单片机Sensor-technology传感器技术大学毕业论文外文文献翻译及原文
红外传感器论文中英文资料对照外文翻译
中英文资料对照外文翻译外文资料Moving Object Counting with an Infrared Sensor NetworkBy KI, Chi KeungAbstractWireless Sensor Network (WSN) has become a hot research topic recently. Great benefit can be gained through the deployment of the WSN over a wide range of applications, covering the domains of commercial, military as well as residential. In this project, we design a counting system which tracks people who pass through a detecting zone as well as the corresponding moving directions. Such a system can be deployed in traffic control, resource management, and human flow control. Our design is based on our self-made cost-effective Infrared Sensing Module board which co-operates with a WSN. The design of our system includes Infrared Sensing Module design, sensor clustering, node communication, system architecture and deployment. We conduct a series of experiments to evaluate the system performance which demonstrates the efficiency of our Moving Object Counting system.Keywords:Infrared radiation，Wireless Sensor Node1.1 Introduction to InfraredInfrared radiation is a part of the electromagnetic radiation with a wavelength lying between visible light and radio waves. Infrared have be widely used nowadays including data communications, night vision, object tracking and so on. People commonly use infrared in data communication, since it is easily generated and only suffers little from electromagnetic interference. Take the TV remote control as an example, which can be found in everyone's home. The infrared remote control systems use infrared light-emitting diodes (LEDs) to send out an IR (infrared) signal when the button is pushed. A different pattern of pulses indicates the corresponding button being pushed. To allow the control of multiple appliances such as a TV, VCR, and cable box, without interference, systems generally have a preamble and an address to synchronize the receiver and identify the source and location of the infrared signal. To encode the data, systems generally vary the width of the pulses (pulse-width modulation) or the width of the spaces between the pulses (pulse space modulation). Another popular system, bi-phase encoding, uses signal transitions to convey information. Each pulse is actually a burst of IR at the carrier frequency. A 'high' means a burst of IR energy at the carrier frequency and a 'low' represents an absence of IR energy. There is no encoding standard. However, while a great many home entertainment devices use their own proprietary encoding schemes, somequasi-standards do exist. These include RC-5, RC-6, and REC-80. In addition, many manufacturers, such as NEC, have also established their own standards.Wireless Sensor Network (WSN) has become a hot research topic recently. Great benefit can be gained through the deployment of the WSN over a wide range of applications, covering the domains of commercial, military as well as residential. In this project, we design a counting system which tracks people who pass through a detecting zone as well as the corresponding moving directions. Such a system can be deployed in traffic control, resource management, and human flow control. Our design is based on our self-made cost-effective Infrared Sensing Module board which co-operates with a WSN. The design of our system includes Infrared Sensing Module design, sensor clustering, node communication, system architecture and deployment. We conduct a series of experiments to evaluate the system performance which demonstrates the efficiency of our Moving Object Counting system.1.2 Wireless sensor networkWireless sensor network (WSN) is a wireless network which consists of a vast number of autonomous sensor nodes using sensors to monitor physical or environmental conditions, such as temperature, acoustics, vibration, pressure, motion or pollutants, at different locations. Each node in a sensor network is typically equipped with a wireless communications device, a small microcontroller, one or more sensors, and an energy source, usually a battery. The size of a single sensor node can be as large as a shoebox and can be as small as the size of a grain of dust, depending on different applications. The cost of sensor nodes is similarly variable, ranging from hundreds of dollars to a few cents, depending on the size of the sensor network and the complexity requirement of the individual sensor nodes. The size and cost are constrained by sensor nodes, therefore, have result in corresponding limitations on available inputs such as energy, memory, computational speed and bandwidth. The development of wireless sensor networks (WSN) was originally motivated by military applications such as battlefield surveillance. Due to the advancement in micro-electronic mechanical system technology (MEMS), embedded microprocessors, and wireless networking, the WSN can be benefited in many civilian application areas, including habitat monitoring, healthcare applications, and home automation.1.3 Types of Wireless Sensor NetworksWireless sensor network nodes are typically less complex than general-purpose operating systems both because of the special requirements of sensor network applications and the resource constraints in sensor network hardware platforms. The operating system does not need to include support for user interfaces. Furthermore, the resource constraints in terms of memory and memory mapping hardware support make mechanisms such as virtual memory either unnecessary or impossible to implement. TinyOS [TinyOS] is possibly the first operating system specifically designed for wireless sensor networks. Unlike most other operating systems, TinyOS is based on an event-driven programming model instead of multithreading. TinyOS programs are composed into event handlers and tasks with run to completion-semantics. When an external event occurs, such as an incomingdata packet or a sensor reading, TinyOS calls the appropriate event handler to handle the event. The TinyOS system and programs are both written in a special programming language called nesC [nesC] which is an extension to the C programming language. NesC is designed to detect race conditions between tasks and event handlers. There are also operating systems that allow programming in C. Examples of such operating systems include Contiki [Contiki], and MANTIS. Contiki is designed to support loading modules over the network and supports run-time loading of standard ELF files. The Contiki kernel is event-driven, like TinyOS, but the system supports multithreading on a per-application basis. Unlike the event-driven Contiki kernel, the MANTIS kernel is based on preemptive multithreading. With preemptive multithreading, applications do not need to explicitly yield the microprocessor to other processes.1.4 Introduction to Wireless Sensor NodeA sensor node, also known as a mote, is a node in a wireless sensor network that is capable of performing processing, gathering sensory information and communicating with other connected nodes in the network. Sensor node should be in small size, consuming extremely low energy, autonomous and operate unattended, and adaptive to the environment. As wireless sensor nodes are micro-electronic sensor device, they can only be equipped with a limited power source. The main components of a sensor node include sensors, microcontroller, transceiver, and power source. Sensors are hardware devices that can produce measurable response to a change in a physical condition such as light density and sound density. The continuous analog signal collected by the sensors is digitized by Analog-to-Digital converter. The digitized signal is then passed to controllers for further processing. Most of the theoretical work on WSNs considers Passive and Omni directional sensors. Passive and Omni directional sensors sense the data without actually manipulating the environmen t with active probing, while no notion of “direction” involved in these measurements. Commonly people deploy sensor for detecting heat (e.g. thermal sensor), light (e.g. infrared sensor), ultra sound (e.g. ultrasonic sensor), or electromagnetism (e.g. magnetic sensor). In practice, a sensor node can equip with more than one sensor. Microcontroller performs tasks, processes data and controls the operations of other components in the sensor node. The sensor node is responsible for the signal processing upon the detection of the physical events as needed or on demand. It handles the interruption from the transceiver. In addition, it deals with the internal behavior, such as application-specific computation.The function of both transmitter and receiver are combined into a single device know as transceivers that are used in sensor nodes. Transceivers allow a sensor node to exchange information between the neighboring sensors and the sink node (a central receiver). The operational states of a transceiver are Transmit, Receive, Idle and Sleep. Power is stored either in the batteries or the capacitors. Batteries are the main source of power supply for the sensor nodes. Two types of batteries used are chargeable and non-rechargeable. They are also classified according to electrochemical material used for electrode such as NiCd(nickel-cadmium), NiZn(nickel-zinc), Nimh(nickel metal hydride), and Lithium-Ion. Current sensors are developed which are able to renewtheir energy from solar to vibration energy. Two major power saving policies used are Dynamic Power Management (DPM) and Dynamic V oltage Scaling (DVS). DPM takes care of shutting down parts of sensor node which are not currently used or active. DVS scheme varies the power levels depending on the non-deterministic workload. By varying the voltage along with the frequency, it is possible to obtain quadratic reduction in power consumption.1.5 ChallengesThe major challenges in the design and implementation of the wireless sensor network are mainly the energy limitation, hardware limitation and the area of coverage. Energy is the scarcest resource of WSN nodes, and it determines the lifetime of WSNs. WSNs are meant to be deployed in large numbers in various environments, including remote and hostile regions, with ad-hoc communications as key. For this reason, algorithms and protocols need to be lifetime maximization, robustness and fault tolerance and self-configuration. The challenge in hardware is to produce low cost and tiny sensor nodes. With respect to these objectives, current sensor nodes usually have limited computational capability and memory space. Consequently, the application software and algorithms in WSN should be well-optimized and condensed. In order to maximize the coverage area with a high stability and robustness of each signal node, multi-hop communication with low power consumption is preferred. Furthermore, to deal with the large network size, the designed protocol for a large scale WSN must be distributed.1.6 Research IssuesResearchers are interested in various areas of wireless sensor network, which include the design, implementation, and operation. These include hardware, software and middleware, which means primitives between the software and the hardware. As the WSNs are generally deployed in the resources-constrained environments with battery operated node, the researchers are mainly focus on the issues of energy optimization, coverage areas improvement, errors reduction, sensor network application, data security, sensor node mobility, and data packet routing algorithm among the sensors. In literature, a large group of researchers devoted a great amount of effort in the WSN. They focused in various areas, including physical property, sensor training, security through intelligent node cooperation, medium access, sensor coverage with random and deterministic placement, object locating and tracking, sensor location determination, addressing, energy efficient broadcasting and active scheduling, energy conserved routing, connectivity, data dissemination and gathering, sensor centric quality of routing, topology control and maintenance, etc.中文译文移动目标点数与红外传感器网络作者KI, Chi Keung摘要无线传感器网络(WSN)已成为最近的一个研究热点。
单片机 英文参考文献 翻译
天津科技大学毕业生外文资料翻译姓名:学院：电子信息与自动化学院专业：测控技术与仪器一．英文原文Progress in ComputersPrestige Lecture delivered to IEE, Cambridge, on 5 February 2009Maurice WilkesThe first stored program computers began to work around 1950. The one we built in Cambridge, the EDSAC was first used in the summer of 1949.These early experimental computers were built by people like myself with varying backgrounds. We all had extensive experience in electronic engineering and were confident that that experience would stand us in good stead. This proved true, although we had some new things to learn. The most important of these was that transients must be treated correctly; what would cause a harmless flash on the screen of a television set could lead to a serious error in a computer.As far as computing circuits were concerned, we found ourselves with an embarass de richess. For example, we could use vacuum tube diodes for gates as we did in the EDSAC or pentodes with control signals on both grids, a system widely used elsewhere. This sort of choice persisted and the term families of logic came into use. Those who have worked in the computer field will remember TTL, ECL and CMOS. Of these, CMOS has now become dominant.In those early years, the IEE was still dominated by power engineering and we had to fight a number of major battles in order to get radio engineering along with the rapidly developing subject of electronics.dubbed in the IEE light current electrical engineering.properly recognised as an activity in its own right. I remember that we had some difficulty in organising a conference because the power engineers’ ways of doing things were not our ways. A minor source of irritation was that all IEE published papers were expected to start with a lengthy statement of earlier practice, something difficult to do when there was no earlier practice Consolidation in the 1960sBy the late 50s or early 1960s, the heroic pioneering stage was over and the computer field was starting up in real earnest. The number of computers in the world had increased and they were much more reliable than the very early ones . To those years we can ascribe the first steps in high level languages and the firstoperating systems. Experimental time-sharing was beginning, and ultimately computer graphics was to come along.Above all, transistors began to replace vacuum tubes. This change presented a formidable challenge to the engineers of the day. They had to forget what they knew about circuits and start again. It can only be said that they measured up superbly well to the challenge and that the change could not have gone more smoothly.Soon it was found possible to put more than one transistor on the same bit of silicon, and this was the beginning of integrated circuits. As time went on, a sufficient level of integration was reached for one chip to accommodate enough transistors for a small number of gates or flip flops. This led to a range of chips known as the 7400 series. The gates and flip flops were independent of one