100个工厂常用英文缩写

合集下载

企业常用缩写-中英文对照

企業常用縮寫5S : 5S管理ABC : 作业制成本制度(Activity-Based Costing)ABB : 实施作业制预算制度(Activity-Based Budgeting)ABM : 作业制成本管理(Activity-Base Management)APS : 先进规画与排程系统(Advanced Planning and Scheduling) ASP : 应用程序服务供货商（Application Service Provider）ATP : 可承诺量(Available To Promise)AVL : 认可的供货商清单(Approved Vendor List)BOM : 物料清单(Bill Of Material)BPR : 企业流程再造(Business Process Reengineering)BSC : 平衡记分卡(Balanced ScoreCard)BTF : 计划生产(Build To Forecast)BTO : 订单生产(Build To Order)CPM : 要径法(Critical Path Method)CPM : 每一百万个使用者会有几次抱怨(Complaint per Million) CRM : 客户关系管理(Customer Relationship Management) CRP : 产能需求规划(Capacity Requirements Planning)CTO : 客制化生产(Configuration To Order)DBR : 限制驱导式排程法(Drum-Buffer-Rope)DMT : 成熟度验证(Design Maturing Testing)DVT : 设计验证(Design Verification Testing)DRP : 运销资源计划(Distribution Resource Planning)DSS : 决策支持系统(Decision Support System)EC : 设计变更／工程变更(Engineer Change)EC : 电子商务(Electronic Commerce)ECRN : 原件规格更改通知(Engineer Change Request Notice)EDI : 电子数据交换(Electronic Data Interchange)EIS : 主管决策系统(Executive Information System)EMC : 电磁相容(Electric Magnetic Capability)EOQ : 基本经济订购量(Economic Order Quantity)ERP: 企业资源规划(Enterprise Resource Planning)FAE: 应用工程师(Field Application Engineer)FCST : 预估(Forecast)FMS : 弹性制造系统(Flexible Manufacture System)FQC : 成品质量管理(Finish or Final Quality Control)IPQC : 制程质量管理(In-Process Quality Control)IQC : 进料质量管理(Incoming Quality Control)ISO : 国际标准化组织(International Organization forStandardization)ISAR : 首批样品认可(Initial Sample Approval Request)JIT : 实时管理(Just In Time)KM ：知识管理(Knowledge Management)L4L : 逐批订购法(Lot-for-Lot)LTC : 最小总成本法(Least Total Cost)LUC : 最小单位成本(Least Unit Cost)MES : 制造执行系统(Manufacturing Execution System)MO : 制令(Manufacture Order)MPS : 主生产排程(Master Production Schedule)MRO : 请修(购)单(Maintenance Repair Operation)MRP : 物料需求规划(Material Requirement Planning)MRPII : 制造资源计划(Manufacturing Resource Planning)NFCF : 更改预估量的通知Notice for Changing ForecastOEM : 委托代工(Original Equipment Manufacture)ODM : 委托设计与制造(Original Design & Manufacture)OLAP : 在线分析处理(On-Line Analytical Processing)OLTP : 在线事务处理(On-Line Transaction Processing)OPT : 最佳生产技术(Optimized Production T echnology)OQC : 出货质量管理(Out-going Quality Control)PDCA : PDCA管理循环(Plan-Do-Check-Action)PDM : 产品数据管理系统(Product Data Management)PERT : 计划评核术(Program Evaluation and Review Technique) PO : 订单(Purchase Order)POH : 预估在手量(Product on Hand)PR : 采购申请Purchase RequestQA : 质量保证(Quality Assurance)QC : 质量管理(Quality Control)QCC : 品管圈(Quality Control Circle)QE : 质量工程(Quality Engineering)RCCP : 粗略产能规划(Rough Cut Capacity Planning)RMA : 退货验收Returned Material ApprovalROP : 再订购点(Re-Order Point)SCM : 供应链管理(Supply Chain Management)SFC : 现场控制(Shop Floor Control)SIS : 策略信息系统(Strategic Information System)SO : 订单(Sales Order)SOR : 特殊订单需求(Special Order Request)SPC : 统计制程管制(Statistic Process Control)TOC : 限制理论(Theory of Constraints)TPM : 全面生产管理Total Production ManagementTQC : 全面质量管理(Total Quality Control)TQM : 全面质量管理(Total Quality Management)WIP : 在制品(Work In Process)5S管理5S是由日本企业研究出来的一种环境塑造方案，其目的在藉由整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及身美(SHITSUKE)五种行为来创造清洁、明朗、活泼化之环境，以提高效率、质量及顾客满意度。

工厂英文缩写大全

• QA: Quality Assurance 品质保证品质保证QC: Quality Control 品质控制品质控制QE: Quality Engineering 品质工程品质工程QFD: Quality Function Design 品质机能展开品质机能展开 Quality 质量质量Quality manual 品质手册品质手册Quality policy 品质政策品质政策Range 全距全距Record 记录记录Reflow 回流回流Reject 拒收拒收Repair 返修返修Repeatability 再现性再现性Reproducibility 再生性再生性Requirement 要求要求 Residual 误差误差Response 响应响应Responsibilities 职责职责Review 评审评审Rework 返工返工Rolled yield 直通率直通率sample 抽样,样本样本Scrap 报废报废SOP: Standard Operation Procedure 标准作业书标准作业书SPC: Statistical Process Control 统计制程管制统计制程管制Specification 规格规格 SQA: Source(Supplier) Quality Assurance 供应商品质保证供应商品质保证 Taguchi-method 田口方法田口方法TQC: Total Quality Control 全面品质控制全面品质控制TQM: Total Quality Management 全面品质管理全面品质管理Traceability 追溯追溯 UCL: Upper Control Limit 管制上限管制上限USL: Upper Size Limit 规格上限规格上限V alidation 确认确认V ariable 计量值计量值V erification 验证验证V ersion 版本版本QCC Quality Control Circle 品质圈/QC 小组小组PDCA Plan Do Check Action 计划计划执行执行检查检查总结总结Consumer electronics 消费性电子产品消费性电子产品Communication 通讯类产品通讯类产品Core value （核心价值）（核心价值） Love 爱心爱心Confidence 信心信心Decision 决心决心 Corporate culture (公司文化)Integration 融合融合Responsibility 责任责任Progress 进步进步QC quality control 品质管理人员品质管理人员FQC final quality control 终点品质管制人员终点品质管制人员IPQC in process quality control 制程中的品质管制人员制程中的品质管制人员OQC output quality control 最终出货品质管制人员最终出货品质管制人员IQC incoming quality control 进料品质管制人员进料品质管制人员TQC total quality control 全面质量管理全面质量管理POC passage quality control 段检人员段检人员 QA quality assurance 质量保证人员质量保证人员OQA output quality assurance 出货质量保证人员出货质量保证人员QE quality engineering 品质工程人员品质工程人员FAI first article inspection 新品首件检查新品首件检查FAA FAA first article assurance first article assurance 首件确认首件确认CP capability index 能力指数能力指数SSQA standardized supplier quality audit 合格供应商品质评估合格供应商品质评估 FMEA failure model effectiveness analysis 失效模式分析失效模式分析AQL Acceptable Quality Level 运作类允收品质水准运作类允收品质水准S/S Sample size 抽样检验样本大小抽样检验样本大小ACC Accept 允收允收REE Reject 拒收拒收CR Critical 极严重的极严重的MAJ Major 主要的主要的MIN Minor 轻微的轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务服务 P/N Part Number 料号料号L/N Lot Number 批号批号AOD Accept On Deviation 特采特采UAI Use As It 特采特采FPIR First Piece Inspection Report 首件检查报告首件检查报告PPM Percent Per Million 百万分之一百万分之一SPC Statistical Process Control 统计制程管制统计制程管制SQC Statistical Quality Control 统计品质管制统计品质管制GRR Gauge Reproducibility & Repeatability 量具之再制性及重测性判断量可靠与否量具之再制性及重测性判断量可靠与否 DIM Dimension 尺寸尺寸DIA Diameter 直径直径 QIT Quality Improvement Team 品质改善小组品质改善小组ZD Zero Defect 零缺点零缺点QI Quality Improvement 品质改善品质改善QP Quality Policy 目标方针目标方针TQM Total Quality Management 全面品质管理全面品质管理RMA Return Material Audit 退料认可退料认可 7QCTools 7 Quality Control Tools 品管七大手法品管七大手法通用之件类通用之件类ECN Engineering Change Notice 工程变更通知(供应商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知工序改动通知PMP Product Management Plan 生产管制计划生产管制计划SIP Standard Inspection Procedure 制程检验标准程序制程检验标准程序SOP Standard Operation Procedure 制造作业规范制造作业规范IS Inspection Specification 成品检验规范成品检验规范BOM Bill Of Material 物料清单物料清单PS Package Specification 包装规范包装规范 SPEC Specification 规格规格DWG Drawing 图面图面系统文件类系统文件类ES Engineering Standard 工程标准工程标准IWS International Workman Standard 工艺标准工艺标准ISO International Standardization Organization 国际标准化组织国际标准化组织 GS General Specification 一般规格一般规格部类部类PMC Production & Material Control 生产和物料控制生产和物料控制PCC Product control center 生产管制中心生产管制中心PPC Production Plan Control 生产计划控制生产计划控制MC Material Control 物料控制物料控制DCC Document Control Center 资料控制中心资料控制中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证处品质保证处QC Quality Control 品质管制(课) PD Product Department 生产部生产部LAB Laboratory 实验室实验室IE Industrial Engineering 工业工程工业工程R&D Research & Design 设计开发部设计开发部• QC: Quality Control 品質管控品質管控• QA: Quality Assurancel 品質保證品質保證• IQC: Incoming Quality Control 進料品質管制進料品質管制• IPQC: In-Process Qualityl Control 制程品質管制制程品質管制• FQC: Final Quality Control 最終品質管制最終品質管制• OQC: Outgoing Qualityl Control 出貨品質管制出貨品質管制• QCC: Quality Control Circle 品管圈l• QE: Qualityl Engineering 品質工程品質工程• PDCA 管理循環(Plan-Do-Check-Action)l• SPC : Statisticl Process Control 統計制程管制統計制程管制• TQM: Total Quality management 全面品質管制l• WIP: Workl In Process 在制品在制品• MO: Manufacture Order 制令制令• JIT: Just In Time 即時管理即時管理• ISO: International Organization For Standardization 國際標準化組織l• BOM: Bill Of Material 物料清單物料清單• 5S : 整理,整頓,清掃,清潔,素養l• FIFO: FIRST IN FIRST OUT先進先出管理先進先出管理。

