半导体导论翻译(精)
半导体专业术语英语教材
1. acceptance testing (WAT: wafer acceptance testing)2. acceptor: 受主，如B，掺入Si中需要接受电子3. ACCESS：一个EDA（Engineering Data Analysis）系统4. Acid：酸5. Active device：有源器件，如MOS FET（非线性，可以对信号放大）6. Align mark(key)：对位标记7. Alloy：合金8. Aluminum：铝9. Ammonia：氨水10. Ammonium fluoride：NH4F11. Ammonium hydroxide：NH4OH12. Amorphous silicon：α-Si，非晶硅（不是多晶硅）13. Analog：模拟的14. Angstrom：A（1E-10m）埃15. Anisotropic：各向异性（如POLY ETCH）16. AQL(Acceptance Quality Level)：接受质量标准，在一定采样下，可以95%置信度通过质量标准（不同于可靠性，可靠性要求一定时间后的失效率）17. ARC(Antireflective coating)：抗反射层（用于METAL等层的光刻）18. Antimony(Sb)锑19. Argon(Ar)氩20. Arsenic(As)砷21. Arsenic trioxide(As2O3)三氧化二砷22. Arsine(AsH3)23. Asher：去胶机24. Aspect ration：形貌比（ETCH中的深度、宽度比）25. Autodoping：自搀杂（外延时SUB的浓度高，导致有杂质蒸发到环境中后，又回掺到外延层）26. Back end：后段（CONTACT以后、PCM测试前）27. Baseline：标准流程28. Benchmark：基准29. Bipolar：双极30. Boat：扩散用（石英）舟31. CD：（Critical Dimension）临界（关键）尺寸。
半导体词汇(英汉对照)
半导体词汇(英汉对照)1. 半导体：semiconductor2. 晶体管：transistor3. 二极管：diode4. 集成电路：integrated circuit5. 电容：capacitor8. 金属氧化物场效应管：Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)9. 数字信号处理器：Digital Signal Processor (DSP)10. 有机发光二极管：Organic Light-Emitting Diode (OLED)11. 光纤放大器：Optical Fiber Amplifier (OFA)12. 直流-直流变换器：DC-DC Converter13. 脉冲编码调制：Pulse Code Modulation (PCM)14. 光耦合器：Optocoupler15. 调制解调器：Modem16. 电池管理系统：Battery Management System (BMS)17. 片上系统：System-on-a-Chip (SoC)18. 功率电子器件：Power Electronics Device20. 纳米技术：Nanotechnology21. 生物芯片：Biochip23. 激光器：Laser24. 双极型发射极晶体管：Bipolar Junction Transistor (BJT)28. 传感器：Sensor29. 能量收集器：Energy Harvester30. 固态驱动器：Solid State Drive (SSD)31. 磁性存储设备：Magnetic Storage Device32. 屏幕显示器：Display33. 快速门：Fast Gate35. 超高速芯片：Ultra-High-Speed Chip38. 量子计算机：Quantum Computer40. 机器人学：Robotics41. 表面声波器件：Surface Acoustic Wave (SAW) Device45. 长寿命电池：Long-Life Battery46. 红外光电探测器：Infrared Photodetector47. 树莓派：Raspberry Pi48. 可充电电池：Rechargeable Battery49. 无线充电器：Wireless Charger51. 控制电路：Control Circuit53. 逆变器：Inverter55. 拓扑优化器：Topology Optimizer57. 智能家居：Smart Home58. 传输线理论：Transmission Line Theory60. 片上调制器：On-Chip Modulator61. 内存芯片：Memory Chip63. 线性电源：Linear Power Supply64. 电机驱动器：Motor Driver66. 相变存储器：Phase-Change Memory (PCM)68. 氮化镓：Gallium Nitride (GaN)69. 自动驾驶：Autonomous Driving72. 机器学习：Machine Learning77. 差分信号：Differential Signal78. 相位锁定环：Phase Locked Loop (PLL)80. 峰值检测器：Peak Detector84. 相移器：Phase Shifter88. 滤波器：Filter91. 直流伏安表：Digital Multimeter (DMM)92. 频率计：Frequency Counter93. 降噪耳机：Noise-Canceling Headphones94. 耳返系统：In-Ear Monitoring (IEM) System95. 电学模型：Electrical Model97. 声音芯片：Audio Chip98. 跟踪器：Tracker。
半导体中英对照
倒序浏览|•Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.•受主- 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。
受主原子必须比半导体元素少一价电子•Alignment Precision - Displacement of patterns that occurs during the photolithography process. . u! F. W' }! b# j4 q•套准精度- 在光刻工艺中转移图形的精度。
2 v I; S4 U, T* r' d9 H3 b! c•Anisotropic - A process of etching that has very little or no undercutting , i( N: Z7 u; {3 z •各向异性- 在蚀刻过程中，只做少量或不做侧向凹刻。
: `3 v& P1 s1 }3 z. `; ?•Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc. + {7 c* p' x H3 B0 m; r•沾污区域- 任何在晶圆片表面的外来粒子或物质。
半导体制造技术导论萧宏台译本
半导体制造技术导论萧宏台译本摘要：一、半导体制造技术的概述二、半导体制造技术的发展历程三、半导体制造技术的重要性四、半导体制造技术的应用领域五、半导体制造技术的未来发展趋势正文：一、半导体制造技术的概述半导体制造技术是指通过一系列复杂的工艺步骤，将半导体材料制成具有特定功能和性能的集成电路和器件的过程。
半导体制造技术作为现代电子信息技术的基础，广泛应用于计算机、通信、家电等领域，对于推动科技发展和提高人类生活水平具有重要意义。
二、半导体制造技术的发展历程半导体制造技术的发展经历了几个阶段。
早期，人们主要通过手工操作和简单的设备进行半导体材料的加工。
随着科学技术的进步，半导体制造技术逐渐实现了自动化、智能化，制造工艺也日趋精密。
从20 世纪中叶开始，半导体制造技术进入了快速发展阶段，集成电路的集成度不断提高，尺寸不断缩小，性能不断提升。
三、半导体制造技术的重要性半导体制造技术对于现代科技和社会经济发展具有举足轻重的地位。
首先，半导体制造技术是信息技术产业发展的基础。
计算机、通信设备等电子产品的核心部件都是由半导体材料制成的。
其次，半导体制造技术对提高人民生活水平具有重要意义。
半导体技术在医疗、教育、交通等领域的应用，极大地改善了人们的生活质量。
最后，半导体制造技术是国家科技实力的重要体现。
一个国家在半导体制造技术领域的地位，往往能反映出这个国家在国际竞争中的实力。
四、半导体制造技术的应用领域半导体制造技术的应用领域非常广泛，主要包括以下几个方面：1.计算机：计算机处理器、内存等关键部件都是由半导体材料制成的。
2.通信：手机、无线通信基站等通信设备中，半导体器件占有重要地位。
3.家电：半导体技术在家电产品中的应用，如电视机、冰箱、空调等，使得这些产品更加智能化、节能化。
4.工业控制：半导体技术在工业控制领域的应用，提高了生产效率和产品质量。
5.医疗：半导体技术在医疗设备中的应用，如超声波、心电图等，提高了疾病诊断和治疗的水平。
半导体导论翻译(精)
半导体导论 P124-125CHAPTER 3 The Semiconductor in Equilibrium(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37 Repeat problem 3.36 for GaAs.3.38 Assume that silicon, germanium, and gallium arsenide each have dopant concentrations of Nd = 1X1013 cm-3 and Na = 2.5 x 1014 cm-3 at T=300K.For each of the three materials(a) Is this material n type or p type?(b) Calculate n0 and p0.3.39 A sample of silicon at T =450K is doped with boron at a concentration 0f 1.5x1015 cm-3and with arsenic at a concentration of 8 X 1014 cm-3 .(a) Is the material n type or p type? (b) Determine the electron and hole concentrations .(c) Calculate the total ionized impurity concentration.3.40 The thermal equilibrium hole concentration in silicon at T = 300 K is p0=2x1015cm-3.Determine the thermal-equilibrium electron concentration .Is the material n type or p type?3.41 In a sample of GaAs at T = 200 K, we have experimentally determined that n0 = 5 p0 and that Na = 0. Calculate n0, p0, and N d.3.42 Consider a sample of silicon doped at N d = 1014 cm-3 and Na = 0 Calcu1ate the majority-carrier concentration at (a) T = 300 K, (b) T = 350 K,(C ) T = 400 K (d) T = 450 K, and (e) T = 500 K.3.43 Consider a sample of silicon doped at N d= 0 and Na = 1014cm-3 .Plot the majority-carrier concentration versus temperature over the range 200≤T≤500K.3.44 The temperature of a sample of silicon is T = 300 K and the acceptor doping concentration is Na = 0. Plot the minority-carrier concentration (on a log-log plot) versus Nd over the range 1015≤N d≤1018 cm-3.3.45 Repeat problem 3.44 for GaAs.3.46 A particular semiconductor material is doped at N d = 2 x 1013 cm-3, Na = 0, and the intrinsic carrier concentration is ni = 2 x 1013 cm-3. Assume complete ionization. Determine the thermal-equilibrium majority-and minority-carrier concentrations.3.47 (a) Silicon at T = 300 K is uniformly doped with arsenic atoms at a concentration of 2 x 1016 cm-3 and boron atoms at a concentration of 1 x1013 cm-3. Determine the thermal-equilibrium concentrations of majority and minority carriers.(b) Repeat part (a) if the impurity concentrations are 2 x1015 cm-3 phosphorus atoms and 3 x 1016 cm-3 boron atoms.3.48 In silicon at T = 300 K, we have experimentally found that n0=4.5 x 104 cm-3and N d=5x1015cm-3. (a) Is the material n type or p type? (b) Determine the majority and minority-carrier concentrations. (c) What types and concentrations of impurity atoms exist in the material?Section 3.6 Position of Fermi Energy Level3.49 Consider germanium with an acceptor concentration of Na = 1015 cm-3 and a donor concentration of N d = 0. Consider temperatures of T = 200, 400,and 600 K. Calculate the position of the Fermi energy with respect to the intrinsic Ferrni level at these temperatures.3.50 Consider germanium at T = 300 K with donor concentrations of N d= 104,1016and1018 cm-3 .Let Na = 0. Calculate the position of the Fermi energy level with respect to the intrinsic Fermi level for these doping concentrations.3.51 A GaAs device is doped with a donor concentration of 3X1015cm-3 .For the device to operate properly ,the intrinsic carrier concentration must remain less than 5 percent of the total electron concentration .What is the maximum temperature that the device may operate?3.52 Consider germanium with an concentration of Na=1015cm-3and a donor concentration of N d=0.Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of temperature over the range 200 ≤T ≤600 K. 3,53 Consider silicon at T =300K with Na=0. Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of the donor doping concentration over the range 1014≤N d≤1018cm-3.3.54 For a particular semiconductor,Eg=1.50eV,m*p=10m*n，T=300K，and ni=105cm-3. (a)Determine the position of the intrinsic Fermi energy level with respect to the center of the bandgap. (b)Impurity atoms are added so that the Fermi energy level is 0.45eV below the center of the bandgap .(i)Are acceptor or donor atoms added? (ii)What is the concentration if impurity atoms added?3.55 Silicon at T = 300 K contains acceptor atoms at a concentration of Na = 5 x1015cm-3 . Donor atoms are add forming an n-type compensated semiconductor such that the Fermi level is 0.215 eV below the conduction band edge .What concentration of donor atoms are added?3.56 Silicon at T = 300 K is doped with acceptor atoms at a concentration of Na = 7 x1015cm-3. (a) Determine E f-E v. (b) Calculate the concentration of additional acceptor atoms that must be added to move the Fermi level a distance kT closer to the valence-band edge.3.57 (a) Determine the position of the Fermi level with respect to the intrinsic Fermi level in silicon at T = 300 K that is doped with phosphorus atoms at a concentration of 1015cm-3. (b) Repeat part (a) if the silicon is doped with boron atoms at a concentration of 1015cm-3. (c) Calculate the electron concentration in the silicon for parts (a) and (b).3.58 Gallium arsenide at T = 300 K contains acceptor impurity atoms at a density of 1015cm-3. Additional impurity atoms are to be added so that the Fermi level is 0.45 eV below the intrinsic level. Determine the concentration and type (donor or acceptor) of impurity atoms to be added.3.59 Determine the Fermi energy level with respect to the intrinsic Fermi level for each condition given in Problem 3.36.3.60 Find the Fermi energy level with respect to the valence band energy for the conditions given in Problem 3.37.3.61 Calculate the position of the Fermi energy level with respect to the intrinsic Fermi for the conditions given in Problem 3.48.Summary and Review3.62 A special semiconductor material is to be “designed. ” The semiconductor is tobe n type and doped with 1 x 1015 cm -3donor atoms . Assume complete ionization and assume N a=0. The effective density of states functions are givenby N c=N v=1.5x1019cm-3 and ate independent of temperature .A particular semiconductor device fabricated with this material requires the electron concentration to be no greater than 1.01x1019cm-3 at T=400K. What is the minimum value of the bandgap energy ?译文第三章半导体的平衡(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37重复3.36砷化镓的问题3.38假设硅，锗，镓砷化物各有厘米的Nd = 1X1013 cm-3掺杂浓度和Na = 2.5 ×1014 cm-3在T = 300K. 对于每三种材料（一）这是N型还是P型材料？（二）计算N0和P0。
半导体英文词汇
半导体英文词汇SemiconductorA semiconductor is a material that has electrical conductivity between that of a conductor and that of an insulator. This means that it can conduct some electricity under certain conditions, but not as much as a conductor. Semiconductors are essential components of electronic devices, such as diodes, transistors, and integrated circuits.半导体半导体是一种在导体和绝缘体之间具有电导性的材料。
这意味着在某些条件下它可以导电，但不像导体那样能够导电。
半导体是电子器件的基本组成部分，如二极管、晶体管和集成电路。
DiodeA diode is a semiconductor device that allows current to flow in only one direction. It has two terminals, an anode and a cathode. When a positive voltage is applied to the anode and a negative voltage to the cathode, the diode conducts electricity. However, if the polarity of theapplied voltage is reversed, the diode blocks the flow of current.二极管二极管是一种只允许电流在一个方向中流动的半导体器件。
半导体导论重要术语解释
第一章(1)晶态:固体材料中的原子有规律的周期性排列,或称为长程有序。
(2)非晶态:固体材料中的原子不是长程有序地排列,但在几个原子的范围内保持着有序性,或称为短程有序(3)准晶态:介于晶态和非晶态之间的固体材料,其特点是原子有序排列,但不具有平移周期性。
(4)单晶:原子呈周期性排列的晶体(5)多晶:由许多取向不同的单晶体颗粒无规则堆积而成的固体材料。
(6)理想晶体(完整晶体):内在结构完全规则的固体,由全同的结构单元在空间无限重复排列而构成。
(7)空间点阵(布拉菲点阵):晶体的内部结构可以概括为是由一些相同的点子在空间有规则地做周期性无限重复排列,这些点子的总体称为空间点阵。
(8)晶格常数:晶胞的棱边的长度。
(9)晶胞:能复制整个晶体的一小部分晶体。
晶胞不是唯一的。
最小的晶胞称为原胞(10)晶面指数(密勒指数):描写布拉菲点阵中晶面方位的一组互质整数。
(11)原子的电负性:原子得失价电子能力的度量。
电负性一常数(电离能+亲和能)。
(12)倒格子及其与正格子的关系:由正格子的基矢(a1,a2,a3)定义的三个矢量(b1,b2,b3)。
(13)布里渊区:在倒格子中,以某一点为坐标原点,作所有倒格矢的垂直平分面,倒格子空间被这些平面分成许多区域,这些区域就称为布里渊区(14)价电子:最外层的电子因构成化学价键而被叫做价电子。
(15)原子价键:主要的原子价键有共价键、离子键、π键和金属键。
(16)共价键与非极性共价键:共价键是相邻原子间通过共用自旋方向相反的电子对(电子云重叠)与原子核间的静电作用形成的,成键的条件是成键原子得失电子的能力相当或是差别较小,或者是成键原子一方有孤对电子(配位体),另一方有空轨道(中心离子)。
如果相邻原子吸引电子的能力是一样的,则共用电子对不会发生偏移,这样的共价键就是非极性共价键。
共价键的数目遵从8-N原则。
(17)共价键的特点:具有方向性和饱和性。
(18)空穴:光激发或热激发等激发因素会使原子键断裂而释放出电子,在断键处少掉了一个电子,等效于留下一个带(+q)电量的正电荷在键电子原来所在的位置,这就是空穴。
半导体制造技术导论萧宏台译本
半导体制造技术导论萧宏台译本
《半导体制造技术导论》是由台湾作家萧宏台所翻译的一本介绍半导体制造技术的入门教材。
该书以通俗易懂的语言，系统地介绍了半导体的基本知识和制造工艺。
《半导体制造技术导论》主要包括以下内容：半导体材料的基本概念、基本物理性质和组成成分；半导体材料的制备及材料的性质分析；半导体器件的基本原理和工艺流程；半导体制造中的控制和测试技术；以及半导体制造中的设备和设备的相关知识。
该书在内容上详细而全面地介绍了半导体制造技术的各个方面，包括半导体材料的选择和制备、器件的设计和制造工艺、制造过程中的设备和设备的选择等。
同时，书中还包含了大量的实际案例和操作流程，帮助读者更好地理解和掌握半导体制造技术。
总之，《半导体制造技术导论》是一本适合初学者学习的半导体制造技术教材，无论是在内容上还是在语言上都非常易懂。
通过阅读该书，读者可以对半导体制造技术有一个全面的了解，并且能够初步掌握半导体制造的基本原理和技术。
该书也适合作为相关专业学生和从事半导体制造工作的技术人员的参考书籍。
半导体一些术语的中英文对照
半导体一些术语的中英文对照半导体一些术语的中英文对照离子注入机ion implanterLSS理论Lindhand Scharff and Schiott theory 又称“林汉德-斯卡夫-斯高特理论”。
沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stopping cross section退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优取向preferred orientation制版工艺mask-making technology图形畸变pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see-through plate高分辨率版high resolution plate, HRP超微粒干版plate for ultra-microminiaturization 掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist又称“光致抗蚀剂”。
负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beam resistX射线光刻胶X-ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithographyX射线光刻X-ray lithography电子束光刻electron beam lithography离子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system分步重复系统step-and-repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子［体］去胶removing of photoresist by plasma 刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching, RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铣ion beam milling又称“离子磨削”。
半导体-毕业论文外文文献翻译