another and each had its own pins. They could be connected by off-chip wiring to make a computer or anything else.These chips made a new kind of computer possible. It was called a minicomputer. It was something less that a mainframe, but still very powerful, and much more affordable. Instead of having one expensive mainframe for the whole organisation, a business or a university was able to have a minicomputer for each major department.Before long minicomputers began to spread and become more powerful. The world was hungry for computing power and it had been very frustrating for industry not to be able to supply it on the scale required and at a reasonable cost. Minicomputers transformed the situation.The fall in the cost of computing did not start with the minicomputer; it had always been that way. This was what I meant when I referred in my abstract to inflation in the computer industry ‘going the other way’. As time goes on people get more for their money, not less.Research in Computer Hardware.The time that I am describing was a wonderful one for research in computer hardware. The user of the 7400 series could work at the gate and flip-flop level and yet the overall level of integration was sufficient to give a degree of reliability far above that of discreet transistors. The researcher, in a university or elsewhere, could build any digital device that a fertile imagination could conjure up. In the Computer Laboratory we built the Cambridge CAP, a full-scale minicomputer with fancy capability logic.The 7400 series was still going strong in the mid 1970s and was used for the Cambridge Ring, a pioneering wide-band local area network. Publication of the design study for the Ring came just before the announcement of the Ethernet. Until these two systems appeared, users had mostly been content with teletype-based local area networks.Rings need high reliability because, as the pulses go repeatedly round the ring, they must be continually amplified and regenerated. It was the high reliability provided by the 7400 series of chips that gave us the courage needed to embark on the project for the Cambridge Ring.The RISC Movement and Its AftermathEarly computers had simple instruction sets. As time went on designers of commercially available machines added additional features which they thought would improve performance. Few comparative measurements were done and on the whole the choice of features depended upon the designer’s intuition.In 1980, the RISC movement that was to change all this broke on the world. The movement opened with a paper by Patterson and Ditzel entitled The Case for the Reduced Instructions Set Computer.Apart from leading to a striking acronym, this title conveys little of the insights into instruction set design which went with the RISC movement, in particular the way it facilitated pipelining, a system whereby several instructions may be in different stages of execution within the processor at the same time. Pipelining was not new, but it was new for small computers The RISC movement benefited greatly from methods which had recently become available for estimating the performance to be expected from a computer design without actually implementing it. I refer to the use of a powerful existing computer to simulate the new design. By the use of simulation, RISC advocates were able to predict with some confidence that a good RISC design would be able to out-perform the best conventional computers using the same circuit technology. This prediction was ultimately born out in practice.Simulation made rapid progress and soon came into universal use by computer designers. In consequence, computer design has become more of a science and less of an art. Today, designers expect to have a roomful of, computers available to do their simulations, not just one. They refer to such a roomful by the attractive name of computer farm.The x86 Instruction SetLittle is now heard of pre-RISC instruction sets with one major exception, namely that of the Intel 8086 and its progeny, collectively referred to as x86. This has become the dominant instruction set and the RISC instruction sets that originally had a considerable measure of success are having to put up a hard fight for survival.This dominance of x86 disappoints people like myself who come from the research wings.both academic and industrial.of the computer field. No doubt, business considerations have a lot to do with the survival of x86, but there are other reasons as well. However much we research oriented people would like to think otherwise. high level languages have not yet eliminated the use of machine code altogether. We need to keep reminding ourselves that there is much to be said for strict binary compatibility with previous usage when that can be attained. Nevertheless, things might have been different if Intel’s major attempt to produce a good RISC chip had been more successful. I am referring to the i860 (not the i960, which was something different). In many ways the i860 was an excellent chip, but its software interface did not fit it to be used in a workstation.There is an interesting sting in the tail of this apparently easy triumph of the x86 instruction set. It proved impossible to match the steadily increasing speed of RISC processors by direct implementation of the x86 instruction set as had been done in the past. Instead, designers took a leaf out of the RISC book; although it is not obvious, on the surface, a modern x86 processor chip contains hidden within it a RISC-style processor with its own internal RISC coding. The incoming x86 code is, after suitable massaging, converted into this internal code and handed over to the RISC processor where the critical execution is performed.In this summing up of the RISC movement, I rely heavily on the latest edition of Hennessy and Patterson’s books on computer design as my supporting authority; see in particular Computer Architecture, third edition, 2003, pp 146, 151-4, 157-8.The IA-64 instruction set.Some time ago, Intel and Hewlett-Packard introduced the IA-64 instruction set. This was primarily intended to meet a generally recognised need for a 64 bit address space. In this, it followed the lead of the designers of the MIPS R4000 and Alpha. However one would have thought that Intel would have stressed compatibility with the x86; the puzzle is that they did the exact opposite.Moreover, built into the design of IA-64 is a feature known as predicationwhich makes it incompatible in a major way with all other instruction sets. In particular, it needs 6 extra bits with each instruction. This upsets the traditional balance between instruction word length and information content, and it changes significantly the brief of the compiler writer.In spite of having an entirely new instruction set, Intel made the puzzling claim that chips based on IA-64 would be compatible with earlier x86 chips. It was hard to see exactly what was meant.Chips for the latest IA-64 processor, namely, the Itanium, appear to have special hardware for compatibility. Even so, x86 code runs very slowly.Because of the above complications, implementation of IA-64 requires a larger chip than is required for more conventional instruction sets. This in turn implies a higher cost. Such at any rate, is the received wisdom, and, as a general principle, it was repeated as such by Gordon Moore when he visited Cambridge recently to open the Betty and Gordon Moore Library. I have, however, heard it said that the matter appears differently from within Intel. This I do not understand. But I am very ready to admit that I am completely out of my depth as regards the economics of the semiconductor industry.AMD have defined a 64 bit instruction set that is more compatible with x86 and they appear to be making headway with it. The chip is not a particularly large one. Some people think that this is what Intel should have done. [Since the lecture was delivered, Intel have announced that they will market a range of chips essentially compatible with those offered by AMD.]The Relentless Drive towards Smaller TransistorsThe scale of integration continued to increase. This was achieved by shrinking the original transistors so that more could be put on a chip. Moreover, the laws of physics were on the side of the manufacturers. The transistors also got faster, simply by getting smaller. It was therefore possible to have, at the same time, both high density and high speed.There was a further advantage. Chips are made on discs of silicon, known as wafers. Each wafer has on it a large number of individual chips, which are processed together and later separated. Since shrinkage makes it possible to get more chips on a wafer, the cost per chip goes down.Falling unit cost was important to the industry because, if the latest chips are cheaper to make as well as faster, there is no reason to go on offering the old ones, at least not indefinitely. There can thus be one product for the entiremarket.However, detailed cost calculations showed that, in order to maintain this advantage as shrinkage proceeded beyond a certain point, it would be necessary to move to larger wafers. The increase in the size of wafers was no small matter. Originally, wafers were one or two inches in diameter, and by 2000 they were as much as twelve inches. At first, it puzzled me that, when shrinkage presented so many other problems, the industry should make things harder for itself by going to larger wafers. I now see that reducing unit cost was just as important to the industry as increasing the number of transistors on a chip, and that this justified the additional investment in foundries and the increased risk.The degree of integration is measured by the feature size, which, for a given technology, is best defined as the half the distance between wires in the densest chips made in that technology. At the present time, production of 90 nm chips is still building upSuspension of LawIn March 1997, Gordon Moore was a guest speaker at the celebrations of the centenary of the discovery of the electron held at the Cavendish Laboratory. It was during the course of his lecture that I first heard the fact that you can have silicon chips that are both fast and low in cost described as a violation of Murphy’s law.or Sod’s law as it is usually called in the UK. Moore said that experience in other fields would lead you to expect to have to choose between speed and cost, or to compromise between them. In fact, in the case of silicon chips, it is possible to have both.In a reference book available on the web, Murphy is identified as an engineer working on human acceleration tests for the US Air Force in 1949. However, we were perfectly familiar with the law in my student days, when we called it by a much more prosaic name than either of those mentioned above, namely, the Law of General Cussedness. We even had a mock examination question in which the law featured. It was the type of question in which the first part asks for a definition of some law or principle and the second part contains a problem to be solved with the aid of it. In our case the first part was to define the Law of General Cussedness and the second was the problem;A cyclist sets out on a circular cycling tour. Derive an equation giving the direction of the wind at any time.The single-chip computerAt each shrinkage the number of chips was reduced and there were fewer wiresgoing from one chip to another. This led to an additional increment in overall speed, since the transmission of signals from one chip to another takes a long time.Eventually, shrinkage proceeded to the point at which the whole processor except for the caches could be put on one chip. This enabled a workstation to be built that out-performed the fastest minicomputer of the day, and the result was to kill the minicomputer stone dead. As we all know, this had severe consequences for the computer industry and for the people working in it.From the above time the high density CMOS silicon chip was Cock of the Roost. Shrinkage went on until millions of transistors could be put on a single chip and the speed went up in proportion.Processor designers began to experiment with new architectural features designed to give extra speed. One very successful experiment concerned methods for predicting the way program branches would go. It was a surprise to me how successful this was. It led to a significant speeding up of program execution and other forms of prediction followedEqually surprising is what it has been found possible to put on a single chip computer by way of advanced features. For example, features that had been developed for the IBM Model 91.the giant computer at the top of the System 360 range.are now to be found on microcomputersMurphy’s Law remained in a state of suspension. No longer did it make sense to build experimental computers out of chips with a small scale of integration, such as that provided by the 7400 series. People who wanted to do hardware research at the circuit level had no option but to design chips and seek for ways to get them made. For a time, this was possible, if not easyUnfortunately, there has since been a dramatic increase in the cost of making chips, mainly because of the increased cost of making masks for lithography, a photographic process used in the manufacture of chips. It has, in consequence, again become very difficult to finance the making of research chips, and this is a currently cause for some concern.The Semiconductor Road MapThe extensive research and development work underlying the above advances has been made possible by a remarkable cooperative effort on the part of the international semiconductor industry.At one time US monopoly laws would probably have made it illegal for UScompanies to participate in such an effort. However about 1980 significant and far reaching changes took place in the laws. The concept of pre-competitive research was introduced. Companies can now collaborate at the pre-competitive stage and later go on to develop products of their own in the regular competitive manner.The agent by which the pre-competitive research in the semi-conductor industry is managed is known as the Semiconductor Industry Association (SIA). This has been active as a US organisation since 1992 and it became international in 1998. Membership is open to any organisation that can contribute to the research effort.Every two years SIA produces a new version of a document known as the International Technological Roadmap for Semiconductors (ITRS), with an update in the intermediate years. The first volume bearing the title ‘Roadmap’ was issued in 1994 but two reports, written in 1992 and distributed in 1993, are regarded as the true beginning of the series.Successive roadmaps aim at providing the best available industrial consensus on the way that the industry should move forward. They set out in great detail.over a 15 year horizon. the targets that must be achieved if the number of components on a chip is to be doubled every eighteen months.that is, if Moore’s law is to be maintained.