sht10温湿度传感器说明.
数字温湿度传感器
典型值 最大值 典型值 最大值 典型值 最大值
原始数据 线性化 tau (63%)
典型值
Min. Typ. Max.
0.4 0.05 0.05
8 12 12
±4.5 见图 2 ±3.0 见图 2 ±2.0 见图 2 ±0.1 可完全互换
±1
±3
<<1
数量 货号
2000
100 400 2000 100 400
1-100218-04
1-100051-04 1-100098-04 1-100524-04 1-100085-04 1-100093-04
1 默认测量分辨率为温度 14 位，湿度 12 位。通过状态寄存器 可分别降至 12 位和 8 位。 2 在出厂质量检验时，每支传感器都在 25℃（77℉）和 3.3V 条 件下测试并且完全符合精度指标。该精度值不包括滞后与非线 性。
2
SHT1x 系列温湿度传感器
SHT1x 用户指南
1. 应用信息 1.1 工作条件 传感器在建议的工作条件下性能正常，请参阅图 4。 超出建议的工作范围可能导致信号暂时性漂移（60 小 时后漂移+3%RH）。当恢复到正常工作条件后，传感 器会缓慢自恢复到校正状态。可参阅 1.4 小节的“恢 复处理”以加速恢复进程。在非正常条件下的长时间 使用，会加速产品的老化。
材质 传感器采用环氧 LCP 帽，下层为 FR4。插针采用铜/ 铍合金制作，外层镀有镍和金。传感器符合 ROHS 和 WEEE 标准，因此不受 Pb, Cd, Hg, Cr(6+), PBB, PBDE 的影响。
开发包 开发包 EK-H2 为客户提供了测试，检验，开发传感器 的工具。EK-H2 包括传感器，测试板和计算机软件。
SHT10_SHT11数字温湿度传感器-中文资料
40—100
100—200
每月消费金额
200以上
人数 人数
学生饮食上注重的方面表：
70 60 50 40 30 20 10 0
营养均衡
价格合适
选择饮食最为合 理的荤素均匀的学生 所在的比例是23%， 多数的同学不是荤少 素多就是荤多素少。 食物搭配不合理。
大学生饮食荤素 搭配情况表：
方便快捷
35
30
<三>采用的促销方法 1.宣传： 因为目标市场的流动性，决议店面3-4年内全部翻新，由于随时都会有老顾客散
失，新顾客光顾的市场更替，所以宣传和营销必需坚持到永恒，综合考虑各方因素， 具体采以下多少种方式：
1)与各高校学生会组织和有社会影响及关系的联系，介入资助学校迎新晚会等类 似活动来做企业宣传。
市场细分
1）按经济起源分： ①无经济来源的学生（主导地位）。此消费群体对餐饮高贵、舒服方面要有不和
有收入来源的群体一样有较高的请求，较合适个别的消费标准，在制定价格的同时需 恰当调低价格。
②有经济来源的教职工、店面员工等。根据这种消费市场可以依照社会上的价格 消费水平，制订绝对来说较多层次、多种类的标准来制作各种标准餐。 2）按性别分：
风险以及应答措施
<一>风险： 竞争对手多，竞争激烈；管理和经营缺乏实践，科学化、高技术含量的管理及运营运 用存在磨合风险；原料的安全卫生存在一定隐患；市场补缺者和市场追随者及市场模仿者 加入竞争增长了一定商场竞争力。 <二>办法 1.产品和服务保持特色，一直革故鼎新，加入新元素。 2.不断学习成功者的管理教训，完善自身管理。 3.认真建立与原料供应商的长期协作关系。 4.不断挖掘自身漏洞，发现新市场，坚持强度宣传，营造企业在顾客印象中的良好形 象和在消费者心中形成一定的亲和力，直至企业做大做强！
温湿度传感器SHT10驱动程序
温湿度传感器SHT10驱动程序——基于MSP430这是暑假时用430的单片机写的温湿度传感器SHT10的程序，参考了官方的51例程，分享一下~~/****************************************Copyright(c)********************************************************************************************LiPeng********************* *************************************--------------FileInfo-------------------------------------------------------------------------------** File Name: Sht10_Driver.c** Created by: LiPeng** Created date: 2008-09-15** Version: 1.0** Descriptions: The original version****------------------------------------------------------------------------------------------------------** Modified by:** Modified date:** Version:** Descriptions:****------------------------------------------------------------------------------------------------------** System Function: Sht10 Driver------温湿度传感器SHT10驱动** 使用MSP430-F413连接方式:** VCC: P6.3** SCK: P6.4** SDA: P6.5*********************************************************************** ***********************************/#include <msp430x14x.h>/*宏定义，延时函数，参数为1时相应延时分别为1us和1ms*/#define CPU_F (double)1000000#define delay_us(x) __delay_cycles((long)(CPU_F * (double)x/1000000.0)) #define delay_ms(x) __delay_cycles((long)(CPU_F * (double)x/1000.0))/*常量定义*/#define uint unsigned int#define uchar unsigned char#define ulong unsigned long//adr command r/w#define STATUS_REG_W 0x06 //000 0011 0#define STATUS_REG_R 0x07 //000 0011 1#define MEASURE_TEMP 0x03 //000 0001 1#define MEASURE_HUMI 0x05 //000 0010 1#define RESET 0x1e //000 1111 0#define bitselect 0x01 //选择温度与湿度的低位读#define noACK 0#define ACK 1#define HUMIDITY 2#define TEMPERATURE 1#define SCK BIT4#define SDA BIT5#define SVCC BIT3#define SCK_H P6OUT|=SCK#define SCK_L P6OUT&=~SCK#define SDA_H P6OUT|=SDA#define SDA_L P6OUT&=~SDA#define SVCC_H P6OUT|=SVCC#define SVCC_L P6OUT&=~SVCCtypedef union{unsigned int i;float f;}value;uint table_temp[3];uint table_humi[3];uint temten;uint humi_true;/******************************************************************** ****************************************Function Name: S_Init**Description: 初始化**Input Parameters: 无**Output Parameters: 无*************************************/void S_Init(){P6SEL&=~(SCK+SDA+SVCC); //选择P6.3 P6.4 为IO端口，输出 P6.5输入P6DIR|=(SCK+SVCC);P6DIR&=~SDA;BCSCTL1=(XT2OFF+RSEL2); //关闭XT2，1MHz DOCDCOCTL=DCO2; //设定DCO频率为1MHz}/******************************************************************** ****************************************Function Name: S_Transstart**Description: 发送开始时序**** generates a transmission start** _____ ________** DATA: |_______|** ___ ___** SCK : ___| |___| |______**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/void S_Transstart(){P6DIR|=SDA;SDA_H;SCK_L;_NOP();SCK_H;_NOP();SDA_L;_NOP();SCK_L;_NOP();_NOP();_NOP();SCK_H;_NOP();SDA_H;_NOP();SCK_L;P6DIR&=~SDA;}****************************************Function Name: S_WriteByte**Description: 写时序**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/char S_WriteByte(unsigned char value){unsigned char i,error=0;P6DIR|=SDA;for(i=0x80;i>0;i/=2) //shift bit for masking{if(i&value)SDA_H; //masking value with i , write to SENSI-BUSelseSDA_L;SCK_H; //clk for SENSI-BUS_NOP();_NOP();_NOP(); //pulswith approx. 5 usSCK_L;}SDA_H; //release DATA-lineP6DIR&=~SDA; //Change SDA to be inputSCK_H; //clk #9 for ackerror=P6IN; //check ack (DATA will be pulled down by SHT11)error&=SDA;P6DIR|=SDA;SCK_L;if(error)return 1; //error=1 in case of no acknowledgereturn 0;}/******************************************************************** ****************************************Function Name: S_ReadByte**Description: 读时序**Input Parameters: ack--->reads a byte form the Sensibus and gives an acknowledge in case of "ack=1"**Output Parameters: 无********************************************************************* *************************************/char S_ReadByte(unsigned char ack){unsigned char i,val=0;P6DIR|=SDA;SDA_H; //release DATA-lineP6DIR&=~SDA;for(i=0x80;i>0;i/=2) //shift bit for masking{SCK_H; //clk for SENSI-BUSif(P6IN&SDA)val=(val|i); //read bitSCK_L;}P6DIR|=SDA;if(ack) //in case of "ack==1" pull down DATA-LineSDA_L;elseSDA_H;SCK_H; //clk #9 for ack_NOP();_NOP();_NOP(); //pulswith approx. 