Resistor.Today-RPM600系列SOT-227封装平面无感功率电阻规格书

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汽车电线标准

汽车电线（国标生产）名称型号特性工作温度'C 普通聚氯乙烯绝缘低压电缆QVR 普通型-40 〜+80耐热聚氯乙烯绝缘低压电缆QVR-105 良好的耐热性能-40 ~ +105聚氯乙烯绝缘聚氯乙烯护套电缆QVVR 一一聚氯乙烯-丁睛复合物绝缘低压电缆QFR 一-40 ~ +70 国家机械行业标准：JB/T 8139-1999 公路车辆用低压电缆（电线）QVR型汽车电线：普通聚氯乙烯绝缘低压电缆产品特性：导体符合JB/T 8139的要求，由符合GB 3953要求的软铜线绞合而成产品示意图:产品性能符合JB/T 8139要求产品结构标称截面导体结构标称绝缘厚度电线最大外径mrh 根数/直径mm mm0.2 12/0.15 0.3 1.30.3 16/0.15 0.3 1.40.4 23/0.15 0.3 1.60.5 16/0.20 0.6 2.40.75 24/0.20 0.6 2.61.0 32/0.20 0.62.81.5 30/0.25 0.6 3.12.5 49/0.25 0.73.74.0 56/0.30 0.8 4.56.0 84/0.30 0.8 5.110.0 84/0.40 1.0 6.7QVR-105型汽车电线：耐热聚氯乙烯绝缘低压电缆产品示意图:产品特性：导体符合JB/T 8139的要求，由符合GB 3953要求的软铜线绞合而成产品性能符合JB/T 8139要求。

产品结构：产品示意图:产品特性：导体符合 JB/T 8139的要求，由符合 GB 3953要求的软铜线绞合而成产品性能符合JB/T 8139要求产品结构：标称截面导体结构标称绝缘厚度标称护套厚度电缆最大外径mrh根数/直径mmmmmm mm 1X 2.5+6 X 1.5 49/0.25+30/0.250.5(2.5 mm 2)0.6(1.5 mm 2)1.513.5QFR 型汽车电线：聚氯乙烯-丁睛复合物绝缘低压电缆产品示意图:聚氯匕烯-F 轻50.0 396/0.40 1.5 13.7 70.0 360/0.50 1.6 15.7 95.0475/0.501.618.2QVVR 型汽车电线：聚氯乙烯绝缘聚氯乙烯护套低压电缆产品特性：导体符合 JB/T 8139的要求，由符合GB 3953要求的软铜线绞合而成产品性能符合JB/T 8139要求。

Resistor.Today-RPM300系列SOT-227封装平面无感功率电阻规格书

4-M4
4-4.2
4-4R
10.0 11.8
15.0 30.0 38.0
13.0 25.0
外壳填充物电阻元素引脚导体氧化铝基板铜法兰
引脚方式
4
3
R1
4
3
R1
4 R1 3
1
2
RPM300X
1
2
RPM300Y
1
2
RPM300Z
脉冲功率 (kW)
额定功率％
100 80 60 40 20 0 -50 0
选型表
选型示例：RPM300YJ10R0S (RPM300, 引脚方式为Y, 10R, ±5%)
R PM3 0 0 Y J 1 0 R 0 S
系列号 RPM300
引脚方式
X=1-2 Y=1-3 Z=14-23
精度 F=±1% J=±5%
阻值
R100=0.1R 1K00=1000R 1R00=1R 10K0=10000 10R0=10R 100K=100000R 100R=100R 1M00=1000000R
RPM300
平面无感功率电阻
SOT-227封装，厚膜技术，氧化铝基板功率可达300W，热阻0.23℃/W，最大工作电流100A
使用厚膜电阻技术的SOT-227封装功率电阻
R P M 3 0 0系列产品使用金属化厚膜电阻技术，在散热良好的情况下额定功率高达3 0 0 W，阻值范围是0 . 1 - 1 M Ω，温飘为 ±1 0 0 p p m，精度为 ±1 %， ±5 %。提供多种引脚方式，满足客户不同需求。该系列同时具有极好的抗脉冲能力和低电感特性。广泛应用于铁路，新能源，电力和医疗等领域。

Resistor.Today-RPK900系列SOT-227封装平面无感功率电阻规格书

规格和参数
系列功率阻值范围阻值标准温飘可选精度电阻技术
RPK900 900W 25R-1K
E24阻 0.11℃/W
绝缘电压 2500VAC
最大工作电流
100A
工作温度 -55~+155℃
频率特性
并联电容串联电感
15pF
15nH
尺寸单位：mm
4-M4.0 2-4.20+/-0.1 dia.
电阻温度℃
160 140 120 100 80 60 40 20
0 0 200
电阻温度
法兰温度 400 600 800 1000 1200
功率 (W)
脉冲功率 (kW)
100
引脚方式
4
3
R1
4
3
R1
4 R1 3
1
2
RPK900X
1
2
RPK900Y
1
2
RPK900Z
10
1
0.1
0.01 10ns 100ns 1us 10us 100us 1ms 10ms 100ms 1s 脉冲宽度 (占空比 0.01)
RPK900
平面无感功率电阻
SOT-227封装，金属化薄膜技术，无感设计，氮化铝基板功率可达900W，热阻0.11℃/W，最大工作电流100A
使用金属化薄膜技术的平面无感功率电阻
R P K 9 0 0系列产品使用金属化薄膜技术，阻值范围2 5 R - 1 K Ω ，在散热良好的情况下可以达到9 0 0 W的额定功率。该系列同时具有极好的抗脉冲能力和低电感特性。广泛应用于铁路，新能源，电力和医疗等领域。

ACPL227 光耦

LEAD FREE
1.27 ±0.25 0.050 ±0.010
DATE CODE
PIN ONE
A227V YYWWA
VDE option only
4.40 ±0.20 0.173 ±0.008
0.030
0.75
0.75 0.030
5.20 ±0.30 0.205 ±0.012
RANK
5.30 ±0.3 [0.208 ±0.012]
Example 1: ACPL-227-56CE to order product of Dual Channel SO-8 Surface Mount package in Tape & Reel with IEC/EN/DIN EN 60747-5-2 Safety Approval, 200%<CTR<400% and RoHS compliant.
10V, IC = 2mA, RL= 100:) x SO package x CMR 10kV/μs (typical) x Safety and regulatory approvals
- cUL - IEC/EN/DIN EN 60747-5-2 x Options available: – CTR Ranks 0, B & C for ACPL-227 and Rank 0 only for
0.20 ±0.05 0.008 ±0.002
0.12 ±0.10 0.005 ±0.004
0.079 ±0.008
2.00 ±0.20
0.40 ±0.10 0.016 ±0.004
DIMENSIONS IN MILLIMETERS [INCHES]
ACPL-247 PACKAGE OUTLINE

