PCB常见工程咨询中英文对照总结
PCB专业用语-中英文对照
PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
PCB行业常用语言中英文对照表
导电铜箔的表面凹陷，它不会明显的影响到导铜箔的厚度。
Design spacing of Conductive
线路之间的描绘距离，或者在客户图纸上定义的线路之间的距离。
Desmear
除污
从孔壁上将被钻孔摩擦融化的树脂和钻孔的碎片移走。
Dewetting
缩锡
在融化的锡在导体表面时，由于表面的张力，导致锡面的不平整，有的地方厚，有的地方薄，但是不会导致铜面露出。
Base Material
基材
绝缘材料，线路在上面形成。（可以是刚性或柔性，或两者综合。它可以是不导电的或绝缘的金属板。）。
Base Material thickness
不包括铜箔层或镀层的基材的厚度。
Bland Via
导通孔仅延伸到线路板的一个表面。
Blister
离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
Hole breakout
破孔
是指部分孔体已落在焊环区之外，使孔壁未能受到焊环的完全包围。
Hole location
孔位
指孔的中心点位置
Hole pull Strength
指将整个孔壁从板子上拉下的力量，即孔壁与板子所存在地固著力量。
Hole Void
破洞
指已完成电镀的孔壁上存在地见到底材的破洞。
Hot Air Leveling
Access Hole
在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring
是指孔周围的导体部分。
Artwork
用于生产“Artwork Master”“production Master”,有精确比例的菲林。
PCB专业用语-英汉对照
PCB专业用语-英汉对照：一、综合词汇:1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board 10、单面印制板：single-sided printed board(ssb) 11、双面印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (slc) 43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-cladlaminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bonding sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer (cover lay) 28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base film surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料:1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin 4、环氧树脂：epoxy resin 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silicone resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (wpe) 27、环氧值：epoxy value 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film (pi) 38、聚四氟乙烯：polytetrafluoetylene (ptfe) 39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep) 40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、 e玻璃纤维：e-glass fibre 43、 d玻璃纤维：d-glass fibre 44、 s玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise, filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive foil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ed copper foil) 90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (rcc) 96、复合金属箔：composite metallic material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计:1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae) 10、计算机辅助测试：computer-aided test.(cat) 11、电子设计自动化：electric design automation .(eda) 12、工程设计自动化：engineering designautomaton .(eda2) 13、组装设计自动化：assembly aided architectural design. (aaad) 14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display .(ccd) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format .(mdf) 27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization (design) 31、供设计优化坐标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rulechecking 53、走（布）线器：router (cad) 54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit analysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing (pdp) 59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 62、方块框图：block diagram 63、迷宫：moze 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、分层：separated layer 78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
PCB行业最常用术语之中英文对照
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
PCB行业最常用术语之中英文对照（按字母检索）AW（artwork）底片
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
PCB相关专业术语英汉对照
solder bridge chip load definition deburr foil removal surface smear removal resin-starved area nick mis-picks solderless wrap thermal shock thermal conductivity hot air leveling line HASL heat shield thermal-machanical analysis coefficient of thermal expansion fusing fusing fluid hot strength retention thermal stress method thermal test human resource department emulsion side wetting agent electronic equipment melamine formaldehyde resin heat sink plane SEM strike burned palting cauterization design rule checking RFI elongation bleading production master biological product construction quality wet lamination wet strength retention insulation resistance anter exposure to moisture etching
桥接 切削量 清晰度 去毛刺 去铜箔面 去钻污 缺胶区 缺口 缺纬 绕接 热冲击 热导率 热风整平 热风整平 热隔离 热机分板 热膨胀系数 热熔 热熔液 热态强度保留率 热应力方法 热应力试验 人力资源部 乳胶面 润湿剂 三级封装(各种电子整机产品) 三聚氰胺甲醛树脂 散热层 扫描式电子显微镜 闪镀 烧焦镀层 烧灼 设计规则检查 射频干扰 伸长率 渗出 生产底版 生物制品 施工质量 湿法贴膜 湿强度保留率 湿热后绝缘电阻 蚀刻
PCB专业用语-中英文对照
PCB专业用语一、综合词汇1、 E印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、E印制元件：printed component7、E印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayerprited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、I刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、E印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material28、覆铜箔层压板：copper-clad laminate (ccl)29、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、力口成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板： phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板： epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料I、a 阶树脂：a-stage resin2、b 阶树脂：b-stage resin3、c 阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resinII、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e 玻璃纤维：e-glass fibre43、d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷： ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔(剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdfdatabse28、设计数据库：design database29、设计原点：design origin30、优化(设计)：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走(布)线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction （track）2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孑L环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孑L位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、E印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业术语中英文对照
1影響電性及外觀Affect upon electrical performance or appearance 2過度的Excessively3異常Abnormal4規格不符specification is below standard5品質異常quality is below standard6嚴格按照QC規定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8設備device(另義:主動零件) \ machine \ equipment9參數設置錯誤parameters setting error10依保養計劃According to the maintaining plan11壓力過小lack of pressure12曝光不全\過度exposure-energy insufficient\excessive13間距不足spacing nonenough14線細width reduce15光強度Light Intensity16缺口nick\chipping17氣泡Bubble\blister\air inclusion18異物foreign particle \ foreign material（壓合異物）\dust(灰塵) 19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定點開路fixed position open22固定點短路fixed position short23線路針孔trace pin-hole24孔破void in PTH hole\Barrel Crack25斷脖子Open near pad26靜置時間Holding time27識別方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,殘材 Debris30顯影不潔Developing uncleanness31外觀不良Appearace defective32傳動\傳送速度convey speed33偏離deviation\shifted34單軸single axis35底片漲縮A/W expand or contract 36漏失率Loss Rate37補償compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\銅箔基板copper clad laminates (CCL)40線路露銅copper exposure 41織紋顯露weave exposure42光學點\基準標記fiducial mark43環氧樹脂epoxy44蝕刻速率etch rate45網布fabric46助焊劑不均勻flux coating uneven 47過濾filtration48電測治具fixture49鉆尖分離gap50標準板golden board1影響上件及外觀affect upon mounting or appearance2銅厚測量儀Copper thickness Measuring Instrument3佐證evidence4微蝕量microetching quantity5 濕度humidityinternal proofread cycle\calibration system cycle 6內部校正周期(校驗矯正)7板面刮傷Surface Scratch8制定handling 標準Define standard of handling9目視檢查\目檢visual inspection10規定頻率defined frequency11壓力計\表pressure gauge12工程程式designed program13超規格out of the tolerance14毛頭\去毛頭burr\deburring15影響下工序製作difficult to product in the following process16化學銅electroless plating17除膠速率desmearing rate18電流current19分層delamination\bulge20濕潤Damped21預浸Pre-dipped22活化液activator23速化accelerator24漂錫solder