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Bondstrand 2000m-7000m glassfiber reinforced epoxy(gre) pipe systems for marine service
© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 1 of 28. Printed in The Netherlands.Bondstrand ® 2000M/7000M Glassfiber Reinforced Epoxy (GRE) pipe systems for marine servicewith external pressure requirementsIn 1993, IMO (International Maritime Organisation) issued a resolution (A.18/Res. 753) covering acceptance criteria for assuring ship safety. Major certifying bodies have adopted and implemented these Guidelines in their respective Rules and Regulations for the Classification of Ships.All Bondstrand pipe series used in the marine industry are designed and type-approved by the below major certifying bodies. (A complete list is available, on request)● American Bureau of Shipping (ABS), U.S.A.;● Bureau Veritas, France;● Det Norske Veritas, Norway;● Germanischer Lloyd, Germany;● Lloyd’s Register, United Kingdom;● Nippon Kaiji Kyokai, Japan; ● Registro Italiano Navale (RINA), Italy;● United States Coast Guard (USCG), U.S.A..Maximum operating temperature: up to 121°C.Pipe diameter: 1-40 inch (25-1000 mm).Pipe system design for pressure ratings up to 16 bar.ASTM D-2992 Hydrostatic Design Basis (Procedure B - service factor 0.5);ASTM D-1599 Safety factor of 4:1. Design criteria for external pressure requirements are in accordance with IMO regulations.Bondstrand 2000MASTM D-2310 Classification: RTRP-11FW for static hydrostatic design basis; MDA cured.ASTM D-2310 Classification: RTRP-11FX for static hydrostatic design basis; IPD plies with ASTM F-1173 Classification.Bondstrand 7000MASTM D-2310 Classification: RTRP-11AW for static hydrostatic design basis; MDA cured.ASTM D-2310 Classification: RTRP-11AX for static hydrostatic design basis; IPD plies with ASTM F-1173 Classification.ApprovalsUses and applicationsCharacteristicsA complete library of Bondstrand pipe and fittings in PDS and PDMS-format is available on CD-ROM. Please contact Ameron for details.For specific fire protection requirements, an outher layer of passive fire protection is available.For pipe systems without external pressure requirements, please refer to Bondstrand 3400 product data (FP 835) or contact your Ameron representative.● Ballast● Portable discharge line ● Chlorination ● Stripping lines● Draining ● Tankcleaning (salt water)● Cargo line● Fire protection mains● Sanitary service & sewage ● Various other applicationsTable of Contents GENERAL DATAAdhesives (27)Conversions (28)Engineering design & installation data (28)Hydrostatic testing (28)Important notice (28)Joining system and configuration (3)Mechanical properties (4)Physical properties (4)Pipe series (3)Pipe length (4)Pipe dimensions and weights (7)Pipe performance .....................................................................................................5-6Span length (9)Surge Pressure (28)Ultimate Collapse Pressures (8)FITTINGS DATAAdaptors ...............................................................................................................26-27Bell mouth (25)Couplings (22)Elbows ....................................................................................................................9-11Expansion coupling (26)Flanges .................................................................................................................20-22Joint dimensions Quick-Lock® (8)Joint dimensions Taper/Taper (8)Laterals (17)Nipples (23)Reducers ..............................................................................................................18-19Saddles .............................................................................................................17 & 24Specials (28)Tees .......................................................................................................................11-16© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 2 of 28. Printed in The Netherlands.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 3 of 28. Printed in The Netherlands.Pipe seriesPipeFilament-wound Glassfiber Reinforced Epoxy (GRE) pipe for Bondstrand adhesive-bonding systems. MDA (diaminodiphenylmethane) or IPD (isophoronediamine) cured.FittingsA wide range of lined filament-wound Glassfiber Reinforced Epoxy (GRE) fittings for Bondstrand adhesive-bonding systems. For special fittings, not listed in this product guide, please contact your Ameron representative.FlangesFilament-wound Glassfiber Reinforced Epoxy (GRE) heavy-duty flanges, hubbed and stub-end flanges for Quick-Lock adhesive bonding systems. Standard flange drillingpatterns as per ANSI B16.5 (150 Lb). Other flange drilling patterns, such as ANSI B16.5 (> 150 Lb), DIN, ISO and JIS are also availabe.Bondstrand® 2000MGlassfiber Reinforced Epoxy (GRE) pipe system; IPD or MDA cured.Standard 0.5 mm internal resin-rich reinforced liner.Maximum operating temperature: 121°C for MDA cured and 93°C for IPD cured.Maximum pressure rating: 16 bar.Minimum pressure: full vacuum.External Pressure Requirements: In accordance with IMO Regulations.Bondstrand® 7000M (* conductive)Glassfiber Reinforced Epoxy (GRE) pipe system; IPD or MDA cured.Maximum operating temperature: 121°C for MDA cured and 93°C for IPD cured.Maximum pressure rating: 16 bar.Minimum pressure: full vacuum.External Pressure Requirements: In accordance with IMO Regulations.* ConductiveOur conductive pipe systems have been developed to prevent accumulation of potentially dangerous levels of static electrical charges. Pipe, fittings and flanges contain high strength conductive filaments. Together with a conductive adhesive this provides an electrically continuous system.Description Bondstrand® 2000MBondstrand® 7000MPipe diameter 1-40 inch1-40 inchJoining system Quick-Lock 1-16 inch Quick-Lock 1-16 inchTaper/Taper 18-40 inchTaper/Taper 18-40 inchLiner*0.5 mm -**Temperature 121°C 121°C Pressure Rating16 bar16 bar* Also available without liner;** Above 93°C, derate the pressure rating lineairly to 50% at 121°C.Pipe25-400 mm (1-16 inch):Quick-Lock (straight/taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell end x shaved straight spigot.450-1000 mm (18-40 inch): Taper/Taper adhesive joint.End configuration: Integral Taper bell x shaved taper spigotFitting25-400 mm (1-16 inch):Quick-Lock (straight/ taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell ends.450-1000 mm (18-40 inch): Taper/Taper adhesive joint.End configuration: Integral Taper bell ends.Flanges25-1000 mm (1-40 inch):Quick-Lock (straight/ taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell end.Note: * Pipe nipples, saddles and flanged fittings have different end configurations.Joining system &configurationTypical mechanical properties Nominal Joining Approximate overall Length*Pipe Size System Europe Plant Asia Plant[mm] [inch] [m] [m] 25-40 1-1½ Quick-Lock 5.5 3.0 50-125 2-5 Quick-Lock 6.15 5.85/9.0 150 6 Quick-Lock 6.1 5.85/9.0 200 8 Quick-Lock 6.1/11.8 5.85/9.0 250 10 Quick-Lock 6.1/11.8 5.85/11.89 300-400 12-16 Quick-Lock 6.05/11.8 5.85/11.89 450-1000 18-40 Taper/Taper 11.811.89 * Tolerance +/- 50 mm.Pipe property Units Value Method Thermal conductivity pipe wall W(m.K) .33 Ameron Thermal expansivity (lineair) 10-6 mm/mm °C 18.0 Ameron Flow coefficient Hazen-Williams 150 —Absolute roughness 10-6 m 5.3 —Density kg/m31800 — Specific gravity - 1.8 ASTM D-792Pipe property IPD cured Units 21°C. 93°C. Method Bi-axialUltimate hoop stress at weeping N/mm2300 — ASTM D-1599 CircumferentialHoop tensile strength N/mm2380 — ASTM D-2290 Hoop tensile modulus N/mm223250 18100 ASTM D-2290 Poisson’s ratio axial/hoop — 0.93 1.04 Ameron LongitudinalAxial tensile strength N/mm265 50 ASTM D-2105 Axial tensile modulus N/mm210000 7800 ASTM D-2105 Poisson’s ratio hoop/axial — 0.40 0.45 ASTM D-2105 Axial bending strength — 80 — Ameron BeamApparent elastic modulus N/mm29200 7000 ASTM D-2925 Hydrostatic Design BasisStatic N/mm2148* — ASTM D-2992(Proc. B.)Pipe property MDA cured Units 21°C. 93°C. Method Bi-axialUltimate hoop stress at weeping N/mm2250 — ASTM D-1599 CircumferentialHoop tensile strength N/mm2220 — ASTM D-2290 Hoop tensile modulus N/mm225200 ASTM D-2290 Poisson’s ratio axial/hoop — 0.65 0.81 Ameron LongitudinalAxial tensile strength N/mm280 65 ASTM D-2105 Axial tensile modulus N/mm212500 9700 ASTM D-2105 Poisson’s ratio hoop/axial — 0.40 0.44 ASTM D-2105 Axial bending strength — 85 — Ameron BeamApparent elastic modulus N/mm212500 8000 ASTM D-2925 Hydrostatic Design BasisStatic N/mm2124* — ASTM D-2992(Proc. B.) * At 65°C.Typical physicalpropertiesTypical pipe length© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 4 of 28. Printed in The Netherlands.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 5 of 28. Printed in The Netherlands..Typical pipe performanceBondstrand 2000M (MDA cured) at 21°C.Nominal STISStifness Pipe Pipe Factor Stiffness Size [mm] [inch][kN/m 2] [lb.in] [psi]25 1 2079.1 502 1618740 1½ 618.1 502 4812 50 2 350.6 554 2729 80 3 102.2 554 796 100 4 110.8 1281 863125 5 57.7 1281 449 150 6 33.4 1281 260200 8 35.5 3092 276250 10 36.6 6375 285300 12 35.9 10627 280350 14 36.8 13548 286400 16 36.9 20308 287450 18 36.2 28265 282500 20 36.3 38976 283600 24 36.6 67877 285700 28 36.9 121531 288750 30 36.8 148680 286800 32 37.1 182139 289900 36 36.8 256919 28610004037.7361759294Bondstrand 2000M (IPD-cured) at 21°C. Nominal STISStifness Pipe Pipe Factor Stiffness Size [mm] [inch][kN/m 2] [lb.in] [psi]25 1 2087.4 504 1625140 1½ 620.6 504 483150 2 352.0 556 2740 80 3 102.6 556 799 100 4 111.3 1286 866125 5 57.9 1286 451150 6 33.5 1286 261200 8 35.6 3104 277250 10 36.8 6400 286300 12 36.1 10669 281350 14 36.9 13602 287400 16 37.1 20389 289450 18 36.3 28378 283500 20 36.5 39130 284600 24 36.6 68147 285700 28 36.9 122013 289750 30 36.8 149270 288800 32 37.1 182862 290900 36 36.8 257939 28810004037.7363195295Typical pipe performance Bondstrand 7000M (MDA-cured) at 21°C.Nominal STIS Stifness PipePipe Factor StiffnessSize[mm] [inch] [kN/m2] [lb.in] [psi]25 1 3142.4 797 2446440 1½ 949.6 797 739350 2 534.7 867 416280 3 157.3 867 1225100 4 154.4 1809 1202125 5 80.6 1809 627150 6 46.7 1809 363200 8 39.4 3092 276250 10 38.2 6375 285300 12 37.2 10627 280350 14 38.0 13548 286400 16 37.2 20308 287450 18 38.0 28265 282500 20 37.2 38976 283600 24 36.7 67877 285700 28 37.1 121531 288750 30 36.9 148680 286800 32 37.3 182139 289900 36 36.9 256919 2861000 40 37.9 361759 294Bondstrand 7000M (IPD-cured) at 21°C.Nominal STIS Stifness PipePipe Factor StiffnessSize[mm] [inch] [kN/m2] [lb.in] [psi]25 1 3154.9 800 2456140 1½ 953.3 800 742250 2 536.8 871 417980 3 157.9 871 1230100 4 155.0 1816 1207125 5 80.9 1816 630150 6 46.9 1816 365200 8 35.6 3104 277250 10 36.8 6400 286300 12 36.1 10669 281350 14 36.9 13602 287400 16 37.1 20389 289450 18 36.3 28378 283500 20 36.5 39130 284600 24 36.7 68147 286700 28 37.1 122013 289750 30 36.9 149270 288800 32 37.3 182862 290900 36 36.9 257939 2881000 40 37.9 363195 295© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 6 of 28. Printed in The Netherlands.Typical pipe dimensions and weights Bondstrand 2000M.Nominal Pipe Minimum Average Designation Pipe Inside Struct. Wall Pipe per ASTM Size Diameter Thickness [t] Weight D-2966 [mm] [inch] [mm] [mm] [kg/m] MDA IPD 25 1 27.1 3.0 0.7 RTRP-11 FW1-2112 FX1-3112 40 1½ 42.1 3.0 1.3 RTRP-11 FW1-2112 FX1-3112 50 2 53.0 3.1 1.3 RTRP-11FW1-2112 FX1-3112 80 3 81.8 3.1 1.8 RTRP-11FW1-2112 FX1-3112 100 4 105.2 4.1 3.1 RTRP-11FW1-2113 FX1-3113 125 5 131.9 4.1 3.5 RTRP-11FW1-2113 FX1-3113 150 6 159.0 4.1 4.6 RTRP-11FW1-2113 FX1-3113 200 8 208.8 5.5 7.4 RTRP-11FW1-2116 FX1-3116 250 10 262.9 7.0 12 RTRP-11FW1-2116 FX1-3116 300 12 313.7 8.3 17 RTRP-11FW1-2116 FX1-3116 400 14 337.6 9.0 19 RTRP-11FW1-2116 FX1-3116 400 16 385.8 10.3 25 RTRP-11FW1-2116 FX1-3116 450 18 433.8 11.5 32 RTRP-11FW1-2116 FX1-3116 500 20 482.1 12.8 39 RTRP-11FW1-2116 FX1-3116 600 24 578.6 15.4 56 RTRP-11FW1-2116 FX1-3116 700 28 700.0 18.7 75 RTRP-11FW1-2116 FX1-3116 750 30 750.0 20.0 93 RTRP-11FW1-2116 FX1-3116 800 32 800.0 21.4 102 RTRP-11FW1-2116 FX1-3116 900 36 900.0 24.0 132 RTRP-11FW1-2116 FX1-3116 1000 40 1000.0 26.9 165 RTRP-11FW1-2116 FX1-3116Bondstrand 7000M.Nominal Pipe Minimum Average Designation Pipe Inside Struct. Wall Pipe per ASTM Size Diameter Thickness [t] Weight D-2966 [mm] [inch] [mm] [mm] [kg/m] MDA IPD 25 1 27.1 3.5 0.7 RTRP-11AW1-2112 AX1-3112 40 1½ 42.1 3.5 1.3 RTRP-11AW1-2112 AX1-3112 50 2 53.0 3.6 1.3 RTRP-11AW1-2112 AX1-3112 80 3 81.8 3.6 1.8 RTRP-11AW1-2112 AX1-3112 100 4 105.2 4.6 3.1 RTRP-11AW1-2113 AX1-3113 125 5 131.9 4.6 3.5 RTRP-11AW1-2113 AX1-3113 150 6 159.0 4.6 4.6 RTRP-11AW1-2113 AX1-3113 200 8 208.8 5.5 7.4 RTRP-11AW1-2116 AX1-3116 250 10 262.9 7.0 12 RTRP-11AW1-2116 AX1-3116 300 12 313.7 8.3 17 RTRP-11AW1-2116 AX1-3116 350 14 337.6 9.0 19 RTRP-11AW1-2116 AX1-3116 400 16 385.8 10.3 25 RTRP-11AW1-2116 AX1-3116 450 18 433.8 11.5 32 RTRP-11AW1-2116 AX1-3116 500 20 482.1 12.8 39 RTRP-11AW1-2116 AX1-3116 600 24 578.6 15.4 56 RTRP-11AW1-2116 AX1-3116 700 28 700.0 18.7 75 RTRP-11AW1-2116 AX1-3116 750 30 750.0 20.0 93 RTRP-11AW1-2116 AX1-3116 800 32 800.0 21.4 102 RTRP-11AW1-2116 AX1-3116 900 36 900.0 24.0 132 RTRP-11AW1-2116 AX1-3116 1000 40 1000.0 26.9 165 RTRP-11AW1-2116 AX1-3116© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 7 of 28. Printed in The Netherlands.Ultimate collapse pressure Quick-Lock® dimensions Taper/Taper dimensions Ultimate collapse pressure (ultimate short term external failure pressure) at 21º C. Nominal Internal 2000M 2000M 7000M 7000M Pipe Pressure MDA IPD MDA IPD Size static*[mm] [inch] [bar] [bar] [bar] [bar] [bar] 25 1 16 491 491 714 714 40 1½ 16 160 160 239 239 50 2 16 95 95 141 141 80 3 16 29 29 44 44 100 4 16 31 31 43 43 125 5 16 16.5 16.5 23 23 150 6 16 9.7 9.7 13.5 13.5 200 8 16 10.3 10.3 10.3 10.3 250 10 16 10.7 10.7 10.7 10.7 300 12 16 10.5 10.5 10.5 10.5 350 14 16 10.7 10.7 10.7 10.7 400 16 16 10.7 10.7 10.7 10.7 450 18 16 10.5 10.5 10.5 10.5 500 20 16 10.6 10.6 10.6 10.6 600 24 16 10.7 10.7 10.7 10.7 700 28 16 10.8 10.8 10.8 10.8 750 30 16 10.7 10.7 10.7 10.7 800 32 16 10.8 10.8 10.8 10.8 900 36 16 10.7 10.7 10.7 10.7 1000 40 16 11.0 11.0 11.0 11.0 * Up to 93°C.Nominal Insertion Spigot Diameter Spigot Length Pipe Depth Min. Max. Min. Max.Size (Ds) Sd Sd L L [mm] [inch] [mm] [mm] [mm] [mm] [mm] 25 1 27 32.6 32.9 28.5 31.0 40 1½ 32 47.5 47.8 33.5 36.0 50 2 46 59.2 59.6 49.0 52.0 80 3 46 87.6 88.0 49.0 52.0 100 4 46 112.5 112.9 49.0 52.0 125 5 57 139.5 139.9 58.5 61.5 150 6 57 166.2 166.6 59.0 62.0 200 8 64 217.1 217.5 65.0 68.0 250 10 70 271.3 271.7 71.0 74.0 300 12 76 322.2 322.6 78.0 81.0 350 14 89 353.8 354.2 89.0 93.0 400 16 102 404.1 404.5 103.0 106.0 Dimensions for Quick-Lock Spigots for bonding HD Flanges. Dia of StraightSpigot [Sd] 450 18 111 455.8 500 20 111 506.6 600 24 127 608.2 700 28 152 736.3 750 30 165 788.4 800 32 178 840.5 900 36 163 943.4 1000 40 230 1051.4Dimensions for adhesive Taper spigots for adhesive Taper/Taper joints.Nominal Taper Insertion Nominal Dia of Pipe Angle Depth Spigot Spigot Size Nose Thickn. at NoseX Ds nose Sd [mm] [inch] [degrees] [mm] [mm] [mm] 450 18 2.5 114 4.6 443.0 500 20 2.5 127 5.0 492.2 600 24 3.5 178 3.8 586.3 700 28 1.75 178 6.4 712.9 750 30 1.75 178 4.2 758.4 800 32 1.75 178 8.9 817.8 900 36 1.75 203 5.6 911.3 1000 40 1.75 410 8.11016.3© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 8 of 28. Printed in The Netherlands.Span length Bondstrand 2000M.Nominal Single MDA Contininuous Single IPD ContinuousPipe Size Span* Span* Span* Span*[mm] [inch] [m] [m] [m] [m]25 1 2.6 3.3 2.4 3.040 1½ 2.9 3.7 2.7 3.450 2 3.1 4.0 2.9 3.780 3 3.5 4.5 3.3 4.2100 4 4.0 5.1 3.7 4.7125 5 4.3 5.4 4.0 5.0150 6 4.5 5.7 4.2 5.3200 8 5.1 6.5 4.8 6.1250 10 5.8 7.3 5.3 6.8300 12 6.3 8.0 5.8 7.4350 14 6.5 8.3 6.0 7.7400 16 7.0 8.8 6.4 8.2450 18 7.4 9.3 6.8 8.7500 20 7.7 9.8 7.2 9.1600 24 8.5 10.8 7.9 10.0700 28 9.3 11.8 8.6 11.0750 30 9.6 12.2 8.9 11.3800 32 10.0 12.7 9.2 11.7900 36 10.5 13.4 9.8 12.41000 40 11.1 14.1 10.3 13.1Bondstrand 7000M.MDA IPD25 1 2.5 3.3 2.4 3.040 1½ 2.9 3.8 2.7 3.450 2 3.1 4.1 2.9 3.780 3 3.5 4.5 3.3 4.2100 4 4.0 5.2 3.7 4.7125 5 4.3 5.6 4.0 5.0150 6 4.5 5.9 4.2 5.3200 8 5.0 6.5 4.7 5.9250 10 5.7 7.3 5.3 6.7300 12 6.2 8.0 5.7 7.3350 14 6.4 8.3 6.0 7.6400 16 6.9 8.8 6.4 8.1450 18 7.3 9.3 6.7 8.6500 20 7.7 9.8 7.1 9.0600 24 8.4 10.8 7.8 9.9700 28 9.3 11.8 8.6 10.9750 30 9.6 12.2 8.9 11.3800 32 9.9 12.7 9.2 11.7900 36 10.5 13.4 9.7 12.41000 40 11.1 14.1 10.3 13.0* Span recommendations are based on pipes filled with water having a density of 1000 kg/m3and include no provisions for weights caused by valves, flanges or other heavy objects.