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AVC Confidential 6
測試結果
看結果與INTEL要求
AVC Confidential
7
CPU List 1 thermal management
AVC Confidential
8
CPU List 2 thermal management
AVC Confidential
9
CPU List 3 thermal management
串fin
如fin有脫落時要點膠
串fin 熱管串FIN，不用銲接，無環保問題，成本低。
Tower heat pipe for FSC
AVC Confidential
31
扣fin
連續模一次成型
扣fin 用連續模生產一條龍。
AVC Confidential
32
鋁擠&銅擠
擠型品與鋁鑄造、鋁鍛造不同的地方，是它將鋁（合金）加熱至可塑溫 度（400℃~500℃）之後，以擠壓機利用油壓力量將鋁擠錠擠壓通過擠 型模具而變成所需要之型材。形狀依模具不同而有所差異，包括型材、 線材、管材、棒材等等！ 凡是物品各橫斷面完全一致，均可利用擠型方 式製造！
4
INTEL測試平台
平台測試
AVC Confidential
5
INTEL THERMAL REQUIREMENT 2H’03 1H’04 2H’04 1H’05
LGA775
2004 Universal Performance FMB
TDP = 115W Prescott Tc = [P x 0.25] + 44.0 Iccmax = 119A VR_TDC = 101A
940 939 M2
AVC Confidential
16
M2 CPU LIST
AVC Confidential
17
AMD CPU THERMAL SPEC
AMD Athlon 64 FX Processor Model Number Options HyperTransport Frequency Model Num ber Thermal Design Power Thermal Resistance (caseamb)
AVC Confidential
6300 106.9 42.5 65.7 0.217
系統測試?
BTX12.7L
AVC Confidential
20
系統測試?
各溫度測試
AVC Confidential
21
系統測試?
Chamber 35℃ 40% 85% ZGH703Z DS09238B12HPFAF 4820 Z9M740X001 DS09238B12HPFAF 4824 Shin Etsu G-762 70.78 37.36 46.37 53.9 69.97 53.16 51.3 55.6 52.67 58.18 45.5 46.02 43.99 AVC Confidential 73.18 37.38 45.35 55.93 69.17 50.55 49.66 52.4 50.2 57.31 45.43 46.88 44.11 72.18 36.87 48.87 55.99 69.99 49.73 49.11 52.1 49.35 57.31 44.56 47.03 43.32 22 Z9M740X002 DS09238B12HPFAF 4828
AMD Athlon 64 X2 Dual Core Processor Model Number Options Package Cache Size FrequencyMax
939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA
電腦開機後沒有工作時稱為idle
AVC Confidential
28
FAN CONTROL (1)
PWM+THERMAL CONTROL Full Speed Fan Speed (RPM) 100% Fan Speed PWM % Duty Cycle X% T_low T_control Diode Temperature
AVC Confidential
10
BIG MAC TEST
THE COOLER CAN PASS WHICH ONE CPU?
