集成电路的发展现状与趋势英文版

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集成电路技术的进展及未来发展趋势

集成电路技术的进展及未来发展趋势

集成电路技术的进展及未来发展趋势从20世纪50年代开始,人类就开始研究集成电路技术。

70年代末,集成电路技术已经得到了广泛应用,它的市场规模也随着技术进步的步伐逐渐扩大。

进入21世纪以来,集成电路技术已经成为了现代科技领域的核心技术之一,广泛应用于计算机、通讯和消费类电子产品中。

集成电路技术的发展主要有四个阶段:SSI(small-scale integration)、MSI(medium-scale integration)、LSI(large-scale integration)、VLSI(very-large-scale integration)。

随着技术的不断发展,由于晶体管的尺寸不断缩小,集成度越来越高。

VLSI时代,微处理器、高密度存储器等器件已经开始大量应用。

目前集成度更高的现代微电子器件有SOC(system-on-chip)、ASIC (application-specific integrated circuit)、FPGA(field-programmable gate array)、DSP(digital signal processor)等,它们已经走向数字、混合、模拟一体化的多功能化器件。

集成电路技术发展的主要驱动力是人类对计算机处理速度提升的迫切需求,以及消费电子产品的多样化和高性能化。

例如,随着智能手机的广泛普及,处理器性能和功耗成为手机手机设计中的关键因素。

除此之外,集成电路技术还广泛应用于图像、音频、视频处理,以及人工智能、自动驾驶、物联网等领域。

未来,集成电路技术将继续向数字化、智能化、高集成化发展。

智能手机、平板电脑等消费类产品将继续推动集成电路技术的应用。

同时,随着物联网、云计算等技术的快速发展,人们对数据传输速度、信息安全性、节能降耗也提出了更高的要求。

因此,高速处理、低功耗、高集成度就成为了未来集成电路技术发展的关键词。

FPGA、SOC、ASIC等高级芯片技术的成熟和应用,以及新技术的探索和引入,都将推动集成电路技术的发展和进步。

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势集成电路(Integrated Circuit,IC)是由晶体管、电容、电感和电阻等电子元器件组成的电路在单个小硅片上的微细制造。

它的出现极大地推动了电子技术的发展,并为计算机、通信、电子产品等诸多行业提供了基础支持。

那么,集成电路的现状及其发展趋势是怎样的呢?就集成电路的现状而言,随着科技的进步和市场的需求,集成电路技术在各个方面都取得了巨大的成就。

目前,集成电路已经逐渐实现了小型化、高密度和高性能的发展。

传统的集成电路以硅作为材料,而近些年来,新型材料如石墨烯、碳纳米管等也开始应用到集成电路领域,为集成电路的发展开辟了新的道路。

集成电路的发展趋势主要体现在以下几个方面:1. 小型化和高密度:随着科技的进步,集成电路的尺寸越来越小,元器件的排列密度也越来越高。

尤其是在移动设备领域,对于更加紧凑和轻便的产品设计要求,集成电路必须不断追求小型化和高密度化。

2. 低功耗和低电压:随着节能环保理念的普及,集成电路在工作时需要尽量降低功耗和工作电压。

这就对集成电路设计提出了更高的要求,需要采用更加先进的工艺和设计方法,以实现低功耗和低电压运行。

3. 多功能化和高性能:随着科技的发展和市场需求的变化,集成电路需要具备更多的功能和更高的性能。

集成电路需要支持更高的数据传输速率、更低的时延、更强的信号处理能力等。

这就需要集成电路设计师不断创新和突破,提升集成电路的功能和性能。

4. 材料的创新和应用:为了满足集成电路对于小型化、高密度和高性能的要求,材料创新是非常关键的。

通过研发新型材料,如石墨烯、碳纳米管等,可以大大提升集成电路的性能和可靠性,并拓宽集成电路的应用领域。

5. 可编程和自适应:在未来的发展中,集成电路需要具备更高的智能化和自适应性能。

可编程逻辑器件可以根据不同的任务和需求进行自我调整和优化,提高系统的灵活性和效率。

集成电路作为现代电子技术的核心,其发展趋势主要体现在小型化、高密度、低功耗、多功能化、高性能、材料创新和自适应等方面。

英语作文-探索集成电路设计的未来趋势与发展方向

英语作文-探索集成电路设计的未来趋势与发展方向

英语作文-探索集成电路设计的未来趋势与发展方向Exploring the Future Trends and Development Directions of Integrated Circuit Design。

In recent years, the field of integrated circuit (IC) design has witnessed rapid advancements and breakthroughs. As the backbone of modern technology, ICs are essential components in various electronic devices, ranging from smartphones and computers to medical equipment and automotive systems. In this article, we will explore the future trends and development directions of IC design, focusing on three key aspects: miniaturization, power efficiency, and functional integration.First and foremost, miniaturization is a fundamental trend in IC design. Over the years, the size of ICs has continuously decreased, leading to the development of smaller and more powerful electronic devices. This trend is expected to continue in the future, with the demand for compact and portable devices on the rise. To achieve miniaturization, designers need to overcome various challenges, such as reducing power consumption, improving heat dissipation, and enhancing signal integrity. Advanced fabrication technologies, such as nanoscale lithography and 3D integration, will play a crucial role in enabling further miniaturization of ICs.Secondly, power efficiency is another important aspect of IC design. With the increasing demand for energy-saving devices and the growing concern for environmental sustainability, power efficiency has become a key consideration in IC design. Designers are constantly exploring new techniques to reduce power consumption without compromising performance. This includes the use of low-power design methodologies, such as voltage scaling, clock gating, and power gating, as well as the integration of power management circuits. Additionally, the development of energy harvesting technologies, such as solar cells and wireless charging, presents opportunities for further improving the power efficiency of ICs.Lastly, functional integration is a significant direction for the future of IC design. Traditionally, ICs were designed to perform specific functions, such as processing, memory, or communication. However, the increasing complexity of electronic systems demands higher levels of integration. Designers are now focusing on integrating multiple functions onto a single chip, leading to the development of system-on-chip (SoC) and system-in-package (SiP) solutions. This trend enables the creation of more versatile and compact devices, as well as the realization of emerging technologies like internet of things (IoT) and artificial intelligence (AI). To achieve functional integration, designers need to address challenges related to interconnectivity, power distribution, and thermal management.In conclusion, the future of IC design is characterized by miniaturization, power efficiency, and functional integration. These trends are driven by the demand for smaller, more energy-efficient, and multifunctional electronic devices. To stay at the forefront of IC design, designers need to embrace advanced fabrication technologies, explore innovative power-saving techniques, and focus on integrating multiple functions onto a single chip. By doing so, they can contribute to the development of cutting-edge technologies and shape the future of the electronics industry.。

