内部资料之制程能力控制(英文版)
制程过程IPQC检验控制计划中英文版
100%
全检 All inspection 2H 全检 All inspection
2PCS
4
装配灯罩，锁灯 罩扣位片，涂 704 硅胶（水泥 电阻）Assembly of chimney, chimney screw slice, with 704 silica gel (cement resistor)
2PCS
2H
IPQC 抽检 spot check
2
组装水窗（右） Assemble the water window
外观 appearance
100%
All inspection
操作员自检 The operator self-inspection
burst/white/screen printing is bad
制程过程 IPQC 检验控制计划中英文版
机种： type of machine number Process: KETTLE MODEL NO.: XXX sampling standard 抽样方案：GB/T2828.1-2003 AQL:Crit=（A）0 Maj=（B）1.0 Min（C）2.5
100%
全检 All inspection
2PCS
2H
PQC 抽检记录
7
装配蒸气管及锁 电制螺丝 Steam pipe assembly 夹具 fixed screws and lock the electric system
外观 appearance
1.电制组装线要牢固，螺丝要打紧/不可滑牙 目測 /漏打/用错螺丝。Electrical system eyeballing assembly line wants firm, screws are matter/non slip teeth/play/using the wrong screw. 2.蒸汽硅胶 目測 要装到位， 不能有漏装。 2. Steam silica gel eyeballing pack in place, there can be no packing. 1.电制组装插线要到位，不能松脱， 目測 Electrical system assembly line is in eyeballing place, not loose 2.锁水泥电 阻固定夹要打紧/不可有松动/螺丝未打紧/ 螺丝滑牙等现象。 Cement resistance clamp 目測 lock to matter/not have loose not eyeballing matter/screws/screw the phenomenon such
制程能力评估(中英文)
Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ？within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内？ Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or，ag是e 否un先it h入av先e出a 控tem制p？er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e，rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p？erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t？emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时，是否有证据证明采取了行动？ Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上？ Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or？use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ，tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p？erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem？perature with its 'seal in place' documented and known?
统计制程管制-SPC
管制图的判读
制程是否在管制状态可用下列原则判断:
1.管制图上的点都出现在管制界限内侧,并没有特别排法 时,原则上认为制程是正常.这种状态谓之管制状态.
2.管制图上有点超出管制界限外时,就判断制程有了异常 变化,这种状态谓之非管制状态.
3.管制图上的点虽未超出管制界限,但点的出现有下列法 时,就判断有异常原因发生. (a)点在中心线的单侧连续出现7点以上时
7.将所求出之各X值及R值点入管制图上并将相邻两点用 直线连接
8.制程状态检讨 9.记入其它注意事项
X- 管制圖
AGP CONN. GAP CONTROL CHART
0. 80
0. 70
0. 60
0. 50
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20
AGP CONN. GAP CONTROL CHART
10.49 10.48 10.50 10.49 10.50
解:1) X=
ΣXi n
262.43 = 25 = 10.49
Σ(Xi-X)2 S= n-1 =
0.02 24
= 0.029
公差裕度-2中心偏移量 0.10 -2│10.49-10.50∣
Cpk=
6标准差
=
6×0.029
= 0.46
规格上限-平均值 10.55-10.49
1.管制用管制图
先有管制界限,后有数据.
2.解析用管制图
先有数据,后才有管制界限.
一.平均值与全距管制图 (X-R Chart)
X-R管制图的定义
在计量值管制图中,X-R管制图系最常用的一种,所谓平均 值与全距管制图,系平均值管制图(X Chart)与全距管制图 (R Chart)二者合并使用.