日Cred要迪3的迪电footer的迪迪面答1说明书

Portfolio of ProductsThermal Interface Materials for Today's ElectronicsKEEP COOL – PERFORM BETTER.As an advanced materials supplier, Honeywell hasbeen meeting the application needs of electronic device manufacturers for more than 50 years, and we continue to provide vital materials for thermal management solutions across multiple industries.HONEYWELLTHERMAL INTERFACESOLUTIONSOVERVIEWSELECTION GUIDECONTENTSOverview Selection Guide3Honeywell Strength & Advantages 4Targeted Materials 5Phase Change Materials 6Thermal Gap Pads 8Thermal Putty Pads 10Thermal Insulators 11Thermal Grease 12One-Part Hybrid 14Two-Part Hybrid 16SOLVING INCREASINGTHERMAL CHALLENGES FOR TODAY AND TOMORROWOur ongoing investment in research for more advanced materials has resulted in breakthroughs for key applications: thermal interface materials (TIMs) such as phase change materials, and low alpha particle materials for electrical interconnect.The modern electronics industry is constantly advancing toward higherpower consumption and more integratedHoneywell TIMs are based on proprietary technologies of polymer matrices andthermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownershipfunctions and miniaturization, resulting in a sharp increase in the power density of modern electronic devices. In fact, we have entered the era of 5G.Therefore, efficient heat dissipation has become an even more critical requirement for the design of modern electronic packages. Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips.A FOUNDATION OF EXPERTISEHoneywell's commitment to advanced materials research is evidenced by its three global centers for excellence in the US and China.Whether adapted from our extensive portfolio of proven materials, or created for a specific customer, all Honeywell products undergo rigorous research, testing and quality control protocols.For over half a century, Honeywell has been a keysupplier to the worldwide electronics industry, providing critical materials to enhance the performance and reliability of our customers’ products.HONEYWELL STRENGTHDETERMINING YOUR TIM REQUIREMENTSThe role of Thermal Interface Materials is to dissipate heat as quickly and effectively as possible from the device. But not all devices are the same. Requirements are driven by product use, product life cycle, packaging design, and operating conditions.Thermal PerformanceIncreasing power densities are raising device temperatures — requiring more effective TIM solutions that mustdeliver low thermal impedance and high bulk conductivity. Reducing operating temperature can reduce device throttling, while increasing efficiency and design flexibility.Product Life Cycle & Reliability Mobile products such as tablets and smartphones have a relatively short product life, but still require thermalmanagement to protect from extreme and sudden bursts of energy and temperature spikes.Conversely, automotive, power and server products must remain robust for significantly longer product life cycles.These applications involve harsh operating conditions such as extreme heat and humidity, which must be taken intoaccount in choosing the best TIM material. The key requirement in these applications is not just immediate performance but also sustained, long-term thermal stability.Gaps & Bondline ThicknessIC designers are continually looking for ways to achieve more processing power in less space. Additionally, high power devices with dedicated heat sinks aim to achieve an extremely thin TIM bond line with low thermal impedance and a reduced thermal path. To add to the complexity, chip-scale packages assembled on a PC board will share the same heat spreader but will have different heights with varying gaps, requiring a TIM that delivers both thermal and compressible properties. Taking all this into consideration, it is important for today’s TIMs to provide effective thermal management inincreasingly constrained environments and different assembly designs.TARGETED MATERIALSOUR APPROACHWe have designed our products to optimize thermal impedance. This means that we look at the entire thermal path, not just the TIM itself. This includes the material interfaces, the thermal expansion of the joining interfaces, contact resistance and bond line thicknesses.Our portfolio of materials dissipate heat away from the IC, in an appropriate way for the device structure, packaging design and application. The design of Honeywell’s phase change materials (PCMs) is drivenIn addition to our phase change materials, we offer a variety of products with high thermal conductivity and high compress-ibility, including thermal gap pads, Thermal Hybrid, thermal grease, thermal insulators, and more.Honeywell’s application support experts can help you choose the correct thermal interface solutions for your product — taking into account its design, usage and life cycle.by an innovative polymer technology and advanced filler systems, which can be customized to fit diverse product applications and end uses.Smartphones and tablets experience sudden temperature spikes, requiring very high thermal performance, while power electronics in automobiles need extreme thermal stability to meet warranties that stretch over long lifetimes. Our TIMs portfolio is designed to meet these varying needs and more.Honeywell’s research and development center in Shanghai, China.THERMALPHASE CHANGE MATERIALSPhase change materials (PCM) are often used as matrix materials for thermal interface applications, because they aresolid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bondline and high reliability without pump-out issues.Recommended ApplicationClamping pressure and temperature aresuggested to achieve a minimum bondline thickness, typically less than 1.5 mil(0.038mm) for best thermal performance.Storage & UseShelf Life: 12 months at 23±2˚CAvailabilityPCM material is available in both sheetand roll formats. Stencil printable (SP)material is available in 300cc syringesor 1kg jars.Thickness Range: 0.2mm–1.0mm(PTM7950 is only available in 0.25mmthickness)Thickness Tolerance:±0.075mmTYPICAL PROPERTIESPROPERTYDESCRIPTIONLTMSERIESPCM45FSERIESPTM5000SERIESPTM6000SERIES*PTM7000SERIESTESTMETHOD*PTM6000 ha s higher reliab ility than PTM5000 SeriesIncreasing TemperatureTheoretical Curve:PCM Viscosity vs. TemperatureViscosity Solid Liquid/Gel State• Optimal surface wetting• Low contact resistance• Low thermal impedancePhase ChangeTemperaturePCM PERFORMANCETHERMALLY CONDUCTIVEPHASE CHANGE MATERIALFor many applications, the Honeywellsolution, which adds a TC filler to the PCMmatrix, forms a phase change compositewith high heat transfer performance thatsolves these pump-out issues.Honeywell offers both pad and pasteformats for its thermally conductive PCM.These products were designed to minimizethermal resistance at interfaces andmaintain stable performance through therigorous reliability testing required for longproduct life applications.Based on a robust polymer PCM structure,this material exhibits effective wettingproperties during typical operatingtemperature ranges, resulting in very lowsurface contact resistance. The proprietarymaterial provides superior reliability andmaintains low thermal impedance, makingPCM desirable for high-performanceintegrated circuit devices.Honeywell offers PCM in both padand paste formats.For almost 20 years, PCM products havebeen a Honeywell mainstay for thermalsolutions in a wide variety of applications.PCM paste is well-suited for the stencilprinting application process.THERMAL GAP PADSHoneywell Thermal Gap Pads (TGPs) provide high thermalperformance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance.1Typical ValueTHERMALLY CONDUCTIVE, HIGH BREAKDOWN VOLTAGE GAP PADTGP8000HV is a Thermal Gap Pad which offers a strong combination of low thermal impedance, high breakdown voltage and ease of use across a widevariety of applications. The naturally tacky property means there is no need for an additional adhesive, which could inhibit thermal performance. Available formats for TGP8000HV include standard sheets and custom die-cut parts in a range of thicknesses.Applications & FeaturesIn addition to the features of the TGP1200- TGP8000 line, TGP8000HV is effective for applications that require high break-down voltage.TGP8000HV TYPICAL PROPERTIESPROPERTYTGP8000HV TEST METHODTHERMALLY CONDUCTIVE, HIGH COMPRESSIBILITY GAP PADHoneywell TGP models provide thermal performance with ease of use across a multitude of applications. They have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. A range of thicknesses from 0.5mm to 5.0mm are available. Honeywell TGP models come with two surface liners, which enables users to remove the liner after installation (before operation), with no contaminantrisk and easier handling.Storage & UseShelf Life: 12 months at 23±2˚C Thickness Range:0.5-5.0mm with 0.25mm incremental Thickness Tolerance:>1mm, ±10%0.5-1mm, ±0.1mm <0.5mm, ±0.05mmPlease check thickness availability before ordering.Honeywell TGP model gap pads are available in standard sheets and also custom die-cut parts, and in a range of thicknesses.Two surface liners enable easier handling with less contamination risk.2Thickness range: 0.5-5.0mm with 0.25mm incremental Low hardness provides excellent surface wetting and high compressibility.The low oil-bleeding property protects components from contamination.THERMALPUTTY PADSTYPICAL PROPERTIESPROPERTYTGP 3500PTTGP 6000PTTGP 8000PTTEST METHODTHERMAL INSULATORSHIGH THERMAL CONDUCTIVITY, ELECTRICAL INSULATIONTIP1500 combines 1.5 W/m·K, and TIP3500 combines 3.5 W/m·K thermal conductivity, with superior insulation. TIP1500 and TIP3500 are designed to be soft and conformal, which providesexcellent mating surfaces for low-pressure mounting. TIP1500 is offered in 0.19 and 0.23mm thickness. TIP3500 available thicknesses range from 0.25mm to0.50mm.The TIP series provides low thermal impedance and high insulation for highpower and high voltage applications.TYPICAL PROPERTIESPROPERTYTIP1500TIP3500TEST METHODStorage & UseShelf Life: 12 months at 23±2˚CConfigurations AvailableSheet form and die-cut partsHoneywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances.HIGH THERMAL CONDUCTIVITY, HIGH COMPRESSIBILITY, THERMAL PUTTY PADSpecial surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink. Thermal putty pads are available in thicknesses ranging from 0.5mm to 5.0mm.Storage & UseShelf Life: 12 months at 23±2˚CTIP1500, TIP3500The TIP series is Honeywell’s latest high-performance thermal conductivity and insulation material. It is made with silicon resin as the matrix, reinforced with glass fiber as the substrate.TGP putty pad materials are ideal for applications with large dimensional variations between surfaces.1Thickness range: 0.5-5.0mm with 0.25mm incremental 2Thickness tolerance: TIP1500: ±0.01mm, (±0.02mmTHERMAL GREASEHoneywell silicone grease products provide superiorthermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing.TYPICAL PROPERTIESPROPERTYTG2000ITG2800ITG3000TG3000I TG4000TG5500TEST METHODHIGH THERMAL CONDUCTIVITY THERMAL GREASEThermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, therefore greatly increasing thermal transfer efficiency.Silicone thermal grease is a composite containing silicone and inorganic or metal nanomaterials with high thermal conductivity. Compared with thermal pads or liquid gap fillers, grease has the lower viscosity, and it can be used by dispense or screenprint, forming a thinner thermal conductivity layer with high thermal conductivity performance.Honeywell thermal greases are designed to minimize thermal resistance at inter-faces, and maintain excellent performance through reliability testing. TG seriesproducts are offered with varying thermal impedance and thermal conductivityproperties to complement different power densities in real applications. Products are also available in a range of bondline thicknesses (BLT) to meet variations ininterface flatness.Storage & UseShelf Life: 12 months at 23±2˚CLow viscosity and excellent thixotropy make thermal grease appropriate for large-scale production.Honeywell thermal grease remainsstable under room temperature storage.Packaging availability:0.5kg can, 1kg can, 5 gallon pailONE-PART, DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL HYBRID Hybrid is a substance between liquid and solid, combining the advantagesof thermal grease and thermal gap pad, without the potential problems of either. Thermal Hybrid is prepared as a silicone polymer, with low molecular siloxane, and mixed with high thermal conductivity particles (such as alumina, aluminum nitride powder, etc.).Compared with thermal grease, the main difference is that thermal Hybrid does not present oil separation issues while in storage, and the Hybrid can be torn offand reused. Thermal Hybrid only needsa relatively low working pressure whenconnected with heat sink and chip, andhas a wide working temperature range.The HT series, our one-part Gap Filler,provides effective thermal propertiesand high conformability along with itshigh compressibility. It is formulated todeliver high dispense rates for improvedproductivity, long-term reliabilityperformance and easy re-workability. It isdesigned to minimize thermal resistanceat interfaces, maintain its performancethrough reliability testing, and providescalable application at a competitivecost. All HT series products are availablein 280cc aluminum cartridge, and 1 and5-gallon pail.Thermal conductivity liquid gap fillers not only have the benefitsof shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.*Contact Hon eywell for late st information.One-part thermal Hybrid offer gooddispensing and thixotropy propertiesfor automated assembly processes.Honeywell’s thermal Hybrid materialsprovide good surface wetting withoutslump after dispensing.A large selection of packaging options isavailable for our one-part and two-partthermal Hybrid products.Hybrid thermal interface materialsoffer a variety of options for dispensing methods, depending on the application.HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage.TWO-PART, DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL HYBRIDPrior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.The product can be cured in a short time after two-component mixing at room temperature. The high compressibilityminimizes thermal resistance at interfaces, while maintaining excellent performanceduring reliability testing.The recommended modified viscosity and cure schedule meets large-scale application requirements.*Contact Hon eywell for late st information . ** Brookfield Viscometer, #7 spindle, 10r pmStorage & UseShelf Life: 6 months at 23±2˚CAvailabilitySyringes—200+200cc Jar—1+1gal, 5+5gal On requestState-of-the-art two-part Hybrid with high thermal conductivity for high power density applications.DEVELOPMENT ANDMANUFACTURING LOCATIONSUnited StatesSanta Clara, California Sunnyvale, California Spokane, Washington Chandler, Arizona Salt Lake City, Utah Bryan, Texas Mansfield, TexasFombell, PennsylvaniaEuropeSeelze, GermanyAsiaShanghai, China Jincheon, Korea Yaita, JapanChonburi, ThailandHONEYWELL ADVANTAGES Quality• Industry-leading reliability over device lifetime• More than twenty years specializing in TIM materials R&D and manufacturing • Proprietary formulations optimized for the needs of specific applications • Proven, long-standing supplier with multiple worldwide quality certificationsCustomer Focused• Serving diverse range of customers • TIMs offered in a wide range of thermal conductivity and application forms • Superior global technical support • Portfolio of other materials, such as thermal spreaders, electrical interconnect and pure metalsEEE EResearch & Development Site Manufacturing SiteGLOBAL SUPPORTFor More Information Honeywell Electronic Materials USA: 509.252.2102China: 400.840.2233 Germany: 49.5137.999.9199 Japan: 81.3.6730.7092 Korea: 82.2.3483.5076 Singapore: 65.6580.3593 Taiwan: 886.3.6580300 ext.312Although all statements and information contained hereinare believed to be accurate and reliable, they are presented without guarantee or warranty of any kind, express or implied. Information provided herein does not relieve the user from the responsibility of carrying out its own tests and experiments, and the user assumes all risks and liability for use of the information and results obtained. Statements or suggestions concern-ing the use of materials and processes are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all toxicity data and safety measures are indicated herein or that other measures may not be required.Brochure 10-2019-R1©2019 Honeywell International Inc.。