集成电路的发展历程和未来趋势

集成电路的发展历程和未来趋势

集成电路的发展历程和未来趋势集成电路(Integrated Circuit,简称IC)是将多个电子元件(如晶体管、电容、电阻等)集成到一块半导体芯片上的技术。

集成电路的发展历程源远流长,经历了多个重要的里程碑,同时也展现出令人期待的未来趋势。

集成电路的发展可以追溯到20世纪50、60年代,当时电子器件已经普及运用,但由于电子元件体积大、成本高、制造工艺复杂等因素的限制,使得电子设备成本昂贵且体积庞大。

此时,人们开始希望能够将多个电子元件集成到一块芯片上,以提高器件的性能和成本效益。

1959年,杰克·基尔比(Jack Kilby)在德州仪器公司(Texas Instruments)发明了第一颗集成电路,它是由几个晶体管和其他电子元件组成的。

而同年,罗伯特·诺伊斯(Robert Noyce)在Fairchild Semiconductor公司也独立发明了集成电路,并且将其制造工艺不断改进,进一步推动了集成电路的发展。

自那以后,集成电路技术取得了长足的进步。

1965年,戈登·摩尔(Gordon Moore)提出了著名的摩尔定律,预言了集成电路中晶体管的数量每隔18~24个月会翻一番,而成本则会减少一半,这也推动了集成电路技术的迅速发展。

随着工艺水平的不断提高,集成电路在功能、速度、功耗和体积上都取得了显著进步。

1968年,Intel公司推出了第一款8位微处理器,极大地推动了计算机的发展。

20世纪70年代初,随着NMOS工艺的发展,集成电路进入了第二代制程时代。

但由于功耗和成本问题,对功耗要求很高的应用领域,如移动通信等并未普及集成电路。

1980年代,CMOS工艺的出现改变了这一局面,由于CMOS工艺可以在大规模集成电路上实现低功耗设计,CMOS技术成为主导。

这一改变为后来的计算机和通信领域的快速发展打下了基础。

到了21世纪,集成电路的发展呈现出越来越多的应用领域。

首先是个人电子设备的普及,如智能手机、平板电脑等,这些设备都离不开高性能的处理器和存储器。

三维集成技术的现状和发展趋势

三维集成技术的现状和发展趋势

三维集成技术的现状和发展趋势吴际;谢冬青【摘要】The definition of 3D technologies is given in this paper. A clear classification of variety 3D technologies is pro-posed,in which there are 3D packaging,3D wafer-level packaging,3D system-on-chip,3D stacked-integrated chip and 3D in-tegrated chip. Two technologies (3D system-on-chip and 3D stacked-integrated chip) with application prospect and their TSV technical roadmap are analyzed and compared. 3D integrated circuit's some problems in the aspects of technology,testing,heatdissipation,interconnection line and CAD tool are proposed and analyzed. Its research prospect is pointed out.%给出了三维技术的定义,并给众多的三维技术一个明确的分类,包括三维封装(3D-P)、三维晶圆级封装(3D-WLP)、三维片上系统(3D-SoC)、三维堆叠芯片(3D-SIC)、三维芯片(3D-IC)。

分析了比较有应用前景的两种技术,即三维片上系统和三维堆叠芯片和它们的TSV技术蓝图。

给出了三维集成电路存在的一些问题,包括技术问题、测试问题、散热问题、互连线问题和CAD工具问题,并指出了未来的研究方向。

高性能集成电路的发展趋势与前景

高性能集成电路的发展趋势与前景

高性能集成电路的发展趋势与前景高性能集成电路(High-performance Integrated Circuit,HPIC)是一种高度集成的微电子元件,集成了传感器、处理器、存储器、通信和控制电路等多种功能,以达到高速、高能效、高性能等多方面优势。

随着现代科技的不断发展,HPIC已经成为了许多重要的应用领域的基础和核心。

例如,大规模芯片、人工智能与机器学习、5G通信、云计算和物联网等等。

本文将重点讨论HPIC未来发展的趋势与前景。

一、芯片集成度和功耗优化随着芯片制造技术的不断提升,芯片集成度不断提高,集成度越高,芯片里面可供利用的元件数量将越大,也就意味着芯片可以实现更加复杂的功能。

随着制造工艺向更深入的微米或纳米级别发展,芯片的功耗也将会越来越低,尤其是低功耗的集成电路将成为未来的主流。

利用功耗优化的技术和设计方法,将有可能延长芯片的电池寿命,减少功耗的同时不影响性能。

二、异构系统集成传统的系统芯片都是单一的处理器集成电路,在性能和功耗方面的限制不断限制着设备的发展。

而异构系统则可以将不同架构的处理器或计算单元集成到同一个芯片上,以满足不同的应用需求。

例如,CPU、GPU、NPU、FPGA、DSP等多种计算单元的协作可以将任务分配到合适的处理器上,分别利用其擅长的计算能力,从而提高计算性能、降低功耗和延长电池寿命。

目前,异构系统在人工智能、5G通信和汽车等多个领域得到了广泛的应用。

三、可计算硬件随着人工智能和机器学习等领域的快速发展,对于计算效率和速度的要求变得越来越高。

传统的计算机芯片无法满足这些要求,并且为了支持这些新兴技术,需要不断优化计算芯片的计算能力。

ASIC、FGPA 和SoC等可计算硬件成为了实现高性能与低功耗的利器。

这些技术的发展将使计算机更加快速、准确,同时也将使芯片设计更加灵活和适应性更强。

四、可重构性芯片可重构性芯片是一种可以通过软件调整其硬件结构和功能的芯片。

这种芯片允许芯片的灵活变换和优化,以最大限度地发挥芯片的性能和效率。

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势一、概述集成电路(Integrated Circuit,简称IC)是将多个电子元件集成在一块衬底上,完成一定的电路或系统功能的微型电子部件。

自20世纪50年代诞生以来,集成电路已经经历了从小规模集成电路(SSI)、中规模集成电路(MSI)、大规模集成电路(LSI)、超大规模集成电路(VLSI)到甚大规模集成电路(ULSI)的发展历程。

