笔记本电脑主板新图纸(全)
笔记本电脑主板新图纸(全)
29 38 PMH-7G/A Serial ATA I/F USB 2.0 Port1 Mocha-1 Block Diagram 34 Media Slice VCC1R8B S-BAT-PWR CRT UltraSlimBay RJ45 USB2514 USB Hub SMSC MAX6694 Thermal Sensor SMBus SATA Port 1 I/F 20,21,22,23 34 CRT Port Media Slice 195 40 Processor 15 Serial ATA 150MB/s PCI Express CRT I/F G-Sensor 42 CH10 Bluetooth 31 CH8 DDR3 1067/800 Channel A UNBUFFERED DDR3 SODIMM Reverse Socket 204-PIN DDR3 SODIMM 13 14 Channel B DDR3 1067/800 VCC1R05AMT/VCC1R5A VCC5V_OUT VCC3M VCC1R05AMT VCC1R5A VCC1R8B BD3550 VT351A 50 52,53 I2C Bus / SM Bus Thermal Sensor LM26 5
Trace should be less than 0.5 inch 2 2 2 2 2 TPAD302 22 2 22 2 2
E 2 2 22 MAX6694TE9A-2-GP 2 E 22 SC2200P50V2KX-2GP E 22 2 2 2 22 2 2 22
18 Display Port 3029 Azalia bus IOSUB Card Conn. 32 USB 2.0CH5 Media Card Reader 3-in-1 Slot USB 3 USB2.0 CH6VCC1R5A VCC0R75AMT BD3550 MAX1510 Display Port RJ 11Conn Audio Codec IOSUB Card (LCD Conn)HP OUT MIC IN 16
笔记本电脑图纸(全)D500E(1)
Trace Width 12 Mil
AGTL+ Vref To CPU < 1.5" Midway From CPU & GMCH
R100 169 1%
Trace Width 12 Mil
HGTLREF C163 1UF C155 220PF HGTLREF [5]
VCCP
D
R31 R491 R499 R481 R489 R23 R492 R455 R22 R30 R29 R433 R111 R105 RP31 4 3 2 1 RP123 4 3 2 1 +3VS R485 U3 Z0201 15 STBY# VCC 2 3 R64
C
USB Port 1 USB Port 2 USB Port 3 USB Port 4 Blue Tooth Card Reader
SATA Interface USB 2.0/1.1
Hub Link 1.5
MINI PCI
I/O Controller Hub
ICH5
CARD BUS
1394
Clock GEN.
ICH5
12 MHz
XTAL
24 MHz
Keyboard PS2 X2
A
H8 KBC
LPC BUS
NS87393
LPC SIO
Floppy
AC97 LPC IO
XTAL
FAN X 3 BATT. X2 DEBUGB PORT
A
PCIs
Title Size Date: Document Number 2431 星期一, 十二月 15, 2003
VCCP
R98 200 1%
D
通用主板图解华硕联想戴尔
主板图解一块主板主要由线路板和它上面的各种元器件组成1.线路板PCB印制电路板是所有电脑板卡所不可或缺的东东。
它实际是由几层树脂材料粘合在一起的,内部采用铜箔走线。
一般的PCB线路板分有四层,最上和最下的两层是信号层,中间两层是接地层和电源层,将接地和电源层放在中间,这样便可容易地对信号线作出修正。
而一些要求较高的主板的线路板可达到6-8层或更多。
此主题相关图片如下:主板(线路板)是如何制造出来的呢?PCB的制造过程由玻璃环氧树脂(Glass Epoxy)或类似材质制成的PCB“基板”开始。
制作的第一步是光绘出零件间联机的布线,其方法是采用负片转印(Subtractive transfer)的方式将设计好的PCB线路板的线路底片“印刷”在金属导体上。
这项技巧是将整个表面铺上一层薄薄的铜箔,并且把多余的部份给消除。
而如果制作的是双面板,那么PCB的基板两面都会铺上铜箔。
而要做多层板可将做好的两块双面板用特制的粘合剂“压合”起来就行了。
接下来,便可在PCB板上进行接插元器件所需的钻孔与电镀了。
在根据钻孔需求由机器设备钻孔之后,孔璧里头必须经过电镀(镀通孔技术,Plated-Through-Hole technology,PTH)。
在孔璧内部作金属处理后,可以让内部的各层线路能够彼此连接。
在开始电镀之前,必须先清掉孔内的杂物。
这是因为树脂环氧物在加热后会产生一些化学变化,而它会覆盖住内部PCB层,所以要先清掉。
清除与电镀动作都会在化学过程中完成。
接下来,需要将阻焊漆(阻焊油墨)覆盖在最外层的布线上,这样一来布线就不会接触到电镀部份了。
然后是将各种元器件标示网印在线路板上,以标示各零件的位置,它不能够覆盖在任何布线或是金手指上,不然可能会减低可焊性或是电流连接的稳定性。
此外,如果有金属连接部位,这时“金手指”部份通常会镀上金,这样在插入扩充槽时,才能确保高品质的电流连接。
最后,就是测试了。
测试PCB是否有短路或是断路的状况,可以使用光学或电子方式测试。
戴尔DELLD400DP1笔记本主板电路图
