制程能力评估(中英文)
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P as te Pr in ti n g 印 锡
1#.
Wo
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
2. Sol
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2.17
Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old) 是否建立过版本控制每一有特定细节的特定产品的操作指引？如果有任意未签名/未签日期的手写工艺或任意的 Are Work Instructions readily available to the operator and are they followed at Paste Print? 工艺是否被操作员利用并且在操作时是否按照工艺执行？ Is the Solder Paste specified in the Paste Printing program or on Work Instructions? 焊Is 料the是S否ol详de细r P指a定ste在m印a锡nu计fa划ctu或re工r,艺nu上m？ber, & mesh defined in the Paste Print Program or on Work Instructions? 焊料的制造商，数量与筛选是否定义在印锡计划或工艺上？ Is the Stencil's identification specified in the Paste Printing program or on Work Instructions? 钢网的标识是否定义在印锡计划或工艺上？ Is the Stencil's identification traceable to a specific PCB part number, revision level and board side? 钢网的标识是否可追朔到相应PCB的编码，版本和哪一面？ Is the Stencil loading orientation specified on the Stencil or on Work Instructions? 钢网装载方向是否定义在钢网或工艺上？ Is the Squeegee in use specified in the Paste Print program or Work Instructions? 当前使用的滚轴是否定义在印锡计划或工艺上？ Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions? 支撑块/脚的数量，位置，类型和高度是否定义在工艺上？ Are all hand tools needed by the operator listed with their descriptions on Work Instructions? 所有操作员需要的手工工具是否在工艺上列出清单，并描述清楚？ Has the use of metal tools for the application and/or removal of paste been specifically disallowed? 使用金属工具移动锡点是否被明确禁止？ Is the PCB part number and Revision specified on the Work Instruction or line set-up instructions? PCB的编号和版本是否定义在工艺或开拉确认表中？ Is the PCB orientation to the Stencil identified in the Work Instructions or line set-up instructions? PCB相对于钢网的方向定义在工艺或开拉确认表中？ Is the machine Program Name specified on the Work Instruction or line set-up instructions? 机器的程序名被定义在工艺或开拉确认表中？
Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ？within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内？ Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or，ag是e 否un先it h入av先e出a 控tem制p？er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e，rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p？erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t？emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时，是否有证据证明采取了行动？ Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上？ Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or？use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ，tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p？erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem？perature with its 'seal in place' documented and known?
3. Ste
3.1 3.2 3.3 3Βιβλιοθήκη Baidu4 3.5 3.6 3.7 3.8
3.9
3.10
3.11
3.12
3.13
3.14
4. Sq ue eg ee 滚 轴
4.1
4.2
4.3
4.4
4.5
5. Va cu um Blo ck s an d To oli ng 真 空 吸 尘 模 块 和 工 具
5.1
Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials? 所Ar有e a的ll 钢St网en是cil否s i充de分nt保ifie存d 在wi能th避pr免oc潜es在s p损ro坏of和la密be封ls的or地p方lat？es which are visible when the stencil is in its rack or mounted in the Printer? 所Is 有the的S钢te网nc是il c否le定an义ed明in显a的a制ut程om防at错ic标st签en或cil金cl属ea板ne，r a以t 至the钢e网nd保o存f a或p安ro在du印cti刷on机ru上n的or时af候te能r a一fi目xe了d t然im？e has elapsed? 在生产结束或在一段时间闲致之后，钢网是否被自动的钢网清洁机清洁？ Is there a documented requirement to inspect a Stencil for damage once cleaned? 一旦被清洁，是否有文本请求去检查钢网是否被损坏？ Is the evidence of cleaning and inspection documented? 清Is 洁the和re检a测d钢oc网um的e证nte据d是St否en被ci文l C本le记an录ing？process which identifies the chemicals, wash times, dry times, & consumables to be used? 是Is 否the有re钢a网d清oc洁um过e程nte的d文St本en记ci录l C，le记an录er了m清ain洁te用na的nc化e学pr品oc，ed清ur洗e 时wh间ic，h d烘e干fin时es间fr和eq被ue使nc用y 的for消c费he品ck？ing filters and solution levels? 是Is 否the有re清e洁vid维en护c流e t程o d的e文mo本n记str录at，e t定ha义t t校he验S过ten滤c器il C的le频an率er和's 检M验ain等te级na？nce procedure and records are adequate and up-to-date? 是否有证据去证明钢网清洗机的维护程序和记录是适当的和最新的？