如今,集成电路已经成为现代电子设备中不可或缺的核心部件,广泛应用于计算机、通信、消费电子、汽车电子、工业控制等领域。

随着科技的快速发展,集成电路的设计、制造和应用技术也在不断进步。

在设计方面,随着计算机辅助设计(CAD)技术的发展,集成电路设计的复杂性和精度不断提高,使得高性能、低功耗、高可靠性的集成电路得以实现。

在制造方面,集成电路的生产线越来越自动化、智能化,纳米级加工技术、三维堆叠技术等新兴技术也在不断应用于集成电路的制造过程中。

在应用方面,集成电路正向着更高集成度、更小尺寸、更低功耗、更高性能的方向发展,以满足不断增长的市场需求。

集成电路的发展也面临着一些挑战。

随着集成电路尺寸的不断缩小,传统的制造方法已经接近物理极限,这使得集成电路的进一步发展变得更为困难。

同时,随着全球经济的不断发展和市场竞争的加剧,集成电路产业也面临着巨大的竞争压力。

探索新的制造技术、开发新的应用领域、提高产业竞争力成为集成电路产业未来的重要发展方向。

总体来说,集成电路作为现代电子技术的核心,其发展现状和趋势直接影响着整个电子产业的发展。

未来,随着技术的不断进步和市场的不断变化,集成电路产业将继续保持快速发展的势头,为全球经济和社会的发展做出更大的贡献。

1. 集成电路的定义与重要性集成电路(Integrated Circuit,简称IC)是一种微型电子器件或部件,采用一定的工艺,把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起,制作在一小块或几小块半导体晶片或介质基片上,然后封装在一个管壳内,成为具有所需电路功能的微型结构。

集成电路英语作文

集成电路英语作文

集成电路英语作文English:An integrated circuit (IC) is a small electronic device made up of several interconnected components such as transistors, resistors, diodes, and capacitors, all etched onto a single semiconductor substrate. They are commonly referred to as chips or microchips and are the building blocks of modern electronic devices. Integrated circuits have revolutionized the field of electronics by enabling the fabrication of complex electronic systems in a small package. They have significantly reduced the size, cost, and power consumption of electronic devices while increasing their performance and reliability. Integrated circuits are used in a wide range of applications, from consumer electronics like smartphones and laptops to industrial control systems and medical devices. The continuous advancements in IC technology have led to the development of more powerful and energy-efficient devices, pushing the boundaries of what was previously thought possible.中文翻译:集成电路(IC)是由几个互相连接的组件组成的小型电子设备,如晶体管、电阻、二极管和电容器,所有这些都在单一半导体基底上刻蚀而成。

集成电路技术的发展和未来趋势分析

集成电路技术的发展和未来趋势分析

集成电路技术的发展和未来趋势分析随着信息化时代的到来,计算机、手机、电子设备等电子产品已成为人们生活中不可或缺的一部分。

而集成电路技术正是这些电子产品中不可或缺的重要组成部分,它的技术发展对于整个电子行业的发展至关重要。

本文将对集成电路技术的发展历程以及未来趋势进行分析。

一、集成电路技术的发展历程集成电路技术(Integrated Circuit Technology),简称”IC技术”,是指把一个或多个电子元器件、电路和组装还有一个或多个连接所需的电路板集成在一块晶圆上,然后进行切割、封装,最终形成一个微小的封装件,成为一个芯片,这种技术被称为集成电路技术。

20世纪50年代,美国贝尔实验室的德拉曼和诺伊斯等人制成了第一个晶体管集成器件。

20世纪60年代,美国的摩尔提出了著名的“摩尔定律”。

他认为:集成电路中集成的晶体管数量约每隔18至24个月就会增加一倍,而成本却会下降一半,性能却提高一倍。

70年代,国内开始引进集成电路技术,成立了中国第一个集成电路企业——上海华虹。

不久后,国内又陆续成立了大连长兴、深圳松山、成都半导体、中芯国际等集成电路企业。

80年代,国内集成电路企业开始了技术创新,研制出了一批自主知识产权的芯片,类似于78K0、神州、延安等。

90年代,随着中国大力发展信息化,在集成电路技术方面也取得了长足的进展,研制出了一批高端技术产品,如公交IC卡、手机芯片、数字电视芯片、GPS芯片、数码相框芯片等。

二、集成电路技术的未来趋势随着科技的不断进步,集成电路技术也在不断升级。

未来,集成电路技术的发展趋势主要表现在以下几个方面:1、芯片尺寸越来越小随着技术的不断进步,制程工艺的提高,芯片尺寸越来越小已成为不争的事实。

如今,微型集成电路的尺寸已经达到亚微米级别,如7nm、5nm,并由此带来了更高的性能和更低的功耗。

2、芯片集成度越来越高芯片集成度是指在一个芯片上集成的单元数、功能、器件面积、线宽、制程层数等指标,它越高,则意味着芯片的性能越好、功耗越低。

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势摘要:随着信息技术的发展,集成电路已经成为电子工业中的核心技术之一。

本文首先介绍了集成电路的基本概念和分类,然后探讨了目前集成电路发展的现状,包括芯片制造工艺、存储器设计、数字信号处理和通信技术等领域。

最后,本文对集成电路的未来发展趋势进行了展望,并提出了一些建议,以促进集成电路技术的创新和发展。

关键词:集成电路、制造工艺、存储器、数字信号处理、通信技术正文:一、集成电路的基本概念和分类集成电路是将多个电子元器件(例如晶体管、电阻器、电容器等)和互连线集成在一起,形成一个独立的电路功能单元的电子器件。

根据电子元器件的功能和互连线的规模,集成电路可以分为模拟集成电路(analog integrated circuits,简称模拟IC),数字集成电路(digital integrated circuits,简称数字IC)和混合集成电路(mixed-signal integrated circuits,简称混合IC)三类,其中模拟IC主要用于处理模拟信号,数字IC主要用于处理数字信号,混合IC主要用于处理模拟信号和数字信号混合的应用。

二、集成电路的现状目前,集成电路技术已经广泛应用于计算机、通信、消费电子、汽车、医疗、航天等领域。

在芯片制造工艺方面,由于芯片的制造要求非常高,因此要求制造工艺必须保证芯片的质量和稳定性。

目前,采用的主要工艺有传统的MOS(MOSFET)技术和高速的SI(SI-GaAs)、超通量CMOS和SOI(硅上绝缘体)技术,这些工艺在实现高集成度和增加速度、降低功耗等方面都取得了很大的成功。

