蓝牙音响设计原理图参考
AB5325A蓝牙音箱标准原理图
2
3
4
U1
A
DACL
1
AGND
C1 104 VDDDAC
2 3
FM_ANT L1
0R/220nH/470nH 4
BLUE_LED 5
6
MUTE
7
C3 104 VDDIO
8
C4 104 VMCU
9
GND
C6 105 VDDBT
10 11
PWRKEY 12
DACL VDDDAC AGND FM_ANT PE7/AUXR2/ADC9/IR PE6/AUXL2/ADC8/IR PE0/MUTE/IR VDDIO VBAT DGND VDDBT PWRKEY
J1
TF3
1 2 3 4 5 6 7 8 9 10
SD2 SD3 SCMD VDD SCLK VSS SD0 SD1 CD SHEET
D
upDate:芯片支持USB与SD接口升级
GND
C
PWRKEY
LED
MIC
USB/SD
R8
D2
RED GND
NC
Q1
R9
2K
JACK1
MINI-USB
+5V
8550
24 23 22 21 20 19 18 17 16 15 14 13
AUX MICIN SDCMD SDCLK SDDAT USBDP USBDM OSCO OSCI
BT_ANT
C2 NC Y1
26MHZ
GND
C5
NC
2
L2
0R
1
BT-ANT1
L3
L4
ANTENNA_PIFA
A
AC6901A蓝牙方案标准原理图V1.0
VCOM DACVDD DACL DACR MIC AUXL AUXR LINEIN PHIN AD_KEY PWR_CTL MUTE
C105 105
J302
C106 105
2 4 3 1
LPF_R PHIN LPF_L
R301 100R
C303 10uF
DACR
DACVDD
DACL R302 100R C304 10uF R306 1K R307 2.2K R304 10K C308 224 C301 105 AUXR AUXL R305 10K C305 NC/202 C307 224 C306 NC/202 C302 102 C309 104 MIC
S401 V-
S402 V+
S410 NC
C/S C/S C/S C/S C/S C/S C/S
7 6 5 4 3 2 1
备注:若功放Shutdown 后功耗为uA级别, 此电路可省, 直接短接,但需考虑U盘耗电
C/S7 C/S6 C/S5 C/S4 C/S3 C/S2 C/S1
B V_PA
C601 NC/105
C110 15P Y101 C111 15P 32.768K C109 2.7P L102 NC L103 0R C113 106
1 2 3 4 5 6 7 8 9 10 11 12
VSSIO LDO_IN VDDIO RTCVDD PR1/ADC12 PR2/ADC13 PR3 OSC32KI PR0/OSC32KO BT_AVDD BT_RF AVSS
LCD_CS LCD_RES LCD_A0 LCD_DATA
BL_LIGHT LCD_CLK USBDM USBDP
BT_OSCI BT_OSCO
DIY时尚蓝牙音箱电路图
DIY时尚蓝牙音箱电路图
•详细说明
材料:音箱1只,蓝牙耳机主板1块,锂电池1块,开关按键两个,长的按键压杆2个,导线若干。
做法:将蓝牙耳机的各按键外引,更换电池,耳机线外引。
原理框图见下图。
制作过程:
1.将原蓝牙耳机电池换成容量更大的诺基亚手机锂电池,同时引出正负极,做充电接口。
2.将蓝牙耳机的“音量增加”和“音量减小”的按键接出引线,外接按键。
3.保持蓝牙耳机的“蓝牙打开按键”不动,在其上方加一个按键压杆。
4.将蓝牙耳机原听筒拆除,导线外引,接音箱的音频输入。
5.最后,用热熔胶和透明胶带进行固定,组装。
至此,蓝牙音箱DIY就大功告威了。
与电脑进行蓝牙配对后,就能像使用蓝牙耳机那样使用蓝牙音箱了。
其优点在于,大容量的电池让蓝牙使用时间更长,而且不再受“线”制,十分方便。
AC4602杰理蓝牙音响标准原理图
U1
DACR DACL DACVDD VCOM DACVSS FMIP PLLAVSS PLLAVDD LDO_IN AVDD BT_RF AVSS BTXOSCO BTXOSCI
28 27 26 DACVDD 25 24 23 22 21 C3 105 C7
DACR DACL C6 105 105 LINEL C25 L3 LINER C49 R8 FM_ANT C26 LINE_EN C19
2 VCC3V7 1 SP2
LED1
RED
R23 47K 2 S5 RESET
R51 47K
PPLED
2 R7 1K
1
LED2
BLUE
C14 105
INR
INL
1
S2 L2 NC
MODE
R42
9K1 6K2 3K
MT3608
S3 NEXT/VOL+ S4 PREV/VOL-
R50 R56
USB供电,
分升压和不分压两种方式可选。
VCC3V7 R2 0R USBDM USBDP C47 104 C42 100P VBUS 1 2 3 4 5 6 VBUS DM 22K上拉电阻一定要放在主控IC这边.