monoINT SPKINT MICCODECPCI BUSMEM BUSHOST BUSQSWDDR 266/200SO-DIMM*2CLK GENGMCHTouchPadPS2 SMBusUSB 2.0 KB CONNK/BAC97BIOS LPC BUSUSB 2.0ICH4-MSMsCSIO&KBCPrimary IDE USB*4PCI BUS TPA0312STAC9750LPC BUSHUB I/FMic jack ICS 950810CGMontara-GMOPOP AMPX-BUSMiniPCILPC47N254PCI75101394 conn.RJ45MODEM Gigabit LANBroadcom BCM5705M RJ45X f o r m e rCRT D- DockDVIS-video CONNLCD LVDSSPDIFDVO BMDCS/W MODEM RJ11CH7009BSocketCardBusSLOT*1POWERUSBCPU BaniasLAN SwitchCRTS-video,DVI,CRTVcc_core: 0.7~1.708V @32A Vccp:1.05V @3AVcc_GMCH:1.2V @1.65AVcc_mem:2.5V @1.2A + 2*SO-DIMMIrDAP.10P.11P.11P.19P.24P.25P.25P.25P.25P.25Headphone jackP.26P.27P.31P.31P.31P.3P.4,5P.7,8,9P.12,13,14P.15,16,17P.18P.18P.18P.18P.20P.21P.21P.22P.22P.23P.28,29P.30TPS2211APWR SWP.2191.42Y01.001Pebble Mar.7 '03INPUT +DC_INMAX1645BMAX1632CHARGEROUTPUT BATT++RTC_PWRP.39MAX1644/MAX17923V/5V/12VP.35P.38DDR 2.5V/1.25VSC1486P.37SC1476Vcc_core: 0.7~1.708V @32ACPU CORE POWERP.36VCC_IO:1.05V @3AVcc_GMCH:1.2V @1.65A1.05V/1.2VP.38MAX1715SerialPortP.31P.19QVJ3/5/6Ver.B1Ver.A2Ver.A2500mA02203-SEVCC_mem:2.5V @1.2A+2*SO-DIMMVer.B1BlueToothP.31USB 1.1Module conn.Qual Build QD68QE27Ver.B A11.5V/1.8VCC1Pass 2Cypress CY28346-2PI31301DANCN6000I/F ICP.21Smart CardP.21TitleWistron Corporation21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,Taipei Hsien 221, Taiwan, R.O.C. QQ:453100829A-PDF Watermark DEMO: Purchase from to remove the watermarkCG_* : CPU GTL+CC_* : CPU CMOS P_* : PCI BUS G_* : AGP BUS HL_* : HUB LINK I/F M_* : MEMORY BUS LPC_* : LPC I/FICH_AC_* : AC'97 LINK I/F IDE_* : IDE BUSPCI TABLEDEVICE IDSEL IRQ REQ# / GNT#DREQ/DGNT PCMCIA PCI7510LAN Broadcom BCM5705M MINIPCI SLOTAD19AD16AD17PIRQB#PIRQC#PIRQD#REQ#1 / GNT#1REQ4# / GNT4#REQ3# / GNT3#01.BLOCK DIAGRAM 02.TABLE OF CONTENT 04.CPU05.CPU CONFIGURATION 03.CLOCK GENERATOR 06.MAX6654 & ITP & FAN 07.GMCH (1/3)08.GMCH (2/3)09.GMCH (3/3)12.DDR SOCKET13.DDR SERIAL/TERMINATOR RESISTOR 11.LCD / INVERTER & CRT CONN 15.ICH-4M (1/3)16.ICH-4M (2/3)17.ICH-4M (3/3)18.GIGABIT LAN 19.HDD & MDC CONN.20.CARDBUS CONTROLLER21.CARDBUS & 1394 CONNECTOR & POWER SWITCH 23.MINIPCI CONN B POWER SWITCH & CONN 24.AUDIO CODEC 31.TOUCHPAD, KB ,BLUETOOTH CONN, IR 27.D DOCK 28.SIO (1/2)34.POWER-ON RESET LOGIC 36.CPU VCORE-IMVP4 SC147638.VCC_IO,1.2V, 1.5V, 1.8V 35.DCDC 3V/5V33.POWER PLANE ENABLES 39.CHARGER40.HOLES & GND PADSREQB# / GNTB#PIRQC#D-DOCKPIRQB#REQ0# / GNT0#10.S-VIDEO/DVI14.DDR DECOUPLING CAP 25.AUDIO AMP & JACK 26.D DOCK BUFFERS 29.SIO (2/2)30.BIOS32.LED & BUTTON CONN 37.DDR 2.5V/1.25V & RTC & BIRIDGE BATTERY AD24PIRQD#Montania to Montania+ changes1.Changed VR resistor to generate 1.35V for MGM+ core(R529,R530)2.Changed R112 from 27.4 to 37.4 Ohm (changes HLZCOMP for MGM+)3.Put R612,R613,R614 1K ohm(For Pebble don't need change because we use +1.5VRUN)4.Need Changed PSWING,HLVREF for MGM+ if use MGM core your meet DDR333 require (For Pebble already done)Wistron Corporation21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,Taipei Hsien 221, Taiwan, R.O.C.