反激式开关电源外文翻译
反激式开关电源原理
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与你分享(反激式开关电源原理)反激式开关电源是指使用反激高频变压器隔离输入输出回路的开关电源."反激"(FL Y BACK)的具体所指是当输入为高电平(开关管接通)时输出线路中串联的电感为放电状态,相反当输入为高电平(开关管断开)时输出线路中的串联的电感为充电状态.与之相对的是"正激"(FORWARD)式开关电源,当输入为高电平(开关管接通)时输出线路中串联的电感为充电状态,相反当输入为高电平(开关管断开)时输出线路中的串联的电感为放电状态,以此驱动负载.三相电机的配导线:(电机一个千瓦大约在2A)"1.5加二,2.5加三""4后加四,6后加六""25后加五,50后递增减五""百二导线,配百数" 该口诀是按三相380V交流电动机容量直接选配导线的。
"1.5加二"表示1.5mm2的铜芯塑料线,能配3.5kW的及以下的电动机。
由于4kW 电动机接近3.5kW的选取用范围,而且该口诀又有一定的余量,所以在速查表中4kW以下的电动机所选导线皆取1.5mm2。
"2.5加三"、"4后加四",表示2.5mm2及4mm2的铜芯塑料线分别能配5.5kW、8kW电动机。
"6后加六",是说从6mm2的开始,能配"加大六"kW的电动机。
即6mm2的可配12kW,选相近规格即配1lkW电动机。
10mm2可配16kW,选相近规格即配15kW电动机。
16mm2可配22kW电动机。
这中间还有18.5kW电动机,亦选16mm2的铜芯塑料线。
"25后加五",是说从25mm2开始,加数由六改为五了。
即25mm2可配30kW的电动机。
35mm2可配40kW,选相近规格即配37kW电动机。
"50后递增减五",是说从50mm2开始,由加大变成减少了,而且是逐级递增减五的。
反激开关电源
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1,反激电路是由buck-boost拓扑演变而来,先分析一下buck-boost电路的工作过程。
工作时序说明:t0时刻,Q1开通,那么D1承受反向电压截止,电感电流在输入电压作用下线性上升。
t1时刻,Q1关断,由于电感电流不能突变,所以,电感电流通过D1,向C1充电。
并在C1两端电压作用下,电流下降。
t2时刻,Q1开通,开始一个新的周期。
从上面的波形图中,我们可以看到,在整个工作周期中,电感L1的电流都没有到零。
所以,这个工作模式是电流连续的CCM模式,又叫做能量不完全转移模式。
因为电感中的储能没有完全释放。
从工作过程我们也可以知道,这个拓扑能量传递的方式是,在MOS管开通时,向电感中储存能量,MOS管关断时,电感向输出电容释放能量。
MOS管不直接向负载传递能量。
整个能量传递过程是先储存再释放的过程。
整个电路的输出能力,取决于电感的储存能力。
我们还要注意到,根据电流流动的方向,可以判断出,在输入输出共地的情况下,输出的电压是负电压。
MOS管开通时,电感L1承受的是输入电压,MOS关断时,电感L1承受的是输出电压。
那么,在稳态时,电路要保证电感不进入饱和,必定要保证电感承受的正向和反向的伏秒积的平衡。
那么:Vin×(t1-t0)=Vout×(t2-t1),假如整个工作周期为T,占空比为D,那么就是:Vin×D=V out×(1-D)那么输出电压和占空比的关系就是:V out=Vin×D/(1-D)同时,我们注意看MOS管和二极管D1的电压应力,都是Vin+V out另外,因为是CCM模式,所以从电流波形上可以看出来,二极管存在反向恢复问题。
MOS开通时有电流尖峰。
上面的工作模式是电流连续的CCM模式。
在原图的基础上,把电感量降低为80uH,其他参数不变,仿真看稳态的波形如下:t0时刻,Q1开通,那么D1承受反向电压截止,电感电流在输入电压作用下从0开始线性上升。
开关电源需掌握的基本英语词汇
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Reservoir(储能的)
Ripple current(纹波电流)
Self-heating(自加热)
Tantalum(钽)
Temperature coefficient(温度系数)
Capacitor definition(电容定义)
Charge pump(电荷泵)
Clamp circuit(钳位电路)
Compensation(补偿)
Control equation(控制等式)
Buck converter (Buck 变换器)
Compensation(补偿)
Control equation(控制等式)
Buck-Boost converter(Buck-Boost 变换器)
Ultra-fast(超快速)
Discontinuous operation(断续工作)
Dissipation factor(损耗因数)
E
Eddy current(涡流)
Electromagnetic compatibility(EMC,电磁兼容)
Electromagnetic interference(EMI,电磁干扰)
Universal input(通用输入)
V
Voltage doubler(电压倍增器)
Voltage mode PWM controller(电压模式PWM 控制器)
W
Wire table(导线一览表)
Z
Zener diode(齐纳二极管)
开关电源需掌握的基本英语词汇
A
Auxiliary supply(辅助电源)
B
B-H curve(磁化曲线)
电源拓扑结构介绍----正激和反激
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变换器的介绍: Transformer introduction
变压器:原边(原级)primary side 和
副边(次级)secondary side 原边电感(励磁电感)--magnetizing inductance
漏感---leakage inductance
副边开路或者短路测量原边电感分别得励磁电感和漏感 变压器的作用:1. 电气隔离; 2. 变比不同,达到电压升降; 3. 磁耦合传送能量;
压器储存能量,磁通量增加。在导通期间,磁通的增加量
为:
( )
V in W1
* D * Ts
此过程中,副边绕组的电压为Vin/N(N为原边和副 边匝数比),整流二极管D3导通,给电感、电容充电和负
载供电。
2012-10-31
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(2) MOS管截止时,变压器原边励磁电感中的电流不
能跃变(方向不变,大小连续变化),通过二极管D1和D2
式中,K13=W1/W3是原边与复位绕组的匝比,
K23=W2/W3 是副边与复位绕组的匝比。
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此时,整流二极管D1 关断,滤波电感电流iL1通过续
流二极管D2续流,与buck变换器类似。
在此开关模态中,加在Q上的电压VQ为:
VQ=Vin+K13*Vin。
电源电压Vin反向加在复位绕组W3上,故铁芯去磁, 铁芯磁通Ø减小: W3*dØ/dt=-Vin 铁芯磁通Ø的减小量为:Vin/W3*ΔD*Ts。
2. 和Boost、Buck变换器一样,Flyback变换器也 有电流连续和断续两种工作方式。对Flyback变换器
来说,电流连续是指变压器两个绕组的合成安匝在一 个开关周期中不为零,而电流断续是指合成安匝在Q 截止期间有一段时间为零。图中a、b、c 给出了变换 器在不同开关模态下的等效电路图。
开关电源03、flyback-converter
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在电源电压 一定时开关管的电压和占空比有关, 故必须限制D 值。 二极管 D1承受的电压为
V D1 V0 V in K
反激变换器
开关电源技术—— tqzheng@
5
负载电流I0就是流过D1的电流平均值,由波形图可得 根据变压器的工作原理,有下面两个表达式:
W 1 I p min W 2 I s min
I s max
V0 L2
(1 D y )T s
在此过程中,磁芯中的磁通也线性减小,由
反激变换器
d
V0 W2
dt
磁通增量
(- )
V0 W2
(1 D y )T s
开关电源技术—— tqzheng@
4
四、基本关系 稳态工作时,Q导通时铁芯磁通 的增长量必等于Q关断时的减少量, ( )
p
in
dt
L1
t=Ton时ip达到最大值
I P max I P min
V in D y L1
Ts
在此过程中,磁芯中的磁通也线性增加 ,由
d
V in W1
dt
磁通增量
()
V in W1
D yTs
反激变换器
开关电源技术—— tqzheng@
3
三、开关Q关断工况
Fly-back Converter
反激变换器
开关电源技术—— tqzheng@
1
Flyback converter (反激变换器)
一、基本电路 由buck-boost推演而得. Iin Vin
隔离变压器
IP UP
IS D US
Iout Cf 率高; 2.输出电压纹波较大; 3.处理功率在150W以下; 4.小功率多组输出特别有效;
反激式开关电源工作原理
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反激式开关电源工作原理反激式开关电源(Switch Mode Power Supply,简称SMPS)是指利用开关导通和反激耦合发挥效果的电源。
主要组成部件有金属氧化物半导体开关功率晶体管(MOSFET),反激变压器、铁心变压器、元件电容等,临界换流变压器的核心在于MOSFET的开关功率管,它的本质是一个继电器,即磁性调压变压器和开关放大器的内部集成产物。
反激式开关电源的工作原理是:变压器的终端依靠MOSFET的开关功率管以脉冲宽度调制的方式进行以比经变压器不管它工作的频率转换,以进行检测变压器的输出电压,综合电路将信号反馈输入MOSFET,形成闭环控制。
MOSFET的开关功率管控制器经过控制,使原有拓扑结构变为变压器输出电压要求的额定输出电压值。
开关导通由MOSFET放大器控制,即PWM模块。
它调节MOSFET的开通频率和占空比,使其能按需要的频率、效率和相应的电压输出,电流以金属氧化物半导体开关功率晶体管的开启和关闭来实现,将输入高频调制脉冲输出到变压器的一转绕组,此处的传感依赖与金属氧化物半导体管,微处理器监测变压器的二转绕组的质量,当质量达到设定的电压值时,信号告诉PWM模块关闭MOSFET,以调节输出电压,既起到调节和控制变压器的输出电压作用。
反激开关电源上配有反激变压器,其终端可由MOSFET的开关导通而输出脉冲变化的PWM脉冲,使反激变压器的过热和短路保护功能得以激活,从而保证反激、铁心变压器更加安全可靠地工作。
反激开关电源上配有铁心变压器,其功能是在变压器漏感、双极管和滤波电容之间形成一个特殊的电路,以稳定变压器输出纹波,使输出电压得到优化,补偿电容部件能够补偿发生在反激变压器和铁心变压器之间的变化。
另外,随着SMPS在电源的应用的不断深入,电源的效率、稳定性和可靠性也大大提高。
由于反激开关电源的几个优势在技术性、成本性和简便性等方面,反激开关电源越来越受到重视,在电源领域得到更广泛的应用。
开关电源专业电子中英文词汇
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开关电源专业电子中英文词汇Absorber Circuit 吸收电路AC/AC Frequency Converter 交交变频电路AC power control交流电力控制AC Power Controller交流调功电路AC Power Electronic Switch交流电力电子开关Ac Voltage Controller交流调压电路Asynchronous Modulation异步调制Baker Clamping Circuit 贝克箝位电路Bi-directional Triode Thyristor双向晶闸管Bipolar Junction Transistor-- BJT双极结型晶体管Boost-Buck Chopper 升降压斩波电路Boost Chopper 升压斩波电路Boost Converter 升压变换器Bridge Reversible Chopper 桥式可逆斩波电路Buck Chopper 降压斩波电路Buck Converter 降压变换器Commutation 换流Conduction Angle 导通角Constant Voltage Constant Frequency --CVCF 恒压恒频Continuous Conduction—CCM (电流)连续模式Control Circuit 控制电路Cuk Circuit CUK 斩波电路Current Reversible Chopper 电流可逆斩波电路Current Source Type Inverter--CSTI 电流(源)型逆变电路Cycloconvertor 周波变流器DC-AC-DC Converter直交直电路DC Chopping 直流斩波DC Chopping Circuit 直流斩波电路DC-DC Converter 直流-直流变换器Device Commutation 器件换流Direct Current Control 直接电流控制Discontinuous Conduction mode (电流)断续模式displacement factor 位移因数distortion power 畸变功率double end converter 双端电路driving circuit 驱动电路electrical isolation 电气隔离fast acting fuse 快速熔断器fast recovery diode 快恢复二极管fast revcovery epitaxial diodes快恢复外延二极管fast switching thyristor 快速晶闸管field controlled thyristor 场控晶闸管flyback converter 反激电流forced commutation 强迫换流forward converter 正激电路frequency converter 变频器full bridge converter 全桥电路full bridge rectifier 全桥整流电路full wave rectifier 全波整流电路fundamental factor 基波因数gate turn-off thyristor——GTO可关断晶闸管general purpose diode普通二极管giant transistor——GTR电力晶体管half bridge converter 半桥电路hard switching 硬开关high voltage IC 高压集成电路hysteresis comparison 带环比较方式indirect current control 间接电流控制indirect DC-DC converter 直接电流变换电路insulated-gate bipolar transistor-----IGBT绝缘栅双极晶体管intelligent power module-------IPM智能功率模块integrated gate-commutated thyristor------IGCT集成门极换流晶闸管inversion 逆变latching effect 擎住效应leakage inductance 漏感light triggered thyristo---LTT光控晶闸管line commutation 电网换流load commutation 负载换流loop current 环流Schottky Barrier Diode 肖特基二极管。
开关电源外文文献翻译
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开关电源外文文献翻译(文档含中英文对照即英文原文和中文翻译)外文:Switched-mode power supplyA switched-mode power supply (also switching-mode power supply, SMPS, or simply switcher) is an electronic power supply unit (PSU) that incorporates a switching regulator. While a linear regulator maintains the desired output voltage by dissipating excess power in a pass power transistor, the switched-mode power supply switches a power transistor between saturation (full on) and cutoff (completely off) with a variable duty cycle whose average is the desired output voltage. It switches at a much-higher frequency (tens to hundreds of kHz) than that of the AC line (mains), which means that the transformer that it feeds can be much smaller than one connected directly to the line/mains. Switching creates a rectangular waveform that typically goes to the primary of the transformer; typically several secondaries feed rectifiers, series inductors, and filter capacitors to provide various DC outputs with low ripple.The main advantage of this method is greater efficiency because the switching transistor dissipates little power in the saturated state and the off state compared to the semiconducting state (active region). Other advantages include smaller size and lighter weight (from the elimination of low frequency transformers which have a high weight) and lower heat generation due to higher efficiency. Disadvantages include greater complexity, the generation of high amplitude, high frequency energy that the low-pass filter must block to avoid electromagnetic interference (EMI), and a ripple voltage at the switching frequency and the harmonic frequencies thereof.A note about terminologyAlthough the term "power supply" has been in use since radios were first powered from the line/mains, that does not mean that it is a source of power, in the sense that a battery provides power. It is simply a device that (usually) accepts commercial AC power and provides one or more DC outputs. It would be more correctly referred to as a power converter, but long usage has established the term. ClassificationSMPS can be classified into four types according to the input and output waveforms: AC in, DC out: rectifier, off-line converter input stageDC in, DC out: voltage converter, or current converter, or DC to DC converterAC in, AC out: frequency changer, cycloconverter, transformerDC in, AC out: inverterInput rectifier stageIf the SMPS has an AC input, then the first stage is to convert the input to DC. This is called rectification. The rectifier circuit can be configured as a voltage doubler by the addition of a switch operated either manually or automatically. This is a feature of larger supplies to permit operation from nominally 120 volt or 240 volt supplies. The rectifier produces an unregulated DC voltage which is then sent to a large filter capacitor. The current drawn from the mains supply by this rectifier circuit occurs in short pulses around the AC voltage peaks. These pulses have significant high frequency energy which reduces the power factor. Special control techniques can be employed by the following SMPS to force the average input current to follow the sinusoidal shape of the AC input voltage thus the designer should try correcting the power factor. An SMPS with a DC input does not require this stage. An SMPS designed for AC input can often be run from a DC supply (for 230V AC this would be 330V DC), as the DC passes through the rectifier stage unchanged. It's howeveradvisable to consult the manual before trying this, though most supplies are quite capable of such operation even though nothing is mentioned in the documentation. However, this type of use may be harmful to the rectifier stage as it will only utilize half of diodes in the rectifier for the full load. This may result in overheating of these components, and cause them to fail prematurely.If an input range switch is used, the rectifier stage is usually configured to operate as a voltage doubler when operating on the low voltage (~120 V AC) range and as a straight rectifier when operating on the high voltage (~240 V AC) range. If an input range switch is not used, then a full-wave rectifier is usually used and the downstream inverter stage is simply designed to be flexible enough to accept the wide range of dc voltages that will be produced by the rectifier stage. In higher-power SMPSs, some form of automatic range switching may be used.Inverter stageThe inverter stage converts DC, whether directly from the input or from the rectifier stage described above, to AC by running it through a power oscillator, whose output transformer is very small with few windings at a frequency of tens or hundreds of kilohertz (kHz). The frequency is usually chosen to be above 20 kHz, to make it inaudible to humans. The output voltage is optically coupled to the input and thus very tightly controlled. The switching is implemented as a multistage (to achieve high gain) MOSFET amplifier. MOSFETs are a type of transistor with a low on-resistance and a high current-handling capacity. Since only the last stage has a large duty cycle, previous stages can be implemented by bipolar transistors leading to roughly the same efficiency. The second last stage needs to be of a complementary design, where one transistor charges the last MOSFET and another one discharges the MOSFET. A design using a resistor would run idle most of the time and reduce efficiency. All earlier stages do not weight into efficiency because power decreases by a factor of 10 for every stage (going backwards) and thus the earlier stages are responsible for at most 1% of the efficiency. This section refers to the block marked Chopper in the block diagram.V