3528带透镜白光led规格书

ＳＰＥＣＩＦＩＣＡＴＩＯＮ　ＦＯＲ　ＡＰＰＲＯＶＡＬ

Package Dimensions And Materials

Absolute Maximum Rating at TA=25°C

Item

Forward Current Peak Forward Current Reverse Voltage Power Dissipation Electrostaic discharge Operation Temperature Storage Temperature

Lesd Soldering Temperature

Symbol

Absolute Maximum Rating

Unit If Ifp VR PD ESD Topr Tstg Tsol

5015051303000-40 -- +80

Max.245°C for 5sec Max

mA V mW V °C IFP Conditions:Pulse Width ≤10mser duty ≤1/10

Tsol Conditions: 5mm form the base of the epoxy bulb

mA °C

-30 -- +80

Typical Optical/Electrode Characteristic

Vr=5V 50If(rec)

IV Ir IF=50mA Vf mA

uA V 50

10

2.640

----4900--

2.02θ1/2λD --585

8200MCD

deg

Unit Max.Typ.Min.Condition

Symbol Item

Forward Voltage Reverse Current % Power Angle Luminous Intensity Recommend Forward Current

IF=50mA IF=50mA IF=50mA --

--595

NM The Main Wavelength

Typical Optical/Electrode Characteristic Curves (Ta=25℃

Unless Otherwise Noted)

Luminous Spertrum(Ta=25℃)

SPECTRAL RADIANCE

-30°

30°

60°

90°

-90°

-60°0°

100%

80%

60%

40

%

20%

100%

80%

60%

40%

20%

Forward Current vs. Ambient Temperature

Ambient Temperature Ta(°C)

F o r w a r d V o l t a g e V f (V )

Forward Current vs. Ambient Temperature

F o r w a r d C u r r e n t I f (m A )

Forward Voltage Vf(V)

Forward Current vs. Ambient Temperature

Relstive Intensity vs.Ambient Temperature

Ambient Temperature Ta(°C)F o r w a r d C u r r e n t I f (m A )

R e l a t i v e I n t e n s i t y I V (m c d )

Ambient Temperature Ta(°C)

nm

800700

600

6080100500

400

400

20RELATIVE RESPONSE 100%=1.642e-G01

Range of bins

VF Ranks(If=50mA)

Bin Code VF(V)

Bin12.0-2.2

Bin22.2-2.4

Bin32.4-2.6

Bin Code

λD(NM)

Bin1

585-590

Bin2590-595

λ

D Ranks(If=50mA)

IV Ranks(If=50mA)

Bin Code IV(MCD)

6300-8200

4900-6300

Bin25Bin24

MOISTURE PROOF PACKAGE 防潮包装

STORAGE CONDITIONS 储存条件

●When moisture is absorbed into the SMT package it may vaproize and expand during soldering. There is a possibility that this can cause

exfoliation of the contacts and damage the optical characteristics of the LEDs.For this reason ,the moisture proof package is used to keep moisture to a minimum in the package.

当水分吸收到SMT 封装，会可能在焊接过程中扩大，就有可能材料出现剥落和损坏LED 的光学特性；

出于这个原因，防潮铝袋是用来保持水分的最小包装

●The moisture proof package is made absorbent material (silica gel desiccants)is inserted into the aluminium moisture proof bag.将防潮包装制成的吸收性材料(硅胶干燥剂)放入到防潮铝袋中

●The silica gel desiccants change from blue to red if moisture had penertrated bags.

如果有水分进入防潮铝袋中，硅

胶干燥剂由蓝色变为红色

●Before opeing the package :打开包装前

The LEDs should be kept at 30℃ or less and 60％ RH or less.LED 应该保存在≤30℃，≤60%RH 环境中

The LEDs should be used within 3 months.

When storing the LEDs, moisture proof packaging with absorbent material (silica gel desiccants)is recommended.

LED 保存在防潮铝袋真空包装，防潮铝袋中放硅胶干燥剂时，必须在3个月内使用，

●After opening the package :打开包装后

After this bag is opened , devices that will sujected to infraed reflow , vapor -phase reflow , or equivalent processing Must be:

防潮包装打开后，将过回流焊处理时，必须：

a)Mounted within 24 hours at factory condition of ≤30℃/60％RH.在≤30℃/60％RH 环境中24小时内使用完