5 usSCK_L;SDA_H; //release DATA-lineP6DIR&=~SDA;return val;}/******************************************************************** ****************************************Function Name: S_Connectionreset**Description: 通讯复位时序** communication reset: DATA-line=1 and at least 9 SCK cycles followed by transstart** _____________________________________________________ ________** DATA: |_______|** _ _ _ _ _ _ _ _ _ ___ ___** SCK : __| |__| |__| |__| |__| |__| |__| |__| |__| |______| |___| |______ **Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/void S_Connectionreset(){unsigned char ClkCnt;P6DIR|=SDA;SDA_H;SCK_L; //Initial statefor(ClkCnt=0;ClkCnt<9;ClkCnt++) //9 SCK cycles{SCK_H;SCK_L;}S_Transstart(); //transmission start}/******************************************************************** ****************************************Function Name: S_Softreset**Description: 软件复位时序resets the sensor by a softreset**Input Parameters: 无**Output Parameters: 无********************************************************************* *************************************/char S_Softreset(){unsigned char error=0;S_Connectionreset(); //reset communicationerror+=S_WriteByte(RESET); //send RESET-command to sensorreturn error; //error=1 in case of no response form the sensor}/******************************************************************** ****************************************Function Name: S_WriteStatusReg**Description: 写状态寄存器**Input Parameters: *p_value**Output Parameters: 无********************************************************************* *************************************/char S_WriteStatusReg(unsigned char *p_value){unsigned char error=0;S_Transstart(); //transmission starterror+=S_WriteByte(STATUS_REG_W); //send command to sensorerror+=S_WriteByte(*p_value); //send value of status registerreturn error; //error>=1 in case of no response form the sensor}/******************************************************************** ****************************************Function Name: S_Mearsure**Description: 读时序 makes a measurement (humidity/temperature) withchecksum**Input Parameters: *p_value ,*p_checknum ,mode**Output Parameters: 无********************************************************************* *************************************/unsigned char S_Measure(unsigned char *p_value, unsigned char*p_checksum, unsigned char mode){unsigned error=0;unsigned int i;S_Transstart(); //transmission startswitch(mode){ //send command to sensorcase TEMPERATURE: error+=S_WriteByte(MEASURE_TEMP); break;case HUMIDITY: error+=S_WriteByte(MEASURE_HUMI); break;}P6DIR&=~SDA;for(i=0;i<65535;i++) //wait until sensor has finished the measurement if((P6IN&SDA)==0)break;if(P6IN&SDA)error+=1; //or timeout (~2 sec.) is reached*(p_value)=S_ReadByte(ACK); //read the first byte (MSB)*(p_value+1)=S_ReadByte(ACK); //read the second byte (LSB)*p_checksum=S_ReadByte(noACK); //read checksumreturn(error);}/******************************************************************** ****************************************Function Name: S_Calculate**Description: 计算**Input Parameters: humi [Ticks] (12 bit)** temp [Ticks] (14 bit)**Output Parameters: humi [%RH]** temp [癈]********************************************************************* *************************************/void S_Calculate(unsigned int *p_humidity ,unsigned int *p_temperature) {const float C1=-4.0; // for 8 Bitconst float C2=+0.648; // for 8 Bitconst float C3=-0.0000072; // for 8 Bitconst float D1=-39.6; // for 12 Bit @ 3Vconst float D2=+0.04; // for 12 Bit @ 3Vconst float T1=0.01; // for 8 bitconst float T2=0.00128; // for 8 bitfloat rh=*p_humidity; // rh: Humidity [Ticks] 12 Bitfloat t=*p_temperature; // t: Temperature [Ticks] 14 Bitfloat rh_lin; // rh_lin: Humidity linearfloat rh_true; // rh_true: Temperature compensated humidityfloat t_C; // t_C : Temperature [癈]t_C=t*D2+D1; //calc. temperature from ticks to [癈]rh_lin=C3*rh*rh + C2*rh + C1; //calc. humidity from ticks to [%RH]rh_true=(t_C-25)*(T1+T2*rh)+rh_lin; //calc. temperature compensated humidity [%RH]if(rh_true>100)rh_true=100; //cut if the value is outside ofif(rh_true<0.1)rh_true=0.1; //the physical possible range*p_temperature=t_C; //return temperature [癈]*p_humidity=rh_true; //return humidity[%RH]}void main(){value humi_val,temp_val;unsigned char error,checksum;unsigned int i,temphigh,templow;unsigned int RegCMD=0x01;WDTCTL=WDTPW+WDTHOLD; //Stop watchdog timer to prevent time out resetS_Init();SVCC_H;S_Connectionreset();S_WriteStatusReg((unsigned char *)&RegCMD);while(1){error=0;error+=S_Measure((unsigned char*) &humi_val.i,&checksum,HUMIDITY);//measure humidityerror+=S_Measure((unsigned char*) &temp_val.i,&checksum,TEMPERATURE); //measure temperatureif(error!=0)S_Connectionreset(); //in case of an error: connection resetelse{templow=(humi_val.i&0xff00);humi_val.i=templow>>8;temphigh=((temp_val.i&0xf)<<8);templow=((temp_val.i&0xff00)>>8);temp_val.i=temphigh+templow;S_Calculate(&humi_val.i,&temp_val.i); //calculate humidity, temperature//temp_val_NOP();//printf("temp:%5.1fC humi:%5.1f%% dewpoint:%5.1fC\n",temp_val.f,humi_val.f,dew_point);}//----------wait approx. 0.8s to avoid heating upSHTxx------------------------------for (i=0;i<40000;i++); //(be sure that the compiler doesn't eliminate this line!)//-----------------------------------------------------------------------------------}}。
