中高压电容器MLCC贴片电容器规格书

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C系列TDK高压瓷片电容命名规格书

MULTILAYER CERAMIC CHIP CAPACITORS
C Series Commercial Grade Mid Voltage (100 to 630V)
Type:
C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220]
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Notice: Effective January 2013, TDK will use a new catalog number which adds product thickness and packaging speciﬁcation detail. This new catalog number should be referenced on all catalog orders going forward, and is not applicable for OEM part number orders. Please be aware the last ﬁve digits of the catalog number will differ from the item description (internal control number) on the product label. Contact your local TDK Sales representative for more information.

2211(X7R)贴片陶瓷电容器规格书说明书

2 倍额定电压
电压 250V＜V＜1KV 1.5 倍额定电压
1KV≤V
1.2 倍额定电压
在常温常湿下放置 48±4 小时后再测试.
注：NO3，11，12，13 电容的初值测定：先放在 150℃预热 1 小时,再常温常压放置48 小时测试。
第 5 页共 14 页
No 项目
规格
测试方法
使用混合焊锡将电容器焊接在图1 的夹具(玻璃环氧树脂)上,然后再图 2 所释放向加力. 焊接应用回流焊进行,避免焊接不均及热冲击等不良现象.
第 8 页共 14 页
第 9 页共 14 页
第 10 页共 14 页
第 11 页共 14 页
第 12 页共 14 页
第 13 页共 14 页
第 14 页共 14 页
6
耐电压
无介质被击穿或损伤
Ur=450/500/630V,1.5倍额定电压
（DC）
1KV≤Ur≤2KV,........ 1.2倍额定电压
2KV＜Ur,............... 1.1 倍额定电压升压时间为：1～3S 保压时间为：5S
7
可焊性
■上锡率应大于 95% ■外观无可见损伤
将电容器在 80-120℃预热 10-30 秒,无铅焊料,使用助焊剂；焊锡温度：245±5℃
测试电压:额定电压测
试时间:60±5 秒测试
5
绝缘电阻
IR≥4*109Ω,C≤25nF
湿度:≤75% 测试
IR*Cr≥100*1012Ω,C＞25nF 温度:25±5℃
测试充放电电流:≤50mA
Ur=100V,............. 2.5 倍额定电压
Ur=200V/250V,.... 2.0 倍额定电压

各类贴片电容容值规格参数表

各类贴片电容容值表X7R贴片电容简述X7R贴片电容属于EIA规定的Class 2类材料的电容。

它的容量相对稳固。

X7R贴片电容特性具有较高的电容量稳定性，在-55℃～125℃工作温度范围内，温度特性为±15%。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于隔直、耦合、旁路、鉴频等电路中。

X7R贴片电容容量范围厚度与符号对应表0201～1206 X7R贴片电容选型表1210～2225 X7R贴片电容选型表NPO COG 贴片电容容量规格表2009-07-15 16:28 阅读354 评论1 字号：大中小NPO(COG)贴片电容属于Class 1温度补偿型电容。

它的容量稳定，几乎不随温度、电压、时间的变化而变化。

尤其适用于高频电子电路。

具有最高的电容量稳定性，在-55℃～125℃工作温度范围内,温度特性为：0±30ppm/℃(COG）、0±60ppm/℃(COH）。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于各种高频电路,如:振荡、计时电路等。

咱们把用来制造片式多层瓷介电容（MLCC）的陶瓷叫电容器瓷。

那个地址所说的瓷介确实是用电容器瓷制成的陶瓷介质。

大伙儿明白，陶瓷是一类质硬、性脆的无机烧结体。

就其显微结构而论，多数具有多晶多相结构。

其性能往往决定于其成份和结构。

当配方确信以后，可否达到预期的成效，关键取决于制造陶瓷粉料的工艺。

按其用途能够分为三类：①高频热补偿电容器瓷（UJ、SL）；②高频热稳固电容器瓷（NPO）；③低频高介电容器瓷（X7R、Y5V、Z5U）。

按温度系数分能够分为两类：①负温度系数电容器瓷（即高频热补偿电容器瓷）；②正温度系数电容器瓷（即平常咱们常说的COG、X7R、Y5V瓷料）。

按工作频率能够分为三类：低频、高频、微波介质。

高频热补偿、热稳固电容器瓷是专供Ⅰ类瓷介电容器作介质用，其瓷料要紧成份是MgTiO3、CaTiO3、SrTiO3和TiO2再加入适量的稀土类氧化物等配制而成。

最全贴片电容规格书

贴片电容的材质规格贴片电容的材质规格贴片电容(MLCC)Multilayer Ceramic Capacitor常规贴片电容按材料分为COG(NPO)、X7R、Y5V，常见封装有0201、0402、0603、0805、1206、1210、1812、2010。

NPO、X7R、Z5U和Y5V的主要区别是它们的填充介质不同。

在相同的体积下由于填充介质不同所组成的电容器的容量就不同，随之带来的电容器的介质损耗、容量稳定性等也就不同。

所以在使用电容器时应根据电容器在电路中作用不同来选用不同的电容器。

上表可看出各个不同材料的温度特性一 NPO电容器NPO是一种最常用的具有温度补偿特性的单片陶瓷电容器。

它的填充介质是由铷、钐和一些其它稀有氧化物组成的。

NPO电容器是电容量和介质损耗最稳定的电容器之一。

在温度从-55℃到+125℃时容量变化为0±30ppm/℃，电容量随频率的变化小于±0.3ΔC。

NPO电容的漂移或滞后小于±0.05%，相对大于±2%的薄膜电容来说是可以忽略不计的。

其典型的容量相对使用寿命的变化小于±0.1%。

NPO电容器随封装形式不同其电容量和介质损耗随频率变化的特性也不同，大封装尺寸的要比小封装尺寸的频率特性好。

NPO电容器适合用于振荡器、谐振器的槽路电容，以及高频电路中的耦合电容。

二 X7R电容器X7R电容器被称为温度稳定型的陶瓷电容器。

当温度在-55℃到+125℃时其容量变化为15%，需要注意的是此时电容器容量变化是非线性的。

X7R电容器的容量在不同的电压和频率条件下是不同的，它也随时间的变化而变化，大约每10年变化1%ΔC，表现为10年变化了约5%。

X7R电容器主要应用于要求不高的工业应用，而且当电压变化时其容量变化是可以接受的条件下。

它的主要特点是在相同的体积下电容量可以做的比较大。

三 Z5U电容器Z5U电容器称为”通用”陶瓷单片电容器。

村田贴片电容规格书

Q EIA 0201 0202 0303 0504 0402 0603 X
关于排列型GNM系列,“厚度”表示单元个数。
0805 1111 1206 1210
16
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尤其，有些产品请务必阅读其品级，或!注意事项 (保管、使用环境、品级上的注意事项、装配时的注意事项、使用时的注意事项)，否则有可能出现冒烟、起火等情况。 • 产品检索引擎 (http://search.murata.co.jp/) 或产品目录数据库 (/catalog/) 上登载有详细规格，因此，在索取规格表，或互换协商定案图之前可阅览其详细规格。
静电容量阶段 E24 Series,1pF * 1pF E24 Series,1pF * 1pF E24 Series E12 Series E24 Series E12 Series E24 Series E6 Series E12 Series E3 Series E6 Series E3 Series E3 Series
电容器
04.2.25
接上页。
o个别规格代号用3个数字来表示。 !0包装方式代号 L D K J E F B C T 包装方式 ø178mm 塑料带包装 ø178mm 纸带包装 ø330mm 塑料带包装 ø330mm 纸带包装 ø178mm 特殊包装 ø330mm 特殊包装散装袋包装散装盒包装散装浅盘包装
u静电容量以pF为单位,用3个数字或文字来表示。头2个字表示有效数字,第3个数字则表示有效数字后的0的个数。有小数点时以 "R" 为表示小数点,此时3个数字都是有效数字。 Ex.) 代号 R50 1R0 100 103 静电容量 0.5pF 1.0pF 10pF 10000pF