float25熱應力測試thermal stress test26孔環(焊墊)Lifted land\annular ring27熱水洗Hot water rinsing28震動馬達vibrating motor29銅渣copper residue (copper splash)\cosmetics island獨立銅渣30清潔濾網purifying filters31定期換水replace water regularly32回收槽recovery tank33加強管控to strengthen the control of sth.34酸洗\鹼洗acid\alkali rinse35定期分析濃度Analyze Conc. regularly36金屬雜質污染Contamination of metal impurities37碳化物carbide38碳處理carbon treatment39整流器(電流矯正)Current rectifier40銅厚測量儀Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43電流控制器current controller44吸水滾輪破舊water-absorptive roller worn-out45新水補充不足Insufficient for water replenishment46濾芯Filter element47化學藥液chemicals liquid48孔塞(孔內異物)dirty hole49多與\少與1mil厚Less\More than 1 mil Thickness 度50色差color variation1板面粘油墨屑(顯影段)sticky ink debris2擋水滾輪water apart roller3網板高度Screen height4網板張力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃鈍化Squeegee edge blunt7油墨黏度過大viscosity of ink too thick8張力應力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12靜電噴涂Spray Coating13印可剝膠Peelable Solder Mask14風刀air knife15隔離環clearance16燒焦burning17化鎳金immersion nickel and gold18銅鎳層接著不良Poor combination the copper and nickel 19刷磨滾輪brush roller20刷幅測試brush breadth\width test21脫脂溫度Defatting Temp.22流量計flowmeter23執行\導電Conduct24助焊劑\熔合液rosin(天然松香)\flux\fusing fluids25錫粗Tin roughness26焊料中銅離子含量過高The cu2+ content out of upper in solder 27機臺異常machine-motion error28缺點標示卡nominal card of defects29程序\程式錯誤Programbug30人員疏忽operator's carelessness31日保養daily maintainance32人員技能不熟練Operator is not skilled33口頭考核examine orally34阻抗異常Impedance Abnormal35阻抗測量儀impedance measuring instrument36漏氣puncture37受潮moisture absorption38膜面污染film surface contaminated39漏檢Leaking inspection40二次元 2D(biaxial) dimension-measuring instrument 41工單run card\work order42飛針Flying Probe43目檢Visual Inspection44專用治具測試Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47銅箔厚度Copper foil Thickness48板彎翹Bow and Twist(warp)49尺寸(含對角)Size(Diagonal)\dimensions(成型)50拉力計\張力計tensile meter1棕化\黑化Brow\black oxide2循環水洗circulating water rinsing3PP膠片Prepreg4物理性質\化學性質physical\chemical character5暫存時間Temporary store time6鉚釘組合Eyelet7疊板結構stacking(lay up) structure8鉚釘rivet9熱熔機heat-melting machine10有用壽命useful life11印製電路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13圍堵措施Containment Plan14現狀Current Status15原因分析Gap Analysis16內部稽核\外部稽核Internal\outside Audit17修改\變更Modify18無鹵素Halogen Free19更新\修訂Update/Revise20改進措施ure Plan21長期異常Chronic22突發異常Excursion23陶爾(壓力單位)Torr24靶孔距Space between target holes25層偏misalignment26組合線Combined producing line27鋼板\隔板steel plate\caul plate\separator28板厚測量儀Board-thickness measuring instrument 29鋼印機 steel seal machine30品質檢驗 quality examination31介質厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剝離強度stripping strength35焊錫耐熱性heat-resistant of solder36抗麻斑測試spot-resistant test37信賴性測試reliability test38介電常數測量儀dielectric constant measuring device 39包裝標籤packing tag40電子天平electrical balances41焊錫爐solder furnace42孔徑規calliper gauge43比色計color comparing meter44密度計density meter45蝕刻均勻性Etching uniformability46化驗單 laboratory list47出貨單manifest48雙面板\多層板 Reversible Board\Multi layer board 49定位孔 Location Hole50疊板數stack boards count1硝基戊烷amylnitrite2陽極泥anode slime (sludge)3液態光阻aqueous photoresist4縱橫比aspect ratio5預留在製品banked work in process 6貝他射線照射法beta backscattering7斜邊beveling8吹孔blow hole9黏結層bonding plies10焊橋solder bridge11接單生產Build To Order(BTO) 12金手指斜邊\倒角chamfering13網框chase14螯合劑chelator15化學鍵chemical bond16熱膨脹Thermal Expansion17同心圓concentric circle18密貼性conformance19消費類產品consumer products20庫倫定理coulombs law21喇叭孔countersink22試樣coupon\sample23覆蓋力covering power24挖空cut-outs25交期縮短cycle-time reduction 26專用型dedicated27縮錫dewetting28介質常數dielectric constant29孔黑\孔灰discolor hole30停機\稼動時間downtime\uptime31鉆針切削面drill facet32鉆針研磨機drill pointer33裸板(未鍍銅) blank board34延展性ductility\Elongation35留邊寬度edge spacing36金手指edge-board contact ( gold finger )\tab 37電化學反應器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40織維突出fiber protrusion41成品final board42固著fixing43燃燒等級flammability rating44抗菌性\抗酶性fungus resistance45膠化時間gel time46一般阻焊油墨general resist ink47玻璃態轉換溫度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化劑hardener50空氣濾清器\過濾器hepa filter1規範specification\standard2銑靶spot face3衝壓\鋼印stamping4標準液壓法standard hydraulic lamination 5缺膠starvation6應力\應度strain7應力計stress meter8板面突起surface convex\swelling9板面檢查surface examination10板面粗糙度surface roughness11熱震蕩試驗thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化劑tarnish and oxide resist14透光度transmittance15裁切線trim line16測試undercut17萬用型universal18有形庫存visible inventory19倉庫warehouse20濕化學制程wet chemistry process21燈芯\滲銅wicking22縱橫比width-to-thickness ratio23良率yield24點燈次數Times of Light switch25真空延遲時間Vacuum delayed time26+/-2 周The front or rear two weeks 27無塵室clean room28上噴壓Upper spray pressure29下噴壓Lower spray pressure30顯影劑developer31主軸轉速(RPM) Spindle Revolution Speed\Revolution Per MinuteRPM32光電耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺點偵測\檢測defect detection35聚焦focus36光校正calibration37極性Polarity38正極\陽極Positive39負極\陰極Negative40下鉆點\下刀點entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨) 44溫差temperature difference45文字不清marking(symbol) blurred46文字白點S/L white point47補充顯影additional developing48烘烤baking49確認檢修系統Visual Repair System(VRS)50圖表Diagram1腐蝕Corrosive2致癌物carcinogenic3有機體突變的Mutagenic4染色體錯位chromosome aberration5畸形teratogenic6有害氣體poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入劑inhalation10護目鏡goggle11棉手套Cotton glove12化學特性Chemical properties13熔點Melting point14抽樣檢查spot check15沸水boiling water16沖模Punching17氫溴化物hydrochloride18醇\酒精alcohol19持續改進continual improvement20糾正措施corrective action21環境因素\影響\方針environment aspect\impact\policy 22環境管理體系environment management system 23污染預防prevention of pollution24品質關鍵點critical to quality(CTQ)25客戶需求分析Customer Needs Mapping(CNM) 26質量功能分布Quality Function Deployment(QFD)27失效模式及後果分析Failure Mode & Effects Analysis(FMEA)28跨功能小組Cross-functional involvement 29傳感器sensor30點陣圖tally chart31全面品質管理Total Quality Management(TQM)如QC七大手法32柏拉圖Pareto Chart33因果圖\魚骨圖Cause and Effect diagrams34腦力激蕩Brainstorming35散布圖Scatter diagrams36全面設備保養Total Productive Maintenance(TPM)37控製圖Conttrol Chart38測定系統分析Gage Repeatability&Reproducibility(GRR)39印製電路板協會Institute of printed circuit(IPC)40有機保焊膜Organic Solderability Preservative(OSP)41進刀Feed42金鹽Potassium Gold Cyanide(金氰化鉀PGC)43輻射式紅外線焊Radiation(輻射) Infrared Rays(IR) Reflow(焊接)接44錫膏熔焊Reflow Soldering45縮錫Dewetting46錫爐浮渣Dross47錫尖Solder Icicle48錫球Solder Ball49電容器capacitor50波峰焊Wave Soldering1石油petroleum2線圈\纏繞coil3代理商agency4自由基Free Radical5鍍金Golden Plating6防焊阻劑Polymer coating(solder resistent) 7內層(外層)孔環Internal(external) Annular ring 8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\霧面油墨glossy\matte ink11晶片直接組裝Chip On Board(COB)12組裝密度packaging density13球狀陣列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16觸變性thixotropy(粘度變化特性)17儲存壽命shelf life18網版(脫網)高度snap off distance19拉絲stringing20平移偏差shifting deviation21貼裝幾Placement equipment22虛焊點(焊點不佳)colder solder connection23焊盤起翹lifted land24錫珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27離子清潔度ion cleaning28印製電路元件printed circuit assembly(PCA) 29特采Accept on Deviation\Use As It 30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔銅厚度Barrel Copper thickness\Hole Copper Thickness 33面銅厚度Surface Copper Thickness34皺折wrinkle35置信區間Confidence interval36相關性Correlation37相關矩陣Correlation Matrix38任意抽樣法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正態分布Normal