-and if the cost per chip is to fall.In the case of some items, the way ahead is clear. In others, manufacturing problems are foreseen and solutions to them are known, although not yet fully worked out; these areas are coloured yellow in the tables. Areas for which problems are foreseen, but for which no manufacturable solutions are known, are coloured red. Red areas are referred to as Red Brick Walls.The targets set out in the Roadmaps have proved realistic as well as challenging, and the progress of the industry as a whole has followed the Roadmaps closely. This is a remarkable achievement and it may be said that the merits of cooperation and competition have been combined in an admirable manner.It is to be noted that the major strategic decisions affecting the progress of the industry have been taken at the pre-competitive level in relative openness, rather than behind closed doors. These include the progression to larger wafers.By 1995, I had begun to wonder exactly what would happen when the inevitable point was reached at which it became impossible to make transistors any smaller. My enquiries led me to visit ARPA headquarters in Washington DC, where I was given a copy of the recently produced Roadmap for 1994. This made it plain that seriousproblems would arise when a feature size of 100 nm was reached, an event projected to happen in 2007, with 70 nm following in 2010. The year for which the coming of 100 nm (or rather 90 nm) was projected was in later Roadmaps moved forward to 2004 and in the event the industry got there a little sooner.I presented the above information from the 1994 Roadmap, along with such other information that I could obtain, in a lecture to the IEE in London, entitled The CMOS end-point and related topics in Computing and delivered on 8 February 1996.The idea that I then had was that the end would be a direct consequence of the number of electrons available to represent a one being reduced from thousands to a few hundred. At this point statistical fluctuations would become troublesome, and thereafter the circuits would either fail to work, or if they did work would not be any faster. In fact the physical limitations that are now beginning to make themselves felt do not arise through shortage of electrons, but because the insulating layers on the chip have become so thin that leakage due to quantum mechanical tunnelling has become troublesome.There are many problems facing the chip manufacturer other than those that arise from fundamental physics, especially problems with lithography. In an update to the 2001 Roadmap published in 2002, it was stated that the continuation of progress at present rate will be at risk as we approach 2005 when the roadmap projects that progress will stall without research break-throughs in most technical areas “. This was the most specific statement about the Red Brick Wall, that had so far come from the SIA and it was a strong one. The 2003 Roadmap reinforces this statement by showing many areas marked red, indicating the existence of problems for which no manufacturable solutions are known.It is satisfactory to report that, so far, timely solutions have been found to all the problems encountered. The Roadmap is a remarkable document and, for all its frankness about the problems looming above, it radiates immense confidence. Prevailing opinion reflects that confidence and there is a general expectation that, by one means or another, shrinkage will continue, perhaps down to 45 nm or even less.However, costs will rise steeply and at an increasing rate. It is cost that will ultimately be seen as the reason for calling a halt. The exact point at which an industrial consensus is reached that the escalating costs can no longer be met will depend on the general economic climate as well as on the financial strength of the semiconductor industry itself.。
单片机英文文献资料及翻译
单片机英文文献资料及翻译单片机(英文：Microcontroller)Microcontroller is a small computer on a single integrated circuit that contains a processor core, memory, and programmable input/output peripherals. Microcontrollers are designed for embedded applications, in contrast to the microprocessors used in personal computers or other general purpose applications.A microcontroller's processor core is typically a small, low-power computer dedicated to controlling the operation of the device in which it is embedded. It is often designed to provide efficient and reliable control of simple and repetitive tasks, such as switching on and off lights, or monitoring temperature or pressure sensors.MEMORYMicrocontrollers typically have a limited amount of memory, divided into program memory and data memory. The program memory is where the software that controls the device is stored, and is often a type of Read-Only Memory (ROM). The data memory, on the other hand, is used to store data that is used by the program, and is often volatile, meaning that it loses its contents when power is removed.INPUT/OUTPUTMicrocontrollers typically have a number of programmable input/output (I/O) pins that can be used to interface with external sensors, switches, actuators, and other devices. These pins can be programmed to perform specific functions,such as reading a sensor value, controlling a motor, or generating a signal. Many microcontrollers also support communication protocols like serial, parallel, and USB, allowing them to interface with other devices, including other microcontrollers, computers, and smartphones.APPLICATIONSMicrocontrollers are widely used in a variety of applications, including:- Home automation systems- Automotive electronics- Medical devices- Industrial control systems- Consumer electronics- RoboticsCONCLUSIONIn conclusion, microcontrollers are powerful and versatile devices that have become an essential component in many embedded systems. With their small size, low power consumption, and high level of integration, microcontrollers offer an effective and cost-efficient solution for controlling a wide range of devices and applications.。
传感器技术论文中英文对照资料外文翻译文献
传感器技术论文中英文对照资料外文翻译文献Development of New Sensor TechnologiesSensors are devices that can convert physical。
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then sensors are like the five senses。
Sensors can correctly sense the measured quantity and convert it into a corresponding output。
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In today's n age。
the n industry includes three parts: sensing technology。
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单片机英文文献及翻译
附录A英文文献翻译原文Temperature Control Using a Microcontroller:An Interdisciplinary Undergraduate Engineering Design ProjectJames S. McDonaldDepartment of Engineering ScienceTrinity UniversitySan Antonio, TX 78212AbstractThis paper describes an interdisc iplinary design project which was done under the author’s supervision by a group of four senior students in the Department of Engineering Science at Trinity University. The objective of the project was to develop a temperature control system for an air-filled chamber. The system was to allow entry of a desired chamber temperature in a prescribed range and to exhibit overshoot and steady-state temperature error of less than 1 degree Kelvin in the actual chamber temperature step response. The details of the design developed by this group of students, based on a Motorola MC68HC05 family microcontroller, are described. The pedagogical value of the problem is also discussed through a description of some of the key steps in the design process. It is shown that the solution requires broad knowledge drawn from several engineering disciplines including electrical, mechanical, and control systems engineering.1 IntroductionThe design project which is the subject of this paper originated from a real-world application.A prototype of a microscope slide dryer had been developed around an OmegaTM modelCN-390 temperature controller, and the objective was to develop a custom temperature control system to replace the Omega system. The motivation was that a custom controller targeted specifically for the application should be able to achieve the same functionality at a much lower cost, as the Omega system is unnecessarily versatile and equipped to handle a wide variety of applications.The mechanical layout of the slide dryer prototype is shown in Figure 1. The main element of the dryer is a large, insulated, air-filled chamber in which microscope slides, each with a tissue sample encased in paraffin, can be set on caddies. In order that the paraffin maintain the proper consistency, the temperature in the slide chamber must be maintained at a desired (constant) temperature. A second chamber (the electronics enclosure) houses a resistive heater and the temperature controller, and a fan mounted on the end of the dryer blows air across theheater, carrying heat into the slide chamber. This design project was carried out during academic year 1996–97 by four students under the author’s supervision as a Senior Design project in the Department of Engineering Science at Trinity University. The purpose of this paper isto describe the problem and the students’ solution in some detail, and to discuss some of the pedagogical opportunities offered by an interdisciplinary design project of this type. The students’ own report was presented a t the 1997 National Conference on Undergraduate Research [1]. Section 2 gives a more detailed statement of the problem, including performance specifications, and Section 3 describes the students’ design. Section 4 makes up the bulk of the paper, and discusses in some detail several aspects of the design process which offer unique pedagogical opportunities. Finally, Section 5 offers some conclusions.2 Problem StatementThe basic idea of the project is to replace the relevant parts of the functionality of an Omega CN-390 temperature controller using a custom-designed system. The application dictates that temperature settings are usually kept constant for long periods of time, but it’s nonetheless important that step changes be tracked in a “reasonable” manner. Thus the main requirements boil down to·allowing a chamber temperature set-point to be entered,·displaying both set-point and actual temperatures, and·tracking step changes in set-point temperature with acceptable rise time, steady-state error, and overshoot.Although not explicitly a part of the specifications in Table 1, it was clear that the customer desired digital displays of set-point and actual temperatures, and that set-point temperature entry should be digital as well (as opposed to, say, through a potentiometer setting).3 System DesignThe requirements for digital temperature displays and setpoint entry alone are enough to dictate that a microcontrollerbased design is likely the most appropriate. Figure 2 shows a block diagram of the stude nts’ design.The microcontroller, a MotorolaMC68HC705B16 (6805 for short), is the heart of the system. It accepts inputs from a simple four-key keypad which allow specification of the set-point temperature, and it displays both set-point and measured chamber temperatures using two-digit seven-segment LED displays controlled by a display driver. All these inputs and outputs are accommodated by parallel ports on the 6805. Chamber temperature is sensed using apre-calibrated thermistor and input via one of the 6805’s analog-to-digital inputs. Finally, a pulse-width modulation (PWM) output on the 6805 is used to drive a relay which switches line power to the resistive heater off and on.Figure 3 shows a more detailed schematic of the electronics and their interfacing to the 6805. The keypad, a Storm 3K041103, has four keys which are interfaced to pins PA0{ PA3 of Port A, configured as inputs. One key functions as a mode switch. Two modes are supported: set mode and run mode. In set mode two of the other keys are used to specify the set-point temperature: one increments it and one decrements. The fourth key is unused at present. The LED displays are driven by a Harris Semiconductor ICM7212 display driver interfaced to pins PB0{PB6 of Port B, configured as outputs. The temperature-sensing thermistor drives, through a voltage divider, pin AN0 (one of eight analog inputs). Finally, pin PLMA (one of two PWM outputs) drives the heater relay.Software on the 6805 implements the temperature control algorithm, maintains the temperature displays, and alters the set-point in response to keypad inputs. Because it is not complete at this writing, software will not be discussed in detail in this paper. The control algorithm in particular has not been determined, but it is likely to be a simple proportional controller and certainly not more complex than a PID. Some control design issues will be discussed in Section 4, however.4 The Design ProcessAlthough essentially the project is just to build a thermostat, it presents many nice pedagogical opportunities. The knowledge and experience base of a senior engineering undergraduate are just enough to bring him or her to the brink of a solution to various aspects of the problem. Yet, in each case, realworld considerations complicate the situation significantly.Fortunately these complications are not insurmountable, and the result is a very beneficial design experience. The remainder of this section looks at a few aspects of the problem which present the type of learning opportunity just described. Section 4.1 discusses some of the features of a simplified mathematical model of the thermal properties of the system and how it can beeasily validated experimentally. Section 4.2 describes how realistic control algorithm designs can be arrived at using introductory concepts in control design. Section 4.3 points out some important deficiencies of such a simplified modeling/control design process and how they can be overcome through simulation. Finally, Section 4.4 gives an overview of some of the microcontroller-related design issues which arise and learning opportunities offered.4.1 MathematicalModelLumped-element thermal systems are described in almost any introductory linear control systems text, and just this sort of model is applicable to the slide dryer problem. Figure 4 shows a second-order lumped-element thermal model of the slide dryer. The state variables are the temperatures Ta of the air in the box and Tb of the box itself. The inputs to the system are the power output q(t) of the heater and the ambient temperature T¥. ma and mb are the masses of the air and the box, respectively, and Ca and Cb their specific heats. μ1 and μ2 are heat transfer coefficients from the air to the box and from the box to the external world, respectively.It’s not hard to show that the (linearized) state equationscorresponding to Figure 4 areTaking Laplace transforms of (1) and (2) and solving for Ta(s), which is the output of interest, gives the following open-loop model of the thermal system:where K is a constant and D(s) is a second-order polynomial.K, tz, and the coefficients ofD(s) are functions of the variousparameters appearing in (1) and (2).Of course the various parameters in (1) and (2) are completely unknown, but it’s not hard to show that, regardless of their values, D(s) has two real