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德州仪器(TI) BQ34Z100宽量程电量监测计说明书

BQ34Z100 采用 Impedance Track™ 技术的宽量程电量监测计1 特性•支持锂离子和磷酸铁锂化学物质•对电压为 3V 至 65V 的电池使用已获得专利的 Impedance Track™技术估算容量–老化补偿–自放电补偿•支持超过 65Ah 的电池容量•支持高于 32A 的充放电电流•外部负温度系数 (NTC) 热敏电阻支持•支持与主机系统的两线制 I2C 和 HDQ 单线制通信接口•SHA-1/HMAC 认证•一个或者四个 LED 直接显示控制•五个 LED 和通过端口扩展器的更多显示•节能模式（典型电池组运行范围条件）–正常工作：< 140µA 平均电流–睡眠：< 64µA 平均电流–全睡眠：< 19µA 平均电流•封装：14 引脚 TSSOP 2 应用•轻型电动车辆•医疗仪器•移动无线电•电动工具•不间断电源 (UPS)3 说明德州仪器 (TI) BQ34Z100 是独立于电池串联配置工作的电量监测计解决方案，支持各种锂离子和磷酸铁锂电池化学物质。

通过外部电压转换电路可支持 3V 至 65V 的电池，此电路可通过自动控制来降低系统功耗。

BQ34Z100 器件提供多个接口选项，其中包括一个 I2C 从接口、一个 HDQ 从接口、一个或四个直接 LED 接口以及一个警报输出引脚。

此外，BQ34Z100 还支持外部端口扩展器，连接四个以上的 LED。

(1)如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。

简化版原理图Table of Contents1 特性...................................................................................12 应用...................................................................................13 说明...................................................................................14 Revision History ..............................................................25 Pin Configuration and Functions ...................................36 Specifications ..................................................................46.1 Absolute Maximum Ratings........................................46.2 ESD Ratings...............................................................46.3 Recommended Operating Conditions.........................46.4 Thermal Information....................................................56.5 Electrical Characteristics: Power-On Reset................56.6 Electrical Characteristics: LDO Regulator...................56.7 Electrical Characteristics: Internal TemperatureSensor Characteristics..................................................56.8 Electrical Characteristics: Low-FrequencyOscillator.......................................................................66.9 Electrical Characteristics: High-FrequencyOscillator.......................................................................66.10 Electrical Characteristics: Integrating ADC(Coulomb Counter) Characteristics...............................66.11 Electrical Characteristics: ADC (Temperatureand Cell Measurement) Characteristics........................66.12 Electrical Characteristics: Data Flash MemoryCharacteristics (7)6.13 Timing Requirements: HDQ Communication............76.14 Timing Requirements: I 2C-Compatible Interface......86.15 Typical Characteristics..............................................97 Detailed Description ......................................................107.1 Overview...................................................................107.2 Feature Description...................................................117.3 Device Functional Modes..........................................398 Application and Implementation ..................................408.1 Typical Applications..................................................409 Power Supply Recommendations ................................4910 Layout ...........................................................................5010.1 Layout Guidelines...................................................5010.2 Layout Example......................................................5011 Device and Documentation Support ..........................5311.1 Documentation Support..........................................5311.2 接收文档更新通知...................................................5311.3 支持资源..................................................................5311.4 Trademarks.............................................................5311.5 Electrostatic Discharge Caution..............................5311.6 术语表.....................................................................5312 Mechanical, Packaging, and OrderableInformation (53)4 Revision History注：以前版本的页码可能与当前版本的页码不同Changes from Revision B (December 2012) to Revision C (May 2021)Page•根据更新的德州仪器 (TI) 标准更改了文档格式并通篇更新了 SRP 和 SRN 引脚................................................1•Changed Ground System ................................................................................................................................50•Changed Board Offset Considerations ............................................................................................................51Changes from Revision A (September 2012) to Revision B (December 2012)Page•Changed Absolute Maximum Ratings ...............................................................................................................4•Changed 节 6.3 ..................................................................................................................................................4•Changed 节 7.2.15.3 ........................................................................................................................................39•Changed SLEEP Mode ....................................................................................................................................39•Changed FULL SLEEP Mode ..........................................................................................................................39•Changed STEP 3 (44)BQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 20215 Pin Configuration and FunctionsP2P3/SDA VEN P4/SCL P1P5/HDQ BAT P6/TS CE SRN REGIN SRP REG25VSSBQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 2021BQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 6 Specifications6.1 Absolute Maximum Ratings(1)(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.6.2 ESD Ratings(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.3 Recommended Operating Conditions6.3 Recommended Operating Conditions (continued)6.4 Thermal Information(1)For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report , SPRA953.6.5 Electrical Characteristics: Power-On Reset6.6 Electrical Characteristics: LDO Regulator(1)(1)LDO output current, I OUT , is the sum of internal and external load currents.(2)Specified by design. Not production tested.6.7 Electrical Characteristics: Internal Temperature Sensor CharacteristicsBQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 2021BQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 6.8 Electrical Characteristics: Low-Frequency Oscillator(1)The frequency drift is included and measured from the trimmed frequency at VCC = 2.5 V, T A = 25°C.(2)The frequency error is measured from 32.768 kHz.(3)The startup time is defined as the time it takes for the oscillator output frequency to be ±3%.6.9 Electrical Characteristics: High-Frequency Oscillator(1)The frequency error is measured from 2.097 MHz.(2)The startup time is defined as the time it takes for the oscillator output frequency to be ±3%.6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics(1)Specified by design. Not tested in production.(2)Full-scale reference6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics (continued)(1)Specified by design. Not tested in production.6.12 Electrical Characteristics: Data Flash Memory Characteristics(1)Specified by design. Not tested in production.6.13 Timing Requirements: HDQ CommunicationT A = –40°C to 85°C, C REG = 1.0 μF, 2.45 V < V REGIN = V BAT < 5.5 V; typical values at T A = 25°C and V REGIN = V BAT = 3.6 VBQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 2021(a)Break and Break Recovery(c)Host Transmitted Bit(d)Gauge Transmitted Bit(b)HDQ line rise time图 6-1. Timing Diagrams6.14 Timing Requirements: I2C-Compatible InterfaceT A = –40°C to 85°C, C REG = 0.47 μF, 2.45 V < V REGIN = V BAT < 5.5 V; typical values at T A = 25°C and V REGIN = V BAT = 3.6t SU(STA)SCLSDAt w(H)tw(L)t f tr t(BUF)t rt d(STA)REPEATEDSTARTt h(DAT)t su(DAT)t f t su(STOP)STOP START图 6-2. I2C-Compatible Interface Timing DiagramsBQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 6.15 Typical CharacteristicsBQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 2021BQ34Z100ZHCS926C – MAY 2012 – REVISED MAY 7 Detailed Description7.1 OverviewThe BQ34Z100 device accurately predicts the battery capacity and other operational characteristics of a single cell or multiple rechargeable cell blocks, which are voltage balanced when resting. The device supports various Li-ion and LiFePO4 chemistries, and can be interrogated by a host processor to provide cell information, such as remaining capacity, full charge capacity, and average current.Information is accessed through a series of commands called Standard Data Commands (see 节7.2.1.1). Further capabilities are provided by the additional Extended Data Commands set (see 节 7.2.2). Both sets of commands, indicated by the general format Command(), are used to read and write information contained within the BQ34Z100 device’s control and status registers, as well as its data flash locations. Commands are sent from host to gauge using the BQ34Z100 serial communications engines, HDQ and I2C, and can be executed during application development, pack manufacture, or end-equipment operation.Cell information is stored in the BQ34Z100 in non-volatile flash memory. Many of these data flash locations are accessible during application development and pack manufacture. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by using the BQ34Z100 device’s companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known. The BQ34Z100 provides 32 bytes of user-programmable data flash memory. This data space is accessed through a data flash interface. For specifics on accessing the data flash, refer to 节 7.2.3.The key to the BQ34Z100 device’s high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track algorithm. This algorithm uses voltage measurements, characteristics, and properties to create state-of-charge predictions that can achieve accuracy with as little as 1% error across a wide variety of operating conditions.The BQ34Z100 measures charge/discharge activity by monitoring the voltage across a small-value series sense resistor connected in the low side of the battery circuit. When an application’s load is applied, cell impedance is measured by comparing its Open Circuit Voltage (OCV) with its measured voltage under loading conditions.The BQ34Z100 can use an NTC thermistor (default is Semitec 103AT or Mitsubishi BN35-3H103FB-50) for temperature measurement, or can also be configured to use its internal temperature sensor. The BQ34Z100 uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.To minimize power consumption, the BQ34Z100 has three power modes: NORMAL, SLEEP, and FULL SLEEP. The BQ34Z100 passes automatically between these modes, depending upon the occurrence of specific events. Multiple modes are available for configuring from one to 16 LEDs as an indicator of remaining state of charge. More than four LEDs require the use of one or two inexpensive SN74HC164 shift register expanders.A SHA-1/HMAC-based battery pack authentication feature is also implemented on the BQ34Z100. When the IC is in UNSEALED mode, authentication keys can be (re)assigned. A scratch pad area is used to receive challenge information from a host and to export SHA-1/HMAC encrypted responses. See 节 7.2.14.1 for further details.备注Formatting conventions in this document:Commands: italics with parentheses and no breaking spaces; for example, RemainingCapacity().Data Flash: italics, bold, and breaking spaces; for example, Design Capacity.Register Bits and Flags: brackets only; for example, [TDA] DataFlash Bits: italic and bold; for example, [LED1]Modes and states: ALL CAPITALS; for example, UNSEALED mode.7.2 Feature Description7.2.1 Data Commands7.2.1.1 Standard Data CommandsThe BQ34Z100 uses a series of 2-byte standard commands to enable host reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in 表 7-1. Because each command consists of two bytes of data, two consecutive HDQ/I2C transmissions must be executed to initiate the command function and to read or write the corresponding two bytes of data. Standard commands are accessible in NORMAL operation. Also, two block commands are available to read Manufacturer Name and Device Chemistry. Read/Write permissions depend on the active access mode.7.2.1.2 Control(): 0x00/0x01Issuing a Control() command requires a subsequent two-byte subcommand. These additional bytes specify the particular control function desired. The Control()command allows the host to control specific features of the BQ34Z100 during normal operation, and additional features when the BQ34Z100 is in different access modes, as described in 表 7-2.7.2.1.2.1 CONTROL_STATUS: 0x0000Instructs the fuel gauge to return status information to Control addresses 0x00/0x01. The status word includes the following information.Legend: RSVD = ReservedFAS:Status bit that indicates the BQ34Z100 is in FULL ACCESS SEALED state. Active when set.SS:Status bit that indicates the BQ34Z100 is in the SEALED state. Active when set.CALMODE:Status bit that indicates the BQ34Z100 calibration function is active. True when set.Default is 0.CCA:Status bit that indicates the BQ34Z100 Coulomb Counter Calibration routine is active. Active when set.BCA:Status bit that indicates the BQ34Z100 Board Calibration routine is active. Active when set.CSV:Status bit that indicates a valid data flash checksum has been generated. Active when set.FULLSLEEP:Status bit that indicates the BQ34Z100 is in FULL SLEEP mode. True when set. The state can only be detected by monitoring the power used by the BQ34Z100 because any communication will automatically clear it.SLEEP:Status bit that indicates the BQ34Z100 is in SLEEP mode. True when set.LDMD:Status bit that indicates the BQ34Z100 Impedance Track algorithm using constant-power mode. True when set.Default is 0 (CONSTANT CURRENT mode).RUP_DIS:Status bit that indicates the BQ34Z100 Ra table updates are disabled. True when set.VOK:Status bit that indicates cell voltages are OK for Qmax updates. True when set.QEN:Status bit that indicates the BQ34Z100 Qmax updates are enabled. True when set.7.2.1.2.2 DEVICE TYPE: 0x0001Instructs the fuel gauge to return the device type to addresses 0x00/0x01.7.2.1.2.3 FW_VERSION: 0x0002Instructs the fuel gauge to return the firmware version to addresses 0x00/0x01.7.2.1.2.4 HW_VERSION: 0x0003Instructs the fuel gauge to return the hardware version to addresses 0x00/0x01.7.2.1.2.5 RESET_DATA: 0x0005Instructs the fuel gauge to return the number of resets performed to addresses 0x00/0x01.7.2.1.2.6 PREV_MACWRITE: 0x0007Instructs the fuel gauge to return the previous command written to addresses 0x00/0x01. The value returned is limited to less than 0x0020.7.2.1.2.7 CHEM ID: 0x0008Instructs the fuel gauge to return the chemical identifier for the Impedance Track configuration to addresses 0x00/0x01.7.2.1.2.8 BOARD_OFFSET: 0x0009Instructs the fuel gauge to calibrate board offset. During board offset calibration the [BCA] bit is set.7.2.1.2.9 CC_OFFSET: 0x000AInstructs the fuel gauge to calibrate the coulomb counter offset. During calibration the [CCA] bit is set.7.2.1.2.10 CC_OFFSET_SAVE: 0x000BInstructs the fuel gauge to save the coulomb counter offset after calibration.7.2.1.2.11 DF_VERSION: 0x000CInstructs the fuel gauge to return the data flash version to addresses 0x00/0x01.7.2.1.2.12 SET_FULLSLEEP: 0x0010Instructs the fuel gauge to set the FULLSLEEP bit in the Control Status register to 1. This allows the gauge to enter the FULL SLEEP power mode after the transition to SLEEP power state is detected. In FULL SLEEP mode, less power is consumed by disabling an oscillator circuit used by the communication engines. For HDQ communication, one host message will be dropped. For I2C communications, the first I2C message will incur a 6-ms–8-ms clock stretch while the oscillator is started and stabilized. A communication to the device in FULL SLEEP will force the part back to the SLEEP mode.7.2.1.2.13 STATIC_CHEM_DF_CHKSUM: 0x0017Instructs the fuel gauge to calculate chemistry checksum as a 16-bit unsigned integer sum of all static chemistry data. The most significant bit (MSB) of the checksum is masked yielding a 15-bit checksum. This checksum is compared with the value stored in the data flash Static Chem DF Checksum. If the value matches, the MSB will be cleared to indicate a pass. If it does not match, the MSB will be set to indicate a failure.7.2.1.2.14 SEALED: 0x0020Instructs the fuel gauge to transition from UNSEALED state to SEALED state. The fuel gauge should always be set to SEALED state for use in customer’s end equipment.7.2.1.2.15 IT ENABLE: 0x0021Forces the fuel gauge to begin the Impedance Track algorithm, sets Bit 2 of UpdateStatus and causes the [VOK] and [QEN] flags to be set in the CONTROL STATUS register. [VOK] is cleared if the voltages are not suitable for a Qmax update. Once set, [QEN] cannot be cleared. This command is only available when the fuel gauge is UNSEALED and is typically enabled at the last step of production after the system test is completed.7.2.1.2.16 RESET: 0x0041Instructs the fuel gauge to perform a full reset. This command is only available when the fuel gauge is UNSEALED.7.2.1.2.17 EXIT_CAL: 0x0080Instructs the fuel gauge to exit CALIBRATION mode.7.2.1.2.18 ENTER_CAL: 0x0081Instructs the fuel gauge to enter CALIBRATION mode.7.2.1.2.19 OFFSET_CAL: 0x0082Instructs the fuel gauge to perform offset calibration.7.2.1.3 StateOfCharge(): 0x02/0x03This read-only function returns an unsigned integer value of the predicted remaining battery capacity expressed as a percentage of FullChargeCapacity() with a range of 0 to 100%.7.2.1.4 RemainingCapacity(): 0x04/0x05This read-only command pair returns the compensated battery capacity remaining. Unit is 1 mAh per bit.7.2.1.5 FullChargeCapacity(): 0x06/07This read-only command pair returns the compensated capacity of the battery when fully charged. Unit is 1 mAh per bit except if X10 mode is selected. In X10 mode, units are 10 mAh per bit. with units of 1 mAh per bit. . FullChargeCapacity() is updated at regular intervals, as specified by the Impedance Track algorithm.7.2.1.6 Voltage(): 0x08/0x09This read-word function returns an unsigned integer value of the measured cell-pack voltage in mV with a range of 0 V to 65535 mV.7.2.1.7 AverageCurrent(): 0x0A/0x0BThis read-only command pair returns a signed integer value that is the average current flowing through the sense resistor. It is updated every 1 second. Unit is 1 mA per bit except if X10 mode is selected. In X10 mode, units are 10 mA per bit. with units of 1 mA per bit.7.2.1.8 Temperature(): 0x0C/0x0DThis read-word function returns an unsigned integer value of the temperature, in units of 0.1 K, measured by the gas gauge and has a range of 0 to 6553.5 K. The source of the measured temperature is configured by the [TEMPS] bit in the Pack Configuration register (see 节 7.2.2).7.2.1.9 Flags(): 0x0E/0x0FThis read-word function returns the contents of the Gas Gauge Status register, depicting current operation status.Legend: RSVD = ReservedOTC:Overtemperature in Charge condition is detected. True when setOTD:Overtemperature in Discharge condition is detected. True when setBATHI:Battery High bit that indicates a high battery voltage condition. Refer to the data flash BATTERY HIGH parameters for threshold settings.BATLOW:Battery Low bit that indicates a low battery voltage condition. Refer to the data flash BATTERY LOW parameters for threshold settings.CHG_INH:Charge Inhibit: unable to begin charging. Refer to the data flash [Charge Inhibit Temp Low, Charge Inhibit Temp High] . True when setXCHG:Charging not allowedRSVD:ReservedFC:Full charge is detected. FC is set when charge termination is reached and FC Set% = –1 (see 节 7.2.10 for details) or StateOfCharge() is larger than FC Set% and FC Set% is not –1. True when setCHG:(Fast) charging allowed. True when setOCVTAKEN:Cleared on entry to RELAX mode and set to 1 when OCV measurement is performed in RELAX mode.ISD:Internal Short is detected. True when set. TDD = Tab Disconnect is detected. True when setSOC1:State-of-Charge Threshold 1 reached. True when setSOCF:State-of-Charge Threshold Final reached. True when setDSG:Discharging detected. True when set7.2.2 Extended Data CommandsExtended commands offer additional functionality beyond the standard set of commands. They are used in the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words. The number of command bytes for a given extended command ranges in size from single to multiple bytes, as specified in 表 7-6. For details on the SEALED and UNSEALED states, refer to 节 7.2.3.3.(1)SEALED and UNSEALED states are entered via commands to CNTL 0x00/0x01.(2)In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F.7.2.2.1 AtRate(): 0X10/0x11The AtRate() read-/write-word function is the first half of a two-function call-set used to set the AtRate value used in calculations made by the AtRateTimeToEmpty() function. The AtRate() units are in mA.The AtRate() value is a signed integer and both positive and negative values will be interpreted as a discharge current value. The AtRateTimeToEmpty()function returns the predicted operating time at the AtRate value of discharge. The default value for AtRate() is zero and will force AtRate() to return 65535.7.2.2.2 AtRateTimeToEmpty(): 0x12/0x13This read-word function returns an unsigned integer value of the predicted remaining operating time if the battery is discharged at the AtRate() value in minutes with a range of 0 to 65534. A value of 65535 indicatesAtRate() = 0.The gas gauge updates AtRateTimeToEmpty() within 1s after the host sets the AtRate() value. The gas gauge automatically updates AtRateTimeToEmpty() based on the AtRate() value every 1 s.7.2.2.3 Current(): 0x10/0x11This read-only command pair returns a signed integer value that is the current flow through the sense resistor. It is updated every 1 second. Units are 1 mA per bit except if X10 mode is selected. In X10 mode, units are 10 mA per bit.with units of 1mA. However, if PackConfiguration [SCALED]is set then the units have been scaled through the calibration process. The actual scale is not set in the device and SCALED is just an indicator flag.7.2.2.4 NominalAvailableCapacity(): 0x14/0x15This read-only command pair returns the uncompensated (no or light load) battery capacity remaining. Unit is 1 mAh per bit.7.2.2.5 FullAvailableCapacity(): 0x16/0x17This read-only command pair returns the uncompensated (no or light load) capacity of the battery when fully charged. Unit is 1 mAh per bit. FullAvailableCapacity()is updated at regular intervals, as specified by the Impedance Track algorithm.7.2.2.6 TimeToEmpty(): 0x18/0x19This read-only function returns an unsigned integer value of the predicted remaining battery life at the present rate of discharge , in minutes. A value of 65535 indicates that the battery is not being discharged.This read-only function returns an unsigned integer value of predicted remaining time until the battery reaches full charge, in minutes, based upon AverageCurrent(). The computation should account for the taper current time extension from the linear TTF computation based on a fixed AverageCurrent() rate of charge accumulation. A value of 65535 indicates the battery is not being charged.7.2.2.8 StandbyCurrent(): 0x1C/0x1DThis read-only function returns a signed integer value of the measured standby current through the sense resistor. The StandbyCurrent() is an adaptive measurement. Initially, it reports the standby current programmed in Initial Standby, and after spending some time in standby, reports the measured standby current.The register value is updated every 1 second when the measured current is above the Deadband (3 mA default) and is less than or equal to 2 x Initial Standby. The first and last values that meet this criterion should not be averaged in, since they may not be stable values. To approximate a 1 minute time constant, each new StandbyCurrent() value is computed as follows:StandbyCurrent()NEW = (239/256) × StandbyCurrent()OLD + (17/256) × AverageCurrent()7.2.2.9 StandbyTimeToEmpty(): 0x1E/0x1FThis read-only function returns an unsigned integer value of the predicted remaining battery life at the standby rate of discharge, in minutes. The computation should use Nominal Available Capacity (NAC), the uncompensated remaining capacity, for this computation. A value of 65535 indicates battery is not being discharged.7.2.2.10 MaxLoadCurrent(): 0x20/0x21This read-only function returns a signed integer value, in units of mA, of the maximum load conditions. The MaxLoadCurrent()is an adaptive measurement which is initially it reports the maximum load current programmed in Initial Max Load Current. If the measured current is ever greater than Initial Max Load Current, then MaxLoadCurrent() updates to the new current. MaxLoadCurrent() is reduced to the average of the previous value and Initial Max Load Current whenever the battery is charged to full after a previous discharge to an SOC less than 50%. This prevents the reported value from maintaining an unusually high value.7.2.2.11 MaxLoadTimeToEmpty(): 0x22/0x23This read-only function returns an unsigned integer value of the predicted remaining battery life at the maximum load current discharge rate, in minutes. A value of 65535 indicates that the battery is not being discharged.7.2.2.12 AvailableEnergy(): 0x24/0x25This read-only function returns an unsigned integer value of the predicted charge or energy remaining in the battery. The value is reported in units of mWh.7.2.2.13 AveragePower(): 0x26/0x27This read-word function returns an unsigned integer value of the average power of the current discharge. A value of 0 indicates that the battery is not being discharged. The value is reported in units of mW.7.2.2.14 TimeToEmptyAtConstantPower(): 0x28/0x29This read-only function returns an unsigned integer value of the predicted remaining operating time if the battery is discharged at the AveragePower() value in minutes. A value of 65535 indicates AveragePower() = 0. The gas gauge automatically updates TimeToEmptyatContantPower() based on the AveragePower() value every 1s.7.2.2.15 InternalTemp(): 0x2A/0x2BThis read-only function returns an unsigned integer value of the measured internal temperature of the device, in units of 0.1 K, measured by the fuel gauge.。

