线路板pcb专业英语词汇(制造、测试、缺陷名等)
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
pcb专业术语英文及翻译
pcb专业术语英文及翻译摘要：本文介绍了PCB（Printed Circuit Board，印刷电路板）专业术语的英文表达和翻译，根据内容实际需求分为三大类：PCB制造术语、PCB组装术语和PCB测试术语。
在每个类别下，将列举相关术语及其英文表达和翻译，从而帮助读者更好地理解和运用PCB专业术语。
正文：I. PCB制造术语1. 单、双面板 (Single-sided, Double-sided board)单面板：一种仅在板的一侧进行布线和元件安装的印刷电路板。
双面板：一种在两侧布线和元件安装的印刷电路板。
2. 环氧树脂 (Epoxy Resin)环氧树脂是一种常用的PCB基材，具有良好的绝缘性和耐热性。
3. 铜盖膜 (Copper Foil)铜盖膜是覆盖在印刷电路板表面的一层铜箔，用于电气连接。
4. 阻焊层 (Solder Mask Layer)阻焊层是一种覆盖在印刷电路板表面的保护层，用于防止元件的误焊。
5. 玻璃纤维布 (Glass Fiber Cloth)玻璃纤维布是PCB制造中一种常用的增强材料，用于提高印刷电路板的强度和耐磨性。
6. 焊盘 (Pad)焊盘是印刷电路板上用于连接元件引脚的焊接区域。
7. 过孔 (Through-hole)过孔是印刷电路板上贯穿两侧的孔洞，用于连接不同电子元器件。
8. 排针 (Pin Header)排针是一种插针式连接器，常用于将PCB与其他设备连接。
9. 焊接 (Soldering)焊接是将电子元件与印刷电路板焊接在一起的一种连接方法。
II. PCB组装术语1. 表面贴装技术 (Surface Mount Technology, SMT)表面贴装技术是一种将电子元件直接焊接在印刷电路板表面的组装方法。
2. 波峰焊接 (Wave Soldering)波峰焊接是一种通过将印刷电路板浸入焊锡浪涌中来实现电子元件的连接。
3. 焊接膏 (Solder Paste)焊接膏是表面贴装技术中使用的一种黏性材料，用于在印刷电路板上确定元件的位置并进行焊接。
pcb工厂常用单词
pcb工厂常用单词
在PCB工厂中，一些常用的英文单词包括：
1.circuit board：电路板
2.printed circuit board：印刷电路板
3.PCBA：PCBA，是Printed Circuit Board Assembly的缩写，意思是印
刷电路板组装件
4.trace：迹线，表示电路板上的线路
5.trace width：迹线宽度，表示电路板上线条的粗细
6.trace spacing：迹线间距，表示电路板上两条线路之间的距离
yer：层，表示电路板上的不同导体层
8.dielectric：介质，表示电路板上的绝缘材料
9.via：导通孔，表示电路板上连接不同层导体的孔洞
10.drill hole：钻孔，表示电路板上用于安装元器件的孔洞
ponent：元器件，表示电路板上所安装的电子元件
12.resistor：电阻器
13.capacitor：电容器
14.inductor：电感器
15.transistor：晶体管
16.diode：二极管
17.LED：发光二极管
18.connector：连接器，表示电路板上连接不同部分之间的插座或插
头
19.jumper：跳线，表示用于连接不同部分的短导线
20.tooling hole：工具孔，表示电路板上用于安装治具的孔洞
21.mounting hole：安装孔，表示电路板上用于安装元器件的孔洞
以上仅是部分常用词汇，实际工作中还会涉及到更多专业术语和词汇。
pcb线路板专业英语(中英)
3
h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask)
化學蒸著鍍 圓周性之孔破 包夾金屬 無塵室 間隙 鍍外表 防焊覆蓋錯誤
8
coefficient of thermal expansion (CTE) 熱澎脹系數
cold solder joint
冷焊點
cold-weld
金屬粉末冷焊
color
顏色
color error
顏色錯誤
compensation
1
* Process Module 說明 :
A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size)
B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling)
突出
coordinate list
資料清單
copper claded laminates (CCL)
銅箔基板
copper exposure
線路露銅
加速試驗
中英文对照的PCB专业用语
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlay er printed board(mlb)13、多层印制电路板：mulitlay er printed circuit board14、多层印制线路板：mulitlay er prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilay er printed board19、挠性多层印制板：flexible multilay er printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilay er printed board, rigid-flex multilay er printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlay er37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlay er printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-lay ered film substrate(mfs)45、层间全内导通多层印制板：alivh multilay er printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：cataly zed board ,coated cataly zed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncataly zed laminate23、粘结层：bonding lay er24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover lay er (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ploy ester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：poly imide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：poly ester resin7、聚酰亚胺树脂：poly imide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acry lic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：sy nthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicy andiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated poly ester36、聚酯薄膜：poly ester37、聚酰亚胺薄膜：poly imide film (pi)38、聚四氟乙烯：polytetrafluoety lene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethy lene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft y arn52、经纱：warp y arn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish ey e68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of y arn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：poly armide fiber79、聚酯纤维非织布：non-woven poly ester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic poly amide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire lay out4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：lay out19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：lay out effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：phy sical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated lay er78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor lay er5、导线宽度/间距：conductor line/space6、第一导线层：conductor lay er no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any lay er inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