+DC_IN +1.8VRUN +5VSUS +3VRUN +5VALW +5VRUN+3.3VRTC +3VALW +3VSUSVCC_IO VCC_CORE LCDVDD DOCK_DC_IN CRT_VCC +1.5VRUN +5VHDDAC97_3V AC97_5V +3VAUX_LAN DOCK_PWR_SRCPWR_SRC+5V_QDOCK BATT++2.5VAUX_LAN+1.2VAUX_LAN CBS_VCC CBS_VPP CBS_VCCF +2.5VSUS ICH_VBIAS VCC_RTC +RTCSRC +RTC_PWR+1.25VRUN +1.2VRUN+DC_IN 27,37,39PWR_SRC 11,22,27,33,35,36,37,38,39+1.8VRUN 4,33,38+3.3VRTC 16,28,34,37+5VALW 11,27,28,32,33,34,39+3VRUN 3,4,6,8,9,10,11,12,15,16,17,18,19,23,24,26,28,29,31,32,33,34,36,38,40+5VRUN 6,8,10,11,17,19,23,26,29,31,32,33,34,36,37,40+3VALW 16,25,27,28,29,30,34,40+5VSUS 6,11,17,21,22,24,25,31,32,33,34,35,37,38,40+3VSUS 6,11,15,16,17,18,19,20,21,23,25,27,31,33,34,37,38,40VCC_IO 4,5,6,7,9,16,17,33,38VCC_CORE 5,33,36LCDVDD 11DOCK_DC_IN 27CRT_VCC 11+1.5VRUN 4,7,8,9,10,11,15,17,33+5VHDD 19,33AC97_3V 19AC97_5V 19+3VAUX_LAN 18,23,33DOCK_PWR_SRC 27+5V_QDOCK 26BATT+39+2.5VAUX_LAN 18,27+1.2VAUX_LAN 18CBS_VCC 20,21CBS_VPP 21CBS_VCCF 21+2.5VSUS 6,7,9,12,14,33,37ICH_VBIAS 16VCC_RTC 16+RTCSRC 37+RTC_PWR 34,35,37,39,40+1.25VRUN 13,14,33,37+1.2VRUN 7,9,38 QQ:453100829。
topstar笔记本主板电路图纸(全)
Address
1101 001x 1101 010x 1010 000x 1010 001x 1010 111x 0001 011x 1001 110x
Hex
D2 D4 A0 A2 AE 16 9C
Bus
SMB_ICH_S SMB_ICH_S SMB_ICH_S SMB_ICH_S SMB_ICH_S I2C_591 I2C_591
732 uFCBGA
+V3.3S,+V2.5 +V1.5S,+V1.2S +VCCP
1.6-2.1GB/s
DDR266 SODIMM1
+V1.25S,+V2.5,+V3.3S
C
VGA
Page 16
R/G/B
Page 11,12,13 LAN Controller
RTL8100BL
+V3.3AL
Page 7,8,9 IDE1
With AC IN
G3
With Battery
TOPSTAR TECHNOLOGY Andy Han Page Name Size A4 Project Name Annotations & Information P21i Rev A
A
A
of Date: Monday, April 21, 2003 Sheet 2 46 PROPERTY NOTE: this document contains information confidential and property to TOPSTAR and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that for which it was obtained without the expressed written consent of TOPSTAR
蓝天代工笔记本主板图纸M660SU_M665SU
Appendix B:Schematic DiagramsThis appendix has circuit diagrams of the M660SU/M665SU notebook’s PCB’s. The following table indicates where to find the appropriate schematic diagram.Diagram - Page Diagram - Page Diagram - Page SYSTEM BLOCK DIAGRAM - Page B - 2VT8237A-1 - Page B - 16CHARGER, DC IN - Page B - 30 CLOCK GENERATOR - Page B - 3VT8237A-2 - Page B - 17 1.05VS, 1.5V, 2.5VS - Page B - 31CPU-1 - Page B - 4VT8237A-3 - Page B - 18VCORE - Page B - 32CPU-2 - Page B - 5HDD & CDROM - Page B - 19 1.8V, 0.9VS - Page B - 33VN896-1 - Page B - 6CARD READER - Page B - 20VDD3, VDD5 - Page B - 34VN896-2 - Page B - 7NEW CARD SOCKET - Page B - 21EXT GPU 1.0VS/1.2VS - Page B - 35VN896-3 - Page B - 8LAN - Page B - 22HOTKEY LT BOARD - Page B - 36VN896-4 - Page B - 9USB & CCD - Page B - 23PWR HOT BOARD - Page B - 37DDR2-1 - Page B - 10HITACHI H8 - Page B - 24AUDIO & MODEM BOARD - Page B - 38 DDR2-2 - Page B - 11CRT & LVDS - Page B - 25CLICK BOARD - Page B - 39VGA G72M-1 - Page B - 12CPU FAN, LPC ROM - Page B - 26USB BOARD - Page B - 40VGA G72M-2 - Page B - 13MINI-PCI & BLUETOOTH - Page B - 27FINGERPRINT BOARD - Page B - 41 VGA G72M-3 - Page B - 14AUDIO VT1708A/ALC883 - Page B - 28VGA G72M-4 - Page B - 15LED - Page B - 29Table B - 1SchematicDiagramsVersion NoteThe schematic dia-grams in this chapter are based upon ver-sion 6-7P-M66U7-005.If your mainboard (or other boards) are a lat-er version, please check with the Service Center for updated di-agrams (if required).B-1SYSTEM BLOCK DIAGRAMSheet 1 of 40SYSTEM BLOCKDIAGRAMB - 2 SYSTEM BLOCK DIAGRAMCLOCK GENERATOR B -3B.Schematic DiagramsCLOCK GENERATORSheet 2 of 40CLOCK GENERATORCPU-1Sheet 3 of 40CPU-1B - 4 CPU-1CPU-2 B -5B.Schematic DiagramsCPU-2Sheet 4 of 40CPU-2VN896-1VN896-1B - 6 VN896-1VN896-2 B -7B.Schematic DiagramsVN896-2Sheet 6 of 40VN896-2VN896-3VN896-3B - 8 VN896-3VN896-4 B -9B.Schematic DiagramsVN896-4Sheet 8 of 40VN896-4DDR2-1DDR2-1B - 10 DDR2-1DDR2-2 B -11B.Schematic DiagramsDDR2-2Sheet 10 of 40DDR2-2VGA G72M-1VGA G72M-1B - 12 VGA G72M-1VGA G72M-2 B -13B.Schematic DiagramsVGA G72M-2Sheet 12 of 40VGA G72M-2VGA G72M-3VGA G72M-3B - 14 VGA G72M-3VGA G72M-4 B -15B.Schematic DiagramsVGA G72M-4Sheet 14 of 40VGA G72M-4VT8237A-1Sheet 15 of 40VT8237A-1B - 16 VT8237A-1VT8237A-2 B -17B.Schematic DiagramsVT8237A-2Sheet 16 of 40VT8237A-2VT8237A-3VT8237A-3B - 18 VT8237A-3HDD & CDROM B -19B.Schematic DiagramsHDD & CDROMSheet 18 of 40HDD & CDROMCARD READERSheet 19 of 40CARD READERB - 20 CARD READERNEW CARD SOCKET B -21B.Schematic DiagramsNEW CARD SOCKETSheet 20 of 40NEW CARD SOCKETLANLANB - 22 LANUSB & CCD B -23B.Schematic DiagramsUSB & CCDSheet 22 of 40USB & CCDHITACHI H8HITACHI H8B - 24 HITACHI H8CRT & LVDS B -25B.Schematic DiagramsCRT & LVDSSheet 24 of 40CRT & LVDSCPU FAN, LPC ROMSheet 25 of 40CPU FAN,LPC ROMB - 26 CPU FAN, LPC ROMMINI-PCI & BLUETOOTH B -27B.Schematic DiagramsMINI-PCI & BLUETOOTHSheet 26 of 40MINI-PCI & BLUETOOTHAUDIO VT1708A/ALC883Sheet 27 of 40AUDIO VT1708A/alc883B - 28 AUDIO VT1708A/ALC883LED B -29B.Schematic DiagramsLEDSheet 28 of 40LEDCHARGER, DC INSheet 29 of 40CHARGER, DC INB - 30 CHARGER, DC IN1.05VS, 1.5V,2.5VS B -31B.Schematic Diagrams1.05VS, 1.5V,2.5VSSheet 30 of 401.05VS, 1.5V, 2.5VXVCORESheet 31 of 40VCOREB - 32 VCORE1.8V, 0.9VS B -33B.Schematic Diagrams1.8V, 0.9VSSheet 32 of 401.8V, 0.9VSVDD3, VDD5VDD3, VDD5B - 34 VDD3, VDD5EXT GPU 1.0VS/1.2VS B -35B.Schematic DiagramsEXT GPU 1.0VS/1.2VSSheet 34 of 40EXT GPU 1.0VS/1.2VSHOTKEY LT BOARDSheet 35 of 40HOTKEY LTBOARDB - 36 HOTKEY LT BOARDPWR HOT BOARD B -37B.Schematic DiagramsPWR HOT BOARDSheet 36 of 40PWR HOT BOARDAUDIO & MODEM BOARDSheet 37 of 40AUDIO & MODEMBOARDB - 38 AUDIO & MODEM BOARDCLICK BOARD B -39B.Schematic DiagramsCLICK BOARDSheet 38 of 40CLICK BOARDUSB BOARDSheet 39 of 40USB BOARDB - 40 USB BOARDSchematic DiagramsFINGERPRINT BOARD B-41B.Schematic DiagramsFINGERPRINT BOARDSheet 40 of 40FINGERPRINTBOARDSchematic Diagrams B - 42。