生产过程控制(英文版)
生产过程控制(英文版)Firstly, it is important to establish clear and specific production goals and standards. This includes setting targets for output, quality, and cost, as well as identifying critical control points within the production process. These standards serve as a benchmark for performance and provide a basis for monitoring and evaluating the production process. Secondly, the use of advanced technology and automation is essential for effective production process control. Automated systems can provide real-time data on various aspects of production, such as temperature, pressure, flow rates, and quality control parameters. This allows for precise monitoring and adjustment of the production process to ensure that it meets the established standards.In addition, regular and systematic monitoring of the production process is crucial. This involves the use of various tools and techniques, such as Statistical Process Control (SPC), to analyze data and identify any deviations from the established standards. By detecting and addressing deviations early, potential issues can be mitigated before they affect the overall production output and quality.Furthermore, implementing a robust quality management system is essential for effective production process control. This involves thorough testing and inspection of raw materials, work-in-progress, and finished products to ensure that they meet the required standards. Any non-conforming products or materials should be immediately identified and addressed to prevent them from affecting the production process.Lastly, continuous improvement is a key principle in production process control. This involves ongoing monitoring, analysis, and adjustment of the production process to identify opportunities for optimization and efficiency gains. By continually striving for improvement, manufacturers can enhance their overall production output, quality, and competitiveness.In conclusion, production process control is a multifaceted and essential aspect of manufacturing and industrial operations. It involves setting clear standards, utilizing advanced technology, systematic monitoring, robust quality management, and continuous improvement to ensure that the production process meets its goals and produces high-quality products. By implementing effective production process control, manufacturers can enhance their overall efficiency, quality, and competitiveness in the market.很抱歉，由于输入字数限制，我无法提供1500字的完整文本。
制程能力分析 (Cpk , Z值)
距離下限=2.25
距離上限=3.75
平均值偏移=0.75
Target=100 LSL=97
μ = 99.25
USL=103
σ = 0.5
5 Z值, Sigma Level -1
僅有規格上限
USL LSL
僅有規格下限
D σ
D σ
A
Z值 = D/σ
A
1- Z值：衡量平均值與規格界限間之距離(D)相當於幾個標準差, 也 稱為Sigma Level (Sigma 水準) 2- Z值也可由不合格率來推算 (適用於計數型資料) 3- 只有單邊規格時, 平均值遠離規格, 代表Z值越高, 品質越好
R C hart
Sample Range
8
UC L= 8.106 _ R = 3.833
N orm al P rob P lot A D : 0.279, P : 0. 640
4
0 1 3 5L= 0 595 600 605
Las t 18 S ubgroups
給定規格界限, 才能進行製程能力分析
7 計量型製程能力分析- 2
資料輸入
有2種資料輸入方式
7 計量型製程能力分析- 3
製程能力分析 Stat > Quality Tools > Capability Analysis > Normal
7 計量型製程能力分析- 4
條件輸入
輸入資料位置
輸入規格界限
A
Cpk = Cp (1 – Ca ) =
4 Cpk , 製程能力指數 -3
EX:假設產品品質特性的規格為100± 3, 今由生產線收集100件產品, 量測後獲得平均值為99.25 , 標準差為0.5 ; 試計算Cp, Cpk指標 Cp = (103-97)/(6x0.5) = 2.0 Cpk = Cp (1 – Ca ) = 2.0 (1- (100 – 99.25)/3) = 2.0(0.75) = 1.5 CPU = (103-99.25)/(3x0.5) = 2.5 CPL = (99.25-97)/(3x0.5) = 1.5
制程能力评估(中英文)
Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ？within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内？ Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or，ag是e 否un先it h入av先e出a 控tem制p？er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e，rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p？erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t？emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时，是否有证据证明采取了行动？ Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上？ Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or？use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ，tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p？erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem？perature with its 'seal in place' documented and known?
某外资企业的SPC内部培训
目录
1. SPC概述 2. 统计学的概述 3. SPC包括的内容 4. 质量管理7个工具图 5. 控制图 6. Cpk 工程能力
2. 统计学概述
统计学是通过搜索、整理、分析数据等手段，以 达到推断所测对象的本质，甚至预测对象未来的 一门综合性科学。
数据的定义
差不多≠事实 大概≠事实 应该≠事实 数据=事实
要解决事情或是决策就是需要以事实为基础,而事实则由 数据来表示, 有数据才能依据此数据所显示的事实来采取 行动
2. 统计学概述
项目
平均值 MEAN
符号 读音
EXCEL 函数
MU / X BAR
=AVERAGE( … )
公式
中值 MEDIAN
方差 VARIANCE
标准差1 STANDARD DEVIATION
3.29σ
4σ
4.5σ
5σ
6σ
7σ
Cpk % 范围内 % 范围外 不良几率
0.2 50.0% 50.0%
2
0.3 68.27% 31.73%
3.2
0.7 95.45% 4.55%
22.0
1.0 99.73% 0.27% 370.4
1.1 99.90% 0.10% 1,000
1.3
1.5
1.7
99.994% 99.99966% 100.0%
样本（或时间）
1
2. 以质量特性值或其统计量为纵坐标的平面坐 标系；
3. 一条质量特性值或其统计量的波动曲线。
4 LCL,
中心线CL、上控制线UCL 和下控制线
作为判断工序有无异常的标准和尺度。若点子落在控制界限外或其排列
有明显缺陷，则说明工序有异常因素的影响。
制程能力CPK及直方图解析教材
其样本平均当然为常态分配N
σ2
（μ,
n），若群体之形状虽为长方形或三角形之分配， 而n≧30时，其样本平均之分配亦可近似成为常态
分配.
