评估板DSP56311EVM.

合集下载

第四章：DSP的开发环境

C 编译器的优化
C编译器的效率取决于所作的优化的范围和数量。TMS320的C编译器能作很宽范围的多种优化，从而改善其编译所得代码的效率。 TMS320的C编译器所作的优化分为适用于所有处理器的通用优化和针对特定片种的专门优化
汇编语言工具
TMS320的汇编语言工具是一个软件包，其中包括：汇编器连接器归档器交叉引用列表器十六进制转换公用程序
第五章 DSP的开发环境与工具
一般估计，一个嵌入式系统，开发的80%的努力，以及系统的 80%的复杂程度，取决于软件。因此，设计人员在为实时系统选择处理器时，都极为看重先进的、易于使用的开发环境与工具。
DSP的开发环境和工具
代码生成工具（编译器，连接器，优化C编译器，转换工具等）系统集成及调试环境与工具实时操作系统
用户实验代码
DES PC插卡
DES的图形化中文界面
信号源
虚拟示波器
虚拟频谱仪
VC5402实验板
VC5402实验板
1. 2. 3. 4. 5. 6. 7. 8. 9. 两路独立的A/D和D/A通道 HPI接口引脚 32KB启动FLASH RAM（占用地址0x8000-0x0FFFF） 16K外部数据存储器（占用地址0x4000-0x7FFF） 32K外部程序存储器（占用地址0x38000-0x3FFFF）方便灵活的外部电源输入（+6v - +18v） McBSPs串口引脚 TMS320VC5402-PGE100 JTAG引脚
集成化的DSP开发环境CCS
主机和目标机之间的实时数据交换（RTDX）实时分析和数据可视化目前可用于WIN95、 WIN98和NT4等多种操作系统。
基于WIN的图形化界面

i.MX 6SoloLite 评估板快速入门指南说明书

MCIMXHDMICARD.i.MX 6SoloLite Evaluation Kit Quick Start Guidei.MX 6SoloLite Evaluation KitQuick Start GuideAbout the i.MX 6SoloLite Evaluation KitThe i.MX 6SoloLite evaluation kit (EVK) offers a solid platform to evaluate thei.MX 6 series single-core applications processor built on ARM® Cortex®-A9 technology as well as a reference for future designs. Key features of this platform include:• i.MX6SL single Cortex-A9core operating up to 1 GHz• 1 GB LPDDR2 (400 MHz)• SPI NOR• SD socket for external devices• SD socket for boot code• SD socket for Wi-Fi® and accessories • eMMC expansion footprint• Audio codec • EPDC expansion port• Parallel display port• Port for CSI CMOS sensor (camera)• SIM card slotButton matrix• Ethernet• Lithium battery charger• USB host, USB OTG and USB to UART ports2 Getting StartedThe i.MX 6SoloLite EVK includes the following items:• Board: MCIMX6SLEVK• Cables: Micro USB-B-2-USB-Type A male, V2.0• Power supply: 100/240 V input, 5 V, 2.4 A output W/AC adaptor• Documentation: Quick Start Guide (this document)• Two SD cards: Programmed Android™34Figure 1: Front side of i.MX 6SoloLite EVK (top)Quick Start GuideOvervoltage LEDMain PowerLEDPMIC on LEDMicrophoneParallelDisplayPortSIM Card SlotEPDCExpansionPortPort for CSICMOS Sensor(Camera)ButtonMatrixGet to Know the i.MX 6SoloLite EVK5Figure 2: Back side of i.MX 6SoloLite EVK (bottom)5 V PowerJackMini PCIe(Only USB connection is supplied for Mini PCIe connector)USB HostUSB OTGLi Cell ConnectorsOn/Off SwitchEthernet Connector JTAG Connector Boot ModeSelection Switch USB to UARTConnectorBootSelection SwitchesHeadphone ConnectorSpeaker OuteMMC Expansion FootprintSD Socket for Wi-Fi and SD Accessories(SD3)SD Socket for Primary External Card Slot (SD1)SD Socket for Boot Code (SD2)Quick Start Guide Setting Up the Board1Insert SDCardInsert the supplied SD card into the SD2 card slot.2Set Up BootSwitchesBy default, boot switches are configured to boot from SD2. If any other boot source is desired, boot switches have to be configured according to Table 1. 3Connect USB toUART CableConnect from USB to UART port (J26) using a micro USB cable to PC. Once the PC recognizes the virtual USB to UART device, it can be seen it in your PC Device Manager list.Serial port configuration: 115.2 Kbaud, 8 data bits, 1 stop bit, no parity.Note: The PC needs a driver to enable a virtual COM port through the PC USB port. Visit /drivers/vcp.htm to download the correct driver.4Connect EPDC orParallel DisplayConnect by means of the IMXEBOOKDC3-E board, which has to be connected to J12 and J13. For more information about this board, please visit .5ConnectPower DisplayConnect 5 V power supply into power jack J6 and set SW14 to the On position.6 Setting Up the Board (cont.)The i.MX 6SoloLite EVK is compatible with the following daughter cards through the LCD extension slot:• MCIMX28LCD—LCD daughter card*• MCIMXHDMICARD—HDMI daughter card• IMXEBOOKDC3-E—EPD daughter card* E VK does not natively support the resistive touchscreen on the LCD and HDMI cards. Use a USBmouse to navigate when using the LCD or HDMI cards. Touch is supported on the EPDC card.7Quick Start GuideThe Android BSP is provided on two different SD cards, depending upon the display daughter card used.LCD/HDMI SD Card for Booting AndroidThe default boot mode configures the system to display the UI on the MCIMX28LCD (sold separately).To change the default configuration and enable the MCIMXHDMICARD daughter card (sold separately), hit any key to stop u-boot from proceeding. Once prompt is visible, the u-boot can be configured as follows:For LCD boot up, type the following commands (as one line):setenv bootargs console=ttymxc0,115200 init=/initandroidboot.console=ttymxc0 panel=lcdsaveenvresetFor HDMI boot up, type the following commands (as one line):setenv bootargs console=ttymxc0,115200 init=/initandroidboot.console=ttymxc0 panel=hdmisaveenvresetEPDC SD Card for Booting AndroidThe default settings should be used and no change is needed.8 Boot Options and Switch ConfigurationTable 1: Boot OptionsS1_2S1_1BOOT_MODE1BOOT_MODE0Boot from fuses00Serial downloader D01Internal boot10Reserved11Table 2: SW3 ConfigurationSW3_8SW3_7SW3_6SW3_5SW3_4SW3_3SW3_2SW3_1BT_CFG1_0BT_CFG1_1BT_CFG1_2BT_CFG1_3BT_CFG1_4BT_CFG1_5BT_CFG1_6BT_CFG1_7 SD1******010SD2D******010SD3******010SD4******010 eMMC X X***110SPI NOR X X X X1100X None specifiedDefault configuration* Switch needs to be configured for high or low depending on the application needs.Please check reference manual for boot configuration options.** 1 = power cycle on power-up via SDa_RST_B (SD3_RST). 0 = no power cycle910Quick Start GuideBoot Options and Switch Configuration (cont.)Table 4: SW5 ConfigurationSW5_8SW5_7SW5_6SW5_5SW5_4SW5_3SW5_2SW5_1BT_CFG4_0BT_CFG4_1BT_CFG4_2BT_CFG4_3BT_CFG4_4BT_CFG4_5BT_CFG4_6BT_CFG4_7SD1XX X X X X X X SD2DX X X X X X X X SD3X X X X X X X X SD4X X X X X X X X eMMC X X X X X X X X SPI NOR1XXTable 3: SW4 ConfigurationSW4_8SW4_7SW4_6SW4_5SW4_4SW4_3SW4_2SW4_1BT_CFG2_0BT_CFG2_1BT_CFG2_2BT_CFG2_3BT_CFG2_4BT_CFG2_5BT_CFG2_6BT_CFG2_7SD1*X X 001**SD2D*X X 101**SD3*X X 011**SD4*X X 111**eMMC ***10011SPI NORXXXXXXXXXNone specified Default configuration* Switch needs to be configured for high or low depending on the application needs.Please check reference manual for boot configuration options.** 1 = power cycle on power-up via SDa_RST_B (SD3_RST). 0 = no power cycleJumper and Solder Short ConfigurationTable 5: Jumper and Solder Short ConfigurationReference Shunt Installation FunctionJ161–2Use pins 1 and 2 to connect an external charger 2–3Shunt 2–3 to experiment with USB charging Open D No chargerJ171–2D 5 V rail supplied by PMIC (600 mA limited) 2–3 5 V rail supplied from wall adapterJ181–2Mini-PCIe connector J8 supply voltage connected Open D Mini-PCIe connector J8 supply voltage unconnectedSH121–2D MX_USB_HOST_D_P connected to USB type A connector 2–3J10-USB_HOST_D_PMX_USB_HOST_D_P connected to PCIE_USB_HOST_D_PSH131–2D MX_USB_HOST_D_N connected to USB type A connector 2–3J10-USB_HOST_D_NMX_USB_HOST_D_N connected to PCIE_USB_HOST_D_NSW141–2D0 2–3Default configurationTips and PrecautionsThe i.MX 6SoloLite includes an overvoltage protection circuit that will disconnect the power supply from the system by opening transistor Q1 in case the supply voltage exceeds 5.5 V. The user must take into account this is the maximum voltage that can be plugged into J6.Further Documentation• MX6SL EVK schematics• MX6SL EVK BOM• MX6SL EVK gerber files• MX6SL EVK reference manualComplete documentation is availableat /6SLEVK.11SupportVisit the i.MX community at . WarrantyVisit /warranty for completewarranty information.For more information, visit /iMX6series Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. © 2012, 2014 Freescale Semiconductor, Inc.Doc Number: IMX6SLEVKQSG REV 2 Agile Number: 926-27452 REV BMCIMXHDMICARD.。