oltage converter and output rectifierIf the output is required to be isolated from the input, as is usually the case in mains power supplies, the inverted AC is used to drive the primary winding of a high-frequency transformer. This converts the voltage up or down to the required output level on its secondary winding. The output transformer in the block diagramserves this purpose.If a DC output is required, the AC output from the transformer is rectified. For output voltages above ten volts or so, ordinary silicon diodes are commonly used. For lower voltages, Schottky diodes are commonly used as the rectifier elements; they have the advantages of faster recovery times than silicon diodes (allowing low-loss operation at higher frequencies) and a lower voltage drop when conducting. For even lower output voltages, MOSFETs may be used as synchronous rectifiers; compared to Schottky diodes, these have even lower conducting state voltage drops.The rectified output is then smoothed by a filter consisting of inductors and capacitors. For higher switching frequencies, components with lower capacitance and inductance are needed.Simpler, non-isolated power supplies contain an inductor instead of a transformer. This type includes boost converters, buck converters, and the so called buck-boost converters. These belong to the simplest class of single input, single output converters which utilize one inductor and one active switch. The buck converter reduces the input voltage in direct proportion to the ratio of conductive time to the total switching period, called the duty cycle. For example an ideal buck converter with a 10 V input operating at a 50% duty cycle will produce an average output voltage of 5 V. A feedback control loop is employed to regulate the output voltage by varying the duty cycle to compensate for variations in input voltage. The output voltage of a boost converter is always greater than the input voltage and the buck-boost output voltage is inverted but can be greater than, equal to, or less than the magnitude of its input voltage. There are many variations and extensions to this class of converters but these three form the basis of almost all isolated and non-isolated DC to DC converters. By adding a second inductor the Ćuk and SEPIC converters can be implemented, or, by adding additional active switches, various bridge converters can be realised.Other types of SMPSs use a capacitor-diode voltage multiplier instead of inductors and transformers. These are mostly used for generating high voltages at low currents (Cockcroft-Walton generator). The low voltage variant is called charge pump. RegulationA feedback circuit monitors the output voltage and compares it with a reference voltage, which is set manually or electronically to the desired output. If there is an error in the output voltage, the feedback circuit compensates by adjusting the timing with which the MOSFETs are switched on and off. This part of the power supply is called the switching regulator. The Chopper controller shown in the block diagramserves this purpose. Depending on design/safety requirements, the controller may or may not contain an isolation mechanism (such as opto-couplers) to isolate it from the DC output. Switching supplies in computers, TVs and VCRs have these opto-couplers to tightly control the output voltage.Open-loop regulators do not have a feedback circuit. Instead, they rely on feeding a constant voltage to the input of the transformer or inductor, and assume that the output will be correct. Regulated designs compensate for the parasitic capacitance of the transformer or coil. Monopolar designs also compensate for the magnetic hysteresis of the core.The feedback circuit needs power to run before it can generate power, so an additional non-switching power-supply for stand-by is added.Transformer designSMPS transformers run at high frequency. Most of the cost savings (and space savings) in off-line power supplies come from the fact that a high frequency transformer is much smaller than the 50/60 Hz transformers formerly used.There are several differences in the design of transformers for 50 Hz vs 500 kHz. Firstly a low frequency transformer usually transfers energy through its core (soft iron), while the (usually ferrite) core of a high frequency transformer limits leakage. Since the waveforms in a SMPS are generally high speed (PWM square waves), the wiring must be capable of supporting high harmonics of the base frequency due to the skin effect, which is a major source of power loss.Power factorSimple off-line switched mode power supplies incorporate a simple full wave rectifier connected to a large energy storing capacitor. Such SMPSs draw current from the AC line in short pulses when the mains instantaneous voltage exceeds the voltage across this capacitor. During the remaining portion of the AC cycle the capacitor provides energy to the power supply.As a result, the input current of such basic switched mode power supplies has high harmonic content and relatively low power factor. This creates extra load on utility lines, increases heating of the utility transformers and standard AC electric motors, and may cause stability problems in some applications such as in emergency generator systems or aircraft generators. Harmonics can be removed through the use of filter banks but the filtering is expensive, and the power utility may require a business with a very low power factor to purchase and install the filtering onsite.In 2001 the European Union put into effect the standard IEC/EN61000-3-2 to set limits on the harmonics of the AC input current up to the 40th harmonic for equipment above 75 W. The standard defines four classes of equipment depending on its type and current waveform. The most rigorous limits (class D) are established for personal computers, computer monitors, and TV receivers. In order to comply with these requirements modern switched-mode power supplies normally include an additional power factor correction (PFC) stage.Putting a current regulated boost chopper stage after the off-line rectifier (to charge the storage capacitor) can help correct the power factor, but increases the complexity (and cost).Quasiresonant ZCS/ZVSA quasiresonant ZCS/ZVS switch (Zero Current/Zero V oltage) is a design where "each switch cycle delivers a quantized 'packet' of energy to the converter output, and switch turn-on and turn-off occurs at zero current and voltage, resulting in an essentially lossless switch."EfficiencyHigher input voltage and synchronous rectification mode makes the conversion process more efficient. Higher switch frequency allows component size to be shrunk, but suffer from radio frequency (RF) properties on the other hand. The power consumption of the controller also has to be taken into account.ApplicationsSwitched-mode PSUs in domestic products such as personal computers often have universal inputs, meaning that they can accept power from most mains supplies throughout the world, with rated frequencies from 50 Hz to 60 Hz and voltages from 100 V to 240 V (although a manual voltage range switch may be required). In practice they will operate from a much wider frequency range and often from a DC supply as well. In 2006, at an Intel Developers Forum, Google engineers proposed the use of a single 12 V supply inside PCs, due to the high efficiency of switch mode supplies directly on the PCB.Most modern desktop and laptop computers already have a DC-DC converter on the motherboard, to step down the voltage from the PSU or the battery to the CPU core voltage, as low as 0.8 V for a low voltage CPU to 1.2-1.5 V for a desktop CPU as of 2007. Most laptop computers also have a DC-AC inverter to step up the voltage from the battery to drive the backlight, typically around 1000 Vrms.Certain applications, such as in automobile industry where ordinary cars often use 12 V DC and in some industrial settings, DC supply is chosen to avoid hum and interference and ease the integration of capacitors and batteries used to buffer the voltage. Most small aircraft use 28 V DC, but larger aircraft like Boeing-747 often use up to 90 kV A 3-phase at 200 V AC 400 Hz, though they often have a DC bus as well. Even fighter planes like F-16 use 400 Hz power. The MD-81 airplane has an 115/200 V 400 Hz AC and 28 V DC power system generated by three 40 kV A AC generators. Helicopters also use the 28 V DC system. Some submarines like the Soviet Alfa class submarine utilized two synchronous generators providing a variable three-phase current, 2 x 1500 kW, 400 V, 400 Hz. The space shuttle uses three fuel cells generating 30 - 36 V DC. Some is converted into 400 Hz AC power and 28 V DC power. The International Space Station uses 120 V DC power. Larger trucks uses 24 V DC.See also: Avionics, Airplane ground supportIn the case of TV sets, for example, one can test the excellent regulation of the power supply by using a variac. For example, in some models made by Philips, the power supply starts when the voltage reaches around 90 volts. From there, one can change the voltage with the variac, and go as low as 40 volts and as high as 260 (known such case that voltage was 360), and the image will show absolutely no alterations.TerminologyThe term switchmode was widely used until Motorola trademarked SWITCHMODE(TM), for products aimed at the switching-mode power supply market, and started to enforce their trademark.翻译:开关模式电源开关模式电源(也开关式电源,开关电源,或只是交换机)是一种电子电源供应器(电源),包含了开关稳压器。
反激式开关电源原理
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反激式开关电源原理反激式开关电源(flyback power supply)是一种常见的开关电源拓扑结构,广泛应用于电子产品、通信设备以及工业设备等领域。
它具有高效率、体积小、成本低等优点,在现代电子技术中应用非常广泛。
下面将详细介绍反激式开关电源的原理和工作过程。
1.开关管电路部分:开关管(MOSFET或BJT)作为主要开关元件,它的导通和截止通过控制电压或电流改变。
在正半周期内,开关管导通,输入电源向变压器的一端充电,同时能量储存到变压器的磁场中;在负半周期内,开关管截止,磁场能量被传递到输出电路中,从而实现电能的转换。
2.变压器电路部分:反激式开关电源中的变压器是一个关键组件,它负责将输入电源中的能量转换为输出电源所需的电压和电流。
变压器的一端连接开关管,另一端连接输出电路。
当开关管导通时,输入电源的能量通过变压器的互感作用储存到磁场中;当开关管截止时,储存在磁场中的能量通过互感作用传递到输出电路中。
变压器的变比决定了输入电源与输出电源之间的电压和电流转换关系。
3.输出电路部分:输出电路部分包括整流电路和滤波电路等。
在反激式开关电源中,输出电流的产生是通过变压器传递的磁场能量,经过整流后得到直流电压。
滤波电路则用于去除输出电路中的纹波,保证输出电压的稳定性。
1.开关管导通状态:当开关管导通时,输入电源的正电压通过变压器传递给输出电路,同时通过滤波电路获取直流电压。
开关管导通的时间很短,通常在几微秒到几毫秒之间。
2.开关管截止状态:当开关管截止时,变压器中储存的磁场能量开始传递到输出电路。
变压器中储存的磁场能量通过互感作用将电压和电流传递到输出电路中。
通过调整变压器的变比,可以实现输入电压向输出电压的降压或升压转换。
1.高效率:由于开关管的截止和导通可以精确地控制,反激式开关电源具有较高的转换效率。
一般情况下,其转换效率可以达到80%以上,甚至可以达到90%以上。
2.体积小:反激式开关电源采用了变压器来实现电能转换,无需使用大型的电容或电感器件,节省了空间。
开关电源中英文对照外文翻译文献
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开关电源中英文对照外文翻译文献(文档含英文原文和中文翻译)Modeling, Simulation, and Reduction of Conducted Electromagnetic Interference Due to a PWM Buck Type Switching Power Supply IA. FarhadiAbstract:Undesired generation of radiated or conducted energy in electrical systems is called Electromagnetic Interference (EMI). High speed switching frequency in power electronics converters especially in switching power supplies improves efficiency but leads to EMI. Different kind of conducted interference, EMI regulations and conducted EMI measurement are introduced in this paper. Compliancy with national or international regulation is called Electromagnetic Compatibility (EMC). Power electronic systems producers must regard EMC. Modeling and simulation is the first step of EMC evaluation. EMI simulation results due to a PWM Buck type switching power supply are presented in this paper. To improve EMC, some techniques are introduced and their effectiveness proved by simulation.Index Terms:Conducted, EMC, EMI, LISN, Switching SupplyI. INTRODUCTIONFAST semiconductors make it possible to have high speed and high frequency switching in power electronics []1. High speed switching causes weight and volume reduction of equipment, but some unwanted effects such as radio frequency interference appeared []2. Compliance with electromagnetic compatibility (EMC) regulations is necessary for producers to present their products to the markets. It is important to take EMC aspects already in design phase []3. Modeling and simulation is the most effective tool to analyze EMC consideration before developing the products. A lot of the previous studies concerned the low frequency analysis of power electronics components []4[]5. Different types of power electronics converters are capable to be considered as source of EMI. They could propagate the EMI in both radiated and conducted forms. Line Impedance Stabilization Network (LISN) is required for measurement and calculation of conducted interference level []6. Interference spectrum at the output of LISN is introduced as the EMC evaluation criterion []7[]8. National or international regulations are the references for the evaluation