在存储器设计方面,DRAM(动态随机存储器)已经成为主流,同时Flash存储器等非易失性存储器也取得了很大的发展。

在数字信号处理方面,基于FPGA(现场可编程门阵列)技术的处理器已成为核心处理器,同时在处理器设计、射频电路、音视频处理等领域也取得了很多进展。

在通信技术方面,随着移动通信和5G技术的发展,集成电路已成为支撑通信网络的技术基础,芯片设计以及发射和接收模块设计等都取得了令人瞩目的成果。

超大规模集成电路技术的现状与发展趋势

超大规模集成电路技术的现状与发展趋势

超大规模集成电路技术的现状与发展趋势超大规模集成电路(Very Large Scale Integration Circuit,缩写为VLSI)技术是当今电子工业和信息产业的基石,也是计算机科学、工程学、物理学等学科的前沿领域之一。

随着各国对科学技术的投入不断增加,人类社会正走向信息化时代,VLSI技术的发展趋势和前景备受关注。

本文将就VLSI技术的现状与发展趋势展开讨论。

一、VLSI技术的现状VLSI技术最初出现于20世纪60年代末期,并在70年代里开始进入商业化应用领域。

通过工艺不断完善和发展,现在的VLSI 技术已经实现了海量管脚集成电路芯片设计与制造。

2019年,美国国防部推出了一款基于7纳米FinFET工艺的ASIC芯片——Polaris,其晶体管数目逼近100亿个,是目前业内最为先进和规模最大的微电子器件。

此外,Intel的Tiger Lake处理器和苹果公司的A14芯片也采用了7纳米工艺,其晶体管密集度也达到了1.3亿/平方毫米。

这些数据充分证明了VLSI技术的发展已经进入了井喷式增长的阶段。

二、VLSI技术的发展趋势从目前的技术发展趋势来看,VLSI技术将在以下几个方面取得新的突破:1. 下一代制造工艺的引领集成电路的制造工艺一直是当前技术变革的关键。

未来,VLSI 技术将着力发展一个更加快速、精准、环保的制造过程。

目前Wafer Foundry(晶圆代工)已经推出的5纳米FinFET工艺仍不断被引领着。

同时,在改进制造工艺的同时,VLSI技术还需继续提高器件的集成度和功耗比。

比如逐渐向1.0nm(纳米)工艺、三维芯片打造、量子计算器等方向迈进等。

2. 大数据应用需求的增长VLSI技术的快速发展引起了大数据应用的日益增长,如2G、3G、4G、5G、6G通信、人工智能、物联网、医疗健康、能源环保、无人驾驶等领域,这些都将为集成电路技术提供巨大空间和深厚市场需求。

3. VLSI软硬件融合的发展与以往大规模工程系统设计相比,软硬件融合芯片设计(series Connected)已经成为下一阶段VLSI产业的趋势发展。

集成电路市场现状及发展趋势

集成电路市场现状及发展趋势

集成电路市场现状及发展趋势集成电路发展大事记1947年:贝尔实验室肖特莱等人发明了晶体管,这是微电子技术发展中第一个里程碑;1950年:结型晶体管诞生;1950年: R Ohl和肖特莱发明了离子注入工艺;1951年:场效应晶体管发明;1956年:C S Fuller发明了扩散工艺;1958年:仙童公司Robert Noyce与德仪公司基尔比间隔数月分别发明了集成电路,开创了世界微电子学的历史;1960年:H H Loor和E Castellani发明了光刻工艺;1962年:美国RCA公司研制出MOS场效应晶体管;1963年:F.M.Wanlass和C.T.Sah首次提出CMOS技术,今天,95%以上的集成电路芯片都是基于CMOS工艺;1964年:Intel摩尔提出摩尔定律,预测晶体管集成度将会每18个月增加1倍;1966年:美国RCA公司研制出CMOS集成电路,并研制出第一块门阵列(50门);1967年:应用材料公司(Applied Materials)成立,现已成为全球最大的半导体设备制造公司;1971年:Intel推出1kb动态随机存储器(DRAM),标志着大规模集成电路出现;1971年:全球第一个微处理器4004由Intel公司推出,采用的是MOS工艺,这是一个里程碑式的发明;1974年:RCA公司推出第一个CMOS微处理器1802;1976年:16kb DRAM和4kb SRAM问世;1978年:64kb动态随机存储器诞生,不足0.5平方厘米的硅片上集成了14万个晶体管,标志着超大规模集成电路(VLSI)时代的来临;1979年:Intel推出5MHz 8088微处理器,之后,IBM基于8088推出全球第一台PC;1981年:256kb DRAM和64kb CMOS SRAM问世;1984年:日本宣布推出1Mb DRAM和256kb SRAM;1985年:80386微处理器问世,20MHz;1988年:16M DRAM问世,1平方厘米大小的硅片上集成有3500万个晶体管,标志着进入超大规模集成电路(ULSI)阶段;1989年:1Mb DRAM进入市场;1989年:486微处理器推出,25MHz,1μm工艺,后来50MHz芯片采用0.8μm 工艺;1992年:64M位随机存储器问世;1993年:66MHz奔腾处理器推出,采用0.6μm工艺;1995年:Pentium Pro, 133MHz,采用0.6-0.35μm工艺;1997年:300MHz奔腾Ⅱ问世,采用0.25μm工艺;1999年:奔腾Ⅲ问世,450MHz,采用0.25μm工艺,后采用0.18μm工艺;2000年: 1Gb RAM投放市场;2000年:奔腾4问世,1.5GHz,采用0.18μm工艺;2001年:Intel宣布2001年下半年采用0.13μm工艺。

