锡膏印刷作业指导书

O(65xxB),P(65xxC),Q(65xxD),R(65xxE) ,S(65xxF), T(65xxG),U(91xx); V(86xx),W(83xx),X(83xxA); Y=(89xx); 2.2 If print parameter exceeds SPEC,ME engineers have to change and make another WI,then IE issue the newest WI. 3、Part No.： 3.1 CUSTOMER PART NO:
Program Name Y81030T1
清洁频率1 (Clean Rate1)
7
清洁频率2 (Clean Rate2)
14
Station No. Prepared Date
分离速度 (Separation
Speed)
分离距离 (Separation Distance)
0.2mm/sec
0.8mm
治 工 具(TOOL / FIXTURE)
作 业 指 导 书 (WORKING INSTRUCTION )
MODEL:
PCA VER.
PCB VER
PCB P/N
Process Stat
P12-8981100
锡膏印刷(SOLDER PRINT)
线 别 ： LINE
U
机 型 : HELLER 1800EXL
程序名称 (Program Name)
pattern, then the foreman have to check it with SMT checklist. Setting tooling pin refer the procedure as below: Step operation until PCB loading to M/C ,and table lift , then loose the snugger, replace with the tooling pin pattern , then operator can adjust with the pattern 5.3 Use stencil must check direction,the arrow should be left to right and Pcb direction must same as stencil. 5.4 Only M.E. and Test OK Of Person can be adjusted by line operators with the limits above ,but if the parameters mightbe adjusted over the limits by some reasons, inform the supervisor . The adjusted parameters should be recorded in the daily downtime report,and tell the next shift . Do not adjust the other parameters. 5.5 Before using the stencil, you should check the version and if the stencil is clean . Before and after using he stencil, use the stencil washer(SAWA) to clean it and manually remove the solder powder on the stencil；after cleaning ,return the stencil to warehouse. 5.6 After setting up the stencil , and start to print the 1st PCB, need to press F1 , and in the end of print stroke,
4. Support Pin Ver:1.0 2、 Program Name: abbcccde(abb-model, ccc-model version ;d-T(TOP), B(BOT);e=Program Version)
2.1 abbcccde : a-A(61xx),B(63xx),C(65xx),D(69xx),E(88xx),F(22xx),G(81xx),H(82xx),I(63xxA),J(63xxB),K(63xxC),L(63xxD),M(63xxE),N(65xxA),
钢板名称
钢板版本 钢板厚度
(Stencil Name) (Stencil (Stencil
Revision) Thickness)
钢板大小 (Stencil Size)
刮刀长度
刮刀速度
(Squeegee Length) (Squeegee Speed)
刮刀压力 (Squeegee Pressure)
(Board Thickness) (Clean after knead)
(Clean after
(Clean after)
(DRY clean
(WET clean speed)
(VAC clean speed)
0mm
1.5mm
W/V/D
W/V/D
3 minute
30 mm/s
30mm/sec
15mm/sec
作业人员先取一空板以step方向直至table上升，顶针与轨道平行后，再将head上升及放松板夹及PCB 取出后，人员再以顶针位置图平放于轨道及顶针上作调整。 5.3 钢板放入时须注意流向，箭头流向由左到右，PCB流向须与钢板流向相同。 5.4 只有ME,EE或生产线指定人员可依上列范围修改参数，但若有特殊制程改变须作超出范围之修改时， 须由ME实验确认后，修改WI。严禁任何未经ME确认之温度参数设定。 5.5 钢板使用前需核对版本是否正确，外观是否完好、清洁。使用前、后用钢板清洗机洗净并将已硬化之 锡垢刮除,钢板清洁后置回钢板管理室。 5.6 钢板架设完毕,印刷FIRST PCB 时,先按F1 RUN 开始印刷,再按F6 Knead Paste 3次(总共来回印刷 4次)。 5.7 印刷首片后2片及第3片要作锡厚量测(前刮刀量测一片，后刮刀量测一片)印刷目检人员依 SMT印锡目检作业指导书(C-5-1-1-QW0916-18)确认OK后方可继续印刷。 5.8 机器没有生产时，将刮刀清洁之后放回钢板室刮刀放置处。 5.9 锡膏罐开封之前，必须以锡膏搅拌机搅拌，搅拌时间为18 秒(0.3min)。 