zeros. Therefore the main transfer function of interest (which isthe one from Q(s), since we’ll assume constant ambient temperature) can be writtenMoreover, it’s not too hard to show that 1=tp1 <1=tz <1=tp2, i.e., that the zero lies between the two poles. Both of these are excellent exercises for the student, and the result is the openloop pole-zero diagram of Figure 5.Obtaining a complete thermal model, then, is reduced to identifying the constant K and the three unknown time constants in (3). Four unknown parameters is quite a few, but simple experiments show that 1=tp1 _ 1=tz;1=tp2 so that tz;tp2 _ 0 are good approximations. Thus the open-loop system is essentially first-order and can therefore be written(where the subscript p1 has been dropped).Simple open-loop step response experiments show that,for a wide range of initial temperatures and heat inputs, K _0:14 _=W and t _ 295 s.14.2 Control System DesignUsing the first-order model of (4) for the open-loop transfer function Gaq(s) and assuming for the moment that linear control of the heater power output q(t) is possible, the block diagram of Figure 6 represents the closed-loop system. Td(s) is the desired, or set-point, temperature,C(s) is the compensator transfer function, and Q(s) is the heater output in watts.Given this simple situation, introductory linear control design tools such as the root locus method can be used to arrive at a C(s) which meets the step response requirements on rise time, steady-state error, and overshoot specified in Table 1. The upshot, of course, is that a proportional controller with sufficient gain can meet all specifications. Overshoot is impossible, and increasing gains decreases both steady-state error and rise time.Unfortunately, sufficient gain to meet the specifications may require larger heat outputs than the heater is capable of producing. This was indeed the case for this system, and the result is that the rise time specification cannot be met. It is quite revealing to the student how useful such an oversimplified model, carefully arrived at, can be in determining overall performance limitations.4.3 Simulation ModelGross performance and its limitations can be determined using the simplified model of Figure 6, but there are a number of other aspects of the closed-loop system whose effects on performance are not so simply modeled. Chief among these are·quantization error in analog-to-digital conversion of the measured temperature and· the use of PWM to control the heater.Both of these are nonlinear and time-varying effects, and the only practical way to study them is through simulation (or experiment, of course).Figure 7 shows a SimulinkTM block diagram of the closed-loop system which incorporates these effects. A/D converter quantization and saturation are modeled using standard Simulink quantizer and saturation blocks. Modeling PWM is more complicated and requires a customS-function to represent it.This simulation model has proven particularly useful in gauging the effects of varying thebasic PWM parameters and hence selecting them appropriately. (I.e., the longer the period, the larger the temperature error PWM introduces. On the other hand, a long period is desirable to avoid excessiv e relay “chatter,” among other things.) PWM is often difficult for students to grasp, and the simulation model allows an exploration of its operation and effects which is quite revealing.4.4 The MicrocontrollerSimple closed-loop control, keypad reading, and display control are some of the classic applications of microcontrollers, and this project incorporates all three. It is therefore an excellent all-around exercise in microcontroller applications. In addition, because the project isto produce an actua l packaged prototype, it won’t do to use a simple evaluation board with theI/O pins jumpered to the target system. Instead, it’s necessary to develop a complete embedded application. This entails the choice of an appropriate part from the broad range offered in a typical microcontroller family and learning to use a fairly sophisticated development environment. Finally, a custom printed-circuit board for the microcontroller and peripherals must be designed and fabricated.Microcontroller Selection. In view of existing local expertise, the Motorola line of microcontrollers was chosen for this project. Still, this does not narrow the choice down much. A fairly disciplined study of system requirements is necessary to specify which microcontroller, out of scores of variants, is required for the job. This is difficult for students, as they generally lack the experience and intuition needed as well as the perseverance to wade through manufacturers’ selection guides.Part of the problem is in choosing methods for interfacing the various peripherals (e.g., what kind of display driver should be used?). A study of relevant Motorola application notes [2, 3, 4] proved very helpful in understandingwhat basic approaches are available, and what microcontroller/peripheral combinations should be considered.The MC68HC705B16 was finally chosen on the basis of its availableA/D inputs and PWMoutputs as well as 24 digital I/O lines. In retrospect this is probably overkill, as only oneA/D channel, one PWM channel, and 11 I/O pins are actually required (see Figure 3). The decision was made to err on the safe side because a complete development system specific to the chosen part was necessary, and the project budget did not permit a second such system to be purchased should the firstprove inadequate.Microcontroller Application Development. Breadboarding of the peripheral hardware, development of microcontroller software, and final debugging and testing of a customprinted-circuit board for the microcontroller and peripherals all require a development environment of some kind. The choice of a development environment, like that of themicrocontroller itself, can be bewildering and requires some faculty expertise. Motorola makes three grades of development environment ranging from simple evaluation boards (at around $100) to full-blown real-time in-circuit emulators (at more like $7500). The middle option was chosen for this project: the MMEVS, which consists of _ a platform board (which supports all 6805-family parts), _ an emulator module (specific to B-series parts), and _ a cable and target head adapter (package-specific). Overall, the system costs about $900 and provides, with some limitations, in-circuit emulation capability. It also comes with the simple but sufficient software development environment RAPID [5].Students find learning to use this type of system challenging, but the experience they gain in real-world microcontroller application development greatly exceeds the typical first-course experience using simple evaluation boards.Printed-Circuit Board. The layout of a simple (though definitely not trivial) printed-circuit board is another practical learning opportunity presented by this project. The final board layout, with package outlines, is shown (at 50% of actual size) in Figure 8. The relative simplicity of the circuit makes manual placement and routing practical—in fact, it likely gives better results than automatic in an application like this—and the student is therefore exposed to fundamental issues of printed-circuit layout and basic design rules. The layout software used was the very nice package pcb,2 and the board was fabricated in-house with the aid of our staff electronics technician.5 ConclusionThe aim of this paper has been to describe an interdisciplinary, undergraduate engineering design project: a microcontroller- based temperature control system with digital set-point entry and set-point/actual temperature display. A particular design of such a system has been described, and a number of design issues which arise—from a variety of engineering disciplines—have been discussed. Resolution of these issues generally requires knowledge beyond that acquired in introductory courses, but realistically accessible to advance undergraduate students, especiallywith the advice and supervision of faculty.Desirable features of the problem, from a pedagogical viewpoint, include the use of a microcontroller with simple peripherals, the opportunity to usefully apply introductorylevel modeling of physical systems and design of closed-loop controls, and the need for relatively simple experimentation (for model validation) and simulation (for detailed performance prediction). Also desirable are some of the technologyrelated aspects of the problem including practical use of resistive heaters and temperature sensors (requiring knowledge of PWM and calibration techniques, respectively), microcontroller selection and use of development systems, and printedcircuit design.AcknowledgementsThe author would like to acknowledge the hard work, dedication, and ability shown by the students involved in this project: Mark Langsdorf, Matt Rall, PamRinehart, and David Schuchmann. It is their project, and credit for its success belongs to them.References[1] M. Langsdorf, M. Rall, D. Schuchmann, and P. Rinehart,“Temperature control of a microscope slide dryer,” in1997 National Conference on Undergraduate Research,(Austin, TX), April 1997. Poster presentation.[2] Motorola, Inc., Phoenix, AZ, Temperature Measurementand Display Using the MC68HC05B4 and the MC14489,1990. Motorola SemiconductorApplicationNote AN431.[3] Motorola, Inc., Phoenix, AZ, HC05 MCU LED DriveTechniques Using the MC68HC705J1A, 1995. MotorolaSemiconductor Application Note AN1238.[4] Motorola, Inc., Phoenix, AZ, HC05MCU Keypad DecodingTechniques Using the MC68HC705J1A, 1995. MotorolaSemiconductor Application Note AN1239.[5] Motorola, Inc., Phoenix, AZ, RAPID Integrated DevelopmentEnvironment User’s Manual, 1993. (RAPID wasdeveloped by P & E Microcomputer Systems, Inc.).附录B英文文献翻译中文单片机温度控制：一个跨学科的本科生工程设计项目JamesS.McDonald工程科学系三一大学德克萨斯州圣安东尼奥市78212摘要本文所描述的是作者领导由四个三一大学高年级学生组成的团队进行的一个跨学科工程项目的设计。
Sensor-technology传感器技术大学毕业论文外文文献翻译及原文
毕业设计（论文）外文文献翻译文献、资料中文题目：传感器技术文献、资料英文题目：Sensor-technology文献、资料来源：文献、资料发表（出版）日期：院（部）：专业：班级：姓名：学号：指导教师：翻译日期： 2017.02.14Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , and mass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation , laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example, through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country theexhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrarythree-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conducttwo-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application of sensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedomFiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
单片机的外文文献及中文翻译
SCM is an integrated circuit chip，is the use of large scale integrated circuit technology to a data processing capability of CPU CPU random access memory RAM，read—only memory ROM，a variety of I / O port and interrupt system, timers / timer functions (which may also include display driver circuitry，pulse width modulation circuit，analog multiplexer, A / D converter circuit) integrated into a silicon constitute a small and complete computer systems。
SCM is also known as micro—controller （Microcontroller)，because it is the first to be used in industrial control. Only a single chip by the CPU chip developed from a dedicated processor。
The first design is by a large number of peripherals and CPU on a chip in the computer system，smaller, more easily integrated into a complex and demanding on the volume control device which. The Z80 INTEL is the first designed in accordance with this idea processor, then on the development of microcontroller and dedicated processors will be parting ways。
单片机外文文献和中文翻译
Validation and Testing of Design Hardening for Single Event Effects Using the 8051 MicrocontrollerAbstractWith the dearth of dedicated radiation hardened foundries, new and novel techniques are being developed for hardening designs using non-dedicated foundry services。
In this paper，we will discuss the implications of validating these methods for the single event effects （SEE) in the space environment。
Topics include the types of tests that are required and the design coverage (i.e.，design libraries: do they need validating for each application？）。
Finally, an 8051 microcontroller core from NASA Institute of Advanced Microelectronics （IAμE) CMOS Ultra Low Power Radiation Tolerant (CULPRiT) design is evaluated for SEE mitigative techniques against two commercial 8051 devices.Index TermsSingle Event Effects, Hardened—By—Design，microcontroller，radiation effects。
单片机外文文献毕业翻译
单片机介绍单片机也被称为微控制器（Microcontroller Unit)，常用英文字母的缩写MCU表示单片机，它最早是被用在工业控制领域。
单片机由芯片内仅有CPU 的专用处理器发展而来。
最早的设计理念是通过将大量外围设备和CPU 集成在一个芯片中，使计算机系统更小, 更容易集成进复杂的而对体积要求严格的控制设备当中。
INTEL 的Z80是最早按照这种思想设计出的处理器, 从此以后, 单片机和专用处理器的发展便分道扬镳.早期的单片机都是8 位或 4 位的。
其中最成功的是INTEL 的8031, 因为简单可靠而性能不错获得了很大的好评. 此后在8031 上发展出了MCS51 系列单片机系统。
基于这一系统的单片机系统直到现在还在广泛使用。
随着工业控制领域要求的提高,开始出现了16 位单片机, 但因为性价比不理想并未得到很广泛的应用。
90 年代后随着消费电子产品大发展, 单片机技术得到了巨大提高。
随着INTEL i960 系列特别是后来的ARM 系列的广泛应用，32 位单片机迅速取代16 位单片机的高端地位，并且进入主流市场。
而传统的8 位单片机的性能也得到了飞速提高，处理能力比起80 年代提高了数百倍。
目前，高端的32 位单片机主频已经超过300MHz，性能直追90 年代中期的专用处理器，而普通的型号出厂价格跌落至 1 美元，最高端的型号也只有10 美元。
当代单片机系统已经不再只在裸机环境下开发和使用，大量专用的嵌入式操作系统被广泛应用在全系列的单片机上。
而在作为掌上电脑和手机核心处理的高端单片机甚至可以直接使用专用的Windows 和Linux 操作系统。
单片机比专用处理器更适合应用于嵌入式系统, 因此它得到了最多的应用。
事实上单片机是世界上数量最多的计算机。
现代人类生活中所用的几乎每件电子和机械产品中都会集成有单片机。
手机、电话、计算器、家用电器、电子玩具、掌上电脑以及鼠标等电脑配件中都配有1—2 部单片机。
传感器技术外文文献及中文翻译
传感器技术外文文献及中文翻译Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , andmass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation ,laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example,through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country the exhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrary three-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conduct two-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application ofsensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedom Fiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
单片机毕业参考英文文献及翻译
