TVS瞬态抑制二极管阵列SP1003

Description

Applications Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20µs surge current (IEC61000-4-5) with very low clamping voltages. Features

• ESD, IEC61000-4-2,

±30kV contact, ±30kV air

• EFT , IEC61000-4-4, 40A (5/50ns)

• Lightning, IEC61000-4-5, 7A (8/20µs)

• Low leakage current of 100nA (MAX) at 5V • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space • Fits solder footprint of industry standard 0402 (1005) devices • A EC-Q101 qualified (SOD882 package)

• Mobile phones • Smart phones

• PDAs

• Portable navigation devices

• Digital cameras

• Portable medical devices

Pinout

Functional Block Diagram

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.Application Example

Signal I/O port B1Ground

B2B3B4

1

2

SOD882

(AEC-Q101 qualified)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Absolute Maximum Ratings

Thermal Information

Electrical Characteristics (T OP =25º

C)

Note: 1 Parameter is guaranteed by design and/or device characterization.

Capacitance vs. Reverse Bias

Clamping Voltage vs. I PP

0.0

5.010.015.020.025.030.0

35.040.00.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

DC Bias (V)

C a p a c i t a n c e (p F )

T ransmission Line Pulsing (TLP) Plot

Soldering Parameters

Leakage vs. T emperature

Pulse Waveform

0%

10%20%30%40%50%60%70%80%

90%100%110%0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

P e r c e n t o f I P P

Package Dimensions — SOD723

Recommended Solder Pad Layout

]

Millimeters (Inches)

Package Dimensions — SOD882

Recommended Soldering Pad Layout

Ordering Information

Product Characteristics

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

Part Numbering System Part Marking System

SP 1003 *T G

Series

Package D: SOD723T= Tape & Reel G= Green –TVS Diode Arrays (SPA ® Diodes)E: SOD882

Number of Channels

-01 = 1 Channel

01 SOD723

SOD882

or C

C