for transmitting regular messages is avoided for the barrier messages.6.3.Bookkeeping and Error Control for BarrierMessagesThe Myrinet Control Program provides bookkeeping and error control for each packet that has been transmitted.This is to ensure the reliable delivery of packets.One acknowl-edgment must be returned by the receiver in order for the sender to release the bookkeeping entries,i.e.,a send record in MCP.When a sender NIC fails to receive the ACK within a timeout period specified in the send record,it retrans-mits the packet.Besides creating multiple send records and keeping track of them,this also generates twice as many packets as the number of barrier messages.It is desirable to design a better way to provide the bookkeeping and er-ror control for the barrier operations based on its collective nature.For the bookkeeping purpose,we create only a send record for a barrier operation.Within the send record,a bit vector is provided to keep track of the list of barrier mes-sages.When the barrier operation starts,a time-stamp is also created along with the send record.In addition,an ap-proach called receiver-driven retransmission is provided toensure reliable delivery of barrier messages.The receiver NICs of the barrier messages no longer need to return ac-knowledgments to the sender NICs.If any of the expected barrier messages is not received within the timeout period,a NACK will be generated from the receiver NIC to the corre-sponding sender NIC.The sender NIC will then retransmit the barrier message.Taken together,these enhancements ensure the reliable delivery with the minimal possible over-head and also reduce the number of total packets by half compared to the reliability scheme for the regular messages. Thus,it promises a more efficient solution for barrier oper-ation.7.Implementation of the Proposed NIC-BasedBarrier over QuadricsIn this section,we describe the NIC-based barrier over Quadrics.Quadrics provides salient mechanisms to pro-gram the NIC to support collective operations[14],e.g., threads running in the NIC or chained RDMA descriptors. Thus it is rather convenient to implement NIC-based barrier operation over Quadrics.Since a barrier operation typically involves no data transfer,all messages communicated between processes just serve as a form of notification,indicating that the corresponding processes have reached the barrier.Over Quadrics/Elan,RDMA operation with no data transfer can be utilized tofire a remote event,which serves as a kind of notification to the remote process.Although Elan threads can be created and executed by the thread processor to pro-cess the events and chain RDMA operations together,an ex-tra thread does increase the processing load to the Elan NIC. With either pairwise-exchange or dissemination algorithm, all that needed is to chain the multiple RDMA operations together to support a NIC-based barrier.We have chosen not to set up an additional thread to sup-port NIC-based barrier,and instead,set up a list of chained RDMA descriptors at the NIC from user-level.The RDMA operations are triggered only upon the arrival of a remote event except the veryfirst RDMA operation,which the host process triggers to initiate a barrier operation.The comple-tion of the very last RDMA operation will trigger a local event to the host process and signify the completion of the barrier.8.Performance EvaluationIn this section,we describe the performance evaluation of our implementation.The experiments were conducted on two clusters.One is a16-node cluster of quad-SMP 700MHz Pentium-III,each equipped with1GB DRAM and 66MHz/64bit PCI bus.This cluster is connected with both a Myrinet2000network and a QsNet/Elan3network(with only8nodes).The Myrinet NICs have133MHz LANai 9.1processors and2MB SRAM.The QsNet network con-sists of a dimension two,quaternary fat tree switch,Elite-16,and Elan3QM-400cards.The other system is a clus-ter of8-node SuperMicro SUPER P4DL6,each with dual Intel Xeon2.4GHz processors,512MB DRAM,PCI-X 133MHz/64-bit bus.This cluster is only connected with Myrinet2000network and NICs with225MHz LANai-XP processors and2MB SRAM.Our NIC-based implementa-tion over Myrinet is based on GM-2.0.3.The NIC-based implementation over Quadrics is based on5.2.7quadrics release and Elanlib-1.4.3-2.8.1.NIC-Based Barrier over Myrinet102030405060708090100246810121416Latency(µs)Number of NodesNIC-DSNIC-PEHost-DSHost-PEFig. 