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 10of 28.Printed in The Netherlands.Elbows ANSI 45ºElbows ANSI 90ºshort radiusFilament-wound 90° elbows with integral Quick-Lock male ends.*Nominal Laying Maximum Average Pipe Length Working WeightSize (LL) Pressure[mm] [inch][mm] [bar] [kg]50 2 110 12 0.480 3 135 12 0.7100 4 160 12 1.0150 6 198 12 2.4200 8 224 12 3.9250 10 275 12 6.3300123001213.3* Also available with flanges.Filament-wound 45°elbows with integral Quick-Lock male ends.*Nominal Laying Maximum Average Pipe Length Working WeightSize (LL) Pressure[mm] [inch][mm] [bar] [kg]50 2 60 12 0.280 3 71 12 0.4100 4 97 12 0.9150 6 121 12 1.9200 8 134 12 3.9250 10 159 12 8.3300121861210.0* Also available with flanges.Elbows 22½ºEqual TeesQuick-LockFilament-wound 22½°elbows with integral Quick-Lock socket ends 300 12 76 152 16 10.4350 14 83 172 16 12.0400168919116 14.0Filament-wound equal Tee with integral Quick-Lock (1-16 inch) orTaper/Taper (18-40 inch) socket ends for adhesive bonding.6 286 400 143 200 16 6.78 356 484 178 242 16 10.010 432 572 216 286 16 18.012 508 660 254 330 16 29.014 534 712 267 356 16 37.016 584 788 292 394 16 56.018 648 876 324 438 16 69.0 20 712 966 356 483 16 92.024 838 1194 419 597 16 168.028 964 1320 482 660 16 285.030 1016 1372 508 686 16 337.032 1090 1446 545 723 16 459.036 1220 1626 610 813 16 581.01000 4014162236708111816686.0Reducing TeesStandardFabricatedFilament-wound standard and fabricated reducing tees with integral Quick-Lock (1-16 inch) socket ends for adhesive bonding.Nominal Laying Overall LayingOverall Maximum Average100x100x50 4x4x2 105 151 89 135 20 2.1100x100x80 4x4x3 105 151 98 144 20 2.3125x125x50 5x5x2 127 184 102 148 16 3.4125x125x80 5x5x3 127 184 111 157 16 4.0125x125x100 5x5x4 127 184 118 164 16 4.6200x200x150 8x8x6 178 242 168 225 16 11.4250x250x25 10x10x1 83 153 273 300 16 18.1250x250x40 10x10x1½ 100 170 273 305 16 21.0250x250x50 10x10x2 115 185 273 320 16 24.0 250x250x80 10x10x3 115 185 273 320 16 24.0250x250x100 10x10x4 216 286 184 230 16 14.8 250x250x125 10x10x5 216 286 194 251 16 15.2250x250x150 10x10x6 216 286 194 251 16 15.5250x250x200 10x10x8 216 286 203 267 16 16.5300x300x25 12x12x1 84 160 298 325 16 21.2 300x300x40 12x12x1½ 102 178 298 330 16 25.0 300x300x50 12x12x2 117 193 298 344 16 29.0 300x300x80 12x12x3 117 193 298 344 16 29.0 300x300x100 12x12x4 254 330 206 252 16 21.0300x300x150 12x12x6 254 330 219 276 16 22.0 300x300x200 12x12x8 254 330 229 293 16 23.0300x300x250 12x12x10 254 330 241 311 16 24.0350x350x25 14x14x1 81 170 314 341 16 24.0350x350x40 14x14x1½ 99 188 314 346 16 28.0350x350x50 14x14x2 114 203 314 361 16 31.0350x350x80 14x14x3 114 203 314 361 16 31.0350x350x100 14x14x4 114 203 314 361 16 31.0350x350x150 14x14x6 267 356 244 301 16 29.0350x350x200 14x14x8 267 356 254 318 16 30.0 350x350x250 14x14x10 267 356 267 337 16 32.0 350x350x300 14x14x12 267 356 279 355 16 34.0400x400x25 16x16x1 85 187 338 365 16 29.0400x400x40 16x16x1½ 103 205 338 370 16 33.0400x400x50 16x16x2 118 220 338 384 16 37.0400x400x80 16x16x3 118 220 338 384 16 37.0400x400x100 16x16x4 118 220 338 384 16 37.0400x400x150 16x16x6 292 394 264 321 16 37.0400x400x200 16x16x8 292 394 273 337 16 38.0400x400x250 16x16x10 292 394 283 353 16 41.0400x400x300 16x16x12 292 394 295 371 16 45.0400x400x350 16x16x14 292394 292 381 16 49.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees; Filament-wound standard and fabricated reducing tees with integral.Reducing Tees Taper/Taper (18-40 inch) socket ends for adhesive bonding.Nominal Laying Overall Laying Overall Maximum AveragePipe Length Length Length Length Working Weight450x450x400 18x18x16 324 438 319 421 16 69.0500x500x25 20x20x1 88 215 382 409 16 35.0500x500x40 20x20x1½ 88 215 382 414 16 35.0500x500x50 20x20x2 88 215 382 428 16 36.0500x500x80 20x20x3 100 227 382 428 16 39.0500x500x100 20x20x4 113 240 382 428 16 43.0500x500x150 20x20x6 138 265 391 448 16 50.0500x500x250 20x20x10 356 483 344 414 16 77.0500x500x300 20x20x12 356 483 345 421 16 82.0500x500x350 20x20x14 356 483 343 432 16 85.0500x500x400 20x20x16 356 483 344 446 16 85.0500x500x450 20x20x18 356 483 350 464 16 89.0600x600x25 24x24x1 88 266 430 457 16 51.0600x600x40 24x24x1½ 88 266 430 462 16 51.0600x600x50 24x24x2 88 266 430 476 16 52.0600x600x80 24x24x3 100 278 430 476 16 56.0600x600x100 24x24x4 113 291 430 476 16 61.0600x600x150 24x24x6 138 316 439 496 16 69.0600x600x200 24x24x8 419 597 412 476 14 78.0600x600x250 24x24x10 419 597 386 456 16 85.0600x600x300 24x24x12 419 597 408 484 16 85.0600x600x350 24x24x14 419 597 394 483 16 101.0600x600x400 24x24x16 419 597 395 497 16 123.3600x600x450 24x24x18 419 597 413 527 16 137.0600x600x500 24x24x20 419 597 406 533 16 156.0700x700x25 28x28x1 88 266 491 518 16 59.0700x700x40 28x28x1½ 88 266 491 523 16 59.0700x700x50 28x28x2 88 266 491 537 16 59.0700x700x80 28x28x3 100 278 491 537 16 64.0700x700x100 28x28x4 113 291 491 537 16 70.0700x700x150 28x28x6 138 316 500 557 16 80.0700x700x350 28x28x14 482 660 490 579 16 147.0700x700x400 28x28x16 482 660 500 602 16 166.0700x700x450 28x28x18 482 660 500 614 16 189.0700x700x500 28x28x20 482 660 506 633 16 210.0700x700x600 28x28x24 482 660 506 684 16 252.0750x750x25 30x30x1 88 266 516 543 16 63.0750x750x40 30x30x1½ 88 266 516 548 16 63.0750x750x50 30x30x2 88 266 516 562 16 63.0750x750x80 30x30x3 100 278 516 562 16 69.0750x750x100 30x30x4 113 291 516 562 16 74.0750x750x150 30x30x6 138 316 525 582 16 85.0750x750x300 30x30x12 508 686 756 832 16 118.0750x750x350 30x30x14 508 686 722 811 16 157.0750x750x400 30x30x16 508 686 698 800 16 178.0750x750x450 30x30x18 508 686 488 602 16 202.0750x750x500 30x30x20 508 686 495 622 16 225.0750x750x600 30x30x24 508 686 481 659 16 270.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees.Reducing Tees (C’tnd) StandardFabricated Filament-wound standard and fabricated reducing tees with integra l Taper/Taper (18-40 inch) socket ends for adhesive bonding.800x800x750 32x32x30 545 723 534 712 16 387.0 900x900x25 36x36x1 88 291 591 618 16 78.0 900x900x40 36x36x1½ 88 291 591 623 16 78.0 900x900x50 36x36x2 88 291 591 637 16 78.0 900x900x80 36x36x3 100 303 591 637 16 85.0 900x900x100 36x36x4 113 316 591 637 16 92.0 900x900x150 36x36x6 138 341 600 657 16 105.0 900x900x400 36x36x16 610 813 563 665 16 270.0 900x900x450 36x36x18 610 813 563 677 16 290.0 900x900x500 36x36x20 610 813 563 690 16 323.0 900x900x600 36x36x24 610 813 541 719 16 387.0 900x900x700 36x36x28 610 813 570 748 16 459.0 900x900x750 36x36x30 610 813 584 762 16 484.0 1000x1000x400 40x40x1 120 530 641 668 16 92.0 1000x1000x450 40x40x1½ 120 530 641 673 16 92.0 1000x1000x500 40x40x2 120 530 641 687 16 92.0 1000x1000x600 40x40x3 132 542 641 687 16 100.0 1000x1000x600 40x40x24 708 1118 593 771 16 457.0 1000x1000x700 40x40x28 708 1118 632 810 16 541.0 1000x1000x750 40x40x30 708 1118 633 811 16 571.0 1000x1000x800 40x40x32 708 1118 652 830 16 605.0 1000x1000x900 40x40x36 708 1118 652 855 16 634.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees.250x250x50 10x10x2 115 185 322 16 25.6 250x250x80 10x10x3 115 185 323 16 26.3 300x300x25 12x12x1 84 160 329 16 22.3 300x300x40 12x12x1½ 102 178 334 16 26.1 300x300x50 12x12x2 117 193 348 16 30.2 300x300x80 12x12x3 117 193 349 16 30.9 350x350x25 14x14x1 81 170 344 16 24.3 350x350x40 14x14x1½ 99 188 349 16 28.4 350x350x50 14x14x2 114 203 363 16 32.7 350x350x80 14x14x3 114 203 369 16 33.4 350x350x100 14x14x4 114 203 364 16 34.2 400x400x25 16x16x1 85 187 369 16 29.1 400x400x40 16x16x1½ 103 205 374 16 33.8 400x400x50 16x16x2 118 220 388 16 38.5 400x400x80 16x16x3 118 220 389 16 39.2 400x400x100 16x16x4 118 220 389 16 39.9Note: Other sizes, or multiple size branched tees available on request. Please contact Ameron.500x500x80 20x20x3 100 227 433 16 41.4 500x500x100 20x20x4 113 240 433 16 45.9 500x500x150 20x20x6 138 265 454 16 54.8 600x600x25 24x24x1 88 266 460 16 51.9 600x600x40 24x24x1½ 88 266 467 16 52.0 600x600x50 24x24x2 88 266 480 16 53.0 600x600x80 24x24x3 100 278 481 16 58.2 600x600x100 24x24x4 113 291 481 16 63.4 600x600x150 24x24x6 138 316 502 16 73.7 700x700x25 28x28x1 88 266 521 16 59.3 700x700x40 28x28x1½ 88 266 527 16 59.3 700x700x50 28x28x2 88 266 541 16 60.5 700x700x80 28x28x3 100 278 542 16 66.5 700x700x100 28x28x4 113 291 542 16 72.6 700x700x150 28x28x6 138 316 563 16 84.5 750x750x25 30x30x1 88 266 546 16 63.2 750x750x40 30x30x1½ 88 266 552 16 63.4 750x750x50 30x30x2 88 266 566 16 64.4 750x750x80 30x30x3 100 278 567 16 70.8 750x750x100 30x30x4 113 291 567 16 77.1 750x750x150 30x30x6 138 316 588 16 89.8 800x800x25 32x32x1 88 266 571 16 66.9 800x800x40 32x32x1½ 88 266 576 16 67.2 800x800x50 32x32x2 88 266 590 16 68.1 800x800x80 32x32x3 100 278 590 16 74.9 800x800x100 32x32x4 113 291 590 16 81.6 800x800x150 32x32x6 138 316 610 16 94.9 900x900x25 36x36x1 88 291 621 16 78.3 900x900x40 36x36x1½ 88 291 627 16 78.6 900x900x50 36x36x2 88 291 641 16 79.6 900x900x80 36x36x3 100 303 642 16 87.0 900x900x100 36x36x4 113 316 642 16 94.4 900x900x150 36x36x6 138 341 663 16 109.2 1000x1000x25 40x40x1 120 530 672 16 92.3 1000x1000x40 40x40x1½ 120 530 677 16 92.6 1000x1000x50 40x40x2 120 530 691 16 93.7 1000x1000x80 40x40x3 132 542 692 16 103.0Note: Other sizes, or multiple size branched tees available on request. Please contact Ameron.Bushing Saddles 45º Laterals Filament-wound pipe saddles with stainless steel, 1/2 inch and 3/4 inchthreaded bushings.*Nominal Angle Saddle Saddle Maximum Average Required250 10 180 100 14 16 1.6 1 1 300 12 180 100 14 12 1.9 1 1 350 14 180 100 14 12 2.1 1 1 400 16 180 100 14 12 2.5 - 2 450 18 90 100 14 12 3.3 - 1 500 20 90 100 14 12 3.7 1 1 600 24 90 100 14 12 4.4 - 2* Consult Ameron for other type material, or other sized bushings.Filament-wound 45° laterals with integral Quick-Lock socking ends.Nominal Laying Overall Laying Overall Maximum Average Pipe Length Length Length Length Working Weight Size (LL1) (OL1) (LL2) (OL2) Pressure[mm] [inch] [mm] [mm] [mm] [mm] [bar] [kg] 50 2 64 110 203 249 16 1.6 80 3 76 122 254 300 16 3.0 100 4 76 122 305 351 16 3.9 125 5 89 146 337 394 16 5.8 150 6 89 146 368 425 16 6.8 200 8 114 178 445 509 16 12.0 250 10 127 197 521 591 12 21.0 300 12 140 216 622 698 12 30.0 350 14 140 229 622 711 12 39.0 400 16 140 242 622 724 12 54.0。
腾云联盟2023-2024学年度上学期高三年级10月联考化学试卷及答案
2023—2024学年度上学期高三年级十月联考化学试卷试卷满分：100分＊祝考试顺利＊注意事项：1答题前，先将自己的姓名、准考证号填写在试卷和答题卡上，并将准考证号条形码粘贴在答题卡上的指定位置。
2选择题的作答：每小题选出答案后，用2B铅笔把答题卡上对应题目的答案标号涂黑。
写在试卷、草稿纸和答题卡上的非答题区域均无效。
3非选择题的作答：用黑色签字笔直接答在答题卡上对应的答题区域内。
写在试卷、草稿纸和答题卡上的非答题区域均无效。
4考试结束后，请将本试卷和答题卡一并上交。
可能用到的相对原子质量：H1 N 14 0 16 F 19 Mg 24-S 32 K 39 Fe 56 Ni 59 一、选择题：本题共15小题，每小题3分，共45分。
在每小题给出的四个选项中，只有一项是符合题目要求的。
l．生活中处处有化学。
下列说法正确的是A.食用白糖的主要成分：庶糖B.水煤气的主要成分：甲烧C.84消毒液的主要成分：次氯酸钙D.植物油的主要成分：高级脂肪酸2.湖北大冶铁矿素有江南“聚宝盆”的美称。
下列说法正确的是A.生铁属于碳素钢B.，铁元素位千d区c.铁强化酱油中铁为单质 D.常用KSCN检验Fe2+3.2016年IUPAC将117号元素命名为础(Ts)。
下列关于帘Ts和帘Ts的说法正确的是A.二者互为同位素B.都含有117个中子C.含有不同的电子数D.分别含有176个和177个质子4.两种有机物的分子式均为C3压o,二者的沸点信息如下图所示。
：丙醇：91.2·c 下列说法错误的是A.二者互为同分异构体c.一氯代物均有4种甲乙酸：10.8-CB.碳原子均为sp3杂化D.丙醇分子间存在氢键化学试卷第1.页（共8页）5.制备过氧化锡晶体的原理为S产＋H心计8H20=Sr02·8比Ot+2H.，装置如下图所示。
下列说法错误的是A.该反应为氧化还原反应B.仪器X的作用是防倒吸C.氨气的作用是中和H+D.冰水混合液可减少Sr02·8比0分解6.设凡为阿伏加德罗常数的值。
pbs使用手册
pbs使用手册PBS（Portable Batch System）是一种用于管理和调度作业的软件系统，广泛应用于高性能计算和云计算环境。
以下是PBS使用手册的简要介绍：1. 作业提交：用户可以使用PBS命令行工具或脚本提交作业。
提交作业时，需要指定作业的名称、脚本文件、执行所需的资源等信息。
作业提交后，PBS会将作业放入队列中等待调度。
2. 作业调度：PBS使用作业调度器来决定作业的执行顺序。
调度器会根据作业的优先级、资源需求和可用资源的情况来选择合适的作业执行。
3. 作业执行：一旦作业被调度器选中，PBS会将作业分配到指定的计算节点上执行。
在作业执行期间，PBS会监控作业的运行状态，确保资源的正确使用和管理。
4. 作业管理：用户可以通过PBS命令行工具或Web界面查看作业的状态、资源使用情况、执行日志等信息。
用户还可以对作业进行控制，如暂停、恢复、杀死等操作。
5. 资源管理：PBS提供了一套完整的资源管理机制，包括对计算节点、存储设备和网络资源的管理。
用户可以通过PBS来申请和释放资源，以满足作业的资源需求。
6. 用户认证和权限管理：PBS支持用户认证和权限管理功能，以确保只有授权用户才能提交和管理作业。
用户需要使用有效的用户名和密码登录系统，并具有相应的权限来执行特定的操作。
7. 日志和监控：PBS提供了详细的日志记录和监控功能，以便用户了解作业的执行情况和系统的运行状态。
用户可以通过查看日志文件来获取作业的执行日志、系统事件等信息。
以上是PBS使用手册的简要介绍，具体的操作细节和配置选项可能因版本和实际应用而有所不同。
建议查阅具体版本的PBS文档或向专业人员咨询以获得更详细的信息和使用指导。
PI2EQX502TZHE SMA EVB User Guide
For the customer use onlyPI2EQX502TZHE SMA EVB User Guide IntroductionPericom Semiconductor’s PI2EQX502T is a low power, high performance 5.0 Gbps signal ReDriver specifically for the USB 3.0 protocol.The device provides programmable equalization and De-Emphasis to optimize performance over a variety of physical mediums by reducing Inter-Symbol Interference.PI2EQX502T supports two 100Ω Differential CML data I/O’s between the Protocol ASIC to a switch fabric, over cable, or to extend the signals across other distant data pathways on the user’s platform.This user guide describes how to use PI2EQX502TZHE SMA EVB for evaluation.Figure1 shows top view and bottom view of PI2EQX502TZHE SMA EVB.Figure1a. TOP view of PI2EQX502TZHE SMA EVBPericom Semiconductor Corp.For the customer use onlyFigure1b. Bottom view of PI2EQX502TZHE SMA EVBBoard Operationz Logical Block DiagramFigure2 shows the logical block diagram of PI2EQX502TZHE.Figure2. Logical Block Diagram of PI2EQX502TZHEPericom Semiconductor Corp.For the customer use only z Board Setting and Operation1) Power SupplyOn the EV board, there is one way for the power supply below.Two 3-Pin headers are for this 3.3V power and ground input.Figure3. Power Input for PI2EQX502TZHE SMA board2) Configuration ControlPI2EQX502TZHE provides pin control for EQ_A/B, DE_A/B and OS_A/B on EVB like in dark blue below.Figure4. Pin control for PI2EQX502TZHE SMA boardOn PI2EQX502TZHE EVB, Below are description and configuration tables for equalization, de-emphasis and swing control setting.Equalization SettingEQ_A and EQ_B are the selection pins for the equalization selection for ChA and ChB in Table2 below. EQ_A or EQ_B can be selected by 3pin headers for 0, open and 1 option to separately 3dB, 6dB and 9dB. N ote for 12dB, the user needs to hand-solder one 48kohm resistor between EQ_A/B and ground like Figure5.Pericom Semiconductor Corp.For the customer use onlyPericom Semiconductor Corp.Table2. Equalizer Configuration Selection Table for PI2EQX502TZHEFigure5. 48Kohm Resistor hand-soldered for 12dB selection of EQ_A/B on PI2EQX502TZHE SMA boardDe-emphasis Setting:DE_A and DE_B are the selection pins for the equalization selection for ChA and ChB in Table3 below. DE_A orDE_B can be selected by 3pin headers for 0, open and 1 option to separately 0dB, -3.5dB and -6dB.Table3. De-emphasis Configuration Selection Table for PI2EQX502TZHER=48KohmR=48KohmFor the customer use onlyPericom Semiconductor Corp.Swing Setting:OS_A and OS_B are the selection pins for the equalization selection for ChA and ChB in Table4 below. OS_A or OS_B can be selected by 3pin headers for 0(GND) and 1(VDD) option to separately 700mV and 1000mV.Table4. Swing Configuration Selection Table for PI2EQX502TZHE3) EVB Test ConnectionFigure6 is the test connection example for AI signal input and AO signal output.Figure6. Test connection with PI2EQX502TZHE SMA boardPower Supply for3.3V Power and GNDFor the customer use onlyPericom Semiconductor Corp.Appendix A: PCB SchematicAppendix B: PCB Stack-upFor the customer use only HistoryVersion 1.0 Original Version 2014/1/27Pericom Semiconductor Corp.。
大型显示器产品说明书