TI(德州仪器)公司产品导购手册

TI(德州仪器)德州仪器，简称TI，全球约 30,300人，总部位于美国得克萨斯州的达拉斯，2008年营业额为185亿美元，是全球领先的半导体公司，为现实世界的信号处理提供创新的数字信号处理(DSP)及模拟技术，应用领域涵盖无线通讯、宽带、网络家电、数字马达控制与消费类市场。

TI(德州仪器)目录更多关于产品•MSP430系列单片机•TMS370系列单片机•TMS470系列单片机•Stellaris系列单片机•32位C2000单片机•C2000 DSP•C5000 DSP•C6000 DSP•达芬奇 DSP•A/D转换器•D/A转换器•电池管理•PWM控制器•DC/DC控制器MSP430系列单片机MSP430 系列是一个 16 位的、具有精简指令集的、超低功耗的混合型单片机，在 1996 年问世，由于它具有极低的功耗、丰富的片内外设和方便灵活的开发手段，已成为众多单片机系列中一颗耀眼的新星。

MSP430 系列单片机的迅速发展和应用范围的不断扩大，主要取决于以下的特点。

强大的处理能力 MSP430 系列单片机是一个 16 位的单片机，采用了精简指令集（ RISC ）结构，具有丰富的寻址方式（ 7 种源操作数寻址、 4 种目的操作数寻址）、简洁的 27 条内核指令以及大量的模拟指令；大量的寄存器以及片内数据存储器都可参加多种运算；还有高效的查表处理指令；有较高的处理速度，在 8MHz 晶体驱动下指令周期为 125 ns 。

这些特点保证了可编制出高效率的源程序。

在运算速度方面， MSP430 系列单片机能在 8MHz 晶体的驱动下，实现 125ns 的指令周期。

16 位的数据宽度、 125ns 的指令周期以及多功能的硬件乘法器（能实现乘加）相配合，能实现数字信号处理的某些算法（如 FFT 等）。

MSP430 系列单片机的中断源较多，并且可以任意嵌套，使用时灵活方便。

当系统处于省电的备用状态时，用中断请求将它唤醒只用 6us 。

Ti(德州仪器)-芯片手册-sn74ac86

PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.Addendum-Page 2(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54AC86, SN74AC86 :•Catalog: SN74AC86•Military: SN54AC86NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AC86DBR SSOP DB 142000330.016.48.2 6.6 2.512.016.0Q1SN74AC86DR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1SN74AC86NSR SO NS 142000330.016.48.210.5 2.512.016.0Q1SN74AC86PWRTSSOPPW142000330.012.46.95.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74AC86DBR SSOP DB142000367.0367.038.0 SN74AC86DR SOIC D142500367.0367.038.0 SN74AC86NSR SO NS142000367.0367.038.0SN74AC86PWR TSSOP PW142000367.0367.035.0PACKAGE OUTLINECDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGENOTES:1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This package is hermitically sealed with a ceramic lid using glass frit.4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.5. Falls within MIL-STD-1835 and GDIP1-T14.EXAMPLE BOARD LAYOUTCDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGEIMPORTANT NOTICETexas Instruments Incorporated(TI)reserves the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.TI’s published terms of sale for semiconductor products(/sc/docs/stdterms.htm)apply to the sale of packaged integrated circuit products that TI has qualified and released to market.Additional terms may apply to the use or sale of other types of TI products and services.Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such reproduced rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products(collectively,“Designers”)understand and agree that Designers remain responsible for using their independent analysis,evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers'applications and compliance of their applications(and of all TI products used in or for Designers’applications)with all applicable regulations,laws and other applicable requirements.Designer represents that,with respect to their applications,Designer has all the necessary expertise to create and implement safeguards that(1)anticipate dangerous consequences of failures,(2)monitor failures and their consequences,and(3)lessen the likelihood of failures that might cause harm and take appropriate actions.Designer agrees that prior to using or distributing any applications that include TI products,Designer will thoroughly test such applications and the functionality of such TI products as used in such applications.TI’s provision of technical,application or other design advice,quality characterization,reliability data or other services or information, including,but not limited to,reference designs and materials relating to evaluation modules,(collectively,“TI Resources”)are intended to assist designers who are developing applications that incorporate TI products;by downloading,accessing or using TI Resources in any way,Designer(individually or,if Designer is acting on behalf of a company,Designer’s company)agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice.TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products,and no additional obligations or liabilities arise from TI providing such TI Resources.TI reserves the right to make corrections, enhancements,improvements and other changes to its TI Resources.TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource.Designer is authorized to use,copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s)identified in such TI Resource.NO OTHER LICENSE,EXPRESS OR IMPLIED,BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT,AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN,including but not limited to any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI products or services are rmation regarding or referencing third-party products or services does not constitute a license to use such products or services,or a warranty or endorsement e of TI Resources may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.TI RESOURCES ARE PROVIDED“AS IS”AND WITH ALL FAULTS.TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS,EXPRESS OR IMPLIED,REGARDING RESOURCES OR USE THEREOF,INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS,TITLE,ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE,AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE.IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT,SPECIAL,COLLATERAL,INDIRECT,PUNITIVE,INCIDENTAL,CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF,AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard(e.g.,ISO/TS16949 and ISO26262),TI is not responsible for any failure to meet such industry standard requirements.Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards,such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and ing products in an application does not by itself establish any safety features in the application.Designers must ensure compliance with safety-related requirements and standards applicable to their applications.Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death(e.g.,life support,pacemakers,defibrillators,heart pumps,neurostimulators,and implantables).Such equipment includes,without limitation,all medical devices identified by the U.S.Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.TI may expressly designate certain products as completing a particular qualification(e.g.,Q100,Military Grade,or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’own risk.Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection.Designer will fully indemnify TI and its representatives against any damages,costs,losses,and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2017,Texas Instruments Incorporated。

CD4030

J
C D
5 6
4
K
Description
The CD4030BMS types consist of four independent Exclusive-OR gates. The CD4030BMS provides the system designer with a means for direct implementation of the Exclusive-OR function. The CD4030BMS is supplied in these 14-lead outline packages: Braze Seal DIP H4H Frit Seal DIP H1B Ceramic Flatpack H3W
A 1 B 2 J=A⊕B 3 K=C⊕D 4 C 5 D 6 VSS 7
14 VDD 13 H 12 G 11 M = G ⊕ H 10 L = E ⊕ F 9 F 8 E
Functional Diagram
A B 1 2 3
Applications
• Even and Odd-Parity Generators and Checkers • Logical Comparators • Adders/Subtractors • General Logic Functions
3. For accuracy, voltage is measured differentially to VDD. Limit is 0.050V max.
7-318
Speciﬁcations CD4030BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS TEMPERATURE 9 10, 11 VDD = 5V, VIN = VDD or GND 9 10, 11 +25oC +125oC, -55oC LIMITS MIN MAX 280 378 200 270 UNITS ns ns ns ns

施耐德手册

本质安全, Class 1, Division I, Groups A, B, C & D
American Buerau of Shipping (ABS) TYPE APPROVAL 95-NY-166-X
Det Norske Veritas (DNV) A-7038
第6页共6页
传送器: 专利的低昂音发生器
耳机: 隔噪式: 双重耳机线的单音, 阻抗 16 ohms. 超过 23dB 噪声衰减. 满足或超过 ANSI 规范和 OSHA 标准
指示器: 弹射式输出表: 载入相关测量的 0-100 的线形校正范围. 仪表全量程精度 1% . 低电池 LED 显示以便保持主
第5页共6页
生频率大于 20KHz 的空载超声波。
l
当转动机械由于润滑不当、过载等原因造成磨损时，这种情况的发生一定伴有空
载超声波。
l
电弧，爬电和电晕放电都是电气设备失效的先兆，这些失效的先兆同时会伴有空
载超声波。
超声波多功能探测仪采用一种超声波接收探头，探测空载超声波信号并黑心换成人耳能听到的声音，并反映到指示表头上。
机内部电源供应
电池: 自载镍镉充电. 充电系统电压：标准 110V. 同样在 220V.有效特性: 频率调谐调整盘: 范围 20-100 kHz ，对于超窄的频率响应带有'定波段' 位置为对数和线性表标度调整的双峰米开关为图形记录器输出可选的辅助模式选项: 0 - 50 mV, 用于限定增益调整的带有数字校准灵敏精密增量的十转调整盘 finite gain adjustment. 灵敏度控制, 一个十转数字校准可调电位器. 弹簧支撑触发器开关外形尺寸: 全套仪器包在一个 Zero Haliburton 铝制箱: 15' x 22' x 7' (38.1 x 55.9 x 17.8 cm). 手枪 2 lbs (.9kg). 全套: 14 lbs (6.4 kg). 灵敏度: 50 英尺内检测 .005' (.127 mm) dia. 泄漏 @ 5 psi (.34 bar) (15.24 m). 临界值*: 1 X 10-² 1 X 10-³ std. cc/sec. freon 保固: 5 年零件/工时 *取决于配置 ULTRAPROBE 2000 仪器包符合和超越 ASTM E1002-93 泄漏检测要求. 政府代码 NSN: 6635-01-156-3927 FSCM (CAGE) Code: 59202 误差表 #s: 788, 404, 576, 583, 607 包含以下专利: 4416145, EP015115, 502674183 安全认证