of equipment in point of view of EMC []7[]8.II. SOURCE, PATH AND VICTIM OF EMIUndesired voltage or current is called interference and their cause is called interference source. In this paper a high-speed switching power supply is the source of interference.Interference propagated by radiation in area around of an interference source or by conduction through common cabling or wiring connections. In this study conducted emission is considered only. Equipment such as computers, receivers, amplifiers, industrial controllers, etc that are exposed to interference corruption are called victims. The common connections of elements, source lines and cabling provide paths for conducted noise or interference. Electromagnetic conducted interference has two components as differential mode and common mode []9.A. Differential mode conducted interferenceThis mode is related to the noise that is imposed between different lines of a test circuit by a noise source. Related current path is shown in Fig. 1 []9. The interference source, path impedances, differential mode current and load impedance are also shown in Fig. 1.B. Common mode conducted interferenceCommon mode noise or interference could appear and impose between the lines, cables or connections and common ground. Any leakage current between load and common ground could be modeled by interference voltage source.Fig. 2 demonstrates the common mode interference source, common mode currents Iandcm1 and the related current paths[]9. The power electronics converters perform as noise source Icm2between lines of the supply network. In this study differential mode of conducted interference is particularly important and discussion will be continued considering this mode only.III. ELECTROMAGNETIC COMPATIBILITY REGULATIONS Application of electrical equipment especially static power electronic converters in different equipment is increasing more and more. As mentioned before, power electronics converters are considered as an important source of electromagnetic interference and have corrupting effects on the electric networks []2. High level of pollution resulting from various disturbances reduces the quality of power in electric networks. On the other side some residential, commercial and especially medical consumers are so sensitive to power system disturbances including voltage and frequency variations. The best solution to reduce corruption and improve power quality is complying national or international EMC regulations. CISPR, IEC, FCC and VDE are among the most famous organizations from Europe, USA and Germany who are responsible for determining and publishing the most important EMC regulations. IEC and VDE requirement and limitations on conducted emission are shown in Fig. 3 and Fig. 4 []7[]9.For different groups of consumers different classes of regulations could be complied. Class A for common consumers and class B with more hard limitations for special consumers are separated in Fig. 3 and Fig. 4. Frequency range of limitation is different for IEC and VDE that are 150 kHz up to 30 MHz and 10 kHz up to 30 MHz respectively. Compliance of regulations is evaluated by comparison of measured or calculated conducted interference level in the mentioned frequency range with the stated requirements in regulations. In united European communitycompliance of regulation is mandatory and products must have certified label to show covering of requirements []8.IV. ELECTROMAGNETIC CONDUCTED INTERFERENCE MEASUREMENTA. Line Impedance Stabilization Network (LISN)1-Providing a low impedance path to transfer power from source to power electronics converter and load.2-Providing a low impedance path from interference source, here power electronics converter, to measurement port.Variation of LISN impedance versus frequency with the mentioned topology is presented inFig. 7. LISN has stabilized impedance in the range of conducted EMI measurement []7.Variation of level of signal at the output of LISN versus frequency is the spectrum of interference. The electromagnetic compatibility of a system can be evaluated by comparison of its interference spectrum with the standard limitations. The level of signal at the output of LISN in frequency range 10 kHz up to 30 MHz or 150 kHz up to 30 MHz is criterion of compatibility and should be under the standard limitations. In practical situations, the LISN output is connected to a spectrum analyzer and interference measurement is carried out. But for modeling and simulation purposes, the LISN output spectrum is calculated using appropriate software.For a simple fixed frequency PWM controller that is applied to a Buck DC/DC converter, it is) changes slow with respect to the switching frequency, the possible to assume the error voltage (vepulse width and hence the duty cycle can be approximated by (1). Vp is the saw tooth waveform amplitude.A. PWM waveform spectral analysisThe normalized pulse train m (t) of Fig. 8 represents PWM switch current waveform. The nth pulse of PWM waveform consists of a fixed component D/fs , in which D is the steady state duty cycle, and a variable component dn/f sthat represents the variation of duty cycle due to variation of source, reference and load.As the PWM switch current waveform contains information concerning EMI due to powersupply, it is required to do the spectrum analysis of this waveform in the frequency range of EMI studies. It is assumed that error voltage varies around V e with amplitude of V e1as is shown in (2).fm represents the frequency of error voltage variation due to the variations of source, reference and load. The interception of the error voltage variation curve and the saw tooth waveform with switching frequency, leads to (3) for the computation of duty cycle coefficients []10.Maximum variation of pulse width around its steady state value of D is limited to D1. In each period of Tm=1/fm , there will be r=fs/fm pulses with duty cycles of dn. Equation (4) presents the Fourier series coefficients Cn of the PWM waveform m (t). Which have the frequency spectrum of Fig.9.B-Equivalent noise circuit and EMI spectral analysisTo attain the equivalent circuit of Fig.6 the voltage source Vs is replaced by short circuit and) as it has shown in Fig. 10. converter is replaced by PWM waveform switch current (IexThe transfer function is defined as the ratio of the LISN output voltage to the EMI current source as in (5).The coefficients di, ni (i = 1, 2, … , 4) c orrespond to the parameters of the equivalent circuit. Rc and Lc are respectively the effective series resistance (ESR) and inductance (ESL) of the filter capacitor Cf that model the non-ideality of this element. The LISN and filter parameters are as follows: CN = 100 nF, r = 5 Ω, l = 50 uH, RN =50 Ω, LN=250 uH, Lf = 0, Cf =0, Rc= 0, Lc= 0, fs =25 kHzThe EMI spectrum is derived by multiplication of the transfer function and the source noise spectrum. Simulation results are shown in Fig. 11.VI. PARAMETERS AFFECTION ON EMIA. Duty CycleThe pulse width in PWM waveform varies around a steady state D=0.5. The output noise spectrum was simulated with values of D=0.25 and 0.75 that are shown in Fig. 12 and Fig. 13. Even harmonics are increased and odd ones are decreased that is desired in point of view of EMC.On the other hand the noise energy is distributed over a wider range of frequency and the level of EMI decreased []11.B. Amplitude of duty cycle variationThe maximum pulse width variation is determined by D1. The EMI spectrum was simulatedwith D1=0.05. Simulations are repeated with D1=0.01 and 0.25 and the results are shown in Fig.14and Fig.15.Increasing of D1 leads to frequency modulation of the EMI signal and reduction in level ofconducted EMI. Zooming of Fig. 15 around 7thcomponent of switching frequency in Fig. 16shows the frequency modulation clearly.C. Error voltage frequencyThe main factor in the variation of duty cycle is the variation of source voltage. The fm=100 Hz ripple in source voltage is the inevitable consequence of the usage of rectifiers. The simulation is repeated in the frequency of fm=5000 Hz. It is shown in Fig. 17 that at a higher frequency for fm the noise spectrum expands in frequency domain and causes smaller level of conducted EMI. On the other hand it is desired to inject a high frequency signal to the reference voltage intentionally.D. Simultaneous effect of parametersSimulation results of simultaneous application of D=0.75, D1=0.25 and fm=5000 Hz that leadto expansion of EMI spectrum over a wider frequencies and considerable reduction in EMI level is shown in Fig. 18.VII. CONCLUSIONAppearance of Electromagnetic Interference due to the fast switching semiconductor devices performance in power electronics converters is introduced in this paper. Radiated and conducted interference are two types of Electromagnetic Interference where conducted type is studied in this paper. Compatibility regulations and conducted interference measurement were explained. LISN as an important part of measuring process besides its topology, parameters and impedance were described. EMI spectrum due to a PWM Buck type DC/DC converter was considered and simulated. It is necessary to present mechanisms to reduce the level of Electromagnetic interference. It shown that EMI due to a PWM Buck type switching power supply could be reduced by controlling parameters such as duty cycle, duty cycle variation and reference voltage frequency.VIII. REFRENCES[1] Mohan, Undeland, and Robbins, “Power Electronics Converters, Applications and Design” 3rdedition, John Wiley & Sons, 2003.[2] P. Moy, “EMC Related Issues for Power Electronics”, IEEE, Automotive Power Electronics, 1989, 28-29 Aug. 1989 pp. 46 – 53.[3] M. J. Nave, “Prediction of Conducted Interference in Switched Mode Power Supplies”, Session 3B, IEEE International Symp. on EMC, 1986.[4] Henderson, R. D. and Rose, P. J., “Harmonics and their Effects on Power Quality and Transfor mers”, IEEE Trans. On Ind. App., 1994, pp. 528-532.[5] I. Kasikci, “A New Method for Power Factor Correction and Harmonic Elimination in Power System”, Proceedings of IEEE Ninth International Conference on Harmonics and Quality of Power, Volume 3, pp. 810 – 815, Oct. 2000.[6] M. J. Nave, “Line Impedance Stabilization Networks: Theory and Applications”, RFI/EMI Corner, April 1985, pp. 54-56.[7] T. Williams, “EMC for Product Designers” 3rd edition 2001 Newnes.[8] B. Keisier, “Principles of Electromagnetic Compatibility”, 3rd edition ARTECH HOUSE 1987.[9] J. C. Fluke, “Controlling Conducted Emission by Design”, Vanhostrand Reinhold 1991.[10] M. Daniel,”DC/DC Switching Regulator Analysis”, McGrawhill 1988[11] M. J. Nave,” The Effect of Duty Cycle on SMPS Common Mode Emission: theory and experiment”, IEEE National Symposium on Electromagnetic Compatibility, Page(s): 211-216, 23-25 May 1989.基于压降型PWM开关电源的建模、仿真和减少传导性电磁干扰IIA. Farhadi摘要:电子设备之中杂乱的辐射或者能量叫做电磁干扰(EMI)。
各种开关电源的原理
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各种开关电源的原理
开关电源是一种将输入直流电压转换为输出可调节的直流电压的电源装置。
它通过开关器件(如晶体管、MOSFET等)的开关动作来实现输入电压的转换和调节。
根据不同的拓扑结构和工作原理,可以分为多种类型的开关电源,包括以下几种常见的原理:
1. 降压型开关电源(Buck Converter):将输入电压降低到输出较低的电压。
工作原理是通过开关器件周期性地将输入电压与电感储能器连接和断开,通过电感储能器的能量转移来降低输出电压。
2. 升压型开关电源(Boost Converter):将输入电压提高到输出较高的电压。
工作原理是通过开关器件周期性地将输入电压与电容储能器连接和断开,通过电容储能器的能量转移来提高输出电压。
3. 反激型开关电源(Flyback Converter):实现输入输出电压的隔离,可同时提供多种输出电压。
工作原理是通过开关器件周期性地将输入电压与电感储能器连接和断开,在开关断开时产生一个脉冲输出。
4. 交变型开关电源(Full-Bridge Converter):能够输出交流电。
工作原理是通过开关器件使输入电压在正负半个周期内与电容和电感分别连接和断开,通过这种周期性的切换来输出交流电。
5. 双向开关电源(Bidirectional Converter):能实现电能的双向流动。
工作原理是通过开关器件的切换,将输入电压能量转换为输出电压能量或者将输出电压能量转换为输入电压能量。
这些开关电源的设计和工作原理各有不同,但它们都通过开关器件的开关动作来实现输入电压的转换和调节,以满足各种电子设备对不同输出电压的需求。
基于单片机的开关电源外文参考文献译文及原文
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本科毕业设计(论文) 外文参考文献译文及原文学院信息工程学院专业信息工程年级班别学号学生姓名指导教师目录译文 (1)基于单片机的开关电源 (1)1、用途 (1)2、简介 (1)3、分类 (2)4、开关电源的分类 (3)5、技术发展动向 (4)6、原理简介 (6)7、电路原理 (7)8、DC/DC变换 (8)9、AC/DC变换 (8)原文 (10)The design Based onsingle chip switching power supply (10)1、uses (10)2、Introduction (10)3、classification (11)4、the switching power supply. (13)5、technology developments (14)6、the principle of Introduction (17)7、the circuit schematic (18)8、the DC / DC conversion (19)9, AC / DC conversion (20)译文基于单片机的开关电源1、用途开关电源产品广泛应用于工业自动化控制、军工设备、科研设备、LED 照明、工控设备、通讯设备、电力设备、仪器仪表、医疗设备、半导体制冷制热、空气净化器,电子冰箱,液晶显示器,LED灯具,通讯设备,视听产品,安防,电脑机箱,数码产品和仪器类等领域。
2、简介随着电力电子技术的高速发展,电力电子设备与人们的工作、生活的关系日益密切,而电子设备都离不开可靠的电源,进入80年代计算机电源全面实现了开关电源化,率先完成计算机的电源换代,进入90年代开关电源相继进入各种电子、电器设备领域,程控交换机、通讯、电子检测设备电源、控制设备电源等都已广泛地使用了开关电源,更促进了开关电源技术的迅速发展。
开关电源是利用现代电力电子技术,控制开关晶体管开通和关断的时间比率,维持稳定输出电压的一种电源,开关电源一般由脉冲宽度调制(PWM)控制IC和开关器件(MOSFET、BJT等)构成。
开关电源设计及其英文翻译