各介质种类MLCC电容器规格书

一、概述●电容器及介质种类：※高频类：此类介质材料的电容器为Ⅰ类电容器，包括通用型高频COG、COH电容器和温度补偿型高频HG、LG、PH、RH、SH、TH、UJ、SL电容器。

其中COG、COH电容器电性能最稳定，几乎不随温度、电压和时间的变化而变化，适用于低损耗，稳定性要求高的高频电路，HG、LG、PH、RH、SH、TH、UJ、SL电容器容量随温度变化而相应变化，适用于低损耗、温度补偿型电路中。

※X7R、X5R：此类介质材料的电容器为Ⅱ类电容器，具有较高的介电常数，容量比Ⅰ类电容器高，具有较稳定的温度特性，适用于容量范围广，稳定性要求不高的电路中，如隔直、耦合、旁路、鉴频等电路中。

※Y5V：此类介质材料的电容器为Ⅱ类电容器，是所有电容器中介电常数最大的电容器，但其容量稳定性较差，对温度、电压等条件较敏感，适用于要求大容量，温度变化不大的电路中。

※Z5U：此类介质材料的电容器为Ⅱ类电容器，其温度特性介于X7R和Y5V之间，容量稳定性较差，对温度、电压等条件较敏感，适用于要求大容量，使用温度范围接近于室温的旁路，耦合等，低直流偏压的电路中。

SUMMARY●Types of Dielectric Material and Capacitor※HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor,including high frequency COG、COH capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH, TH, UJ, SL. The electrical properties of COG、COH capacitor are the most stable one and changeinvariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HG，LG，PH，RH，SH，TH，UJ，SL capacitor’s capacitance changes with temperature.They are suited for applications where low-losses and temperature compensating circuits.※X7R、X5R：X7R、X5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱcapacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc.※Y5V：The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc.※Z5U：The capacitor made of this kind of material is considered as ClassⅡcapacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature.型号Type英制表示公制表示WBWB三、型号规格表示方法HOW TO ORDER0805 CG 101 J 500 N T①②③④⑤⑥⑦※说明NOTES：①尺寸DIMENSIONS单位（unit）：inch/ mm尺寸规格S ize C o d e0402 0603 0805 1206 1210 1808 1812 2220 2225 3035 长×宽(L×W)in c h0.04×0.02 0.06×0.03 0.08×0.05 0.12×0.06 0.12×0.10 0.18×0.08 0.18×0.12 0.22×0.20 0.22×0.25 0.30×0.35 长×宽(L×W)m m1.00×0.50 1.60×0.802.00×1.253.20×1.60 3.20×2.504.50×2.00 4.50×3.205.70×5.00 5.70×6.307.60×9.00.②介质种类DIELECTRIC STYLE介质种类(Dielectric Code)CG CH HG LG PH RH SH TH UJ SL X B E F 介质材料(Dielectric)COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V③标称容量NOMINAL CAPACITANCE单位(unit)：pF表示方式(Express Method)实际值(Actual V alue)0R5 0.5 1R0 1.0 102 10×102 224 22×104… … 注：头两位数字为有效数字，第三位数字为0的个数；R为小数点。

MLCC规格书

0805
2012
2.00±0.20
1206
1210 1808 1812 2220 2225
3216
3225 4520 4532 5750 5763
3.20±0.30
3.20±0.30 4.50±0.40 4.50±0.40 5.70±0.50 5.70±0.50
尺寸（mm）
W 0.30±0.03 0.50±0.05 0.80±0.10
4
6.3
10
16
1808
25
(4532)
50
100
250
500
1000
2000
3000
4000
电容量范围
---------0.5PF---33000PF 0.5PF---33000PF 0.5PF---33000PF 0.5PF---33000PF 0.5PF---12000PF 0.5PF----3300PF 0.5PF----2200PF 0.5PF---1000PF
and microwave application requiring high Q, low ESR, and high resonant frequency.
产品结构图 FORMANCE CHARACTERISTICS
产品型号代码 ORDERING CODE
常规产品代码：
例 EX： CB
① HQ 产品代码：
Page 7 of 28