附录：英文技术资料翻译英文原文：Structure and function of the MCS-51 seriesStructure and function of the MCS-51 series one-chip computer MCS-51 is a name of a piece of one-chip computer series which Intel Company produces. This company introduced 8 top-grade one-chip computers of MCS-51 series in 1980 after introducing 8 one-chip computers of MCS-48 series in 1976. It belong to a lot of kinds this line of one-chip computer the chips have,such as 8051, 8031, 8751, 80C51BH, 80C31BH,etc., their basic composition, basic performance and instruction system are all the same. 8051 daily representatives- 51 serial one-chip computers .An one-chip computer system is made up of several following parts: ( 1) One microprocessor of 8 (CPU). ( 2) At slice data memory RAM (128B/256B),it use not depositting not can reading /data that write, such as result not middle of operation, final result and data wanted to show, etc. ( 3) Procedure memory ROM/EPROM (4KB/8KB ), is used to preserve the procedure , some initial data and form in slice. But does not take ROM/EPROM within some one-chip computers, such as 8031 , 8032, 80C ,etc.. ( 4) Four 8 run side by side I/O interface P0 four P3, each mouth can use as introduction , may use as exporting too. ( 5) Two timer / counter, each timer / counter may set up and count in the way, used to count to the external incident, can set up into a timing way too, and can according to count or result of timing realize the control of the computer. ( 6) Five cut off cutting off the control system of the source . ( 7) One all duplexing serial I/O mouth of UART (universal asynchronous receiver/transmitter (UART) ), is it realize one-chip computer or one-chip computer and serial communication of computer to use for. ( 8) Stretch oscillator and clock produce circuit, quartz crystal finely tune electric capacity need outer. Allow oscillation frequency as 12 megahertas now at most. Every the above-mentioned part was joined through the inside data bus .Amongthem, CPU is a core of the one-chip computer, it is the control of the computer and command centre, made up of such parts as arithmetic unit and controller , etc.. The arithmetic unit can carry on 8 persons of arithmetic operation and unit ALU of logic operation while including one, the 1 storing device temporarilies of 8, storing device 2 temporarily, 8's accumulation device ACC, register B and procedure state register PSW, etc. Person who accumulate ACC count by 2 input ends entered of checking etc. temporarily as one operation often, come from person who store 1 operation is it is it make operation to go on to count temporarily , operation result and loopback ACC with another one. In addition, ACC is often regarded as the transfer station of data transmission on 8051 inside . The same as general microprocessor, it is the busiest register. Help remembering that agreeing with A expresses in the order. The controller includes the procedure counter , the order is depositted, the order decipher, the oscillator and timing circuit, etc. The procedure counter is made up of counter of 8 for two, amounts to 16. It is a byte address counter of the procedure in fact, the content is the next IA that will carried out in PC. The content which changes it can change the direction that the procedure carries out . Shake the circuit in 8051 one-chip computers, only need outer quartz crystal and frequency to finely tune the electric capacity, its frequency range is its 12MHZ of 1.2MHZ. This pulse signal, as 8051 basic beats of working, namely the minimum unit of time. 8051 is the same as other computers, the work in harmony under the control of the basic beat, just like an orchestra according to the beat play that is commanded.There are ROM (procedure memory , can only read ) and RAM in 8051 slices (data memory, can is it can write ) two to read, they have each independent memory address space, dispose way to be the same with general memory of computer. Procedure 8051 memory and 8751 slice procedure memory capacity 4KB, address begin from 0000H, used for preserving the procedure and form constant. Data 8051- 8751 8031 of memory data memory 128B, address false 00FH, use for middle result to deposit operation, the data are stored temporarily and the data are buffered etc.. In RAM of this 128B, there is unit of 32 byteses that can be appointed as the job register, this and general microprocessor is different, 8051 slice RAM and job register rank one formation the same toarrange the location. It is not very the same that the memory of MCS-51 series one-chip computer and general computer disposes the way in addition. General computer for first address space, ROM and RAM can arrange in different space within the range of this address at will, namely the addresses of ROM and RAM, with distributing different address space in a formation. While visiting the memory, corresponding and only an address Memory unit, can ROM, it can be RAM too, and by visiting the order similarly. This kind of memory structure is called the structure of Princeton. 8051 memories are divided into procedure memory space and data memory space on the physics structure, there are four memory spaces in all: The procedure stores in one and data memory space outside data memory and one in procedure memory space and one outside one, the structure forms of this kind of procedure device and data memory separated form data memory, called Harvard structure. But use the angle from users, 8051 memory address space is divided into three kinds: (1) In the slice, arrange blocks of FFFFH , 0000H of location , in unison outside the slice (use 16 addresses). (2) The data memory address space outside one of 64KB, the address is arranged from 0000H 64KB FFFFH (with 16 addresses ) too to the location. (3) Data memory address space of 256B (use 8 addresses). Three above-mentioned memory space addresses overlap, for distinguishing and designing the order symbol of different data transmission in the instruction system of 8051: CPU visit slice, ROM order spend MOVC , visit block RAM order uses MOVX outside the slice, RAM order uses MOV to visit in slice.8051 one-chip computer have four 8 walk abreast I/O port, call P0, P1, P2 and P3. Each port is 8 accurate two-way mouths, accounts for 32 pins altogether. Every one I/O line can be used as introduction and exported independently. Each port includes a latch (namely special function register ), one exports the driver and a introduction buffer . Make data can latch when outputting, data can buffer when making introduction , but four function of passway these self-same. Expand among the system of memory outside having slice, four port these may serve as accurate two-way mouth of I/O in common use. Expand among the system of memory outside having slice, P2 mouth see high 8 address off; P0 mouth is a two-way bus, send the introduction of 8 low addresses and data / export in timesharingOutput grade , P3 of mouth , P1 of P1 , connect with inside have load resistance of drawing , every one of they can drive 4 Model LS TTL load to output. As while inputting the mouth, any TTL or NMOS circuit can drive P1 of 8051 one-chip computers as P3 mouth in a normal way . Because draw resistance on output grade of them have, can open a way collector too or drain-source resistance is it urge to open a way, do not need to have the resistance of drawing outerly . Mouths are all accurate two-way mouths too. When the conduct is input, must write the corresponding port latch with 1 first . As to 80C51 one-chip computer, port can only offer milliampere of output electric currents, is it output mouth go when urging one ordinary basing of transistor to regard as, should contact a resistance among the port and transistor base , in order to the electricity while restraining the high level from exporting P1~P3 Being restored to the throne is the operation of initializing of an one-chip computer. Its main function is to turn PC into 0000H initially , make the one-chip computer begin to hold the conduct procedure from unit 0000H. Except that the ones that enter the system are initialized normally,as because procedure operate it make mistakes or operate there aren't mistake, in order to extricate oneself from a predicament , need to be pressed and restored to the throne the key restarting too. It is an input end which is restored to the throne the signal in 8051 China RST pin. Restore to the throne signal high level effective , should sustain 24 shake cycle (namely 2 machine cycles ) the above its effective times. If 6 of frequency of utilization brilliant to shake, restore to the throne signal duration should exceed 4 delicate to finish restoring to the throne and operating. Produce the logic picture of circuit which is restored to the throne the signal:Restore to the throne the circuit and include two parts outside in the chip entirely. Outside that circuit produce to restore to the throne signal (RST ) hand over to Schmitt's trigger, restore to the throne circuit sample to output , Schmitt of trigger constantly in each S5P2 , machine of cycle in having one more , then just got and restored to the throne and operated the necessary signal insidly. Restore to the throne resistance of circuit generally, electric capacity parameter suitable for 6 brilliant to shake,can is it restore to the throne signal high level duration greater than 2 machine cycles to guarantee. Being restored to the throne in the circuit is simple, its function is very important. Pieces of one-chip computer system could normal running,should first check it can restore to the throne not succeeding. Checking and can pop one's head and monitor the pin with the oscillograph tentatively, push and is restored to the throne the key, the wave form that observes and has enough range is exported (instantaneous), can also through is it restore to the throne circuit group holding value carry on the experiment to change.注：文献来源中文译文：51系列单片机的功能和结构51系列单片机是Intel公司设计的单片机产品。
传感器技术外文文献及中文翻译讲课讲稿
Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , and mass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation , laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example, through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country theexhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrarythree-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conducttwo-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application of sensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedomFiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
单片机英文文献及翻译)
Validation and Testing of Design Hardening for Single Event Effects Using the 8051 MicrocontrollerAbstractWith the dearth of dedicated radiation hardened foundries, new and novel techniques are being developed for hardening designs using non-dedicated foundry services. In this paper, we will discuss the implications of validating these methods for the single event effects (SEE) in the space environment. Topics include the types of tests that are required and the design coverage (i.e., design libraries: do they need validating for each application?). Finally, an 8051 microcontroller core from NASA Institute of Advanced Microelectronics (IAμE) CMOS Ultra Low Power Radiation Tolerant (CULPRiT) design is evaluated for SEE mitigative techniques against two commercial 8051 devices.Index TermsSingle Event Effects, Hardened-By-Design, microcontroller, radiation effects.I. INTRODUCTIONNASA constantly strives to provide the best capture of science while operating in a space radiation environment using a minimum of resources [1,2]. With a relatively limited selection of radiation-hardened microelectronic devices that are often two or more generations of performance behind commercialstate-ofthe-art technologies, NASA’s performance of this task is quite challenging. One method of alleviating this is by the use of commercial foundry alternatives with no or minimally invasive design techniques for hardening. This is often called hardened-by-design (HBD).Building custom-type HBD devices using design libraries and automated design tools may provide NASA the solution it needs to meet stringent science performance specifications in a timely,cost-effective, and reliable manner.However, one question still exists: traditional radiation-hardened devices have lot and/or wafer radiation qualification tests performed; what types of tests are required for HBD validation?II. TESTING HBD DEVICES CONSIDERATIONSTest methodologies in the United States exist to qualify individual devices through standards and organizations such as ASTM, JEDEC, and MIL-STD- 883. Typically, TID (Co-60) and SEE (heavy ion and/or proton) are required for device validation. So what is unique to HBD devices?As opposed to a “regular” commercial-off-the-shelf (COTS) device or application specific integrated circuit (ASIC) where no hardening has been performed, one needs to determine how validated is the design library as opposed to determining the device hardness. That is, by using test chips, can we “qualify” a future device using the same library?Consider if Vendor A has designed a new HBD library portable to foundries B and C. A test chip is designed, tested, and deemed acceptable. Nine months later a NASA flight project enters the mix by designing a new device using Vendor A’s library. Does this device require complete radiation qualification testing? To answer this, other questions must be asked.How complete was the test chip? Was there sufficient statistical coverage of all library elements to validate each cell? If the new NASA design uses a partially or insufficiently characterized portion of the design library, full testing might be required. Of course, if part of the HBD was relying on inherent radiation hardness of a process, some of the tests (like SEL in the earlier example) may be waived.Other considerations include speed of operation and operating voltage. For example, if the test chip was tested statically for SEE at a power supply voltage of 3.3V, is the data applicable to a 100 MHz operating frequency at 2.5V? Dynamic considerations (i.e., nonstatic operation) include the propagated effects of Single Event Transients (SETs). These can be a greater concern at higher frequencies.The point of the considerations is that the design library must be known, the coverage used during testing is known, the test application must be thoroughly understood and the characteristics of the foundry must be known. If all these are applicable or have been validated by the test chip, then no testing may be necessary. A task within NASA’s Electronic Parts and Packaging (NEPP) Program was performed to explore these types of considerations.III. HBD TECHNOLOGY EVALUATION USING THE 8051 MICROCONTROLLERWith their increasing capabilities and lower power consumption, microcontrollers are increasingly being used in NASA and DOD system designs. There are existing NASA and DoD programs that are doing technology development to provide HBD. Microcontrollers are one such vehicle that is being investigated to quantify the radiation hardness improvement. Examples of these programs are the 8051 microcontroller being developed by Mission Research Corporation (MRC) and the IAμE (the focus of this study). As these HBD technologies become available, validation of the technology, in the natural space radiation environment, for NASA’s use in spaceflight systems is required.The 8051 microcontroller is an industry standard architecture that has broad acceptance, wide-ranging applications and development tools available. There are numerous commercial vendors that supply this controller or have it integrated into some type of system-on-a-chip structure. Both MRC and IAμE chose this device to demonstrate two distinctly different technologies for hardening. The MRC example of this is to use temporal latches that require specific timing to ensure that single event effects are minimized. The IAμE technology uses ultra low power, and layout and architecture HBD design rules to achieve their results. These are fundamentally different than the approach by Aeroflex-United Technologies Microelectronics Center (UTMC), the commercial vendor of a radiation–hardened 8051, that built their 8051 microcontroller using