最新集成电路课件
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▪ Integration reduces manufacturing cost（降 低成本）
▪ BOM (Board of Materials) cost reduces ▪ Mass IC production reduces cost
Electronics Industry
▪ Design, fab, application ▪ Education ▪ Software ▪ Communication/Networki
Challenges of IC Design
Complexity: Multi-million transistors on a single chip (smaller size/faster speed)
Multiple and conflicting specifications for high performance (power/speed/throughput)
▪ Gordon Moore – Intel Founder
▪ “The number of transistors on a chip doubled every
18 to 24 months.”
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Байду номын сангаас
Gordon Moore
0
Intel Co-Founder and Chairmain Emeritus
Image source: Intel Corporation www.intel.com
Electronics, April 19, 1965.
Information Revolution
▪ Electronic system in cars. ▪ Electronic financial system: e-banking,e-money,
ng ▪ Fab cost: $2-$3 billion ▪ Driving force of world
economy ▪ Large investment: fab,
packaging, design, EDA
Pentium® 4 “Northwood” 55M transistors / 2-2.5GHz
▪ CMOS (complementary metal oxide semiconductor)
▪ IC (integrated circuit) ▪ VLSI (very large scale integrated) ▪ ULSI (ultra-large scale integrated) ▪ MOSFET (metal oxide semiconductor field
为什么需要集成电路?
▪ Integration reduces device size（减小尺寸）
▪ Laptop, iPod, mp3, cellphone, ...
▪ Integration improves the design（提高性能）
▪ higher speed; lower power consuption; ▪ more reliable.
e-stock, RFID lable ▪ Personal computing/entertainment ▪ Medical electronic systems. ▪ Internet: routers, firewalls, servers, storages ▪ Electronic library (Google, ...) ▪ DVD R/W, HDTV, Interactive TV ▪ In general, consumer electronics ▪ etc ...
Circuit) ▪ CMOS时序逻辑电路设计(Sequential Logic Circuit ) ▪ IC 版图设计(Layout) ▪ IC 仿真技术(Simulation) ▪ 存储器电路设计介绍(Memory Circuits) ▪ 模拟IC设计介绍(Analog IC)
几个常见缩略词
effect transistors) ▪ SPICE (simulation program with integrated
circuit emphasis)
认识集成电路和集成电路设计
▪ 为什么需要集成电路？ ▪ 与以前的集成电路设计
相比，为什么现在的集 成电路设计出现了不同 以及现在的集成电路设 计遇到了哪些新的挑战？ ▪ 未来，集成电路将如何 发展？
Competition: Short design time
Design Tools: Multiple tools involved, Complex design flow
Small Signal RF
Powe r RF
Power Manageme
nt
Analog Baseband
Digital Baseband
集成电路课件
《集成电路分析与设计》课程主要介绍什么内容?
▪ CMOS数字集成电路(CMOS digital IC)
▪ IC的发展历史及现状(History of IC) ▪ IC 设计流程和方法(Design process and Methodology) ▪ IC 制造工艺技术(Fabrication process) ▪ IC EDA（CAD）工具使用(EDA tools) ▪ CMOS反相器设计(CMOS Inverter) ▪ CMOS组合逻辑门设计(Combinational Logic
(DSP + MCU)
Related to IC Jobs
L=0.13µm
Moore’s Law (1965)
L O 2G O F T H E N U M B E R O F C O M P O N E N T S P E R IN T E G R A T E D F U N C T IO N 1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975
▪ BOM (Board of Materials) cost reduces ▪ Mass IC production reduces cost
Electronics Industry
▪ Design, fab, application ▪ Education ▪ Software ▪ Communication/Networki
Challenges of IC Design
Complexity: Multi-million transistors on a single chip (smaller size/faster speed)
Multiple and conflicting specifications for high performance (power/speed/throughput)
▪ Gordon Moore – Intel Founder
▪ “The number of transistors on a chip doubled every
18 to 24 months.”
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Байду номын сангаас
Gordon Moore
0
Intel Co-Founder and Chairmain Emeritus
Image source: Intel Corporation www.intel.com
Electronics, April 19, 1965.
Information Revolution
▪ Electronic system in cars. ▪ Electronic financial system: e-banking,e-money,
ng ▪ Fab cost: $2-$3 billion ▪ Driving force of world
economy ▪ Large investment: fab,
packaging, design, EDA
Pentium® 4 “Northwood” 55M transistors / 2-2.5GHz
▪ CMOS (complementary metal oxide semiconductor)
▪ IC (integrated circuit) ▪ VLSI (very large scale integrated) ▪ ULSI (ultra-large scale integrated) ▪ MOSFET (metal oxide semiconductor field
为什么需要集成电路?
▪ Integration reduces device size（减小尺寸）
▪ Laptop, iPod, mp3, cellphone, ...
▪ Integration improves the design（提高性能）
▪ higher speed; lower power consuption; ▪ more reliable.
e-stock, RFID lable ▪ Personal computing/entertainment ▪ Medical electronic systems. ▪ Internet: routers, firewalls, servers, storages ▪ Electronic library (Google, ...) ▪ DVD R/W, HDTV, Interactive TV ▪ In general, consumer electronics ▪ etc ...
Circuit) ▪ CMOS时序逻辑电路设计(Sequential Logic Circuit ) ▪ IC 版图设计(Layout) ▪ IC 仿真技术(Simulation) ▪ 存储器电路设计介绍(Memory Circuits) ▪ 模拟IC设计介绍(Analog IC)
几个常见缩略词
effect transistors) ▪ SPICE (simulation program with integrated
circuit emphasis)
认识集成电路和集成电路设计
▪ 为什么需要集成电路？ ▪ 与以前的集成电路设计
相比，为什么现在的集 成电路设计出现了不同 以及现在的集成电路设 计遇到了哪些新的挑战？ ▪ 未来，集成电路将如何 发展？
Competition: Short design time
Design Tools: Multiple tools involved, Complex design flow
Small Signal RF
Powe r RF
Power Manageme
nt
Analog Baseband
Digital Baseband
集成电路课件
《集成电路分析与设计》课程主要介绍什么内容?
▪ CMOS数字集成电路(CMOS digital IC)
▪ IC的发展历史及现状(History of IC) ▪ IC 设计流程和方法(Design process and Methodology) ▪ IC 制造工艺技术(Fabrication process) ▪ IC EDA（CAD）工具使用(EDA tools) ▪ CMOS反相器设计(CMOS Inverter) ▪ CMOS组合逻辑门设计(Combinational Logic
(DSP + MCU)
Related to IC Jobs
L=0.13µm
Moore’s Law (1965)
L O 2G O F T H E N U M B E R O F C O M P O N E N T S P E R IN T E G R A T E D F U N C T IO N 1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975