毕业设计外文翻译原文

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毕业论文(设计)外文文献翻译及原文

毕业论文(设计)外文文献翻译及原文

金融体制、融资约束与投资——来自OECD的实证分析R.SemenovDepartment of Economics,University of Nijmegen,Nijmegen(荷兰内梅亨大学,经济学院)这篇论文考查了OECD的11个国家中现金流量对企业投资的影响.我们发现不同国家之间投资对企业内部可获取资金的敏感性具有显著差异,并且银企之间具有明显的紧密关系的国家的敏感性比银企之间具有公平关系的国家的低.同时,我们发现融资约束与整体金融发展指标不存在关系.我们的结论与资本市场信息和激励问题对企业投资具有重要作用这种观点一致,并且紧密的银企关系会减少这些问题从而增加企业获取外部融资的渠道。

一、引言各个国家的企业在显著不同的金融体制下运行。

金融发展水平的差别(例如,相对GDP的信用额度和相对GDP的相应股票市场的资本化程度),在所有者和管理者关系、企业和债权人的模式中,企业控制的市场活动水平可以很好地被记录.在完美资本市场,对于具有正的净现值投资机会的企业将一直获得资金。

然而,经济理论表明市场摩擦,诸如信息不对称和激励问题会使获得外部资本更加昂贵,并且具有盈利投资机会的企业不一定能够获取所需资本.这表明融资要素,例如内部产生资金数量、新债务和权益的可得性,共同决定了企业的投资决策.现今已经有大量考查外部资金可得性对投资决策的影响的实证资料(可参考,例如Fazzari(1998)、 Hoshi(1991)、 Chapman(1996)、Samuel(1998)).大多数研究结果表明金融变量例如现金流量有助于解释企业的投资水平。

这项研究结果解释表明企业投资受限于外部资金的可得性。

很多模型强调运行正常的金融中介和金融市场有助于改善信息不对称和交易成本,减缓不对称问题,从而促使储蓄资金投着长期和高回报的项目,并且提高资源的有效配置(参看Levine(1997)的评论文章)。

因而我们预期用于更加发达的金融体制的国家的企业将更容易获得外部融资.几位学者已经指出建立企业和金融中介机构可进一步缓解金融市场摩擦。

毕业设计(论文)外文翻译(原文)

毕业设计(论文)外文翻译(原文)

编号:毕业设计(论文)外文翻译(原文)院(系):桂林电子科技大学职业技术学院专业:工商企业管理学生姓名:方智立学号:010*********指导教师单位:桂林电子科技大学职业技术学院姓名:朱芸芸职称:讲师2016年 4 月 1 日Marketing Strategy Analysis of SportsAbstractSports market is a special industry market, which for provide exchange of sports tangible products and services market. Sports market including fixed type, such as sports facilities, sports goods market, Mobile market, such as all kinds of sports service provided by the fitness club. Sports tourism and advertising business, sports goods should be consumers to accept, and occupy a larger market. If success of the sports marketing involves many factors. According to the specific characteristics of sports marketing, develop and implement appropriate marketing strategy is very important. Sports marketing strategy is to the sports business units within a certain period or stage marketing campaign's overall development plan of decision making.This paper argues that the marketing strategy can be further subdivided into market positioning strategy, market timing strategy, market entry strategy, market development strategy, market competition strategy, Choose a strategy, must conform to the enterprise's own competitive position, product status, to grasp the market opportunity, determined according to the demands of consumers. In this paper, the sports market segmentation marketing strategy for the market positioning strategy, market timing strategy, market entry strategy, market development strategy, market competition strategy, and discusses the sports marketing how to carry out strategic choice.Keywords: Sports bazaar ; Sports marketing; Marketing strategy1.Sports marketing strategy and characteristics1.1Sports marketing strategyStrategy refers to the planning of overall and profound things. Sports marketing strategy refers to the commodity business units under the guidance of modern marketing concept, to achieve its economic goal for enterprise in a certain period of the overall design and planning of marketing development.Inan increasingly competitive market circumstances, sports business units in order to effectively carry out business activities, to achieve its business objectives, must understand and based on the characteristics of marketing concepts and strategies, and Target the demand of the market, comprehensive analysis and marketing of various environmental factors, choose effective market strategy in the background.1.2The characteristics of the sports marketing strategySports marketing strategy has sports business units within a certain period or stage marketing campaign's overall development plan of decision making. It has the characteristics of the following.(1) Overall importance.Sports marketing strategy is a matter of the global business units, including two aspects the meaning of this global:on the one hand, Sports marketing strategy is the overall design, the development of the business units, including overall planning and the overall strategy and means.On the other hand, Sports marketing strategy decision is a matter of global business units and their all-round development in the future.(2)Secular.Sports marketing strategy is really about the future of sports business units: to achieve the goals of sports marketing strategy, will make the sports business units to produce qualitative leap, but this is not usually that can be done in the short term.Important, sports business units of marketing strategy on the strategic period not only very important to enterprise's survival and development, but also to the long-term development of enterprises play an important role.(3) Systematicness.Sports systemic marketing refers to business units, each part of the work of each link is a contact each other, are closely related to the organic unity of the whole.System have layers, the size and the primary and secondary division, at the next lower level to obey and serve at the next higher level.For a certain sports and business operation entity, the strategy of the whole enterprise as a whole system engineering to overall arrangement, the pursuit of the overall development of the biggest benefits.(4)Adaptability.Sports marketing adaptability, refers to the sports marketing and business operation entity is easily affected by external and internal environment, when the environment changes, sports business units made to adapt themselves to the new environment of the characteristics of rapid response.Sports marketing of the external environment including the market demand, political or economic situation changes, policy and law changes. Similarly, sports business entities internal conditions change will impact on marketing.(5)Risk.Due to sports marketing strategy is the business unit for the marketing activities during the period development collection of expected decision, and this decision is absolutely impossible in various conditions fully mature and information fully, make and sports market, especially the intangible product variety and complexity of the market, make sports marketing strategy has the characteristics of uncertainty and instantaneity, many market opportunities tend to be a passes, no longer to, opportunity and risk coexist.2.Sports marketing strategy comprisedand choiceSports marketing strategies mainly include market positioning strategy, market timing strategy, market entry strategy, market development strategy, market competition strategy.2.1 Market orientation strategyMarket positioning refers to the sports business units according to the condition of market competition situation and its own resources, establish and develop differentiated competitive advantage, to make their own products in the consumer formed in the difference between each product unique image and is superior to the competition.This unique image can be tangible or intangible.Enterprise after analyzing the market environment, should highlight its own market advantage, establish market position, Which companies need to know on a certain level of paper generalizes, consumers mind what is the best sports products as expected.2.2 Market entry policyMarket entry strategy is the sports business units at the right time to capture the target market, how to appropriately in the two aspects of production capacity and sales ability to make reliable measures and guarantee, to ensure the decision-making of sports products successfully enter the market.Its content mainly includes the production capacity of decision-making and sales ability to form two aspects.(1) Capacity Decision. In the necessary time, sports business entities formtargetmarket capacity, is one of the important conditions to achieve market goal.Regardless of whether they are sports tangible products and intangible products, generally there are two alternative strategies.①Independent development strategy refers to both tangible products, the development of sports and development of sports intangible products. All on its own strength to expand production scale, enhance the comprehensive production capacity or adjust the structure of the comprehensive production capacity of enterprise, to adapt the demand of product combination structure. ②Comprehensive development strategy, mainly depend on the sports business units of the external forces, namely, through joint, collaboration, subcontract, form a new comprehensive production capacity. Due to participating in planning, control, coordination, etc, are more difficult. Therefore, sports business units must be good at optimizing collaborator, deal with the various cooperation of responsibility, right and benefit, to maintain good relations of cooperation.(2) Sales ability decision. A sports product to enter and occupy the market, production enterprise must have the necessary sales ability and the ability to penetrate the market.Sales ability decision-making main consideration circulation channels and sales, product should be considered when making decisions, market, enterprise, social environment and the factors such as economic effect.2.3 Market development strategyMarket development strategy refers to the perspective of market prospects, the choice of market development means, usually includes two kinds of intensive development and diversified development main form.(1)Intensive development.When some kind of sports products in the market has the potential of further development, the choice of market penetration, product development and market development of three kinds of intensive development form. As the tangible products market, in sports and intangible products are common market and applicable.①Market penetration. on the basis of the existing market scale, increase the sales of existing products. Can use a variety of measures, consolidate old customers, increase the new user. ②Product development Is through developing and improving existing products, make its have some new properties and USES, meet the social demand more. ③market development. Refers to an enterprise that open up new product sales market, in order to increase sales.(2) Diversified development.Diversity is also called the diversification, basically have concentricity scattered scattered, horizontal dispersion and the integrityof three. ①Concentricity is sports business unit USES the original dispersed development technology and the characteristics, with its as the core, the development use different structure similar products. ②Scattered level of sexual development.Was used in the original market advantage, has occupied the market development of technology, nature and purpose of different products. For example, Sports club olicy makers, can through the player transfer channels, to sell players, profit.Others use their sports club or the player's social awareness to participate in the sales promotion of goods, in order to obtain profits. ③Integrity of dispersed development. Refers to the sports business units to expand the business into its original business, technology, market and the product has no connection in the industry. Such as the sports department construction and run a catering and service hotels, hotels, entertainment city, charge for parking lot, etc., is the form of scattered holistic development. Implement the diversification development, can improve the ability of sports business units to adapt to the environment, reduce the risk of a single business, at the same time, may be more fully use of all kinds of resources within the enterprise, make its have more potential development opportunities. However, the development of decentralized often leads to complication of operation and management, and business operation entities such as diversifying some problems.2.4Strategic Marketing CompetitionThe rules of the development of the market is superior bad discard, its characteristic is the petition can promote the economic development of the enterprise and the improvement of economic benefits.Enterprises should establish a clear concept of competition, flexible use of price and non-price competition means, take a man without I have, people have my good, good people knew, new I cheap, cheap I turn the principle and method of making enterprise competitive strategy, must accomplish know fairly well the competition environment and competition situation, can with ease.Enterprise competition environment factors mainly refers to the enterprise in addition to the social and cultural environment stress factors of various aspects, such as management scientist professor Michael porter of Harvard University famous the competitive offer slightly above, an enterprise usually exist competition pressure from five aspects, namely the industry competition pressure, potential to join the pressure from the industry, suppliers forward pressure (by providing raw materials or semi-finished products, to develop into their production products), buyers.(1) The overall competitive strategy. Under different conditions, the enterprise facing the pressure of competition is different, the analysis of the pressure of competition is to understand the purpose of each kind of competition situation of power, so as to make effective competition strategy.Under normal circumstances, the sports business units of competition strategy in general have a low cost strategy, product differentiation strategy and intensive strategy. ①low-cost strategy. Low cost strategy is to point to in under the premise of guarantee the quality of products and services, efforts to reduce the cost of production and sales so that the enterprise product prices lower than competitors' prices, with rapidly expanding sales increase market share. ②Product differentiation strategies. Product differentiation strategy is to point to create a unique characteristic of the enterprise products, to develop unique products or marketing programs, for in such aspects as product or service than competitors are unique. Thus to obtain the difference advantage.The United States, for example, "NIKE" brand sports shoes, NIKE production due to the appearance of novel design, the innovation of the use function and unique, and exquisite packaging, etc., although the price is surprisingly expensive, but occupies considerable market in China, the teenagers are very loving. ③Intensive strategy. Intensive strategy refers to the enterprises focus on one or several market segments provide the most effective service, better meet certain customers with different needs, so as to strive for the local competitive advantage. It is little different from the above three kinds of overall competition strategy, successfully implement these three strategies need different resources and decision-making, also should have different requirements on organization and management.(2) The competitive strategy of enterprises of different competitive position. Where the status of enterprise in market competition, the enterprise can be divided into: market leader, market challenger, market follower. Different competitive position of enterprises, should choose different market competitive strategy.①Dominant market competition strategy. Market power refers to the related products has the highest market share. Such as the current market position and stable dominated by clothing JinMeiLong, "ADIDAS", they are price changes, new product development, sales channel width and promotional efforts in a dominant position, recognized by other sports enterprises. ②The challenger market competition strategy. Market challenger refers to those in a secondary position in the market of the enterprise, such as "lining" brand garment enterprises .Market challenger to choosechallenge object is closely related to the strategic target, for a same object has different goals and strategies Such as attack market leader to gain the market share and product advantage ;Attack power with yourself quite seize its market position; Attacking small businesses taking their customers even small business itself."Lining" to win market price advantage to the international brand, with product quality advantages to gain "anta" challenger "peak" brand's market share. ③Followers of the market competition strategy. Market followers is to point to in a secondary position, under the conditions of "coexistence" market for as much as possible the benefit of the enterprise. Market followers don't need a lot of money, less risky and can obtain high profits, so many enterprises adopt this strategy, especially the sort of small or no fame and status of sports clothing enterprises. As the current sports "philharmonic" brand clothing enterprise in the enterprise.Reference[1] LiJianJun,WangCuiHua:The Research on Marketing Environment Enterprise of Things for Sports Use in China[J] Journal of NanJing institute of sport (social science edition) 2013.(10),36 ~ 48.[2] Discuss Sports market, products and marketing characteristics. [J] journal of xi ' an institute of physical education,2012.(3)101 ~109.[3] HuZhengMing Ed. Marketing Management[M].Shandong people's publishing house,2012.302 ~325.[4] [US]Kotler write. YuLiJun translate. Introduction to Marketing[M].Huaxia Publishing House,2011.333~389.[5] ZhangTongYao.Application areas to promote the marketing advantage analysis of third party logistics[J].Market of China,2010(3)128 ~136.[6] WangHuaiShu.The influence of the logistics quality of marketing[J].Teacher's Journal,2010(3)31 ~38.[7] WangChenWen.Shallow theory of logistics strategy in the role of marketing management[J].Chemical Enterprise Management,2009(7)175 ~178.。

本科毕业设计外文翻译(中文)

本科毕业设计外文翻译(中文)

本科生毕业设计(论文)外文翻译外文原文题目:Real-time interactive optical micromanipulation of a mixture of high- and low-index particles中文翻译题目:高低折射率微粒混合物的实时交互式光学微操作毕业设计(论文)题目:阵列光镊软件控制系统设计姓名:任有健学院:生命学院班级:06210501指导教师:李勤高低折射率微粒混合物的实时交互式光学微操作Peter John Rodrigo Vincent Ricardo Daria Jesper Glückstad丹麦罗斯基勒DK-4000号,Risø国家实验室光学和等离子研究系jesper.gluckstad@risoe.dkhttp://www.risoe.dk/ofd/competence/ppo.htm摘要:本文论证一种对于胶体的实时交互式光学微操作的方法,胶体中包含两种折射率的微粒,与悬浮介质(0n )相比,分别低于(0L n n <)、高于(0H n n >)悬浮介质的折射率。

球形的高低折射率微粒在横平板上被一批捕获激光束生成的约束光势能捕获,捕获激光束的横剖面可以分为“礼帽形”和“圆环形”两种光强剖面。

这种应用方法在光学捕获的空间分布和个体几何学方面提供了广泛的可重构性。

我们以实验为基础证实了同时捕获又独立操作悬浮于水(0 1.33n =)中不同尺寸的球形碳酸钠微壳( 1.2L n ≈)和聚苯乙烯微珠( 1.57H n =)的独特性质。

©2004 美国光学学会光学分类与标引体系编码:(140.7010)捕获、(170.4520)光学限制与操作和(230.6120)空间光调制器。

1 引言光带有动量和角动量。

伴随于光与物质相互作用的动量转移为我们提供了在介观量级捕获和操作微粒的方法。

过去数十年中的巨大发展已经导致了在生物和物理领域常规光学捕获的各种应用以及下一代光学微操作体系的出现[1-5]。

毕业设计论文外文文献翻译

毕业设计论文外文文献翻译

毕业设计(论文)外文文献翻译院系:财务与会计学院年级专业:201*级财务管理姓名:学号:132148***附件: 财务风险管理【Abstract】Although financial risk has increased significantly in recent years risk and risk management are not contemporary issues。

The result of increasingly global markets is that risk may originate with events thousands of miles away that have nothing to do with the domestic market。

Information is available instantaneously which means that change and subsequent market reactions occur very quickly。

The economic climate and markets can be affected very quickly by changes in exchange rates interest rates and commodity prices。