The Large Displays are easy to configure and scale to virtually any engineering units with the push buttons on the front panel, or with a personal computer using the free configuration software and the optional Ethernet connectivity or Serial Communications.The Ethernet option allows the device to be connected on a standard Ethernet network and communicates using standard TCP/IP protocol. The Ethernet option (-C4EI) also includes RS485 (and RS422) Serial Communications. The serial communications option (-C24) includes both RS232 and RS485 (and RS422) on one instrument. It communicates with a straightforward ASCII communications protocol, as well as MODBUS protocol.Control FunctionsThe Universal Large Displays features a choice of two optional outputs: Form C SPDT (single pole double throw) mechanical relays (-3), Solid State Relays (-2), DC pulse (-4), and/or programmable analog output (-5) selectable as either a controlling function or as retransmission of the process value.The Universal Large Displays can control simple manual operation to ON-OFF and full Autotune PID control. (Selectable preset tune, adaptive tune, PID, PI, PD control modes.) The dual control outputs can be configured for a variety of independent control and alarm applications. The ramp-to-setpoint feature allows the user to define the rate of rise to setpoint, minimizing thermal shock to the load during start-up. Maximum ramp time: 99.59 (HH.MM), Soak: 00.00 to 99.59 (HH.MM), Damping: 1 to 8 in unit steps. Input types: 0 to 20 mA, 0 to 100 mV, 0 to 1 V and 0 to 10 Vdc. For applications that do not require PID control,Universal Large Displays controllers are available in a special model that offer simplified programming. The Universal Large Displays “Simplified Menu” model (specify -SM option) offers simplified programming. The menu flowchart is similar to programmable digital panel meters that are used for on/off control or alarms. (Please see the Universal Large Displays operator’s manuals for programming details.)Meters shown smallerthan actual size.Large DisplayMeters and ControllersThe Large Displays can handle a wide variety of signal inputs direct from transducer or process transmitters and offer multiple control output options and serial or Ethernet connectivity for logging the data.The “Universal Temperature+Process LargeDisplay ” (iLD-UTP) is designed for Thermocouples, RTD’s, and Process (DC) Voltage or Current. Ithandles TEN (10) thermocouple types: K, J, T, E, R, S, B, C, N, & J DIN.It works with a wide selection of RTD’s, both Pt. 0.00385 and 0.00392 curves for 100 Ω, 500 Ω, and 1000 Ω and it measures with 2, 3, or 4 wireconnections for the highest accuracy. This model also measures process voltage: 0 to 100 mV , 0 to 1V , 0 to 10V ranges and process current, 0 to 20 mA(4 to 20 mA) with built-in excitation of 24 Vdc standard.The “Universal Strain+Process Large Display ” (iLD-SP) handles a wide variety of DC voltage and current outputs from all common load cells, pressure transducers, and most any strain gagetype of transducer. The meter measures input ranges of 0 to 100 mV , -100 mV to 1V , 0 to 10V , 0 to 20 mA (4 to 20 mA) with built-in excitation of 5 Vdc and 10 Vdc standard. This model also features 10 point linearization enabling accurate measurements from a wide assortment of unique and nonlinear transducers.U U L and cUL Certified U B ig Bright LED 4-Digits U P rogram to Change Colors: RED, AMBER, GREEN U T emperature and Process Input Models U S train and Process Input Models U O ptional Relays, DC Pulse, and Analog Outputs for Alarm and Full PID Control U C ommunications Via Ethernet, RS232, RS485, and MODBUS ®U E mbedded Web Server U RoHS 2 Compliant57 and 101 mm (2.25 and 4")Displays Available!iLD-UTP and iLD-SP Series51Universal Temperature and Process Input (Model UTP)Accuracy: ±0.5°C temp; 0.03% reading processResolution: 1°/0.1°; 10 µV process Temperature Stability: RTD: 0.04°C/°CThermocouple @ 25°C (77°F):0.05°C/°C—cold junction compensation Process: 50 ppm/°CNMRR: 60 dB; CMRR: 120 dB A/D Conversion: Dual slopeReading Rate: 3 samples per second Digital Filter: ProgrammableDisplay : 4-digit, 7-segment LED 57.2 mm (2.25") or 101.6 mm (4.00") red, green and amber programmable colors for process variable, set point and temperature unitsInput Types: Thermocouple, RTD, analog voltage, analog currentThermocouple Lead Res: 100 Ω max Thermocouple Type (ITS 90): J, K, T , E, R, S, B, C, N, LRTD Input (ITS 68): 100/500/1000 Ω Pt sensor, 2-, 3- or 4-wire; 0.00385 or 0.00392 curveVoltage Input: 0 to 100 mV , 0 to 1 V , 0 to 10 VdcInput Impedance: 10 M Ω for 100 mV 1 M Ω for 1 or 10 VdcCurrent Input: 0 to 20 mA (5 Ω load)Configuration: Single-ended Polarity: UnipolarStep Response: 0.7 sec for 99.9%Decimal Selection: Temperature: None, 0.1Process: None, 0.1, 0.01 or 0.001Setpoint Adjustment: -1999 to 9999 cts Span Adjustment: 0.001 to 9999 cts Offset Adjustment: -1999 to 9999Excitation (Optional in Place of Communication): 24 Vdc @ 25 mAUniversal Strain and Process Input (Model SP)Accuracy: 0.03% reading Resolution: 10/1µVTemperature Stability: 50 ppm/°C NMRR: 60 dB; CMRR: 120 dB A/D Conversion: Dual slopeReading Rate: 3 samples per second Digital Filter: Programmable Input Types: Analog voltage, analog currentVoltage Input: 0 to 100 mVdc, -100 mVdc to 1 Vdc, 0 to 10 VdcInput Impedance: 10 M Ω for 100 mV; 1 M Ω for 1 V or 10 VdcCurrent Input: 0 to 20 mA (5 Ω load)Linearization Points: Up to 10 Linearization PointsConfiguration: Single-ended Polarity: UnipolarStep Response: 0.7 sec for 99.9%Decimal Selection: None, 0.1, 0.01 or 0.001Setpoint Adjustment: -1999 to 9999 cts Span Adjustment: 0.001 to 9999 cts Offset Adjustment: -1999 to 9999Excitation (Optional in Place of Communication):5 Vdc @ 40 mA; 10 Vdc @ 60 mACommunication OptionsEthernet: Standards compliance IEEE 802.3 10Base-TSupported Protocols: TCP/IP , ARP , HTTPGETRS232/RS422/RS485/MODBUS ®: Selectable from menu; both ASCII and MODBUS protocol selectable from menu; programmable 300 to 19.2 K baud;complete programmable setup capability; program to transmit current display,alarm status, minimum/maximum, actual measured input value and status RS485: Addressable from 0 to 199Connection: Screw terminals Control for UTP, SP Action: Reverse (heat) or direct (cool)Alarm 1 and 2 (Programmable)Operation: High/low, above/below, band, latch/unlatch, normally open/normally closed and process/deviation; front panel configurationsIsolationPower to Input/Output: 2300 Vac per 1 min test (RS232 or RS485, input or output)Between Inputs: 500 Vac per 1 min testGeneralPower: 100 to 240 Vac ±10%, 50/60 Hz 22.5 WEnvironmental Conditions: 0 to 40°C (32 to 104°F), 90% RH non-condensing Warm-Up to Rated Accuracy: 60 minutesProtection: NEMA 1 (IP65) front bezel DimensionsiLD24: 289 L x 137 W x 73 mm D (11.75 x 5.375 x 2.875")iLD44: 480 L x 211 W x 95 mm D (18.11 x 8.31 x 3.76")Factory Scaling (-FS) is available if you prefer the unit to be fully configured before shipment.Please provide your selections forOrdering Example: iLD24-UTP-33-C24, large 57.2 mm (2.25") 4-digit controller with temperature/process input, 2 relays and serial communication.Programmable Color Display The Large Display can be programmed to change colorsbetween RED , AMBER , and GREEN at any set point or alarm point. The Large Display has a wide range of signal inputs as well as control, alarm, and communication outputs including: RS232, RS485, MODBUS ®, and Ethernet. The device with anembedded Web Server can connect directly to Ethernet/Internet. Y ou can “see” your meter and control your process through a web browser over the Internet from halfway around the world. With the Large Display, you can also see your meter from a hundred feet.The Large Display can be mounted flush in a panel or surface mounted with the included brackets. The entire Large Display enclosure provides NEMA 1 protection.Configuration of the iLD-UTP or iLD-SP can be performed by using either -C24 or -C4EI options and the configuration software that is available on our website.2。
高分子物理实验-聚合物复合材料中填料与基体间的相互作用
动态流变仪测聚合物复合材料中填料与基体间的相互作用2011011743 分1 黄浩同组实验者：刘念实验日期：2014-3-26一、实验目的1. 知道旋转流变仪的基本功能以及适用范围。
2．了解旋转流变仪的基本结构、工作原理。
3．掌握采用旋转流变仪测量聚合物的动态粘度的方法。
4. 掌握采用旋转流变仪测量聚合物与纳米片层测量微观相互作用的方法。
二、实验仪器Anton Paar Physica 301 旋转流变仪、空气压缩机、循环泵槽、不同比例的淀粉填充PBS 复合材料、铜铲、铜刷三、实验原理聚合物受外力作用时，会发生流动与变形，产生内应力。
流变学所研究的就是流动、变形与应力间的关系。
旋转流变仪是现代流变仪中的重要组成部分，它们依靠旋转运动来产生简单剪切流动，可以用来快速确定材料的粘性、弹性等各方面的流变性能。
旋转流变仪一般是通过一对夹具的相对运动来产生流动的。
引入流动的方法有两种：一种是驱动一个夹具，测量产生的力矩，这种方法最早是由Couette在1888年提出的，也称为应变控制型，即控制施加的应变，测量产生的应力；另一种是施加一定的力矩，测量产生的旋转速度，它是由Searle于1912年提出的，也称为应力控制型，即控制实际的应力，测量产生的应变。
实际用于粘度等流变性能测量的几何结构有同轴圆筒（Couette）、锥板和平行板等。
选择流变仪的测试模式一般可以分为稳态测试、瞬态测试和动态测试，区分它们的标准是应变或应力施加的方式。
本实验着重介绍动态测试模式，动态测试主要指对流体施加振荡的应变或应力，测量流体相应的应力或应变。
动态测试中，可以使用在被测材料共振频率下的自由振荡，或者采用在固定频率下的正弦振荡。
这两种方式都可用来测量粘度和模量，不同的是在固定频率下的正弦振荡测试在得到材料性能频率依赖性的同时，还可得到其性能的应变或应力依赖性。
在动态测试中，流变仪可以控制振动频率、振动幅度、测试温度和测试时间。
溴芬酸钠滴眼液对碱烧伤诱导大鼠角膜新生血管的抑制作用
pbs提交作业
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--其中常用的几项是：NDS 表示请求的节点数目，Req’d Memory 表示请求的内存 大小，Req’d Time 表示请求的 cpu 时间，S 表示任务的当前状态， Elap Time 表示任 务已经运行的时间。由于本例中没有请求节点数目、内存大小以及 cpu 时间，所以均 没有显示，而任务当前处于等待状态，所以 Elap Time 也没有显示。 -f：qstat –f sequence-number 可以查询任务标识号为 sequence-number 的任务状态， 这个任务标识号是在任务提交时系统自动赋予的。例如： [yaliang@cnode03 mpi]$ qstat -f 572 Job Id: ode01 Job_Name = test Job_Owner = yaliang@cnode03 job_state = W queue = default server = cnode01 Checkpoint = u
mem ncpus nice pcput pmem pvmem vmem walltime custom resources
任务的所有进程能够分配到的最大物理内存数 请求的 cpu 数 任务运行时的 nice 优先级值 任务的任何一个进程拥有的最大 cpu 执行时间 任务的任何一个进程能够分配到的最大物理内存数 任务的任何一个进程能够使用的虚拟内存的最大数 任务的所有并发进程能够使用的最大虚存数 任务可以处于运行态的最大 wall-clock 时间 用户自定义资源
� 资源请求的两种方式： a、资源块方式：资源块是将任务所需的资源作为一个整体，这个整体中说明 …]， 了所需要的各种资源的数目。其格式为：-l select=[N:]chunk[+[N:]chunk select=[N:]chunk[+[N:]chunk… 如qsub –l select=2:ncpus=3:mem=4gb:arch=linux ，select=2表示需要2个这样 的资源块，一个资源块包括3个cpu，4gb的内存，系统结构要求是linux，即总 共需要6个cpu ，8gb的内存。再如： -l select=2:ncpus=1:mem=10GB+3:ncpus=2:mem=8GB:arch=solaris 注意中间的+号，是两个资源块的分隔符 .] b、 请求全任务(job-wide) 资源： 格式为 –l keyword=value[,keyword=value .. ...] 如：qsub -l ncpus=4,mem=123mb,arch=linux � 任务（程序或命令） ：可以是用户程序（如C程序） ，也可以是系统命令 下面是一个完整的任务脚本例子，脚本名为 mytask： 1) #!/bin/sh //指明所用的 shell 2) #PBS –N mytask //设置任务名称 3) #PBS -l walltime=1:00:00 //请求任务执行时间 4) #PBS -l select=ncpus=4:mem=400mb //请求任务执行所需资源 5) #PBS -j oe //设置相关属性(文件合并) 6) date /t //系统命令（打印日期时间） 7) .\my_application //所要执行的任务(当前目录名为 // my_application的任务) 8) date /t // 系统命令 第 1 行说明所用的 shell ；第 2 至 5 行是 pbs 指示语句，设置了任务的一些属性，并 请求了资源；第 6 至 8 行是要执行的命令及任务。 编写完脚本后，使用 qsub 命令提交脚本，在 shell 下输入： qsub mytask 后敲回车。 系统会输出一个 任务标识符： sequence-number.servername ，如 ode01 。 sequence-number 是任务编号，后面需要用这个号查看任务的执行状态，servername 是 pbs server 的名称。
IMP811 IMP812电源管理说明书
POWER MANAGEMENTApplicationsR eset ThresholdSuf f i x V olt ag e (V) L 4.63 M 4.38 J 4.00 T 3.08 S 2.93 R 2.63 Z 2.32The IMP811/IMP812 are low-power supervisors designed to monitor voltage levels of 2.5V,3.0V, 3.3V and 5.0V power supplies in low-power micro-processor (µP), microcontroller (µC) and digital systems. Each fea-tures a debounced manual reset input. The IMP811/812 are improved drop-in re-placements for the Maxim MAX811/812 with ex-tended temperature specifications to 125°C.A reset signal is issued if the power supply voltage drops below a preset threshold and is asserted for at least 140ms after the supply has risen above the reset threshold. The IMP811 has an active-low output RESET that is guaranteed to be in the correct state for VCC down to 1.1V. The IMP812 has an active-high output RESET. The reset comparator is de-signed to ignore fast transients on VCC.Low power consumption makes the IMP811/IMP812 ideal for use in portable and battery-operated equipment. Available in a compact 4-pin SOT143 package, the devices use minimal board space.Three voltage thresholds are available to support 2.5V to 5V systems:General Description• Improved Maxim MAX811/MAX812 replacement—Specified to 125°C • 6µA supply current• Monitor 5V,3.3V,3V and 2.5V supplies • Manual reset input• 140ms min. reset pulse width • Guaranteed over temperature• Active-LOW reset valid with 1.1V supply (IMP811)• Small 4-pin SOT-143 package • No external components• Power-supply transient-immune designKey Features- Computers and controllers - Embedded controllers - Battery operated systems - Intelligent instruments- Wireless communication systems - PDAs and handheld equipmentBlock DiagramV CCV CCIMP811 (IMP812)V CCGNDRESET ¯¯¯¯¯¯ InputGNDRESET¯¯¯¯¯¯ RESET ¯¯¯ MRPOWER MANAGEMENTAbsolute Maximum RatingsPin AssignmentsSOT143¯¯¯¯¯¯ (RESET ) RESETGNDV CCIMP811 (IMP812)MR¯¯¯ Ordering InformationP a c k a g e Mar king 2 P a r t N umber 1 R eset Threshold (V) T e mper ature R ang ePin-Pack a g e (XXX L o t Code)IMP811 Active LOW ResetIMP811LEUS/T 4.63 – 40°C to +125°C 4-SOT143AMXXX IMP811MEUS/T 4.38 – 40°C to +125°C 4-SOT143 ANXXX IMP811JEUS/T 4.00 – 40°C to +125°C 4-SOT143 AOXXX IMP811TEUS/T 3.08 – 40°C to +125°C 4-SOT143 APXXX IMP811SEUS/T 2.93 – 40°C to +125°C 4-SOT143 AQXXX IMP811REUS/T 2.63 – 40°C to +125°C 4-SOT143 ARXXX IMP811ZEUS/T 2.32 – 40°C to +125°C 4-SOT143 ZCXXX IMP812 Active HIGH ResetIMP812LEUS/T 4.63 – 40°C to +125°C 4-SOT143 ASXXX IMP812MEUS/T 4.38 – 40°C to +125°C 4-SOT143 ATXXX IMP812JEUS/T 4.00 – 40°C to +125°C 4-SOT143 AUXXX IMP812TEUS/T 3.08 – 40°C to +125°C 4-SOT143 AVXXX IMP812SEUS/T 2.93 – 40°C to +125°C 4-SOT143 AWXXX IMP812REUS/T 2.63 – 40°C to +125°C 4-SOT143 AXXXX IMP812ZEUS/T 2.32 – 40°C to +125°C4-SOT143ZDXXXNotes: 1. Tape and Reel packaging is indicated by the /T designation.2. Devices may also be marked with full part number: 811L, 812M etc. XXX refers to lot.Pin Terminal Voltage with Respect to GroundV CC . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 6.0V Operating Temperature Range . . . . . . . –40°C to 125°CRESET, RESET and MR . . . . . –0.3V to (V CC + 0.3V) Storage Temperature Range . . . . . . . . –65°C to 160°C Input Current at V CC and MR . . . . . .. . . . . . . . 20mA Lead Temperature (soldering, 10 sec) . . . . . 300°COutput Current: RESET or RESET . . . . . . . . . 20mA Rate of Rise at V CC . . . . . . . . . . . . . . . . .. . 100V/µsPower Dissipation (T A = 70°C) . . . . . . . . . . 320mW(Derate SOT-143 4mW/°C above 70°C)These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for pro-longed time periods may affect device reliability.¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTElectrical CharacteristicUnless otherwise noted V CC is over the full voltage range, T A = –40°C to 125°C.Typical values at T A = 25°C, V CC = 5V for L/M/J devices, V CC = 3.3V for T/S devices and V CC = 3V for R devices, V CC =2.5V for Z devicesP a r a meterSymbol Conditions Min T ypMa U nits Input V oltage (V CC ) RangeV CC T A = 0°C to 70°C T A = – 40°C to 125°C 1.1 1.25.5 5.5 VSupply Current I CCT A = – 40°C to 85°C T A = – 40°C to 85°C T A = 85°C to 125°C T A = 85°C to 125°C V CC < 5.5V , L/M/J V CC < 3.6V , R/S/T/Z V CC < 5.5V , L/M/J V CC < 3.6V , R/S/T/Z 6 5 15 10 25 20 µAReset Threshold V TH L devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 4.54 4.50 4.40 4.63 4.72 4.75 4.86 VM devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 4.30 4.25 4.16 4.38 4.46 4.50 4.56 J devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 3.92 3.89 3.80 4.00 4.07 4.10 4.20 T devices T A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 3.03 3.00 2.92 3.08 3.14 3.15 3.23 S devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 2.88 2.85 2.78 2.93 2.98 3.00 3.08 R devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 2.58 2.55 2.50 2.63 2.68 3.70 2.76 Z devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C2.27 2.24 2.222.32 2.37 2.39 2.42 Reset Threshold Temp. Coefficient TC VTH30 ppm/°C V CC to Reset Delay V CC = V TH to (V TH - 125mV),L/M/J devices40 µs V CC = V TH to (V TH - 125mV),R/S/T/Z devices 20 Reset Active Timeout Period T A = – 40°C to 85°C T A = 85°C to 125°C 140 100 240560 840ms MR Minimum Pulse Width t MR 10 us MR Glitch ImmunityNote 3 100 ns MR to RESET Propagation Delayt MD Note 20.5usMR Input ThresholdV IH V CC >V TH(MAX),IMP811/812L/M/J 2.3 VV IL0.8V IH V CC >V TH(MAX),IMP811/812R/S/T/Z 0.7V CC V IL0.25V CCMR Pull-up Resistance102030K Ω¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTLow RESET Output V oltage (IMP811)V OLV CC = V TH min., I SINK = 1.2mA, IMP811R/S/T/Z0.30.4 0.3 VV CC = V TH min., I SINK = 3.2mA, IMP811L/M/J V CC > 1.1V , I SINK = 50µAHigh RESET Output V oltage (IMP811) V OH V CC > V TH max., I SOURCE = 500µA, IMP811R/S/T/Z 0.8V CCV CC -1.5V V CC > V TH max., I SOURCE = 800µA, IMP811L/M/J Low RESET Output V oltage (IMP812) V OL V CC = V TH max., I SINK = 1.2mA, IMP812R/S/T/Z0.3 0.4 V V CC = V TH max., I SINK = 3.2mA, IMP812L/M/J High RESET Output V oltage (IMP812)V OH1.8V < V CC < V TH min., I SOURCE = 150µA0.8V CCVElectrical CharacteristicUnless otherwise noted V CC is over the full voltage range, T A = –40°C to 125°C.Typical values at T A = 25°C, V CC = 5V for L/M/J devices, V CC = 3.3V for T/S devices and V CC = 3V for R devices, V CC =2.5V for Z devicesNotes: 1. Production testing done at TA = 25°C. Over temperature specifications guaranteed by design only using six sigma design limits.2. RESET output is active LOW for the IMP811 and RESET output is active HIGH for the IMP812.3. Glitches of 100ns or less typically will not generate a reset pulse.Pin DescriptionsPin N u mberN a me Function 1 GND Ground2 (IMP811) RESET RESETis asserted LOW if V CC falls below the reset threshold and remains LOW for the 240ms typical reset timeout period (140ms minimum) after V CC exceeds the threshold.2 (IMP812)RESETRESET is asserted HIGH if V CC falls below the reset threshold and remains HIGH for the 240ms typical reset timeout period (140ms minimum) after V CC exceeds the threshold.3MR4 V CCPower supply input voltage (2.5V,3.0V,3.3V,5V)Manual Reset Input. A logic LOW on MR asserts RESET. RESET remains activeas long as MR is LOW and for 180ms after MR returns HIGH. The active low in-put has an internal 20k Ω pull-up resistor. The input should be left open if not used.It can be driven by TTL or CMOS logic or shorted to ground by a switch.. Related ProductsIMP809 IMP810 IMP811 IMP812 Max. Supply Current15µA 15µA 15µA 15µA Package Pins334 4 Manual RESET input ■ ■Package T ypeSOT -23 SOT -23 SOT -143 SOT -143Active-HIGH RESET output ■ ■Active-LOW RESET output■ ■¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯¯¯¯¯¯¯¯¯¯POWER MANAGEMENTTypical Performance CharacteristicsThe reset signal is asserted –LOW for the IMP811 and HIGH for the IMP812 – when the VCC signal falls below the threshold trip voltage and remains asserted for 140ms minimum after the VCC has risen above the threshold.Alogic low on MR asserts RESET LOW on the IMP811 and HIGH on the IMP812. MR is internally pulled high through a 20k Ω resistor and can be driven by TTL/CMOS gates or with open collector/drain outputs.MR can be left open if not used.MR may be connected to a normally-open switch connected to ground without an external debounce circuit.For added noise rejection, a 0.1μF capacitor from MR to Ground can be added.Figure 1. Reset Timing DiagramRESET Output OperationIn μP/μC systems it is important to have the processor begin operation from a known state or be able to return the system to a known state. A RESET output to a processor is provided to prevent improper op-eration during power supply sequencing or low voltage – brownout – conditions.The IMP811/812 are designed to monitor the system power supply voltages and issue a RESET signal when levels are out of range. RESET outputs are guaranteed to be active for VCC above 1.1V. When VCC exceeds the reset threshold, an internal timer keeps RESET active for the reset timeout period, after which RESET becomes inactive (HIGH for the IMP811 and LOW for the IMP812).V THActive ResetTimeout Period 140ms minimumIMP811IMP812 5V 0V5V 0V 5V 0VRESETRESETV CCActive Reset Timeout Period5V 0V MRReset Timing and Manual Reset (MR)¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTTo ensure that logic inputs connected to the IMP811 RESET pin are in a known state when VCC isunder 1.1V, a 100k Ω pull-down resistor at RESET is needed. The value is not critical.A similar pull-up resistor to VCC is needed with the IMP812. If VCC drops below the reset threshold, RESET automatically becomes active. Alternatively, external circuitry or a human operator can initiate this condition using the Manual Reset (MR) pin. There is aninternal pullup on MR so it can be left open if it is not used. MR can be driven by TTL/CMOS logic or even an external switch, since it is already debounced. If the switch is at the end of a long cable, it might require a bypass (100nF) at the pin if noise pickup is a problem. Eight voltage thresholds are available to support 2.5V and 5V systems:Typical Performance CharacteristicsValid Reset with V CC under 1.1VR eset ThresholdSuf f i x V olt ag e (V) L 4.63 M 4.38 J 4.00 T 3.08 S 2.93 R 2.63 Z 2.32V CCPower SupplyGNDIMP812100k ΩRESET V CCPower SupplyGNDIMP811100k ΩRESETFigure 2. RESET Valid with VCC Under 1.1VFigure 3. RESET Valid with V CC Under 1.1VMRMR¯¯¯¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTTypical Performance Characteristics(Continued)Negative V CC TransientsTypically short duration transients of 100mV amplitude and 20μs duration do not cause a false RESET. A 0.1μF capacitor at VCC increases transient immunity.Bi-directional Reset Pin InterfacingThe IMP811/812 can interface with µP/µC bi-directional reset pins by connecting a 4.7k Ω resistor in series with the IMP809/810 reset output and the µP/µC bi-directional reset pin.Figure 4. Bi-directional Reset Pin InterfacingPowerSupplyV CCIMP811RESETGNDBUF4.7k ΩBufferedRESETµC or µPRESETInputGNDBi-directional I/O Pin(Example: 68HC11)MR ¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯POWER MANAGEMENTMechanical DimensionsPlastic SOT-143 (4-Pin)Symbol InchesMillimetersMinMaxMinMaxA 0.035 0.045 0.900 1.150 A1 0.000 0.004 0.000 0.100 A2 0.035 0.041 0.900 1.050 b 0.012 0.020 0.300 0.500 c 0.003 0.006 0.080 0.150 D 0.110 0.118 2.800 3.000 d 0.008 TYP. E 0.047 0.055 1.200 1.400 E1 0.089 0.1002.250 2.550e 0.037 TYP0.950 TYPe1 0.071 0.0791.8002.000L 0.022 REF0.550 REFL1 0.012 0.020 0.300 0.500 θ0° 8°0° 8°0.200 YYP.POWER MANAGEMENTISO 9001 RegisteredDaily Silver IMP Microelectronics Co.,Ltd7 keda Road ,Hi-Tech Park,NingBo,Zhejiang,P.R.CPost Code:315040Tel:(086)-574-87906358Fax:(086)-574-87908866Email:****************.cn The IMP logo is a registered trademark of Daily Silver IMP. All other company and product names are trademarks of their respective owners @2015 Daily Silver IMP Printed in china Revision: FIssue Date: 28th.Aug.15 Type: Product。
Silicon Labs Simplicity Studio 5 用户指南说明书
Tech Talks LIVE Schedule –Presentation will begin shortlyFind Past Recorded Sessions at: https:///support/trainingFill out the survey for a chance to wina BG22Thunderboard!TopicDateBuilding a Proper Mesh Test Environment: How This Was Solved in Boston Thursday, July 2Come to your Senses with our Magnetic Sensor Thursday, July 9Exploring features of the BLE Security Manager Thursday, July 23New Bluetooth Mesh Light & Sensor Models Thursday, July 30Simplicity Studio v5 IntroductionThursday, August 6Long Range Connectivity using Proprietary RF Solution Thursday, August 13Wake Bluetooth from Deep Sleep using an RF SignalThursday, August 20Silicon Labs LIVE:Wireless Connectivity Tech Talks Summer SeriesWELCOMESilicon Labs LIVE:Wireless Connectivity Tech TalksSummer SeriesIntroduction to Simplicity Studio 5August 6th, 2020https:///products/development-tools/software/simplicity-studio/simplicity-studio-5What is Simplicity Studio 5?§Free Eclipse Based Development Environment§Designed to support Silicon Labs IoTPortfolio§Provides Access to Target Device-SpecifiedWeb & SDK Resources§Software & Hardware Configuration Tools§Integrated Development Environment (IDE)§Eclipse based, C/C++ IDE§GNU ARM Toolchain§Advanced Value Add Tools§Network Analysis, Code Correlated EnergyProfiling, Configuration Tools, etc.The Data Driving Simplicity Studio 5?Simplicity StudioGecko SDK Dev Guides, TutorialsAPI RMsRef Manuals,Datasheets, ErrataStacks, Gecko Platform,Examples, Demos,metadataHardware KitBoard IDSimplicity Studio 5 -LauncherOn the Welcome PageYou Can•Select Target Device •Start a New Project •Access Support Resources and EducationalPressing ‘Welcome’ onthe tool bar will return to Welcome page at any time.1. Welcome & Target SelectionThis is a “get started” section to help with device or board selection12342. Debug Adapters Area shows connected debug adapters including Silicon Lab kits, Segger, J-Link, etc…3. My ProductsEditable list of products you may wish to use as target devices 4. MenuMenu & Tool bar provide access to a number of functions and shortcutsLauncher Perspective -Overview1. General InformationGI card shows debugger,debugger mode, firmwareversions for adapter andsecurity, SDK12 342. Recommended QSGs Quick links to recommended quick start guides for selected product.3. BoardBoard shows which evaluation board is being used and provides easy access to its documentation.4. Target PartTarget part shows full part number and also provides easy access to its documentationLauncher Perspective –Example Projects1. Technology Filter Keyword Filter box and Technology Type check boxes let you dial into the example you are looking for.122. Resource ListResource list will show corresponding example projects that are intended for your selectedtechnology and target device.Launcher Perspective –Documentation1. Resource FilterKeyword Filter box andResource Type checkboxes let you dial into theresource you are lookingfor (Data Sheet, App Note,Errata, QSG, etc…).1232. Technology TypeTechnology check boxesnarrow your search basedon a give technology(Bluetooth, Bootloaders,Thread, Zigbee, etc…).3. ResourcesList of resources that willnarrow as you selectfilters (Data Sheet, AppNote, Errata, QSG, etc…).Launcher Perspective –Demos1. Demo FilterDemo Filter allows you to narrow your search of demos for your selected device.122. DemosList of Pre-compiled demos that are ready to be programmed into your selected device.Launcher Perspective –Compatible Tools1. Compatible ToolsLaunching pad for toolssuch as Hardware1Configurator, NetworkAnalyzer, Device Console,Energy Profiler, etc…Launcher Perspective –Tools –Pin Configuration ToolPin Configuration ToolSimplicity Studio 5 offers aPin Configuration Tool thatallows the user to easilyconfigure new peripheralsor change the propertiesof existing ones. Thegraphical view will differbased on the chip beingused.Simplicity Studio 5 -IDEIDE –Overview1. Tool Bar & MenuLaunching pad for tools 123452. Project ExplorerDirectory structure and allfiles associate with theproject.4. Editor & ConfiguratorsCode editing windows andconfigurators forproject/technologies.3. Debug AdaptersShows connecteddebuggers and EVKs5. Additional WindowsProblems, Search, CallHierarchy, ConsoleIDE –Project Configurator Overview1. Target & SDKAllows user to changedevelopment target andSDK.1232. Project DetailsCan change import mode& force generation.3. Project GeneratorsAllows user to modifywhat files are beinggenerated by projec tIDE –Project Configurator Software Components1. ComponentExpand components to see categories and sub-categories.1232. Selected Component View details of a given component. Gearindicates a configurable component. Check marks show installed components.3. Filters & KeywordsHelp you to search various component categoriesIDE –Configurators (GATT)1. GATT Configurator View, Add, Remove GATT Profiles, Services, Characteristics, and Descriptors122. GATT EditorAllows user to view & modify settings in the Profiles, Services, Characteristics and Descriptors within the GATT.IDE –Configurators (Editing the GATT)EDIT (Device Name)From GATT Configuratorclicking on an editableitem such as device namewill open up a newwindow allowing the userto see content that can beedited and several optionsfor that content that canbe selected/de-selected.Simplicity Studio 5 -MigrationSimplicity Studio -Developer Options*Bugfixes provided per software longevity commitment (https:///products/software/longevity-commitment )Developer ProjectExisting ProjectNew Project GSDK v2.7.x *Simplicity Studio 4*GSDK v3.x.x Simplicity Studio 5Secure VaultFinal Developer BinariesSS4/GSDK2.7x Continuance Option *MigrationToolkitProcess and availability varies by technologyGSDK v2.7.x *Simplicity Studio 4*SS5/GSDK3.x Upgrade OptionLIMITED SUPPORTSubject to longevity commitmentGS D K 2.x t o 3.x = M aj o r C h a n g e .Simplicity Studio –Project StructureBluetooth SDK v2.x Project StructureBluetooth SDK v3.x Project StructureProject Structure There is a change in project structure from GSDK v2.x to GSDK v3.x.It’s now much easier to see which file can be modified by the generator and it’s easier to find/identify the configuration files This is important because withGSDKv3.x many more files are generated by the addition of software components.Simplicity Studio –BGAPI CommandsBGAPI CommandBGAPI CommandsBGAPI Commandschange both theirname and theirstructure to make theerror checking andhandling of returnvalues simpler.Simplicity Studio –Changes to BGAPI CommandsChanges to BGAPI Commands With manycommands, renaming means only changing gecko_cmd_ to sl_bt_.Other functions have been renamed due to changes infunctionality, changed API class, or simply to make the functions more logical.Some API functions have been split into multiple ones while others have been merged.123Simplicity Studio 5 -DemoSimplicity Studio 5 -LinksSimplicity Studio –Useful LinksSimplicity Studio 5https:///products/development-tools/software/simplicity-studio/simplicity-studio-5 Simplicity Studio 5 User Guidehttps:///simplicity-studio-5-users-guide/latest/indexQuick Start Guide Bluetooth SDK v3.xhttps:///documents/public/quick-start-guides/qsg169-bluetooth-sdk-v3x-quick-start-guide.pdfTransitioning from Bluetooth SDK v2.x to v3.xhttps:///documents/public/application-notes/an1255-transitioning-from-bluetooth-sdk-v2-to-v3.pdfBluetooth SDK 3.0.0.2 Release Noteshttps:///documents/public/release-notes/bt-software-release-notes-3.0.0.2.pdfThe Largest Smart Home Developer EventS E P T E M B E R9 –1 0, 2 0 2 0Immerse yourself in two days of technical training designedespecially for engineers, developers and product managers.Learn how to"Work With" ecosystems including Amazon and Google and join hands-on classes on how tobuild door locks, sensors, LED bulbs and more.Don't miss out, register today!w o r k s w i t h.s i l a b s.c o mThank you…..Questions? 。
TNT4882手册
TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 3D I O 6N G N DL A D C S D I O 8NG N D I F C N D I O 5NS R Q N G N D D I O 7N A T N NR E N NG N D R E S E T NG N D DATA5DATA4GND GND VDD GND DATA0INTR DACKN DRQ BURST_RDN DAVNGNDVDDGNDDIO2NDIO3NVDDXTAL1EOINW R N G N D V D DT R I G C P U A C C T A D C S A B U S _O E N A D D R 4A D D R 3A D D R 2A D D R 1A D D R 0A B U S N P A G E D G N D R E M S W A P N F I F O _R D Y GNDXTAL0GNDKEYDQKEYRSTN DATA3DATA2DATA1GND VDD RDY1V D D D A T A 10G N D D A T A 11D A T A 12D A T A 13G N D D A T A 14D A T A 15B B U S _O E N D A T A 9D A T A 8V D D G N D GND DATA6DATA7R D N B B U S N G N D V D D G N D V D D G N D G N D C S N G N D M O D E N C D C A SGNDNRFDNNDACNGeneric Pin ConfigurationFigure 3. TNT4882 Generic Pin ConfigurationTable continued on page 4Generic Pin DescriptionAll pins with names that end in ‘N’ are active low; all others are active high. All input (I) and bidirectional (I/O) pins have an internal pull-up resistor between 50 k Ωand 150 k Ω.Note: You can also see the “Hardware Considerations” chapter of the “TNT Programmer Reference Manual” (P/N 320724-01) for more information.TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 4Pin No.(s)Name(s)Type Description 51DCAS O Asserts when the device clear state machine is in DCAS 52NC O Leave this pin unconnected 53MODE I Determines whether the TNT4882 powers up in 7210 or 9914 emulation mode – High = 7210 mode, Low = 9914 mode 55CSN I Chip Select enables I/O transfers between the CPU and the TNT488262BBUSN I Enables register accesses through the B bus (DATA7-0)63RDN I Enables the contents of the registers selected by ADDR 4:0 and CSN or the FIFOs to appear on the data bus selected by ABUSN and BBUSN 64WRN I Latches data on the bus selected by ABUSN and BBUSN into an internal TNT4882 register on the trailing (rising) edge of WRN 66LADCS O Asserts when the TNT4882 is addressed as a Listener 67RESETN I Holds the TNT4882 in its idle state 71,74,77,80,88,DIO8-1N I/O 8-bit bidirectional IEEE 488 data bus 89,91,9270,73,76,79,RENN, ATNN, SRQN, I/O IEEE 488 control signals 81,82,84,85IFCN, NDACN, NRFDN, DAVN, EOIN 95XTAL0O Output of crystal circuit – use only for driving a quartz crystal 96XTAL1I Crystal oscillator input – drive with a 40 MHz CMOS input level clock signal 98KEYCLKN O Strobes data to or from a DS1204 electronic key 99KEYDQ I/O Transmits serial data between the TNT4882 and a DS1204 key 100KEYRSTN O Resets a DS1204 key 4,8,13,25,27,35,37GND _Ground pins – 0 V 41,45,48,54,56,57,59,61,65,68,72,75,78,83,86,90,93,9712,24,36,40,58,VDD _Power pins – +5 V (±5%)60,69,87,94D I O 6N G N D I O C S 16N D I O 8NG N D I F C N D I O 5NS R Q NG N D D I O 7N A T N N R E N NG N D R E S E T G N D DATA5DATA4GND AEN_N VDD GND DATA0INTR DACKN DRQ ADDR9DAVNGNDVDDGNDDIO2NDIO3NVDDXTAL1EOINI O W N G N D V D D S W 7S W 6N C D 15_8_O E N A D D R 4A D D R 3A D D R 2A D D R 1A D D R 0B H E N _N A D D R 5G N D A D D R 6A D D R 7A D D R 8GNDXTAL0GNDKEYDQKEYRSTN DATA3DATA2DATA1GND VDD IOCHRDY V D D D A T A 10G N D D A T A 11D A T A 12D A T A 13G N D D A T A 14D A T A 15D 7_0_O E N D A T A 9D A T A 8V D D G N D GND DATA6DATA7I O R N S E N S E _8_16N G N D V D D V D D V D D G N D V D D S W 5N C M O D E S W 9S W 8GNDNRFDNNDACNISA Pin Configuration Figure 4. TNT4882 ISA Pin ConfigurationTable continued from page 3TNT4882 Single-Chip IEEE 488.2 Talker/Listener ASICNational Instruments Phone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 5ISA Pin DescriptionAll input (I) and bidirectional (I/O) pins have an internal pull-up resistor between 50 kΩand 150 kΩ. Pins with names that end in “N” are active low signals – all others are active high. Open-collector outputs are type “OC.”Note: You can also see the “Hardware Considerations” chapter of the “TNT Programmer Reference Manual” (P/N 320724-01) for more information.Pin No.