sht10温湿度传感器说明
用于密封和粘合的材质（保守推荐）：推荐使用充 满环氧树脂的方法进行电子元件的封装，或是硅树 脂。这些材料释放的气体也有可能污染SHT7x(见 1.3)。因此，应最后进行传感器的组装，并将其置 于通风良好处，或在50℃的环境中干燥24小时，以 使其在封装前将污染气体释放。
烘干：在100-105℃ 和< 5%RH 的湿度条件下保持 10小时； 重新水合：在20-30℃ 和>75%RH 的湿度条件下保 持12 小时9。
1.5 温度影响 气体的相对湿度，在很大程度上依赖于温度。因此 在测量湿度时，应尽可能保证所有测量同一湿度的 传感器在同一温度下工作。在做测试时，应保证被 测试的传感器和参考传感器在同样的温度下，然后 比较湿度的读数。
外形尺寸
0.95 ±0.1
7.47 ±0.05 4.2 ±0.1 1.27 ±0.05
1.5 ±0.2 2.0 ±0.1 1.5 ±0.1 sensor opening 2.5 ±0.1
0.6 ±0.1
NC
NC
1
NC
2
A5Z
NC
3
NC
11 4
NC
5.2 ±0.2
1.83 ±0.05
3.3 ±0.1 4.93 ±0.05
SHT1X 提供表贴LCC 封装，可以使用标准回流焊 接。同样性能的传感器还有插针型封装 （SHT7X ）和柔性PCB封装（SHTA1）。
SHT10空气温湿度MODbus协议(单指令)
SHT10温湿度传感器的通信协议命令包含：1.读取站号命令2.写站号命令3.读取数据4.手动矫正数据串口参数设置：读站号命令(固定命令)主站从站地址功能码H地址L地址 H数据L数据 CRC00 03 00 01 00 01 CRClo CRChi 从站从站地址功能码H地址L地址H数据CRC00 03 02 00 XX CRClo CRChi 注：返回帧与主站相同设备地址：（XX=01-FF）示例：命令00 03 00 01 00 01 D4 1B（固定命令）回复00 03 02 00 FF C5 C4 （设备默认站号FF）写站号命令主站从站地址功能码H地址L地址寄存器个数寄存器个数数据长度数据CRC00 10 00 01 00 01 02 00 XX CRClo CRChi 注：（XX=0X01-0XFF）从站从站地址功能码 H地址L地址寄存器个数CRC00 10 00 01 00 01 CRClo CRChi 示例：命令00 10 00 01 00 01 02 00 33 EA 04回复00 10 00 01 00 01 51 D8读数据主站从站地址功能码 H地址L地址寄存器个数寄存器个数CRCXX 03 00 00 00 02 CRClo CRChi注：（XX=0X01-0XFF）从站从站地址功能码数据长度数据数据CRCXX 03 04 19 AD 1B E4 CRClo CRCh 示例命令FF 03 00 00 00 02 D1 D5回复FF 03 04 19 AD 1B E4 79 FA注：温度：第4，5个字节19 AD温度=读数/100-40度湿度：第5，6个字节1B E4。
SHT10,SHT11,SHT20,SHT21替代品温湿度传感器HTU21D
最小值
-40
-40 -40
典型值
0.01 0.04
±0.3 ±0.4
44 22 11 6 10
最大值
+125
125 221 58 29 15
8
单位
℃ ℃ ℃
℃ ℃ ℃ °F ms ms ms ms s
9.温度误差估算
温湿度感应芯片HTU21D郑：18070430980
10.焊接说明 可以使用标准的回流焊炉对 HTU21 进行焊接。传感器完全符合 IPC/JEDEC J-STD-020D 焊
2．传感器的特点
·完整的互换性，在标准环境下无需校准 ·长期处于湿度饱和状态，可以迅速恢复 ·自动组装工艺生产，无铅材料制成，适合回流焊 ·每个传感器具有单独标记，可追溯生产源头
应用举例
·家庭应用 ·医疗领域 ·打印机 ·加湿器
3．性能规格
参数
储藏温度
供电电压（峰值）
湿度测量范围
温度测量范围
VDD to GND 数字 I/O 口引脚（DATA/SCK）to VDD 每个引脚输入电流
·相对湿度转换
不论基于哪种分辨率，相对湿度RH 都可以根据SDA 输出的相对湿度信号SRH通过如下 公式计算获得 （结果以 %RH 表示）：
例如16位的湿度数据为0x6350:25424，相对湿度的计算结果为42.5%RH。
·温度转换
不论基于哪种分辨率，温度T 都可以通过将温度输出信号ST代入到下面的公式计算得到 （结果以温度°C 表示）：
无论哪种传输模式，由于测量的最大分辨率为14 位，第二个字节SDA 上的后两位LSBs （bit43 和44）用来传输相关的状态信息。两个LSBs 中的bit1 表明测量的类型（’0’温度;‘1’： 湿度）。bit0 位当前没有赋值。
SHT10(温湿度传感器)
应用领域
框图
_ 暖通空调 HVAC
_ 测试及检测设备
_ 汽车
_ 数据记录器
1
_ 消费品
_ 自动控制
_ 气象站
_ 家电
_ 湿度调节器
_ 医疗
_ 除湿器
湿度 传感
器
Amplification
14-bit
校验存储器
D A
数字 2-线 接口
& CRC 发生器
SCK DATA
订货信息
型号 测湿精度 测温精度
封装
200 ns
表 5 SHTxx I/O 信号特性
2.3.2 电量不足 “电量不足”功能可监测到 Vdd 电压低于 2.47V 的 状态。精度为±0.05V。
2.3.3 加热元件
传感芯片上集成了一个可通断的加热元件。接通 后，可将 SHTxx 的温度提高大约 5-15℃（9-27℉）。 功耗增加~8mA @ 5V。 应用于：
2.2.2 串行数据 (DATA) DATA三态门用于数据的读取。DATA在 SCK 时
钟下降沿之后改变状态，并仅在 SCK 时钟上升沿有 效。数据传输期间，在SCK 时钟高电平时，DATA必 须保持稳定。为避免信号冲突，微处理器应驱动 DATA 在低电平。需要一个外部的上拉电阻（例如： 10kΩ）将信号提拉至高电平（参见图 2）。上拉电阻 通常已包含在微处理器的 I/O 电路中。详细的 IO 特 性，参见表 5。
DATA
Transmission Start
SCK 1 2
图4
3 4 -8 9 通讯复位时序
2.2.6 CRC-8 校验
数字信号的整个传输过程由 8bit 校验来确保。任 何错误数据将被检测到并清除。 详情可参阅应用说明“CRC-8 校验”。
STH10-SPI_温湿度传感器中英资料(1)
STH10-SPI
Temperature & Humidity Sensor
Block Diagram
1. Module Performance Specification 模块性能规格
Parameter 参数
Resolution 分辨率
Conditions Min
条件
最小值 Typ
Humidity 湿度
Product Summery 产品简介 The STH10 is a MCU based temperature and relative humidity sensor module, comprising a SPI interface (master mode) for direct temperature and humidity read out. The digital output is pre-calculated and no extra calculation is required. The system applied two sensor elements: NTC type high precision temperature sensor and a resistor type relative humidity sensor from Japan. With a very unique and patented relative humidity calculation algorithm, the system can assure accurate relative humidity output through fine tuned
- 完全可互换 - Small Size - 尺寸小 - Automatic Power Down - 自动断电
基于SHT10的数字温湿度计设计
装或 四脚互换封装 ， 积微小 ， 自动降能功能。 体 全
２２ 单片机和 Ｓ ． ＨＴ１ ０接口电路
由于 Ａ ８ Ｓ １ Ｔ ９ ５ 不具备 Ｉ Ｃ总线接 口， ２ 故使 用单 片机通用
Ｉ ／ Ｏ口线来虚拟 ＩＣ总线［ 利用 Ｐ ． ２ ９ １ ， １ ６来虚拟时钟线 ， 利用 Ｐ ． １ ５
图３ 主程序流程 图
Ｈ ． ６
只支持 ” ０ ” ０ ０ ）和 ５ 个命 令位 ，当上述命令 发送给 Ｓ １ ＨＴ ０之 后， 单片机通过检测 Ｄ Ｔ Ａ Ａ脚 的 Ａ Ｋ位 是否处于低 电位确认 Ｃ
Ｐ ． ３２
度
传
感
嚣
嚣
Ｓ １ ＨＴ ０是否正确讯
会使 串口复位 ： 当使 ＤＡ Ａ线处 于高 电平时 ， Ｔ 触发 Ｓ Ｋ９次以 Ｃ 上 （ ９次 ）并随后发一个前述的“ 含 ， 传输开始” 命令 。
３３ 温 湿 度 测 量 时 序 ．
０ ６
８
当单片机发出 了传输开始命令 ，且 Ｓ ＨＴ １ ０正确接收到温
李 志 强 ， 顺 ， 黄 郭华新
（ ． 阳师范学院， １衡 湖南 衡 阳 ４ ｌ ０ ；． ２ ０ ８２ 湖南省常宁市农业局 ， 湖南 常宁 ４ ｌ ０ ） ２ ０ ５
【 摘 要 】 介绍了 种基于Ｓ Ｔ ０ 度计的设计原理， 说明了 度计的电 一 Ｈ １ 温湿 详细 温湿 路结构、Ｈ １ 数据传输格式、 度、 ＳＴ０ 温
湿度数 据采集软件设 计。通过硬件 电路 设计和软件程序设 计并实施 实验的数字式温湿度 计具有智 能化 、 高精度 、 高可靠性等优势。
【 关键词 】 Ｓ Ｔ ０数字 温 湿度 Ｈ １； 式； 度； 【 中图分类号 】 Ｔ ２２ Ｐ１ 【 文献标识码 】 Ａ
SHT10 SHT11中文资料
可以使用标准的回流焊炉对SHT1x 进行焊接。传感 器完全符合IPC/JEDEC J-STD-020D 焊接标准，在最高 260℃温度下，接触时间应小于40 秒。
TP tP
Temperature
TL TS (max)
tL
图 6: 传感器电极的后面, 俯视图. No copper in this field
max 单位 0.01 14 °C bit °C °C °C °C 123.8 254.9 30 °C °F s °C/yr
典型值 最大值 典型值 最大值 典型值 最大值
可完全互换 -40 -40 (63%) 5 < 0.04
± 10 ±8 RH (%RH)
T (°C)
± 2.0
SHT10 SHT11 SHT15
± 3.0 ± 2.5
max 0.05 12
单位 %RH bit %RH %RH %RH %RH
参数 分辨率 1 精度 2 SHT10 精度 2 SHT11 精度 2 SHT15 重复性 互换性 工作范围 响应时间6 漂移
条件
min 0.04 12
typ 0.01 14 0.5 参见图 3 0.4 参见图 3 0.3 参见图 3 0.1
1.8
用于密封/包装的材质