工厂企业常用英文缩写

Manag ement Repres entativ e(MR) Materi al Review Board( MRB) Nonconfor ming Report Open Box Audit( OBA) Origin al Equip ment Manuf acture( OEM) Operat ion Manag er(OP) One Piece Flow(O PF) Ongoin g Reliabi lity Test(O RT)
Work
WIP
In Process
(WIP)
Waive Waive
ZD
Zero Defect
Process
/
PE
Produc tion
Engine
ering
业务訂單業務部表面貼片技術作業指導書統計制程管制供應書
SIP Standard Inspection Procedure Sorting Sorting VQM Vendor Quality Management(VQM)
W/O Working Order(W/O)
W/H Warehouse(W/H)
WI Working Instruction(WI)
工業工程
制程品質控制
IQC ISO
ITS QE LRR MBO MC ME
Incomi ng Quality Contro l(IQC) Interna tional Standa rd Organi zation Inform ation Techno logy Service (ITS) Quality Engine er Lot Reject Rate(L RR) Manag ement By Objecti ve Materi al Contro l(MC) Machin e Engine ering

100个工厂常用英文缩写

设计验证
19 ECN Engineering Change Notice 工程变更通知
20 ECO Engineering Change Order
工程变更指令
21 ECR Engineering Change Request 工程变更需求
22
EE Electronic Engineering
电子工程
欧规手持装置数字地面广播标准
16
DVB-S
Digital Video BroadcastingSatellite
17
DVB-T
Digital Video BroadcastingTerrestrial
欧规数字电视卫星广播标准欧规数字电视地面广播标准
18 DVT Design Verification Testing
面向产品生命周期各/某环节的设计。 DFP：Design for Procurement 可采购设计 DFM：Design for Manufacture 可生产设计 DFT：Design for Test 可测试设计 DFD：Design for Diagnosibility 可诊断分析设计 DFA：Design for Assembly 可组装设计 DFE：Design for Environment 可环保设计 DFF：Design for Fabrication of the PCB 为PCB可制造而设计 DFS：Design for Serviceability 可服务设计 DFR：Design for Reliability 为可靠性而设计 DFC：Design for Cost 为成本而设计
关键绩效指标
45
KR Korea
韩国
46 MAJ Major

工厂英文缩写大全

•QA: Quality Assurance 品质保证•QC: Quality Control 品质控制•QE: Quality Engineering 品质工程•QFD: Quality Function Design 品质机能展开•Quality 质量•Quality manual 品质手册•Quality policy 品质政策•Range 全距•Record 记录•Reflow 回流•Reject 拒收•Repair 返修•Repeatability 再现性•Reproducibility 再生性•Requirement 要求•Residual 误差•Response 响应•Responsibilities 职责•Review 评审•Rework 返工•Rolled yield 直通率•sample 抽样,样本•Scrap 报废•SOP: Standard Operation Procedure 标准作业书•SPC: Statistical Process Control 统计制程管制•Specification 规格•SQA: Source(Supplier) Quality Assurance 供应商品质保证•Taguchi-method 田口方法•TQC: Total Quality Control 全面品质控制•TQM: Total Quality Management 全面品质管理•Traceability 追溯•UCL: Upper Control Limit 管制上限•USL: Upper Size Limit 规格上限•Validation 确认•Variable 计量值•Verification 验证•Version 版本•QCC Quality Control Circle 品质圈/QC小组•PDCA Plan Do Check Action 计划执行检查总结•Consumer electronics 消费性电子产品•Communication 通讯类产品•Core value （核心价值）•Love 爱心•Confidence 信心•Decision 决心•Corporate culture (公司文化)•Integration 融合•Responsibility 责任•Progress 进步•QC quality control 品质管理人员•FQC final quality control 终点品质管制人员•IPQC in process quality control 制程中的品质管制人员•OQC output quality control 最终出货品质管制人员•IQC incoming quality control 进料品质管制人员•TQC total quality control 全面质量管理•POC passage quality control 段检人员•QA quality assurance 质量保证人员•OQA output quality assurance 出货质量保证人员•QE quality engineering 品质工程人员•FAI first article inspection 新品首件检查•FAA first article assurance 首件确认•CP capability index 能力指数•SSQA standardized supplier quality audit 合格供应商品质评估•FMEA failure model effectiveness analysis 失效模式分析•AQL Acceptable Quality Level 运作类允收品质水准•S/S Sample size 抽样检验样本大小•ACC Accept 允收•REE Reject 拒收•CR Critical 极严重的•MAJ Major 主要的•MIN Minor 轻微的•Q/R/S Quality/Reliability/Service 品质/可靠度/服务•P/N Part Number 料号•L/N Lot Number 批号•AOD Accept On Deviation 特采•UAI Use As It 特采•FPIR First Piece Inspection Report 首件检查报告•PPM Percent Per Million 百万分之一•SPC Statistical Process Control 统计制程管制•SQC Statistical Quality Control 统计品质管制•GRR Gauge Reproducibility & Repeatability 量具之再制性及重测性判断量可靠与否•DIM Dimension 尺寸•DIA Diameter 直径•QIT Quality Improvement Team 品质改善小组•ZD Zero Defect 零缺点•QI Quality Improvement 品质改善•QP Quality Policy 目标方针•TQM Total Quality Management 全面品质管理•RMA Return Material Audit 退料认可•7QCTools 7 Quality Control Tools 品管七大手法•通用之件类•ECN Engineering Change Notice 工程变更通知(供应商)•ECO Engineering Change Order 工程改动要求(客户)•PCN Process Change Notice 工序改动通知•PMP Product Management Plan 生产管制计划•SIP Standard Inspection Procedure 制程检验标准程序•SOP Standard Operation Procedure 制造作业规范•IS Inspection Specification 成品检验规范•BOM Bill Of Material 物料清单•PS Package Specification 包装规范•SPEC Specification 规格•DWG Drawing 图面•系统文件类•ES Engineering Standard 工程标准•IWS International Workman Standard 工艺标准•ISO International Standardization Organization 国际标准化组织•GS General Specification 一般规格•部类•PMC Production & Material Control 生产和物料控制•PCC Product control center 生产管制中心•PPC Production Plan Control 生产计划控制•MC Material Control 物料控制•DCC Document Control Center 资料控制中心•QE Quality Engineering 品质工程(部)•QA Quality Assurance 品质保证处•QC Quality Control 品质管制(课)•PD Product Department 生产部•LAB Laboratory 实验室•IE Industrial Engineering 工业工程•R&D Research & Design 设计开发部•QC: Quality Control? 品质管控•?QA: Quality Assurancel 品质保证•?IQC: Incoming Quality Control 进料品质管制•?IPQC: In-Process Qualityl Control 制程品质管制•?FQC: Final Quality Control 最终品质管制•?OQC: Outgoing Qualityl Control 出货品质管制•?QCC: Quality Control Circle 品管圈l•?QE:? Qualityl Engineering? 品质工程•?PDCA管理循环(Plan-Do-Check-Action)l•?SPC : Statisticl Process Control 统计制程管制•?TQM: Total Quality management 全面品质管制l•?WIP: Workl In Process? 在制品•?MO: Manufacture Order 制令•?JIT: Just In Time 即时管理•?ISO: International Organization For Standardization 国际标准化组织l •?BOM: Bill Of Material 物料清单•?5S : 整理,整顿,清扫,清洁,素养l•?FIFO: FIRST IN FIRST OUT先进先出管理。