Resistor.Today-PZFR系列精密箔电阻规格书

PZFR精密箔技术贴片电阻高精密表贴电阻，金属箔技术，最高工作温度+175°C温飘±2ppm/°C ，最高精度±0.01%，高耐湿能力，天然低噪声抗脉冲能力强，抗静电，极好货架寿命及负载寿命高精密和高稳定性应该一起来讨论才具有实际的意义。

无论是膜式的电阻还是合金的电阻，通过精密的调阻工艺都可以达到很高的初始精度。

但电阻在使用前要经过运输，存储，焊接等过程，这些过程都会造成电阻阻值的变化。

另外电阻需要在不同的环境温度下工作，同时加载功率也会使电阻产生自热，这些因素都会使阻值发生不可逆的变化。

高精密的电阻必须同时具有高稳定性的特点。

电阻的稳定性比初始精度更重要最快24小时交货，无最小起定量限制开步电子常备箔电阻芯片，可以满足小批量快速交付。

从用户下单到发货最快24小时完成，1且不设最小订购量，即使1片也可以订购。

每只箔电阻出厂前都经过严格的测试程序，确保符合性能指标。

不受阻值标准约束，可任意定义需要的阻值每只箔电阻都要经过调阻，通过切断边缘区域的调阻带从而增加阻值，达到调整阻值的目的。

和其他电阻不同，用户可以任意的定义阻值，不受标准阻值的约束，比如1.234欧。

备箔芯片库存可以在关注“开步电子微服平台”，进入箔电阻库存查询。

常① 根据不同的使用温度范围，我们可以定制最低+/-1ppm 的温飘。

PZFR精密箔技术贴片电阻额定功率%环境温度°C1007550250-55°C +70°C-75-50-250+25+50+75+100+125+150+175在需要选择一个具有长期稳定性的电阻的时候，几个因素需要被考虑。

这些因素包括：温度系数（TCR ）, 功率系数（PCR ）, 负载寿命，寿命末期精度，噪声，热电势，抗静电能力。

PZFR 系列箔电阻基于全新的Z1箔技术生产，Z1箔技术在原有Z 箔技术的基础上改进了绑定层和保护层，极大的改善了电阻的稳定性和耐湿能力，使得该电阻可以在很宽的温度范围内工作。

IXYS CORPORATION XPTTM 600V IGBT 数据手册说明书

XPT TM 600V IGBT GenX3TMCES I C110= 75A V CE(sat) ≤ 2.3V t fi(typ)= 75nsG = GateC = Collector E = Emitter Tab = CollectorTO-247 ADExtreme Light Punch Through IGBT for 20-60 kHz SwitchingFeaturesz Optimized for 20-60kHz Switching z Square RBSOAz Avalanche Capability z Short Circuit CapabilityzInternational Standard PackageAdvantagesz High Power Density z 175°C Ratedz Extremely RuggedzLow Gate Drive RequirementApplicationsz Power Inverters z UPSz Motor Drives z SMPSz PFC Circuits z Battery Chargers z Welding Machines zLamp BallastsSymbol Test Conditions Characteristic Values (T J = 25°C, Unless Otherwise Specified) Min. Typ. Max.BV CES I C = 250μA, V GE = 0V 600 VV GE(th)I C= 250μA, V CE = V GE3.05.5VI CES V CE = V CES , V GE = 0V25μA T J = 150°C 2 mA I GES V CE = 0V, V GE = ±20V±100 nAV CE(sat)I C = 60A, V GE = 15V, Note 11.852.30 V T J = 150°C2.30 VSymbol Test ConditionsMaximum Ratings V CES T J = 25°C to 175°C600V V CGR T J = 25°C to 175°C, R GE = 1M Ω 600V V GES Continuous ±20V V GEM Transient±30VI C25T C = 25°C (Chip Capability) 150 AI C110T C = 110°C 75A I CM T C = 25°C, 1ms 300AI A T C = 25°C 30 A E AST C = 25°C 500 mJSSOA V GE = 15V, T VJ = 150°C, R G = 5Ω I CM = 150A(RBSOA) Clamped Inductive Load @V CE ≤ V CES t scV GE = 15V, V CE = 360V, T J = 150°C 10 μs (SCSOA)R G = 22Ω, Non Repetitive P C T C = 25°C750W T J -55 ... +175°C T JM 175°C T stg -55 ... +175°CT LMaximum Lead Temperature for Soldering 300°CT SOLD 1.6 mm (0.062in.) from Case for 10s 260 °C M d Mounting Torque1.13/10Nm/lb.in.Weight6gIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Notes:1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.2. Switching times & energy losses may increase for higher V CE (clamp), T J or R G .Symbol Test Conditions (T J = 25°C Unless Otherwise Specified)fs I C = 60A, V CE = 10V, Note 1 20 33C ie sC oes V CE = 25V, V GE C resQ g(on)Q ge I C = 75A, V GE = 15V, V Q gc d(on)PRELIMINARY TECHNICAL INFORMATIONThe product presented herein is under development. The Technical Specifications offered are derived from data gathered during objective characterizations of preliminary engineering lots; but also may yet contain some information supplied during a pre-production design evaluation. IXYS reserves the right to change limits, test conditions, and dimensions without notice.Fig. 1. Output Characteristics @ T 6080100120140I C - A m p e r e sIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 7. Transconductance20304050g f s - S i e m e n sFig. 12. Inductive Switching Energy Loss vs.Gate Resistance1.522.533.54E o f f - M i l l i J o u l e sE off E on - - - - T J = 150ºC , V GE = 15V V CE = 400VI C = 80AIXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.Fig. 18. Inductive Turn-on Switching Times vs.Gate Resistance80120160200240r i - N a n o s e c o n d st r i t d(on) - - - -T J = 150ºC, V GE = 15V V CE = 400V。

欧姆尼克-单相二代逆变器

5年质保欧姆尼克-单相二代逆变器Omniksol-1K/1.5K/2K-TL2内置WiFi可选功能电感外置、有利于散热体积小重量轻，2k机器只有9.6公斤高性能DSP做算法控制获得VDE-AR-N 4105认证全新一代SS拓扑结构触摸按键设计液晶屏夜间可显具备防阴影功能优点使用时间更长监控、安装、设置更方便数据传输不用再付费机器内部温度更低运输安装方便CPU运算速度更快实现有功功率和无功功率可调最大效率97.7%，欧洲效率96.9%操作方便、快捷夜间实时读取工作数据适用于各种复杂的安装环境好处机器更稳定可靠,降低系统成本无需调试，即插即用即可实现远程监控无需流量传输费用即可实现远程监控使用寿命更长节约安装空间整机控制精度更高符合最新认证法规提高客户发电收益操作简单实时观察机器运转状态提高系统在阴影环境的发电量Omniksol-1k/1.5k/2k-TL2欧姆尼克新能源逆变器技术参数地址：苏州工业园区苏州工业园区新泽路80号网址：邮箱：*********************服务热线： 400-999-0892产品持续不断更新，参数如有更改，恕不另行通知，本产品参数，版权所有欧姆尼克公司保留最终解释权苏州欧姆尼克新能源科技有限公司Omnik New Energy Co., Ltd.2014/06 C h i n a V 1最大输入功率1300W 1750W 2300W 最大输入电压500V 500V 500V 额定直流电压360V 360V 360V MPP 电压范围80 - 360V 120 - 450V 120 - 450V 满载M PP 电压范围150 - 360V 150 - 450V 150 - 450V 启动电压90V 150V 150V 关断电压80V 120V 120V 最大输入电流16A 18A 18A 每路M PP T 最大短路电流20A 20A 20A M PP 追踪数量11111直流输入路数1直流连接类型MC4 端子MC4 端子MC4 端子最大输出视在功率1100VA 1650VA 2200VA 额定输出功率1000W1500W2000W额定电网电压220V/230V/240V 220V/230V/240V 220V/230V/240V 额定电网频率50Hz/60Hz 50Hz/60Hz 50Hz/60Hz 最大输出电流 5.8A 9.0A 11.0A 电网电压范围*185-276V 185-276V 185-276V 电网频率范围*45-55Hz/55-65Hz 45-55Hz/55-65Hz 45-55Hz/55-65Hz 功率因数0.9 超前…0.9 滞后0.9超前…0.9滞后0.9超前…0.9滞后总电流谐波畸变<2%<2%<2%启动并网功率30W 30W 30W 夜间自消耗<1W <1W <1W 待机损耗6W 6W6W交流连接类型即插即用端子即插即用端子即插即用端子最大效率97.7%97.7%97.7%欧洲效率96.7%96.8%96.9%M PP T 效率99.9%99.9%99.9%直流开关漏电流监控模块电网监控及保护保护等级过压等级安规标准电磁兼容标准并网标准尺寸（宽x 高x 厚）重量防护等级散热方式安装方式工作温度范围相对湿度最高海拔噪音等级隔离类型显示界面显示界面计算机通讯标准质保自然冷却I (参考 IEC 62103)电池板侧 II / 交流侧 III (参考 IEC 62109-1)EN 61000-6-1, EN 61000-6-3, EN 61000-6-2, EN 61000-6-4, EN61000-3-2, EN61000-3-3EN 62109, AS/NZS 31005年(可选10-25 年)壁装悬挂固定-25°C 至 +60°C(大于45℃降载)0% 至 98%, 无凝露2000m < 40dB 无变压器3 LED, 20 x 4字符型LCD 背光显示RS485(WiFi, GPRS, 可选)USB343x281x150mm9.6kg IP 65 (参考 IEC 60529)有可选内部集成有*交流电压和电流范围可能会由于各国标准要求而变动。

Resistor.Today-RNP50S系列TO-247封装平面无感功率电阻规格书

引脚，铜镀锡环氧模压, UL94-V0 铜导体电阻, 镍铬或氧化钌基板, 氧化铝法兰，铜镀镍
脉冲功率 (W) 100k
RNP50SCF50R0S
连续脉冲功率允许占空比 0.0，
寿命试验需要根据实际情况来确定
1k 1350W
100 100W
10 10n 100n 1u 10u 100u 1m 10m 100m 1 10 脉冲宽度 (秒)
阻值
R020=0.02R 1R00=1R 10R0=10R 100R=100R
1K00=1000R 51K0=51000R
温飘
Q=50ppm K=100ppm T=250ppm
包装 9=标准品
RNP50S
平面无感功率电阻
TO-247封装，厚膜和薄膜技术功率可达100W，热阻1.3℃/W，极好的频率特性
使用厚膜和薄膜两种电阻技术的TO-247封装功率电阻
相比较厚膜电阻技术，薄膜电阻可以提供更好的温飘和精度。R N P 5 0 S系列产品在1 0 R - 5 1 K Ω的阻值范围内使用金属化薄膜电阻技术，不仅可以实现高达1 0 0 W的功率，而且可以提供5 0 p p m的温飘和1 %的阻值精度。本系列在0.02-510KΩ的阻值范围内也可以提供标准厚膜电阻技术。
阻值 (Ohms) 1k
100
10
1 10k
100k
1M
10M
100M
1G
频率 (Hz)
选型表
选型示例：RNP50SCF10R0Q9 (RNP50SC, ±1%, 10R, ±50ppm/℃, 标准品)