AVC Confidential
11
AMD 測試平台
TTK
AVC Confidential
12
AMD 測試平台
TTK
源自文库
AVC Confidential
13
M2 主機板
2H’05
1H’06
mPGA478
PSC FMB1.5
Performance
TDP = 103W Iccmax = 91A VR_TDC = 81A
2005 Universal Performance FMB
TDP = 130W Dual Core Tc = [P x 0.21] + 43.4 Cedar Mill Tc = tbd Iccmax = 125A VR_TDC = 115A
Plastic RM A102000100
P202000005(Rm+BP)
SOCKET 939 SOCKET 754 Plastic RM A10900008
AVC Confidential
P109000005 (Rm+BP)
15
AMD CPU THERMAL SPEC
Thermal Requirement
AVC Confidential 29
Min Speed
FAN CONTROL (2)
THERMAL CONTROL Variable Speed Fan (VSF) Curve Full Speed (RPM)
MIN Operating (RPM)
22℃
AVC Confidential
32℃
30
Package
Cache Size
FrequencyMax
FX51 939 Pin Lidded OµPGA FX53 939 Pin Lidded OµPGA FX55 939 Pin Lidded OµPGA FX57 939 Pin Lidded OµPGA
1MB 1MB 1MB 1MB
2200 MHz 2400 MHz 2600 MHz 2800 MHz
Mainstream 3
Mainstream 2
PSC FMB1
TDP = 89W Iccmax = 78A VR_TDC = 68A
Mainstream 1 Value 3 Value 2 Value 1
2004 Mainstream / Value FMB
TDP = 84W Prescott Tc = [P x 0.28] + 44.2 Iccmax = 78A VR_TDC = 68A
Radeon X1300(VGA)
3/13 OE will send the new cooler for this VGA Card The card on hand
The new cooler for test
AVC Confidential
23
The New Part For Test
INTEL 測試平台
CPU
AVC Confidential
1
INTEL 測試平台
TTV
AVC Confidential
2
INTEL ATX 775 測試平台
TTV
AVC Confidential
3
SEVER DEMPSY FOR SOCKET 771 PRELOAD
AVC Confidential
Socket 1207
Power(Watt) 120 95 68 55 95 110 110 125
Tcase(degC) 69 72 72 70 68 65 65 63
Ta(degC) 38 42 42 42 42 42 42 38
Res(C/W) 0.258 0.316 0.441 0.509 0.274 0.209 0.209 0.200
1.MAINBOARD *2 2.HDD *1 3.VGA CARD *1 4.GHOST CD *1
1.AVC FAN 9225 *2 1700RPM 2.AVC FAN 9225 *2 2300RPM 3 AVC INTEL SMITHFIELD 3.0 Ghz 4.AVC Z9M741L001 3600RPM 5.AVC Z9M740P001 3600RPM
1 MB 1 MB 2 MB 1 MB 2 MB 2 MB
2000 MHz 2200 MHz 2200 MHz 2400 MHz 2400 MHz 2600 MHz
3800+ 4200+ 4400+ 4600+ 4800+ 5000+
89W 89W 110W 110W 110W 110W
0.32 0.32 0.20 0.20 0.20 0.20
2005 Mainstream / Value FMB
TDP = 95W Dual Core Tc = [P x 0.22] + 44 Cedar Mill Tc = tbd Iccmax= 100A VR_TDC = 85A
NWD FMB2 NWD FMB1
• Segmented design envelope will continue into 2006 • Design-in performance FMB for platform leadership and best flexibility in support of performance and mainstream processors
MSI
AVC Confidential
14
Socket 939 Retention Module & Back Plate Change To Socket M2
New four stand off Four new hole for new clip
SOCKET M2
Original two stand off
89W 89W 104W 104W
HyperTransport Frequency 1000MHz 1000MHz 1000MHz 1000MHz 1000MHz 1000MHz Model Num ber Thermal Design Power
0.31 0.31 0.22 0.22
Thermal Resistance (caseamb)
AVC Confidential
26
噪音測試平台