常规COG产品介质电容器容值范围
材质类型
尺寸
耐压值（V）
4
6.3
10 16
25
1812
50
(4532)
100
250
500

风华中高压贴片电容规格书

MULTILAYER CHIP CERAMIC CAPACITOR(:)DC Medium-voltage MLCCDC medium-voltage MLCC has good high-voltage reliability,it is made in special design that based on the MLCC technology and equipments.It is suitable for surface-mounting ,can improve the properties of circuits.New monolithic structureThe size of the capacitor is small,yet has high electrostatic capacitance,can operate at high-voltage levels.Has good solderability.Technology Parameter (refer to the picture below):DC-DC converter.The circuit filter and vibration bell of telephone,electrograph and modem.Snubber circuit for switching power supply.FeaturesApplicationsProduct Part Number Expression1206CG100J202NTWMULTILAYER CHIP CERAMIC CAPACITORCapacitance RangeOutside DimensionWMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITOR【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R 1808 (V)10018122225200 200 200 5001000 2000 3000 4000 100 500 1000 2000 3000 4000 100 500 1000 2000 3000 4000 5000 /250 /250 /250100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3 F 10 F 22 F75【南京南山半导体有限公司 — 贴片电容选型资料】ItemX7R Medium-voltage MLCCDielectric 1808 1812 2225 Size Rated 100 200 5001000 2000 3000 4000 100 200 500 1000 2000 3000 4000 100 200 500 1000 2000 3000 4000 5000 /250 /250 Volatage(V) /250 Capacitance 100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3. F 10 F 22 F76【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V 0603 (V) 100 100 0805 200 250 100 1206 200 250 100 1210 200 250 100 1812 200 250 100 2225 200 2501000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 F 2.2 3.3 10 F F F77【南京南山半导体有限公司 — 贴片电容选型资料】ItemY5V Medium-voltage MLCC 1210 100 200 250 100 1812 200 250 100 2225 200 250Dielectric 0603 0508 1206 Size Rated Volatage(V) 100 100 200 250 100 200 250 Capacitance 1000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 2.2 3.3 10 F F F F78【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG1-551251. 2. 3. 2 4. , , , , , 105.3 4 :HP4278A 1. 2. 5 (D.F.) 3. HP4284 25 5 :30% 75% 1.0 0.2V C<1000PF,1.0 0.1MHz; C 1000PF,1.0 0.1KHZ :10( :SF2511) >500V6I.R. 500V: , 60 5>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA 150+0/-10 60 55S 5S 5S824 2 -55 125 25975235 5 5 2 0.5 150+0/-10 5% 0.5PF, 10 1 D.F. 24 2 265 5 24 2 25 2.5mm/ : 25 2.5mm/ 60 524510I.R.1 2100 170120 2001 179【南京南山半导体有限公司 — 贴片电容选型资料】Middle and high Voltage COG MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed innerelectrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified toleranceCr 5PF 0.56% -4 5PF Cr 50PF 1.5[(150/Cr)+7] 10 Cr 50PF 0.15%Check by using microscope10.3 4Dimensions Capacitance Dissipation Factor (DF) Insulation ResistanceUsing micrometer or vernier calipers Measuring Equipment:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30%~75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and if Ur>500V,then just use 500V,measure the IR within 60 1 seconds. Ur Max. Current Measuring Time 1000V 1000V 2000V 2000V 50mA 50mA 10mA 5S 5S 5S56C<10nF,IR 5 10 C>10nF,IR CR 500S10Withstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur8Must meet the capacitor Capacitance temperature coefficient Temperature requirements within the Characteristics operating temperature range. Solderability Tin coverage 75% should be of the outer electrode covered by Tin Appearance Cap. Change ratio No defects visible 5% or 0.5PF whichever is bigger Same as original standard Same as original standardFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55~125 or 55~85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 eutectic solder solution for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minutes 1minutes9 Resistance to Soldering10DFIR80【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz10 55Hz 10Hz 2 6 123 420 mmmm3mm mm mm mmmm150+0/-10 14 24 260 524 281【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Adhesive Strength of TerminationStandard No removal of the termination or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc.11Fig.1 Vibration Resistance10N,10 1s Speed:1.0mm/s Glss epoxy resin board12Appearance No defects or Solder the capacitor to the test jig (glass epoxy resin abnormities board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the Capacitance Within the frequency being varied uniformly between the specified approximate limits of 10 and 55Hz, shall be traversed tolerance range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 DF Same as hours in each 3 mutually perpendicular directions original (total is 6 hours). standardFig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown in Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mmmm13mmmm mmmmTemperature Cycle 14Appearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, the measure.82【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, min. 14 D.F. I.R. 10000M 1 2 3 4 2 3 30 2 30 2 3 3 3 34029095 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M1.5 50mA ( 5% 0.5PF, 16 .) >2000V100012 24 21.2D.F. I.R. 10000M83【南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Temperature CycleStandard Cap. Change ratio 2.5% or 0.25PF whichever is larger Same as original standard More than 10000M Heat-treatment:Test MethodD.F. 14 I.R.Stage Temperature Time 1 lowest operating temperature 3 30 2 2 Room Temperature 3 Highes operating temperature 2 30 4 Room Temperature 2min. 3 3 3 3Humidity Steady State 15AppearanceNo defects or abnormities 5% or 0.5PF whichever is larger Same as original standard More than 10000M No defects or abnormities 5% or 0.5PF (whichever is larger) Same as original standard More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.Cap. Change ratioD.F.I.R. Life Test AppearanceCap. Change ratio 16Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2times Ur to test)D.F.I.R.84【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R1-551251. 2. 3. 2 4. , , , , , 105.3 4 : HP4278A HP42845(D.F.)25010-41.255:30% 75% 2. 3. : :1.0 :1.0 0.2V 0.1KHz ( :SF2511 ) >500V , 60 56I.R.C 25nF,IR 10000M C>25nF,R C 500S 500V:>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA5S 5S 5S150+0/-10 24 8 25 -55 125 2605235 9 75 245 5 25 2.5mm/ 2 0.5585【南京南山半导体有限公司 — 贴片电容选型资料】General X7R MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of the termination width. Within the specified dimensions Within the specified tolerance 250 10-4Check by using microscope10 .3 4Dimensions Capacitance Dissipation Factor (DF)5Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency:1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 1 seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5SInsulation Resistance 6C 25nF,IR 10000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000V8Capacitance Temperature CharacteristicsMust meet the capacitor character temperature coefficient requirements within the operating temperature range. 75% of the outer electrode should be covered by TinFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 ,then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 245 5 eutectic solder solution for 2 0.5 seconds. Dipping speed:25 2.5mm/second.Solderability 986【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 10% D.F. 10 I.R. 25 : 10 1 24 2 26560 5 24522.5mm/1 2100 170120 2001 1110N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 55Hz 55Hz 10Hz 1 2 12 6 1023 13 ( ) 487【南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Within 10% ratio DF 10 IR Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defect shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1388【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mmmmmm13mmmmmmmmmin. 20% 1 2 14 D.F. I.R. 3 4 2 3 30 2 30 2 3 3 3 340 20% 15 ( ) D.F. I.R.29095 48 2500+24/-01.5 20% .) 16 D.F. I.R 50mA ( >2000V100012 24 21.289【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmmmm13mm mmmmTemperature CycleAppearanceNo defects or abnormities 20%Cap. Change Within ratio 14Stage Temperature Time min. 1 Min. Operating Temperature 3 30 3 2 Room Temperature 2 3 3 Max. Operating Temperature 2 30 3 4 Room Temperature 2 3D.F.Same as original Specification Same as original Specification No defects or abnormities 20% Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 48 2 hours at room temperature, then measure.I.R.Humidity Steady StateAppearanceCap. Change within ratio D.F.15 I.R. Life Test AppearanceSame as original Specification Same as original Specification No defects or abnonrmities 20% Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2Ur to test.)Cap. Change within ratio 16 D.F.Same as original specification Same as original specificationI.R.90【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V1-25~851. 2. 3. 2 4. 5. , , , , ,103 4 : HP4278A 1. 5 (D.F.) 500 10-4HP4284 25 5 75% 0.2V 0.1kHz:30% 2. 3. : :1.0 :1.06I.R.C 25nF,IR 40000M C>25nF,R C 500S( : ,: SF2511 60 5)7>300V >400V >500V100V 200V 250V50mA 50mA 50mA5S 5S 5S150+0/-10 8 24 -25 85 2605 25975235 25 0.52455 25 2.5mm/91【南京南山半导体有限公司 — 贴片电容选型资料】General Y5V MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -25 85 Standard Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified tolerance 500 10-4Check by using microscope10.3 4Dimensions Capacitance) Dissipation Factor (DF)Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency: 1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 5seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5S5Insulation Resistance 6C 25nF,IR 40000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000VCapacitance Temperature Characteristics 8Must meet the capacitor temperature coefficient requirements within the operating temperature range.First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55 125 or 55 85 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 235 5 (or 245 5 leadless eutectic solder solution) eutectic solder solution hanging lead for 2 0.5seconds. Dipping speed: 25 2.5mm/second.Solderability 975% of the outer electrode should be covered by Tin92【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 30% D.F. I.R. 10 60 5 24 22655 24 2 25 2.5mm/ :1011 2100 170120 200 11 110N11 10N,10 1 :1.0mm/ 11.5mm D.F. 10 55Hz 12 55Hz 10Hz 1 2 6 1023 ( 13 ) 493【南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Z5U, Y5V: within ratio DF 10 IR30%Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defects shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1394【南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mm mmmm13mm mmmmmm30%min. 1 2 3 4 3 2 30 2 30 2 3 3 3 3D.F. 14 I.R.40 30%29095 48 2500+24/-015()D.F. I.R.30% 16 D.F. I.R 48 21.5 50mA10001295【南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmm13mmmmmmmmTemperature CycleAppearanceNo defects or abnonrmities 2.5Cap. Change Within ratio 14Stage Temperature Time 30 1 Min. Operating Temperature 3 2 Room Temperature 2 3 Max. Operating Temperature 2 30 4 Room Temperature 2min. 3 3 3 3D.F.Same as original spec. Same as original spec. No defects or abnonrmities Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.I.R.Humidity Steady State 15AppearanceCap. Change within 30% ratio Same as D.F. original spec. I.R. Same as original spec. No defects or abnonrmities 30%Life TestAppearanceCap. Change within ratio 16 D.F.Same as original spec. Same as original spec.Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.I.R.96。