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势

集成电路的现状及其发展趋势集成电路(Integrated Circuit,IC)是电子技术中的核心组成部分,也是电子设备不可或缺的关键元件。

它将数百到数千个电子元件集成在一块小芯片上,制造出高度集成化的电路,极大地提高了电子设备的性能和功能。

下面将从现状和发展趋势两个方面介绍集成电路。

目前集成电路的发展已经处于成熟阶段。

集成电路技术始于20世纪50年代,经过几十年的发展,已经取得了巨大的进步。

现如今,集成电路在各个行业和领域都得到了广泛的应用,从计算机到通信设备,从消费电子到汽车电子,无处不见集成电路的身影。

集成电路的制造工艺也逐渐趋于成熟,可以生产出大规模集成电路(LSI)、超大规模集成电路(VLSI)以及甚至超大规模集成电路(ULSI)等各种级别的芯片。

集成电路的发展趋势主要表现在以下几个方面。

首先是芯片尺寸的不断缩小。

随着制造工艺的进步,芯片的尺寸越来越小,集成度越来越高。

现在最主流的芯片工艺已经达到了14纳米甚至更小的级别,可以在一个芯片上集成更多的电子元器件,提高电路性能和功能。

其次是功耗的不断降低。

随着电子设备越来越小型化和便携化,对功耗的要求也越来越高。

集成电路制造商通过采取一系列的技术手段,如工艺改进、智能功耗管理等,不断降低芯片的功耗,延长电池续航时间。

第三是功能的多样化和集成化。

随着物联网和人工智能等新兴技术的兴起,集成电路不仅要求实现更多的功能,如通信、计算、传感、图像处理等多种功能集成于一芯片上,还需要具备更强的数据处理和决策能力。

第四是安全和可靠性的提升。

在信息安全和数据隐私保护方面,集成电路制造商需要增强芯片的安全性能,采用硬件加密和安全认证等手段,防止黑客攻击和数据泄露。

对于关键电子设备,如航天器、核电站等,对集成电路的可靠性要求也非常高,制造商需要提高芯片的可靠性和抗干扰能力。

最后是环境友好型的发展。

随着对资源和能源的节约和环境保护的重视,集成电路制造商需要采用低能耗、低污染的制造工艺,减少对环境的影响。

论文的中英文译文

论文的中英文译文

1, Electromechanical integration and the development of technology trends 一、机电一体化技术发展历程及其趋势Since an electronic technology birth of electronic technology and mechanical technology integration began, only a semiconductor integrated circuit, particularly in a microprocessor representative of thelarge-scale integrated circuits for the future, "mechatronics," a technical after significant progress, and has attracted widespread attention.自电子技术一问世,电子技术与机械技术的结合就开始了,只是出现了半导体集成电路,尤其是出现了以微处理器为代表的大规模集成电路以后,"机电一体化"技术之后有了明显进展,引起了人们的广泛注意.(1) mechanical-electrical integration, "the course of development(一)机电一体化"的发展历程1. CNC machine tools come out, wrote "mechatronics," the first page of history;1.数控机床的问世,写下了"机电一体化"历史的第一页;2. Microelectronic technology, "mechatronics''bring a great vitality;2.微电子技术为"机电一体化''带来勃勃生机;3. PLC, "Power Electronics" for the development of "mechatronics" providea firm foundation;3.可编程序控制器、"电力电子"等的发展为"机电一体化"提供了坚强基础;4. Laser technology, fuzzy technology, information technology and other new technologies to "mechanical and electrical integration," a new and higher level.4.激光技术、模糊技术、信息技术等新技术使"机电一体化"跃上新台阶.(2) mechanical-electrical integration, "the development trend(二)机电一体化"发展趋势1. Integration of optical and electrical machinery. General mechanical and electrical integration system by sensing systems, energy systems, information processing systems, machinery, and other components of the structure. Therefore, the introduction of optical technology, the realization of the inherent advantages of optical technology is effective Improved mechanical-electrical integration system sensing system, energy (power) systems and information processing system. optical and electrical machinery integration is the development of mechanical and electrical products trend.1.光机电一体化.一般的机电一体化系统是由传感系统、能源系统、信息处理系统、机械结构等部件组成的.因此,引进光学技术,实现光学技术的先天优点是能有效地改进机电一体化系统的传感系统、能源(动力)系统和信息处理系统.光机电一体化是机电产品发展的重要趋势.2. Systematic self-distribution - Flexible Future electromechanical integration products, and implementation of control systems are adequate "redundancy" and more "flexible" and can better deal with an emergency, is designed "self-distribution system." Self-discipline in thedistribution system, the various subsystems are independent of each other's work, the subsystem for system services, and has its own "self-discipline", according to different environmental conditions react differently. Its characteristics are subsystem can generate its own information and additional information given in the overall premise, specific "action" can be changed. In this way, significantly increase the system's ability to adapt (flexible), not because of the failure of a subsystem of the whole system.2.自律分配系统化——柔性化.未来的机电一体化产品,控制和执行系统有足够的“冗余度”,有较强的“柔性”,能较好地应付突发事件,被设计成“自律分配系统”。

集成电路行业的发展现状与未来趋势

集成电路行业的发展现状与未来趋势

集成电路行业的发展现状与未来趋势随着科技的快速发展,集成电路(Integrated Circuit,简称IC)作为电子信息领域的核心技术之一,正扮演着越来越重要的角色。

IC是用于嵌入式系统、通信设备、计算机、消费电子产品等各种电子产品中的核心组件,其性能的提升对于现代社会的发展至关重要。

本文将探讨集成电路行业的发展现状和未来趋势。

一、发展现状1. 市场规模扩大:目前,全球集成电路市场规模持续扩大。

根据市场研究机构的数据显示,2019年全球集成电路市场规模已经达到3000亿美元,而且预计未来几年市场规模还会进一步增长。

2. 技术升级换代:集成电路技术不断升级换代,特别是新一代的制程工艺的应用,如7纳米、5纳米工艺,使得芯片更小、功耗更低、性能更强大。

同时,三维集成电路(3D IC)技术的出现也为电子产品提供了更高的集成度和性能。

3. 应用领域广泛:集成电路已经广泛应用于各个领域,如计算机、通信设备、智能家居、工业自动化等。

尤其是新兴的人工智能、物联网等领域,对于集成电路的需求更加迫切。

二、未来趋势1. 人工智能与芯片的结合:人工智能已经成为集成电路行业发展的重要驱动力之一。

未来,随着深度学习、机器学习等技术的不断发展,对于计算能力更强大、能够进行更复杂运算的芯片需求将不断增加。

因此,人工智能芯片的研发与应用将是未来的重点。

2. 物联网的兴起:随着物联网的蓬勃发展,集成电路行业也将迎来新的机遇。

物联网设备的广泛普及和应用推动了对于无线通信、传感器、微控制器等集成电路的需求。

因此,在物联网时代,集成电路行业有望迎来新的发展机遇。

3. 安全与隐私保护:随着信息时代的到来,隐私和安全问题越来越受到关注。

在集成电路行业中,保障数据传输安全和设备隐私成为了迫切需求。

未来,集成电路行业将不断加强芯片安全性能的研发和应用,提供更加安全可靠的解决方案。

4. 环境友好型芯片:环保意识逐渐增强,对于低功耗、高效能源的需求也在不断增长。

集成电路的发展趋势和关键技术

集成电路的发展趋势和关键技术

ElectronicComponent &Device ApplicationsVol.11No.1Jan.2009第11卷第1期2009年1月0引言目前,以集成电路为基础的信息产业已超过了以汽车、石油、钢铁为代表的传统产业,因此,集成电路产业已成为改造传统产业,奔向数字时代的强大引擎。