IC集成电路型号大全及40系列芯片功能大全

IC集成电路型号大全及40系列芯片功能大全CD4001 四2输入端或者非门CD4002 双4输入端或者非门CD4006 18位串入/串出移位寄存器CD4007 双互补对加反相器CD4008 4位超前进位全加器CD4009 六反相缓冲/变换器CD4010 六同相缓冲/变换器CD4011 四2输入端与非门CD4012 双4输入端与非门CD4013 双主-从D型触发器CD4014 8位串入/并入-串出移位寄存器CD4015 双4位串入/并出移位寄存器CD4016 四传输门CD4017 十进制计数/分配器CD4018 可预制1/N计数器CD4019 四与或者选择器CD4020 14级串行二进制计数/分频器CD4021 08位串入/并入-串出移位寄存器CD4022 八进制计数/分配器CD4023 三3输入端与非门CD4024 7级二进制串行计数/分频器CD4025 三3输入端或者非门CD4026 十进制计数/7段译码器CD4027 双J-K触发器CD4028 BCD码十进制译码器CD4029 可预置可逆计数器CD4030 四异或者门CD4031 64位串入/串出移位存储器CD4032 三串行加法器CD4033 十进制计数/7段译码器CD4034 8位通用总线寄存器CD4035 4位并入/串入-并出/串出移位寄存CD4038 三串行加法器CD4040 12级二进制串行计数/分频器CD4041 四同相/反相缓冲器CD4042 四锁存D型触发器CD4043 三态R-S锁存触发器("1"触发)CD4044 四三态R-S锁存触发器("0"触发)CD4046 锁相环CD4047 无稳态/单稳态多谐振荡器CD4048 四输入端可扩展多功能门CD4049 六反相缓冲/变换器CD4050 六同相缓冲/变换器CD4051 八选一模拟开关CD4052 双4选1模拟开关CD4053 三组二路模拟开关CD4054 液晶显示驱动器CD4055 BCD-7段译码/液晶驱动器CD4056 液晶显示驱动器CD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器CD4063 四位数字比较器CD4066 四传输门CD4067 16选1模拟开关CD4068 八输入端与非门/与门CD4069 六反相器CD4070 四异或者门CD4071 四2输入端或者门CD4072 双4输入端或者门CD4073 三3输入端与门CD4075 三3输入端或者门CD4076 四D寄存器CD4077 四2输入端异或者非门CD4078 8输入端或者非门/或者门CD4081 四2输入端与门CD4082 双4输入端与门CD4085 双2路2输入端与或者非门CD4086 四2输入端可扩展与或者非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器CD4095 三输入端J-K触发器CD4096 三输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器CD4099 8位可寻址锁存器CD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器CD40107 双2输入端与非缓冲/驱动器CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动CD40147 10-4线编码器CD40160 可预置BCD加计数器CD40161 可预置4位二进制加计数器CD40162 BCD加法计数器CD40163 4位二进制同步计数器CD40174 六锁存D型触发器CD40175 四D型触发器CD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) CD40193 可预置4位二进制加/减计数器CD40194 4位并入/串入-并出/串出移位寄存CD40195 4位并入/串入-并出/串出移位寄存CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或者非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或者非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或者选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交叉点开关0206A 天线开关集成电路03VFG9 发射压控振荡集成电路1021AC 发射压控振荡集成电路1097C 升压集成电路140N 电源取样比较放大集成电路14DN363 伺服操纵集成电路15105 充电操纵集成电路15551 管理卡升压集成电路1710 视频信号处理集成电路1N706 混响延时集成电路20810－F6096 存储集成电路2252B 微处理集成电路2274 延迟集成电路24C01ACEA 存储集成电路24C026 存储集成电路24C04 存储集成电路24C64 码片集成电路24LC16B 存储集成电路24LC65 电可改写编程只读存储集成电路27C1000PC－12 存储集成电路27C2000QC－90 存储集成电路27C20T 存储集成电路27C512 电可改写编程只读存储集成电路2800 红外遥控信号接收集成电路28BV64 码片集成电路28F004 版本集成电路31085 射频电源集成电路32D54 电源、音频信号处理集成电路1732D75 电源、音频信号处理集成电路32D92 电源中频放大集成电路4066B 电子开关切换集成电路4094 移位寄存串入、并出集成电路424260SDJ 存储集成电路4260 动态随机存储集成电路4270351/91B9905 中频放大集成电路4370341/90M9919 中频处理集成电路4464 存储集成电路4558 双运算放大集成电路4580D 双运算放大集成电路47C1638AN－U337 微处理集成电路47C1638AU－353 微处理集成电路47C432GP 微处理集成电路47C433AN－3888 微处理集成电路49/4CR1A 中频放大集成电路5101 天线开关集成电路5G052 发光二极管四位显示驱动集成电路5G24 运算放大集成电路5W01 双运算放大集成电路649/CRIA70612 中频放大集成电路673/3CR2A 多模转换集成电路74122 可重触发单稳态集成电路74HC04 逻辑与非门集成电路74HC04D 六反相集成电路74HC123 单稳态集成电路74HC125 端口功能扩展集成电路74HC14N 六反相集成电路74HC157A 多路转换集成电路74HC165 移相寄存集成电路1874HC245 总线收发集成电路74HC32 或者门四2输入集成电路74HC374八D 触发集成电路74HC573D 存储集成电路74HCT157 多路转换双输入集成电路74HCT4046A 压控振荡集成电路74HCT4538D 单稳态集成电路74HCT4538N 触发脉冲集成电路74HCT86D 异或者门四2输入集成电路74HCU04 与非门集成电路74LS125 端口功能扩展集成电路74LS373 锁存集成电路74LS393 计数双四位二进制集成电路74LS74双D 触发集成电路78014DFP 系统操纵处理集成电路811N 伴音阻容偏置集成电路83D33 压控振荡集成电路85712 场扫描信号校正处理集成电路85713 行扫描信号校正集成电路87C52 微处理集成电路87CK38N－3584 微处理集成电路87CK38N－3627 微处理集成电路89C52 系统操纵处理集成电路89C55 系统操纵处理集成电路93C66 电可改写编程只读存储集成电路93LC56 电可改写编程存储集成电路9821K03 系统操纵集成电路A1642P 背景歌声消除集成电路A701 红外遥控信号接收集成电路A7950 场频识别集成电路19A8772AN 色差信号延迟处理集成电路A9109 功率放大集成电路AAB 电源集成电路ACA650 色度信号解调集成电路ACFP2 色度、亮度信号分离集成电路ACP2371 多伴音、多语言改善集成电路ACVP2205 色度、亮度信号分离集成电路AD1853 立体声数/模转换集成电路AD1858 音频解调集成电路AD722 视频编码集成电路ADC2300E 音频数/模转换集成电路ADC2300J 音频数/模转换集成电路ADC2310E 音频数/模转换集成电路ADV7172 视频编码集成电路ADV7175A 视频编码集成电路AE31201 频率显示集成电路AJ7080 射频调制集成电路AK4321－VF－E1 音频数/模转换集成电路AN1319 双高速电压比较集成电路AN1358S 双运算放大集成电路AN1393 双运算放大集成电路AN1431T 稳压电源集成电路AN1452 音频前置放大集成电路AN1458S 双运算放大集成电路AN206 伴音中频及前置放大集成电路AN222 自动频率操纵集成电路AN236 副载波信号处理集成电路AN239Q 图像、伴音中频放大集成电路AN247P 图像中频放大、AGC操纵集成电路AN253P 调频/调幅中频放大集成电路20AN262 音频前置放大集成电路AN2661NK 视频信号处理集成电路AN2663K 视频信号处理集成电路AN272 音频功率放大集成电路AN2751FAP 视频信号处理集成电路AN281 色度解码集成电路AN2870FC 多功能操纵集成电路AN295 行、场扫描信号处理集成电路AN301 伺服操纵集成电路AN305 视频自动增益操纵集成电路AN306 色度自动相位操纵集成电路AN318 直流伺服操纵集成电路AN320 频率操纵、调谐显示驱动集成电路AN3215K 视频信号处理集成电路AN3215S 视频信号处理集成电路AN3224K 磁头信号记录放大集成电路AN3248NK 亮度信号记录、重放处理集成电路AN331 视频信号处理集成电路AN3311K 磁头信号放大集成电路AN3313 磁头信号放大集成电路AN3321S 录像重放信号处理集成电路AN3331K 磁头信号处理集成电路AN3337NSB 磁头信号放大集成电路AN3380K 磁头信号处理集成电路AN3386NK 磁头信号处理集成电路AN3495K 色度、亮度信号降噪集成电路AN355 伴音中频放大、检波集成电路AN3581S 视频驱动集成电路AN366 调频/调幅中频放大集成电路AN3791 移位操纵集成电路21AN3792 磁鼓伺服操纵接口集成电路AN3795 主轴伺服操纵接口集成电路AN3814K 电机驱动集成电路AN4265 音频功率放大集成电路AN4558 运算放大集成电路AN5010 电子选台集成电路AN5011 电子选台集成电路AN5015K 电子选台集成电路AN5020 红外遥控信号接收集成电路AN5025S 红外遥控信号接收集成电路AN5026K 红外遥控信号接收集成电路AN5031 电调谐操纵集成电路AN5034 调谐操纵集成电路AN5036 调谐操纵集成电路AN5043 调谐操纵集成电路AN5071 频段转换集成电路AN5095K 电视信号处理集成电路AN5110 图像中频放大集成电路AN5130 图像中频、视频检波放大集成电路AN5138NK 图像、伴音中频放大集成电路AN5156K 电视信号处理集成电路AN5177NK 图像、伴音中频放大集成电路AN5179K 图像、伴音中频放大集成电路AN5183K 中频信号处理集成电路AN5195K 中频、色度、扫描信号处理集成电路AN5215 伴音信号处理集成电路AN5520 伴音中频放大及鉴频集成电路AN5222 伴音中频放大集成电路AN5250 伴音中频放大、鉴频及功率放大集成电路AN5262 音频前置放大集成电路22AN5265 音频功率放大集成电路AN5270 音频功率放大集成电路AN5273 双声道音频功率放大集成电路AN5274 双声道音频功率放大集成电路AN5275 中置、3D放大集成电路AN5285K 双声道前置放大集成电路AN5295NK 音频信号切换集成电路AN5312 视频、色度信号处理集成电路AN5313NK 视频、色度信号处理集成电路AN5342 图像水平轮廓校正集成电路AN5342FB 水平清晰度操纵集成电路AN5344FBP 色度信号处理集成电路AN5348K 人工智能信号处理集成电路AN5385K 色差信号放大集成电路AN5410 行、场扫描信号处理集成电路AN5421 同步检测集成电路AN5422 行、场扫描信号处理集成电路AN5512 场扫描输出集成电路AN5515 场扫描输出集成电路AN5521 场扫描输出集成电路AN5532 场扫描输出集成电路AN5534 场扫描输出集成电路AN5551 枕形校正集成电路AN5560 场频识别集成电路AN5600K 中频、亮度、色度及扫描信号处理集成电路AN5601K 视频、色度、同步信号处理集成电路AN5607K 视频、色度、行场扫描信号处理集成电路AN5615 视频信号处理集成电路AN5620X 色度信号处理集成电路AN5621 场扫描输出集成电路23AN5625 色度信号处理集成电路AN5633K 色度信号处理集成电路AN5635 色度解码集成电路AN5635NS 色度解码集成电路AN5637 色度解码、亮度延迟集成电路AN5650 同步信号分离集成电路AN5682K 基色电子开关切换集成电路AN5693K 视频、色度、行场扫描信号处理集成电路AN5712 图像中频放大、AGC操纵集成电路AN5722 图像中频放大、检波集成电路AN5732 伴音中频放大、鉴频集成电路AN5743 音频功率放大集成电路AN5750 行自动频率操纵及振荡集成电路AN5757S 行扫描电源电压操纵集成电路AN5762 场扫描振荡、输出集成电路AN5764 光栅水平位置操纵集成电路AN5765 电源稳压操纵集成电路AN5767 同步信号处理集成电路AN5768 光栅倾斜校正操纵集成电路AN5769 行、场会聚操纵集成电路AN5790N 行扫描信号处理集成电路AN5791 同步脉冲相位与脉宽调整集成电路AN5803 双声道立体声解调集成电路AN5836 双声道前置放大集成电路AN5858K 视频信号操纵集成电路AN5862 视频信号操纵集成电路AN5862S－E1 视频信号开关操纵集成电路AN5870K 模拟信号切换集成电路AN5891K 音频信号处理集成电路AN614 行枕形校正集成电路24AN6210 双声道前置放大集成电路AN6306S 亮度信号处理集成电路AN6308 模拟电子开关集成电路AN6327 视频重放信号处理集成电路AN6341N 伺服操纵集成电路AN6342N 基准分频集成电路AN6344 伺服操纵集成电路AN6345 分频集成电路AN6346N 磁鼓伺服操纵集成电路AN6350 磁鼓伺服操纵集成电路AN6357N 主轴接口集成电路AN6361N 色度信号处理集成电路AN6367NK 色度信号处理集成电路AN6371S 自动相位操纵集成电路AN6387 电机伺服操纵集成电路AN6550 卡拉OK音频放大集成电路AN6554 四运算放大集成电路AN6561 双运算放大集成电路AN6562SG 双运算放大集成电路AN6609N 电机驱动集成电路AN6612 电机稳速操纵集成电路AN6650 电机速度操纵集成电路AN6651 电机速度操纵集成电路AN6652 电机稳速操纵集成电路AN6875 发光二极管五位显示驱动集成电路AN6877 发光二极管七位显示驱动集成电路AN6884 发光二极管五位显示驱动集成电路AN6886 发光二极管五位显示驱动集成电路AN6888 发光二极管显示驱动集成电路AN6914 双电压比较集成电路25AN7085N5 单片录、放音集成电路AN7105 双声道音频功率放大集成电路AN7106K 双声道音频功率放大集成电路AN7108 单片立体声放音集成电路AN710S 单片放音集成电路AN7110E 音频功率放大集成电路AN7114 音频功率放大集成电路AN7116 音频功率放大集成电路AN7118 双声道音频功率放大集成电路AN7118S 双声道音频功率放大集成电路AN7120 音频功率放大集成电路AN7124 双声道音频功率放大集成电路AN7145 双声道音频功率放大集成电路AN7148 双声道音频功率放大集成电路AN7158N 音频功率放大7.5W×2集成电路AN7161N 音频功率放大集成电路AN7164 双声道音频功率放大集成电路AN7171NK 音频功率放大集成电路AN7205 调频/调谐及高频放大集成电路AN7220 调频/调幅中频放大集成电路AN7222 调频/调幅中频放大集成电路AN7223 调频/调幅中频放大集成电路AN7226 调频/调幅中频放大集成电路AN7256 调频/调谐及中频放大集成电路AN7311 双声道前置放大集成电路AN7312 双声道前置放大集成电路AN7315 双声道前置放大集成电路AN7315S 双声道前置放大集成电路AN7320 音频前置放大集成电路AN7396K 双声道前置放大集成电路26AN7397K 双声道前置放大集成电路AN7410 调频立体声多路解码集成电路AN7414 调频立体声解码集成电路AN7420N 调频立体声解码集成电路AN7470 调频立体声解码集成电路AN7805 三端电源稳压＋5V/1A集成电路AN7806 三端电源稳压＋6V/1A集成电路AN7807 三端电源稳压＋7V/1A集成电路AN7808 三端电源稳压＋8V/1A集成电路AN7809 电源稳压＋9V/1A集成电路AN7810 三端电源稳压＋10V/1A集成电路AN7812 三端电源稳压＋12V/1A集成电路AN7815 三端电源稳压＋15V/1A集成电路AN7818 三端电源稳压＋18V/1A集成电路AN7820 三端电源稳压＋20V/1A集成电路AN7824 三端电源稳压＋24V/1A集成电路AN78L05 三端电源稳压＋5V/0.1A集成电路AN78L06 三端电源稳压＋6V/0.1A集成电路AN78L08 三端电源稳压＋8V/0.1A集成电路AN78L09 三端电源稳压＋9V/0.1A集成电路AN78L10 三端电源稳压＋10V/0.1A集成电路AN78L12 三端电源稳压＋12V/0.1A集成电路AN78L15 三端电源稳压＋15V/0.1A集成电路AN78L18 三端电源稳压＋18V/0.1A集成电路AN78L20 三端电源稳压＋20V/0.1A集成电路AN78L24 三端电源稳压＋24V/0.1A集成电路AN78M05 三端电源稳压＋5V/0.5A集成电路AN78M06 三端电源稳压＋6V/0.5A集成电路AN78M08 三端电源稳压＋8V/0.5A集成电路AN78M09 三端电源稳压＋9V/0.5A集成电路27AN78M10 三端电源稳压＋10V/0.5A集成电路AN78M12 三端电源稳压＋12V/0.5A集成电路AN78M15 三端固定式稳压＋15V/0.5A集成电路AN78M18 三端电源稳压＋18V/0.5A集成电路AN78M20 三端电源稳压＋20V/0.5A集成电路AN78M24 三端电源稳压＋24V/0.5A集成电路AN7905 三端电源稳压－5V/1A集成电路AN7906 三端电源稳压－6V/1A集成电路AN7908T 三端电源稳压－8V/1A集成电路AN7909T 三端电源稳压－9V/1A集成电路AN7910T 三端电源稳压－10V/1A集成电路AN7912 三端电源稳压－12V/1A集成电路AN7915 三端电源稳压－15V/1A集成电路AN7918 三端电源稳压－18V/1A集成电路AN7920 三端电源稳压－20V/1A集成电路AN7924 三端电源稳压－24V/1A集成电路AN79L05 三端电源稳压－5V/0.1A集成电路AN79L06 三端电源稳压－6V/0.1A集成电路AN79L08 三端电源稳压－8V/0.1A集成电路AN79L09 三端电源稳压－9V/0.1A集成电路AN79L10 三端电源稳压－10V/0.1A集成电路AN79L12 三端电源稳压－12V/0.1A集成电路AN79L15 三端电源稳压－15V/0.1A集成电路AN79L18 三端电源稳压－18V/0.1A集成电路AN79L20 三端电源稳压－20V/0.1A集成电路AN79L24 三端电源稳压－24V/0.1A集成电路AN79M05 三端电源稳压－5V/0.5A集成电路AN79M06 三端电源稳压－6V/0.5A集成电路AN79M08 三端电源稳压－8V/0.5A集成电路AN79M09 三端电源稳压－9V/0.5A集成电路28AN79M10 三端电源稳压－10V/0.5A集成电路AN79M12 三端电源稳压－12V/0.5A集成电路AN79M15 三端电源稳压－15V/0.5A集成电路AN79M18 三端电源稳压－18V/0.5A集成电路AN79M20 三端电源稳压－20V/0.5A集成电路AN79M24 三端电源稳压－24V/0.5A集成电路AN8028 自激式开关电源操纵集成电路AN8270K 主轴电机操纵集成电路AN8280 电机驱动集成电路AN8281S 电机驱动集成电路AN8290S 主轴电机驱动集成电路AN8355S 条形码扫描接收集成电路AN8370S 光电伺服操纵集成电路AN8373S 射频伺服处理集成电路AN8375S 伺服处理集成电路AN8389S－E1 电机驱动集成电路AN8480NSB 主轴电机驱动集成电路AN8481SB－E1 主轴电机驱动集成电路AN8482SB 主轴电机驱动集成电路AN8623FBQ 主轴伺服处理集成电路AN8788FB 电机驱动集成电路AN8802CE1V 伺服处理集成电路AN8813NSBS 主轴电机驱动集成电路AN8819NFB 伺服驱动、直流交换集成电路AN8824FBQ 前置放大集成电路AN8825NFHQ－V 聚焦、循迹误差处理集成电路AN8831SC 视频预视放集成电路AN8832SB－E1 射频放大、伺服处理集成电路AN8837SB－E1 伺服处理集成电路AN89C2051－24PC 微处理集成电路29APU2400U 音频信号处理集成电路APU2470 音频信号处理集成电路AS4C14405－60JC 动态随机存储1M×4集成电路AS4C256K16ED－60JC 存储集成电路ASD0204－015 图文操纵集成电路ASD0204GF－022－3BA显示操纵集成电路AT24C08 存储集成电路AT24C08A 存储集成电路AT24C256－10CI 码片集成电路AT27C010 电可改写编程只读存储集成电路AT27C020 存储集成电路ATMEL834 存储集成电路AVM－1 视频信号处理厚膜集成电路AVM－2 音频信号处理厚膜集成电路AVSIBCP08 倍压整流切换集成电路B0011A 存储集成电路B1218 电子快门操纵集成电路BA033T 三端电源稳压＋3.3V集成电路BA10324 四运算放大集成电路BA10393N 双运算放大集成电路BA1102F 杜比降噪处理集成电路BA1106F 杜比降噪处理集成电路BA12ST 电源稳压集成电路BA1310 调频立体声解码集成电路BA1332L 调频立体声解码集成电路BA1350 调频立体声解码集成电路BA1351 调频立体声解码集成电路BA1356 调频立体声解码集成电路BA1360 调频立体声解码集成电路BA15218N 双运算放大集成电路30BA225 可触发双单稳态振荡集成电路BA302 音频前置放大集成电路BA311 音频前置放大集成电路BA313 音频前置放大集成电路BA3283 单片放音集成电路BA328F 双声道前置放大集成电路BA329 双声道前置放大集成电路BA3304F 录放音前置均衡放大集成电路BA3306 音频、前置放大集成电路BA3312N 话筒信号前置放大集成电路BA3313L 自动音量操纵集成电路BA3314 话筒信号前置放大集成电路BA335 自动选曲集成电路BA336 自动选曲集成电路BA340 音频前置放大集成电路BA3402F 双声道前置放大集成电路BA3404F 自返转放音集成电路BA343 双声道前置放大集成电路BA3503F 双声道前置放大集成电路BA3506 单片放音集成电路BA3513FS 单片放音集成电路BA3516 单片放音集成电路BA3706 自动选曲集成电路BA3707 录音带曲间检测集成电路BA3812L 五频段音调补偿集成电路BA3818F 电压比较运放集成电路BA3822LS 双声道五频段显示均衡集成电路BA3828 电子选台预置集成电路BA3880 音频处理集成电路31BA401 调频中频放大集成电路BA402 调频中频放大集成电路BA4110 调频中频放大集成电路BA4234L 调频中频放大集成电路BA4402 调频调谐收音集成电路BA4403 调频高频放大、混频、本振集成电路BA4560 双运算放大集成电路BA5096 数字混响集成电路BA5102A 音频功率放大集成电路BA514 音频功率放大集成电路BA516 音频功率放大集成电路BA5208AF 音频功率放大集成电路BA532 音频功率放大集成电路BA534 音频功率放大集成电路BA5406 双声道音频功率放大集成电路BA5412 音频功率放大集成电路BA547 音频功率放大1.5W集成电路BA5912AFP－YE2 电机驱动、倾斜、加载集成电路BA5981FP－E2 聚焦、循迹驱动集成电路BA5983FB 四通道伺服驱动集成电路BA5983FM－E2 电机驱动集成电路BA6104 发光二极管五位显示驱动集成电路BA6107A 电机伺服操纵集成电路BA6109 加载电机驱动集成电路BA6125 发光二极管五位显示驱动集成电路BA6137 发光二极管五位显示驱动集成电路BA6191 音频操纵集成电路BA6196FP 伺服驱动集成电路BA6208 电机驱动集成电路BA6208D 电机驱动集成电路32BA6209 电机驱动集成电路BA6209N 双向驱动电机集成电路BA6218 加载电机驱动集成电路BA6219 电机驱动集成电路BA6219B 电机驱动集成电路BA6227 电机稳速操纵集成电路BA6238 电机驱动集成电路BA6239 电机双向驱动集成电路BA6239A 电机双向驱动集成电路BA6246M 加载、转盘电机驱动集成电路BA6248 电机驱动集成电路BA6286 电机驱动集成电路BA6287 电机驱动集成电路BA6290 电机驱动集成电路BA6295AFP－E2 加载、倾斜驱动集成电路BA6296FP 电机速度操纵集成电路BA6297AFP 伺服驱动集成电路BA6302A 电机伺服操纵集成电路BA6305 操纵放大集成电路BA6305F 操纵放大集成电路BA6308 电子开关切换集成电路BA6321 电机伺服操纵集成电路BA6392 伺服驱动集成电路BA6395 主轴电机驱动集成电路BA6396FP 伺服驱动集成电路BA6411 电机驱动集成电路BA6435S 主轴电机驱动集成电路BA6459P1 电机驱动集成电路BA6570FP－E2 聚焦、循迹驱动集成电路33BA6664FM 三相主电机驱动集成电路BA6791FP 四通道伺服驱动集成电路BA6796FP 电机驱动集成电路BA6810S 音频显示驱动集成电路BA6844AFP－E2 三相主电机驱动集成电路BA6849FP 主轴电机驱动集成电路BA689 发光二极管十二位显示驱动集成电路BA6893KE2 直流变换驱动集成电路BA6956AN 加载电机驱动集成电路BA6993 双运算放大集成电路BA7001 音频切换集成电路BA7004 测试信号发生集成电路BA7005AL 射频调制集成电路BA7007 信号检测集成电路BA7021 视频信号选择集成电路BA7024 视频信号测试集成电路BA7025L 信号检测集成电路BA7042 振荡集成电路BA7047 调频检波集成电路BA7048N 包络信号检测集成电路BA7106LS 检测信号操纵集成电路BA7180FS 磁头信号放大集成电路BA7212S 磁头信号放大集成电路BA7253S 磁头信号放大集成电路BA7254S 四磁头信号放大集成电路BA7258AS 亮度信号处理集成电路BA7264S 视频信号处理集成电路BA7274S 磁头信号放大集成电路BA7357S 中频放大集成电路BA7604N 电子开关切换集成电路34BA7606F 色差信号切换集成电路BA7655 色度信号处理集成电路BA7665FS－E2 视频输出放大集成电路BA7725FS 混响立体声放大集成电路BA7725S 信号压缩及扩展处理集成电路BA7743FS 磁头信号放大集成电路BA7751ALS 音频信号录放处理集成电路BA7752LS 音频信号处理集成电路BA7755 磁头开关集成电路BA7755AF－E2 磁头开关集成电路BA7765AS 音频信号处理集成电路BA7766SA 音频信号处理集成电路BA7767AS 音频信号处理集成电路BA7797F 音频信号处理集成电路BA8420 特技操纵处理集成电路BAL6309 场同步信号发生集成电路BH3866AS 音频、色度信号前置放大集成电路BH4001 微处理集成电路BH7331P 音频功率放大集成电路BH7770KS 音频信号处理集成电路BL3207 亮度延时集成电路BL3208B 音频延迟混响集成电路BL5132 中频放大集成电路BL54573 电子调频波段转换集成电路BL5612 视频放大、色差矩阵集成电路BM5060 微处理集成电路BM5061 字符发生集成电路BM5069 微处理集成电路BN5115 图像中频放大集成电路BOC31F 单片微处理集成电路35BP5020 视频电源转换集成电路BT852 视频编码集成电路BT864 视频编码集成电路BT866PQFP 微处理集成电路BU12102 时序信号发生解码集成电路BU2092F 扩展集成电路BU2185F 同步信号处理集成电路BU2285FV 时钟信号发生集成电路BU2820 伺服操纵集成电路BU2841FS 视频、蓝背景信号发生集成电路BU2872AK 操作系统操纵、屏显驱动集成电路BU3762AF 红外遥控信号发射集成电路BU4053B 电子开关切换集成电路BU5814F 红外遥控信号发射集成电路BU5994F 红外遥控信号发射集成电路BU6198F 屏幕显示集成电路BU9252F 音频延时集成电路BU9252S 数/模转换集成电路BU9253FS 话筒音频混响集成电路BX1303 音频功率放大集成电路BX1409 红外遥控信号接收集成电路BX7506 主轴电机电源操纵集成电路C1363CA 红外遥控电子选台集成电路C1490HA 红外遥控信号接收集成电路C187 分配、十进制计数集成电路C301 译码BCD－10段集成电路C68639Y 微处理集成电路C75P036 微处理集成电路CA0002 调幅模拟声解调集成电路CA2004 音频功率放大集成电路36CA2006 音频功率放大集成电路CA270AW 视频检波放大集成电路CA3075 调频中频放大集成电路CA3089 调频中频放大集成电路CA3120E 视频信号处理集成电路CA3140 运算放大集成电路CA810 音频功率放大集成电路CA920 行扫描信号处理集成电路CAS126 天线开关集成电路CAT24C16 电可改写编程只读存储集成电路CAT35C104HP 存储集成电路CC4000 或者非门双3输入集成电路CC4008 计数4位二进制集成电路CC40107 与非双2输入缓冲、驱动集成电路CC40174 六D触发集成电路CC40194 移位寄存集成电路CC4025 或者非门3输入集成电路CC4026 译码、驱动、十进制计数集成电路CC4027 上升沿J－K触发集成电路。