Test Platform Diagram
AVC Confidential
27
Idle 定義
BACKGUARD Environmental Condition Ambient Relative Humidity Background Mode 22℃ 72% 16.2 dB(A) Idle
結果
RH P4maxpower Model Fan Cooler Speed (RPM) TIM Tcase Chassis Inlet Heat Sink Exhaust North Bridge South Bridge RAM 1 RAM 2 RAM 3 RAM 4 HDD Case PSU Air Inlet PSU Air Outlet Chassis Rear Vent
AVC Confidential
24
MT2 Chassis
MT2
AVC Confidential
25
Noise Test
Test Configuration Reference Mic. Distance Mic. Height Mic. Angle ISO 7779 50cm 120cm 30∘
18
AVC Confidential
Test report
Horizontal
B3 C3-3pipe B3 LOW COST Horizontal 42°C 4480 104.2 42.5 65.2 0.217
19
Cooler Horizonta Horizontal Horizontal Horizontal Position l 25°C 25°C 42°C 42°C Cooler Speed W Ta Tc THETA ca 3080 108.6 25.6 59.5 0.312 5820 106.9 42.6 65.1 0.216 3200 109.07 25.5 58.1 0.299
測試結果
看結果與INTEL要求
AVC Confidential
7
CPU List 1 thermal management
AVC Confidential
8
CPU List 2 thermal management
AVC Confidential
9
CPU List 3 thermal management
串fin
如fin有脫落時要點膠
串fin 熱管串FIN，不用銲接，無環保問題，成本低。
Tower heat pipe for FSC
AVC Confidential
31
扣fin
連續模一次成型
扣fin 用連續模生產一條龍。
AVC Confidential
32
鋁擠&銅擠
擠型品與鋁鑄造、鋁鍛造不同的地方，是它將鋁（合金）加熱至可塑溫 度（400℃~500℃）之後，以擠壓機利用油壓力量將鋁擠錠擠壓通過擠 型模具而變成所需要之型材。形狀依模具不同而有所差異，包括型材、 線材、管材、棒材等等！ 凡是物品各橫斷面完全一致，均可利用擠型方 式製造！
4
INTEL測試平台
平台測試
AVC Confidential
5
INTEL THERMAL REQUIREMENT 2H’03 1H’04 2H’04 1H’05
LGA775
2004 Universal Performance FMB
TDP = 115W Prescott Tc = [P x 0.25] + 44.0 Iccmax = 119A VR_TDC = 101A
940 939 M2
AVC Confidential
16
M2 CPU LIST
AVC Confidential
17
AMD CPU THERMAL SPEC
AMD Athlon 64 FX Processor Model Number Options HyperTransport Frequency Model Num ber Thermal Design Power Thermal Resistance (caseamb)
AVC Confidential
6300 106.9 42.5 65.7 0.217
系統測試?
BTX12.7L
AVC Confidential
20
系統測試?
各溫度測試
AVC Confidential
21
系統測試?
Chamber 35℃ 40% 85% ZGH703Z DS09238B12HPFAF 4820 Z9M740X001 DS09238B12HPFAF 4824 Shin Etsu G-762 70.78 37.36 46.37 53.9 69.97 53.16 51.3 55.6 52.67 58.18 45.5 46.02 43.99 AVC Confidential 73.18 37.38 45.35 55.93 69.17 50.55 49.66 52.4 50.2 57.31 45.43 46.88 44.11 72.18 36.87 48.87 55.99 69.99 49.73 49.11 52.1 49.35 57.31 44.56 47.03 43.32 22 Z9M740X002 DS09238B12HPFAF 4828
AMD Athlon 64 X2 Dual Core Processor Model Number Options Package Cache Size FrequencyMax
939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA 939 Pin Lidded OµPGA
電腦開機後沒有工作時稱為idle
AVC Confidential
28
FAN CONTROL (1)
PWM+THERMAL CONTROL Full Speed Fan Speed (RPM) 100% Fan Speed PWM % Duty Cycle X% T_low T_control Diode Temperature
AVC Confidential
10
BIG MAC TEST
THE COOLER CAN PASS WHICH ONE CPU?