Counterparties can rapidly become problematic。

As a result it is important to ensure financial risks are identified and managed appropriately. Preparation is a key component of risk management。

【Key Words】Financial risk,Risk management,YieldsI. Financial risks arising1.1What Is Risk1.1.1The concept of riskRisk provides the basis for opportunity. The terms risk and exposure have subtle differences in their meaning. Risk refers to the probability of loss while exposure is the possibility of loss although they are often used interchangeably。

本科毕业设计外文文献翻译

本科毕业设计外文文献翻译

(Shear wall st ructural design ofh igh-lev el fr ameworkWu Jiche ngAbstract : In t his pape r the basic c oncepts of man pow er from th e fra me sh ear w all str uc ture, analy sis of the struct ur al des ign of th e c ont ent of t he fr ame she ar wall, in cludi ng the seism ic wa ll she ar spa本科毕业设计外文文献翻译学校代码: 10128学 号:题 目:Shear wall structural design of high-level framework 学生姓名: 学 院:土木工程学院 系 别:建筑工程系 专 业:土木工程专业(建筑工程方向) 班 级:土木08-(5)班 指导教师: (副教授)nratiodesign, and a concretestructure in themost co mmonly usedframe shear wallstructurethedesign of p oints to note.Keywords: concrete; frameshearwall structure;high-risebuildingsThe wall is amodern high-rise buildings is an impo rtant buildingcontent, the size of theframe shear wall must comply with building regulations. The principle is that the largersizebut the thicknessmust besmaller geometric featuresshouldbe presented to the plate,the force is close to cylindrical.The wall shear wa ll structure is a flatcomponent. Itsexposure to the force along the plane level of therole ofshear and moment, must also take intoaccountthe vertical pressure.Operate under thecombined action ofbending moments and axial force andshear forcebythe cantilever deep beam under the action of the force levelto loo kinto the bottom mounted on the basis of. Shearwall isdividedinto a whole walland theassociated shear wall in theactual project,a wholewallfor exampl e, such as generalhousingconstruction in the gableor fish bone structure filmwalls and small openingswall.Coupled Shear walls are connected bythecoupling beam shear wall.Butbecause thegeneralcoupling beamstiffness is less thanthe wall stiffnessof the limbs,so. Walllimb aloneis obvious.The central beam of theinflection pointtopay attentionto thewall pressure than the limits of the limb axis. Will forma shortwide beams,widecolumn wall limbshear wall openings toolarge component atbothen ds with just the domain of variable cross-section ro din the internalforcesunder theactionof many Walllimb inflection point Therefore, the calcula tions and construction shouldAccordingtoapproximate the framestructure to consider.The designof shear walls shouldbe based on the characteristics of avariety ofwall itself,and differentmechanical ch aracteristicsand requirements,wall oftheinternalforcedistribution and failuremodes of specific and comprehensive consideration of the design reinforcement and structural measures. Frame shear wall structure design is to consider the structure of the overall analysis for both directionsofthehorizontal and verticaleffects. Obtain theinternal force is required in accordancewiththe bias or partial pull normal section forcecalculation.The wall structure oftheframe shear wall structural design of the content frame high-rise buildings, in the actual projectintheuse of themost seismic walls have sufficient quantitiesto meet thelimitsof the layer displacement, the location isrelatively flexible. Seismic wall for continuous layout,full-length through.Should bedesigned to avoid the wall mutations in limb length and alignment is notupand down the hole. The sametime.The inside of the hole marginscolumnshould not belessthan300mm inordertoguaranteethelengthof the column as the edgeof the component and constraint edgecomponents.Thebi-direc tional lateral force resisting structural form of vertical andhorizontalwallconnected.Each other as the affinityof the shear wall. For one, two seismic frame she ar walls,even beam highratio should notgreaterthan 5 and a height of not less than400mm.Midline columnand beams,wall midline shouldnotbe greater tha nthe columnwidthof1/4,in order toreduce thetorsional effect of the seismicaction onthecolumn.Otherwisecan be taken tostrengthen thestirrupratio inthe column tomake up.If theshear wall shearspan thanthe big two. Eventhe beamcro ss-height ratiogreaterthan 2.5, then the design pressure of thecut shouldnotmakeabig 0.2. However, if the shearwallshear spanratioof less than two couplingbeams span of less than 2.5, then the shear compres sion ratiois notgreater than 0.15. Theother hand,the bottom ofthe frame shear wallstructure to enhance thedesign should notbe less than200mmand notlessthanstorey 1/16,otherpartsshouldnot be less than 160mm and not less thanstorey 1/20. Aroundthe wall of the frame shear wall structure shouldbe set to the beam or dark beamand the side columntoform a border. Horizontal distributionofshear walls can from the shear effect,this design when building higher longeror framestructure reinforcement should be appropriatelyincreased, especially in the sensitiveparts of the beam position or temperature, stiffnesschange is bestappropriately increased, thenconsideration shouldbe givento the wallverticalreinforcement,because it is mainly from the bending effect, andtake in some multi-storeyshearwall structurereinforcedreinforcement rate -likelessconstrained edgeofthecomponent or components reinforcement of theedge component.References: [1 sad Hayashi,He Yaming. On the shortshear wall high-rise buildingdesign [J].Keyuan, 2008, (O2).高层框架剪力墙结构设计吴继成摘要: 本文从框架剪力墙结构设计的基本概念人手, 分析了框架剪力墙的构造设计内容, 包括抗震墙、剪跨比等的设计, 并出混凝土结构中最常用的框架剪力墙结构设计的注意要点。

本科毕业设计(论文)外文翻译

本科毕业设计(论文)外文翻译
1.引言
重金属污染存在于很多工业的废水中,如电镀,采矿,和制革。
2.实验
2.1化学药剂
本实验所使用的药剂均为分析纯,如无特别说明均购买自日本片山化工。铅离子储备液通过溶解Pb(NO3)2配制,使用时稀释到需要的浓度。HEPES缓冲液购买自Sigma–Aldrich。5 mol/L的HCl和NaOH用来调整pH。
附5
华南理工大学
本科毕业设计(论文)翻译
班级2011环境工程一班
姓名陈光耀
学号201130720022
指导教师韦朝海
填表日期
中文译名
(1)巯基改性纤维素对葡萄糖溶液中铅的吸附(2)黄原酸化橘子皮应用于吸附水中的铅离子
外文原文名
(1)Adsorption of Pb(II) from glucose solution on thiol-functionalized cellulosic biomass
2.5分析方法
铅离子的浓度用分光光度计在616 nm波长处用铅与偶氮氯膦-III络合物进行分析。葡萄糖含量采用苯酚—硫酸分光光度法测定。所有的实验均进行三次,已经考虑好误差。
3.结果和讨论
3.1FTIR分析和改性脱脂棉对铅(II)的吸附机制
图1是脱脂棉、改性脱脂棉在400-4000 cm-1(A)和2540-2560 cm-1(B)范围内的红外光谱图。可以看出,改性后改性脱脂棉的红外光谱图中在1735.71 cm-1处出现了一个新的吸收峰是酯基C=O的拉伸振动峰,可见改性脱脂棉中已经成功引入巯基官能团。同时,在2550.52 cm-1出现的一个新吸收峰代表的是S-H官能团的弱吸收峰,更深一层的证明了巯基已经嫁接到脱脂棉上。图1(b)是2540-2560 cm-1光谱范围的一个放大图像,可以清楚的观察到S-H官能团的弱吸收峰。进一步证明了酯化改性脱脂棉引入巯基是成功的。而从吸附后的曲线可以看到,2550.52cm-1处S-H的吸收峰消失,证明了硫原子和Pb(II)络合物的形成,同时1735.71cm-1处C=O的吸收峰强度看起来有轻微的减弱可能也是和Pb(II)的络合吸附有关。

毕业设计外文原文及翻译

毕业设计外文原文及翻译

Thermal analysis for the feed drive system of a CNC machineAbstractA high-speed drive system generates more heat through friction at contact areas, such as the ball-screw and the nut, thereby causing thermal expansion which adversely affects machining accuracy. Therefore, the thermal deformation of a ball-screw is oneof the most important objects to consider for high-accuracy and high-speed machine tools. The objective of this work was to analyze the temperature increase and the thermal deformation of a ball-screw feed drive system. The temperature increase was measured using thermocouples, while a laser interferometer and a capacitance probe were applied to measure the thermal error of the ball-screw.Finite element method was used to analyze the thermal behavior of a ball-screw. The measured data were compared with numerical simulation results. Inverse analysis was applied to estimate the strength of the heat source from the measured temperature profile.The generated heat sources for different feed rates were investigated.Keywords:Machine tool; Ball-screw; Thermal error; Finite element method; Thermocouple1. IntroductionPrecise positioning systems with high speed, high resolution and long stroke become more important in ultra-precision machining. The development of high-speed feed drive systems has been a major issue in the machine-tool industry. A high-speed feed drive system reduces necessary non-cutting time. However, due to the backlash and friction force between the ball-screw and the nut, it is difficult to provide a highly precise feed drive system.Most current research is focused on the thermal error compensation of the whole machine tools. Thermally induced error is a time-dependent nonlinear process caused by nonuniform temperature variation in the machine structure. The interaction between the heat source location, its intensity, thermal expansion coefficient and the machine system configuration creates complex thermal behavior . Researchers have employed various techniques namely finite element methods,coordinate transformation methods, neural net-works etc., in modelling the thermal characteristicsA high-speed drive system generates more heat through friction at contact areas, such as the ball-screw and the nut, thereby causing thermal expansion which adversely affects machining accuracy. Therefore, the thermal deformation of a ball-screw is one of the most important objects to consider for high-accuracy and high-speed machine tools [5]. In order to achieve high-precision positioning, pre-load on the ball-screw is necessary to eliminate backlash. ball-screw pre-load also plays an important role in improving rigidity, noise, accuracy and life of the positioning stage [6]. However, pre-load also produces significant friction between the ball-screw and the nut that generates greater heat, leading to large thermal deformation of the ball-screw and causing low positioning accuracy. Consequently, the accuracy of the main system, such as a machine tool, is affected. There-fore, anoptimum pre-load of the ball-screw is one of the most important things to consider for machine tools with high accuracy and great rigidity.Only a few researchers have tackled this problem with some success. Huang used the multiple regression method to analyze the thermal deformation of a ball-screw feed drive system. Three temperature increases at front bearing, nut and back bearing were selected as independent variables of the analysis model. The multiple-regression model may be used to predict the thermal deformation of the ball-screw. Kim et al. Analyzed the temperature distribution along a ball-screw system using finite element methods with bilinear type of elements. Heat induced due to friction is the main source of deformation in a ball-screw system, the heat generated being dependent on the pre-load, the lubrication of the nut and the assembly conditions. The proposed FEM model was based on the assumption that the screw shaft and nut are a solid and hollow shaft respectively. Yun et al. used the modified lumped capacitance method and genius education algorithm to analyze the linear positioning error of the ball-screw.The objective of this work was to analyze the temperature increase and the thermal deformation of a ball-screw feed drive system. The temperature increase was measured using thermocouples while a laser interferometer and a capacitance probe were applied to meas-ure the thermal error of the ball-screw. Finite element method was also applied to simulate the thermal behavior of the ball-screw. Measured data were compared with numerical simulation results. Inverse analysis was applied to estimate the strength of the heat source from the measured temperature pro file. Generated heat sources for different feed rates were investigated.2 Experimental set-up and procedureIn this study, the object used to investigate the thermal characteristics of a ball-screw system is a machine center as shown in Fig. 1. The maximum rapid speed along thex-axis of the machine center is 40 m/min and the x-axis travel is 800 mm. The table repeatedly moved along the x-axis with a stroke of 600 mm. The main heat sourceFig. 1. Photograph of machine center.of the ball-screw system is the friction caused by a moving nut and rotating bearings. The produced temperature increase and thermal deformation were measured to study the thermal characteristics of the ball-screw system.In order to measure the temperature increase and the thermal deformation of a ball-screw system under long-term movement of the nut, experiments were performed with the arrangement shown in Fig. 2. Temperatures at nine points were measured as shown in Fig. 2a .Two thermocouples (numbered 1 and 8) were located on the rear and front bearing surfaces, respectively. They were used to measure the surface temperatures of these two support bearings. The last one (numbered 9) was used to measure the room temperature. The recorded room temperature was to eliminate the effect of environmental variation. These three thermocouples were used for continuous acquisition under moving conditions. The other six thermocouples (numbered 2 –7) were used to measure the surface temperatures of the ball-screw. Because the moving nut covered most of the ball-screw, thermocouples cannot be consistently fixed on the ball-screw. While temperature measurement was necessary, the ball-screw stopped running and these six thermocouples were quickly attached to specified locations of the ball-screw. Having collected the required data, the thermocouples were quickly removed.Thermal deformation errors were simultaneously measured with two methods. Because a thrust bearing is used on the driving side of the ball-screw, this end is considered to be fixed. A capacitance probe was installed next to the driven side of the ball-screw with a direction perpendicular to the side surface as shown in Fig. 2b. This probe was used to record the whole thermal deformation of the ball-screw. The values can be collected continuously during running conditions. The second method is used to measure the thermal error distribution at some specified time. Before the feed drive system started to operate, the original positional error distribution was measured with a laser interferometer (HP5528A). The table moved step-by-step (the increment ofFig. 2. Locations of measured points for (a) temperatures and (b) thermal errors.each step was 100 mm) and the positioning error was recorded at each step. Then the feed drive system started to operate and generate heat. After a certain time interval, the feed drive system stopped to measure thermal errors. In the same way, the positioning error distribution was again collected with the laser interferometer. Subtracting the actual error from the original error of the x-coordinates, the results are net thermal errors. Having collected the temperature increase (with thermocouples) and deformation distribution, the feed drive system starts running again.In this study, three feed rates (10, 15 and 20 m/min) along the x-axis and three different pre-loads (0, 150 and 300 kgf·cm) were used. The table moved along the x-axis in a reciprocating motion and the stroke was 600mm. The point temperatures and thermal errors were measured at sampling intervals of 10 min. Each stopping time was only about 10 s. These procedures were operated repeatedly until the temperature reached a steady state.3. Experimental results and discussionThe developed experimental setup was utilized for three constant feed rates (running at 10, 15 and 20m/min, respectively). The table reciprocated until point temperatures and thermal errors reached a steady state. Firstly, the ball-screw pre-load was zero and its thermal characteristics were studied. In Fig. 3, temperature variationsFig. 3. (a) Measured temperature increase and (b) thermal error over time for feed rate of 10 m/min and zero-pre-load.and thermal errors of the feed drive system are shown over time for a feed rate of 10 m/min. Measurements can also be made for feed rates of 15 and 20m/min. Themeasured data at a steady state are shown in Tables 1 and 2 . A brief discussion can be made as fol-lows.1. The higher feed rate produces larger frictional heat at the interface between the ball-screw and the nut. The frictional heat generated by the support bearings and the motor also increases with the feed rate. Therefore, the temperature of the ball-screw increases with the feed rate.2. The table travels over the middle part with a 600 mm stroke. The central part of the ball-screw reveals a higher temperature increase. Support bearings do not have high temperature increase because the bearing pre-load is zero.3. A higher rotational speed brings a larger thermal expansion for the ball-screw. The middle part of the screw has a slightly larger thermal expansion because of its higher temperature increase. However, this phenomenon is not obvious. The thermal error at some specified point of the ball-screw is approximately proportional to the distance between this point and the front end (the motor-driving side of the screw). Secondly, the ball-screw pre-load was set at 150kgf·cm and its thermal characteristics were studied. In Figs. 4 –5, temperature variations around the feed drive system and thermal errors are shown over time for feed rates of 10 and 15 m/min. Measured data are shown in Tables 1 and 2. Results reveal two interesting phenomena shown as follows.1. Temperature increases of measured points grow gradually until the ball-screw reaches a steady state except for the temperature increase of the bearing on the driven side. The temperature of this bearing quickly reaches a maximum value and then gradually drops.2. The thermal errors of P6, P7 and P8 are negative at the steady state. It means that these three points move to the driving side due to thermal expansion, while other points move to the driven side. Furthermore, the thermal errors of P4 to P8 show a gradual decrease after 60 min.These phenomena are different from previous results with no pre-load. Some experiments were carried out to study these phenomena. We found that the two bearing stands bent if the ball-screw was pre-loaded. After the pre-load was applied on the ball-screw, the original positional error distribution was measured using a laser interferometer. At this moment, the bending effects on error distribution were includ- Table 1Temperature distribution at steady state with different pre-loads and feed rates (unit: °C)Table 2Thermal error distribution at steady state with different pre-loads and feed rates (unit:µm)Fig. 4. (a) Measured temperature increase Fig. 5. (a) Measured temperature increase and (b) thermal error over time for feed and (b) thermal error over time for feed rate of 10 m/min and pre-load of rate of 15 m/min and pre-load of150kgf ·cm. 150kgf ·cm.-ed in the measured positioning error. The feed drive system starts to run and the ball-screw expands. The expansion relaxes the pre-load of the ball-screw and the bending deformation of two bearing stands. Therefore, the points on the driving side move closer to the motor, thereby thermal errors are negative, nevertheless, the points on the driven side move to the free end, thereby thermal errors are positive.The temperature change of the rear bearing was also investigated. A journal bearing was applied on the driven side and a thrust bearing was applied on the driving side. The pre-load of the ball-screw increases the pre-load of the bearing on the driven side. When the feed drive system runs, the bearing temperature on the driven side sharplyincreases due to the rising pre-load. However, the thermal expansion of the ball-screw relaxes the ball-screw and decreases pre-load of the bearing on the driven side. Therefore, the temperature gradually decreases to a steady state.Finally, the ball-screw pre-load was set to 300kgf·cm and its thermal characteristics were studied. In Figs. 6 and 7, temperature variations around the feed drive systemFig. 6. (a) Measured temperature increase and (b) thermal error over time for feed rate of 10 m/min and pre-load of 300kgf ·cm.Fig. 7. (a) Measured temperature increase and (b) thermal error over time for feed rate of 15 m/min and pre-load of 300kgf ·cm.and thermal errors are shown over time for feed rates of 10 and 15 m/min. The tendency with a 300kgf·cm is similar to that with a 150kgf·cm. Measured data are shown in Tables 1 and 2.4. Numerical simulationThe main heat source of a ball-screw system is the friction caused by a moving nut and the support bearings. In this study, temperature distribution was calculated using the FEM based on the following assumptions:1. The screw shaft is a solid cylinder.2. Friction heat generation between the moving nut and the screw shaft is uniform at contacting surface and is proportional to contacting time.3. Heat generation at support bearings is also constant per unit area and unit time.4. Convective heat coefficients are always constant during moving. The radiation term is neglected.The problem is de fined as transient heat conduction in non-deforming media without radiation. A classical form of the initial/boundary value problem is shown below:where is the internal heat generation rate, q the entering heat flux, a unit outward normal vector, the ambient temperature and h the convective heattrans-fer coefficient at a given boundary. A simplified heat transfer model of the ball-screw system is described in Fig. 8 along with the boundary conditions. The nut moves reciprocally with a stroke, s. The length of the nut is w. According to the previously mentioned assumption, No. 2, frictional heat fluxes on the balls-crew are shown as in Fig. 8b . Both ends of the balls-crew are subjected to frictional heat fluxq and q caused by the support bearings. Heat fluxes on rear and front ends are13 respectively. Other surfaces are subjected to convection heat transfer as shown in Fig.8c .To obtain an approximate solution, Eqs. (1)–(3) may be transformed through discretization into algebraic expressions that may be solved for unknowns. In orderto allow the replacement of the continuous system by an equivalent discrete system, the original domain is divided into elements. Four-node tetrahedral elements are chosen in this study. Elements and nodes of the balls-crew for FEM are shown in Fig.9.Once temperature distribution is obtained, the thermal expansion of the balls-crew may be predicted. In the case of linearly elastic isotropic three-dimensional solid, stress–strain relations are given by Hooke ’s law as [9]:of balls-crew.Fig. 9. Elements and nodes of ball-screw for FEM.where [C] is a matrix of elastic coefficients and 0ε→is the vector of initial strains. In the case of heating of an isotropic material, the initial strain vector is given by:where a is the coefficient of thermal expansion and T is the temperature change. Three unknowns 123,,q q and q are to be determined with inverse analysis. Firstly, initial guessing of these heat fluxes is applied in FEM simulation to obtain the temperature distribution of the balls-crew. If numerical results do not agree with the measured temperature distribution, the values of 123,,q q and q are adjusted iteratively until numerical and simulation results are in good agreement.Calculated values of 123,,q q and q for an un-pre-loaded ball-screw are listed in Table3. Measured and simulated temperature distributions for feed rates of 10, 15 and 20 m/min are indicated in Fig. 10. For each feed rate, it shows a good agreement between measured and simulated temperature distributions. The numerical program can also be used to simulate the thermal expansion of the ball-screw based on the calculated heatTable 3Values of heat flux at different locations (unit:2W m)/Fig. 10. Temperature increase from experimental measurement and numerical simulation for feed rate of (a) 10 m/min, (b) 15 m/min and (c) 20 m/min.fluxes. Measured and simulated thermal expansions of the ball-screw are compared as shown in Table 4. Thermal expansions also show good agreement with each other. From Table 3, the heat flux increases with the feed rate. Approximate linear relation can be found between the heat flux and the feed rate under the same operating condition.5. ConclusionsThis paper proposes a systematic method to investigate the thermal characteristics of a feed drive system. The approach measures the temperature increase and the thermal deformation under long-term movement of the working table. A simplified FEM model for the ball-screw was developed. The FEM model incorporated with themeasured temperature distribution was used to determine the strength of the frictional heat source by inverse analysis. The strength of the heat source was applied to the FEM model to calculate the thermal errors of the feed drive system. Calculated and measured thermal errors were found to agree with each other. From the results, the following conclusions can be drawn:1. The positional accuracy increases while closer to the driving side of the ball-screw. The thermal error increases with the distance to the driven side of the ball-screw. The maximum thermal error occurs at the driven side of the ball-screw (free end). This value can be taken as the total thermal error of the ball-screw and may be measured with a capacitance probe.2. The ball-screw pre-load raises the temperature increases of both support bearings, especially the bearing on the driven side. The surface temperature of the ball-screw decreases because the thermal effects relax the pre-load, thereby decreasing the friction between the nut and the ball-screw.3. The thermal expansion of the ball-screw increases with the feed rate, thereby increasing the positional error. However, the increasing pre-load reduces thermal errors and improves the positional accuracy of the feed drive system.4.Two bearing stands may bend if the ball-screw is pre-loaded. The thermal expansi Table 4Thermal errors at different feed rates-on relaxes the pre-load of the ball-screw and the bending deformation of two bearing stands. Therefore, the points on the motor side move closer to the motor and the thermal errors are negative; nevertheless, the points on the free side move to the free end and the thermal errors are positive.数控加工中心进给驱动系统的热分析摘要高速驱动系统在接触区域(如滚珠丝杠和螺母)通过摩擦产生大量的热,从而导致热膨胀,热膨胀严重地影响机械加工精度。