充电
POWER
DACR DACL USB1 MICRO VBUS DM DP ID GND 1 2 3 4 5 6 7 8 9 10
D2 1N5819 1
R6 2R2
R5 4.7K 102 C36 C37 102
VCC3V7 220uF
BAT
2
VBAT+
2 1
2
C25,L3尽量靠IC放 QQ:1207435600 C15,L4尽量靠IC放 模拟地尽量接功放地或者电池地 USBDM、USBDP尽量走差分线,远离其它的信号线
杰理AC6928A蓝牙、插卡单声道音箱方案原理图.PDF
B、单声道、带过热保护功能音频功放
R4 10K
2、蓝牙匹配电路参数以调试结果为准 3、为保证产品的安全可靠性,电池必须用带保护板的电池。
频偏偏差:±10PPM以内 电容:晶振匹配电容位置请预留
Y1 OSCI
24MHZ OSCO
C、宽工作电压范围2.5V—7V D、超低EMI,高效率,音质优
DACVDD
ADC12/PR1
VCOM
RTCVDD
DACVSS
VBAT
VDDIO
PWMH2H/ADC9/AUX0R/PB5
20 19 18 17 16 15 14 13 12 11
OSCO OSCI GND BT_RF BTAVDD AD_KEY C16 MUTE RTCVDD C17 VBAT PP/LED C4
2、8W输出功率设置: A、8W功率输出的条件:
MUTE C5 105
U1 1 SD 2 BYP
HX8358 VOP 8 GND 7
SPL1 1
+
NC
NC
4 3
C1
C2
VDD=6V,RL=2Ω,Po=8W,THD+N≤10% B、8W功率输出设置:
VBAT R1 33K
3 MODE 4 IN
VDD 6 VON 5
B
TF卡电路
13
12
+3.3V
TF1
4R7 R25
SD_CMD
SD_CLK
SD_DAT R16 3K
1 2 3 4 5 6 7 8 9
DAT2 DAT3 CMD VDD CLK VSS DAT0 DAT1 SW DECT
AC6951C蓝牙音箱方案标准原理图V1.1
C308 105
AUXR
AUXL
C307 105 R305 10K
MIC_BIAS
C302 NC
C309 104
MIC
+ M301 MIC
MIC、PA、Earphone,AUX
B
6
VMCU
C601 224
C602 225
USB5V
U601
6 5 4
C+ VIN C-
VOUT GND EN2、内 Nhomakorabea 锂电 的方 案,RTCVDD可不 接纽 扣电 池,也支 持走 时
C
3、无时 钟的 方案 ,32K晶振 和RTCVDD引脚 悬空
C106 105 C107 105 C108 105
BT_ANT
C104 15P C105 15P
Y101
32.768K
C109
SD_DAT VMCU
+3.3V RTCVDD
注:原理 图中 注释 说明 设计时 需特 别注 意
D
FM_ANT
L101 102P
L102 NC
C101 NC
C102 105
C103 105
SD_CMD SD_CLK PHIN LINEIN AUXL AUXR SD_PWR FM_ANT DACR DACL DACVDD VCOM
48 47 46 45 44 43 42 41 40 39 38 37
D2 D3/CS CMD/DI VSS VDD CLK VSS D0/DO D1
A
3.3K
SD_DET
10 11 12
CD WP SHEET
SD
KEY、SD
13
蓝牙芯片AB5321A标准原理图
300/10K/200K PE4
300/10K/200K PE5
300/10K/200K PE6
300/10K/200K PE7
300/10K/200K PF0
G F E D C B A
7 LED_G 6 LED_F 5 LED_E 4 LED_D 3 LED_C 2 LED_B 1 LED_A
可根据layout的情况调整IO的顺序
R9
S10
5.1K
VOL+
R10
S11
B
7.5K R11
VOLS12
10K
PHONE
R12
S13
15K
NEXT/VOL+
AUXUSB FM SD
VMCU VDDBT SDDAT SDCLK SDCMD PWRKEY BT_ANT VDDBT
C5
C8
104
NC
L3
0R
2
BT-ANT1
1
ANTENNA_PIFA
300/10K/200K PF3 300/10K/200K PF4 300/10K/200K PF5
SEG_LED8888_7P
R13
S14
20K
PREV/VOL-
R14
S15
33K
NC
R15
S16
GND
GND
GND
AB5321A LQFP48 7*7 硬开关蓝牙音箱V1.0
LED
ADKEY
56K
NC
IRDA
LED1
MHZ MP3
PWRKEY
VDDIO
R5 10K ADKEY
R6 1K R7 2K R8
AC6925A双声道蓝牙MP3音箱方案原理图详细说明
1 2 3 4
SD BYP MODE IN
8 7 6 5
C12 226 VMCU
SPR1 1 2 + C
L2
0R NC L4
C16 105 C17 105
R2
33K
R5
10K
R10 15K
按键
