MSA1022CT1资料

The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
The 625°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using a board material such as Thermal Clad, a power dissipation of 400 milliwatts can be achieved using the same footprint.
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic Collector Cutoff Current (VCB = –10 Vdc, IE = 0) Collector–Emitter Breakdown Voltage (VCE = – 20 Vdc, IB = 0) Emitter–Base Breakdown Voltage (VEB = – 5.0 Vdc, IC = 0) DC Current Gain(1) (VCE = –10 Vdc, IC = –1.0 mAdc) Current–Gain — Bandwidth Product (VCB = –10 Vdc, IE = 1.0 mAdc) 1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%. Symbol ICBO ICEO IEBO hFE fT Min — — — 110 150 Max – 0.1 –100 –10 220 — Unit µAdc µAdc µAdc — MHz
DEVICE MARKING
Marking Symbol
ECX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the part was manufactured. Thermal Clad is a trademark of the Bergquist Company
2.4 0.039 1.0 0.031 0.8
inches mm
SC–59 POWER DISSIPATION
The power dissipation of the SC–59 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA . Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) – TA RθJA the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 200 milliwatts. PD = 150°C – 25°C = 200 milliwatts 625°C/W
MSA1022-CT1
or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SC–59 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
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MSA1022-CT1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.037 0.95
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5°C or less. 260°C for more than 10 seconds.
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Motorola Small–Signal Transistors, FETs and Diodes Device Data
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SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass
Motorola Preferred Device
3 2 1
2 BASE
1 EMITTER
MAXIMUM RATINGS (TA = 25°C)
Rating Collector–Base Voltage Collector–Emitter Voltage Emitter–Base Voltage Collector Current — Continuous Symbol VCBO VCEO VEBO IC Value – 30 – 20 – 5.0 – 30 Unit Vdc Vdc Vdc mAdc
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MSA1022–CT1/D
PNP RF Amplifier Transistor Surface Mount
COLLECTOR 3
MSA1022-CT1
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MSA1022–BT1/D)
© Motorola, Inc. 1996
Motorola Small–Signal Transistors, FETs and Diodes Device Data
• The soldering temperature and time should not exceed • When shifting from preheating to soldering, the • After soldering has been completed, the device should
CASE 318D–03, STYLE 1 SC–59
THERMAL CHARACTERISTICS
Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 200 150 – 55 ~ +150 Unit mW °C °C