软件工程专业毕业设计外文文献翻译

软件工程专业毕业设计外文文献翻译

软件工程专业毕业设计外文文献翻译1000字本文将就软件工程专业毕业设计的外文文献进行翻译,能够为相关考生提供一定的参考。

外文文献1: Software Engineering Practices in Industry: A Case StudyAbstractThis paper reports a case study of software engineering practices in industry. The study was conducted with a large US software development company that produces software for aerospace and medical applications. The study investigated the company’s software development process, practices, and techniques that lead to the production of quality software. The software engineering practices were identified through a survey questionnaire and a series of interviews with the company’s software development managers, software engineers, and testers. The research found that the company has a well-defined software development process, which is based on the Capability Maturity Model Integration (CMMI). The company follows a set of software engineering practices that ensure quality, reliability, and maintainability of the software products. The findings of this study provide a valuable insight into the software engineering practices used in industry and can be used to guide software engineering education and practice in academia.IntroductionSoftware engineering is the discipline of designing, developing, testing, and maintaining software products. There are a number of software engineering practices that are used in industry to ensure that software products are of high quality, reliable, and maintainable. These practices include software development processes, software configuration management, software testing, requirements engineering, and project management. Software engineeringpractices have evolved over the years as a result of the growth of the software industry and the increasing demands for high-quality software products. The software industry has developed a number of software development models, such as the Capability Maturity Model Integration (CMMI), which provides a framework for software development organizations to improve their software development processes and practices.This paper reports a case study of software engineering practices in industry. The study was conducted with a large US software development company that produces software for aerospace and medical applications. The objective of the study was to identify the software engineering practices used by the company and to investigate how these practices contribute to the production of quality software.Research MethodologyThe case study was conducted with a large US software development company that produces software for aerospace and medical applications. The study was conducted over a period of six months, during which a survey questionnaire was administered to the company’s software development managers, software engineers, and testers. In addition, a series of interviews were conducted with the company’s software development managers, software engineers, and testers to gain a deeper understanding of the software engineering practices used by the company. The survey questionnaire and the interview questions were designed to investigate the software engineering practices used by the company in relation to software development processes, software configuration management, software testing, requirements engineering, and project management.FindingsThe research found that the company has a well-defined software development process, which is based on the Capability Maturity Model Integration (CMMI). The company’s software development process consists of five levels of maturity, starting with an ad hoc process (Level 1) and progressing to a fully defined and optimized process (Level 5). The company has achieved Level 3 maturity in its software development process. The company follows a set of software engineering practices that ensure quality, reliability, and maintainability of the software products. The software engineering practices used by the company include:Software Configuration Management (SCM): The company uses SCM tools to manage software code, documentation, and other artifacts. The company follows a branching and merging strategy to manage changes to the software code.Software Testing: The company has adopted a formal testing approach that includes unit testing, integration testing, system testing, and acceptance testing. The testing process is automated where possible, and the company uses a range of testing tools.Requirements Engineering: The company has a well-defined requirements engineering process, which includes requirements capture, analysis, specification, and validation. The company uses a range of tools, including use case modeling, to capture and analyze requirements.Project Management: The company has a well-defined project management process that includes project planning, scheduling, monitoring, and control. The company uses a range of tools to support project management, including project management software, which is used to track project progress.ConclusionThis paper has reported a case study of software engineering practices in industry. The study was conducted with a large US software development company that produces software for aerospace and medical applications. The study investigated the company’s software development process,practices, and techniques that lead to the production of quality software. The research found that the company has a well-defined software development process, which is based on the Capability Maturity Model Integration (CMMI). The company uses a set of software engineering practices that ensure quality, reliability, and maintainability of the software products. The findings of this study provide a valuable insight into the software engineering practices used in industry and can be used to guide software engineering education and practice in academia.外文文献2: Agile Software Development: Principles, Patterns, and PracticesAbstractAgile software development is a set of values, principles, and practices for developing software. The Agile Manifesto represents the values and principles of the agile approach. The manifesto emphasizes the importance of individuals and interactions, working software, customer collaboration, and responding to change. Agile software development practices include iterative development, test-driven development, continuous integration, and frequent releases. This paper presents an overview of agile software development, including its principles, patterns, and practices. The paper also discusses the benefits and challenges of agile software development.IntroductionAgile software development is a set of values, principles, and practices for developing software. Agile software development is based on the Agile Manifesto, which represents the values and principles of the agile approach. The manifesto emphasizes the importance of individuals and interactions, working software, customer collaboration, and responding to change. Agile software development practices include iterative development, test-driven development, continuous integration, and frequent releases.Agile Software Development PrinciplesAgile software development is based on a set of principles. These principles are:Customer satisfaction through early and continuous delivery of useful software.Welcome changing requirements, even late in development. Agile processes harness change for the customer's competitive advantage.Deliver working software frequently, with a preference for the shorter timescale.Collaboration between the business stakeholders and developers throughout the project.Build projects around motivated individuals. Give them the environment and support they need, and trust them to get the job done.The most efficient and effective method of conveying information to and within a development team is face-to-face conversation.Working software is the primary measure of progress.Agile processes promote sustainable development. The sponsors, developers, and users should be able to maintain a constant pace indefinitely.Continuous attention to technical excellence and good design enhances agility.Simplicity – the art of maximizing the amount of work not done – is essential.The best architectures, requirements, and designs emerge from self-organizing teams.Agile Software Development PatternsAgile software development patterns are reusable solutions to common software development problems. The following are some typical agile software development patterns:The Single Responsibility Principle (SRP)The Open/Closed Principle (OCP)The Liskov Substitution Principle (LSP)The Dependency Inversion Principle (DIP)The Interface Segregation Principle (ISP)The Model-View-Controller (MVC) PatternThe Observer PatternThe Strategy PatternThe Factory Method PatternAgile Software Development PracticesAgile software development practices are a set ofactivities and techniques used in agile software development. The following are some typical agile software development practices:Iterative DevelopmentTest-Driven Development (TDD)Continuous IntegrationRefactoringPair ProgrammingAgile Software Development Benefits and ChallengesAgile software development has many benefits, including:Increased customer satisfactionIncreased qualityIncreased productivityIncreased flexibilityIncreased visibilityReduced riskAgile software development also has some challenges, including:Requires discipline and trainingRequires an experienced teamRequires good communicationRequires a supportive management cultureConclusionAgile software development is a set of values, principles, and practices for developing software. Agile software development is based on the Agile Manifesto, which represents the values and principles of the agile approach. Agile software development practices include iterative development, test-driven development, continuous integration, and frequent releases. Agile software development has many benefits, including increased customer satisfaction, increased quality, increased productivity, increased flexibility, increased visibility, and reduced risk. Agile software development also has some challenges, including the requirement for discipline and training, the requirement for an experienced team, the requirement for good communication, and the requirement for a supportive management culture.。