按键电路说明: 1、如果要做按键分离, R11上拉电阻最好 放在主板一边 2、AD_KEY走线远离音频线和数据线 3、电阻阻值尽量按我的来设计 4、按键功能定义还可以多加
1
2
3
4 R4 U1
MUTE C5 105 AB/D
MCU 注:原理图中注释说明设计时需特别注意
D
晶振选型: 封装:兼容3225,M49S,HC49S等封装 要求:稳定性、一致性要好, 频偏偏差:±10PPM以内 电容:晶振匹配电容位置请预留
Y1 OSCI NC 24MHZ OSCO NC C2 180NH L1
R26 100R
MIC
通话电路
DACVDD
C20
104
R14 6K2
+ MIC/-38db USB1
VMCU
1 2 3 4
+5V DM DP GND 5 B
B
放电电阻,请预留
POWER2
U盘电路
USBDM USBDP
R11 22K
硬开机电路
VMCU
+3.3V PP/LED R12 1K R13 1K
C4 104 C10 NC
10K
HX8358 VOP GND VDD VON R7 R9 NC 15K
C6 105 DACL
设计注意事项: 1、主控所有电源的退耦电容必须靠近芯片放置, 退耦电容的回路地必须最短回到该电源地. 2、蓝牙匹配电路参数以调试结果为准 3、对FM要求比较高的客户,请预留FM放大电路, 灵敏度可提升2dBu以上。FM信号线铺地, 间距至少0.6MM以上。 4、为保证产品的安全可靠性,电池必须用带保护板的电池。
AC6929C纯蓝牙音箱标准原理图V1.0
OUTN 10
CS8326C
SPK-
R3 22K
C
NC
AC6929C_SOP16
RTCVDD
R6
22K
S1
B
AD_KEY
Power/P/P
0V
C25 NC/100P
R8
S2
33K
PREV/V-
2.0V
R9
S3
51K
NEXT/V+
2.3V
R10 100K
S4 TALK
2.7V
A
KEY
DACVDD
C4 NC
D1
C7 470uF
L2
5
4.7uH
6
D2
9
C9 C12
106 105
LX LX
PVDD
PGND GND GND GND GND
11 1 4 8 7
C11
R4 C22 104 30K
15 IN+
OUTP 12 SPK+
DACL 105
C21 104
R2 22K
R5 C23 104 30K
16 IN-
C3 NC
R11 6.8K
C26 MIC
+
104/224
M1
MIC
MCU
VIN VBAT
7
NC R18
1K
Q1
R16
8850C/9015C
10K D4
BT_LED
D5 RED
BLUE
MIC、LED
6
6
L6
C24
SPK+
1nF
FB
J1
SPK
JL杰理蓝牙音箱AC925F标准原理图标准软件_V1
晶振选型:
封装:兼容3225,M49S,HC49S等封装 要求:稳定性、一致性要好,
频偏偏差:±10PPM以内 电容:晶振匹配电容位置请预留
Y1 OSCI
24MHZ OSCO
BT_ANT
4 3
SDCLK SDCMD SDDAT MIC
C14 105 C6 105 C7 105
U1
B_LED
1 PC5/SD1CLKA
MCU D
C
1
2
设计注意事项: 1、主控所有电源的退耦电容必须靠近芯片放置,
退耦电容的回路地必须最短回到该电源地. 2、蓝牙匹配电路参数以调试结果为准 3、对FM要求比较高的客户,请预留FM放大电路,
灵敏度可提升2dBu以上。FM信号线铺地,
间距至少0. 6MM以上。qq:298391364
4、为保证产品的安全可靠性,电池必须用带保护板的电池。
OSCO OSCI GND
BT_RF BTAVDD AD_KEY MUTE RTCVDD VMCU AUXL AUXR
做耳机使用时接耳机喇叭共用负极
C15 C10 105
2P7
蓝牙天线接法适用倒F型天线 其它的天线要加增益网络
C8 105 C9 105
B_LED R8 1K
播放指示灯
BLED
3
4
音频电路
要音量记忆,开机时是上一次关机时的音量
R9 10K
U2 HX8018
MUTE
1 SD
8 VOP
SPK
C5
105 2
7
1
BYP
GND
+
R3
NC 3
MODE
6 VDD
VMCU
AC6951C蓝牙音箱方案标准原理图V1.1
3 8
BYP BYP
C314 105
C315 105
MIX3901
FB 21
R316 56K 1%
R317
12K 1%
LOUTP LOUTN
11 10
LSPK+ LSPK-
ROUTP ROUTN
14 15
RSPK+ RSPK-
R318
COMP SS
1 2
4.7K
C330 473
C331 472
PGND PGND PGND
背光
J502 BL 1
2
R502 330R/NC
BL_LIGHT R503 NC
BL_LIGHT
R501
3K/NC Q501
9014C/NC
R504 NC
U501 IR
1 IR 2 GND 3 VCC
IRDA
DACVDD
C504 NC/105
红外 接收 头供 电接 DACVDD
LED、LCD、IR
功 放端 物料 , 根 据实 际电 路去 精 简
10 LCD_RES
11 LCD_CS
+3.3V
C503 104
LCD128*64-11P
J501
MP3
FM
C/S C/S C/S C/S C/S C/S C/S