TI 便携式媒体播放器解决方案

便携式多媒体点唱机，有时也被称为音频/视频点唱机，便携式媒体播放器或便携式视频播放器，为消费类和消费类电子制造厂商提供了具有巨大利益的市场。

这些器件都是基于硬盘驱动器的，能够存储几个小时的内容，为当今忙碌生活的人们提供娱乐。

尽管这些产品的相关市场还很小，但是,它的市场潜力却是很大的。

便携式媒体组成器件为：TS5V330/TS3V330：视频开关SN74AVCXT245/74LVCXT245：双电源电平转换器SN74LV4320A：CompactFlash接口收发器TLV320AIC32/TLV320AIC31：低功耗、立体声音频编解码器PCM3792A：低功耗、立体声音频编解码器TSC2100/TSC2102: High-Performance “Smart” Touch- Screen Controllers w/ Integrated Low-Power Audio ConvertersTSC2100/TSC2102：集成了低功耗音频转换器高性能”智能”触摸屏控制器TSC2301/TSC2302：集成了低功耗音频转换器高性能”智能”触摸屏控制器SN74AVCA406/SN74AVCA406L：MMC，SD，Memory Stick，SmartMedia 和xD-Picture Card收发器下图为便携式多功能数字媒体设备方框图下面对各个元器件的性能和方框图进行描述：Video switches in the TS switch product family provide low differential gain and phase, making these switches ideal for composite and RGBvideo applications. TS video switches also offer the wide bandwidth and low crosstalk required to support high-frequency video applications.Key Features*Low differential gain and phase (3-V DG = 0.82%, DP = 0.1 degrees typ) (5-V DG = 0.64%, DP = 0.1 degrees typ)*Wide bandwidth (BW = 300 MHz min)*Low crosstalk (3-V XTALK = –80 dB typ) (5-V XTALK = –63 dB typ) *Low-power consumption (ICC = 3 A max)*Bidirectional data flow, with near-zero propagation delay*Low ON-state resistance (ron = 3 typ)*Rail-to-rail switching on data I/O ports (0 to VCC)*Ioff supports partial-power-down mode operation*Suitable for both RGB and composite-video switching Applications*Composite and RGB video多路视频信号从视频处理器到VGA卡两个外接视频端口Dual-supply level shifters are the ideal solution for bidirectional level translation. These devices have two separate VCC supplies, one for each port (VCCA and VCCB), which gives them flexibility to operate in mixed-mode applications. These dual-supply devices allow for bidirectional level translation between different voltage nodes from 1.2 V to 3.6 V and 1.65 V to 5.5 V. TI also offers a wide range ofbit-width options.TI’s Dual-Supply Level-Translation Portfolio扩展系列双电源电平转换设备This CompactFlash (CF) interface chip is designed to provide a singlechip solution for CF card interfaces. Separate VCC rails for the system bus side and the CF connector bus side allow voltage-level shifting.This is helpful for interfacing between a core chipset, which may operatefrom 3.3 V down to 1.65 V, and CF cards with 3.3-V or 5-V supply voltages.Key Features*Level translation supports both 3.3- and 5-V CompactFlash cards *High degree of integration*Schmidt-trigger inputs for CompactFlash control signals*Ioff and /MASTER_EN (shutdown) pin*Internal decode logic for direction control (DIR)*Robust ESD protection (+8-kV HBM) on card pinsApplications*PDAs*Handheld scanners*Set-top boxes*Network equipmentSN74LV4320A典型应用示意图]The TLV320AIC32/TLV320AIC31 are highly integrated, low-power stereo CODECs for use in a variety of portable audio equipment. The TLV320AIC32 includes six single-ended analog inputs. TheTLV320AIC31 includes two single-ended analog inputs and two differential analog inputs. Both CODECs have six output drivers. They also include two line output drivers and four high-power amplifiers that can be configured as stereo headphone drivers or stereo speaker drivers.Key Features*Stereo DAC (100 dBA) and ADC (92 dBA) support rates up to 96 kSPS*14-mW power dissipation with stereo playback at 48 kSPS*Stereo headphone drivers and 500-mW, 8speaker driver*Stereo microphone preamps and hardware automatic gain control *Integrated PLL for flexible audio clock generation*Programmable digital audio bass/treble/EQ with 3D effects*Analog inputs are configurable as single-ended (AIC32/AIC31) or fully differential (AIC31 only)*Up to six analog inputs, six output drivers for easy connectivity to multiple devices in a cellular telephony system*Packaging: 5 5 mm 32-pin QFNApplications*Cellular and smart phones*Digital still cameras, digital video cameras*MP3 and portable media players* PDAs*Talking toys and toys with audioTLV320AIC32方框图The PCM3792A is a single-chip, 20-bit stereo audio CODEC with three single-ended analog inputs, three stereo outputs and two mono outputs. It includes an integrated stereo Class-D audio power amplifier. The PCM3792A accepts left-justified,right-justified andI2S™ data formats for simple interface to audio DSP or decoder/encoder chips. It can be controlled with a two- or threewire serial interface. The PCM3792A is suitable for a wide variety of portable applications where good performance and low power are required.Key Features*95-dB SNR DAC, 90-dB SNR ADC*Stereo 500 mW at 8 for speaker amplifier*Stereo 30 mW at 32 for headphone amplifier*+6-dB to –70-dB volume control for each analog output*+30-dB to –12-dB gain control for analog inputs*48-mW power dissipation at 3.3 V (playback)*67-mW power dissipation at 3.3 V (recording)*Auto Level Control (ALC) for playback and recording*Power supply:*1.8 to 3.6 V for digital I/O*2.7 to 3.6 V for digital and analog*2.7 to 4.5 V for speaker amplifier*Packaging: 6 6 mm BGAApplications*Mobile phones, PDAs*Video camcorders, movie digital still cameras*Portable digital audio players*Expected release April 2006.PCM3792A方框图The TSC2100 is a four-wire smart touch-screen controller (TSC) with an integrated audio CODEC, a headphone/speaker amplifier and a 12-bit battery/temperature/auxiliary measurement SAR ADC. The TSC2102 is a pin- and software-compatible version of the TSC2100, incorporating the smart four-wire TSC, a stereo audio DAC and a headphone/speaker driver.Key Features*Four-wire smart touch-screen controller*Stereo DAC and mono audio ADC (TSC2100) support up to 53 kSPS *97-dB stereo playback at 11-mW power dissipation*Audio output drivers provide 325 mW into 8 and also support stereo headphones with capless output option*Integrated PLL for flexible audio clock generation*Programmable digital audio bass/treble/EQ/de-emphasis (TSC2100 only)*Microphone preamp and hardware automatic gain control*Direct battery measurement accepts up to 6-V input*On-chip temperature and auxiliary-input measurement*Packaging:7 ×7 mm 48-pin QFN (TSC2101)5 × 5 mm 32-pin QFN (TSC2100)32-pin TSSOP (TSC2100)Applications*Portable media players*PDAs*Portable audio productsTSC2100方框图The TSC2301 is a 4-wire smart touch-screen controller (TSC) with an integrated audio codec, a headphone/speaker amplifier and a 12-bit battery/temperature/auxiliary measurement ADC. The TSC2301 includes a keypad controller and 6 additional GPIO pins.Key Features*4-wire smart touch-screen controller*4 4 keypad interface (TSC2301 only)*6 GPIO pins (TSC2301 only)*Full stereo codec supporting up to 48 kSPS*98-dB stereo playback with 27-mW power dissipation*8-bit DAC for LCD contrast control*Integrated PLL for flexible audio clock generation*27-mW stereo headphone driver with capless output option*Programmable digital audio bass/treble/EQ/de-emphasis*Microphone preamp and hardware automatic gain control*Direct battery measurement accepts up to 6-V input*On-chip temperature and auxiliary-input measurement*Packaging: 6 6 mm 120-ball BGA (TSC2301), 64-pin TQFP (TSC2301), 7 7 mm 48-pin QFN (TSC2302)Applications*Smart phones*PDAs*Portable media players*Low-power audio productsTSC2301方框图The SN74AVCA406 is a transceiver for interfacing microprocessors with MultiMediaCard (MMC), SD Secure Digital™ cards, Memory Stick-compliant products, SmartMedia cards, or xD-Picture Card. It integrates high ESD protection, which eliminates the need for external ESD diodes.Key Features*Transceiver for interface with MultiMediaCard (MMC), SD Secure Digital, Memory Stick (MS) compliant products, SmartMedia andxD-Picture Card*Configurable I/O switching levels with dual-supply pins operating over full 1.4- to 3.6-V power-supply range*A ports are placed in high-impedance state when card-side supply voltage is switched off*ESD protection for card-side pins exceeds ±15-kV air gap discharge,±8-kV contact dischargeApplications*Handsets-Digital still cameras*PDAs-Set-top boxes*Handheld scannersSN74AVCA406存储卡接口。

TI芯片资料

目录电源类（1-10）8.CSD19535 (18)9.INA210 (19)10.INA282 (21)1.TPS28225 (2)7.TPS4021 (16)3.TPS54340 (5)4.TPS56528 (9)5.TPS7A1601 (12)6.TPS7A4001 (14)2.UCC27211 (4)高速放大器（11-17）15.LMH6552 (31)12.LMH6703 (25)17.OPA2356 (34)13.OPA2695 (27)16.OPA842 (32)11.THS3201 (23)14.VCA821 (29)精密ADC/DAC （18-21）18.ADS1118 (36)19.DAC7811 (38)20.DAC8571 (41)21.REF3330 (43)精密放大器（22-27）22.INA333 (45)23.INA826 (46)24.OPA192 (48)25.OPA2320 (50)26.OPA2330 (52)27.OPA2376 (53)音频功放（28）28.TPA3112 (55)其他（29-33）30.SN74AUP1G07 (58)29.TLV3501 (57)33.TS12A4515 (62)31.TS5A3159 (61)32.TS5A3166 (62)零一．TPS282258引脚高频4A吸入电流同步MOSFET驱动器描述The TPS28225 and TPS28226 are high-speed drivers for N-channel complimentary driven power MOSFETs with adaptive dead-time control. These drivers are optimized for use in variety of high-current one and multi-phase dc-to-dc converters. The TPS28225/6 is a solution that provides highly efficient, small size low EMI emmissions.The performance is achieved by up to 8.8-V gate drive voltage, 14-ns adaptive dead-time control, 14-ns propagation delays and high-current 2-A source and 4-A sink drive capability. The 0.4-impedance for the lower gate driver holds the gate of power MOSFET below its threshold and ensures no shoot-through current at high dV/dt phase node transitions. The bootstrap capacitor charged by an internal diode allows use of N-channel MOSFETs in half-bridge configuration.The TPS28225/6 features a 3-state PWM input compatible with all multi-phase controllers employing 3-state output feature. As long as the input stays within 3-state window for the 250-ns hold-off time, the driver switches both outputs low. This shutdown mode prevents a load from the reversed- output-voltage.The other features include under voltage lockout, thermal shutdown and two-way enable/power good signal. Systems without 3-state featured controllers can use enable/power good input/output to hold both outputs low during shutting down.The TPS28225/6 is offered in an economical SOIC-8 and thermally enhanced low-size Dual Flat No-Lead (DFN-8) packages. The driver is specified in the extended temperature range of –40°C to 125°C with the absolute maximum junction temperature 150°C. The TPS28226 operates in the same manner as the TPS28225/6 other than the input under voltage lock out. Unless otherwise stated all references to the TPS28225 apply to the TPS28226 also.特性Drives Two N-Channel MOSFETs with 14-ns Adaptive Dead TimeWide Gate Drive Voltage: 4.5 V Up to 8.8 V With Best Efficiency at 7 V to 8 V Wide Power System Train Input Voltage: 3 V Up to 27 VWide Input PWM Signals: 2.0 V up to 13.2-V AmplitudeCapable Drive MOSFETs with ≥40-A Current per PhaseHigh Frequency Operation: 14-ns Propagation Delay and10-ns Rise/Fall Time Allow FSW - 2 MHzCapable Propagate <30-ns Input PWM PulsesLow-Side Driver Sink On-Resistance (0.4 ) Prevents dV/dT Related Shoot-Through Current 3-State PWM Input for Power Stage Shutdown Space Saving Enable (input) and Power Good (output) Signals on Same Pin Thermal Shutdown UVLO Protection Internal Bootstrap Diode Economical SOIC-8 and Thermally Enhanced 3-mm x 3-mm DFN-8 Packages High Performance Replacement for Popular 3-State Input Drivers APPLICATIONS Multi-Phase DC-to-DC Converters with Analog or Digital Control Desktop and Server VRMs and EVRDs Portable/Notebook Regulators Synchronous Rectification for Isolated Power Supplies参数零二.UCC27211120V 升压4A 峰值电流的高频高侧/低侧驱动器描述UCC27210 和 UCC27211 驱动器基于常见的 UCC27200 和 UCC27201 MOSFET 驱动器，但是对性能进行了几项重大改进。

用户手册

2 11DS-CDBR4300B能耗式 2.5Ω100A 400A*表中额定电流是指制动单元工作时最大电流与制动频率Kc 乘积的最大允许值，该值并不表示制动单元一定可以在该电流下持续工作，而是与其工作环境的散热条件有关。

八附件：1.产品保修凭证用户信息用户名称电话地址及邮编产品信息产品型号机身号销售信息销售商名称地址及邮编服务电话出厂日期保修须知1. 保修有效期自出厂之日起的十二个月内出现故障，免费维修。

2. 不属于免费维修的范围：超过保修有效期；未按产品使用说明的要求操作而造成的损坏；擅自涂改保修凭证的；原装机器无拆过痕迹。

维修记录 1 23本凭证为产品保修的重要依据，请您妥善保管七安全守则：高压危险，请注意人身安全注意，请注意人身以及设备安全！！！其他帮助信息制动单元内部和制动单元所连接的设备都处于危险的高电压，错误的操作和不当的安装使用都可能危害生命安全或导致财产损失。

安装和接线时，必须把与其相连接的变频器和主电源断开，并等待5-10分钟，变频器内部电容放电完备时才可操作。

散热：制动单元本身会产生热量，配用的制动电阻会产生高热，因此用户安装时一定要考虑通风，散热和人身安全。

请务必通过机箱外部的没有上漆的接地孔位可靠接地安装和接线时，请务必参考相关的接线图进行接线，特别是母线电压严禁接反，否则将导致制动单元损坏并有起火危险，注意装配时不要将金属片掉入机箱内，装配好后将端子盖板固定好制动单元的安装最小通风空间：上下100mm ，左右30mm ，制动电阻不可以放在易爆易燃物的附近；制动电阻会产生高热，可能会影响其他设备工作。