附录附录A:外文资料翻译—原文部分SemiconductorA semiconductor is a solid material that has electrical conductivity between those of a conductor and an insulator; it can vary over that wide range either permanently or dynamically.[1]Semiconductors are important in electronic technology. Semiconductor devices, electronic components made of semiconductor materials, are essential in modern consumer electronics, including computers, mobile phones, and digital audio players. Silicon is used to create most semiconductors commercially, but dozens of other materials are used.Bragg reflection in a diffuse latticeA second way starts with free electrons waves. When fading in an electrostatic potential due to the cores, due to Bragg reflection some waves are reflected and cannot penetrate the bulk, that is a band gap opens. In this description it is not clear, while the number of electrons fills up exactly all states below the gap.Energy level splitting due to spin state Pauli exclusionA third description starts with two atoms. The split states form a covalent bond where two electrons with spin up and spin down are mostly in between the two atoms. Adding more atoms now is supposed not to lead to splitting, but to more bonds. This is the way silicon is typically drawn. The band gap is now formed by lifting one electron from the lower electron level into the upper level. This level is known to be anti-bonding, but bulk silicon has not been seen to lose atoms as easy as electrons are wandering through it. Also this model is most unsuitable to explain how in graded hetero-junction the band gap can vary smoothly.Energy bands and electrical conductionLike in other solids, the electrons in semiconductors can have energies only within certain bands (ie. ranges of levels of energy) between the energy of the ground state, corresponding to electrons tightly bound to the atomic nuclei of the material, and the free electron energy, which is the energy required for an electron to escape entirely from the material. The energy bands each correspond to a large number of discrete quantum states of the electrons, and most of the states with low energy (closer to the nucleus) are full, up to a particular band called the valence band. Semiconductors and insulators are distinguished from metals because the valence band in the semiconductor materials is very nearly full under usual operating conditions, thus causing more electrons to be available in the conduction band.The ease with which electrons in a semiconductor can be excited from the valence band to the conduction band depends on the band gap between the bands, and it is the size of this energybandgap that serves as an arbitrary dividing line (roughly 4 eV) between semiconductors and insulators.In the picture of covalent bonds, an electron moves by hopping to a neighboring bond. Because of the Pauli exclusion principle it has to be lifted into the higher anti-bonding state of that bond. In the picture of delocalized states, for example in one dimension that is in a wire, for every energy there is a state with electrons flowing in one direction and one state for the electrons flowing in the other. For a net current to flow some more states for one direction than for the other direction have to be occupied and for this energy is needed. For a metal this can be a very small energy in the semiconductor the next higher states lie above the band gap. Often this is stated as: full bands do not contribute to the electrical conductivity. However, as the temperature of a semiconductor rises above absolute zero, there is more energy in the semiconductor to spend on lattice vibration and — more importantly for us — on lifting some electrons into an energy states of the conduction band, which is the band immediately above the valence band. The current-carrying electrons in the conduction band are known as "free electrons", although they are often simply called "electrons" if context allows this usage to be clear.Electrons excited to the conduction band also leave behind electron holes, or unoccupied states in the valence band. Both the conduction band electrons and the valence band holes contribute to electrical conductivity. The holes themselves don't actually move, but a neighboring electron can move to fill the hole, leaving a hole at the place it has just come from, and in this way the holes appear to move, and the holes behave as if they were actual positively charged particles.One covalent bond between neighboring atoms in the solid is ten times stronger than the binding of the single electron to the atom, so freeing the electron does not imply destruction of the crystal structure.Holes: electron absence as a charge carrierThe notion of holes, which was introduced for semiconductors, can also be applied to metals, where the Fermi level lies within the conduction band. With most metals the Hall effect reveals electrons to be the charge carriers, but some metals have a mostly filled conduction band, and the Hall effect reveals positive charge carriers, which are not the ion-cores, but holes. Contrast this to some conductors like solutions of salts, or plasma. In the case of a metal, only a small amount of energy is needed for the electrons to find other unoccupied states to move into, and hence for current to flow. Sometimes even in this case it may be said that a hole was left behind, to explain why the electron does not fall back to lower energies: It cannot find a hole. In the end in both materials electron-phonon scattering and defects are the dominant causes for resistance.Fermi-Dirac distribution. States with energy εbelow the Fermi energy, here μ, have higher probability n to be occupied, and those above are less likely to be occupied. Smearing of the distribution increases with temperature.The energy distribution of the electrons determines which of the states are filled and which are empty. This distribution is described by Fermi-Dirac statistics. The distribution is characterized bythe temperature of the electrons, and the Fermi energy or Fermi level. Under absolute zero conditions the Fermi energy can be thought of as the energy up to which available electron states are occupied. At higher temperatures, the Fermi energy is the energy at which the probability of a state being occupied has fallen to 0.5.The dependence of the electron energy distribution on temperature also explains why the conductivity of a semiconductor has a strong temperature dependency, as a semiconductor operating at lower temperatures will have fewer available free electrons and holes able to do the work.Energy–momentum dispersionIn the preceding description an important fact is ignored for the sake of simplicity: the dispersion of the energy. The reason that the energies of the states are broadened into a band is that the energy depends on the value of the wave vector, or k-vector, of the electron. The k-vector, in quantum mechanics, is the representation of the momentum of a particle.The dispersion relationship determines