毕业设计外文翻译

毕业设计外文翻译

AT89C51外文翻译DescriptionThe AT89C51 is a low-power, high-performance CMOS 8-bit microcomputer with 4K bytes of Flash Programmable and Erasable Read Only Memory (PEROM). The device is manufactured using Atmel’s high density nonvolatile memory technology and is compatible with the industry standard MCS-51™ instruction-set and pinout. The on-chip Flash allows the program memory to be reprogrammed in-system or by a conventional nonvolatile memory programmer. By combining a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel A T89C51 is a powerful microcomputer which provides a highly flexible and cost effective solution to many embedded control applications.Features• Compatible with MCS-51™ Products• 4K Bytes of In-System Reprogrammable Flash Memory– Endurance: 1,000 Write/Erase Cycles• Fully Static Operation: 0 Hz to 24 MHz• Three-Level Program Memory Lock• 128 x 8-Bit Internal RAM• 32 Programmable I/O Lines• Two 16-Bit Timer/Counters• Six Interrupt Sources• Programmable Serial Channel• Low Power Idle and Power Down ModesThe AT89C51 provides the following standard features: 4K bytes of Flash,128 bytes of RAM, 32 I/O lines, two 16-bit timer/counters, a five vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator and clock circuitry. In addition, the AT89C51 is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port and interrupt system to continue functioning. The Power-down Mode saves the RAM contents but freezes the oscillator disabling all other chip functions until the next hardware reset.VCCSupply voltage.GNDGround.Port 0Port 0 is an 8-bit open-drain bi-directional I/O port. As an output port, each pin can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance inputs.Port 0 may also be configured to be the multiplexed low-order address/data bus during accesses to external program and data memory. In this mode P0 has internal pullups. Port 0 also receives the code bytes during Flash programming, and outputs the code bytes during program verification. External pullups are required during program verification.Port 1Port 1 is an 8-bit bi-directional I/O port with internal pullups.The Port 1 output buffers can sink/source four TTL inputs.When 1s are written to Port 1 pins they are pulled high by the internal pullups and can be used as inputs. As inputs,Port 1 p ins that are externally being pulled low will source current (IIL) because of the internal pullups.Port 1 also receives the low-order address bytes during Flash programming and verification.Port 2Port 2 is an 8-bit bi-directional I/O port with internal pullups.The Port 2 output buffers can sink/source four TTL inputs.When 1s are written to Port 2 pins they are pulled high by the internal pullups and can be used as inputs. As inputs,Port 2 pins that are externally being pulled low will source current (IIL) because of the internal pullups. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application, it uses strong internal pullups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special Function Register. Port 2 also receives the high-order address bits and some control signals during Flash programming and verification.Port 3Port 3 is an 8-bit bi-directional I/O port with internal pullups. The Port 3 output buffers can sink/source four TTL inputs.When 1s are written to Port 3 pins they arepulled high by the internal pullups and can be used as inputs. As inputs,Port 3 pins that are externally being pulled low will source current (IIL) because of the pullups. Port 3 also serves the functions of various special features of the AT89C51 as listed below:Port 3 also receives some control signals for Flash programming and verification. RSTReset input. A high on this pin for two machine cycles while the oscillator is running resets the device.ALE/PROGAddress Latch Enable output pulse for latching the low byte of the address during accesses to external memory. This pin is also the program pulse input (PROG) during Flash programming. In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external Data Memory.If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high. Setting the ALE-disable bit has no effect if the microcontroller is in external execution mode.PSENProgram Store Enable is the read strobe to external program memory. When the AT89C51 is executing code from external program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external data memory.EA/VPPExternal Access Enable. EA must be strapped to GND in order to enable the device to fetch code from external program memory locations starting at 0000H up toFFFFH.Note, however, that if lock bit 1 is programmed, EA will be internally latched on reset. EA should be strapped to VCC for internal program executions.This pin also receives the 12-volt programming enable voltage (VPP) during Flash programming, for parts that require 12-volt VPP.XTAL1Input to the inverting oscillator amplifier and input to the internal clock operating circuit.XTAL2Output from the inverting oscillator amplifier.Oscillator CharacteristicsXTAL1 and XTAL2 are the input and output, respectively,of an inverting amplifier which can be configured for use as an on-chip oscillator, as shown in Figure 1. Either a quartz crystal or ceramic resonator may be used. To drive the device from an external clock source, XTAL2 should be left unconnected while XTAL1 is driven as shown in Figure 2.There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low time specifications must be observed.Idle ModeIn idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The mode is invoked by software. The content of the on-chip RAM and all the special functions registers remain unchanged during this mode. The idle mode can be terminated by any enabled interrupt or by a hardware reset. It should be noted that when idle is terminated by a hard ware reset, the device normally resumes program execution, from where it left off, up to two machine cycles before the internal reset algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but access to the port pins is not inhibited. To eliminate the possibility of an unexpected write to a port pin when Idle is terminated by reset, the instruction following the one that invokes Idle should not be one that writes to a port pin or to external memory.Figure 1. Oscillator ConnectionsNote: C1, C2 = 30 pF ± 10 pF for Crystals= 40 pF ± 10 pF for Ceramic ResonatorsFigure 2. External Clock Drive ConfigurationPower-down ModeIn the power-down mode, the oscillator is stopped, and the instruction that invokes power-down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the power-down mode is terminated. The only exit from power-down is a hardware reset. Reset redefines the SFRs but does not change the on-chip RAM. The reset should not be activated before VCC is restored to its normal operating level and must be held active long enough to allow the oscillator to restart and stabilize.Program Memory Lock BitsOn the chip are three lock bits which can be left unprogrammed (U) or can be programmed (P) to obtain the additional features listed in the table below.When lock bit 1 is programmed, the logic level at the EA pin is sampled and latched during reset.If the device is powered up without a reset, the latch initializes to a random value, and holds that value until reset is activated. It is necessary that the latched value of EA be in agreement with the current logic level at that pin in order for the device to function properly.Programming the FlashThe AT89C51 is normally shipped with the on-chip Flash memory array in the erased state (that is, contents = FFH)and ready to be programmed. The programming interface accepts either a high-voltage (12-volt) or a low-voltage (VCC) program enable signal. The low-voltage programming mode provides a convenient way to program the AT89C51 inside t he user’s system, while the high-voltage programming mode is compatible with conventional thirdparty Flash or EPROM programmers.The AT89C51 is shipped with either the high-voltage or low-voltage programming mode enabled. The respective top-side marking and device signature codes are listed in the following table.The AT89C51 code memory array is programmed byte-by-byte in either programming mode. To program any non-blank byte in the on-chip Flash Memory, the entire memory must be erased using the Chip Erase Mode. Programming Algorithm: Before programming the A T89C51, the address, data and control signals should be set up according to the Flash programming mode table and Figures 3 and 4. To program the AT89C51, take the following steps.1. Input the desired memory location on the address lines.2. Input the appropriate data byte on the data lines.3. Activate the correct combination of control signals.4. Raise EA/VPP to 12V for the high-voltage programming mode.5. Pulse ALE/PROG once to program a byte in the Flash array or the lock bits. The byte-write cycle is self-timedand typically takes no more than 1.5 ms. Repeat steps 1 through 5, changing the address and data for the entire array or until the end of the object file is reached.Data Polling: The AT89C51 features Data Polling to indicate the end of a write cycle. During a write cycle, anattempted read of the last byte written will result in the complement of the written datum on PO.7. Once the write cycle has been completed, true data are valid on all outputs, and the next cycle may begin. Data Polling may begin any time after a write cycle has been initiated.Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY output signal. P3.4 is pulled low after ALE goes high during programming to indicate BUSY. P3.4 is pulled high again when programming is done to indicate READY.Program V erify: If lock bits LB1 and LB2 have not been programmed, the programmed code data can be read back via the address and data lines for verificatio n. The lock bits cannot be verified directly. V erification of the lock bits is achieved by observing that their features are enabled.Chip Erase: The entire Flash array is erased electrically by using the proper combination of control signals and by holding ALE/PROG low for 10 ms. The code array is written with all ―1‖s. The chip erase operation must be executed before the code memory can be re-programmed.Reading the Signature Bytes: The signature bytes are read by the same procedure as a normal verification of locations 030H, 031H, and 032H, except that P3.6 and P3.7 must be pulled to a logic low. The values returned are as follows.(030H) = 1EH indicates manufactured by Atmel(031H) = 51H indicates 89C51(032H) = FFH indicates 12V programming(032H) = 05H indicates 5V programmingProgramming InterfaceEvery code byte in the Flash array can be written and the entire array can be erased by using the appropriate combination of control signals. The write operation cycle is selftimed and once initiated, will automatically time itself to completion.All major programming vendors offer worldwide support for the Atmelmicrocontroller series. Please contact your local programming vendor for the appropriate software revision.Flash Programming and V erification Waveforms - High-voltage Mode (VPP = 12V)Flash Programming and V erification Waveforms - Low-voltage Mode (VPP = 5V)Flash Programming and Verification Characteristics TA = 0°C to 70°C, VCC = 5.0 ±10%Absolute Maximum Ratings**NOTICE: Str esses beyond those listed under ―Absolute Maximum Ratings‖ may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.DC CharacteristicsTA = -40°C to 85°C, VCC = 5.0V ±20% (unless otherwise noted)Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:Maximum IOL per port pin: 10 mAMaximum IOL per 8-bit port: Port 0: 26 mAPorts 1, 2, 3: 15 mAMaximum total IOL for all output pins: 71 mAIf IOL exceeds the test condition, VOL may exceed the related specification. Pins arenot guaranteed to sink current greater than the listed test conditions.2. Minimum VCC for Power-down is 2V.AC CharacteristicsUnder operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other outputs = 80 pF.External Program and Data Memory CharacteristicsExternal Program Memory Read CycleExternal Data Memory Read CycleExternal Data Memory Write CycleExternal Clock Drive WaveformsExternal Clock DriveSerial Port Timing: Shift Register Mode Test Conditions (VCC = 5.0 V ±20%; Load Capacitance = 80 pF)Shift Register Mode Timing WaveformsAC Testing Input/Output Waveforms(1)Note: 1. AC Inputs during testing are driven at VCC - 0.5V for a logic 1 and 0.45V for a logic 0. Timing measurements are made at VIH min. for a logic 1 and VIL max. for a logic 0.Float Waveforms(1)Note: 1. For timing purposes, a port pin is no longer floating when a 100mV change from load voltage occurs. A port pin begins to float when 100mV change from the loaded VOH/VOL level occurs.AT89C51中文原文AT89C51是美国ATMEL公司生产的低电压,高性能CMOS8位单片机,片内含4k bytes的可反复擦写的只读程序存储器(PEROM)和128 bytes的随机存取数据存储器(RAM),器件采用A TMEL公司的高密度、非易失性存储技术生产,兼容标准MCS-51指令系统,片内置通用8位中央处理器(CPU)和Flash存储单元,功能强大AT89C51单片机可为您提供许多高性价比的应用场合,可灵活应用于各种控制领域。

华南理工大学 毕业设计 外文翻译

华南理工大学  毕业设计 外文翻译

华南理工大学本科毕业设计(论文)翻译班级土木工程三班姓名王剑锋学号 200930132042指导教师骆冠勇填表日期 2013年4月21日中文译名一种用于预测拉森钢板桩弯曲强度的数值模型外文原文名 A numerical model for predicting the bending strength of Larssen steel sheetpiles外文原文版出处Journal of Constructional Steel Research 58 (2002) 1361–1374译文:一种用于预测拉森钢板桩弯曲强度的数值模型R.J. Crawford, M.P. Byfield摘要拉森桩为U形横截面并通过可滑动的接头连接在一起组成码头岸壁,围堰,和其他类型的挡土墙。

由于滑动接头位于桩墙的中心线上,相互连接桩的桩间滑移可能导致桩墙70%的弯曲强度折减。

这种桩间滑移可以通过安装成对的带有卷曲的锁头的桩来部分阻止。

然而,像非卷曲桩一样弯曲强度很难被预测,因为这种联锁桩依然存在桩间滑移。

本文提出了一种用于预测联锁拉森桩弯曲应力以及压应力的数值方法。

通过测试1:6比例大小的铝制拉森桩微缩模型的数据与数值模型计算结果进行比较,结果表明数值模型所预测的应力与实际实验结果接近一致。

同时本数值模型也可用于钢板桩的设计生产,以达到使用最少的材料来达到最大的弯曲强度的目的。

C 2002爱思唯尔股份有限公司保留解释权利关键词:行业规范;组合结构;拉森桩;桩结构;挡土墙;钢结构1.介绍钢板桩被广泛运用于全世界。

工程上经常使用的两种钢板桩是U型拉森钢板桩和Z型钢板桩。

两种类型的钢板桩桩都是利用沿着构件长度方向的锁头连接成有缝的连续墙结构。

根据欧洲标准化委员会引入的欧3标准第五部分,U型钢板桩锁头连接部分的下滑位移的影响不能忽视(见图1 步骤1)。

如果钢板桩单肢的相对滑移严重,则钢板桩的弯曲强度会下降到整体强度的70%,我们将其称为钢板桩模量下降。

办公楼毕业设计英文翻译(外文翻译)

办公楼毕业设计英文翻译(外文翻译)

In 1980 the Level House, designed by Skidmore, Owings and Merril1 (SOM) received the 25-year award from the American Institute of Architects “in recognition of architectural design of enduring significance”. This award is given once a year for a building between 25and 35 years old .Lewis Mumford described the Lever House as “the first office building in which modern materials, modern construction, modern functions have been combined with a modern plan”. At the time, this daring concept could only be achieved by visionary men like Gordon Bunshaft , the designer , and Charles Luckman , the owner and then-president of Lever Brothers . The project also included a few “first” : (1) it was the first sealed glass tower ever built ; (2) it was the first office building designed by SOM ;and (3) it was the first office building on Park Avenue to omit retail space on the first floor. Today, after hundreds of look-alike and variations on the grid design, we have reached what may be the epitome of tall building design: the nondescript building. Except for a few recently completed buildings that seem to be people-oriented in their lower floors, most tall buildings seem to be a repletion of the dull, graph-paper-like monoliths in many of our cities. Can this be the end of the design-line for tall buildings? Probably not. There are definite signs that are most encouraging. Architects and owners have recently begun to discuss the design problem publicly. Perhaps we are at the threshold of a new era. The 1980s may bring forth some new visionaries like Bunshaft and Luckman. If so, what kinds of restrictions or challenges do they face? 译文: 来自高层建筑展望及建筑结构

毕业设计(论文)外文翻译

毕业设计(论文)外文翻译

华南理工大学广州学院本科生毕业设计(论文)翻译外文原文名Agency Cost under the Restriction of Free Cash Flow中文译名自由现金流量的限制下的代理成本学院管理学院专业班级会计学3班学生姓名陈洁玉学生学号200930191100指导教师余勍讲师填写日期2015年5月11日外文原文版出处:译文成绩:指导教师(导师组长)签名:译文:自由现金流量的限制下的代理成本摘要代理成本理论是资本结构理论的一个重要分支。

自由现金流代理成本有显着的影响。

在这两个领域相结合的研究,将有助于建立和扩大理论体系。

代理成本理论基础上,本研究首先分类自由现金流以及统计方法的特点。

此外,投资自由现金流代理成本的存在证明了模型。

自由现金流代理成本理论引入限制,分析表明,它会改变代理成本,进而将影响代理成本和资本结构之间的关系,最后,都会影响到最优资本结构点,以保持平衡。

具体地说,自由现金流增加,相应地,债务比例会降低。

关键词:资本结构,现金流,代理成本,非金钱利益1、介绍代理成本理论,金融契约理论,信号模型和新的啄食顺序理论,新的资本结构理论的主要分支。

财务con-道的理论侧重于限制股东的合同行为,解决股东和债权人之间的冲突。

信令模式和新的啄食顺序理论中心解决投资者和管理者之间的冲突。

这两种类型的冲突是在商业组织中的主要冲突。

代理成本理论认为,如何达到平衡这两种类型的冲突,资本结构是如何形成的,这是比前两次在一定程度上更多的理论更全面。

……Agency Cost under the Restriction of Free Cash FlowAbstractAgency cost theory is an important branch of capital structural theory. Free cash flow has significant impact on agency cost. The combination of research on these two fields would help to build and extend the theoretical system. Based on agency cost theory, the present study firstly categorized the characteristics of free cash flow as well as the statistical methodologies. Furthermore, the existence of investing free cash flow in agency cost was proved by a model. Then free cash flow was introduced into agency cost theory as restriction, the analysis shows that it will change agency cost, in turn, will have an impact on the relationship between agency cost and capital structure, finally, will influence the optimal capital structure point to maintain the equilibrium. Concretely, with the increasing free cash flow, correspondingly, debt proportion will decrease.Keywords:Capital Structure,Free Cash Flow,Agency Cost,Non-Pecuniary Benefit1. IntroductionAgency cost theory, financial contract theory, signaling model and new pecking order theory are the main branches of new capital structure theory. Financial con-tract theory focuses on restricting stockholders’ behavior by contract and solving the conflict between stockholders and creditors. Signaling model and new pecking order theory center on solving the conflict between investors and managers. These two types of conflict are the main conflict in business organizations. Agency cost theory considers how equilibrium is reached in both types of conflict and how capital structure is formed, which is more theory is more comprehensive than the previous two to some degree.……。

_毕业设计外文文献及翻译_

_毕业设计外文文献及翻译_

_毕业设计外文文献及翻译_Graduation Thesis Foreign Literature Review and Chinese Translation1. Title: "The Impact of Artificial Intelligence on Society"Abstract:人工智能对社会的影响摘要:人工智能技术的快速发展引发了关于其对社会影响的讨论。

本文探讨了人工智能正在重塑不同行业(包括医疗保健、交通运输和教育)的各种方式。

还讨论了AI实施的潜在益处和挑战,以及伦理考量。

总体而言,本文旨在提供对人工智能对社会影响的全面概述。

2. Title: "The Future of Work: Automation and Job Displacement"Abstract:With the rise of automation technologies, there is growing concern about the potential displacement of workers in various industries. This paper examines the trends in automation and its impact on jobs, as well as the implications for workforce development and retraining programs. The ethical and social implications of automation are also discussed, along with potential strategies for mitigating job displacement effects.工作的未来:自动化和失业摘要:随着自动化技术的兴起,人们越来越担心各行业工人可能被替代的问题。