安装时必须预先考虑；！！要求使用绝缘等级和截面都满足标准的电缆。

软电缆有更好的灵活性。

因为电缆可能和高温设备有接触，建议使用高温阻燃电缆线进行连接，直流连接线应该绞合以降低干扰配线：制动单元和变频器的距离要尽可能靠近，最远距离不得超过1米，直流侧电缆应该绞合，减少辐射和电感。

德州仪器全系处理器深度解析,各阶段德州仪器处理器详细性能

德州仪器全系处理器深度解析，各阶段德州仪器处理器详细性能作为手机处理器行业内堪称元老级的芯片厂商，德州仪器的处理器芯片一直凭借其出色稳定的性能表现以及良好的兼容性而备受推崇，今天笔者就带大家来细细盘点德州仪器旗下OMAP平台的全系产品，让用户对德州仪器的手机处理器产品有更深入的了解。

德州仪器公司成立于1930年，是有着近80多年历史的全球知名半导体厂商，它以开发、制造、销售半导体和计算机技术闻名于世，主要从事创新型数字信号处理与模拟电路方面的研究、制造和销售。

当然，德州仪器的业务还包括我们今天将要为大家解析的OMAP系列手机处理器。

OMAP(Open Multimedia Application Platform)开放式多媒体应用平台，是德州仪器研发的一种专为智能手机、平板电脑和其它具有丰富多媒体功能的移动终端设备而设计的高性能应用处理器，通常包括一个或多个ARM架构处理器和专用协处理器等，这一系列的处理器芯片在早期的诺基亚经典Symbian智能手机以及如今的摩托罗拉Android智能手机上应用最为广泛。

堪称经典的OMAP 1代处理器:成就诺基亚的辉煌OMAP 1是德州仪器于2003年推出的第一代移动智能终端处理器，具体产品只有OMAP1710这一款。

OMAP1710是当时业界第一款采用90nm工艺制程技术的处理器产品，它包括一个基于ARM926TEJ V5 架构的处理器，一个TMS320C55x DSP引擎(使得运行程序和通话互不影响)以及一系列用于处理视频编解码、静态图像压缩、JA V A和安全性的软件和硬件加速器。

第一代OMAP1710处理器芯片核心架构图也许你现在会对这款OMAP1710处理器感到些许陌生，但相信很多人都用过搭载这款处理器的产品，因为当时诺基亚旗下众多经典Symbian智能手机均搭载这款处理器，这其中就包括当时的大众流行街机N70和N73，此外还有诺基亚6630、6680、6681、E50、E60、E61、E62、E65、E70、N71、N72(网购最低价746.0元)、N80、N90、N91、N92等至今让人怀念的经典产品。

IC集成电路型号大全与40系列芯片功能大全

CD4000 双3输入端或非门单非门CD4001 四2输入端或非门CD4002 双4输入端或非门CD4006 18位串入/串出移位寄存器CD4007 双互补对加反相器CD4008 4位超前进位全加器CD4009 六反相缓冲/变换器CD4010 六同相缓冲/变换器CD4011 四2输入端与非门CD4012 双4输入端与非门CD4013 双主-从D型触发器CD4014 8位串入/并入-串出移位寄存器CD4015 双4位串入/并出移位寄存器CD4016 四传输门CD4017 十进制计数/分配器CD4018 可预制1/N计数器CD4019 四与或选择器CD4020 14级串行二进制计数/分频器CD4021 08位串入/并入-串出移位寄存器CD4022 八进制计数/分配器CD4023 三3输入端与非门CD4024 7级二进制串行计数/分频器CD4025 三3输入端或非门CD4026 十进制计数/7段译码器CD4027 双J-K触发器CD4028 BCD码十进制译码器CD4029 可预置可逆计数器CD4030 四异或门CD4031 64位串入/串出移位存储器CD4032 三串行加法器CD4033 十进制计数/7段译码器CD4034 8位通用总线寄存器CD4035 4位并入/串入-并出/串出移位寄存CD4038 三串行加法器CD4040 12级二进制串行计数/分频器CD4041 四同相/反相缓冲器CD4042 四锁存D型触发器CD4043 三态R-S锁存触发器("1"触发) CD4044 四三态R-S锁存触发器("0"触发) CD4046 锁相环CD4047 无稳态/单稳态多谐振荡器CD4048 四输入端可扩展多功能门CD4049 六反相缓冲/变换器CD4050 六同相缓冲/变换器CD4051 八选一模拟开关CD4052 双4选1模拟开关CD4053 三组二路模拟开关CD4054 液晶显示驱动器CD4055 BCD-7段译码/液晶驱动器CD4056 液晶显示驱动器CD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器CD4063 四位数字比较器CD4066 四传输门CD4067 16选1模拟开关CD4068 八输入端与非门/与门CD4069 六反相器CD4070 四异或门CD4071 四2输入端或门CD4072 双4输入端或门CD4073 三3输入端与门CD4075 三3输入端或门CD4076 四D寄存器CD4077 四2输入端异或非门CD4078 8输入端或非门/或门CD4081 四2输入端与门CD4082 双4输入端与门CD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器CD4095 三输入端J-K触发器CD4096 三输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器CD4099 8位可寻址锁存器CD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器CD40107 双2输入端与非缓冲/驱动器CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动CD40147 10-4线编码器CD40160 可预置BCD加计数器CD40161 可预置4位二进制加计数器CD40162 BCD加法计数器CD40163 4位二进制同步计数器CD40174 六锁存D型触发器CD40175 四D型触发器CD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) CD40193 可预置4位二进制加/减计数器CD40194 4位并入/串入-并出/串出移位寄存CD40195 4位并入/串入-并出/串出移位寄存CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交叉点开关0206A 天线开关集成电路03VFG9 发射压控振荡集成电路1021AC 发射压控振荡集成电路1097C 升压集成电路140N 电源取样比较放大集成电路 14DN363 伺服控制集成电路15105 充电控制集成电路15551 管理卡升压集成电路1710 视频信号处理集成电路1N706 混响延时集成电路20810－F6096 存储集成电路2252B 微处理集成电路2274 延迟集成电路24C01ACEA 存储集成电路24C04 存储集成电路24C64 码片集成电路24LC16B 存储集成电路24LC65 电可改写编程只读存储集成电路 27C1000PC－12 存储集成电路27C2000QC－90 存储集成电路27C20T 存储集成电路27C512 电可改写编程只读存储集成电路 2800 红外遥控信号接收集成电路28BV64 码片集成电路28F004 版本集成电路31085 射频电源集成电路32D54 电源、音频信号处理集成电路1732D75 电源、音频信号处理集成电路32D92 电源中频放大集成电路4066B 电子开关切换集成电路4094 移位寄存串入、并出集成电路424260SDJ 存储集成电路4260 动态随机存储集成电路4270351/91B9905 中频放大集成电路4370341/90M9919 中频处理集成电路4464 存储集成电路4558 双运算放大集成电路4580D 双运算放大集成电路47C1638AN－U337 微处理集成电路47C1638AU－353 微处理集成电路47C432GP 微处理集成电路47C433AN－3888 微处理集成电路49/4CR1A 中频放大集成电路5101 天线开关集成电路5G052 发光二极管四位显示驱动集成电路 5G24 运算放大集成电路5W01 双运算放大集成电路649/CRIA70612 中频放大集成电路673/3CR2A 多模转换集成电路74122 可重触发单稳态集成电路74HC04 逻辑与非门集成电路74HC04D 六反相集成电路74HC123 单稳态集成电路74HC125 端口功能扩展集成电路74HC14N 六反相集成电路74HC157A 多路转换集成电路1874HC245 总线收发集成电路74HC32 或门四2输入集成电路74HC374八D 触发集成电路74HC573D 存储集成电路74HCT157 多路转换双输入集成电路74HCT4046A 压控振荡集成电路74HCT4538D 单稳态集成电路74HCT4538N 触发脉冲集成电路74HCT86D 异或门四2输入集成电路74HCU04 与非门集成电路74LS125 端口功能扩展集成电路74LS373 锁存集成电路74LS393 计数双四位二进制集成电路74LS74双D 触发集成电路78014DFP 系统控制处理集成电路811N 伴音阻容偏置集成电路83D33 压控振荡集成电路85712 场扫描信号校正处理集成电路 85713 行扫描信号校正集成电路87C52 微处理集成电路87CK38N－3584 微处理集成电路87CK38N－3627 微处理集成电路89C52 系统控制处理集成电路89C55 系统控制处理集成电路93C66 电可改写编程只读存储集成电路 93LC56 电可改写编程存储集成电路9821K03 系统控制集成电路A1642P 背景歌声消除集成电路A701 红外遥控信号接收集成电路A7950 场频识别集成电路19A8772AN 色差信号延迟处理集成电路A9109 功率放大集成电路AAB 电源集成电路ACA650 色度信号解调集成电路ACFP2 色度、亮度信号分离集成电路 ACP2371 多伴音、多语言改善集成电路 ACVP2205 色度、亮度信号分离集成电路 AD1853 立体声数/模转换集成电路AD1858 音频解调集成电路AD722 视频编码集成电路ADC2300E 音频数/模转换集成电路ADC2300J 音频数/模转换集成电路ADC2310E 音频数/模转换集成电路ADV7172 视频编码集成电路ADV7175A 视频编码集成电路AE31201 频率显示集成电路AJ7080 射频调制集成电路AK4321－VF－E1 音频数/模转换集成电路AN1319 双高速电压比较集成电路AN1358S 双运算放大集成电路AN1393 双运算放大集成电路AN1431T 稳压电源集成电路AN1452 音频前置放大集成电路AN1458S 双运算放大集成电路AN206 伴音中频及前置放大集成电路AN222 自动频率控制集成电路AN236 副载波信号处理集成电路AN239Q 图像、伴音中频放大集成电路AN247P 图像中频放大、AGC控制集成电路 AN253P 调频/调幅中频放大集成电路20AN262 音频前置放大集成电路AN2661NK 视频信号处理集成电路AN2663K 视频信号处理集成电路AN272 音频功率放大集成电路AN2751FAP 视频信号处理集成电路AN281 色度解码集成电路AN2870FC 多功能控制集成电路AN295 行、场扫描信号处理集成电路AN301 伺服控制集成电路AN305 视频自动增益控制集成电路AN306 色度自动相位控制集成电路AN318 直流伺服控制集成电路AN320 频率控制、调谐显示驱动集成电路 AN3215K 视频信号处理集成电路AN3215S 视频信号处理集成电路AN3224K 磁头信号记录放大集成电路AN3248NK 亮度信号记录、重放处理集成电路 AN331 视频信号处理集成电路AN3311K 磁头信号放大集成电路AN3313 磁头信号放大集成电路AN3321S 录像重放信号处理集成电路AN3331K 磁头信号处理集成电路AN3337NSB 磁头信号放大集成电路AN3380K 磁头信号处理集成电路AN3495K 色度、亮度信号降噪集成电路AN355 伴音中频放大、检波集成电路AN3581S 视频驱动集成电路AN366 调频/调幅中频放大集成电路AN3791 移位控制集成电路21AN3792 磁鼓伺服控制接口集成电路AN3795 主轴伺服控制接口集成电路AN3814K 电机驱动集成电路AN4265 音频功率放大集成电路AN4558 运算放大集成电路AN5010 电子选台集成电路AN5011 电子选台集成电路AN5015K 电子选台集成电路AN5020 红外遥控信号接收集成电路AN5025S 红外遥控信号接收集成电路AN5026K 红外遥控信号接收集成电路AN5031 电调谐控制集成电路AN5034 调谐控制集成电路AN5036 调谐控制集成电路AN5043 调谐控制集成电路AN5071 频段转换集成电路AN5095K 电视信号处理集成电路AN5110 图像中频放大集成电路AN5130 图像中频、视频检波放大集成电路AN5138NK 图像、伴音中频放大集成电路AN5156K 电视信号处理集成电路AN5177NK 图像、伴音中频放大集成电路AN5179K 图像、伴音中频放大集成电路AN5183K 中频信号处理集成电路AN5195K 中频、色度、扫描信号处理集成电路AN5215 伴音信号处理集成电路AN5520 伴音中频放大及鉴频集成电路AN5222 伴音中频放大集成电路AN5250 伴音中频放大、鉴频及功率放大集成电路 AN5262 音频前置放大集成电路22AN5265 音频功率放大集成电路AN5270 音频功率放大集成电路AN5273 双声道音频功率放大集成电路AN5274 双声道音频功率放大集成电路AN5275 中置、3D放大集成电路AN5285K 双声道前置放大集成电路AN5312 视频、色度信号处理集成电路AN5313NK 视频、色度信号处理集成电路AN5342 图像水平轮廓校正集成电路AN5342FB 水平清晰度控制集成电路AN5344FBP 色度信号处理集成电路AN5348K 人工智能信号处理集成电路AN5385K 色差信号放大集成电路AN5410 行、场扫描信号处理集成电路AN5421 同步检测集成电路AN5422 行、场扫描信号处理集成电路AN5512 场扫描输出集成电路AN5515 场扫描输出集成电路AN5521 场扫描输出集成电路AN5532 场扫描输出集成电路AN5534 场扫描输出集成电路AN5551 枕形校正集成电路AN5560 场频识别集成电路AN5600K 中频、亮度、色度及扫描信号处理集成电路 AN5601K 视频、色度、同步信号处理集成电路AN5607K 视频、色度、行场扫描信号处理集成电路 AN5615 视频信号处理集成电路AN5620X 色度信号处理集成电路AN5621 场扫描输出集成电路23AN5625 色度信号处理集成电路AN5633K 色度信号处理集成电路AN5635 色度解码集成电路AN5635NS 色度解码集成电路AN5637 色度解码、亮度延迟集成电路AN5650 同步信号分离集成电路AN5682K 基色电子开关切换集成电路AN5693K 视频、色度、行场扫描信号处理集成电路 AN5712 图像中频放大、AGC控制集成电路AN5722 图像中频放大、检波集成电路AN5732 伴音中频放大、鉴频集成电路AN5743 音频功率放大集成电路AN5750 行自动频率控制及振荡集成电路AN5757S 行扫描电源电压控制集成电路AN5762 场扫描振荡、输出集成电路AN5764 光栅水平位置控制集成电路AN5765 电源稳压控制集成电路AN5767 同步信号处理集成电路AN5768 光栅倾斜校正控制集成电路AN5790N 行扫描信号处理集成电路AN5791 同步脉冲相位与脉宽调整集成电路 AN5803 双声道立体声解调集成电路AN5836 双声道前置放大集成电路AN5858K 视频信号控制集成电路AN5862 视频信号控制集成电路AN5862S－E1 视频信号开关控制集成电路AN5870K 模拟信号切换集成电路AN5891K 音频信号处理集成电路AN614 行枕形校正集成电路24AN6210 双声道前置放大集成电路AN6306S 亮度信号处理集成电路AN6308 模拟电子开关集成电路AN6327 视频重放信号处理集成电路AN6341N 伺服控制集成电路AN6342N 基准分频集成电路AN6344 伺服控制集成电路AN6345 