radiationhardened processes. This broad range of technology within one device structure makes the 8051an ideal vehicle for performing this technology evaluation.The objective of this work is the technology evaluation of the CULPRiT process [3] from IAμE. The process has been baselined against two other processes, the standard 8051 commercial device from Intel and a version using state-of-the-art processing from Dallas Semiconductor. By performing this side-by-side comparison, the cost benefit, performance, and reliability trade study can be done.In the performance of the technology evaluation, this task developed hardware and software for testing microcontrollers. A thorough process was done to optimize the test process to obtain as complete an evaluation as possible. This included taking advantage of the available hardware and writing software that exercised the microcontroller such that all substructures of the processor were evaluated. This process is also leading to a more complete understanding of how to test complex structures, such as microcontrollers, and how to more efficiently test these structures in the future.IV. TEST DEVICESThree devices were used in this test evaluation. The first is the NASA CULPRiT device, which is the primary device to be evaluated. The other two devices are two versions of a commercial 8051, manufactured by Intel and Dallas Semiconductor, respectively.The Intel devices are the ROMless, CMOS version of the classic 8052 MCS-51 microcontroller. They are rated for operation at +5V, over a temperature range of 0 to 70 °C and at a clock speeds of 3.5 MHz to 24 MHz. They are manufactured in Intel’s P629.0 CHMOS III-E process.The Dallas Semiconductor devices are similar in that they are ROMless 8052 microcontrollers, but they are enhanced in various ways. They are rated for operation from 4.25 to 5.5 Volts over 0 to 70 °C at clock speeds up to 25 MHz. They have a second full serial port built in, seven additional interrupts, a watchdog timer, a power fail reset, dual data pointers and variable speed peripheral access. In addition, the core is redesigned so that the machine cycle is shortened for most instructions, resulting in an effective processing ability that is roughly 2.5 times greater (faster) than the standard 8052 device. None of these features, other than those inherent in the device operation, were utilized in order to maximize the similarity between the Dallas and Intel test codes.The CULPRiT technology device is a version of the MSC-51 family compatible C8051 HDL core licensed from the Ultra Low Power (ULP) process foundry. The CULPRiT technology C8051 device is designed to operate at a supply voltage of 500 mV and includes an on-chip input/output signal level-shifting interface with conventional higher voltage parts. The CULPRiT C8051 device requires two separate supply voltages; the 500 mV and the desired interface voltage. The CULPRiT C8051 is ROMless and is intended to be instruction set compatible with the MSC-51 family.V. TEST HARDWAREThe 8051 Device Under Test (DUT) was tested as a component of a functional computer. Aside from DUT itself, the other componentsof the DUT computer were removed from the immediate area of the irradiation beam.A small card (one per DUT package type) with a unique hard-wired identifier byte contained the DUT, its crystal, and bypass capacitors (and voltage level shifters for the CULPRiT DUTs). This "DUT Board" was connected to the "Main Board" by a short 60-conductor ribbon cable. The Main Board had all other components required to complete the DUT Computer, including some which nominally are not necessary in some designs (such as external RAM, external ROM and address latch). The DUT Computer and the Test Control Computer were connected via a serial cable and communications were established between the two by the Controller (that runs custom designed serial interface software). This Controller software allowed for commanding of the DUT, downloading DUT Code to the DUT, and real-time error collection from the DUT during and post irradiation. A 1 Hz signal source provided an external watchdog timing signal to the DUT, whose watchdog output was monitored via an oscilloscope. The power supply was monitored to provide indication of latchup.VI. TEST SOFTWAREThe 8051 test software concept is straightforward. It was designed to be a modular series of small test programs each exercising a specific part of the DUT. Since each test was stand alone, they were loaded independently of each other for execution on the DUT. This ensured that only the desired portion of the 8051 DUT was exercised during the test and helped pinpoint location of errors that occur during testing. All test programs resided on the controller PC until loaded via the serial interface to the DUT computer. In this way, individual tests could have been modified at any time without the necessity of burning PROMs. Additional tests could have also been developed and added without impacting the overall test design. The only permanent code, which was resident on the DUT, was the boot code and serial code loader routines that established communications between the controller PC and the DUT.All test programs implemented:• An external Universal Asynchronous Receive and Transmit device (UART) for transmission of error information and communication to controller computer.• An external real-time clock for data error tag.•A watchdog routine designed to provide visual verification of 8051 health and restart test code if necessary.• A "foul-up" routine to reset program counter if it wanders out of code space.• An external telemetry data storage memory to provide backup of data in the event of an interruption in data transmission.The brief description of each of the software tests used is given below. It should be noted that for each test, the returned telemetry (including time tag) was sent to both the test controller and the telemetry memory, giving the highest reliability that all data is captured.Interrupt –This test used 4 of 6 available interrupt vectors (Serial, External, Timer0 Overflow, and Timer1 Overflow) to trigger routines that sequentially modified a value in the accumulator which was periodically compared to a known value. Unexpected values were transmitted with register information.Logic –This test performed a series of logic and math computations and provided three types of error identifications: 1) addition/subtraction, 2) logic and 3) multiplication/division. All miscompares of computations and expected results were transmitted with other relevant register information.Memory – This test loaded internal data memory at locations D:0x20 through D:0xff (or D:0x20 through D:0x080 for the CULPRiT DUT), indirectly, with an 0x55 pattern. Compares were performed continuously and miscompares were corrected while error information and register values were transmitted.Program Counter -The program counter was used to continuously fetch constants at various offsets in the code. Constants were compared with known values and miscompares were transmitted along with relevant register information. Registers – This test loaded each of four (0,1,2,3) banks of general-purpose registers with either 0xAA (for banks 0 and 2) or 0x55 (for banks 1 and 3). The pattern was alternated in order to test the Program Status Word (PSW) special function register, which controls general-purpose register bank selection. General-purpose register banks were then compared with their expected values. All miscompares were corrected and error information was transmitted.Special Function Registers (SFR) – This test used learned static values of 12 out 21 available SFRs and then constantly compared the learned value with the current one. Miscompares were reloaded with learned value and error information was transmitted.Stack – This test performed arithmetic by pushing and popping operands on the stack. Unexpected results were attributed to errors on the stack or to the stack pointer itself and were transmitted with relevant register information.VII. TEST METHODOLOGYThe DUT Computer booted by executing the instruction code located at address 0x0000. Initially, the device at this location was an EPROM previously loaded with "Boot/Serial Loader" code. This code initialized the DUT Computer and interface through a serial connection to the controlling computer, the "Test Controller". The DUT Computer downloaded Test Code and put it into Program Code RAM (located on the Main Board of the DUT Computer). It then activated a circuit which simultaneously performed two functions: held the DUT reset line active for some time (~10 ms); and, remapped the Test Code residing in the Program Code RAM to locate it to address 0x0000 (the EPROM will no longer be accessible in the DUT Computer's memory space). Upon awaking from the reset, the DUT computer again booted by executing the instruction code at address 0x0000, except this time that code was not be the Boot/Serial Loader code but the Test Code.The Test Control Computer always retained the ability to force the reset/remap function, regardless of the DUT Computer's functionality. Thus, if the test ran without a Single Event Functional Interrupt (SEFI) either the DUT Computer itselfor the Test Controller could have terminated the test and allowed the post-test functions to be executed. If a SEFI occurred, the Test Controller forced a reboot into Boot/Serial Loader code and then executed the post-test functions. During any test of the DUT, the DUT exercised a portion of its functionality (e.g., Register operations or Internal RAM check, or Timer operations) at the highest utilization possible, while making a minimal periodic report to the Test Control Computer to convey that the DUT Computer was still functional. If this reportceased, the Test Controller knew that a SEFI had occurred. This periodic data was called "telemetry". If the DUT encountered an error that was not interrupting the functionality (e.g., a data register miscompare) it sent a more lengthy report through the serial port describing that error, and continued with the test.VIII.DISCUSSIONA. Single Event LatchupThe main argument for why latchup is not an issue for the CULPRiT devices is that the operating voltage of 0.5 volts should be below the holding voltage required for latchup to occur. In addition to this, the cell library used also incorporates the heavy dual guard-barring scheme [4]. This scheme has been demonstrated multiple times to be very effective in rendering CMOS circuits completely immune to SEL up to test limits of 120 MeV-cm2/mg. This is true in circuits operating at 5, 3.3, and 2.5 Volts, as well as the 0.5 Volt CULPRiT circuits. In one case, a 5 Volt circuit fabricated on noncircuits wafers even exhibited such SEL immunity.B. Single Event UpsetThe primary structure of the storage unit used in the CULPRiT devices is the Single Event Resistant Topology (SERT) [5]. Given the SERT cell topology and a single upset node assumption, it is expected that the SERT cell will be completely immune to SEUs occurring internal to the memory cell itself. Obviously there are other things going on. The CULPRiT 8051 results reported here are quite similar to some resultsobtained with a CULPRiT CCSDS lossless compression chip (USES) [6]. The CULPRiT USES was synthesized using exactly the same tools and library as the CULPRiT 8051.With the CULPRiT USES, the SEU cross section data [7] was taken as a function of frequency at two LET values, 37.6 and 58.5 MeV-cm2/mg. In both cases the data fit well to a linear model where cross section is proportional to clock. In the LET 37.6 case, the zero frequency intercept occurred essentially at the zero cross section point, indicating that virtually all of these SEUs are captured SETs from the combinational logic. The LET 58.5 data indicated that the SET (frequency dependent) component is sitting on top of a "dc-bias" component –presumably a second upset mechanism is occurring internal to the SERT cells only at a second, higher LET threshold.The SET mitigation scheme used in the CULPRiT devices is based on the SERT cell's fault tolerant input property when redundant input data is provided to separate storage nodes. The idea is that the redundant input data is provided through a total duplication of combinational logic (referred to as “dual rail design”) such that a simple SET on one rail cannot produce an upset. Therefore, some other upset mechanism must be happening. It is possible that a single particle strike is placing an SET on both halves of the logic streams, allowing an SET to produce an upset. Care was taken to separate the dual sensitive nodes in the SERT cell layouts but the automated place-and-route of the combinatorial logic paths may have placed dual sensitive nodes close enough.At this point, the theory for the CULPRiT SEU response is that at about an LET of 20, the energy deposition is sufficiently wide enough (and in the right locations) to produce an SET in both halves of the combinatorial logic streams. Increasing LET allows for more regions to be sensitive to this effect, yielding a larger cross section. Further, the second SEU mechanism that starts at an LET of about 40-60 has to do with when the charge collection disturbance cloud gets large enough to effectively upset multiples of the redundant storage nodes within the SERT cell itself. In this 0.35 μm library, the node separation is several microns. However, since it takes less charge to upset a node operating at 0.5 Volts, with transistors having effective thresholds around 70 mV, this is likely the effect being observed. Also the fact that the per-bit memory upset cross section for the CULPRiT devices and the commercial technologies are approximately equal, as shown in Figure 9, indicates that the cell itself has become sensitive to upset.IX. SUMMARYA detailed comparison of the SEE sensitivity of a HBD technology (CULPRiT) utilizing the 8051 microcontroller as a test vehicle has been completed. This paper discusses the test methodology used and presents a comparison of the commercial versus CULPRiT technologies based on the data taken. The CULPRiT devices consistently show significantly higher threshold LETs and an immunity to latchup. In all but the memory test at the highest LETs, the cross section curves for all upset events is one to two orders of magnitude lower than the commercial devices. Additionally, theory is presented, based on the CULPRiT technology, that explain these results.This paper also demonstrates the test methodology for quantifying the level of hardness designed into a HBD technology. By using the HBD technology in a real-world device structure (i.e., not just a test chip), and comparing results to equivalent commercial devices, one can have confidence in the level of hardness that would be available from that HBD technology in any circuit application.ACKNOWLEDGEMENTSThe authors of this paper would like to acknowledge the sponsors of this work. These are the NASA Electronic Parts and Packaging Program (NEPP), NASA Flight Programs, and the Defense Threat Reduction Agency (DTRA).。