现代经济发展的数据表明,每l ~2元的集成电路产值可带动10元左右的电子工业产值,进而能大体带动100元的GDP 增长。

预计未来10年内,世界集成电路销售额将以年均15%的速度增长,2010年将达到6000~8000亿美元。

作为当今世界经济竞争的焦点,拥有自主知识产权的集成电路已日益成为经济发展的命脉和国际竞争的筹码。

1世界集成电路的发展21世纪上半叶,微电子技术仍将以尺寸不断缩小的硅基CMOS 工艺技术为主流。

尽管微电子学在化合物半导体和其它新材料方面的研究应用取得了突破进展,但远不具备替代硅基工艺的条件。

集成电路技术发展到现在,全世界以万亿美元的投人,已使硅基工艺形成了非常强大的产业能力。

同时,长期的科研投入也使人们对集成电路工艺的了解,达到了十分透彻的地步,这是弥足珍贵的知识财富。

集成电路主要的生产过程包括:开发EDA(电子设计自动化)工具,利用EDA 进行集成电路设计,根据设计结果在晶圆片上加工芯片(主要流程为薄膜制造、曝光和刻蚀),对加工完毕的芯片进行测试和封装,最后经应用开发系统将其装备到整机系统之上。

1.1集成电路发展概况2006年,单片系统集成芯片的最小特征尺寸已达0.09μm 、芯片集成度达2亿个晶体管、芯片面积520mm 、7~8层金属连线、管脚数4000个、工作电压0.9~1.2V 、工作频率2~2.5GHz ,功率160瓦。

到2010年,将提高到0.07μm 的水平。

而硅IC 晶片直径尺寸在2006~2010年将转向400mm 以上。

为了适应新技术的发展,极限紫外线、X 射线、准分子激光等超微细图形曝光技术等将成为今后几年主要的工艺技术并将获得更广泛的应用,先进的集群式全自动智能化综合加工系统将成为新一代IC 制造设备。

中国芯片发展现状英文作文

中国芯片发展现状英文作文

中国芯片发展现状英文作文China's chip development has been rapidly advancing in recent years. With the government's support and investment, many Chinese companies have been able to catch up withtheir international counterparts in terms of technology and innovation.One of the key factors driving China's chip development is the country's huge consumer market. With a population of over 1.4 billion people, China is the world's largest market for electronic devices and appliances. This has created a huge demand for chips, which has in turn spurred the development of domestic chip companies.Despite the progress that has been made, China's chip industry still faces many challenges. One of the biggest obstacles is the lack of talent. While there are many talented engineers and scientists in China, there is still a shortage of skilled workers in the chip industry. This has led to a brain drain, with many talented individualsleaving China to work for foreign companies.Another challenge facing China's chip industry is the dominance of foreign companies. Many of the world's leading chip companies are based in the United States, Japan, and South Korea. These companies have a significant technological advantage over their Chinese counterparts, which makes it difficult for Chinese companies to catch up.Despite these challenges, China's chip industry isstill growing at an impressive rate. With the government's support and investment, and the increasing demand for chips in China's consumer market, it is likely that China will continue to make progress in the years to come.。

ai发展现状及趋势英语作文

ai发展现状及趋势英语作文

ai发展现状及趋势英语作文The current status and trends of AI developmentArtificial Intelligence (AI) has become one of the most talked-about technologies in recent years. With its ability to mimic human intelligence and perform tasks that were once thought to be exclusive to humans, AI has the potential to revolutionize industries, improve efficiency, and change the way we live and work.The current status of AI development is characterized by rapid growth and advancement in various fields. Machine learning, a subset of AI that allows machines to learn from data, has seen significant progress in recent years. Many companies are investing heavily in AI research and development, leading to the creation of more sophisticated AI algorithms and models.One of the most notable applications of AI is in the field of automation. AI-powered robots and machines are being used in manufacturing, logistics, and other industries to perform tasks that were previously done by humans. This has led to increased productivity, cost savings, and improved safety in many workplaces.Another area where AI is making a big impact is in healthcare. AI algorithms are being used to analyze medical images, diagnose diseases, and even predict patient outcomes. This has the potential to revolutionize healthcare by making diagnosis faster and more accurate, and by enabling personalized treatment plans for patients.In addition to these applications, AI is also being used in other fields such as finance, marketing, and transportation.AI-powered chatbots and virtual assistants are being used to improve customer service, AI algorithms are being used to detect fraud and predict market trends, and self-driving cars are using AI technology to navigate roads safely.Looking ahead, the future trends of AI development are promising. As AI technologies continue to advance, we can expect to see even more applications in different industries. AI will become more integrated into our daily lives, helping us make better decisions, improve efficiency, and solve complex problems.However, as AI becomes more widespread, there are also concerns about its impact on society. Issues such as job displacement, data privacy, and ethics need to be addressed as AI technology continues to evolve. It is important forpolicymakers, researchers, and industry leaders to work together to ensure that AI is developed in a responsible and ethical manner.In conclusion, the current status of AI development is characterized by rapid growth and advancement in various fields. AI has the potential to revolutionize industries, improve efficiency, and change the way we live and work. Looking ahead, the future trends of AI development are promising, but there are also challenges that need to be addressed. By working together, we can harness the power of AI to create a better future for all.。