许多材质吸收湿气并将充当缓冲器的角色，这会加 大响应时间和迟滞。因此传感器周边的材质应谨慎 选用。推荐使用的材料有：金属材料, LCP, POM (Delrin),PTFE (Teflon), PE, PEEK，PP, PB, PPS, PSU, PVDF,PVF。 用于密封和粘合的材质（保守推荐）：推荐使用充 满环氧树脂的方法进行电子元件的封装，或是硅树 脂。这些材料释放的气体也有可能污染SHT7x(见 1.3)。因此，应最后进行传感器的组装，并将其置 于通风良好处，或在50℃的环境中干燥24小时，以 使其在封装前将污染气体释放。
SHT10防护型温湿度传感器产品说明书
1应用范围
SHT10（SHT11、SHT15）防护型温湿度传感器采用原装进口温湿度测量元件(内置SHT10/11/15)为核心部件，具有非常高的一致性、可完全互换，全量程标定，两线数字输出，湿度精度可高达±2%RH。
铜烧结网的防护加强了探头的耐温、耐压、耐损能力，可广泛适用于农业温室大棚、花卉、苗圃、草坪，养殖、仓储等各种需要测量环境温湿度的场所。
2技术参数
¾湿度测量范围：0～100%RH
¾温度测量范围：-40～+123.8℃
¾湿度测量精度： ±4.5%RH
¾温度测量精度： ±0.5℃
¾响应时间：8s(tau63%)
¾低功耗 80μW(12位测量，1次/s)
3接线方式
航空插头的管脚定义与SHT10的管脚定义相同，具体如下：
红色线VCC-电源正极（航空插头管脚4）
黄色线GND-电源负极（航空插头管脚1）
绿色线DATA-数据（航空插头管脚2）
蓝色线SCK-时序（航空插头管脚3）
4产品外观如图
4芯航空插头接插件连接，轻松更换，轻松维护。
Sensirion SHTxx 湿度与温度传感器操作指南说明书
Handling InstructionsFor SHTxx Humidity and Temperature SensorsAbstractSensirion SHTxx are relative humidity and temperature sensors of high quality. For taking advantage of their outstanding performance some precautions must be taken during storage, assembly and packaging. Therefore, please read the following instructions carefully - preferably during design-in phase and before production release of the respective device. Special attention is required regarding the exposure to volatile organic compounds, i.e. high concentration and long exposure time to respective gases shall be avoided. Such conditions are known to occur in manufacturing environment and/or during storage. Therefore, proper handling and choice of materials are crucial. Applying sensors in the field in ambient environment is not critical.ApplicabilityThis document is applicable to all Sensirion SHTxx humidity and temperature sensors.ESD protectionThe sensor shall be protected from ESD (Electrostatic Discharge) and only be handled in ESD protected areas (EPA) under protected and controlled conditions (ground all personnel with wrist-straps, ground all non-insulating and conductive objects, exclude insulating materials from the EPA, operate only in grounded conductive floor, etc.). Protect sensor outside the EPA using ESD protective packaging.Protection against ESD is mandatory. Exposure to chemicalsHumidity and Temperature sensors are highly accurate environmental sensors and as such they are not ordinary electronic components. The opening in the package exposes the sensor to the environment and makes it susceptible to pollutants. While applying sensors in the field in ambient environment is not critical, pollutants are known to occur in manufacturing environments and during storage. Please carefully follow the guidelines in this application note to ensure that you can benefit of the sensor’s outstand ing performance.The sensor shall not get in close contact with volatile chemicals such as solvents or other organic compounds. Especially high concentration and long exposure must be avoided. Ketenes, Acetone, Ethanol, Isopropyl Alcohol, Toluene, etc. are known to cause drift of the humidity reading –irreversibly in most of the cases. Please note that such chemicals are integral part of epoxies, glues, adhesives, etc. and outgas during baking and curing. These chemicals are also added as plasticisers into plastics, used for packaging materials, and do out-gas for some period.Acids and bases may affect the sensor irreversibly and shall be avoided: HCl, H2SO4, HNO3, NH3etc. Also Ozone in high concentration or H2O2have the same effect and therefore shall be avoided. Please note, that above examples represent no complete list of harmful substances.The sensor shall not get in contact with cleaning agents (e.g. PCB board wash after soldering) or strong air blasts from an air-pistol (not oil-free air). Applying cleaning agents to the sensor may lead to drift of the reading or complete breakdown of the sensor.Ensure good ventilation (fresh air supply) to avoid high concentrations of volatile chemicals (solvents, e.g. ethanol, isopropanol, methanol, acetone, cleaning solutions, detergents…).Packaging and storagePrior to assembly or use of the sensors it is strongly recommended to store the sensors in the original sealed ESD bag at following conditions: Temperature shall be in the range of 10°C – 50°C (0 – 125°C for limited time) and humidity at 20 – 60%RH (sensors that are not stored in ESD bags).Store sensors in original, unopened ESD bag. Place additional stickers only on the outside of the ESD bag.Once sensors have been removed from the original ESD bag we recommend to store the individual sensors as well as devices with assembled sensors in metal-in antistatic shielded ESD bags. In particular, it is recommended not to use any adhesive or adhesive tapes to reseal the sensor bag after opening. Following ESD Bags can be recommended (no polluting effect on humidity sensor):ESD Bag Manufacturer ProductStroebel"Topshield" BagsSensors as a component or mounted into the final product shall not be packaged in outgassing plastic materials which could cause sensor pollution. Besides metal-in antistatic shielded ESD bags, paper or cardboards based packaging, deep drawn plastic trays (PE, PET, PP) may be considered. Do not use antistatic polyethylene bags (light blue, pink or rose color); be very careful with bubble foils and foams.Be careful about stickers present inside the packing (e.g. on the housing of the device). Sticker