毕业设计论文外文文献翻译智能交通信号灯控制中英文对照

毕业设计论文外文文献翻译智能交通信号灯控制中英文对照

英语原文Intelligent Traffic Light Controlby Marco Wiering The topic I picked for our community project was traffic lights. In a community, people need stop signs and traffic lights to slow down drivers from going too fast. If there were no traffic lights or stop signs, people’s lives would be in danger from drivers going too fast.The urban traffic trends towards the saturation, the rate of increase of the road of big city far lags behind rate of increase of the car.The urban passenger traffic has already become the main part of city traffic day by day and it has used about 80% of the area of road of center district. With the increase of population and industry activity, people's traffic is more and more frequent, which is unavoidable. What means of transportation people adopt produces pressure completely different to city traffic. According to calculating, if it is 1 to adopt the area of road that the public transport needs, bike needs 5-7, car needs 15-25, even to walk is 3 times more than to take public transits. So only by building road can't solve the city traffic problem finally yet. Every large city of the world increases the traffic policy to the first place of the question.For example,according to calculating, when the automobile owning amount of Shanghai reaches 800,000 (outside cars count separately ), if it distributes still as now for example: center district accounts for great proportion, even when several loop-lines and arterial highways have been built up , the traffic cannot be improved more than before and the situation might be even worse. So the traffic policy Shanghai must adopt , or called traffic strategy is that have priority to develop public passenger traffic of city, narrow the scope of using of the bicycle progressively , control the scale of growth of the car traffic in the center district, limit the development of the motorcycle strictly.There are more municipals project under construction in big city. the influence on the traffic is greater.Municipal infrastructure construction is originally a good thing of alleviating the traffic, but in the course of constructing, it unavoidably influence the local traffic. Some road sections are blocked, some change into an one-way lane, thus the vehicle can only take a devious route . The construction makes the road very narrow, forming the bottleneck, which seriously influence the car flow.When having stop signs and traffic lights, people have a tendency to drive slower andlook out for people walking in the middle of streets. To put a traffic light or a stop sign in a community, it takes a lot of work and planning from the community and the city to put one in. It is not cheap to do it either. The community first needs to take a petition around to everyone in the community and have them sign so they can take it to the board when the next city council meeting is. A couple residents will present it to the board, and they will decide weather or not to put it in or not. If not put in a lot of residents might be mad and bad things could happened to that part of the city.When the planning of putting traffic lights and stop signs, you should look at the subdivision plan and figure out where all the buildings and schools are for the protection of students walking and riding home from school. In our plan that we have made, we will need traffic lights next to the school, so people will look out for the students going home. We will need a stop sign next to the park incase kids run out in the street. This will help the protection of the kids having fun. Will need a traffic light separating the mall and the store. This will be the busiest part of the town with people going to the mall and the store. And finally there will need to be a stop sign at the end of the streets so people don’t drive too fast and get in a big accident. If this is down everyone will be safe driving, walking, or riding their bikes.In putting in a traffic light, it takes a lot of planning and money to complete it. A traffic light cost around $40,000 to $125,000 and sometimes more depending on the location. If a business goes in and a traffic light needs to go in, the business or businesses will have to pay some money to pay for it to make sure everyone is safe going from and to that business. Also if there is too many accidents in one particular place in a city, a traffic light will go in to safe people from getting a severe accident and ending their life and maybe someone else’s.The reason I picked this part of our community development report was that traffic is a very important part of a city. If not for traffic lights and stop signs, people’s lives would be in danger every time they walked out their doors. People will be driving extremely fast and people will be hit just trying to have fun with their friends. So having traffic lights and stop signs this will prevent all this from happening.Traffic in a city is very much affected by traffic light controllers. When waiting for a traffic light, the driver looses time and the car uses fuel. Hence, reducing waiting times before traffic lights can save our European society billions of Euros annually. To make traffic light controllers more intelligent, we exploit the emergence of novel technologies such as communication networks and sensor networks, as well as the use of more sophisticated algorithms for setting traffic lights. Intelligent traffic light control does not only mean thattraffic lights are set in order to minimize waiting times of road users, but also that road users receive information about how to drive through a city in order to minimize their waiting times. This means that we are coping with a complex multi-agent system, where communication and coordination play essential roles. Our research has led to a novel system in which traffic light controllers and the behaviour of car drivers are optimized using machine-learning methods.Our idea of setting a traffic light is as follows. Suppose there are a number of cars with their destination address standing before a crossing. All cars communicate to the traffic light their specific place in the queue and their destination address. Now the traffic light has to decide which option (ie, which lanes are to be put on green) is optimal to minimize the long-term average waiting time until all cars have arrived at their destination address. The learning traffic light controllers solve this problem by estimating how long it would take for a car to arrive at its destination address (for which the car may need to pass many different traffic lights) when currently the light would be put on green, and how long it would take if the light would be put on red. The difference between the waiting time for red and the waiting time for green is the gain for the car. Now the traffic light controllers set the lights in such a way to maximize the average gain of all cars standing before the crossing. To estimate the waiting times, we use 'reinforcement learning' which keeps track of the waiting times of individual cars and uses a smart way to compute the long term average waiting times using dynamic programming algorithms. One nice feature is that the system is very fair; it never lets one car wait for a very long time, since then its gain of setting its own light to green becomes very large, and the optimal decision of the traffic light will set his light to green. Furthermore, since we estimate waiting times before traffic lights until the destination of the road user has been reached, the road user can use this information to choose to which next traffic light to go, thereby improving its driving behaviour through a city. Note that we solve the traffic light control problem by using a distributed multi-agent system, where cooperation and coordination are done by communication, learning, and voting mechanisms. To allow for green waves during extremely busy situations, we combine our algorithm with a special bucket algorithm which propagates gains from one traffic light to the next one, inducing stronger voting on the next traffic controller option.We have implemented the 'Green Light District', a traffic simulator in Java in which infrastructures can be edited easily by using the mouse, and different levels of road usage can be simulated. A large number of fixed and learning traffic light controllers have already been tested in the simulator and the resulting average waiting times of cars have been plotted and compared. The results indicate that the learning controllers can reduce average waiting timeswith at least 10% in semi-busy traffic situations, and even much more when high congestion of the traffic occurs.We are currently studying the behaviour of the learning traffic light controllers on many different infrastructures in our simulator. We are also planning to cooperate with other institutes and companies in the Netherlands to apply our system to real world traffic situations. For this, modern technologies such as communicating networks can be brought to use on a very large scale, making the necessary communication between road users and traffic lights possible.中文翻译:智能交通信号灯控制马克·威宁我所选择的社区项目主题是交通灯。

毕业设计论文外文文献翻译

毕业设计论文外文文献翻译

xxxx大学xxx学院毕业设计(论文)外文文献翻译系部xxxx专业xxxx学生姓名xxxx 学号xxxx指导教师xxxx 职称xxxx2013年3 月Introducing the Spring FrameworkThe Spring Framework: a popular open source application framework that addresses many of the issues outlined in this book. This chapter will introduce the basic ideas of Spring and dis-cuss the central “bean factory” lightweight Inversion-of-Control (IoC) container in detail.Spring makes it particularly easy to implement lightweight, yet extensible, J2EE archi-tectures. It provides an out-of-the-box implementation of the fundamental architectural building blocks we recommend. Spring provides a consistent way of structuring your applications, and provides numerous middle tier features that can make J2EE development significantly easier and more flexible than in traditional approaches.The basic motivations for Spring are:To address areas not well served by other frameworks. There are numerous good solutions to specific areas of J2EE infrastructure: web frameworks, persistence solutions, remoting tools, and so on. However, integrating these tools into a comprehensive architecture can involve significant effort, and can become a burden. Spring aims to provide an end-to-end solution, integrating spe-cialized frameworks into a coherent overall infrastructure. Spring also addresses some areas that other frameworks don’t. For example, few frameworks address generic transaction management, data access object implementation, and gluing all those things together into an application, while still allowing for best-of-breed choice in each area. Hence we term Spring an application framework, rather than a web framework, IoC or AOP framework, or even middle tier framework.To allow for easy adoption. A framework should be cleanly layered, allowing the use of indi-vidual features without imposing a whole worldview on the application. Many Spring features, such as the JDBC abstraction layer or Hibernate integration, can be used in a library style or as part of the Spring end-to-end solution.To deliver ease of use. As we’ve noted, J2EE out of the box is relatively hard to use to solve many common problems. A good infrastructure framework should make simple tasks simple to achieve, without forcing tradeoffs for future complex requirements (like distributed transactions) on the application developer. It should allow developers to leverage J2EE services such as JTA where appropriate, but to avoid dependence on them in cases when they are unnecessarily complex.To make it easier to apply best practices. Spring aims to reduce the cost of adhering to best practices such as programming to interfaces, rather than classes, almost to zero. However, it leaves the choice of architectural style to the developer.Non-invasiveness. Application objects should have minimal dependence on the framework. If leveraging a specific Spring feature, an object should depend only on that particular feature, whether by implementing a callback interface or using the framework as a class library. IoC and AOP are the key enabling technologies for avoiding framework dependence.Consistent configuration. A good infrastructure framework should keep application configuration flexible and consistent, avoiding the need for custom singletons and factories. A single style should be applicable to all configuration needs, from the middle tier to web controllers.Ease of testing. Testing either whole applications or individual application classes in unit tests should be as easy as possible. Replacing resources or application objects with mock objects should be straightforward.To allow for extensibility. Because Spring is itself based on interfaces, rather than classes, it is easy to extend or customize it. Many Spring components use strategy interfaces, allowing easy customization.A Layered Application FrameworkChapter 6 introduced the Spring Framework as a lightweight container, competing with IoC containers such as PicoContainer. While the Spring lightweight container for JavaBeans is a core concept, this is just the foundation for a solution for all middleware layers.Basic Building Blockspring is a full-featured application framework that can be leveraged at many levels. It consists of multi-ple sub-frameworks that are fairly independent but still integrate closely into a one-stop shop, if desired. The key areas are:Bean factory. The Spring lightweight IoC container, capable of configuring and wiring up Java-Beans and most plain Java objects, removing the need for custom singletons and ad hoc configura-tion. Various out-of-the-box implementations include an XML-based bean factory. The lightweight IoC container and its Dependency Injection capabilities will be the main focus of this chapter.Application context. A Spring application context extends the bean factory concept by adding support for message sources and resource loading, and providing hooks into existing environ-ments. Various out-of-the-box implementations include standalone application contexts and an XML-based web application context.AOP framework. The Spring AOP framework provides AOP support for method interception on any class managed by a Spring lightweight container.It supports easy proxying of beans in a bean factory, seamlessly weaving in interceptors and other advice at runtime. Chapter 8 dis-cusses the Spring AOP framework in detail. The main use of the Spring AOP framework is to provide declarative enterprise services for POJOs.Auto-proxying. Spring provides a higher level of abstraction over the AOP framework and low-level services, which offers similar ease-of-use to .NET within a J2EE context. In particular, the provision of declarative enterprise services can be driven by source-level metadata.Transaction management. Spring provides a generic transaction management infrastructure, with pluggable transaction strategies (such as JTA and JDBC) and various means for demarcat-ing transactions in applications. Chapter 9 discusses its rationale and the power and flexibility that it offers.DAO abstraction. Spring defines a set of generic data access exceptions that can be used for cre-ating generic DAO interfaces that throw meaningful exceptions independent of the underlying persistence mechanism. Chapter 10 illustrates the Spring support for DAOs in more detail, examining JDBC, JDO, and Hibernate as implementation strategies.JDBC support. Spring offers two levels of JDBC abstraction that significantly ease the effort of writing JDBC-based DAOs: the org.springframework.jdbc.core package (a template/callback approach) and the org.springframework.jdbc.object package (modeling RDBMS operations as reusable objects). Using the Spring JDBC packages can deliver much greater pro-ductivity and eliminate the potential for common errors such as leaked connections, compared with direct use of JDBC. The Spring JDBC abstraction integrates with the transaction and DAO abstractions.Integration with O/R mapping tools. Spring provides support classesfor O/R Mapping tools like Hibernate, JDO, and iBATIS Database Layer to simplify resource setup, acquisition, and release, and to integrate with the overall transaction and DAO abstractions. These integration packages allow applications to dispense with custom ThreadLocal sessions and native transac-tion handling, regardless of the underlying O/R mapping approach they work with.Web MVC framework. Spring provides a clean implementation of web MVC, consistent with the JavaBean configuration approach. The Spring web framework enables web controllers to be configured within an IoC container, eliminating the need to write any custom code to access business layer services. It provides a generic DispatcherServlet and out-of-the-box controller classes for command and form handling. Request-to-controller mapping, view resolution, locale resolution and other important services are all pluggable, making the framework highly extensi-ble. The web framework is designed to work not only with JSP, but with any view technology, such as Velocity—without the need for additional bridges. Chapter 13 discusses web tier design and the Spring web MVC framework in detail.Remoting support. Spring provides a thin abstraction layer for accessing remote services without hard-coded lookups, and for exposing Spring-managed application beans as remote services. Out-of-the-box support is inc luded for RMI, Caucho’s Hessian and Burlap web service protocols, and WSDL Web Services via JAX-RPC. Chapter 11 discusses lightweight remoting.While Spring addresses areas as diverse as transaction management and web MVC, it uses a consistent approach everywhere. Once you have learned the basic configuration style, you will be able to apply it in many areas. Resources, middle tier objects, and web components are all set up using the same bean configuration mechanism. You can combine your entireconfiguration in one single bean definition file or split it by application modules or layers; the choice is up to you as the application developer. There is no need for diverse configuration files in a variety of formats, spread out across the application.Spring on J2EEAlthough many parts of Spring can be used in any kind of Java environment, it is primarily a J2EE application framework. For example, there are convenience classes for linking JNDI resources into a bean factory, such as JDBC DataSources and EJBs, and integration with JTA for distributed transaction management. In most cases, application objects do not need to work with J2EE APIs directly, improving reusability and meaning that there is no need to write verbose, hard-to-test, JNDI lookups.Thus Spring allows application code to seamlessly integrate into a J2EE environment without being unnecessarily tied to it. You can build upon J2EE services where it makes sense for your application, and choose lighter-weight solutions if there are no complex requirements. For example, you need to use JTA as transaction strategy only if you face distributed transaction requirements. For a single database, there are alternative strategies that do not depend on a J2EE container. Switching between those transac-tion strategies is merely a matter of configuration; Spring’s consistent abstraction avoids any need to change application code.Spring offers support for accessing EJBs. This is an important feature (and relevant even in a book on “J2EE without EJB”) because the u se of dynamic proxies as codeless client-side business delegates means that Spring can make using a local stateless session EJB an implementation-level, rather than a fundamen-tal architectural, choice.Thus if you want to use EJB, you can within a consistent architecture; however, you do not need to make EJB the cornerstone of your architecture. This Spring feature can make devel-oping EJB applications significantly faster, because there is no need to write custom code in service loca-tors or business delegates. Testing EJB client code is also much easier, because it only depends on the EJB’s Business Methods interface (which is not EJB-specific), not on JNDI or the EJB API.Spring also provides support for implementing EJBs, in the form of convenience superclasses for EJB implementation classes, which load a Spring lightweight container based on an environment variable specified in the ejb-jar.xml deployment descriptor. This is a powerful and convenient way of imple-menting SLSBs or MDBs that are facades for fine-grained POJOs: a best practice if you do choose to implement an EJB application. Using this Spring feature does not conflict with EJB in any way—it merely simplifies following good practice.Introducing the Spring FrameworkThe main aim of Spring is to make J2EE easier to use and promote good programming practice. It does not reinvent the wheel; thus you’ll find no logging packages in Spring, no connection pools, no distributed transaction coordinator. All these features are provided by other open source projects—such as Jakarta Commons Logging (which Spring uses for all its log output), Jakarta Commons DBCP (which can be used as local DataSource), and ObjectWeb JOTM (which can be used as transaction manager)—or by your J2EE application server. For the same reason, Spring doesn’t provide an O/R mapping layer: There are good solutions for this problem area, such as Hibernate and JDO.Spring does aim to make existing technologies easier to use. For example, although Spring is not in the business of low-level transactioncoordination, it does provide an abstraction layer over JTA or any other transaction strategy. Spring is also popular as middle tier infrastructure for Hibernate, because it provides solutions to many common issues like SessionFactory setup, ThreadLocal sessions, and exception handling. With the Spring HibernateTemplate class, implementation methods of Hibernate DAOs can be reduced to one-liners while properly participating in transactions.The Spring Framework does not aim to replace J2EE middle tier services as a whole. It is an application framework that makes accessing low-level J2EE container ser-vices easier. Furthermore, it offers lightweight alternatives for certain J2EE services in some scenarios, such as a JDBC-based transaction strategy instead of JTA when just working with a single database. Essentially, Spring enables you to write appli-cations that scale down as well as up.Spring for Web ApplicationsA typical usage of Spring in a J2EE environment is to serve as backbone for the logical middle tier of a J2EE web application. Spring provides a web application context concept, a powerful lightweight IoC container that seamlessly adapts to a web environment: It can be accessed from any kind of web tier, whether Struts, WebWork, Tapestry, JSF, Spring web MVC, or a custom solution.The following code shows a typical example of such a web application context. In a typical Spring web app, an applicationContext.xml file will reside in the WEB-INF directory, containing bean defini-tions according to the “spring-beans” DTD. In such a bean definition XML file, business objects and resources are defined, for example, a “myDataSource” bean, a “myInventoryManager” bean, and a “myProductManager” bean. Spring takes care of their configuration, their wiring up, and their lifecycle.<beans><bean id=”myDataSource” class=”org.springframework.jdbc. datasource.DriverManagerDataSource”><property name=”driverClassName”> <value>com.mysql.jdbc.Driver</value></property> <property name=”url”><value>jdbc:mysql:myds</value></property></bean><bean id=”myInventoryManager” class=”ebusiness.DefaultInventoryManager”> <property name=”dataSource”><ref bean=”myDataSource”/> </property></bean><bean id=”myProductManager” class=”ebusiness.DefaultProductManage r”><property name=”inventoryManager”><ref bean=”myInventoryManager”/> </property><property name=”retrieveCurrentStock”> <value>true</value></property></bean></beans>By default, all such beans have “singleton” scope: one instance per context. The “myInventoryManager” bean will automatically be wired up with the defined DataSource, while “myProductManager” will in turn receive a reference to the “myInventoryManager” bean. Those objects (traditionally called “beans” in Spring terminology) need to expos e only the corresponding bean properties or constructor arguments (as you’ll see later in this chapter); they do not have to perform any custom lookups.A root web application context will be loaded by a ContextLoaderListener that is defined in web.xml as follows:<web-app><listener> <listener-class>org.springframework.web.context.ContextLoaderListener</listener-class></listener>...</web-app>After initialization of the web app, the root web application context will be available as a ServletContext attribute to the whole web application, in the usual manner. It can be retrieved from there easily via fetching the corresponding attribute, or via a convenience method in org.springframework.web. context.support.WebApplicationContextUtils. This means that the application context will be available in any web resource with access to the ServletContext, like a Servlet, Filter, JSP, or Struts Action, as follows:WebApplicationContext wac = WebApplicationContextUtils.getWebApplicationContext(servletContext);The Spring web MVC framework allows web controllers to be defined as JavaBeans in child application contexts, one per dispatcher servlet. Such controllers can express dependencies on beans in the root application context via simple bean references. Therefore, typical Spring web MVC applications never need to perform a manual lookup of an application context or bean factory, or do any other form of lookup.Neither do other client objects that are managed by an application context themselves: They can receive collaborating objects as bean references.The Core Bean FactoryIn the previous section, we have seen a typical usage of the Spring IoC container in a web environment: The provided convenience classes allow for seamless integration without having to worry about low-level container details. Nevertheless, it does help to look at the inner workings to understand how Spring manages the container. Therefore, we will now look at the Spring bean container in more detail, starting at the lowest building block: the bean factory. Later, we’ll continue with resource setup and details on the application context concept.One of the main incentives for a lightweight container is to dispense with the multitude of custom facto-ries and singletons often found in J2EE applications. The Spring bean factory provides one consistent way to set up any number of application objects, whether coarse-grained components or fine-grained busi-ness objects. Applying reflection and Dependency Injection, the bean factory can host components that do not need to be aware of Spring at all. Hence we call Spring a non-invasive application framework.Fundamental InterfacesThe fundamental lightweight container interface is org.springframework.beans.factory.Bean Factory. This is a simple interface, which is easy to implement directly in the unlikely case that none of the implementations provided with Spring suffices. The BeanFactory interface offers two getBean() methods for looking up bean instances by String name, with the option to check for a required type (and throw an exception if there is a type mismatch).public interface BeanFactory {Object getBean(String name) throws BeansException;Object getBean(String name, Class requiredType) throws BeansException;boolean containsBean(String name);boolean isSingleton(String name) throws NoSuchBeanDefinitionException;String[] getAliases(String name) throws NoSuchBeanDefinitionException;}The isSingleton() method allows calling code to check whether the specified name represents a sin-gleton or prototype bean definition. In the case of a singleton bean, all calls to the getBean() method will return the same object instance. In the case of a prototype bean, each call to getBean() returns an inde-pendent object instance, configured identically.The getAliases() method will return alias names defined for the given bean name, if any. This mecha-nism is used to provide more descriptive alternative names for beans than are permitted in certain bean factory storage representations, such as XML id attributes.The methods in most BeanFactory implementations are aware of a hierarchy that the implementation may be part of. If a bean is not foundin the current factory, the parent factory will be asked, up until the root factory. From the point of view of a caller, all factories in such a hierarchy will appear to be merged into one. Bean definitions in ancestor contexts are visible to descendant contexts, but not the reverse.All exceptions thrown by the BeanFactory interface and sub-interfaces extend org.springframework. beans.BeansException, and are unchecked. This reflects the fact that low-level configuration prob-lems are not usually recoverable: Hence, application developers can choose to write code to recover from such failures if they wish to, but should not be forced to write code in the majority of cases where config-uration failure is fatal.Most implementations of the BeanFactory interface do not merely provide a registry of objects by name; they provide rich support for configuring those objects using IoC. For example, they manage dependen-cies between managed objects, as well as simple properties. In the next section, we’ll look at how such configuration can be expressed in a simple and intuitive XML structure.The sub-interface org.springframework.beans.factory.ListableBeanFactory supports listing beans in a factory. It provides methods to retrieve the number of beans defined, the names of all beans, and the names of beans that are instances of a given type:public interface ListableBeanFactory extends BeanFactory {int getBeanDefinitionCount();String[] getBeanDefinitionNames();String[] getBeanDefinitionNames(Class type);boolean containsBeanDefinition(String name);Map getBeansOfType(Class type, boolean includePrototypes,boolean includeFactoryBeans) throws BeansException}The ability to obtain such information about the objects managed by a ListableBeanFactory can be used to implement objects that work with a set of other objects known only at runtime.In contrast to the BeanFactory interface, the methods in ListableBeanFactory apply to the current factory instance and do not take account of a hierarchy that the factory may be part of. The org.spring framework.beans.factory.BeanFactoryUtils class provides analogous methods that traverse an entire factory hierarchy.There are various ways to leverage a Spring bean factory, ranging from simple bean configuration to J2EE resource integration and AOP proxy generation. The bean factory is the central, consistent way of setting up any kind of application objects in Spring, whether DAOs, business objects, or web controllers. Note that application objects seldom need to work with the BeanFactory interface directly, but are usu-ally configured and wired by a factory without the need for any Spring-specific code.For standalone usage, the Spring distribution provides a tiny spring-core.jar file that can be embed-ded in any kind of application. Its only third-party dependency beyond J2SE 1.3 (plus JAXP for XML parsing) is the Jakarta Commons Logging API.The bean factory is the core of Spring and the foundation for many other services that the framework offers. Nevertheless, the bean factory can easily be used stan-dalone if no other Spring services are required.Derivative:networkSpring 框架简介Spring框架:这是一个流行的开源应用框架,它可以解决很多问题。

