电路板中英文专业术语词汇(A-M)

电路板专业词汇（A－M）

Abietic Acid松脂酸.

Abrasion Resistance耐磨性.

Abrasives磨料,刷材.

ABS树脂.

Absorption吸收(入).

Ac Impedance交流阻抗.

Accelerated Test(Aging)加速老化(试验).

Acceleration速化反应.

Accelerator 加速剂,速化剂.

Acceptability,Acceptance 允收性,允收.

Access Hole露出孔,穿露孔.

Accuracy准确度.

Acid Number (Acid Value)酸值.

Acoustic Microscope (AM)感音成像显微镜.

Acrylic压克力(聚丙烯酸树脂).

Actinic Light (or Intensity, or Radiation)有效光.

Activation活化.

Activator活化剂.

Active Carbon活性炭.

Active Parts(Devices)主动零件.

Acutance解像锐利度.

Addition Agent添加剂.

Additive Process加成法.

Adhesion附着力.

Adhesion Promotor附着力促进剂.

Adhesive胶类或接着剂.

Admittance导纳(阻抗的倒数).

Aerosol喷雾剂,气熔胶,气悬体.

Aging老化.

Air Inclusion气泡夹杂.

Air Knife风刀.

Algorithm算法.

Aliphatic Solvent脂肪族溶剂.

Aluminium Nitride(AlN)氮化铝.

Ambient Tamp环境温度.

Amorphous无定形,非晶形.

Amp-Hour安培小时.

Analog Circuit/Analog Signal模拟电路/模拟讯号.

Anchoring Spurs着力爪.

Angle of Contack接触角.

Angle of Attack攻角.

Anion阴离子.

Anisotropic异向性,单向的.

Anneal 韧化(退火).

Annular Ring孔环.

Anode阳极.

Anode Sludge阳极泥.

Anodizing阳极化.

ANSI美国标准协会.

Anti-Foaming Agent消泡剂.

Anti-pit Agent抗凹剂.

AOI自动光学检验.

Apertures开口,钢版开口.

AQL品质允收水准.

AQL(Acceptable Quality Level)允收品质水准.

Aramid Fiber聚醯胺纤维.

Arc Resistance耐电弧性.

Array排列.

Artwork底片.

ASIC特定用途绩体电路器.

Aspect Ratio纵横比.

Assembly组装装配.

A-stage A阶段.

ATE自动电测设备.

Attenuation讯号衰减.

Autoclave压力锅.

Axial-lead轴心引脚.

Azeotrope共沸混合液.

*****B*****

Back Light (Back Lighting)背光法.

Back Taper反锥斜角.

Backpanels, Backplanes支撑板.

Back-up 垫板.

Balanced Transmission Lines平衡式传输线.

Ball Grid Array球脚数组(封装).

Bandability弯曲性.

Banking Agent护岸剂.

Bare Chip Assembly裸体芯片组装.

Barrel孔壁,滚镀.

Base Material基材.

Basic Grid基本方格.

Batch批.

Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr) 凡液体比重比水轻则Be=140÷(Sp.Gr-130)

*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).

Beam lead光芒式的平行密集引脚.

Bed-of-Nail Testing针床测试.

Bellows Conact弹片式接触.

Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.

Bias斜张纲布,斜纤法.

Bi-Level Stencil]双阶式钢板.

Binder粘结剂.

Bits头(Drill Bits).

Black Oxide黑氧化层.

Blanking冲空断开.

Bleack 漂洗.

Bleeding溢流.

Blind Via Hole肓通孔.

Blister局部性分层或起泡.

Block Diagram电路系统块图 .

Blockout封纲.

Blotting干印.

Blotting Paper吸水纸.

Blow Hole吹孔.

Blue Plaque蓝纹(锡面钝化层).

Blur Edge (Circle)模糊边带(圈).

Bomb Sight弹标.

Bond Strength结合强度.

Bondability结合性.

Bonding Layer结合层接着层.

Bonding Sheet(Layer)接合片.

Bonding Wire结合线.

Bow, Bowing板弯.

Braid编线.

Brazing硬焊(用含银的铜锌合金焊条).

在425℃~870℃下进行熔接的方式). Break Point显像点.

Break-away Panel可断开板. Breakdown Voltage崩溃电压.

Break-out破出.

Bridging搭桥.

Bright Dip光泽浸渍处理.

Brightener光泽剂.

Brown Oxide棕氧化.

Brush Plating刷镀.

B-stageB阶段.

Build Up Process增层法制程.

Build-up堆积.