WLCSP新产品介绍 New
腾讯云-智能钛机器学习平台白皮书
智能钛机器学习平台产品概述目录产品简介产品概述 (3)什么是TI-ONE..................................................................................................................................................................3.....如何使用TI-ONE ..............................................................................................................................................................3....TI-ONE 定价....................................................................................................................................................................3.......其他相关产品...................................................................................................................................................................3....... 客户价值 (5)技术价值...........................................................................................................................................................................5.......业务价值...........................................................................................................................................................................5....... 应用场景 (6)金融风控...........................................................................................................................................................................6.......营销推荐...........................................................................................................................................................................6.......工业质量检测...................................................................................................................................................................7.......算法大赛...........................................................................................................................................................................7.......物业智能化管理................................................................................................................................................................8......人物监察管理识别...........................................................................................................................................................8...... 版本更新. (11)V.1.5 版本说明..............................................................................................................................................................1..1.....新特性.....................................................................................................................................................................1..1.....V.1.4 版本说明..............................................................................................................................................................1..1.....新特性.....................................................................................................................................................................1..1.....问题修复及优化.....................................................................................................................................................1..2....V1.3 版本说明...............................................................................................................................................................1...2....新特性.....................................................................................................................................................................1..2.....问题修复及优化.....................................................................................................................................................1..2....V1.2 版本说明...............................................................................................................................................................1...2....新特性.....................................................................................................................................................................1..2.....产品简介产品概述什么是TI-ONE智能钛机器学习平台（TI-ONE ）是为AI 工程师打造的一站式机器学习服务平台，为用户提供从数据预处理、模型构建、模型训练、模型评估到模型服务的全流程开发及部署支持。
杭州希康维数字科技有限公司产品使用及管理指南说明书
Barrier GateUser ManualLegal Information©2022 Hangzhou Hikvision Digital Technology Co., Ltd. All rights reserved.About this ManualThe Manual includes instructions for using and managing the Product. Pictures, charts, images and all other information hereinafter are for description and explanation only. The information contained in the Manual is subject to change, without notice, due to firmware updates or other reasons. Please find the latest version of this Manual at the Hikvision website ( https:/// ).Please use this Manual with the guidance and assistance of professionals trained in supporting the Product.Trademarksand other Hikvision's trademarks and logos are the properties of Hikvision in various jurisdictions.Other trademarks and logos mentioned are the properties of their respective owners. DisclaimerTO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, THIS MANUAL AND THE PRODUCT DESCRIBED, WITH ITS HARDWARE, SOFTWARE AND FIRMWARE, ARE PROVIDED "AS IS" AND "WITH ALL FAULTS AND ERRORS". HIKVISION MAKES NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, MERCHANTABILITY, SATISFACTORY QUALITY, OR FITNESS FOR A PARTICULAR PURPOSE. THE USE OF THE PRODUCT BY YOU IS AT YOUR OWN RISK. IN NO EVENT WILL HIKVISION BE LIABLE TO YOU FOR ANY SPECIAL, CONSEQUENTIAL, INCIDENTAL, OR INDIRECT DAMAGES, INCLUDING, AMONG OTHERS, DAMAGES FOR LOSS OF BUSINESS PROFITS, BUSINESS INTERRUPTION, OR LOSS OF DATA, CORRUPTION OF SYSTEMS, OR LOSS OF DOCUMENTATION, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY, OR OTHERWISE, IN CONNECTION WITH THE USE OF THE PRODUCT, EVEN IF HIKVISION HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR LOSS.YOU ACKNOWLEDGE THAT THE NATURE OF THE INTERNET PROVIDES FOR INHERENT SECURITY RISKS, AND HIKVISION SHALL NOT TAKE ANY RESPONSIBILITIES FOR ABNORMAL OPERATION, PRIVACY LEAKAGE OR OTHER DAMAGES RESULTING FROM CYBER-ATTACK, HACKER ATTACK, VIRUS INFECTION, OR OTHER INTERNET SECURITY RISKS; HOWEVER, HIKVISION WILL PROVIDE TIMELY TECHNICAL SUPPORT IF REQUIRED.YOU AGREE TO USE THIS PRODUCT IN COMPLIANCE WITH ALL APPLICABLE LAWS, AND YOU ARE SOLELY RESPONSIBLE FOR ENSURING THAT YOUR USE CONFORMS TO THE APPLICABLE LAW. ESPECIALLY, YOU ARE RESPONSIBLE, FOR USING THIS PRODUCT IN A MANNER THAT DOES NOT INFRINGE ON THE RIGHTS OF THIRD PARTIES, INCLUDING WITHOUT LIMITATION, RIGHTS OF PUBLICITY, INTELLECTUAL PROPERTY RIGHTS, OR DATA PROTECTION AND OTHER PRIVACY RIGHTS. YOU SHALL NOT USE THIS PRODUCT FOR ANY PROHIBITED END-USES, INCLUDING THEDEVELOPMENT OR PRODUCTION OF WEAPONS OF MASS DESTRUCTION, THE