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Switching Power Supply DesignSwitching power supply work in high frequency, high pulse state, are analog circuits in a rather special kind. Cloth boards to follow the principle of high-frequency circuit wiring.1, layout:Pulse voltage connection as short as possible, including input switch connected to the transformer, output transformer to the rectifier tube cable. Pulse current loop as small as possible such as the input filter capacitor is returned to the transformer to the switch capacitor negative. Some out-ended output transformers are the output rectifier to the output capacitor back to transformer circuit X capacitor as close as possible to the input switching power supply, input lines should be avoided in parallel with other circuits, should be avoided. Y capacitor should be placed in the chassis ground terminal or FG connectors. A total of touch induction and transformer to maintain a certain distance in order to avoid magnetic coupling. Such as poor handling of feeling in between inductor and transformer plus a shield, over a number of EMC performance for power supply to the greater impact.General the output capacitor can be used the other two a close rectifier output terminal should be close to, can affect the power supply output ripple index, two small capacitor in parallel results should be better than using a large capacitor. Heating devices to maintain a certain distance, and electrolytic capacitors to extend machine life, electrolytic capacitors is the switching power supply bottleneck life, such as transformers, power control, high power resistors and electrolytic to maintain the distance required between the electrolyte leaving space for heat dissipation , conditions permitting, may be placed in the inlet.Control part to pay attention to: Weak signal high impedance circuit connected to sample the feedback loop as short as in the processing as far as possible avoid interference, the current sampling signal circuits, in particular the current control circuit, easy to deal with some unexpected bad The accident, which had some skill, now to 3843 the circuit example shown in Figure (1) Figure 1 better than Yu Figure 2, Figure 2 Zai full time by observing the current waveform oscilloscope Mingxian superimposed spikes, Youyuganrao limited flow ratio design Zhi Dian low, Figure 1 there is no such phenomenon, there are switch drive signal circuit, switch resistance should be close to the switch driver can switch the work to improve the reliability of this and the high DC impedance voltage power MOSFET driver characteristics.Second, routingAlignment of current density: now the majority of electronic circuit board using insulated copper constitute tied. Common PCB copper thickness of 35μm, the alignment valuecan be obtained in accordance with 1A/mm experience the value of current density, the specific calculations can be found in textbooks. To ensure the alignment principles of mechanical strength should be greater than or equal to the width of 0.3mm (other non-power supply circuit board may be smaller minimum line width). PCB copper thickness of 70μm is also common in switching power supply, then the current density can be higher.Add that, now Changyong circuit board design tool design software generally items such as line width, line spacing, hole size and so dry plate Guo Jin Xing parameters can be set. In the design of circuit boards, design software automatically in accordance with the specifications, can save time, reduce some of the workload and reduce the error rate.Generally higher on the reliability of lines or line density wiring can be used double panel. Characterized by moderate cost, high reliability, to meet most applications.The ranks of some of the power module products are also used plywood, mainly to facilitate integration of power devices such as transformer inductance to optimize wiring, cooling and other power tube. Good consistency with the craft beautiful, transformer cooling good advantage, but its disadvantage is high cost, poor flexibility, only suitable for industrial mass production.Single-sided, the market circulation of almost universal switching power supply using single-sided circuit board, which has the advantage of lower costs in the design and production technology are also taken some measures to ensure its performance.Single PCB design today to talk about some experience, as a single panel with low cost, easy-to-manufacture features, the switching power supply circuit has been widely used, because of its side tied only copper, the device's electrical connections, mechanical fixation should rely on the copper layer, the processing must be careful.To ensure good performance of the mechanical structure welding, single-sided pad should be slightly larger to ensure that the copper and substrate tied good focus, and thus will not be shocked when the copper strip, broken off. General welding ring width should be greater than 0.3mm. Pad diameter should be slightly larger than the diameter of the device pins, but not too large, to ensure pin and pad by the solder connection between the shortest distance, plate hole size should not hinder the normal conditions for the degree of investigation, the pad diameter is generally greater than pin diameter 0.1-0.2mm. Multi-pin device to ensure a smooth investigation documents can also be larger.Electrical connection should be as wide as possible, in principle, should be larger than the width of pad diameter, special circumstances should be connected in line with the need to widen the intersection pad (commonly known as Generation tears), to avoid breaking certain conditions, line and pad. Principle of minimum line width should be greater than 0.5mm.Single-board components to be close to the circuit board. Need overhead cooling device to device and circuit board between the pins plus casing, can play a supporting deviceand increase the dual role of insulation to minimize or avoid external shocks on the pad and the pin junction impact and enhance the firmness of welding. Circuit board supporting the weight of large parts can increase the connection point, can enhance joint strength between the circuit board, such as transformers, power device heat sink.Single-sided welding pins without affecting the surface and the shell spacing of the prior conditions, it can be to stay longer, the advantage of increased strength of welded parts, increase weld area and immediately found a Weld phenomenon. Shear pin long legs, the welding force smaller parts. In T aiwan, the Japanese often use the device pins in the welding area and the circuit board was bent 45 degrees, and then welding process, its reasoning Ibid. Double panel today to talk about the design of some of the issues, in relatively high number of requests, or take the line density of the larger application environments using double-sided PCB, its performance and various indicators of a lot better than a single panel.Two-panel pad as holes have been high intensity metal processing, welding ring smaller than a single panel, the pad hole diameter slightly larger in diameter than pins, as in the welding process solder solution conducive to penetrate through the top hole solder pad to increase the welding reliability. But there is a disadvantage if the hole is too large, wave soldering tin when the jet impact in the lower part of the device may go up, have some flaws.High current handling of alignment, line width in accordance with pre-quote processing, such as the width is not enough to go online in general can be used to increase the thickness of tin plating solution, the method has a good variety of1. Will take the line set to pad property, so that when the circuit board manufacturing solder alignment will not be covered, the whole hot air normally be tin plated.2. In the wiring by placing pads, the pad is set to take in line shape, pay attention to the pad holes set to zero.3. In the solder layer placed on line, this method is the most flexible, but not all PCB manufacturers will understand your intentions, needed captions. Place the line in the solder layer of the site will not coated solder tinning line several methods as above, to note that, if the alignment of a very wide all plated with tin in solder after the solder will bond a lot and distribution is very uneven, affecting appearance. Article tin can be used generally slender width in the 1 ~ 1.5mm, length can be determined according to lines, tin part of the interval 0.5 ~ 1mmDouble-sided circuit board for the layout, the alignment provides a very selective, make wiring more reasonable. On the ground, the power ground and signal ground must be separated, the two to converge in filter capacitors, in order to avoid a large pulsed current through the signal ground connection instability caused by unexpected factors, the signal control circuit grounding point as far as possible, a skill, as far as possible the alignment of the non-grounded wiring layer in the same place, the last shop in another layer of earth.Output line through the filter capacitors, the general first, and then to the load, input line must also pass capacitor, to the transformer, the theoretical basis is to ripple through trip filter capacitor.Voltage feedback sampling, in order to avoid high current through the alignment of the feedback voltage on the sampling point must be the most peripheral power output to increase the load effect of target machine.Alignment change from a wiring layer to another wiring layer generally used hole connected, not through the pin pad device to achieve, because the plug in the device may be damaged when the relationship between this connection, there is current in every passage of 1A, at least two through-hole, through hole diameter is greater than the principle of 0.5mm, 0.8mm generally processed ensure reliability.Cooling devices, in some small power supply, the circuit board traces can be and cooling, characterized by the alignment as generous as possible to increase the cooling area is not coated solder, conditions can even be placed over holes, enhanced thermal conductivity .Today to talk about the aluminum plate in the switching power supply application and multilayer printed circuit in the switching power supply applications.Aluminum plate by its own structure, has the following characteristics: very good thermal conductivity, single Mianfu copper, the device can only be placed in tied copper surface, can not open electrical connection hole so as not to place jumper in accordance with a single panel.Aluminum plate is generally placed patch device, switch, the output rectifier heat conduction through the substrate to go out, very low thermal resistance, high reliability can be achieved. Transformer with planar chip structure, but also through substrate cooling, the temperature is lower than the conventional, the same size transformer with a large aluminum plate structure available output power. Aluminum plate jumper bridge approach can be used. Aluminum plate power are generally composed by the two PCB, another one to place the control circuit board, through the physical connection between the two boards is integrated.As the excellent thermal conductivity of aluminum plate, in a small amount of manual welding more difficult, solder cooling too fast and prone to problems of a simple and practical way of existing, an ironing ordinary iron (preferably temperature regulation function), over and iron for the last, fixed, and temperature to 150 ℃ and above the aluminum plate on the iron, heating time, and then affix the components according to conventional methods and welding, soldering iron temperature is appropriate to the device easy to , is too high when the device may be damaged, or even copper strip aluminum plate, the temperature is too low welding effect is not good, to be flexible.Recent years, with the multi-layer circuit board applications in switching powersupply circuit, printed circuit transformer makes it possible, due to multilayer, smaller spacing also can take advantage of Bianya Qi window section, the main circuit board can be re- Add 1-2 formed by the multilayer printed coil to use the window, the purpose of reducing circuit current density, due to adopt printed coil, reducing manual intervention, transformers consistency, surface structure, low leakage inductance, coupling good . Open-type magnetic core, good heat dissipation. Because of its many advantages, is conducive to mass production, it is widely used. But the research and development of large initial investment, not suitable for small-scale health.Switching power supply