贴片保险丝 CF慢熔断

Residual Resistance Thermal Shock
±20%
No evident damages on protective coating
and marking
10kΩ and more △R< 10 %
Rated current ,4hr 200% of its rated current After the fuse is interrupted ,rated voltage applied for
290
CF06V3TR63
I
0.63A
205
CF06V3TR80
K
0.80A
132
CF06V3T1R0
L
1.00A
84
CF06V3T1R25
M
1.25A
Open within 1min.at
63
DC 32V
DC32V 50A
<75℃at
CF06V3T1R50
P
1.50A
200%
50.5
100% rated
Marking
F K L M P S T 3 W Y Z
Rated Current
0.50A 0.80A 1.00A 1.25A 1.50A 2.00A 2.50A 3.00A 4.00A 5.00A 7.00A
Fusing Time
Resistance (mΩ)
Tolerance±25%
517
211
Document No TCF-XXOS032J
Issued date
2012/06/28
Page
7/20
12. Label
LOT NO:
Date Code Rating current
QTY: 5000 PCS T942F0032K 0942
R50
CF06V5T
Type
200%
Customer Label
CF04V3TR315 CF04V3TR50 CF04V3TR75** CF04V3TR80 CF04V3T1R0 CF04V3T1R25 CF04V3T1R50 CF04V3T1R60 CF04V3T2R0 CF04V3T2R50 CF04V3T3R0 CF04V3T3R15 CF04V3T4R0
0.2±0.1
0.25±0.1
0.80±0.10
0.3±0.2
0.35±0.2
1.55±0.10
0.5±0.3
0.50±0.2
t 0.35±0.05 0.45±0.10 0.60±0.10
5. Applications and ratings
Part Designation
Marking
Rated Current
5000 5000
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Thin Film Chip Fuse
Document No TCF-XXOS032J
Issued date
2012/06/28
Page
6/20
9.2 Reel Specifications
Series
CF04 CF06 CF12
Rated Voltage
V6:63V V5:50V V3:32V
T
Packaging
T: Paper Tape (5K/10K)
R50 2
Rated Current
R50:0.5A 1R0:1A
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Thin Film Chip Fuse
Document No TCF-XXOS032J
D 0.315A
F
0.50A
V
0.75A
K
0.80A
L
1.00A
M
1.25A
P
1.50A
N
1.60A
S
2.00A
T
2.50A
3
3.00A
U
3.15A
W
4.00A
Fusing Time
Resistance
(mΩ)
Rated
Tolerance±25% Voltage
690
340
140
100
Open within
Thin Film Chip Fuse
Document No TCF-XXOS032J
Issued date
2012/06/28
Page
5/20
8. Marking
Symbol for Rating Current
Symbol
D E F I K L MP N S T 3 UWY Z
Rating Current(A) 0.315 0.4 0.5 0.63 0.8 1 1.25 1.5 1.6 2 2.5 3 3.15 4 5 7
2. Construction
Over Coat
Conductor
Sn Plating
Ceramic Substrate
Fuse Element
Cu / Ni Plating
3. Type Designation
CF Chip Fuse
06
V5
Size
04:0402(1005) 06:0603(1608) 12:1206(3216)
W
8.0±0.2 8.0±0.2 8.0±0.2
F
E
3.5±0.05 1.75±0.1
3.5±0.05 1.75±0.1
3.5±0.05 1.75±0.1
P1
2.0±0.1 4.0±0.1 4.0±0.1
P2
2.0±0.05 2.0±0.05 2.0±0.05
P0
D0
4.0±0.1
+0.1 ψ1.5
ψA 178 ±2.0
ψB 60.0±1.0
ψC 13.0±1.0
W 9.0±1.0
Unit: mm
T 11.4±2.0
9.3 Peel –off force : Top cover tape
carrier tape
PULL 300 mm/min
10〜15∘ STANDARD : 0.1 ~ 0.7 N
temperature 105℃±5℃,1000 hrs
23℃±5℃of Isopropyl alcohol 90second
Measure DC resistance after fusing -20℃/+25℃/+125℃/+25℃, 10 cycles
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Issued date
2012/06/28
Page
4/20
6. Temperature Derating Curve 6.1 Normal Ambient Temperature: 25℃ 6.2 Operating Temperature: -20℃~105℃, whit proper Derating factor as below:
9. Taping & Reel 9.1 Taping Dimensions 4mm pitch paper