(工厂与企业)工厂英文经典知识缩写

英文经典知识缩写AF Acceleration factorALT Accelerated life testANOVA Analysis of VarianceAOQL Average Outgoing Quality LevelAPO Auto Power OffAPQP Advanced Product Quality Planning and Control Plan ARE Area OptionsASIC Application Specific Integrated CircuitASSP Application Specific Standard PartATE Automatic test equipmentATO Assembly To OrderAVL RFQ IMPUT CHECKLIST里面用到BAC BackupBCI Bulk current injectionBD Business DeveloperBFR Batch Failure Ratebo BochumBOM Bill of MaterialBU Business Unitc acceptance level (= number of failed components accepted) CBD Cost Break DownCDM Contract Design ManufacturerCDM Charge Device Model –discharge typeCDM Original Design done by Partner specifically tosupport NokiaCDN Coupling and Decoupling Network.CE Concurrent EngineeringCE Concurrent Engineering (used for product development)CE. E0...E5Concurrent Engineering (CE) Product Program MilestonesCEM Contract Electronic ManufacturerCER. FILTERS,MONOBL. DUPLEXERS Powder mixing, Block pressing, FiringCI Capacity ImplementationCIM Custom In MouldCLUSTER Group of companies, head by one Cluster leaderCM Cost ManagementCMO Customer & Market Operationsco CopenhagenCOC Certificate of complianceCOO Country of OriginCp, Cpk Process Capability indicesCpk Capability IndexCPL Cost Part listCQE Component Quality EngineerCQP Component Quality PlanningCQS Component Quality SpecialistCR Change RequestCRR Component review reportCRYSTALS Crystal wafer manufacturingCSA Current State AnalysisCSMC-TPAT Customs-Trade Partners Against TerrorismCTS Cost Target SettingD Draft, first version of the documentda DallasDC DirectDC Direct CurrentDCN Design change noticeDES Deselect allDFA Design For AssemblyDFBA Design for Board AssemblyDFDS Design for Demand SupplyDfE Design for EnvironmentDFFA Design for Final AssemblyDFM Design For Manufacturing (includes DFPT, DFBA, DFFA) DFMEA Design Failure Mode and Effects AnalysisDFPT Design for Production TestDGDI-EL. DUPLEXERS Resonator preparingDIR Design Improvement ReportsDocMan Type of Lotus Notes database (for documents)DOE Design Of ExperimentDOE Design Of ExperimentDPM Defects Per MillionDSB Demand Supply BalanceDSN Demand Supplier NetworkDUT Device Under TestDV Demand VolumeDVRE0...E5Concurrent Engineering (CE) MilestonesE0..E5Concurrent engineering (CE) milestonesECN Engineering Change NoticeEFR Early Failure RateELMECH Electro MechanicalEMC EMI EMS EN EoL EPA Electro Magnetic Compatibility Electro Magnetic Interference Environmental Management Sys-tem European NormEnd of LifeESD protected areaERPes ESD ESDS ESI ETA EUT EV EVM FFA FAC FAQ FAI FEM FFR FIL FIML FIT FMEAEspooElectrostatic dischargeElectrostatic discharge sensitive deviceEarly Supplier InvolvementEstimate to be arriveEquipment Under TestEnclosed volumeEnhancements Version ManagementFinal, document to be archivedFailure AnalysisFully anechoic chamberFrequently Asked QuestionsFirst article inspectionFinite Element ModellingField Failure RateFilter..Fabric Inmold Labeling,samewith CIM Custom In Mould Failures in TimeFailure Mode and Effect AnalysisFORFOT第一次试模FRG.A. Gauge R&R Failure RateGeneral AssemblyGauge Repeatability and ReproducibilityGCPMGD&T GRP GRR HBM HBM HCP HIGH hk HUB ICDR ICDR IDGeometrical Dimensioning & Tolerances ground reference planeGauge Repeatability and Reproducibility Human Body ModelHuman Body Model –discharge type horizontal coupling planeHighlight selectedHong KongWarehousing and Shipping functionality location Integrated Circuit Design ReviewsIC Design ReviewIndustrial DesignIFR Intrinsic Failure RateIMD Insert Mold DecorationIME Inject Mold EquipmentIML Insert Mold LabelingIML IN MOLD LABELINGIPQC In Process Quality ControlIPR Intellectual Property RightsISO International Standardization Organization jk Jyv?skyl?JR&D Joint Research and developmentKCR Key Component ReviewKO Kick OffLA License Agreementla Los AngelesLAB LabelLCL Lower Control LimitLL Lesson LearnedLRVP Long Range Volume PlanLSL Lower Specification LimitLSSE Light SW Subcontractor EvaluationM&O Mechanics & OutsourcingM/C machineM3Global quality databaseMAR Mechanics Acceptance ReportMAR’ s Mechanical Acceptance Report ’ s MatCoMaMC Measuring CentreMD Mechanics DesginMDF Material Data FormMDFs material data formsME Manufacturing EngineerMECH MechanicsMFI Melt flow indexMISMM Machine Model – discharge typeMOR Monthly Operation ReviewMOSS Visual Quality Criteria’s procedure MPL Material Project LeaderMPL/M Material Project Leader / Manager MPL/MPM Material Project Leader/ ManagerMPM Material Project ManagerMR Measurements ReportMRPⅡMS Manufacturing SolutionsMS MilestoneMSA Measurement System AnalysisMSID Moisture-Sensitive IdentificationMSM Mechnical Supplier ManagementMSM Mechanics Sourcing ManagerMTO Make TO OrderMTS Mechanical Technology SourcingCeramic powder manuf, Sheet forming, Cutting, Printing, FiringNC non connectNCTNDA Non Disclosure AgreementNET Nokia NetworksNET NetworksNGP Nokia Global ProcessesNGS Nokia Global StandardsNGSW Nokia Global Supplier WebNMP Nokia Mobile Phones LtdNOSS Nokia Supplier Status databaseNPI Nokia Product IntegrationNPI New Product IntroductionNPSQS Nokia Part Specific Quality StandardsNRT Nokia Rapid ToolingNSL Nokia Substance ListNSM Nokia Supplier ManualNSR Nokia Supplier RequirementNTP Normal temperature and pressure, see laboratory environmentOAP Original Accessory PartnerOCAP Out-of-Control Action PlanOCV Open Circuit VoltageODM Original Design ManufacturerODM Original Design done by Partner independentlyOEM Original Equipment ManufactureOEM Original Design done by NokiaOPL Operations Project LeaderOQC Outgoing Quality ControlORS Operating Resource SourcingOT Over timeOTD On time deliveryou OuluPA Process AssessmentPA Product AgreementPC Product CreationPC Polycarbonate PCBAPCN PCNs PCQE PCQM PD PDM PDM PDM PDT PEProcess Change Noticeproduct change notification casesProgram Component Quality Engineer Program Component Quality Manager Product DeliveryProduct Development ManagerProduct Data ManagementProduct Data Management SystemProject Development TeamProduct Engineering (used for product in massproduction)PFMEA PGP PIProcess Failure Mode and Effect Analysis Pretty Good PrivacyProduct ImplementationPIRPLM PLP PLRM PM PM PM PM/MP PMAProduct Line ManagementProduct Lifetime ProfitabilityProgram Loading Road mapProduct ManagerPurchasing ManagerProject ManagerPartner Manufacturing/Manufacturing Partner Project Manager AssistantPMCPMMPMTPOPOKA-YOKE POPPop-Port POWER AMPS Pp, PpkPPAPPAPPPMppmPQPQGFPPQMPQPPQPProgram Portfolio ManagementProject Management TeamPurchasing OrderMistake ProofingPackage Operation ProcedureSystem connector in NOKIA mobile devices MMIC and/or IC manufacturingProcess Performance IndicesProduct Purchase AgreementProduction Part Approval ProcessProduct Program ManagerParts per millionProcess QualificationPackage qualification guideline for programs Program Quality ManagerProgram Quality PlanPackage Qualification ProcedurePR1/2PTO Package TO OrderPV Product ValidationPVD Physical Vapor DepositionPWB Printed Wire BoardQA quality assurenQBR Quarterly Business ReviewQC quality controlQE Quality EngineerQFD Quality Function DeploymentQM quality managementQSR Quality System RequirementQTE Quality Technician EngineerQTE Quality and Technology EngineerQTE / QTM Quality Technology Engineer / ManagerQTE / QTM Quality Technology Engineer / ManagerQTM Quality and Technology ManagerQTY QuantityR&D Research and DevelopmentR&R Roles and ResponsibilitiesR&T Research and TechnologyRAM Random Access MemoryRamp Up/SAREC ReconsiderREL Related toRFP Request For ProposalRFQ Request For QuotationRIPS Recently Introduced Product SupportRMA Return Material AuthorizationSASAC semi anechoic chamberSAW /BAW FILTERS, SAW DUPLEXERS Die wafer manufacturing SCP Service Channel PreparationSEM Scanning Electron MicroscopeSG Save as groupSHO Showsi SingaporeSIDSIP Standard Inspection ProcedureSLI Supply Line Implementation processSLM Supply Line ManagementSLP Supply Line Preparation processSO Solution OfferingSOP Standard Operation ProcedureSOW statement of workSPC SPPM SPR SQA SQC SQE SQM ss STA SVP SW sy TCRM TEC toTPStatistical Process ControlSenior Product Program ManagerStandard Product Requirement (Nokia) Supplier Quality Assurancestatistical quality controlSupply Quality EngineerSupply Quality Managersample sizeShort Term AvailabilitySenior Vice PresidentSoftwareSydneyTechnology Competence Roadmap Technology PlatformTokyoTechnology PlatformTPETPR Technical Product Requirement TPUtreUU/IU/IUCLUGUIulvcVCO VCTCXO VIS VPQCT VQD VQE VQR WBSTampereUpdate, all updated documents that are not final Voltage / CurrentVoltage / CurrentUpper Control LimitUse groupUser InterfaceUlmVancouver ¨IC manufacturing (discrete transistors, other ICs)Crystal wafer and IC (LSI-VCTCXO) manufacturing VisibleVolume Production Quality Control TestVisual Quality EngineerVisual Quality EngineerVisual Quality RequirementsWork Breakdown Structure。

工厂英文缩写大全

•QA: Quality Assurance 品质保证QC: Quality Control 品质控制QE: Quality Engineering 品质工程QFD: Quality Function Design 品质机能展开Quality 质量Quality manual 品质手册Quality policy 品质政策Range 全距Record 记录Reflow 回流Reject 拒收Repair 返修Repeatability 再现性Reproducibility 再生性Requirement 要求Residual 误差Response 响应Responsibilities 职责Review 评审Rework 返工Rolled yield 直通率sample 抽样,样本Scrap 报废SOP: Standard Operation Procedure 标准作业书SPC: Statistical Process Control 统计制程管制Specification 规格SQA: Source(Supplier) Quality Assurance 供应商品质保证Taguchi-method 田口方法TQC: Total Quality Control 全面品质控制TQM: Total Quality Management 全面品质管理Traceability 追溯UCL: Upper Control Limit 管制上限USL: Upper Size Limit 规格上限V alidation 确认V ariable 计量值V erification 验证V ersion 版本QCC Quality Control Circle 品质圈/QC小组PDCA Plan Do Check Action 计划执行检查总结Consumer electronics 消费性电子产品Communication 通讯类产品Core value （核心价值）Love 爱心Confidence 信心Decision 决心Corporate culture (公司文化)Integration 融合Responsibility 责任Progress 进步QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproducibility & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standardization Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DCC Document Control Center 资料控制中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证处QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部•QC: Quality Control 品質管控• QA: Quality Assurancel 品質保證• IQC: Incoming Quality Control 進料品質管制• IPQC: In-Process Qualityl Control 制程品質管制• FQC: Final Quality Control 最終品質管制• OQC: Outgoing Qualityl Control 出貨品質管制• QCC: Quality Control Circle 品管圈l• QE: Qualityl Engineering 品質工程• PDCA管理循環(Plan-Do-Check-Action)l• SPC : Statisticl Process Control 統計制程管制• TQM: Total Quality management 全面品質管制l• WIP: Workl In Process 在制品• MO: Manufacture Order 制令• JIT: Just In Time 即時管理• ISO: International Organization For Standardization 國際標準化組織l • BOM: Bill Of Material 物料清單• 5S : 整理,整頓,清掃,清潔,素養l• FIFO: FIRST IN FIRST OUT先進先出管理。