精密电阻电容电感选型手册

精密电阻电容电感选型手册,Resistor 电阻Automotive GradeNew Resistance TCR Product Type Series SPEC Tolerance Size Product Range (ppm/?)Automotive Grade ThinFilm Precision Chip 0402/0603/0805Resistor AR..A 10Ω~1MΩ ?0.05%~?1% 25/50 1206/1210 汽车等级高精密薄膜芯片2010/2512电阻Automotive Grade Chip 0402/0603/0805/1206 Resistor CR..A1Ω~100MΩ ?0.1%~?5%, 100/200/400 1210/2010/2512 汽车等级厚膜芯片电阻Automotive GradeAnti-Sulfurated Chip 0402/0603/0805/1206 AS..A1Ω~10MΩ ?0.5%,?1%,?5% 100/200 Resistor 1210/2010/2512汽车等级抗硫化芯片电阻Automotive Grade Current 0402/0603/0805Sensing Chip Resistor 100/150/200 1206/1210/2010 CS..A3mΩ~8000mΩ ?1%,?2%,?5% 汽车等级电流感应芯片电300/400/6002512/1225/3720阻 7520 Thin filmNew Resistance TCR Product Type Series SPEC Tolerance Size Product Range (ppm/?)0201/0402/0603 Thin Film Precision Chip Resistor 5/10/15 AR1Ω~3MΩ ?0.01%~?1% 0805/1206/1210 高精密薄膜芯片电阻 25/50 2010/2512Anti-Corrosive Thin Film 0402/0603/0805 Precision Chip Resistor PR 10Ω~1.5MΩ ?0.1%~?0.5% 15/25/50 1206/2010/2512 抗蚀高精密薄膜芯片电阻Thin Film Current Sensing Chip 0402/0603/0805 Resistor TCS50mΩ~1000mΩ ?0.5%,?1% 50/100/200 1206/2010/2512 电流感应芯片电阻Wire Bondable Chip Resistor WB 10Ω~332KΩ ?0.1%~?10% 25/50/100 0201/0402/0603 打线式芯片电阻Thin Film Anti-Sulfurated Chip TAS 24.9Ω~499KΩ ?0.05%~?1%10/15/25/50 0603/0805 Resistor曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供高精密薄膜抗硫化芯片电阻Thin Film Array Chip Resistor TFAN 100Ω~33KΩ ?0.1%~?1% 10/15/25/50 0603x4 高精密薄膜芯片排阻Resistor ArrayNew TCR Product Type Series SPEC Resistance Range Tolerance Size Product (ppm/?)Thin Film Array Chip Resistor ?0.1%,?0.25% TFAN 100Ω~33KΩ10/15/25/50 0603x4 高精密薄膜芯片排阻 ?0.5%Thick Film Array Chip Resistor CN 1Ω~1MΩ ?1%,?5% 200 0402x4 厚膜芯片排阻 CNAThick Film Flat Array Chip Resistor CN-21 0201x2 10Ω~1MΩ ?5% 200 厚膜芯片平板排阻 CN-41 0201x4MELF/CarbonNew TCR Product Type Series SPEC Resistance Range Tolerance Size Product (ppm/?)Metal Film Precision Resistor 10/15/25 CSR 0.1Ω~10MΩ ?0.1%~?5% 0102/0204/0207tr> 金属精密薄膜电阻 50/100Metal Film Precision Resistor 10/15/25 CSRV 0.1Ω~1MΩ ?0.1%~?5% 0204/0207 金属精密薄膜电阻 50/100Carbon Film Resistor CFS 1Ω~1MΩ ?2%,?5% - 0204/0207/0309 碳膜无脚电阻Thick filmNew Resistance TCR Product Type Series SPEC Tolerance Size Product Range (ppm/?)01005/0201/0402 Thick Film Chip Resistor CR 1Ω~100MΩ ?0.1%~?5%50/100/200/400 /0603/0805/1206/ 厚膜芯片电阻 1210/2010/2512High Ohmic Chip Resistor HMR 110MΩ~1GΩ ?5% 500/1000 0805/1206 高阻值厚膜芯片电阻曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供Pulse Withstanding Chip 0603/0805/1206 Resistor PWR1Ω~20MΩ ?0.5%~?5% 100/200 1210/2010/2512 耐突波贴片电阻Surge Withstanding Chip 0603/0805/1206 Resistor SWR1Ω~20MΩ ?5%~?20% 100/200 1210/2010/2512 抗浪涌芯片电阻High Voltage Thick Film 0402/0603/0805 Chip Resistor HVR10Ω~100MΩ ?1%,?5% 100/200/400 1206/2010/2512 耐高压厚膜芯片电阻Anti-Sulfurated Thick Film 0201/0402/0603Chip Resistor AS 1Ω~10MΩ ?0.5%,?1%,?5% 100/200 0805/1206/1210 抗硫化芯片电阻 2010/2512Trimmable Thick Film 0402/0603/0805Chip Resistor RT 1Ω~10MΩ -10%~-30% 100/200 1206/1210/2010 可雷切芯片电阻 2512 LeadedNew Resistance TCR Product Type Series SPEC Tolerance Size Product Range (ppm/?)Metal Film Leaded Precision 5/10/15/25 0318/0623/0932 Resistor MFR 0.1Ω~10MΩ ?0.05%~?1% 50/100 1145/1550 插件式金属精密电阻Me tal Film Leaded Resistor ?0.02%,?0.05%, MFD 10Ω~1MΩ 5/10/15/25 0727/1040 高精密金属膜固定电阻器 ?0.1%Carbon Film Leaded Resistor 0318/0623/0932 CFR 0.1Ω~22MΩ ?2%,?5% - 插件式碳膜电阻 1145/1550Metal Oxide Leaded Film 0623/0932/1145 Resistor MOF0.1Ω~22MΩ ?1%,?2%,?5% 200 1550/1765/2485 插件式金属氧化皮膜电阻Current sensingNew Resistance TCR Product Type Series SPEC Tolerance Size Product Range (ppm/?)0201/0402/0603 Current Sensing Chip 100/150/200/300 0805/1206/1210 Resistor CS 3mΩ~8000mΩ ?1%,?2%,?5% 400/600/1000 2010/2512/1225 电流感应芯片电阻 3720/7520 曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供Thin Film Current 0402/0603/0805 Sensing Chip Resistor TCS50mΩ~1000mΩ ?0.5%,?1% 50/100/200 1206/2010/2512 薄膜电流感应芯片电阻Current Sensing Thick 0402/0603/0805 200/500/800 Film Chip Resistor RS 10mΩ~976mΩ ?1%, ?5% 1206/1210/2010 1200/1500 电流感应芯片电阻 2512Ultra Low Ohm (MetalStrip) Chip Resistor LR 0.5mΩ~15mΩ ?1%,?3%,?5% 50/75/100/1501206/2010/2512 1W~3W合金超低阻芯片电阻Chip Shunt Resistor 50/60/75 LRS 0.5mΩ~4mΩ ?1%,?2%,?5% 1050/1575分流芯片电阻 100/120Current Sensing Metal 0805/1206 Chip Resistor CSM10mΩ~100mΩ ?1%,?2%,?5% 50/100 2010/2512 电流感应金属芯片电阻Low Ohm (Metal Strip)Chip Resistor LRM 5mΩ~100mΩ ?1%,?2%,?5% 75/100 1206/2010/2512 合金低阻芯片电阻Power resistorPower ResistorNew TCR Product Type Series SPEC Resistance Range Tolerance power Product (ppm/?)TO-220 Power Resistor ?0.5%,1%, 5%, TR20 0.05Ω~10KΩ 50/100/200/300 20W 插件式功率电阻 10%TO-220 Power Resistor ?0.5%,1%, 5%, TR30 0.05Ω~10KΩ 50/100/200/300 30W 插件式功率电阻 10%TO-220 Power Resistor ?0.5%,1%, 5%, TR35 0.05Ω~10KΩ 50/100/200/300 35W 插件式功率电阻 10%TO-220 Power Resistor ?0.5%,1%, 5%, TR50 0.1Ω~10KΩ 50/100/200/300 50W 插件式功率电阻 10%TO-247 Power Resistor ?0.5%,1%, 5%, TR100 0.05Ω~10KΩ50/100/200/300 100W 插件式功率电阻 10%曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供TO-220 Power Resistor ?0.5%,1%, 5%, TR50-H 0.1Ω~10KΩ50/100/200/300 50W 插件式功率电阻 10%,Inductor 电感高频电感(RF Inductor)New Inductance Product Product Description Series SPEC Curve Tolerance SRF(MHZ) DCR(Ω) IDC(mA) Size Product RangeThin Film Chip 0201 Inductor ?0.1,0.2,0.3nH AL 0.1nH~100nH1000~14000 0.1~7.5 75~800 0402 高频薄膜精密芯片电?1%,2%,3%,5% 0603 感Multilayer Chip ?0.3nH 0402 Inductor CL 1nH~220nH 600~10000 0.1~2.7 100~500 ?5%,10% 0603 高频陶瓷积层电感Wire Wound Chip 0402Inductor 0603(Low Profile, High Q, WL 1nH~15000nH ?2%, 5%,10% 15~12700 0.02~11.5 80~2400 0805 Current, High SRF) 1008高频陶瓷绕线电感 1206功率电感(Power Inductor)New Product Inductance Product Series SPEC Tolerance DCR(Ω) I DC(A) Size Product Description RangeNon-shielded,High Power, WireWound Power ?20% 1608/1813/3316 PDH 0.47u~100uH 0.003~1.6 0.4~30 Inductor +40%-20% 4920/5022 开磁路绕线功率电感Non-shielded,Wire Wound Power 1608/3308/3316 Inductor PD 0.18u~1000uH ?20%,30% 0.007~13.8 0.1~40 3340/5022 开磁路绕线功率电感曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供Non-shielded,Low Profile Wire 0301/0302/0402/0403 Wound Power PCD1.0u~1000uH ?10%,20% 0.01~10.19 0.09~9.5 0502/0503/0504/0703 Inductor 0705/1004/1005/1006 开磁路绕线功率电感Low Profile , Mini Wire Wound Power Inductor MPI 1.2u~1000uH ?20%, 0.04~22.6 0.08~2.5 0610/0612/0620 小型绕线功率电感Low Profile , Mini Wire Wound Power Inductor MPE 1u~68uH ?20%,30% 0.08~4.2 0.17~1.4 0312 小型绕线功率电感Shielded, Wire Wound Power Inductor PS 1u-10000uH ?10%,20%0.021~32.8 0.02~5 1608/3316/5022 闭磁路绕线功率电感Shielded, Wire Wound Power ?20% 62B/64B/73/74 Inductor PCS 1.2u-1000uH 0.007~9.44 0.14~9.8 +40%-20% 124/125/127 闭磁路绕线功率电感Shielded, Wire Wound Power 0628/0728/0730Inductor PCDR 1.2u~1500uH ?20%,30% 0.0069~4.78 0.13~130732/0745/1045 闭磁路绕线功率1255/1265/1275电感Shielded, Low Cost, Wire Wound Power Inductor PCDS10u~820uH ?20%,30% 0.03~2 0.33~3.15 63B/74B/105B/125B 闭磁路绕线功率电感Shielded, Low Profile Wire Wound Power 5D28 PSDB 1.3u~1000uH ?30% 0.006~1.989 0.4~10.5 Inductor 1003/1004/1005 闭磁路绕线功率电感曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供Shielded, Low Profile Wire Wound Power 2D12/2D15 SCDB1.2u~47uH ?20%,30% 1.2~47 0.22~1.1 Inductor 2D18 闭磁路绕线功率电感Shielded, Low Profile Wire 3D18Wound Power 4D18/4D22/4D28 SCDS 1u~470uH ?30% 0.012~6.56 0.13~6.15 Inductor 5D18/5D28 闭磁路绕线功率6D28/6D38电感Shielded Wire 4010/4020/4030 Wound Power 5010/ 5020/5030 Inductor PCF 0.36u~10000uH ?20%,30% 0.005~201.16 0.026~12.6 6915/6919/7040 闭磁路绕线功率1015/1040/1062 电感Shielded, Low Profile Wire Wound Power 0.47u~ 0302/0303/0418PDRH ?20%,30% 0.009~175.4 17~4820 Inductor 27000uH 0501/0502/0503 闭磁路绕线功率电感Shielded, Wire Wound Power Inductor SDRH 1.0u~100uH ?30% 0.0095~0.43 0.75~9 0830/0840/0845 闭磁路绕线功率电感Shielded, Wire Wound Power Inductor SDB 0.10u~47uH ?20% 0.0015~0.210 1.2~32.5 0630/1040 闭磁路绕线功率电感Miniature Wire Wound Power 0312/0412/0612 Inductor SDIA1u~100uH ?20% 0.016~60 0.05~8.16 0820/0825/0840 小型绕线功率电感Shielded, 201609E/201514 Non-shielded, ?5%,10% 321618C/322515 Miniature Wire VLH 0.1u~10000uH 0.0098~140 0.023~50 ?20%,30%322520C/453226C Wound Power 575047C Inductor曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供小型绕线功率电感Shielded, LowProfile Wire 2D10/2D15/2D18 SCDA 0.47uH~100uH ?20%,?30% 0.035~3.840.18~3.9 Wound Power 3D12/3D15/3D18 Inductor磁芯电感(Ferrite Inductor)New Product Inductance Product Series SPEC Tolerance SRF(MHZ) DCR(Ω) IDC(mA) Size Product Description RangeMultilayerFerrite ChipInductor ML 0.01~33uH ?10%,20% 13~320 0.15~2.55 5~300 0603/0805/1206 积层芯片式黑电感Multilayer 0402/0603/0805/1204 Chip Bead CB 5~2700Ω ?25% - 0.01~250~6000 1206/1210/1808/1812 贴片磁珠Wound ChipInductors(Ferrite) ?5%,10% 0805/1008/1210 NL 0.12uH~1000uH 0.5~800 0.03~150 30~1800 铁芯绕线电感?20% 1812/2220 (开放，铸膜及背胶)Chip CommonMode Choke CM 67~2200Ω ?20% - 0.25~1.2 200~400 0805/1206 共模滤波器插件式电感(DIP Power Inductor)New Product Inductance Product Series SPEC Tolerance DCR(Ω) IDC(A) Size Product Description RangeDIP PowerInductor DRGH 10u~47000uH ?10%,20% 0.022~96.4 0.038~5.3664/855/875/895/106/108/110 插件式开磁路功率电感曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供DIP PowerInductor DRGR 10u~10000uH ?10%,20% 0.023~35 0.074~3.51664/875/108/110 插件式闭磁路功率电感DIP Power 0708/0808/1210 DM 0.22u~33uH ?20% 0.0006~0.025 6~56 Inductor 1310/1818,Capacitor 电容积层电容(SMD Capacitor)New Product Capacitance Picture Series SPEC Tolerance Voltage Material Size Product Description Range Multilayer ?0.1,0.25,0.5pF Ceramic 6.3V,10V,16V NPO/X7R 0402/0603/0805 MC-1 0.5pF~100uF ?5%,10%,20% Capacitor 25V,50V,100V X5R/Y5V 1206/1210/1812 -20/+80% 迭层贴片电容MultilayerCeramicCapacitor ?0.25,0.5pF (Middle & 200V,250V,500V NPO/X7R0603/0805/1206 MC-2 0.5pF~0.68uF ?5%,10%,20% High 630V,1KV,2KV,3KV Y5V 1210/1808/1812 -20/+80% Voltage)中高壓迭层贴片电容MultilayerCeramicCapacitor ?0.25,0.5pF 6.3V,10V,16V NPO/X7R (Ultra-Small MC-30.3pF~0.1uF 0201 ?5%,10%,20% 25V,50V X5R Capacitor)小型迭层贴片电容MultilayerCeramicCapacitor ?0.1,0.25,0.5pF MCHL 0.5pF~3300pF 16V,25V,50V,100V NPO0402/0603/0805 (High Q, Low ?5%ESR)迭层贴片电容Multilayer ?0.05,0.1,0.25,0.5pF 6.3V,10V,25V 0201/0402/0603 Ceramic MCRF 0.1pF~100pF NPO ?1%,2%,5% 50V,100V,250V 0805 Capacitor曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供(Ultra HighQ, Low ESR)高频迭层贴片电容MultilayerCeramicCapacitor(Low MCLI 10nF~150nF ?10%,20% 50V X7R 0612 Inductance)低感迭层贴片电容------------------------------ 咨询及样品申请，请联系光颉viking代理: 曹小姐提供**************************曹小姐提供 010 - 5 6 0 3 4 1 9 5 viking台湾光颉提供。