maxim-max7311evkit-evkit-评估板-说明书

Evaluates: MAX7311MAX7311 Evaluation KitGeneral DescriptionThe MAX7311 evaluation kit (EV kit) provides a proven design to evaluate the MAX7311 I 2C-compatible 16-bit I/O port expander, with each port configurable as input or push-pull output. The EV kit also includes Windows ® 2000/XP/Vista ®-compatible software that provides a simple graphical user interface (GUI) for exercising the features of the MAX7311. The MAX7311 EV kit PCB comes with a MAX7311ATG+ installed.Features●Windows 2000/XP/Vista (32-Bit)-CompatibleEvaluation Software ●USB-PC Connection (Cable Included) ●USB Powered●Configurable Input or Push-Pull Output ●Proven PCB Layout ●Fully Assembled and Tested ●RoHS Compliant●On-Board Pushbutton Switches●On-Board LEDs for Demonstrating the Push-PullCapabilities of the GPIOs19-4151; Rev 1; 10/20Windows and Windows Vista are registered trademarks of Microsoft Corp.#Denotes RoHS compliant*EP = Exposed pad.PART TYPE MAX7311EVKIT#EV KitDESIGNATION QTY DESCRIPTIONC1, C12, C14310μF ±20%, 16V X5R ceramic capacitors (1206)Murata GRM31CR61C106M C2, C3222pF ±5%, 50V C0G ceramic capacitors (0603)Murata GRM1885C1H220J C410.033μF ±10%, 16V X5R ceramic capacitor (0603)Taiyo Yuden EMK107BJ333KA C5–C10, C17, C18, C2090.1μF ±10%, 16V X7R ceramic capacitors (0603)TDK C1608X7R1C104K C11, C13, C131μF ±10%, 16V X5R ceramic capacitors (0603)TDK C1608X5R1C105K C15, C16210pF ±5%, 50V C0G ceramic capacitors (0603)Murata GRM1885C1H100J D1, D3, D5, D7, D9, D11, D13, D158Green LEDs (0603)D2, D4, D6, D8, D10, D12, D14, D168Red LEDs (0603)J11USB series type-B right-angle PC-mount receptacleDESIGNATION QTY DESCRIPTIONJU0, JU1, JU235-pin headers JU3, JU4, JU533-pin headers L11Ferrite beadR1, R2227Ω ±5% resistors (0603)R3, R17, R18,R194 1.5kΩ ±5% resistors (0603)R51 2.2kΩ ±5% resistor (0603)R6, R36, R37310kΩ ±5% resistors (0603)R101169kΩ ±1% resistor (0603)R111100kΩ ±1% resistor (0603)R12–R160Not installed; resistors—short (PC trace) (0603)R4, R20–R3517470Ω ±5% resistors (0603)S1, S22Pushbutton switches U11I/O port expander (24 TQFN-EP*)Maxim MAX7311ATG+U21Adjustable output LDO regulator (5 SC70)Maxim MAX8512EXK+T U31LDO regulator (5 SC70)Maxim MAX8511EXK25+T U41UART-to-USB converter (32 TQFP)FTDI FT232BLOrdering InformationComponent ListClick here to ask about the production status of specific part numbers.Quick StartRecommended EquipmentBefore beginning, the following equipment is needed:●MAX7311 EV kit (USB cable included)● A user-supplied Windows 2000/XP/Vista-compatiblePC with a spare USB portNote: In the following sections, software-related items are identified by bolding. Text in bold refers to items directly from the EV kit software. Text in bold and underlined refers to items from the Windows operating system.ProcedureThe MAX7311 EV kit is fully assembled and tested. Follow the steps below to verify board operation:1) Visit /evkit-software todownload the latest version of the EV kit software, 7311Rxx.ZIP. Save the EV kit software to a temporary folder and uncompress the ZIP file.2) Install the EV kit software on your computer by run-ning the INSTALL.EXE program inside the temporary folder. The program files are copied and icons are created in the Windows Start | Programs menu.3) Verify that all jumpers (JU0–JU5) are in their defaultpositions, as shown in Table 1.4) Connect the USB cable from the PC to the EV kitboard. A New Hardware Found window pops up when installing the USB driver for the first time. If youdo not see a window that is similar to the one describedabove after 30 seconds, remove the USB cable from the board and reconnect it. Administrator privileges are required to install the USB device driver on Windows. 5) Follow the directions of the Add New HardwareWizard to install the USB device driver. Choose the Search for the best driver for your device option.Specify the location of the device driver to be C:\Program Files\MAX7311 (default installation directory) using the Browse button. During device driver installation, Windows may show a warning message indicating that the device driver Maxim usesdoes not contain a digital signature. This is not an error condition and it is safe to proceed with instal-lation. Refer to the USB_Driver_Help.PDF document included with the software for additional information. 6) Start the MAX7311 EV kit software by opening its iconin the Start | Programs menu. The EV kit software main window appears, as shown in Figure 1.7) Wait approximately five seconds for the program toautomatically detect the slave address (0x40) of the MAX7311 in the I2C Addresses group box.8) Set I/O0–I/O7 to outputs by selecting all Outputradio buttons in the Configuration group box.9) Verify that all red LEDs are brightly lit.*EP = Exposed pad.Note: Indicate that you are using the MAX7311 when contacting these component suppliers.DESIGNATION QTY DESCRIPTIONU5193C46 type 3-wire EEPROM (8 SO) Atmel AT93C46A-10SU-2.7U61Microcontroller (68 QFN-EP*) Maxim MAXQ2000-RAX+Y1116MHz crystalCitizen Finedevice Crystals HCM4916000000ABJTY216MHz crystalCitizen Finedevice Crystals HCM496000000ABJTY30Not installed, crystal—6Shunts—1USB high-speed A-to-B cables, 6ft —1PCB: MAX7311 Evaluation Kit+SUPPLIER PHONE WEBSITE CitizenFinedeviceCo. Ltd.(Crystal)+81-267-31-1111cfd.citizen.co.jp/englishMurataElectronicsAmerica, Inc. Taiyo TDK SUPPLIER WEBSITEINSTALL.EXE Installs the EV kit files on your computer MAX7311.EXE Application programFTD2XX.INF USB device driver fileUNINST.INI Uninstalls the EV kit software USB_Driver_Help.PDF USB driver installation help fileComponent List (continued)Component SuppliersMAX7311 EV Kit FilesDetailed Description of SoftwareTo start the MAX7311 EV kit software, double-click on the MAX7311 EV kit icon that is created during installation. The GUI main window appears, as shown in Figure 1. Port 1 and Port 2 TabsThe Port 1 tab sheet shown in Figure 1 controls all of the registers for I/O0–I/O7 of the MAX7311. In the Configuration group box, the user can set the I/O port as an input or output by selecting the adjacent Input or Output radio buttons.In the Input Port group box, press the Read button to read the input port status.Check the desired checkboxes and press the Write button in the Polarity Inversion group box to invert the polarity of the corresponding port pins. Uncheck the checkboxes and press the Write button to obtain the default polarity of the corresponding port pins.Figure 1. MAX7311 EV Kit Software Main Window (Port 1 Tab)Check or uncheck the desired checkboxes and press the Write button in the Output Port group box to write the port settings to the MAX7311.The Port 2 tab sheet shown in Figure 2 contains the same functions as the Port 1 tab sheet to control the registers for I/O8–I/O15.Bus Timeout CheckboxCheck the Bus Timeout checkbox to enable the bus-timeout function.Interrupt Status Group BoxThe Interrupt Status group box shows the current status of the MAX7311 INT pin (active-low latching-transition-detection interrupt output).Figure 2. MAX7311 EV Kit Software Main Window (Port 2 Tab)I 2C Addresses Group BoxThe I 2C slave address of the MAX7311 depends on the jumper settings of JU0, JU1, and JU2. The I2C Addresses drop-down list automatically detects the MAX7311’s I 2C slave address when the GUI software starts. The default I 2C slave address, when the EV kit is shipped, is 0x40.Reconnect ButtonIf the jumper settings of JU0, JU1, and JU2 change, press the Reconnect button to automatically detect the new I 2C slave address of the MAX7311.Detailed Description of HardwareThe MAX7311 has 16 I/Os, configurable as push-pull outputs or inputs. The MAX7311 EV kit board provides a proven layout for evaluating the MAX7311. The EV kit comes with a MAX7311ATG+ installed.I 2C Address ConfigurationThe combinations of shunt position of jumpers JU0,JU1, and JU2 determine the I 2C slave address of theMAX7311 device. Refer to the MAX7311 IC data sheet for appropriate settings.Output Evaluations of I/OsThere are eight red LEDs and eight green LEDs on the EV kit to demonstrate the push-pull capability of the I/Os. When an I/O is configured as an output and the logic level is high, the corresponding red LED will be on and the green LED will be off. If the logic level is low, the corre-sponding green LED will be on and the red LED will be off.Input Evaluations of I/OsTwo pullup resistors and two pushbuttons are connected to I/O8 and I/O9 of the MAX7311. Press pushbutton S2 to drive I/O8 low and press pushbutton S1 to drive I/O9 low.User-Supplied Power SupplyBy default, the MAX7311 EV kit is powered by USB. To use the user-supplied power supply, place a shunt on pins 2-3 of JU5, cut the trace between pins 1-2 of JU5, and connect a 2.5V to 3.3V power supply to the VIN pad.User-Supplied I 2C InterfaceTo use the MAX7311 EV kit with a user-supplied I 2C interface, install shunts on pins 2-3 of JU3 and JU4. Connect SDA, SCL, and GND lines from the user- supplied I 2C interface to the SDA, SCL, and GND pads on the MAX7311 EV kit. Place a shunt on pins 2-3 of JU5, cut the trace between pins 1-2 of JU5, and connect a 2V to 5.5V power supply to the VIN pad.Table 1. MAX7311 EV Kit Jumper Descriptions (JU0–JU5)*Default position JUMPERSSHUNT POSITIONDESCRIPTIONJU01-2Connects AD0 to SCL 1-3Connects AD0 to SDA 1-4*Connects AD0 to GND 1-5Connects AD0 to VCC JU11-2Connects AD1 to SCL 1-3Connects AD1 to SDA 1-4*Connects AD1 to GND 1-5Connects AD1 to VCC JU21-2Connects AD2 to SCL 1-3Connects AD2 to SDA 1-4*Connects AD2 to GND 1-5Connects AD2 to VCCJU31-2MAX7311 SCL signal connected to on-board microcontroller 2-3Connects user-supplied SCL signal to the on-board SCL pad JU41-2*MAX7311 SDA signal connected to on-board microcontroller 2-3Connects user-supplied SDA signal to the on-board SDA padJU51-2*MAX7311 V+ is set to the on-board 3.3V supply powered from the USB port 2-3Connects user-supplied external supply to the VIN padFigure 3a. MAX7311 EV Kit Schematic (Sheet 1 of 2)Figure 3b. MAX7311 EV Kit Schematic (Sheet 2 of 2)1.0”Figure 4. MAX7311 EV Kit Component Placement Guide—Component SideFigure 5. MAX7311 EV Kit PCB Layout—Component SideFigure 6. MAX7311 EV Kit PCB Layout—Solder SideMaxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.© 2020 Maxim Integrated Products, Inc. │ 11Evaluates: MAX7311MAX7311 Evaluation Kit REVISION NUMBER REVISION DATEDESCRIPTION PAGES CHANGED 05/08Initial release —110/20Updated Ordering Information , Features, Component List, Component Suppliers,and Figure 41, 2, 8Revision HistoryFor pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https:///en/storefront/storefront.html.。