(s)Name(s)Type Description1D7_0_OEN O Asserts when DATA7-0 bus is enabled for output – may be left unconnected2,3,5,6,7,9,10,11DATA15-8I/O Upper eight bits of bidirectional three-state data bus for transfer of commands,data, and status between TNT4882 and CPU – can connect directly to the AT bus –DATA15 is the most significant bit14BHEN_N I Enables access to upper eight bits of data bus when asserted19-15ADDR4-0I Determines which register will be accessed during an I/O access31,30,29,28,26ADDR9-5I Determines if an I/O address is within the range occupied by the TNT4882 –the chip is selected and an I/O access occurs when ADDR9-5 match SW9-5 andAEN_N is asserted20D15_8_OEN O Asserts when DATA15:8 bus is enabled for output – may be left unconnected21,54NC O Leave unconnected52,51,23,22,55SW9-5I Determines the base address of the TNT488232DRQ O Asserts to request a DMA transfer cycle33DACKN I Enables FIFO accesses during a DMA transfer cycle34INTR O Asserts when one or more of the unmasked interrupt conditions becomes true37AEN_N I Enables I/O accesses to the TNT488238IOCHRDY OC When the TNT4882 is not accessed, this open-collector signal is not driven, and apull-up resistor on the system board keeps it pulled high – at the start of someTNT4882 accesses, the TNT4882 may drive it low, then pull it high again during thecycle to indicate that the TNT4882 is ready for the CPU to end that cycle50,49,47,46,44,DATA7-0I/O Lower eight bits of bidirectional three-state data bus for transfer of commands, data, 43,42,39and status between TNT4882 and CPU – can connect directly to the AT bus – DATA7is the most significant bit53MODE I Forces the TNT4882 to 7210 (high) or 9914 (low) emulation mode on a hardwarereset – may be left unconnected62SENSE_8_16N I Pull this pin low to tell the TNT4882 that it is connected to a 16-bit bus – leave itunconnected if the TNT4882 is connected to an 8-bit bus63IORN I Drives the contents of the register selected by ADDR4-0 on the data bus when theTNT4882 is selected64IOWN I The value on the data bus is latched into the register selected by ADDR4-0 on therising edge of IOWN when you select the TNT488266IOCS16N OC Driven low during an access to the upper data bus67RESET I Causes a hardware reset and holds the TNT4882 in its idle state while asserted 71,74,77,80,88,DIO8-1N I/O8-bit bidirectional IEEE 488 data bus89,91,9270,73,76,79,81,RENN, ATNN, SRQN,I/O IEEE 488 control signals82,84,85IFCN, NDACN, NRFDN,DAVN, EOIN95XTAL0O Output of crystal circuit – use only for driving a quartz crystal96XTAL1I Crystal oscillator input – drive with a 40 MHz CMOS input level clock signal98KEYCLKN O Strobes data to or from the DS1204 electronic key99KEYDQ I/O Transmits serial data between the TNT4882 and a DS1204 key100KEYRSTN O Resets a DS1204 key4,8,13,25,27,35,41,GND–Ground pins – 0 V45,48,57,61,65,68,72,75,78,83,86,90,93,9712,24,36,40,56,58,VDD–Power pins – +5 V (±5%)59,60,69,87,94TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 6TNT4882 Register MapNotes on Register Map1. For complete register descriptions, see the “TNT4882Programmer Reference Manual” (320724-01)2. Some of the 7210 mode registers, such as the ISR1, havethe same names as some of the 9914 mode registers. The7210 mode registers are NOT the same as their 9914 modecounterparts. Be sure to refer to the appropriate bit map forthe chip emulation mode you are using when programmingthese registers.3. The shaded registers are “paged-in registers.” Paged-inregisters only exist in 9914 mode. Writing to the address of the9914 mode ADSR normally does not access any registers.Writing one of four page-in commands to the AUXCR changesall subsequent writes to that address to that of the corresponding paged-in register . The two readable paged-in registers, the 9914 mode SPSR and ISR2, are both paged in whenever any one of the four writable paged-in registers is paged in. When you write the clear page-in command to the AUXCR, all paged-in registers are paged out again and are no longer accessible.4.There are several unused bytes in the address space of the TNT4882. These addresses are reserved for adding new features to the chip. You should not map any external hardware into these addresses or access them at any time, as this may cause compatibility problems with future versions of the TNT4882.TNT4882 Single-Chip IEEE 488.2 Talker/Listener ASICNational Instruments Phone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 7zero; leaving them unconnectedcauses those address lines to becompared to one. (Base I/Oaddress 2C0 hex shown.)to be compared to zero;leaving them u nconnectedcauses those address linesto be compared to one. (BaseI/O address 2C0 hex shown.) Figure 5. PC/XT and AT (ISA) Bus to ISA Mode TNT4882Hardware Interfacing – ISA Mode TNT4882TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 8SENSE_8_16N BHEN_N ADDR4-0IORN IOWN DATA15-8DATA7-001100001FIFOA FIFOB 001100010FIFOA FIFOB 00XXXX101Read Not Driven 00XXXX110Written Ignored 01XXXX001Not Driven Read 01XXXX010Ignored Written 11XXXX001Not Driven Read 11XXXX010Ignored Written 11XXXX101Not Driven Read 11XXXX110Ignored WrittenISA Pin Configuration Byte Lane TableThis table shows which byte lane accesses the TNT4882 internalregisters during an I/O access when you use the ISA pinconfiguration. All combinations of ADDR4-1, SENSE_8_16N,and BHEN_N not shown in this table are illegal. You should notapply these combinations to the TNT4882 while the chip isselected. The accessed register is determined only by ADDR4-0,not SENSE_8_16N or BHEN_N.TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 9Generic Pin Configuration Byte Lane TableThis table shows which byte lanes will access TNT4882 registersduring I/O accesses.Figure 6. Intel CPU to Generic Mode TNT4882Hardware Interfacing – Generic Mode TNT4882ABUSN BBUSN ADDR4-0D15-8D7-00111000FIFOB unused1011000unused FIFOB0011000FIFOA FIFOB01XXXXX*used unused10XXXXX*unused used*Any address except 11000TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 10Generic Mode DC CharacteristicsParameterSymbol Min Max Unit Notes Supply voltageV DD 4.75 5.25V Voltage input lowV IL -0.5 0.8V Voltage input highV IH 2.0V CC V Voltage output lowV OL 0.00.4V Voltage output highV OH 2.4V DD V Supply currentI DD 90mA 50 mA, typical Output current lowI OL 24mA V OL = 0.4 V DATA15-0, LADCS, DRQ, INTR, RDY1Output current lowI OL 8mA V OL = 0.4 V BBUS_OEN, ABUS_OEN, TADCS,CPUACC, REM, TRIG, DCAS, CICFIFO_RDYI OL 4mA V OL = 0.4 V Output current lowI OL 2mA V OL = 0.4 V KEYDQ, KEYRSTN, KEYCLKNDIO8-1N, IFCN, SRQN, EOIN, ATNN,I OL 48mA V OL = 0.4 V RENN, DAVN, NRFDN, NDACNOutput current highI OH -12mA V OH =V DD -0.5 V DATA15-0, LADCS, DRQ, INTR, RDY1-24mA V OH = 2.4 V Output current highI OH -4mA V OH = V DD -0.5 V BBUS_OEN, ABUS_OEN, TADCS,CPUACC, REM, TRIG, DCAS-8mA V OH = 2.4 V FIFO_RDYI OH -2mA V OH = V DD -0.5 V -4V OH = 2.4 V Output current highI OH -1mA V OH = V DD -0.5 V KEYDQ, KEYRSTN, KEYCLKN-2mA V OH = 2.4 V DIO8-1N, IFCN, SRQN, EOIN, ATNN,I OH 16mA V OH = 2.4 V RENN, DAVN, NRFDN, NDACNInput leakage current – all pinsI IH±10µA V DD = 5.5 VOutput leakage current – all pins I OZ±10µA V DD = 5.5 V Generic Mode CapacitanceParameterSymbol Min Typ Max Unit Notes Pin capacitanceC 50pF DIO8-1N, RENN, ATNN, IFCN, SRQN, DAVN, EOIN, NDACN, NRFDNPin capacitance all other pins C 3.6pF Generic Mode AC CharacteristicsCommercial Industrial ParameterSymbol Min Max Min Max Unit Address setup to RDN = 0, WRN = 0t AS 2427ns Data delay from RDN = 0, CSN = 0 (one-chip mode access)t RD 7178ns Data float from RDN = 1t DF 4044ns RDN pulsewidth (I/0 access)t RW 7178ns RDN recovery widtht RR 4044ns Address hold from RDN = 1, WRN = 1t AH 00ns DRQ unassertiont DU 7886ns Data delay from RDN = 0, DACKN = 0t DR 4044ns Data setup to WRN = 1t WS 1416ns Data hold from WRN = 1t WH 00ns CSN setup to RDN or WRNt CS 00ns CSN hold from RDN or WRNt CH 00ns DACKN setup to RDN or WRNt DS 00ns DACKN hold from RDN or WRNt DH 00ns RDN or WRN to CPUACC (two-chip mode NAT4882 access only)t CPU 2629ns RDN or WRN to RDY1 assertt ARDY Two-chip mode NAT4882 access1010clock periods Other accesses2528ns RDN or WRN to RDY1 unassertt URDY 2225ns WRN pulse width (DMA access)t WP4044ns RDN pulse width (DMA access)t RP4044nsNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 11Figure 8. DMA ReadFigure 7. CPU ReadFigure 9. CPU WriteGeneric Mode AC Characteristics WaveformsWaveforms continued on page 12DATAWRNCSNABUSN,BBUSN, ADDR4-0RDY1CPUACC †††† CPUACC asserts during two-chip modeNAT4882 accesses onlyDRQ DACKNRDN DATA15-0RDY1ABUSN, BBUSN,ADDR4-0CSNRDNDATARDY1CPUACC ††††NAT4882 accesses onlyNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 12WRNDRQ DACKN DATA15-0Figure 10. DMA WriteWaveforms continued from page 11ISA Mode DC CharacteristicsParameterSymbolMin Max UnitNotesSupply voltage V DD 4.75 5.25V Voltage input low V IL -0.5 0.8V Voltage input high V IH 2.0V CC V Voltage output low V OL 0.00.4V Voltage output high V OH 2.4V DD V Supply current I DD 90mA 50 mA, typical Output current low I OL24mAV OL = 0.4 VDATA15-0DRQ, INTR, IOCS16, IOCHRDY Output current low I OL 16mA V OL = 0.4 V D7_0_OENOutput current lowI OL 8mA V OL = 0.4 V D15_8_OEN, TP_INTWTN Output current lowI OL2mAV OL = 0.4 VKEYDQ, KEYRSTN, KEYCLKN Output current lowDIO8-1N, RENN, ATNN, IFCN, SRQN,I OL 48mA V OL = 0.4 V DAVN, EOIN, NDACN, NRFDN Output current high I OH-12mA V OH = V DD -0.5 V DATA15-0DRQ, INTR-24mA V OH = 2.4 V Output current high I OH-8mA V OH = V DD -0.5 V D7_0_OEN-16mA V OH = 2.4 V Output current high I OH-4mA V OH = V DD -0.5 V D15_8_OEN,TP_INTWTN-8mA V OH = 2.4 V Output current high I OH-1mA V OH = V DD -0.5 V KEYDQ, KEYRSTN,KEYCLKN-2mA V OH = 2.4 V Output current highDIO8-1N, RENN, ATNN, IFCN, SRQN,I OH -16mA V OH = 2.4 V DAVN, EOIN, NDACN, NRFDN Input leakage current – all pins I IH ±10mA V DD = 5.5 V Output leakage current – all pinsI OZ±10mAV DD = 5.5 VNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 13Figure 11. I/O Read Access Waveforms continued on page 14ISA Mode CapacitanceParameterSymbolMin TypMax UnitNotesPin capacitanceC3.6pFDATA15-0, DRQ, INTR, IOCS16N, IOCHRDY, ADDR6Pin capacitanceC 3.0pFD7_0_OEN, D15_8_OEN, TP_INTWTN,KEYDQ, KEYRSTN, KEYCLKN, ADDR4, ADDR8, ADDR9Pin capacitanceC 3.5pFBHEN_N, ADDR3-0, ADDR5, ADDR7, DACKN, AEN_N, MODE, TESTMODE,PWBSEL2-0, SW9, SENSE_8_16N,IORN, IOWN, RESET Pin capacitanceC 50pFDIO8-1N, RENN, ATNN, IFCN, SRQN,DAVN, EOIN, NDACN, NRFDNParameterSymbol Min MaxUnit NotesADDR9-0 setup to IORN, IOWN t AS30ns ADDR9-0 hold from IORN, IOWN t AH 0ns DACKN setup to IORN, IOWN t DS 0ns DACKN hold from IORN, IOWN t DH 20ns Data setup time to IOWN rising t SU 22ns Data hold time from IOWN rising t WH 0ns IORN low pulse width t RPWL 100ns IORN high pulse width t RPWH 42ns IOWN low pulse width t WPWL 100ns IOWN high pulse widtht WPWH 100ns IORN or IOWN held from IOCHRDY t TD 20ns DRQ unassertion time t DU 73ns Due to FIFO full/empty DRQ unassertion timet DU 48ns Due to byte count reachedData access time from IORN falling, DMA t DACC 80ns Data access time from IORN falling, I/O t ACC 80ns Data hold time from IORN rising t RH 0ns Data float time from IORN rising t DF 30ns IOCS16N assertion after valid address t DEC 30ns IOCS16N negation after invalid address t DECN 20ns IOCHRDY negation from IORN or IOWN t RDYN 40ns IOCHRDY release after IORN or IOWNt RDY350nsISA Mode AC CharacteristicsADDR9-0, AEN_NIORN DATA15-0IOCS16N IOCHRDYNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 14Waveforms continued from page 13Figure 13. DMA Read AccessFigure 14. DMA Write AccessFigure 12. I/O Write AccessADDR9-0, AEN_NIOWN DATA15-0IOCS16N IOCHRDYIORN DRQDACKNDATA15-0IOWN DRQ DACKNDATA15-0National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 15Figure 16. Mechanical DataFigure 17. Recommended Land Pattern (not to scale)Absolute Maximum RatingsProperty RangeUnitsSupply voltage, V DD - 0.5 to + 7.0 V Input voltage, V IN- 0.5 to V CC + 0.5V Output voltage, V OUT- 0.5 to V CC + 0.5V Storage temperature, T STG- 55 to 150˚ CFRONT VIEW SIDE VIEWPIN 1PIN 300.650.22 (MIN)0.38 (MAX)17.90 ± 3.40 (MAX.)2.80 ±0.250.23 ±0.13SEE DETAIL A0°0.80 ±0.15NOTES:1. All dimensions are shown in millimeters.2. Unless otherwise specified, all dimensions are nominal.3. When converting from millimeters to inches, four significant digits to the right of the decimal point are necessary.Technical SupportNational Instruments strives to provide you with quality technical assistance worldwide. We currently offer electronic technical support along with our technical support centers staffed by Applications Engineers.Access information from our Web site at Our FTP site is dedicated to 24-hour support, with a collection of files and documents to answer your questions. Log on to our Internet host at You can fax questions to our Applications Engineers anytime at (800) 328-2203 or (512) 683-5678. Or , you can call from 8:00 a.m. to 6:00 p.m. (central time) at (512) 795-8248.Internationally, contact your local office. National Instruments sponsors a wide variety of group activities, such as user group meetings at trade shows and at large industrial sites. Our users also receive our quarterly Instrumentation Newsletter with the latest information on new products, product updates, application tips,and current events. 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Call for training schedules.For More InformationContact National Instruments for Application Notes such as:”Using the TNT4882 in a MC68340 System“”Factors to Consider When Clocking the TNT4882 at Frequencies Less than 40 MHz“”Porting a 9914 GPIB Design to Use the TNT4882“Ordering InformationTNT4882-BQTNT4882 Developer Kit..........................................776866-01Includes 2 TNT4882 ASICs, PC AT evaluation board, ESP-488TL source code software, and documentation.TNT4882 Programmer Reference Manual..............320724-01Part Number Legenda.Family name TNT = Single-chip, high-speed, GPIB Talker/Listener interfaceb.Device-number 4882 = IEEE 488.2 compatiblec.Reservedd.Revisione.Package type Q = Quad flat packU.S. Corporate Headquarters Fax (512) 683-9300 • info@Branch Offices: Australia 03 9879 5166 • Austria 0662 45 79 90 0 • Belgium 02 757 00 20 • Brazil 000 811 781 0559• Canada 905 785 0085China 86 21 6555 7838 • Denmark 45 76 26 00 • Finland 09 725 725 11 • France 01 48 14 24 24 • Germany 089 741 31 30 • Hong Kong 2645 3186India 91805275406• Israel 03 6120092 • Italy 02 413091 • Japan 03 5472 2970 • Korea 02 596 7456 • Mexico 001 800 010 0793Netherlands 0348 433466 • New Zealand 09 914 0488• Norway 32 27 73 00 • Singapore 2265886 • Spain 91 640 0085 • Sweden 08 587 895 00Switzerland 056 200 51 51 • Taiwan 02 2377 1200 • U.K . 01635 523545© Copyright 1999 National Instruments Corporation. All rights reserved. Product and company names listed are trademarks or trade names of their respective companies.0305599(512) 794-0100*000000A-01*340570D-01。
鸡群血凝抑制抗体水平快速测定法——β-微量法
鸡群血凝抑制抗体水平快速测定法——β-微量法作者：吴佳宁来源：《现代畜牧科技》 2015年第5期吴佳宁�（沈阳市动物疫病预防控制中心 110000）近年来养鸡业有较快发展。