8.2
8.3
8.4
8.5
8.6
8.7
9. PC BA 9.1
9.2
9.3
9.4
PCBA Process Capability Assessment
制程能力评估
Add a 'Y' to the Box if the Process Was Assessed
如果此制程被评估需增加Y于方框内
Assessment Criterion 评估标准
5.2
5.3
6. PC
6.1
6.2
6.3
6.4
6.5
6.6
7. Ma 7.1
7.2
7.3 7.4 7.5 7.6 7.7 7.8 7.9 ### ### ### ### ### ### ### ### ### ### ### ###
8. Sol der Pa ste Ins pe cti on 焊 接 检 查 8.1
Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood by users? 是否有证据去证明锡糕失效时间已经被正确执行，此流程已经完全被使用者使用？ Are Screen Print Operators required to wear gloves when handling Solder Paste? 当取理锡糕时，印锡操作员需要去带手套操作 Is there a specification readily available for the Solder Paste? 是否有通俗易懂的锡糕规格书？ Is the mesh for the Solder Paste used suitable for the pitch technology on the board being built? 是Is 否the锡m糕a的xim滤u筛m被tim适e当th使at用th于e制So造ld板er的P倾as斜te 技is 术all？owed to remain on a board prior to reflow documented, known, & followed? 锡Is 糕the在S回ol流de焊r P之a前ste允lo许t 留co于de板re上co的rd最ed长a时nd间fu是lly否a被nd定e义as，ily知tr道ac，ea遵ble循t？o the individual product serial number product? 锡糕的批量代码是否被记录，且由此能全部容易地追溯到单个的产品系列号？
1#.
Wo
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
2. Sol
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2.17
Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old) 是否建立过版本控制每一有特定细节的特定产品的操作指引？如果有任意未签名/未签日期的手写工艺或任意的 Are Work Instructions readily available to the operator and are they followed at Paste Print? 工艺是否被操作员利用并且在操作时是否按照工艺执行？ Is the Solder Paste specified in the Paste Printing program or on Work Instructions? 焊Is 料the是S否ol详de细r P指a定ste在m印a锡nu计fa划ctu或re工r,艺nu上m？ber, & mesh defined in the Paste Print Program or on Work Instructions? 焊料的制造商，数量与筛选是否定义在印锡计划或工艺上？ Is the Stencil's identification specified in the Paste Printing program or on Work Instructions? 钢网的标识是否定义在印锡计划或工艺上？ Is the Stencil's identification traceable to a specific PCB part number, revision level and board side? 钢网的标识是否可追朔到相应PCB的编码，版本和哪一面？ Is the Stencil loading orientation specified on the Stencil or on Work Instructions? 钢网装载方向是否定义在钢网或工艺上？ Is the Squeegee in use specified in the Paste Print program or Work Instructions? 当前使用的滚轴是否定义在印锡计划或工艺上？ Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions? 支撑块/脚的数量，位置，类型和高度是否定义在工艺上？ Are all hand tools needed by the operator listed with their descriptions on Work Instructions? 所有操作员需要的手工工具是否在工艺上列出清单，并描述清楚？ Has the use of metal tools for the application and/or removal of paste been specifically disallowed? 使用金属工具移动锡点是否被明确禁止？ Is the PCB part number and Revision specified on the Work Instruction or line set-up instructions? PCB的编号和版本是否定义在工艺或开拉确认表中？ Is the PCB orientation to the Stencil identified in the Work Instructions or line set-up instructions? PCB相对于钢网的方向定义在工艺或开拉确认表中？ Is the machine Program Name specified on the Work Instruction or line set-up instructions? 机器的程序名被定义在工艺或开拉确认表中？
Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ？within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内？ Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or，ag是e 否un先it h入av先e出a 控tem制p？er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e，rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p？erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t？emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时，是否有证据证明采取了行动？ Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上？ Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or？use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ，tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p？erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem？perature with its 'seal in place' documented and known?