INMP441 MEMS麦克风评估板说明书

UG-362 I2S Daughter Board User GuideGENERAL DESCRIPTIONThe EVAL-INMP441Z is an evaluation board that works with the EVAL-INMP441Z-FLEX and the Analog Devices’ system demonstration platform (SDP) to allow quick evaluation of the performance of the INMP441 MEMS microphone. This evaluation system can be used to stream two channels of audio from two INMP441 microphones to a PC over a USB connection. The system identifies itself to a PC as a standard USB audio interface; therefore, no additional drivers or software are required to run the system. One EVAL-INMP441Z-FLEX board is included in the evaluation kit. The SDP-B controller board is purchased separately from Analog Devices.The EVAL-INMP441Z board also provides hardware control and probe/test points to examine the digital signals of theINMP441.QUICK START GUIDETo quickly start up the evaluation board and capture audio on a PC, follow these steps. These steps are described in greater detail in the rest of this user guide.1.Connect at least one EVAL-INMP441Z-FLEX board to theEVAL-INMP441Z daughter board (see Figure 1).2.Connect the EVAL-INMP441Z daughter board to the SDP-B controller board.3.Connect a jumper across J9 and make sure that J8 is notpopulated.4.Push both switches of S1 to the right (enable) position.5.Provide a 5 V to 6 V supply to J4.6.Connect a mini-USB cable from a PC to J1 on the SDP-Bcontroller board.The PC should recognize the system as an audio interface using standard audio drivers. You can now use the microphones to record one or two channels of audio with any software that uses the standard audio driver (see the Software Setup section).PLEASE SEE THE LAST PAGE FOR AN IMPORTANT WARNING AND LEGAL TERMS AND CONDITIONS.HARDWARE OVERVIEWFigure 1 shows a photo of the EVAL-INMP441Z daughter board with one EVAL-INMP441Z-FLEX board plugged into the ZIF connector. Figure 2 shows the dimensions of the evaluation board.Figure 1. Evaluation Board Photo 1432-1InvenSense reserves the right to change the detail specifications as may be required to permitimprovements in the design of its products.InvenSense Inc.1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339Document Number: UG-362-00Revision: 1.1Rev Date: 04/28/2014UG-362Dimensions shown in millimetersSETTING UP THE EVALUATION BOARDHARDWARE SETUP PowerThe EVAL-INMP441Z board is powered with a single 5 V to 6 V supply from either Barrel Connector J4 or Pin Header J5. The dc supply connected to J4 should be positive-tip. The micro-phones are configured to run with a single 1.8 V supply, but the supply can be set to either 2.5 V or 3.3 V by mounting a 0 Ω resistor on R17 or R11, respectively, and removing R18.LED D1 is illuminated when the board is powered on. With V DD = 1.8 V, the LED is only faintly lit.Power is supplied to the EVAL-INMP441Z-FLEX board through Voltage Regulator U5.The power supply connected to the EVAL-INMP441Z board also powers the SDP-B controller board through Connector J3. The microphone board requires only a few milliamps of current, but the SDP-B controller board requires up to 200 mA at 5 V.JumpersThe J8 and J9 jumper headers on the EVAL-INMP441Z board set the clock source and select the boot code.Header J8 does not need to be shorted with a jumper for the default clocking configuration. When J8 is populated, the 3.072 MHz crystal on the EVAL-INMP441Z board generates the master clock for the SPORT interface of the Blackfin® processor. By default, however, the microphone clocks are generated on the Blackfin processor.Header J9 selects the source of the code to boot the Blackfin processor on the SDP-B controller board. To use theevaluation system to stream USB audio to a PC, a jumper must be shorted across Header J9. Without the jumperpresent, the Blackfin processor boots the standard SDP code and does not perform USB streaming audio.These settings for J8 and J9 are illustrated in Figure 3.Figure 3. Top View of EVAL-IN MP441Z Board with Default Switchand Jumper Settings10432-00210432-003Document Number: UG-362--00 Page 2 of 9Revision: 1.1Rev Date: 04/28/2014UG-362SwitchesSwitch Block S1 has two SPST switches to control the CHIPEN pins of the two INMP441 microphones. When the switches are in the left position, the microphones are disabled; when the switches are in the right position, the microphones are enabled. Switch 1 (bottom switch) controls the leftmicrophone, and Switch 2 (top switch) controls the right microphone. The switch settings in Figure 3 show the microphones enabled.Flex Board ConnectionsThe EVAL-INMP441Z daughter board includes two headers, J1 and J2, to connect two INMP441 microphone flex boards (EVAL-INMP441Z-FLEX). The EVAL-INMP441Z-FLEX board connects all the pins of the INMP441 to copper contacts on the edge of the flex board.The EVAL-INMP441Z-FLEX board can be inserted directly into a ZIF connector, such as J1 or J2 on the EVAL-INMP441Zboard. A microphone connected to Header J1 is configured tooutput its data to the left channel of the I 2S data stream, and the microphone connected to Header J2 is configured to output its data to the right channel.The EVAL-INMP441Z-FLEX boards slide easily into the ZIF connectors on the EVAL-INMP441Z board. Follow these steps to install the flex boards.1. Loosen the black clamp on the J1 or J2 connector bypulling it to the right.2. Insert the flex board into the connector with the coppercontacts facing down.3. After the flex board is fully inserted, tighten the blackclamp to fasten the flex board in the connector. When properly connected, the sound port of the microphone is pointed up (see Figure 4). When two flex boards areconnected, the microphone sound ports are spaced 21 mm apart.Figure 4. EVAL-INMP441Z with Two Flex Boards Connected to an SDP-B Controller BoardSDP-B ConnectionThe EVAL-INMP441Z board connects to the Blackfin SDP-B controller board through Connector J3. The EVAL-INMP441Z board can be connected to either CON A or CON B on the SDP-B controller board; these two connectors provideidentical functionality. After you connect the EVAL-INMP441Z board to the SDP-B controller board but before you connect the USB jack of the SDP-B board to a PC, connect the power to the EVAL-INMP441Z board. After the system is powered on, you can connect the USB cable between the PC and J1 on the SDP-B controller board.The EVAL-INMP441Z board connects to the SDP-B controller board using a Hirose FX8-120P-SV1(91) connector on the SDP-B board. For more information about the SDP-B controller board, see the SDP User Guide (UG-277).The ADSP-BF527 Blackfin DSP on the SDP-B controller board is booted from code stored in the SPI flash memory IC (U7) on the EVAL-INMP441Z board.10432-004Document Number: UG-362--00 Page 3 of 9Revision: 1.1Rev Date: 04/28/2014UG-362I2S Monitoring HeaderThe I2S signal output from the INMP441 microphones canbe monitored on Header J7. The WS and SCK clock signals aresupplied from the SDP-B controller board, whereas the SDdata signal is output from the microphones. Note that HeaderJ7 cannot be used to supply clocks directly to themicrophones because the level translator (U6) is configuredto always drive the clock signals.SOFTWARE SETUPThe SDP-B/EVAL-INMP441Z system does not require newsoftware to be installed on the PC. The system identifies itselfas a standard audio class device and uses the standardWindows® audio drivers. Therefore, the system can be usedby any PC software that can record audio through thestandard drivers.The EVAL-INMP441Z board is identified in the WindowsDevice Manager as INMP441 USB Audio (see Figure 5).One or two channels of audio can be recorded at a samplerate of 48 kHz.Figure 5. Windows Device ManagerThe evaluation system functions as a USB audio device inWindows XP, Windows Vista®, and Windows 7. The PC audiosettings show both a Microphone and a Line setting forINMP441 USB Audio. These items have identical function-ality; either can be selected with no functional differences.The sensitivity of the IN MP441 is −26 dBFS. If the microphoneis used to record voices at normal conversational levels, thelevel of the recording may be somewhat low. To boost thelevel of the recorded audio, try applying gain to the signal in therecord path of the recording software (a gain of 10 dB to 20 dB isrecommended).The following sections provide instructions for setting upseveral popular software tools to listen and record with theEVAL-INMP441Z system.Windows Sound SettingsYou can control the properties of the INMP441 USB audiodevice in Windows as follows. (The following steps and thescreenshot in Figure 6 are for Windows 7. For other versionsof Windows software, this procedure may vary.)1.Right-click the speaker icon in the taskbar and selectRecording devices.2.Ensure that the IN MP441 USB audio microphone device isenabled and active.3.Select Properties for the device to display the MicrophoneProperties window.4.In the Microphone Properties window, click the Listen tab(see Figure 6).Figure 6. Windows Microphone Properties Window5.Select the box labeled Listen to this device and click Apply.The Listen to this device option allows you to loop themicrophone audio back to the audio output of the PC,either through the internal speakers or throughexternally connected headphones or speakers.1432-51432-6Document Number: UG-362--00 Page 4 of 9Revision: 1.1Rev Date: 04/28/2014UG-362You should now be able to hear the microphone audiodirectly on the PC audio output. If you are using speakersinstead of headphones with your PC, do not place themicrophones too close to the speakers because audiblefeedback can be created.Audacity Sound SettingsAudacity® is a free audio recording and editing tool. To recordaudio using the EVAL-INMP441Z system, you can select eitherMicrophone (INMP441 USB Audio) or Line (INMP441 USBAudio) as the recording device in the Audacity Preferenceswindow (see Figure 7). The version tested was Audacity 1.3.Figure 7. Audacity Preferences WindowAdobe Audition SettingsAudition® is the Adobe® multitrack audio recording tool. Torecord audio using the EVAL-INMP441Z system, you canselect either Microphone (INMP441 USB Audio) or Line(INMP441 USB Audio) as the default input in the AuditionPreferences window (see Figure 8). The version tested wasAdobe Audition CS5.5.Figure 8. Adobe Audition Preferences Window1432-71432-8Document Number: UG-362--00 Page 5 of 9Revision: 1.1Rev Date: 04/28/2014UG-362EVALUATION BOARD SCHEMATICFigure 9. Schematic of the Evaluation Board74L V C 125A _S S O P 141Document Number: UG-362--00 Page 6 of 9Revision: 1.1Rev Date: 04/28/2014UG-362TABLE 1. BILL OF MATERIALSQTY REFERENCE DESCRIPTION MANUFACTURER PART NUMBER6 C1 to C6 Capacitor, multilayer ceramic, 1 μF, 16 V, X7R, 0603 Taiyo Yuden EMK107BJ105KA-TR 2 C7, C8 Capacitor, multilayer ceramic, 27 pF, 50 V, NP0,0402 Murata ENA GRM1555C1H270JZ01D 2 C9, C10 Capacitor, SMD tantalum, 10 μF, 6.3 V, 0805 Rohm TCP0J106M8R8 C11 to C14,C19 to C22 Capacitor, multilayer ceramic, 0.10 μF, 16 V, X7R,0402 Panasonic EC ECJ-0EX1C104K1 C15 Capacitor, multilayer ceramic, 0.10 μF, 16 V, X7R,0402 (not installed) Panasonic EC ECJ-0EX1C104K3 C16 to C18 Capacitor, multilayer ceramic, 22 pF, 50 V, NP0,0402 Murata ENA GRM1555C1H220JZ01D1 D1 Diode, green diffused, 10 mcd, 565 nm, 1206 Lumex Opto SML-LX1206GW-TR2 D2, D3 Schottky diode, 30 V, 0.5 A, SOD-123 On Semiconductor MBR0530T1G2 J1, J2 FPC connector, 1 × 10-pin, surface mount, horizontal AMP 1-84952-01 J3 120-way connector, 0.6 mm pitch Hirose FX8-120S-SV1 J4 Mini power jack, 0.08”, R/A, T/H Switchcraft, Inc. RAPC722X1 J5 2-pin header, unshrouded jumper, 0.10” Sullins ConnectorSolutions PBC02SAAN1 J6 10-way, shrouded polarized header,2 × 5 (notinstalled) 3M N2510-6002RB1 J7 6-way, unshrouded header,2 ×3 Sullins ConnectorSolutions PBC03DAAN2 J8, J9 2-pin header, unshrouded jumper, 0.10”; use shuntTyco 881545-2 Sullins ConnectorSolutions PBC02SAAN5 R1, R2, R12,R19, R27 Chip resistor, 10 kΩ, 1%, 63 mW, thick film, 0402Rohm MCR01MZPF1002 3 R3, R4, R18 Chip resistor, 0 Ω, 5%, 100 mW, thick film, 0402 Panasonic EC ERJ-2GE0R00X 3 R5, R6, R22 Chip resistor, 100 kΩ, 1%, 63 mW, thick film, 0402Rohm MCR01MZPF100313 R7 to R9, R11,R17, R20, R21,R23 to R26,R28, R29Do not install1 R10 Chip resistor, 68.1 Ω, 1%, 63 mW, thick film, 0402Yageo RC0402FR-0768R1L2 R30, R31 Chip resistor, 2.67 kΩ, 1%, 63 mW, thick film, 0402;do not install Vishay/Dale CRCW04022K67FKEDDocument Number: UG-362--00 Page 7 of 9Revision: 1.1Rev Date: 04/28/2014UG-362QTY REFERENCE DESCRIPTION MANUFACTURER PART NUMBER1 R32 Chip resistor, 1 MΩ, 1%, 63 mW, thick film, 0402Rohm MCR01MZPF1004 1 R33 Chip resistor, 1.3 kΩ, 1%, 63 mW, thick film, 0402Vishay/Dale CRCW04021K30FKED 1 R34 Chip resistor, 2 kΩ, 1%, 100 mW, thick film, 0402 Panasonic EC ERJ-2RKF2001X3 R35 to R37 Chip resistor, 100 Ω, 1%, 63 mW, thick film, 0402Rohm MCR01MZPF1000 1 S1 2-section SPST SMD dip switch, raised actuator CTS Corp 219-2LPST8 TP1 to TP8 Mini test point, white, 0.1” OD Keystone Electronics 50021 U1 256 kb I2C CMOS serial EEPROM Microchip 24AA256-I/ST2 U2, U3 Inverter, SGL TinyLogic, SOT-23 Fairchild Semiconductor NC7SZ04M5X1 U4 IC, quad buffer, three-state, 14-TSSOP Texas Instruments 74LVC125APWT1 U5 Fixed triple-output low dropout voltage regulator Analog Devices, Inc. ADP322ACPZ-135-R7 1 U6 IC, bidirectional volt-level translator, 16-DQFN Fairchild Semiconductor FXL4TD245BQX1 U7 32 Mb serial flash Numonyx (Micron) M25P32-VMW6G 1 Y1 Crystal, 3.072 MHz, SMT, 18 pF Abracon ABLS-LR-3.072MHZ-TSUPPORTING DOCUMENTSUG-303: User Guide, EVAL-INMP441Z-FLEX: Bottom-Port I2S Output MEMS Microphone Evaluation BoardUG-277: Analog Devices User Guide, SDP-B Controller BoardESD CAUTIONESD (electrostatic discharge) sensitive device.Charged devices and circuit boards candischarge without detection. Although thisproduct features patented or proprietaryprotection circuitry, damage may occur ondevices subjected to high energy ESD.Therefore proper ESD precautions should betaken to avoid performance degradation orloss of functionality. EVALUATION KIT CONTENTS EV_INMP441 Daughter BoardEV_INMP441-FX Board5 V Power SupplyDocument Number: UG-362--00 Page 8 of 9 Revision: 1.1Rev Date: 04/28/2014UG-362COMPLIANCE DECLARATION DISCLAIMERInvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.©2014 InvenSense, Inc. All rights reserved.Document Number: UG-362--00Revision: 1.1Rev Date: 04/28/2014。

Microsemi IGLOO2 FPGA 评估板说明书

IGLOO2 FPGA Evaluation KitQuickstart CardKit Contents—M2GL-EVAL-KITQuantity Description1IGLOO2 FPGA 12K LE M2GL010T-1FGG484 Evaluation Board 112 V, 2 A AC power adapter1FlashPro4 JTAG programmer1USB 2.0 A-Male to Mini-B cable1Quickstart cardOverviewThe Microsemi IGLOO®2 FPGA Evaluation Kit makes it easier to develop embedded applications that involve motor control, system management, industrial automation, and high-speed serial I/O applications such as PCIe, SGMII, and user-customizable serial interfaces. The kit offers best-in-class feature integration coupled with the lowest power, proven security, and exceptional reliability. The board is also small form-factor PCIe-compliant, which allows quick prototyping and evaluation using any desktop PC or laptop with a PCIe slot.The kit enables you to:• Develop and test PCI Express Gen2 x1 lane designs• Test signal quality of the FPGA transceiver using the full-duplex SerDes SMA pairs• Measure the low power consumption of the IGLOO2 FPGA• Quickly create a working PCIe link with the included PCIe Control Plane DemoHardware Features• 12K LE IGLOO2 FPGA in the FGG484 package (M2GL010T-1FGG484)• 64 Mb SPI flash memory• 512 Mb LPDDR• PCI Express Gen2 x1 interface• Four SMA connectors for testing the full-duplex SerDes channel • RJ45 interface for 10/100/1000 Ethernet • JTAG/SPI programming interface• Headers for I2C, SPI, and GPIOs• Push-button switches and LEDs for demo purposes• Current measurement test pointsRunning the DemoThe IGLOO2 FPGA Evaluation Kit is shipped with the PCI Express Control Plane demo preloaded. Instructions on running the demo design are available in the IGLOO2 FPGA Evaluation Kit PCIe Control Plane Demo user guide. See the Documentation Resources section for more information. ProgrammingThe IGLOO2 FPGA Evaluation Kit comes with a FlashPro4 programmer. Embedded programming with the IGLOO2 FPGA Evaluation Kit is also available, and it is supported by the Libero SoC v11.4 SP1 or later.Jumper SettingsJumper Development Kit Function Pins Factory DefaultJ23Selects switch-side MUX inputsof A or B to the line side 1–2 (input A to the line side) thatis on board 125 MHz differentialclock oscillator output will berouted to line sideClosed2–3 (input B to the line side)that is external clock requiredto source through SMAconnectors to the line sideOpenJ22Selects the output enablecontrol for the line side outputs 1–2 (line-side output enabled)Closed 2–3 (line-side output disabled)OpenJ24Provides the VBUS supply toUSB when using in Host mode OpenJ8Selects between RVI headeror FP4 header for applicationdebug1–2 FP4 for SoftConsole/FlashPro Closed2–3 RVI for Keil ULINK/IARJ-Link Open2–4 for toggling JTAG_SELsignal remotely using the GPIOcapability of the FT4232 chipOpenJ3Selects either the SW2 inputor the ENABLE_FT4232 signalfrom the FT4232H chip1–2 for manual power switchingusing the SW7 switch Closed2–3 for remote power switchusing the GPIO capability of theFT4232 chipOpenJ31Selects between FTDI JTAGprogramming and FTDI slaveprogramming1–2 for FlashPro FTDI JTAGprogramming Closed2–3 for SPI slave programming OpenJ32Selects between FTDI SPI andSC_SCI header 1–2 for programming throughFTDI SPI Closed 2–3 for programming throughSC_SPI header OpenJ35Selects between FP4 headerand FTDI JTAG 1–2 for programming throughFP4 header Closed 2–3 for programming throughFTDI JTAG Open©2016–2017 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996Email:***************************Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself Software and LicensingLibero ® SoC Design Suite offers high productivity with its comprehensive, easy-to-learn, easy-to-adopt development tools for designing with Microsemi’s low power Flash FPGAs and SoC. The suite integrates industry standard Synopsys Synplify Pro ® synthesis and Mentor Graphics ModelSim ® simulation with best-in-class constraints management and debug capabilities.Download the latest Libero SoC release/products/fpga-soc/design-resources/design-software/libero-soc#downloads Generate a Libero Silver license for your kit/products/fpga-soc/design-resources/licensingDocumentation ResourcesFor more information about the IGLOO2 FPGA Evaluation Kit, including user’s guides, tutorials, and design examples, see the documentation at /products/fpga-soc/design-resources/dev-kits/igloo2/igloo2-evaluation-kit#documentation .SupportTechnical support is available online at /soc/support and by email at **********************Microsemi sales offices, including representatives and distributors, are located worldwide. To find your local representative, go to /salescontacts。