AVC Confidential
11
AMD 測試平台
TTK
AVC Confidential
12
AMD 測試平台
TTK
源自文库
AVC Confidential
13
M2 主機板
2H’05
1H’06
mPGA478
PSC FMB1.5
Performance
TDP = 103W Iccmax = 91A VR_TDC = 81A
2005 Universal Performance FMB
TDP = 130W Dual Core Tc = [P x 0.21] + 43.4 Cedar Mill Tc = tbd Iccmax = 125A VR_TDC = 115A
Plastic RM A102000100
P202000005(Rm+BP)
SOCKET 939 SOCKET 754 Plastic RM A10900008
AVC Confidential
P109000005 (Rm+BP)
15
AMD CPU THERMAL SPEC
Thermal Requirement
AVC Confidential 29
Min Speed
FAN CONTROL (2)
THERMAL CONTROL Variable Speed Fan (VSF) Curve Full Speed (RPM)
MIN Operating (RPM)
22℃
AVC Confidential
32℃
30
Package
Cache Size
FrequencyMax
FX51 939 Pin Lidded OµPGA FX53 939 Pin Lidded OµPGA FX55 939 Pin Lidded OµPGA FX57 939 Pin Lidded OµPGA
1MB 1MB 1MB 1MB
2200 MHz 2400 MHz 2600 MHz 2800 MHz
Mainstream 3
Mainstream 2
PSC FMB1
TDP = 89W Iccmax = 78A VR_TDC = 68A
Mainstream 1 Value 3 Value 2 Value 1
2004 Mainstream / Value FMB
TDP = 84W Prescott Tc = [P x 0.28] + 44.2 Iccmax = 78A VR_TDC = 68A
Radeon X1300(VGA)
3/13 OE will send the new cooler for this VGA Card The card on hand
The new cooler for test
AVC Confidential
23
The New Part For Test
INTEL 測試平台
CPU
AVC Confidential
1
INTEL 測試平台
TTV
AVC Confidential
2
INTEL ATX 775 測試平台
TTV
AVC Confidential
3
SEVER DEMPSY FOR SOCKET 771 PRELOAD
AVC Confidential
Socket 1207
Power(Watt) 120 95 68 55 95 110 110 125
Tcase(degC) 69 72 72 70 68 65 65 63
Ta(degC) 38 42 42 42 42 42 42 38
Res(C/W) 0.258 0.316 0.441 0.509 0.274 0.209 0.209 0.200
1.MAINBOARD *2 2.HDD *1 3.VGA CARD *1 4.GHOST CD *1
1.AVC FAN 9225 *2 1700RPM 2.AVC FAN 9225 *2 2300RPM 3 AVC INTEL SMITHFIELD 3.0 Ghz 4.AVC Z9M741L001 3600RPM 5.AVC Z9M740P001 3600RPM
1 MB 1 MB 2 MB 1 MB 2 MB 2 MB
2000 MHz 2200 MHz 2200 MHz 2400 MHz 2400 MHz 2600 MHz
3800+ 4200+ 4400+ 4600+ 4800+ 5000+
89W 89W 110W 110W 110W 110W
0.32 0.32 0.20 0.20 0.20 0.20
2005 Mainstream / Value FMB
TDP = 95W Dual Core Tc = [P x 0.22] + 44 Cedar Mill Tc = tbd Iccmax= 100A VR_TDC = 85A
NWD FMB2 NWD FMB1
• Segmented design envelope will continue into 2006 • Design-in performance FMB for platform leadership and best flexibility in support of performance and mainstream processors
MSI
AVC Confidential
14
Socket 939 Retention Module & Back Plate Change To Socket M2
New four stand off Four new hole for new clip
SOCKET M2
Original two stand off
89W 89W 104W 104W
HyperTransport Frequency 1000MHz 1000MHz 1000MHz 1000MHz 1000MHz 1000MHz Model Num ber Thermal Design Power
0.31 0.31 0.22 0.22
Thermal Resistance (caseamb)
AVC Confidential
26
噪音測試平台
Test Platform Diagram
AVC Confidential
27
Idle 定義
BACKGUARD Environmental Condition Ambient Relative Humidity Background Mode 22℃ 72% 16.2 dB(A) Idle
結果
RH P4maxpower Model Fan Cooler Speed (RPM) TIM Tcase Chassis Inlet Heat Sink Exhaust North Bridge South Bridge RAM 1 RAM 2 RAM 3 RAM 4 HDD Case PSU Air Inlet PSU Air Outlet Chassis Rear Vent
AVC Confidential
24
MT2 Chassis
MT2
AVC Confidential
25
Noise Test
Test Configuration Reference Mic. Distance Mic. Height Mic. Angle ISO 7779 50cm 120cm 30∘
18
AVC Confidential
Test report
Horizontal
B3 C3-3pipe B3 LOW COST Horizontal 42°C 4480 104.2 42.5 65.2 0.217
19
Cooler Horizonta Horizontal Horizontal Horizontal Position l 25°C 25°C 42°C 42°C Cooler Speed W Ta Tc THETA ca 3080 108.6 25.6 59.5 0.312 5820 106.9 42.6 65.1 0.216 3200 109.07 25.5 58.1 0.299