各种贴片电容容值规格参数表

各种贴片电容容值表X7R贴片电容简述X7R贴片电容属于EIA规定的Class 2类材料的电容。

它的容量相对稳定。

X7R贴片电容特性具有较高的电容量稳定性，在-55℃～125℃工作温度范围内，温度特性为±15%。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于隔直、耦合、旁路、鉴频等电路中。

X7R贴片电容容量范围厚度与符号对应表0201～1206 X7R贴片电容选型表1210～2225 X7R贴片电容选型表NPO COG 贴片电容容量规格表默认分类 2009-07-15 16:28 阅读354 评论1字号：大大中中小小NPO(COG)贴片电容属于Class 1温度补偿型电容。

它的容量稳定，几乎不随温度、电压、时间的变化而变化。

尤其适用于高频电子电路。

具有最高的电容量稳定性，在-55℃～125℃工作温度范围内,温度特性为：0±30ppm/℃(COG）、0±60ppm/℃(COH）。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于各种高频电路,如:振荡、计时电路等。

我们把用来制造片式多层瓷介电容（MLCC）的陶瓷叫电容器瓷。

这里所说的瓷介就是用电容器瓷制成的陶瓷介质。

大家知道，陶瓷是一类质硬、性脆的无机烧结体。

就其显微结构而论，大都具有多晶多相结构。

其性能往往决定于其成份和结构。

当配方确定之后，能否达到预期的效果，关键取决于制造陶瓷粉料的工艺。

按其用途可以分为三类：①高频热补偿电容器瓷（UJ、SL）；②高频热稳定电容器瓷（NPO）；③低频高介电容器瓷（X7R、Y5V、Z5U）。

按温度系数分可以分为两类：①负温度系数电容器瓷（即高频热补偿电容器瓷）；②正温度系数电容器瓷（即平时我们常说的COG、X7R、Y5V瓷料）。

按工作频率可以分为三类：低频、高频、微波介质。

高频热补偿、热稳定电容器瓷是专供Ⅰ类瓷介电容器作介质用，其瓷料主要成分是MgTiO3、CaTiO3、SrTiO3和TiO2再加入适量的稀土类氧化物等配制而成。

高压陶瓷贴片电容

使用注意事项
使用本产品前，请务必阅读
安全注意事项
注意
1. 2. 3. 4. 5. 6. 7.
计划将本产品目录中记载的产品用于可能对人身安全或对社会造成重大损失的用途时，请务必通知本公司的销售窗口。本产品目录中记载的产品因改良及其他原因可能在不经预告的情况下进行变更或停止供应。关于本产品目录中记载的产品，本公司备有记载了各产品的规格及安全注意事项的 “ 交货规格书 ”。在选用产品时，建议签定交货规格书。在出口本产品目录中记载的产品时，有时会被归为 “ 外汇及外贸管理法 ” 中规定的管制货物等。在这种情况下，需要有依据该法规定的出口许可。关于本产品目录的内容，未经本公司许可不得擅自转载或复制。因使用本产品目录中记载的产品而发生涉及本公司或第三者的知识产权及其他权利的问题时，本公司对此将不承担责任。并且，本公司不对该等权利的实施权办理许可。本产品目录适用于从本公司或本公司的正规代理商购买的产品。从其他第三者购买的产品不在适用范围之内。
EIA CC2220 [C5750]
C0G 代码
103 123 153 183 223 273 333 J:±5%
3A (1KV)
标称厚度 2.80 mm
为了能够更加正确、安全地使用产品，请务必索取能进一步确认详细特性、规格的采购规格书。记载内容可能因为产品改良等原因不经预告而更改，恕不另行通知。
目录型号 C1608C0G1E103J(080AA) C1608C0G1E103J080AA
交货型号（交货标签上的标识） C1608C0G1E103JT000N C1608C0G1E103JT000N
20160829 / mlcc_reminders.fm
(1/5)

各类贴片电容容值规格参数表

各类贴片电容容值表X7R贴片电容简述X7R贴片电容属于EIA规定的Class 2类材料的电容。

它的容量相对稳固。

X7R贴片电容特性具有较高的电容量稳定性，在-55℃～125℃工作温度范围内，温度特性为±15%。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于隔直、耦合、旁路、鉴频等电路中。