AMC1210EVM模块评估板用户指南说明书

1EVM Overview1.1Analog InterfaceUser's GuideSLAU185–August 2006Contents1EVM Overview ......................................................................................12EVM Operation ......................................................................................33AMC1210Modular EVM Bill of Materials ........................................................4The AMC1210modular evaluation module (EVM)provides four modulator channels from the ADS1204for the AMC1210.Two are designated for resolver applications and two are designated for current measurements.All interface modes of the AMC1210are provided.The new modular EVM form factor allows for direct evaluation of the AMC1210’s operating characteristics.This EVM is compatible with the HPA-MCU Interface Board from Texas Instruments.•Four modulator channels provided by ADS1204•All AMC1210interface modes available•Direct operation with a variety of DSK and microcontroller platforms from Texas Instruments •All four ADS1204channels have an input range of 0V to 5V.The AMC1210modular EVM is designed for easy interfacing to resolvers and current sensors.Connector J05is a 9-pole DSUB jack for easy connection to standard resolvers.To hold the floating resolver inputs to a predefined common mode level,a 2.5-V voltage is added on the resolver inputs.SignalDescription J05.1IN1+Positive sine wave input J05.2IN1–Negative sine wave input J05.3IN2+Positive cosine wave input J05.6PWM1Positive carrier wave output J05.7PWM2Negative carrier wave output J05.8IN2–Negative cosine wave input Shield PE Cable shieldAt the connectors J03and J04,analog current sensor signals can be connected.SignalDescription J03.1,J04.1IN3+,IN4+Positive current input signal J03.2,J04.2PE Cable shield J03.3,J04.3IN3–,IN4–Negative current input signalSLAU185–August 2006AMC1210EVM 11.2Digital InterfaceEVM OverviewJ07is a dummy connector for mechanical stability purposes only.The inputs of the ADS104are secured against voltage peaks through clamp diodes.The AMC1210modular EVM is designed for easy interfacing to multiple control platforms.Through theconnectors J09and J08,the AMC1210can be configured through a SPI interface from a F2812type DSK.SignalDescription J08.1CLK System clock J08.2SH2Sample-and-hold signal 2J08.7SH1Sample-and-hold signal 1J09.3SPICLK SPI clock J09.7SPISTE SPI frame sync J09.11SPIDIN SPI input data J09.13SPIDOUT SPI output data J09.14RST Asynchronous reset input J09.15ACK Data acknowledge output J09.19INT Interrupt outputThrough J08,J09,J10,and J11,the AMC1210can be configured through one of three differentmultiplexed parallel interface modes.Signal (1)Description J08.1CLK System clock J08.2SH2Sample-and-hold signal 2J08.7SH1Sample-and-hold signal 1J09.14RST Asynchronous reset input J10.1CS Chip select J10.3WR Write signal J10.5RD Read signal J11.1AD0Address/databus bit 0(LSB)J11.3AD1Address/databus bit 1J11.5AD2Address/databus bit 2J11.7AD3Address/databus bit 3J11.9AD4Address/databus bit 4J11.11AD5Address/databus bit 5J11.13AD6Address/databus bit 6J11.15AD7Address/databus bit 7(MSB)J09.15ACK Data acknowledge output J09.17ALE Address latch enable J09.19INT Interrupt output (1)All even pin numbers of the connectors J10,J11,J12,and J15are grounded.All digital signals can be accessed through the connectors J12,J13,J14,and J15on the top of the AMC1210modular EVM.The different signals are placed at the same position as the bottom-mounted connectors,see the preceding tables.For higher frequencies on the CLK input of the AMC1210,it could be possible to reduce the value of the series resistor R47.AMC1210EVM 2SLAU185–August 20061.3Power Supply 2EVM Operation EVM OperationThe AMC1210modular EVM requires two supply voltages and two optional supply voltages.A5-Vdc voltage is needed for the ADS1204and the core of the AMC1210.A variable supply in the range of2.7 Vdc to5Vdc is needed for the interface pins of the AMC1210.In addition,a±15-V supply is necessary if the PWM driver operational amplifier OPA1632is used.If the AMC1210modular EVM is used incombination with theBoard,J06provides connection to the common power busdescribed in the documentWhen used as a stand-alone EVM,the power supplies can be applied to J01and J02.While filters are provided for all four power supplies,optimal performance of the EVM requires a clean,well-regulatedpower source.To configure a desired interface mode of the AMC1210the jumpers JP09,JP10,and JP16are used.Jumper DescriptionJP09JP10JP16Open Open Open SPI interface modeOpen Closed Closed Parallel interface mode1Closed Open Closed Parallel interface mode2Closed Closed Closed Parallel interface mode3(Factory default condition)The jumpers JP01,JP06,and JP11determine the clocking scheme of the ADS1204.Jumper DescriptionJP01JP06JP111-2Closed Open Open The ADS1204gets the clock from AMC1210pin CLK4.2-3Closed Open Closed The ADS1204gets the system clock.(Factory default condition)2-3Closed Closed Open The ADS1204works with its internal clock.The jumpers JP07and JP08choose the driver of the PWM output pins for the resolver carrier signal.Jumper DescriptionJP07,JP081-2Closed The PWM signal is driven directly from the AMC1210.2-3Closed The PWM signal is driven by the operational amplifier OPA1632.(Factory default condition)The AMC1210can drive up to100mA directly from the pins PWM1and PWM2.The purpose of theoperational amplifier OPA1632is for the ability of filtering the carrier signal and still be capable of driving 85mA.If the OPA1632operational amplifier is not used,the±15-V supply can be left unconnected.In this case,it is recommenced to remove the resistors R24and R26to prevent latchup effects in the operational amplifier and nonlinearities on the PWM outputs.The jumpers JP02,JP03,JP04,and JP05determine if the current sensor signals will be buffered orconnected directly to the ADS1204inputs.Jumper DescriptionJP02,JP03,JP12,JP13,JP04,JP05JP14,JP151-2Closed Closed The current sensor signal is buffered.(Factory default condition)2-3Closed Open The current sensor signal is unbuffered.SLAU185–August2006AMC1210EVM3 AMC1210Modular EVM Bill of MaterialsThe ADS1204has a reference input pin for each channel and a reference output pin.This reference input pin normally is direct connected to the2.5-V reference output pin through a buffer and a RC-low-passfilter.If the input signal span is from either the resolver or the current sensor,a resistive divider can be added to reduce the reference voltage at the input pin.The resistor R53has to be soldered in to reduce the reference voltage for the resolver channels.The resistor R55has to be soldered in to reduce thereference voltage for the current sensor channels.3AMC1210Modular EVM Bill of MaterialsThe following table contains a complete bill of materials for the AMC1210EVM.Designators Description Manufacturer Mfg.Part Number C01,C14,C16,C25,C03410µF,size A,tantalum,16V,10%Kemet T491A106K016AS C02,C04,C06,C08,C09,100nF,0805,ceramic,50V,10%,X7R TDK C0805C104K5RAC C15,C17,C18,C20,C22,C26–30,C35,C36,C44C45C10–C1322pF,0805,ceramic,50V,10%,COG TDK C0805C220K5GAC C19,C2110µF,size C,tantalum,20V,10%Kemet T491C106K020AS C23,C241000pF,0805,ceramic,50V,10%,X7R TDK C0805C102K5RAC C31–C33,C4333µF,size D,tantalum,16V,10%Kemet T491D336K016AS C37–C421µF,0805,ceramic,16V,10%,X7R TDK C0805C105K4RAC D01Zener diode,7.5V,1.3W Fairchild BZX85C7V5D02,D03Zener diode,18V,1.3W Fairchild BZX85C18D04–D09,D15,D16Small signal diodes,SOT23Fairchild BAV99D10–D13LED,SMT1206,Green Kingbright KPTD-3216CGCK D14Zener diode,5.1V,1.3W Fairchild BZX85C_5V1F1-F4(Optional-not installed Filter,EMI suppression,0.5MHz-1GHz,50VDC,Murata BNX002-01on production EVMs)10AMJ01-J043Terminal screw connector OST ED1515J05DB9,RTANG RECPT0.318W/STD HDWR Assmann ADF09LLFJ06(bottom side)5pin,dual row,SMT socket Samtec SSW-105-F-D-VS-K J07–J10(bottom side)10pin,dual row,SMT socket Samtec SSW-110-F-D-VS-K J11(bottom side)16pin,dual row,SMT socket Samtec SSW-116-F-D-VS-K J12(top side)16pin,dual row,SMT header Samtec TSM-116-01-T-DV J13-J15(top side)10pin,dual row,SMT header Samtec TSM-110-01-T-DV JP01–JP05,JP07,JP083Pin header Samtec TSW-103-07-L-SJP06,JP09–JP162Pin header Samtec TSW-102-07-L-SR01,R04,R05,R08,R13,10.0Ω,0805,0.100W,1%Vishay/Dale CRCW080510R0F R16,R19,R22,R58,R59,R60–R65R02,R03,R06,R07 4.99kΩ,0805,0.10W,1%Vishay/Dale CRCW08054991F R11,R12,R14,R15,R17, 2.0kΩ,0805,0.100W,1%Vishay/Dale CRCW08052001F R18,R20,R21,R24,R26,R52,R54R23,R28,R29,R51,R56,R7410.0kΩ,0805,0.100W,1%Vishay/Dale CRCW08051002F R25,R27 2.49kΩ,0805,0.100W,1%Vishay/Dale CRCW08052491F R30–R39200Ω,0805,0.100W,1%Vishay/Dale CRCW08052000F R40–R46,R48,R72,R73 1.0kΩ,0805,0.100W,1%Vishay/Dale CRCW08051001F R47511Ω,0805,0.100W,1%Vishay/Dale CRCW08055110F R53,R55Not installedR57,R70,R71100kΩ,0805,0.100W,1%Vishay/Dale CRCW08051003F R66,R67 1.50kΩ,1206,0.125W,1%Vishay/Dale CRCW12061501F R68332Ω,1206,0.125W,1%Vishay/Dale CRCW12063320F4AMC1210EVM SLAU185–August20063.1AMC1210Modular EVM Schematic AMC1210Modular EVM Bill of MaterialsDesignators Description Manufacturer Mfg.Part Number R69511Ω,1206,0.125W,1%Vishay/Dale CRCW12065110F U01AMC1210Texas Instruments AMC1210RHAU02ADS1204Texas Instruments ADS1204IU03OPA4354Texas Instruments OPA4354UU04OPA2347Texas Instruments OPA2347UAU05-U07SN74LVC2G157Texas Instruments SN74LVC2G157DCT U08OPA1632Texas Instruments OPA1632UAThe schematic diagram is shown on the following page.SLAU185–August2006AMC1210EVM5EVALUATION BOARD/KIT IMPORTANT NOTICETexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling the product(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30 days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement of patents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling the product.This notice contains important safety information about temperatures and information on TI’s environmental and/or safety programs,please contact the TI application engineer orNo license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15 of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of this equipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of+15V to-15V and the output voltage range of0V to5V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there are questions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than30°C.The EVM is designed to operate properly with certain components above60°C as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2006,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyLow Power Video&ImagingWirelessWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

CP3113 EVA KIT Rev1.1 评估板用户手册说明书

Subject: 应用文档 AN22019 Rev 1.1 20131017 Model Name: CP3113 EVA KIT Rev1.1评估板用户手册CP3113 EVA KIT Rev1.1评估板用户手册1CP3113概述CP3113是一款立体声D类音频放大器，工作电压范围7V至25V。