毕业设计外文文献翻译

毕业设计外文文献翻译

毕业设计外文文献翻译Graduation Design Foreign Literature Translation (700 words) Title: The Impact of Artificial Intelligence on the Job Market Introduction:Artificial Intelligence (AI) is a rapidly growing field that has the potential to revolutionize various industries and job markets. With advancements in technologies such as machine learning and natural language processing, AI has become capable of performing tasks traditionally done by humans. This has raised concerns about the future of jobs and the impact AI will have on the job market. This literature review aims to explore the implications of AI on employment and job opportunities.AI in the Workplace:AI technologies are increasingly being integrated into the workplace, with the aim of automating routine and repetitive tasks. For example, automated chatbots are being used to handle customer service queries, while machine learning algorithms are being employed to analyze large data sets. This has resulted in increased efficiency and productivity in many industries. However, it has also led to concerns about job displacement and unemployment.Job Displacement:The rise of AI has raised concerns about job displacement, as AI technologies are becoming increasingly capable of performing tasks previously done by humans. For example, automated machines can now perform complex surgeries with greaterprecision than human surgeons. This has led to fears that certain jobs will become obsolete, leading to unemployment for those who were previously employed in these industries.New Job Opportunities:While AI might potentially replace certain jobs, it also creates new job opportunities. As AI technologies continue to evolve, there will be a greater demand for individuals with technical skills in AI development and programming. Additionally, jobs that require human interaction and emotional intelligence, such as social work or counseling, may become even more in demand, as they cannot be easily automated.Job Transformation:Another potential impact of AI on the job market is job transformation. AI technologies can augment human abilities rather than replacing them entirely. For example, AI-powered tools can assist professionals in making decisions, augmenting their expertise and productivity. This may result in changes in job roles and the need for individuals to adapt their skills to work alongside AI technologies.Conclusion:The impact of AI on the job market is still being studied and debated. While AI has the potential to automate certain tasks and potentially lead to job displacement, it also presents opportunities for new jobs and job transformation. It is essential for individuals and organizations to adapt and acquire the necessary skills to navigate these changes in order to stay competitive in the evolvingjob market. Further research is needed to fully understand the implications of AI on employment and job opportunities.。

毕业设计英文 翻译(原文)

毕业设计英文 翻译(原文)