最全版工厂常用英文缩写简称大全

Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義體系術語CSR Corparation Social Responsibility企業社會責任體系術語EICC Electronic Industry Code of Conduct電子行業行為守則體系術語FCC Federal Communications Commission美国联邦通信委员会體系術語GP Green Parts綠色產品/環保體系術語IP intellectual property知識產權(保護)體系術語ISO International Standards Organization國際標準化組織體系術語QPA Quality Process Audit品質製程稽核體系術語QSA Quality System Audit品質體系稽核體系術語SER Social & Environmental Responsibility社会与环境责任質量類APQP Advanced Product Quality Planning先期產品質量規劃質量類AQL Acceptable Quality Level允收質量水準質量類Ca Capability of Accuracy製程準確度質量類CA Cause Analysis/Corrective Action原因分析/糾正措施質量類CAPA Corrective Action & Prevetive Action糾正預防措施質量類CAR Correction Action Report改善對策報告質量類CIP Continuous Improvement Program質量持續改善計劃質量類CLCA Closed Loop Corrective Action闭环纠正措施質量類Cp Capability of Precision製程精密度質量類CPK Process Capability index製程能力指數質量類CQ Corporation Quality公司質量質量類CTQ Critical To Quality關鍵質量特性質量類DMAIC Define=>Measure=> Analysis=>Improve=> Control Six Sigma的步驟﹕定義測量分析改善控制質量類DOE Design of Experiments實驗設計法質量類DPMO Defects Per Million Opportunities每百萬個機會的缺點數質量類DPPM Defect Parts Per Million 每百萬個單位數中的不合格單位數質量類DRI Derectly responsibility indictor直接負責人質量類FA Failure Analysis失效分析Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義質量類FAI First Article Inspection首件確認質量類FMEA Failure Mode Effect Analysis失效模式分析質量類FPY First Pass Yield直通率質量類FRR Field Return Rate市場退貨率質量類JQE Joint Quality Engineer 客户端品质工程师(SQE的眼睛和耳朵)質量類KCC Key Control Characteristics 关键控制特性=過程特殊特性質量類KPC key product characteristic 關鍵產品特性=產品特殊特性質量類LAR Lot Acceptance Rate合格率質量類LRR Lot Reject Rate批退率質量類MBO Management By Objection目標管理質量類MCD Material Composition Declaration物質成分宣告質量類MRB Material Review Board材料評審委員會質量類MSA Measurement System Analysis測量系統分析質量類NG Not Good不良質量類OBA Out of Box Audit開箱檢驗質量類ORT Ongoing Realiability Test 產品連續性測試/產品可靠性測試質量類PDCA Plan-Do-Check-Action管理循環/質量環質量類PPAP Production Parts Approval Process生產零件認可程序質量類PR/R Problem reporting and solving問題通報與解決質量類PSC Product Special CharacteristicsProcess Special Characteristics 产品特殊特性過程特殊特性質量類QBR Quarter Bussiness Review季度業務評審質量類QCC Quality Control Circle品管圈質量類QIS Quality Information System質量信息系統質量類QIT Quality Improvement Team質量改善小組質量類QQR Quarter Quality Review季度質量評審Category類別Abbreviation簡稱Full Name 全稱Paraphrase釋義質量類RMA Return Material Authoriztion 物料退貨授權質量類RPNRisk Priority Number風險係數》126質量類SMART Goal Specific MeasurableAttainableRelevant Time-based 明確的,具體的可衡量的可達到的相關性的時效性的質量類SOD Severity Occurrence Detectivity 嚴重度S>8，頻度（發生率）O ，探測度D 質量類SPC Statistical Process Control 统计过程控制質量類VLRR Verified Line Reject Rate 產線不合格品判退率質量類SIP Standard Inspection Procedure 標準檢驗程序質量類MSOP Measurement Standard Operation Procedure測量標準作業程序精益生產BPR Business Process Re-Engineering 企業流程再造精益生產BR Business Re-Engineering企業再造精益生產ECRS Eliminate-Combine-Rearrange-Simplify 取消-合併-重排-簡化精益生產GRR Gage Repeatability & Reproducibility 量具的重複性和再現性精益生產JIT Just In Time 即時管理精益生產LB Line Balance 生產線平衡精益生產LP Lean Production 精益生產精益生產MIR Method Improve Report 提案改善精益生產OEE Overall Equipment Effectiveness 設備綜合效率=時間開動率*性能開動率*良品率精益生產PPH piece person hour人均時產能精益生產SIPOC Supplier-Input-Process-Output-Customer 供應商-投入-流程-產出-顧客精益生產SMED Single Minute Exchange of Die 快速換模/單分鐘換模精益生產TPM Total Productive Maitenance 全面生產性維護精益生產VSMValue Stream Mapping價值流程圖Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義管理系統BPM Bussiness Process Management商業流程管理管理系統CRM Customer Relationship Management客戶關係管理管理系統EIS Executive Information System高階主管資訊系統管理系統ERP Enterprise Resource Planning企業資源規劃管理系統GLM Global Logistics Management全球運籌管理管理系統GPS Global Positioning System全球定位系统管理系統GSM Global System for Mobile communications全球移动通信系统管理系統MES Manufacturing Execution System製造執行系統管理系統MIS Management Information System信息管理系統管理系統PLM Production Life-cycle Management產品生命週期管理管理系統SPM Services-Oriented Process Management服務導向流程管理部門名稱AE Acoustic Engineering聲學工程部門名稱ME Machanical Engineering結構工程部門名稱EE Electronic Engineering電子工程部門名稱AM Account Manager客戶經理/業務部門名稱ASD Assembly Department組裝部門名稱Bds Boards董事會部門名稱Dept Dep ar t ment部門部門名稱DIP Dual In-line Pakage雙列直插式封裝部門名稱DQE Design Quality Engineer設計質量工程部門名稱FATP Final assembly test and pack最後組裝,測試和包裝部門名稱FQC Final Quality Control終點品質管制部門名稱HR Human Resources人力資源部門名稱IE Industrial Engineering工業工程部門名稱IQC Incoming Quality Control進料質量控制部門名稱MFG M anu f acturin g製造部門名稱OPM Operation Project Management運營項目管理Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義部門名稱OQC Outgoing Quality Control出貨質量控制部門名稱PM Project Management項目管理部門名稱PMC Product Material Control生產物料控制部門名稱PQC Process Quality Control製程質量控制部門名稱QPM Quality Project Management質量專案管理部門名稱QRA Quality & Reliability Assurance質量可靠性保證部門名稱RD Research and Development研發部門名稱SCM Supplier Chain Management供應鏈管理部門名稱SMT Surface Mount Technology表面貼裝技術部門名稱SQM Supplier Quality Management供應商質量管理規格類CMF Color Material Finishing顏色/材質/工藝規格類EMC Electro Magnetic Compatibility電磁相容規格類EMC Electro Magnetic Compatibility电磁兼容規格類EMI Electro Magnetic Interference电磁干扰規格類EMS Electro Magnetic Susceptibility电磁敏感度 (电磁抗干扰)規格類ESD Electrostatic Discharge靜電放電規格類HDD Hard Disk Drive硬盘驱动器產品類型BCP Bluetooth Charger Product藍牙充電器產品產品類型BD Bluetooth Device藍牙設備產品類型BHC Bluetooth Headset for Comm.藍牙無線產品產品類型DSH Dynamic Speaker for Headphone動圈式揚聲器產品類型DTR Dynamic Telephone Receiver動圈式收受話器產品類型ECM Electret Condenser Microphone駐極體電容式麥克風產品類型HDT HeaDseT頭戴耳機產品類型HPS High Performance Speaker高性能喇叭產品類型PBP Power Bank Product移動電源產品產品類型SBP Smart Battery Pack智能電池組Category類別Abbreviation簡稱Full Name 全稱Paraphrase釋義產品類型TWS True Wireless Stereo 無線立體聲藍牙耳機產品類型WCP Wireless Charger Product 無線充電器採購類AVL Approved Vendor List 合格供應商名錄採購類B/L Bill of lading提單採購類EOQ Economic Order Quantity 經濟採購量採購類ETAEstimated Time of Arrival 預計到達時間採購類ETC Estimate Time Completed 預估完成時間採購類FCST F ore C a ST 預估採購類MRP Material Requirement Planning 物料需求計劃採購類PO Purchasing Order 採購訂單財務類AP Accounts Payable 應付賬款財務類Inv Inv oice發票客戶名稱BOCBOSE Operation CenterBOSE 運營中心工藝類IML Insert Molding Label模內貼標表面：硬化透明薄膜中间：印刷图案层背面：注塑层工藝類LSR Lequid Silicon Rubber 液体硅橡胶工藝類MIM Metal Injection Molding金屬粉末注塑成型技術工藝類NCVM Non conductive vacuum metalization 不導電真空電鍍工藝類OSPOrganic Solderability Preservatives有机保焊膜，又称护铜剂OSP 的工艺流程Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義工廠類型JDM Joint Design Manufacture聯合設計製造工廠類型ODM Original Design Manufacturer原始设计制造商工廠類型OEM Original Equipment Manufacturer 原始设备制造商;定点生产，俗称代工（生产）人資類HC H ead c ount員工人數人資類Info Infor mation資料人資類TR Turnover Rate周轉率/離職率NPI BOM Bill Of Material物料清單NPI DFM Design For Manufacturing設計製造NPI DPR Design Producibility Review--SonyEricsson客戶新產品開發導入時:設計可生產性之檢討NPI DVT Design Verification Testing设计验证测试NPI EOL End Of Live產品壽命終止NPI EPR engineering pilot run工程試做NPI EVT Engineering Verification Test工程验证测试NPI MP MASS Product量產NPI NPD New product Development新產品設計NPI NPI New Product Introduction新產品導入NPI NRE Non-Recurring(Recur現在分詞復發/循環/再來) Engineering一次性工程/非重複性工程NPI PVT Pilot-run Verification Test小批量过程验证测试NPI RFI Request For Information信息要求NPI RFQ Request For Quotations詢價BOSE文件ASD Automotive Systems Division汽車系統部BOSE文件GSM Global Supply Management全球供應管理BOSE文件PSDS Part Submission Data Sheet零件提交数据表BOSE文件QOS Quality of ServiceQuality Overall Summary服务质量全面质量总结Category 類別Abbreviation簡稱Full Name全稱Paraphrase釋義BOSE文件SPAP Supplier Production Approval Process供應商產品批准程序BOSE文件SRC Supplier Report Card供應商評分卡BOSE文件SRD Supplier Readiness Dashboard供應商準備指示板BOSE文件STA Supplier Technology Assurance供應商技術保證通用類ASAP As soon as possible盡快通用類CVMI Consider Vendor Managed Inevntory廠商管理存貨考慮通用類DRI Derectly responsibility indictor直接負責人通用類PIC Person In Charge負責人通用類FYI For Your Information供參考通用類Intro Intro duction介紹通用類MR Manufacturing Resources制造資源通用類NA Not Applicable不適用通用類RF Referred value參考值通用類SOP Standard Operation Procedure標準作業程序通用類TBA To be assured待確定通用類TBD To be determined待確定通用類VMI Vendor Management Inventory供應商管理庫存通用類WIP Work in process在製品。

显示器工厂模式中常用英文缩写单词

工厂模式中常用英文缩写单词1. AB (Automatic Brightness) 自动亮度调整，显示器自动根据环境光线的明暗程度自动的调整显示器屏幕图像的亮度。

2. ABL Automatic Brightness Limited 自动亮度限制，设置该选项数值可调整显示器屏幕的最大亮度范围。

3. ADJUSTING 正在调中4. ANALOG 模拟信号输入5. AUTO CONTRAST 自动对比度调整6. AUTO TUNING自动调整7. B-Bias Blue Bias蓝枪偏置（截止电压）调整8. B-Gain Blue Gain蓝枪增益调整9. BCL (ABL Automatic Brightness Limited) 自动亮度限制范围调整10. BC (Bottom Corner) 屏幕图像下边角调整。

11. BI (SET BURN-IN OFF/ON或 BURN OPTION) 老化开关CONTRAST对比度12. BIAS 偏置电压调整13. BL(Bottom Left Landing) 底部左边角调整14. BL(BLACK LEVEL) 钳位电平调整15. BR(Bottom Right Landing或B-R Landing) 底部右边角调整16. BRIGHTNESS亮度17. BT BURNIN TIME 老化时间设定18. BURN 老化开关设定19. BU BurnIn Select 老化开关设置20. C1 9300色温21. C2 6550色温22. CC C－Correction C校正调整23. CLOCK 信号时钟频率选择24. CLOCKPHASE 信号时钟相位选择25. COOL 冷色调26. COLOR ADJUST颜色调整27. CUTOFF 截止电压调整28. DEFO (Deflect IC) 行振荡芯片型号选择29. DEFO（TDA4856，TDA4841）行振荡集成块IC选择30. DEGAUSS消磁31. DE Deflection IC (TDA4856 TDA4841) 行振荡IC选择，这主要是显示器生产厂家为降低生产和设计成本，在同一条生产线上生产不同型号的显示器时，基本电路都相同，但主要的IC不相同，通过选择相对应的IC型号来变化不同型号的显示器。