在12V电源电压下，8欧姆负载单通道输出功率可达10W（10%THD）。

通过增益设置管脚GAIN1和GAIN0可以配置四种基础增益模式（20dB、26dB、32dB、36dB）。

芯片内置了功率管理功能，启动后可以有效防止输出功率过大导致喇叭损伤，专用的功率管理架构保证了输出被较好的控制在非常小的失真范围，即使在输入信号失控过大的状态下也可保持非常理想的输出音质。

当系统要求工作在大功率输出模式下，进一步提高效率成为芯片能保持良好工作状态的前提条件，将PBTL引脚悬空后CP3113可以实现通道并行驱动，在该模式下两路输出驱动管合并输出可以降低50%的导通电阻，进一步提高芯片的驱动效率，满足大功率工作模式下的散热需求。

CP3113具备完善的保护模式，通过FAULTN可以设置芯片在触发保护后的恢复方式，当FAULTN 悬空时候，芯片需要重新上电或通过使能引脚复位保护状态，当FAULTN接EN引脚时候，芯片将在触发保护关闭输出400ms后自动恢复。

1.1 封装图图 1CP3113封装图1.2 引脚定义序号名称描述1 EN 使能引脚，内置120K 下拉电阻2 FAULTN 保护设置引脚，内置500K 下拉电阻该引脚悬空：触发过流保护和DC 保护后需要重新上电恢复该引脚接EN ：芯片触发保护模式后可以自动延时恢复工作3 INP_L 左通道差分输入正端4 INN_L 左通道差分输入负端5 GAIN0增益配置引脚，内置300K上拉电阻至GVDD 6 GAIN1增益配置引脚，内置300K上拉电阻至GVDD 7 AVCC模拟电源8 AGND模拟地9 GVDD芯片内部产生的低压工作电源10 PLIMIT 功率管理配置引脚，高有效11 INN_R 右通道差分输入正端12 INP_R 右通道差分输入负端13 NC NC14 PBTL 并行输出模式配置引脚，内置300K上拉电阻15\16 PVCC_R 右通道功率电源17 BSP_R右通道正输出功率管自举驱动端口18 OUTP_R右通道正输出端口19 PGND 功率地20 OUTN_R右通道负输出端口21 BSN_R右通道负输出功率管自举驱动端口22 BSN_L 左通道负输出功率管自举驱动端口23 OUTN_L左通道负输出端口24 PGND 功率地25 OUTP_L左通道正输出端口26 BSP_L 左通道正输出功率管自举驱动端口27\28 PVCC_L 左通道功率电源2CP3113评估板介绍2.1CP3113评估板原理图图 2 CP3113评估板原理图2.2CP3113评估板PCB图图 3 CP3113评估板PCB图（TOP View）2.3器件设置说明序号器件名设置说明备注1 J1 PVCC2 J2,J3 GND3 J4,J5 INNR,INPR4 J6，J7 INPL,INNL5 J8,J9 OUTP_L,OUTN_L6 J10,J11 OUTN_R,OUTP_R7 JP6,JP7 单端输入控制，接GND为单端模式8 JP1 芯片EN端9 JP13 PLIMIT控制端10 JP2，JP3 G0，G1，增益控制11 JP14 不接，测试用12 JP4 FAULT是否连接EN端13 X1 3.5mm音频接口调试步骤：1)去掉JP1即 EN信号跳线帽。

MAX25603评估板说明书

MAX25603EVKIT#Click here to ask an associate for production status of specific part numbers.MAX25603 Evaluation KitEvaluates: MAX25603319-100847; Rev 0; 12/21General DescriptionThe MAX25603 evaluation kit (EV kit) provides a provendesign to evaluate the MAX25603 automotive high-voltage, high-brightness LED buck-boost controller. The EV kit operates from a 5V to 60V DC supply voltage. The EV kit is configured to deliver up to 1A to one or two strings of 1 to 15 LEDs. The total voltage of each string can vary from 0V to 60V. The anode of the LED strings should go to LED1+ or LED2+ terminals and the cathodes to the GND terminal. Shunting FETs are provided to emulate a combination headlamp in which a single LED string can contain the clearance lamp (CLL), low beam (LB), and high beam (HB) all in one. Each can be independently turned on or off by shorting across the appropriate segments of the LED string.Features•5V to 60V Input Voltage Range•Demonstrates Use in Combination Headlamps and Multistring, Time-Sharing Applications •Analog and Digital Dimming Control •Input Current Limit•LED Current Clamp Function•Output Discharge for Faster Transient Time •LED Short and Open Protection •Proven PCB Layout•Fully Assembled and TestedOrdering Information appears at end of data sheet.Quick StartRequired Equipment•MAX25603 EV kit•12V, 5A DC power supply •Signal generator•Series-connected LED strings rated to at least 1.5A •Oscilloscope with a current probeProcedureThe EV kit is fully assembled and tested. Use the following steps below to verify board operation:Caution: Do not turn on power supply until all connections are made. Be sure not to violate power ratings if modifying component values.1.Verify that all jumpers are in their default positions, asshown in Table 1.2.Connect the positive terminal of the 12V supply toVINP1 and the negative terminal to the PGND.3.Connect the anode a LED string to LED1+ and thecathode to GND on the EV kit.4.Clip the current probe on the wire connected to the LEDstring.5.Turn on the DC power supply.6.Apply 5V to EN1.7.Verify that the LEDs turn on.8.Adjust potentiometer R3 until the LED current isapproximately 1A.EV Kit PhotoMAX25603 Evaluation KitEvaluates: MAX2560319-XXXXXX; Rev 0; MM/YYTable 1. Jumper Connection GuideSetup and Operation1.Verify that all jumpers are in their default positions, as shown in Table 1.2.Connect the positive terminal of the 12V supply to VINP1 and the negative terminal to the PGND.3.Connect the anode a LED string to LED1+ and the cathode to GND on the EV Kit.4.Clip the current probe on the wire connected to the LED string.5.Turn on the DC power supply.6.Apply 5V to EN1.7.Verify that the LEDs turn on.8.Adjust potentiometer R3 until the LED current is approximately 1A.Clearance Lamp (CCL), Low Beam (LB), High Beam (HB)Shunting FETs Q7, Q9, Q10, and Q11 are provided to emulate an application in which a single MAX25603 device can drive the clearance lamp, daytime running lamps, low beam, and high beam functions all from a single LED string. The following procedure describes how to configure this EV kit to drive the LED configuration shown in Typical Application Circuit .MAX25603 Evaluation Kit Evaluates: MAX256039.With jumper J6 closed, connect the daytime running lamp LEDs between LED2+ and DRL-. The clearance lampLEDs are connected between DRL- and LB.10.Short LED1+ to LB+. The low beam LEDs are connected between LB+ and HB. The high beam LEDs areconnected between HB and GND.11.Controlling each individual segment is done by driving the gates of the appropriate shunting FETs high or low.The clearance lamp and daytime running lamps can be dimmed simultaneously by applying a 5V 200Hz PWM signal at EN1. While EN1 is low, EN2 must be high to conduct the clearance and daytime running lamps. A level shifter is provided for driving the gate of the Q7 pMOS.12.Apply a 5V signal to the gate of Q8 to turn the daytime running lamps off. If desired, the SHUNT pin can be tiedto EN1. When SHUNT is low, the error amplifier of the MAX25603 uses the compensation network on COMP1.COMP2 is connected to the error amplifier when SHUNT is high. Using the SHUNT pin also enables the output discharge feature.Detailed Description of HardwareThis evaluation kit should be used with the following documents:•MAX25603 data sheet•MAX25603 EV kit data sheet (this document)These documents, or links to them, are included on the MAX25603 EV kit package. For the latest versions of the documents listed above, use the following link: /MAX25603EN1 and EN2—PWM DimmingEN1 and EN2 are input signals that control GTP1 and GTP2, respectively, as well as the switching of MAX25603. If both EN1 and EN2 are low, the MAX25603 is in the off state. If both EN1 and EN2 are high, EN1 has priority, and GTP1 is on while GTP2 is off. PWM dimming can be achieved on either channel by keeping the respective jumper J4 or J5 open and applying an external PWM signal to either EN1 or EN2. Move either jumper to position 1-2 keeps that channel on 100% and moving that jumper to 2-3 keeps that channel off. If simultaneously toggling between EN1 and EN2, ensure that there is at least a 1µs deadtime between the falling edge of one EN and the rising edge of the other EN. For the typical application circuit in Figure 1, keep EN2 high and toggle EN1 to implement PWM dimming on the CLL and DRL LEDs. Analog Dimming Control (ICTRL)When J1 is closed, the LED current is set by resistive divider from VCC. The equation to set the LED current is:I LED=(V ICTRL−200mV)/(5×R24||R25)Use a screwdriver to turn the potentiometer R3 to adjust ICTRL. If ICTRL is greater than 1.3V, the LED current is limited to:I LED=1.1V/(5×R24||R25)For time sharing applications in which EN1 and EN2 are alternately dimmed, a different LED current setting can be desired on each string. R4 and Q1 are provided to lower the programmed current. Place jumper J2 in position 1-2 for a lower LED current on the EN2 or in position 2-3 for a lower LED on the EN1 string. By default, J2 is open and the LED current is the same for both strings. Analog Devices | 3MAX25603 Evaluation KitEvaluates: MAX25603 Analog Devices | 4LED Current Clamp and Output DischargeWhen closing any of the shunting FETs, the total LED string voltage is initially too high that causes the LEDs to conduct a large amount of current until the output capacitor decreases to the appropriate value for the desired programmed current. A unique feature with the MAX25603 is the ability to drive the PMOS on GTP1 and GTP2 as linear current clamps to limit the LED current and protect the LEDs. This clamp level is set to 25% greater than the current set by ICTRL. If the current clamp is triggered concurrently to a rising edge on the SHUNT pin, the MAX25603 switches in a hysteretic mode to provide negative inductor current and discharge the output capacitor back to the supply. The LED current clamp improves robustness of the system while utilizing the dual compensation and output discharge of SHUNT pin greatly improves transient performance.Input-Current LimitThe MAX25603 features circuitry that limits the input current during line dropouts. Refer to the MAX25603 IC data sheet for details on setting the input current limit. The input current is given by the following equation:IN MAX =0.1RN1||RN2This circuitry can be disabled by replacing RN1 and RN2 with 0Ω resistors.Open LEDThe MAX25603 features an adjustable overvoltage threshold used for open LED detection. The threshold is determined by the voltage divider on the FB pin and is given by the following equation:V OVP =1.24×R45+R46R46The overvoltage threshold level should be set to approximately 25% above the expected LED forward voltage. When driving the LEDs with a very narrow PWM duty cycle, overvoltage may not be detected if the overvoltage level is set too high and the output cannot slew up to it within the PWM on-time. This can arise when driving two strings with a largely different number of LEDs. R49 and Q3 are provided as way to lower the threshold. By default, J8 is open and the overvoltage threshold is set to 35V for both EN1 and EN2. Select an appropriate value for R49 and short jumper J8 between 1-2 or 2-3 depending on if either EN1 or EN2 requires the lower threshold.When an open is detected, switching stops and FLT is pulled low. Switching resumes only when the voltage on the FB drops by 70mV and EN1 or EN2 is high. FLT goes high only if EN1 or EN2 is high and V(ISP-ISN) is greater than 20mV.Short LEDA short-circuit condition across the LED string is detected when the voltage on ISP falls below 4.7V for at least 10ms. After 10ms the regulation point of the voltage across the LED current-sense resistor is determined by the lower of 320mV or ICTRL. A short-circuit does not assert FLT. The short-circuit condition is cleared when ISP rises above 4.8V.MAX25603 Evaluation Kit Evaluates: MAX25603 Typical Application CircuitOrdering Information Analog Devices | 5MAX25603 Evaluation Kit Evaluates: MAX25603 MAX25603 EV Kit Bill of Materials Analog Devices | 6MAX25603 Evaluation Kit Evaluates: MAX25603 Analog Devices | 7MAX25603 Evaluation Kit Evaluates: MAX25603 Analog Devices | 8MAX25603 Evaluation Kit Evaluates: MAX25603MAX25603 EV Kit Schematic Analog Devices | 9 Analog Devices | 10MAX25603 EV Kit PCB LayoutMAX25603 EV Kit Component Placement Guide —Top SilkscreenMAX25603 EV Kit PCB Layout —Layer 2 MAX25603 EV Kit PCB Layout —Top MAX25603 EV Kit PCB Layout —Layer 3MAX25603 EV Kit PCB LayoutMAX25603 EV Kit PCB Layout—Bottom Analog Devices | 11MAX25603EVKIT#。