但由于免疫失时，免疫不当和疫苗失效等多种原因致使鸡新城疫仍有流行，一些免疫力低落的鸡群，遇野外强毒侵袭时，有的引起急性暴发招致大批死亡，有的造成隐性感染而使野毒继续潜留。
这不仅给广大农户带来损失也威胁着养鸡业的进一步发展。
血凝抑制（HI）试验比中和试验简单、方便。
且HI抗体水平与攻毒保护有密切关系。
�1 器材�塑料微孔板：96孔V型凝集板，使用前后充分清洗，晾干。
针管定量稀释器：以4支全量0.25mL的注射器并联制成，可以定量，前端接塑料滴头，每挤一下为0.05mL。
一次可同时稀释4个样品。
然后更换干净的滴头再用。
微型振荡器：专用于微量凝集后的混合。
也可用手振荡混合。
塑料采血管：内径2mL的聚乙稀塑料管，剪成10～12cm，备用。
标准滴管：以静脉注射管连接磨去尖端的18G号针头，要求每滴0.025mL。
�2 试剂�磷酸缓冲盐水（PBS），用作稀释液。
高压蒸气灭菌，4℃冰箱保存，用时作20倍稀释。
浓缩抗原：以含有Lasota系病毒的尿囊液经福尔马林灭灭，聚乙二醇浓缩制成，其血凝价为5000～16000，用聚乙烯塑料管小剂量分装，置4℃冰箱保存备用。
（可在4℃下保存10个月以上，效价不变）。
此抗原具有效价高、洗脱慢、耐长期保存和不散毒等优点，每次作血凝抑制试验按固定比例稀释配制4个血凝单位浓度的抗原，抗原稀释倍数按下式计算：（稀释倍数=血凝效价/血凝单位数）红血球悬液，采成年鸡血放入有8%柠檬酸钠抗凝剂的试管中或等量Alsever液中（后者可在4℃下保存2周），用20倍量的PBS洗涤血球，重复3～4次。
每次2000转、分离心5分钟，最后一次离心10分钟，吸取压积血球，用PBS配成0.5%悬液，或先配成10%浓悬液（可在4℃下保存2～3天）用时进行20倍稀释。
MTT实验原理和实验步骤
MTT实验原理和实验步骤MTT原理：MTT全称为3-(4,5)-dimethylthiahiazo (-z-y1)-3,5-di- phenytetrazoliumromid e，是一种黄颜色的染料。
活细胞线粒体中琥珀酸脱氢酶能够代谢还原MTT，同时在细胞色素C的作用下，生成蓝色（或蓝紫色）不溶于水的甲�H（Formazan），甲�H的多少可以用酶标仪在570nm 处进行测定。
在通常情况下，甲�H生成量与活细胞数成正比，因此可根据光密度OD值推测出活细胞的数目。
由于死细胞中不含琥珀酸脱氢酶，因此加入MTT 不会有反应。
MTT 溶液的配制方法：通常，此法中的 MTT 浓度为5mg/ml。
因此，可以称取MTT 0.5克，溶于100 ml的磷酸缓冲液（PBS）或无酚红的培养基中，用0.22μm滤膜过滤以除去溶液里的细菌，放4℃ 避光保存即可。
在配制和保存的过程中，容器最好用铝箔纸包住。
需要注意的是，MTT法只能用来检测细胞相对数和相对活力，但不能测定细胞绝对数。
在用酶标仪检测结果的时候，为了保证实验结果的线性，MTT 吸光度最好在0-0.7 范围内。
实验步骤：（1）接种细胞：用含10％胎小牛血清得培养液配成单个细胞悬液，以每孔1000－1 0000个细胞接种到96孔板，每孔体积200ul.（2）培养细胞：同一般培养条件，培养3－5天（可根据试验目的和要求决定培养时间）。
（3）呈色：培养3－5天后，每孔加MTT溶液（5mg/ml用PBS <ph=7.4>配)20ul.（4）继续孵育4小时，终止培养，小心吸弃孔内培养上清液，对于悬浮细胞需要离心后再吸弃孔内培养上清液。
每孔加150ul DMSO，振荡10分钟，使结晶物充分融解。
（5）比色：选择490nm波长，在酶联免疫监测仪上测定各孔光吸收值，记录结果，以时间为横坐标，吸光值为纵坐标绘制细胞生长曲线。
注意事项：（1）选择适当得细胞接种浓度。
（2）避免血清干扰：一般选小于10％的胎牛血清的培养液进行试验。
福特TRANSIT CONNECT商业用车型号技术参数说明说明书
T ECHNICAL S PECIFICATIONSFORD TRANSIT CONNECT – PRELIMINARY SPECIFICATIONS FUEL CONSUMPTIONFuel consumptionl/100km (mpg)Engine Power(PS)CO2(g/km)Urban Extra Urban CombinedTransit Connect Van L11.6 Duratorq TDCi (5-sp man) with FE pack* 75 115 4.8 (58.9) 4.2 (67.3) 4.4 (64.2) 1.6 Duratorq TDCi (5-sp man) 75 124 5.5 (51.4) 4.3 (65.7) 4.8 (58.9) 1.6 Duratorq TDCi (5-sp man) with FE pack 95 115 4.8 (58.9) 4.2 (67.3) 4.4 (64.2) 1.6 Duratorq TDCi (5-sp man) 95 124 5.5 (51.4) 4.3 (65.7) 4.8 (58.9) 1.6 Duratorq TDCi ECOnetic** (5-sp man) 95 105 4.5 (62.8)3.7 (76.3)4.0 (70.6) 1.6 Duratorq TDCi (6-sp man) 115 1245.5 (51.4) 4.3 (65.7) 4.8 (58.9) 1.0 EcoBoost (6-sp man) 100 1296.4 (44.1) 5.1 (55.4) 5.6 (50.4) 1.6 EcoBoost (6-sp auto) 150 179 10.8 (26.2) 5.9 (47.9) 7.7 (36.7) Transit Connect Van L21.6 Duratorq TDCi (5-sp man) with FE pack 75 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 75 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6) 1.6 Duratorq TDCi (5-sp man) with FE pack 95 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 95 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6) 1.6 Duratorq TDCi ECOnetic** (5-sp man) 95 108 4.7 (60.1)3.8 (74.3) 4.1 (68.9) 1.6 Duratorq TDCi (6-sp man) 115 1285.7 (49.6) 4.4 (64.2) 4.9 (57.6) 1.0 EcoBoost (6-sp man) 100 1296.4 (44.1) 5.1 (55.4) 5.6 (50.4) 1.6 EcoBoost (6-sp auto) 150 184 10.9 (25.9) 6.3 (44.8) 8.0 (35.3) Transit Connect Kombi***/DCiV L11.6 Duratorq TDCi (5-sp man) with FE pack 75 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 75 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6) 1.6 Duratorq TDCi (5-sp man) with FE pack 95 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 95 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6) Transit Connect Kombi***/DCiV L21.6 Duratorq TDCi (5-sp man) with FE pack 75 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 75 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6) 1.6 Duratorq TDCi (5-sp man) with FE pack 95 119 5.0 (56.5) 4.3 (65.7) 4.6 (61.4) 1.6 Duratorq TDCi (5-sp man) 95 128 5.5 (51.4) 4.5 (62.8) 4.9 (57.6)* Fuel Economy pack includes Auto-Start-Stop, Active Grille Shutter, Smart Regenerative Charging** Fitted with 100kph speed limiter*** Figures for Kombi vehicles refer to N1; Kombi vehicles with M1 homologation deliver slightly different results.WEIGHTS AND DIMENSIONS WeightsGross payload (kg)ØGrossvehiclemass(kg)Kerbmass(kg)uFrontaxleplatedmass(kg)Frontaxlekerbmass(kg)Rearaxleplatedmass(kg)Rearaxlekerbmass(kg)TrailerPlate (kg)braked(unbraked)Max.GTM(kg)200 L1 Transit Connect1.0 EcoBoost 628 1970 1342 1125 777 1050 564 1200 (705) 2875 1.6 EcoBoost 634 2025 1391 1125 832 1050 559 1200 (730) 2925 1.6 Duratorq 75 PS 625 2005 1380 1125 819 1050 561 1200 (725) 2905 1.6 Duratorq 95PSECO644 2015 1371 1125 823 1050 548 N/A N/A 1.6 Duratorq 95 PS 625 2005 1380 1125 821 1050 561 1200 (725) 3155 1.6 Duratorq 115 PS 626 2015 1389 1125 832 1050 557 1200 (730) 3165 220 L1 Transit Connect High Payload1.6 Duratorq 75 PS 825 2215 1390 1125 824 1250 566 1200 (730) 2915 1.6 Duratorq 95 PS 825 2215 1390 1125 824 1250 566 1200 (730) 3165 1.6 Duratorq 115 PS 831 2230 1399 1125 837 1250 563 1200 (735) 3180 220 L1 Transit Connect DCiV High Payload1.6 Duratorq 75 PS 725 2230 1505 1125 880 1250 624 1200 (750) 2930 1.6 Duratorq 95 PS 725 2230 1505 1125 880 1250 624 1200 (750) 3180 220 L1 Transit Connect Kombi High Payload1.6 Duratorq 75 PS 708 2220 1512 1125 885 1250 628 1175 (750) 2920 1.6 Duratorq 95 PS 708 2220 1512 1125 885 1250 628 1200 (750) 3170 210 L2 Transit Connect1.0 EcoBoost 714 2085 1371 1175 813 1125 558 1200 (720) 2935 1.6 Duratorq 75 PS 715 2125 1410 1175 855 1125 555 1200 (740) 2925 1.6 Duratorq 95PSECO706 2125 1419 1175 864 1125 555 N/A N/A 1.6 Duratorq 95 PS 715 2125 1410 1175 855 1125 555 1200 (740) 3175 1.6 Duratorq 115 PS 716 2135 1419 1175 868 1125 551 1200 (745) 3185 230 L2 Transit Connect High Payload1.6 EcoBoost 911 2335 1424 1225 873 1300 552 1200 (745) 2935 1.6 Duratorq 95 PS 1003 2395 1392 1225 853 1355 539 1200 (730) 3195 1.6 Duratorq 115 PS 1004 2405 1401 1225 866 1355 535 1200 (735) 3205 230 L2 Transit Connect DCiV High Payload1.6 Duratorq 75 PS 716 2270 1554 1175 909 1275 645 1150 (750) 2940 1.6 Duratorq 95 PS 716 2270 1554 1175 909 1275 645 1200 (750) 3140 230 L2 Transit Connect Kombi High Payload1.6 Duratorq 75 PS 770 2270 1500 1175 852 1275 648 1140 (750) 2940 1.6 Duratorq 95 PS 770 2270 1500 1175 852 1275 648 1200 (750) 3140 L2 Transit Connect Kombi 7-Seater1.6 Duratorq 75 PS 788 2300 1512 1175 885 1240 627 800 (750) 2945 1.6 Duratorq 95 PS 788 2300 1512 1175 885 1240 627 1000 (750) 31452ØPayload = Gross vehicle mass, less kerb mass. All kerb masses quoted are subject to manufacturing tolerances and are for base models with minimum equipment and no spare wheel. u Represents the lightest kerbweight assuming full fluid levels and 90% fuel levels, subject to manufacturing tolerances and options, etc, fitted. Dimensions(Dimensions in mm unless stated)TransitConnectL1TransitConnectL2TransitConnectDCiV L1TransitConnectDCiV L2TransitConnectKombiL1TransitConnectKombiL2TransitConnectKombi L2 7SeaterOverall length 4418 4818 4418 4818 4418 4818 4818 Overall width without mirrors 1835 1835 1835 1835 1835 1835 1835 Overall width with mirrors 2137 2137 2137 2137 2137 2137 2137 Overall height (unladen) 1861 1862 1836 1839 1836 1845 1840 Front overhang 878 878 878 878 878 878 878 Wheelbase 2662 3062 2662 3062 2662 3062 3062 Rear overhang 878 878 878 878 878 878 878 Side door entry width n/a n/a 612 839 612 839 839 Side door entry width (withbulkhead)433 660 n/a n/a n/a n/a n/aRear door opening widthbelow belt1248 1248 n/a n/a n/a n/a n/a Rear door opening width max n/a n/a 1248 1248 1248 1193 1193 Loadspace width betweenwheel arches1226 1226 1226 1226 1226 1149 1149 Rear door opening height 1136 1136 1136 1136 1146 1146 1146 Loadspace width at floor 1538 1538 n/a n/a n/a n/a n/a Loadspace width n/a n/a 1268 1268 1268 1477 1477 Side door opening height 1228 1228 1228 1228 1228 1141 1141 Loadspace floor to roof 1269 1269 1237 1267 1237 1226 1066 Loadspace length (max) (tobulkhead)1753 2153 n/a n/a n/a n/a n/aLoadspace length (laden tobelt line)1558 1958 n/a n/a n/a n/a n/aLoadspace length (laden tobelt line, to back of front seat)n/a n/a n/a n/a 1800 1947 1947 Loadspace length (at floor) n/a n/a 845 1072 913 n/a n/a Loadspace length (back offront seat, at floor)n/a n/a n/a n/a n/a 2179 2179Loadspace length max (withload through bulkhead)3000 3400 n/a n/a n/a n/a n/a Loading height (unladen) 599 599 593 586 593 597 597 Front track 1568 1568 1568 1568 1568 1568 1568 Rear track 1585 1585 1584 1584 1584 1584 1584 Ground clearance 152 159 154 165 154 163 163 Cargo volume behindbulkhead VDA/SAE2.6/2.9m33.2/3.6m3n/a/1.2m3n/a/1.6m3n/a n/a n/aCargo Volume (7 seats up)(litres)n/a n/a n/a n/a n/a n/a 322Cargo volume (2nd row seatup) (litres)n/a n/a n/a n/a 1029 1529 1287Cargo volume (2nd row seatfolded) (litres)n/a n/a n/a n/a 2003 2761 26203Cargo volume less bulkhead,3.7m34.4m3n/a n/a n/a n/a n/a with front seat folded SAE4BODY AND CHASSISBody Structure Computer-optimised, high-efficiency, unitary-welded steel body incorporatingrigid occupant cell and front and rear energy-absorbing crumple zones;direct-glazed windshield.Passive safety and restraint system elements Integrated passive safety system featuring:•Full size driver’s airbag•Optional passenger airbag with de-activation switch•Optional thorax-protecting side airbags for front occupants•Optional side curtain airbags for front occupants•Three-point safety belts in all positions. Front seat belts are specified with outboard pre-tensioners as standard.•Safety belt reminders for driver and front passenger•ISOFIX child seat attachment points on single front passenger seats (not on dual passenger seat) for vans and on the 2 outer seats in the 2nd row on Kombi modelsCorrosion protection Multi-stage paint and body protection process, including zinc precoating forall relevant exterior panels, optimised dip phosphate coat, electrocoatprimer, primer/surfacer and basecoat/clearcoat system, plus comprehensivecavity wax injection, PVC underbody coating and stone chip protection.Thick PVC sealing beads for flanges. Front plastic wheel arch liners, reartextile wheel arch liners, anti scuff strips on inner doorsills.Suspension Front – Independent MacPherson struts with offset coil spring over gas filleddamper units and lower L-arms with optimised front rubber bushings andrear bush mounted on separate reinforced cross-member sub-frame, anti rollbar.Rear – Torsion beam rear suspension with coil springs and monotubedamper units.Steering Type – Rack and pinion steering with rack-mounted Electric Power AssistedSteering (EPAS)Turning circle (Kerb-to-Kerb) – 11.3m (L1), 12.2m (L2)Turning circle (Wall-to-Wall) – 11.7m (L1), 12.5m (L2)Turns lock-to-lock – 2.7Brakes Dual circuit, diagonally split, hydraulically operated disc brakes front andrear. Vacuum servo assisted with four-channel ABS and electronic brakedistribution (EBD)Brake disc dimensions (front/ventilated discs):300mm diameter (low payload models)320mm diameter (high payload models)Brake disc dimensions (rear/solid discs):280mm diameterModulation:ABS, Traction Control, ESC, EBD, Emergency Brake Assist (EBA), LoadAdaptive Control (LAC), Hill Start Assist (HSA), Trailer Sway Control (TSC),Emergency Brake Light (EBL), Torque Vectoring Control (TVC)Optional Active City Stop system5Wheels and tyresWheel type Pressed Steel AlloyWheel size 6.5 x 16” 6.5 x 16”Tyre size 205/60 R 16 205/60 R 16Spare wheel and tyre Full-sized spare or Tyre Mobility Kit (varies by market and vehiclespecification)6PETROL ENGINES1.0-litre EcoBoost(100PS) 1.6-litre EcoBoost(150PS)Type Inline three cylinder turbo petrol, directfuel injection and Ti-VCT, transverse Inline four cylinder turbo petrol, direct fuel injection and Ti-VCT, transverseDisplacement cm3999 1597 Bore mm 71.9 79.0 Stroke mm 82.0 81.4 Compressionratio10.0:1 10.0:1 Max power PS (kW) 100 (74) 150 (110) at rpm 6000 5700 Max torque Nm 170 240 at rpm 1400-4000 1600—4000Valve gear DOHC with 4 valves per cylinder,twin independent variable cam timingDOHC with 4 valves per cylinder, twin independent variable cam timingCylinders 3 in line 4 in lineCylinder head Cast aluminium Cast aluminium Cylinder block Cast iron Cast aluminium Camshaft drive Low friction Belt-in-Oil with dynamictensionerTiming belt with dynamic tensionerCrankshaft Cast iron, 6 counterweights, 4 mainbearings Cast iron, 4 counterweights, 5 mainbearingsEngine management Bosch MED17 with CAN-Bus andindividual cylinder knock controlBosch MED17 with CAN-Bus andindividual cylinder knock controlFuel injection High pressure direct fuel injection with 6hole injectors High pressure direct fuel injection with 6hole injectorsEmission level Euro Stage 5 Euro Stage 5 Turbocharger Continental low inertia turbo Borg Warner KP39 low inertia turboLubrication systemElectronically controlled variabledisplacement oil pump for improved fueleconomyElectronically controlled variabledisplacement oil pump for improved fueleconomySystem capacitywith filterlitres 4.1 4.1Cooling system Split cooling system with 2 thermostats Water pump with thermostat and valves System capacityincl heaterlitres 5.5 5.5Transmission Durashift 6-speed (B6) manual 6F35 6-speed automatic transmission Gear ratios6th 0.6835th 0.8444th 0.7803rd 1.1212nd 1.8641st 3.727 Reverse 3.625 Final Drive 4.276th 0.7465th 1.0004th 1.4463rd 1.9122nd 2.9641st 4.584Reverse 2.943Final Drive 3.06678 Power Curves1.0-litre EcoBoost 100PS (74kW)1.6-litre EcoBoost 150PS (110kW)DIESEL ENGINE1.6-litre Duratorq TDCi(95PS)Type Inline four cylinder turbo diesel, transverseDisplacement cm31560Bore mm 75.0Stroke mm 88.3Compressionratio16.0:1Max power PS (kW) 75 (55) 95 (70) 115 (85) at rpm 3500 3600 3600Max torque Nm 220 230 270 at rpm 1500 1500—2000 1750—2500 Valve gear SOHCwith 2 valves per cylinderCylinders 4 in lineCylinder head Cast aluminiumCylinder block Cast aluminiumCamshaft drive Timing belt with dynamic tensionerCrankshaft Drop forged steel, 8 counter- weights, 5 main bearingsEnginemanagementFord Common Rail Diesel Engine Management SystemFuel injection Common rail direct fuel inj; 1650 bar injection pressure; 7-hole piezo-electricinjectorsEmissioncontrolOxidation catalyst, water cooled EGR and standard cDPF Emission level Euro Stage 5Turbocharger Garrett variable geometry turbochargerLubricationsystemPressure-fed lubrication system with full flow oil filterSystem capacity litres 3.8 with filterCooling system Water pump with thermostat and valves, with thermal management system System capacity litres 5.8 incl heaterTransmission Durashift 5-speed (MTX75) manual Durashift 6-speed(MMT6) manual Gear ratios5th 0.6744th 0.8653rd 1.2582nd 2.0481st 3.800 Reverse 3.727 Final Drive 3.565th 0.6744th 0.8653rd 1.2582nd 2.0481st 3.800Reverse 3.727Final Drive 3.56(Econetic 3.41)6th 0.7895th 0.9434th 0.8683rd 1.1942nd 1.8641st 3.583Reverse 3.615Final Drive 3.699Power Curves1.6-litre Duratorq TDCi 75PS (55kW)1.6-litre Duratorq TDCi 95PS (70kW)10111.6-litre Duratorq TDCi 115PS (85kW)* The stated fuel consumption and CO2 emissions are measured according to the technical requirements and specifications of the European Regulation (EC) 715/2007 as last amended. Results in MPG also correspond to this European drive cycle and are stated in imperial gallons. The results may differ from fuel economy figures in other regions of the world due to the different drive cycles and regulations used in those marketsNote: The data information in this press release reflects preliminary specifications and was correct at the time of going to print. However, Ford policy is one of continuous product improvement. The right is reserved to change these details at any time.About Ford Motor CompanyFord Motor Company, a global automotive industry leader based in Dearborn, Mich., manufactures or distributes automobiles across six continents. With about 175,000 employees and 65 plants worldwide, the company’s automotive brands include Ford and Lincoln. The company provides financial services through Ford Motor Credit Company. For more information regarding Ford’s products, please visit .Ford Europe is responsible for producing, selling and servicing Ford brand vehicles in 50 individual markets and employs approximately 47,000 employees at its wholly owned facilities and approximately 69,000 people when joint ventures and unconsolidated businesses are included. In addition to Ford Motor Credit Company, Ford Europe operations include Ford Customer Service Division and 24 manufacturing facilities (15 wholly owned or consolidated joint venture facilities and nine unconsolidated joint venture facilities). The first Ford cars were shipped to Europe in 1903 – the same year Ford Motor Company was founded. European production started in 1911.Contacts: Detlef JenterFord of Europe+49 221 901 8745****************1213。