DEVELOPMENT OR PRODUCTION OF CHEMICAL OR BIOLOGICAL WEAPONS, ANY ACTIVITIES IN THE CONTEXT RELATED TO ANY NUCLEAR EXPLOSIVE OR UNSAFE NUCLEAR FUEL-CYCLE, OR IN SUPPORT OF HUMAN RIGHTS ABUSES.IN THE EVENT OF ANY CONFLICTS BETWEEN THIS MANUAL AND THE APPLICABLE LAW, THE LATTER PREVAILS.Symbol Conventions The symbols that may be found in this document are defined as follows.ContentsChapter 1 Introduction (1)1.1 Product Introduction (1)1.2 Key Feature (1)Chapter 2 Installation (2)2.1 Installation Environment (2)2.2 Install Barrier Gate (2)2.2.1 Fix Barrier Gate Host (2)2.2.2 Install Boom Pole (4)2.3 Wiring (5)2.3.1 Connect to Peripheral Devices (5)2.3.2 Connect to Power Supply (7)Chapter 3 Debug (9)3.1 Remote Control (9)3.2 Button Operation (9)Chapter 4 Maintenance (13)4.1 Check Regularly (13)4.2 Check After Collision (13)4.3 Fault Code Description (13)4.4 Troubleshooting for Failed Auto Rising/Falling of Boom Pole After Power Cutoff (15)Appendix A. Peripheral Device Interfaces Introduction (16)Chapter 1 Introduction1.1 Product IntroductionBarrier gate is the entrance and exit management device to limit motor vehicle passing. It can control the boom pole automatically via parking lot management system. Or you can control the boom pole via buttons on remote controller.Barrier gate is widely applicable to toll station, parking lot, the entrance and exit of community and unit, etc. Its working temperature ranges from -30 °C to 70 °C (-22 °F to 158 °F).1.2 Key Feature●Adopts direct current brushless motor which can run steadily, applicable to entrance and exit, ETC system, etc.●The boom pole can rise rapidly and fall slowly. The barrier gate can learn the rising and falling limit positions automatically after it is powered on.●Over-voltage and over-current protection to prevent the motor from being burnt caused by locked rotor during running.●Supports anti-fall function via inductive loop, IR, etc., and protection functions including pressure wave, resistance rebound, etc.●Adjustable boom pole direction from left to right or from right to left.Chapter 2 Installation2.1 Installation EnvironmentThe installation environment of the barrier gate should meet the following requirements.●The installation space should be large enough to guarantee the boom pole can rise or fall normally.●Install the barrier gate on horizontal ground.●Installation surface requirements:○If no base is installed, the installation surface must be firm enough to fix the host to guarantee the barrier gate can run stably.○If base is needed, it is recommended to install the base with quick setting cement. The base should be horizontal. The height should be larger than 300 mm. The length and width of base should be larger than those of the actual barrier gate installation surface. Bury the set bolts prepared by yourself before installation.●If the barrier gate is anti-collision, the boom pole will flick 90° in reverse direction if it is impacted. Make sure there is no obstacle in the range.●Bury the cables before installation. The conduit should be 50 mm higher than the ground to avoid the gathered water on the ground to enter into the cable and cause short circuit.2.2 Install Barrier Gate2.2.1 Fix Barrier Gate HostFollow the steps below to fix the host of barrier gate.Steps1.Mark the positions of holes on the refuge island as shown below. The hole depth is approx. 120 mm.Figure 2-1 Mark Positions of HolesThe suggestions for positions of holes:●The holes in vertical direction should be near to the boom pole.●If the entrance/exit is unidirectional, the holes should be in the horizontal center of the refugeisland. If the entrance/exit is bi-directional, the holes in the horizontal direction should be far away from the entrance/exit.2.Punch the four M12 × 150 expansion screws in the package into the marked positions on refuge island, and fasten the nuts to make the screws expand to grip the ground. Then unfasten thenuts.Figure 2-2 Install Expansion Screws3.Uninstall the top and front covers.1)Use the L-type key to unlock the top cover.2)Lift the top cover gently and push it to take it down.3)Lift the front cover gently to take it down.Figure 2-3 Uninstall Top and Front Covers4.Fix the host.1)Put the layers on the host bottom and parallel them to the rising or falling direction of theboom pole.2)Put the host on the positions of expansion screws on the refuge island to make the screwspass through the layers. Keep the layers parallel to the rising or falling direction of the boom pole.3)Fasten the expansion nuts on the screws to fix the host.Figure 2-4 Fix HostKeep the supporting bracket of the boom pole vertically upward to avoid accident.2.2.2 Install Boom PoleFollow the steps to install boom pole.Steps1.Align the holes on the supporting bracket with those on the boom pole.2.Insert four M8 screws into the holes.3.Install flat washers, spring washers, and nuts on both sides of the screws.4.Fasten the nuts to fix the boom pole.Figure 2-5 Install Boom PoleCautionContact the professional technical personnel to change the boom pole. You may damage the barrier gate if you change it by yourself.2.3 Wiring2.3.1 Connect to Peripheral DevicesThe barrier gate can connect to peripheral devices such as entrance/exit capture unit.Steps1.Open the top cover of the host, and you can see the interfaces to connect peripheral devices.2.Connect peripheral devices to the interfaces as shown below.Refer to "Peripheral Device Interfaces Introduction" for the detailed definition of the peripheraldevices interfaces.Figure 2-7 Connect to Peripheral Devices2.3.2 Connect to Power SupplyConnect the laid power cord (RVV3 × 1.5 mm2 or above) to the power input of barrier gate. Installthe top and front covers. Use the L-type key to lock the top cover.●Cut off the power before wiring.●The power voltage of barrier gate is 220 VAC ± 10%. If the voltage exceeds the range, voltage stabilizer is needed.●Make sure the barrier gate is connected to the ground firmly, or it may cause electric shock.Figure 2-8 Power InputChapter 3 DebugAfter the installation completes, power on the barrier gate, and it will operate self-check of rising to limit position.After the self-check completes, you can control the barrier gate via remote controller or buttons.3.1 Remote ControlAfter the self-check completes, you can control the boom pole to rise, fall, and stop via the remote controller leaving factory with the barrier gate.3.2 Button OperationOpen the top cover of the host, and you can see the buttons and nixie tube. You can control the barrier gate via the buttons and judge the status via the nixie tube.There is respective initial status for the rising limit position, falling limit position, and rising speed of the barrier gate. You can adjust them via buttons if the initial status cannot meet the requirements of the installation site.Figure 3-1 Control ButtonsNote●If you need to hold the buttons to trigger operations, hold for 3 seconds or above.