评估板DSP56311EVM

1. 评估板的总体结构（1/8) 评估板的总体结构的总体结构（
• 评估板 DSP56311EVM （ EVM ， Evaluation Module）能够充分展示DSP56311的能力，并提供了允许使用DSP56311应用开发的硬件工具，相当于一种通常所谓的“开发装置” • 这一评估板硬件部分包括了：DSP56311芯片，外围器件控制连接器，外部存储器和一个语音编码解码器（CODEC），其中，外围器件扩展连接器用于信号的监视和用户未来开发的可扩充性
音频编码解码器（4/9）音频编码解码器（4/9）
• Codec通过短接J7，连到DSP56311的ESSI0 ，短接J9连到ESSI1，跳线器J9把ESSI1的引脚连到CS4218的控制引脚上，J7把ESSI0 连到CS4218的数据引脚上。通过断开这些跳线器的连接，用户可以全部读写ESSI0和 ESSI1引脚 • Codec的模拟输入/输出 DSP56311EVM有适用于立体声输入、输出和耳机的1/8＇＇,直径的塞孔，下图为Codec的模拟回路部分
2.2 评估板DSP56311EVM 评估板DSP56311EVM
• • • • • • DSP56311EVM的总体结构 DSP56311EVM的总体结构 56311EVM DSP56311EVM的硬件技术 56311EVM DSP56311EVM的硬件技术音频编码解码器（Codec）音频编码解码器（Codec）命令转换器外围器件接口其它
音频编码解码器（7/9）音频编码解码器（7/9）
• Codec的数字接口下图表示Codec的数字接口
音频编码解码器（8/9）音频编码解码器（8/9）
• Codec的串行接口把数字音频数据和控制数据传输进和传输出器件，Codec与DSP56311 通过ESSI0进行数据信息、通过ESSI1进行控制信息的通信 • DSP56311的ESSI0传送数据信息到/从Codec 。DSP56311串行发送数据引脚（STD0）发送数据到Codec，串行接收数据引脚（SRD0 ）从Codec接收数据，这两个引脚分别连到 Codec的串口数据输入引脚（SDIN）和串口数据输出引脚（SDOUT）

微尺寸技术有限公司 BM23蓝牙评估板用户指南说明书

BM23 Bluetooth®Evaluation Board User’s GuideIndex Preface (4)1 OVERVIEW (6)1.1 INTRODUCTION (6)1.2 BM23 EVALUATION BOARD FEATURES (7)1.3 BM23 EVALUATION BOARD CONTENTS (8)1.4 BM23 EVB KIT CONTENTS (10)2. Getting Started (11)2.1 INTRODUCTION (11)2.2 HARDWARE REQUIREMENTS (11)2.2.1 Hardware Setup (11)2.2.2 Using Evaluation Board (11)2.3 APPLICATION DEMONSTRATION (11)2.3.1 AUDIO DEMONSTRATION (A2DP) (11)2.3.2 HSP/HFP DEMONSTRATION (13)2.4SOFTWARE CUSTOMIZATION (14)2.4.1 UI Tool (14)2.4.2 DSP TOOL (19)2.4.4 EEPROM Parameters Update (27)2.5 MODULE CONFIGURATION (29)APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS (30)Abbreviations List:AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile HFP: Hands-free ProfileHSP: Headset ProfileNFC: Near Field CommunicationSPP: Serial Port ProfilePrefaceINTRODUCTIONThis chapter contains general information that will be useful to know before using theBM23. Items discussed in this chapter include:●Document Layout●Recommended Reading●The Microchip Web Site●Customer Support●Document Revision HistoryDOCUMENT LAYOUTThis user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as follows:●Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides anoverview of various features.●Chapter 2. “Getting Started” – This chapter describesThe hardware components and setup of the BM23 Bluetooth Evaluation Board.The application demonstrations of the BM23 Bluetooth Evaluation Board.Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.●Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of theBM23 Bluetooth Evaluation Board.RECOMMENDED READINGThis user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources:STEREO Module Data Sheet (BM20/23 Data Sheet)MICROCHIP WEBSITEMicrochip provides online support via our web site at . This website is used as a means to make files and information easily available to the customers. Accessible by using your favorite Internet browser, the website contains the following information:●Product Support – Data sheets and errata, application notes and sample programs, design resources,user’s guides and hardware support documents, latest software releases and archived software●General Technical Support – Frequently Asked Questions (FAQs), technical support requests, onlinediscussion groups, Microchip consultant programmer listing●Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing ofseminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:●Distributor or Representative●Local Sales Office●Field Application Engineer (FAE)●Technical SupportCustomers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at:DOCUMENT REVISION HISTORYRevision A (Aug 2015)This is the initial released version of this document.Revision 1.0 : Added details of V4 EVB1 OVERVIEW1.1 INTRODUCTIONThis user’s guide describes the hardware and software setup for the BM23 Bluetooth® Evaluation Board. This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:●PIC18 MCU and YAMAHA YDA174 DSP on board●12 push buttons to control audio playback●Status LEDs●The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP●A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),●AVRCP media player remote control●HFP/HSP for accepting a phone call support.For data sheet and other details related to BM23 module, refer to the Microchip website at/bm23.This chapter discusses the following topics:●BM23 Evaluation Board Features●BM23 Evaluation Board Contents and Part DetailsThe BM23 Evaluation Board has the following features:●It includes a Bluetooth module (BM23), MCU (PIC18) and DSP (YDA174) on the board for easyfunction and feature demonstration.●BM23 module is a fully qualified Bluetooth version 4.1, fully compatible with Bluetooth version 3.0, 2.0,1.2.●Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shieldingcase)●Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP, Bluetooth SIG certified.●System gets power from 15V / 3A DC adapter for speaker application.●Environmentally friendly, RoHS compliant●Keypad matrix on board and controlled by MCU, easy for playback control (play/pause, Vol Up/Down,forward/rewind, Next/previous track etc.).BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation board.FIGURE 1-1: BM23 EVALUATION BOARDMIC (JP23) ICSP (J5)123456TABLE 1-1:BM23 EVALUATION BOARD HARDWARE1.4 BM23 EVB KIT CONTENTSBM23 EVB kit include: BM23 EVB board, 15V adapter, micro USB cable and 2 speaker cables as shown in Figure 1-2.FIGURE 1-2: BM23 EVB KIT1) 15V adapter: main power source of the whole system.2) USB cable: micro USB cable can connect to P3 of BM23 EVB board to do firmware update onBM23.3) Speaker cable: connect speaker to BM23 EVB J6 and J7.2. Getting Started2.1 INTRODUCTIONThis chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to support the evaluation/development of demo applications. This chapter discusses the following topics:●Hardware Requirements●Software/Utility Requirements●Module Configuration2.2 HARDWARE REQUIREMENTS2.2.1 Hardware SetupTo setup the evaluation hardware, perform the following steps:1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” to make system in application mode.2. Connect the speaker line to the amplifier output connector (J6 / 7).2.2.2 Using Evaluation Board1. Connect 15V adapter P2.2. Connect speaker to J6 and J7.3. Long press MFB button (SW24) to turn-on and enter pairing mode. The status LEDs will blink.4. Press and hold Pairing button (SW34). Blue and Red LED will flash alternately. Release the Pairingbutton. Now the BM23 Evaluation board is discoverable.5. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device willdisplay a list of discoverable Bluetooth devices. Select the BM23-002 EVB and connect with it.6. If the pairing with the device is successful, BM23 evaluation board is connect to the host device.Once connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for audio playback and Audio Video Remote Control Profile (AVRCP) for player control.7. Play music and the host device and listen the music on the speaker. This will demonstrate A2DP.8. If host device is cell phone, call you cell phone from another phone. Accept the incoming phone callon your paired and connected cell phone. This will demonstrate HFP.2.3 APPLICATION DEMONSTRATION2.3.1 AUDIO DEMONSTRATION (A2DP)In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or smartphone. The following are the steps to perform the demonstration.1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.2. Connect speakers to BM23 evaluation board J6 / 7.Media Player, iTunes, and Android).4. Start the audio stream on the media player.When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the following audio control buttons can be used:●Control the volume of audio output (Vol+ (SW27), Vol- (SW28)).●Go to the previous track(SW23)●Go to the next track(SW45)●Start / stop playing the current track (SW31).FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS2.3.2 HSP/HFP DEMONSTRATIONIn this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a paired smartphone. This demonstration requires a microphone. It would be good to use a PCheadset/microphone (with two-plugs). The following are the steps to perform the demonstration.1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MICinput (P6) respectively.2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetoothprofiles.3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. TheA2DP stream pauses and the ringtone plays on the speakers.4. Click butto n “MFB” on BM23 evaluation board to accept the incoming call.5. Once phone call is terminated, A2DP stream resumes.2.4 SOFTWARE CUSTOMIZATIONUser can customized UI and DSP settings according to their requirements. These settings can then be merged along with patch code to create IISC patch file (*.ipf). This patch file then programmed into EEPROM. Process of patch file creation is given below.Tools needed for customizationUI Tool: user can use this tool to create customize Bluetooth behavior like button functionality, Bluetooth name etc.DSP Tool: user can use this tool to modify audio parameter.MPET Tool: user can use this tool to merge UI, DSP and patch code. Details about Patch code will be provided latter section.EEPROM Tool: user can use this tool to upgrade the merged parameter into EEPROM of BM23.All these tools can be obtained from /bm23 or through FAE.2.4.1 UI ToolStep1. Open UI toolStep2. Load appropriate default UI setting (included in UI tool package) or previous saved file.Step3.Click “Edit” to modify the settings.Step4. In the main settings, profile can be enabled/disabled by checking/unchecking the box as shown below.Click “Next” for other setting.Step5. You can do system and functional setting in these pages.Click “Help” you can get more detail information.Step6. After finish parameter selection, click “Finish” button and a message will remind you check EEPROM size on your system.Step7.Click “Save” button to save these UI parameter s as a “.txt” file2.4.2 DSP TOOLStep1. Open DSP toolStep2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2023S-002)Step3.You can setup all voice and audio function in these pages.Step4. Click “Save” button to save these DSP parameters as a “.txt” file after finish all DSP setting.2.4.3 MERGE TOOLStep1.Open MPET tool, click “Next” to set up.Step2.Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.Step3.Select the bin file (full EEPROM table) and click “Next”Step4. If the bin file includes UI/DSP/patch code, you can see them as shown in the above figure. If you want to keep any one of them in your customization, you can select that and use “pull down” button (2) to add them to merge list. For adding customized parameters, you can use add button (+) (3) to add new parameters (e.g. UI/DSP parameters), into tool to merge with EEPROM table.Step5. Select output path and choose a file name for the merged EEPROM table.Step6.Click “Next” and choose Merge Default Bin to Patch (Patch File, *.ipf) as shown in the following picture and then Click “Next”. “Generate” button to generate the new EEPROM table.Step7. Click Generate buttonStep8.Select all as shown below and then click Next.Step9. Now you have a merged patch file (*.ipf file).2.4.4 EEPROM Parameters UpdateStep1. Make sure SW9 in “ROM TEST” mode. Mode switch (1/2/3 – on/off/on)Step2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting. Step3. Run the E2PROM_tool.exe program and a window will be come up as belowStep4. Specify the COM Port (1). Click IC/Module (2) Identify to know IC version of BM23. This is useful to prevent IC version mismatch.Step5. Press ”Browse” (3) to choose the *.ipf file (created in section 2.4.3) and click Write(4)Step6. After data update is completed, remove USB cable and make SW9 to “ROM APP”(mode Switch 1/2/3 off/off/on) mode and power cycle.EVB will be using new setting from EEPROM. Follow section 2.0 to see the effect of parameter customization.2.5 MODULE CONFIGURATION 2.5.1 Mode SettingsSetting in Mode Switch:APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS EVB block diagramKey Button Matrix:BM23 BLUETOOTHEVALUTATION BOARD USER ’S GUIDE2K2_02_43_0C 510u /1C O D S Y S _P W R R S T _NC 54.7u /P C B 1J P 11J P 1x 2C I _T XD C I _R X D F 2F o o t i n g 1F 4F o o t i n g1F 3F o o t i n g 1F 1F o o t i n g 1M A I N C I R C U I T4.0B M 23 E V BB48T h u r s d a y , O c t o b e r 01, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385U 7G 691L 293G N D1R S T 2V C C 3R S T _N S W 10T S 08M -P F21C UP 1P 2P 3P 4P 5T P 6T P 7T P 8T P 9T P 1T P 1T P 1D S P /M C U I N TE RF A C E U 17314u /16V P(15V )S P K O U T0.1u /50VC 106I 2S I N T E R F A C ER 1733R 11833R 1833R 1933B o a r d N a m eS i z e T i t l eR e v D a t e :S h e e t o f P /N D S P _Y D A 1744.0B M 23 E V BB68W e d n e s d a y , J u l y 22, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385R F S 0S C L K T F S 0D R 0D T 0A M PS P _M U T E S P _S L E E P S P _I C _N S P _P 1_2S P _P 1_3S P _P R O T _N S P _I R Q _N 0.1u /50VC 10513300u /50VR 12R 110V3R 377C U _P 71B U T T O NC U _P 70R 1R 0R 2C U _P 72S W 34T S 08M -P FS W 35T S 08M -P FS W 38T S 08M -P FB o a r d N a m eS i z e T i t l eR e v D a t e :S h e e t o f P /N M C U _B U T T O N4.0B M 23 E V BA88M o n d a y , J u l y 27, 201503605F , N o .5, I n d u s t r y E . R d . V I I , H s i n c h u S c i e n c e P a r k ,H s i n c h u C i t y 30078, T a i w a n T E L . 886-3-5778385Worldwide Sales and ServiceAMERICAS Corporate Office2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200Fax: 480-792-7277 Technical Support:/ supportWeb Address: AtlantaDuluth, GATel: 678-957-9614Fax: 678-957-1455 Austin, TXTel: 512-257-3370 BostonWestborough, MATel: 774-760-0087Fax: 774-760-0088 ChicagoItasca, ILTel: 630-285-0071Fax: 630-285-0075 Cleveland Independence, OHTel: 216-447-0464Fax: 216-447-0643 DallasAddison, TXTel: 972-818-7423Fax: 972-818-2924 DetroitNovi, MITel: 248-848-4000 Houston, TXTel: 281-894-5983 Indianapolis Noblesville, INTel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CATel: 949-462-9523Fax: 949-462-9608New York, NYTel: 631-435-6000San Jose, CATel: 408-735-9110 Canada - TorontoTel: 905-673-0699Fax: 905-673-6509 ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2943-5100Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8569-7000Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - HangzhouTel: 86-571-8792-8115Fax: 86-571-8792-8116China - Hong Kong SARTel: 852-2943-5100Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8864-2200Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - XiamenTel: 86-592-2388138Fax: 86-592-2388130China - ZhuhaiT el: 86-756-3210040Fax: 86-756-3210049ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-3019-1500Japan - OsakaTel: 81-6-6152-7160Fax: 81-6-6152-9310Japan - TokyoTel: 81-3-6880- 3770Fax: 81-3-6880-3771Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20Fax: 33-1-69-30-90-79Germany - DusseldorfTel: 49-2129-3766400Germany - MunichTel: 49-89-627-144-0Fax: 49-89-627-144-44Germany - PforzheimTel: 49-7231-424750Italy - MilanTel: 39-0331-742611Fax: 39-0331-466781Italy - VeniceTel: 39-049-7625286Netherlands - DrunenTel: 31-416-690399Fax: 31-416-690340Poland - WarsawTel: 48-22-3325737Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820。