电子工厂常见英文缩写

电子工厂常见英文缩写ISO International Organization for Stan-dardization 国际标准化组织缩写OEM Original Equipment Manufacturer 原设备制造商缩写R&D research&design 研发ODM Original design manufacture 原始设计商缩写。

品质人员名称类QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproductiveness & Repeatability量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商) ECO Engineering Change Order 工程改动要求(客户) PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 作业系统TBA To Be Assured。

工厂英文经典知识缩写

英文经典知识缩写AF Acceleration factorALT Accelerated life testANOVA Analysis of VarianceAOQL Average Outgoing Quality LevelAPO Auto Power OffAPQP Advanced Product Quality Planning and Control PlanARE Area OptionsASIC Application Specific Integrated CircuitASSP Application Specific Standard PartATE Automatic test equipmentATO Assembly To OrderAVL RFQ IMPUT CHECKLIST里面用到BAC BackupBCI Bulk current injectionBD Business DeveloperBFR Batch Failure Ratebo BochumBOM Bill of MaterialBU Business Unitc acceptance level (= number of failed components accepted) CBD Cost Break DownCDM Contract Design ManufacturerCDM Charge Device Model –discharge typeCDM Original Design done by Partner specifically to support NokiaCDN Coupling and Decoupling Network.CE Concurrent EngineeringCE Concurrent Engineering (used for product development) CE. E0...E5 Concurrent Engineering (CE) Product Program MilestonesCEM Contract Electronic ManufacturerCER. FILTERS, MONOBL. DUPLEXERS Powder mixing, Block pressing, FiringCI Capacity ImplementationCIM Custom In MouldCLUSTER Group of companies, head by one Cluster leaderCM Cost ManagementCMO Customer & Market Operationsco CopenhagenCOC Certificate of complianceCOO Country of OriginCp, Cpk Process Capability indicesCpk Capability IndexCPL Cost Part listCQE Component Quality EngineerCQP Component Quality PlanningCQS Component Quality SpecialistCR Change RequestCRR Component review reportCRYSTALS Crystal wafer manufacturingCSA Current State AnalysisCSMC-TPAT Customs-Trade Partners Against TerrorismCTS Cost Target SettingD Draft, first version of the documentda DallasDC DirectDC Direct CurrentDCN Design change noticeDES Deselect allDFA Design For AssemblyDFBA Design for Board AssemblyDFDS Design for Demand SupplyDfE Design for EnvironmentDFFA Design for Final AssemblyDFM Design For Manufacturing (includes DFPT, DFBA, DFFA) DFMEA Design Failure Mode and Effects AnalysisDFPT Design for Production TestDGDI-EL. DUPLEXERS Resonator preparingDIR Design Improvement ReportsDocMan Type of Lotus Notes database (for documents) DOE Design Of ExperimentDOE Design Of ExperimentDPM Defects Per MillionDSB Demand Supply BalanceDSN Demand Supplier NetworkDUT Device Under TestDV Demand VolumeDVRE0...E5 Concurrent Engineering (CE) MilestonesE0..E5 Concurrent engineering (CE) milestonesECN Engineering Change NoticeEFR Early Failure RateELMECH Electro MechanicalEMC Electro Magnetic CompatibilityEMI Electro Magnetic InterferenceEMS Environmental Management Sys-temEN European NormEoL End of LifeEPA ESD protected areaERPes EspooESD Electrostatic dischargeESDS Electrostatic discharge sensitive deviceESI Early Supplier InvolvementETA Estimate to be arriveEUT Equipment Under TestEV Enclosed volumeEVM Enhancements Version ManagementF Final, document to be archivedFA Failure AnalysisFAC Fully anechoic chamberFAQ Frequently Asked QuestionsFAI First article inspectionFEM Finite Element ModellingFFR Field Failure RateFIL Filter..FIML Fabric Inmold Labeling, same with CIM Custom In Mould FIT Failures in TimeFMEA Failure Mode and Effect AnalysisFORFOT 第一次试模FR Failure RateG.A. General AssemblyGauge R&R Gauge Repeatability and ReproducibilityGCPMGD&T Geometrical Dimensioning & TolerancesGRP ground reference planeGRR Gauge Repeatability and ReproducibilityHBM Human Body ModelHBM Human Body Model –discharge typeHCP horizontal coupling planeHIGH Highlight selectedhk Hong KongHUB Warehousing and Shipping functionality locationICDR Integrated Circuit Design ReviewsICDR IC Design ReviewID Industrial DesignIFR Intrinsic Failure RateIMD Insert Mold DecorationIME Inject Mold EquipmentIML Insert Mold LabelingIML IN MOLD LABELINGIPQC In Process Quality ControlIPR Intellectual Property RightsISO International Standardization Organization jk JyväskyläJR&D Joint Research and developmentKCR Key Component ReviewKO Kick OffLA License Agreementla Los AngelesLAB LabelLCL Lower Control LimitLL Lesson LearnedLRVP Long Range Volume PlanLSL Lower Specification LimitLSSE Light SW Subcontractor EvaluationM&O Mechanics & OutsourcingM/C machineM3 Global quality databaseMAR Mechanics Acceptance ReportMAR’s Mechanical Acceptance Report’s MatCoMaMC Measuring CentreMD Mechanics DesginMDF Material Data FormMDFs material data formsME Manufacturing EngineerMECH MechanicsMFI Melt flow indexMISMM Machine Model –discharge typeMOR Monthly Operation ReviewMOSS Visual Quality Criteria’s procedureMPL Material Project LeaderMPL / M Material Project Leader / Manager MPL/MPM Material Project Leader/ ManagerMPM Material Project ManagerMR Measurements ReportMRPⅡMS Manufacturing SolutionsMS MilestoneMSA Measurement System AnalysisMSID Moisture-Sensitive IdentificationMSM Mechnical Supplier ManagementMSM Mechanics Sourcing ManagerMTO Make TO OrderMTS Mechanical Technology SourcingMULTIL.PRODUCTS Ceramic powder manuf, Sheet forming, Cutting, Printing, FiringNC non connectNCTNDA Non Disclosure AgreementNET Nokia NetworksNET NetworksNGP Nokia Global ProcessesNGS Nokia Global StandardsNGSW Nokia Global Supplier WebNMP Nokia Mobile Phones LtdNOSS Nokia Supplier Status databaseNPI Nokia Product IntegrationNPI New Product IntroductionNPSQS Nokia Part Specific Quality StandardsNRT Nokia Rapid ToolingNSL Nokia Substance ListNSM Nokia Supplier ManualNSR Nokia Supplier RequirementNTP Normal temperature and pressure, see laboratory environment OAP Original Accessory PartnerOCAP Out-of-Control Action PlanOCV Open Circuit VoltageODM Original Design ManufacturerODM Original Design done by Partner independentlyOEM Original Equipment ManufactureOEM Original Design done by NokiaOPL Operations Project LeaderOQC Outgoing Quality ControlORS Operating Resource SourcingOT Over timeOTD On time deliveryou OuluPA Process AssessmentPA Product AgreementPC Product CreationPC PolycarbonatePCBAPCN Process Change NoticePCNs product change notification casesPCQE Program Component Quality EngineerPCQM Program Component Quality ManagerPD Product DeliveryPDM Product Development ManagerPDM Product Data ManagementPDM Product Data Management SystemPDT Project Development TeamPE Product Engineering (used for product in mass production) PFMEA Process Failure Mode and Effect AnalysisPGP Pretty Good PrivacyPI Product ImplementationPIRPLM Product Line ManagementPLP Product Lifetime ProfitabilityPLRM Program Loading Road mapPM Product ManagerPM Purchasing ManagerPM Project ManagerPM/MP Partner Manufacturing/Manufacturing PartnerPMA Project Manager AssistantPMCPMM Program Portfolio ManagementPMT Project Management TeamPO Purchasing OrderPOKA-YOKE Mistake ProofingPOP Package Operation ProcedurePop-Port System connector in NOKIA mobile devicesPOWER AMPS MMIC and/or IC manufacturingPp, Ppk Process Performance IndicesPPA Product Purchase AgreementPPAP Production Part Approval ProcessPPM Product Program Managerppm Parts per millionPQ Process QualificationPQGFP Package qualification guideline for programsPQM Program Quality ManagerPQP Program Quality PlanPQP Package Qualification ProcedurePR1/2PTO Package TO OrderPV Product ValidationPVD Physical Vapor DepositionPWB Printed Wire BoardQA quality assurenQBR Quarterly Business ReviewQC quality controlQE Quality EngineerQFD Quality Function DeploymentQM quality managementQSR Quality System RequirementQTE Quality Technician EngineerQTE Quality and Technology EngineerQTE / QTM Quality Technology Engineer / ManagerQTE / QTM Quality Technology Engineer / ManagerQTM Quality and Technology ManagerQTY QuantityR&D Research and DevelopmentR&R Roles and ResponsibilitiesR&T Research and TechnologyRAM Random Access MemoryRamp Up/SAREC ReconsiderREL Related toRFP Request For ProposalRFQ Request For QuotationRIPS Recently Introduced Product SupportRMA Return Material AuthorizationSASAC semi anechoic chamberSAW /BAW FILTERS, SAW DUPLEXERS Die wafer manufacturing SCP Service Channel PreparationSEM Scanning Electron MicroscopeSG Save as groupSHO Showsi SingaporeSIDSIP Standard Inspection ProcedureSLI Supply Line Implementation processSLM Supply Line ManagementSLP Supply Line Preparation processSO Solution OfferingSOP Standard Operation ProcedureSOW statement of workSPC Statistical Process ControlSPPM Senior Product Program ManagerSPR Standard Product Requirement (Nokia)SQA Supplier Quality AssuranceSQC statistical quality controlSQE Supply Quality EngineerSQM Supply Quality Managerss sample sizeSTA Short Term AvailabilitySVP Senior Vice PresidentSW Softwaresy SydneyTCRM Technology Competence RoadmapTEC Technology Platformto TokyoTP Technology PlatformTPETPR Technical Product RequirementTPUtre TampereU Update, all updated documents that are not final U/I Voltage / CurrentU/I Voltage / CurrentUCL Upper Control LimitUG Use groupUI User Interfaceul Ulmvc Vancouver¨VCO IC manufacturing (discrete transistors, other ICs) VCTCXO Crystal wafer and IC (LSI-VCTCXO) manufacturing VIS VisibleVPQCT Volume Production Quality Control TestVQD Visual Quality EngineerVQE Visual Quality EngineerVQR Visual Quality RequirementsWBS Work Breakdown Structure。

企业常用英文缩写.