Distribution42排列圖(柏拉圖)Pareto Chart43預測區間Prediction IntervalProbability Based Chart44基於概率的控制圖45制程能力Process Capability46二次函數Quadratic47隨機抽樣Random sampling48極差Range49合理子組Rational Subgroup50回歸控製圖Regression control chart1故障failure\breakdown2夾頭grip holder3解析度\解像度resolution4可靠度reliability5孔位錯誤(孔偏)mis hole location6孔徑\鉆孔直徑錯誤Hole Diameter error7離子污染度試驗ionic contamination testing8線距line space9線寬line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lotcrazing\mealing(白點)\Haloing(白邊) 12 裂痕\白斑\白點\白邊13對位不准misregistration14釘頭nail heading15數位鉆孔機NC drill16原稿底片original art work (A/W)17鉆針重疊overlap18氧化oxidation19剝離\抗撕強度peel strength20感光起始劑photo initiator21凹陷dent22塞孔plug hole\stuffing23補線不良poor touch-up24循環周期Periodically cycle25初始資料protocal26噴砂pumice scrub27對位孔registration hole28文字印刷silk screen printing\printing of legend 29膠渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛邊serrated edges 33跳印skip printing34漂錫solder float35噴涂spray coating36刮刀Squeegee37孔規taped hole gauge 38薄基板\內層板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41電流密度Current Density42風刀Air Knife43獲取資格的Qualify/qualified + n. or + to44現場locality(PD)45濃度偏低Conc. Lower46濃度偏高Conc. Higher47人員疏忽Operator careless48經緯向錯誤longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露銅unreal copper exposure2積墨ink accumulation3印偏ink printing deviated4遵照現場作業規範comply with the handling standardization 5放置時間Holding time6烘乾溫度不足Insufficient in dry temperature7設備故障breakdown of machine8壓膜滾輪 D/F laminated roller9sth. 受損或污染Damaged or contaminated10粘塵壓力sticky pressure11曝光燈管exposure fluorescent tube12光階 light step condition13曝偏Exposure misregistration14層間對準度alignment registration15吸氣不良vacuum treatment abnormal16曝光藏點Exposure shelter17人員動作不當improper handling18顯影Developing19蝕刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育訓練instruction and trainning23進行顯破點測試conduct developing point broken test 24噴壓Spraying pressure25蝕刻不潔Etching incompletely\underetch26蝕刻液Etchants27首件確認First article confirm28電性不良Electrical performance defective29去膜不凈Film stripping uncleanness30幾臺漏測Equipment test leaking31領班Foreman32主管Chief33穩定性Stability34誤判Misjudgement35混料Mixture36鋁粉濃度(火山灰)Aluminum percentage37超音波測試(錫箔Tin foil perforating test 紙)38水破測試water broken test39油墨黏度ink viscosity40黏度計viscosimeter41數孔機hole counter42振動馬達vibration motor43網版調偏net screen misregistration 44試印膜trial printing film45機臺未清潔worktable uncleaness46萬用塞孔墊板universal plugging back-up 47預烤Precure48上錫\焊錫性不良poor solderability49溫度均勻性Temp. uniformability 5010倍放大鏡10X magnifier1捲尺measuring tape2千分尺micrometer3剝離強度Peeling strength4尺寸安定性Dimensional stability5有害物質Hazardous substance6元素分析儀 element analyzing instrument7顯微鏡microscope8遊標卡尺vernier caliper9膜厚測量儀membrane thickness measuring intrument 10銑刀milling cutter\routing bit11鉆針drill bit12化學元素chemical elements13化學藥水chemical liquid14裁切刀具cutting tool15控制面板control panel16日點檢表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\誤差 tolerance\variance\bias(偏差)19量產mass production20白色文字white ident21成型外型routed outline22連片尺寸PNL drawing dimension23折斷邊break-away tabs24檢查表inspection sheet25記錄表data sheet\record chart26報表report forms27點檢表Check list28磨邊機Grind- edging machine\ Edger29打磨機polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32溫度計Temp. meter\Thermograph33壓力計Pressure meter34能量格測試Energy-step tablet test35黏紙viscosity paper36六點測溫儀Six points Temp. uniformability test Instrument 37催化劑catalyst38穩定劑\安定劑stabilizer39硫酸銅回收機CuSO4 retrieve equipment40秒錶stopwatch41預熱preheat42計時器chronograph\timepiece43能量計energy meter44靶孔機target hole equipment45銅含量The contents of Cu46液體比重計hydrometer47比重測定法stereometry48殺菌劑sterilant49蝕刻因子Etching factor\value\element50自動光學檢測Automatical optical inspection(AOI)1精度Precision2棧板pallet3電動拖車\叉車electric trailer\fork lifter4針盤bit holder5放置架placement rack6靜止消泡時間static\rest defoaming time7轉板Transfer plate8水性筆Mark pen9尼龍\不織布\陶瓷nylon\non-woven fabric\ceramic10比色計chromo meter11濕度卡Humidity Indicator Cards12測溫儀Thermoscope13龍門吊gantry crane14搖擺\擺動swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除膠速率desmear rate20濕潤(電鍍)moisten21獲准供應商supplier warrant22供應商批准程序書Supplier Part Approval Process(SPAP) 23V-cut殘厚Remain thickness of V-cut24冷媒油refrigerant oil25壓力腳pressure foot26塊規block gauge27高度規vernier height gage28金剛砂carborundum\Emery29火山灰volcanic ash30高阻計high resistance meter31模具圖mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36電流強度current amperage37化驗分析表Assay analysis report forms 38加壓水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42沖污水waste water rinsing43水柱式沖洗Jet cleaning44高壓水柱式沖洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板組合Drying module47抗腐蝕測試accelerated corrosion test48速化反應acceleration49實際在製品active work in process50總量amount1高性能(電子)工業high performance industrial級2高延展性銅箔high temperature elongation copper(HTEC)3高溫樹脂high temperature epoxy (HTE)4孔數hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度單位)Knoop(Hardness)9牛皮紙kraft paper10壓膜機laminator11刃角磨損lay back12牽引\定位螺絲lead screw13平整劑levelling additive14線性可變差動轉換器linear variable differential transformer(LVDL) 15 刷磨清潔法machine scrub16鉆頭刃帶margin17主圖\機構圖master drawing18基材利用率material use factor19濕度與絕緣電阻測試moisture and insulation resistance test20鋸齒\蝕刻缺口mouse bite21負片negative film22結瘤\銅瘤nodule23流膠量百分比resin flow percentage24膠含量resin content25報廢因素obsolescence factor26一銅panel plating27二銅pattern plating28透電率\介電常熟permittivity29極性吸引力polar-polar interaction30聚酯類polyester31孔變形poor drill32預聚合物prepolymer33原始資料protocal34噴砂清潔法pumice scrub35掛架rack36折光率refraction37對位元用標記register mark(對位點)38孔內沾文字S/L on hole39孔內防焊S/M on hole40干膜屑\透明殘膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技術SMT ( surface mount technology ) 44錫突solder bump45漂錫solder float46油墨附著力solder mask adhesion47金手指上錫solder on G/F48線路沾錫solder on trace49錫塞solder plug50統計制程管控SPC ( Statistical Process Control )1自檢Self-examine2檸檬酸濃度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6噴砂能力pumice capability7閥門 Valve8外包加工contract-production 9退貨拒收REJ ( reject )10植PIN深度Depth of external pin 11上PIN beat PIN12精確度Precision13準確度accuracy14操作員技術不嫻熟operator technique unskilled15套环深度depth of sleeve-ring16精修(成型)finely couting17漏鉆\漏撈Leaking drilling\routing 18多鉆\多撈surplus drilling\routing 19排屑chip load20排屑槽flute21蜂鳴器check beeper22建立檔案資料(建檔)Archive data building 23合格qualified24電子稱Electronic scale25封口時間sealing time26超出範圍out of scope27微蝕速率Micro-etching ratio28變色\褪色discolor29破損breakage30電導率conductance ratio31履歷表biographic sketch32公式formula33擴孔針reaming drill bit34電木板bakelite board35允收水準general criteria36理想狀況Target Condition37模板\模具Template38基準孔reference holes39壓敏開關Piezo-switch40指示燈indicator41直方圖Histogram42并聯導體parallel conductors43導體連接處area of adjacent conductors44金屬導體Metal conductors45防焊側露(焊墊\線路)Adjacent isolated lands or conductors exposed 46有害物質公約Restriction of Hazardous Substances(RoHS) 47預防措施Precaution48生物可降解Biodegradability49生態環境ecologyDisposal50(垃圾\廢棄物)處理1浸焊Immersion Soldering2焊接點Solder Joint3焊錫絲Solder Wire4待工溫度Idle Temp.\+Time(空轉時間)5靜電釋放Electrostatic Discharge(ESD)6靜電壓力Electrostatic Overstress(ESO)7電阻係數Electrical Resistivity8內應力Internal Stress9導熱係數Thermal Conductivity10磷含量Phosphorous11顆粒大小Grain Size(μm)12X光測量X-ray Diffraction13抗拉強度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15賈凡尼效應Galvanic Effect(不同金屬電位差加速腐蝕) 16高頻信號High Frequency Signal17肌膚效應Skin Effect(高頻線路沿道題表面傳輸)18阻隔效應Barrier Effect(合金層可有效減低離子遷移度) 19銀Silver20硫酸sulfuric acid21儀器Apparatus(測試用儀器)22拋光Polish23磨切片grind microsection24文件保存期限Documentation of age25內部管理政策Internal Policies26工資支付Salary payments27責任書Responsibility28法定最小年齡The legal minimum age29熟練\技能Facility30隱私權right to privacy31貪污\腐敗corruption32有效日期valid period33溫度循環實驗Temperature Cycling Test(TCT)34熱衝擊實驗Thermal Shock Test(TST)35離子遷移試驗Electrochemical Migration Test(ECM) 36絕緣電阻試驗Surface Insulation Resistance(SIR)37陽極燈絲Conductive Anode Filament(CAF)38爆板popcorn39生產車間Fabricating Plant40吊車crane41危隩物品hazardous substance42文字脫落symbol fading43鋸齒Worm-Eaten-Crack44經緯方向Grain Direction45V-cut Slit46幻燈片slide47預算budget48運輸工具transport49貨物cargo50容器vessel1殘差控製圖Residuals Control Chart2雙邊Bilateral3單邊(極致)unilateral4分布寬度Spread5標準差Standard Deviation6統計推斷Statistical Inference7變差Variation8區域分析Zone Analysis9可接受質量水平Accpet Quality Level(AQL)10物質安全品質表Material Safey Data Sheet(MSDS) 11錫渣Tin residue12外包商Subcontractor13結論conclusion14能力competence15工作關鍵表Job Element Sheets(JET)16目數mesh count171819202122232425262728293031 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50。
