XL2803A 500mA Darlington Array IC说明书

8C 7C 6C 5C 4C 3C 2C
7B
6B
5B
4B
3B
2B
1B
COM
8B
1C
XL2803A SOP18
1Features
•
500-mA-Rated Collector Current (Single Output)
•High-Voltage Outputs:50V •Output Clamp Diodes
•
Inputs Compatible With Various Types of Logic
2Applications
•Relay Drivers •Hammer Drivers •Lamp Drivers
•Display Drivers (LED and Gas Discharge)•Line Drivers •Logic Buffers •Stepper Motors •IP Camera
•
HVAC Valve and LED Dot Matrix
PART NUMBER PACKAGE BODY SIZE (NOM)XL2803A
SOIC (18)
11.55mm ×7.50mm
Logic Diagram
4
Device Information (1)
TTL or 5-V CMOS devices.
for each Darlington pair for operation directly with XL2803A device has a 2.7-k Ωseries base resistor discharge),line drivers,and logic buffers.The lamp drivers,display drivers (LED and gas Applications include relay drivers,hammer drivers,be connected in parallel for higher current capability.Darlington pair is 500mA.The Darlington pairs may inductive loads.The collector-current rating of each common-cathode clamp diodes for switching Darlington pairs that feature high-voltage outputs with transistor array.The device consists of eight NPN The XL2803A device is a 50V,500mA Darlington 3Description
1B 1C 2B 2C 3B 3C 4B 4C 5B 5C 6B 6C 7B 7C 8B 8C GND
COM
5Pin Configuration and Functions
DW Package 18-Pin SOIC Top View
Pin Functions
PIN
TYPE
DESCRIPTION
NAME NO.1B 1I
Channel 1through 8Darlington base input
2B 23B 34B 45B 56B 67B 78B 81C 18O
Channel 1through 8Darlington collector output
2C 173C 164C 155C 146C 137C 128C 11GND 9—Common emitter shared by all channels (typically tied to ground)COM
10
I/O
Common cathode node for flyback diodes (required for inductive loads)
(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)
All voltage values,unless otherwise noted,are with respect to the emitter/substrate terminal GND.
6Specifications
6.1Absolute Maximum Ratings
at 25°C free-air temperature (unless otherwise noted)(1)
MIN
MAX UNIT V CE Collector-emitter voltage 50V V I Input voltage (2)30V Peak collector current 500mA I(clamp)Output clamp current
500mA Total substrate-terminal current –2.5A T J Junction temperature –65150°C T stg Storage temperature
–65
150
°C
(1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)
JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2ESD Ratings
VALUE
UNIT V (ESD)Electrostatic discharge
Human body model (HBM),per ANSI/ESDA/JEDEC JS-001
(1)
±2000V
Charged device model (CDM),per JEDEC specification JESD22-C101
(2)
±500
6.3Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT V CE Collector-emitter voltage 050V T A
Ambient temperature
–40
85
°C
(1)
For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report.
6.4Thermal Information
THERMAL METRIC (1)
UNIT
DW (SOIC)18PINS R θJA Junction-to-ambient thermal resistance 66.4°C/W R θJC(top)Junction-to-case (top)thermal resistance 29.5°C/W R θJB Junction-to-board thermal resistance 33.0°C/W ψJT Junction-to-top characterization parameter 6.0°C/W ψJB Junction-to-board characterization parameter 32.5°C/W R θJC(bot)Junction-to-case (bottom)thermal resistance
N/A
°C/W XL2803A
6.5Electrical Characteristics
at T A=25°C free-air temperature(unless otherwise noted)
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
I CEX Collector cutoff current V CE=50V,
see Figure3
I I=050μA
I I(off)Off-state input current V CE=50V,
T A=70°C
I C=500μA,
see Figure4
5065μA
I I(on)Input current V I=3.85V,See Figure50.93 1.35mA
V I(on)On-state input voltage V CE=2V,
see Figure6
I C=200mA 2.4
V
I C=250mA 2.7
I C=300mA3
V CE(sat)Collector-emitter saturation voltage I I=250μA,
see Figure7
I C=100mA0.9 1.1
V I I=350μA,
see Figure7
I C=200mA1 1.3
I I=500μA,
see Figure7
I C=350mA 1.3 1.6
I R Clamp diode reverse current V R=50V,see Figure850μA V F Clamp diode forward voltage I F=350mA see Figure9 1.72V C i Input capacitance V I=0,f=1MHz1525pF
6.6Switching Characteristics
T A=25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t PLH Propagation delay time,low-to high-level output V
S =50V,C L=15pF,R L=163Ω,
See Figure10130
ns
t PHL Propagation delay time,high-to low-level output20
V OH High-level output voltage after switching V S=50V,I O=300mA,see Figure11V S–20mV 6.7Typical Characteristics
XL2803A
Open
V
Open
V
I
Open
V
I
Open V I C
I CEX
Open
7Parameter Measurement Information
Figure 3.I CEX Test Circuit
Figure 4.I I(off)Test Circuit
Figure 5.I I(on)Test Circuit
Figure 6.V I(on)Test Circuit
Figure 7.h FE ,V CE(sat)Test Circuit
Figure 8.I R Test Circuit
F
Input
Open
Ω
Output
V IH
(see Note C)
Test Circuit
Voltage Waveforms
V OH
A.The pulse generator has the following characteristics:PRR =12.5kHz,Z O =50Ω.