ASUS主板图纸
Engineer:ASUSTeK COMPUTER INCTitle : Engineer:Engineer: ASUSTeK COMPUTER INCAvoid BPSB,PowerASUSTeK COMPUTER INC <Variant Name>Engineer:ASUSTeK COMPUTER INCTitle : Engineer:Engineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCASUSTeK COMPUTER INCTitle : Engineer:ASUSTeK COMPUTER INCTitle : Engineer:ASUSTek COMPUTER INCTitle : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:<OrgName>Title : Engineer:Engineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCASUSTeK COMPUTER INCTitle : Engineer:Engineer: ASUSTeK COMPUTER INCASUSTek COMPUTER INC. NB1Title : Engineer:ASUSTeK COMPUTER INCTitle : Engineer:<OrgName>Title : Engineer:Title : Engineer:Engineer: ASUSTeK COMPUTER INCTitle : Engineer:Title : Engineer:Title : Engineer:SUSPEND : CB_HWSUSP# LO=> PCIRST# LO=> +3VS OFF ASUSTeK COMPUTER INC Engineer:Title : Engineer:Engineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCASUSTeK COMPUTER INCTitle : Engineer:ASUSTeK COMPUTER INCTitle : Engineer:Engineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INCEngineer: ASUSTeK COMPUTER INC<OrgName>Title : Engineer:Title : Engineer:。
华硕ASUS F3Jv rev2.0笔记本电脑维修图纸
Type
PCI Device CARD READER 1394 IDSEL# AD17 AD17 REQ/GNT# 0 0 Interrupts A B
Pin Name
PWM0/GPA0 PWM1/GPA1 PWM2/GPA2 PWM3/GPA3 PWM4/GPA4 PWM5/GPA5 PWM6/GPA6 PWM7/GPA7 RXD/GPB0 TXD/GPB1 GPB2 SMCLK0/GPB3 SMDAT0GPB4 GA20/GPB5 KBRST#/GPB6 GPB7 CLKOUT/GPC0 SMCLK1/GPC1 SMDAT1/GPC2 GPC3 TMRI0/WUI2/GPC4 GPC5 TMRI1/WUI3/GPC6 CK32KOUT/GPC7 RI1#/WUI0/GPD0 RI2#/WUI1/GPD1 LPCRST#/WUI4//GPD2 ECSCI#/GPD3 GPD4 GINT/GPD5 TACH0/GPD6 TACH1/GPD7 ADC4/GPE0 ADC5/GPE1 ADC6/GPE2 ADC7/GPE3 PWRSW/GPE4 WUI5/GPE5 LPCPD#/WUI6/GPE6 CLKRUN#/WUI7/GPE7 PS2CLK0/GPF0 PS2DAT0/GPF1 PS2CLK1/GPF2 PS2DAT1/GPF3 PS2CLK2/GPF4 PS2DAT2/GPF5 PS2CLK3/GPF6 PS2DAT3/GPF7 FA16/GPG0 FA17/GPG1 FA18/GPG2 FA19/GPG3 FA20/GPG4 FA21/GPG5 LPC80HL/GPG6 LPC80LL/GPG7
5
4
3
2
1
01 02 03 04 05 06 07
D
电脑主板各部件详细图解[P]
电脑主板各部件详细图解[21P]大家知道,主板是所有电脑配件的总平台,其重要性不言而喻。
而下面我们就以图解的形式带你来全面了解主板。
一、主板图解一块主板主要由线路板和它上面的各种元器件组成1.线路板PCB印制电路板是所有电脑板卡所不可或缺的东东。
它实际是由几层树脂材料粘合在一起的,内部采用铜箔走线。
一般的PCB线路板分有四层,最上和最下的两层是信号层,中间两层是接地层和电源层,将接地和电源层放在中间,这样便可容易地对信号线作出修正。
而一些要求较高的主板的线路板可达到6-8层或更多。
主板(线路板)是如何制造出来的呢?PCB的制造过程由玻璃环氧树脂(Glass Epoxy)或类似材质制成的PCB“基板”开始。
制作的第一步是光绘出零件间联机的布线,其方法是采用负片转印(Subtractive transfer)的方式将设计好的PCB线路板的线路底片“印刷”在金属导体上。
这项技巧是将整个表面铺上一层薄薄的铜箔,并且把多余的部份给消除。
而如果制作的是双面板,那么PCB的基板两面都会铺上铜箔。
而要做多层板可将做好的两块双面板用特制的粘合剂“压合”起来就行了。
接下来,便可在PCB板上进行接插元器件所需的钻孔与电镀了。
在根据钻孔需求由机器设备钻孔之后,孔璧里头必须经过电镀(镀通孔技术,Plated- Through-Hole technology,PTH)。
在孔璧内部作金属处理后,可以让内部的各层线路能够彼此连接。
在开始电镀之前,必须先清掉孔内的杂物。
这是因为树脂环氧物在加热后会产生一些化学变化,而它会覆盖住内部PCB层,所以要先清掉。