PCB专业术语中英文对照
1影响电性及外观Affect upon electrical performance or appearance2过度的Excessively3异常Abnormal4规格不符specification is below standard5品质异常quality is below standard6严格按照QC规定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8设备device(另義:主動零件) \ machine \9参数设置错误parameters setting error10依保养计划According to the maintaining plan11压力过小lack of pressure12曝光不全\过度exposure-energy insufficient\excessive 13间距不足spacing nonenough14线细width reduce15光强度Light Intensity16缺口nick\chipping17气泡Bubble\blister\air inclusion18异物foreign particle \ foreign material（壓合異物）\dust(灰塵)19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定点开路fixed position open22固定点短路fixed position short23线路针孔trace pin-hole24孔破void in PTH hole\Barrel Crack25断脖子Open near pad26静置时间Holding time27识别方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,残材 Debris30显影不洁Developing uncleanness 31外观不良Appearace defective32传动\传送速度convey speed33偏离deviation\shifted34单轴single axis35底片涨缩A/W expand or contract 36漏失率 Loss Rate37补偿compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\铜箔基板copper clad laminates (CCL)40线路露铜copper exposure41织纹显露weave exposure42光学点\基准标记fiducial mark43环氧树脂epoxy44蚀刻速率etch rate45网布fabric46助焊剂不均匀flux coating uneven 47过滤filtration48电测治具fixture49钻尖分离gap50标准板golden board1影响上件及外观affect upon mounting or appearance2铜厚测量仪Copper thickness Measuring Instrument 3佐证evidence4微蚀量microetching quantity5 湿度humidity6内部校正周期(校验矫正)internal proofread cycle\calibrationsystem cycle7板面刮伤Surface Scratch8制定handling 标Define standard of handling 9目视检查\目检visual inspection10规定频率defined frequency11压力计\表pressure gauge12工程程式designed program13超规格out of the tolerance14毛头\去毛头burr\deburring15影响下工序制作difficult to product in the following process16化学铜electroless plating17除胶速率desmearing rate18电流current19分层delamination\bulge20湿润Damped21预浸Pre-dipped22活化液activator23速化accelerator24漂锡solder float25热应力测试thermal stress test26孔环(焊垫)Lifted land\annular ring 27热水洗Hot water rinsing28震动马达vibrating motor29铜渣copper residue (copper splash)\cosmetics island獨立銅渣30清洁滤网purifying filters31定期换水replace water regularly32回收槽recovery tank33加强管控to strengthen the control of sth.34酸洗\硷洗acid\alkali rinse35定期分析浓度Analyze Conc. regularly36金属杂质污染Contamination of metal impurities37碳化物carbide38碳处理carbon treatment39整流器(电流矫正)Current rectifier40铜厚测量仪Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43电流控制器current controller44吸水滚轮破旧water-absorptive roller worn-out45新水补充不足Insufficient for water replenishment 46滤芯Filter element47化学药液chemicals liquid48孔塞(孔内异物)dirty hole49多与\少与1mil厚度Less\More than 1 mil Thickness50色差color variation1板面粘油墨屑(显影段)sticky ink debris2挡水滚轮water apart roller3网板高度Screen height4网板张力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃钝化Squeegee edge blunt7油墨黏度过大viscosity of ink too thick8张力应力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12静电喷涂Spray Coating13印可剥胶Peelable Solder Mask14风刀air knife15隔离环clearance16烧焦burning17化镍金immersion nickel and gold18铜镍层接著不良Poor combination the copper and nickel 19刷磨滚轮brush roller20刷幅测试brush breadth\width test21脱脂温度Defatting Temp.22流量计flowmeter23执行\导电Conduct24助焊剂\熔合液rosin(天然松香)\flux\fusing fluids25锡粗Tin roughness26焊料中铜离子含量过高The cu2+ content out of upper in solder 27机台异常machine-motion error28缺点标示卡nominal card of defects29程序\程式错误Programbug30人员疏忽operator's carelessness31日保养daily maintainance32人员技能不熟练Operator is not skilled33口头考核examine orally34阻抗异常Impedance Abnormal35阻抗测量仪impedance measuring instrument36漏气puncture37受潮moisture absorption38膜面污染film surface contaminated39漏检Leaking inspection40二次元 2D(biaxial) dimension-measuringinstrument41工单run card\work order42飞针Flying Probe43目检Visual Inspection44专用治具测试Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47铜箔厚度Copper foil Thickness48板弯翘Bow and Twist(warp)49尺寸(含对角)Size(Diagonal)\dimensions(成型) 50拉力计\张力计tensile meter1棕化\黑化Brow\black oxide2循环水洗circulating water rinsing3PP胶片Prepreg4物理性质\化学性质physical\chemical character5暂存时间Temporary store time6铆钉组合Eyelet7叠板结构stacking(lay up) structure8铆钉rivet9热熔机heat-melting machine10有用寿命useful life11印制电路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13围堵措施Containment Plan14现状Current Status15原因分析Gap Analysis16内部稽核\外部稽核Internal\outside Audit17修改\变更Modify18无卤素Halogen Free19更新\修订Update/Revise20改进措施ure Plan21长期异常Chronic22突发异常Excursion23陶尔(压力单位)Torr24靶孔距Space between target holes25层偏misalignment26组合线Combined producing line27钢板\隔板steel plate\caul plate\separator28板厚测量仪Board-thickness measuring instrument 29钢印机 steel seal machine30品质检验 quality examination31介质厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剥离强度stripping strength35焊锡耐热性heat-resistant of solder36抗麻斑测试spot-resistant test37信赖性测试reliability test38介电常数测量仪dielectric constant measuring device 39包装标籤packing tag40电子天平electrical balances41焊锡炉solder furnace42孔径规calliper gauge43比色计color comparing meter44密度计density meter45蚀刻均匀性Etching uniformability46化验单 laboratory list47出货单manifest48双面板\多层板 Reversible Board\Multi layer board 49定位孔 Location Hole50叠板数stack boards count1硝基戊烷amylnitrite2阳极泥anode slime (sludge)3液态光阻aqueous photoresist4纵横比aspect ratio5预留在制品banked work in process 6贝他射线照射法beta backscattering7斜边beveling8吹孔blow hole9黏结层bonding plies10焊桥solder bridge11接单生产Build To Order(BTO)12金手指斜边\倒角chamfering13网框chase14螯合剂chelator15化学键chemical bond16热膨胀Thermal Expansion17同心圆concentric circle18密贴性conformance19消费类产品consumer products20库伦定理coulombs law21喇叭孔countersink22试样coupon\sample23覆盖力covering power24挖空cut-outs25交期缩短cycle-time reduction 26专用型dedicated27缩锡dewetting28介质常数dielectric constant29孔黑\孔灰discolor hole30停机\稼动时间downtime\uptime31钻针切削面drill facet32钻针研磨机drill pointer33裸板(未镀铜) blank board34延展性ductility\Elongation35留边宽度edge spacing36金手指edge-board contact ( gold finger )\tab 37电化学反应器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40织维突出fiber protrusion41成品final board42固著fixing43燃烧等级flammability rating44抗菌性\抗酶性fungus resistance45胶化时间gel time46一般阻焊油墨general resist ink47玻璃态转换温度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化剂hardener50空气滤清器\过滤器hepa filter1规范specification\standard2铣靶spot face3衝压\钢印stamping4标准液压法standard hydraulic lamination 5缺胶starvation6应力\应度strain7应力计stress meter8板面突起surface convex\swelling9板面检查surface examination10板面粗糙度surface roughness11热震荡试验thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化剂tarnish and oxide resist14透光度transmittance15裁切线trim line16测试undercut17万用型universal18有形库存visible