PCB缺陷英语汇总
PCB缺陷英语汇总open circuit 开路short circuit2短路circuit wist开路狗牙circuit nick3开路缺口circuit dent4开路凹痕plating Bloody5渗开pad nick6开开缺口I/L white spot7内开白斑poor B.O8黑化不良measling9爆板pinking ring10粉开圈press blister11开开起泡misregistation12开位shift13偏位no Cu on Pth14孔无开内hole burrs15孔毛刺内Cu on NPTH16NPTH有开exposed laminate17开面露基材dent on Cu surface18开面凹痕gum residue19胶开D/F nip20开膜under etching21开刻不尽line too thin22开幼hole oversize23孔大hole undersize24孔小hole misregistration25偏孔Cu nodule26开面瘤粒under developing27开影不尽scratch on Cu surface28开面刮开hole plugged29塞孔poor repairing30修理不良copper too thin31开薄I/L scratch 32内开擦花I/L misregistation33内开偏位I/L inclusions34内开开物film off35掉膜D/F meaking36干膜碎poor Sn stripping37退开不尽space too marrow38开隙小board too thin39板薄board too thickness40板厚pinhole41开孔breakout42崩孔undrcut43开开plating layer roughness44开开粗糙dull colour45开色lifted land46开开开起missing hole47漏开孔weave exposure48露布开hole misregistratiion49开偏孔hole damage50孔开害delamination51基材分开over etching52开刻开度hole too much53多孔remain Cu54残开laminate exposure in hole55孔露基材内pad break off56开开落脱pad dent 57开开凹痕pad bulge 58开开凸起pad damaged59开开开坏pad nick60开开缺口pad expose Cu61开开露开dent1板面凹痕I/L white spot2内开白斑circuit nick3开路缺口undering etching4开刻不开S/M peel off5开油剥离under developing6开影不开laminate measling7基材白点copper oxide8开面化氧s/m on pad9开油上开开c/m on pad10白字上开开poor S/M11阻开不良12开路擦花track scratchsn on circuit13开上开sn mass14聚开sn gray15开灰cu exposed on pad16开开露开sn on G/F17开上金手指G/F dent18金手指凹痕G/F scratch19金手指擦花G/F roughness20金手指粗糙poor V-cut21v-cut不良poor milling22倒开不良ET dent23开床开开poor touch up24拖开不良poor repairing Au25开金不良poor repairing s/m26开油不良pinhole27开孔paster stain28胶开burrs in hole29k孔毛刺内solder in hole30开珠入孔expose Cu31露开expose Ni32露开solder mask blister33开油起泡solder mask winbles34开油起开G/F oxiding35金手指化氧Au discoloration36金开色不良Au surface blister37金面凸起solder mask in hole38开油入孔board angle damafe39爆板warp40开板。
线路板PCB专业英语词汇(制造、测试、缺陷名等)
热固性
Clad
覆箔
Layup
叠层
laminating
层压
Postcure
后固化
Curing time
固化时间
Resinflow
树脂流动度
Resin content
树脂含量
PCB英语词汇（二）
3 设计
3.1 通用术语
Computer-aided design (CAD)
计算机辅助设计
导线宽度/ቤተ መጻሕፍቲ ባይዱ距
Conductor layer
导线层
Component hole
元件孔
Mountinghole
安装孔
Supported hole
支撑孔
Unsupported hole
非支撑孔
Via
导通孔
Plated through hole
镀通孔
Blind via (hole)
盲孔
Buried via (hole)
消泡剂
resolution
分辨率
definition
逼真度
ghost image
重影
halation
晕环
air inclusion
夹杂气泡
tackiness
粘着性
post cure
后固化
shelf life
保存期
pot life/ working life
适用期
dip coating
浸涂法
roller coating
网版印刷
Silk screen
丝印网版
Stencil
网版
Screenability
PCB专业用语
18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilay er printed board20、挠性印制板：flexible printed boar d21、挠性单面印制板：flexible single-s ided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed ci rcuit (fpc)24、挠性印制线路：flexible printed wi ring25、刚性印制板：flex-rigid printed bo ard, rigid-flex printed board26、刚性双面印制板：flex-rigid doubl e-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multil ayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring pri nted board40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polya32、陶瓷印制板：ceramic substrate pri nted board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiri ng board36、顺序层压多层印制板：sequentially -laminated mulitlayer37、散线印制板：discrete wiring boar d38、微线印制板：micro wire board39、积层印制板：buile-up printed boar d40、积层多层印制板：build-up mulitla yer printed board (bum)41、积层挠印制板：build-up flexible p rinted board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed b oard44、多层膜基板：multi-layered film s ubstrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother boardmide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copperfoil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copperfoil (rcc)96、复合金属箔：composite metallicmaterial97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aidedmanufacturing.(cam)8、计算机集成制造：computer integratmanufacturing.(cim)9、计算机辅助工程：computer-aided e49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-coppe r board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid c ircuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component sidengineering.