adi评估板

adi评估板ADI评估板全名为Analog Devices Inc.评估板，是ADI公司开发的一种用于测试和评估各种模拟集成电路和数字信号处理器的开发板。

评估板通常由一个主控板和一些外围设备组成，用于测试芯片的功能和性能。

首先，ADI评估板具有多种接口和连接方式，能够适应各种不同的测试场景。

这包括USB、RS-232、以太网等常见接口，以及SPI、I2C、UART等常见总线接口。

这些接口可以与PC 或其他控制设备相连接，方便进行控制和数据的传输。

其次，ADI评估板还提供了丰富的软件和开发工具，使得开发人员可以方便地进行代码编写、仿真和调试。

这包括完整的开发环境和SDK，支持多种编程语言和开发平台。

此外，评估板还提供了丰富的应用示例和代码库，供开发者参考和使用。

第三，ADI评估板集成了丰富的外围设备和接口，如ADC、DAC、放大器、滤波器等，能够满足各种不同的测试需求。

这些外围设备可以用于测试芯片的性能指标，如精度、带宽、功耗等。

另外，评估板还提供了多个传感器接口，用于连接和测试各种不同的传感器。

第四，ADI评估板还具备灵活性和可扩展性。

该板支持用户自定义硬件和接口，可以根据具体的测试需求进行扩展和改造。

评估板还具备丰富的资源和文档，方便用户进行二次开发和定制。

综上所述，ADI评估板是一种功能强大、易用性高的工具，能够帮助开发人员快速测试和评估模拟集成电路和数字信号处理器。

它的多种接口和连接方式、丰富的软件和开发工具、集成的外围设备和灵活可扩展的设计使得开发人员能够快速完成各种测试任务。

ADI评估板在电子行业中具有广泛的应用前景，可以提高开发效率，降低开发成本，促进产品的快速上市。

MP8833评估板（EVKT-MP8833）用户指南说明书

User Guide MP8833 Evaluation Kit (EVKT-MP8833)Table of Contents Overview (2)Introduction (2)Kit Contents (2)Features and Benefits (3)Kit Specifications ............................................................................... Error! Bookmark not defined. Section 1. Hardware Specifications.. (4)1.1Personal Computer Requirements (4)1.2EV8833-D-01B Specifications (4)1.3EVKT-USBI2C-02 Specifications (4)Section 2. Software Requirements (5)2.1 Software Installation Procedure (5)Section 3. Evaluation Kit Test Set-Up (6)3.1Hardware Set-Up (6)3.2Powering Up the EVB (6)3.3Software Set-Up (6)3.4 Troubleshooting Tips (9)Section 4. I2C Transfer Data (11)Section 5. Ordering Information (12)OverviewIntroductionThe EVKT-MP8833 is an evaluation kit for the MP8833, which is a monolithic thermoelectric cooler controller with built-in internal power MOSFETs. The MP8833 provides features such as TEC voltage/current limiting, and can be controlled through an I 2C serial interface.Kit ContentsEVKT-MP8833 kit contents (items listed below can be ordered separately, and the GUI installation file and supplemental documents can be downloaded from the MPS website):# Part Number ItemQuantity1 EV8833-D-01B MP8833GD evaluation board1 2 EVKT-USBI2C-02Includes one USB to I 2C communication interface, one USB cable, and one ribbon cable1Figure 1: EVKT-MP8833 Evaluation Kit Set-UpInput P ower SupplyInputOutput LoadUSB CableRibbon CableEvaluation Board USB to I 2C Communication Interface EVKT-USBI2C-02GUIFeatures and BenefitsThe MP8833 is highly customizable. Users can program the MP8833 via the MPS I2C GUI.⚠Any changes made in I2C mode are not retained once the EVB shuts down. Adjustable features are outlined below.I2C∙Selectable soft-start current∙System on/off control∙Discharge time set after system shutdown∙Selectable heating/cooling output current limit∙Enable or disable heating/cooling output current limit∙Enable or disable VIN over-voltage protection (OVP)∙Selectable heating/cooling output voltage limit∙Enable or disable heating/cooling output voltage limit∙Selectable LDO hiccup current limit∙Selectable buck hiccup current limit∙TEC voltage/current monitor∙Status monitorKit SpecificationsFeatures SpecificationStart-Up Voltage 2.7V to 5.5VOutput Voltage Cooling voltage limit to heating voltage limitOperating Systems Supported Windows XP, 7, or laterSystem Requirements Minimum 15 MB freeGUI Software 11 register controls: ILIMT, VLIMIT, IMON, VTEC, STATUS EVB Size (LxW) 6.3cmx6.3cm1.1 Personal Computer RequirementsThe following requirements must be met to use the EVKT-MP8833: ∙ Operating system of Windows XP, 7, or later ∙ Net Framework 4.0∙ PC with a minimum of one available USB port ∙At least 1 MB of free space1.2 EV8833-D-01B SpecificationsThe EV8833-D-01B is an evaluation board for the MP8833GD. For more information, refer to the EV8833-D-01B datasheet.FeatureSpecification Start-Up Voltage 2.7V to 5.5V Output Voltage Cooling voltage limit to heating voltage limit EVB Size (LxW)6.3cmx6.3cmFigure 2: EV8833-D-01B Evaluation Board1.3 EVKT-USBI2C-02 SpecificationsThe EVKT-USBI2C-02 refers to the USB to I 2C communication interface device, which connects the EVB, the PC, and its supporting accessories. It provides I 2C and PMBus capabilities. Together with the Virtual Bench Pro and GUI tools, it provides a quick and easy way to evaluate the performance of MPS digital products. For more details, refer to the EVKT-USBI2C-02 datasheet.Figure 3: EVKT-USBI2C-02 Communication Interface2.1 Software Installation ProcedureProgramming occurs through the MPS I2C GUI. Follow the instructions below to install the software: Note: This software can be downloaded from the MPS website.1. Download the GUI installation file tiled “MP8833 GUI” from the MPS website.2. Extract the zip package and double-click the .exe file to open the set-up guide (see Figure 4). If aprotection window comes up, click “More info,” then click “Run anyway.”3. Wait for the status screen to verify that installation is complete (see Figure 5).Figure 4: MPS I2C GUI Set-Up GuideFigure 5: Driver Set-Up SuccessSection 3. Evaluation Kit Test Set-Up3.1 Hardware Set-UpThe hardware must be configured properly prior to use. Follow the instructions below to set up the EVB:1. Locate the proper wires to connect the EVB to the EVKT-USBI2C-02 communication interface.2. Connect SCL, SDA, and GND (see Figure 6). Refer to the evaluation board datasheet for furtherclarification.3. Use the USB cable to connect the EVKT-USBI2C-02 communication interface to the PC.Figure 6: EVB to MPS I2C Communication Interface Wire Connection3.2 Powering Up the EVB1. Preset the power supply between2.7V and 5.5V.2. Turn the power supply off.3. Connect the power supply terminals to:a. Positive (+): VINb. Negative (-): GND4. Connect the load to:a. Positive (+): TEC+b. Negative (-): TEC-5. Turn the power supply on after making the connections. The board should start up automatically. 3.3 Software Set-UpAfter connecting the hardware according to the steps above, follow the steps below to use the GUI software:1. Start the software. It should check the EVB connection automatically.If the connection is successful, the address will be listed in the section titled “Slave Add ress”(see Figure 7).Figure 7: Appearance of Address Indicates Successful ConnectionIf the connection fails, one of two warnings can appear at the bottom of the screen: o“No Slave Found, Please check the connection!” This means that the evaluation board is not connected (see Figure 8).o“Device is not available, Please check the connection!”This means that the USB I2C communication interface is not connected (see Figure 9).No Slave Found, Please check the connection!Figure 8: Warning Indicates Unsuccessful Connection – Evaluation Board Not ConnectedDevice is not available, Please check theconnection!Figure 9: Warning Indicates Unsuccessful Connection – USB I2C Communication Interface NotConnected2. Establish a successful connection, then proceed to Step3. If there is no connection, check theconnections between the EVB, communication interface, and PC. Re-plug the USB into the PC and restart the GUI.3. Select the MP8833 from the drop-down menu titled “Part Numbers.”The Register Control menushould appear on the left side. The I2C register values should be read automatically and displayed on the right (see Figure 10).Figure 10: Values from I2C Shown in Table4. Find the item to change, then choose a value from the drop-down menu. The item’s changedinformation should appear on the right side (see Figure 11).Figure 11: Changing Values Using the Software⚠All changes made via the I2C will be restored to default values once the EVB turns off.3.4 Troubleshooting TipsNote: USBI2C-02 and USBI2C-01 drivers are notcompatible. USBI2C-02 uses USBXpress andUSBI2C uses Cyusb3. USBI2C-02 is therecommended device for the MPS PMBus andI2C.EVKT-USBI2C-01If the USBI2C-01 driver is not properly installed,manual installation is required. Follow the stepsbelow:1. Open the Device Manager and select “U pdateDriver Software” (see Figure 12).Figure 12: Updating the Driver Software 2. Click “Browse My Computer for DriverSoftware,” find the driver, and install.EVKT-USBI2C-02If the USBI2C-02 driver is not properly installed, Array manual installation is required. Follow the stepsbelow:Note: Check driver version. Find “USBXpressDevice”in the Device Manager under USBcontrollers.Right-click and view properties. Ensure thedriver version matches the newest version (seeFigure 13).1. Install the correct USBXpress “.exe” fileChoose either 32-bit or 64-bit operatingsystem.32-bit: USBXpressInstaller_x86.exe64-bit: USBXpressInstaller_x64.exe2. Connect the EVKT-USBI2C-02communication interface to the PC with theUSB cable.Figure 13: Determining the Driver SoftwareSection 4. I 2C Transfer DataThe MP8833 includes a full I 2C slave controller. The I 2C slave fully complies with the I 2C specification requirements. It requires a start condition, valid I 2C address, register address byte, and data byte for a single data update. After receiving each byte, the MP8833 acknowledges by pulling the SDA line low during the high period of a single clock pulse. A valid I 2C address selects the MP8833. The MP8833 then performs an update on the falling edge of the LSB byte. Figure 14 and Figure 15 show examples of the I 2C read and write commands.S Slave Address WR A Register Address K Write Data A A PMaster to Slave A = Acknowledge (SDA = Low)S = Start Condition P = Stop ConditionNA = Not Acknowledge (SDA = High)WR Write = 0RD Read = 1Figure 14: I 2C Write ExampleSSlave AddressWR ARegister Address KRead Data KA APA = Acknowledge (SDA = Low)S = Start ConditionP = Stop ConditionNA = Not Acknowledge (SDA = High)8 Bits8 Bits 8 Bits SrSlave AddressRD NA8 Bits WR Write = 0RD Read = 1Register address to read specifiedRead register data from current register locationSr = Repeated Start ConditionFigure 15: I 2C Read ExampleSection 5. Ordering InformationThe components of the evaluation kit can be purchased separately depending on user needs. Part Number DescriptionEVKT-MP8833 Complete evaluation kitContents of EVKT-MP8833EV8833-D-01B MP8833GD evaluation boardEVKT-USBI2C-02Includes one USB to I2C communication interface device, oneUSB cable, and one ribbon cableOrder directly from or our distributors.。