inventory19仓库warehouse20湿化学制程wet chemistry process21灯芯\渗铜wicking22纵横比width-to-thickness ratio23良率yield24点灯次数Times of Light switch25真空延迟时间Vacuum delayed time26+/-2 周The front or rear two weeks 27无尘室clean room28上喷压Upper spray pressure29下喷压Lower spray pressure30显影剂developer31主轴转速(RPM) Spindle Revolution Speed\Revolution PerMinute RPM32光电耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺点侦测\检测defect detection35聚焦focus36光校正calibration37极性Polarity38正极\阳极Positive39负极\阴极Negative40下钻点\下刀点entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨)44温差temperature difference45文字不清marking(symbol) blurred46文字白点S/L white point47补充显影additional developing48烘烤baking49确认检修系统Visual Repair System(VRS)50图表Diagram1腐蚀Corrosive2致癌物carcinogenic3有机体突变的Mutagenic4染色体错位chromosome aberration5畸形teratogenic6有害气体poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入剂inhalation10护目镜goggle11棉手套Cotton glove12化学特性Chemical properties13熔点Melting point14抽样检查spot check15沸水boiling water16冲模Punching17氢溴化物hydrochloride18醇\酒精alcohol19持续改进continual improvement20纠正措施corrective action21环境因素\影响\方针environment aspect\impact\policy22环境管理体系environment management system23污染预防prevention of pollution24品质关键点critical to quality(CTQ)25客户需求分析Customer Needs Mapping(CNM)26质量功能分布Quality Function Deployment(QFD)27失效模式及后果分析Failure Mode & Effects Analysis(FMEA) 28跨功能小组Cross-functional involvement29传感器sensor30点阵图tally chart31全面品质管理Total Quality Management(TQM)如QC七大手法32柏拉图Pareto Chart33因果图\鱼骨图Cause and Effect diagrams34脑力激荡Brainstorming35散布图Scatter diagrams36全面设备保养Total Productive Maintenance(TPM)37控制图Conttrol Chart38测定系统分析Gage Repeatability&Reproducibility(GRR) 39印制电路板协会Institute of printed circuit(IPC)40有机保焊膜Organic Solderability Preservative(OSP) 41进刀Feed42金盐Potassium Gold Cyanide(金氰化鉀PGC)43辐射式红外线焊接Radiation(輻射) Infrared Rays(IR)Reflow(焊接)44锡膏熔焊Reflow Soldering45缩锡Dewetting46锡炉浮渣Dross47锡尖Solder Icicle48锡球Solder Ball49电容器capacitor50波峰焊Wave Soldering1石油petroleum2线圈\缠绕coil3代理商agency4自由基Free Radical5镀金Golden Plating6防焊阻剂Polymer coating(solder resistent) 7内层(外层)孔环Internal(external) Annular ring8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\雾面油墨glossy\matte ink11晶片直接组装Chip On Board(COB)12组装密度packaging density13球状阵列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16触变性thixotropy(粘度變化特性)17储存寿命shelf life18网版(脱网)高度snap off distance19拉丝stringing20平移偏差shifting deviation21贴装几Placement equipment22虚焊点(焊点不佳)colder solder connection23焊盘起翘lifted land24锡珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27离子清洁度ion cleaning28印制电路元件printed circuit assembly(PCA)29特采Accept on Deviation\Use As It30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔铜厚度Barrel Copper thickness\Hole CopperThickness33面铜厚度Surface Copper Thickness34皱折wrinkle35置信区间Confidence interval36相关性Correlation37相关矩阵Correlation Matrix38任意抽样法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正态分布Normal Distribution42排列图(柏拉图)Pareto Chart43预测区间Prediction Interval44基于概率的控制图Probability Based Chart45制程能力Process Capability46二次函数Quadratic47随机抽样Random sampling48极差Range49合理子组Rational Subgroup50回归控制图Regression control chart1故障failure\breakdown2夹头grip holder3解析度\解像度resolution4可靠度reliability5孔位错误(孔偏)mis hole location6孔径\钻孔直径错误Hole Diameter error7离子污染度试验ionic contamination testing8线距line space9线宽line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lot12 裂痕\白斑\白点\白边crazing\mealing(白點)\Haloing(白邊)13对位不准misregistration14钉头nail heading15数位钻孔机NC drill16原稿底片original art work (A/W)17钻针重叠overlap18氧化oxidation19剥离\抗撕强度peel strength20感光起始剂photo initiator21凹陷dent22塞孔plug hole\stuffing23补线不良poor touch-up24循环周期Periodically cycle25初始资料protocal26喷砂pumice scrub27对位孔registration hole28文字印刷silk screen printing\printing of legend29胶渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛边serrated edges 33跳印skip printing34漂锡solder float35喷涂spray coating36刮刀Squeegee37孔规taped hole gauge 38薄基板\内层板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41电流密度Current Density42风刀Air Knife43获取资格的Qualify/qualified + n. or + to44现场locality(PD)45浓度偏低Conc. Lower46浓度偏高Conc. Higher47人员疏忽Operator careless48经纬向错误longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露铜unreal copper exposure2积墨ink accumulation3印偏ink printing deviated4遵照现场作业规范comply with the handling standardization 5放置时间Holding time6烘乾温度不足Insufficient in dry temperature7设备故障breakdown of machine8压膜滚轮 D/F laminated roller9sth. 受损或污染Damaged or contaminated10粘尘压力sticky pressure11曝光灯管exposure fluorescent tube12光阶 light step condition13曝偏Exposure misregistration14层间对准度alignment registration15吸气不良vacuum treatment abnormal16曝光藏点Exposure shelter17人员动作不当improper handling18显影Developing19蚀刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育训练instruction and trainning23进行显破点测试conduct developing point broken test 24喷压Spraying pressure25蚀刻不洁Etching incompletely\underetch26蚀刻液Etchants27首件确认First article confirm28电性不良Electrical performance defective29去膜不净Film stripping uncleanness 30几台漏测Equipment test leaking31领班Foreman32主管Chief33稳定性Stability34误判Misjudgement35混料Mixture36铝粉浓度(火山灰)Aluminum percentage37超音波测试(锡箔纸)Tin foil perforating test 38水破测试water broken test39油墨黏度ink viscosity40黏度计viscosimeter41数孔机hole counter42振动马达vibration motor43网版调偏net screen misregistration 44试印膜trial printing film45机台未清洁worktable uncleaness46万用塞孔垫板universal plugging back-up 47预烤Precure48上锡\焊锡性不良poor solderability49温度均匀性Temp. uniformability5010倍放大镜10X magnifier1捲尺measuring tape2千分尺micrometer3剥离强度Peeling strength4尺寸安定性Dimensional stability5有害物质Hazardous substance6元素分析仪 element analyzing instrument7显微镜microscope8游标卡尺vernier caliper9膜厚测量仪membrane thickness measuring intrument 10铣刀milling cutter\routing bit11钻针drill bit12化学元素chemical elements13化学药水chemical liquid14裁切刀具cutting tool15控制面板control panel16日点检表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\误差 tolerance\variance\bias(偏差)19量产mass production20白色文字white ident21成型外型routed outline22连片尺寸PNL drawing dimension23折断边break-away tabs24检查表inspection sheet25记录表data sheet\record chart26报表report forms27点检表Check list28磨边机Grind- edging machine\ Edger29打磨机polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32温度计Temp. meter\Thermograph33压力计Pressure meter34能量格测试Energy-step tablet test35黏纸viscosity paper36六点测温仪Six points Temp. uniformability testInstrument37催化剂catalyst38稳定剂\安定剂stabilizer39硫酸铜回收机CuSO4 retrieve equipment40秒錶stopwatch41预热preheat42计时器chronograph\timepiece43能量计energy meter44靶孔机target hole equipment45铜含量The contents of Cu46液体比重计hydrometer47比重测定法stereometry48杀菌剂sterilant49蚀刻因子Etching factor\value\element50自动光学检测Automatical optical inspection(AOI)1精度Precision2栈板pallet3电动拖车\叉车electric trailer\fork lifter4针盘bit holder5放置架placement rack6静止消泡时间static\rest defoaming time7转板Transfer plate8水性笔Mark pen9尼龙\不织布\陶瓷nylon\non-woven fabric\ceramic10比色计chromo meter11湿度卡Humidity Indicator Cards12测温仪Thermoscope13龙门吊gantry crane14摇摆\摆动swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除胶速率desmear rate20湿润(电镀)moisten21获准供应商supplier warrant22供应商批准程序书Supplier Part Approval Process(SPAP) 23V-cut残厚Remain thickness of V-cut24冷媒油refrigerant oil25压力脚pressure foot26块规block gauge27高度规vernier height gage28金刚砂carborundum\Emery29火山灰volcanic ash30高阻计high resistance meter31模具图mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36电流强度current amperage37化验分析表Assay analysis report forms38加压水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42冲污水waste water rinsing43水柱式冲洗Jet