企业常用英文缩写5S : 整理(SEIRI、整顿(SEITON、清扫(SEISO、清洁(SEIKETSU及素养(SHITSUKEAVL : 认可的供应商清单(Approved Vendor ListBPR : 企业流程再造 (Business Process ReengineeringCPI: 持续的过程改善Continuous Process ImprovementCPM : 客户抱怨比,每一百万个使用者会有几次抱怨(Complaint per Million CRM : 客户关系管理 (Customer Relationship ManagementCRP : 产能需求计划 (Capacity Requirements PlanningDRP : 分销资源计划 (Distribution Resource PlanningDSS : 决策支持系统 (Decision Support SystemEC : 设计变更/工程变更 (Engineer ChangeEC : 电子商务 (Electronic CommerceEIS : 主管决策系统 (Executive Information SystemEOQ : 基本经济订购量 (Economic Order QuantityERP : 企业资源规划 (Enterprise Resource PlanningIE: 工业工程(Industrial EngineeringJIT : 实时管理(Just In TimeKM :知识管理(Knowledge ManagementKPI 关键业绩指标(Key Process IndicationMRP : 物料需求计划 (Material Requirement PlanningMRPII : 制造资源计划 (Manufacturing Resource PlanningPDCA: P( PLAN--计划;D(Do--执行;C(CHECK--检查;A(Action--行动PDM : 产品数据管理系统 (Product Data ManagementSCM : 供应链管理 (Supply Chain ManagementSFC : 现场控制 (Shop Floor ControlSIS : 策略信息系统 (Strategic Information SystemSPC : 统计过程控制 (Statistic Process ControlTPM全面设备维护保养(Total Productive MaintenanceTQC : 全面质量控制 (Total Quality ControlTQM : 全面质量管理 (Total Quality ManagementVE:价值工程(value engineeringVA:价值分析(Value Analysis部分说明:5S5S是由日本企业研究出来的一种环境塑造方案,其目的在通过整理(SEIRI、整顿(SEITON、清扫(SEISO、清洁(SEIKETSU及素养(SHITSUKE五种行为来创造清洁、明朗、活泼化的环境,以提高效率、品质及顾客满意度。

企业常用英文简写

企业常⽤英⽂简写Abbreviations and their explanations 缩写与其解释Engineering ⼯程 / Process ⼯序（制程）4M&1E Man, Machine, Method, Material, Environment⼈，机器，⽅法，物料，环境- 可能导致或造成问题的根本原因AI Automatic Insertion⾃动插机ASSY Assembly制品装配ATE Automatic Test Equipment⾃动测试设备BL Baseline参照点BM Benchmark参照点BOM Bill of Material⽣产产品所⽤的物料清单C&ED/CAED Cause and Effect Diagram原因和效果图CA Corrective Action解决问题所采取的措施CAD Computer-aided Design电脑辅助设计.⽤于制图和设计3维物体的软件CCB Change Control Board对⽂件的要求进⾏评审，批准，和更改的⼩组CI Continuous Improvement依照短期和长期改善的重要性来做持续改善COB Chip on Board邦定-线焊芯⽚到PCB板的装配⽅法.CT Cycle Time完成任务所须的时间DFM Design for Manufacturability产品的设计对装配的适合性DFMEA Design Failure Mode and Effect Analysis设计失效模式与后果分析--在设计阶段预测问题的发⽣的可能性并且对之采取措施DFSS Design for Six Sigma六西格玛(6-Sigma)设计 -- 设计阶段预测问题的发⽣的可能性并且对之采取措施并提⾼设计对装配的适合性DFT Design for Test产品的设计对测试的适合性DOE Design of Experiment实验设计-- ⽤于证明某种情况是真实的DPPM Defective Part Per Million根据⼀百万件所⽣产的产品来计算不良品的标准DV Design Verification / Design Validation设计确认ECN Engineering Change Notice客户要求的⼯程更改或内部所发出的⼯程更改⽂件ECO Engineering Change Order客户要求的⼯程更改ESD Electrostatic Discharge静电发放-由两种不导电的物品⼀起摩擦⽽产⽣的静电可以破坏ICs和电⼦设备FI Final Inspection 在⽣产线上或操作中由⽣产操作员对产品作最后检查F/T Functional Test测试产品的功能是否与所设计的⼀样FA First Article / Failure Analysis⾸件产品或⾸件样板/ 产品不良分析FCT Functional Test功能测试-检查产品的功能是否与所设计的⼀样FFF Fit Form Function符合产品的装配，形状和外观及功能要求FFT Final Functional Test包装之前，在⽣产线上最后的功能测试FMEA Failure Mode and Effect Analysis失效模式与后果分析-- 预测问题的发⽣可能性并且对之采取措施FPY First Pass Yield⾸次检查合格率FTY First Test Yield⾸次测试合格率FW Firmware韧体（软件硬化）-控制产品功能的软件HL Handload在波峰焊接之前，将PTH元件⽤⼿贴装到PCB上，和⼿插机相同I/O Input / Output输⼊ / 输出iBOM Indented Bill of Material内部发出的BOM（依照客户的BOM）ICT In-circuit Test线路测试-- ⽤电⽓和电⼦测试来检查PCBA短路，开路，少件，多件和错件等等不良IFF Information Feedback Form情报联络书-反馈信息所使⽤的⼀种表格IR Infra-red红外线KPIV Key Process Input Variable主要制程输⼊可变因素-在加⼯过程中，所有输⼊的参数/元素，将影响制成品的质量的可变因素KPOV Key Process Output Variable主要制程输出可变因素-在加⼯过程中，所有输出的结果，所呈现的产品品质特征。

电子厂常见的英文缩写大全

电子厂里常见的英文缩写-??浏览次数：1591次悬赏分：10|解决时间：2009-6-28 20:57 |提问者：Smile2008com比如ECN是指工程变更-AOI是光学检测-QE是品质工程....那FIFO是指什么呢???OEM....ODM--又是指什么呢..??这些都要谁来执行完成呢??这些是我们要学的?但是我要在学之前把它弄懂一些--万分谢谢--!!!!最佳答案ISO 国际标准化组织（ISO,International Organization for Stan-dardization缩写）。

OEM是英文Original Equipment Manufacturer的缩写，意思是原设备制造商R&D (research&design) 研发ODM，即Original design manufacture(原始设计商)的缩写。

IQC incoming quality controlRD research development centerIPQC in process quality controlRD HQ research development center head quarterFQC final quality controlQA quality assuranceBOM bill of materialPVT product verification testOQC outgoing quality controlPRP phase review processQE quality engineeringPM project managementDCC document center controlPJE project engineerECN engineering change noticePE product engineerECR engineering change requestNPI new product introductionMRB material review bomMP mass productionCAR corrective action requestMFG manufacturingFPC flexible printed circuit boardME mechanical engineerNCR non conforming reportKBD keyboardOBE out of box evaluationIFR instant failure rateIQA internal quality auditIFIR instant failure incident ratePCR process change requestHW hardwareIPO internal purchase officeN/A No ActionIE industrial engineeringESD electrostatic dischargeQPA quality process auditEOL end of lifeQSA quality system auditEN engineering noticeATE automatic test equipmentEMI electromagnetic interferenceAOI automatic optical inspectionEMC electromagnetic compatibilityPCBA print circuit board assemblyEE electronic engineer(ing)TTL technology transfer listEDC electronic data centerSQA supplier quality assuranceECO engineering change orderORT ongoing reliability testingDVT design verification testQM quality manualDOA dead on arrivalSW softwareCAD/ID computer aided design /industrial designSOW standard of workBIOS basic input /output systemSCSI small computer system interfaceAP application programSA software applicationAFR annual failure rateSO sales orderNTF no trouble foundMRP material requirement planningCND can not duplicateAVL approved vendor listDPPM defect parts per millionFAI first article inspectionFMEA failure mode effect analysisCLCA closed loop corrective actionLRR line reject rate measured by DPPMMQR monthly quality reviewMTQ manufacturing ,test and qualityRCA root cause analysisPFMEA process failure mode effect analysisSFIS Shop Floor Information SystemQEM Quality engineering measurementBGA Ball Grid ArrayIC Integrated CircuitQFP Quad Flat PackEOS Elwctrical Over StressTNB terminal notebook businessSMT Surface Mount Technology品质人员名称类QC quality control 品质管理人员FQC final quality control 终点品质管制人员IPQC in process quality control 制程中的品质管制人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供应商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供应商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 品质管制(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 作业系统TBA To Be Assured 待定。

企业常用缩写-中英文对照

企业常用缩写5S : 5S管理ABC : 作业制成本制度(Activity-Based Costing)ABB : 实施作业制预算制度(Activity-Based Budgeting)ABM : 作业制成本管理(Activity-Base Management)APS : 先进规画与排程系统(Advanced Planning and Scheduling)ASP : 应用程序服务供货商（Application Service Provider）ATP :可承诺量(Available To Promise)AVL : 认可的供货商清单(Approved Vendor List)BOM : 物料清单(Bill Of Material)BPR : 企业流程再造(Business Process Reengineering)BSC : 平衡记分卡(Balanced ScoreCard)BTF : 计划生产(Build To Forecast)BTO : 订单生产(Build To Order)CPM : 要径法(Critical Path Method)CPM : 每一百万个使用者会有几次抱怨(Complaint per Million)CRM : 客户关系管理(Customer Relationship Management)CRP : 产能需求规划(Capacity Requirements Planning)CTO : 客制化生产(Configuration To Order)DBR : 限制驱导式排程法(Drum-Buffer-Rope)DMT : 成熟度验证(Design Maturing Testing)实用文档DVT : 设计验证(Design Verification Testing)DRP : 运销资源计划(Distribution Resource Planning)DSS : 决策支持系统(Decision Support System)EC : 设计变更／工程变更(Engineer Change)EC : 电子商务(Electronic Commerce)ECRN : 原件规格更改通知(Engineer Change Request Notice)EDI : 电子数据交换(Electronic Data Interchange)EIS : 主管决策系统(Executive Information System)EMC : 电磁相容(Electric Magnetic Capability)EOQ : 基本经济订购量(Economic Order Quantity)ERP :企业资源规划(Enterprise Resource Planning) FAE : 应用工程师(Field Application Engineer)FCST : 预估(Forecast)FMS : 弹性制造系统(Flexible Manufacture System)FQC : 成品质量管理(Finish or Final Quality Control)IPQC : 制程质量管理(In-Process Quality Control)IQC : 进料质量管理(Incoming Quality Control)ISO : 国际标准组织(International Organization for Standardization) ISAR : 首批样品认可(Initial Sample Approval Request) JIT : 实时管理(Just In Time)KM ：知识管理(Knowledge Management)实用文档L4L : 逐批订购法(Lot-for-Lot)LTC : 最小总成本法(Least Total Cost)LUC : 最小单位成本(Least Unit Cost)MES : 制造执行系统(Manufacturing Execution System) MO : 制令(Manufacture Order)MPS : 主生产排程(Master Production Schedule) MRO : 请修(购)单(Maintenance Repair Operation)MRP : 物料需求规划(Material Requirement Planning)MRPII : 制造资源计划(Manufacturing Resource Planning) NFCF : 更改预估量的通知Notice for Changing ForecastOEM : 委托代工(Original Equipment Manufacture)ODM : 委托设计与制造(Original Design & Manufacture)OLAP : 在线分析处理(On-Line Analytical Processing)OLTP : 在线交易处理(On-Line Transaction Processing)OPT : 最佳生产技术(Optimized Production Technology)OQC : 出货质量管理(Out-going Quality Control)PDCA : PDCA管理循环(Plan-Do-Check-Action)PDM : 产品数据管理系统(Product Data Management)PERT : 计划评核术(Program Evaluation and Review Technique) PO : 订单(Purchase Order)实用文档POH : 预估在手量(Product on Hand)PR : 采购申请Purchase RequestQA : 质量保证(Quality Assurance)QC : 质量管理(Quality Control)QCC : 品管圈(Quality Control Circle)QE : 质量工程(Quality Engineering)RCCP : 粗略产能规划(Rough Cut Capacity Planning) RMA : 退货验收Returned Material ApprovalROP : 再订购点(Re-Order Point)SCM : 供应链管理(Supply Chain Management)SFC : 现场控制(Shop Floor Control)SIS : 策略信息系统(Strategic Information System) SO : 订单(Sales Order)SOR : 特殊订单需求(Special Order Request)SPC :统计制程管制(Statistic Process Control)TOC : 限制理论(Theory of Constraints)TPM :全面生产管理Total Production ManagementTQC : 全面质量管理(Total Quality Control)TQM : 全面质量管理(Total Quality Management)WIP : 在制品(Work In Process)实用文档5S管理5S是由日本企业研究出来的一种环境塑造方案，其目的在藉由整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及身美(SHITSUKE)五种行为来创造清洁、明朗、活泼化之环境，以提高效率、质量及顾客满意度。