●The nixie tube shows the status (e.g., H0) and fault codes (hexadecimal characters, e.g., 1A). If the fault codes appear on the nixie tube, it means there is operation error. Contact the technical personnel of our company to solve the problems.Table 3-1 Button Operation DescriptionThe controller can learn no more than 481.Press2.Holdadjust the boom pole to H5 status.Displayed fallingunit of thedurationPressnixie tube displays rL.Apply control signal to let the boom pole rise to the limit position.Holdadjust the boom pole to H8 status.HoldPressChapter 4 Maintenance4.1 Check RegularlyThe barrier gate should be maintained every three months. Check according to the following instructions.●Check mechanical drive.●Check if the wiring and GND is firm.●Check if the motor sounds abnormally.4.2 Check After Collision●Check if the slewer is damaged. Change it if it is damaged.●Check if the boom pole is curved. Change it if it is curved.●Check if the barrier gate sounds abnormally during running. Contact the qualified after-sales service agent in time.4.3 Fault Code DescriptionWhen the barrier gate is abnormal, open the top cover, and observe the fault code on the nixie tube to troubleshoot.Table 4-1 Fault Code Description4.4 Troubleshooting for Failed Auto Rising/Falling of Boom Pole After Power CutoffIf the boom pole cannot rise or fall automatically after the power is cut off suddenly, follow the steps to solve the problem.Steps1.Uninstall the top and front covers.2.Insert L-type wrench into the hexagonal hole on the host.Figure 4-1 Rotate Wrench3.Rotate the wrench according to the barrier gate status.-If the barrier gate is in the falling limit status, rotate the wrench anticlockwise to raise the boom pole slowly until it can rise and fall automatically.-If the barrier gate is in the rising limit status, rotate the wrench clockwise to make the boom pole fall slowly until it can rise and fall automatically.Appendix A. Peripheral Device InterfacesIntroductionOpen the top cover of host, and you can see the interfaces as shown below.Figure A-1 Interfaces Table A-1 Interface Description。
WLCSP封装晶圆翘曲成因与控制方法研究
摘要晶圆级芯片尺寸封装（Wafer Level Chip Scale Package，WLCSP）以其较少的制造环节和较高的生产效率在先进电子封装领域中得到越来越广泛的应用，满足了半导体工业中高效率、低成本、小型化的发展需求。
本文以8英寸WLCSP 晶圆为研究对象，采用实验和数值模拟的方法对WLCSP产品在塑封工艺和减薄工艺过程中的晶圆翘曲进行研究。
采用实验的方法，对晶圆级WLCSP六面包封结构工艺进行研究，主要包括钝化层制作、再布线层制作、焊球制作、晶圆预切割、正面塑封、背面减薄、背面塑封、晶圆终切等工艺步骤。
在晶圆封装过程中发现，正面塑封和背面减薄工艺后，晶圆翘曲尤为严重，最大翘曲值分别达到1.2 mm和17.9 mm，背面塑封工艺后对翘曲有一定缓解作用，但并不能有效解决翘曲问题。
建立了六面包封的WLCSP有限元模型，仿真得到晶圆翘曲结果与实际工艺后测量结果一致。
数值模拟结果表明：随着塑封材料弹性模量和热膨胀系数的增加，晶圆翘曲变形增大。
材料中热失配对晶圆翘曲的影响大于弹性模量的影响。
在材料选择时，应首先考虑材料的热膨胀系数，选择与基底材料热膨胀系数相近的材料，降低热失配的影响；随着晶圆厚度减小，晶圆的弯曲刚度减小，由热失配引起的晶圆翘曲迅速增加；在工艺允许的范围内，应尽量选择较薄的塑封厚度，降低材料间热失配对晶圆翘曲的影响；背面塑封工艺在一定程度上可以缓解前工艺制程的翘曲，但是过大的背面塑封厚度会引起晶圆的反向翘曲，选择合适的正面和背面塑封厚度可以较好地控制翘曲。
根据数值模拟结果，对封装工艺进行了优化，提出并实验验证了晶圆级六面包封的新工艺方案，晶圆最大翘曲值在1 mm 之内，晶圆切割成单颗芯片后，通过芯片的高加速寿命测试，晶圆翘曲问题得到有效解决。
为晶圆级产品封装工艺设计及生产提供了参考。
另外，在晶圆翘曲工艺优化的研究中观测到不同工艺后晶圆出现不同的翘曲形态，采用数值模拟与实验测试的方法研究晶圆翘曲形态的变化，从数值模拟的结果发现，晶圆厚度对晶圆翘曲形态有重要影响，晶圆在减薄前多呈现球形翘曲，当晶圆厚度小于300 μm时，晶圆出现圆柱形翘曲，变化规律与实验结果一致。
Silicon Labs Wi-SUN 软件开发套件和硬件产品说明书
Wi-SUN SDK 1.1.0.0 GAGecko SDK Suite 3.2July 21, 2021Wireless Smart Ubiquitous Network (Wi-SUN) is the leading IPv6 sub-GHz mesh technol-Array ogy for smart city and smart utility applications. Wi-SUN brings Smart Ubiquitous Networksto service providers, utilities, municipalities/local government, and other enterprises, byenabling interoperable, multi-service, and secure wireless mesh networks. Wi-SUN canbe used for large-scale outdoor IoT wireless communication networks in a wide range ofapplications covering both line-powered and battery-powered nodes.Silicon Labs' Wi-SUN hardware is certified by the Wi-SUN Alliance, a global industry as-sociation devoted to seamless LPWAN connectivity. Wi-SUN builds upon open standardinternet protocols (IP) and APIs, enabling developers to extend existing infrastructure plat-forms to add new capabilities. Built to scale with long-range capabilities, high-datathroughput and IPv6 support, Wi-SUN simplifies wireless infrastructure for industrial ap-plications and the evolution of smart cities.These release notes cover SDK versions:1.1.0.0 released July 21, 20211.0.1.0 released June 16, 20211.0.0.0 released May 10, 2021Compatibility and Use NoticesFor information about security updates and notices, see the Security chapter of the Gecko Platform Release notes installed with this SDK or on the Silicon Labs Release Notes page. Silicon Labs also strongly recommends that you subscribe to Security Advisories for up-to-date information. For instructions, or if you are new to the Silicon Labs Wi-SUN SDK, see Using This Release.Compatible Compilers:IAR Embedded Workbench for ARM (IAR-EWARM) version 8.50.9•Using wine to build with the IarBuild.exe command line utility or IAR Embedded Workbench GUI on macOS or Linux could result in incorrect files being used due to collisions in wine’s hashing algorithm for generating short file names.•Customers on macOS or Linux are advised not to build with IAR outside of Simplicity Studio. Customers who do should carefully verify that the correct files are being used.GCC (The GNU Compiler Collection) version 10.2.0, provided with Simplicity Studio.Contents Contents1Wi-SUN Stack (2)1.1New Items (2)1.2Improvements (2)1.3Fixed Issues (2)1.4Known Issues in the Current Release (2)1.5Deprecated Items (3)1.6Removed Items (3)2Wi-SUN Applications (4)2.1New Items (4)2.2Improvements (4)2.3Fixed Issues (4)2.4Known Issues in the Current Release (4)2.5Deprecated Items (5)2.6Removed Items (5)3Using This Release (6)3.1Installation and Use (6)3.2Security Information (6)3.3Support (7)1 Wi-SUN Stack1.1 New ItemsAdded in release 1.1.0.0•Added a new SL_WISUN_MSG_NETWORK_UPDATE_IND_ID event that is fired when the network is updated: ip address update, new primary parent or new secondary parent.