5.10 添加锡膏: 首次印刷时,每次用搅拌刀切取1/2刀面的锡膏量添加7次于钢板上;在印刷过程中,每印刷80Pcs以 1/2刀面的锡膏量添加2次锡膏,同时用搅拌刀将钢板两边溢出的锡膏移至中央。 5.11 除加锡膏及其余特定用途外，请勿任意打开锡膏机之护盖；并在使用后立即盖回。 5.12 机台因异常停止超过1小时时,在线人员须将钢板及刮刀上之锡膏回收锡膏罐内,并手动擦拭钢板及刮刀, 若钢板面或孔壁内有粘锡须使用钢板清洗机清洗干净; 已印刷OK的PCB若超过1小时未完成置件时,此PCB应清除锡膏, 并用洗板机做清洗(参考C-5-1-1-QW0933)。 5.13 钖膏印刷机内之清洁擦拭纸卷不可重复使用。 5.14 清洁钢板使用之清洁剂型号为YC-336A，切勿加错。 5.15 锡膏使用厂牌为KESTER，型号为R253-5 10% , ALLOY: SN 63/37 MESH:-325+500 5.16 印刷机操作参考文件：“DEK 265印刷机作业规范（C-5-5-2-QW0934) 5.17 锡膏管制参考文件：SMT停工管理办法（C-5-5-2-QW0904)、SMT锡膏管理办法(C-5-1-1QW0905) 、锡膏搅拌机作业规范 (C-5-1-1-QW0959)、SMT DEK CONTROL ' LOG(C-5-1-1-QW0916-06) 、Tooling Pin架设作业规范(C-5-1-1-QW0904)、清洗机作业规范(C-5-1-1-QW0933). 5.18 连续生产时,每12小时必须使用钢板清洗机清洗钢板一次,并作好钢板出入和清洗记录. 5.19 作业环境控制参照<<作业环境管制规范>> (C-5-5-2-QW0938). 5.20 每印刷80片PCB板后,必须手动清洗钢板一次. 5.21确认board stopper 的位置是否停在金手指边,且勿停在缺口或其他位置.
press F6 knead paste. Do the same procedure 3 times. (Amount strokes are 4 times) 5.7 After printing , the 2nd and 3rd (one for front , another for rear squeegee) have to be taken to measure the solderpaste thickness,refer
3.2 PCA PART NO: 8981-030
3.3 PCB PART NO: 18981-100 4. 刮刀材质:不锈钢; 刮刀硬度≧100°; 刮刀角度为60°. 5.注意事项:
5.1 依据ERP 所给予的机种名称定义加载程序名称，程序制作时按程序名称定义输入正确档名及适当参数并储存。 5.2 换线之后，DEK操作人员必须依照顶针位置图调整顶PIN位置，再由领班做确认的动作。设定顶针位置时，
1. 胶质刮刀
2.擦拭纸
3.清洁剂瓶
2、程序名称定义: abbcccde (abb=model,ccc-阶层码 ; d-T为正面, B为背面;e代表程序版本) 2.1 abbcccde (a代表A=61xx,B=63xx,C=65xx,D=69xx,E=88xx,F=22xx,G=81xx,H=82xx,I=63xxA,J=63xxB,K=63xxC,L=63xxD,
the smt solder paste thickness spec. If the result is within the control limit , then inform the line to continue printing. 5.8 After production , please take off the squeegee and clean it . Then please turn back the squeegee to stencil warehouse. 5.9 Before open and use the solder paste , have to mix the solder paste by mixing machine , and the time setup is 18sec( 0.3 min). 5.10 When adding solder paste , please add half of the stirring knife solder paste in stencil every time.Before printing, please add solder paste seven times;
3.2 PCA PART NO: 8981-030 3.3 PCB PART NO: 18981-100 4. Material of squeegee is stainless steel ; Rigidity of squeegee is ≧100°; Angle of squeegee is 60 °. 5、Attention： 5.1 By mode to load program and stencil,The following parameters will be entered after loading an old program or making a new program. 5.2 After change the model , the operator is responsible for adjusting the tooling pin position by the tooling pin position by the tooling pin
M=63xxE,N=65xxA,O=65xxB,P=65xxC,Q=65xxD,R=65xxE,S=65xxF,T=65xxG,U=91xx,V=86xx,W=83xx,X=83xxA,Y=89xx) 2.2 机种有参数超出SPEC.由ME修改后, IE发行新版WI(版本升级) 3、Part No. 3.1 CUSTOMER PART NO:
清洁模式1 (Clean Mode1)
清洁模式2 (Clean Mode2)
Y81030T1
18981-100(T)
1.0
0.13mm
65cmX55cm
25cm
50±5mm/sec
7kg±1kg
W/V/D
W/V/D
印刷间隙
板厚
印刷后清洁
停机后清洁
自动清洗时间
干擦速度
湿擦速度
真空擦速度
(Print Gap)