生产制造英文缩写大全

EVT(Engineering Verification Test)工程验证测试阶段DVT(Design Verification Test)设计验证测试阶段DMT（Design Maturity Test）成熟度验证MVT（Mass-Production Verification Test）量产验证测试PVT(Production/Process Verification Test)生产/制程验证测试阶段MP(Mass Production)量产工程师类:PE: Product Engineer 产品工程师Process Engineer 制程工程师ME: Mechanical Engineer 机构工程师IE：Industrial Engineer 工业工程师QE: Quality Engineer 品质工程师SQESupplier Quality Engineer供货商质量工程师QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员TE Test Engineer 测试工程师AE Automatic Engineer 自动化工程师研发类:R&D Research & Design 设计开发部ID (Industry Design)工业设计MD (Mechanical Design)结构设计HW(Hardware) 硬件设计SW(Software)软件设计PDM Product Data Management 产品数据管理PLM product lifecycle management 产品生命周期管理电子设计:ICT In Circuit Test 电路测试PCB Printed Circuit Board 印刷电路板PCBA Printed Circuit Board Assembly 印刷电路板装配FPC FlexiblePrintedCircui 挠性电路板EMI Electrical Magnetic Interference 电子干扰RFI adio Frequency Interference射频干扰。

工厂常用英文缩写

工廠常用英文縮寫PE: Products Engineer; 生产工程Process engineer 制程工程TE: Test Engineer 测试工程ME: Manufacturing Engineer; 制造工程;Mechanical Engineer 机械工程IE: Industrial Engineer 工业工程DCC: Document Control Center 文管中心BOM: Bill OF Material 材料清单ECN: Engineering Change Notice 工程变动公告TECN: Temporary Engineering Change Notice 工程临时变动公告ATY: Assembly Test Yield Total Yield 直通率TPM: Total Productivity MaintenancePM: Product Manager; Project ManagerECR: Engineering Change Request 工程变更申请ECO: Engineering Change Order 工程变更指令EN: Engineering Notice 工程通报WPS: Work Procedure Sheet 工作说明书ICT: In Circuit Test 电路测试P/R: pilot run; C/R control run T/R trial run 试做EVT: Engineer Verification Test 工程验证测试DVT: Design Verification Test 设计验证测试MVT: Mass Verification Test 多项验证测试ORT: On Going Reliability Test 出货信赖性测试S/W: software 软件H/W: hardware 硬件DCN: Design Change Notice 设计变更通知PVT: Production Verification Test 生产验证测试MTF: Modulation Transfer Function 调整转换功能CAT: Carriage Alignment Tool 载器调整具ID: Industrial Design 工业设计(外观设计)PCBA: Printed Circuit Board Assembly 电路板组装F/T: Function Test 功能测试CCD: Charge Coupled Device 扫描仪之读器ERS: External Reference Spec 外部规格PMP: Production Management Plan 工程管理计划SOP: Standar Operation Procedure 作业标准书QRA: Quality reliability Assurance 品保部ESD: Electrical Static Discharge 静电释放或静电防护OAY: Output Accept Yeild 直通率VMI: Visual mechanical inspection 外观检查PK: Packing 包装FQA: Final quality assurance 质量追踪CE: Component engineer 材料工程师EE: Electronic engineer 电子工程师EVT: Engineer verification test 工程验证测试WIP: Working in process inventory 在制品QA Quality Assurance 质量保证QRA :Quality & Reliability Assurance质量与可靠性保证MQA :Manufacturing Quality Assurance 制造质量保证DQA: Design Quality Assurance 设计质量保证QC: Quality Control 质量控制IQC: Incoming Quality Control 进货质量控制VQC: Vendor Quality Control 售货质量控制IPQC: In Process Quality Control 制程质量控制OQA: Out going Quality Control 出货质量控制QE: Quality Engineer 质量工程AQL: Acceptable Quality Level 可接受的质量水平DPPM: Defective Pieces Per Million units 百万件中有损件数PPM: Pieces Per Million 百万分之一CS: Custom Service 顾客服务MRB: Marerial Review Board 材料审核委员会DMR Defective Material Report 材料缺陷报告RMA: Return Marerial Administration 材料回收处理Life Test 寿命测试T/C: Temperature Cycle 温度循环H/T: High Temperature Test 高温测试L/T: Low Temperature Test 低温测试ISO: International Standard Organization 国际标准化组织SPC: Statistic process control 统计过程控制5S: Seiri Seito Seiso Seiketsu Shitsuke整理.整顿.清理.清扫.素养VMI: Visual Mechanical Inspection 外观机构检验MIL-STD: Military Standard 美军标准SPEC: Specification 规格AVL: Approval Vendor List 合格厂商QVL: Qualified Vendor List 合格厂商FQC: Final Quality Control 最终质量控制OBA: Open Box Audit 成品检验EAR: Engineering Analysis Request 工程分析需求FAI: First Article Inspection 首件检验VQM: Vendor Quality Management 厂商质量管理CAR: Corrective Action Request 改进对策要求4M: Man; Machine; Material; Method 人,机,材,方法5M: Man; Machine; Material; Method; Measurement 人,机,材,方法,测量MTBF: Mean Time Between Failure 平均寿命TTL: TotalFIN Finance&Accounting 财务与账目P&L: Profit & LosePV : Performance Variance 现象差异3 Element of Cost = M,L,OM: Material 材料L: Labor 人力O: Overhead 管理费用Fix OH Fix Overhead 固定管理费用Var OH Variable Overhead 不定管理费用COGS Cost Of Goods Sold 工厂制造成本AR: Account Receivable 应收AP: Account Payable 应支MIS Management Information System 资迅管理系统IS: Information System 资迅系统IT: Information Technology 系统技术MRP: Material Requisition Plan 材料需求计划I2:Information Integration System 资迅整合系统SAP: System Application Programming 系统申请项目ERP: Enterprise Resource Programming 企业资源项目HR Human Resource 人力资源PR: Public relation 公共关系T/O: Turn Over Rate=Monthly T/O Total People*12 GR: General Affair 总务Organization 组织HQ Head Quarter 总公司Chairmen 主席President 总裁Executive Vice President 常务副总裁Vice President 副总裁HR Human Resource 人力资源部FIN Finance 财务Sales 销售R&D: Research & Developing 研发部QA: 质量保证QA DQA CSMIS: Management Information System 资迅管理系统PUR 采购PurchasingIMD: Image Management Division 影像管理事业部ITS: Information Technology System 计算机部QRA: Quality Reliability Assurance 品保部MFG: Manufacturing 制造部PMC: Production & Material Control 生(产)物(料)管(理)Materials 材料PC: Production Control 生产控制MPS: Mass Production Schedule 量产计划FGI: Finished goods Inventory 成品存货UTS: Units To Stock 存货单元WIP: Working In Process Inventory 在制品C/T: Cycle Time 循环时间,瓶颈WD: Working Days 工作天MTD: Month To Days 月初到今日(例如总表整理) YTD: Year To Days年初到今日SO: Sales Order 销售清单MO: Manufacture Order 制造清单BTO: Build To Order 订单生产P/N: Part Number 料号MC: Material Control 材料控制MRP: Material Requisition Plan 材料需求计划INV: Inventory 存货清单Inv Turn Over Days=INVS/NSB X WD 库存周转天数PSI: Production Shipping Inventory 预备待出货JIT: Just In Time 实时Safety Inventory 安全存量CKD: Completed Kits Delivery 全件组装出货SKD: Semi Kits Delivery 半件(小件)组装出货W/H: Warehouse 仓库Rec: Receiving Center 接收中心Raw MTL 原物料F/G: finish goods 成品Import/Export 进出口SI: Shipping Instruction 发货指令PL: Packing List 包装清单Inv: Shipping Invoice 出货发票ETA: Estimate Arrive 预估到达时间ETD: Estimate departure 预估离开时间BL: Bill of Landing 提货单(海运)AWB: Air Way Bill 提货单(空运)MAWB: Master Air Way Bill 主提货单HAWB: House Air Way Bill 副提货单TEU: Twenty foot Equipment Unit(Contain) 二十英尺货柜FEU: Forty foot Equipment Unit(Contain) 四十英尺货柜CY: Container Yard 货柜场THC: Terminal Handing Charge 码头费ORC: Original Receiving Charge 码头费PUR: Purchasing 采购FOB: Free on Board 货运至甲板(离岸价) CIF: Cost Insurance Freight 成本+运费+保险OA: Open Account 开户TT: Telegram Transfer 电汇COD: Cash On DeliveryCRP: Cost Reduction Program 降低成本方案PR: Purchasing Requisition 采购申请PO: Purchasing Order 采购单MFG Manufacturing Production 制造生产DL: Director Labor 直接人工IDL: Indirect Labor 间接人工DLH: Direct Labor Hours 直接工时Productivity=UTS/DLHPPH: Pieces Per Hour 每小时件数Efficiency=Actual/Target(%)DT: Machine Down Time 停机时间AI: Auto Insertion 自动插入MI: Manual Insertion 人工插入SMD: Surface Mount Device 表面粘着零件SMT: Surface mount technology 表面粘着技术B/I: Burn In(for how many hours at how many degree) 烧机WI: Work Instruction 工作说明SOP: Standard Operation Procedure 作业指导书R/I: Run In 运转机器ESD: Electrical Static Discharge 静电释放MP: Mass Production 量产。