(cae)10、计算机辅助测试：computer-aidedtest.(cat)11、电子设计自动化：electric designautomation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aidedarchitectural design. (aaad)14、计算机辅助制图：computer aideddrawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominantaxis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive patte rn81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade ma terial4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided co pper-clad laminate6、双面覆铜箔层压板：double-sided c opper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core c opper-clad laminate10、金属基覆铜层压板：metal base co pper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible co pper-clad dielectric film12、基体材料：basis material41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bond ing sheer16、环氧玻璃基板：epoxy glass substr ate17、加成法用层压板：laminate for ad ditive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coat ed dielectric film26、无支撑胶粘剂膜：unsupported adh esive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surfac e五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole。
PCB专业术语翻译(英语)
PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PW A Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
PCB专业英语
综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine des criptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB工程部专业英语词汇(参考模板)
PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to 28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET（electrical test）cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.避免：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size 88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width118.线距：line spacing 或者trace spacing119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer 148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts 155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem. silver) 160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map 182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out 197.一般性阻焊油墨general resist ink 198.孔位错误mis hole location 199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle 208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up226.品质等级quality classification227.对位孔registration228.拒收rejectable229.树脂含量resin content230.排列电阻resistor network231.锣刀（铣刀）routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing238.间距不足spacing non-enough239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress242.厚度分布thickness distribution243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching) N-7 除胶渣(Desmear)N-8 微蚀(Microetching )---精心整理，希望对您有所帮助。
PCB专业英语词汇
PCB专业英语词汇一．Process 工艺流程1．Board cut /开料2．Drill /钻孔3．IQC(Incoming Quality Control) /来料检查4．PTH(Plated Through Hole) /沉铜5．Panel Plating /整板电镀6．D/F(Dry Film) /干膜7．Pattern Plating /图形电镀8．ETCH /蚀刻9．QC (Quality Control) /品质检查10.W/F(Wet Film) /湿膜11.Legend /字符12.HAL(Hot Air Leveling) /喷锡13.Immersion gold (chemical gold) /沉金14.Routing /锣15.V-CUT /V刻16.Punting /啤17.Rinse /清洗18.FQC(Final Quality Control) /终检19.QA Audit /审核20.Package /包装21.Shipment /出货ship out二．The items For QA1.PQC(Process Quality Control) /过程品质检查2.IPQC(In Process Quality Control) /过程控制检查3.First Article check /首件检查4.Backlight /背光检查5.Microsection /切片检查6.Etch Factor /蚀刻系数7.Tape test /胶纸实验8.Lot check /批检9.Full check /全检10.Sampling check /抽检11.Customer /客户12.Date code /日期代码13.AQL level(Average Quality Level) /AQL水平14.Sample size /抽样数15.Lot size /批量数16.Visual check /目视检查17.Logo /商标18.Solder side /焊接面ponent side /元件面20.Gold tape test /金层结合力实验21.S/M tape test /绿油结合实验22.C/M tape test /字符结合实验23.Impedance test /阻抗测试24.Wetting test(solder ability test) /可焊性实验25.Specimen 样板，样品26.Outgoing Report(shipment report) 出货报告27.ACC(Accepted) 可接受28.Rej (Rejected) 拒收29.Pass 过30.UAI(Use As Is) 特采（让步接受）31.Defect 缺陷32.Corrective Actions 纠正措施33.MRB(Material Review Bcard) 物料审核委员会34.Customer Complain 客户投诉35.DCC(Document Control Center) 文控中心三．The items for Engineering Department1.Engineering Department工程部2.QE: Quality Engineering 品质工程师3.MI: Manufacturing Instruction生产指引4.ECN: Engineering Change notice 工程变更通知5.Template 模板6.E/T Fixture测试架7.Ground Layer地层8.Inner Layer内层9.Dummy Pad(inner layer)假PAD10.Artwork Check11.Pattern12.Pattern Artwork13.S/M Artwork14.Legend Artwork字符非林15.Carbon Artwork16.CAD: Computer Assistant Design17.CAM: Computer Assistant Manufacturing18.MI Audit19.Tolerance20.Second Drill21.Tenting22.certificate / 证书23.clear / 清除24.client / 客户25.samples 样板/样品四．Y ear or week and month1.week:星期2.Monday1:星期3.Tuesday4.Wednesday5.Thursday6.Friday7.Saturday8.Sunday/first day9.month:月10.January 1月11.February 2月12.March 3月13.April 4月14.May 5月15.June 6月16.July 7月17.August 8月18.September 9月19.October 10月20.November 11月21.December 12月五Other one glossary1. Guarantee 保证2. Calibration 刻度3. hole 孔，洞。