3. Ste
3.1 3.2 3.3 3Βιβλιοθήκη Baidu4 3.5 3.6 3.7 3.8
3.9
3.10
3.11
3.12
3.13
3.14
4. Sq ue eg ee 滚 轴
4.1
4.2
4.3
4.4
4.5
5. Va cu um Blo ck s an d To oli ng 真 空 吸 尘 模 块 和 工 具
5.1
Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials? 所Ar有e a的ll 钢St网en是cil否s i充de分nt保ifie存d 在wi能th避pr免oc潜es在s p损ro坏of和la密be封ls的or地p方lat？es which are visible when the stencil is in its rack or mounted in the Printer? 所Is 有the的S钢te网nc是il c否le定an义ed明in显a的a制ut程om防at错ic标st签en或cil金cl属ea板ne，r a以t 至the钢e网nd保o存f a或p安ro在du印cti刷on机ru上n的or时af候te能r a一fi目xe了d t然im？e has elapsed? 在生产结束或在一段时间闲致之后，钢网是否被自动的钢网清洁机清洁？ Is there a documented requirement to inspect a Stencil for damage once cleaned? 一旦被清洁，是否有文本请求去检查钢网是否被损坏？ Is the evidence of cleaning and inspection documented? 清Is 洁the和re检a测d钢oc网um的e证nte据d是St否en被ci文l C本le记an录ing？process which identifies the chemicals, wash times, dry times, & consumables to be used? 是Is 否the有re钢a网d清oc洁um过e程nte的d文St本en记ci录l C，le记an录er了m清ain洁te用na的nc化e学pr品oc，ed清ur洗e 时wh间ic，h d烘e干fin时es间fr和eq被ue使nc用y 的for消c费he品ck？ing filters and solution levels? 是Is 否the有re清e洁vid维en护c流e t程o d的e文mo本n记str录at，e t定ha义t t校he验S过ten滤c器il C的le频an率er和's 检M验ain等te级na？nce procedure and records are adequate and up-to-date? 是否有证据去证明钢网清洗机的维护程序和记录是适当的和最新的？
8.2
8.3
8.4
8.5
8.6
8.7
9. PC BA 9.1
9.2
9.3
9.4
PCBA Process Capability Assessment
制程能力评估
Add a 'Y' to the Box if the Process Was Assessed
如果此制程被评估需增加Y于方框内
Assessment Criterion 评估标准
5.2
5.3
6. PC
6.1
6.2
6.3
6.4
6.5
6.6
7. Ma 7.1
7.2
7.3 7.4 7.5 7.6 7.7 7.8 7.9 ### ### ### ### ### ### ### ### ### ### ### ###
8. Sol der Pa ste Ins pe cti on 焊 接 检 查 8.1
Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood by users? 是否有证据去证明锡糕失效时间已经被正确执行，此流程已经完全被使用者使用？ Are Screen Print Operators required to wear gloves when handling Solder Paste? 当取理锡糕时，印锡操作员需要去带手套操作 Is there a specification readily available for the Solder Paste? 是否有通俗易懂的锡糕规格书？ Is the mesh for the Solder Paste used suitable for the pitch technology on the board being built? 是Is 否the锡m糕a的xim滤u筛m被tim适e当th使at用th于e制So造ld板er的P倾as斜te 技is 术all？owed to remain on a board prior to reflow documented, known, & followed? 锡Is 糕the在S回ol流de焊r P之a前ste允lo许t 留co于de板re上co的rd最ed长a时nd间fu是lly否a被nd定e义as，ily知tr道ac，ea遵ble循t？o the individual product serial number product? 锡糕的批量代码是否被记录，且由此能全部容易地追溯到单个的产品系列号？