2020/9/2
22
• 常态分配 σ2
•
N(μ, n )。兹用图三来作一说明﹕
σ
μ 三角分配之群体
长方形分配之群体
σ（或 ）σ n
μ
μ
样本平均之分配
常态分配N（μ, ）
2020/9/2
图三
23
3.基本统计量
(1)群体参数 表示群体特性的定数，谓之群体参数
（PARAMETER），现在一般所使用 的群体。
群体参数有： ‧群体平均 ﹕群体的平均值，以符号μ表
示。 ‧群体变异 ﹕群体的变异，以符号σ2表示。
‧群体标准偏差﹕群体的标准偏差，以符号σ
表示。2020/9/22444. SPC演进史
SPC之演进史
SQC极限 其他技术开发
SQC⊕品质 企划与设计
日本执行SQC 且极有成效
质量障碍极高
SQC开发
质量障碍极低 1.SHEWIIAR T 2.ZI-1/-2/-3
质量障碍高
质量障碍低
1.Deming引SPC 入日本 2.Z 9021/9022/9023
1.QCC发展 2.ZD计划 3.TQC萌芽 4.QFD萌芽 5.实验设计
变异形成之原因，可分为机遇原因及非机遇原 因两类：
2020/9/2
7
A.机遇原因（Chance causes）
又称为：不可避免之原因、非人为原因、共同原 因、偶然原因、一般原因等等。 a.例如某人量身高，用同一量测器，由同一人量
测该人之身高数，在短时间内，所得量测值有 差异存在，造成此种差异之原因，即属于机遇 原因。 b.在生产工作中，虽然订有操作标准，但在操作 条件容许之范围内必有变化。
工厂品管常用英语
零件材料类的专有名词CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit（记忆集成电路）RAM: Random Access Memory（随机存取存储器）DRAM: Dynamic Random Access Memory（动态随机存取存储器）SRAM: Staic Random Access Memory（静态随机存储器）ROM: Read-only Memory（只读存储器）EPROM:Electrical Programmable Read-only Memory（电可抹只读存诸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（电可抹可编程只读存储器）CMOS: Complementary Metal-Oxide-Semiconductor（互补金属氧化物半导体）BIOS: Basic Input Output System（基本输入输出系统）Transistor：电晶体LED:发光二极体Resistor：电阻Variator：可变电阻Capacitor:电容Capacitor array：排容Diode：二极体Transistor：三极体Transformer：变压器（ADP）Oscillator：频率振荡器（0sc）Crystal：石英振荡器XTAL/OSC:振荡产生器（X）Relay：延时器Sensor：感应器Bead core：磁珠Filter:滤波器Flat Cable：排线Inductor：电感Buzzer：蜂鸣器Socket：插座Slot：插槽Fuse：熔断器Current：电流表Solder iron：电烙铁Magnifying glass：放大镜Driver：螺丝起子Oven：烤箱TFT:液晶显示器Oscilloscope：示波器Connector：连接器PCB:printed circuit board（印刷电路板）PCBA: printed circuit board assembly（电路板成品）PP:并行接口HDD:硬盘FDD:软盘PSU:power supply unit（电源供应器）SPEC:规格Attach:附件Case: 机箱，盖子Cover：上盖Base：下盖Bazel：面板（panel）Bracket：支架，铁片Lable：贴纸Guide：手册Manual：手册，指南Card：网卡Switch：交换机Hub：集线器Router：路由器Sample：样品Gap：间隙Sponge：海绵Pallet：栈板Foam：保利龙Fiber：光纤Disk：磁盘片PROG:程序Barcode：条码System：系统System Barcode：系统条码M/B:mother board：主板CD-ROM:光驱FAN:风扇Cable：线材Audio：音效K/B:Keyboard（键盘）Mouse：鼠标Riser card：转接卡Card reader：读卡器Screw：螺丝Thermal pad：散热垫Heat sink：散热片Rubber：橡胶垫Rubber foot：脚垫Bag：袋子Washer：垫圈Sleeve：袖套Config：机构Label hi-pot：高压标签Firmware label：烧录标签Metal cover：金属盖子Plastic cover：塑胶盖子Tape for packing：包装带Bar code：条码Tray：托盘Collecto：集线夹Holder：固定器,L铁Connecter：连接器IDE:集成电路设备，智能磁盘设备SCSI:小型计算机系统接口Gasket：导电泡棉AGP:加速图形接口PCI:周边组件扩展接口LAN:局域网USB:通用串形总线架构Slim：小型化COM:串型通讯端口LPT:打印口，并行口Power cord：电源线I/O:输入，输出Speaker：扬声器EPE:泡棉Carton：纸箱Button：按键，按钮Foot stand：脚架部门名称的专有名词QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA) CQA：Customer Quality Assurance客户质量保证PQA:Process Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPE:Product Engineer 产品工程IE:Industrial engineer 工业工程ADM:Administration Department行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD:General Affairs Dept总务部A/D:Accountant /Finance Dept会计LAB:Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD:Product Department生产部PA:采购(PUR:Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:document control center 文件管制中心厂内作业中的专有名词QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX:Maximum最大值MIN:Minimum最小值DIA:Diameter直径DIM:Dimension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求（客户）ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility：兼容性Marking：标记DWG:Drawing图面Standardization：标准化Consensus：一致Code：代码ZD:Zero