pcb英文术语
pcb英文术语
以下是一些PCB（Printed Circuit Board，印刷电路板）的英文术语：
1. PCB：Printed Circuit Board，印刷电路板
2. SMD：Surface Mount Device，表面贴装器件
3. BGA：Ball Grid Array，球栅阵列
4. FPGA：Field Programmable Gate Array，现场可编程门阵列
5. DIP：Dual In-line Package，双列直插封装
6. PTH：Plated Through Hole，贯穿孔
7. VIA：Vertical Interconnect Access，垂直互连通孔
8. NC：No Connection，未连接
9. Pads：焊盘
10. Gerber File：Gerber文件，包含PCB设计图层信息的文件格式
11. Silk Screen：丝网印刷，用于标记元件位置或文字的印刷层
12. Copper Trace：铜线追踪，指PCB上的导线路径
13. Solder Mask：焊盘阻焊层，用于保护焊盘和其他不需要焊接的区域
14. Component Footprint：元件封装，描述组件在PCB上的安装尺寸和引脚布局
15. ESD：Electrostatic Discharge，静电放电
希望这些术语能对您有所帮助！如果您有其他问题，请随时提问。
PCB_中英文对照的PCB专业用语
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【转帖】中英文对照的PCB专业用语
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专业英语
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chenxin-nust308
0# 只看作者 发表于：2007-1-8 21:17:00
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30、 去铜箔面：foil removal surface 31、 层压板面：unclad laminate surface 32、 基膜面：base film surface 33、 胶粘剂面：adhesive faec 34、 原始光洁面：plate finish 35、 粗面：matt finish 36、 纵向：length wise direction 37、 模向：cross wise direction 38、 剪切板：cut to size panel 39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad lami 40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad lamin 41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-cla 42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, gla 43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven gla 44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-cla 45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper 46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/e mimates 47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copp 48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad la 49、 超薄型层压板：ultra thin laminate 50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、 紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates
PCB工程部专业英语词汇
PC吐程部专业英文词汇词汇1.板料: material2.最低限度:minimum 或者min.3.最大限度: maximum 或者max.4.基准点（零点）datum point5.周期Date code6.V-cut 余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孑L塞plug hole13.要求requirement14.缺少miss15.偏公差uneven toleranee16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19•金手指斜边bevel of G/F20.制程能力process capability21•建议，暗示suggest22.确保ensure23.满足，达到meet25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于 3mil less than 3mil32.高于 3mil more than 3 mil33.压合结构 stacking structure 或者 stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与…同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：con firm agai n44.工程问题：engineering query (EQ)45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：con tact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET (electrical test ) cost51.通断测试：Open and short testing52.参考：refer to53.IPC 标准：I PC standard54.I PC 二级：IPC class 255.可接受的：acceptable56.允许：permit57.希9造：manufacture 或者fabricate58.修改：revision59.公差：toleranee60.忽略：ignore61.工具孑L： tooling hole62.安装孑L： mounting hole63.元件孑L： component hole64.槽孔：slot hole65.由E票孑L： snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孑L： buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孑L位：hole location72.避免：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.肖U铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点：fiducial mark84.不同：be differe nt from (differ from)85.内弧：in side radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸：panel size89.铳，锣：routing90.铳刀:router 或者Routing bit93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：com er mark113.特性阻抗：characteristic impedanee 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width 118.线住巨：lin e spaci ng 或者trace spaci ng 119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change 123.