is divided into, two forms of isolation and non-isolated, isolated here mainly to talk about switching power supply topologies form below,non-specified, are to isolate the power. Isolated power supply in accordance with the structure of different forms, can be divided into two categories: a forward and flyback. Flyback transformer primary side means that when the Vice-edge conduction cut-off, transformer storage. Close of the primary, secondary side conduction, the energy released to the load of work status, general conventional flyback power multiplex, twin-tube is not common. Forward refers to the primary conduction in transformer secondary side while the corresponding output voltage is induced into the load, the direct transfer of energy through the transformer. According to specifications can be divided into conventional forward, including the single-transistor forward, Double Forward. Half-bridge, bridge circuits are all forward circuit.Forward and flyback circuits have their own characteristics in the process of circuit design to achieve optimal cost-effective, can be applied flexibly. Usually in the low-power flyback can be adopted. Slightly larger forward circuit can use a single tube, medium-power can use Double Forward circuit or half-bridge circuit, low-voltage push-pull circuit, and the half-bridge work in the same state. High power output, generally used bridge circuit, low voltage can be applied push-pull circuit.Flyback power supply because of its simple structure, and to cut the size of a similar size and transformer inductance, the power supply in the medium has been widely applied. Presentation referred to in some flyback power supply can do dozens of watts, output power exceeding 100 watts would be no advantage to them difficult. Under normal circumstances, I think so, but it can not be generalized, PI's TOP chips can do 300 watts, an article describes the flyback power supply can be on the KW, but not seen in kind. Power output and the output voltage level.Flyback power transformer leakage inductance is a critical parameter, because the power needs of the flyback transformer stored energy, to make full use of transformer core, the general must be open in the magnetic circuit air gap, the aim is to change the core hysteresis back line of the slope, so that transformers can withstand the impact of a largepulse current, which is not core into saturation non-linear state, the magnetic circuit in the high reluctance air gap in the state, generated in the magnetic flux leakage is much larger than completely closed magnetic circuit .Transformer coupling between the first pole is the key factor determining the leakage inductance, the coil to be very close as far as possible the first time, the sandwich can be used around the law, but this would increase the distributed capacitance transformer. Use core as core with a long window, can reduce the leakage inductance, such as the use of EE, EF, EER, PQ-based EI type magnetic core effective than good.The duty cycle of flyback power supplies, in principle, the maximum duty cycle of flyback power supply should be less than 0.5, otherwise not easy loop compensation may be unstable, but there are some exceptions, such as the U.S. PI has introduced the TOP series chip can work under the conditions of duty cycle is greater than 0.5.Duty cycle by the transformer turns ratio to determine former deputy side, I am an anti-shock view is, first determine the reflected voltage (output voltage reflected through the transformer coupling the primary voltage value), reflecting a certain voltage range of voltage increase is duty cycle increases, lower power loss. Reduce the reflected voltage duty cycle decreases, increases power loss. Of course, this is a prerequisite, when the duty cycle increases, it means that the output diode conduction time, in order to maintain output stability, more time will be to ensure that the output capacitor discharge current, the output capacitor will be under even greater high-frequency ripple current erosion, while increasing its heat, which in many circumstances is not allowed.Duty cycle increases, change the transformer turns ratio, transformer leakage inductance will increase, its overall performance change, when the leakage inductance energy large enough, can switch to fully offset the large account space to bring low-loss, no further increase when the meaning of duty, because the leakage inductance may even be too high against the peak voltage breakdown switch. Leakage inductance as large, may make the output ripple, and other electromagnetic indicators deteriorated. When the duty hours, the high RMS current through the switch, transformer primary current rms and lowered the converter efficiency, but can improve the working conditions of the output capacitor to reduce fever. How to determine the transformer reflected voltage (duty cycle)Some netizens said switching power supply feedback loop parameter settings, work status analysis. Since high school mathematics is rather poor, "Automatic Control Theory," almost on the make-up, and for the door is still feeling fear, and now can not write a complete closed-loop system transfer function, zero for the system, the concept of feeling pole vague, see Bode plot is only about to see is a divergence or convergence, so the feedback compensation can not nonsense, but there are a number of recommendations. If you have some mathematical skills, and then have some time to learn then the University of textbooks,"Principles of Automatic Control" digest look carefully to find out, combined with practical switching power supply circuit, according to the work of state for analysis. Will be harvested, the Forum has a message, "coach feedback loop to study the design, debugging," in which CMG good answer, I think we can reference.Then today, on the duty cycle of flyback power supply (I am concerned about the reflected voltage, consistent with the duty cycle), the duty cycle with the voltage selection switch is related to some early flyback switching power supply using a low pressure tube, such as 600V or 650V AC 220V input power as a switch, perhaps when the production process, high pressure tubes, easy to manufacture, or low-pressure pipes are more reasonable conduction losses and switching characteristics, as this line reflected voltage can not be too high, otherwise the work order to switch the security context of loss of power absorbing circuit is quite impressive.Reflected voltage 600V tube proved not more than 100V, 650V tube reflected voltage not greater than 120V, the leakage inductance voltage spike when the tubes are clamped at 50V 50V working margin. Now that the MOS raise the level of manufacturing process control, flyback power supplies are generally used 700V or 750V or 800-900V the switch. Like this circuit, overvoltage capability against a number of switching transformer reflected voltage can be done a bit higher, the maximum reflected voltage in the 150V is appropriate, to obtain better overall performance.TOP PI's recommendation for the 135V chipset with transient voltage suppression diode clamp. But his evaluation board generally reflected voltage to be lower than the value at around 110V. Both types have their advantages and disadvantages:Category: shortcomings against over-voltage, low duty cycle is small, a large pulse current transformer primary. Advantages: small transformer leakage inductance, electromagnetic radiation and low ripple index higher switch loss, the conversion efficiency is not necessarily lower than the second.The second category: a large number of shortcomings of power loss, a large number of transformer leakage inductance, the ripple worse. Advantages: Some strong against over-voltage, large duty cycle, lower transformer losses and efficiency higher.Reflected voltage flyback power supply and a determining factorReflected voltage flyback power supply with a parameter related to that is the output voltage, output voltage, the lower the larger the transformer turns ratio, the greater the transformer leakage inductance, switch to withstand higher voltage breakdown switch is possible to absorb power consumption is higher, has the potential to permanently absorb the circuit power device failure (particularly with transient voltage suppression diode circuits). In the design of low-voltage low-power flyback power output optimization process must be handled with care, its approach has several:1, using a large core of a power level lower leakage inductance, which can improve the low-voltage flyback power conversion efficiency, reduce losses, reduce output ripple and improve multi-output power of the cross regulation in general is common in household appliances with a switch power, such as CD-ROM drive, DVB set-top boxes.2, if the conditions were not increased core, can reduce the reflected voltage, reducing the duty cycle. Reduce the reflected voltage can reduce the leakage inductance but may reduce the power conversion efficiency, which is a contradiction between the two, must have an alternative process to find a suitable point, replace the transformer during the experiment can detect the transformer original side of the anti-peak voltage, peak voltage to minimize the anti-pulse width, and magnitude of the work safety margin increase converter. Generally reflected voltage 110V when appropriate.3, enhance the coupling, reducing losses, the introduction of new technologies, and the routing process, transformers to meet the security specifications will between the primary and secondary side to insulation measures, such as pad tape, plus side air insulation tape. These will affect the performance of transformer leakage inductance, the reality can be used in production around the primary winding secondary wrapping method. Or sub-system with a triple insulated wire wound to remove the insulation between the initial level, can enhance the coupling, even use wide copper winding.The article refers to low voltage output is less than or equal to 5V output, as this type of small power supply, my experience is that the power output of more than 20W output can use a forward, get the best value for money, of course, this is not the right decision , and personal habits, relationship between the application environment, the next time to talk about the flyback power supply with a magnetic core, magnetic circuit air gap opening some understanding, I hope you receive adequate guidance.Flyback power transformer core magnetization state at work in one way, it needs to open the air gap magnetic circuit, similar to the pulsating direct current sensor. Part of the magnetic coupling through the air gap. Why I understand the principle of open air gap as follows: As the power ferrite also has a similar rectangle of the operating characteristics (hysteresis loop), operating characteristics curve in the Y-axis magnetic induction (B), now the general production process saturation point in 400mT above, the general value in the design of this value should be more appropriate in the 200-300mT, X-axis magnetic field strength (H) the value of current intensity is proportional to the magnetization. Open magnetic circuit air gap equal to the magnetic hysteresis loop to the X axis tilt, in the same magnetic induction intensity, can withstand a greater magnetizing current, equivalent to core store more energy, this energy cut-off switch When spilled into the load through the transformer secondary circuit, flyback power core to open the air gap is twofold. One is to transfer more energy, and the second to prevent the core into saturation.Flyback Power Transformer magnetization state in one way, not only to pass through the magnetic coupling energy, is also responsible for input and output isolation voltage transform multiple roles. Therefore, the treatment gap need to be very careful, the air gap leakage inductance can become too large, increase the hysteresis loss, iron loss, copper loss increases, affecting the power of the whole performance. Air gap is too small has the potential to transformer core saturation, resulting in damage to powerThe so-called flyback power supply is continuous and discontinuous mode transformer working conditions, working in full load condition in the power transformer complete transfer, or incomplete transmission mode. General design of the working environment, conventional flyback power supply should work in continuous mode, this switch, circuit loss are relatively small, and can reduce the stress of work input and output capacitors, but that there are some exceptions.Requires in particular that: As the characteristics of the flyback power supply is also more suitable for design into a high-voltage power supply, and high-voltage power transformers generally work in discontinuous mode, I understand the need for as high voltage power supply output voltage of the rectifier diodes. Because of the manufacturing process characteristics, high-tension diode, reverse recovery time is long, low speed, the current continuous state, the diode has a positive bias in the recovery, reverse recovery energy loss is very large, is not conducive to converter performance increase, ranging from reduced conversion efficiency, rectifiers, severe fever, weight is even burnt rectifier. As in the intermittent mode, the diode is reverse biased under zero bias, loss can be reduced to a relatively low level. Therefore, high voltage power supply work in discontinuous mode, and the frequency can not be too high.Another type of flyback power supply work in the critical state, the general type of power supply work in FM, or FM-width-modulated dual-mode, a number of low-costself-excitation power (RCC) is often used this form in order to ensure stable output transformer As the operating frequency, output current or input voltage change, close to the fully loaded transformer is always maintained at between continuous and intermittent, this power is only suitable for small power output, otherwise the handling characteristics of electromagnetic compatibility will be a headacheFlyback switching power supply transformer should work in continuous mode, it required relatively large winding inductance, of course, is to some extent continuous, excessive pursuit of absolute continuity is not realistic, may need a great core, very much coil turns, accompanied by a large leakage inductance and distributed capacitance, worth the trouble. So how does this parameter to determine, through repeated practice, and analysis of peer design, I think, in the nominal voltage input, the output reached 50% and 60% transformer from intermittent, continuous state of transition to more appropriate. Or at thehighest input voltage state, the full output, the transformer can transition to the continuous state on it.开关电源状态,电源工作在高频率,高脉冲的模拟电路的一个比较特殊的一种。
反激式开关电源介绍
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Magnetics and Power Conversion Lab
反激变换器的变压器
陈 为 博士 chw@
福州大学电气工程与自动化学院 教授, 博士生导师 中国电源学会理事, 变压器与电感器专委会 主任委员
Magnetics and Power Conversion Lab
主要内容
博士chwfzueducn福州大学电气工程与自动化学院教授博士生导师中国电源学会理事变压器与电感器专委会主任委员magneticspowerconversionlab磁性元件对功率变换器发展的重要性反激式变压器的设计考虑反激式变压器杂散参数的效应反激式变压器的磁场特性感性效应反激式变压器的电场特性容性效应主要内容magneticspowerconversionlab05w075w10w250w03w05w10wtierjul06tierjan05ratedpowernoloadpowerconsumption绿色电源要求电磁兼容要求空载损耗要求负载效率要求环境保护要求谐波电流要求ieee5191992环境友好负载效率25507510080电网环境电磁环境生态环境自然环境load影响全负载范围效率的因素磁性元件的损耗和设计对全负载范围效率有重要影响磁性元件的设计考虑结构设计电气设计损耗设计热设计emi设计杂散参数dcmccmvivonviipvdsvivovdsipoffvdsipvdsvivo最大占空比限制dmax045二极管反向耐压限制开关管承受电压限制vo12vvimax265vimin90vimin反激变压器基本电气设计电感量maxminipvdsvivomaxmindcmbccmdcm反激变压器优化设计铁芯面积匝数绕组损耗模型匝数匝长磁芯面积绕组结构线规线径股数频?磁芯损耗模型匝数磁芯面积材质体积频?匝数铁芯面积ae匝数or磁芯面积损耗pwpept损耗vs
电源专业英语词汇
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电源专业词汇(一)背板backplane带隙电压参考 Band gap voltage reference工作台电源 benchtop supply方块图 Block Diagram波特图Bode Plot自举Bootstrap桶形电容bucket capcitor机架chassis恒流源constant current source铁芯饱和Core Sataration交叉频率 crossover frequency纹波电流current ripple逐周期 Cycle by Cycle周期跳步 cycle skipping死区时间 Dead Time核心温度DIE Temperature非使能,无效,禁用,关断Disable主极点dominant pole 主极点使能,有效,启用 Enable额定值ESD Rating ESD评估板Evaluation Board超过下面的规格使用可能引起永久的设备损害或设备故障.建议不要工作在电特性表规定的参数范围以外. Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied.下降沿 Failling edge品质因数figure of merit浮充电压float charge voltage反驰式功率级flyback power stage前向压降forward voltage drop自由运行free-running续流二极管Freewheel diode满负载Full load栅极驱动gate drive栅极驱动级gate drive stage图gerber plot Gerber接地层ground plane电感单位(亨利) Henry人体模式Human Body Model滞回 Hysteresis涌入电流inrush current反相Inverting抖动jittery 结点Junction开尔文连接Kelvin connection引脚框架 Lead Frame无铅 Lead Free电平移动 level-shift电源调整率Line regulation负载调整率 load regulation批号 Lot Number低压差Low Dropout密勒Miller节点 node非反相Non-Inverting新颖的novel关断状态off state电源工作电压 Operating supply voltage 输出驱动级out drive stage异相Out of Phase产品型号Part NumberP沟道MOSFET P-channel MOSFET 相位裕度 Phase margin开关节点Phase Node便携式电子设备portable electronics掉电power down电源正常 Power Good功率地 Power Groud节电模式Power Save Mode上电 Power up下拉pull down上拉pull up逐脉冲Pulse by Pulse推挽转换器 push pull converter斜降ramp down斜升 ramp up冗余二极管redundant diode电阻分压器resistive divider振铃ringing纹波电流ripple current上升沿rising edge检测电阻sense resistor序列电源Sequenced Power Supplys直通,同时导通shoot-through杂散电感stray inductances子电路sub-circuit基板substrate电信Telecom热性能信息Thermal Information散热片thermal slug阈值 Threshold振荡电阻timing resistor线路,走线,引线Trace传递函数Transfer function 跳变点Trip Point 跳变点匝数比(初级匝数/次级匝数)turns ratio (Np / Ns)欠压锁定Under V oltage Lock Out (UVLO)电压参考V oltage Reference伏秒积voltage-second product零极点频率补偿zero-pole frequency compensation拍频beat frequency单击电路one shots缩放scaling等效串联电阻ESR地电位Ground平衡带隙trimmed bandgap压差dropout voltage大容量电容large bulk capacitance断路器circuit breaker电荷泵charge pump过冲overshoot元件设备三绕组变压器:three-column transformer ThrClnTrans双绕组变压器:double-column transformer DblClmnTrans电容器:Capacitor并联电容器:shunt capacitor电抗器:Reactor母线:Busbar输电线:TransmissionLine发电厂:power plant断路器:Breaker刀闸(隔离开关):Isolator分接头:tap电动机:motor状态参数有功:active power无功:reactive power电流:current容量:capacity电压:voltage档位:tap position有功损耗:reactive loss无功损耗:active loss功率因数:power-factor 功率:power功角:power-angle电压等级:voltage grade空载损耗:no-load loss铁损:iron loss铜损:copper loss空载电流:no-load current阻抗:impedance正序阻抗:positive sequence impedance负序阻抗:negative sequence impedance零序阻抗:zero sequence impedance电阻:resistor电抗:reactance电导:conductance电纳:susceptance无功负载:reactive load 或者QLoad有功负载: active load PLoad遥测:YC(telemetering)遥信:YX励磁电流(转子电流):magnetizing current定子:stator功角:power-angle上限:upper limit下限:lower limit并列的:apposable高压: high voltage低压:low voltage中压:middle voltage电力系统power system发电机generator励磁excitation励磁器excitor电压voltage电流current母线bus变压器transformer升压变压器step-up transformer高压侧high side输电系统power transmission system输电线transmission line固定串联电容补偿fixed series capacitor compensation 稳定stability电压稳定voltage stability功角稳定angle stability暂态稳定transient stability电厂power plant能量输送power transfer交流AC装机容量installed capacity电网power system落点drop point开关站switch station双回同杆并架double-circuit lines on the same tower 变电站transformer substation补偿度degree of compensation高抗high voltage shunt reactor无功补偿reactive power compensation故障fault调节regulation裕度magin三相故障three phase fault故障切除时间fault clearing time极限切除时间critical clearing time切机generator triping高顶值high limited value强行励磁reinforced excitation线路补偿器LDC(line drop compensation)机端generator terminal静态static (state)动态dynamic (state)单机无穷大系统one machine - infinity bus system 机端电压控制A VR电抗reactance电阻resistance功角power angle有功(功率) active power无功(功率) reactive power功率因数power factor无功电流reactive current下降特性droop characteristics斜率slope额定rating变比ratio参考值reference value电压互感器PT分接头tap下降率droop rate仿真分析simulation analysis传递函数transfer function框图block diagram 受端receive-side裕度margin同步synchronization失去同步loss of synchronization阻尼damping摇摆swing保护断路器circuit breaker电阻:resistance电抗:reactance阻抗:impedance电导:conductance电纳:susceptance导纳:admittance电感:inductance电容: capacitance电源专业词汇(二)coupling 耦合 intermittent 周期的 dislocation 错位propeller 螺旋桨 switchgear 配电装置 dispersion 差量flange 法兰盘 dielectric 介电的 binder 胶合剂alignment 定位 elastomer 合成橡胶 corollary 必然的结果rabbet 插槽 vent 通风孔 subtle 敏感的gearbox 变速箱 plate 电镀 crucial 决定性的flexible 柔性的 technics 工艺ultimate 最终的resilience 弹性vendor 自动售货机partition 分类rigid 刚性的prototype 样机diagram 特性曲线interfere 干涉compatible 兼容的simulation 模拟clutch 离合器refinement 精加工fixture 夹具torque 扭矩responsive 敏感的tensile 拉伸cushion 减震器rib 肋strength 强度packing 包装metallized 金属化stress 应力mitigate 减轻trade off 折衷方案yield 屈伸line shaft 中间轴matrix 母体inherent 固有的spindle 主轴aperture 孔径conformance 适应性axle 心轴turbulence 扰动specification 规范semipermanent 半永久性的enclosure 机壳specialization 规范化bolt 螺栓oscillation 振幅calling 职业nut 螺母anneal 退火vitalize 激发screw 螺丝polymer 聚合体revelation 揭示fastner 紧固件bind 凝固dissemination 分发rivit 铆钉mount 支架booster 推进器hub 轴套distortion 变形contractual 契约的coaxial 同心的module 模块verdict 裁决crank 曲柄slide 滑块malfunction 故障inertia 惰性medium 介质allegedly 假定active 活性的dissipation 损耗controversy 辩论lubrication 润滑assembly 总装dictate 支配graphite 石墨encapsulate 封装incumbent 义不容辞的derivative 派生物adhesive 粘合剂validation 使生效contaminate 沾染turbine 涡轮procurement 收购asperity 粗糙bearing 支撑架mortality 失败率metalworking 金属加工isostatic 均衡的shed light on 阐明viscous 粘稠的osculate 接触adversely 有害的grinding 研磨imperative 强制的consistency 连续性corrosin 侵蚀lattice 晶格fitness 适应性flush 冲洗fracture 断裂warrant 保证inhibitor 防腐剂diffusivity 扩散率turning 车工dispersant 分散剂vice versa 反之亦然ways 导轨deteriorate 降低tribological 摩擦的hybrid 混合物neutralize 平衡screen 屏蔽ID=inside diameter pulley 滑轮exclusion 隔绝OD=outside diameter hydraulic 液压的insulation 绝缘reciprocate 往复运动delicate 精密的elaborate 加工dress 精整dampen 阻尼incontrovertible 无可争议的by and large 大体上pivotal 中枢的luminous 发光的plastic 塑胶utilitarian 功利主义out of round 失园organic 有机的grass root 基层premature 过早的film 薄膜state-of-the-art 技术发展水平guard 防护罩polyester 聚酯blade 托板permeate 渗入epoxy 环氧的carrier 载体spillage 溢出polypropylene 聚丙烯chuck 卡盘erosion 浸蚀photoconductive 光敏的infeed 横向进给routine 程序miniaturization 小型化lapping 抛光postprocess 后置处理asynchronism 异步milling 洗削solder-bump 焊点synchronization 同步speciality 专业grid 栅格respond 响应stroke 行程impedance 阻抗feedback 反馈attachment 备件approximately 大约aberrance 畸变tapered 楔形的purported 据说steady 稳态的casting 铸件consumable 消费品dynamic 动态的index 换档inductance 电感transient 瞬态的stop 挡块capacitance 电容coordinate 坐标contour 轮廓resistance 电容curve 曲线machine center 加工中心audion 三极管diagram 特性曲线capitalize 投资diode 二极管history 关系曲线potentiometer 电位器transistor 晶体管gradient 斜率know-how 实践知识choker 扼流圈parabola 抛物线potted 封装的filter 滤波器root 根mechatronics 机电一体化transformer 变压器eigenvalue 特征值stem from 起源于fuse 保险丝function 函数rule-based 基于规则的annular core 磁环vector 向量consolidation 巩固radiator 散热器reciprocal 倒数energize 激发regulator 稳压器virtual value 有效值synchronous 同时发生bobbin 骨架square root 平方根socket 插孔tape 胶带cube 立方polarity 极性ceramic capacitor 瓷片电容integral 积分armature 电枢electrolytic C 电解电容differential 微分installment 分期付款self-tapping screw 自攻螺丝hisgram 直方图lobe 凸起footprint 封装ratio 比率plunge 钻入resin 松香grade down 成比例降低servo 伺服机构solderability 可焊性proportion 比例dedicated 专用的shock 机械冲击inverse ratio 反比interpolation 插补endurance 耐久性direct ratio 正比compensation 校正initial value 初始值plus 加upload 加载flashing 飞弧subtract 减overload 过载canned 千篇一律的multiply 乘lightload 轻载lot 抽签divide 除stagger 交错排列parallel 并联impedance 阻抗traverse 横向in series 串联damp 阻尼longitudinal 纵向的equivalent 等效的reactance 电抗latitudinal 横向的terminal 终端admittance 导纳restrain 约束creep 蠕动susceptance 电纳square 平方Hyperlink 超级连接spring 触发memo 备忘录wastage 损耗presentation 陈述principle 原理binder 打包planer 刨床source program 源程序 Client-Server Model客户机server 服务器table 表query 查询form 表单report 报表macro 宏 module 模块field 字段record 记录电源专业词汇(三)printed circuit 印制电路printed wiring 印制线路printed board 印制板printed circuit board 印制板电路printed wiring board 印制线路板printed component 印制元件printed contact 印制接点printed board assembly 印制板装配board 板rigid printed board 刚性印制板flexible printed circuit 挠性印制电路flexible printed wiring 挠性印制线路flush printed board 齐平印制板metal core printed board 金属芯印制板metal base printed board 金属基印制板mulit-wiring printed board 多重布线印制板molded circuit board 模塑电路板discrete wiring board 散线印制板micro wire board 微线印制板buile-up printed board 积层印制板surface laminar circuit 表面层合电路板B2it printed board 埋入凸块连印制板chip on board 载芯片板buried resistance board 埋电阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 键盘板夹心板dynamic flex board 动态挠性板static flex board 静态挠性板break-away planel 可断拼板cable 电缆flexible flat cable (FFC) 挠性扁平电缆membrane switch 薄膜开关hybrid circuit 混合电路thick film 厚膜thick film circuit 厚膜电路thin film 薄膜thin film hybrid circuit 薄膜混合电路interconnection 互连conductor trace line 导线flush conductor 齐平导线transmission line 传输线crossover 跨交edge-board contact 板边插头stiffener 增强板substrate 基底real estate 基板面conductor side 导线面component side 元件面solder side 焊接面printing 印制grid 网格pattern 图形conductive pattern 导电图形non-conductive pattern 非导电图形legend 字符mark 标志base material 基材laminate 层压板metal-clad bade material 覆金属箔基材copper-clad laminate (CCL) 覆铜箔层压板composite laminate 复合层压板thin laminate 薄层压板basis material 基体材料prepreg 预浸材料bonding sheet 粘结片preimpregnated bonding sheer 预浸粘结片epoxy glass substrate 环氧玻璃基板mass lamination panel 预制内层覆箔板core material 内层芯板bonding layer 粘结层film adhesive 粘结膜unsupported adhesive film 无支撑胶粘剂膜cover layer (cover lay) 覆盖层stiffener material 增强板材copper-clad surface 铜箔面foil removal surface 去铜箔面unclad laminate surface 层压板面base film surface 基膜面adhesive faec 胶粘剂面plate finish 原始光洁面matt finish 粗面length wise direction 