最常用的热敏电阻应用参数

Dmax. 6.5 9.5 11.5 14.5 16.5 21.5 29 36
P. 4±0.6 5±0.8 5±0.8 7.5±1 7.5±1 7.5±1 7.5±1 7.5±1
d 0.8±0.02 0.8±0.02 0.8±0.02 0.8±0.02 1.0±0.02 1.0±0.02 1.0±0.02 1.0±0.02
Zero Power Resistance
at 25°C
Max. Steady Residual
State Resistance
Current at 25℃
at 25°C
Imax
R25(Ω)
Imax(A)
RImax(Ω)
0.7
8
0.051
1
8
0.054
1.3
8
0.064
1.5
8
0.068
2
8
0.078
SCK150R78A□ SCK15018□ SCK151R38□ SCK151R58□ SCK15028□ SCK152R58□ SCK15037□ SCK15046□ SCK15056□ SCK15065□ SCK15075□ SCK15085□ SCK15105□ SCK15125□ SCK15154□ SCK15164□ SCK15184□ SCK15204□ SCK15224□ SCK15253□ SCK15303□ SCK15333□ SCK15403□ SCK15473□ SCK15802X□ SCK151202□ SCK200R7□ SCK201R0□ SCK201R5□ SCK202R0□ SCK202R5□ SCK203R0□ SCK204R0□ SCK204R7□ SCK205R0□ SCK206R0□ SCK206R8□ SCK207R0□ SCK208R0□ SCK20100□ SCK20120□ SCK20130□ SCK20150□ SCK20160□ SCK20180□ SCK20200□

美高森美半导体扩展NPT IGBT产品系列

美高森美半导体扩展NPT IGBT产品系列
功率、安全性、可靠度和效能差异化半导体解决方案供应商美高森美公司（Microsemi）宣布其新一代1200V非贯穿型（non-punch through，NPT）系列的叁款IGBT新产品：APT85GR120B2、APT85GR120L和
APT85GR120J。

该产品系列的所有元件均採用美高森美的先进Power MOS 8技术，整体开关和导通损耗比竞争解决方案显着降低20%或以上。

这些IGBT元件专为如焊接机、太阳能逆变器和不断电与开关电源等高功率的高性能开关模式产品而设计。

美高森美的1200V解决方案可与其FRED或碳化硅萧特基（Schottky）二极体组合封装，为工程师提供高整合度解决方案，以便简化产品开发工作。

其它特性包括：闸极电荷（Qg）比竞争产品显着减少，提供更快的开关性能；硬体开关运作频率高于80 KHz，达到更高效率的功率转换；易于并联（Vcesat之正温度系数），可提升高功率应用的可靠性；以及额定短路耐受时间（Short Circuit Withstand TIme，SCWT），为需要短路能力的应用提供可靠运作。

此外，美高森美将于短期内提供採用SOT-227封装的
APT85GR120JD60元件，包含了一个採用美高森美的专有採用美高森美的专有「DQ」系列低开关损耗、额定雪崩能量二极体技术製造的60A反向平行（anTI-parallel）超快速恢复二极体。

台湾PAS信昌FWF车规级电阻规格书

0603
Zero Ohm，Jumper
≦ 1A
＜50mΩ
FWF05
0805
Zero Ohm，Jumper
≦ 2A
＜50mΩ
FWF06
1206
Zero Ohm，Jumper
≦ 2A
＜50mΩ
FWF12
1210
Zero Ohm，Jumper
≦ 3A
＜50mΩ
FWF20
2010
Zero Ohm，Jumper
3. Dimension and construction ………………………..……………..2
4. Power Derating Curve …..…………………………….…………..3
5. Rating ……………………………………………………………….3
6. Part Number ………………………………..………………………5
L 1.00±0.05 1.60±0.10 2.00±0.10 3.10±0.10 3.10±0.10 5.00±0.20 6.40±0.20
W 0.50±0.05 0.80±0.10 1.25±0.10 1.60±0.10 2.60±0.10 2.50±0.20 3.20±0.20
C 0.20±0.10 0.30±0.20 0.40±0.20 0.50±0.25 0.50±0.25 0.60±0.25 0.60±0.25
Soldering Reference：

sales@
6/12
FWF-REV.6.0.G03 PDC
FWF series. (AEC-Q200)
Automotive Grade General Purpose

