微电子科学与工程

微电子科学与工程专业本科培养方案
Un dergraduate Program for Specialty in
Microelectro nic Scie nee and Engin eeri ng
一、培养目标
I . Program Objectives
本专业培养掌握微电子科学与工程专业必需的根底知识、根本理论和根本实验技能，能够从事该领域的各种微电子材料、器件、封装、测试、集成电路设计与系统的科研、教学、科技开发、工程技术、生产管理等工作的高级专门人才。

This program trains advaneed talents with basic knowledge, theory and experimental skills n ecessary for Microelectro nic Science and Engin eeri ng. These tale nts can be en gaged in various works in microelectro nic materials, devices, packagi ng, test ing, in tegrated circuit desig n and sy stem as well as the scie ntific research, educati on, tech nique developme nt, engin eeri ng tech no logy, product ion man ageme nt.
二、根本规格要求
n . Learning Outcomes
毕业生应获得以下几个方面的知识和能力：
1、具有扎实的自然科学根底，良好的人文社会科学根底和外语能力；
2、掌握本专业领域较宽的根底理论知识，主要包括固体物理、半导体物理、微电子材料、微电子器件、集成电路设计等方面的根底理论知识；在本专业领域内具备从事科学研究的能力；
3、受到良好的工程实践训练，掌握各种微电子器件与集成电路的分析、设计与制造方法，具有独立进行微电子材料及器件性能分析、集成电路设计、微电子工艺流程的根本能力；具备一定的工程开发和组织管理能力；
4、了解本专业的最新开展动态和开展前景，了解微电子产业的开展状况。

The program requires that the learners have the knowledge and abilities listed as follows:
1. Have solid foundation in natural scienee, basic fine knowledge in humanities and social sciences and good foreig n Ian guage skills;
2. Master wide branch of fun dame ntal theoretical kno wledge of this specialty, which mai nly in clude the solid state physics, semic on ductor physics, microelectr onic materials, microelectr onic devices, in tegrated circuit desig n and so on. Master the ability to con duct scie ntific research in the
field of this specialty ；
3. Have good trainings in engineering practice, master the analysis, design and fabrication
methods of differe nt kinds of microelectro nic devices and in tegrated circuits, have the fun dame ntal ability to in depe nden tly deal with the performa nee an alysis of microelectr onic materials and devices, integrated circuit design and microelectronics processing. Master the ability of engineering developme nt and orga ni zati on man ageme nt ；
4. Have the knowledge of the latest developments and prospects in this specialty, have the kno wledge of the curre nt situati on of microelectro nic in dustry.
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三、培养特色
川.Program Highlights
本专业以微纳电子材料和工艺为根底，以微纳电子器件和集成电路制造为核心，以集成电路设计及其系统应用为方向；坚持理工结合，重视根底理论，强调实践技能，培养“根底-to-应用〞
与“器件-to-系统〞相结合的综合思考及横向思维的能力，培养具有良好科学素养、微纳电子材料-器件-电路-幅员-工艺-系统的综合设计与研究能力和组织管理能力的工程技术与科研人才。

Based on micro-/nano- electr onics materials and process ing, tak ing micro -/nano- electr onic devices and integrated circuits fabrication as the core, oriented in integrated circuit design and its system applicati on, this program in sists on the comb in ati on of scie nee and engin eeri ng, values the theoretical foundation and emphasizes the practical skills. By training the ability of comprehensive and lateral thi nki ng with the comb in ati on of basis-to-applicati on 〞and devices-to-system 〞, this program aims at cultivating scientific and engineering talents with good scientific quality, capability in in tegrated desig n of micro -/nano- electro nics material-devices-circuits-layout-processi ng-systems, as well as the ability of research and orga ni zati on man ageme nt.
四、主干学科
IV. Main Discipline
电子科学与技术
Electr onic Scie nee and Tech no logy
五、学制与学位
V. Program Length and Degree
学制：四年
Duratio n: 4 years
授予学位：工学学士
Degrees Con ferred: Bachelor of Engin eeri ng
六、学时与学分
W . Credits Hours and Units
完成学业最低课内学分(含课程体系与集中性实践教学环节)要求：162学分。

Minimum Credits of Curricular(Compris ing course system and inten sified intern ship practical training) : 162 credits.
其中，专业根底课程、专业核心课程学分不允许用其他课程学分进行学分冲抵和替代。

Major-related basic courses and core courses cannot be covered using credits from other courses in the program
完成学业最低课外学分要求：3学分。

Minimum Extracurricular Credits : 3 credits.
1.课程体系学时与学分
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Practicum Credits
Extracurricular Credits
校级三等奖等同
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deemed respectively the first prize, the second prize and the third prize of university level.
七、主要课程
Vfl . Main Courses
量子力学Quantum Mechanics、固体物理Solid State Physics、半导体物理Semiconductor Physics、微电子材料Microelectro nic Materials 、半导体器件物理Physics of Semico nductor Devies、纳电子器件Nanoelectronic Devices、微电子工艺学Microelectronic Process 、CMOS模拟集成电路CMOS An alog In tegrated Circuit 、数字集成电路根底Fun dame ntals of Digital IC 、微电子圭寸装与测试Microelectro nic Packag ing and Testi ng、微电子器件可靠性技术根底Fu ndame ntal of
Microelectr onic Devices Reliability Tech no logy.
八、主要实践教学环节(含专业实验)
忸. Practicum Module (experiments included)
新生专业认知实践Professi onal Cogn iti on Practice for Freshme n、电工实习Electrical Engineering Practice、软件课程设计Course Project for Software Design 、集成电路课程设计Course Project for ICs、微电子工艺课程设计Course Project for Fabrication Process of Microelectronic Devices、微电子器件建模课程设计Course Project for Modeling of Microelectronic Devices 、微电子专业实验Experiments of Microelectronics Specialty 、专业实习Professional Social Practice、毕业
设计Undergraduate Thesis.
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专业：微电子科学与工程
九、教学进程方案表
School 〔Department〕: School of Optical and Electronic Information Specialty: Microelectronic Science and Engineering
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