cleaning44高压水柱式冲洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板组合Drying module47抗腐蚀测试accelerated corrosion test48速化反应acceleration49实际在制品active work in process50总量amount1高性能(电子)工业级high performance industrial2高延展性铜箔high temperature elongation copper(HTEC) 3高温树脂high temperature epoxy (HTE)4孔数hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度单位)Knoop(Hardness)9牛皮纸kraft paper10压膜机laminator11刃角磨损lay back12牵引\定位螺丝lead screw13平整剂levelling additive14线性可变差动转换器linear variable differential transformer(LVDL)15 刷磨清洁法machine scrub16钻头刃带margin17主图\机构图master drawing18基材利用率material use factor19湿度与绝缘电阻测试moisture and insulation resistance test 20锯齿\蚀刻缺口mouse bite21负片negative film22结瘤\铜瘤nodule23流胶量百分比resin flow percentage24胶含量resin content25报废因素obsolescence factor26一铜panel plating27二铜pattern plating28透电率\介电常熟permittivity29极性吸引力polar-polar interaction30聚酯类polyester31孔变形poor drill32预聚合物prepolymer33原始资料protocal34喷砂清洁法pumice scrub35挂架rack36折光率refraction37对位元用标记register mark(對位點)38孔内沾文字S/L on hole39孔内防焊S/M on hole40干膜屑\透明残膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技术SMT ( surface mount technology )44锡突solder bump45漂锡solder float46油墨附著力solder mask adhesion47金手指上锡solder on G/F48线路沾锡solder on trace49锡塞solder plug50统计制程管控SPC ( Statistical Process Control )1自检Self-examine2柠檬酸浓度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6喷砂能力pumice capability7阀门 Valve8外包加工contract-production9退货拒收REJ ( reject )10植PIN深度Depth of external pin11上PIN beat PIN12精确度Precision13准确度accuracy14操作员技术不娴熟operator technique unskilled 15套环深度depth of sleeve-ring16精修(成型)finely couting17漏钻\漏捞Leaking drilling\routing18多钻\多捞surplus drilling\routing19排屑chip load20排屑槽flute21蜂鸣器check beeper22建立档案资料(建档)Archive data building23合格qualified24电子称Electronic scale25封口时间sealing time26超出范围out of scope27微蚀速率Micro-etching ratio28变色\褪色discolor29破损breakage30电导率conductance ratio31履历表biographic sketch32公式formula33扩孔针reaming drill bit34电木板bakelite board35允收水准general criteria36理想状况Target Condition37模板\模具Template38基准孔reference holes39压敏开关Piezo-switch40指示灯indicator41直方图Histogram42并联导体parallel conductors43导体连接处area of adjacent conductors44金属导体Metal conductors45防焊侧露(焊垫\线路)Adjacent isolated lands or conductorsexposed46有害物质公约Restriction of Hazardous Substances(RoHS) 47预防措施Precaution48生物可降解Biodegradability49生态环境ecology50(垃圾\废弃物)处Disposal理1浸焊Immersion Soldering2焊接点Solder Joint3焊锡丝Solder Wire4待工温度Idle Temp.\+Time(空轉時間)5静电释放Electrostatic Discharge(ESD)6静电压力Electrostatic Overstress(ESO)7电阻係数Electrical Resistivity8内应力Internal Stress9导热係数Thermal Conductivity10磷含量Phosphorous11颗粒大小Grain Size(μm)12X光测量X-ray Diffraction13抗拉强度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15贾凡尼效应Galvanic Effect(不同金屬電位差加速腐蝕)16高频信号High Frequency Signal17肌肤效应Skin Effect(高頻線路沿道題表面傳輸)18阻隔效应Barrier Effect(合金層可有效減低離子遷移度) 19银Silver20硫酸sulfuric acid21仪器Apparatus(測試用儀器)22抛光Polish23磨切片grind microsection24文件保存期限Documentation of age25内部管理政策Internal Policies26工资支付Salary payments27责任书Responsibility28法定最小年龄The legal minimum age29熟练\技能Facility30隐私权right to privacy31贪污\腐败corruption32有效日期valid period33温度循环实验Temperature Cycling Test(TCT)34热衝击实验Thermal Shock Test(TST)35离子迁移试验Electrochemical Migration Test(ECM) 36绝缘电阻试验Surface Insulation Resistance(SIR) 37阳极灯丝Conductive Anode Filament(CAF)38爆板popcorn39生产车间Fabricating Plant40吊车crane41危险物品hazardous substance42文字脱落symbol fading43锯齿Worm-Eaten-Crack44经纬方向Grain Direction45V-cut Slit46幻灯片slide47预算budget48运输工具transport49货物cargo50容器vessel。
PCB相关专业术语英汉对照
布局 布局效率 布设总图 布线 布线密度 步进重复 材料检验 参考尺寸 参考基准 残余铜 测试板 测试图形 側蚀 层间距 层间连接 层压（复合） 层压板 层压板裂缝 层压板面 层压板缺陷 层压板完整性 层压膜板 插（贴）装 差分驱动 差分蚀刻法 差示扫描量热法 潮湿和绝缘电阻 成品板 成像 尺寸稳定性 尺寸要求 冲切 抽查 出厂交收条件 储存 储存期 处理剂含量 处理面 处理物转移 处理织物 触变性 穿线弯连 传输线
桥接 切削量 清晰度 去毛刺 去铜箔面 去钻污 缺胶区 缺口 缺纬 绕接 热冲击 热导率 热风整平 热风整平 热隔离 热机分板 热膨胀系数 热熔 热熔液 热态强度保留率 热应力方法 热应力试验 人力资源部 乳胶面 润湿剂 三级封装(各种电子整机产品) 三聚氰胺甲醛树脂 散热层 扫描式电子显微镜 闪镀 烧焦镀层 烧灼 设计规则检查 射频干扰 伸长率 渗出 生产底版 生物制品 施工质量 湿法贴膜 湿强度保留率 湿热后绝缘电阻 蚀刻
placement layout efficiency master drawing routing circuit density step-and-repeat materials inspection datum dimension datum reference estraneous copper test board test pattern undercut layer-to-layer spacing internalyer connection laminating laminate crack of laminate unclad laminate surface laminate imperfections laminate integrity laminate moulding plate mounting differentia drive differential etching differential scanning caborimetry moisture and insulation resistance production board imaging dimensional stability dimensional requirements punching spot-check inspectin of product for delivery storage storage life finish level treated side treatment transfer finished fabric thixotopic clinched-wire through connection transmission line
PCB工程问客中英文对照
PCB工程问客中英文对照1) 线路和铜皮距外形很近，锣板后或V-CUT后会露铜The circuits and copper planes are very close to outline and V-cut. If follow Gerber, the circuits willbe damaged and copper will be exposed after profiling.建议：将线路适当向单元内移动、削减铜皮，确保它们离外形**mm. Suggestion: Move the circuit and shave the copper properly to keep them(**mm) away from outline.2)GERBER异常：xx面发现一些无终止PAD的线，请回复如何制作？We find some circuits without terminated pads on XX side.3)隔离线宽度太小，易造成内层短路In Gerber data the separated line width is 8mils in layer 3. It is so narrow that shorten maybe happened.建议:将第3层8mil的隔离线宽加大到15milSuggestion: For safety we will shave copper to get 15mils clearances between two copper planes to avoid shorten happened.4)方便产线操作,要求取消内层线路独立PADPlease confirm we can remove the isolated pads in inner layers.5)PTH孔线路PAD太小，我司用酸性蚀刻工艺无法制作建议：将PTH孔的PAD加比孔单边大0.2mmrFor better continuity between via pads and holes, we would like to add teardrops to via holes.6)光点脱落In order to protect the fiducial marks in isolated areas from peeling off建议：给独立的Fiducial Mark加保护环Suggestion: we would like to add protective rings to them. Details see the following:7)孔的属性未指定The attributions of holes were not specified.建议:A)做NPTH B:做PTH孔,线路PAD的尺寸和同类孔的PAD的尺寸一样大.8)孔径公差未指定Since the tolerances of hole were not specified.建议:PTH孔按+/-0.08mm ,NPTH按+/-0.05mmSuggestion: We will build them as follows:PTH: +/-0.08mm NPTH:+/-0.05mm. Slot length: +/-0.10mm9)PTH钻在铜皮上，孔边将会露铜Some Non-plated holes drill on the copper planes on xx layer. Copper will be exposed around the holes.建议：将在外层线路掏8mils的clearance，内层线路掏10mils的clearance Suggestion: Shave copper to get 10mils metal clearance in inner layers and 8mils clearance in out layers.10)孔径（外形）公差做不到It is difficult to meet the tolerance of hole to edge(hole to hole; edge to edge)in drawing.要求将孔径公差放宽至+/-XXXFor better control in production, we would like to change the tolerance of hole size from +/-xx to +/-xx.议将外形公差放宽至+/-XXFor better control in production, we would like to change the tolerance of profile from +/-xx to +/-xx.11)VIA孔孔径太大,无法塞孔The size of via hole is so large as to plug them difficulty in production.建议：VIA孔孔径按+0/-1mm控制，做塞孔Suggestion: Control them per xx+0/-0.1mm.12）成品破孔（图*指示的孔距只有**mm，孔到边只有**mm）建议：保证孔与孔(孔到边)的距离有0.3mm13)线路/绿油/字符层上发现2个不同的P/N。
PCB术语中英文对照表