平面无感功率电阻英语缩写

平面无感功率电阻英语缩写The English abbreviation for planar non-inductive power resistor is typically referred to as "PNR" or "PNPR." However, it's important to note that the exact abbreviation may vary depending on the industry, manufacturer, orspecific application. In this article, we will delve into the details of planar non-inductive power resistors, including their construction, characteristics, applications, and the significance of using the appropriate abbreviation.Planar non-inductive power resistors, also known as planar resistors or surface mount power resistors, are specialized devices designed to handle significant power levels while minimizing inductive effects. Their primary function is to convert electrical energy into heat, thereby dissipating the power in a controlled manner.Construction of Planar Non-Inductive Power Resistors.Planar non-inductive power resistors are typicallyconstructed using a metal-based resistive element that is embedded or printed onto a planar substrate. The resistive element is carefully designed to minimize inductance, which is a measure of the ability of a device to store energy in a magnetic field.The resistive element is typically surrounded by an insulating material that provides electrical isolation and protection. The entire assembly is then encapsulated in a protective housing or coating to ensure durability.。

Resistor.Today-RMP20S系列TO-220封装平面无感功率电阻规格书

RMP20S
平面无感功率电阻
阻值 (ohm )
1K
100
10
1
100k
1M
10M
100M
1G
频率 (Hz)
TO-220封装，符合AEC-Q200认证
厚膜和薄膜技术，功率可达35W ，热阻3.3℃/W ，极好的频率特性
10 20 30
40
50
加载功率 (W )
100 80 60 40
20 0 温升 ()
℃0.01
0.1
1.0
阻值 (Ohms )
温飘ppm/℃(0~100)℃250 200 150 100 50 0 使用厚膜和薄膜两种电阻技术的TO -220封装功率电阻
法兰温度
℃100806040200额定功率%
10n 100n 1u 10u 100u 1m 10m 100m 1
100
脉冲宽度 (秒) 100k 10k
1k 100
10
10 尺寸单位：mm
相比较厚膜电阻技术，薄膜电阻可以提供更好的温飘和精度。

RMP20S 系列产品在10R-51KΩ的阻值范围内使用金属化薄膜电阻技术，不仅可以实现高达35W 的功率，而且可以提供50ppm 的温飘和1%的阻值精度。

本系列在0.02-510KΩ的阻值范围内也可以提供标准厚膜电阻技术。

各种负温度系数 NTC 热敏电阻-温度传感器技术参数详解与选型

DTV 系列——汽車溫度感測器用 NTC 熱敏晶片
DTV Series -- Die (Bare Chip) NTC Thermistor for Vehicle Temperature Sensor & Thermo Switch Making
DTM 系列——醫療溫度感測器用 NTC 熱敏晶片
DTM Series -- Die (Bare Chip) NTC Thermistor for Medical Temperature Sensor Making
4. 通讯： CT系列——片式负温度系数热敏电阻 AT系列——非绝缘引线插件 NTC热敏电阻
5. 计算机及办公自动化设备： OT系列——办公自动化NTC热敏电阻/温度传感器 GT系列——玻璃封装NTC热敏电阻 FT系列——薄膜NTC热敏电阻
6. 消费类电子： PT系列——功率型（浪涌抑制）NTC热敏电阻 AT系列——非绝缘引线插件 NTC热敏电阻 BT系列——绝缘引线型NTC温度传感器
1、零功率電阻值 RT Zero-power resistance (RT)
在規定溫度下，採用引起電阻變化相對於總的測量誤差來說可以忽略不計的測量功率測得的電阻值。 The zero-power resistance is the value of a resistance when measured at a specified temperature, under conditions such that the change in resistance due to the internal generation of heat is negligible with respect to the total error of measurement.

