焊线及焊线工艺介绍

Bonding Process
The Wire Bond
Temp
PREHEAT
BONDSITE
CU L/F200+/-10
200+/-10
AL L/F210+/-10
230+/-10
BGA 150+/-10
160+/-10
TFBGA150+/-10
160+/-10
LBGA 150+/-10
160+/-10
heat
lead
Formation of a second bond Base
pad
heat
lead
pad
lead
pad
lead
pad
lead
Tail
length
pad
lead
pad
lead
pad
lead
Disconnection of the tail
pad
lead
Disconnection of the tail
• Tool less conversion window clamps and top plate enables fast device
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal
WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT
NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
pad lead
Free air ball is captured in the chamfer
SEARCH HEIGHT
pad lead
Free air ball is captured in the chamfer
•Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
lead
Formation of a first bond
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond
IMPACT FORCE
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Formation of a first bond Contact
(Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
2nd Search Height
Search Speed 2
Search Tol 2
pad
lead
Capillary rises to loop height position
RH
pad
lead
Formation of a loop
RD (Reverse Distance)
pad
lead
Formation of a loop
pad
lead
pad
lead
WIRE CLAMP ‘CLOSE’
SEARCH SPEED1
pad
SEARCH TOL 1
lead
Free air ball is captured in the chamfer
SEARCH SPEED1
pad
SEARCH TOL 1
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
lead
Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
pad
W/H ASSY
• changeover
•·Fully programmable indexer & tracks
•·Motorized window clamp with soft close feature
•·Output indexer with leadframe jam protection feature
封裝簡介
晶片Die
金線 Gold Wire 導線架
Lead fram
Wafer Grinding
封裝流程
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
PRESSURE
Ultra Sonic Vibration
pad
heat
lead
Formation of a first bond Base
PRESSURE
Ultra Sonic Vibration
pad
heat
lead
Capillary rises to loop height position
(3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond
Wire Tracing •Max. Die Level Different 400 – 500 um
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 mi源自文库ron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
Calculated Wire Length
pad
lead
Calculated Wire Length
pad
lead
SEARCH DELAY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
TRAJECTORY
pad
lead
pad
lead
Search Speed 2
Search Tol 2
pad
lead
Search Speed 2
Search Tol 2
pad
lead
Formation of a second bond
pad
heat
lead
Formation of a second bond Contact
pad
Gold wire
pad lead
B.PRINCIPLE
PRESSURE VIBRATION
AL2O3
CONTAMINATION GLASS
GOLD BALL
Al SiO2
Si
MOISTURE
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power)
Solder Ball Placement
Dejunk TRIM Solder Plating
Singulation
Solder Plating TRIM/ FORMING
Dejunk TRIM
Packing
Wire Bond 原理
Ball Bond ( 1st Bond )
Wedge Bond ( 2nd Bond )
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Formation of a new free air ball
pad
lead
Material
Leadfram Capillary Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer (SPT, GAISER, PECO, TOTO…)
= 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm
•Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum)
Programmable profile, control and vibration modes
Eagle
MACHINE SPECIFICATIONS (II)
•Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead
Capillary Data ( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)