defect零缺点Tolerance：公差Subject matter：主要事项Auditor：审核员BOM:Bill of material物料清单Rework：重工ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP:capability index（准确度）CPK:capability index of process(制程能力)PMP:制程管理计划（生产管制计划）MPI:制程分析DAS:Defects Analysis System 缺陷分析系统PPB：十亿分之一Flux：助焊剂P/N:料号L/N：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO:Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)ASY:组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT) RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式：百万分之一) 1000PPM即为0.1% Corrective Action: (CAR改善对策)ACC：允收REJ:拒收S/S：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession / Waive特采ISO:国际标准化组织ISA：Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List)QCD: Quality cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S：Quality/Reliability/Service质量/可靠度/服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Material reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR：企业流程再造 (Business Process Reengineering) ISAR ：首批样品认可(Initial Sample Approval Request)- JIT：实时管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单) SCAR: Supplier Corrective Action Report (供货商改善对策报告) 8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知) QAPS: Quality Assurance Process Sheet (品质工程表)DRP ：运销资源计划 (Distribution Resource Planning)DSS：决策支持系统 (Decision Support System)EC ：电子商务 (Electronic Commerce)EDI ：电子资料交换 (Electronic Data Interchange)EIS ：主管决策系统 (Excutive Information System)ＥＲＰ：企业资源规划 (Enterprise Resource Planning)FMS ：弹性制造系统 (Flexible Manufacture System)KM ：知识管理 (Knowledge Management)4L ：逐批订购法 (Lot-for-Lot)LTC ：最小总成本法 (Least Total Cost)LUC ：最小单位成本 (Least Unit Cost)MES ：制造执行系统 (Manufacturing Execution System)MPS ：主生产排程 (Master Production Schedule)MRP ：物料需求规划 (Material Requirement Planning)MRPⅡ：制造资源计划 (Manufacturing Resource Planning)OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托设计与制造 (Original Design & Manufacture) OLAP：线上分析处理 (On-Line Analytical Processing)OLTP：线上交易处理 (On-Line Transaction Processing)OPT ：最佳生产技术 (Optimized Production Technology) PDCA：PDCA管理循环 (Plan-Do-Check-Action)PDM：产品数据管理系统 (Product Data Management))RCCP：粗略产能规划 (Rough Cut Capacity Planning)SCM ：供应链管理 (Supply Chain Management)SFC ：现场控制 (Shop Floor Control)TOC：限制理论 (Theory of Constraints)TQC ：全面品质管制 (Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance：全面生产保养ESD Wrist strap：静电环IT:information technology信息技术，资讯科学CEO：Chief Executive Officer执行总裁COO：Chief Operaring Officer首席业务总裁SWOT：Strength,Weakness,Opportunity,Threat优势﹐弱点﹐机会﹐威胁Competence：专业能力Communication：有效沟通Cooperation：统御融合Vibration Testing：振动测试IDP：Individual Development Plan个人发展计划MRP：Material Requirement Planning物料需求计划MAT'S：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知会3C：Computer ,Communication , Consumer electronic消费性电子5W1H：When , Where , Who , What , Why , Ho5M:Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE:Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I:Manpower , Machine , Material , Method,Market , Management , Money , Information人力，机器，材料，方法, 市场，管理，资金，资讯1 Accuracy 