相类似：similar to 124.规格：specification 125.下移：shift down126.垂直地：vertically 127.水平的：horizontally 128.增大：in crease129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow a nd twist138.夕卜层：outer layer 或者external layer139.内层：inn er layer 或者intern al layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：lege nd layer (silkscree n layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carb on I ayer149.夕卜形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts 155.金手指：Gold-finger156.防氧化：Entek (OSP)159. 沉银：Immersion Silver (chem. silver) 160. 单面板:single sided board161. 双面板:double sided board162. 多层板:multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铳：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170•倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant 174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad 181.分孔图：drill chart 或者drill m即182.度数：degree183.被…覆盖：be covered with 184.负公差：minus toleranee185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedanee trace190.评估estimate191.玻纤显露Fiber Exposure 192.底铜base copper 193.工作搞working Gerber 194.原稿original art work 195.放宽relax196.挖空blanking 或者cut-out197.一般性阻焊油墨general resist ink198.孑L位令昔误mis hole location199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.力卩大Enlarge207.压合周期press cycle208.毛边serrated edges209.跳印，漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路，网络network222.缺口nick223.氧化oxidation224.剥离（剥落）peeling off225.补线不良poor touch-up 226.品质等级quality classification 227.对位孑L registration 228.拒收rejectable4树脂含量 resin content排列电阻 resistor n etwork锣刀（铳刀）routing bit 孔内沾文字 S/Lon hole孑L 内绿漆 S/M on hole线路沾锡 solder on trace金手指沾锡 solder on G/F废框 scrap 圭寸孔处理 sealing间住巨不足 spaci ng non-eno ugh靶位孔 target hole测试线路 test circuit热应力试验 thermal stress厚度分布 thickness distribution薄基板，内层板 thin core 线路缺口及针孔track nick & pin hole裁切线 trim line 真平整 true leveling 真正位置的孑L true position万用型 un iversal气化室 vaporizer仓库 warehouse契尖角 wedge angle线细 width reduce良率 yield渗铜，渗入，灯芯效应 wicking允收 acceptable 试样点 coup on locati on经核准的，被认可的 approved 超越胜过，超过其他 exceed 牛皮纸 kraft paper 孑L 壁破铜 Hole void孑L 位破出 Hole breakout229.230. 231. 232. 233. 234. 235. 236. 237. 238. 239. 240. 241. 242. 243. 244. 245. 246. 247. 248. 249. 250. 251. 252. 253. 254.255.256.257.258.PC吐产一经典流程一英文培训教程A.开料(Cut Lamination)a-1 裁板(Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B.钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C.干膜制程(Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检(Touch-up)c-8化学前处理，化学研磨(Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing) c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D.压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3钏钉组合(eyelet)d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化(Black Oxide Removal)d-8 铳靶(spot face)d-9 去溢胶(resin flush removal)E.减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F.电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀(Tin-Lead Plating ) (Pattern Plating) f-3 低于1 mil ( Lessthan 1 mil Thickness ) f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding) f-6 剥锡铅(Tin-Lead Stripping) f-7 微切片(Microsection)G.塞孔(Plug Hole) g-1 印刷(Ink Print) g-2 预烤(Precure) g-3表面刷磨(Scrub) g-4 后烘烤(Postcure)H.防焊(绿漆/绿油):(Solder Mask) h-1 C 面印刷(Printing TopSide)h-2 S 面印刷(Printing Bottom Side) h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment) h-5 预烤(Precure) h-6 曝光(Exposure)h-7 显影(Develop) h-8 后烘烤(Postcure) h-9 UV 烘烤(UV Cure)h-10 文字印刷(Printing of Legend ) h-11 喷砂(Pumice)(WetBlasting) h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Goldplatingi-1 金手指镀K金(Gold Finger)i-2 电镀软金(Soft Ni/Au Plating)5i-3 浸IM金(Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling) j-2 垂直喷锡(Vertical Hot Air Solder Leveling) j-3 超级焊锡(SuperSolder) j-4.印焊锡突点(Solder Bump) K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V 型槽(V-Cut)(V-Scoring)k-5 金手指斜边(Beveling of G/F)L.开短路测试(Electrical Testing) (Continuity & Insulation Testing) 1-1 AOI 光学检查(AOI Inspection)I-2 VRS 目检(Verified & Repaired)I-3泛用型治具测试(Universal Tester)I-4 专用治具测试(Dedicated Tester)I-5 飞针测试(Flying Probe)M. 终检(Final Visual Inspection) m-1 压板翘(Warpage Remove) m-2 X-OUT 印刷(X-Out Marking) m-3 包装及岀货(Packing & shipping) m-4 目检(Visual Inspection)m-5 清洗及烘烤(Final Clean & Baking) m-6 护铜剂(ENTEKCu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test "Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing) m-9 焊锡性试验(Solderability Testing ) N. 雷射钻孔(LaserAblation)N-1 雷射钻Tooling 孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask 制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AO I 检查及VRS (AO I Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching)6。