the effective mass, m* , of electrons or holes in the semiconductor, according to the formula:The effective mass is important as it affects many of the electrical properties of the semiconductor, such as the electron or hole mobility, which in turn influences the diffusivity of the charge carriers and the electrical conductivity of the semiconductor.Typically the effective mass of electrons and holes are different. This affects the relative performance of p-channel and n-channel IGFETs, for example (Muller & Kamins 1986:427).The top of the valence band and the bottom of the conduction band might not occur at that same value of k. Materials with this situation, such as silicon and germanium, are known as indirect bandgap materials. Materials in which the band extrema are aligned in k, for example gallium arsenide, are called direct bandgap semiconductors. Direct gap semiconductors are particularly important in optoelectronics because they are much more efficient as light emitters than indirect gap materials.Carrier generation and recombinationWhen ionizing radiation strikes a semiconductor, it may excite an electron out of its energy level and consequently leave a hole. This process is known as electron–hole pair generation.Electron-hole pairs are constantly generated from thermal energy as well, in the absence of any external energy source.Electron-hole pairs are also apt to recombine. Conservation of energy demands that these recombination events, in which an electron loses an amount of energy larger than the band gap, beaccompanied by the emission of thermal energy (in the form of phonons) or radiation (in the form of photons).In some states, the generation and recombination of electron–hole pairs are in equipoise. The number of electron-hole pairs in the steady state at a given temperature is determined by quantum statistical mechanics. The precise quantum mechanical mechanisms of generation and recombination are governed by conservation of energy and conservation of momentum.As the probability that electrons and holes meet together is proportional to the product of their amounts, the product is in steady state nearly constant at a given temperature, providing that there is no significant electric field (which might "flush" carriers of both types, or move them from neighbour regions containing more of them to meet together) or externally driven pair generation. The product is a function of the temperature, as the probability of getting enough thermal energy to produce a pair increases with temperature, being approximately 1×exp(−E G / kT), where k is Boltzmann's constant, T is absolute temperature and E G is band gap.The probability of meeting is increased by carrier traps – impurities or dislocations which can trap an electron or hole and hold it until a pair is completed. Such carrier traps are sometimes purposely added to reduce the time needed to reach the steady state.DopingThe property of semiconductors that makes them most useful for constructing electronic devices is that their conductivity may easily be modified by introducing impurities into their crystal lattice. The process of adding controlled impurities to a semiconductor is known as doping. The amount of impurity, or dopant, added to an intrinsic (pure) semiconductor varies its level of conductivity. Doped semiconductors are often referred to as extrinsic.DopantsThe materials chosen as suitable dopants depend on the atomic properties of both the dopant and the material to be doped. In general, dopants that produce the desired controlled changes are classified as either electron acceptors or donors. A donor atom that activates (that is, becomes incorporated into the crystal lattice) donates weakly-bound valence electrons to the material, creating excess negative charge carriers. These weakly-bound electrons can move about in the crystal lattice relatively freely and can facilitate conduction in the presence of an electric field. (The donor atoms introduce some states under, but very close to the conduction band edge. Electrons at these states can be easily excited to conduction band, becoming free electrons, at room temperature.) Conversely, an activated acceptor produces a hole. Semiconductors doped with donor impurities are called n-type, while those doped with acceptor impurities are known as p-type. The n and p type designations indicate which charge carrier acts as the material's majority carrier. The opposite carrier is called the minority carrier, which exists due to thermal excitation at a much lower concentration compared to the majority carrier.For example, the pure semiconductor silicon has four valence electrons. In silicon, the most common dopants are IUPAC group 13 (commonly known as group III) and group 15 (commonly known as group V) elements. Group 13 elements all contain three valence electrons, causing them to function as acceptors when used to dope silicon. Group 15 elements have five valence electrons, which allows them to act as a donor. Therefore, a silicon crystal doped with boron creates a p-type semiconductor whereas one doped with phosphorus results in ann-type material.Carrier concentrationThe concentration of dopant introduced to an intrinsic semiconductor determines its concentration and indirectly affects many of its electrical properties. The most important factor that doping directly affects is the material's carrier concentration. In an intrinsic semiconductor under thermal equilibrium, the concentration of electrons and holes is equivalent. That is,n = p = n iIf we have a non-intrinsic semiconductor in thermal equilibrium the relation becomes:n0 * p0 = (n i)2Where n is the concentration of conducting electrons, p is the electron hole concentration, and n i is the material's intrinsic carrier concentration. Intrinsic carrier concentration varies between materials and is dependent on temperature. Silicon's n i, for example, is roughly 1.6×1010 cm-3 at 300 kelvin (room temperature).In general, an increase in doping concentration affords an increase in conductivity due to the higher concentration of carriers available for conduction. Degenerately (very highly) doped semiconductors have conductivity levels comparable to metals and are often used in modern integrated circuits as a replacement for metal. Often superscript plus and minus symbols are used to denote relative doping concentration in semiconductors. For example, n+ denotes an n-type semiconductor with a high, often degenerate, doping concentration. Similarly, p−would indicate a very lightly doped p-type material. It is useful to note that even degenerate levels of doping imply low concentrations of impurities with respect to the base semiconductor. In crystalline intrinsic silicon, there are approximately 5×1022 atoms/cm³. Doping concentration for