编号:毕业设计(论文)外文翻译(原文)院(系):桂林电子科技大学专业:电子信息工程学生姓名: xx学号: xxxxxxxxxxxxx 指导教师单位:桂林电子科技大学姓名: xxxx职称: xx2014年x月xx日Timing on and off power supplyusesThe switching power supply products are widely used in industrial automation and control, military equipment, scientific equipment, LED lighting, industrial equipment,communications equipment,electrical equipment,instrumentation, medical equipment, semiconductor cooling and heating, air purifiers, electronic refrigerator, LCD monitor, LED lighting, communications equipment, audio-visual products, security, computer chassis, digital products and equipment and other fields.IntroductionWith the rapid development of power electronics technology, power electronics equipment and people's work, the relationship of life become increasingly close, and electronic equipment without reliable power, into the 1980s, computer power and the full realization of the switching power supply, the first to complete the computer Power new generation to enter the switching power supply in the 1990s have entered into a variety of electronic, electrical devices, program-controlled switchboards, communications, electronic testing equipment power control equipment, power supply, etc. have been widely used in switching power supply, but also to promote the rapid development of the switching power supply technology .Switching power supply is the use of modern power electronics technology to control the ratio of the switching transistor to turn on and off to maintain a stable output voltage power supply, switching power supply is generally controlled by pulse width modulation (PWM) ICs and switching devices (MOSFET, BJT) composition. Switching power supply and linear power compared to both the cost and growth with the increase of output power, but the two different growth rates. A power point, linear power supply costs, but higher than the switching power supply. With the development of power electronics technology and innovation, making the switching power supply technology to continue to innovate, the turning points of this cost is increasingly move to the low output power side, the switching power supply provides a broad space for development.The direction of its development is the high-frequency switching power supply, high frequency switching power supply miniaturization, and switching power supply into a wider range of application areas, especially in high-tech fields, and promote the miniaturization of high-tech products, light of. In addition, the development and application of the switching power supply in terms of energy conservation, resource conservation and environmental protection are of great significance.classificationModern switching power supply, there are two: one is the DC switching power supply; the other is the AC switching power supply. Introduces only DC switching power supply and its function is poor power quality of the original eco-power (coarse) - such as mains power or battery power, converted to meet the equipment requirements of high-quality DC voltage (Varitronix) . The core of the DC switching power supply DC / DC converter. DC switching power supply classification is dependent on the classification of DC / DC converter. In other words, the classification of the classification of the DC switching power supply and DC/DC converter is the classification of essentially the same, the DC / DC converter is basically a classification of the DC switching power supply.DC /DC converter between the input and output electrical isolation can be divided into two categories: one is isolated called isolated DC/DC converter; the other is not isolated as non-isolated DC / DC converter.Isolated DC / DC converter can also be classified by the number of active power devices. The single tube of DC / DC converter Forward (Forward), Feedback (Feedback) two. The double-barreled double-barreled DC/ DC converter Forward (Double Transistor Forward Converter), twin-tube feedback (Double Transistor Feedback Converter), Push-Pull (Push the Pull Converter) and half-bridge (Half-Bridge Converter) four. Four DC / DC converter is the full-bridge DC / DC converter (Full-Bridge Converter).Non-isolated DC / DC converter, according to the number of active power devices can be divided into single-tube, double pipe, and four three categories. Single tube to a total of six of the DC / DC converter, step-down (Buck) DC / DC converter, step-up (Boost) DC / DC converters, DC / DC converter, boost buck (Buck Boost) device of Cuk the DC / DC converter, the Zeta DC / DC converter and SEPIC, the DC / DC converter. DC / DC converters, the Buck and Boost type DC / DC converter is the basic buck-boost of Cuk, Zeta, SEPIC, type DC / DC converter is derived from a single tube in this six. The twin-tube cascaded double-barreled boost (buck-boost) DC / DC converter DC / DC converter. Four DC / DC converter is used, the full-bridge DC / DC converter (Full-Bridge Converter).Isolated DC / DC converter input and output electrical isolation is usually transformer to achieve the function of the transformer has a transformer, so conducive to the expansion of the converter output range of applications, but also easy to achieve different voltage output , or a variety of the same voltage output.Power switch voltage and current rating, the converter's output power is usually proportional to the number of switch. The more the number of switch, the greater the output power of the DC / DC converter, four type than the two output power is twice as large,single-tube output power of only four 1/4.A combination of non-isolated converters and isolated converters can be a single converter does not have their own characteristics. Energy transmission points, one-way transmission and two-way transmission of two DC / DC converter. DC / DC converter with bi-directional transmission function, either side of the transmission power from the power of lateral load power from the load-lateral side of the transmission power.DC / DC converter can be divided into self-excited and separately controlled. With the positive feedback signal converter to switch to self-sustaining periodic switching converter, called self-excited converter, such as the the Luo Yeer (Royer,) converter is a typical push-pull self-oscillating converter. Controlled DC / DC converter switching device control signal is generated by specialized external control circuit.the switching power supply.People in the field of switching power supply technology side of the development of power electronic devices, while the development of the switching inverter technology, the two promote each other to promote the switching power supply annual growth rate of more than two digits toward the light, small, thin, low-noise, high reliability, the direction of development of anti-jamming. Switching power supply can be divided into AC / DC and DC / DC two categories, AC / AC DC / AC, such as inverters, DC / DC converter is now modular design technology and production processes at home and abroad have already matured and standardization, and has been recognized by the user, but AC / DC modular, its own characteristics make the modular process, encounter more complex technology and manufacturing process. Hereinafter to illustrate the structure and characteristics of the two types of switching power supply.Self-excited: no external signal source can be self-oscillation, completely self-excited to see it as feedback oscillation circuit of a transformer.Separate excitation: entirely dependent on external sustain oscillations, excited used widely in practical applications. According to the excitation signal structure classification; can be divided into pulse-width-modulated and pulse amplitude modulated two pulse width modulated control the width of the signal is frequency, pulse amplitude modulation control signal amplitude between the same effect are the oscillation frequency to maintain within a certain range to achieve the effect of voltage stability. The winding of the transformer can generally be divided into three types, one group is involved in the oscillation of the primary winding, a group of sustained oscillations in the feedback winding, there is a group of load winding. Such as Shanghai is used in household appliances art technological production of switching power supply, 220V AC bridge rectifier, changing to about 300V DC filter added tothe collector of the switch into the transformer for high frequency oscillation, the feedback winding feedback to the base to maintain the circuit oscillating load winding induction signal, the DC voltage by the rectifier, filter, regulator to provide power to the load. Load winding to provide power at the same time, take up the ability to voltage stability, the principle is the voltage output circuit connected to a voltage sampling device to monitor the output voltage changes, and timely feedback to the oscillator circuit to adjust the oscillation frequency, so as to achieve stable voltage purposes, in order to avoid the interference of the circuit, the feedback voltage back to the oscillator circuit with optocoupler isolation.technology developmentsThe high-frequency switching power supply is the direction of its development, high-frequency switching power supply miniaturization, and switching power supply into the broader field of application, especially in high-tech fields, and promote the development and advancement of the switching power supply, an annual more than two-digit growth rate toward the light, small, thin, low noise, high reliability, the direction of the anti-jamming. Switching power supply can be divided into AC / DC and DC / DC two categories, the DC / DC converter is now modular design technology and production processes at home and abroad have already matured and standardized, and has been recognized by the user, but modular AC / DC, because of its own characteristics makes the modular process, encounter more complex technology and manufacturing process. In addition, the development and application of the switching power supply in terms of energy conservation, resource conservation and environmental protection are of great significance.The switching power supply applications in power electronic devices as diodes, IGBT and MOSFET.SCR switching power supply input rectifier circuit and soft start circuit, a small amount of applications, the GTR drive difficult, low switching frequency, gradually replace the IGBT and MOSFET.Direction of development of the switching power supply is a high-frequency, high reliability, low power, low noise, jamming and modular. Small, thin, and the key technology is the high frequency switching power supply light, so foreign major switching power supply manufacturers have committed to synchronize the development of new intelligent components, in particular, is to improve the secondary rectifier loss, and the power of iron Oxygen materials to increase scientific and technological innovation in order to improve the magnetic properties of high frequency and large magnetic flux density (Bs), and capacitor miniaturization is a key technology. SMT technology allows the switching power supply has made considerable progress, the arrangement of the components in the circuit board on bothsides, to ensure that the light of the switching power supply, a small, thin. High-frequency switching power supply is bound to the traditional PWM switching technology innovation, realization of ZVS, ZCS soft-switching technology has become the mainstream technology of the switching power supply, and a substantial increase in the efficiency of the switching power supply. Indicators for high reliability, switching power supply manufacturers in the United States by reducing the operating current, reducing the junction temperature and other measures to reduce the stress of the device, greatly improve the reliability of products.Modularity is the overall trend of switching power supply, distributed power systems can be composed of modular power supply, can be designed to N +1 redundant power system, and the parallel capacity expansion. For this shortcoming of the switching power supply running noise, separate the pursuit of high frequency noise will also increase, while the use of part of the resonant converter circuit technology to achieve high frequency, in theory, but also reduce noise, but some The practical application of the resonant converter technology, there are still technical problems, it is still a lot of work in this field, so that the technology to be practical.Power electronics technology innovation, switching power supply industry has broad prospects for development. To accelerate the pace of development of the switching power supply industry in China, it must take the road of technological innovation, out of joint production and research development path with Chinese characteristics and contribute to the rapid development of China's national economy.Developments and trends of the switching power supply1955 U.S. Royer (Roger) invented the self-oscillating push-pull transistor single-transformer DC-DC converter is the beginning of the high-frequency conversion control circuit 1957 check race Jen, Sen, invented a self-oscillating push-pull dual transformers, 1964, U.S. scientists canceled frequency transformer in series the idea of switching power supply, the power supply to the size and weight of the decline in a fundamental way. 1969 increased due to the pressure of the high-power silicon transistor, diode reverse recovery time shortened and other components to improve, and finally made a 25-kHz switching power supply.At present, the switching power supply to the small, lightweight and high efficiency characteristics are widely used in a variety of computer-oriented terminal equipment, communications equipment, etc. Almost all electronic equipment is indispensable for a rapid development of today's electronic information industry power mode. Bipolar transistor made of 100kHz, 500kHz power MOS-FET made, though already the practical switching power supply is currently available on the market, but its frequency to be further improved. Toimprove the switching frequency, it is necessary to reduce the switching losses, and to reduce the switching losses, the need for high-speed switch components. However, the switching speed will be affected by the distribution of the charge stored in the inductance and capacitance, or diode circuit to produce a surge or noise. This will not only affect the surrounding electronic equipment, but also greatly reduce the reliability of the power supply itself. Which, in order to prevent the switching Kai - closed the voltage surge, RC or LC buffers can be used, and the current surge can be caused by the diode stored charge of amorphous and other core made of magnetic buffer . However, the high frequency more than 1MHz, the resonant circuit to make the switch on the voltage or current through the switch was a sine wave, which can reduce switching losses, but also to control the occurrence of surges. This switch is called the resonant switch. Of this switching power supply is active, you can, in theory, because in this way do not need to greatly improve the switching speed of the switching losses reduced to zero, and the noise is expected to become one of the high-frequency switching power supply The main ways. At present, many countries in the world are committed to several trillion Hz converter utility.the principle of IntroductionThe switching power supply of the process is quite easy to understand, linear power supplies, power transistors operating in the linear mode and linear power, the PWM switching power supply to the power transistor turns on and off state, in both states, on the power transistor V - security product is very small (conduction, low voltage, large current; shutdown, voltage, current) V oltammetric product / power device is power semiconductor devices on the loss.Compared with the linear power supply, the PWM switching power supply more efficient process is achieved by "chopping", that is cut into the amplitude of the input DC voltage equal to the input voltage amplitude of the pulse voltage. The pulse duty cycle is adjusted by the switching power supply controller. Once the input voltage is cut into the AC square wave, its amplitude through the transformer to raise or lower. Number of groups of output voltage can be increased by increasing the number of primary and secondary windings of the transformer. After the last AC waveform after the rectifier filter the DC output voltage.The main purpose of the controller is to maintain the stability of the output voltage, the course of their work is very similar to the linear form of the controller. That is the function blocks of the controller, the voltage reference and error amplifier can be designed the same as the linear regulator. Their difference lies in the error amplifier output (error voltage) in the drive before the power tube to go through a voltage / pulse-width conversion unit.Switching power supply There are two main ways of working: Forward transformand boost transformation. Although they are all part of the layout difference is small, but the course of their work vary greatly, have advantages in specific applications.the circuit schematicThe so-called switching power supply, as the name implies, is a door, a door power through a closed power to stop by, then what is the door, the switching power supply using SCR, some switch, these two component performance is similar, are relying on the base switch control pole (SCR), coupled with the pulse signal to complete the on and off, the pulse signal is half attentive to control the pole voltage increases, the switch or transistor conduction, the filter output voltage of 300V, 220V rectifier conduction, transmitted through the switching transformer secondary through the transformer to the voltage increase or decrease for each circuit work. Oscillation pulse of negative semi-attentive to the power regulator, base, or SCR control voltage lower than the original set voltage power regulator cut-off, 300V power is off, switch the transformer secondary no voltage, then each circuit The required operating voltage, depends on this secondary road rectifier filter capacitor discharge to maintain. Repeat the process until the next pulse cycle is a half weeks when the signal arrival. This switch transformer is called the high-frequency transformer, because the operating frequency is higher than the 50HZ low frequency. Then promote the pulse of the switch or SCR, which requires the oscillator circuit, we know, the transistor has a characteristic, is the base-emitter voltage is 0.65-0.7V is the zoom state, 0.7V These are the saturated hydraulic conductivity state-0.1V-0.3V in the oscillatory state, then the operating point after a good tune, to rely on the deep negative feedback to generate a negative pressure, so that the oscillating tube onset, the frequency of the oscillating tube capacitor charging and discharging of the length of time from the base to determine the oscillation frequency of the output pulse amplitude, and vice versa on the small, which determines the size of the output voltage of the power regulator. Transformer secondary output voltage regulator, usually switching transformer, single around a set of coils, the voltage at its upper end, as the reference voltage after the rectifier filter, then through the optocoupler, this benchmark voltage return to the base of the oscillating tube pole to adjust the level of the oscillation frequency, if the transformer secondary voltage is increased, the sampling coil output voltage increases, the positive feedback voltage obtained through the optocoupler is also increased, this voltage is applied oscillating tube base, so that oscillation frequency is reduced, played a stable secondary output voltage stability, too small do not have to go into detail, nor it is necessary to understand the fine, such a high-power voltage transformer by switching transmission, separated and after the class returned by sampling the voltage from the opto-coupler pass separated after class, so before the mains voltage, and after the classseparation, which is called cold plate, it is safe, transformers before power is independent, which is called switching power supply.the DC / DC conversionDC / DC converter is a fixed DC voltage transformation into a variable DC voltage, also known as the DC chopper. There are two ways of working chopper, one Ts constant pulse width modulation mode, change the ton (General), the second is the frequency modulation, the same ton to change the Ts, (easy to produce interference). Circuit by the following categories:Buck circuit - the step-down chopper, the average output voltage U0 is less than the input voltage Ui, the same polarity.Boost Circuit - step-up chopper, the average output voltage switching power supply schematic U0 is greater than the input voltage Ui, the same polarity.Buck-Boost circuit - buck or boost chopper, the output average voltage U0 is greater than or less than the input voltage Ui, the opposite polarity, the inductance transmission.Cuk circuit - a buck or boost chopper, the output average voltage U0 is greater than or less than the input voltage Ui, the opposite polarity, capacitance transmission.The above-mentioned non-isolated circuit, the isolation circuit forward circuits, feedback circuit, the half-bridge circuit, the full bridge circuit, push-pull circuit. Today's soft-switching technology makes a qualitative leap in the DC / DC the U.S. VICOR company design and manufacture a variety of ECI soft-switching DC / DC converter, the maximum output power 300W, 600W, 800W, etc., the corresponding power density (6.2 , 10,17) W/cm3 efficiency (80-90)%. A the Japanese Nemic Lambda latest using soft-switching technology, high frequency switching power supply module RM Series, its switching frequency (200 to 300) kHz, power density has reached 27W/cm3 with synchronous rectifier (MOSFETs instead of Schottky diodes ), so that the whole circuit efficiency by up to 90%.AC / DC conversionAC / DC conversion will transform AC to DC, the power flow can be bi-directional power flow by the power flow to load known as the "rectification", referred to as "active inverter power flow returned by the load power. AC / DC converter input 50/60Hz AC due must be rectified, filtered, so the volume is relatively large filter capacitor is essential, while experiencing safety standards (such as UL, CCEE, etc.) and EMC Directive restrictions (such as IEC, FCC, CSA) in the AC input side must be added to the EMC filter and use meets the safety standards of the components, thus limiting the miniaturization of the volume of AC / DC power, In addition, due to internal frequency, high voltage, current switching, making the problem difficult to solve EMC also high demands on the internal high-density mountingcircuit design, for the same reason, the high voltage, high current switch makes power supply loss increases, limiting the AC / DC converter modular process, and therefore must be used to power system optimal design method to make it work efficiency to reach a certain level of satisfaction.AC / DC conversion circuit wiring can be divided into half-wave circuit, full-wave circuit. Press the power phase can be divided into single-phase three-phase, multiphase. Can be divided into a quadrant, two quadrant, three quadrants, four-quadrant circuit work quadrant.he selection of the switching power supplySwitching power supply input on the anti-jamming performance, compared to its circuit structure characteristics (multi-level series), the input disturbances, such as surge voltage is difficult to pass on the stability of the output voltage of the technical indicators and linear power have greater advantages, the output voltage stability up to (0.5)%. Switching power supply module as an integrated power electronic devices should be selected。

毕业设计外文翻译

毕业设计外文翻译

毕业设计外文翻译Graduation Design – English TranslationIntroductionThe graduation design is a crucial part of a student’s academic journey. It is a project that showcases the knowledge and skills that the student has acquired throughout their studies. The purpose of this translation is to provide an overview of the graduation design and explain its significance.Significance of the Graduation DesignThe graduation design serves as an opportunity for students to apply the theoretical knowledge they have gained in a practical manner. It allows them to put their skills into action and demonstrate their problem-solving abilities. Through the completion of the graduation design, students are equipped with the necessary tools to enter the workforce with confidence.Components of the Graduation DesignThe graduation design typically consists of several key components. Firstly, there is a written report that provides an in-depth analysis of the project. This report outlines the objectives, methodology, results, and conclusions of the graduation design. It also includes a literature review that discusses the existing research related to the topic.In addition to the written report, a presentation is also required aspart of the graduation design. This presentation allows students to communicate their findings to a larger audience. It is an opportunity for students to showcase their ability to effectively present complex information in a clear and concise manner.Furthermore, the graduation design often involves a practical component. This can range from designing and building a prototype to conducting experiments or surveys. The practical component allows students to apply their engineering skills and test their theories in a real-world setting.Evaluation of the Graduation DesignThe graduation design is evaluated based on several criteria. The written report is assessed for its clarity, organization, and depth of analysis. The presentation is evaluated for the student’s ability to effectively communicate their ideas and engage the audience. The practical component is assessed based on the quality and accuracy of the work completed.ConclusionIn conclusion, the graduation design is a significant project that allows students to apply their knowledge and skills in a practical manner. It consists of a written report, a presentation, and a practical component. The completion of the graduation design prepares students for their future careers by equipping them with the necessary tools and abilities.。