•The stack library is now compiled with the preprocessor definition DEBUG_EFM_USER and provides a default implementation of assertEFM(). It will only be used if the application is also compiled with that same definition. The user can provide a custom imple-mentation. See assertEFM() documentation for more information.Added in release 1.0.0.0Wi-SUN stack and SDK initial release1.2 ImprovementsNone1.3 Fixed IssuesFixed in release 1.1.0.0710923 Fixed an issue causig the event SL_WISUN_MSG_CONNECTED_IND_ID to be fired although no new connection was established. It was fired after each network update.699627 Fixed an issue causing connections to fail after an operating class update.721399 Fixed an issue causing US-IE configuration to be invalid when excluding channels.Fixed in release 1.0.1.0701190Fixed an issue causing a parent to lose track of its child frequency hopping sequence. The child router was sending an incorrect IFSU misleading the parent router and forcing it to be one frequency hop interval late. Fixed in release1.0.0.0Wi-SUN stack and SDK initial release1.4 Known Issues in the Current ReleaseIssues in bold were added since the previous release.714402 Wi-SUN border routervery infrequently hits a hard fault. Thecommand line interface is non-responsive and the router will notadvertize anymore. Routers will eventually report a PAN timeout.1.5 Deprecated ItemsNone1.6 Removed ItemsRemoved in release 1.1.0.0•Removed internal type definitions from the API public headers2 Wi-SUN Applications2.1 New ItemsAdded in release 1.0.0.0New Applications:•Wi-SUN - SoC CLI•Wi-SUN - SoC Empty•Wi-SUN - SoC Ping•Wi-SUN - SoC UDP Server•Wi-SUN - SoC UDP Client•Wi-SUN - SoC TCP Server•Wi-SUN - SoC TCP Client•Wi-SUN - SoC Meter•Wi-SUN - SoC Collector•Wi-SUN - SoC CoAP Meter•Wi-SUN - SoC CoAP CollectorNew precompiled demos:•Wi-SUN - SoC Border Router•Wi-SUN - SoC Border Router with backhaulEasy to use features (components):•POSIX like Socket•Application Core (event handling, connection handling, network configuration, etc.)•CoAP (Constrained Application Protocol)Radio Configurator Support (19 PHYs)Simplicity Studio – Network Analyzer Wi-SUN Support2.2 ImprovementsAdded in release 1.1.0.0Wi-SUN - SoC Border Router•Added a new command that configures new certificates•Added a new command to exclude channels from the frequency hopping schedule2.3 Fixed IssuesFixed in release 1.1.0.0720367 Fixed an issue causig collectors from both CoAP and non-CoAP sample applications to remove meters from their meter list.720336 Fixed an issue causing sample application for non-radio board targets to miss a radio configuration.2.4 Known Issues in the Current ReleaseSimplicity Studio – Network Analyzer: Wi-SUN Encrypted Packets are not supported yet2.5 Deprecated Items None2.6 Removed Items None3 Using This ReleaseThis release contains the following•Wi-SUN stack library•Wi-SUN sample applications•Wi-SUN border router pre-compiled demos•DocumentationIf you are a first time user, see QSG181: Silicon Labs Wi-SUN Quick-Start Guide.3.1 Installation and UseA registered account at Silicon Labs is required in order to download the Silicon Labs Wi-SUN SDK. You can register at https:///apex/SL_CommunitiesSelfReg?form=short.SDK installation instructions are covered in the Simplicity Studio 5 User’s Guide and QSG181: Silicon Labs Wi-SUN Quick-Start Guide. Use the Silicon Labs Wi-SUN SDK with the Silicon Labs Simplicity Studio 5 development platform. Simplicity Studio ensures that most software and tool compatibilities are managed correctly. Install software and board firmware updates promptly when you are notified. Documentation specific to the SDK version is installed with the SDK.3.2 Security InformationSecure Vault IntegrationThis version of the stack does not integrate Secure Vault Key Management.Security AdvisoriesTo subscribe to Security Advisories, log in to the Silicon Labs customer portal, then select Account Home. Click HOME to go to the portal home page and then click the Manage Notifications tile. Make sure that ‘Software/Security Advisory Notices & Product Change Notices (PCNs)’ is checked, and that you are subscribed at minimum for your platform and protocol. Click Save to save any changes.3.3 SupportDevelopment Kit customers are eligible for training and technical support. Contact Silicon Laboratories support at /support.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USAIoT Portfolio/IoTSW/HW/simplicityQuality /qualitySupport & Community/communityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple-menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor -mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit /about-us/inclusive-lexicon-projectTrademark InformationSilicon Laboratories Inc.®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, Clockbuilder ®, CMEMS ®, DSPLL ®, EFM ®, EFM32®, EFR, Ember ®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Ember ®, EZLink ®, EZRadio ®, EZRadioPRO ®, Gecko ®, Gecko OS, Gecko OS Studio, ISOmodem ®, Precision32®, ProSLIC ®, Simplicity Studio ®, SiPHY ®, Telegesis, the Telegesis Logo ®, USBXpress ® , Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Hold-ings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.。
维亚维解决方案第三代多应用平台（MAP-300）产品数据表说明书
VIAVI SolutionsData Sheet VIAVIThird Generation Multiple Application Platform (MAP-300)The VIAVI Solutions Multiple Application Platform (MAP-300) is an optical test and measurement platform optimized for compact cost-effective development and manufacturing of optical communications technology.Key Featuresy Available in rackmount, reverse-rackmount and benchtop mainframe configurationsy HTML-based graphical user interface gives consistent user experience both locally and remotelyy Field-replaceable controller includes an integrated 3.5-inch LCD touchscreen for network and system status y Support for USB 3.0 port, 15.6-inch external monitor, and ethernety Optional GPIB, additional ethernet ports and additional USB and trigger modulesy SCPI logical interface for automation programming, with remote programming supported via TCP/IP (LXI) over ethernet, GPIB and direct socket y Multi-user capabilityy Backward compatible with MAP2xx series cassettes and remote-control support y Hot swappable modulesy Supports the MAP-Series asset management tool MAPccApplicationsy General purpose fiber-optic lab use y Manufacturing test automation y DWDM/WSS test y Connectivity IL/RLy Polarization scrambling and OSNRCompliancey MAP Series cassettes include amplifier and sourcecassettes classified as either Class 3B or Class 1M Laser products. While operating in a MAP Series mainframe, cassettes meet the requirements of the IEC 60825-1 standard and comply with 21 CFR 1040.10 and 1040.11, except for deviations pursuant to Laser Notice 50, dated June 24, 2007.From the original Multiple Application Platform (MAP) system released in 2001 as part of JDSU to the new third generation MAP-300 Series, the MAP system is the heart of the VIAVI optical test solutions for labs and manufacturing. With unmatched scalability , users can be assured that our solutions will meet their current and future needs. MAP-300 provides the