IBM小型机硬件架构

IBM 小型机简介
• IBM Power6 p570
– General description – Architecture and technical Overview
• IBM Power5 p590
– General description – Architecture and technical Overview
Front View
Back View
Power5系列 系列
System features
The full system configuration is made of four CEC building blocks. It features: 2-, 4-, 8-, 12-, 16-, and 32-core configurations utilizing the POWER6 chip on up to eight dual core processor cards, or eight dual-core POWER6 dual-chip processor cards. 32 MB of L3 cache, 8 MB of L2 cache. 3.5, 4.2, or 4.7 GHz. Up to 192 GB DDR2 memory per enclosure, 768 GB DDR2 max per system. Available memory features are 667 MHz, 533 MHz, or 400 MHz depending on memory density. Up to 6 SAS DASD disk drives per enclosure, 24 max per system. 6 PCI slots per enclosure: 4 PCIe, 2 PCI-X; 24 PCI per system: 16 PCIe, 8 PCI-X. Up to 2 GX+ adapters per enclosure; 8 per system One hot-plug slim-line media bay per enclosure, 4 max per system.
Memory subsystem-Fully buffered DIMM
FBD是一种用于提高可靠性、速度和密度的内存技术。
Memory subsystem- Memory placements rules
First quad includes J0A, J0B, J0C, and J0D memory slots Second quad includes J1A, J1B, J1C, and J1D memory slots Third quad includes J2A, J2B, J2C, and J2D memory slots
System specifications
Physical package
• IBM Power6 p570
– General description – Architecture and technical Overview
• IBM Power5 p590
– General description – Architecture and technical Overview
Overview
System design
Both the p5-590 and p5-595 servers are based on a modular design, where all components are mounted in 24-inch racks. Inside this rack, all the server components are placed in specific positions. This design and mechanical organization offer advantages in optimization of floor space usage. There are three major subsystems: The Central Electronics Complex (CEC) The power subsystem The I/O subsystem
– General description – Architecture and technical Overview
• IBM Power5 p590
– General description – Architecture and technical Overview
System frames
p5-590 systems are based on the same 24-inch wide, 42 EIA height frame Inside this frame all the server components are placed in predetermined positions.
System specifications
单个Central Electronics Complex(CEC) enclosure的规格：
Physical package
可以使用1-4个building block enclosures 每个CEC drawer building blocks高4U
The 570 internal disk subsystem is driven by the latest DASD interface technology Serial Attached SCSI (SAS). This interface provides enhancements over parallel SCSI with its point to point high frequency connections. The SAS controller has eight SAS ports, four of them are used to connect to the DASD drives and one to a media device. The DASD backplane implements two SAS port expanders that take four SAS ports from the SAS controller and expands it to 12 SAS ports. These 12 ports allow for redundant SAS ports to each of the six DASD devices. The DASD backplane provides the following functions : supports six 3.5 inches SAS DASD devices contains two SAS port expanders for redundant SAS paths to the SAS devices SAS passthru connection to medias backplane
Processor cards
In the 570, the POWER6 processors, associated L3 cache chip, and memory DIMMs are packaged in processor cards. A single CEC may have one or two processor cards installed. They are interfaced to 12 memory slots, where as each memory DIMM has its own memory buffer chip and are interfaced in a point-to-point connection. I/O connects to the 570 processor module using the GX+ bus.
• IBM Power6 p570
– General description – Architecture and technical Overview
• IBM Power5 p590
– General description – Architecture and technical Overview
External I/O subsystems
Each GX+ bus can be populated with a GX+ adapter card that adds more RIO-G ports to connect external I/O drawersem buses - I/O buses and GX+ card
Each POWER6 processor provides a GX+ bus which is used to connect to an I/O subsystem or Fabric Interface card. In a fully populated 570, there are two GX+ buses, one from each processor. Optional Dual port RIO-2 I/O Hub (FC 1800) and Dual port 12x Channel Attach (FC 1802)adapters that are installed in the GX+ slots are used for external DASD and IO drawer expansion.
Processor drawer interconnect cables
The SMP fabric bus that connects the processors of separate 570 building blocks is routed on the interconnect cable that is routed external to the building blocks. The flexible cable attaches directly to the processor cards, at the front of the 570 building block, and is routed behind the front covers (bezels) of the 570 building blocks.