BCA法和考马斯亮蓝法测蛋白质浓度
BCA法和考马斯亮蓝法测蛋白质浓度分光光度法介绍分光光度法是利用溶液中特定溶质的光吸收测定其浓度的方法，其基本原理是根据Lambert和Beer定律。
一 Lambert定律当一束平行单色光垂直照射于一均匀物质溶液时，溶液将吸收一部分光能，使光的强度减弱。
若溶液的浓度不变，则在溶液中的光程越长，光线强度的减弱也越显著。
设：入射光强度为I0，透射光强度为I，L代表光在溶液中的光程。
I0lg =K1L IK1是常数，受光线波长，溶液性质，溶液浓度影响。
二 Beer定律当一束光通过一溶液时，光能被溶液介质吸收一部分，若光程不变，则溶液的浓度越大，光吸收越强，透射光强度的减弱也越显著，光线减弱的比例与溶液浓度呈正比。
I0lg =K2C IK2为吸收系数，是常数。
溶液对光吸收的强弱与溶液浓度C成正比。
三 Lambert-Beer定律将以上两个定律合并： Iolg =KCL IIoI令A=lg T= 则A=KCL=-lgTIIoT为透光度，A为吸光度，K为消光系数四待测样品浓度的计算 A标=KC标L A样=KC样L 由于是同一物质及相同的光程，则：A样/A标=KC样L/KC标L=C样/C标即：C样=（A样/A标）*C样故已知标准溶液的浓度及吸光度，依据公式可计算出待测样品溶液的浓度。
一实验名称： BCA法测定蛋白质含量二实验原理：BCA即二奎�@甲酸。
在碱性条件下，蛋白的肽键结构将二价铜离子还原为亚铜离子，亚铜离子与BCA试剂形成稳定的紫色络合物，并在562nm处有最大的光吸收值，该复合物颜色深浅与蛋白质的浓度成正比，故可通过吸收值的大小对蛋白质进行定量。
三实验步骤：A 标准品的稀释：将9支干燥的1.5ml离心管编号，按表加入下列试剂：1.2ml离心管 A B C D E F G H IBCA法标准曲线和样品测定ddH2O（μL2mg/mLBSA（μL蛋白质终浓度（μg/mL) ））0 50μL标准品2000 125 375μL标准品1500 325 325μL标准品 1000 175175μLB管混合液750 325 325μLC管混合液500 325 325μLE管混合液 250 325325μLF管混合液125 400 100μLG管混合液 25 400 0 0=BlankB 配置BCA工作液：依据样品数量，将试剂A和试剂B按体积比50:1配制适量BCA工作液，并充分混匀。
Pm25LV010
512 Kbit / 1 Mbit 3.0 Volt-only, Serial Flash MemoryWith 25 MHz SPI Bus Interface PMCFEATURES• Single Power Supply Operation- Low voltage range: 2.7 V - 3.6 V• Memory Organization- Pm25LV512: 64K x 8 (512 Kbit)- Pm25LV010: 128K x 8 (1 Mbit)• Cost Effective Sector/Block Architecture- Uniform 4 Kbyte sectors- Uniform 32 Kbyte blocks (8 sectors per block)- Two blocks with 32 Kbytes each (512 Kbit)- Four blocks with 32 Kbytes each (1 Mbit)- 128 pages per block• Serial Peripheral Interface (SPI) Compatible - Supports SPI Modes 0 (0,0) and 3 (1,1)• High Performance Read- 25 MHz clock rate (maximum)• Page Mode for Program Operations- 256 bytes per page • Block Write Protection- The Block Protect (BP1, BP0) bits allow part or entire of the memory to be configured as read-only.• Hardware Data Protection- Write Protect (WP#) pin will inhibit write operations to the status register•Page Program (up to 256 Bytes)- Typical 2 ms per page program time• Sector, Block and Chip Erase- Typical 40 ms sector/block/chip erase time• Single Cycle Reprogramming for Status Register - Build-in erase before programming• High Product Endurance- Guarantee 100,000 program/erase cycles per single sector (preliminary)- Minimum 20 years data retention• Industrial Standard Pin-out and Package- 8-pin JEDEC SOIC- 8-contact WSON- Optional lead-free (Pb-free) packagesGENERAL DESCRIPTIONThe Pm25LV512/010 are 512 Kbit/1 Mbits 3.0 Volt-only serial Flash memories. These devices are designed to use a single low voltage, range from 2.7 Volt to 3.6 Volt, power supply to perform read, erase and program operations. The devices can be programmed in standard EPROM programmers as well.The device is optimized for use in many commercial applications where low-power and low-voltage operation are essential. The Pm25LV512/010 is enabled through the Chip Enable pin (CE#) and accessed via a 3-wire interface consisting of Serial Data Input (Sl), Serial Data Output (SO), and Serial Clock (SCK). All write cycles are com-pletely self-timed.Block Write protection for top 1/4, top 1/2 or the entire memory array (1M) or entire memory array (512K) is enabled by programming the status register. Separate write enable and write disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts to the status register. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence.Pm25LV512 / Pm25LV010The Pm25LV512/010 are manufactured on PMC’s advanced nonvolatile CMOS technology, P-FLASH™. The de-vices are offered in 8-pin JEDEC SOIC and 8-contact WSON packages with operation frequency up to 25 MHz.PRODUCT ORDERING INFORMATIONPm25LVxxx -25 S C ETemperature RangeC = Commercial (0°C to +70°C)Package TypeS = 8-pin SOIC (8S)Q = 8-contact WSON (8Q)Operating Speed 25 MHzPMC Device Number Pm25LV512 (512 Kbit)Pm25LV010 (1 Mbit)r e b m u N t r a P y c n e u q e r F g n i t a r e p O )z H M (e g a k c a P eg n a R e r u t a r e p m e T E C S 52-215V L 52m P 52S8l a i c r e m m o C )C °07+o t C °0(C S 52-215V L 52m P E C Q 52-215V L 52m P Q8C Q 52-215V L 52m P E C S 52-010V L 52m P 52S8C S 52-010V L 52m P E C Q 52-010V L 52m P Q8CQ 52-010V L 52m P Environmental AttributeE = Lead-free (Pb-free) Package Blank = Standard PackageSPI MODESThese devices can be driven by microcontroller with its SPI peripheral running in either of the two following modes:Mode 0 = (0, 0)Mode 3 = (1, 1)For these two modes, input data is latched in on the rising edge of Serial Clock (SCK), and output data isavailable from the falling edge of Serial Clock (SCK).The difference between the two modes, as shown in Figure 2, is the clock polarity when the bus master is in Stand-by mode and not transfering data:- Clock remains at 0 (SCK = 0) for Mode 0 (0, 0)- Clock remains at 1 (SCK = 1) for Mode 3 (1, 1)Figure 2. SPI ModesSCKSCKSIS OMode 0 (0 0)Mode 3 (1 1)SERIAL INTERFACE DESCRIPTION (CONTINUED)e m a N n o i t c u r t s n I ta m r o F n o i t c u r t s n I ed o C xe H no i t a r e p O N E R W 01100000h 60h c t a L e l b a n E e t i r W t e S I D R W 00100000h 40h c t a L e l b a n E e t i r W t e s e R R S D R 10100000h 50r e t s i g e r s u t a t S d a e R R S R W 10000000h 10re t s i g e R s u t a t S e t i r W D A E R 11000000h 30yr a r r A y r o m e M m o r f a t a D d a e R D A E R _T S A F 11010000h B 0d e e p S r e h g i H t a y r o m e M m o r f a t a D d a e R G O R P _G P 01000000h 20y a r r A y r o m e M o t n I a t a D m a r g o r P E S A R E _R O T C E S 11101011h 7D y a r r A y r o m e M n i r o t c e S e n O e s a r E E S A R E _K C O L B 00011011h 8D y a r r A y r o m e M n i k c o l B e n O e s a r E E S A R E _P I H C 11100011h 7C y a r r A y r o m e M e r i t n E e s a r E DI D R 11010101hB A DI t c u d o r P d n a r e r u t c a f u n a M d a e R Table 1. Instruction Set for the Pm25LV512/010DEVICE OPERATIONThe Pm25LV512/010 is designed to interface directly with the synchronous serial peripheral interface (SPI) of the 6800 type series of microcontrollers.The Pm25LV512/010 utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in Table 1. All instructions, addresses, and data are transferred with the MSB first and start with a high-to-low transition.Write is defined as program and/or erase in this specification. The following commands, PAGE PROGRAM,SECTOR ERASE, BLOCK ERASE, CHIP ERASE, and WRSR are write instructions for Pm25LV512/010.n o i t a c i f i t n e d I t c u d o r P a t a D D I r e r u t c a f u n a M hD 9:D I e c i v e D 215V L 52m P h B 7010V L 52m P h C 7Table 2. Product IdentificationREAD PRODUCT ID (RDID): The RDID instruction allows the user to read the manufacturer and product ID of the device. The instruction code is followed by three dummy bytes, each bit being latched-in on Serial Data Input (SI)during the rising edge of Serial Clock (SCK). Then the first manufacturer ID (9Dh) is shifted out on Serial Data Output (SO), followed by the device ID (7Bh = Pm25LV512; 7Ch = Pm25LV010) and the second manufacturer ID (7Fh), each bit been shifted out during the falling edge of Serial Clock (SCK).t i B no i t i n i f e D )Y D R (0t i B .Y D A E R s i e c i v e d e h t s e t a c i d n i 0=0t i B s i e c i v e d e h t d n a s s e r g o r p n i s i e l c y c e t i r w e h t s e t a c i d n i 1=0t i B .Y S U B )N E W (1t i B .D E L B A N E E T I R W t o n s i e c i v e d e h t s e t a c i d n i 0=1t i B .D E L B A N E E T I R W s i e c i v e d e h t s e t a c i d n i 1=1t i B )0P B (2t i B .5e l b a T e e S )1P B (3t i B .5e l b a T e e S .e l c y c e t i r w l a n r e t n i n a n i t o n s i e c i v e d n e h w s 0e r a 6-4s t i B )N E P W (7t i B .)#P W (n i p t c e t o r P e t i r W f o n o i t c n u f e h t s k c o l b 0=N E P W .)#P W (n i p t c e t o r P e t i r W e h t s e t a v i t c a 1=N E P W .s l i a t e d r o f 6e l b a T e e S .e l c y c e t i r w l a n r e t n i n a g n i r u d s 1e r a 7-0s t i B Table 4. Read Status Register Bit DefinitionWRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select one of four levels of protec-tion for the Pm25LV010. The Pm25LV010 is divided into four blocks where the top quarter (1/4), top half (1/2), or all of the memory blocks can be protected (locked out) from write. The Pm25LV512 is divided into 2 blocks where all of the memory blocks can be protected (locked out) from write. Any of the locked-out blocks will therefore be READ only. The locked-out block and the corresponding status register control bits are shown in Table 5.The three bits, BP0, BP1, and WPEN, are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, RDSR).WRITE ENABLE (WREN): The device will power up in the write disable state when Vcc is applied. All write instructions must therefore be preceded by the WREN instruction.WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the WRDI instruction disables all write commands. The WRDI instruction is independent of the status of the WP# pin.READ STATUS REGISTER (RDSR): The RDSR instruction provides access to the status register. The READY/BUSY and write enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction.During internal write cycles, all other commands will be ignored except the RDSR instruction.7t i B 6t i B 5t i B 4t i B 3t i B 2t i B 1t i B 0t i B NE P W XXX1P B 0P B NE W YD R Table 3. Status Register FormatN E P W P W N E W sk c o l B d e t c e t o r P sk c o l B d e t c e t o r p n U re t s i g e R s u t a t S 0X 0d e t c e t o r P d e t c e t o r P d e t c e t o r P 0X 1d e t c e t o r P e l b a t i r W e l b a t i r W 1w o L 0d e t c e t o r P d e t c e t o r P d e t c e t o r P 1w o L 1d e t c e t o r P e l b a t i r W d e t c e t o r P X h g i H 0d e t c e t o r P d e t c e t o r P d e t c e t o r P Xhg i H 1de t c e t o r P el b a t i r W el b a t i r W Table 6. WPEN OperationThe WRSR instruction also allows the user to enable or disable the Write Protect (WP#) pin through the use of the Write Protect Enable (WPEN) bit. Hardware write protection is enabled when the WP# pin is low and the WPEN bit is "1". Hardware write protection is disabled when either the WP# pin is high or the WPEN bit is "0." When the device is hardware write protected, writes to the Status Register, including the Block Protect bits and the WPEN bit, and the locked-out blocks in the memory array are disabled. Write is only allowed to blocks of the memory which are not locked out. The WRSR instruction is self-timed to automatically erase and program BP0, BP1, and WPEN bits. In order to write the status register, the device must first be write enabled via the WREN instruction.Then, the instruction and data for the three bits are entered. During the internal write cycle, all instructions will be ignored except RDSR instructions. The Pm25LV512/010 will automatically return to write disable state at the completion of the WRSR cycle.Note: When the WPEN bit is hardware write protected, it cannot be changed back to "0", as long as the WP# pinis held low.l e v e L st i B r e t s i g e R s u t a t S 215V L 52m P 010V L 52m P 1P B 0P B s e s s e r d d A y a r r A tu O d e k c o L t u o -d e k c o L )s (k c o l B s e s s e r d d A y a r r A tu O d e k c o L t u o -d e k c o L )s (k c o l B 000en o N en o N e n o N e n o N )4/1(101F F F F 10-0008104k c o l B )2/1(210F F F F 10-0000104,3k c o l B )l l A (311FF F F 00-000000s k c o l B l l A )2-1(FF F F 10-000000s k c o l B l l A )4-1(Table 5. Block Write Protect BitsREAD: Reading the Pm25LV512/010 via the SO (Serial Output) pin requires the following sequence. After the CE#line is pulled low to select a device, the READ instruction is transmitted via the Sl line followed by the byte address to be read (Refer to Table 7). Upon completion, any data on the Sl line will be ignored. The data (D7-D0) atthe specified address is then shifted out onto the SO line. If only one byte is to be read, the CE# line should be driven high after the data comes out. The READ instruction can be continued since the byte address is automati-cally incremented and data will continue to be shifted out. For the Pm25LV512/010, when the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one continuous READ instruction.FAST_READ: The device is first selected by driving CE# low. The FAST READ instruction is followed by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of SCK (Serial Clock). Then the memory contents, at that address, is shifted out on SO (Serial Output), each bit being shifted out, at a maximum frequency f FR , during the falling edge of SCK (Serial Clock).The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read with a single FAST READ instruction. The FAST READ instruction is terminated by driving CE# high.PAGE PROGRAM (PG_PROG): In order to program the Pm25LV512/010, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then the PAGE PROGRAM instruc-tion can be executed. Also, the address of the memory location(s) to be programmed must be outside the pro-tected address field location selected by the Block Write Protection Level. During an internal self-timed program-ming cycle, all commands will be ignored except the RDSR instruction.The PAGE PROGRAM instruction requires the following sequence. After the CE# line is pulled low to select the device, the PAGE PROGRAM instruction is transmitted via the Sl line followed by the address and the data (D7-D0)to be programmed (Refer to Table 7). Programming will start after the CE# pin is brought high. The low-to-high transition of the CE# pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data bit.The READY/BUSY status of the device can be determined by initiating a RDSR instruction. If Bit 0 = 1, the program cycle is still in progress. If Bit 0=0, the program cycle has ended. Only the RDSR instruction is enabled during the program cycle. A single PROGRAM instruction programs 1 to 256 consecutive bytes within a page if it is not write protected. The starting byte could be anywhere within the page. When the end of the page is reached, the address will wrap around to the beginning of the same page. If the data to be programmed are less than a full page, the data of all other bytes on the same page will remain unchanged. If more than 256 bytes of data are provided, the address counter will roll over on the same page and the previous data provided will be replaced. The same byte cannot be reprogrammed without erasing the whole sector/block first. The Pm25LV512/010 will automatically return to the write disable state at the completion of the PROGRAM cycle.Note: If the device is not write enabled (WREN) the device will ignore the Write instruction and will return to thestandby state, when CE# is brought high. A new CE# falling edge is required to re-initiate the serial communication.ss e r d d A 215V L 52m P 010V L 52m P A NA 51A -0A 61A -0st i B e r a C t 'n o D A 32A -61A 32A -71Table 7. Address Keys s e r d d A k c o l B kc o l B 215V L 52m P kc o l B 010V L 52m P F F F 700o t 0000001k c o l B 1k c o l B F F F F 00o t 0008002k c o l B 2k c o l B F F F 710o t 000010A /N 3k c o l B FF F F 10o t 000810A/N 4k c o l B Table 8. Block AddressesSECTOR_ERASE, BLOCK_ERASE: Before a byte can be reprogrammed, the sector/block which contains the byte must be erased. In order to erase the Pm25LV512/010, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then the SECTOR ERASE or BLOCK ERASE instruction can be executed.The BLOCK ERASE instruction erases every byte in the selected block if the block is not locked out. Block address is automatically determined if any address within the block is selected. The BLOCK ERASE instruction is internally controlled; it will automatically be timed to completion. During this time, all commands will be ignored,except RDSR instruction. The Pm25LV512/010 will automatically return to the write disable state at the completion of the BLOCK ERASE cycle.CHIP_ERASE: As an alternative to the SECTOR and BLOCK ERASE, the CHIP ERASE instruction will erase every byte in all blocks that are