3528带透镜白光led规格书

ＳＰＥＣＩＦＩＣＡＴＩＯＮ　ＦＯＲ　ＡＰＰＲＯＶＡＬPackage Dimensions And MaterialsAbsolute Maximum Rating at TA=25°CItemForward Current Peak Forward Current Reverse Voltage Power Dissipation Electrostaic discharge Operation Temperature Storage TemperatureLesd Soldering TemperatureSymbolAbsolute Maximum RatingUnit If Ifp VR PD ESD Topr Tstg Tsol5015051303000-40 -- +80Max.245°C for 5sec MaxmA V mW V °C IFP Conditions:Pulse Width ≤10mser duty ≤1/10Tsol Conditions: 5mm form the base of the epoxy bulbmA °C-30 -- +80Typical Optical/Electrode CharacteristicVr=5V 50If(rec)IV Ir IF=50mA Vf mAuA V 50102.640----4900--2.02θ1/2λD --5858200MCDdegUnit Max.Typ.Min.ConditionSymbol ItemForward Voltage Reverse Current % Power Angle Luminous Intensity Recommend Forward CurrentIF=50mA IF=50mA IF=50mA ----595NM The Main WavelengthTypical Optical/Electrode Characteristic Curves (Ta=25℃Unless Otherwise Noted)Luminous Spertrum(Ta=25℃)SPECTRAL RADIANCE-30°30°60°90°-90°-60°0°100%80%60%40%20%100%80%60%40%20%Forward Current vs. Ambient TemperatureAmbient Temperature Ta(°C)F o r w a r d V o l t a g e V f (V )Forward Current vs. Ambient TemperatureF o r w a r d C u r r e n t I f (m A )Forward Voltage Vf(V)Forward Current vs. Ambient TemperatureRelstive Intensity vs.Ambient TemperatureAmbient Temperature Ta(°C)F o r w a r d C u r r e n t I f (m A )R e l a t i v e I n t e n s i t y I V (m c d )Ambient Temperature Ta(°C)nm800700600608010050040040020RELATIVE RESPONSE 100%=1.642e-G01Range of binsVF Ranks(If=50mA)Bin Code VF(V)Bin12.0-2.2Bin22.2-2.4Bin32.4-2.6Bin CodeλD(NM)Bin1585-590Bin2590-595λD Ranks(If=50mA)IV Ranks(If=50mA)Bin Code IV(MCD)6300-82004900-6300Bin25Bin24MOISTURE PROOF PACKAGE 防潮包装STORAGE CONDITIONS 储存条件●When moisture is absorbed into the SMT package it may vaproize and expand during soldering. There is a possibility that this can causeexfoliation of the contacts and damage the optical characteristics of the LEDs.For this reason ,the moisture proof package is used to keep moisture to a minimum in the package.当水分吸收到SMT 封装，会可能在焊接过程中扩大，就有可能材料出现剥落和损坏LED 的光学特性；出于这个原因，防潮铝袋是用来保持水分的最小包装●The moisture proof package is made absorbent material (silica gel desiccants)is inserted into the aluminium moisture proof bag.将防潮包装制成的吸收性材料(硅胶干燥剂)放入到防潮铝袋中●The silica gel desiccants change from blue to red if moisture had penertrated bags.如果有水分进入防潮铝袋中，硅胶干燥剂由蓝色变为红色●Before opeing the package :打开包装前The LEDs should be kept at 30℃ or less and 60％ RH or less.LED 应该保存在≤30℃，≤60%RH 环境中The LEDs should be used within 3 months.When storing the LEDs, moisture proof packaging with absorbent material (silica gel desiccants)is recommended.LED 保存在防潮铝袋真空包装，防潮铝袋中放硅胶干燥剂时，必须在3个月内使用，●After opening the package :打开包装后After this bag is opened , devices that will sujected to infraed reflow , vapor -phase reflow , or equivalent processing Must be:防潮包装打开后，将过回流焊处理时，必须：a)Mounted within 24 hours at factory condition of ≤30℃/60％RH.