分频集成电路AN6346N 磁鼓伺服控制集成电路AN6350 磁鼓伺服控制集成电路AN6357N 主轴接口集成电路AN6361N 色度信号处理集成电路AN6367NK 色度信号处理集成电路AN6371S 自动相位控制集成电路AN6387 电机伺服控制集成电路AN6550 卡拉OK音频放大集成电路AN6554 四运算放大集成电路AN6561 双运算放大集成电路AN6562SG 双运算放大集成电路AN6609N 电机驱动集成电路AN6612 电机稳速控制集成电路AN6650 电机速度控制集成电路AN6651 电机速度控制集成电路AN6652 电机稳速控制集成电路AN6875 发光二极管五位显示驱动集成电路 AN6877 发光二极管七位显示驱动集成电路 AN6884 发光二极管五位显示驱动集成电路 AN6886 发光二极管五位显示驱动集成电路 AN6888 发光二极管显示驱动集成电路AN6914 双电压比较集成电路25AN7085N5 单片录、放音集成电路AN7105 双声道音频功率放大集成电路AN7106K 双声道音频功率放大集成电路AN7108 单片立体声放音集成电路AN710S 单片放音集成电路AN7110E 音频功率放大集成电路AN7114 音频功率放大集成电路AN7116 音频功率放大集成电路AN7118 双声道音频功率放大集成电路AN7118S 双声道音频功率放大集成电路AN7120 音频功率放大集成电路AN7124 双声道音频功率放大集成电路AN7145 双声道音频功率放大集成电路AN7148 双声道音频功率放大集成电路AN7158N 音频功率放大7.5W×2集成电路 AN7161N 音频功率放大集成电路AN7164 双声道音频功率放大集成电路AN7171NK 音频功率放大集成电路AN7205 调频/调谐及高频放大集成电路 AN7220 调频/调幅中频放大集成电路AN7222 调频/调幅中频放大集成电路AN7223 调频/调幅中频放大集成电路AN7226 调频/调幅中频放大集成电路AN7256 调频/调谐及中频放大集成电路 AN7311 双声道前置放大集成电路AN7312 双声道前置放大集成电路AN7315 双声道前置放大集成电路AN7315S 双声道前置放大集成电路AN7320 音频前置放大集成电路AN7396K 双声道前置放大集成电路26AN7397K 双声道前置放大集成电路AN7410 调频立体声多路解码集成电路AN7414 调频立体声解码集成电路AN7420N 调频立体声解码集成电路AN7470 调频立体声解码集成电路AN7805 三端电源稳压＋5V/1A集成电路 AN7806 三端电源稳压＋6V/1A集成电路 AN7807 三端电源稳压＋7V/1A集成电路 AN7808 三端电源稳压＋8V/1A集成电路 AN7809 电源稳压＋9V/1A集成电路AN7810 三端电源稳压＋10V/1A集成电路 AN7812 三端电源稳压＋12V/1A集成电路 AN7815 三端电源稳压＋15V/1A集成电路 AN7818 三端电源稳压＋18V/1A集成电路AN7824 三端电源稳压＋24V/1A集成电路AN78L05 三端电源稳压＋5V/0.1A集成电路AN78L06 三端电源稳压＋6V/0.1A集成电路AN78L08 三端电源稳压＋8V/0.1A集成电路AN78L09 三端电源稳压＋9V/0.1A集成电路AN78L10 三端电源稳压＋10V/0.1A集成电路 AN78L12 三端电源稳压＋12V/0.1A集成电路 AN78L15 三端电源稳压＋15V/0.1A集成电路 AN78L18 三端电源稳压＋18V/0.1A集成电路 AN78L20 三端电源稳压＋20V/0.1A集成电路 AN78L24 三端电源稳压＋24V/0.1A集成电路 AN78M05 三端电源稳压＋5V/0.5A集成电路AN78M06 三端电源稳压＋6V/0.5A集成电路AN78M08 三端电源稳压＋8V/0.5A集成电路AN78M09 三端电源稳压＋9V/0.5A集成电路27AN78M10 三端电源稳压＋10V/0.5A集成电路 AN78M12 三端电源稳压＋12V/0.5A集成电路 AN78M15 三端固定式稳压＋15V/0.5A集成电路 AN78M18 三端电源稳压＋18V/0.5A集成电路 AN78M20 三端电源稳压＋20V/0.5A集成电路 AN78M24 三端电源稳压＋24V/0.5A集成电路 AN7905 三端电源稳压－5V/1A集成电路AN7906 三端电源稳压－6V/1A集成电路AN7908T 三端电源稳压－8V/1A集成电路AN7909T 三端电源稳压－9V/1A集成电路AN7910T 三端电源稳压－10V/1A集成电路AN7912 三端电源稳压－12V/1A集成电路AN7915 三端电源稳压－15V/1A集成电路AN7918 三端电源稳压－18V/1A集成电路AN7920 三端电源稳压－20V/1A集成电路AN7924 三端电源稳压－24V/1A集成电路AN79L05 三端电源稳压－5V/0.1A集成电路AN79L06 三端电源稳压－6V/0.1A集成电路AN79L08 三端电源稳压－8V/0.1A集成电路AN79L09 三端电源稳压－9V/0.1A集成电路AN79L10 三端电源稳压－10V/0.1A集成电路 AN79L12 三端电源稳压－12V/0.1A集成电路 AN79L15 三端电源稳压－15V/0.1A集成电路 AN79L18 三端电源稳压－18V/0.1A集成电路 AN79L20 三端电源稳压－20V/0.1A集成电路 AN79L24 三端电源稳压－24V/0.1A集成电路 AN79M05 三端电源稳压－5V/0.5A集成电路AN79M08 三端电源稳压－8V/0.5A集成电路 AN79M09 三端电源稳压－9V/0.5A集成电路28AN79M10 三端电源稳压－10V/0.5A集成电路 AN79M12 三端电源稳压－12V/0.5A集成电路 AN79M15 三端电源稳压－15V/0.5A集成电路 AN79M18 三端电源稳压－18V/0.5A集成电路 AN79M20 三端电源稳压－20V/0.5A集成电路 AN79M24 三端电源稳压－24V/0.5A集成电路 AN8028 自激式开关电源控制集成电路AN8270K 主轴电机控制集成电路AN8280 电机驱动集成电路AN8281S 电机驱动集成电路AN8290S 主轴电机驱动集成电路AN8355S 条形码扫描接收集成电路AN8370S 光电伺服控制集成电路AN8373S 射频伺服处理集成电路AN8375S 伺服处理集成电路AN8389S－E1 电机驱动集成电路AN8480NSB 主轴电机驱动集成电路AN8481SB－E1 主轴电机驱动集成电路AN8482SB 主轴电机驱动集成电路AN8623FBQ 主轴伺服处理集成电路AN8788FB 电机驱动集成电路AN8802CE1V 伺服处理集成电路AN8813NSBS 主轴电机驱动集成电路AN8819NFB 伺服驱动、直流交换集成电路AN8824FBQ 前置放大集成电路AN8825NFHQ－V 聚焦、循迹误差处理集成电路AN8831SC 视频预视放集成电路AN8832SB－E1 射频放大、伺服处理集成电路AN8837SB－E1 伺服处理集成电路AN89C2051－24PC 微处理集成电路29APU2400U 音频信号处理集成电路APU2470 音频信号处理集成电路AS4C14405－60JC 动态随机存储1M×4集成电路AS4C256K16ED－60JC 存储集成电路ASD0204－015 图文控制集成电路ASD0204GF－022－3BA显示控制集成电路AT24C08 存储集成电路AT24C08A 存储集成电路AT24C256－10CI 码片集成电路AT27C010 电可改写编程只读存储集成电路 AT27C020 存储集成电路ATMEL834 存储集成电路AVM－1 视频信号处理厚膜集成电路AVM－2 音频信号处理厚膜集成电路AVSIBCP08 倍压整流切换集成电路B0011A 存储集成电路B1218 电子快门控制集成电路BA033T 三端电源稳压＋3.3V集成电路 BA10324 四运算放大集成电路BA10393N 双运算放大集成电路BA1102F 杜比降噪处理集成电路BA1106F 杜比降噪处理集成电路BA12ST 电源稳压集成电路BA1310 调频立体声解码集成电路BA1332L 调频立体声解码集成电路BA1350 调频立体声解码集成电路BA1351 调频立体声解码集成电路BA1356 调频立体声解码集成电路BA1360 调频立体声解码集成电路BA15218N 双运算放大集成电路30BA225 可触发双单稳态振荡集成电路 BA302 音频前置放大集成电路BA311 音频前置放大集成电路BA313 音频前置放大集成电路BA3283 单片放音集成电路BA328F 双声道前置放大集成电路BA329 双声道前置放大集成电路BA3304F 录放音前置均衡放大集成电路 BA3306 音频、前置放大集成电路BA3312N 话筒信号前置放大集成电路BA3313L 自动音量控制集成电路BA3314 话筒信号前置放大集成电路BA335 自动选曲集成电路BA336 自动选曲集成电路BA340 音频前置放大集成电路BA3402F 双声道前置放大集成电路BA3404F 自返转放音集成电路BA3416BL 双声道前置放大集成电路BA343 双声道前置放大集成电路BA3503F 双声道前置放大集成电路BA3506 单片放音集成电路BA3513FS 单片放音集成电路BA3706 自动选曲集成电路BA3707 录音带曲间检测集成电路BA3812L 五频段音调补偿集成电路BA3818F 电压比较运放集成电路BA3822LS 双声道五频段显示均衡集成电路BA3828 电子选台预置集成电路BA3880 音频处理集成电路31BA401 调频中频放大集成电路BA402 调频中频放大集成电路BA4110 调频中频放大集成电路BA4234L 调频中频放大集成电路BA4402 调频调谐收音集成电路BA4403 调频高频放大、混频、本振集成电路 BA4560 双运算放大集成电路BA5096 数字混响集成电路BA5102A 音频功率放大集成电路BA514 音频功率放大集成电路BA516 音频功率放大集成电路BA5208AF 音频功率放大集成电路BA532 音频功率放大集成电路BA534 音频功率放大集成电路BA5406 双声道音频功率放大集成电路BA5412 音频功率放大集成电路BA547 音频功率放大1.5W集成电路BA5912AFP－YE2 电机驱动、倾斜、加载集成电路BA5981FP－E2 聚焦、循迹驱动集成电路BA5983FB 四通道伺服驱动集成电路BA5983FM－E2 电机驱动集成电路BA6104 发光二极管五位显示驱动集成电路 BA6107A 电机伺服控制集成电路BA6109 加载电机驱动集成电路BA6125 发光二极管五位显示驱动集成电路 BA6137 发光二极管五位显示驱动集成电路 BA6191 音频控制集成电路BA6196FP 伺服驱动集成电路BA6208 电机驱动集成电路BA6208D 电机驱动集成电路32BA6209 电机驱动集成电路BA6209N 双向驱动电机集成电路BA6209U 电机双向驱动集成电路BA6218 加载电机驱动集成电路BA6219B 电机驱动集成电路BA6227 电机稳速控制集成电路BA6238 电机驱动集成电路BA6239 电机双向驱动集成电路BA6239A 电机双向驱动集成电路BA6246M 加载、转盘电机驱动集成电路BA6248 电机驱动集成电路BA6286 电机驱动集成电路BA6287 电机驱动集成电路BA6290 电机驱动集成电路BA6295AFP－E2 加载、倾斜驱动集成电路BA6296FP 电机速度控制集成电路BA6297AFP 伺服驱动集成电路BA6302A 电机伺服控制集成电路BA6305 控制放大集成电路BA6305F 控制放大集成电路BA6308 电子开关切换集成电路BA6321 电机伺服控制集成电路BA6392 伺服驱动集成电路BA6395 主轴电机驱动集成电路BA6396FP 伺服驱动集成电路BA6411 电机驱动集成电路BA6435S 主轴电机驱动集成电路BA6459P1 电机驱动集成电路BA6570FP－E2 聚焦、循迹驱动集成电路33BA6664FM 三相主电机驱动集成电路BA6791FP 四通道伺服驱动集成电路BA6796FP 电机驱动集成电路BA6810S 音频显示驱动集成电路BA6844AFP－E2 三相主电机驱动集成电路BA6849FP 主轴电机驱动集成电路BA689 发光二极管十二位显示驱动集成电路 BA6893KE2 直流变换驱动集成电路BA6956AN 加载电机驱动集成电路BA6993 双运算放大集成电路BA7001 音频切换集成电路BA7004 测试信号发生集成电路BA7005AL 射频调制集成电路BA7007 信号检测集成电路BA7021 视频信号选择集成电路BA7024 视频信号测试集成电路BA7025L 信号检测集成电路BA7042 振荡集成电路BA7047 调频检波集成电路BA7048N 包络信号检测集成电路BA7106LS 检测信号控制集成电路BA7180FS 磁头信号放大集成电路BA7212S 磁头信号放大集成电路BA7253S 磁头信号放大集成电路BA7254S 四磁头信号放大集成电路BA7258AS 亮度信号处理集成电路BA7264S 视频信号处理集成电路BA7274S 磁头信号放大集成电路BA7357S 中频放大集成电路BA7604N 电子开关切换集成电路34BA7606F 色差信号切换集成电路BA7655 色度信号处理集成电路BA7665FS－E2 视频输出放大集成电路BA7725FS 混响立体声放大集成电路BA7725S 信号压缩及扩展处理集成电路BA7743FS 磁头信号放大集成电路BA7751ALS 音频信号录放处理集成电路BA7752LS 音频信号处理集成电路BA7755 磁头开关集成电路BA7755AF－E2 磁头开关集成电路BA7765AS 音频信号处理集成电路BA7766SA 音频信号处理集成电路BA7767AS 音频信号处理集成电路BA7797F 音频信号处理集成电路BA8420 特技控制处理集成电路BAL6309 场同步信号发生集成电路BH3866AS 音频、色度信号前置放大集成电路 BH4001 微处理集成电路BH7331P 音频功率放大集成电路BH7770KS 音频信号处理集成电路BL3207 亮度延时集成电路BL3208B 音频延迟混响集成电路BL5132 中频放大集成电路BL54573 电子调频波段转换集成电路BL5612 视频放大、色差矩阵集成电路BM5060 微处理集成电路BM5061 字符发生集成电路BM5069 微处理集成电路BN5115 图像中频放大集成电路BOC31F 单片微处理集成电路35BP5020 视频电源转换集成电路BT852 视频编码集成电路BT864 视频编码集成电路BT866PQFP 微处理集成电路BU12102 时序信号发生解码集成电路BU2092F 扩展集成电路BU2185F 同步信号处理集成电路BU2285FV 时钟信号发生集成电路BU2820 伺服控制集成电路BU2841FS 视频、蓝背景信号发生集成电路 BU2872AK 操作系统控制、屏显驱动集成电路 BU3762AF 红外遥控信号发射集成电路BU4053B 电子开关切换集成电路BU5814F 红外遥控信号发射集成电路BU5994F 红外遥控信号发射集成电路BU6198F 屏幕显示集成电路BU9252F 音频延时集成电路BU9252S 数/模转换集成电路BU9253FS 话筒音频混响集成电路BX1303 音频功率放大集成电路BX1409 红外遥控信号接收集成电路BX7506 主轴电机电源控制集成电路C1363CA 红外遥控电子选台集成电路C1490HA 红外遥控信号接收集成电路C187 分配、十进制计数集成电路C301 译码BCD－10段集成电路C68639Y 微处理集成电路C75P036 微处理集成电路CA0002 调幅模拟声解调集成电路CA2004 音频功率放大集成电路36CA2006 音频功率放大集成电路CA270AW 视频检波放大集成电路CA3075 调频中频放大集成电路CA3089 调频中频放大集成电路CA3120E 视频信号处理集成电路CA3140 运算放大集成电路CA810 音频功率放大集成电路CA920 行扫描信号处理集成电路CAS126 天线开关集成电路CAT24C16 电可改写编程只读存储集成电路 CAT35C104HP 存储集成电路CC4000 或非门双3输入集成电路。