PCB术语中英文对照表下面是一些常见的PCB术语的中英文对照表：1. PCB (Printed Circuit Board) - 印刷电路板2. PWB (Printed Wiring Board) - 印刷布线板3. FR4 (Flame Retardant 4) - 阻燃44. SMT (Surface Mount Technology) - 表面贴装技术5. THT (Through-Hole Technology) - 过孔技术6. BGA (Ball Grid Array) - 球栅阵列7. QFP (Quad Flat Package) - 四边平封装8. DIP (Dual Inline Package) - 双列直插封装9. SMD (Surface Mount Device) - 表面贴装元件10. CEM (Composite Epoxy Material) - 复合环氧材料11. HASL (Hot Air Solder Leveling) - 热空气焊锡平整12. OSP (Organic Solderability Preservatives) - 有机焊接性保护剂13. ENIG (Electroless Nickel Immersion Gold) - 无电镀镍浸金14. OSP (Organic Solderability Preservative) - 有机焊接性保护剂15. DRC (Design Rule Check) - 设计规则检查16. EMI (Electromagnetic Interference) - 电磁干扰17. EMC (Electromagnetic Compatibility) - 电磁兼容性18. NPTH (Non-Plated Through Hole) - 非电镀过孔19. PTH (Plated Through Hole) - 电镀过孔20. RoHS (Restriction of Hazardous Substances) - 有害物质限制21. UL (Underwriters Laboratories) - 美国安全实验室22. IPC (Institute for Interconnecting and Packaging Electronic Circuits) - 集成电路互连与封装协会这些是一些常见的PCB术语，希望对你有帮助！。
pcb中英文术语对照
pcb中英文术语对照A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率电路板门户网，商机无限，资讯最新，问答圈子，社区平台 jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:32:00第3楼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具) flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金)immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位) kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)线路板流程术语中英文对照流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )专业线路板厂ＣＡＭ及ＭＩ工程师培训，热线报名:05廖小姐jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:35:00第5楼PCB综合词汇中英文对照：1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer print ed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark中国新柳电子开发专业PCB线路设计：02(设计基地)() Email: jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:35:00第6楼1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制层覆箔板：mass lamination panel19、层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/pa per ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/pape r ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外专业线路板厂ＣＡＭ及ＭＩ工程师培训，热线报名:05廖小姐jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:36:00第7楼PCB原材料化学用语中英文对照：1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil中国PCB人才网，提供最全面的PCB专业人才信息，.pcbjob.jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:36:00第8楼PCB线路设计词汇中英文对照：1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence中国PCB人才网，提供最全面的PCB专业人才信息，.pcbjob.jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:37:00第9楼PCB线路板其他相关中英文对照：1、主面：primary side2、辅面：secondary side3、支撑面：supporting plane4、信号：signal5、信号导线：signal conductor6、信号地线：signal ground7、信号速率：signal rate8、信号标准化：signal standardization9、信号层：signal layer10、寄生信号：spurious signal11、串扰：crosstalk12、电容：capacitance13、电容耦合：capacitive coupling14、电磁干扰：electromagnetic interference15、电磁屏蔽：electromangetic shielding17、电磁兼容性：electromagnetic compatbility18、特性阻抗：impedance19、阻抗匹配：impedance match20、电感：inductance21、延迟：delay22、微带线：microstrip23、带状线：stripline24、探测点：probe point25、开窗口：cross hatching26、跨距：span27、共面性（度）：coplanarity28、埋入电阻：buried resistance29、黄金板：golden board30、芯板：core board31、薄基芯：thin core32、非均衡传输线：unbalanced transmission line33、阀值：threshold34、极限值：threshold limit value(TLV)35、散热层：heat sink plane36、热隔离：heat sink plane37、导通孔堵塞：via filiing39、卡板：card40、卡板盒/卡板柜：card cages/card racks41、薄型多层板：thin type multilayer board42、埋/盲孔多层板：43、模块：module44、单芯片模块：single chip module (SCM)45、多芯片模块：multichip module (MCM)46、多芯片模块层压基板：laminate substrate version of multichip module (MCM-L)47、多芯片模块瓷基数板：ceramic substrate version o fmultichip module (MCM-C)48、多芯片模块薄膜基板：deposition thin film substrate version of multilayer mod ule (MCM-D)49、嵌入凸块互连技术：buried bump interconnection technology (B2 it)50、自动测试技术：automatic test equipment (ATE)51、芯板导通孔堵塞：core board viafilling52、对准标记：alignment mark53、基准标记：fiducial mark54、拐角标记：corner mark55、剪切标记：crop mark56、铣切标记：routing mark57、对位标记：registration mark58、缩减标记：reduvtion mark59、层间重合度：layer to layer registration60、狗骨结构：dog hone61、热设计：thermal design62、热阻：thermal resistance翱世电子科技，为您提供芯片采购、PCB设计、打样贴片一体化服务！jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:38:00第10楼线路板（PCB）常用度量衡单位术语换算1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美度)翱世电子科技，为您提供芯片采购、PCB设计、打样贴片一体化服务！jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:38:00第11楼PCB外观及功能性测试相关术语1.综合词汇1.1 as received 验收态提交验收的产品尚未经受任何条件处理,在正常大气条件下机械试验时阿状态1.2 production board 成品板符合设计图纸,有关规和采购要求的,并按一个生产批生产出来的任何一块印制板1.3 test board 测试板用相同工艺生产的,用来确定一批印制板可接受性的一种印制板.它能代表该批印制板的质量1.4 test pattern 测试图形用来完成一种测试用的导电图形.图形可以是生产板上的一部分导电图形或特殊设计的专用测试图形,这种测试图形可以放在附连测试板上液可以放在单独的测试板上(coupon)1.5 composite test pattern 综合测试图形两种或两种以上不同测试图形的结合,通常放在测试板上1.6 quality conformance test circuit 质量一致性检验电路在制板包含的一套完整的测试图形,用来确定在制板上的印制板质量的可接受性1.7 test coupon 附连测试板质量一致性检验电路的一部分图形,用于规定的验收检验或一组相关的试验1.8storage life 储存期2外观和尺寸2.1 visual examination 目检用肉眼或按规定的放大倍数对物理特征进行的检查2.2 blister 起泡基材的层间或基材与导电箔之间,基材与保护性涂层间产生局部膨胀而引起局部分离的现象.它是分层的一种形式2.3 blow hole 气孔由于排气而产生的孔洞2.4 bulge 凸起由于部分层或纤维与树脂分离而造成印制板或覆箔板表面隆起的现象2.5 circumferential separation 环形断裂一种裂缝或空洞.它存在于围绕镀覆孔四周的镀层,或围绕引线的焊点,或围绕空心铆钉的焊点,或在焊点和连接盘的界面处2.6 cracking 裂缝金属或非金属层的一种破损现象,它可能一直延伸到底面.2.7 crazing 微裂纹存在于基材的一种现象,在织物交织处,玻璃纤维与树脂分离的现象.表现为基材表面下出现相连的白色斑点或十字纹,通常与机械应力有关2.8 measling 白斑发生在基材部的,在织物交织处,玻璃纤维与树脂分离的现象,表现位在基材表面下出现分散的白色斑点或十字纹,通常与热应力有关2.9 crazing of conformal coating 敷形涂层微裂纹敷形涂层表面和部呈现的细微网状裂纹2.10 delamination 分层绝缘基材的层间,绝缘基材与导电箔或多层板任何层间分离的现象。
PCB常见工程咨询中英文对照总结
常见工程咨询中英文对照问题：客户未告知采用什么标准进行制作与检查。
建议：我们按IPC-6012B Class2与IPC-A-600G Class2 做。
Question 1: Customer doesn’t tell us what standards we should take to manufacture and inspect.Suggestion: We will follow IPC-6012B Class2 &IPC-A-600G Class2.问题：客户未告知板料类型。
建议：我们将使用FR4．Question: Customer doesn’t tell us material type.Suggestion: We will use FR4.six -layer board., it’s hard to control for us.问题：客户未规定使用何种类型的阻焊油及颜色。
建议: 我们采用普通感光绿色湿油.Question: Customer doesn’t specify solder mask type and color.Suggestion: We use normal green LPI.问题：客户未指定UL 标记与Date code加于何处及以何种方式显示。
建议：见下图，我们将其加于TOP面，以白字显示。
Question: Customer doesn’t specify where and by what display form we should add UL logo and date code.Suggestion: See below picture, we add them on top side and display them by silk letters.问题：客户要求线路表面油厚为30um min，线路拐角位为20um min，此要求太高。
PCB专业术语中英文汇总
中文
代码
英文名称
图形电镀去膜
SAP
Stripping after Pattern Plating
退锡
TSR
Tin Stripping
蚀刻/退锡
ETS
Etching, Tin Stripping
去膜/蚀刻/退锡
SES
DF Stripping, Etching, Tin Stripping
AOI：AOI
中文
代码
英文名称
外层离线AOI
OOA
Outer Offline AOI
外层AOI
OAO
Outer AOI
层间对准度测试1
QRE1
IPQC for Registration 1
外层VRS
OVR
Outer VRS
MASKAOI
MAO
Mask AOI
填孔AOI
SAO
Solid Via Filling Plating AOI
减铜干膜曝光
DER
D/F Exposuring before Copper Reduction
减铜干膜显影
DDR
D/F Development before Copper Reduction
减铜干膜LDI
DDC
D/F Laser Direct Image before Copper Reduction
脉冲全板电镀
PPP
Pulse Panel Plating
POFV沉铜
PBP
PTH before POFV
POFV电镀
POFV
Plate over Filling Via
全板电镀
PCB术语中英文对照表