foundation to our entire portfolio, enabling scalability and efficiency for manufacturing optical network elements, modules and components.Customer Focused InnovationThe new MAP-300 builds upon the proven strengths of the MAP System while adding innovation where it matters most for our customers. Backwards compatible support for the installed automation base, combined with several new features, including an HTML-based GUI for multi-user environments, gives our customers the capabilities they need to achieve their goals. We can’t wait to see what you will accomplish with the new MAP-300!MAP-300 ConfigurationsThe MAP-300 mainframe, like its predecessor, is offered in both benchtop and rackmount versions as either threeor eight slot mainframe configurations. The eight-slot can also provided in a reverse rack-mount configuration. MAP-380 Eight-Slot MainframesEach MAP-380 mainframe consists of a 3U chassis that can house up to eight cassettes, plus a field-replaceable controller. The MAP-380 mainframe is available in rackmount, reverse-rackmount, and benchtopconfigurations.Figure 2 - MAP-380 rackmount and benchtop mainframes, rear viewFigure 1 - MAP-380 rackmount and benchtop mainframes front viewFigure 3 - MAP-380 reverse rackmount mainframes, front and rear viewMAP-330 Three-Slot MainframesEach MAP-330 mainframe consists of a 3U chassis that can house up to three cassettes, plus a field-replaceable controller. The rackmount versions are half 19” rack wide, so two units can be mounted side-by-side. An optional touch screen can be docked on the mainframe of a benchtop three-slot chassis for an easy portable, self-contained system.Figure 4 - MAP-330 benchtop mainframe, front and rear viewFigure 5 - MAP-330 benchtop mainframe with 15.6-inch touchscreen docked, front viewFigure 6 - MAP-330 3U half 19-inch rackmount mainframe, front viewSimple, Intuitive Graphical ControllerThe MAP-300 chassis includes a 3.5-inch touch screen that supports intuitive swipes for easy navigation. This local touchscreen provides access to connection and configuration settings.Users can access the MAP-300 GUI from a mainframe locally or remotely via Ethernet. The MAP-300 GUI allows multi-user access via a supported web browser by entering the IP address acquired from the controller in the location field of the web browser. The slot configuration of a mainframe is represented by widgets (one per slot) on the MAP-300 dashboard. When a slot is populated, the widget representing that slot identifies the cassette and provides quick access to the main device settings. The user can change the size of the widget to see more detail on specific cassettes. A detailed view of a cassette is available, whilst still having a complete view of all other slots.The settings panel gives you access to network and system settings, as well as remote chassis and license settings if available. The MAP-300 can be rebooted or placed in standby mode using through the GUI or local touchscreen.Figure 7 - MAP-300 local touchscreenFigure 8 - MAP-380 Dashboard GUI example.Control InterfacesAs a full-fledged member of the MAP family , all remote interfaces can interoperate with the three-slot and eight-slot versions. It includes optimized Interchangeable Virtual Instrument (IVI) drivers for ease of use with popular application-development environments, such as LabVIEW, Visual C++, Visual Basic, and LabWindows™, to provide full control of the modules and drop-in instrument programming capabilities. These capabilities let test programmers focus on test-level functions and sequences rather than the details required to communicate with the specific modules in the MAP system. The IVI drivers also include a simulation mode that lets developers capture system configurations so they can perform most of their development offline, freeing hardware for other purposes. These features make test automation development and debugging fast and easy. All MAP series module and platform commands conform to the Standard Commands for Programmable Instruments (SCPI) command language.Extensive Input/Output InterfacesAll mainframe configurations include: y Ethernet port for remote communication.y 4 USB host ports for installing peripheral devices, including USB drives, a mouse, and a keyboard. y One USB host port for the optional touchscreen.y Integrated 3.5-inch LCD touchscreen for network and system status information.y All mainframes can support up to two field-installable additional accessory modules for control and triggering. Available modules include (1) IEEE-488 (GPIB), (2) dual trigger LXI-compliant LDVS driver ports, and (3) three USB 3.0 ports and one Ethernet interface.Users who are comfortable with the General Purpose Interface Bus (GPIB)remote interface can order the field-installable option at any time.Automation Remote Use 1(Optional)Automation Remote Use 2(Optional)Automation Remote Use 3(Optional)MAP Control Center (MAPcc)VIAVI now offers the MAP Control Center (MAPcc), an asset management tool for MAP mainframes and cassettes. The MAPcc simplifies network management via a single screen that lists a full inventory of all your assets, enabling you to explore internal and external mainframes as well as the cassettes present in those mainframes. From the list of available mainframes, you can retrieve IP addresses, firmware versions and serial numbers, and you can search for a specific type of cassette, fiber or connector. The MAPcc lets you upgrade multiple mainframes at the same time using the upgrade center, as well as retrieve log files.MAP Chassis Selection GuideVIAVI offers a variation of chassis, the table below summaries their key attributes of each chassis and why it would be ideal for you.SpecificationsMainframe SpecificationsThe table below provides specifications for MAP-300 mainframes. For MAP Series cassettes, refer to the user guide for each cassette.Mainframe ChassisCapacity (Single-width cassettes) 3 cassettes8 cassettes Rackmount Kit OptionalBenchtop Kit OptionalController (MAP-300CLD-B)Operating System LinuxLocal T ouchscreen 3.5-in touchscreen for network/system status controls, 320 x 240 resolution Power Supply100 to 240 V AC, 50/60 Hz, Auto-switchingPower Consumption450 VA MAX450 VA MAXField Replaceable Y esBays for Plug-in Modules2Native Ports/InterfacesUSB 3.0 Host 1 frontUSB 3.0 (Mouse, Keyboard, etc.) 4 rearEthernet 10/100/1000BASE-T 1 rearMonitor port 1 rearOptical Plug-in Modules GPIB, USB/LAN Expansion, TriggerAutomationDriver Type IVI compliantStandard/Protocol LXI, VXI-11, SCPIDriver Compatibility LabView TM, LabWindows TM, Microsoft® Visual C++,Microsoft® Visual Basic®Accessibility Multiuser sharing