模拟器件TI半导体TI数字信号处理德州仪器处理器宽带RFIF和数字音频广播

LM2903DR TI2,500茂百兴LM2903PWR TI2,000茂百兴LM3S1601-IQC50-A2T TI1,000茂百兴LM3S1607-IQR50-A0T TI1,500茂百兴LM3S1911-IQC50-A2T TI1,000茂百兴LM3S1968-IQC50-A2T TI1,000茂百兴LM3S2793-IQC80-C3T TI1,000茂百兴LM3S2965-IQC50-A2T TI1,000茂百兴LM3S3749-IQC50-A0T TI1,000茂百兴LM3S6911-IQC50-A2T TI1,000茂百兴LM3S9B90-IQC80-C3T TI1,000茂百兴LM3S9B92-IQC80-C1TI90茂百兴LM3S9B92-IQC80-C3TI90茂百兴LM4040C50IDBZR TI3,000茂百兴LM4041C12IDCKR TI3,000茂百兴LMV321IDBVR TI3,000茂百兴LMV324IPWR TI2,000茂百兴LMV331IDCKR TI3,000茂百兴LT1013DDR TI2,500茂百兴MAX3221CDBR TI2,000茂百兴MAX3221CPWR TI2,000茂百兴MAX3221IPWR TI2,000茂百兴MAX3223ECDBR TI2,000茂百兴MAX3232CDBR TI2,000茂百兴MAX3232CPWR TI2,000茂百兴MAX3232ECDBR TI2,000茂百兴MAX3232IPWR TI2,000茂百兴MAX3238EIPWR TI2,000茂百兴MAX3243CDBR TI2,000茂百兴MAX3243CPWR TI2,000茂百兴MAX3243ECDBR TI2,000茂百兴MAX3243ECPWR TI2,000茂百兴MSC1211Y5PAGR TI1,500茂百兴MSP430F1232IPWR TI2,000茂百兴MSP430F135IPMR TI1,000茂百兴MSP430F149IPMR TI1,000茂百兴MSP430F1611IPMR TI1,000茂百兴MSP430F1612IPMR TI1,000茂百兴MSP430F169IPMR TI1,000茂百兴MSP430F2001IPWR TI2,000茂百兴MSP430F2011TPWR TI2,000茂百兴MSP430F2132IPMR TI2,000茂百兴MSP430F2232IDAR TI2,000茂百兴MSP430F2252IRHAR TI2,500茂百兴MSP430F413IPMR TI1,000茂百兴MSP430F4250IRGZR TI2,500茂百兴MSP430F5418IPNR TI1,000茂百兴ONET1101LRGER TI3,000茂百兴ONET8501PRGTR TI3,000茂百兴ONET8501VRGPR TI3,000茂百兴OPA2131UA TI2,500茂百兴OPA2132UA TI2,500茂百兴OPA2134UA TI2,500茂百兴OPA2227UA TI2,500茂百兴OPA2244EA TI2,500茂百兴OPA2277UA TI2,500茂百兴OPA2335AIDR TI2,500茂百兴OPA2343EA/2K5TI2,500茂百兴OPA2348AIDCNR TI3,000茂百兴OPA2348AIDR TI3,000茂百兴OPA2349EA/3K TI3,000茂百兴OPA2350UA TI2,500茂百兴OPA2354AIDGKR TI2,500茂百兴OPA2357AIDGSR TI2,500茂百兴OPA2364AIDGKR TI2,500茂百兴OPA2364IDGKR TI2,500茂百兴OPA277AIDRMR TI3,000茂百兴OPA277U TI2,500茂百兴OPA277UA TI2,500茂百兴OPA334AIDBVR TI3,000茂百兴OPA335AIDBVR TI3,000茂百兴OPA336N TI3,000茂百兴OPA340UA/2K5TI2,500茂百兴OPA348AIDBVR TI3,000茂百兴OPA361AIDCKR TI3,000茂百兴OPA374AIDBVR TI3,000茂百兴OPA376AIDBVR TI3,000茂百兴OPA4227UA/2K5TI2,500茂百兴OPA4340UA/2k5TI2,500茂百兴OPA846IDBVR TI3,000茂百兴PCI1510PGE TI60茂百兴PCI1520ZHK TI90茂百兴PCI2040PGE TI60茂百兴PCI2050BIPDV TI36茂百兴PCI2050BIZHK TI450茂百兴PCI2050BPDV TI360茂百兴PCI2050BZHK TI450茂百兴PCI2050IBPDV TI360茂百兴PCI2250PCM TI24茂百兴PCI8402ZHK TI90茂百兴PCI8412ZHK TI90茂百兴PCM1742KE/2K TI2,000茂百兴PCM1753DBQR TI2,000茂百兴PCM1754DBQR TI2,000茂百兴PCM1755DBQR TI2,000茂百兴PCM1808PWR TI2,000茂百兴PCM4104PFBR TI2,000茂百兴PCM4204PAPR TI1,500茂百兴PTH08T220WAZT TI250茂百兴PTH08T260WAZT TI250茂百兴REF3025AIDBZR TI3,000茂百兴REF3030AIDBZR TI3,000茂百兴REF3033AIDBZR TI3,000茂百兴SN65176BDR TI2,500茂百兴SN65220DBVR TI3,000茂百兴SN65240PWR TI2,000茂百兴SN65HVD10DR TI2,500茂百兴SN65HVD11DR TI2,500茂百兴SN65HVD230DR TI2,500茂百兴SN65HVD23DR TI2,500茂百兴SN65HVD251DR TI2,500茂百兴SN65HVD3082EDR TI2,500茂百兴SN65HVD3088EDGKR TI2,500茂百兴SN65HVD33DR TI2,500茂百兴SN65LVDS2DBVR TI3,000茂百兴SN65MLVD200ADR TI2,500茂百兴SN7406DR TI2,500茂百兴SN7407DR TI2,500茂百兴SN74ABTE16246DGGR TI2,000茂百兴SN74AC14PWR TI2,000茂百兴SN74AHC14PWR TI2,000茂百兴SN74AHC1G14DBVR TI3,000茂百兴SN74AHCT08DGVR TI2,000茂百兴SN74AHCT132DR TI2,500茂百兴SN74ALVC164245DLR TI1,000茂百兴SN74ALVCH162244GR TI2,000茂百兴SN74ALVCH162373GR TI2,000茂百兴SN74AUP1G125DCKR TI3,000茂百兴SN74AVC2T45DCUR 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TI2,000茂百兴SN74LVTH162244DGGR TI2,000茂百兴SN74LVTH16244ADGGR TI2,000茂百兴SN74LVTH16244ADLR TI1,000茂百兴SN74LVTH16245ADLR TI1,000茂百兴SN74LVTH244APWR TI2,000茂百兴SN75240PWR TI2,000茂百兴SN75ALS1178NSR TI2,000茂百兴SN75LBC176ADR TI2,500茂百兴TAS1020BPFBR TI1,000茂百兴TAS5707PHPR TI1,000茂百兴TFP410PAP TI160茂百兴THS7314DR TI2,500茂百兴THS7316DR TI2,500茂百兴THS7374IPWR TI2,000茂百兴THS8134BCPHP TI250茂百兴THS8200PFP TI96茂百兴TL16C2550PFBR TI1,000茂百兴TL16C550CIPTR TI1,000茂百兴TL16C550CPTR TI1,000茂百兴TL16C550CPTR TI1,000茂百兴TL16C554AFNR TI250茂百兴TL16C554AIPNR TI1,000茂百兴TL16C554APNR TI1,000茂百兴TL16C752BPTR TI1,000茂百兴TL431AIDBVR TI3,000茂百兴TL431IDBVR TI3,000茂百兴TL7705ACDR TI2,500茂百兴TL7712ACDR TI2,500茂百兴TLC1543CDWR TI2,000茂百兴TLC2252AIDR TI2,500茂百兴TLC2252CDR TI2,500茂百兴TLC2254IDR TI2,500茂百兴TLC2262CDR TI2,500茂百兴TLC2272CDR TI2,500茂百兴TLC2274ACDR TI2,500茂百兴TLC2543CDBR TI2,000茂百兴TLC2543CDWR TI2,000茂百兴TLC25M2CDR TI2,500茂百兴TLC3548IDWR TI2,000茂百兴TLC3548IPWR TI2,000茂百兴TLC3702IDR TI2,500茂百兴TLC5510INSR TI2,000茂百兴TLC555CDR TI2,500茂百兴TLC555IDR TI2,500茂百兴TLC5602CDWR TI2,000茂百兴TLC5946RHBR TI3,000茂百兴TLC7701IDR TI2,500茂百兴TLE2062ACDR TI2,500茂百兴TLE2072CDR TI2,500茂百兴TLK1501IRCPR TI1,000茂百兴TLV1543CDWR TI2,000茂百兴TLV2211IDBVR TI3,000茂百兴TLV2231IDBVR TI3,000茂百兴TLV2371IDBVR TI3,000茂百兴TLV2372IDGKR TI2,500茂百兴TLV2432AIDR TI2,500茂百兴TLV2442CDR TI2,500茂百兴TLV2462IDGKR TI2,500茂百兴TLV2556IPWR TI2,000茂百兴TLV272CDR TI2,500茂百兴TLV274CPWR TI2,000茂百兴TLV320AIC1106PWR TI2,000茂百兴TLV320AIC12IDBTR TI2,000茂百兴TLV320AIC3104IRHBR TI3,000茂百兴TLV320AIC31IRHBR TI3,000茂百兴TLV320AIC32IRHBR TI3,000茂百兴TLV320AIC33IZQER TI2,500茂百兴TLV431ACDBVR TI3,000茂百兴TMDS442PNPR TI1,000茂百兴TMP100NA TI3,000茂百兴TMP101NA TI3,000茂百兴TMP20AIDCKR TI3,000茂百兴TMP275AIDR TI2,500茂百兴TMP411ADR TI2,500茂百兴TMP75AIDGKR TI2,500茂百兴TMP75AIDR TI2,500茂百兴TMS320C32PCM50TI24茂百兴TMS320C6205ZHK200TI90茂百兴TMS320C6211BZFN167TI40茂百兴TMS320C6713BGDP225TI40茂百兴TMS320C6713BZDP225TI40茂百兴TMS320C6713BZDP300TI40茂百兴TMS320C6727BZDH300TI90茂百兴TMS320DM355ZCE216TI160茂百兴TMS320DM355ZCE270TI160茂百兴TMS320DM365ZCE27TI160茂百兴TMS320DM365ZCE30TI160茂百兴TMS320DM642AZDK6TI60茂百兴TMS320DM642AZDK7TI60茂百兴TMS320DM642AZNZ7TI40茂百兴TMS320DM6441AZWT TI90茂百兴TMS320DM6446AZWT TI90茂百兴TMS320DM6467TZUT1TI84茂百兴TMS320DM648ZUT9TI84茂百兴TMS320F28015PZA TI90茂百兴TMS320F2802PZA TI90茂百兴TMS320F2806PZA TI90茂百兴TMS320F2808PZA TI90茂百兴TMS320F2810PBKA TI90茂百兴TMS320F2811PBKA TI90茂百兴TMS320F2812GHHA TI160茂百兴TMS320F2812PGFA TI40茂百兴TMS320F28335PGFA TI40茂百兴TMS320LC549PGE-80TI60茂百兴TMS320LF2401AVFA TI250茂百兴TMS320LF2406APZA TI90茂百兴TMS320LF2407APGEA TI60茂百兴TMS320VC33PGE120TI60茂百兴TMS320VC33PGE150TI60茂百兴TMS320VC33PGEA120TI60茂百兴TMS320VC5402PGE100TI60茂百兴TMS320VC5409APGE16TI60茂百兴TMS320VC5409PGE80TI60茂百兴TMS320VC5410APGE16TI60茂百兴TMS32C6713BGDPA200TI40茂百兴TPA2005D1DRBR TI3,000茂百兴TPA2008D2PWPR TI2,000茂百兴TPA2010D1YZFR 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TI2,000茂百兴TPS54610PWPR TI2,000茂百兴TPS54612PWPR TI2,000茂百兴TPS54614PWPR TI2,000茂百兴TPS54616PWPR TI2,000茂百兴TPS54620RGYR TI3,000茂百兴TPS54672PWPR TI2,000茂百兴TPS54680PWPR TI2,000茂百兴TPS54910PWPR TI2,000茂百兴TPS54972PWPR TI2,000茂百兴TPS60150DRVR TI3,000茂百兴TPS60230RGTR TI3,000茂百兴TPS60231RGTR TI3,000茂百兴TPS60400DBVR TI3,000茂百兴TPS60403DBVR TI3,000茂百兴TPS60500DGSR TI2,500茂百兴TPS61020DRCR TI3,000茂百兴TPS61026DRCR TI3,000茂百兴TPS61030PWPR TI2,000茂百兴TPS61030RSAR TI2,000茂百兴TPS61032PWPR TI2,000茂百兴TPS61040DBVR TI3,000茂百兴TPS61041DBVR TI3,000茂百兴TPS61042DRBR TI3,000茂百兴TPS61045DRBR TI3,000茂百兴TPS61050YZGR TI3,000茂百兴TPS61070DDCR TI3,000茂百兴TPS61080DRCR TI3,000茂百兴TPS61081DRCR TI3,000茂百兴TPS61087DRCR TI3,000茂百兴TPS61090RSAR TI3,000茂百兴TPS61097-33DBVR TI3,000茂百兴TPS61160DRVR TI3,000茂百兴TPS61161DRVR TI3,000茂百兴TPS61165DRVR TI3,000茂百兴TPS62000DGSR TI2,500茂百兴TPS62040DGQR TI2,500茂百兴TPS62040DRCR TI3,000茂百兴TPS62046DGQR TI2,500茂百兴TPS62050DGSR TI2,500茂百兴TPS62060DSGR TI3,000茂百兴TPS62110RSAR TI3,000茂百兴TPS62111RSAR TI3,000茂百兴TPS62200DBVR TI3,000茂百兴TPS62201DBVR TI3,000茂百兴TPS62202DBVR TI3,000茂百兴TPS62203DBVR TI3,000茂百兴TPS62204DBVR TI3,000茂百兴TPS62260DDCR TI3,000茂百兴TPS62260DRVR TI3,000茂百兴TPS62290DRVR TI3,000茂百兴TPS62410DRCR TI3,000茂百兴TPS62510DRCR TI3,000茂百兴TPS62590DRVR TI3,000茂百兴TPS63000DRCR TI3,000茂百兴TPS63001DRCR TI3,000茂百兴TPS63020DSJR TI3,000茂百兴TPS63021DSJR TI3,000茂百兴TPS63030DSKR TI3,000茂百兴TPS63031DSKR TI3,000茂百兴TPS63700DRCR TI3,000茂百兴TPS64200DBVR TI3,000茂百兴TPS64202DBVR TI3,000茂百兴TPS65020RHAR TI2,500茂百兴TPS65021RHAR TI2,500茂百兴TPS65023RSBR TI3,000茂百兴TPS650243RHBR TI3,000茂百兴TPS65053RGER TI3,000茂百兴TPS65120RGTR TI3,000茂百兴TPS65150PWPR TI2,000茂百兴TPS65251RHAR TI2,500茂百兴TPS65920BZCHR TI2,000茂百兴TPS65930BZCHR TI1,000茂百兴TPS6755IDR TI2,500茂百兴TPS70102PWPR TI2,000茂百兴TPS70302PWPR TI2,000茂百兴TPS7101QDR TI2,500茂百兴TPS71501DCKR TI3,000茂百兴TPS71530DCKR TI3,000茂百兴TPS71533DCKR TI3,000茂百兴TPS71550DCKR TI3,000茂百兴TPS71701DCKR TI3,000茂百兴TPS72301DBVR TI3,000茂百兴TPS72501DCQR TI2,500茂百兴TPS72515DCQR TI2,500茂百兴TPS73018DBVR TI3,000茂百兴TPS73033DBVR TI3,000茂百兴TPS73101DBVR TI3,000茂百兴TPS73115DBVR TI3,000茂百兴TPS73130DBVR TI3,000茂百兴TPS73133DBVR TI3,000茂百兴TPS73201DBVR TI3,000茂百兴TPS73601DBVR TI3,000茂百兴TPS73601DCQR TI3,000茂百兴TPS73633DRBR TI3,000茂百兴TPS73701DCQR TI2,500茂百兴TPS73701DRBR TI3,000茂百兴TPS74401RGWR TI3,000茂百兴TPS74701DRCR TI3,000茂百兴TPS74801DRCR TI3,000茂百兴TPS75201QPWPR TI2,000茂百兴TPS76050DBVR TI3,000茂百兴TPS76301DBVR TI3,000茂百兴TPS76318DBVR TI3,000茂百兴TPS76333DBVR TI3,000茂百兴TPS76350DBVR TI3,000茂百兴TPS76633DR TI2,500茂百兴TPS76650DR TI2,500茂百兴TPS76701QPWPR TI2,000茂百兴TPS767D318PWPR TI2,000茂百兴TPS76801QDR TI2,500茂百兴TPS76933DBVR TI3,000茂百兴TPS77601PWPR TI2,000茂百兴TPS77633DR TI2,500茂百兴TPS77701PWPR TI2,000茂百兴TPS77801PWPR TI2,000茂百兴TPS78833DBVR TI3,000茂百兴TPS79101DBVR TI3,000茂百兴TPS79301DBVR TI2,500茂百兴TPS79318DBVR TI3,000茂百兴TPS793285DBVR TI3,000茂百兴TPS79328DBVR TI3,000茂百兴TPS79330DBVR TI3,000茂百兴TPS79333DBVR TI3,000茂百兴TPS79501DCQR TI2,500茂百兴TPS79533DCQR TI2,500茂百兴TPS79633DCQR TI2,500茂百兴TPS79730DCKR TI3,000茂百兴TPS79901DDCR TI3,000茂百兴TS3USB221DRCR TI3,000茂百兴TS5A3167DBVR TI3,000茂百兴TSB12LV26PZT TI90茂百兴TSB43AB22APDT TI90茂百兴TSC2003IPWR TI2,500茂百兴TSC2007IPWR TI2,000茂百兴TSC2007IYZGR TI3,000茂百兴TSC2017IYZGR TI3,000茂百兴TSC2046IPWR TI2,500茂百兴TUSB2046BIVFR TI1,000茂百兴TUSB2046BVFR TI1,000茂百兴TUSB3200ACPAHR TI1,500茂百兴TUSB3410VF TI250茂百兴TVP5150AM1PBSR TI1,000茂百兴TVP5154APNPR TI1,000茂百兴TVP5158IPNPR TI1,000茂百兴TVP5158PNPR TI1,000茂百兴UC2637DWTR TI2,000茂百兴UC2825ADWTR TI2,000茂百兴UC2842AD8TR TI2,500茂百兴UC2843AD8TR TI2,500茂百兴UC2844AD8TR TI2,500茂百兴UC3637DWTR TI2,000茂百兴UC3825ADWTR TI2,000茂百兴UC3843AD8TR TI2,500茂百兴UC3845AD8TR TI2,500茂百兴UC3845AN TI50茂百兴UC3846DWTR TI2,000茂百兴UC3846N TI25茂百兴UC3854AN TI25茂百兴UC3854BDWTR TI2,000茂百兴UC3854N TI25茂百兴UC3902DTR TI2,500茂百兴UCC27223PWPR TI2,000茂百兴UCC27324DGNR TI2,500茂百兴UCC27324DR TI2,500茂百兴UCC27423DR TI2,500茂百兴UCC27424DR TI2,500茂百兴UCC2800DTR TI2,500茂百兴UCC28060DR TI2,500茂百兴UCC28061DR TI2,500茂百兴UCC28070PWR TI2,000茂百兴UCC2808APWTR-2TI2,000茂百兴UCC2809DTR-1TI2,500茂百兴UCC2809PTR-1TI2,500茂百兴UCC2818DTR TI2,500茂百兴UCC28600DR TI2,500茂百兴UCC2891PWR TI2,000茂百兴UCC2894DR TI2,500茂百兴UCC2895DWTR TI2,000茂百兴UCC2897APWR TI2,000茂百兴UCC28C43DR TI2,500茂百兴UCC28C44DR TI2,500茂百兴UCC28C45DR TI2,500茂百兴UCC37324DGNR TI2,500茂百兴UCC3801DTR TI2,500茂百兴UCC3807DTR-3TI2,500茂百兴UCC3808DTR-2TI2,500茂百兴UCC3818PWTR TI2,000茂百兴UCC3895DWTR TI2,000茂百兴UCC3895PWTR TI2,000茂百兴UCC3919DTR TI2,500茂百兴UCC3946DTR TI2,500茂百兴ULN2003ADR TI2,500茂百兴ULN2003AIDR TI2,500茂百兴ULN2003AN TI25茂百兴XIO1100GGB TI160茂百兴XTR116UA/2K5TI2,500茂百兴。

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small changes could cause the device not to meet its published specifications.