它的容量稳定，几乎不随温度、电压、时间的变化而变化。

尤其适用于高频电子电路。

具有最高的电容量稳定性，在-55℃～125℃工作温度范围内,温度特性为：0±30ppm/℃(COG）、0±60ppm/℃(COH）。

层叠独石结构，具有高可靠性。

优良的焊接性和和耐焊性，适用于回流炉和波峰焊。

应用于各种高频电路,如:振荡、计时电路等。

咱们把用来制造片式多层瓷介电容（MLCC）的陶瓷叫电容器瓷。

那个地址所说的瓷介确实是用电容器瓷制成的陶瓷介质。

大伙儿明白，陶瓷是一类质硬、性脆的无机烧结体。

就其显微结构而论，多数具有多晶多相结构。

其性能往往决定于其成份和结构。

当配方确信以后，可否达到预期的成效，关键取决于制造陶瓷粉料的工艺。

按其用途能够分为三类：①高频热补偿电容器瓷（UJ、SL）；②高频热稳固电容器瓷（NPO）；③低频高介电容器瓷（X7R、Y5V、Z5U）。

按温度系数分能够分为两类：①负温度系数电容器瓷（即高频热补偿电容器瓷）；②正温度系数电容器瓷（即平常咱们常说的COG、X7R、Y5V瓷料）。

按工作频率能够分为三类：低频、高频、微波介质。

高频热补偿、热稳固电容器瓷是专供Ⅰ类瓷介电容器作介质用，其瓷料要紧成份是MgTiO3、CaTiO3、SrTiO3和TiO2再加入适量的稀土类氧化物等配制而成。

贴片电容(MLCC)试验指导书0.1

低温：-25℃
1.NPO：△C/C≤±2.5%或±0.25PF的其中较大者；
3
温度冲击
高温：+85℃ 保持时间：30分钟室温转换时间不超过3分钟循环次数：5次试验后在标准大气条件下恢
1
10
绝缘电阻≥1000M ；
0
2.X5R、X7R：△C/C≤±12.5%，tgδ≤2倍初始值；绝缘电阻≥900M ；
1.Ⅰ类:外观无明显异常及可见损伤， △C/C≤±2.5%或±0.25PF的其中较大者 1 10 0 绝缘电阻≥1000M 或Rj×C≥25s 2.Ⅱ类: (1)显微镜下检查，外观无明显异常及可见损伤 (2)X7R/X5R:△C/C≤±12.5%；tgδ≤2倍初始值绝缘电阻≥900M 或Rj×C≥25s 1 10 0 (3)Y5V:△C/C≤±30%；tgδ≤1.5倍初始值绝缘电阻≥400M 或Rj×C≥25s(UR≥25v) 绝缘电阻≥400M 或Rj×C≥5s(UR≤16V)
6
绝缘耐压测试夹具上，给样
耐压试验
品两端施加直流电压，然后缓慢调节电压，直至样品击
1
5
NPO：击穿电压≥6倍额定电压 0 X7R/X5R：击穿电压≥4倍额定电压"
穿，记录此电压值。
Ⅰ类陶瓷电容测试条件
标称容量 C≤1000PF C＞1000PF
测试频率测试电压 1MHz 1KHz
1Vrms
备 Ⅱ类陶瓷电容测试条件
C≤10μF C≤100PF
1KHz 1MHz
1Vrms
注 1、MLCC需要（除了NPO材质的电容）预处理后再进行试验，处理条件如下：150℃放置1小时，取出后在标准大气条件下恢复24小时 2、高压MLCC（500V以上）要做抗电强度测试，抗电强度测试时施加1.25倍额定电压*60S 3、2、4试验后的恢复时间定为：NPO、X7R、X5R（<104)24小时，Y5V及X5R（>=104)48小时； 4、本试验需要样品数量为50PCS，试验周期：七天（含预处理时间）