supportWeb GUI Compatibility Google Chrome, Mozilla Firefox or Microsoft EdgeLaser Interlock (See the MAP Series Safety and Compliance Reference Guide, 22112369-325, for more information.) Local Interlock Software controlledRemote Interlock2-pin terminal block at rear controllerMechanicalDimensions of rackmount (W x H x D)24.61 x 13.26 x 38.63 cm(9.6 x 5.2 x 15.2 in)48.26 x 13.26 x 38.63 cm(19 x 5.2 x 15.2 in)Dimensions of benchmount (W x H x D) 26.43 x 15.49 x 44.27 cm(10.4 x 6.1 x 17.5 in)46.94 x 15.49 x 44.27 cm(18.5 x 6.1 x 17.5 in)WeightBenchtop Mainframe10 kg (22 lb)12.6 kg (27.7 lb) Rackmount Mainframe7.4 kg (16.3 lb) 10.8 kg (23.8 lb) EnvironmentOperating T emperature0 to 50°CStorage T emperature-30 to 60°CRelative Humidity5% to 85% non-condensingOptional 15.6-inch Touchscreen (MAP-300AKD) SpecificationsDock to Benchtop MainframeMAP-330SupportedMAP-380Not SupportedPower/Interface to MainframeMAP-330USB cable or docking connectorMAP-380USB cableWeight 2.7 kg (5.95 lb)Ordering InformationFor more information on this or other products and their availability, please contact your local VIAVI account manager or VIAVI directly at 1-844-GO-VIAVI (1-844-468-4284) or to reach the VIAVI office nearest you, visit /contacts.MAP-300 MainframesMAP-300 Accessories and Replacement Parts11 Third Generation Multiple Application Platform (MAP-300)LightDirect and LightTest Modular Families for the MAP SystemMAP mainframes are the foundation to our entire portfolio of functional modules, enabling scalability and efficiency for manufacturing optical network elements and modules. The MAP-300 series replaces the highly successful MAP-200. It is compatible with all our current cassettes and legacy cassette (all -C1, -C2 and -B1 modules). The cassette modules fall into two different families, the LightT est turn-key solutions and LightDirect configurable solutions to meet each customer’s exact needs.The LightDirect family includes a wide range of foundational optical test modules that are used in simple bench test applications, or combined in larger, multi-modules customer driven automated test systems. They are easy-to-control, single-functionality modules.© 2020 VIAVI Solutions Inc.Product specifications and descriptions in this document are subject to change without notice.map300-ds-lab-nse-ae 30190857 904 0920Contact Us +1 844 GO VIAVI (+1 844 468 4284)To reach the VIAVI office nearest you, visit /contacts.VIAVI SolutionsThe LightT est family are application specific, integrated test solutions that leverage the power of the MAP Series Super-Application or PC based software. Built with specialized MAP modules or assemblies of LightDirect modules, LightT est solutions are typically used in bench test applications but can also be combined in larger, multi-modules customer driven automated test systems.Passive Connector Test SolutionsThe VIAVI Solutions passive component/connector test solution (PCT) consists of a powerful family of modules, software, and peripherals for testing IL, RL, physical length, and polarity of optical connectivity products. Leveraging the modularity and connectivity of the VIAVI MAP platforms.Single Fiber Insertion Loss and Return Loss Test SystemThe PCT-rm is a MAP-220 based Single mode Insertion Loss (IL) and Return Loss (RL) test meter for single fiber connector applications. Part of the MAP Series PCT solution family , it features fully EF-compliant multimode Insertion Loss test meters with connector adapters that can be configured for all connectivity applications to ensure maximized productivity.Swept Wavelength SystemmSWS-C1 are swept wavelength test solutions for manufacturing and new device development of passive DWDM devices, ROADMs & Circuit Packs. Provides full characterization of wavelength.Optical Component Environmental Test SystemsAt the core of OCETS Plus is a pair of custom-grade programmable switches (1xN configuration). OCETS switches are specified to higher levels of IL repeatability and background RL than analogue-grade switches.。
先进封装技术WLCSP和SiP的发展现状和趋势
先进封装技术WLCSP和SiP的发展现状和趋势关于先进封装工艺的话题从未间断，随着移动电子产品趋向轻巧、多功能、低功耗发展，高阶封装技术也开始朝着两大板块演进，一个是以晶圆级芯片封装WLCSP （Fan-In WLP、Fan-out WLP等）为首，功能指向在更小的封装面积下容纳更多的引脚数；另一板块是系统级芯片封装（SiP），功能指向封装整合多种功能芯片于一体，压缩模块体积，提升芯片系统整体功能性和灵活性。
图1：主要封装形式演进Source：拓璞产业研究所整理，2016.9WLCSP：晶圆级芯片封装（Wafer Level Chip Scale Package）也叫WLP。
与传统封装工艺相反，WLP是先封装完后再切割，因此切完后芯片的尺寸几乎等于原来晶粒的大小，相比传统封装工艺，单颗芯片封装尺寸得到了有效控制。
如何在更小的尺寸芯片上容纳更多的引脚数目？WLP技术利用重分布层（RDL）可以直接将芯片与PCB做连接，这样就省去了传统封装DA（Die attach）段的工艺，不仅省去了DA工艺的成本，还降低了整颗封装颗粒的尺寸与厚度，同时也绕过DA工艺对良率造成的诸多影响。
起初，Fan-In WLP单位面积的引脚数相对于传统封装（如FC BGA）有所提升，但植球作业也仅限于芯片尺寸范围内，当芯片面积缩小的同时，芯片可容纳的引脚数反而减少，在这个问题的节点上，Fan-out WLP诞生，实现在芯片范围外充分利用RDL做连接，以此获取更多的引脚数。
图2：从传统封装至倒装封装及晶圆级封装结构变化示意图Source：拓璞产业研究所整理，2016.9SiP：将不同功能的裸芯片通过整合封装的方式，形成一个集多种功能于一体的芯片组，有效地突破了SoC（从设计端着手，将不同功能的解决方案集成与一颗裸芯片中）在整合。
新创云终端L12使用说明书
新创云终端L12———开启新创计算之门前言您还在为四处寻找经济适用的PC而奔波吗？您还在为PC的软件花销和庞大的电费支出而苦恼吗？您还在为频繁的软件升级和复杂的管理维护而焦头烂额吗？您还在为泛滥的网络病毒而束手无策吗？让每个人轻松使用电脑在信息社会的今天，我们的日常生活越来越离不开计算机和互联网，我们的学习、工作、沟通和娱乐也因此变得丰富多彩。
与此同时烦恼也随之而来，计算机软硬件技术的不断发展，我们需要不断地承担硬件更新换代、软件升级的代价。
新创制造公司的新创云终端产品作为新创计算战略的第一步，为我们带来了最佳的解决方案，为企业和个人用户带来经济、好用、安全、绿色、易管理的全新精致体验。
新创云终端是一种精巧别致的网络计算机，既可以作为迷你PC单独运行，进行网页浏览，又可以构架共享计算网络，以创新的成本优势开展业务运营网络。
产品优势技术创新和特色新创云终端使用模式模式1：共享计算模式使用新创安全独有的VDP技术，构架共享计算网络，新创云终端桌面机共享使用中心主机（服务器）的软硬件资源，实现远程桌面，带来与单独PC 桌面机相同的使用体验 ♦中心主机管理软件统一实施集中管理策略，管理员轻松实现集中管控♦每个用户按照预定策略独立使用属于自己的资源♦现有环境无需改变，轻松部署，构建企业基于新创计算理念的网络环境模式2：迷你PC 模式可作为迷你PC 单独使用，也可单独上网冲浪（surfing ）、享受新创计算、独立运行精简Office 软件，可下载数据并存储到U 盘或移动硬盘特别适合的用户群产品接口♦1、电源开关♦2、直流电源插口 ♦3、10/100M 自适应以太网口（RJ45）♦4、VGA 显示器接口（支持多种分辨率，显示分辨率最高可达1280*1024或1440*900）♦5、麦克风输入端口 ♦6、扬声器输出端口 ♦7、USB 接口3个，可以接USB 键盘、鼠标、USB 打印机、优盘等设备品牌新创型号L12服务器类型 塔式 CPU ARM926EJCPU 主频 533（GHz ） 标配CPU 个数1个支持内存容量 64（GB ）重量0.5（kg ）质保 三年（年）Model FlashRAM Part Number新创云终端L12 CloudTerminal（Top ofTerminal ）1024MB(可加大)32MB（可加大）TC-L12-01创新的流线型Windows CE 智能网络应用终端新创云终端(计算机的顶级产品)采用了创新的Windows® CE 5.0操作系统，设计紧凑、时尚，并具有高速I/O 和创新的连接系统。
后摩尔时代的3D封装技术--高端通信网络芯片对3D封装技术的应用驱动
后摩尔时代的3D封装技术--高端通信网络芯片对3D封装技术的应用驱动王晓明【摘要】Developing new package technology to extend Moore's law has became one of the hottest spots to meet the needs of both future communication chips and consumer electronics. In this paper, after analyzing and introduction the status and advantages of 3D packaging technology, it is clear that 3D packaging technology is a urgently need to boost up communication network chip to higher bandwidth, higher performance, larger capacity and higher density. Then, we analyze how to solve the bottleneck problem of 400G network processor through stacking packaging in detail. We suggest that the whole Chinese chip industry chain should promote the development of IC industry cooperatively.%认为通过封装技术的发展创新延续摩尔定律，满足未来通信芯片及消费性电子的需求已成为业界新的热点。