线路板PCB专业英语词汇(制造、测试、缺陷名等)
铜箔面
Foil removal surface
去铜箔面
Length wise direction
纵向
cross wise direction
横向
Core material
内层芯材
2.2基材的材料
A-stage resin
A阶树脂
B-stage resin
B阶树脂
Job traveller
工作流程单
4.2照相底版制作
Artwork
照相底图
Phototool
照相底版
Artwork master
照相原版
Working master
工作原版
Production master
生产底版
Photographic film
照相底片
Silver film
银盐底片
Diazo film
Flexible printed circuit board
挠性印制电路板
Flex-rigid printed circuit board
挠性印制电路板
Build-up printed board
积层印制板
Surface laminar circuit (SLC)
表面层合电路板
B2it printd board
circuit board (SSB)
单面印制电路板
double-sided printed
circuit board (SSB)
双面印制电路板
Multilayer printed
circuit board (MLB)
多层印制电路板
Rigid printed circuit board
中英文对照的PCB专业用语
1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copperfoil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
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PCB英语词汇(一）1. 综合词汇Printed circuit 印制电路Printed wiring 印制线路Printed circuit board 印制电路板Printed wiring board 印制线路板Printed component 印制元件Printed contact 印制接点Single-sided printedcircuit board (SSB) 单面印制电路板double-sided printedcircuit board (SSB)双面印制电路板Multilayer printedcircuit board (MLB)多层印制电路板Rigid printed circuit board 刚性印制电路板Flexible printed circuit board 挠性印制电路板Flex-rigid printed circuitboard挠性印制电路板Build-up printed board 积层印制板Surface laminar circuit (SLC) 表面层合电路板B2it printd board埋入凸块互连印制板ALIVH Multilayerprintd board层间全内导通多层印制板Chip on board (COB) 载芯片板Backplane 背板Bare board 裸板Break-away board 可断拼板Interconnection 互连Conductor race line 导线Substrate 基底Real estate 基板面Conductor side 导线面Component side 元件面Solder side 焊接面Printing 印制grid 网格pattern 图形Conductive pattern 导电图形Non- conductive pattern非导电图形Legend 字符Mark 标志2．基材2.1 基材的种类和结构Base material 基材Laminate 层压板Copper-clad laminate (CCL) 覆铜箔层压板Prepreg 预浸材料Bonding sheet/bonding layer 粘结片Epoxy glass substrate 环氧玻璃基板Copper-clad surface 铜箔面Foil removal surface 去铜箔面Length wise direction 纵向cross wise direction 横向Core material 内层芯材2.2 基材的材料A-stage resin A 阶树脂B-stage resin B 阶树脂C -stage resin C 阶树脂epoxy resin 环氧树脂Polymer 聚合物Photosensitive resin 感光性树脂Thermosetting resin 热固性树脂Thermoplastic resin 热塑性树脂Adhensive 胶粘剂Curing agent 固化剂Flame retardant 阻燃剂opaquer 遮光剂Polyester film (PET) 聚酯薄膜Polyimide film (PI) 聚酰亚胺薄膜Polytetrafluoetylene聚四氟乙烯Non-woven fabric 非织布/无纺布(PTFE)Glass fiber 玻璃纤维Glass fabric 玻璃布Warp-wise 经向Weft-wise 纬向Copper foil 铜箔Eletrodeposited copper foil 电解铜箔Rolled copper foil 压延铜箔Resin coated copper foil (RCC) 涂树脂铜箔2.3 基材的制造Polymerize 聚合Thermoplastic 热塑性Thermoset 热固性Clad 覆箔Layup 叠层laminating 层压Postcure 后固化Curing time 固化时间Resinflow 树脂流动度Resin content 树脂含量PCB英语词汇（二）3 设计3.1 通用术语Computer-aided design (CAD) 计算机辅助设计Computer-aidedmanufacturing (CAM)计算机辅助制造Routing 布线Layout 布图设计Component density 元件密度Arry 阵列3.2 形状与尺寸Conductor 导线Conductor width 导线宽度Conductor spacing 导线间距Conductor width/space 导线宽度/间距Conductor layer 导线层Component hole 元件孔Mounting hole 安装孔Supported hole 支撑孔Unsupported hole 非支撑孔Via 导通孔Plated through hole 镀通孔Blind via (hole) 盲孔Buried via (hole) 埋孔Buried/ blind via 埋/盲孔Any layer inner via hole(ALIVH)任意层内部导通孔Tooling/ pilot hole 定位孔Landless hole 无连接盘导通孔Via-in-pad 在连接盘中导通孔Pitch 节距Fine pitch 精细节距3.3 电气互连Interfacial connection 表面间连接Interlayer connection 层间连接Innerlayer connection 内层连接Pad, land 连接盘Component lead3.4其他Primary side 主面Secondary side 辅面Signal layer 信号层Crosstalk 串扰Capacitance 电容Electromagneticinterference(EMT)电磁干扰Electromagneticshielding电磁屏蔽Impedance 特性阻抗Inductance 电感Coplanarity 共面性（度）Core material 芯板Thin type multilayer board 薄型多层板Buried and blind via hole mutilayer board 埋/盲孔多层板Buried bump interconnectiontechnology (B2it)嵌入凸块互连技术Multichip module (MCM) 多芯片模块Alignment mark 对准标记Registration mark 对位标记Layer to layer registration 层间重合度PCB英语词汇（三）4. 