size should be kept to a minimum, and the sticky side shall fully adhere onto a surface.Please note that many packaging materials may be provided with additives (plasticizers) which may have a polluting effect on the sensor. Generally speaking, if a material emits a strong odour you should not use it. Additives may also be added to materials which are listed for recommended use. For high safety, device housing and shipment packaging must be qualified. Such a qualification test may contain exposure of the final device with sensor in its shipment packaging to temperature ≥65°C for at least 168 hours. (If shipping or storage conditions are expected to be harsh, the qualification test conditions for the packing material have to be customized.) The sensor reading then shall showno changed deviation against a reference compared to same measurements before the exposure.Do not use polyethylene antistatic bags (light blue, pink or rose color). Do not use adhesive tapes inside packaging.For guidance on simple and straight-forward testing of humidity sensors please consult the Testing Guide for humidity sensors.Assembly - SolderingFor soldering, standard reflow soldering ovens may be used. The sensors are designed to withstand soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260°C during up to 30sec for Pb-free assembly in IR/Convection reflow ovens (see Error! Reference source not found.).Make sure that maximum temperatures and exposure times are respected. In case the PCB passes through multiple solder cycles (as is the case for e.g. PCB that are assembled on top and bottom side), it is recommended to assemble the SHTxx only in the last solder cycle. This is to reduce risks of sensor pollution.Figure 1 Soldering profile according to JEDEC standard. T P ≤ 260°C and t P ≤ 30sec above 255°C for Pb -free assembly. T L < 220°C and t L < 150sec. Ramp-up rate <3°C and ramp-down rate < 6°C/sec for temperatures > T L .SHT31 – 500pcsInspectedT e m p e r a t u r eTimet P T PT L T S (max)t Lpreheatin liquid phaseThe use of “no clean” type ≥3 solder paste 1 is strongly recommended as no board wash can be applied to SHTxx humidity sensors. An appropriate amount of solder paste shall be used, to result in a stand-off height (clearance between the package body and any part of the substrate) of 50μm to 75μm. Please consult the appropriate sensor data sheet for device specific information on the metal land pattern and recommendations on solder paste printing stencils. Standard pick & place equipment and vacuum nozzles for standard QFN packages may be used for assembly of SHTxx and STSxx sensors.Manual soldering is not recommended. For rework soldering, contact time must be limited to 5 seconds at up to 350°C.Immediately after the exposure to high temperatures SHTxx humidity sensors may temporarily read a negative humidity offset (typ. -1 to -2 %RH after reflow soldering). This offset slowly disappears again by itself when the sensor is exposed to ambient conditions (typ. within 1-3 days). If RH testing is performed immediately after reflow soldering, this offset should be considered when defining the test limits.It is important to note that the diced edge or side faces of the I/O pads may oxidise over time, therefore a solder fillet may or may not form. Hence there is no guarantee for solder joint fillet heights of any kind.Assembly – OthersSensors in SMT packages are classified as Moisture Sensitivity Level 1 (IPC/JEDEC J-STD-020). It is recommended to process the sensors within 1 year after date of delivery.Before developing the assembly process, please read the User ’s Guide and the Datasheets carefully. In the following, crucial items are underlined plus additional items are given:No mechanical force shall be applied to any part of the sensor during assembly or usage.No board wash shall be applied to SHTxx humidity sensors. Therefore, and as mentioned in the previous section , it is strongly recommended to use “no -clean” solder paste.1 Solder types are related to the solder particle size in the paste: Type 3covers the size range of 25 – 45 µm as specified in IPC J-STD-005A .Do not apply board wash.For application in corrosive environment – such as condensed water or corrosive gases – it may be necessary to protect the electronic assembly including the soldered contacts of the sensor with a passivation. Such passivation may be achieved by conformal coating or by applying adhesive.Low viscose conformal coatings or potting materials may flow into the inside the sensor cap, cover the sensor element and thus make the humidity sensor inoperative. Use only high viscose conformal coatings or potting materials, or seal the interface between sensor cap and sensor PCB before applying conformal coating. In any case, covering the humidity sensor opening with any kind of coating must be avoided. Therefore, the top surface of the sensor should remain free of coating.If conformal coating is applied, the top surface of the sensor must remain free of coating.Solvent vapors are produced during curing and processing of the coating. Ensure good ventilation throughout the application, staging and curing to prevent pollution of the sensor. Ventilation shall be established in such a way that the concentration of these gaseous substances