企业常用英文缩写

企业常用缩写5S : 5S管理(整理﹐整顿﹐清洁﹐清扫﹐素养)ABC : 作业制成本制度(Activity-Based Costing)ABB : 实施作业制预算制度(Activity-Based Budgeting)ABM : 作业制成本管理(Activity-Base Management)APS : 先进规画与排程系统(Advanced Planning and Scheduling) ASP : 应用程序服务供货商（Application Service Provider）ATP : 可承诺量(Available To Promise)AVL : 认可的供货商清单(Approved Vendor List)BOM : 物料清单(Bill Of Material)BPR : 企业流程再造(Business Process Reengineering)BSC : 平衡记分卡(Balanced ScoreCard)BTF : 计划生产(Build To Forecast)BTO : 订单生产(Build To Order)CPM : 要径法(Critical Path Method)CPM : 每一百万个使用者会有几次抱怨(Complaint per Million) CRM : 客户关系管理(Customer Relationship Management) CRP : 产能需求规划(Capacity Requirements Planning)CTO : 客制化生产(Configuration To Order)DBR : 限制驱导式排程法(Drum-Buffer-Rope)DMT : 成熟度验证(Design Maturing Testing)DVT : 设计验证(Design Verification Testing)DRP : 运销资源计划(Distribution Resource Planning)DSS : 决策支持系统(Decision Support System)EC : 设计变更／工程变更(Engineer Change)EC : 电子商务(Electronic Commerce)ECRN : 原件规格更改通知(Engineer Change Request Notice)EDI : 电子数据交换(Electronic Data Interchange)EIS : 主管决策系统(Executive Information System)EMC : 电磁相容(Electric Magnetic Capability)EOQ : 基本经济订购量(Economic Order Quantity)ERP: 企业资源规划(Enterprise Resource Planning)FAE: 应用工程师(Field Application Engineer)FCST : 预估(Forecast)FMS : 弹性制造系统(Flexible Manufacture System)FQC : 成品质量管理(Finish or Final Quality Control)IPQC : 制程质量管理(In-Process Quality Control)IQC : 进料质量管理(Incoming Quality Control)ISO : 国际标准组织(International Organization for Standardization) ISAR : 首批样品认可(Initial Sample Approval Request)JIT : 实时管理(Just In Time)KM ：知识管理(Knowledge Management)L4L : 逐批订购法(Lot-for-Lot)LTC : 最小总成本法(Least Total Cost)LUC : 最小单位成本(Least Unit Cost)MES : 制造执行系统(Manufacturing Execution System)MO : 制令(Manufacture Order)MPS : 主生产排程(Master Production Schedule)MRO : 请修(购)单(Maintenance Repair Operation)MRP : 物料需求规划(Material Requirement Planning)MRPII : 制造资源计划(Manufacturing Resource Planning)NFCF : 更改预估量的通知Notice for Changing ForecastOEM : 委托代工(Original Equipment Manufacture)ODM : 委托设计与制造(Original Design & Manufacture)OLAP : 在线分析处理(On-Line Analytical Processing)OLTP : 在线交易处理(On-Line Transaction Processing)OPT : 最佳生产技术(Optimized Production T echnology)OQC : 出货质量管理(Out-going Quality Control)PDCA : PDCA管理循环(Plan-Do-Check-Action)PDM : 产品数据管理系统(Product Data Management)PERT : 计划评核术(Program Evaluation and Review Technique)PO : 订单(Purchase Order)POH : 预估在手量(Product on Hand)PR : 采购申请Purchase RequestQA : 质量保证(Quality Assurance)QC : 质量管理(Quality Control)QCC : 品管圈(Quality Control Circle)QE : 质量工程(Quality Engineering)RCCP : 粗略产能规划(Rough Cut Capacity Planning)RMA : 退货验收Returned Material ApprovalROP : 再订购点(Re-Order Point)SCM : 供应链管理(Supply Chain Management)SFC : 现场控制(Shop Floor Control)SIS : 策略信息系统(Strategic Information System)SO : 订单(Sales Order)SOR : 特殊订单需求(Special Order Request)SPC : 统计制程管制(Statistic Process Control)TOC : 限制理论(Theory of Constraints)TPM : 全面生产管理Total Production ManagementTQC : 全面质量管理(Total Quality Control)TQM : 全面质量管理(Total Quality Management)WIP : 在制品(Work In Process)5S管理5S是由日本企业研究出来的一种环境塑造方案，其目的在藉由整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及身美(SHITSUKE)五种行为来创造清洁、明朗、活泼化之环境，以提高效率、质量及顾客满意度。

工厂英文缩写大全

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

企业资源规划系统业资源划系统静电释放静电释放（放电）欧洲失效分析首件样首件样品检查失效模式分析可绕性印刷电路板性印刷电成品质成品质量管理不良率功能测试功能测试提供您参阅（提供您参阅（对平级和下级用）参阅和下级提供您参提供您参考（对平级和上级用）和上级地面工业设计制程质制程质量控制进料质量控制日规数字电视地面广播标准规数字电视地面广地面国际标准化组织国际标准化组织准化关键绩效指标关键绩效指标效指韩国主要的目标管理制造变制造变更通知制程变制程变更需求机构工程制造执行系统制造执行系统制造轻微的管理信息系统管理信息系统工单量产材料审材料审核会议物料需求计物料需求计划无效/不适用不良
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
ERP ESD EU FA FAI FMEA FPC FQC FR F/T FYI FYR GND ID IPQC IQC ISDB-T ISO KPI KR MAJ MBO MCN MCR ME MES MFG MIN MIS MO MP MRB MRP NA NG
11
DFX
Design for X
12 13 14
DOE DPPM
Design of experiments Defect part per million
DVB-C Digital Video Broadcasting-Cable DVB-H DVB-S Digital Video Broadcasting for handheld Digital Video Broadcasting-Satellite
可允收质可允收质量水平组装合格供应商名录合格供应商名录材料清单材料清单按钮矫正措施事业处中国强制认证国强制制程能力参数制程能力参数文件管制中心面向产品生命周期各/ 环节的设计。面向产品生命周期各/某环节的设计。 DFP：可采购设计 DFP：Design for Procurement 可采购设计 DFM：可生产设计 DFM：Design for Manufacture 可生产设计 DFT： DFT：Design for Test 可测试设计 DFD：Design for Diagnosibility 可诊断分析设计 DFD：诊断分析设计分析 DFA： DFA：Design for Assembly 可组装设计 DFE： DFE：Design for Environment 可环保设计 DFF： PCB可制造 DFF：Design for Fabrication of the PCB 为PCB可制造而设计 DFS：可服务设计 DFS：Design for Serviceability 可服务设计 DFR：可靠性而设计 DFR：Design for Reliability 为可靠性而设计 DFC：成本而设计 DFC：Design for Cost 为成本而设计实验设计法实验设计法每百万的缺陷数每百万的缺陷数欧规数字电视有线广播欧规数字电视有线广播标准欧规手持装欧规手持装置数字地面广播标准手持字地面广欧规数字电视卫星欧规数字电视卫星广播标准欧规数字电视地面广欧规数字电视地面广播标准地面设计验证工程变工程变更通知工程变工程变更指令工程变工程变更需求电子工程电磁共容电磁干扰产品生命结束品生命结
Enterprise Resources planing Electro-Static Discharge Europe Failure Analysis First Article Inspection Failure model effectiveness analysis Flexible Printed Circuit Finish Quality Control Failure Rate Function Test For Your Information For Your Reference Ground Industry Design In-process Quality Control Incoming Quality Control Integrated Services Digital Broadcasting-Terrestrial International Standard Organization Key Performance Indicator Korea Major Management by Objective Manufacturing Change Notice Manufacturing Change Request Mechanical Engineering Manufacturing Execution System Manufacturing Minor Management Information System Manufacturing Order Mass Production Material Review Board Material Requirement Plan Not Available No Good
100句工廠常用單詞 100句工廠常用單詞
1 2 3 4 5 6 7 8 9 10
AQL ASS'Y AVL BOM BTN CA BU CCC CPKty Level Assembly Approved Vendor List Bill of Materials Button Corrective Action Business Unit China Compulsory Certification Capability process index Document Control Center
PN(P/N) Part Number
99 100
TE WIP
Test Engineering Working In Process
测试工程测试工程在制半成品
New Product Introduction Original Design Manufacturer Original Equipment Manufacture Operator Outgoing Quality Assurance Outgoing Quality Control On-going Reliability Test Operation System Printed CircuitBoard Printed CircuitBoard assembly Plan-Do-Check-Action Process Engineering Packing Project Management Purchase order Production Plan Percent Per Million Pilot Run Proces Verification Quality Assurance Quality Control Quality Engineering Quality Management Quality System Research&Development Return Materials Approval Shop Floor Control Shop Floor Integrated System Standard Inspection Procedure Surface Mount Device Surface Mount Technology Serial Number Standard Operation Procedure Statistical Process Control Speaker Supplier Quality Engineer To Be Determined
61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98
NPI ODM OEM OP OQA OQC ORT OS PCB PCBA PDCA PE PKG PM PO PP PPM P/R PV QA QC QE QM QS RD RMA SFC SFIS SIP SMD SMT SN SOP SPC SPK SQE TBD
15 16 17 18 19 20 21 22 23 24 25
DVB-T Digital Video Broadcasting-Terrestrial DVT ECN ECO ECR EE EMC EMI EOL Design Verification Testing Engineering Change Notice Engineering Change Order Engineering Change Request Electronic Engineering Electromagnetic Compatibility Electromagnetic Interference End of Life
新机种导新机种导入代设计制造者设计制造者委托代工作业员出货品质确认成品出货质量管理成品出货质量管理货质持续性可靠度测试性可靠度测试操作系统操作系统印刷电印刷电路板电路板组装路板组装 PDCA管理循环 PDCA管理循环管理循制程工程师制程工程师包装项目管理料号订购单生产计划产计划百万分之一试产制程验证制程验证质量保证量保证质量控制质量工程质量管理质量系统量系统研发退货验收货验收现场控制现场控制现场信息整合系统现场信息整合系统信息整合系标准检验程序检验程序表面粘着组件表面粘着组件着组表面粘着表面粘着技术序号标准作业指导准作业统计制程管制统计制程管制喇叭/扬声器喇叭/扬声器供应商质量管理待决定