7 6 5 4 3 2 1
C/S7 C/S6 C/S5 C/S4 C/S3 C/S2 C/S1
II SD
USB
LED-4_8S-7P
VMCU
DACVSS HPVDD
SEG20/MIC/PC6 AUX0L/SEG21/SEG0/MIC_BIAS/PA0/PC7
杰理蓝牙MP3音箱方案原理图-1.0
2
主控电路
设计注 意事项:
D
1、主控所 有电源的 退耦电容必须靠近芯片 放置,退耦电容的回路 地必须最短 回到该电源地
4、为保证 产品的安 全可靠性,电池必 须使用带 保护板的电池。 5、TF 卡和U盘的线 为数据线 ,PCB LAYOUT时要远 离音频信号线。 6、晶振、蓝牙天线附近和 底面不能有 走线。 QQ:1207435600
24 BTOSCI
23 BTOSCO
22
21
C19 12P
20
19
C3 105
18 ADK_KEY
17 MUTE
16 RTCVDD C16 105
15
14 BT_VCC C15 105
13 VCC3V3 C17 105
D
电容地 要接到就 近就主控的 GND
串吕&IR&EP
串口接口
1 2 3 4
BT_VCC UART_RX UART_TX
红外摇控
3 2 1
VCC3V3 IR_MIC
耳机输出
DACR DACL
R7 10R R1310R
EP_EN C4 106
C5 106
1 2 3 4
1 2 3 4
C
2
IR_MIC C24 105 R23 6K8
DACVDD
+
-38db MIC
1
10
11
按键电路
1、如果不用按键,一定要接R7电阻
电源电路
功放电路
B
R5
22K VCC3V3
ADK_KEY
R1
0R
K11 播放/暂停
R2
3K
K12 上一曲/快退
AC6928A蓝牙方案标准原理图V1.1
10K
RED
A
D4
LED
MCU
DACVDD
C4 NC
C3 NC
R11 6.8K
C26 MIC
+
104/224
M1
MIC
+3.3V
R13 4.7R
R14 3.3K
SD_CMD
SD_CLK C5
105/NC SD_DAT
TF1
10 9 1 2 3 4 5 6 7 8 11
CD WP D2 D3/CS CMD VDD CLK VSS D0 D1 Sheet
5 6
LX LX
D1
D2
C7
C9
9
C12
PVDD
PGND GND GND GND GND
11 1 4 8 7
C
USB预留测试点
SD_CLK
SD_CMD
USBDM SD_DAT
USBDP LIN_L/R
MIC
C14 C13
105/224 105/224
DACL
DACVDD
VCOM
AGND
+3.3V
1 2 3 4 5 6 7 8 9 10
SD-TF
6
6
L6
C24
SPK+
1nF
FB
J1
SPK
SPK-
L7
FB
C27
1nF
J2
VIN
D3
VBAT
6
IN5822
+5V LIN_L AGND LIN_R
GND
1 2 3 4 5
R15 4.7R C18 224/105 LIN_L/R
AC6925A立体声蓝牙方案标准原理图V1.0
DACL
DACVDD
VCOM
AGND
+3.3V
U1
1 2 3 4 5 6 7 8 9 10 11 12
PC5/SD1CLKA
BT_OSCO
PC4/SD1CMDA/ADC4
BT_OSCI
PC3/SD1DATA/ADC10
VSSIO
USBDM/ADC11
FMIP
USBDP
BT_RF
PA0/MIC/PA4/AUX1R/ADC1 BT_AVDD
A
Power
1
2
3
4
C18 470uF
6.8uH
SS54
D
9 13
U2
SW 22
PVDD PVDD
4、为保证产品的安全可 靠性,电池必须使用带保护 板的电池。
C1
C2
NC
NC
24 AVDD
R7
FM_ANT
C
SD_CLK
SD_CMD
SD_DAT
USBDM
USBDP
MIC
DACR
C23 C22
105/224 105/224
BYP BYP
MIX3901
FB 21
30K R8 30K
LOUTP LOUTN
11 10
LSPK+ LSPK-
ROUTP ROUTN
14 15
RSPK+ RSPK-
R11
COMP SS
1 2
4.7K
C
C24 105/224
AC6925A_QSOP24
MCU
C10
C11
105
105
C30
C31
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