5.Performance Evaluation of NIC-basedand Host-Based Barrier Operations with MyrinetLANai-9.1Cards on a16-node700MHz cluster510152025303540452468Latency(µs)Number of NodesNIC-DSNIC-PEHost-DSHost-PEFig. 6.Performance Evaluation of NIC-basedand Host-Based Barrier Operations with MyrinetLANai-XP Cards on an8-node2.4GHz clusterWe tested the latency of our NIC-based barrier opera-tions and compared it to the host-based barrier operations. Our tests were performed by having the processes execute consecutive barrier operations.To avoid any possible im-pact from the network topology and the allocation of nodes, our tests were performed with random permutation of the nodes.We observed only negligible variations in the perfor-mance results.Thefirst100iterations were used to warm up the nodes.Then the average for the next10,000iterations was taken as the latency.We compared the performance for both the pairwise-exchange and dissemination algorithms.Fig.5shows the barrier latencies of NIC-based and host-based barriers for both algorithms over the16-node quad-700MHz cluster with LANai9.1cards.With ei-ther pairwise-exchange(PE)or dissemination(DS)algo-rithm,the NIC-based barrier operations reduce the barrier latency,compared to the host-based barrier operations.The pairwise-exchange algorithm tends to have a larger latency over non-power of two number of nodes for the extra step it takes.Over this16-node cluster,a barrier latency of 25.72s is achieved with both algorithms.This is a3.38fac-tor of improvement over host-based barrier -ing the direct NIC-based barrier scheme on the same clus-ter,our earlier implementation[3,4],achieved1.86factorof improvement using LANai7.2cards.The earlier work was done over GM-1.2.3and not maintained as new ver-sions of GM are released.We believe that the same amountof relative improvement(1.86)would have been achieved if the previous work was reimplemented over GM-2.0.3sincethe NIC-base barrier is mainly dependent on the number ofmessages and processing steps to be performed.Although, direct comparisons are not available,the difference in theimprovement factors over the common denominator(host-based barrier operations)suggests that our new scheme pro-vides a large amount of relative benefits.Fig.6shows the barrier latencies of NIC-based and host-based barriers for both algorithms over the eight-node2.4GHz Xeon cluster with LANai-XP cards.Similarly,the NIC-based barrier operation reduces the barrier latency compared to the host-based barrier operation.Over thiseight node cluster,a barrier latency of14.20s is achieved with both algorithms.This is a2.64factor of improvement over the host-based implementation.The reason that thefactor of improvement becomes smaller on this cluster isbecause this cluster has a much larger ratio of host CPU speed to NIC CPU speed and also a faster PCI-X bus.Thus the benefits from the reduced host involvement and I/O bus traffic are smaller.8.2.NIC-Based Barrier over QuadricsOver an eight-node Quadrics/Elan3cluster,we tested thelatency of our NIC-based barrier operations and comparedthem to the elanhgsync()is tested with hardwarebroadcast either enabled or disabled.Our tests were per-formed by having the processes perform consecutive bar-rier operations.Thefirst100iterations were used to warm up the nodes.Then the average for the next10,000itera-tions was taken as the latency.The performance for both the pairwise-exchange and dissemination algorithms are com-pared to the elanhgsync()achieves a barrier latency of4.20s.For a small number of nodes,the hardware barrier performs worse than the NIC-based bar-rier operation.This is because the hardware barrier is im-plemented with an atomic test-and-set operation down the NIC,which requires a higher number of network transac-tions.For a large number of nodes,the hardware barrier per-forms better but it requires that the involving processes be well synchronized.This is hardly the case for parallel pro-grams over large size pared to tree-based bar-rier operation elangsync().With non-power of two number of nodes,the pairwise-exchange algorithm performs bet-ter than the dissemination algorithm over Quadrics.This is because Quadrics Elan cards is very efficient in coping with the hot-spot RDMA operations[10],which reduces the effects of the steps for registering and releasing non-power two processes in a barrier operation.Over this eight node cluster,a barrier latency of5.60s is achieved with both algorithms.This is a2.48factor of improvement overelan。