NTC热敏电阻

热敏电阻器(thermistor)——型号MZ、MF：之巴公井开创作是一种对温度反应较敏感、阻值会随着温度的变动而变动的非线性电阻器,通常由单晶、多晶半导体资料制成.文字符号：“RT”或“R”热敏电阻器的种类：A．按结构及形状分类——圆片形（片状）、圆柱形（柱形）、圆圈形（垫圈形）等多种热敏电阻器.B．按温度变动的灵敏度分类——高灵敏度型（突变型）、低灵敏度型（缓变型）热敏电阻器.C．按受热方式分类——直热式热敏电阻器、旁热式热敏电阻器. D．按温变（温度变动）特性分类——正温度系数（PTC）、负正温度系数（NTC）热敏电阻器.热敏电阻器的主要参数：除标称阻值、额定功率和允许偏差等基本指标外,还有如下指标： 1）丈量功率：指在规定的环境温度下,电阻体受丈量电源加热而引起阻值变动不超越0.1％时所消耗的功率. 2）资料常数：是反应热敏电阻器热灵敏度的指标.通常,该值越年夜,热敏电阻器的灵敏度和电阻率越高. 3）电阻温度系数：暗示热敏电阻器在零功率条件下,其温度每变动1℃所引起电阻值的相对变动量. 4）热时间常数：指热敏电阻器的热惰性.即在无功功率状态下,当环境温度突变时,电阻体温度由初值变动到最终温度之差的63.2％所需的时间. 5）耗散系数：指热敏电阻器的温度每增加1℃所耗散的功率. 6）开关温度：指热敏电阻器的零功率电阻值为最低电阻值两倍时所对应的温度. 7）最高工作温度：指热敏电阻器在规定的标准条件下,长期连续工作时所允许接受的最高温度. 8）标称电压：指稳压用热敏电阻器在规定的温度下,与标称工作电流所对应的电压值. 9）工作电流：指稳压用热敏电阻器在在正常工作状态下的规定电流值. 10）稳压范围：指稳压用热敏电阻器在规定的环境温度范围内稳定电压的范围值. 11）最年夜电压：指在规定的环境温度下,热敏电阻器正常工作时所允许连续施加的最高电压值. 12）绝缘电阻：指在规定的环境条件下,热敏电阻器的电阻体与绝缘外壳之间的电阻值.●正温度系数热敏电阻器（PTC—positive temperature coefficient thermistor）结构——用钛酸钡（BaTiO3）、锶（Sr）、锆（Zr）等资料制成的.属直热式热敏电阻器.特性——电阻值与温度变动成正比关系,即当温度升高时电阻值随之增年夜.在常温下,其电阻值较小,仅有几欧姆～几十欧姆；当流经它的电流超越额定值时,其电阻值能在几秒钟内迅速增年夜至数百欧姆～数千欧姆以上.作用与应用——广泛应用于黑色电视机消磁电路、电冰箱压缩机启动电路及过热或过电流呵护等电路中、还可用于电驱蚊器和卷发器、电热垫、暖器等小家电中.●负温度系数热敏电阻器（NTC—negative temperature coefficient thermistor）结构——用锰（Mn）、钴（Co）、镍（Ni）、铜（Cu）、铝（Al）等金属氧化物（具有半导体性质）或碳化硅（SiC）等资料采纳陶瓷工艺制成的.特性——电阻值与温度变动成反比关系,即当温度升高时,电阻值随之减小.作用与应用——广泛应用于电冰箱、空调器、微波炉、电烤箱、复印机、打印机等家电及办公产物中,作温度检测、温度赔偿、温度控制、微波功率丈量及稳压控制用.热敏电阻是开发早、种类多、发展较成熟的敏感元器件．热敏电阻由半导体陶瓷资料组成,利用的原理是温度引起电阻变动．若电子和空穴的浓度分别为n、p,迁移率分别为μn、μp,则半导体的电导为：σ=q（nμn+pμp）因为n、p、μn、μp都是依赖温度T的函数,所以电导是温度的函数,因此可由丈量电导而推算出温度的高低,并能做出电阻-温度特性曲线．这就是半导体热敏电阻的工作原理．热敏电阻包括正温度系数（PTC）和负温度系数（NTC）热敏电阻,以及临界温度热敏电阻（CTR）．它们的电阻-温度特性如图1所示．热敏电阻的主要特点是：①灵敏度较高,其电阻温度系数要比金属年夜10～100倍以上,能检测出10-6℃的温度变动；②工作温度范围宽,常温器件适用于-55℃～315℃,高温器件适用温度高于315℃（目前最高可到达2000℃）,高温器件适用于-273℃～55℃；③体积小,能够丈量其他温度计无法丈量的空隙、腔体及生物体内血管的温度；④使用方便,电阻值可在0.1～100kΩ间任意选择；⑤易加工成复杂的形状,可年夜批量生产；⑥稳定性好、过载能力强．由于半导体热敏电阻有共同的性能,所以在应用方面,它不单可以作为丈量元件（如丈量温度、流量、液位等）,还可以作为控制元件（如热敏开关、限流器）和电路赔偿元件．热敏电阻广泛用于家用电器、电力工业、通讯、军事科学、宇航等各个领域,发展前景极其广阔．一、PTC热敏电阻PTC（Positive Temperature Coeff1Cient）是指在某一温度下电阻急剧增加、具有正温度系数的热敏电阻现象或资料,可专门用作恒定温度传感器．该资料是以BaTiO3或SrTiO3或PbTiO3为主要成份的烧结体,其中掺入微量的Nb、Ta、Bi、Sb、Y、La等氧化物进行原子价控制而使之半导化,常将这种半导体化的BaTiO3等资料简称为半导（体）瓷；同时还添加增年夜其正电阻温度系数的Mn、Fe、Cu、Cr的氧化物和起其他作用的添加物,采纳一般陶瓷工艺成形、高温烧结而使钛酸铂等及其固溶体半导化,从而获得正特性的热敏电阻资料．其温度系数及居里点温度随组分及烧结条件（尤其是冷却温度）分歧而变动．钛酸钡晶体属于钙钛矿型结构,是一种铁电资料,纯钛酸钡是一种绝缘资料．在钛酸钡资料中加入微量稀土元素,进行适当热处置后,在居里温度附近,电阻率陡增几个数量级,发生PTC效应,此效应与BaTiO3晶体的铁电性及其在居里温度附近资料的相变有关．钛酸钡半导瓷是一种多晶资料,晶粒之间存在着晶粒间界面．该半导瓷当到达某一特定温度或电压,晶体粒界就发生变动,从而电阻急剧变动．钛酸钡半导瓷的PTC效应起因于粒界（晶粒间界）．对导电电子来说,晶粒间界面相当于一个势垒．当温度低时,由于钛酸钡内电场的作用,招致电子极容易越过势垒,则电阻值较小．当温度升高到居里点温度（即临界温度）附近时,内电场受到破坏,它不能帮手导电电子越过势垒．这相当于势垒升高,电阻值突然增年夜,发生PTC效应．钛酸钡半导瓷的PTC效应的物理模型有海望概况势垒模型、丹尼尔斯等人的钡缺位模型和叠加势垒模型,它们分别从分歧方面对PTC效应作出了合理解释．实验标明,在工作温度范围内,PTC热敏电阻的电阻-温度特性可近似用实验公式暗示：RT=RT0expBp（T-T0）式中RT、RT0暗示温度为T、T0时电阻值,Bp为该种资料的资料常数．PTC效应起源于陶瓷的粒界和粒界间析出相的性质,并随杂质种类、浓度、烧结条件等而发生显著变动．最近,进入实用化的热敏电阻中有利用硅片的硅温度敏感元件,这是体型且精度高的PTC热敏电阻,由n型硅构成,因其中的杂质发生的电子散射随温度上升而增加,从而电阻增加．PTC热敏电阻于1950年呈现,随后1954年呈现了以钛酸钡为主要资料的PTC热敏电阻．PTC热敏电阻在工业上可用作温度的丈量与控制,也用于汽车某部位的温度检测与调节,还年夜量用于民用设备,如控制瞬间开水器的水温、空调器与冷库的温度,利用自己加热作气体分析和风速机等方面．下面简介一例对加热器、马达、变压器、年夜功率晶体管等电器的加热和过热呵护方面的应用.PTC热敏电阻除用作加热元件外,同时还能起到“开关”的作用,兼有敏感元件、加热器和开关三种功能,称之为“热敏开关”,如图2和3所示．电流通过元件后引起温度升高,即发热体的温度上升,当超越居里点温度后,电阻增加,从而限制电流增加,于是电流的下降招致元件温度降低,电阻值的减小又使电路电流增加,元件温度升高,周而复始,因此具有使温度坚持在特定范围的功能,又起到开关作用．利用这种阻温特性做成加热源,作为加热元件应用的有暖风器、电烙铁、烘衣柜、空调等,还可对电器起到过热呵护作用．二、NTC热敏电阻NTC（Negative Temperature Coeff1Cient）是指随温度上升电阻呈指数关系减小、具有负温度系数的热敏电阻现象和资料．该资料是利用锰、铜、硅、鈷、铁、镍、锌等两种或两种以上的金属氧化物进行充沛混合、成型、烧结等工艺而成的半导体陶瓷,可制成具有负温度系数（NTC）的热敏电阻．其电阻率和资料常数随资料成份比例、烧结气氛、烧结温度和结构状态分歧而变动．现在还呈现了以碳化硅、硒化锡、氮化钽等为代表的非氧化物系NTC 热敏电阻资料．NTC热敏半导瓷年夜多是尖晶石结构或其他结构的氧化物陶瓷,具有负的温度系数,电阻值可近似暗示为：式中RT、RT0分别为温度T、T0时的电阻值,Bn为资料常数．陶瓷晶粒自己由于温度变动而使电阻率发生变动,这是由半导体特性决定的．NTC热敏电阻器的发展经历了漫长的阶段．1834年,科学家首次发现了硫化银有负温度系数的特性．1930年,科学家发现氧化亚铜-氧化铜也具有负温度系数的性能,并将之胜利地运用在航空仪器的温度赔偿电路中．随后,由于晶体管技术的不竭发展,热敏电阻器的研究取得重年夜进展．1960年研制出了N1C热敏电阻器．NTC 热敏电阻器广泛用于测温、控温、温度赔偿等方面．下面介绍一个温度丈量的应用实例,NTC热敏电阻测温用原理如图4所示．它的丈量范围一般为-10～+300℃,也可做到-200～+10℃,甚至可用于+300～+1200℃环境中作测温用．RT为NTC热敏电阻器；R2和R3是电桥平衡电阻；R1为起始电阻；R4为满刻度电阻,校验表头,也称校验电阻；R7、R8和W为分压电阻,为电桥提供一个稳定的直流电源．R6与表头（微安表）串连,起修正表头刻度和限制流经表头的电流的作用．R5与表头并联,起呵护作用．在不服衡电桥臂（即R1、RT）接入一只热敏元件RT作温度传感探头．由于热敏电阻器的阻值随温度的变动而变动,因而使接在电桥对角线间的表头指示也相应变动．这就是热敏电阻器温度计的工作原理．℃,感温时间可少至10s以下．它不单适用于粮仓测温仪,同时也可应用于食品贮存、医药卫生、科学种田、海洋、深井、高空、冰川等方面的温度丈量．三、CTR热敏电阻临界温度热敏电阻CTR（Crit1Cal Temperature Resistor）具有负电阻突变特性,在某一温度下,电阻值随温度的增加激剧减小,具有很年夜的负温度系数．构成资料是钒、钡、锶、磷等元素氧化物的混合烧结体,是半玻璃状的半导体,也称CTR为玻璃态热敏电阻．骤变温度随添加锗、钨、钼等的氧化物而变．这是由于分歧杂质的掺入,使氧化钒的晶格间隔分歧造成的．若在适当的还原气氛中五氧化二钒酿成二氧化钒,则电阻急变温度变年夜；若进一步还原为三氧化二钒,则急变消失．发生电阻急变的温度对应于半玻璃半导体物性急变的位置,因此发生半导体-金属相移．CTR能够作为控温报警等应用．热敏电阻的理论研究和应用开发已取得了引人注目的功效．随着高、精、尖科技的应用,对热敏电阻的导机电理和应用的更深条理的探索,以及对性能优良的新资料的深入研究,将会取得迅速发展．电阻知识导电体对电流的阻碍作用称为电阻,用符号R暗示,单元为欧姆、千欧、兆欧,分别用Ω、KΩ、MΩ暗示.一、电阻的型号命名方法：国产电阻器的型号由四部份组成（不适用敏感电阻）第一部份：主称 ,用字母暗示,暗示产物的名字.如R暗示电阻,W 暗示电位器. 第二部份：资料 ,用字母暗示,暗示电阻体用什么资料组成,T-碳膜、H-合成碳膜、S-有机实心、N-无机实心、J-金属膜、Y-氮化膜、C-堆积膜、I-玻璃釉膜、X-线绕. 第三部份：分类,一般用数字暗示,个别类型用字母暗示,暗示产物属于什么类型.1-普通、2-普通、3-超高频、4-高阻、5-高温、6-精密、7-精密、8-高压、9-特殊、G-高功率、T-可调. 第四部份:序号,用数字暗示,暗示同类产物中分歧品种,以区分产物的外型尺寸和性能指标等例如：R T 1 1 型普通碳膜电阻二、电阻器的分类1、线绕电阻器：通用线绕电阻器、精密线绕电阻器、年夜功率线绕电阻器、高频线绕电阻器. 2、薄膜电阻器：碳膜电阻器、合成碳膜电阻器、金属膜电阻器、金属氧化膜电阻器、化学堆积膜电阻器、玻璃釉膜电阻器、金属氮化膜电阻器. 3、实心电阻器：无机合成实心碳质电阻器、有机合成实心碳质电阻器. 4、敏感电阻器：压敏电阻器、热敏电阻器、光敏电阻器、力敏电阻器、气敏电阻器、湿敏电阻器. 三、主要特性参数 1、标称阻值：电阻器上面所标示的阻值. 2、允许误差：标称阻值与实际阻值的差值跟标称阻值之比的百分数称阻值偏差,它暗示电阻器的精度.允许误差与精度品级对应关系如下：±0.5%-0.05、±1%-0.1(或00)、±2%-0.2(或0)、±5%-Ⅰ级、±10%-Ⅱ级、±20%-Ⅲ级 3、额定功率：在正常的年夜气压力90-106.6KPa及环境温度为－55℃～＋70℃的条件下,电阻器长期工作所允许耗散的最年夜功率. 线绕电阻器额定功率系列为（W）：1/20、1/8、1/4、1/2、1、2、4、8、10、16、25、40、50、75、100、150、250、500 非线绕电阻器额定功率系列为（W）：1/20、1/8、1/4、1/2、1、2、5、10、25、50、100 4、额定电压：由阻值和额定功率换算出的电压. 5、最高工作电压：允许的最年夜连续工作电压.在低气压工作时,最高工作电压较低. 6、温度系数：温度每变动1℃所引起的电阻值的相对变动.温度系数越小,电阻的稳定性越好.阻值随温度升高而增年夜的为正温度系数,反之为负温度系数. 7、老化系数：电阻器在额定功率长期负荷下,阻值相对变动的百分数,它是暗示电阻器寿命长短的参数. 8、电压系数：在规定的电压范围内,电压每变动1伏,电阻器的相对变动量. 9、噪声：发生于电阻器中的一种不规则的电压起伏,包括热噪声和电流噪声两部份,热噪声是由于导体内部不规则的电子自由运动,使导体任意两点的电压不规则变动. 四、电阻器阻值标示方法 1、直标法：用数字和单元符号在电阻器概况标出阻值,其允许误差直接用百分数暗示,若电阻上未注偏差,则均为±20%. 2、文字符号法：用阿拉伯数字和文字符号两者有规律的组合来暗示标称阻值,其允许偏差也用文字符号暗示.符号前面的数字暗示整数阻值,后面的数字依次暗示第一位小数阻值和第二位小数阻值. 暗示允许误差的文字符号文字符号D F G J K M 允许偏差±0.5% ±1% ±2% ±5% ±10% ±20%3、数码法：在电阻器上用三位数码暗示标称值的标识表记标帜方法.数码从左到右,第一、二位为有效值,第三位为指数,即零的个数,单元为欧.偏差通常采纳文字符号暗示.4、色标法：用分歧颜色的带或点在电阻器概况标出标称阻值和允许偏差.国外电阻年夜部份采纳色标法. 黑-0、棕-1、红-2、橙-3、黄-4、绿-5、蓝-6、紫-7、灰-8、白-9、金-±5%、银-±10%、无色-±20% 当电阻为四环时,最后一环必为金色或银色,前两位为有效数字, 第三位为乘方数,第四位为偏差. 当电阻为五环时,最后一环与前面四环距离较年夜.前三位为有效数字, 第四位为乘方数, 第五位为偏差.五、经常使用电阻器 1、电位器电位器是一种机电元件,他靠电刷在电阻体上的滑动,取得与电刷位移成一定关系的输出电压.1.1 合成碳膜电位器电阻体是用经过研磨的碳黑,石墨,石英等资料涂敷于基体概况而成,该工艺简单,是目前应用最广泛的电位器.特点是分辩力高耐磨性好,寿命较长.缺点是电流噪声,非线性年夜, 耐潮性以及阻值稳定性差. 1.2 有机实心电位器有机实心电位器是一种新型电位器,它是用加热塑压的方法,将有机电阻粉压在绝缘体的凹槽内.有机实心电位器与碳膜电位器相比具有耐热性好、功率年夜、可靠性高、耐磨性好的优点.但温度系数年夜、动噪声年夜、耐潮性能差、制造工艺复杂、阻值精度较差.在小型化、高可靠、高耐磨性的电子设备以及交、直流电路中用作调节电压、电流. 1.3 金属玻璃铀电位器用丝网印刷法依照一定图形,将金属玻璃铀电阻浆料涂覆在陶瓷基体上,经高温烧结而成.特点是：阻值范围宽,耐热性好,过载能力强,耐潮,耐磨等都很好,是很有前途的电位器品种,缺点是接触电阻和电流噪声年夜. 1.4 绕线电位器绕线电位器是将康铜丝或镍铬合金丝作为电阻体,并把它绕在绝缘骨架上制成.绕线电位器特点是接触电阻小,精度高,温度系数小,其缺点是分辨力差,阻值偏低,高频特性差.主要用作分压器、变阻器、仪器中调零和工作点等. 1.5 金属膜电位器金属膜电位器的电阻体可由合金膜、金属氧化膜、金属箔等分别组成.特点是分辩力高、耐高温、温度系数小、动噪声小、平滑性好. 1.6 导电塑料电位器用特殊工艺将DAP（邻苯二甲酸二稀丙脂）电阻浆料覆在绝缘机体上,加热聚合成电阻膜,或将DAP电阻粉热塑压在绝缘基体的凹槽内形成的实心体作为电阻体.特点是：平滑性好、分辩力优异耐磨性好、寿命长、动噪声小、可靠性极高、耐化学腐蚀.用于宇宙装置、导弹、飞机雷达天线的伺服系统等. 1.7 带开关的电位器有旋转式开关电位器、推拉式开关电位器、推推开关式电位器 1.8 预调式电位器预调式电位器在电路中,一旦调试好,用蜡封住调节位置,在一般情况下不再调节. 1.9 直滑式电位器采纳直滑方式改变电阻值. 1.10 双连电位器有异轴双连电位器和同轴双连电位器 1.11 无触点电位器无触点电位器消除机械接触,寿命长、可靠性高,分光电式电位器、磁敏式电位器等. 2、实芯碳质电阻器用碳质颗粒壮导电物质、填料和粘合剂混合制成一个实体的电阻器.特点：价格昂贵,但其阻值误差、噪声电压都年夜,稳定性差,目前较少用. 3、绕线电阻器用高阻合金线绕在绝缘骨架上制成,外面涂有耐热的釉绝缘层或绝缘漆.绕线电阻具有较低的温度系数,阻值精度高, 稳定性好,耐热耐腐蚀,主要做精密年夜功率电阻使用,缺点是高频性能差,时间常数年夜. 4、薄膜电阻器用蒸发的方法将一定电阻率资料蒸镀于绝缘资料概况制成.主要如下： 4.1 碳膜电阻器将结晶碳堆积在陶瓷棒骨架上制成.碳膜电阻器本钱低、性能稳定、阻值范围宽、温度系数和电压系数低,是目前应用最广泛的电阻器. 4.2 金属膜电阻器. 用真空蒸发的方法将合金资料蒸镀于陶瓷棒骨架概况.金属膜电阻比碳膜电阻的精度高,稳定性好,噪声, 温度系数小.在仪器仪表及通讯设备中年夜量采纳. 4.3 金属氧化膜电阻器在绝缘棒上堆积一层金属氧化物.由于其自己即是氧化物,所以高温下稳定,耐热冲击,负载能力强. 4.4 合成膜电阻将导电合成物悬浮液涂敷在基体上而得,因此也叫漆膜电阻.由于其导电层呈现颗粒状结构,所以其噪声年夜,精度低,主要用他制造高压, 高阻, 小型电阻器. 5、金属玻璃铀电阻器将金属粉和玻璃铀粉混合,采纳丝网印刷法印在基板上. 耐湿润, 高温, 温度系数小,主要应用于厚膜电路. 6、贴片电阻SMT 片状电阻是金属玻璃铀电阻的一种形式,他的电阻体是高可靠的钌系列玻璃铀资料经过高温烧结而成,电极采纳银钯合金浆料.体积小,精度高,稳定性好,由于其为片状元件,所以高频性能好. 7、敏感电阻敏感电阻是指器件特性对温度,电压,湿度,光照,气体, 磁场,压力等作用敏感的电阻器. 敏感电阻的符号是在普通电阻的符号中加一斜线,并在旁标注敏感电阻的类型,如：t. v等.7.1、压敏电阻主要有碳化硅和氧化锌压敏电阻,氧化锌具有更多的优良特性. 7.2、湿敏电阻由感湿层,电极,绝缘体组成,湿敏电阻主要包括氯化锂湿敏电阻,碳湿敏电阻,氧化物湿敏电阻.氯化锂湿敏电阻随湿度上升而电阻减小,缺点为测试范围小,特性重复性欠好,受温度影响年夜.碳湿敏电阻缺点为高温灵敏度低,阻值受温度影响年夜,由老化特性,较少使用.氧化物湿敏电阻性能较优越,可长期使用,温度影响小,阻值与湿度变动呈线性关系.有氧化锡,镍铁酸盐,等资料. 7.3、光敏电阻光敏电阻是电导率随着光量力的变动而变动的电子元件,当某种物质受到光照时,载流子的浓度增加从而增加了电导率,这就是光电导效应. 7.4、气敏电阻利用某些半导体吸收某种气体后发生氧化还原反应制成,主要成份是金属氧化物,主要品种有：金属氧化物气敏电阻、复合氧化物气敏电阻、陶瓷气敏电阻等. 7.5、力敏电阻力敏电阻是一种阻值随压力变动而变动的电阻,国外称为压电电阻器.所谓压力电阻效应即半导体资料的电阻率随机械应力的变动而变动的效应.可制成各种力矩计,半导体话筒,压力传感器等.主要品种有硅力敏电阻器,硒碲合金力敏电阻器,相对而言,合金电阻器具有更高灵敏度. 7.6、热敏电阻热敏电阻是敏感元件的一类,其电阻值会随着热敏电阻本体温度的变动呈现出阶跃性的变动,具有半导体特性. 热敏电阻依照温度系数的分歧分为: 正温度系数热敏电阻(简称PTC热敏电阻) 负温度系数热敏电阻(简称NTC热敏电阻) 正温度热敏电阻(PTC Thermistor) PTC是Positive Temperature Coefficient 的缩写,意思是正的温度系数,泛指正温度系数很年夜的半导体资料或元器件.通常我们提到的PTC是指正温度系数热敏电阻,简称PTC热敏电阻. PTC热敏电阻是一种典范具有温度敏感性的半导体电阻,超越一定的温度(居里温度)时, 它的电阻值随着温度的升高呈阶跃性的增高. PTC热敏电阻根据其材质的分歧分为:陶瓷PTC 热敏电阻有机高分子PTC热敏电阻目前年夜量被使用的PTC热敏电阻种类: 恒温加热用PTC热敏电阻过流呵护用PTC热敏电阻空气加热用PTC热敏电阻延时启动用PTC热敏电阻传感器用PTC热敏电阻自动消磁用PTC热敏电阻一般情况下,有机高分子PTC热敏电阻适合过流呵护用途,陶瓷PTC热敏电阻可适用于以上所列各种用途. 负温度热敏电阻(NTC Thermistor) NTC是Negative Temperature Coefficient 的缩写,意思是负的温度系数,泛指负温度系数很年夜的半导体资料或元器件.通常我们提到的NTC是指负温度系数热敏电阻,简称NTC热敏电阻. NTC热敏电阻是一种典范具有温度敏感性的半导体电阻,它的电阻值随着温度的升高呈阶跃性的减小. NTC热敏电阻是以锰、钴、镍和铜等金属氧化物为主要资料,采纳陶瓷工艺制造而成的.这些金属氧化物资料都具有半导体性质,因为在导电方式上完全类似锗、硅等半导体资料.温度低时,这些氧化物资料的载流子（电子和孔穴）数目少,所以其电阻值较高；随着温度的升高,载流子数目增加,所以电。