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The present situation and developing tendency ofintegrated circuitLiu ChenLang Fang Teacher’s UniversityMathematics and Information Science CollegeInformation EngineeringAbstract: The thesis demonstrates the current technology of IC industry and the influence of IC to the world, and it also discusses the problems IC has encountered and the corresponding solutions. According to the problems and solutions, I synthetically expound the tendency of IC in size, material and technology. At the end of the thesis, I conclude the current situation of IC and express my expectation of future development of IC.Key Words: integrated circuit, current situation, and tendencyⅠ. IntroductionIntegrated circuit and software are the basis and center of economic development in the information society. Nowadays, information industry based on integrated circuit has exceeded the traditional industry which is represented by car, petroleum and steel. Therefore, IC industry has become the powerful tool to transform the traditional industry and move towards the digital times. IC is the leading industry of the national economy and social development. It has very strong innovation and integration, and has already penetrated into daily life, production and all aspects of national defense security. The world's major countries and regions have regarded the development of the integrated circuit industry as an important means to enhance the comprehensive national strength, economic development and national security. As the focus of today's world economic competition, integrated circuit with independent intellectual property rights has become the lifeblood of economic development and international competition.Ⅱ. The current situation of the overseas development of IC1. The development of ICIn the first half of the twenty-first century, the mainstream of microelectronic technology is silicon CMOS technology whose size is shrinking. The development of IC technology in today’s world has entered into the nanometer era, and continues to develop depth. Today, 45nm technologies have entered the practical stage; and the development of 32nm and 22nm technology has also made gratifying achievements. In addition, the key technology in IC technology –immersion lithography and extreme ultraviolet lithography has used 45nm chip lithography; what’s more, neon imprint lithography technology has also made progress. Long term of investment in scientific research makes people understand the IC process thoroughly. This is the precious wealth of knowledge.In 2006, the minimum feature size of system on chip integrated chip reached 0.09 μm, the integration of chip reached 200000000 transistors, the chip had the area of 520 mm, metal wire of 7 ~ 8 layers, pin number 4000, a voltage of 0.9 ~ 1.2 V, operating frequencyof 2 ~ 2.5 GHz, the power of 160 watts. By 2010, it had increased to 0.07 μm. Silicon IC wafer’s diameter had turned to more than 400nm in 2006 ~ 2010.From the 1990s to now, communication and computer occupy the 2/3 demand of world semiconductor. Among them, the communication growing is the fastest. Information technology is changing and influencing our life. Information technology has improved the entrepreneurial competitiveness and become a new driving force for the growth of the world economy. The development of IC industry is the results of the prompt of market and technology. The fundamental vitality IC lies in its high volume, low cost and high reliable production.With the development of science and technology, IC’s share in the electronic product sales increases year by year. At present, the application of an integrated circuit in a complete machine, computer is the first, communication is the second, third is the consumer electronics. In order to complete system on a chip, there will be various compatible technologies in the future.At present, USA, Japan, South Korea and Taiwan are the leaders of IC industry in today's world, and USA, Japan and European countries occupy the upper industrial chain and master the design, production, equipment and other core technologies. As the market demanding for product information increases, especially for the communication, computer and the Internet, electronic commerce, digital audio-visual and other electronic products, the world IC market will be in a high-speed growth.In next few years, integrated circuit technology will move towards the directions of "Moore's law "and "more than Moore". Moore's law will continue to promote the technology and product upgrading through narrowing size of the features after 28nm, and its representative products are processor, memory and logic devices. ‘More than Moore's law achieves the combination of integration functions and diversity of product mainly through various 3D package, system in package and other means, and its representative products are analog, power device, sensor and so on.2. Effect of integrated circuit development in the worldInformation technology improves the competitiveness of enterprises. At the same time; it has become a new driving force for the growth of the world economy. Beginning at the end of 80s, personal computer becomes a strong force of semiconductor demand. So far, PC has still driven the demand of these misconduct and product. In 2004, the Asia-Pacific region became the world's largest semiconductor market, and the main driving force is the growth of domestic demand and the rapid growth in China which are the world's place of production. Production of electronic terminal product will continue to transfer from Japan and other parts of Asia to China.Over the years, the IC industry has developed 3 -- 4 times faster than the growth rate of the national economy, and new technology and new products continue to emerge. At present, integrated circuit production has entered into the nanometer era. In the world, a plurality of 90nm, 12 inch production lines are used into large-scale production, production technology has been basically formed based on the 70-65nm level line. At present, the number of the monolithic integrated circuit chip of the world's highest level has reached about 8,000,000,000.Integrated circuit products are characterized by the monopoly of the Multi-NationalCorporation in the global industrial organization. Therefore only with highly international market being the basis, the enterprises can gain advantage of economies of scale in production and sales, the global market expansion and research and development are also complementary to each other.Ⅲ. Development status of domestic integrated circuit3.1 The development of integrated circuitsChina has gained rapid development in the integrated circuit industry in recent years, and the competitiveness of ascendant enterprises started to appear. In recent years, IC production lines in Chinese mainland increased rapidly, and increased by 16 in the period of ‘the 10th Five-Year Plan’and 20 in ‘the 11th Five-Year Plan’. The ratio of lines in large size was also rising. At present, there are nearly 50 chip manufacturing factories in the mainland, and there are seven enterprises with 200mm and 300mm pure chip foundry.In 2000-2012, Chinese IC industry and market got a fast development. The scale of the market tripled, and increased from 97,500,000,000 Yuan to 855,900,000,000 Yuan. Its growth is in the forefront in the world's major countries and regions. Since 2008, the designing process with high technology and advanced industry is developing rapidly, its proportion in the entire industry rose from less than 10% to 28% in 2012.At present, the IC industry in our country has formed a coordinated pattern including design, chip manufacturing and packaging and testing industry. The industrial zone including The Yangtze River Delta, the Beijing-Tianjin region and the Pearl River Delta appeared. Driven by 3G network communication, digital home and flat-panel TV and other fields, Chinese IC market will maintain rapid growth. According to the plan of Ministry of information industry, the size of sales of the semiconductor industry in our country will reach 300000000000 Yuan, and we can occupy 8% of the world market, China will become one of the most important bases of manufacturing integrated circuit in the world.After 30 years of development, Chinese IC testing industry develops from small to large, from hardware development and software development to integrated system, from imitation to independence, and has formed a pattern which gives priority to professional institution and testing group and locates in top university, central and local research institutions.Although Chinese IC industry are not rich from both the quality and quantity, with the global industry shifting to eastern area, Chinese economy grow steadily, market demand is huge, and all kinds of talents are abundant and natural resources are rich, we can infer that Chinese IC industry, having all the advantages in a situation, will rise to become the world's new IC manufacturing center.3.2 The problems when developing ICIC production lines in mainland increased rapidly, but the major subject of investment is foreign transferring production line or Sino foreign joint venture cooperation, not the state-owned holding. Strategic Support involving national security is missing. There are problems in the coordination of various sectors of the industry chain; the major obstacle refers to the loss of a reasonable layout in the layout of various sectors of the industry chain.In the early development period of the industry, the integrated circuit industry and supporting industry have not developed very well because of the weak foundation and the imbalance of regional development, as a result, efficiency was low, and cost of the enterprise is high. Innovation alliance, the