在≤30℃/60％RH 环境中24小时内使用完b)If unused LEDs remain, they should be stored in the moisture proof package ,such as sealed containers with package of moisture absorbent material (silica gel deaiccants). It is also recommended to return the LEDs to the original moisture proof bag and reseal the moisture prrof bag again . Stored at ≤20％RH.若不用LED 时，LED 应该被储存在防潮环境中，如密封的容器(防潮柜)，另外，还建议LED 返回到原来的防潮袋中，再次重新真空包装，储存在≤20％RH.●If the moiature basorbent material (silica gel deaiccants)has faded away or the LEDs have exceeded the storage time ,baking treatment should be performed using the following conditions.Backing treatment : 1.more than 12 hours at 130℃（Bulk material, ie without Reel)如果硅胶干燥剂已消失或LED 已经超过存储时间，须烘烤处理，烘烤条件：1.130℃烘烤超过12小时(散装材料，即不带卷盘包装)●Please avoid rapaid transitions in ambient temperature,especially in high humidity environments where condensation can ocuur.请避免在高温环境，尤其是高湿度的环境中作业STATIC ELECTRICITY 静电防护●Static electricity or surge voltage damages the LEDsIt is recommended that a wrist band or an anti-electrostaic glove be used when handing the LEDs.静电或过电压会损坏LED ，建议在作业时使用防静电手环或者防静电手套●All devices equipment and machinery must be properly grounded. It isrecommended that precautions be taken against surge voltage to the eauipment that mounts the LEDs.所有设备和机台必须正确接地，以避免过电压加载到LED 上2.Reflow Soldering Profile (Pb-Free)1.Iron:烙铁Soldering Iron:30W Max 烙铁：30W （Max)Temperature 350°C Max 温度：350度（Max)Soldering Time:3 Seconds Max(One Time) 焊接时间：3秒（Max)一次Moisture sensitivity level : level 6. 湿度敏感等级：6级Soldering Condition(Pb-Free) 焊接条件（无铅）Pre-heat 120-150°C Pre-heat time 120 sec. Max.Peak temperature 245°C Max.Dipping time 10 sec. Max.ConditionSee below预热温度120-150°C 预热时间120 sec. Max.峰值温度245°C Max.峰值温度时间10 sec. Max.条件见以下2.回流焊条件 (无铅)温度Temperature2.5-5°C245°CMax时间 TimePre-heating 120-150°C 2.5-5°C/sec120 sec. Max.120 sec. Max.Above200°C 60sec.MaxTest Classifcation TestItemTestCondititonsTestDurationSampleSizeAC/RE0/15PCS5PCS5PCS5PCS5PCS5PCS5PCS5PCS1000Hrs50cycles50cycles1000Hrs1000Hrs1000Hrs5sec3timesLife TestRoom Temperatuer DCOperating Life TestTa=25℃±5℃,IF=50mAThermal Shock Test-10℃±5℃←→+100℃±5℃5min. 10sec. 5minTemperature CycleTest-55℃±5℃←→+85℃±5℃30min. 5min. 30minHigh TemperatureHigh Humidity testTa=85℃±5℃RH=85%±0.5%RHHigh TemperatureStorageTa=100℃±5℃Low TemperatureStorage Ta=-55℃±5℃Resistance toSoldering Heat Ta=245℃±5℃Lead IntegrityLoad 2.5N(0.25kgf)0° ~ 90° ~0°Criteria for Judging The DamageForward VoltageReverse CurrentLuminous IntensityItem Symbol Test ConditionsV FI RI VIF=50mAV R=5VIF=50mACriteria for JudgmentMin.Max.U.S.L.*1.2U.S.L.*2.2L.S.L.**×0.7U.S.L.* : Upper Standard LevelL.S.L.** : Lower Standard LevelEnvironmentTestMechanicalTest0/10/10/10/10/10/10/1。