remains low, e.g. by using ovens with fresh air supply.XXXCoating thickness and curing times shall be chosen according to respective datasheets and application notes of the manufacturer. If a time frame for curing is provided it is recommended to apply the upper time limit. This is especially true if the PCB design features large components with undercuts where high layer thicknesses on/under components or drain-off edges can form. Please note that the tack-free state of the coating is no indication of full curing. For full curing refer to application notes of the manufacturer. Ensure process stability for coating thickness and apply corresponding safety margins for curing times.The following table lists conformal coatings which have been tested regarding pollution of the humidity sensorand are known to be suitable if applied and fully cured under good ventilation and according to respective datasheet.Conformal CoatingsManufacturer ProductPeters Elpeguard SL 1301 ECO-FLZ Electrolube AFA (Aromatic Free Acrylic) Coating Chase HumiSeal 1B51NSLUDow Corning Dow corning 1-2620Do not apply spray to unprotected sensor. Whenever using spray coating techniques (e.g. to apply varnish or conformal coating, etc.) the SHT3x with protective cover option can be used or the SHTxx sensor has to be covered by the adhesive tape to prevent coating of the humidity sensor opening. The following table lists adhesive tapes which have been tested regarding pollution of the humidity sensor and are known to be suitable.Adhesive TapesManufacturer Product3M Electrical Tape 92Do not apply any other adhesive tapes such as Scotch Tape, Sello Tape, Tesa Film, etc. In conjunction with the sensor, use only recommended Kapton® tape Electrical Tape 92 by 3M™.Regarding adhesives and encapsulants the material in the following tables may be used –according to respective datasheets, applied and fully cured in well ventilated environment (fresh air supply). Materials and brands not listed in the following tables may be harmful and shall be tested carefully before applying.Epoxy AdhesivesManufacturer ProductEPO-TEK H70E/SEPO-TEK T6067EPO-TEK 93-86Lord MD-130Eccobond E3503-1Ablebond 84-3Epoxy Glob Top EncapsulantsManufacturer ProductStycast 50300 / 50400 seriesHysol EO1061/EO1062Silicone AdhesivesManufacturer ProductRTV 6424 (Momentive)Dow Corning 732Silicone Glob Top EncapsulantsManufacturer ProductStycast S 7503Instant AdhesivesManufacturer ProductLoctite 401PUR (Polyutherane) Casting Compounds Manufacturer ProductPeters VU 4457-61Hot melts may absorb water and thus may have an impact on the response time of the sensor in the device. Therefore, hot melt shall be applied sparingly.The sensor shall be mounted into the device, if possible, after all materials that are used in the assembly process have completely cured or dried out. Otherwise ensure good ventilation (fresh air supply) in curing ovens and assembly lines.Prevent any dust or particles from entering the sensor opening (sensor performance may be affected).Wear clean gloves or finger cots while handling the sensor and avoid touching the sensor opening.Ensure recommendations in this application note are equally considered during repair and rework of assemblies containing sensors. During repair and rework, it may be recommendable to cover the sensor with Kapton tape (specific recommendation see above). Be particularly careful when using strong cleaning agents (e.g. detergents, alcohols, brominated or fluorinated solvents). Cleaning any part of a product might lead to high concentration of cleaning agents on the sensor. Please remove any sensors or devices containing sensors before cleaning the production area and tools. Ensure good ventilation (fresh air supply) and that any solvents have evaporated before resuming production.Prevent sensor from exposure to cleaning agents. Application in extreme environment Some applications require the exposure of humidity and temperature sensors to harsh environments. In many of the cases the sensor is uncritical to be used. However, some precautions must be taken.For exposure to extreme conditions with regards to humidity and temperature please consult the datasheet 275%RH can conveniently be generated with saturated NaCl solution. of respective product. Please make sure that exposure time of the sensor to maximum range of operating conditions is limited as given in datasheet. Exposure to volatile organic compounds at high concentration and long exposure time is critical not only in assembly but also in the field. Such application needs to be carefully tested and qualified.Exposure to acids or bases may be critical, too. In order to be critical, the concentration must be such that polymers are attacked. For bases there is a rule of thumb that pH<9 are uncritical. Etching substances such as H2O2, NH3, etc. at high concentrations are critical to the sensor, too.Corrosive substances at very low concentrations are not critical to the sensor itself. However, they may attack the solder contacts. Therefore, the contacts must be well protected (passivated) in case of an application to such environment –compare also Section “Assembly”. Application of Sensirion humidity and temperature sensors to harsh environment must be carefully tested and qualified. Sensirion