制造 4.1 通用术语Subtractive process 减成法Additive process 加成法Semi-additive process 半加成法Full-additive process 全加成法Solder mask on bare copperBuild up process 积层法裸铜覆阻焊工艺(SMOBC)Tenting 掩蔽法Sequential lamination 顺序层压法Wet process 湿处理Panel plating process 板面电镀法Pattern plating process 图形电镀法Finishing 最终修饰Reworking 返工Tooling feature 工艺标识Panel 在制板，拼板First article 首板Prototype 试样板End product 最终产品Process flow 工艺流程Process window 工艺范围Lot size/ batch 批量Job traveller 工作流程单4.2 照相底版制作Artwork 照相底图Phototool 照相底版Artwork master 照相原版Working master 工作原版Production master 生产底版Photographic film 照相底片Silver film 银盐底片Diazo film 重氮底片Positive 正像Positive pattern 正像图形Negative 负像Negative pattern 负像图形Photo plotting 光绘图Laser platting 激光绘图Gerber file Gerber文件Photoplotter 光绘机Laser plotter 激光绘图机Registration mark 定位标记4.3 图形转移Printing ink 印料Etching resist ink 抗蚀印料Plating resist ink 耐电镀印料Resist 抗蚀剂Photo resist 光致抗蚀剂Dry film photoresist 干膜光致抗蚀剂Liquid photoresist 液体光致抗蚀剂Positive-acting resist 正性抗蚀剂Negative-acting resist 负性抗蚀剂Plating resist 耐电镀抗蚀剂Plated resist 抗蚀镀层Permanent resist 永久性保护层Electro-deposited电沉积光致抗蚀剂Mask 掩膜photoresistSolder resist、solder mask 阻焊剂Solder mask ink 阻焊印料Liquid photosensitive液体光致阻焊剂Dry film solder mask 阻焊干膜solder resistMarking ink、legend ink 标记印料Conductive paste 导电膏Hole filing ink 堵孔油墨Peelable solder mask ink 可剥性防焊油墨Thermally curable、heat cured 热固化Ultraviolet curable (UVcured)紫外线固化Screen printing 网版印刷Silk screen 丝印网版Stencil 网版Screenability 网印能力Chase、frame 网框Fabric、cloth 丝网Mesh count 网目数Squeegee 刮板PCB英语词汇（四）（续上一页）Skip printing 漏印Thinner、diluent 稀释剂Viscosity 粘度Imaging 成像Imaging transfer 图像转移D ry film imaging 干膜制图形Lamination 贴膜Wet lamination 湿法贴膜Exposure 曝光holding time 停留时间developing 显影developer 显影液anti-foamer/anti-foaming agent消泡剂resolution 分辨率definition 逼真度ghost image 重影halation 晕环air inclusion 夹杂气泡tackiness 粘着性post cure 后固化shelf life 保存期pot life/ working life 适用期dip coating 浸涂法roller coating 辊涂法spray coating 喷涂法curtain coating 帘幕法laser direct imaging 激光直接成像4.4清洗与蚀刻rinsing / rinse 水洗electrolytic cleaning 电解清洗alkaline degreasing 化学除油e lectrolytic degreasing 电解除油overflow 溢流deionized water 去离子水surface active agent /surfactant 表面活性剂surface tension 表面张力wetting 润湿wetting agent / wetter 润湿剂tarnish 污化drag in/ drag out 带进/带出brushing / scrubbing 磨刷abrasive 磨料scrubber 磨刷机mechanical cleaning 机械清洗chemical clearing 化学清洗p umice power 浮石粉/火山灰sand blasting 喷砂deburring 去披峰/去毛刺mechanical polishing 机械抛光c hemical polishing 化学抛光electropolishing 电抛光etchant 蚀刻剂/蚀刻液under etch 侧蚀microetch 微蚀over etching 过腐蚀stripper 剥离液bright dip 浸亮4.5 电镀和涂覆Plating 镀覆electrochemistry 电化学electrolyte 电解质electrolytic solution 电解液electrochemical corrosion 电化学腐蚀chemical corrosion 化学腐蚀ionization 电离migration 迁移solubility 溶解度addition agent/additive 添加剂brightening agent/brightener 光亮剂levelling agent 整平剂catalyst/catalyzer 催化剂activator/activatingagent活化剂acceleration agent/accelerator 增速剂chelating agent/chelant 螯合剂complex 络和物swelling agent/sweller 膨松剂plasma 等离子体e lectroplating 电镀metal electroplating 金属电沉积bright plating 光亮电镀PCB英语词汇（五）（续上一页）alloy plating 合金电镀strike plating 冲击镀flash/flashplating闪镀pulse plating 脉冲电镀rack plating 挂镀barrel plating 滚镀brush plating 刷镀selective plating 选择性电镀Auxiliary anode 辅助阳极Auxiliary cathode 辅助阴极Preplating 镀前处理Postplating 镀后处理Plating up 电镀加厚Pattern plating 图形电镀Panel plating 整板电镀Copper (electro) plating 电镀铜Tin-lead plating 电镀锡铅Plating line 电镀线Electrolessplating,electrolessdeposition无电电镀Immersion plate 浸镀Plated through hole 孔金属化Electroless copperplating化学沉铜Direct plating 直接电镀Roughening 粗化Activating 敏化Catalyzing 催化Mentallization 金属化Acceleration 增速Chemisorption 化学吸附Swelling 溶胀Hole conditioning 整孔Hole cleaning 洗孔Desmear, smearremoval去钻污Etchback 凹蚀Plasma desmear 等离子去钻污passivation 钝化acid dipping 弱浸蚀pickling 强浸蚀hot melting 热熔fusing fluid 热熔液solder levelling 焊料整平tin immersion 浸锡solder 焊锡solder coat 焊锡涂层flux 助焊剂preflux 预焊剂organicsolderabilitypreservatives(OSP)有机保护剂black oxidation 黑氧化brown oxidation 棕氧化Pink ring 粉红圈（环）pits 麻点peeling 起皮blister 起泡orange peel 桔皮pores 针孔porosity 孔隙率hardness 硬度tarnish 金属变色4.6机械加工和压制drilling 钻孔numerical control (NC) 数控back-up 垫板entry material 盖板spindle 主轴ring / collar 钻套feed rate 进给速率off set 钻面不匀resin smear 树脂钻污foil burr 铜箔毛刺break-out 破出hole counter 数孔机laser via hole 激光钻孔photo via hole 光致穿孔plasma via hole 等离子穿孔counterboring 沉头孔（埋头孔）countersinking 锥形孔platen 热压板opening/daylight 开档press plate 压模板bonding layer /粘结层kraft paper 牛皮纸bonding sheetlamination void 层间空洞dent 凹蚀crease 皱褶punching 冲切bugle hole 冷冲die 冲模shearing / cutting 喇叭孔routing 铣切bevelling 倒斜边chamfer 倒角scoring 刻槽V cut Ｖ槽切割Sewing hole 缝纫孔Fixture 夹具Indexing hole 基准孔Tooling feature 定位特征PCB英语词汇（六）（续上一页）5．