清除与电镀动作都会在化学过程中完成。
接下来,需要将阻焊漆(阻焊油墨)覆盖在最外层的布线上,这样一来布线就不会接触到电镀部份了。
然后是将各种元器件标示网印在线路板上,以标示各零件的位置,它不能够覆盖在任何布线或是金手指上,不然可能会减低可焊性或是电流连接的稳定性。
此外,如果有金属连接部位,这时“金手指”部份通常会镀上金,这样在插入扩充槽时,才能确保高品质的电流连接。
Y470笔记本电脑拆机清灰图文教程
Y470笔记本电脑拆机清灰图文教程无论拆什么笔记本电脑,第一步首先要把电池取出来,按图1箭头所示的方向松开笔记本D壳的电池卡扣,向外一拉电池就取下来了。
取出电池后就可以大胆地拆其它部件了,我们先把D壳的挡板拆下来,看看里面是什么东西,把图2红圈所标示的5颗螺丝卸下来。
热风扇了,如果只是简单清理一下灰尘的话,可以直接在这里用吹风机或皮老虎来吹;如果想深度清理、换硅脂的话,继续往下看教程。
按图4箭头所示方向取出光驱。
拆掉图5红圈所标示的两颗硬盘的螺丝,再把硬盘往右推一下,然后取出硬盘。
拆掉D壳上的15颗螺丝(电池仓4颗、光驱位下3颗、其余8颗)。
天线螺丝拆掉后,无线网卡左边的小盖子不需要拆,只要把无线网卡的天线拆下来就可以了,拆时不要硬拽,向上稍微用点力就把天线拆下来了。
现在我们把笔记本翻过来,C 壳朝上,先来拆卸扬声器,从下面电池仓那边慢慢向上顶,先顶左边,再顶右边,拆的时候注意两根排线,千万不能弄断了,最后结果如下图所示。
现在我们来拆键盘,在键盘上方左右各有一颗螺丝(如图9、图10所示),卸下这两颗螺丝就可以把键盘拆下来了,拆时也要注意键盘的排线。
可硬拽。
按同样的方法拆掉电源开关、一键还原、指示灯的排线和多媒体快捷键的排线,拆卸方法和拆键盘排线一样。
拆卸触摸板排线和喇叭电源线的方法与拆卸键盘排线的方法不一样,这两根排线上没有卡扣,直接把排线拔出来即可,不过在拔的时候一定要小心。
板将喇叭盖板向上掀开并将其取出,最后结果如下图所示。
板和WiFi天线将喇叭盖板向上掀开并将其取出,将W i Fi天线从C壳的卡线槽内取出来,接头从洞内拉出来以便方便顺利卸掉C壳。
找到如图16所示的联想保修贴,如果已经过保的话,直接撕掉;如果还在保修期内的笔记本电脑,可以用电吹风稍微加热后再用刀片慢慢刮下来,以保证这个保修贴的完整性,如果这张保修贴撕破的话,可能会影响质保。
在保修贴的下面有一颗螺丝(图17红圈处所示),取出这颗螺丝,就可以把C壳拆解下来了。
全面讲解电脑主板构造及原理图解
大家知道,主板是所有电脑配件的总平台,其重要性不言而喻。而下面我们就以图解的形式带你来全面了解主板。
一、主板图解 一块主板主要由线路板和它上面的各种元器件组成
1.线路板
PCB印制电路板是所有电脑板卡所不可或缺的东东。它实际是由几层树脂材料粘合在一起的,内部采用铜箔走线。一般的PCB线路板分有四层,最上和最下的两层是信号层,中间两层是接地层和电源层,将接地和电源层放在中间,这样便可容易地对信号线作出修正。而一些要求较高的主板的线路板可达到6-8层或更多。
BIOS多采用Flash ROM(可擦可编程只读存储器),通过刷新程序,可以对Flash
ROM进行重写,方便地实现BIOS升级。
目前市面上较流行的主板BIOS主要有Award BIOS、AMI BIOS、Phoenix
BIOS三种类型。Award BIOS是由Award Software公司开发的BIOS产品,在目前的主板中使用最为广泛。Award
2.北桥芯片
芯片组(Chipset)是主板的核心组成部分,按照在主板上的排列位置的不同,通常分为北桥芯片和南桥芯片,如Intel的i845GE芯片组由82845GE GMCH北桥芯片和ICH4(FW82801DB)南桥芯片组成;而VIA
KT400芯片组则由KT400北桥芯片和VT8235等南桥芯片组成(也有单芯片的产品,如SIS630/730等),其中北桥芯片是主桥,其一般可以和不同的南桥芯片进行搭配使用以实现不同的功能与性能。
423用于早期Pentium4处理器,而Socket 478则用于目前主流Pentium4处理器。
而Socket A(Socket462)支持的则是AMD的毒龙及速龙等处理器。另外还有的CPU插座类型为支持奔腾/奔腾MMX及K6/K6-2等处理器的Socket7插座;支持PII或PIII的SLOT1插座及AMD ATHLON使用过的SLOTA插座等等。
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Title21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,Wistron CorporationTaipei Hsien 221, Taiwan, R.O.C.<Variant Name>1067/800MHzAGTL+ FSBIntel ICH9-MUSB 2.0 (12 ports)LAN Connect I/F (LCI)AC97 2.3/Azalia InterfaceACPI 2.0INT. RTCLPC I/FPCI Rev 2.3L7:GND L3:Signal 1System DC/DCVINT20L4:VCC L8:ComponentL1:Component OUTPUTSL6:Signal 3L2:GND PCB Layer StackupINPUTSTPS51221L5:Signal 2Sep.4VCC3MVCC5M Battery Charger/SelectorADP3808DOCK_PWR20_FM-BAT-PWR VINT20VT1311CPU DC/DCVCCCPUCORE3,47,8,9,10,11,124449Penryn SV IntelIntel Cantiga-GMLVDS INTEGRATED GRAHPICSDDR3 1067/800MHz DMI x4MLF68Clock Generator 35,36H8S/2116BG20VKBCLPC Bus / 33MHz12.1'' WXGA LCDLVDS1617RGB CRT CRT SELECTIONWPCN38539LPC Debug Board Conn2938PMH-7G/ASerial ATA I/FUSB 2.0Port1Mocha-1 Block Diagram34Media Slice VCC1R8BS-BAT-PWRCRT UltraSlimBayRJ45USB2514USB HubSMSC