qualifies its humidity and temperature sensors to work properly within ambient clean air – qualification for use in harsh environment is duty of the user of the sensor. Reconditioning procedureAs stated above extreme conditions or exposure to solvent vapors may offset the sensor. The following reconditioning procedure may bring the sensor back to calibration state:Baking: 100 – 105°C at < 5%RH for 10hRe-Hydration: 20 – 30°C at ~ 75%RH for 12h 2. DisclaimerThe above given restrictions, recommendations, materials, etc. do not cover all possible cases and items. The material recommendations are given with regard to pollution of SHTxx sensors and assume optimal processing for avoiding VOC in process – the materials were not tested regarding other properties like reliability, performance, usability or mechanical properties. The material recommendations have been compiled with our best knowledge at the time of writing. Manufacturers may change the compounds without notice, which can lead to reduced Sensor performance due to outgassing.This document is not to be considered complete and is subject to change without prior notice.Revision historyImportant NoticesWarning, Personal InjuryDo not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION shall be allegedly negligent with respect to the design or the manufacture of the product.ESD PrecautionsThe inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation, take customary and statutory ESD precautions when handling this product.See application note “ESD, Latchup and EMC” for more information.WarrantySENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product s hall be of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective, SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:•notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;•such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;•the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and•the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the intended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods. SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with the technical specifications.SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability, including without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be validated for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve reliability, functions and design of this product.Copyright© 2021, by SENSIRION. CMOSens® is a trademark of Sensirion. All rights reservedHeadquarters and SubsidiariesSensirion AG Laubisruetistr. 50CH-8712 Staefa ZH Switzerlandphone: +41 44 306 40 00 fax: +41 44 306 40 30 ****************** Sensirion Inc., USAphone: +1 312 690 5858*********************Sensirion Korea Co. Ltd.phone: +82 31 337 7700~3*********************/krSensirion Japan Co. Ltd.phone: +81 3 3444 4940*********************/jpSensirion China Co. Ltd.phone: +86 755 8252 1501*********************/cnSensirion Taiwan Co. Ltdphone: +886 3 5506701******************To find your local representative, please visit /distributors。
sht10温湿度传感器说明
4 在挥发性有机混合物中数值可能会高一些。见说明书1.3。 5 此数值为 VDD=5.5V 在温度为 25°C 时, 12bit 测量，1 次/秒条件下
的平均值
6 响应时间取决于传感器底层的热容和热阻。
Relative Humidity (%)
2.6 MAX 0.8 ±0.1
2.2 MAX
图1 SHT1x 传感器尺寸（1mm=0.039inch),“11”表示该传感 器型号为SHT11。 外部接口：1：GND, 2: DATA, 3: SCK, 4: VDD
每个传感器芯片都在极为精确的湿度腔室中进行标 定，校准系数以程序形式储存在OTP 内存中，用 于内部的信号校准。两线制的串行接口与内部的电 压调整，使外围系统集成变得快速而简单。微小的 体积、极低的功耗，使SHT1x 成为各类应用的首 选。
1.9 布线规则和信号完整性 如果SCK和DATA信号线相互平行并且非常接近， 有可能导致信号串扰和通讯失败。解决方法是在两 个信号线之间放置VDD和/或GND，将信号线隔 开，和使用屏蔽电缆。此外，降低SCK频率也可能 提高信号传输的完整性。如使用导线，应在电源引 脚（VDD，GND）之间加一个100nF的去藕电容， 用于滤波。此电容应尽量靠近传感器。详情可参阅
1.8 用于密封/包装的材质 许多材质吸收湿气并将充当缓冲器的角色，这会加 大响应时间和迟滞。因此传感器周边的材质应谨慎 选用。推荐使用的材料有：金属材料, LCP, POM (Delrin),PTFE (Teflon), PE, PEEK，PP, PB, PPS, PSU, PVDF,PVF。
用于密封和粘合的材质（保守推荐）：推荐使用充 满环氧树脂的方法进行电子元件的封装，或是硅树 脂。这些材料释放的气体也有可能污染SHT7x(见 1.3)。因此，应最后进行传感器的组装，并将其置 于通风良好处，或在50℃的环境中干燥24小时，以 使其在封装前将污染气体释放。
ShtXX系列介绍
ShtXX系列介绍SHTxx 系列产品是一款高度集成的温湿度传感器芯片，提供全量程标定的数字输出。
它采用专利的CMOSens? 技术，确保产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个电容性聚合体湿度敏感元件和一个用能隙材料制成的温度敏感元件，这两个敏感元件与一个14 位的A/D 转换器以及一个串行接口电路设计在同一个芯片上面。
该传感器品质卓越、响应超快、抗干扰能力强、极高的性价比。
每个传感器芯片都在极为精确的恒温室中进行标定，以镜面冷凝式露点仪为参照。
通过标定得到的校准系数以程序形式储存在芯片本身的OTP内存中。
通过两线制的串行接口与内部的电压调整，使外围系统集成变得快速而简单微小体积、极低功耗等优点使其成为各类应用中的首选。
相对湿度和温度测量特点露点测量全标定输出，无需标定即可互换使用卓越的长期稳定性两线制数字接口，无需额外电路基于请求式测量，低能耗表面贴片或4针引脚安装超小尺寸自动休眠超快响应时间应用领域暖通空调HVAC 汽车消费电子家用气象站湿度调节器_ 测试及检测设备数据记录仪自动控制家电产品医疗仪器型号测湿精度[%RH] 测温精度[℃] 封装SHT10 ±4.5 ±0.5℃在25℃SMD（LCC）SHT11 ±3.0 ±0.4℃在25℃SMD（LCC）SHT15 ±2.0 ±0.3℃在5~40℃SMD（LCC）SHT71 ±3.0 ±0.4℃在25℃4-PIN单排直插SHT75 ±1.8 ±0.3℃在5~40℃4-PIN单排直插框图性能指标电气特性接口说明电源引脚SHTxx 的供电电压为2.4~5.5V。
传感器上电后，要等待11m 来完成“休眠”状态。
在此期间无需发送任何指令。
电源引脚（VDD，GND）之间可增加一个100nF的滤波电容。
串行接口(两线双向)SHTxx 应用的的串行接口技术，在传感器信号读取及电源损耗方面都做了优化处理；但与I2C 接口不兼容，SHTxx 温湿度传感器注意事项1. 按引脚说明图连接电路。
温湿度传感器sht10程序
*p_checksum =s_read_byte(noACK); //read CRC校验码
return error;
}
//----------------------------------------------------------------------------------
for (i=0x80;i>0;i/=2) //高位为1，循环右移
{ if (i & value) DATA=1; //和要发送的数相与，结果为发送的位
else DATA=0;
SCK=1;
_nop_();_nop_();_nop_();
SCK=0;
}
DATA=1; //释放数据线
// DATA_IO=1;
char s_measure(unsigned char *p_value, unsigned char *p_checksum, unsigned char mode)
//----------------------------------------------------------------------------------
SCK=1;