传感器的基础知识论文中英文资料对照外文翻译
传感器的根底知识论文中英文资料对照外文翻译英文文献翻译中英文资料对照外文翻译Basic knowledge of transducersA transducer is a device which converts the quantity being measured into an optical, mechanical, or-more commonly-electrical signal. Theenergy-conversion process that takes place is referred to as transduction.Transducers are classified according to the transduction principle involved and the form of the measured. Thus a resistance transducer for measuring displacement is classified as a resistance displacement transducer. Other classification examples are pressure bellows, force diaphragm, pressure flapper-nozzle, and so on. 1、Transducer Elements Although there are exception ,most transducers consist of a sensing element and a conversion or control element. For example, diaphragms,bellows,strain tubes and rings, bourdon tubes, and cantilevers are sensing elements which respond to changes in pressure or force and convert these physical quantities into a displacement. This displacement may then be used to change an electrical parameter such as voltage, resistance, capacitance, or inductance. Such combination of mechanical and electrical elements form electromechanical transducing devices or transducers. Similar combination can be made for other energy input such as thermal. Photo, magnetic and chemical,giving thermoelectric, photoelectric,electromaanetic, and electrochemical transducers respectively. 2、Transducer SensitivityThe relationship between the measured and the transducer output signal is usually obtained by calibration tests and is referred to as the transducer sensitivity K1= output-signal increment / measured increment .In practice, the transducer sensitivity is usually known, and, by measuring the output signal, the input quantity is determined from input= output-signal increment / K1.3、Characteristics of an Ideal TransducerThe high transducer should exhibit the following characteristicsa) high fidelity-the transducer output waveform shape be a faithful reproduction of the measured; there should be minimum distortion.b) There should be minimum interference with the quantity being measured; the presence of the transducer should not alter the measured in any way.c) Size. The transducer must be capable of being placed exactly where it is needed.1英文文献翻译d) There should be a linear relationship between the measured and the transducer signal. e) The transducer should have minimum sensitivity to external effects, pressuretransducers,for example,are often subjected to external effects such vibration and temperature. f) The natural frequency of the transducer should be well separated from the frequency and harmonics of the measurand.4、Electrical TransducersElectrical transducers exhibit many of the ideal characteristics. In addition they offer high sensitivity as well as promoting the possible of remote indication or mesdurement. Electrical transducers can be divided into two distinct groups: a) variable-control-parameter types,which include: i)resistance ii) capacitance iii) inductanceiv) mutual-inductance typesThese transducers all rely on external excitation voltage for their operation. b) self-generating types,which include i) electromagnetic ii)thermoelectric iii)photoemissive iv)piezo-electric typesThese all themselves produce an output voltage in response to the measurand input and their effects are reversible. For example, a piezo-electric transducer normally produces an output voltage in response to the deformation of a crystalline material; however, if an alternating voltage is applied across the material, the transducer exhibits the reversible effect by deforming or vibrating at the frequency of the alternating voltage. 5、Resistance TransducersResistance transducers may be divided into two groups, as follows: i) Those which experience a large resistance change, measured by using potential-divider methods. Potentiometers are in this group.ii)Those which experience a small resistance change, measured by bridge-circuit methods. Examples of this group include strain gauges and resistance thermometers. 5.1 PotentiometersA linear wire-wound potentiometer consists of a number of turns resistance wire wound around a non-conducting former, together with a wiping contact which travels over the barwires. The construction principles are shown in figure which indicate that the wiper2英文文献翻译displacement can be rotary, translational, or a combination of both to give a helical-type motion. The excitation voltage may be either a.c. or d.c. and the output voltage is proportional to the input motion, provided the measuring device has a resistance which is much greater than the potentiometer resistance.Such potentiometers suffer from the linked problem of resolution and electrical noise. Resolution is defined as the smallest detectable change in input and is dependent on the cross-sectional area of the windings and the area of the sliding contact. The output voltage is thus a serials of steps as the contact moves from one wire to next.Electrical noise may be generated by variation in contact resistance, by mechanical wear due to contact friction, and by contact vibration transmitted from the sensing element. In addition, the motion being measured may experience significant mechanical loading by the inertia and friction of the moving parts of the potentiometer. The wear on the contacting surface limits the life of a potentiometer to a finite number of full strokes or rotations usually referred to in the manufacture’s specification as the ‘number of cycles of life expectancy’, a typical value being 20*1000000 cycles.The output voltage V0 of the unload potentiometer circuit is determined as follows. Let resistance R1= xi/xt *Rt where xi = input displacement, xt= maximum possible displacement, Rt total resistance of the potentiometer. Then output voltage V0= V*R1/(R1+( Rt-R1))=V*R1/Rt=V*xi/xt*Rt/Rt=V*xi/xt. This shows that there is a straight-line relationship between output voltage and input displacement for the unloaded potentiometer. It would seen that high sensitivity could be achieved simply by increasing the excitation voltage V. however, the maximum value of V is determined by the maximum power dissipation P of the fine wires of the potentiometer winding and is given by V=(PRt)1/2 . 5.2 Resistance Strain GaugesResistance strain gauges are transducers which exhibit a change in electrical resistance in response to mechanical strain. They may be of the bonded or unbonded variety . a) bonded strain gaugesUsing an adhesive, these gauges are bonded, or cemented, directly on to the surface of the body or structure which is being examined. Examples of bonded gauges arei) fine wire gauges cemented to paper backingii) photo-etched grids of conducting foil on an epoxy-resin backingiii)a single semiconductor filament mounted on an epoxy-resin backing with copper or nickel leads.Resistance gauges can be made up as single elements to measuring strain in one direction only,3英文文献翻译or a combination of elements such as rosettes will permit simultaneous measurements in more than one direction. b) unbonded strain gauges A typical unbonded-strain-gauge arrangement shows fine resistance wires stretched around supports in such a way that the deflection of the cantilever spring system changes the tension in the wires and thus alters the resistance of wire. Such an arrangement may be found in commercially available force, load, or pressure transducers. 5.3 Resistance Temperature TransducersThe materials for these can be divided into two main groups:a) metals such as platinum, copper, tungsten, and nickel which exhibit and increase in resistance as the temperature rises; they have a positive temperature coefficient of resistance. b) semiconductors, such as thermistors which use oxides of manganese, cobalt, chromium, or nickel. These exhibit large non-linear resistance changes with temperature variation and normally have a negative temperature coefficient of resistance. a) metal resistance temperature transducersThese depend, for many practical purpose and within a narrow temperature range, upon the relationship R1=R0*[1+a*(b1-b2)] where a coefficient of resistance in ℃-1,and R0 resistance in ohms at the reference temperature b0=0℃ at the reference temperature range ℃.℃℃. b) thermistor resistance temperature transducersThermistors are temperature-sensitive resistors which exhibit large non-liner resistance changes with temperature variation. In general, theyhave a negative temperature coefficient. For small temperature increments the variation in resistance is reasonably linear; but, if large temperature changes are experienced, special linearizing techniques are used in the measuring circuits to produce a linear relationship of resistance against temperature.Thermistors are normally made in the form of semiconductor discs enclosed in glass vitreous enamel. Since they can be made as small as 1mm,quite rapid response times are possible. 5.4 Photoconductive Cells The photoconductive cell , uses a light-sensitive semiconductor material. The resistance between the metal electrodes decrease as the intensity of the light striking the semiconductor increases. Common semiconductor materials used for photo-conductive cells are cadmium sulphide, lead sulphide, and copper-doped germanium.The useful range of frequencies is determined by material used. Cadmium sulphide is mainly suitable for visible light, whereas lead sulphide has its peak response in the infra-red region4英文文献翻译and is, therefore , most suitable for flame-failure detection and temperature measurement. 5.5 Photoemissive CellsWhen light strikes the cathode of the photoemissive cell are given sufficient energy to arrive the cathode. The positive anode attracts these electrons, producing a current which flows through resistor R and resulting in an output voltage V. Photoelectrically generated voltage V=Ip.RlWhere Ip=photoelectric current(A),and photoelectric current Ip=Kt.B Where Kt=sensitivity (A/im),and B=illumination input (lumen)Although the output voltage does give a good indication of the magnitude of illumination, the cells are more often used for counting or controlpurpose, where the light striking the cathode can be interrupted. 6、Capacitive TransducersThe capacitance can thus made to vary by changing either the relative permittivity, the effective area, or the distance separating the plates. The characteristic curves indicate that variations of area and relative permittivity give a linear relationship only over a small range of spacings. Thus the sensitivity is high for small values of d. Unlike the potentionmeter, the variable-distance capacitive transducer has an infinite resolution making it most suitable for measuring small increments of displacement or quantities which may be changed to producea displacement.7、Inductive TransducersThe inductance can thus be made to vary by changing the reluctance of the inductive circuit. Measuring techniques used with capacitive and inductive transducers: a)A.C. excited bridges using differential capacitors inductors. b)A.C. potentiometer circuits for dynamic measurements.c) D.C. circuits to give a voltage proportional to velocity for a capacitor.d) Frequency-modulation methods, where the change of C or L varies the frequency of an oscillation circuit.Important features of capacitive and inductive transducers are as follows: i)resolution infiniteii) accuracy+- 0.1% of full scale is quoted iii)displacement ranges 25*10-6 m to 10-3m iv) rise time less than 50us possibleTypical measurands are displacement, pressure, vibration, sound, and liquid level. 8、 Linear Variable-differential Ttransformer 9、Piezo-electric Transducers5。
最新传感器技术外文文献及中文翻译资料
Sensor technologyA sensor is a device which produces a signal in response to its detecting or measuring a property ,such as position , force , torque , pressure , temperature , humidity , speed , acceleration , or vibration .Traditionally ,sensors (such as actuators and switches )have been used to set limits on the performance of machines .Common examples are (a) stops on machine tools to restrict work table movements ,(b) pressure and temperature gages with automatics shut-off features , and (c) governors on engines to prevent excessive speed of operation . Sensor technology has become an important aspect of manufacturing processes and systems .It is essential for proper data acquisition and for the monitoring , communication , and computer control of machines and systems .Because they convert one quantity to another , sensors often are referred to as transducers .Analog sensors produce a signal , such as voltage ,which is proportional to the measured quantity .Digital sensors have numeric or digital outputs that can be transferred to computers directly .Analog-to-coverter(ADC) is available for interfacing analog sensors with computers .Classifications of SensorsSensors that are of interest in manufacturing may be classified generally as follows:Machanical sensors measure such as quantities aspositions ,shape ,velocity ,force ,torque , pressure , vibration , strain , and mass .Electrical sensors measure voltage , current , charge , and conductivity .Magnetic sensors measure magnetic field ,flux , and permeablity .Thermal sensors measure temperature , flux ,conductivity , and special heat .Other types are acoustic , ultrasonic , chemical , optical , radiation , laser ,and fiber-optic .Depending on its application , a sensor may consist of metallic , nonmetallic , organic , or inorganic materials , as well as fluids ,gases ,plasmas , or semiconductors .Using the special characteristics of these materials , sensors covert the quantity or property measured to analog or digital output. The operation of an ordinary mercury thermometer , for example , is based on the difference between the thermal expansion of mercury and that of glass.Similarly , a machine part , a physical obstruction , or barrier in a space can be detected by breaking the beam of light when sensed by a photoelectric cell . A proximity sensor ( which senses and measures the distance between it and an object or a moving member of a machine ) can be based on acoustics , magnetism , capacitance , or optics . Other actuators contact the object and take appropriate action ( usually by electromechanical means ) . Sensors are essential to the conduct of intelligent robots , and are being developed with capabilities that resemble those of humans ( smart sensors , see the following ).This is America, the development of such a surgery Lin Bai an example, through the screen, through a remote control operator to control another manipulator, through the realization of the right abdominal surgery A few years ago our country theexhibition, the United States has been successful in achieving the right to the heart valve surgery and bypass surgery. This robot has in the area, caused a great sensation, but also, AESOP's surgical robot, In fact, it through some equipment to some of the lesions inspections, through a manipulator can be achieved on some parts of the operation Also including remotely operated manipulator, and many doctors are able to participate in the robot under