纵向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型层压板A-stage resin A阶树脂B-stage resin B阶树脂C-stage resin C阶树脂epoxy resin 环氧树脂phenolic resin 酚醛树脂polyester resin 聚酯树脂polyimide resin 聚酰亚胺树脂bismaleimide-triazine resin 双马来酰亚胺三嗪树脂acrylic resin 丙烯酸树脂melamine formaldehyde resin 三聚氰胺甲醛树脂polyfunctional epoxy resin 多官能环氧树脂brominated epoxy resin 溴化环氧树脂epoxy novolac 环氧酚醛fluroresin 氟树脂silicone resin 硅树脂silane 硅烷polymer 聚合物amorphous polymer 无定形聚合物crystalline polamer 结晶现象dimorphism 双晶现象copolymer 共聚物synthetic 合成树脂thermosetting resin 热固性树脂thermoplastic resin 热塑性树脂photosensitive resin 感光性树脂epoxy value 环氧值dicyandiamide 双氰胺binder 粘结剂adesive 胶粘剂curing agent 固化剂flame retardant 阻燃剂opaquer 遮光剂plasticizers 增塑剂unsatuiated polyester 不饱和聚酯polyester 聚酯薄膜polyimide film (PI) 聚酰亚胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增强材料glass fiber 玻璃纤维E-glass fibre E玻璃纤维D-glass fibre D玻璃纤维S-glass fibre S玻璃纤维glass fabric 玻璃布non-woven fabric 非织布glass mats 玻璃纤维垫yarn 纱线filament 单丝strand 绞股weft yarn 纬纱warp yarn 经纱denier 但尼尔warp-wise 经向thread count 织物经纬密度weave structure 织物组织plain structure 平纹组织grey fabric 坏布woven scrim 稀松织物bow of weave 弓纬end missing 断经mis-picks 缺纬bias 纬斜crease 折痕waviness 云织fish eye 鱼眼feather length 毛圈长mark 厚薄段split 裂缝twist of yarn 捻度size content 浸润剂含量size residue 浸润剂残留量finish level 处理剂含量size 浸润剂couplint agent 偶联剂finished fabric 处理织物polyarmide fiber 聚酰胺纤维aromatic polyamide paper 聚芳酰胺纤维纸breaking length 断裂长height of capillary rise 吸水高度wet strength retention 湿强度保留率whitenness 白度ceramics 陶瓷conductive foil 导电箔copper foil 铜箔rolled copper foil 压延铜箔annealed copper foil 退火铜箔thin copper foil 薄铜箔adhesive coated foil 涂胶铜箔resin coated copper foil 涂胶脂铜箔composite metallic material 复合金属箔carrier foil 载体箔invar 殷瓦foil profile 箔(剖面)轮廓shiny side 光面matte side 粗糙面treated side 处理面stain proofing 防锈处理double treated foil 双面处理铜箔shematic diagram 原理图logic diagram 逻辑图printed wire layout 印制线路布设master drawing 布设总图computer aided drawing 计算机辅助制图computer controlled display 计算机控制显示placement 布局routing 布线layout 布图设计rerouting 重布simulation 模拟logic simulation 逻辑模拟circit simulation 电路模拟timing simulation 时序模拟modularization 模块化layout effeciency 布线完成率MDF databse 机器描述格式数据库design database 设计数据库design origin 设计原点optimization (design) 优化(设计) predominant axis 供设计优化坐标轴table origin 表格原点mirroring 镜像drive file 驱动文件intermediate file 中间文件manufacturing documentation 制造文件queue support database 队列支撑数据库component positioning 元件安置graphics dispaly 图形显示scaling factor 比例因子scan filling 扫描填充rectangle filling 矩形填充region filling 填充域physical design 实体设计logic design 逻辑设计logic circuit 逻辑电路hierarchical design 层次设计top-down design 自顶向下设计bottom-up design 自底向上设计net 线网digitzing 数字化design rule checking 设计规则检查router (CAD) 走(布)线器net list 网络表subnet 子线网objective function 目标函数post design processing (PDP) 设计后处理interactive drawing design 交互式制图设计cost metrix 费用矩阵engineering drawing 工程图block diagram 方块框图moze 迷宫component density 元件密度traveling salesman problem 回售货员问题degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈顿距离euclidean distance 欧几里德距离network 网络array 阵列segment 段logic 逻辑logic design automation 逻辑设计自动化separated time 分线separated layer 分层definite sequence 定顺序conduction (track) 导线(通道)conductor width 导线(体)宽度conductor spacing 导线距离conductor layer 导线层conductor line/space 导线宽度/间距conductor layer No.1 第一导线层round pad 圆形盘square pad 方形盘diamond pad 菱形盘oblong pad 长方形焊盘bullet pad 子弹形盘teardrop pad 泪滴盘snowman pad 雪人盘V-shaped pad V形盘annular pad 环形盘non-circular pad 非圆形盘isolation pad 隔离盘monfunctional pad 非功能连接盘offset land 偏置连接盘back-bard land 腹(背)裸盘anchoring spaur 盘址land pattern 连接盘图形land grid array 连接盘网格阵列annular ring 孔环component hole 元件孔mounting hole 安装孔supported hole 支撑孔unsupported hole 非支撑孔via 导通孔plated through hole (PTH) 镀通孔access hole 余隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 任意层内部导通孔all drilled hole 全部钻孔toaling hole 定位孔landless hole 无连接盘孔interstitial hole 中间孔landless via hole 无连接盘导通孔pilot hole 引导孔terminal clearomee hole 端接全隙孔dimensioned hole 准尺寸孔via-in-pad 在连接盘中导通孔hole location 孔位hole density 孔密度hole pattern 孔图drill drawing 钻孔图assembly drawing 装配图datum referan 参考基准。
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Measurement of the Source Impedance of Conducted Emission Using Mode Separable LISN: Conducted Emission of a Switching Power SupplyJUNICHI MIY ASHITA,1 MASAYUKI MITSUZAW A,1 TOSHIYUKI KARUBE,1KIYOHITO Y AMASAW A,2 and TOSHIRO SA TO21Precision Technology Research Institute of Nagano Prefecture, Japan2Shinshu University, JapanSUMMARYIn the procedure for reducing conducted emissions, it is helpful to know the noise source impedance. This paper presents a method of measuring noise source complex impedances of common and differential mode separately. We propose a line impedance stabilization network (LISN) to measure common and differential mode noise separately without changing LISN impedances of each mode. With this LISN, conducted emissions of each mode are measured inserting appropriate impedances at the equipment under test (EUT) terminal of the LISN. Noise source complex impedances of switching power supply are well calculated from measured results. © 2002 Scripta Technica, Electr Eng Jpn, 139(2): 72 78, 2002; DOI 10.1002/eej.1154Key words:Conducted emission; noise terminal voltage; noise source impedance; line impedance stabiliza-tion network (LISN); EMI.1. IntroductionSwitching power supplies are employed widely in various devices. High-speed on/off operation is accompa-nied by harmonic noise that may cause electromagnetic interference (EMI) with communication devices and other equipment. To prevent the interference, methods of meas-urement and limit values have been set for conducted noise (~30 MHz) and radiated noise (30 to 1000 MHz). Much time and effort are required to contain the noise within the limit values; hence, the efficiency of noise removal tech-niques is an urgent social problem. Understanding of the mechanism behind noise generation and propagation is necessary in order to develop efficient measures. In particu-lar, the propagation of conducted noise must be investi-gated.Modeling and analysis of equivalent circuits have been carried out in order to investigate conducted noise caused by switching [1, 2]. However, the stray capacitance and other circuit parameters of each device must be known in order to develop an equivalent circuit, which is not practicable in the field of noise removal. On the other hand, noise filters and other noise-removal devices do not actually provide the expected effect [3, 4], which is explained by the difference between the static characteristics measured at an impedance of 50 Ω, and the actual impedance. Thus, it is necessary to know the noise source impedance in order to analyze the conducted noise.Regulations on the measurement of noise terminal voltage [5] suggest using LISN; in particular, the vector sum (absolute voltage) of two propagation modes, namely, common mode and differential mode, is measured in terms of the frequency spectrum. Such a measurement, however, does not provide phase data, and propagation modes cannot be separated; therefore, the noise source impedance cannot be derived easily. There are publications dealing with the calculation of the noise source impedance; for example, common mode is only considered as the principal mode, and the absolute value of the noise source impedance for the common mode is found from the ground wire current and ungrounded voltage [6], or mode-separated measure-ment is performed by discrimination between grounded and ungrounded devices [7]. However, measurement of the ground wire current is impossible in the case of domestic single-phase two-line devices. The complex impedance can be found using an impedance analyzer in the nonoperating state, but its value may be different for the operating state. Thus, there is no simple and accurate method of measuring source noise impedance as a complex impedance.© 2002 Scripta TechnicaElectrical Engineering in Japan, V ol. 139, No. 2, 2002Translated from Denki Gakkai Ronbunshi, V ol. 120-D, No. 11, November 2000, pp. 1376 1381The authors assumed that the noise source impedance could be found easily using only a spectrum analyzer, provided that the noise could be measured separately for each mode, and the LISN impedance could be varied. For this purpose, a LISN with a balun transformer was devel-oped to ensure noise measurement, with the common mode and differential mode strictly separated. An appropriate known impedance is inserted at the EUT (equipment under test) terminals, and the noise source impedance is found from the variation of the noise level. This method was used to measure the conducted noise of a switching power sup-ply, and it was confirmed that the noise source impedance could be measured as a complex impedance independently for each mode. Thus, significant information for noiseremoval and propagation mode analysis was acquired.This paper presents a new method of measuring the noise source impedance of conducted emission using mode-separable LISN.2. Separate Measurement for Common Mode andDifferential ModeThe conventional single-phase LISN circuit for measurement of the noise terminal voltage is shown in Fig.1. The power supply is provided with high impedance by a 50-µH reactor, and a meter with an input impedance of 50Ω is connected between one line and the ground via a high-pass capacitor, and another line is terminated by 50 Ω. Thus, the LISN impedance as seen at the EUT is 100 Ω in the differential mode, and 25 Ω in the common mode. The measured value is the vector sum of both modes, and the noise must be found separately in order to find the noise source impedance for each mode. There is LISN with Y-to-delta switching to provide mode separation [8], but its impedance is 150 Ω, giving rise to a problem of data compatibility with 50-Ω LISN. Thus, a new mode-separa-ble LISN was developed as shown in Fig.2. The circuit is identical to that in Fig. 1 from the power supply through the high-pass capacitor. Switching of the connection pattern ensures measurement with one line of the balun transformer terminated by 50 Ω, and another line connected to the meter.In Fig. 2, the secondary side of the 2:1 balun trans-former is terminated by 50 Ω, while the primary side has 200 Ω; in the differential mode, the impedance (line-to-line) is 100 Ω since 200 Ω at the high-pass capacitor is connected in parallel. With the switch set at D, the meter is connected to the secondary side of the balun transformer. The voltage is one-half that of the line-to-line voltage, and measurement is performed in the standard way.The common mode current flows from both sides of the balun transformer via the middle tap to the 50-Ω termi-nal. The currents in the windings are antiphase, and no voltage is generated at the secondary side. Therefore, the impedance of the primary side is the terminal resistance of the tap. Since this impedance is connected in parallel to 50Ω (two 100 Ω in parallel) at the high-pass capacitor, the impedance between the common line and ground is 25 Ω. With the switch set at C, the meter is connected to the middle tap of the balun transformer, and the common-mode voltage is the line-to-ground voltage.3. Measurement of Noise Source Impedance3.1 Measurement circuit and calculationThough the propagation routes are different in the two modes, propagation from the noise source to the LISN can be represented in a simplified way as shown in Fig. 3. In the initial measurement, the load impedance Z L is the LISN impedance. Z L can be varied by inserting a knownimpedance at the EUT terminals. Consider three load im-Fig. 1. Standard 50-Ω/50-µH LISN.Fig. 2.Mode-separable LISN.Fig. 3. Schematic circuit of noise propagation.pedances, namely, LISN only and LISN with two different impedances inserted, Z L 1(R 1 + jX 1), Z L 2(R 2 + jX 2), andZ L 3(R 3+ jX 3). Using the values I 1, I 2, I 3 (scalars) measured in the three cases, Z 0(R 0 + jX 0) is found. Since V 0 = |Z L | × I ,the following expressions can be derived:From the above,Here a , b , and c are as follows:Substituting Eq. (2) into Eq. (1), the following quadratic equation for R 0 is obtained:Thus, R 0 and X 0 have two solutions each. The series of frequency points with positive R 0 is taken as the noise source impedance.3.2 Method of measurementAn impedance is inserted at the EUT terminals in order to measure the noise source impedance in the LISN as seen at the EUT. As shown in Fig. 4, the impedance is inserted so as to vary only the impedance in the mode under consideration, thus preventing an influence on the imped-ance in the other mode. In the diagram, V m is the voltage at the meter connected to the LISN, while the input impedance of the meter (50 Ω) is represented by the parallel resistance.Since parameters of both the LISN and the inserted imped-ance are known, the noise current I can be calculated from V m . Now Z 0 is calculated for each mode from the measured data obtained while varying Z L , by using Eqs. (2) and (3).With the differential mode shown in Fig. 4(a), CR is inserted between the two lines, thus varying the load im-pedance Z L . In the differential mode, Z 0 is assumed to be a low impedance, and hence the inserted impedance exerts a significant effect on the measured value. For this reason, 1Ω/0.47 µF and 0 Ω/0.1 µF were inserted, which are rather small compared to the LISN impedance.The measurement of the common mode shown in Fig.4(b) employs common-mode chokes that basically have no impedance in the differential mode. The common-mode chokes are provided with a secondary winding (ratio 1:1),so that the impedance at the secondary side can be varied.In the common mode, Z 0 is assumed to have a particularly high impedance in the low-frequency band. For this reason,5.1 k Ω and 100 pF were used as the secondary load for the common-mode choke to obtain a high inserted impedance.The measured data for the inserted impedance in the case of resistive and capacitive loads are presented in Fig. 5. The impedance of the common-mode choke includes its own inductance and the secondary load. In the case of a capaci-tive load, the resonance point is around 200 kHz; at higher frequencies, the impedance becomes capacitive.A single-phase two-line switching power supply (an ac adapter for a PC with an input of ac 100 V , a rated power of 45 W, and PWM switching at 73 kHz) was used as the EUT, and the rated load resistance was connected at the dcside. Filters were used for both the common and differential(1)modes, except for the case in which one common-mode choke was removed, in order to obtain the high noise level required for analysis. Both the EUT and the loads had conventional commercial ratings, and were placed 40 cm above a metal ground plate; the power cord was fixed.4. Measurement Results and Discussion The results of conventional measurement as well as common-mode and differential-mode measurement for the LISN without inserted impedance are shown in Fig. 6. The measurements were performed in the range of 150 kHz through 30 MHz, divided into three bands, using a spectrum analyzer with frequency linear sweep. Time-variable data were measured at their highest levels using the Max Hold function of the spectrum analyzer, and only the peak values were employed for calculation of Z 0. For this purpose, the values measured in every frequency band were subjected to the FFT, and all harmonics higher than the fundamental frequency were removed. The data were smoothed, and about 10 peak points were detected in every frequency band. In addition, only those peaks that were stronger than the meter s background noise by at least 6 dB were consid-ered.The results in Figs. 6(b) and 6(c) pertain to the LISN only; the level would vary with inserted impedance. The noise source impedance for both modes calculated from the measured data (using triple measurement) is given in Figs.7 and 9, respectively. The bold and dashed lines pertain to data acquired with the impedance analyzer at the EUT power plug, with the EUT not in operation. With the differ-ential mode, there were no high-frequency components, as shown in Fig. 6(b), and hence the impedance is calculated only for significant low-frequency peaks.The noise source impedance in differential mode can be represented schematically as in Fig. 8. The noise sourceimpedance is equal to the impedance between the LISNFig. 5.Inserted impedance in common mode.Fig. 6. Measured results of standard, differential-mode,and common-mode.Fig. 7. Noise source impedance for differential mode.terminals when the noise source is short-circuited. With switching power supplies, filtering is usually performed by a capacitor of 0.1 to 1 µF inserted between the lines. Since the impedance of the power cord is small in the measured frequency range, one may assume that the impedance as seen at the LISN is low, and that the phase changes from capacitive toward inductive as with the measured static characteristics. However, in the case of the given EUT, a nonlinear resistor was inserted between the power cord and the filter as shown in Fig. 8, and hence the impedance is rather high in the nonoperating state. In addition, there are rectifying diodes on the propagation route, but they do not conduct at the measurement voltage of the impedance ana-lyzer. The noise levels show considerable variation at 120Hz, which corresponds to the on/off frequency of the recti-fying diodes; however, only the peak values are measured and then used for calculation, and hence the impedance obtained by the proposed method is considered to pertain to the conductive state. For this reason, the results do not agree well with static characteristics. Thus, the impedance in the operating state cannot be measured in the differential mode.On the other hand, the measured data for |Z 0| in common mode agree well with the static characteristics, as shown in Fig. 9. The phase, too, exhibits a similar variation,although the scatter is rather large. The resistive part of three load impedances and Z 0 may be presented in a simplified way as in Fig. 10. From Eq. (1), the following is true for R 2,R 3, and Z 0:The distance ratio from Z 0 to R 3 and R 2 on the R X plane that satisfies this equation is I 2:I 3, which corresponds to a circle with radius r as in Eq. (4), with the center lying on the line R 3R 2:Similar circles for R 1 and R 2 are also shown in the diagram.When Z 0 and the load impedances lie on one line, the twocircles have a common point. Equation (4) indicates that if I 3 increases slightly, the outer circle becomes bigger, and the two circles do not adjoin. On the other hand, when the outer circle becomes smaller, the two circles intersect at two points, and X 0 varies more strongly than R 0. In practice, the difference in noise level due to the inserted impedance may drop below 1 dB at some frequencies, so that the solution for Z 0 becomes unavailable because of the scatter, or the phase scatters too much. The measurement accuracy is governed by the difference in noise level, and thus the inserted impedance should have a large enough variation compared to the measurement scatter; in addition, there should be a phase difference so that the two circles are not aligned, as in Fig. 10.Figures 7 and 9 pertain to one of the solutions of Eq.(3) with larger R 0. Here R 0 is not necessarily positive and the other solution is not necessarily negative. The two solutions may be basically discriminated from the fre-quency response and other characteristics, but other inser-tion data are employed for the sake of accuracy.Fig. 8. Equivalent circuit of differential-mode noisesource impedance.(4)Fig. 9.Noise source impedance for common mode.Fig. 10. Load impedances and Z 0 on R X plane.Figure 11 compares the measured data and calculated data for the variation of noise level due to insertion of a commercially available common-mode choke, with the cal-culation based on the results of Fig. 9 and the impedance of the common-mode choke. As is evident, the calculation agrees well with the measured values. On the other hand, a considerable discrepancy was confirmed for the other solu-tion. The noise source impedance found as explained above is accurate enough to predict the filtering effect.The noise source resistance in the common mode can be represented as in Fig. 12. Here Z 1 is the stray capacitance between the internal circuit and the case, and Z 2 is the stray capacitance between the case and the ground plate (or in the case of the ground wire, the impedance of the wire). The common-mode noise source impedance for a single-phase two-line EUT is primarily Z 2, becoming capacitive at low frequencies. Since the EUT is equipped with a filter, the influence of the primary rectifying diodes is not related to common-mode, and hence the data measured by the pro-posed method are very close to the static characteristics.However, this is not necessarily true in the case of a grounded line (Z 2 short-circuited) with no filter installed.In addition, here the full impedance as seen at the LISN is found; in practice, however, a filter or Z 1 is employed to suppress noise. Therefore, the impedance of the power cord is required as well as Z 1 and Z 2 in order to analyze the filtering effect. The impedance of the power cord or grounded wire can be easily determined by measurement or calculation. In our experiments without ground, the impedance is very close to Z 2; on the other hand, Z 1 might be measured by grounding the case and removing the filter (Fig. 12), and then used to analyze the filtering effect between the case and the lines. However, noise propagation in the inner circuit must be further investigated in order to estimate the noise-suppressing efficiency of Z 1.5. ConclusionsA new mode-separable LISN is proposed that sup-ports noise measurement without changing the impedance depending on the mode. The proposed LISN ensures accu-rate measurement for each mode, thus supporting imped-ance analysis.With the proposed LISN, an appropriate impedance is inserted at the EUT terminals, and the noise impedance can be found as a complex impedance, just as simply as with conventional measurement of the noise terminal voltage.The value of the inserted impedance must be chosen prop-erly in order to determine the phase accurately. The pro-posed method ensures sufficient accuracy not only to investigate noise propagation and design efficient counter-measures, but also to predict the filtering effect. The pro-posed technique can supply important data for future analysis of noise generation and propagation in switching power supplies.REFERENCES1.Matsuda H et al. Analysis of common-mode noise in switching power supplies. NEC Tech Rep 1998;51:60 65.2.Ogasawara S et al. Modeling and analysis of high-frequency leak currents generated by voltage-fed PWM inverter. Trans IEE Japan 1995;115-D:77 83.3.Iwasaki M, Ikeda T. Evaluation of noise filters for power supply. Tech Rep IEICE EMCJ 1999;90:1 6.4.Kamita M, Toyama K. A study on attenuation char-acteristics of power filters. Tech Rep IEICE EMCJ 1996;96:45 50.rmation technology equipment Radio distur-bance characteristics Limits and method of meas-urement. CISPR 22, 1997.Fig. 11. V ariation of noise level due to insertion ofanother impedance (measured and calculated data).Fig. 12. Equivalent circuit of common-mode noisesource impedance.6.K amita M, Oka N. Calculation of common-mode noise output impedance during operation. Tech Rep IEICE EMCJ 1998;98:59 65.7.Ran L, Clare C, Bradley K J, Chriistoopoulos C.Measurement of conducted electromagnetic emis-sions in PWM motor drive without the need for an LISN. IEEE Trans EMC 1999;41:50 55.8.Specification for radio disturbance and immunity measuring apparatus and method Part 1: Radio dis-turbance and immunity measuring apparatus. CISPR 16-1, 1993.AUTHORS (from left to right)Junichi Miyashita (member) graduated from Tohoku University in 1981 and joined the Precision Technology Research Institute of Nagano Prefecture. His research interests are EMC measurement and prevention. He is a member of IEICE.Masayuki Mitsuzawa (nonmember) graduated from Nagoya University in 1984 and joined the Precision Technology Research Institute of Nagano Prefecture. His research interests are EMC measurement and prevention. He is a member of JIEP .Toshiyuki Karube (nonmember) graduated from Waseda University in 1991 and joined the Precision Technology Research Institute of Nagano Prefecture. His research interests are EMC measurement and prevention. He is a member of IEICE and JIEP .Kiyohito Yamasawa (member) completed the M.E. program at Tohoku University in 1970. He has been a professor at Shinshu University since 1993. His research interests are magnetic device integration, microswitching power units, and microwave sensors. He holds a D.Eng. degree and is a member of IEICE, SICE, the Magnetics Society of Japan, the Japan AEM Society, and IEEE.Toshiro Sato (member) completed his doctorate at Chiba University in 1989 and joined Toshiba Research Institute. He has been an associate professor at Shinshu University since 1996. His research interests are magnetic thin-film devices. He received a 1994 IEE Japan Paper Award and a 1999 Japan Society of Applied Magnetism Paper Award. He holds a D.Sc. degree,and is a member of IEE Japan, IEICE, and the Magnetics Society of Japan.。