Packing
Paper Tape Paper Tape Paper Tape
Type CF04 CF06 CF12
A
B
0.7±0.05 1.2±0.05
1.1±0.1 1.9±0.1
2.0±0.15 3.6±0.2
CF06V3T1R60
N
1.60A
rated
45
current
CF06V3T2R0
S
2.00A current
34
CF06V3T2R50
T
2.50A
24.5
CF06V3T3R00 CF06V3T3R15 CF06V3T4R0
3
3.00A
U
3.15A
W
4.00A
来自百度文库
20
19
DC 32V
DC32V 50A
13
No fusing
Within 1 minute
No mechanical damages
No mechanical damages ±20%
95% coverage minimum
Temperature Rise
<75℃
Resistance to Dry Heat Resistance to Solvent
Marking
Rated Current
Fusing Time
Resistance
(mΩ)
Rated
Tolerance±25% Voltage
Breaking Capacity
Body Temperature
rising
CF06V5TR40 CF06V5TR50
E
0.4A
F
0.50A
496 DC 50V DC50V 50A
** CF04V3TR75 is still under UL application.
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Thin Film Chip Fuse
Document No TCF-XXOS032J
Issued date
2012/06/28
Page
3/20
Part Designation
DC32V 50A
*Resistance valve was measured with less than 10% of rated current
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Thin Film Chip Fuse
Document No TCF-XXOS032J
95
1min.at
57
200%
45
DC 32V
rated
44
current
33
25
19
18
12
Breaking Capacity
Body Temperature
rising
DC32V <75℃at 100% 35A rated current
*Resistance valve was measured with less than 10% of rated current
105
7. Reliability Tests
Parameter
Requirement
Test Method
Carrying capacity Fusing Time
Interrupting Ability
Bending Test Resistance to solder Heat
Solderability
30sec again Distance between holding points: 90mm,
Bending:3mm,1time ,30sec 260℃±5℃,10±1second 235℃±5℃, 2±0.5second
245℃±5℃, 2±0.5second (Lead Free) 100% of its rated current, Measure of surface
Issued date
2012/06/28
Page
2/20
4. Dimensions
Unit: mm
Type (Inch Size code)
CF04 (0402)
CF06 (0603)
CF12 (1206)
L 1.0±0.1 1.6±0.1 3.1±0.1
Dimensions (mm)
W
C
d
0.52±0.05
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Thin Film Chip Fuse
Document No TCF-XXOS032J
Issued date
2012/06/28
Page
1/20
1. Scope
This specification applies for the fuse series of thin film chip fuse made by TA-I.
CF06V3T5R0
Y
5.00A
11
*Resistance valve was measured with less than 10% of rated current
Part Designation
CF12V6TR50 CF12V6TR80 CF12V6T1R0 CF12V6T1R25 CF12V6T1R50 CF12V6T2R0 CF12V3T2R50 CF12V3T3R00 CF12V3T4R0 CF12V3T5R0 CF12V3T7R0
0
T
0.45±0.1
4.0±0.1
+0.1 ψ1.5
-0
0.64±0.1
4.0±0.1
+0.1 ψ1.5
-0
0.84±0.1
Unit: mm
Type Size
CF
04
Type series
CF
06
CF
12
Paper Tape 2 mm pitch 180mm/R
10000
Paper Tape 4 mm pitch 180mm/R
10. Storage Conditions: Temperature: 5℃~35℃,Humidity:40%~75%
11. Shelf Life: 2 years from manufacturing date
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Thin Film Chip Fuse
132
Open within
95
1min.at
76
200%
40.5
rated current
31.5 23.25
16
12
7.5
Rated Voltage DC 63V
DC 32V
Breaking Capacity
Body Temperature
rising
DC63V 50A
<75℃at 100% rated current