surgery Robot doctor to include doctors with pliers, tweezers or a knife to replace the nurses, while lighting automatically to the doctor's movements linked, the doctor hands off, lighting went off, This is very good, a doctor's assistant.Tactile sensing is the continuous of variable contact forces , commonly by an array of sensors . Such a system is capable of performing within an arbitrarythree-dimensional space .has gradually shifted from manufacturing tonon-manufacturing and service industries, we are talking about the car manufacturer belonging to the manufacturing industry, However, the services sector including cleaning, refueling, rescue, rescue, relief, etc. These belong to the non-manufacturing industries and service industries, so here is compared with the industrial robot, it is a very important difference. It is primarily a mobile platform, it can move to sports, there are some arms operate, also installed some as a force sensor and visual sensors, ultrasonic ranging sensors, etc. It’s surrounding environment for the conduct of identification, to determine its campaign to complete some work, this is service robot’s one of the basic characteristicsIn visual sensing (machine vision , computer vision ) , cameral optically sense the presence and shape of the object . A microprocessor then processes the image ( usually in less than one second ) , the image is measured , and the measurements are digitized ( image recognition ) .Machine vision is suitable particularly for inaccessible parts , in hostile manufacturing environments , for measuring a large number of small features , and in situations where physics contact with the part may cause damage .Small sensors have the capability to perform a logic function , to conducttwo-way communication , and to make a decisions and take appropriate actions . The necessary input and the knowledge required to make a decision can be built into a smart sensor . For example , a computer chip with sensors can be programmed to turn a machine tool off when a cutting tool fails . Likewise , a smart sensor can stop a mobile robot or a robot arm from accidentally coming in contact with an object or people by using quantities such as distance , heat , and noise .Sensor fusion . Sensor fusion basically involves the integration of multiple sensors in such a manner where the individual data from each of the sensors ( such as force , vibration , temperature , and dimensions ) are combined to provide a higher level of information and reliability . A common application of sensor fusion occurs when someone drinks a cup of hot coffee . Although we take such a quotidian event for granted ,it readily can be seen that this process involves data input from the person's eyes , lips , tongue , and hands .Through our basic senses of sight , hearing , smell , taste , and touch , there is real-time monitoring of relative movements , positions , and temperatures . Thus if the coffee is too hot , the hand movement of the cup toward the lip is controlled and adjusted accordingly .The earliest applications of sensor fusion were in robot movement control , missile flight tracking , and similar military applications . Primarily because these activities involve movements that mimic human behavior . Another example of sensor fusion is a machine operation in which a set of different but integrated sensors monitors (a) the dimensions and surface finish of workpiece , (b) tool forces , vibrations ,and wear ,(c) the temperature in various regions of the tool-workpiece system , and (d) the spindle power .An important aspect in sensor fusion is sensor validation : the failure of one particular sensor is detected so that the control system maintains high reliability . For this application ,the receiving of redundant data from different sensors is essential . It can be seen that the receiving , integrating of all data from various sensors can be a complex problem .With advances in sensor size , quality , and technology and continued developments in computer-control systems , artificial neural networks , sensor fusion has become practical and available at low cost .Movement is relatively independent of the number of components, the equivalent of our body, waist is a rotary degree of freedom We have to be able to hold his arm, Arm can be bent, then this three degrees of freedom, Meanwhile there is a wrist posture adjustment to the use of the three autonomy, the general robot has six degrees of freedom. We will be able to space the three locations, three postures, the robot fully achieved, and of course we have less than six degrees of freedomFiber-optic sensors are being developed for gas-turbine engines . These sensors will be installed in critical locations and will monitor the conditions inside the engine , such as temperature , pressure , and flow of gas . Continuous monitoring of the signals from thes sensors will help detect possible engine problems and also provide the necessary data for improving the efficiency of the engines .传感器技术传感器一种通过检测某一参数而产生信号的装置。
传感器技术论文中英文对照资料外文翻译文献
传感器技术论文中英文对照资料外文翻译文献中英文对照资料外文翻译文献附件1:外文资料翻译译文传感器新技术的发展传感器是一种能将物理量、化学量、生物量等转换成电信号的器件。
输出信号有不同形式，如电压、电流、频率、脉冲等，能满足信息传输、处理、记录、显示、控制要求，是自动检测系统和自动控制系统中不可缺少的元件。
如果把计算机比作大脑，那么传感器则相当于五官，传感器能正确感受被测量并转换成相应输出量，对系统的质量起决定性作用。
自动化程度越高，系统对传感器要求越高。
在今天的信息时代里，信息产业包括信息采集、传输、处理三部分，即传感技术、通信技术、计算机技术。
现代的计算机技术和通信技术由于超大规模集成电路的飞速发展，而已经充分发达后，不仅对传感器的精度、可靠性、响应速度、获取的信息量要求越来越高，还要求其成本低廉且使用方便。
显然传统传感器因功能、特性、体积、成本等已难以满足而逐渐被淘汰。
世界许多发达国家都在加快对传感器新技术的研究与开发，并且都已取得极大的突破。
如今传感器新技术的发展，主要有以下几个方面:利用物理现象、化学反应、生物效应作为传感器原理，所以研究发现新现象与新效应是传感器技术发展的重要工作，是研究开发新型传感器的基础。
日本夏普公司利用超导技术研制成功高温超导磁性传感器，是传感器技术的重大突破，其灵敏度高，仅次于超导量子干涉器件。
它的制造工艺远比超导量子干涉器件简单。
可用于磁成像技术，有广泛推广价值。
利用抗体和抗原在电极表面上相遇复合时，会引起电极电位的变化，利用这一现象可制出免疫传感器。
用这种抗体制成的免疫传感器可对某生物体内是否有这种抗原作检查。
如用肝炎病毒抗体可检查某人是否患有肝炎，起到快速、准确作用。
美国加州大学巳研制出这类传感器。
传感器材料是传感器技术的重要基础，由于材料科学进步，人们可制造出各种新型传感器。
例如用高分子聚合物薄膜制成温度传感器;光导纤维能制成压力、流量、温度、位移等多种传感器;用陶瓷制成压力传感器。
单片机的外文文献及中文翻译
单片机的外文文献及中文翻译一、外文文献Title: The Application and Development of SingleChip Microcontrollers in Modern ElectronicsSinglechip microcontrollers have become an indispensable part of modern electronic systems They are small, yet powerful integrated circuits that combine a microprocessor core, memory, and input/output peripherals on a single chip These devices offer significant advantages in terms of cost, size, and power consumption, making them ideal for a wide range of applicationsThe history of singlechip microcontrollers can be traced back to the 1970s when the first microcontrollers were developed Since then, they have undergone significant advancements in technology and performance Today, singlechip microcontrollers are available in a wide variety of architectures and capabilities, ranging from simple 8-bit devices to complex 32-bit and 64-bit systemsOne of the key features of singlechip microcontrollers is their programmability They can be programmed using various languages such as C, Assembly, and Python This flexibility allows developers to customize the functionality of the microcontroller to meet the specific requirements of their applications For example, in embedded systems for automotive, industrial control, and consumer electronics, singlechip microcontrollers can be programmed to control sensors, actuators, and communication interfacesAnother important aspect of singlechip microcontrollers is their low power consumption This is crucial in batterypowered devices and portable electronics where energy efficiency is of paramount importance Modern singlechip microcontrollers incorporate advanced power management techniques to minimize power consumption while maintaining optimal performanceIn addition to their use in traditional electronics, singlechip microcontrollers are also playing a significant role in the emerging fields of the Internet of Things （IoT) and wearable technology In IoT applications, they can be used to collect and process data from various sensors and communicate it wirelessly to a central server Wearable devices such as smartwatches and fitness trackers rely on singlechip microcontrollers to monitor vital signs and perform other functionsHowever, the design and development of systems using singlechip microcontrollers also present certain challenges Issues such as realtime performance, memory management, and software reliability need to be carefully addressed to ensure the successful implementation of the applications Moreover, the rapid evolution of technology requires developers to constantly update their knowledge and skills to keep up with the latest advancements in singlechip microcontroller technologyIn conclusion, singlechip microcontrollers have revolutionized the field of electronics and continue to play a vital role in driving technological innovation Their versatility, low cost, and small form factor make them an attractive choice for a wide range of applications, and their importance is expected to grow further in the years to come二、中文翻译标题：单片机在现代电子领域的应用与发展单片机已成为现代电子系统中不可或缺的一部分。
单片机原理中英文文献翻译(一)2024
单片机原理中英文文献翻译（一）引言概述：单片机（Microcontroller）是一种集成电路芯片，融合了中央处理器（CPU）、内存、输入输出端口和其他外围设备接口等功能于一体。
在电子设备中，单片机扮演着控制和管理各种任务的重要角色。
本文将介绍关于单片机原理的中英文文献翻译。
大点1：单片机的基本概念1. 单片机的定义和发展历史2. 单片机的特点和应用领域3. 单片机的工作原理和体系结构4. 单片机与传统微处理器的对比5. 单片机的分类和性能指标大点2：单片机的主要组成部分1. 中央处理器（CPU）的功能和工作原理2. 存储器单元（Memory Unit）的作用和分类3. 输入输出（I/O）端口和外围设备接口4. 定时器和计数器的功能及应用5. 电源和电源管理电路的设计要点大点3：单片机的编程方法1. 单片机的指令系统和寄存器2. 单片机的汇编语言和高级语言编程3. 编写简单的单片机程序的实例4. 单片机编程中常见的问题和解决方法5. 嵌入式操作系统的开发和应用大点4：单片机的应用案例1. 家用电器中的单片机控制应用2. 工业自动化领域中的单片机应用3. 交通和物流行业中的单片机应用4. 医疗设备和仪器中的单片机应用5. 农业和环保领域中的单片机应用大点5：单片机的发展趋势1. 单片机技术的发展历程和现状2. 单片机性能和功耗的改进方向3. 嵌入式系统和物联网对单片机的影响4. 新一代单片机的发展趋势和应用前景5. 单片机教育和研究的发展现状和挑战总结：通过对单片机原理中英文文献的翻译，我们可以了解单片机的基本概念、主要组成部分、编程方法、应用案例和发展趋势。
这些知识有助于我们更好地理解和应用单片机技术，推动电子设备的创新与发展。
传感器技术外文文献及中文翻译
传感器技术外文文献及中文翻译引言传感器是现代检测技术的重要组成部分，它能将物理量、化学量等非电信号转换为电信号，从而实现检测和控制。
传感器广泛应用于工业、医疗、军事等领域中，如温度、湿度、气压、光强度等参数检测。
随着科技的发展，传感器不断新型化、微型化和智能化，已经涵盖了人体所有的感官，开启了大规模的物联网与智能化时代。
本文将介绍几篇与传感器技术相关的外文文献，并对其中较为重要的内容进行中文翻译。
外文文献1标题“Flexible Sensors for Wearable Health: Why Materials Matter”作者Sarah O’Brien, Michal P. Mielczarek, and Fergal J. O’Brien文献概述本文主要介绍了柔性传感器在可穿戴健康监测中的应用，以及传感材料的选择对柔性传感器性能的影响。
文章先介绍了柔性传感器的基本工作原理和常见的柔性传感材料，然后重点探讨了传感材料对柔性传感器灵敏度、稳定性、响应速度等性能的影响。
最后，文章提出未来柔性传感器材料需满足的性能要求，并对可能的研究方向和应用进行了展望。
翻译摘要柔性传感器是可穿戴健康监测中重要的成分，通过将身体状态转化为电信号进行检测。
选择合适的传感材料对柔性传感器产品的成本、性能及标准化有着面向未来的影响。
本文对柔性材料的常见种类 (如: 聚合物、金属、碳复合材料等) 进行了介绍，并重点探讨了传感材料选择的影响因素，如对柔性传感器的灵敏度、特异性和响应时间等。
此外，文章还探讨了柔性传感器的性能要求和建议未来的技术方向。
外文文献2标题“Smart sensing system for precision agriculture”作者Olivier Strauss, Lucas van der Meer, and Benoit Figliuzzi文献概述本文主要介绍智能传感系统在精准农业中的应用。
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毕业设计（论文）外文文献翻译文献、资料中文题目：传感器技术文献、资料英文题目：Sensor technology文献、资料来源：文献、资料发表（出版）日期：院（部）：专业：班级：姓名：学号：指导教师：翻译日期： 2017.02.14微机发展简史IEEE的论文剑桥大学，2004/2/5莫里斯威尔克斯计算机实验室剑桥大学第一台存储程序的计算开始出现于1950前后，它就是1949年夏天在剑桥大学，我们创造的延迟存储自动电子计算机（EDSAC）。
最初实验用的计算机是由象我一样有着广博知识的人构造的。
我们在电子工程方面都有着丰富的经验，并且我们深信这些经验对我们大有裨益。
后来，被证明是正确的，尽管我们也要学习很多新东西。
最重要的是瞬态一定要小心应付，虽然它只会在电视机的荧幕上一起一个无害的闪光，但是在计算机上这将导致一系列的错误。
在电路的设计过程中，我们经常陷入两难的境地。
举例来说，我可以使用真空二级管做为门电路，就象在EDSAC中一样，或者在两个栅格之间用带控制信号的五级管，这被广泛用于其他系统设计，这类的选择一直在持续着直到逻辑门电路开始应用。
在计算机领域工作的人都应该记得TTL，ECL和CMOS，到目前为止，CMOS已经占据了主导地位。
在最初的几年，IEE（电子工程师协会）仍然由动力工程占据主导地位。
为了让IEE 认识到无线工程和快速发展的电子工程并行发展是它自己的一项权利，我们不得不面对一些障碍。
由于动力工程师们做事的方式与我们不同，我们也遇到了许多困难。
让人有些愤怒的是，所有的IEE出版的论文都被期望以冗长的早期研究的陈述开头，无非是些在早期阶段由于没有太多经验而遇到的困难之类的陈述。
60年代的巩固阶段60年代初，个人英雄时代结束了，计算机真正引起了重视。
世界上的计算机数量已经增加了许多，并且性能比以前更加可靠。
这些我认为归因与高级语言的起步和第一个操作系统的诞生。
分时系统开始起步，并且计算机图形学随之而来。
综上所述，晶体管开始代替正空管。
这个变化对当时的工程师们是个不可回避的挑战。
他们必须忘记他们熟悉的电路重新开始。
只能说他们鼓起勇气接受了挑战，尽管这个转变并不会一帆风顺。
小规模集成电路和小型机很快，在一个硅片上可以放不止一个晶体管，由此集成电路诞生了。
随着时间的推移，一个片子能够容纳的最大数量的晶体管或稍微少些的逻辑门和翻转门集成度达到了一个最大限度。
由此出现了我们所知道7400系列微机。
每个门电路或翻转电路是相互独立的并且有自己的引脚。
他们可通过导线连接在一起，作成一个计算机或其他的东西。
这些芯片为制造一种新的计算机提供了可能。
它被称为小型机。
他比大型机稍逊，但功能强大，并且更能让人负担的起。
一个商业部门或大学有能力拥有一台小型机而不是得到一台大型组织所需昂贵的大型机。
随着微机的开始流行并且功能的完善，世界急切获得它的计算能力但总是由于工业上不能规模供应和它可观的价格而受到挫折。
微机的出现解决了这个局面。
计算消耗的下降并非起源与微机，它本来就应该是那个样子。
这就是我在概要中提到的“通货膨胀”在计算机工业中走上了歧途之说。
随着时间的推移，人们比他们付出的金钱得到的更多。
硬件的研究我所描述的时代对于从事计算机硬件研究的人们是令人惊奇的时代。
7400系列的用户能够工作在逻辑门和开关级别并且芯片的集成度可靠性比单独晶体管高很多。
大学或各地的研究者，可以充分发挥他们的想象力构造任何微机可以连接的数字设备。
在剑桥大学实验室力，我们构造了CAP，一个有令人惊奇逻辑能力的微机。
7400在70年代中期还不断发展壮大，并且被宽带局域网的先驱组织Cambridge Ring所采用。
令牌环设计研究的发表先于以太网。
在这两种系统出现之前，人们大多满足于基于电报交换机的本地局域网。
令牌环网需要高可靠性，由于脉冲在令牌环中传递，他们必须不断的被放大并且再生。
是7400的高可靠性给了我们勇气，使得我们着手Cambridge Ring.项目。
精简指令计算机的诞生早期的计算机有简单的指令集，随着时间的推移，商业用微机的设计者增加了另外的他们认为可以微机性能的特性。
很少的测试方法被建立，总的来说特性的选取很大程度上依赖于设计者的直觉。
1980年，RISC运动改变了微机世界。
该运动是由Patterson 和Ditzel发表了一篇命名为精简指令计算机的情况论文而引起的。
除了RISC这个引人注目缩略词外，这个标题传达了一些指令集合设计的见解，随之引发了RISC运动。
从某种意义上说，它推动了线程的发展，在处理器中，同一时间有几个指令在不同的执行阶段称为线程。
线程不是个新概念，但是它对微机来说是从未有过的。
RISC受益于一个最近的可用的方法的诞生，该方法使估计计算机性能成为可能而不去真正实现该微机的设计。
我的意思是说利用目前存在的功能强大的计算机去模拟新的设计。
通过模拟该设计，RISC的提倡者能够有信心的预言，一台使用和传统计算机相同电路的RISC计算机可以和传统的最好的计算机有同样的性能。
模拟仿真加快了开发进度并且被计算机设计者广泛采用。
随后，计算机设计者变的多些可理性少了一些艺术性。
今天，设计者们希望有满屋可用计算机做他们的仿真，而不只是一台，X86指令集除非出现很大意外，要不很少听到有计算机使用早期的RISC指令集了。
INTEL 8086及其后裔都与x86密切相关。
X86构架已经占据了计算机核心指令集的主导地位。
被认为是相当成功的RISC指令集现在的生存空间越来越小了。
对于我们这些从事计算机学术研究的人，X86的统治地位让我们感到失望。
毫无疑问，商业上对于x86的生存会有更多的考虑，但是这里还有很多原因，尽管我们多么希望人们考虑其他的方面。
高级语言并没有完全消除对机器原始编码的的使用。
我们仍需要不断提醒我们自己：我们应该严格的与先前的应用在机器层面上保持兼容。
然而，情况也许有所不同，如果Intel的主要目的是为是生产一个好的RISC芯片。
有一个已经取得了更大的成功，我所说的i860(不是i960,它们有一些不同)。
从许多方面来说，i860是个卓越的芯片，但是它的软件借口不适合在工作站上应用。
对于x86取得胜利的最后有一件有意思的事情。
直接应用先前x86的实现方式对于满足RISC处理器的持续增长的速度要求，是不可能的。
因此，设计者们没有完全实现RISC指令集，尽管这不是很明显。
表面上，一片现代的x86芯片包含了隐藏实现的部分，好象和实现RISC指令集的芯片一样。
当致命的异常发生时，X86引入的代码是，经过适当的篡改后，被转化为它的内部代码并且被RISC芯片处理。
对于以上RISC运动的总结，我非常信赖最新版本的哈里斯和培生出版社的有关计算机设计的书籍。
请参考特殊计算机体系构造，第三版，2003，P146，151-4，157-8IA-64指令集很久以前，Intel 和Hewlett-Packard引进了IA-64指令集。
这最初主要是为了满足通常的64位地址空间问题。
在这种情况下，随后出现了MIPS R4000和Alpha。
然而，人们普遍认为Intel应该与x86构架保持兼容，可令人疑惑的是恰恰相反。
进一步说，IA-64的设计与其他所有的指令集在主要实现方式上有所不同。
特别的，每条指令它需要附加的6位。
这打乱了传统的在指令字长和信息内容的平衡，并且它改变了编译器作者的原先的大纲。
尽管IA-64是个全新的指令集，但Intel发表了一个令人困惑的声明：基于IA-64的芯片将与早期的x86芯片保持兼容。
很难弄懂它所指的是什么。
最新的称为Itaninu IA-64处理器显然需要特殊的兼容性的硬件，尽管如此，x86编码运行的相当慢。
由于以上的复杂因素，IA-64的实现需要更大的体积相对与传统的指令集，这暗示着更大的消耗。
因此，在任何情况下，作为常识和一般性的标准，Gordon Moore在访问剑桥最近开放的Betty and Gordon Moore 图书馆时所反复强调。
在听到他说问题出现在Intel内部也许有所不同，我很不理解。
但是我已经作好了准备，去接受这样的事实，我已经完全不了解半导体经济学了。
AMD已经定义了一种64位的与x86更加兼容的指令集，并且他们已经取得了进展。
这种片子并不是很大。
很多人认为这才是Intel应该做的。
（在这篇演讲稿被提交之前，Intel表示他们将销售一系列本质上与AMD兼容的芯片）更小晶体管的出现集成度还在不断增加，这是通过缩小原始晶体管以致可以更容易放在一个片子上。
进一步说，物理学的定律占在了制造商的一方。
晶体管变的更快，更简单，更小。
因此，同时导致了更高的集成度和速度。
这有个更明显的优势。
芯片被放在硅片上，称为晶片。
每一个晶片拥有很大数量的独立芯片，他们被同时加工然后分离。
因为缩小以致在每块晶片上有了更多的芯片，所以每块芯片的价格下降了。
单元价格下降对于计算机工业是重要的，因为，如果最新的芯片性能和以前一样但价格更便宜，就没有理由继续提供老产品，至少不应该无限期提供。
对于整个市场只需一种产品。
然而，详细计算各项消耗，随着芯片小到一定程度，为了继续保持产品的优势，移到一个更大的圆晶片上是十分必要的。
尺寸的不断增加使的圆晶片不再是很小的东西了。
最初，圆晶片直径上只有1到2英寸，到2000年已经达到了12英寸。
起初，我不太明白，芯片的缩小导致了一系列的问题，工业上应该在制造更大的圆晶片上遇到更多的问题。
现在，我明白了，单元消耗的减少在工业上和在一个芯片上增加电子晶体管的数量是同等重要的，并且，在风险中增加圆晶片厂的投资被证明是正确的。
集成度被特殊的尺寸所衡量，对于特定的技术，它是用在一块高密度芯片上导线间距离的一半来衡量的。
目前，90纳米的晶片正在被建成。
对Murphy‟s定理的怀疑1997年3月，在Cavendish实验室建立一百周年纪念庆典上，Gordon Moore 被邀作为一名演讲者。
在他演讲的过程中，我第一次了解到这样一个事实，我们可以使得硅芯片既快并且消耗低，从而违反在英国被称为Murphy‟s 定律或Sod‟s 定律。
Moore说在其它领域你也许不在二者之间做出取舍，但事实上，在硅片上，同时拥有二者是可能的。
在网上可得到一本相关的书籍，Murphy是在美国空军中从事人体重力加速度研究的工程师。
然而在我们的学生时代就已经相当熟悉该定律，当时我们对于该定律有个更接近散文的名字而不是上面我们提到的那两个名字，我们称为General Cussedness定律。
甚至它都曾出现在我们的试卷上。
问题是这样，第一部分是关于该定律的定义，第二部分是应用该定律解决一道问题。
我们的试题是：一、给出General Cussedness定律的定义；二、当一个骑自行车人围绕着圆做运动时，在任何情况下，考虑到风的因素得到一个平衡公式。