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编号:毕业设计(论文)外文翻译(原文)院(系):应用科技学院专业:机械设计制造及其自动化学生姓名:邓瑜学号:0501120501指导教师单位:应用科技学院姓名:黄小能职称:2009年 5 月20 日The Injection MoldingThe Introduction of MoldsThe mold is at the core of a plastic manufacturing process because its cavity gives a part its shape. This makes the mold at least as critical-and many cases more so-for the quality of the end product as, for example, the plasticiting unit or other components of the processing equipment.Mold MaterialDepending on the processing parameters for the various processing methods as well as the length of the production run, the number of finished products to be produced, molds for plastics processing must satisfy a great variety of requirements. It is therefore not surprising that molds can be made from a very broad spectrum of materials, including-from a technical standpoint-such exotic materials as paper matched and plaster. However, because most processes require high pressures, often combined with high temperatures, metals still represent by far the most important material group, with steel being the predominant metal. It is interesting in this regard that, in many cases, the selection of the mold material is not only a question of material properties and an optimum price-to-performance ratio but also that the methods used to produce the mold, and thus the entire design, can be influenced.A typical example can be seen in the choice between cast metal molds, with their very different cooling systems, compared to machined molds. In addition, the production technique can also have an effect; for instance, it is often reported that, for the sake of simplicity, a prototype mold is frequently machined from solid stock with the aid of the latest technology such as computer-aided (CAD) and computer-integrated manufacturing (CIM). In contrast to the previously used methods based on the use of patterns, the use of CAD and CAM often represents the more economical solution today, not only because this production capability is available pin-house but also because with any other technique an order would have to be placed with an outside supplier.Overall, although high-grade materials are often used, as a rule standard materials are used in mold making. New, state-of-the art (high-performance) materials, such as ceramics, for instance, are almost completely absent. This may be related to the fact that their desirable characteristics, such as constant properties up to very high temperatures, are not required on molds, whereas their negative characteristics, e. g. low tensile strength and poor thermal conductivity, have a clearly related to ceramics, such as sintered material, is found in mild making only to a limited degree. This refers less to the modern materials and componentsproduced by powder metallurgy, and possibly by hot isocratic pressing, than to sintered metals in the sense of porous, air-permeable materials.Removal of air from the cavity of a mold is necessary with many different processing methods, and it has been proposed many times that this can be accomplished using porous metallic materials. The advantages over specially fabricated venting devices, particularly in areas where melt flow fronts meet, I, e, at weld lines, are as obvious as the potential problem areas: on one hand, preventing the texture of such surfaces from becoming visible on the finished product, and on the other hand, preventing the microspores from quickly becoming clogged with residues (broken off flash, deposits from the molding material, so-called plate out, etc.). It is also interesting in this case that completely new possibilities with regard to mold design and processing technique result from the use of such materials.A. Design rulesThere are many rules for designing molds. These rules and standard practices are based on logic, past experience, convenience, and economy. For designing, mold making, and molding, it is usually of advantage to follow the rules. But occasionally, it may work out better if a rule is ignored and an alternative way is selected. In this text, the most common rules are noted, but the designer will learn only from experience which way to go. The designer must ever be open to new ideas and methods, to new molding and mold materials that may affect these rules.B. The basic mold1. Mold cavity spaceThe mold cavity space is a shape inside the mold, “excavated” in such a manner that when the molding material is forced into this space it will take on the shape of the cavity space and, therefore, the desired product. The principle of a mold is almost as old as human civilization. Molds have metals into sand forms. Such molds, which are still used today in foundries, can be used only once because the mold is destroyed to release the product after it has solidified. Today, we are looking for permanent molds that can be used over and over. Now molds are made from strong, durable materials, such as steel, or from softer aluminum or metal alloys and even from certain plastics where a long mold life is not required because the planned production is small. In injection molding the plastic is injected into the cavity space with high pressure, so the mold must be strong enough to resist the injection pressure without deforming.2. Number of cavitiesMany molds, particularly molds for larger products, are built for only cavity space, but many molds, especially large production molds, are built with 2 or more cavities. The reasonfor this is purely economical. It takes only little more time to inject several cavities than to inject one. For example, a 4-cavity mold requires only one-fourth of the machine time of a single-cavity mold. Conversely, the production increases in proportion to the number of cavities. A mold with more cavities is more expensive to build than a single-cavity mold, but not necessarily 4 times as much as a single-cavity mold. But it may also require a larger machine with larger platen area and more clamping capacity, and because it will use 4 times the amount of plastic, it may need a large injection unit, so the machine hour cost will be higher than for a machine large enough for the smaller mold.3. Cavity shape and shrinkageTh e shape of the cavity is essentially the “negative” of the shape of the desired product, with dimensional allowance added to allow for shrinking of the plastic. The shape of the cavity is usually created with chip-removing machine tools, or with electric discharge machining, with chemical etching, or by any new method that may be available to remove metal or build it up, such as galvanic processes. It may also be created by casting certain metals in plaster molds created from models of the product to be made, or by casting some suitable hard plastics. The cavity shape can be either cut directly into the mold plates or formed by putting inserts into the plates.C. Cavity and coreBy convention, the hollow portion of the cavity space is called the cavity. The matching, often raised portion of the cavity space is called the core. Most plastic products are cup-shaped. This does not mean that they look like a cup, but they do have an inside and an outside. The outside of the product is formed by the cavity, the inside by the core. The alternative to the cup shape is the flat shape. In this case, there is no specific convex portion, and sometimes, the core looks like a mirror image of the cavity. Typical examples for this are plastic knives, game chips, or round disks such as records. While these items are simple in appearance, they often present serious molding problems for ejection of the product. The reason for this is that all injection molding machines provide an ejection mechanism on the moving platen and the products tend to shrink onto and cling to the core, from where they are then ejected. Most injection molding machines do not provide ejection mechanisms on the injection side.Polymer ProcessingPolymer processing, in its most general context, involves the transformation of a solid (sometimes liquid) polymeric resin, which is in a random form (e.g., powder, pellets, beads), to a solid plastics product of specified shape, dimensions, and properties. This is achieved by means of a transformation process: extrusion, molding, calendaring, coating, thermoforming,etc. The process, in order to achieve the above objective, usually involves the following operations: solid transport, compression, heating, melting, mixing, shaping, cooling, solidification, and finishing. Obviously, these operations do not necessarily occur in sequence, and many of them take place simultaneously.Shaping is required in order to impart to the material the desired geometry and dimensions. It involves combinations of viscoelastic deformations and heat transfer, which are generally associated with solidification of the product from the melt.Shaping includes: two-dimensional operations, e.g. die forming, calendaring and coating; three-dimensional molding and forming operations. Two-dimensional processes are either of the continuous, steady state type (e.g. film and sheet extrusion, wire coating, paper and sheet coating, calendaring, fiber spinning, pipe and profile extrusion, etc.) or intermittent as in the case of extrusions associated with intermittent extrusion blow molding. Generally, molding operations are intermittent, and, thus, they tend to involve unsteady state conditions. Thermoforming, vacuum forming, and similar processes may be considered as secondary shaping operations, since they usually involve the reshaping of an already shaped form. In some cases, like blow molding, the process involves primary shaping (pair-son formation) and secondary shaping (pair son inflation).Shaping operations involve simultaneous or staggered fluid flow and heat transfer. In two-dimensional processes, solidification usually follows the shaping process, whereas solidification and shaping tend to take place simultaneously inside the mold in three dimensional processes. Flow regimes, depending on the nature of the material, the equipment, and the processing conditions, usually involve combinations of shear, extensional, and squeezing flows in conjunction with enclosed (contained) or free surface flows.The thermo-mechanical history experienced by the polymer during flow and solidification results in the development of microstructure (morphology, crystallinity, and orientation distributions) in the manufactured article. The ultimate properties of the article are closely related to the microstructure. Therefore, the control of the process and product quality must be based on an understanding of the interactions between resin properties, equipment design, operating conditions, thermo-mechanical history, microstructure, and ultimate product properties. Mathematical modeling and computer simulation have been employed to obtain an understanding of these interactions. Such an approach has gained more importance in view of the expanding utilization of computer design/computer assisted manufacturing/computer aided engineering (CAD/CAM/CAE) systems in conjunction with plastics processing.It will emphasize recent developments relating to the analysis and simulation of some important commercial process, with due consideration to elucidation of both thermo-mechanical history and microstructure development.As mentioned above, shaping operations involve combinations of fluid flow and heat transfer, with phase change, of a visco-elastic polymer melt. Both steady and unsteady state processes are encountered. A scientific analysis of operations of this type requires solving the relevant equations of continuity, motion, and energy (I. e. conservation equations).Injection MoldingMany different processes are used to transform plastic granules, powders, and liquids into final product. The plastic material is in moldable form, and is adaptable to various forming methods. In most cases thermoplastic materials are suitable for certain processes while thermosetting materials require other methods of forming. This is recognized by the fact that thermoplastics are usually heated to a soft state and then reshaped before cooling. Theromosets, on the other hand have not yet been polymerized before processing, and the chemical reaction takes place during the process, usually through heat, a catalyst, or pressure. It is important to remember this concept while studying the plastics manufacturing processes and the polymers used.Injection molding is by far the most widely used process of forming thermoplastic materials. It is also one of the oldest. Currently injection molding accounts for 30% of all plastics resin consumption. Since raw material can be converted by a single procedure, injection molding is suitable for mass production of plastics articles and automated one-step production of complex geometries. In most cases, finishing is not necessary. Typical products include toys, automotive parts, household articles, and consumer electronics goods,Since injection molding has a number of interdependent variables, it is a process of considerable complexity. The success of the injection molding operation is dependent not only in the proper setup of the machine variables, but also on eliminating shot-to-shot variations that are caused by the machine hydraulics, barrel temperature variations, and changes in material viscosity. Increasing shot-to-shot repeatability of machine variables helps produce parts with tighter tolerance, lowers the level of rejects, and increases product quality ( i.e., appearance and serviceability).The principal objective of any molding operation is the manufacture of products: to a specific quality level, in the shortest time, and using a repeatable and fully automatic cycle. Molders strive to reduce or eliminate rejected parts, or parts with a high added value such as appliance cases, the payoff of reduced rejects is high.A typical injection molding cycle or sequence consists of five phases:1 Injection or mold filling2 Packing or compression3 Holding4 Cooling5 Part ejectionInjection Molding OverviewProcessInjection molding is a cyclic process of forming plastic into a desired shape by forcingthe material under pressure into a cavity. The shaping is achieved by cooling (thermoplastics) or by a chemical reaction (thermosets). It is one of the most commonand versatile operations for mass production of complex plastics parts with excellent dimensional tolerance. It requires minimal or no finishing or assembly operations. In addition to thermoplastics and thermosets, the process is being extended to suchmaterials as fibers, ceramics, and powdered metals, with polymers as binders.ApplicationsApproximately 32 percent by weight of all plastics processed go through injection molding machines. Historically, the major milestones of injection molding include the invention of the reciprocating screw machine and various new alternative processes, and the application of computersimulation to the design and manufacture of plastics parts.Development of the injection molding machineSince its introduction in the early 1870s, the injection molding machine has undergone significantmodifications and improvements. In particular, the invention of the reciprocating screw machine hasrevolutionized the versatility and productivity of the thermoplastic injection molding process.Benefits of the reciprocating screwApart from obvious improvements in machine control and machine functions, the major development for the injection molding machine is the change from a plunger mechanism to a reciprocating screw. Although the plunger-type machine is inherently simple, its popularity waslimited due to the slow heating rate through pure conduction only. The reciprocating screw canplasticize the material more quickly and uniformly with its rotating motion, as shown in Figure 1. Inaddition, it is able to inject the molten polymer in a forward direction, as a plunger.Development of the injection molding processThe injection molding process was first used only with thermoplastic polymers. Advances in theunderstanding of materials, improvements in molding equipment, and the needs of specific industrysegments have expanded the use of the process to areas beyond its original scope. Alternative injection molding processesDuring the past two decades, numerous attempts have been made to develop injection moldingprocesses to produce parts with special design features and properties. Alternative processes derivedfrom conventional injection molding have created a new era for additional applications, more designfreedom, and special structural features. These efforts have resulted in a number of processes,including:Co-injection (sandwich) moldingFusible core injection molding)Gas-assisted injection moldingInjection-compression moldingLamellar (microlayer) injection moldinLive-feed injection moldingLow-pressure injection moldingPush-pull injection moldingReactive moldingStructural foam injection moldingThin-wall moldingComputer simulation of injection molding processesBecause of these extensions and their promising future, computer simulation of the process has alsoexpanded beyond the early "lay-flat," empirical cavity-filling estimates. Now, complex programs simulate post-filling behavior, reaction kinetics, and the use of two materials with different properties, or two distinct phases, during the process.The Simulation section provides information on using C-MOLD products.Among the Design topicsare several examples that illustrate how you can use CAE tools to improve your part and molddesign and optimize processing conditions.Co-injection (sandwich) moldingOverviewCo-injection molding involves sequential or concurrent injection of two different but compatible polymer melts into a cavity. The materials laminate and solidify. This process produces parts that have a laminated structure, with the core material embedded betweenthe layers of the skin material. This innovative process offers the inherent flexibility ofusing the optimal properties of each material or modifying the properties of the molded part.FIGURE 1. Four stages of co-injection molding. (a) Short shot of skin polymer melt (shown in dark green)is injected into the mold. (b) Injection of core polymer melt until cavity is nearly filled, as shown in (c). (d)Skin polymer is injected again, to purge the core polymer away from the sprue.Fusible core injection moldingOverviewThe fusible (lost, soluble) core injection molding process illustrated below producessingle-piece, hollow parts with complex internal geometry. This process molds a coreinside the plastic part. After the molding, the core will be physically melted or chemically dissolved, leaving its outer geometry as the internal shape of the plastic part.FIGURE 1. Fusible (lost, soluble) core injection moldingGas-assisted injection moldingGas-assisted processThe gas-assisted injection molding process begins with a partial or full injection ofpolymer melt into the mold cavity. Compressed gas is then injected into the core of the polymer melt to help fill and pack the mold. This process is illustrated below.FIGURE 1. Gas-assisted injection molding: (a) the electrical system, (b) the hydraulic system, (c) the control panel, and (d) the gas cylinder.Injection-compression moldingOverviewThe injection-compression molding process is an extension of conventional injection molding. After a pre-set amount of polymer melt is fed into an open cavity, it is compressed, as shown below. The compression can also take place when the polymer isto be injected. The primary advantage of this process is the ability to produce dimensionally stable, relatively stress-free parts, at a low clamp tonnage (typically 20 to 50 percent lower).Lamellar (microlayer) injection moldingOverviewThis process uses a feedblock and layer multipliers to combine melt streams from dual injection cylinders. It produces parts from multiple resins in distinct microlayers, as shown in Figure 1 below. Combining different resins in a layered structure enhances a number of properties, such as the gas barrier property, dimensional stability, heat resistance, and optical clarity.Live-feed injection moldingOverviewThe live-feed injection molding process applies oscillating pressure at multiple polymer entrances to cause the melt to oscillate, as shown in the illustration below. The action of the pistons keeps the material in the gates molten while different layers of molecular or fiber orientation are being built up in the mold due to solidification. This process provides a means of making simple or complex parts that are free from voids, cracks, sink marks, and weld-line defects.Low-pressure injection moldingOverviewLow-pressure injection molding is essentially an optimized extension of conventional injection molding (see Figure 1). Low pressure can be achieved by properly programming the screw revolutions per minute, hydraulic back pressure, and screw speed to controlthe melt temperature and the injection speed. It also makes use of a generous gate size ora n reduce umber of valve gates that open and close sequentially to reduce the flow length. Thepacking stage is eliminated with a generally slow and controlled injection speed. The benefits of low-pressure injection molding include a reduction of the clamp force tonnage requirement, less costly molds and presses, and lower stress in the molded parts.Push-pull injection moldingOverviewThe push-pull injection molding process uses a conventional twin-component injection system and a two-gate mold to force material to flow back and forth between a master injection unit and a secondary injection unit, as shown below. This process eliminatesweld lines, voids, and cracks, and controls the fiber orientation.Reactive moldingProcessingMajor reactive molding processes include reactive injection molding (RIM), and composites processing, such as resin transfer molding (RTM) and structural reactive injection molding (SRIM).The typically low viscosity of the reactive materials permits large and complex parts to be moldedwith relatively lower pressure and clamp tonnage than required for thermoplastics molding. relatively For example, to make high-strength and low-volume large parts, RTM and SRIM can be used to include a preform made of long fibers. Another area that is receiving more attention than ever before is the encapsulation of microelectronic IC chips.The adaptation of injection molding to these materials includes only a small increase in temperature in the feed mechanism (barrel) to avoid pre-curing. The cavity, however, is usually hot enough to initiate chemical cross-linking. As the warm pre-polymer is forced into the cavity, heat is added from the cavity wall, from viscous (frictional) heating of the flow, and from the heat released by the reacting components. The temperature of the part often exceeds the temperature of the mold. When the reaction is sufficiently advanced for the part to be rigid (even at a high temperature) the cycle is complete and the part is ejected.Design considerationsThe mold and process design for injection molding of reactive materials is much more complexbecause of the chemical reaction that takes place during the filling and post-filling stages. For instance, slow filling often causes premature gelling and a resultant short shot, while fast fillingcould induce turbulent flow that creates internal porosity. Improper control of mold-wall temperature and/or inadequate part thickness will either give rise to moldability problems duringinjection, or cause scorching of the materials. Computer simulation is generally recognized as amore cost-effective tool than the conventional, time-consuming trial-and-error method for tool andprocess debugging.Structural foam injection moldingOverviewStructural foam molding produces parts consisting of solid external skin surfaces surrounding an inner cellular (or foam) core, as illustrated in Figure 1 below. This processis suitable for large, thick parts that are subject to bending loads in their end-use application. Structural foam parts can be produced with both low and high pressure, withnitrogen gas or chemical blowing agents.Thin-wall moldingOverviewThe term "thin-wall" is relative. Conventional plastic parts are typically 2 to 4 mm thick. Thin-wall designs are called "advanced" when thicknesses range from 1.2 to 2 mm, and "leading-edge" when the dimension is below 1.2 mm. Another definition of thin-wall molding is based on the flow-length-to-wall-thickness ratios. Typical ratios for thesethin-wall applications range from 100:1 to 150:1 or more.Typical applicationsThin-wall molding is more popular in portable communication and computing equipment, whichdemand plastic shells that are much thinner yet still provide the same mechanical strength as conventional parts.ProcessingBecause thin-wall parts freeze off quickly, they require high melt temperatures, high injectio speeds, and very high injection pressures if multiple gates or sequential valve gating are not an optimized ram-speed profile helps to reduce the pressure requirement.Due to the high velocity and shear rate in thin-wall molding, orientation occurs more readily help minimize anisotropic shrinkage in thin-wall parts, it is important to pack the part adequately while the core is still molten.Injection molding machineComponentsFor thermoplastics, the injection molding machine converts granular or pelleted rawplastic into final molded parts via a melt, inject, pack, and cool cycle. A typical injection molding machine consists of the following major components, as illustrated in Figure 1 below.Machine functionInjection molding machines can be generally classified into three categories, based on machinefunction:General-purpose machinesPrecision, tight-tolerance machinesHigh-speed, thin-wall machinesAuxiliary equipmentThe major equipment auxiliary to an injection molding machine includes resin dryers, materials-handling equipment, granulators, mold-temperature controllers and chillers, part-removal robots, and part-handling equipment.Automated surface finishing of plastic injection mold steel with sphericalgrinding and ball burnishing processesAbstract This study investigates the possibilities of automated spherical grinding and ball burnishing surface finishing processes in a freefor m surface plastic injection mold steel PDS5 on a CNC machining center. The design and manufacture of a grinding tool holder has been accomplished in this study.The optimal surface grinding parameters were determined usingTaguchi’s orthogonal array method f or plastic injection moldingsteel PDS5 on a machining center. The optimal surface grinding parameters for the plastic injection mold steel PDS5 werethe combination of an abrasive material of PA Al2O3, a grinding speed of 18 000 rpm, a grinding depth of 20 µm, and a feed of 50 mm/min. The surface roughness R a of the specimen can be improved from about 1.60 µm to 0.35 µm by using the optimal parameters for surface grinding. Surface roughness R a can befurther improved from about 0.343 µm to 0.06 µm by using the ball burnishing process with the optimal burnishing parameters.Applying the optimal surface grinding and burnishing parame-ters sequentially to a fine-milled freeform surface mold insert,the surface roughness R a of freeform surface region on the tested part can be improved from about 2.15 µm to 0.07 µm.。

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