品质系统常见英文缩写简介

品質系統常見英文縮寫簡介

1.QC : quality control 品質管制

2. IQC : incoming quality control 進料品質管制

3. OQC: output quality control 出貨品質管制

4. AQL: acceptable quality level 允收標準

5.PQC: process quality control 製程品質管制也稱IPQC : in process quality control .

6.CQA: customer quality assurance 客戶品質保証

7. MI: minor defeat 次要缺點

8.MA : major defeat 主要缺點9. CR: critical defeat 關鍵缺點

10. SMT: surface mounting technology 表面粘貼技術16. BOM: bill of material 材料清單

11. SMD: surface mounting device 表面粘貼設備SMC: surface mounting component 表面粘貼元件

12. ECN: engineering change notice 工程變更通知13. DCN: design change notice 設計變更通知

14. PCB: printed circuit board 印刷電路板15. PCBA: printed circuit board assembly裝配印刷電路板

17. BIOS: basically input and output system 基本輸入輸出系統

18. MIL-STD-105E: 美國陸軍標準, 也稱單次抽樣計劃.

19. ISO: international standard organization 國際標準化組織22 . Icicles : 錫尖20. DRAM: 內存條

21. Polarity : 電性23 . Non-wetting : 空焊24. Short circuit: 短路25. Missing component : 缺件

26 . Wrong component : 錯件27. Excess component: 多件28. Insufficient solder : 錫少29. Excessive solder: 錫多30. Solder residue: 錫渣31. Solder ball: 錫球32. Tombstone : 墓碑

33 . Sideward : 側立34. Component damage: 零件破損35. Gold finger : 金手指

36. SOP: standard operation process 標準操作流程37. SIP : standard inspection process 標準檢驗流程

38. The good and not good segregation: 良品和不良品區分39. OBW: on board writer 熸錄BIOS

40. Simple random sampling: 簡單隨機抽樣41. Histogram: 直方圖42. Standard deviation : 標準差43. CIP: Continuous improvement program 44. SPC: Statistical process control 45. Sub-contractors: 分包商46. SQE: Supplier quality engineering 47. Sampling sample: 抽樣計劃48. Loader: 治具

49. QTS: Quality tracking system 品質追查系統50. Debug: 調試51. Spare parts :備用品

52 . Inventory report for : 庫存表53. Manpower/Tact estimation 工時預算54. Calibration : 校驗55. S/N: serial number 序號56. Corrugated pad: 波紋墊57. Takeout tray : 內包裝盒58 . Outer box : 外包裝箱

59 . Vericode : 檢驗碼60 . Sum of square : 平方和61 . Range : 全距62. Conductive bag: 保護袋

63. Preventive maintenance :預防性維護64 . Base unit : 基體65. Fixture: 制具

66. Probe: 探針67. Host probe : 主探針68 . Golden card : 樣本卡69. Diagnostics program: 診斷程序70. Frame : 屏面71 . Lint-free gloves : 靜電手套72 .Wrist wrap : 靜電手環73 . Target value : 目標值

74. Related department : 相關部門75. Lifted solder 浮焊76.plug hole孔塞

77. Wrong direction 极性反ponent damage or broken 零件破損

79.Unmeleted solder熔錫不良80.flux residue松香未拭81.wrong label or upside down label貼反

82.mixed parts機種混裝83. Poor solder mask綠漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor課長88. Forman組長89. WI=work instruction作業指導90. B.P.V:非擦除狀態91. Internal notification:內部聯絡單

92. QP: Quality policy品質政策93.QT: Quality target 品質目標94. Trend:推移圖95.Pareto:柏拉圖

96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心線99.R.T.Y: Rolled throughout yield直通率100. PPM: Parts per million 不良率

101.DPU: Defects per unit 單位不良率102.Resistor: 電阻103.Capacitor:電容

104. Resistor array : 排阻105. Capacitor array: 排容106. DIODE: 二極管107.SOT: 三極管

108. Crystal: 震盪器109. Fuse:保險絲110.Bead: 電感111.Connector:聯結器

112.ADM: Administration Department行政單位113. CE: Component Engineering零件工程

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