贴片功率电感型号说明

15
SP52-180K
1KHz/0.25V
18
SP52-220K
1KHz/0.25V
22
SP52-270K
1KHz/0.25V
27
SP52-330K
1KHz/0.25V
33
SP52-390K
1KHz/0.25V
39
SP52-470K
1KHz/0.25V
47
SP52-560K
1KHz/0.25V
56
SP52-680K
0.36
±10
3.900
0.34
±10
5.300
0.28
±10
5.900
0.24
±10
6.800
0.21
±10
8.500
0.20
±10
10.000
0.18
※超出以上规格的特殊要求也可以满足。Special inquiries besides the above common used types can be meet .
电气性能 Electrical Characteristics SP32 Series
Part NO 产品编号
Test Condition 测试条件
Inductance 电感(μH)
Tolerance 公差( % )
DC Resistance 直流电阻(Ω)Max
Rated Current 额定电流(A)Max
SP32-150K
1KHz/0.25V
15
±10
0.398
0.82
SP32-180K
1KHz/0.25V
18
±10
0.399

Resistor.Today-RNP20E系列TO263(D2-PAK)封装平面无感功率电阻规格书

3.3℃/W 3.3℃/W 3.3℃/W
绝缘电压
2000VAC 2000VAC 2000VAC
最大工作电流
25A 25A 25A
工作温度
-55~+175℃ -55~+175℃ -55~+175℃
频率特性
并联电容串联电感
2pF
10nH
2pF
10nH
2pF
10nH
尺寸单位：mm 1.5
5.08
0.75 1.5
10.1
0.75 0.5 2.75
4.5
2.5
2.2
5.0 10.3
11.0
1.6 5.08
3.50 10.0 15.8
峰值温度时间 20-40s
温度 ℃
350
超过 217 ℃允许60s-180s
300
250
200
150
从 150℃- 200℃
100
120s Байду номын сангаас 180s
50 升温到峰值温度 400s
RNP20E
平面无感功率电阻
TO263(D2-PAK)封装，符合AEC-Q200认证厚膜和薄膜技术，功率可达35W，热阻3.3℃/W，极好的频率特性
使用厚膜和薄膜两种电阻技术的D2-PAK封装功率电阻
相比较厚膜电阻技术，薄膜电阻可以提供更好的温飘和精度。RNP20E系列产品在10R-51KΩ的阻值范围内使用金属化薄膜电阻技术，不仅可以实现高达35W的功率，而且可以提供50ppm的温飘和1%的阻值精度。本系列在0.02-510KΩ的阻值范围内也可以提供标准厚膜电阻技术。
规格和参数
系列功率阻值范围阻值标准温飘可选精度电阻技术