silicon semiconductors may range anywhere from 1013 cm-3 to 1018 cm-3. Doping concentration above about 1018 cm-3 is considered degenerate at room temperature. Degenerately doped silicon contains a proportion of impurity to silicon in the order of parts per thousand. This proportion may be reduced to parts per billion in very lightly doped silicon. Typical concentration values fall somewhere in this range and are tailored to produce the desired properties in the device that the semiconductor is intended for.Effect on band structureDoping a semiconductor crystal introduces allowed energy states within the band gap but very close to the energy band that corresponds with the dopant type. In other words, donor impurities create states near the conduction band while acceptors create states near the valence band. The gap between these energy states and the nearest energy band is usually referred to as dopant-sitebonding energy or E B and is relatively small. For example, the E B for boron in silicon bulk is0.045 eV, compared with silicon's band gap of about 1.12 eV. Because E B is so small, it takes little energy to ionize the dopant atoms and create free carriers in the conduction or valence bands. Usually the thermal energy available at room temperature is sufficient to ionize most of the dopant.Dopants also have the important effect of shifting the material's Fermi level towards the energy band that corresponds with the dopant with the greatest concentration. Since the Fermi level must remain constant in a system in thermodynamic equilibrium, stacking layers of materials with different properties leads to many useful electrical properties. For example, the p-n junction's properties are due to the energy band bending that happens as a result of lining up the Fermi levels in contacting regions of p-type and n-type material.This effect is shown in a band diagram. The band diagram typically indicates the variation in the valence band and conduction band edges versus some spatial dimension, often denoted x. The Fermi energy is also usually indicated in the diagram. Sometimes the intrinsic Fermi energy, E i, which is the Fermi level in the absence of doping, is shown. These diagrams are useful in explaining the operation of many kinds of semiconductor devices.Preparation of semiconductor materialsSemiconductors with predictable, reliable electronic properties are necessary for mass production. The level of chemical purity needed is extremely high because the presence of impurities even in very small proportions can have large effects on the properties of the material. A high degree of crystalline perfection is also required, since faults in crystal structure (such as dislocations, twins, and stacking faults) interfere with the semiconducting properties of the material. Crystalline faults are a major cause of defective semiconductor devices. The larger the crystal, the more difficult it is to achieve the necessary perfection. Current mass production processes use crystal ingots between four and twelve inches (300 mm) in diameter which are grown as cylinders and sliced into wafers.Because of the required level of chemical purity and the perfection of the crystal structure which are needed to make semiconductor devices, special methods have been developed to produce the initial semiconductor material. A technique for achieving high purity includes growing the crystal using the Czochralski process. An additional step that can be used to further increase purity is known as zone refining. In zone refining, part of a solid crystal is melted. The impurities tend to concentrate in the melted region, while the desired material recrystalizes leaving the solid material more pure and with fewer crystalline faults.In manufacturing semiconductor devices involving heterojunctions between different semiconductor materials, the lattice constant, which is the length of the repeating element of the crystal structure, is important for determining the compatibility of materials.附录B:外文资料翻译—译文部分半导体半导体是一种导电性能介于导体与绝缘体之间的固体材料。
semiconductors翻译
semiconductors翻译基本解释●semiconductors：半导体●/ˌsem.i.kənˈdʌk.tərz/●n. 半导体变化形式●n. 复数形式：semiconductors具体用法●n.:o半导体o同义词：silicon devices, electronic components, microchips, transistors, integrated circuitso反义词：insulators, conductors, metals, non-conductors, dielectricso例句：●Semiconductors are essential components in modernelectronic devices, enabling the functionality of smartphones,computers, and many other gadgets. 半导体是现代电子设备中必不可少的组件，使智能手机、计算机和许多其他设备能够正常工作。
●The global semiconductor industry is a key driver oftechnological innovation and economic growth, with companies investing billions in research and development. 全球半导体行业是技术创新和经济增长的关键推动力，各公司在研发上投入了数十亿美元。
●Advances in semiconductor technology have led to thedevelopment of faster and more efficient electronic devices, transforming the way we live and work. 半导体技术的进步导致了更快、更高效的电子设备的发展，改变了我们的生活和工作方式。
半导体制造技术导论萧宏台译本
半导体制造技术导论萧宏台译本
《半导体制造技术导论》是一本介绍半导体制造技术的著作，由萧宏台翻译成中文。
这本书从多个角度全面介绍了半导体制造技术的基本原理、工艺流程、设备和材料等内容。
萧宏台的译本在学术界和工程领域都有一定的影响，因为他在翻译过程中注重准确性和严谨性，使得读者能够更好地理解和掌握半导体制造技术的相关知识。
这本书对于从事半导体制造和相关领域的研究人员、工程师以及对该领域感兴趣的学生都具有一定的参考价值。
总的来说，萧宏台译本的《半导体制造技术导论》是一本值得阅读的权威著作。
半导体导论翻译(精)
半导体导论 P124-125CHAPTER 3 The Semiconductor in Equilibrium(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37 Repeat problem 3.36 for GaAs.3.38 Assume that silicon, germanium, and gallium arsenide each have dopant concentrations of Nd = 1X1013 cm-3 and Na = 2.5 x 1014 cm-3 at T=300K.For each of the three materials(a) Is this material n type or p type?(b) Calculate n0 and p0.3.39 A sample of silicon at T =450K is doped with boron at a concentration 0f 1.5x1015 cm-3and with arsenic at a concentration of 8 X 1014 cm-3 .(a) Is the material n type or p type? (b) Determine the electron and hole concentrations .(c) Calculate the total ionized impurity concentration.3.40 The thermal equilibrium hole concentration in silicon at T = 300 K is p0=2x1015cm-3.Determine the thermal-equilibrium electron concentration .Is the material n type or p type?3.41 In a sample of GaAs at T = 200 K, we have experimentally determined that n0 = 5 p0 and that Na = 0. Calculate n0, p0, and N d.3.42 Consider a sample of silicon doped at N d = 1014 cm-3 and Na = 0 Calcu1ate the majority-carrier concentration at (a) T = 300 K, (b) T = 350 K,(C ) T = 400 K (d) T = 450 K, and (e) T = 500 K.3.43 Consider a sample of silicon doped at N d= 0 and Na = 1014cm-3 .Plot the majority-carrier concentration versus temperature over the range 200≤T≤500K.3.44 The temperature of a sample of silicon is T = 300 K and the acceptor doping concentration is Na = 0. Plot the minority-carrier concentration (on a log-log plot) versus Nd over the range 1015≤N d≤1018 cm-3.3.45 Repeat problem 3.44 for GaAs.3.46 A particular semiconductor material is doped at N d = 2 x 1013 cm-3, Na = 0, and the intrinsic carrier concentration is ni = 2 x 1013 cm-3. Assume complete ionization. Determine the thermal-equilibrium majority-and minority-carrier concentrations.3.47 (a) Silicon at T = 300 K is uniformly doped with arsenic atoms at a concentration of 2 x 1016 cm-3 and boron atoms at a concentration of 1 x1013 cm-3. Determine the thermal-equilibrium concentrations of majority and minority carriers.