DSP56311EVM的教学实验平台设计

的外部设备。本课题采用定时器模块（时间中断）来控制
ＩＤ动态图形显示的刷新频率，ｃ如把ＬＤ的刷新频率设Ｃ
定为２帧／，ｓ即每０５Ｓ向ＩＤ传送１图形的数据。另．Ｃ屏外，ＳＤＰ与ＬＤ通信接口的实现是对ＤＰ的ＧＰｔ编程，ＣＳｉ．）
用汇编语言编写的ＤＰ硬什驱动程序能够为ｃ语言调Ｓ
用；件部分有效利用了芯片的资源，强ｌ应用于教学硬增『的功能，留出了进一步扩展的接口。并
使ＧＩＰＯ引脚的信号符合ＩＤ数据传输的时序要求。由．Ｃ于ＤＰ的工作频率很高，Ｓ与ＬＤ问数据传输不仅要ＳＤＰＣ注意控制引脚上电平的高低和先后次序，而Ｈ还要插入必要的等待时间，持信号线上的电平，ＬＤ可以可靠地维使Ｃ
１个指令周期大约７Ｉ。解决时序问题，快外的接厂ｓｒｉ加１
芯片＿作速度。Ｉ丁．相对于ＤＳＣＤＰ来说，种 “ 应 ” 慢是反很
扩展，包括软件和硬件两个部分。软件部分使用ｃ＋＋
Ｂｉｅ制作ｒＤＰ６１ｕｌｒｄ “ Ｓ５３１实验平台” 平台环境，现的的实
图２系统硬件原理框图
２２软件部分．
软件分两部分：Ｃ叵ｌｅ制作的ＤＰ６１用＋＋ＢｉｒｕｄＳ５３１软件实验平台；用编语言编写的ＤＰ硬件驱动程序。Ｓ

评估板用户指南_ug-026_cn说明书

评估板用户指南UG-026 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781.329.4700 • Fax: 781.461.3113 • 14引脚TSSOP封装的三通道高速运算放大器通用评估板特性可快速实现试验板试验/原型操作用户自定义电路配置支持边缘安装型SMA连接器可轻松连接至测试设备和其它电路符合RoHS标准概述ADI公司的EB-O14RU-3Z通用评估板旨在帮助用户评估14引脚TSSOP封装的三通道高速运算放大器。

EB-O14RU-3Z 是裸板（即评估板上未焊接任何器件），用户可以快速完成各种三通道运算放大器电路的原型设计，从而最大程度地降低风险，加快产品上市。

图1显示的是裸评估板的器件侧，而图2显示的是裸评估板的电路侧。

该2层评估板的输入端和输出端支持SMA边缘安装型连接器，可高效连接至测试设备或其它电路。

接地层、器件放置和电源旁路经过专门设计，可以将寄生电感和电容降至最低。

图3显示的是评估板原理图。

图4和图5显示的是PCB装配图。

图6和图7显示的是PCB布局图。

评估板的器件侧和电路侧图1. 评估板器件侧图2. 评估板电路侧PLEASE SEE THE LAST PAGE FOR AN IMPORTANTUG-026评估板用户指南目录特性 (1)概述 (1)评估板的器件侧和电路侧 (1)修订历史......................................................................................2 评估板原理图、装配图和布局图.. (3)订购信息 (5)物料清单 (5)修订历史2010年4月—修订版0：初始版评估板用户指南UG-026评估板原理图、装配图和布局图图3. 通用评估板原理图图4. 器件侧装配图图5. 电路侧装配图UG-026评估板用户指南图6. 器件侧布局图图7. 电路侧布局图评估板用户指南UG-026订购信息物料清单表1数量索引标识符描述封装−VS, PD1/DIS1, PD2/DIS2, PD3/DIS3, GND连接器TP16 +VS,μF 3528 C2 102 C1,3 C3, C4, C5 用户自定义电容C06036 INA, INB, INC, OUTA, OUTB, OUTC SMA SMT SMA SMT15 R1A, R1B, R1C, R3A, R3B, R3C, R4A, R4B, R4C, R5A, R5B,用户自定义电阻R0805 R5C, R8A, R8B, R8C9 R2A, R2B, R2C, R6A, R6B, R6C, R7A, R7B, R7C 用户自定义电阻R06031 DUT 放大器14引脚TSSOPUG-026评估板用户指南注释评估板用户指南UG-026注释UG-026评估板用户指南ESD 警告ESD （静电放电）敏感器件。

dsp评估板

dsp评估板DSP评估板（Digital Signal Processor Evaluation Board）是用于评估和开发数字信号处理器（DSP）的硬件平台。

它通常由一个基于DSP的主处理单元和与其配套的接口、外设等组成。

DSP评估板的作用是为开发人员提供一个快速、方便和真实的开发环境，以验证和优化DSP算法和应用程序。

它可以帮助开发人员快速调试和测试他们的代码，并实时查看和分析信号处理的效果。

同时，评估板还能够提供一些额外的功能，如模拟输入输出接口、扩展接口、存储器等，以满足不同开发需求。

评估板的主处理单元通常采用一款特定型号的DSP芯片或处理器模块，这些芯片或模块有着强大的信号处理能力和高性能。

开发者可以通过评估板上的开发环境软件，连接它们的开发电脑与评估板，并利用软件工具进行代码编写、编译和下载，实现与评估板的交互。

除了主处理单元，评估板上还会搭载一些与DSP功能相关的外设和接口模块，如模数转换器（ADC）、数模转换器（DAC）、通信接口（UART、USB、Ethernet等）、存储器（RAM、Flash等）等。

这些外设可以让开发者模拟真实的信号输入输出，与其他设备进行通信，并且可以通过扩展接口模块实现更多的功能扩展。

DSP评估板的优点在于开发者可以在一个真实的硬件环境中进行开发和调试，这对于开发复杂的信号处理算法和应用非常重要。

它们可以实时查看和分析信号处理的效果，优化算法的性能，降低系统的延迟等。

另外，评估板还可以通过软件和驱动程序的支持，提供一些快速开发的工具和库，帮助开发者更快速地实现他们的功能。

然而，DSP评估板也存在一些局限性。

由于它们是为特定型号的DSP芯片设计的，因此在换用不同的型号或品牌的芯片时，可能需要进行一些适配和调试。

此外，评估板上的资源有限，无法满足某些特定需求。

因此，在某些情况下，开发者可能需要自行设计和定制一些专用硬件平台。

综上所述，DSP评估板是一个重要的数字信号处理开发工具，它提供了一个快速、方便和真实的开发环境，帮助开发者验证和优化他们的算法和应用。

庞力泰(M4)评估板说明书

3) User Manual- Please download user manual on Powertip website. https:///products_2.php?uID=323#userm
4) TFT- 4 in 1 A series is available for both Sitronix OGS and Hycon GG types. Please refer to price list for the models with border and borderless CTP. https:///products_2.php?uID=323#tftd
CPU Memory Display
Interface Power Input
RISC Processor
On Board RAM On Board ROM External Storage
Resolution Touch Panel
USB COM Port CAN BUS
Alarm Ethernet
GPIO
RGB TFT
CTP
RTP
RS232
DC 9V
Ethernet
Micro SD
CAN BUS
RS458
STMThe M4 evaluation board is an all-in-one embedded solution with features indicated below.
RTC GPIO DC
Cortex-M4 -- STM32F429IGT6 (180MHz)
8MB SDRAM 16MB SPI Flash 1x Micro SD (under 32G) Up to 1024 RGB x 768 Projected Capacitive Touch 1x USB2.0 Host 1x RS485 or RS232

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• 作为硬件的开发平台，使用户可以连接外部硬件外围器件，而板内的外围器件可以被禁止使用，为用户提供了重新指定任一个和所有DSP外围器件的能力。OnCE端口的非侵入式设计意味着板内的和DSP芯片内的所有存储器，用户均可使用
1. 评估板的总体结构（4/8)
• DSP56311EVM的实际结构如图所示
2.2 评估板DSP56311EVM
• DSP56311EVM的总体结构 • DSP56311EVM的硬件技术 • 音频编码解码器（Codec） • 命令转换器 • 外围器件接口 • 其它
1. 评估板的总体结构（1/8)
• 评估板 DSP56311EVM （ EVM ， Evaluation Module ）能够充分展示 DSP56311 的能力，并提供了允许使用 DSP56311 应用开发的硬件工具，相当于一种通常所谓的“开发装置”
• 下表说明了FSRAM通过跳线器J3的可选配置，默认配置选择为64K字的统一存储器映像配置
表 J3对FSRAM存储器配置的选择
J3
存储器映像类型
1-2 统一存储器映像（默认）
2-3 分开的存储器映像
当选择统一存储器映像时，跳线器短接引脚1和 2，外部FSRAM可用的64K字并不分成X数据、 Y 数据和程序存储器，因而，读写 P:$1000 ， X:$1000和Y:$1000，是同一个存储单元，从/到 FSRAM进行48位的长存储数据的传送是不可能的
1. 评估板的总体结构（5/8)
• DSP56311EVM的功能框图如下图
1. 评估板的总体结构（6/8)
• 上图中有9个跳线连接器（J1，J3，J4，J5， J6，J7，J8，J9，J10）默认连接如下图所示，一般情况下，不要轻易改变它，根据系统开发的需要，参见教材上的相关配置说明，作出必要的调整
• 这一评估板硬件部分包括了：DSP56311芯片，外围器件控制连接器，外部存储器和一个语音编码解码器（CODEC），其中，外围器件扩展连接器用于信号的监视和用户未来开发的可扩充性
1. 评估板的总体结构（2/8)
评估板的功用
• 使新用户熟悉 DSP56300 结构的特点， DSP56311EVM所提供的工具和实例便于对其特点以及使用 DSP56300 家族芯片的效益进行评估
FSRAM （6/6）
• 由上所述，FSRAM的作用受引脚AA0和相应的寄存器AAR0的控制，AAR0控制外部的读写类型，存储器类型以及读写FSRAM的外部存储器地址
• 有关问题将在实验中遇到，大家可以去进一步体会
音频编码解码器（Codec）
• DSP56311EVM的模拟通路使用芯片CS4218KQ ，实现 2 路 16 位的 A/D 转换和 2 路 16 位的 D/A转换，CS4218采用一个3.3V的数字电源和一个5V的模拟电源
• FSRAM的作用由AA0和相应的（端口A）地址属性寄存器0(AAR0)控制
FSRAM （3/6）
• FSRAM地址输入引脚A0-A14连到DSP端口相应的地址引脚上
• 地址位A15和地址属性3(AA3) 相应连到跳线器J3引脚1和引脚3上
• 跳线器J3的引脚2连到FSRAM的地址位A15上，它允许外部FSRAM配置为统一的或者分开的存储器映像
• 确信外部7-12V的电源尚未供电 • 把电源插头插入DSP56311EVM的P6口 • 上电。若连接正确，绿色的电源指示灯LED4
亮
2. 评估板硬件模块（1/1）
主要包括： • 24位DSP56311数字信号处理器芯片 • 用作扩展存储器的外部快速静态存储器FSRAM
和可独立工作的闪存FLASH • 16位具有CD质量的声频编码解码器（Codec） • 命令转换器模块
主要介绍外部存储器的有关问题
外部存储器（1）
DSP56311EVM包括以下两类外部存储器： • 64K×24位快速静态RAM（FSRAM）用作扩展
存储器 • 128K×8位闪速存储器（FLASH）用于独立
工作（不介绍）
FSRAM（1/6）
• FSRAM在评估板上的位置参看前图，在元件层上标以 U2 ，型号是 GS71024T-8 ，它使用 3.3V 单电源工作，存取时间 8ns ，与 DSP56311的连接如下图所示
• 作为实时软件开发平台服务。工具配套使用户能够开发和仿真例程，将软件下载到片内或板内的 RAM ，然后通过 JTAG/OnCE 端口，使用调试器运行和调试软件
1. 评估板的总体结构（3/8)
• 由于OnCE断点的特点，使用户能很容易指定中止的条件，全速执行用户开发的软件，直至中止的条件满足为止。具有通过 OnCE 检查和修改所有的用户可读写的寄存器、存储器和外围器件的能力，极大地方便了开发者实现自己的任务
FSRAM （2/6）
• FSRAM的数据输入/输出引脚IO0-IO23被连到 DSP56311 的 D0-D23 引脚上，相应地， FSRAM的写允许WE 与输出允许OE 线被连到 DSP56311 的写允许(WR)与读允许(RD )线上
• FSRAM芯片允许信号(CE1)由DSP56311地址属性0(AA0) 产生
1. 评估板的总体结构（7/8)
• 下图示出了PC、外部电源和评估板三者之间的连接方法
1. 评估板的总体结构（8/8)
具体连接的步Байду номын сангаас为：
• 把DB25并口扩展电缆的插头连接到PC的并口插座
• 把DB25并口扩展电缆的插座连到DSP56311EVM 板上的P2口，这一连接使能PC控制评估板的功能
选择分开的存储器映像，把FSRAM可用的64K 字分成两个32K相邻接的存储体，这种配置允许从FSRAM进行48位长存储数据的传送，这样对 X:$1000和Y:$1000的读写是分开的外部FSRAM
中不同的存储单元。分开的存储器映像使用地址属性引脚 3 （ AA3 ），引脚的动作受相应的 AAR3寄存器控制