检测5.1 通用术语inspection 检验test 试验as received 验收态production board 成品板test board 测试板coupon 附连板qualificationtesting鉴定试验acceptance tests 验收试验accelerated test 加速试验aging 老化qualityconformancetesting质量一致性试验 storage life 贮存期specification 规范standard 标准tolerance 容差/公差nonconformity 不合格nonconforming item(unit)不合格品defect 缺陷sampling inspection 抽样检验acceptable qualitylevel (AQL)可接收质量水平5.2外观和尺寸visualexamination/visualinspection目检blister 起泡blow hole 气孔bulge 凸起cracking 裂缝crazing 微裂纹burr 毛刺dishdown 凹陷measling 白斑delamination 分层dent / indentation 压痕fiber exposure 露纤维wrinkle 皱褶haloing 晕圈hole breakout 破环void 空洞hole void 孔壁空洞foreign material （基材内）外来物lifted land 连接盘起翘nail heading 钉头nick 缺口nodule 结瘤pin hole 针孔pit 麻点resin recession 树脂凹缩scratch 划痕bump 凸瘤laminate void 层压空洞mealing 粉点shadowing / etch back 凹蚀阴影5.3 电性能Surface insulation表明绝缘电阻Dielectric constant 介电常数resistance (SIR)Dielectric介电强度Dielectric breakdown 介电击穿strengthDielectric耐电压Metal migration 金属迁移withstandingvoltageElectro migration 电迁移Known good board (KGB) 已知好板PCB英语词汇（七）（续上一页）5.4 非电性能Bond strength 粘合强度 Pull-off strength 拉脱强度 Pull-out strength 拉出强度 Pull strength 拉离强度 Peel strength剥离强度Flexural strength 弯曲强度 Tensile strength 拉伸强度 Shear strength 剪切强度 Torsional strength 抗扭强度 Hole pull strength 孔拉脱强度 Pull away 拉离 Tear strength 撕裂强度 Bow弓曲Twist扭曲Coefficient of thermalexpansion (CTE) 热导率Dimensional stability 尺寸稳定性Machinability 机械加工性 Heat resistance 耐热性 Thermal stress 热应力 Thermal shock 热冲击 Substrate bending test基板弯曲试验 Bendability 弯曲能力 Fatigue life疲劳寿命Fatigue limit 疲劳极限 Fatigue strength 疲劳强度 Abrasion resistance 耐磨(擦)性Wear resistance 耐磨(损)性 Crease 褶痕 Solderability 可焊性 Wetting 焊料润湿 Dewetting 半润湿 Nonwetting 不润湿 Microsectioning 显微剖切Porosity test 孔隙率试验 Cleanliness 清洁度 Ionic cleanliness离子清洁度Ionizable contaminant 离子污染 Nonionic contaminant 非离子污染 Organic contamination 有机污染Outgassing排气Self-extinguishing 自熄性Chemical resistance 耐化学性bleeding渗出6. 组装surface mount technology (SMT)表面组装技术 surface mountcomponent (SMC)表面组装元件chip scale package (CSP) /chip scale mounting 芯片级组装flip chip package (FCP)倒芯片封装soldering焊接reflow soldering再流焊wave soldering 波峰焊assembly density 组装密度lead 引线lead foot / lead 引脚（腿）lead pitch 引脚节距fine pitch devices(FPD)精细节距器件node 连接节点chip carrier 芯片载体ball grid array(BGA)球栅阵列chip / die / dice 裸芯片flip chip 倒装芯片active devices (parts) 有源器件passive devices(parts)无源器件embedded component 埋入元件add-on component 附加元件integrated circuit(IC)集成电路resin flux 树脂（松香）助焊剂bond 焊（连）接electricalbridging电桥接dross 焊渣residue 残留物stress relief 消除应力印制电路技术英语缩略语ALIVH (any layer inner via hole) 任意层内部导通孔AOI (automatic optional inspection) 自动光学检验BGA (ball grill array) 球栅阵列BUM (build-up multilayer) 积层式多层板BUT (build-up technology) 积层式技术CAM (computer aided manufacturing) 计算机辅助制造CCL (copper clad laminate) 覆铜箔层压板CMT (chip mount technology) 芯片安装技术CNC (computer numerical control) 计算机数字控制COB (chip-on-board) 载芯片板CPCA (China Printed Circuit Association) 中国印制电路行业协会CSP (chip scale packaging) 芯片级封装DI (direct imaging) 直接成像法DIW (deionized water) 去离子水DSB (double-sided board) 双面印制板DP (delivered panel) 发货拼板EMI (electromagnetic interference) 电磁干扰EMS(electronic manufacturing service) 电子制造部门FCP (flip chip packaging) 倒芯片封装FPT (fine-pitch technology) 精细间距技术HAL (hot air levelling) 热风整平IC (integrated circuit) 集成电路IPC (institute for interconnecting andpackaging electronic ciruit (US)) （美国）电子电路互连与封装协会IVH (inner (interstitial) via hole) 内部导通孔KGB (known good board) 已知好板LCD (liquid crysal display) 液晶显示器MCM (multichip module) 多芯片组件/多芯片模块MLB (multilayer board) 多层板NC (numerical control) 数字控制OEM(original equipment manufacturer) 原设备制造商OSP (organic solderability preservatives) 有机保护剂PC (process control) 过程控制PI (polyimide) 聚酰亚铵PTFE (polytetrafluoetylene or teflon) 聚四氟乙烯（特氟隆）PTH (plated through hole) 镀通孔/金属化孔PWA (printed wiring assembly) 印制线路组装件PWB (printed wiring board) 印制线路板PCB? (printed circuit board) 印制电路板RCC (resin coated copper foil) 涂树脂铜箔RFI (radio-frequency interference) 射频干扰SMOBC (solder mask on bare copper) 裸铜箔阻焊工艺SMT (surface mounting technology) 表面安装技术SPC (statistical process control) 统计过程控制TG (glass transition temperature) 玻璃化温度。