MAX6694Thermal SensorSMBusSATA Port 1 I/F20,21,22,2334CRT PortMedia Slice19540Processor15Serial ATA 150MB/sPCI Express CRT I/FG-Sensor42CH10Bluetooth31CH8DDR3 1067/800Channel A UNBUFFERED DDR3 SODIMM Reverse Socket204-PIN DDR3 SODIMM1314Channel B DDR3 1067/800VCC1R05AMT/VCC1R5AVCC5V_OUTVCC3M VCC1R05AMT VCC1R5AVCC1R8BBD3550VT351A5052,53I2C Bus / SM Bus Thermal Sensor LM265UNBUFFERED DDR3 SODIMM Normal SocketWWAN Card27Mini PCI-E 24Intel GLANBOAZMANWLAN Card 27Mini PCI-E USB 2.0 CH3PCI Express25GBE Switch PI3L500AZFEXMedia Slice34RJ45 Conn263131USB2.0 CH5,6USB 2.0 CH7CH0,1USB 1USB 2Bus Switch ICCH9Finger Print1636Int. KB Track point IVKeyboard LightSPI-FLASHSPI GMCH GFX COREVT451&VT45051VINT20VCCGFXCOREVCC0R75AMT5455VCC1R05AUX/1R8AUX56VCC1R05AUX VCC1R8AUXVCC3MPort0Serial ATA I/F PCI Express USB 2.0 CH2PCI Express UWB28Mini PCI-E USB 2.0 CH4PCI Express 33Express Card SoltSATA HDDSATA CONNSUPER I/O WINBOND Camera (LCD Conn)USB 2.0 CH1107226-2-FinalProject Code: 91.47Q01.001PCB(Raw Card): 48.47Q01.001ITP Conn.6AC Coupling18Display Port3029Azalia bus IOSUB Card Conn.32USB 2.0CH5Media Card Reader 3-in-1 SlotUSB 3USB2.0 CH6VCC1R5A VCC0R75AMTBD3550MAX1510Display Port RJ 11Conn Audio CodecIOSUB Card(LCD Conn)HP OUT MIC IN16Trace should be less than 0.5 inch22222 TPAD3022 22 2222E222 2MAX6694TE9A-2-GP2E2 2SC2200P50V2KX-2GPE2 222222222 2VCC3BM_ODT32C 220R1J-GP 2275R1J-GP 2233R1J-GPTPAD30280D6R1F-GP 24K02R1F-GP 275R1J-GP 21KR1J-GP20R1J-GPAD46K24K02R1F-GP21KR1J-GP22K2R1J-GP 2C 2100KR1J-GP21KR1J-GP 230D1R1F-GP 222K2R1J-GP22K2R1J-GP 2100R1J-GP22K2R1J-GP 2222K2R1J-GP 22K2R1J-GP 22C2382SK3541-3-GP2C448222K2R1J-GP 22K4R2F-GP280D6R1F-GP222230D1R1F-GP 2C 2499R1F-GP2475R1F-GP222100KR1J-GP2275R1J-GP 2C2222C2372222222C2662C220DY2222BLM15EG121SN1D-GP 2222222C19120R3-0-U-GP 22222C460220R0306-PAD-GP 2C4372C2132C1802C4232222222222C233222C2862IND-10UH-106-GP222C2852K 2C24122C 4D 7U 6D 2R54122BLM15EG121SN1D-GP SC22U6D3V5MX-4-GP2U 6D 3V 520R0306-PAD-GP 2IND-10UH-106-GP2C43222C301222C422222C25021SC10U6D3V3MX-GP22222227K32R1F-GP2C463SC1KP50V2KX-1GPDY222222C2052SC2D2U6D3V3MX-1-GPSC2D2U10V3KX-1GP22SCD1U10V2KX-4GP2C1762SCD1U10V2KX-4GP2222SC2D2U10V3KX-1GP2SC2D2U6D3V3MX-1-GP2222SCD1U10V2KX-4GP222SCD1U10V2KX-4GP2222C177222C178VCC3AMT_CLKGEN_SECPUCLK_CPU_266M_R-CPUCLK_CPU_266M_R222R1J-GP 222233R1J-GP 2X-14D31818M-43GP20R1J-GP 233R1J-GP 20R1J-GP2SC22P50V2JN-4GPC660222K2R1J-GP 22C53222222222R1J-GP2SC12P50V2JN-3GP2C524SLG8SP568VTR-4-GP212R1J-GPDY22K2R1J-GP 22C305212R1J-GP DY 22C5262210KR1J-GP 2233R1J-GP 2Close to pinK2222MLX-CONN60A-9-GPU2PDTC114EE-1GPU2222DTC115EE-2-GP2DY42SCD047U25V3KX-GP2C52224545452SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP 2SCD1U10V2KX-4GP222216TC7WT126FU-2GP2SC10P50V2JN-4GPSC10P50V2JN-4GP133332SC10P50V2JN-4GP3222222LPC_AD3254D9R1F-GP 