(b) Repeat part (a) if the impurity concentrations are 2 x1015 cm-3 phosphorus atoms and 3 x 1016 cm-3 boron atoms.3.48 In silicon at T = 300 K, we have experimentally found that n0=4.5 x 104 cm-3and N d=5x1015cm-3. (a) Is the material n type or p type? (b) Determine the majority and minority-carrier concentrations. (c) What types and concentrations of impurity atoms exist in the material?Section 3.6 Position of Fermi Energy Level3.49 Consider germanium with an acceptor concentration of Na = 1015 cm-3 and a donor concentration of N d = 0. Consider temperatures of T = 200, 400,and 600 K. Calculate the position of the Fermi energy with respect to the intrinsic Ferrni level at these temperatures.3.50 Consider germanium at T = 300 K with donor concentrations of N d= 104, 1016and1018 cm-3 .Let Na = 0. Calculate the position of the Fermi energy level with respect to the intrinsic Fermi level for these doping concentrations.3.51 A GaAs device is doped with a donor concentration of 3X1015cm-3 .For the device to operate properly ,the intrinsic carrier concentration must remain less than 5 percent of the total electron concentration .What is the maximum temperature that the device may operate?3.52 Consider germanium with an concentration of Na=1015cm-3and a donor concentration of N d=0.Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of temperature over the range 200 ≤T ≤600 K.3,53 Consider silicon at T =300K with Na=0. Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of the donor doping concentration over the range 1014≤N d≤1018cm-3.3.54 For a particular semiconductor,Eg=1.50eV,m*p=10m*n，T=300K，and ni=105cm-3. (a)Determine the position of the intrinsic Fermi energy level with respect to the center of the bandgap. (b)Impurity atoms are added so that the Fermi energy level is 0.45eV below the center of the bandgap .(i)Are acceptor or donor atoms added? (ii)What is the concentration if impurity atoms added?3.55 Silicon at T = 300 K contains acceptor atoms at a concentration of Na = 5 x1015cm-3 . Donor atoms are add forming an n-type compensated semiconductor such that the Fermi level is 0.215 eV below the conduction band edge .What concentration of donor atoms are added?3.56 Silicon at T = 300 K is doped with acceptor atoms at a concentration of Na = 7 x1015cm-3. (a) Determine E f-E v. (b) Calculate the concentration of additional acceptor atoms that must be added to move the Fermi level a distance kT closer to thevalence-band edge.3.57 (a) Determine the position of the Fermi level with respect to the intrinsic Fermi level in silicon at T = 300 K that is doped with phosphorus atoms at a concentration of 1015cm-3. (b) Repeat part (a) if the silicon is doped with boron atoms at a concentration of 1015cm-3. (c) Calculate the electron concentration in the silicon for parts (a) and (b).3.58 Gallium arsenide at T = 300 K contains acceptor impurity atoms at a density of 1015cm-3. Additional impurity atoms are to be added so that the Fermi level is 0.45 eV below the intrinsic level. Determine the concentration and type (donor or acceptor) of impurity atoms to be added.3.59 Determine the Fermi energy level with respect to the intrinsic Fermi level for each condition given in Problem 3.36.3.60 Find the Fermi energy level with respect to the valence band energy for the conditions given in Problem 3.37.3.61 Calculate the position of the Fermi energy level with respect to the intrinsic Fermi for the conditions given in Problem 3.48.Summary and Review3.62 A special semiconductor material is to be “designed. ” The semiconductor is tobe n type and doped with 1 x 1015 cm -3donor atoms . Assume complete ionization and assume N a=0. The effective density of states functions are given by N c=N v=1.5x1019cm-3 and ate independent of temperature .A particular semiconductor device fabricated with this material requires the electron concentration to be no greater than 1.01x1019cm-3 at T=400K. What is the minimum value of the bandgap energy ?译文第三章半导体的平衡(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37重复3.36砷化镓的问题3.38假设硅，锗，镓砷化物各有厘米的Nd = 1X1013 cm-3掺杂浓度和Na = 2.5 ×1014 cm-3在T = 300K. 对于每三种材料（一）这是N型还是P型材料？（二）计算N0和P0。
半导体名词翻译
AA atomic absorption
AAS atomic absorption spectroscopy
ABC activity-based costing
ABM activity-based management
AC alternating current; activated carbon
AMC airborne molecular contamination
AMHS automated material handling system
AMT advanced manufacturing technology
AMU atomic mass unit
ANN artificial neural network
CAT computer-aided testing
CAW Construction Analysis Workgroup
CAWC cryogenic aerosol wafer cleaning
CBGA ceramic ball grid array
CBS chemical bottle storage area
CCW counterclockwise
Cd cadmium
CD critical dimension
CD/OL critical dimension overlay
ADC analog-to-digital converter
ADE advanced development environment
ADI after-develop inspection
ADT applied diagnostic technique
semiconductors 翻译
semiconductors 翻译基本解释●semiconductors：半导体●/ˌsem.i.kənˈdʌk.tər/●n. 一种材料，其导电性介于导体和绝缘体之间变化形式●n. 复数形式：semiconductors具体用法●名词:o意思: 一种材料，其导电性介于导体和绝缘体之间o同义词: silicon, germanium, semiconductor material, chip, wafer o反义词: insulator, nonconductor, dielectric, isolator, nonconductor o例句：●Semiconductors are essential components in modernelectronic devices, enabling the functionality of computersand smartphones. (半导体是现代电子设备中的关键组件，使计算机和智能手机的功能得以实现。
)●The global demand for semiconductors has surged due to theincreasing reliance on technology in everyday life. (由于日常生活中对技术的依赖增加，全球对半导体的需求激增。
)●Researchers are constantly exploring new materials toimprove the efficiency of semiconductors. (研究人员不断探索新材料以提高半导体的效率。
)●The semiconductor industry is a major driver of economicgrowth in many countries. (半导体行业是许多国家经济增长的主要推动力。
)●Advances in semiconductor technology have led to smallerand more powerful electronic devices. (半导体技术的进步导致了更小更强大的电子设备。
半导体制程技术导论
Hong Xiao, Ph. D. hxiao89@
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目標
讀完本章之後，你應該能夠：
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熟悉半導體相關術語的使用 描述基本的積體電路製造流程 簡明的解釋每一個製程步驟 半導體製程與你的工作或產品有相關性的 連結
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IC 設計: 第一顆IC
照片提供: 德州儀器
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IC 設計: CMOS 反相器
NMOS
Vin
Vdd
簡介
• • • • • 第一個電晶體, AT&T貝爾實驗室 , 1947 第一個單晶鍺, 1952 第一個單晶矽, 1954 第一個積體電路元件, 德州儀器, 1958 第一個矽積體電路晶片, 費爾查德照相機 公司, 1961
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原子的大小
Hong Xiao, Ph. D.