Adhesion 附着力Annular Ring 孔环AOI（automatic optical inspection）自动光学检测AQL（acceptable quality level）可接受的质量等级B²；it(buried bump interconnection technology) 埋入凸块焊点互连技术BBH(buried blind hole）埋盲孔BGA（ball grid array）球栅阵列Blister 起泡Board Edges 板边Burr 毛头/毛刺BUM(Build-up multilayer）积层式多层板BVH（buried/blind via hole）埋/盲导通孔CAD（computer aided design) 计算机辅助设计CAM(computer aided manufacturing) 计算机辅助制造Carbon oil 碳油CEM(composite epoxy material) 环氧树脂复合板材chamfer 倒角Characteristic impedance 特性阻抗CNC(computerized numerical control）计算机化数字控制Conductor Crack 导体破裂Conductor Spacing 导线间距connector 连接器Copper foil 铜箔（皮）Crazing 微裂纹（白斑)Delamination 分层Dewetting 半润湿（缩锡)DFM（design for manufacturing）可制造性设计DIP（dual in-line package）双列直插式组件Dk(dielectric constant）介电常数DRC(design rule checking) 设计规则检查drawing 图纸ECN（engineering change notice) 工程更改通知ECO(engineering change order) 工程更改指令E glass 电子级玻璃entek OSP处理Epoxy resin 环氧树脂ESD(electrostatic discharge) 静电释放Etched Marking 蚀刻标记Flatness 翘曲度Foreign Inclusion 外来夹杂物Flame resistant 阻燃性FR—2(flame-retardant 2)耐燃酚醛纸基板FR—3(flame-retardant 3）耐燃环氧纸基板FR-4（flame—retardant 4) 耐燃环氧玻璃布基板FR-5（flame-retardant 5）耐燃多功能环氧玻璃布基板ground 地面（层）Haloing 晕圈HDI（high density interconnection）高密度互连技术HASL(hot air solder leveling）热风焊料整平(整平)IC(integrated circuits) 集成电路Ink Stamped Marking 盖印标记Insulation resistance 绝缘电阻Ion cleanliness 离子清洁度IPC（the institute for interconnecting and packaging of electronic circuits）印制电路互连与封装协会ISO（International organization for standardization）国际标准化组织Laminate Voids 压合空洞laser 激光LDI（laser direct imaging）激光直接成像legend 文字标记、符号Lifted Lands 焊盘浮起logo 标志LPI(liquid photoimageable) 液态感光成像LPISM（liquid photoimageable solder mask）液态感光阻焊膜marking 标记Measling 白斑Microvoids 微坑mil 密耳（千分之一英寸）MIL-STD（military standard) 美国军用标准Negative Etchback 欠蚀Nicks 缺口Nodules 镀镏Nonwetting 不润湿(拒锡）open 开路OSP（organic solderability preservatives) 表面抗氧化oxides 氧化物pad 焊盘panel 拼板pattern 板面图形PCB（printed circuit board) 印制电路板Pcs（pieces) 件、片、只Peeling 剥落pinhole 针孔Pink Ring 粉红圈Pits 凹坑pitch 中心距Plating Voids 镀层破洞plug 塞Positive Etchback 过蚀power 电源层prepreg 半固化片PTFE（polytetrafluoroethylene）聚四氟乙烯PTH(plated through-hole) 金属化孔PWB(printed—wiring board）印制线路板Registration 对准QA（quality assurance）质量保证QC（quality control）质量控制QE（quality engineering）质量工程QFP（quad flat package) 方形扁平组件repair 修理RCC(resin coated copper）已涂覆树脂的铜箔Reference dimension 参考尺寸registration 对准度resin 树脂rejection 拒收revision 修订版RF(radio frequency）射频Ripples 纹路rout 外形铣scratch 划伤Screened Marking 纲印标记scoring 刻槽short 短路signal 信号Silk screen 丝网Skip Coverage 漏印slot 开槽SMD（surface mount device) 表面安装器件SMOBC（solder mask over bare copper）裸铜覆盖阻焊膜SMT（surface mount technology）表面安装技术smear 毛刺solder 焊锡S/M（solder mask）绿油solderability 可焊性Soda Strawing (汽水)吸管式浮空SPC（statistical process control）统计过程控制spacing 间距Tape test 胶带实验TCE(thermal coefficient of expansion）热胀系数TDR（time-domain reflectometry）时域反射测试tolerance 公差Tenting 盖孔Texture Condition 显布纹Tg(glass transition temperature) 玻璃软化温度THT（through hole technology) 通孔（插装）技术trace 线路(条）UL（underwriters laboratories）安全实验所NPTH 非金属化孔UV(ultraviolet）紫外线辐射v-cut V刻Via hole 导通孔（过线孔）void 空洞warp 板弯Waves 波浪Weave Exposure 露织物wetting 沾锡Wicking 灯芯效应（渗铜）Wrinkles 起皱五、形状与尺寸：1、导线（通道）：conduction （track）2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：rectangle pad11、子弹形盘:bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘:v-shaped pad15、环形盘：annular pad16、非圆形盘:non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back—bard land21、盘址：anchoring spaur22、连接盘图形:land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh）36、全部钻孔:all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔:interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated—through hole44、准尺寸孔:dimensioned hole45、在连接盘中导通孔：via-in—pad46、孔位：hole location47、孔密度:hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图:printed board assembly drawing52、参考基准:datum referance。
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常见工程咨询中英文对照问题：客户未告知采用什么标准进行制作与检查。
建议：我们按IPC-6012B Class2与IPC-A-600G Class2 做。
Question 1: Customer doesn’t tell us what standards we should take to manufacture and inspect. Suggestion: We will follow IPC-6012B Class2 &IPC-A-600G Class2.问题：客户未告知板料类型。
建议：我们将使用FR4．Question: Customer doesn’t tell us material type.Suggestion: We will use FR4.问题：客户要求成品厚度为1.60+/-0.10mm，此公差对六层板而言太紧，难以控制。
建议: 将公差放松到+/-0.15mm.Question: Customer requires “1.60+/-0.10mm” finished board thickness, the tolerance is too tight for six -layer board., it’s hard to control for us.Suggestion: Relax the tolerance to be +/-0.15mm.问题：客户未规定使用何种类型的阻焊油及颜色。
建议: 我们采用普通感光绿色湿油.Question: Customer doesn’t specify solder mask type and color.Suggestion: We use normal green LPI.问题：客户未指定UL 标记与Date code加于何处及以何种方式显示。
建议：见下图，我们将其加于TOP面，以白字显示。
Question: Customer doesn’t specify where and by what display form we should add UL logo and date code.Suggestion: See below picture, we add them on top side and display them by silk letters.问题：客户要求线路表面油厚为30um min，线路拐角位为20um min，此要求太高。
建议: 线路油表面厚与线路拐角位油厚分别放松到15um min 与10um min.Question: Solder mask is required to be 30um min over line and 20um min at corners, it’s too strict. Suggestion: Relax it to be 15um min over line and 10um min at corners,问题：客户未规定镍金厚度要求。
建议：我们按镍厚2.54um min,金厚0.03—0.08um制作.Question: Customer doesn’t specify thickness of Ni and gold.Suggestion: Ni: 2.54um min and gold: 0.03---0.08um.问题：客户未清楚指明层序。
建议：层序为：Question: Customer doesn’t indicate layer sequence.Suggestion: Layer sequence is问题：客户未规定压板结构。
建议：按下图所示做。
Question: Customer doesn’t specify lay-up structure.Suggestion: Follow below picture to do.问题：客户未规定如何对电测试OK的板加注标记。
建议：A）板边划一条黑线。
B）板内盖白色的T印。
Question: Customer doesn’t specify how to take a mark for “E-Test OK” board.Suggestion: A) Mark a black line at edge-board.B) Take a white stamp on board.问题：客户未指定V-CUT标准。
建议：V-CUT角度为30°±5°，余厚为0.40+/-0.10mm。
Question: Customer doesn’t specify V-cut standard.Suggestion: V-cut angle: 30°±5°, residue thickness: 0.40+/-0.10mm。
问题：客户未指明斜边标准。
建议：按下图所示制作。
Question: Customer doesn’t specify bevel standard.Suggestion: Follow below picture to do.问题：请看下图，成品板四个角为直角，运输与包装过程中易造成板间擦伤。
建议：A）将直角改成R1.0mm的圆角。
B）不能更改。
Question: See below picture, four outer corners are rectangular, sharp corners will bring scratching between boards during transportation and packaging.Suggestion: A) Change the rectangular corners into R1.0mm ones.B) Take no change.问题：板上P/N为ABCD，但客户资料上为EFG。
建议：A）将板上的P/N改为EFG.B）将文件资料上的P/N改为ABCD。
C）不予理会。
Question: Part number is ABCD on board, but EFG in documents.Suggestion: A) change ABCD into EFG on board.B) change EFG into ABCD in documents.C) Let them be.问题：客户资料上版本为REV. A，但板上为REV.B。
建议：A）将板上版本改为REV. A。
B）将资料上版本改为REV. B.C）不需做任何更改，允许版本不一致。
Question: Reversion No. is A in documents, but B on board.Suggestion: A) Change A into B on board.B) Change B into A in documents.C) Not take any change, let them be.钻孔部分问题：客户未规定孔径公差。
建议：VIA Hole：+0.08/-0.40mm PTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。
Question: Customer doesn’t specify tolerances for holes.Suggestion: VIA Hole：+0.08/-0.40mm PTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm，length+/-0.10mm。
问题：客供图纸上“A”处数据与“B”处数据相矛盾，请看下图。
建议：a）按“A”处数据做。
b）按“B”处数据做。
Question: See below picture, the data marked “A” is conflict with “B” on the mechanical drawing.Suggestion: a) Follow the data marked “A” to do.b) Foll ow the data marked “B” to do.问题：见下图，图纸上“A”处数据公差+/-0.05mm，超我司能力。
建议：将其放松到+/-0.10mm。
Question: See below picture, the tolerance(+/-0.05mm) marked “A” is out of our capability.Suggestion: Relax it to be +/-0.10MM.问题：图纸上“A”处数据为100.25mm（请看下图），Gerber中此处实测数据为100.34mm。
建议：a）按图纸做。
b）按Gerber做。
Question: See below picture, the data marked “A” is 100.25mm on drawing, but the factualvalue is 100.34mm in Gerber.Suggestion: a) Follow drawing to do.b) Follow Gerber to do.问题：请看下图，红色圆圈圈住的Slot宽度为0.65mm，长度为12mm。
由于长度比较长，不宜钻出。
如果锣出，其宽度又比最小锣刀的直径（0.8mm）还小，也无法锣出。
建议：将Slot宽度改为0.80mm以便锣出。
Question: See below picture, the slot (which is marked with red circle) size is 0.65mmX12mm. As the slot is very long, we have to rout it out, but our smallest rout bit is 0.8mm, it’s impossible to rout the slot out yet.Suggestion: Change the slot width into 0.8mm.问题：请看下图，一个0.86mm的孔与一个1.23mm的孔相互重叠。
建议：A）删去0.86mm的孔。
B）删去1.23mm的孔。
Question: See below picture, one 0.86mm hole overlaps another 1.23mm hole.Suggestion: A) Delete 0.86mm hole.B) Delete 1.23mm hole.问题：请看下图，两个相同大小的孔部分重叠。