23C65822222KCH520S-30PT-GP222222MLX-CON3-7-GP-UK22222C6732C64122P 22247R1J-GP 215R1J-GP 222P 22P 2P 222SCD1U10V2KX-4GP2P22222P 2522P 2P 22210KR1J-GP93102P92102P22100KR1J-GP 2P20R1J-GP 210KR1J-GP 28K2R1J-GP210KR1J-GP 2P210KR1J-GP2222P 2222C64222222SCD1U10V2KX-4GP 2D 1U 12222SC1U10V2KX-1GP2222C640222SCD1U10V2KX-4GP 2222C495TP702SCD1U10V2KX-4GP 2Keep to place on the same side of GBE KDS:25MHZ / 9PFUSE INTERNAL REGULATOR FOR 1.05V WG82567LM-Q036-GP2C672SC15P50V2JN-2-GP2222222 22 22222R7442 2DY22 2R656222222SKT-JACK-257-GPSC1KP50V2KX-1GP SKT-JACK-257-GP SCD1U10V2KX-4GPSCD1U10V2KX-4GPSKT-JACK-257-GPSC1KP50V2KX-1GP42SC4D7U10V5KX-1GP2SC1U10V2KX-1GP2C321222222C4312222SC1U10V2KX-1GP222222C602VCC3M_SPI233R1J-GP222233R1J-GP 233R1J-GP 22233R1J-GP233R1J-GP 252602222220R0306-PAD-GPSKT-SATA7P+15P-GP-USKT-USB-257-GP2 25 42222425TPS2066DGN-1-GPPDTC115EE-1-GP SDM20U30-7-GP22SDM20U30-7-GP HRS-CON40-5-GP2C6632222222U 1223CARDBUS-SKT99-GP-U12R800DY22222SC6800P25V2KX-1GP21K P 5100KR2J-1-GPEXPRESSCARD-26P-GP-U2227U 6D 222SCD1U50V3KX-GP 2SCD01U16V2KX-3GPK SCD01U16V2KX-3GP20R2J-2-GP SCD1U50V3KX-GPFDS6675BZ-GPSCD1U50V3KX-GP22222DF2116VBG20MSJV-GP K2210KR1J-GP 212330R1J-GPKD822DAP222-1-GP-U 210KR1J-GP21KR1J-GP2212SCD1U25V3KX-GP2C150SDM20U30-7-GP3321KR2J-1-GP DF2116VBG20MSJV-GP 22560R1J-GP3220R1J-GP20R1J-GPK SDM20U30-7-GP225SCD01U16V2KX-3GPK 2282621292722202JAE-CONN40A-1-U1GP233R1J-GP 220R1J-GP5RN1622SCD1U10V2KX-4GP233R1J-GP 2220R1J-GP 2227233R1J-GP 22SC1KP50V2KX-1GP20R1J-GP2232622RN14R 1J -222SCD1U10V2KX-4GPWPCN385DG-GPSRN10KJ-10-GP-UE2220R2J-2-GP E2NC7SZ384P5X-1-GPPDTC115EE-1-GP2NC7SZ384P5X-1-GP2C108SCD1U10V2KX-4GPNC7SZ384P5X-1-GP22C109SCD1U10V2KX-4GP2C145SCD1U10V2KX-4GP 222C110SCD1U10V2KX-4GP 22C144SCD1U10V2KX-4GP222222NC7SZ384P5X-1-GP 2222SCD1U16V2KX-3GPFDC658AP-GP222SCD1U10V2KX-4GPSCD1U10V2KX-4GPSCD1U10V2KX-4GP16SCD1U10V2KX-4GPE2247U 2522FDS6675BZ-GP122PDTC115EE-1-GPE FUSE-D5A32V-10-GPPDTC115EE-1-GP 2222E 2FUSE-D5A32V-10-GPPDTC115EE-1-GP2DAP222-1-GP-U222SCD01U50V2KX-1GP2SC2200P50V2KX-2GP22252252C350222C3972C 3402222C4622C2022C2822220R2J-2-GP ADP3808AJCPZS3-GP22222C342SCD01U25V2KX-3GPPDTC115EE-1-GP2S 22SCD1U25V3KX-GPSI3483DV-T1-GPDAN222-1-GP2DAN222-1-GP2470KR1J-GP22C352G P 212AMP-CON7-10-GP2C3532FUSE-10A125V-4GPE2DY22222SCD1U10V2KX-4GP22DY 222SC1KP50V2KX-1GPK 21002232222222232C782222222R101SC10U25V6KX-2GP2C872222522C13252DY22220R2J-2-GP 2D 1U 22C6322C8422252222R81222C154SC10U25V6KX-2GP5U15D2C4582VCORE_DB0Close to U51,pin32L8 PA2143NL_PA215-->CPL-2-50-R28K66R2D-GP 24K7R2D-GP20R2J-2-GP 2210KR2J-3-GP 239K2R2D-GP210KR2J-3-GP SRN0J-11-GP-U22VT1311SFCX-GP-U2100KR2F-L1-GP 222IND-350NH-1-GP210KR2J-3-GP 2DY2DY210KR2J-3-GP24K7R2D-GP210KR2J-3-GP 210KR2J-3-GP SRN0J-10-GP-U 210K7R2D-1-GP 268R2-GP2211KR2D-1-GP2222211K3R2D-GP 211KR2D-1-GP 20R2J-2-GP22DY2DY。