华新高压电容规格书

1. INTRODUCTIONWTC middle and high voltage series MLCC is designed by a special internal electrode pattern, which can reduce voltage concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords increased capacitance values in a given case size and voltage rating.Chips size 1206 and larger to use on reflow soldering process only. Capacitors with X7R dielectrics are not intended for AC line filtering applications. Capacitors may require protective surface coating to prevent external arcing.4. HOW TO ORDER1808100202SizeInch (mm) 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532)DielectricN =NP0 (C0G) B =X7R F =Y5VCapacitanceT wo significant digits followed by no. of zeros. And R is in place of decimal point.eg.: R47=0.47pF 0R5=0.5pF 1R0=1.0pF 100=10x100 =10pFT oleranceB =±0.1pFC =±0.25pFD =±0.5pF G =±2% J =±5%K =±10% M =±20% Z =-20/+80% Rated voltageT wo significant digits followed by no. of zeros. And R is in place of decimal point.201=200 VDC 251=250 VDC 501=500 VDC 631=630 VDC 102=1000 VDC 152=1500 VDC 202=2000 VDC 302=3000 VDCTerminationL =Ag/Ni/Sn (for NP0 dielectric) C =Cu/Ni/Sn (for X7R*, Y5V dielectric) PackagingT =7” reeled G =13” reeled * Partial X7R items are with Ag/Ni/Sn terminations, please ref to below product range of X7R dielectric for detail.2. FEATURESa. High voltage in a given case size.b. High stability and reliability. 3. APPLICATIONSa. Snubbers in high frequency power converters.b. High voltage coupling/DC blocking.c. DC-DC converters.d.Back-lighting inverters5. EXTERNAL DIMENSIONS6. GENERAL ELECTRICAL DATADielectric NP0 X7R Y5VSize0603, 0805, 1206, 1210, 1808, 18120805, 1206, 1210, 1812 Capacitance*0.5pF to 6800pF 100pF to 0.47µF 0.01µnF to 0.68µF Capacitance tolerance*** Cap≤5pF: C (±0.25pF) 5pF<Cap<10pF: D (±0.5pF) Cap≥10pF: J (±5%), K (±10%)K (±10%), M (±20%)Z (-20/+80%) Rated voltage (WVDC) 200V to 3kV200V , 250VQ*Cap<30pF: Q≥400+20C Cap≥30pF: Q≥1000≤2.5% ≤5%Insulation resistance at Ur**Ur=200~630V: ≥10G Ω or RxC≥100Ω-F whichever is smallerUr=1000~3000V: ≥10G ΩDielectric strength 200~300V: ≥2 x WVDC 500~999V: ≥1.5 x WVDC 1000~3000V: ≥1.2 x WVDCOperating temperature -55 to +125°C-25 to +85°C Capacitance characteristic ±30ppm±15%+30/-80%TerminationNi/Sn (lead-free termination)* Measured at the condition of 30~70% related humidity .NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF , 25°C at ambient temperature X7R, Y5V: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 20°C ambient temperature. ** Measured at 500VDC for 60 sec. for Ur>500VDC.*** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour , then leave in ambient condition for 24±2 hours before measurement.0603(1608) 1.60±0.10 0.80±0.10 0.80±0.07 S 0.40±0.150.60±0.10 A 0.80±0.10 B 0805 (2012)2.00±0.151.25±0.101.25±0.10 D # 0.50±0.200.80±0.10B 0.95±0.10C 3.20±0.15 1.60±0.15 1.25±0.10D # 1206 (3216)3.20±0.20 1.60±0.20 1.60±0.20 G # 0.60±0.200.95±0.10 C 3.20±0.302.50±0.201.25±0.10 D # 1.60±0.20 G # 1210 (3225)3.20±0.402.50±0.30 2.50±0.30 M # 0.75±0.251.25±0.10 D # 1808 (4520) 4.50+0.5/-0.32.03±0.25 2.00±0.20 K # 0.50±0.25 1.25±0.10 D # 1812 (4532) 4.50+0.5/-0.33.20±0.30 2.00±0.20K#0.50±0.25# Reflow soldering only is recommended.7. CAPACITANCE RANGE (MIDDLE VOLTAGE - 200V to 630V)7-1 NP0 Dielectric0603 0805 1206 1210 1812200 250 200 250 500 630 200 250 500 630 200 250 500 630 200 250 500 6300.5pF (0R5) A A A A 1.0pF (1R0) A A A A 1.2pF (1R2) A A A A 1.5pF (1R5) A A A A B B B B 1.8pF (1R8) A A A A B B B B 2.2pF (2R2) A A A A B B B B 2.7pF (2R7) A A A A B B B B 3.3pF (3R3) A A A A B B B B 3.9pF (3R9) A A A A B B B B 4.7pF (4R7) A A A A B B B B 5.6pF (5R6) A A A A B B B B 6.8pF (6R8) A A A A B B B B 8.2pF (8R2) A A A A B B B B 10pF (100) A A A A B B B B C C C C D D D D 12pF (120) A A A A B B B B C C C C D D D D 15pF (150) A A A A B B B B C C C C D D D D 18pF (180) A A A A B B B B C C C C D D D D 22pF (220) S S A A A A B B B B C C C C D D D D 27pF (270) S S A A A A B B B B C C C C D D D D 33pF (330) S S A A A A B B B B C C C C D D D D 39pF (390) S S A A A A B B B B C C C C D D D D 47pF (470) S S A A A A B B B B C C C C D D D D 56pF (560) S S A A A A B B B B C C C C D D D D 68pF (680) S S A A A A B B B B C C C C D D D D 82pF (820) S S A A B B B B B B C C C C D D D D 100pF (101) S S A B B B B B B B C C C C D D D D 120pF (121) A B D D B B B B C C C C D D D D 150pF (151) B D D D B B B B C C C C D D D D 180pF (181) B D D D B B B B C C C C D D D D 220pF (221) D D D D B B B B C C C C D D D D 270pF (271) D D D D B C C C C C C C D D D D 330pF (331) D D D D B C C C C C C C D D D D 390pF (391) D D D D B C C C C C C C D D D D 470pF (471) D C C C C C C C C D D D D 560pF (561) D C D D D C C C C D D D D 680pF (681) D C D D D C C C C D D D D 820pF (821) D C G G G C C C C D D D D 1,000pF (102) D C G G G D D D D D D D D 1,200pF (122) C D D D D D D D D 1,500pF (152) D D D D D D D D D 1,800pF (182) D D D D D D D D D 2,200pF (222) D D D D D D D 2,700pF (272) D D D D D D 3,300pF (332) D D D D D 3,900pF (392) D D 4,700pF (472) D 5,600pF (562) D C a p a c i t a n c e6,800pF (682) D 1. The letter in cell is expressed the symbol of product thickness.7-2 X7R Dielectric0805120612101812200250 500 630 200 250 500 630 200 250 500 630 200250 500 630 100pF (101) B B B^ B^ 120pF (121) B B B^ B^ 150pF (151) B B B^ B^ D D D^ D^ 180pF (181) B B B^ B^ D D D^ D^ 220pF (221) B B B^ B^ D D D^ D^ 270pF (271) B B B^ B^ D D D^ D^ 330pF (331) B B B^ B^ D D D^ D^ 390pF (391) B B B^ B^ D D D^ D^ 470pF (471) B B B^ B^ D D D^ D^ 560pF (561) B B B^ B^ D D D^ D^ 680pF (681) B B B^ B^ D D D^ D^ 820pF (821) B B B^ B^ D D D^ D^ 1,000pF (102) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 1,200pF (122) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 1,500pF (152) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 1,800pF (182) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 2,200pF (222) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 2,700pF (272) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 3,300pF (332) B B B^ B^ D D D^ D^ C C C^ C^ D D D^ D^ 3,900pF (392) B B D D D^ D^ C C C^ C^ D D D^ D^ 4,700pF (472) B B D D D^ D^ C C C^ C^ D D D^ D^ 5,600pF (562) B B D D D^ D^ C C C^ C^ D D D^ D^ 6,800pF (682) B B D D D^ D^ C C C^ C^ D D D^ D^ 8,200pF (822) B B D D D^ D^ C C C^ C^ D D D^ D^ 0.010µF (103) D D D D D^ D^ C C C^ C^ D D D^ D^ 0.012µF (123) D D D D D^ D^ C C C^ C^ D D D^ D^ 0.015µF (153) D D D D D^ D^ C C C^ C^ D D D^ D^ 0.018µF (183) D D D D D^ D^ C C C^ C^ D D D^ D^ 0.022µF (223) D D D D G^ G^ C C D^ D^ D D D^ D^ 0.027µF (273) D D G^ G^ C C G^ G^ D D D^ D^ 0.033µF (333) G G G^ G^ C C G^ G^ D D D^ D^ 0.039µF (393) G G C C G^ G^ D D D^ D^ 0.047µF (473) G G D D G^ G^ D D D^ D^ 0.056µF (563) G G D D G^ G^ D D K^ K^ 0.068µF (683) G G G G D D K^ K^ 0.082µF (823) G G G G D D K^ K^ 0.10µF (104) G G G G D D K^ K^ 0.12µF (124) G G D D 0.15µF (154) M M K K 0.18µF (184) M M K K 0.22µF (224) M M K K 0.27µF (274) M M K K 0.33µF (334) M M K K 0.39µF (394) M M K K C a p a c i t a n c e0.47µF (474)MMKK1. The letter in cell is expressed the symbol of product thickness.2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.7-3 Y5V Dielectric0805120612101812200 250 200 250 200 250 200 250 0.010µF (103) B B B B C C D D 0.015µF (153) B B B B C C D D 0.022µF (223) B B B B C C D D 0.033µF (333)B B B BC CD D 0.047µF (473) B B B B C C D D 0.068µF (683) B B B B C C D D 0.10µF (104) B B C C D D 0.15µF (154) C C C C D D 0.22µF (224) D D 0.33µF (334) D D 0.47µF (474) D D 0.68µF (684) D D C a p a c i t a n c e1.0µF (105)1. The letter in cell is expressed the symbol of product thickness.8. CAPACITANCE RANGE (HIGH VOLTAGE - 1kV to 3kV)8-1 NP0 Dielectric1206 121018081812 1000 2000 1000 2000 1000 2000 30001000 2000 3000 1.5pF (1R5) B B 1.8pF (1R8) B B 2.0pF (2R0) B B D D D 2.2pF (2R2) B B D D D 2.7pF (2R7) B B D D D 3.3pF (3R3) B B D D D 3.9pF (3R9) B B D D D 4.7pF (4R7) B B D D D 5.6pF (5R6) B B D D D 6.8pF (6R8) B B D D D 8.2pF (8R2) B B D D D 10pF (100) B B C C D D D D D D 12pF (120) B B C C D D D D D D 15pF (150) B B C C D D D D D D 18pF (180) B B C C D D D D D D 22pF (220) B B C C D D D D D D 27pF (270) B B C C D D D D D D 33pF (330) B B C C D D D D D D 39pF (390) B B C C D D D D D D 47pF (470) B B C C D D D D D D 56pF (560) B B C D D D D D D D 68pF (680) B C C D D D D D D D 82pF (820) B C C D D D D D D D 100pF (101) B C C D D D D D D D 120pF (121) B D C D D D D D D D 150pF (151) C D C D D D D D D D 180pF (181) C G C D D D K D D D 220pF (221) D G C D D D K D D D 270pF (271) D C D D K D D K 330pF (331) G D D D K D D K 390pF (391) G D D K D D K 470pF (471) G D D K D D K 560pF (561) K K D D 680pF (681) K K D K 820pF (821) K D K 1,000pF (102) K K K 1,200pF (122) K C a p a c i t a n c e1,500pF (152)K1. The letter in cell is expressed the symbol of product thickness.8-2 X7R Dielectric1206 1210 1808 1812 1000 2000 1000 1000 2000 3000 1000 2000 3000 150pF (151) B^ B^ D^ D^ D^ 180pF (181) B^ B^ D^ D^ D^ 220pF (221) B^ B^ D^ D^ D^ 270pF (271) B^ B^ D^ D^ D^ D^ D^ 330pF (331) B^ B^ D^ D^ K^ D^ D^ 390pF (391) B^ C^ D^ D^ K^ D^ D^ 470pF (471) B^ C^ D^ D^ K^ D^ D^ 560pF (561) B^ C^ D^ D^ K^ D^ D^ 680pF (681) B^ C^ D^ D^ K^ D^ D^ K^ 820pF (821) B^ G^ D^ D^ K^ D^ D^ K^ 1,000pF (102) B^ G^ C^ D^ K^ K^ D^ D^ K^ 1,200pF (122) B^ G^ C^ D^ K^ D^ D^ 1,500pF (152) C^ G^ C^ D^ K^ D^ D^ 1,800pF (182) C^ C^ D^ K^ D^ D^ 2,200pF (222) D^ C^ D^ K^ D^ D^ 2,700pF (272) G^ C^ D^ D^ D^ 3,300pF (332) G^ D^ D^ D^ K^ 3,900pF (392) G^ G^ D^ D^ K^ 4,700pF (472) G^ G^ D^ D^ K^ 5,600pF (562) G^ K^ D^ 6,800pF (682) M^ K^ D^ 8,200pF (822) M^ K^ D^ 0.010µF (103) M^ K^ D^ 0.012µF (123) K^ C a p a c i t a n c e0.015µF (153)K^1. The letter in cell is expressed the symbol of product thickness.2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.9. PACKAGING DIMENSION AND QUANTITY0603 0.80±0.07 S 4k 15k - - 0.60±0.10 A 4k 15k - - 0.80±0.10 B 4k 15k - - 08051.25±0.10 D - - 3k 10k 0.80±0.10 B 4k 15k - - 0.95±0.10 C - - 3k 10k 1.25±0.10 D - - 3k 10k 12061.60±0.20 G - - 2k - 0.95±0.10 C - - 3k 10k 1.25±0.10 D - - 3k 10k 1.60±0.20 G - - 2k - 12102.50±0.30 M - - 1k - 1.25±0.10 D - - 2k - 1808 2.00±0.20 K - - 1k - 1.25±0.10 D - - 1k - 18122.00±0.20K- -1k -Unit: pieces10. APPENDIXES◙ Tape & reel dimensionsSize 0603 08051206 1210 18081812 ThicknessS, XBC, D, I B C, D G C, D, G M D K D, K A 0 1.02±0.05 1.50±0.10 <1.57 2.00±0.10 <1.85 <1.95 <2.97 <2.97 <2.35 <2.35 <3.81 B 0 1.80±0.05 2.30±0.10<2.40 3.50±0.10<3.46 <3.67 <3.73 <3.73 <4.98 <5.00 <5.30 T 0.95±0.05 0.95±0.05 0.23±0.05 0.95±0.05 0.23±0.05 0.23±0.05 0.23±0.05 0.23±0.05 0.25±0.05 0.25±0.05 0.25±0.05 K 0 --<2.50-<2.50<2.50<2.50<3.0<2.50<2.50<2.50W 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 12.0±0.20 12.0±0.20 12.0±0.20 P 0 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.100 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 10xP 0 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 P 1 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 8.00±0.10 P 2 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 D 0 1.55±0.05 1.55±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05 1.50±0.05D 1 --1.00±0.10-1.00±0.10 1.00±0.10 1.00±0.10 1.00±0.10 1.50±0.10 1.50±0.10 1.50±0.10E 1.75±0.05 1.75±0.05 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 F3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 5.50±0.05 5.50±0.05 5.50±0.05Fig. 3 The dimension of plastic tapeFig. 4 The dimension of reelFig. 2 The dimension of paper tapeSize 0603, 0805, 1206, 12101808, 1812Reel size7” 10” 13” 7”C 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 W 1 8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 12.4+2.0/-0 A 178.0±0.10 250.0±1.0 330.0±1.0 178.0±0.10 N60.5±1.0 100.0±1.0 100±1.060.5±1.0◙ Description of customer label◙ Constructions◙Storage and handling conditions(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf lifeextension is needed. Cautions:a. Don’t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidizationof electrode, which easily be resulted in poor soldering.b. To store products on the shelf and avoid exposure to moisture.c. Don’t expose products to excessive shock, vibration, direct sunlight and so on.No.Name NP0, X7RX7R, Y5V1 Ceramic material BaTiO 3 based2 Inner electrodeAgPd alloyNi 3 Inner layerAgCu4 Middle layer Ni 5TerminationOuter layerSn (Matt)Fig. 5 The construction of MLCCa. Customer nameb. WTC order series and item numberc. Customer P/Od. Customer P/Ne. Description of productf. Quantityg. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping datej. Order bar code including series and item numbers k. Serial number of label◙Recommended soldering conditionsThe lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N 2within oven are recommended.Fig. 6 Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste.Fig. 7 Recommended wave soldering profile for SMT process with SnAgCu series solder .。