not locked out. First, the device must be write enabled via the WREN instruction.Then the CHIP ERASE instruction can be executed. The CHIP ERASE instruction is internally controlled; it will automatically be timed to completion. The CHIP ERASE cycle time maximum is 100 miliseconds. During the internal erase cycle, all instructions will be ignored except RDSR. The Pm25LV512/010 will automatically return to the write disable state at the completion of the CHIP ERASE.HOLD: The HOLD# pin is used in conjunction with the CE# pin to select the Pm25LV512/010. When the device is selected and a serial sequence is underway, HOLD# pin can be used to pause the serial communication with the master device without resetting the serial sequence. T o pause, the HOLD# pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD# pin is brought high while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the Sl pin will be ignored while the SO pin is in the high impedance state.HARDWARE WRITE PROTECT: The Pm25LV512/010 has a write lockout feature that can be activated by assert-ing the write protect pin (WP#). When the lockout feature is activated, locked-out sectors will be READ only. The write protect pin will allow normal read/write operations when held high. When the WP# is brought low and WPEN bit is "1", all write operations to the status register are inhibited. WP# going low while CE# is still low will interrupt a write to the status register. If the internal status register write cycle has already been initiated, WP# going low will have no effect on any write operation to the status register. The WP# pin function is blocked when the WPEN bit in the status register is "0". This will allow the user to install the Pm25LV512/010 in a system with the WP# pin tied to ground and still be able to write to the status register. All WP# pin functions are enabled when the WPEN bit is set to "1".DC AND AC OPERATING RANGEABSOLUTE MAXIMUM RATINGS (1)Notes:1.Stresses under those listed in “Absolute Maximum Ratings ” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device or any other conditions under those indicated in the operational sections of this specification is notimplied. Exposure to absolute maximum rating condition for extended periods may affected device reliability.2.Maximum DC voltage on input or I/O pins are V CC + 0.5 V. During voltage transitioning period, input or I/O pins may overshoot to V CC + 2.0 V for a period of time up to 20 ns.Minimum DC voltage on input or I/O pins are -0.5 V. During voltage transitioning period,input or I/O pins may undershoot GND to -2.0 V for a period of time up to 20 ns.s a i B r e d n U e r u t a r e p m e T C °521+o t C °56-er u t a r e p m e T e g a r o t S C °521+o t C °56-er u t a r e p m e T g n i r e d l o S d a e L t n u o M e c a f r u S eg a k c a P d r a d n a t S s d n o c e S 3C °042eg a k c a P e e r f -d a e L s d n o c e S 3C °062s n i P l l A n o d n u o r G o t t c e p s e R h t i w e g a t l o V t u p n I )2(V o t V 5.0-C C V 5.0+d n u o r G o t t c e p s e R h t i w e g a t l o V t u p t u O l l A V o t V 5.0-C C V 5.0+V C C )2(V0.6+o t V 5.0-r e b m u N t r a P 010/215V L 52m P e r u t a r e p m e T g n i t a r e p O C °07o t C °0yl p p u S r e w o P c c V V6.3-V7.2DC CHARACTERISTICSApplicable over recommended operating range from:T AC = 0°C to +70°C, V CC = +2.7 V to +3.6 V (unless otherwise noted).l o b m y S r e t e m a r a P no i t i d n o C ni M p y T x a M s t i n U I 1C C t n e r r u C d a e R e v i t c A c c V V C C n e p O =O S ,z H M 52t a V 6.3=0151A m I 2C C t n e r r u C e s a r E /m a r g o r P c c V V C C n e P O =O S ,z H M 52t a V 6.3=5103A m I 1B S S O M C t n e r r u C y b d n a t S c c V V C C V =#E C ,V 6.3=CC 1.05A µI 2B S L T T t n e r r u C y b d n a t S c c V V C C V =#E C ,V 6.3=H I V o t C C 50.03A m I I L t n e r r u C e g a k a e L t u p n I V N I V o t V 0=CC 1A µI O L t n e r r u C e g a k a e L t u p t u O V N I V o t V 0=C C T ,C A C°07o t C °0=1A µV L I e g a t l o V w o L t u p n I 5.0-8.0V V H I e g a t l o V h g I H t u p n I V 7.0C C V C C 3.0+V V L O e g a t l o V w o L t u p t u O V6.3<C C V <V7.2I L O Am 1.2=54.0V V HO eg a t l o V h g i H t u p t u O I H O A µ001-=V C C 2.0-Vl o b m y S r e t e m a r a P n i M py T x a M s t i n U f R F r o f y c n e u q e r F k c o l C DA E R _T S A F 052z H M f R s n o i t c u r t s n i D A E R r o f y c n e u q e r F k c o l C 002z H M t I R e m i T e s i R t u p n I 02s n t I F e m i T l l a F t u p n I 02s n t H K C e m i T h g i H K C S 02s n t L K C e m i T w o L K C S 02s n t H E C e m i T h g i H E C 52s n t S C e m i T p u t e S E C 52s n t H C e m i T d l o H E C 52s n t S D e m i T p u t e S n I a t a D 5s n t H D e m i T d l o H n i a t a D 5s n t S H e m i T p u t e S d l o H 51s n t D H e m i T d l o H 51s n t V d i l a V t u p t u O 51s n t H O e m i T d l o H t u p t u O 0s n t Z L Z w o L t u p t u O o t d l o H 002s n t Z H Z h g i H t u p t u O o t d l o H 002s n t S I D em i T e l b a s i D t u p t u O 001s n t C E e m i T e s a r E p i h C /k c o l B /r e t c e S 04001s m t p p e m i T m a r g o r P e g a P 25s m t wem i t r e t s i g e R s u t a t S e t i r W 04001sm AC CHARACTERISTICSApplicable over recommended operating range from T A = 0°C to +70°C, V CC = +2.7 V to +3.6 V C L = 1TTL Gate and 30 pF (unless otherwise noted).BLOCK ERASE TimingCHIP ERASE Timing123456789101128293031123212223...3-BYTE ADDRESSINSTRUCTION = 1101 1000bHIGH IMPEDANCECE#SCKSIS O01234567HIGH IMPEDANCESCKCE#SI S OINSTRUCTION = 1100 0111b123456789101128293031123212223...3-BYTE ADDRESSINSTRUCTION = 1101 0111bHIGH IMPEDANCECE#SCKSIS OSECTOR ERASE TimingPROGRAM/ERASE PERFORMANCEre t e m a r a P t i n U p y T x a M sk r a m e R e m i T e s a r E r o t c e S s m 04001n o i t e l p m o c e s a r e o t d n a m m o c e s a r e g n i t i r w m o r F e m i T e s a r E k c o l B s m 04001n o i t e l p m o c e s a r e o t d n a m m o c e s a r e g n i t i r w m o r F e m i T e s a r E p i h C s m 04001n o i t e l p m o c e s a r e o t d n a m m o c e s a r e g n i t i r w m o r F em i T g n i m m a r g o r P e g a P sm 25m a r g o r p o t d n a m m o c m a r g o r p g n i t i r w m o r F no i t e l p m o c re t e m a r a P n i M p y T t i n U do h t e M t s e T e c n a r u d n E 000,001)2(s e l c y C 711A d r a d n a t S C E D E J no i t n e t e R a t a D 02s r a e Y 301A d r a d n a t S C E D E J l e d o M y d o B n a m u H -D S E 000,2s t l o V 411A d r a d n a t S C E D E J l e d o M e n i h c a M -D S E 002s t l o V 511A d r a d n a t S C E D E J pU -h c t a L I +0011C C Am 87d r a d n a t S C E D E J Note: These parameters are characterized and are not 100% tested.Note:1. These parameters are characterized and are not 100% tested.2. Preliminary specification only and will be formalized after cycling qualification test.RELIABILITY CHARACTERISTICS (1)`REVISION HISTORYe t a D .o N n o i s i v e R se g n a h Cf o n o i t p i r c s e D .o N e g a P 2002,r e b o t c O 0.1c e p S y r a n i m i l e r P ,n o i t a c i l b u p w e N l l A 2002,r e b m e c e D 1.1es a e l e R l a m r o F l l A 3002,n u J 2.1n o i t p o e g a k c a p N O S W d e d d A 32,3,2,13002,r e b m e c e D 3.1sn o i t p o e g a k c a p e e r f -d a e L d e d d A 21,3,1000,05m o r f s e l c y c e s a r e /m a r g o r p d e e t n a r u g d e d a r g p U )y r a n i m i l e r p (000,001o t 12,1no i s n e m i d e g a k c a p d e w a r d e r d n a d e t a d p U 32,22。
Mass Spectrometry Metabolite Library 盘5 产品说明书
MSMLS ™ Plate 5 (Water Soluble) Supplied by IROA Technologies, LLC.Catalog Number MSMLS05 Storage Temperature –20 ︒CProduct DescriptionMSMLS05 (Mass Spectrometry Metabolite LibraryPlate 5) is a collection of high quality small biochemical molecules that span a broad range of primarymetabolism. These are high purity (>95%) compounds supplied in an economical, ready-to-use format.The library is most commonly used to provide retention times and spectra for key metabolic compounds, help optimize analytical mass spectrometry protocols, and qualify and quantify mass spectrometry sensitivity and limit of detection.MSMLS ™ Plate 5 comes with MLSDiscovery ™, a software tool to support the extraction, manipulation, and storage of the data generated when using the MSMLS05. For further information on the software, to download, and for manual and video links please visit: /catalog/product/sigma/msmls05ComponentsMSMLS Plate 5 compounds are conveniently provided at 5 μg per well, enough for multiple injections, suitable for manual and automated workflow.The library is intended to be used for massspectrometry metabolomics applications and provides a broad representation of primary metabolism.Occasionally the plate map will change due to theavailability of compounds. The compounds of each row have distinct molecular masses and can be multiplexed, but users should refer to the plate map for their specific lot before proceeding.The plate map contains descriptors and represents information gathered from multiple databases. Please note this data may contain some errors. It is recommended for users to carefully review platecomposition and description information prior to use. To help build a better database, please report any observed discrepancies.MSMLS05 includes:∙ 1 polypropylene plate in 96 well formatPolypropylene deepwell (1.2 mL, total volume per well) plate (MasterBlock ®, GreinerNumber 780215) in combination with seals (VIEWseal ™, Greiner Number 676070)∙ 5 μg (dried weight) of each metaboliteMLSDiscovery software includes: ∙ Plate map∙ Alpha-numeric assigned position ∙ Descriptors:NameParent CIDKEGG ID where available or ChemSpider ID Molecular formula Molecular weightCAS Registry number ChEBIHMDB ID/YMDB IDPubChem Compound and Substance ID Metlin IDPrecautions and DisclaimerFor R&D use only. Not for drug, household, or other uses. Please consult the Safety Data Sheet for information regarding hazards and safe handling practices.Preparation InstructionsThe following are suggestions and dependent on user chromatography and instrumentation.Add 5% of final volume (up to 20 μL) of high purity methanol (MeOH) to every well of the plate. Addultrapure water to make up the desired volume. A final 5% methanol solution is suggested. Pipette liquid up and down in the well 2-3 times to facilitate solubilization.Pool compounds for multiplexing. Again, be sure to check the plate map to ensure one can adequately separate the compounds using the chromatographic system prior to pooling.2Storage/StabilityStore the plate at –20 ︒C.Once the metabolites are dissolved, the plate should be resealed and kept at –20 ︒C or –80 ︒C for long-term storage and protected from light. Avoid repeated freeze/thaw cycles.ProcedureThe compounds of MSMLS Plate 5 can either be used as standards and injected individually or mixed in such a way that the entire library may be examined with reasonable efficiency. Mixing compounds by row mixtures allows multiple compounds to be analyzed per injection. Be sure to check the plate map to ensure one can adequately separate the compounds using the chromatographic system prior to pooling.The following are only suggestions and depend on user chromatography and instrumentation.1. Individual InjectionsAs standards, each well represents a singlecompound. The entire library may be examined ingreat detail with several injections, one for each of the unique metabolites (Total volumes for each well of 250 μL–1 mL may be considered).2. Simple multiplex injectionsIf the rows of the plate are pooled, then the entirecollection may be analyzed with 8 injections ofsimple mixtures. Keep the total volume for eachwell to 150 μL or less to prevent loss due to dilution and use 5-10 μL of each well for the pooledsample. Then, inject 2, 4, or 6 μL of the pooledmaterial as needed. References1. Wishart, D.S. et al., HMDB: the HumanMetabolome Database. Nucleic Acids Res., 2007Jan; 35 (Database issue):D521-6. 17202168.2. Wishart, D.S. et al., HMDB: a knowledge base forthe human metabolome. Nucleic Acids Res., 200937 (Database issue):D603-610. 18953024.3. Wishart, D.S. et al., HMDB 3.0 — The HumanMetabolome Database in 2013. Nucleic Acids Res., 2013. Jan 1;41(D1):D801-7. 231616934. Hastings, J. et al., The ChEBI reference databaseand ontology for biologically relevant chemistry:enhancements for 2013. Nucleic Acids Res., 2013.5. Kanehisa, M., and Goto, S., "KEGG: KyotoEncyclopedia of Genes and Genomes". NucleicAcids Res., 2000 28 (1): 27– 30.doi:10.1093/nar/28.1.27. PMC 102409.PMID10592173.6. Tautenhahn, R. et al., An accelerated workflow foruntargeted metabolomics using the METLINdatabase. Nature Biotechnology, 2012 30: 826–828. doi:10.1038/nbt.2348.7. Smith, C.A. et al., METLIN: a metabolite massspectral database. The Drug Monit., 2005 27 (6):747–51. doi:10.1097/01.ftd.0000179845.53213.39.PMID 16404815.8. Bolton, E. et al., PubChem: Integrated Platform ofSmall Molecules and Biological Activities. Chapter12 IN Annual Reports in Computational Chemistry,Volume4, American Chemical Society, Washington, DC. 2008 Apr [free author manuscript]MSMLS and MLSDiscovery are trademarks of IROA Technologies, LLC.MasterBlock is a registered trademark and VIEWseal is a trademark of Greiner Bio-One GmbH.SS,AA,MAM 04/19-1©2019 Sigma-Aldrich Co. LLC. All rights reserved. SIGMA-ALDRICH is a trademark of Sigma-Aldrich Co. LLC, registered in the US and other countries. Sigma brand products are sold through Sigma-Aldrich, Inc. Purchaser must determine the suitability of the product(s) for their particular use. Additional terms and conditions may apply. Please see product information on the Sigma-Aldrich website at and/or on the reverse side of the invoice or packing slip.。
PBS命令和使用
PBS命令和使⽤PBS是公开源代码的作业管理系统，在此环境下运⾏，⽤户不需要指定程序在哪些节点上运⾏，程序所需的硬件资源由PBS管理和分配。
PBS(Portable Batch System)是由NASA开发的灵活的批处理系统。
它被⽤于集群系统、超级计算机和⼤规模并⾏系统。
PBS主要有如下特征：易⽤性：为所有的资源提供统⼀的接⼝，易于配置以满⾜不同系统的需求，灵活的作业调度器允许不同系统采⽤⾃⼰的调度策略。
移植性：符合POSIX 1003.2标准，可以⽤于shell和批处理等各种环境。
适配性：可以适配与各种管理策略，并提供可扩展的认证和安全模型。
⽀持⼴域⽹上的负载的动态分发和建⽴在多个物理位置不同的实体上的虚拟组织。
灵活性：⽀持交互和批处理作业。
OpenPBS( )是PBS的Open Source的实现。
商业版本的PBS可以参照：。
1、PBS命令PBS提供4条命令⽤于作业管理。
(1)qsub 命令—⽤于提交作业脚本命令格式：qsub [-a date_time] [-c interval] [-C directive_prefix] [-e path] [-I] [-j join] [-k keep] [-l resource_list] [-m mail_options] [-M user_list][-N name] [-o path] [-p priority] [-q destination] [-r c] [-S path_list] [-u user_list][-v variable_list] [-V] [-W additional_attributes] [-z][script]参数说明：因为所采⽤的选项⼀般放在pbs脚本中提交，所以具体见PBS脚本选项。
例：# qsub aaa.pbs 提交某作业，系统将产⽣⼀个作业号(2)qstat 命令—⽤于查询作业状态信息命令格式：qatat [-f][-a][-i] [-n][-s] [-R] [-Q][-q][-B][-u]参数说明：-f jobid 列出指定作业的信息-a 列出系统所有作业-i 列出不在运⾏的作业-n 列出分配给此作业的结点-s 列出队列管理员与scheduler所提供的建议-R 列出磁盘预留信息-Q 操作符是destination id，指明请求的是队列状态-q 列出队列状态，并以alternative形式显⽰-au userid 列出指定⽤户的所有作业-B 列出PBS Server信息-r 列出所有正在运⾏的作业-Qf queue 列出指定队列的信息-u 若操作符为作业号，则列出其状态。
计算杀灭对数值的时候
计算杀灭对数值的时候，取小数点后两位值，可以进行数字修约。
如果消毒试验组消毒处理后平均生产菌落数小于等于1时，其杀灭对数值，即大于等于试验前对照组平均活菌浓度的对数值。
（6）有机干扰物质：按30g牛血清白蛋白中加入1000ml蒸馏水的比例配制约100ml，溶解后用0.45um的无菌滤膜进行过滤除菌后使用，未用完的可于2-8℃冰箱中保存。
（1）菌试验组：取无菌大试管加入0.5ml菌悬液，再加入0.5ml的有机干扰物质，分别用无菌吸管吸取0.2%的新洁尔灭消毒液4.0ml，加入试管中，迅速混匀并立即计时。
待试验菌与0.2%的新洁尔灭消毒液相互作用2.5min时，吸取0.5ml试验菌与消毒剂的混合液，加于4.5ml经灭菌的0.1M硫代硫酸钠-生理盐水溶液中，混匀。
试验菌与消毒剂混合液经硫代硫酸钠-生理盐水溶液作用10min后，吸取1.0ml样液，按活菌培养计数测定方法测定存活菌数，每管样液接种2个平皿即可。
如果菌液浓度较高时，可进行10倍系列稀释后，在进行活菌培养计数，作为试验组，其计数结果为CX。
（2）阳性对照组：用4.0ml磷酸盐缓冲液代替4.0ml0.2%的新洁尔灭消毒液与0.5ml菌悬液、0.5ml有机干扰物质混合2.5min后，取0.5ml混合液与4.5ml 0.1M硫代硫酸钠-生理盐水溶液反应，作用10min后。
计数方法同试验组，计数结果为C0。
（3）阴性对照组：吸取此次试验用的纯化水0.5ml、0.5ml有机干扰物质、4.0ml磷酸盐缓冲液混匀，混匀后取0.5ml混合液与4.5ml0.1M硫代硫酸钠-生理盐水溶液作用10min后，吸取1.0ml混合液，按活菌培养计数测定方法测定存活菌数，作为阴性对照。
（4）培养：所有用细菌试验的样品均放入30-35℃培养箱中培养，培养48小时观察结果；用真菌试验的样品放入23-28℃培养箱中培养，培养72小时观察结果。
4、讨论4.1 由结果可以看出通过中和剂中和效果试验可以确定，每升PBS缓冲液中加入10g 组氨酸、50ml吐温-80、5g卵磷脂可以中和新洁尔灭消毒液的消毒效果，因此，在日常消毒中应该避免以上物质的混入。
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北京雷根生物技术有限公司
蔗糖-PBS 溶液(5%)
简介：
PBS 是磷酸缓冲盐溶液(Phosphate-Buffered Saline)的简称，是最常用的磷酸盐缓冲溶液之一，不含钙镁的PBS 又称Dulbecco's 磷酸缓冲盐溶液、Dulbecco 's PBS 、D-PBSA 、CMF-DPBS 、D-PBS 、DPBS,蔗糖-PBS 溶液(5%)主要由5%蔗糖和PBS 组成，新鲜组织取材后，用该溶液沉淀以去除多余水分，以避免冷冻后产生冰晶。
组成：
操作步骤(仅供参考)：
1、 新鲜组织取材，用充分PBS 清洗数次。
2、 置于蔗糖-PBS 溶液(5%)中，并置于4℃过夜。
3、 更换于恰当的固定液中固定或进行其他操作。
注意事项：
1、 蔗糖溶液容易污染，应注意无菌操作，避免被微生物污染。
2、 为了您的安全和健康，请穿实验服并戴一次性手套操作。
编号 名称 DD0050 Storage 蔗糖-PBS 溶液(5%) 500ml 4℃ 使用说明书 1份。