德州仪器(TI)LM3S1960系列规格书,Datasheet 资料

S T E L L A R I S E R R A T AStellaris ®LM3S1960RevA2ErrataThis document contains known errata at the time of publication for the Stellaris LM3S1960microcontroller.The table below summarizes the errata and lists the affected revisions.See the data sheet for more details.See also the ARM®Cortex™-M3errata,ARM publication number PR326-PRDC-009450v2.0.Table 1.Revision HistoryDescription Revision Date ■Added issue “Standard R-C network cannot be used on RST to extend POR timing”on page 5.■Clarified issue “General-purpose timer 16-bit Edge Count or Edge Time mode does not load reload value”on page 8to include Edge-Time mode.3.0August 2011■Added issue “Hibernation module does not operate correctly”on page 6,replacing previous Hibernation module errata items.■Minor edits and clarifications.2.10September 2010■Added issue “The RTRIS bit in the UARTRIS register is only set when the interrupt is enabled”on page 9.2.9July 2010■Added issue “External reset does not reset the XTAL to PLL Translation (PLLCFG)register”on page 5.2.8June 2010■Removed issue "Hibernation Module 4.194304-MHz oscillator supports a limited range of crystal load capacitance values"as it does not apply to this part.■Minor edits and clarifications.2.7May 2010■Removed issue "Writes to Hibernation module registers sometimes fail"as it does not apply to this part.■Added issue "Hibernation Module 4.194304-MHz oscillator supports a limited range of crystal load capacitance values."■Minor edits and clarifications.2.6April 2010■Removed issue "Setting Bit 7in I2C Master Timer Period (I2CMTPR)register may have unexpected results".The data sheet description has changed such that this is no longer necessary.■Minor edits and clarifications.2.5April 2010■Added issue “The General-Purpose Timer match register does not function correctly in 32-bit mode”on page 8.■Added issue "Setting Bit 7in I2C Master Timer Period (I2CMTPR)register may have unexpected results".2.4February 2010■"Hard Fault possible when waking from Sleep or Deep-Sleep modes and Cortex-M3Debug Access Port (DAP)is enabled"has been removed and the content added to the LM3S1960data sheet.2.3Jan 2010Started tracking revision history.2.2Dec 2009Stellaris LM3S1960A2Errata Table2.List of ErrataStellaris LM3S1960A2Errata1JTAG and Serial Wire Debug1.1JTAG pins do not have internal pull-ups enabled at power-on resetDescription:Following a power-on reset,the JTAG pins TRST,TCK,TMS,TDI,and TDO(PB7and PC[3:0])donot have internal pull-ups enabled.Consequently,if these pins are not driven from the board,twothings may happen:■The JTAG port may be held in reset and communication with a four-pin JTAG-based debugger may be intermittent or impossible.■The receivers may draw excess current.Workaround:There are a number of workarounds for this problem,varying in complexity and impact:1.Add external pull-up resistors to all of the affected pins.This workaround solves both issues ofJTAG connectivity and current consumption.2.Add an external pull-up resistor to TRST.Firmware should enable the internal pull-ups on theaffected pins by setting the appropriate PUE bits of the appropriate GPIO Pull-Up Select(GPIOPUR)registers as early in the reset handler as possible.This workaround addresses theissue of JTAG connectivity,but does not address the current consumption other than to limitthe affected period(from power-on reset to code execution).3.Pull-ups on the JTAG pins are unnecessary for code loaded via the SWD interface or via theserial boot loader.Loaded firmware should enable the internal pull-ups on the affected pins bysetting the appropriate PUE bits of the appropriate GPIOPUR registers as early in the resethandler as possible.This method does not address the current consumption other than to limitthe affected period(from power-on reset to code execution).Silicon Revision Affected:A21.2JTAG INTEST instruction does not workDescription:The JTAG INTEST(Boundary Scan)instruction does not properly capture data.Workaround:None.Silicon Revision Affected:A2Stellaris LM3S1960A2Errata2System Control2.1Clock source incorrect when waking up from Deep-Sleep mode insome configurationsDescription:In some clocking configurations,the core prematurely starts executing code before the main oscillator(MOSC)has stabilized after waking up from Deep-Sleep mode.This situation can cause undesirablebehavior for operations that are frequency dependent,such as UART communication.This issue occurs if the system is configured to run off the main oscillator,with the PLL bypassedand the DSOSCSRC field of the Deep-Sleep Clock Configuration(DSLPCLKCFG)register set touse the internal12-MHz oscillator,30-KHz internal oscillator,or32-KHz external oscillator.Whenthe system is triggered to wake up,the core should wait for the main oscillator to stabilize beforestarting to execute code.Instead,the core starts executing code while being clocked from thedeep-sleep clock source set in the DSLPCLKCFG register.When the main oscillator stabilizes,theclock to the core is properly switched to run from the main oscillator.Workaround:Run the system off of the main oscillator(MOSC)with the PLL enabled.In this mode,the clocksare switched at the proper time.If the main oscillator must be used to clock the system without the PLL,a simple wait loop at thebeginning of the interrupt handler for the wake-up event should be used to stall thefrequency-dependent operation until the main oscillator has stabilized.Silicon Revision Affected:A22.2PLL may not function properly at default LDO settingDescription:In designs that enable and use the PLL module,unstable device behavior may occur with the LDOset at its default of2.5volts or below(minimum of2.25volts).Designs that do not use the PLLmodule are not affected.Workaround:Prior to enabling the PLL module,it is recommended that the default LDO voltage setting of2.5Vbe adjusted to2.75V using the LDO Power Control(LDOPCTL)register.Silicon Revision Affected:A22.3I/O buffer5-V tolerance issueDescription:GPIO buffers are not5-V tolerant when used in open-drain mode.Pulling up the open-drain pinabove4V results in high current draw.Stellaris LM3S1960A2ErrataWorkaround:When configuring a pin as open drain,limit any pull-up resistor connections to the3.3-V power rail.Silicon Revision Affected:A22.4PLL Runs Fast When Using a3.6864-MHz CrystalDescription:If the PLL is enabled,and a3.6864-MHz crystal is used,the PLL runs4%fast.Workaround:Use a different crystal whose frequency is one of the other allowed crystal frequencies(see thevalues shown for the XTAL bit in the RCC register).Silicon Revision Affected:A22.5External reset does not reset the XTAL to PLL Translation(PLLCFG)registerDescription:Performing an external reset(anything but power-on reset)reconfigures the XTAL field in theRun-Mode Clock Configuration(RCC)register to the6MHz setting,but does not reset the XTALto PLL Translation(PLLCFG)register to the6MHz setting.Consider the following sequence:1.Performing a power-on reset results in XTAL=6MHz and PLLCFG=6MHz2.Write an8MHz value to the XTAL field results in XTAL=8MHz and PLLCFG=8MHz3.RST asserted results in XTAL=6MHz and PLLCFG=8MHzIn the last step,PLLCFG was not reset to its6MHz setting.If this step is followed by enabling thePLL to run from an attached6-MHz crystal,the PLL then operates at300MHz instead of400MHz.Subsequently configuring the XTAL field with the8MHz setting does not change the setting ofPLLCFG.Workaround:Set XTAL in PLLCFG to an incorrect value,and then to the desired value.The second changeupdates the register correctly.Do not enable the PLL until after the second change.Silicon Revision Affected:A22.6Standard R-C network cannot be used on RST to extend POR timingDescription:The standard R-C network on RST does not work to extend POR timing beyond the10ms on-chipPOR.Instead of following the standard capacitor charging curve,RST jumps straight to3V at powerStellaris LM3S1960A2Errataon.The capacitor is fully charged by current out of the RST pin and does not extend or filter thepower-on condition.As a result,the reset input is not extended beyond the POR.Workaround:Add a diode to block the output current from RST.This helps to extend the RST pulse,but alsomeans that the R-C is not as effective as a noise filter.Silicon Revision Affected:A23Hibernation Module3.1Hibernation module does not operate correctlyDescription:The Hibernation module on this microcontroller does not operate correctly.Workaround:This errata item does not apply to many Stellaris devices,including the LM3S1166,LM3S1636,LM3S1969,and LM3S2919.Refer to the Stellaris Product Selector Guide(/stellaris_search)and Errata documents to find an alternative microcontroller that meetsthe design requirements for your application.Silicon Revision Affected:A24Flash Controller4.1MERASE bit of the FMC register does not erase the entire FlasharrayDescription:The MERASE bit of the Flash Memory Control(FMC)register does not erase the entire Flash array.If the contents of the Flash Memory Address(FMA)register contain a value less than0x20000,only the first128KB of the Flash array are erased.If bit17(value of0x20000)is set,then only theupper address range of Flash(greater than128KB)is erased.Workaround:If the entire array must be erased,the following sequence is recommended:1.Write a value of0x00000000to the FMA register.2.Write a value of0xA4420004to the FMC register,and poll bit2until it is cleared.3.Write a value of0x00020000to the FMA register.4.Write a value of0xA4420004to the FMC register,and poll bit2until it is cleared.The entire array can also be erased by individually erasing all of the pages in the array.Stellaris LM3S1960A2ErrataSilicon Revision Affected:A25GPIO5.1GPIO input pin latches in the Low state if pad type is open drainDescription:GPIO pins function normally if configured as inputs and the open-drain configuration is disabled.Ifopen drain is enabled while the pin is configured as an input using the GPIO Alternate FunctionSelect(GPIOAFSEL),GPIO Open Drain Select(GPIOODR),and GPIO Direction(GPIODIR)registers,then the pin latches Low and excessive current(into pin)results if an attempt is made todrive the pin High.The open-drain device is not controllable.A GPIO pin is not normally configured as open drain and as an input at the same time.A user maywant to do this when driving a signal out of a GPIO open-drain pad while configuring the pad as aninput to read data on the same pin being driven by an external device.Bit-banging a bidirectional,open-drain bus(for example,I2C)is an example.Workaround:If a user wants to read the state of a GPIO pin on a bidirectional bus that is configured as anopen-drain output,the user must first disable the open-drain configuration and then change thedirection of the pin to an input.This precaution ensures that the pin is never configured as an inputand open drain at the same time.A second workaround is to use two GPIO pins connected to the same bus signal.The first GPIOpin is configured as an open-drain output,and the second is configured as a standard input.Thisway the open-drain output can control the state of the signal and the input pin allows the user toread the state of the signal without causing the latch-up condition.Silicon Revision Affected:A25.2GPIO pins may glitch during power supply ramp upDescription:Upon completing a POR(power on reset)sequence,the GPIO pins default to a tri-stated inputcondition.However,during the initial ramp up of the external V DD supply from0.0V to3.3V,theGPIO pins are momentarily configured as output drivers during the time the internal LDO circuit isalso ramping up.As a result,a signal glitch may occur on GPIO pins before both the external V DDsupply and internal LDO voltages reach their normal operating conditions.This situation can occurwhen the V DD and LDO voltages ramp up at significantly different rates.The LDO voltage ramp-uptime is affected by the load capacitance on the LDO pin,therefore,it is important to keep this loadat a nominal1µF value as recommended in the data sheet.Adding significant more capacitanceloading beyond the specification causes the time delay between the two supply ramp-up times togrow,which possibly increases the severity of the glitching behavior.Workaround:Ensuring that the V DD power supply ramp up is a fast as possible helps minimize the potential forGPIO glitches.Follow guidelines for LDO pin capacitive loading documented in the electrical sectionStellaris LM3S1960A2Errataof the data sheet.System designers must ensure that,during the V DD supply ramp-up time,possibleGPIO pin glitches can cause no adverse effects to their systems.Silicon Revision Affected:A26General-Purpose Timers6.1General-purpose timer Edge Count mode count error when timeris disabledDescription:When a general-purpose timer is configured for16-Bit Input Edge Count Mode,the timer(A or B)erroneously decrements by one when the Timer Enable(TnEN)bit in the GPTM Control(GPTMCTL)register is cleared(the timer is disabled).Workaround:When the general-purpose timer is configured for Edge Count mode and software needs to“stop”the timer,the timer should be reloaded with the current count+1and restarted.Silicon Revision Affected:A26.2General-purpose timer16-bit Edge Count or Edge Time mode doesnot load reload valueDescription:In Edge Count or Edge Time mode,the input events on the CCP pin decrement the counter until thecount matches what is in the GPTM Timern Match(GPTMTnMATCHR)register.At that point,aninterrupt is asserted and then the counter should be reloaded with the original value and countingbegins again.However,the reload value is not reloaded into the timer.Workaround:Rewrite the GPTM Timern Interval Load(GPTMTnILR)register before restarting.Silicon Revision Affected:A26.3The General-Purpose Timer match register does not functioncorrectly in32-bit modeDescription:The GPTM Timer A Match(GPTMTAMATCHR)register triggers a match interrupt when the lower16bits match,regardless of the value of the upper16bits.Workaround:None.Stellaris LM3S1960A2ErrataSilicon Revision Affected:A27UART7.1The RTRIS bit in the UARTRIS register is only set when the interruptis enabledDescription:The RTRIS(UART Receive Time-Out Raw Interrupt Status)bit in the UART Raw Interrupt Status(UARTRIS)register should be set when a receive time-out occurs,regardless of the state of theenable RTIM bit in the UART Interrupt Mask(UARTIM)register.However,currently the RTIM bitmust be set in order for the RTRIS bit to be set when a receive time-out occurs.Workaround:For applications that require polled operation,the RTIM bit can be set while the UART interrupt isdisabled in the NVIC using the IntDisable(n)function in the StellarisWare Peripheral Driver Library,where n is21,22,or49depending whether UART0,UART1or UART2is used.With thisconfiguration,software can poll the RTRIS bit,but the interrupt is not reported to the NVIC.Silicon Revision Affected:A28PWM8.1PWM pulses cannot be smaller than dead-band timeDescription:The dead-band generator in the PWM module has undesirable effects when receiving input pulsesfrom the PWM generator that are shorter than the dead-band time.For example,providing a4-clock-wide pulse into the dead-band generator with dead-band times of20clocks(for both risingand falling edges)produces a signal on the primary(non-inverted)output that is High except for40clocks(the combined rising and falling dead-band times),and the secondary(inverted)output isalways Low.Workaround:User software must ensure that the input pulse width to the dead-band generator is greater thanthe dead-band delays.Silicon Revision Affected:A28.2PWM interrupt clear misses in some instancesDescription:It is not possible to clear a PWM generator interrupt in the same cycle when another interrupt fromthe same PWM generator is being asserted.PWM generator interrupts are cleared by writing a1to the corresponding bit in the PWM Interrupt Status and Clear(PWMnISC)register.If a write toclear the interrupt is missed because another interrupt in that PWM generator is being asserted,Stellaris LM3S1960A2Erratathe interrupt condition still exists,and the PWM interrupt routine is called again.System problemscould result if an interrupt condition was already properly handled the first time,and the softwaretries to handle it again.Note that even if an interrupt event has not been enabled in the PWMInterrupt and Trigger Enable(PWMnINTEN)register,the interrupt is still asserted in the PWMRaw Interrupt Status(PWMnRIS)register.Workaround:In most instances,performing a double-write to clear the interrupt greatly decreases the chancethat the write to clear the interrupt occurs on the same cycle as another interrupt.Because eachgenerator has six possible interrupt events,writing the PWMnISC register six times in a rowguarantees that the interrupt is cleared.If the period of the PWM is small enough,however,thismethod may not be practical for the application.Silicon Revision Affected:A28.3PWM generation is incorrect with extreme duty cyclesDescription:If a PWM generator is configured for Count-Up/Down mode,and the PWM Load(PWMnLOAD)register is set to a value N,setting the compare to a value of1or N-1results in steady state signalsinstead of a PWM signal.For example,if the user configures PWM0as follows:■PWMENABLE=0x00000001–PWM0Enabled■PWM0CTL=0x00000007–Debug mode enabled–Count-Up/Down mode–Generator enabled■PWM0LOAD=0x00000063–Load is99(decimal),so in Count-Up/Down mode the counter counts from zero to99and back down to zero(200clocks per period)■PWM0GENA=0x000000b0–Output High when the counter matches comparator A while counting up–Output Low when the counter matches comparator A while counting down■PWM0DBCTL=0x00000000–Dead-band generator is disabledIf the PWM0Compare A(PWM0CMPA)value is set to0x00000062(N-1),PWM0should output a2-clock-cycle long High pulse.Instead,the PWM0output is a constant High value.If the PWM0CMPA value is set to0x00000001,PWM0should output a2-clock-cycle long negative(Low)pulse.Instead,the PWM0output is a constant Low value.Stellaris LM3S1960A2ErrataWorkaround:User software must ensure that when using the PWM Count-Up/Down mode,the compare valuesmust never be1or the PWMnLOAD value minus one(N-1).Silicon Revision Affected:A28.4PWMINTEN register bit does not function correctlyDescription:In the PWM Interrupt Enable(PWMINTEN)register,the IntPWM0(bit0)bit does not functioncorrectly and has no effect on the interrupt status to the ARM Cortex-M3processor.This bit shouldnot be used.Workaround:PWM interrupts to the processor should be controlled with the use of the PWM0-PWM2Interruptand Trigger Enable(PWMnINTEN)registers.Silicon Revision Affected:A28.5Sync of PWM does not trigger"zero"actionDescription:If the PWM Generator Control(PWM0GENA)register has the ActZero field set to0x2,then theoutput is set to0when the counter reaches0,as expected.However,if the counter is cleared bysetting the appropriate bit in the PWM Time Base Sync(PWMSYNC)register,then the"zero"actionis not triggered,and the output is not set to0.Workaround:None.Silicon Revision Affected:A28.6PWM"zero"action occurs when the PWM module is disabledDescription:The zero pulse may be asserted when the PWM module is disabled.Workaround:None.Silicon Revision Affected:A2August04,2011/Rev.3.011Texas Instruments9QEI 9.1QEI index resets position when index is disabledDescription:When the QEI module is configured to not reset the position on detection of the index signal (thatis,the ResMode bit in the QEI Control (QEICTL)register is 0),the module resets the position whenthe index pulse occurs.The position counter should only be reset when it reaches the maximumvalue set in the QEI Maximum Position (QEIMAXPOS)register.Workaround:Do not rely on software to disable the index pulse.Do not connect the index pulse if it is not needed.Silicon Revision Affected:A29.2QEI hardware position can be wrong under certain conditionsDescription:The QEI Position (QEIPOS)register can be incorrect if the QEI is configured for quadrature phasemode (SigMode bit in QEICTL register =0)and to update the position counter of every edge ofboth PhA and PhB (CapMode bit in QEICTL register =1).This error can occur if the encoder isstepped in the reverse direction,stepped forward once,and then continues in the reverse direction.The following sequence of transitions on the PhA and PhB pins causes the error:PhBAssuming the starting position prior to the above PhA and PhB sequence is 0,the position after thefalling edge on PhB should be -3,however the QEIPOS register will show the position to be -1.Workaround:Configure the QEI to update the position counter on every edge on PhA only (CapMode bit in QEICTLregister =0).The effective resolution is reduced by 50%.If full resolution position detection is requiredby updating the position counter on every edge of both PhA and PhB ,no workaround is available.Hardware and software must take this into account.Silicon Revision Affected:A2August 04,2011/Rev.3.0Texas Instruments12Stellaris LM3S1960A2ErrataCopyright©2007-2011Texas Instruments Incorporated All rights reserved.Stellaris and StellarisWare are registered trademarks of Texas Instruments Incorporated.ARM and Thumb are registered trademarks and Cortex is a trademark of ARM Limited.Other names and brands may be claimed as the property of others.Texas Instruments Incorporated108Wild Basin,Suite350Austin,TX78746/stellaris/sc/technical-support/product-information-centers.htmAugust04,2011/Rev.3.0Texas Instruments13IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI 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TINA-TI使用说明中文版

1.h TI webpage ed TINA-TI version are:000/XPA–August 2007–RevisedAugust 2008Submit Documentation FeedbackZHCU008 –2007年8月–2008年8月修订TINA-TI™入门 1提交文档反1Overview This quick-start user's guide presents an overview of TINA-TI™,a powerful circuit design and simulation tool.TINA-TI is ideal for designing,testing,and troubleshooting a broad variety of basic and advanced circuits,including complex architectures,without any node or number of device limitations.This documentis intended to help new TINA-TI users start creating circuit simulations using the fundamental features of TINA-TI software in the shortest possible time.Contents 1Overview ......................................................................................................................12Schematic Editor .............................................................................................................23Building a Circuit with TINA-TI .............................................................................................34Analysis Capabilities ........................................................................................................65Test and Measurement .....................................................................................................96AdditionalAssistance ......................................................................................................10List of Figures 1DownloadingTINA-TI (2)2TINA-TI Schematic Editor Display .........................................................................................33Building a Circuit with TINA-TI .............................................................................................44Active and Passive Component Selection ................................................................................55Wiring Components Together ..............................................................................................66DC Analysis with Voltages/Currents Table Displayed ..................................................................77Additional TINA .....................................................................................88Virtual Instrumentation Testing (99)Contextual Help in TINA-TI ...............................................................................................10Texas Instruments has teamed up with DesignSoft,Inc.to provide our customers with TINA-TI,a powerful circuit simulation tool that is well-suited for simulating analog and switched-mode power supply (SMPS)circuits.The tool is ideal for helping designers and engineers to develop and test circuit ideas.TI selected the TINA™simulation software over other SPICE-based simulators for its combination of powerful analysis capabilities,simple and intuitive graphics-based interface,and ease of use,allowing you to be up and running in minimal time.If you are familiar with another SPICE simulator,adapting to TINA-TI should be an easy and straighforward transition.Although TINA-TI is a limited version of more powerful DesignSoft simulation products,it easily handles surprisingly complex circuits.Texas Instruments does not warrant or support any DesignSoft product.TINA-TI is a software program developed by both TI and DesignSoft.For more information about DesignSoft,visit the DesignSoft website at .TINA-TI is a trademark of Texas Instruments and DesignSoft,Inc.TINA is a trademark of DesignSoft,Inc.Windows is a registered trademark of Microsoft Corporation.All other trademarks are the property of their respective owners.SBOU052A–August 2007–Revised August 2008Getting Started with TINA-TI™1Submit Documentation Feedback这本用户快速入门指南概要性的介绍了TINA-TI™——一个强大的电路设计及仿真工具。

TI德州仪器电压基准

REF3320
30ppm/C漂移、3.9uA、SOT23-3、SC70-3电压基准
REF3318
30ppm/C漂移、3.9uA、SOT23-3、SC70-3电压基准
REF3240-EP
document.write; document.write; REF3212-EP, REF3220-EP , REF3225-EP ,
0.2%精确度
LM4040B41
4.096V精密微功耗并联电压参考，
0.2%精确度
LM4040B30
3V精密微功耗并联电压参考，
0.2%精确度
LM4040B25
2.5V精密微功耗并联电压参考，0.2%精确度
LM4040B20
2.048V精密微功耗并联电压参考，0.2%精确度
LM4040A50
5V精密微功耗并联电压参考，0.1%精确度
可调节并联稳压器
TL4050C50
精密微功耗并联电压基准
TL4050C41
精密微功耗并联电压基准
TL4050C25
精密微功耗并联电压基准
TL4050C10
精密微功耗并联电压基准
「L4050B50-Q1
汽车类精密微功耗并联电压基准
TL4050B41-Q1
汽车类精密微功耗并联电压基准
TL4050B41
精密微功耗并联电压基准
（带隙）电压基准系列
REF3040
采用SOT23-3封装的4.096V输岀50ppm/C漂移50uA静态电流的（带
隙）电压参考系列
REF3033
采用SOT23-3封装的3.3V输岀50ppm/C漂移50uA静态电流的（带隙）
电压参考系列
REF3025
采用SOT23-3封装的2.5V输岀50ppm/C漂移50uA静态电流的（带隙）