efficiency of official cooperative research and development system is not high, and this is another major factor restricting the rapid development of Chinese IC industry.There is a serious discrepancy between Chinese IC applied industry and IC industry chain, as a result, a large number of CI products are over capacity, but the marketing necessary products lack, so we must rely on imported products. Because there are big problems in the development of IC technology, the small and medium-sized enterprises in the global IC industry development with many difficulties, and it is difficult to obtain quick development in the short term.The development of Chinese testing industry is relatively backward, it is not only trail the developed countries, but also cannot keep up with the development of IC industry in China, and restrict the development of the IC industry of our country to some degree. This problem has increasingly become a bottleneck for the development of IC industry in China.3.3 The development strategies of IC and policies of our countryTaking measures of plan and market parallel, integrating the resources of the domestic and international industrial chain, forming complementary advantages, we can innovate, integrate and build generalized IDM industrial alliance and realize the independent and reasonable IC industry chain layout and finally support the spanning development. Achieving high quality of the learning process and the reconstruction of the innovation system and running mechanism. We should have a full understanding of the regular pattern of the industrial development, and establish and improve effective supporting system of industrial development; we also should be far-sighted in planning the development of industry. Only when we provide support such as policy, infrastructure and industrial chain for the enterprise development, technology and capital introduction, can we promote the healthy development of Chinese IC industry. Finally, it is the base of effective operating system to improve the interactive efficiency between government, universities, research institutions and enterpriseUnder the goal of perfecting the integrated circuit industry chain, our country is in urgent need to establish and improve the industrial chain, especially to improve the productivity of high-end chip and get rid of the fact that high-end products are enslaved to the developed countries. According to the characteristics of the Chinese market and the diversity of product demand, we are supposed to create a mechanism of IC industrial innovation and development and improve the original innovation of technology and products and introduce, digest and absorb the ability of recreation.The development of integrated circuit industry in our country gets great attention from the government. Recently, the government issued special documents so as to give the political help to the IC industry. In terms of fiscal and taxation policy, IC designing enterprises engage in the integration of information system, consulting and maintaining operation and designing integrated circuit, etc, and they are exempted from business tax. In terms of investing and financing policies, local government set up the equity funds orventure capital fund for the development of IC enterprises. As to the policy in research and development, our government actively supports the major and key technical research and development of integrated circuits, and speeds up the industrialization and application of the technology with independent intellectual property.Ⅳ. The tendency of integrated circuit4.1 Size and modelAs the integrated methodology and micro fabrication technology continues to develop and be mature, as well as the enlargement of the application of integrated technology, integrated circuit will be of miniaturized, systematic and relevant. In the near future, the width of integrated electric line will continue to move forward following Moore's law, the chip of 22nm processes will expect the batch production next year, and the research and development of 14mm technologies have already begun. Integrated circuit products are numerous, although the process structures are various. The size will become smaller. For the processor, the future development will give priority to multi-core architecture, and new industry will also be moved towards 22nm. While in storage, smaller size and more advanced forms of packaging will be popular.4.2 Material and componentsIntegrated circuits get a rapid development with Si and CMOS being main stream, at the same time, new material, new structure and new devices appeared. Because of its rapid Fe2 RAM developed rapidly because of its fast speed, low consumption, non volatility, and long life and resistant to radiation. Sic, GaN and AlN has aroused extensive attention and become a research hotspot due to its wide band gap, high breakdown voltage, resistance to radiation, and their the hetero junction devices has the very good application prospect in high frequency, high temperature, high power,. Functional integration is the integration of RF, power control, passive components, and other functions in the aspects of chip, package and module. By 2019, it is predicted that we can develop new device which performance is better than CMOS device to improve the ability of the CMOS process.4.3 The overall trendIn the future, as the global economy gradually went out of the downturn, driven by mobile Internet market, the demand of integrated circuit products market increases obviously, and global IC industry is expected to be out of the trough gradually, and industry growth is rising gradually. Under the attention from our country, the glow of the domestic market and mobile intelligent terminal, cloud computing and other emerging markets, the vigor of the IC market gets more release and market demand gets further growth. The development of Micro fabrication technology and the expansion of the application field will lead to the development of a series of interdisciplinary and related technology.In the next few years, if the global economy does not fluctuate widely, the way of stable growth will be the tendency of Chinese integrated circuit market in the next few years, market growth over the next few years will remain at about 9%, the main driver of market development still mainly comes from the PC, mobile phone, LCD TV and other electronic products which have more productions. In addition, the future emergingapplication becomes one of the promoting factor, the development of Internet of things, cloud computing, new energy, semiconductor lighting, electronics, medical and security electronics and other emerging field will bring Chinese IC market new power, the new products such as MID, portable intelligent products, smart meters and energy control will have a bigger influence to the market. What’s more, these emerging electronic products will also promote the development of the semiconductor market to a certain extent.Ⅴ.ConclusionThe processing and manufacturing technology of IC is closely related to the special equipment, we can say that equipment, process, products are different from generation to the next generation. Constantly improves the cost performance is the power of the quick development of integrated circuit products. Clear border between the integrated circuit and system has been broken, integrated circuit not only become the foundation of modern industry and science and technology, but also has become the cornerstone of modern intelligence work in all professions and trades. Our country has become the second largest integrated circuit manufacturing country, but integrated circuit testing technology is relatively backward, and lacks the design capability of the high level of integrated circuit testing equipment.In the future, the development of microelectronics technology in China will step into rapid development period, integrated circuit combined with other disciplines and technologies, to form a new direction, new discipline or profession and change the traditional pattern of specialization. Through the innovation of technology and industrial developmental mode, the integrated circuit product performance will continue to improve, the price will continue to reduce, the application will continue to expand, and play a more important role in promoting the development of social economy in all aspects in the future.Reference1 Wang Yonggang. Trends and key technologies of integrated circuits [J], the application of electronic components, 2009,11 (1); 70-72.2 Feng Yalin, Zhang Shuping. IC status qua and development trend [J], Microelectronics, 2006,36 (2); 173-176.3 Wangsuo Zhu, Yang and. Ten Highlights foreign electronic information technology development [J]. Information Research, 2009,35 (9); 1-3.4. Radius, Xu Xiaotian. Status and trends in integrated circuit technology and industrial development [J]. Microelectronics, 2014,44 (1); 81-84.5 Du Huan, Shi Lei. Delete the challenges and opportunities of integrated circuit development [J]. And quality of goods, 2011.6 Wei Aria. The status qua of China's IC Development and Countermeasures [D]. University of Electronic Science and Technology. 2014.7 Yu Jianfeng, Chen Xiang, Yang Xueying. Status Quo and Development IC test technology strategy [J]. Chinese test, 2009,35 (3); 1-5.8 Xu Qiang. China's IC industry development status and prospects [J]. International Economic Cooperation, 2009,1; 27-31.9. Wang Shouxiang, Lai Fan. Status of domestic IC development and leapfrogdevelopment of countermeasures [J], Microelectronics, 2013,43 (4); 572-576.10. Tuo Yunfeng. On the prospects of our business strategy and development of the integrated circuit industry [J], computer discs and Applications, 2011, (17); 112.。

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