介绍了3D封装技术发展现状与优势，提出“高带宽、高性能、大容量、高密度”通信网络芯片对3D封装技术有迫切的应用需求，并深入分析了堆叠封装技术如何解决400G网络处理器（NP）所面临的瓶颈问题。
VIAVI SmartPocket OLS-3x系列光源产品说明书
VIAVI SolutionsData SheetVIAVISmartPocketOLS-34/35/36/37/38 Optical Light SourcesThe VIAVI OLS-3x series consists of small and rugged optical light sources for quick, easy, and convenient field insertion loss measurement and continuity checks.Key Benefitsy Cost-effective, rugged, and compact optical light sourcesy Switchable optical adapter versions available for maximum flexibilityy Auto λ and TwinT est transmission modes y 3-year calibrationy Combines up to 4 wavelengths in one instrument (SM+MM)Applicationsy Link insertion loss measurements and continuity checksy Enterprise/LAN networks with 850/1300 nm multimode wavelengths capability y Access and metro (LAN/WAN) networks with multimode and single-mode testing combinationsy Standard single-mode wavelengths for any telecom, CATV , and military applicationPocket-Sized Light Sources for All Kind of ApplicationsSmartPocket™ optical light sources (OLS-3x) are ideal tools to complement the OLP-3x optical power meters for insertion loss and continuity testing in both multimode and single-mode optical fiber networks. They offer a dedicated and cost-optimized solution for testing and troubleshooting optical fibers in the field. All VIAVI sources are equipped with Auto- λ and Multi- λ functions compatible with any VIAVI power meter. This one button operation provides a quick, simple, and error-free testing solution, which makes SmartPocket sources the ideal tools for daily field testing.y The OLS-34 covers LAN/WAN access and enterprise multimode networks with 850/1300 nm y The OLS-35 covers all standard singlemode telecommunication network applications with 1310/1550 nmy The OLS-36 quad-wavelength solution covers both multimode and single-mode wavelengths (850/1300/1310/1550 nm)y The OLS-37 is a singlemode source with 3 wavelengths on one port for testing FTTH/PON networks at 1310/1550 nm and 1490 nm y The OLS-38 is a singlemode source with 3 wavelengths on one port for testing networks at 1310/1550 nm and 1625 nmA Small Product with Big Capabilities!Large, clear screen displays: y Battery status with low level indicatory Power mode (PERM, ECON) y Output wavelength setting y Output power in dBm y Auto wavelength coding y T one generationTwo connector solutions offer more flexibility: y Fixed adapters: ST and LCy Switchable adapters: FC, SC, ST, LCRugged, shock resistant, and splash proof design3-way powering y AA dryy AA rechargeabley AC operation via micro USBFour buttons for fast, easy operation SmartPocket OMK-3x optical test kits include an OLS-3x optical light source, an OLP-3x optical power meter, and accessoriesTechnical Specifications1. FWHM.2. Into a 50/125 μm fiber.3. After 20 minutes warm-up time, at ambient temperature range –10°C to +55°C, ΔT = ±0.3 K.4. With VIAVI power meters.General Specifications5. Typical.Ordering InformationEach product includes:y2 AA alkaline batteriesy Neck strapy Belt bagy SC switchable adapter, mounted on instrumenty FC switchable adapter as spare partOptional AccessoriesFiber Cleaning Consumables Kit FCR-CLN-01 NiMH rechargeable batteries, mignon AA, 1.2 V (2 batteries required)2237/90.02 SNT-505; universal AC power adapter, micro USB connector2302/90.01 ST switchable adapter2155/00.32 FC switchable adapter2155/00.05 SC switchable adapter2155/00.06 LC switchable adapter2155/00.07© 2020 VIAVI Solutions Inc.Product specifications and descriptions in this document are subject to change without notice.ols-34-35-36-37-38-ds-fop-tm-ae 30162956 908 0120Contact Us +1 844 GO VIAVI (+1 844 468 4284)To reach the VIAVI office nearest you, visit /contact.VIAVI Solutions。
晶圆级芯片尺寸封装(WLCSP)技术应用现状及市场前景分析
晶圆级芯片尺寸封装（WLCSP）技术应用现状及市场前景分析先进封装是指处于当时最前沿的封装形式和技术。
目前，带有倒装芯片(FC)结构的封装、晶圆级封装(WLP)、2.5D 封装、3D 封装等被认为属于先进封装的范畴。
先进封装发展线路图资料来源：公开资料从2018 年到2024 年，整个半导体封装市场的营收预计将以5.2%的复合年增长率（CAGR）增长，而先进封装市场将以8%的复合年增长率增长，市场规模到2023 年将增长至400亿美元。
另一方面，传统封装市场的复合年增长率则低于3.3%。
在各种不同的先进封装平台中，3D 硅通孔（TSV）和扇出型（Fan-out）封装，将分别以29%和15%的速度增长。
而占据先进封装市场主要市场份额的倒装芯片（Flip-chip）封装，将以约8%的复合年增长率增长。
与此同时，扇入型晶圆级封装（Fan-in WLP）主要受到移动市场驱动，也将以8%的复合年增长率增长。
2018~2024 年全球先进封装技术市场规模预测情况（十亿美元）资料来源：Yole 此外，前段晶圆制造与后段先进封装结合的趋势日渐增强。
全球晶圆制造大厂（如英特尔、台积电和三星等）更是将先进的晶圆制造技术与先进封装形式紧密结合，以强化集成电路产品制造的技术集成优势。
受技术和规模两方面的影响，全球封测产业集中度稳步提升，2017 年前八大封测企业（含晶圆代工厂后段封装业务部分）占据先进封装市场约87%的份额。
晶圆级芯片尺寸封装（WLCSP）作为一类先进封装技术，符合消费电子发展的需求和趋势（产品的轻小短薄化和低价化）。
WLCSP 封装与传统封装相比，其主要优势体现在：①WLC SP优化了封装产业链。
传统封装方式是先将晶圆划片成颗粒芯片，经测试为合格芯片后，将其放到引线框架或封装衬底（基板）上，而后再进行封装测试，产业链涉及晶圆厂、基板厂、封装厂、测试厂。
而晶圆级芯片尺寸封装是先对晶圆进行封装、测试作业，然后再对封装测试后的晶圆进行切割。
大华出入口抓拍一体机_WEB使用说明书_V1.0.0
前言 I
目录
法律声明 ..................................................................................................................................................... II 前言.............................................................................................................................................................. I 1 WEB 简介 .................................................................................................................................................. 1
前言
概述
本文档详细描述了本设备 WEB 界面的使用方法。
Hale Waihona Puke 适用型号型号 DH-ITC215-PU1B DH-ITC215-PU1C
工作模式 卡口 卡口
像素 200 万像素 200 万像素
符号约定
在本文中可能出现下列标志，它们所代表的含义如下：
符号
说明
表示有高度潜在危险，如果不能避免，会导致人员伤亡或严重 伤害。
表示有中度或低度潜在危险，如果不能避免，可能导致人员轻 微或中等伤害。
Wi-Fi模块Calypso V2.0.0产品说明书
WI-FI MODULE CALYPSO V2.0.0 NEW FEATURE INTRODUCTIONWireless Connecticvity& SensorsOverall functionality and focus▪Security▪(Long Term) Availibility▪Documentation/ SupportNew feature introduction v2.0.0 Overview1.UART-to-Wi-Fi bridge or Transparent mode2.New power save mode3.Remote GPIO control4.WPA3 security mode support5.Customizable web pages6.Improved overall performanceBoot-up mode selection Transparent mode▪provisioning mode→acts as Access Point (AP)→onboard Webserver→easy configuring ▪OTA mode→FW update▪normal mode→AT-commands→UART Connection→…normal“ Data transmission▪transparent mode→automatic connection to preconfigured external Access Point →Roles: TCP server/client, UDP, TLS server/client→Configuration via▪AT command interface or▪web interface(including certificates for TLS)→Power save mode support (Average current consumption< 2 mA)→No need to implement the AT command interface–works withoutHOSTNEWTransparent modeUARTEnd Point Serial DeviceCALYPSO2. Power save mode▪Application processor in sleep▪Network processor active and connected▪Calypso online and connected (to AP with an active socket)▪No new connection after wake up necessary▪Saves a lot of time and with this energy▪Received packets still forwarded to the host