error=DATA; //检查应答信号，确认通讯正常
SCK=0;
return error; //error=1通讯错误
}
//----------------------------------------------------------------------------------
//void init_uart(void)
SHT10详细介绍
读一个字节的数据，并且向传感器发 出一个字节的“已接收”信号
SCK_0; DATA_0; for(i=0;i<8;i++) //发送8位数据，丛机将在上升沿读取数据 { SCK_0; if(value&(0x80>>i)) DATA_1; else DATA_0; delay_little(); SCK_1; delay_little(); } SCK_0; //在接下来的上升沿读取从机发送的“已收到”信号。 DATA_SETINPUT; delay_little(); SCK_1; delay_little(); error = (DATA_IN?1:0); delay_little(); SCK_0; DATA_SETOUTPUT; return error;
几点说明
其中，RHlinear为25℃时相对湿度的线性 值，SORH为传感器输出的相对湿度的数 值,c1，c2，c3为系数，
几点说明
当测量温度与25℃相差较大时，则需要考 虑传感器的温度系数： 其中，RHtrue为温 度不等于25℃时相对湿度的实际值，θc为 当前温度，t1、t2是系数。
状态寄存器读写时序
状态寄存器位
几点说明
CRC一8校验。整个数据的传输过程都由8位校 验保证，确保任何错误的数据都能够被检测到并 删除。 为保持自身发热温升小于0．1℃ ，SHT10的激 活时间不超过l0% 。如12位精度测量，每秒最多 测量2次。 转换为物理量输出 相对湿度输出转换公式为：
几点说明其中rhlinear为25时相对湿度的线性值sorh为传感器输出的相对湿度的数值c1c2c3为系数几点说明当测量温度与25相差较大时则需要考虑传感器的温度系数
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Datasheet SHT1x (SHT10, SHT11, SHT15数字温湿度传感器• 完全标定• 数字信号输出• 低功耗• 卓越的长期稳定性• SMD 封装–适于回流焊接外形尺寸图 1 SHT1x 传感器尺寸(1mm=0.039inch,“ 11”表示该传感器型号为 SHT11。
外部接口:1:GND, 2: DATA, 3: SCK, 4: VDD传感器芯片此说明书适用于 SHT1x-V4。
SHT1x-V4 是第四代硅传感芯片,除了湿度、温度敏感元件以外,还包括一个放大器, A/D 转换器, OTP 内存和数字接口。
第四代传感器在其顶部印有产品批次号,以字母及数字表示,如“ A5Z ”,见图 1。
材质传感器的核心为 CMOS 芯片,外围材料顶层采用环氧 LCP ,底层为 FR4。
传感器符合 ROHS 和WEEE 标准,因此不含 Pb, Cd, Hg, Cr(6+, PBB, PBDE 。
实验包如要进行直接的传感器测量,传感器性能检验或者温湿度实验,客户可选用 EK-H2,其中包括传感器和与电脑配套的软、硬件。
如需进行更复杂的,要求更高的测量,可选用 EK-H3。
它可以同时进行 20个点的温湿度测量。
产品概述SHT1x (包括 SHT10, SHT11 和 SHT15 属于 Sensirion 温湿度传感器家族中的贴片封装系列。
传感器将传感元件和信号处理电路集成在一块微型电路板上,输出完全标定的数字信号。
传感器采用专利的 CMOSens® 技术,确保产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个电容性聚合体测湿敏感元件、一个用能隙材料制成的测温元件,并在同一芯片上,与 14 位的 A/D 转换器以及串行接口电路实现无缝连接。
因此,该产品具有品质卓越、响应迅速、抗干扰能力强、性价比高等优点。
每个传感器芯片都在极为精确的湿度腔室中进行标定,校准系数以程序形式储存在 OTP 内存中,用于内部的信号校准。
两线制的串行接口与内部的电压调整,使外围系统集成变得快速而简单。
微小的体积、极低的功耗,使 SHT1x 成为各类应用的首选。
SHT1X 提供表贴 LCC 封装,可以使用标准回流焊接。
同样性能的传感器还有插针型封装 (SHT7X 和柔性 PCB 封装(SHTA1。
Datasheet SHT1x传感器性能相对湿度参数条件 mintypmax 单位分辨率 1 精度 2 SHT10 典型值±4.5 最大值见图 2 精度 2 SHT11 典型值 ±3.0 最大值参见图 2 精度 2 SHT15 典型值 ±2.0 最大值参见图 2 重复性 ±0.1 互换性可完全互换迟滞 ±1 非线性原始数据 ±3线性化后响应时间3 τ (63% 工作范围漂移 4常规SHT11SHT15SHT10± 0± 2± 4± 6± 8± 100102030405060708090100Relative Humidity (%RH∆R H (%R H图 2: 25°C 时每种型号传感器的相对湿度最大误差电气特性参数条件mintypmax 单位供电电压功耗 5 休眠状态测量状态平均通讯 2线制数字接口 , 参见通讯存储条件10 – 50°C (0 – 125°C peak, 20 – 60%RH1传感器默认测量分辨率为温度 14位,湿度 12位。
可以通过给状态寄存器发送命令将其降低为温度 12位,湿度 8位。
2 此精度为出厂检验时,传感器在 25°C (77°F 和 3.3V. 条件下测试的精度指标,其不包括迟滞和非线性,且只适于非冷凝环境。
温度参数条件 mintypmax 单位分辨率 1 精度 2 SHT10 典型值±0.5 最大值参见图 3 精度 2 SHT11 典型值 ±0.4 最大值参见图 3 精度 2 SHT15 典型值 ±0.3 最大值参见图 3 重复性 ±0.1 互换性可完全互换工作范围响应时间6 τ (63% 漂移SHT11SHT10± 0.0± 0.5± 1.0± 1.5± 2.0± 2.5± 3.0-40-2020406080100Temperature (°C∆T (°C图 3: 每种型号传感器的温度最大误差包装4 在挥发性有机混合物中数值可能会高一些。
见说明书 1.3。
5 此数值为VDD=5.5V 在温度为 25°C时 , 12bit 测量, 1次 /秒条件下的平均值传感器型号包装数量订货号SHT10条带和卷轴 SHT11条带和卷轴条带和卷轴条带和卷轴 SHT15 条带和卷轴条带和卷轴020406080100-40-20020406080100120Temperature (°CR e l a t i v e H u m i d i t y (%图 4: 工作条件1.2 焊接说明可以使用标准的回流焊炉对 SHT1x 进行焊接。
传感器完全符合 IPC/JEDEC J-STD-020C 焊接标准,在最高 260℃温度下,接触时间应小于 40 秒。
图 5 :JEDEC 标准的焊接过程图, Tp<=260℃ , tp<40sec ,无铅焊接。
T L <220℃ ,t l <150sec,焊接时温度上升和下降的速度应小于 5℃/sec。
在蒸气回流焊炉中条件为 TP<233℃ ,tp<60 秒,焊接时温度上升和下降的速度应小于 10℃ /秒。
手动焊接,在最高 350℃ 7的温度条件下接触时间须少于 5 秒。
7233℃相当于 451℉, 260℃相当于 500℉, 350℃相当于 662℉注意 : 回流焊焊接后,将传感器在 >75%RH的环境下存放至少 12小时,以保证聚合物的重新水合。
否则将导致传感器读数的漂移。
不论在哪种情况下,无论是手动焊接还是回流焊结,在焊接后都不允许冲洗电路板。
所以建议客户使用“免洗”型焊锡膏。
如果将传感器应用于腐蚀性气体中,引脚焊盘与 PCB 都需要被封装起来以避免接触不良或短路。
对于 SHT1X 的引脚排列,建议使用图 7 的尺寸。
传感器衬底外镀30μm 的铜, 5μm 的镍和0.1μm 的金。
图 6: Rear side electrodes of sensor, view from top side.图 7: 推荐 SHT1x 引脚尺寸 . 单位 mm.1.3 存储条件与操作说明湿度传感器不是普通的电子元器件,需要仔细防护,这一点用户必须重视。
长期暴露在高浓度的化学蒸汽中将会致使传感器的读数产生漂移。
因此建议将传感器存放于原包装包括封装的 ESD 包内,并且符合以下条件:温度范围 10℃ -50℃(在有限时间内 0-125℃;湿度为 20-60%RH(没有 ESD 封装的传感器。
若传感器没有原包装,则需8Datasheet SHT1x在生产和运输过程中,要保证传感器远离高浓度的化学溶剂。
要避免使用挥发性胶水、粘性胶带、不干胶贴纸,或具有挥发性的包装材料,如发泡塑料袋、泡沫塑料等。
生产场合需要保持通风。
详细信息请参考“操作说明”或联系我们。
1.4恢复处理暴露在极端工作条件或化学蒸汽中的传感器,可通过如下处理,使其恢复到校准状态。
烘干:在 100-105℃和 < 5%RH 的湿度条件下保持10小时;重新水合:在 20-30℃和 >75%RH 的湿度条件下保持 12 小时 9。
1.5温度影响气体的相对湿度,在很大程度上依赖于温度。
因此在测量湿度时,应尽可能保证所有测量同一湿度的传感器在同一温度下工作。
在做测试时,应保证被测试的传感器和参考传感器在同样的温度下,然后比较湿度的读数。
如果 SHT1x 与易发热的电子元件在同一个印刷线路板上,在设计电路时应采取措施尽可能将热传递的影响减小到最小。
如:保持外壳的良好通风,SHT1x 与印刷电路板其它部分的铜镀层应尽可能最小,或在两者之间留出一道缝隙。
(见图 8图 8: SHT1x 俯视图, PCB 板的开口可避免导热此外,如果测量频率过高则会导致传感器自身发热,详细信息请参考 3.3 节。
8例如, 3M 防静电包,“ 1910”带拉链975%RH 的湿度场可以很便利的由 NaCl 饱和盐溶液制得,100-105℃对应于 212-221℉, 20-30℃对应于 68-86℉。
1.6光线SHT1x 不受光线影响。
但长时间暴露在太阳光下或强烈的紫外线辐射中,会使外壳老化。
1.7保护膜SHT1x 的敏感元件部位直接与空气接触,没有保护膜。
如果在外面加保护膜可防止灰尘和水滴进入以保护传感器,同时会降低渗入传感器内部的化学蒸汽的浓度。
为了避免加保护膜对响应时间的影响,保护膜后面的空气体积应尽可能减小。
对于 SHT1X 封装系列,盛世瑞恩推荐使用配套的 SF1型过滤罩,达到 IP54 保护等级。
(若需要更高的防护等级, 如 IP67, SF1 必须用环氧树脂封装在 PCB 板上。
见图 9。
图 9:Side view of SF1 filter cap mounted between PCB and housing wall. Volume below membrane is kept minimal.1.8用于密封 /包装的材质许多材质吸收湿气并将充当缓冲器的角色,这会加大响应时间和迟滞。
因此传感器周边的材质应谨慎选用。
推荐使用的材料有:金属材料 , LCP, POM (Delrin,PTFE (Teflon, PE, PEEK, PP, PB, PPS, PSU, PVDF,PVF。
用于密封和粘合的材质(保守推荐:推荐使用充满环氧树脂的方法进行电子元件的封装,或是硅树脂。
这些材料释放的气体也有可能污染 SHT7x(见 1.3 。
因此,应最后进行传感器的组装,并将其置于通风良好处,或在 50℃的环境中干燥 24小时,以使其在封装前将污染气体释放。
1.9布线规则和信号完整性如果 SCK 和 DATA 信号线相互平行并且非常接近, 有可能导致信号串扰和通讯失败。
解决方法是在两个信号线之间放置 VDD 和 /或 GND ,将信号线隔开,和使用屏蔽电缆。
此外,降低 SCK 频率也可能提高信号传输的完整性。
如使用导线,应在电源引脚(VDD , GND 之间加一个 100nF 的去藕电容, 用于滤波。
此电容应尽量靠近传感器。
详情可参阅Datasheet SHT1x“ESD, Latchup and EMC” 应用说明。