IMPORTANT NOTICE FOR TI REFERENCE DESIGNSTexas Instruments Incorporated("TI")reference designs are solely intended to assist designers(“Buyers”)who are developing systems that incorporate TI semiconductor products(also referred to herein as“components”).Buyer understands and agrees that Buyer remains responsible for using its independent analysis,evaluation and judgment in designing Buyer’s systems and products.TI reference designs have been created using standard laboratory conditions and engineering practices.TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design.TI may make corrections,enhancements,improvements and other changes to its reference designs.Buyers are authorized to use TI reference designs with the TI component(s)identified in each particular reference design and to modify the reference design in the development of their end products.HOWEVER,NO OTHER LICENSE,EXPRESS OR IMPLIED,BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT,AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT,IS GRANTED HEREIN,including but not limited to any patent right,copyright,mask work right, or other intellectual property right relating to any combination,machine,or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services,or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.TI REFERENCE DESIGNS ARE PROVIDED"AS IS".TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS,EXPRESS,IMPLIED OR STATUTORY,INCLUDING ACCURACY OR COMPLETENESS.TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE,QUIET ENJOYMENT,QUIET POSSESSION,AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF.TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON A COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN.IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,SPECIAL,INCIDENTAL,CONSEQUENTIAL OR INDIRECT DAMAGES,HOWEVER CAUSED,ON ANY THEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES,ARISING IN ANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER’S USE OF TI REFERENCE DESIGNS.TI reserves the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.Reproduction of significant portions of TI information in TI data books,data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures,monitor failures and their consequences,lessen the likelihood of dangerous failures and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in Buyer’s safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed an agreement specifically governing such use.Only those TI components that TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk,and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。