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IC 元件的限制
• • • • 原子大小： 數個埃( Å) 形成一個元件需要一些原子 一般最後的限制在100 Å 或 0.01 微米 大概30 個矽原子
arge Scale Integration) 極大型積體電路(Very Large Scale Integration) 超大型積體電路(Ultra Large Scale Integration) 特大型積體電路(Super Large Scale Integration)
MSI
半导体专业英语
半导体专业英语Semiconductor technology has become an integral part of our modern world, revolutionizing the way we live, work, and communicate. As the global demand for high-performance electronic devices continues to grow, the importance of understanding the language and terminology associated with this field has become increasingly crucial. In this essay, we will delve into the fascinating world of semiconductor English, exploring its key concepts, industry-specific vocabulary, and its relevance in the global marketplace.At the heart of the semiconductor industry lies a complex web of technical jargon and specialized terminology. From transistors and integrated circuits to wafers and fabrication plants, the language of semiconductors is a unique and intricate one. Understanding these terms is essential for professionals working in the field, as they form the foundation for effective communication, collaboration, and problem-solving.One of the fundamental concepts in semiconductor English is the notion of a semiconductor itself. A semiconductor is a material thatexhibits the ability to conduct electricity to some degree, but not as well as a metal. This unique property allows semiconductors to be used in a wide range of electronic devices, from computer processors and memory chips to smartphones and solar panels. Mastering the vocabulary related to semiconductor materials, such as silicon, gallium arsenide, and germanium, is crucial for understanding the underlying principles of semiconductor technology.As the semiconductor industry continues to evolve, new technologies and advancements have led to the emergence of specialized terminology. For instance, the term "Moore's Law" refers to the observation that the number of transistors on a microchip doubles approximately every two years, while the cost of computers is halved. This principle has driven the relentless pursuit of miniaturization and increased performance in the semiconductor industry, and understanding its significance is essential for industry professionals.Another important aspect of semiconductor English is the language used in the manufacturing process. The fabrication of semiconductor devices, known as "fabs," involves a complex series of steps, each with its own set of specialized terms. From wafer preparation and lithography to etching and packaging, the vocabulary used in the fab is essential for coordinating the various stages of production and ensuring the quality and reliability of the final product.In addition to technical terminology, semiconductor English also encompasses industry-specific concepts and phrases that are crucial for understanding the broader context of the field. Terms such as "Moore's Law," "System-on-a-Chip (SoC)," and "Internet of Things (IoT)" are examples of how the semiconductor industry has evolved and adapted to new market trends and technological advancements.The importance of semiconductor English extends beyond the technical domain, as it plays a vital role in the global economy. With the semiconductor industry being a driving force behind many technological innovations, proficiency in this specialized language is highly sought after by multinational corporations, research institutions, and government agencies. Effective communication and collaboration across international boundaries require a deep understanding of semiconductor English, enabling seamless knowledge sharing, technology transfer, and joint research efforts.In conclusion, the language of semiconductors is a unique and constantly evolving field that reflects the dynamic nature of the industry. Mastering semiconductor English is not only a professional necessity but also a gateway to understanding the complex and fascinating world of electronic devices and their impact on our daily lives. As the semiconductor industry continues to shape the future of technology, the importance of this specialized language will onlycontinue to grow, making it an essential skill for anyone aspiring to be a part of this rapidly advancing field.。
半导体(semi-conductor)
+5
個，就能多出 1 個自由電子做為
導電用，而且視我們取代多少矽
原子，可以由我們來控制半導體
的導電度。【摻入(dope)雜質 (impurity)的半導體稱為異質半導
Where is the free electron?
體(extrinsic semiconductor)，相對於不加入雜質的本質半導體(intrinsic
陽離子在晶體中之活 價電子躍遷到傳導帶 更多的價電子躍遷到
動而阻礙電子之前進
傳導帶
Al、Cu
n 型半導體或 p 型半導 B、P
體
210103
固態材料：
半導體材料一般以固態物質為主。由固態材料所製作的電子元件，也稱為固
態電子元件。首先，我們先區分一下固體的種類，即使是同一種元素，也會因為
細部原子排列方式的不同，而有不同的物理特性，最典型的例子就是碳(C)，因
semiconductor) 】。
加入五價元素的半導體，我們稱之為『n 型半導體(negative type semiconductor) 』。這個五價元素因為提供了一個自由電子做為導電用，因此也 稱為『施體原子(donor) 』。
而加入三價元素，其實也
可以改變導電度，原理略有不
同。加入五價元素後，矽+五價
(majority carrier)
」，電洞為「少數載子(minority carrier)
」。其中，n×p=
n
2 i
。
[p型半導體中自由電子(n)的濃度小於電洞濃度(p)，自由電子為「少數載
子」，電洞為「多數載子」。其中，n×p=
n
2 i
。【質量作用定律，可以參考高中物
理進階 300 篇，類似化學的平衡常數[H+][OH－]=Kw】
半导体导论翻译精
半导体导论翻译(精)————————————————————————————————作者：————————————————————————————————日期：半导体导论 P124-125CHAPTER 3 The Semiconductor in Equilibrium(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37 Repeat problem 3.36 for GaAs.3.38 Assume that silicon, germanium, and gallium arsenide each have dopant concentrations of Nd = 1X1013 cm-3 and Na = 2.5 x 1014 cm-3 at T=300K.For each of the three materials(a) Is this material n type or p type?(b) Calculate n0 and p0.3.39 A sample of silicon at T =450K is doped with boron at a concentration 0f 1.5x1015 cm-3and with arsenic at a concentration of 8 X 1014 cm-3 .(a) Is the material n type or p type? (b) Determine the electron and hole concentrations .(c) Calculate the total ionized impurity concentration.3.40 The thermal equilibrium hole concentration in silicon at T = 300 K is p0=2x1015cm-3.Determine the thermal-equilibrium electron concentration .Is the material n type or p type?3.41 In a sample of GaAs at T = 200 K, we have experimentally determined that n0 = 5 p0 and that Na = 0. Calculate n0, p0, and N d.3.42 Consider a sample of silicon doped at N d = 1014 cm-3 and Na = 0 Calcu1ate the majority-carrier concentration at (a) T = 300 K, (b) T = 350 K,(C ) T = 400 K (d) T = 450 K, and (e) T = 500 K.3.43 Consider a sample of silicon doped at N d= 0 and Na = 1014cm-3 .Plot the majority-carrier concentration versus temperature over the range 200≤T≤500K.3.44 The temperature of a sample of silicon is T = 300 K and the acceptor doping concentration is Na = 0. Plot the minority-carrier concentration (on a log-log plot) versus Nd over the range 1015≤N d≤1018 cm-3.3.45 Repeat problem 3.44 for GaAs.3.46 A particular semiconductor material is doped at N d = 2 x 1013 cm-3, Na = 0, and the intrinsic carrier concentration is ni = 2 x 1013 cm-3. Assume complete ionization. Determine the thermal-equilibrium majority-and minority-carrier concentrations.3.47 (a) Silicon at T = 300 K is uniformly doped with arsenic atoms at a concentration of 2 x 1016 cm-3 and boron atoms at a concentration of 1 x1013 cm-3. Determine the thermal-equilibrium concentrations of majority and minority carriers.(b) Repeat part (a) if the impurity concentrations are 2 x1015 cm-3 phosphorus atoms and 3 x 1016 cm-3 boron atoms.3.48 In silicon at T = 300 K, we have experimentally found that n0=4.5 x 104 cm-3and N d=5x1015cm-3. (a) Is the material n type or p type? (b) Determine the majority and minority-carrier concentrations. (c) What types and concentrations of impurity atoms exist in the material?Section 3.6 Position of Fermi Energy Level3.49 Consider germanium with an acceptor concentration of Na = 1015 cm-3 and a donor concentration of N d = 0. Consider temperatures of T = 200, 400,and 600 K. Calculate the position of the Fermi energy with respect to the intrinsic Ferrni level at these temperatures.3.50 Consider germanium at T = 300 K with donor concentrations of N d= 104, 1016and1018 cm-3 .Let Na = 0. Calculate the position of the Fermi energy level with respect to the intrinsic Fermi level for these doping concentrations.3.51 A GaAs device is doped with a donor concentration of 3X1015cm-3 .For the device to operate properly ,the intrinsic carrier concentration must remain less than 5 percent of the total electron concentration .What is the maximum temperature that the device may operate?3.52 Consider germanium with an concentration of Na=1015cm-3and a donor concentration of N d=0.Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of temperature over the range 200 ≤T ≤600 K.3,53 Consider silicon at T =300K with Na=0. Plot the position of the Fermi energy with respect to the intrinsic Fermi level as a function of the donor doping concentration over the range 1014≤N d≤1018cm-3.3.54 For a particular semiconductor,Eg=1.50eV,m*p=10m*n，T=300K，and ni=105cm-3. (a)Determine the position of the intrinsic Fermi energy level with respect to the center of the bandgap. (b)Impurity atoms are added so that the Fermi energy level is 0.45eV below the center of the bandgap .(i)Are acceptor or donor atoms added? (ii)What is the concentration if impurity atoms added?3.55 Silicon at T = 300 K contains acceptor atoms at a concentration of Na = 5 x1015cm-3 . Donor atoms are add forming an n-type compensated semiconductor such that the Fermi level is 0.215 eV below the conduction band edge .What concentration of donor atoms are added?3.56 Silicon at T = 300 K is doped with acceptor atoms at a concentration of Na = 7 x1015cm-3. (a) Determine E f-E v. (b) Calculate the concentration of additional acceptor atoms that must be added to move the Fermi level a distance kT closer to thevalence-band edge.3.57 (a) Determine the position of the Fermi level with respect to the intrinsic Fermi level in silicon at T = 300 K that is doped with phosphorus atoms at a concentration of 1015cm-3. (b) Repeat part (a) if the silicon is doped with boron atoms at a concentration of 1015cm-3. (c) Calculate the electron concentration in the silicon for parts (a) and (b).3.58 Gallium arsenide at T = 300 K contains acceptor impurity atoms at a density of 1015cm-3. Additional impurity atoms are to be added so that the Fermi level is 0.45 eV below the intrinsic level. Determine the concentration and type (donor or acceptor) of impurity atoms to be added.3.59 Determine the Fermi energy level with respect to the intrinsic Fermi level for each condition given in Problem 3.36.3.60 Find the Fermi energy level with respect to the valence band energy for the conditions given in Problem 3.37.3.61 Calculate the position of the Fermi energy level with respect to the intrinsic Fermi for the conditions given in Problem 3.48.Summary and Review3.62 A special semiconductor material is to be “designed. ” The semiconductor is tobe n type and doped with 1 x 1015 cm -3donor atoms . Assume complete ionization and assume N a=0. The effective density of states functions are given by N c=N v=1.5x1019cm-3 and ate independent of temperature .A particular semiconductor device fabricated with this material requires the electron concentration to be no greater than 1.01x1019cm-3 at T=400K. What is the minimum value of the bandgap energy ?译文第三章半导体的平衡(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37重复3.36砷化镓的问题3.38假设硅，锗，镓砷化物各有厘米的Nd = 1X1013 cm-3掺杂浓度和Na = 2.5 ×1014 cm-3在T = 300K. 对于每三种材料（一）这是N型还是P型材料？（二）计算N0和P0。
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半导体导论翻译(精)半导体导论 P124-125CHAPTER 3 The Semiconductor in Equilibrium(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37 Repeat problem 3.36 for GaAs.3.38 Assume that silicon, germanium, and gallium arsenide each have dopant concentrations of Nd = 1X1013 cm-3 and Na = 2.5 x 1014 cm-3 at T=300K.For each of the three materials(a) Is this material n type or p type?(b) Calculate n0 and p0.3.39 A sample of silicon at T =450K is doped with boron at a concentration 0f 1.5x1015cm-3and with arsenic at a concentration of 8 X 1014cm-3 .(a) Is the material n type or p type? (b) Determine the electron and hole concentrations .(c) Calculate the total ionized impurity concentration.3.40 The thermal equilibrium hole concentration in silicon at T = 300 K is p0=2x1015 cm-3 .Determine the thermal-equilibrium electron concentration .Is the material n type or p type?3.41 In a sample of GaAs at T = 200 K, we have experimentally determined that n0 = 5 p0 and that Na = 0. Calculate n0, p0, and N d.3.42 Consider a sample of silicon doped at N d = 1014 cm-3 and Na = 0 Calcu1ate the majority-carrier concentration at (a) T = 300 K, (b) T = 350 K,(C ) T = 400 K(d) T = 450 K, and (e) T = 500 K.3.43 Consider a sample of silicon doped at N d = 0 and Na = 1014 cm-3 .Plot the majority-carrier concentration versus temperature over the range 200≤T≤500K.3.44 The temperature of a sample of silicon is T = 300 K and the acceptor doping concentration is Na = 0. Plot the minority-carrier concentration (on a log-log plot) versus Nd over the range 1015≤N d≤1018 cm-3.3.45 Repeat problem 3.44 for GaAs.3.46 A particular semiconductor material is doped at N d = 2 x 1013 cm-3, Na = 0, and the intrinsic carrier concentration is ni = 2 x 1013cm-3. Assume complete ionization. Determine the thermal-equilibrium majority-and minority-carrier concentrations.3.47 (a) Silicon at T = 300 K is uniformly doped with arsenic atoms at a concentration of 2 x 1016cm-3and boron atoms at a concentration of 1 x1013 cm-3. Determine the thermal-equilibrium concentrations of majority andx1015cm-3 . Donor atoms are add forming an n-type compensated semiconductor such that the Fermi level is 0.215 eV below the conduction band edge .What concentration of donor atoms are added?3.56 Silicon at T = 300 K is doped with acceptor atoms at a concentration of Na = 7 x1015cm-3. (a) Determine E f-E v. (b) Calculate the concentration of additional acceptor atoms that must be added to move the Fermi level a distance kT closer to the valence-band edge.3.57 (a) Determine the position of the Fermi level with respect to the intrinsic Fermi level in silicon at T = 300 K that is doped with phosphorus atoms at a concentration of 1015cm-3. (b) Repeat part (a) if the silicon is doped with boron atoms at a concentration of 1015cm-3. (c) Calculate the electron concentration in the silicon for parts (a) and (b).3.58 Gallium arsenide at T = 300 K contains acceptor impurity atoms at a density of 1015cm-3. Additional impurity atoms are to be added so that the Fermi level is 0.45 eV below the intrinsic level. Determine the concentration and type (donor or acceptor) of impurity atoms to be added.3.59 Determine the Fermi energy level with respect to the intrinsic Fermi level for each condition given in Problem 3.36.3.60 Find the Fermi energy level with respect to the valence band energy for the conditions given in Problem 3.37.3.61 Calculate the position of the Fermi energy level with respect to the intrinsic Fermi for the conditions given in Problem 3.48.Summary and Review3.62 A special semiconductor material is to be “designed. ” The semiconductoris to be n type and doped with 1 x 1015 cm -3donor atoms . Assume complete ionization and assume N a=0. The effective density of states functions are given by N c=N v=1.5x1019cm-3 and ate independent of temperature .A particular semiconductor device fabricated with thismaterial requires the electron concentration to be no greater than1.01x1019cm-3at T=400K. What is the minimum value of the bandgapenergy ?译文第三章半导体的平衡(d) T = 400 K, N d = 0, N a = 1014 cm-3(e) T = 500 K, N d = 1014 cm-3, Na = 03.37重复3.36砷化镓的问题3.38假设硅，锗，镓砷化物各有厘米的Nd = 1X1013cm-3掺杂浓度和Na = 2.5 ×1014 cm-3在T = 300K.对于每三种材料（一）这是N型还是P型材料？（二）计算N0和P0。
3.39甲硅样品在T = 450K与硼掺杂浓度1.5x1015cm-3和砷浓度在8 ×1.5x1014cm-3。
（a）是n型或p物质类型？（二）确定的电子和空穴浓度。
（c）计算的总电离杂质浓度。
3.40在硅中的热平衡孔在T = 300 K的浓度为P0= 2x1015 cm-3。
确定热平衡电子浓度。