MCU▪Wake up to transmit data▪Supported both in AT command mode as well as Transparent mode▪Average current consumption as TCP client connected to a server < 2 mA (When idle)Save battery without going offline!3. Remote GPIO▪ 4 general purpose pins▪can be controlled remotely over Wi-Fi▪Configured as Input or Output▪For 2 Pins also PWM mode possible▪Pin configuration can be saved on flash (no re-configurationon every re-start needed)▪Configuration and control via web API:Wi-Fi switch!4. WI-FI SECURITYSecurity mode Overview, new modes in red▪Open▪WEP▪WPA Personal (Wi-Fi Protected Access)▪WPA2 Personal▪WPA2 –TKIP (Temporal Key Integrity Protocol)▪WPA2-CCMP (Counter Mode with Cipher Block Chaining Message Authentication Code Protocol)▪WPA2+ Personal (Fixed security vulnerability of WPA2)▪WPA3 Personal (AES-128 im CCM (Counter with CBC-MAC))▪WPA Enterprise (AES-256 in GCM (Galois/Counter Mode))5. CUSTOMIZABLE WEB PAGES RESTful APIs File system Host MCU Configuration pages Wi-Fi and user settingsRemote GPIOs▪Representational State Transfer Application Programming Interface ▪architectural style for an API that uses HTTP requests▪commonly used in the development of Web services▪Web APIs available to▪Configure Wi-Fi and network▪Configure usersettings▪Upload files to the module▪Configure/control remote GPIOs▪Custom API to talk to host MCU▪Custom API▪Web content determined by the host MCU▪i.e. Display sensor values▪i.e. Switch off a motor connected to the host▪Example web pages on-board CALYPSO6. OTHER UPDATES▪Update NWP (Network Processor) service pack▪TI RTOS (Real-time Operating System) and drivers ▪Bug fixes for known issues from v1.3.0▪Overall performance enhancements▪Lower latency:1ms →10µs▪Higher throughput:40% higher▪New look website▪Easy FW Update (OTA) in AP mode▪Updated AT command tool ▪New Appnotes and user manual▪The STM32 WCON SDK now supports Calypso Wi-Fi module More than you expect!CALYPSO v2.0.01.UART-to-Wi-Fi bridge or Transparent mode▪automatic connection to preconfigured external AP ▪Power save mode support (Average current < 2 mA)▪Possible to work without HOST2.New power save mode▪with an average current consumption of < 2 mA▪Always active network connection3.Remote GPIO control▪can be controlled remotely over Wi-Fi▪Configured as Input or Output▪For 2 Pins also PWM mode possible 4.WPA3 security mode support▪state of the art security5.Customizable web pages▪Web content determined by the host MCU ▪Easy development of Web services6.Improved overall performance▪Lower latency:1ms →10µs▪Higher throughput:40% higher▪STM32-SDK including Calypso▪New look websiteCONCLUSIONCALYPSO TRAINING MATERIALUART-to-WiFi bridge Remote GPIO control Dynamic Web Content Hands-on Videos (4-8min to understand the functionality)▪Retrofitting IIoT▪Replace serial cable connection ▪Transparent data communication AppNote UART-to-WiFi-bridge ▪WiFi switchAppNote Remote GPIO control▪Visualize Sensor Data▪Web interfaceEVALUATION TOOLS▪Detailed documentation available ▪UART communication ▪Hand soldering with edge castellation▪Altium , Eagle and CAD/STEP-filesavailableModuleEvaluation KitFeather Wing▪Easy evaluation▪Special PC-Software AT-Commander available▪Easy Proof of Concept ▪Stackable▪ A lot of other Feather Wings available▪Codes and exampleson github。
飞利浦新纳米CT精华版配置清单和配置说明
Dedicated Pediatric Protocols婴幼儿专用扫描软件包 八 Console Computer 主台计算机系统 Computer Architecture: Main Memory: 主机内存: 4.7 GB DVD Windows™ Dell™ Precision host computer 主计算机配置: Dell Precision工作站,采用Windows 操作系统 12.0 GB RAM 12.0 GB 双19寸液晶显示器配置 主机 DVD 刻录系统
编辑整理
自动螺旋启动技术（SAS） 自动扫描程序选择软件
图像自动搜索传送软件 自动病例分发
Automatic Procedure Selection 图像处理功能
图像标注，测量分析功能 窗宽窗位控制功能
Maximum or Minimum Intensity Projection (MIP) 3-D SSD Reconstruction Volume Rendering CT Time Lapse Tissue mirror Endo -3D 容积仿真内窥镜 CT时间密度曲线图 组织透镜 三维重建软件包 容积三维重建
2* 19’LCD Monitor
Image Management and Archiving图像管理和存档 Filming照相系统 Networking/Connectivity网络/联接 DICOM Connectivity DICOM 联接 CT injector interface高压注射器接口
最大和最小密度投影
Quantitative CT Measurement 血管定量分析测量软件
高级专业型临床应用软硬件 1 R R CV Toolkit 高级心脏成像软件包 Retrospective Tagging 回顾性心电门控重建 Prospective Gating 前瞻性心电门控采集 Integrated ECG Monitor 多功能监护仪 COBRA™ Adaptive Multi-cycle Reconstruction (Cobra Cardiac) 三维智能自适应多周期 重建 2 3 iDose 星光平台 Ultra High Resolution Matrices 超高分辨率成像技术
先进芯片封装知识介绍
▼ BGA Family
Package Development Trend
▼ CSP Family
▼ Memory Card
▼ SiP Module
3D Package
3D Package
3D Package Introduction
High
Package on Package (PoP) Stacking
WLCSP
• Process Flow of WLCSP
▼ Process Flow of WLCSP
WLCSP
Flip Chip Package
(PI)-EHS2-FCBGA
(Passive Integrated Exposed 2 pieces of Heat Sink Flip Chip BGA)
Outline
▼ Package Development Trend ▼ 3D Package ▼ WLCSP & Flip Chip Package
Package Development Trend
Package Development Trend
▼ SO Family
▼ QFP Family
– High thermal performance: since there is no plastic or ceramic molding cap, heat from die can easily spread out.
– Low cost: no need substrate, only one time testing.
Wafer Thinning
Fine Process Control
• Top Package Attach • Die Attach • etc
积体电路构装介绍
W/B
LAN
Plug in / Socket
封裝技術發展趨勢
封裝技術發展趨勢 於輕薄短小之需求下覆晶成為電子封裝製程 之主流趨勢
FCIP(Flip Chip In Package)覆晶式封裝—FC-BGA,FC-CSP FCOB(Flip Chip On Board)覆晶晶片直接結合於PCB板上
BGA
Via ψ0.375mm Silver Spot Plating Lead-Solder Plated Iron and Nickel Alloy, or Solder Plate Copper Alloy
FCOG(Flip Chip On Glass)覆晶晶片直接結合於LCD玻璃基板
FCOF(Flip Chip On Film)覆晶晶片直接與軟式PCB結合 WLCSP(Wafer Level Chip Scalar Packaging)晶圓級晶片尺寸 封裝
IC產品流程簡介1
IC產品 / 流程簡介
Electronic Packaging Hierarchy
Wafer
Chip
Zero Level Package : ● ED Micro-fabrication ● Chip Fabrication
Wafer Level
First Level Package : ●Single Chip Module ●Multi-Chip Module
沖切彎 (Trim/Form) 腳機依導線架是單條或多條（ matrix ）之
設計方式而有不同的沖切方式（如Punch / roller Bend / cam Form） ，此站的品質要求為不能有毛邊 / 沖切不對稱 / 平面度管制。
而其中平面度在QFP產品尤其重要，至於BGA則有沖切（punch
金万维天联高级版产品介绍
金万维天联高级版产品介绍内部编号：（YUUT-TBBY-MMUT-URRUY-UOOY-DBUYI-0128）天联高级版（TeamLink Pro）产品说明本材料的相关权力归北京金万维科技有限公司所有。
文档中的任何部分未经本公司许可，不得转印、影印或复印。
本资料将定期更新，如欲获取最新相关信息，请访问金万维网站。
北京金万维科技有限公司BeiJing GNWAY Technology CO.,LTD北京金万维科技有限公司，100070电话 (TEL) ：(传真（FAX电子信箱：第一章产品简介TeamLink Pro是国内首家集VPN（Virtual Private Network）和SBC （Server Based Computing）技术于一体的远程连接平台，市场领先的天联SSLVPN和异速联远程接入解决方案无缝整合的强大功能，解决了长期困扰用户的高速应用表现与安全应用接入之间的冲突。
它使客户能够以最佳的速度、最高的安全性和最低的成本为任意用户交付各种应用。
金万维目前是国内唯一一家可以提供这种无缝应用程序连接的公司。
天联高级版无须任何硬件设备和其他设置，基本网络结构图如下图标所示：第二章应用价值及优势应用价值＊将C/S架构软件转化成B/S，降低应用软件部署/维护成本＊让只能在局域网内部使用的C/S架构应用实现基于互联网运行＊让各类应用软件在低带宽上实现远程接入，无需改动网络环境＊集成VPN功能，采用VPN加密协议保证数据传输安全性＊通过用户身份认证、权限设置、访问监控等手段保证应用安全性＊无需公网IP，无需固定IP，适用于任何网络环境＊实现对企业各种应用程序和资源的统一部署和集中管理＊实现在任何时间、任何地点、任何网络环境下的安全、快速接入产品优势数据安全所有操作都在服务器执行，客户机与服务器之间只传输键盘信息、鼠标点击和屏幕刷新等矢量信息，不进行实际的数据传输；所有数据资料全部保存到服务器主机上，任何资料不会遗留在PC里，客户端中毒死机均不影响正常使用；通过VPN安全通道对矢量信息进行加密传输，即便被截获，也是不完整的、无利用价值的信息。