MLCC片式多层陶瓷电容器可靠性测试技术规格、测试方法资料

C≤10uF: 测试频率：1KHZ±10% 测试电压：1.0±0.2Vrms Test Frequency:1KHZ±10% Test Voltage:1.0±0.2Vrms
C>10uF: X7R、Y5V、X5R: 测试频率：120±24HZ 测试电压：0.5±0.1Vrms Test Frequency:120±24HZ Test Voltage:5±0.1Vrms
项目 Item
技术规格 Technical tion
测试方法 Test Method and Remarks
潮湿实验 Moidture Resistance
低压产品寿命实验
Life Test
I 类：≤±2%或±1pF,
取两者之中较大者
II 类：X5R,X7R：≤±10%
△C/C
Y5V：≤±30% Class I:≤2%或±1pF
可焊性 Solderability
耐焊接热 Resistanceto Soldering Heat
不应有介质被击穿或损伤 No breakdown or damage.
上锡率应大于 95% 外观：无可见损伤 At least 95% of the terminal electrode is eovered by new solder. Visual Appearance:No visible damage.
抗弯曲强度 Resistance to Flexure of Substrate
(Bending Stength)
端头结合强度 Termination Adhesion
温度循环 Temperature
Cycle
△C/C
≤±12.5%
外观：无可见损伤 Appearance:No visible damage.