B.C L includes probe and jig capacitance.
C.
V IH =3V
Figure 10.Propagation Delay Times
Output
Test Circuit
(see Note C)
V OH
Voltage Waveforms
A.The pulse generator has the following characteristics:PRR=12.5kHz,Z O=50Ω.
B.C L includes probe and jig capacitance.
C.V IH=3V
tch-Up Test
COM
Output C
E
Input B
8.2Functional Block Diagram
the outputs.
Applications requiring sink currents beyond the capability of a single output may be accommodated by paralleling solutions to a great many interface needs,including solenoids,relays,lamps,small motors,and LEDs.operation directly with TTL or CMOS operating at supply voltages of 5V or 3.3V.The XL2803A offers diodes for inductive loads.The XL2803A has a series base resistor to each Darlington pair,thus allowing a common emitter and open collector outputs.To maximize their effectiveness,these units contain suppression The XL2803A is comprised of eight high voltage,high current NPN Darlington transistor pairs.All units feature integration of 8Darlington transistors that are capable of sinking up to 500mA and wide GPIO range capability.This standard device has proven ubiquity and versatility across a wide range of applications.This is due to its 8.1Overview
8Detailed Description
supplies are used,connect to the highest voltage supply.
When driving resistive loads,COM can be left unconnected or connected to the load voltage supply.If multiple 8.4.2Resistive Load Drive
kick-back voltage through the internal free wheeling diodes.When the COM pin is tied to the coil supply voltage,XL2803A is able to drive inductive loads and suppress the 8.4.1Inductive Load Drive
8.4Device Functional Modes
pins.
forward biased,internal parasitic NPN transistors will draw (a nearly equal)current from other (nearby)device In normal operation,the diodes on base and collector pins to emitter will be reverse biased.If these diode are coils causes a reverse current to flow into the coil supply through the kick-back diode.
inductive load that is excited when the NPN drivers are turned off (stop sinking)and the stored energy in the The diodes connected between the output and COM pin are used to suppress the kick-back voltage from an base of the predriver Darlington NPN.
The GPIO voltage is converted to base current through the 2.7-k Ωresistor connected between the input and very-low input current,essentially equating to operation with low GPIO voltages.
of a single transistor with a very-high current gain.The very high βallows for high output current drive with a Each channel of XL2803A consists of Darlington connected NPN transistors.This connection creates the effect 8.3Feature Description
9Application and Implementation
9.1Application Information
XL2803A will typically be used to drive a high voltage and/or current peripheral from an MCU or logic device that cannot tolerate these conditions.The following design is a common application of XL2803A,driving inductive loads.This includes motors,solenoids,and relays.Each load type can be modeled by what is seen in Figure12.
9.2Typical Application
Figure12.XL2803A as Inductive Load Driver
()J(MAX)
A (MAX)JA
T
T PD -=
q N
D OLi Li
i 1
P V I ==´åTypical Application (continued)
9.2.1Design Requirements
For this design example,use the parameters listed in Table 1as the input parameters.
Table 1.Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
GPIO voltage 3.3or 5V Coil supply voltage 12to 50V
Number of channels 8
Output current (R COIL )
20to 300mA per channel
Duty cycle
100%
where
•T J(MAX)is the target maximum junction temperature.•T A is the operating ambient temperature.
•
θJA is the package junction to ambient thermal resistance.
(3)
number of coils possible,use Equation 2to calculate XL2803A on-chip power dissipation P D .
The number of coils driven is dependent on the coil current and on-chip power dissipation.To determine the 9.2.2.3Power Dissipation and Temperature
Electrical Characteristics .
The output low voltage (V OL )is the same thing as V CE(SAT)and can be determined by Figure 1,Figure 2,or 9.2.2.2Output Low Voltage
I COIL =(V SUP –V CE(SAT))/R COIL
(1)
V CE(SAT)).
The coil current is determined by the coil voltage (VSUP),coil resistance,and output low voltage (V OL or 9.2.2.1Drive Current
•Power dissipation •Output and drive current •Temperature range
•Input voltage range When using XL2803A in a coil driving application,determine the following:9.2.2Detailed Design Procedure
to the maximum allowable power dissipation (P D )dictated by Equation 3.
To ensure the reliability of XL2803A and the system,the on-chip power dissipation must be lower that or equal •
V OLi is the OUT i pin voltage for the load current I Li .This is the same as V CE(SAT)
(2)
•N is the number of channels active together.
where
11.2Layout Example
Figure 15.Package Layout
and R COIL =2.8k Ω
The following curves were generated with XL2803A driving an OMRON G5NB relay –V in =5.0V;V sup =12V 9.2.3Application Curves
wide.Some applications require up to 2.5A.
Because all of the channels currents return to a common emitter,it is best to size that trace width to be very material's current density and desired drive current.
for the output,in order to drive high currents as desired.Wire thickness can be determined by the trace care to separate the input channels as much as possible,as to eliminate crosstalk.TI recommends thick traces Thin traces can be used on the input due to the low current logic that is typically used to drive XL2803A.Take 11.1Layout Guidelines
11Layout
chip metal or overheating the part.
heavily forward bias the flyback diodes and cause a large current to flow into COM,potentially damaging the on-When this is the case,make sure that the output voltage does not heavily exceed the COM pin voltage.This will This part does not need a power supply;however,the COM pin is typically tied to the system power supply.10Power Supply Recommendations
12。