mlcc高容高压的范围

mlcc高容高压的范围MLCC（多层陶瓷电容器）是一种电子元器件，用于存储电荷和调节电流。

它的高容量和高压范围使其在各种电子设备中得到广泛应用。

MLCC的高容量范围通常指的是其储存电荷的能力。

MLCC内部由许多层陶瓷薄片和金属电极交替堆叠而成。

这种结构使得MLCC具有较大的表面积，从而能够存储更多的电荷。

高容量的MLCC可以储存更多的电荷，因此在需要大量电荷存储的电路中得到广泛应用。

另一方面，MLCC还具有高压范围。

高压MLCC是指能够承受较高电压的电容器。

在某些电路中，需要承受较高电压的电容器来保证电路的正常运行。

高压MLCC能够稳定地工作在较高的电压下，因此在一些高压应用中被广泛使用。

MLCC的高容量和高压范围使其在许多领域中发挥重要作用。

首先，MLCC在通信设备中被广泛应用。

无线通信设备需要存储大量的电荷以实现数据传输，而高容量的MLCC能够提供足够的电荷存储空间。

同时，通信设备中往往需要承受较高的电压，因此高压MLCC也非常重要。

MLCC在电力电子设备中也得到广泛应用。

电力电子设备需要处理大量的电流和电压，因此需要具有高容量和高压能力的电容器。

MLCC 能够满足这些需求，并且具有较小的尺寸和重量，适合在高密度的电路板上使用。

MLCC还在汽车电子领域中发挥着重要作用。

现代汽车中的电子设备越来越多，需要存储更多的电荷并承受更高的电压。

MLCC能够满足这些需求，同时还能够在恶劣的工作环境中稳定运行。

MLCC的高容量和高压范围使其成为电子设备中不可或缺的元器件。

它在通信设备、电力电子设备和汽车电子等领域中发挥着重要作用。

随着科技的不断进步，人们对电子设备的需求也越来越高，因此MLCC的高容量和高压范围将继续得到重视和发展。

京瓷多联系列MLCC贴片电容规格书

Pb Free
RoHS Compliant
series General
CM
series Arrays
CA
series Low Profile
CT
Multilayer Ceramic Chip Capacitors
series High-Voltage
series Automotive
DM
CF
Structure
Bulk Cassette
Size 05 105 21 EIA CODE 0402 0603 0805 EIAJ CODE 1005 1608 2012 L 1.00.05 1.60.07 2.00.1 W 0.50.05 0.80.07 1.250.1 T 0.50.05 0.80.07 1.250.1 P min. 0.15 0.20 0.20 max. 0.35 0.60 0.75 P to P min. 0.30 0.50 0.70
CAPACITANCE CODE
Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values 10pF, Letter R denotes decimal point, eg. 100000pF 104 1.5pF 1R5 0.1F 104 0.5pF R50 4700pF 472 100F 107
CM CF CT DM General Purpose High Voltage Low Profile Automotive CA Capacitor Arrays
CM
21
X7R
104
K

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中高压电容器HIGH VOLTAGE MLCC
中高压多层片状陶瓷电容器是在多层片状陶瓷电容器的工艺技术、设备基础上，通过采用特殊工艺制作的一种具有良好高压可靠性的产品，该产品适合于表面贴装，适合于多种直流高压线路，可以有效的改善电子线路的性能。

●应用范围
※模拟或数字调制解调器。

※局域网/广域网接口界面。

※日光灯启动辉器照明电路。

※倍压电器。

※直流变送器。

※背光源驱动电路。

Middle & high voltage MLCC is a kind of special design 、special technology MLCC that bases on the technology of general MLCC. This kind of MLCC has stable high voltage reliability and suitable to SMT. Middle & high MLCC is widely applicable for many direct high voltage circuits in which it can improve the performance of the circuit. ●APPLICATIONS
※Analog & Digital Modems ※LAN/WAN Interface ※Lighting Ballast Circuits ※V oltage Multipliers ※DC-DC Converters ※Back-lighting Inverters
容量范围及其电压
单位/unit: pF
尺寸规格容量范围Capacitance
Size Code 工作电压Rated V oltage
NPO X7R Y5V 100V 0.5～820 150～10,000 2,200～68,000 200V 0.5～470 150～6,800 ---------- 0603
250V 0.5～470 150～6,800 ---------- 100V 0.5～1,500 150～33,000 10,000～100,000 200V
0.1～1,500 150～22,000 10,000～56,000 250V 0.1～1,500 150～22,000 10,000～56,000
500V 0.1～560 150～10,000 --------- 0805
1000V 0.1～100 --------- --------- 100V 0.5～3,300 150～100,000 15,000～330,000 200V
0.1～2,700 150～47,000 10,000～150,000 250V 0.1～2,700 150～33,000 10,000～150,000
500V 0.1～1,500 150～22,000 ---------- 1000V 0.1～1,000 150～5,600 ---------- 1206
2000V
0.1～270
150～1,500
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尺寸规格容量范围Capacitance
Size Code 工作电压Rated V oltage
NPO X7R Y5V 100V 1.0～4,700 150～220,000 10,000～820,000 200V 1.0～3,300 150～100,000 10,000～390,000 250V 1.0～3,300 150～82,000 10,000～390,000
500V 1.0～2,000 150～33,000 ---------- 1000V 1.0～820 150～10,000 ----------- 1210
2000V 1.0～470 150～6,800 ----------- 100V 2.0～4,700 150～220,000 150,000～1,000,000 200V 2.0～3,300 150～100,000 10,000～390,000 250V 2.0～3,300 150～82,000 10,000～390,000
500V
2.0～1,800 150～39,000 -------- 1000V 2.0～820 150～10,000 --------- 2000V 2.0～470 150～6,800 --------- 3000V 2.0～470 150～2,200 --------- 4000V 2.0～56 150～1,000 ---------- 1808 5000V 2.0～27 ----------- ---------- 100V
3.0～180 220～10,000 150～330,000 150,000～1,500,000 200V 3.0～5,600 150～150,000 100,000～470,000 250V 3.0～5,600 150～120,000 100,000～470,000
500V 3.0～3,900 150～100,000 ---------- 1000V 3.0～1,200 150～27,000 ---------- 2000V 3.0～680 150～10,000 ---------- 3000V 3.0～470 150～2,200 ---------- 4000V 3.0～220 150～1,500 --------- 1812
5000V 3.0～56 ---------- ---------- 100V 5.0～27,000 150～1,000,000 250,000～3,300,000 200V 5.0～12,000 150～470,000 22,000～680,000 250V 5.0～12,000 150～470,000 22,000～680,000
500V 5.0～6,800 150～330,000 ---------- 1000V 5.0～2,200 150～56,000 ---------- 2000V 5.0～1,000 150～27,000 ---------- 3000V 5.0～680 150～3,900 ---------- 4000V 5.0～560 150～3,300 ---------- 2220 2225
5000V
5.0～100
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备注：可根据客户的特殊要求设计符合客户需求的产品。

Note ：We can design according to customer special requirements.。