准确度2 Action 行动3 Activity 活动4 Analysis Covariance 协方差分析5 Analysis of Variance 方差分析6 Approved 承认7 Attribute 计数值8 Average 平均数9 Balance sheet 资产负债对照表10 Binomial 二项分配11 Brainstorming Techniques 脑力风暴法12 Cause and Effect Matrix 因果图(鱼骨图)13 CL:Center Line 中心线14 Check Sheets 检查表15 Complaint 投诉16 Conformity 合格（符合）17 Control 控制18 Control chart 控制(管制)图19 Correction 纠正20 Correlation Methods 相关分析法21 CPI: continuouse Process Improvement 连续工序改善22 Cross Tabulation Tables 交叉表23 CS: Customer Sevice 客（户）服（务）中心24 DSA: Defects Analysis System 缺陷分析系统25 Data 数据 Description:品名26 DCC: Document Control Center 文控中心27 Decision 决策、判定28 Defects per unit 单位缺点数29 Description 描述30 Device 装置31 Do 执行32 DOE: Design of Experiments 实验设计33 Element 元素34 Engineering recbnology 工程技35 Environmental 环境36 Equipment 设备37 Estimated accumulative frequency 计算估计累计数38 EV: Equipment Variation 设备变异39 External Failure 外部失效,外部缺陷40 FA: Failure Analysis 失效分析41 Fact control 事实管理42 Fatigue 疲劳43 FMEA: Failure Mode and Effect Analysis失效模式与效果分析44 FPY: First-Pass Yield （第一次通过）合格率45 FQA: Final Quality Assurance 最终品质保证46 FQC: Final Quality control 最终品质控制47 Gauge system 测量系统48 Grade 等级49 Histogram 直方图50 Improvement 改善51 Initial review 先期审查52 Inspection 检验53 Internal Failure 内部失效、内部缺陷54 IPQC: In Process Quality Control 制程品质控制55 IQC: Incomming Quality Control 来料品质控制56 IS International Organization for Standardization 国际标准化组织57 LCL: Lower Control limit 管制下限58 LQC: Line Quality Control 生产线品质控制59 LSL: Lower Size Limit 规格下限60 Machine 机械61 Manage 管理62 Materials 物料63 Measurement 测量64 Median 中位数65 MSA: Measurement System Analysis 测量系统分析66 Occurrence 发生率67 Operation Instruction 作业指导书68 Organization 组织69 Parto 柏拉图70 PPM:Parts per Million （百万分之）不良率71 Plan 计划72 Policy 方针73 Population 群体74 PQA: Process Quality Assurance 制程品质保证75 Practice 实务(践)76 Prevention 预防77 Probability 机率78 Probability density function 机率密度函数79 Procedure 流程80 Process 过程81 Process capability analysis 制程能力分析（图）82 Process control and Process capability制程管制与制程能力83 Product 产品84 Production 生产85 Projects 项目86 QA: Quality Assurance 品质保证87 QC: Quality Control 品质控制88 QE: Quality Engineering 品质工程89 QFD: Quality Function Desgin 品质机能展开(法)90 Quality 质量91 Quality manual 品质手册92 Quality policy 品质政策(质量方针)93 Random experiment 随机试验94 Random numbers 随机数95 R:Range 全距（极差）96 Reject 拒收97 Repair 返修98 Repeatusility 再现性99 Reproducibility 再生性100 Requirement 要求101 Responsibilities 职责102 Review 评审103 Reword 返工104 Rolled yield 直通率105 RPN: Risk Priority Number 风险系数106 Sample 抽样,样本107 Sample space 样本空间108 Sampling with replacement 放回抽样109 Sampling without replacement 不放回抽样110 Scatter diagram 散布图分析111 Scrap 报废112 Simple random sampling 简单随机取样113 Size 规格114 SL: Size Line 规格中心线115 Stratified random sampling 分层随机抽样116 SOP: Standard Operation Procedure 标准作业书117 SPC: Statistical Process Control 统计制程管制118 Specification 规范119 SQA: Source(Supplier) Quality Assurance 供货商品质保证120 Stage sampling 分段随机抽样121 Standard Deviation 标准差122 Sum of squares 平方和123 Taguchi-method 田口(试验)方法124 Theory 原理125 TQC: Total Quality Control 全面品质控制126 TQM: Total Quality Management 全面品质管理127 Traceablity 追溯128 Training 培训129 UCL: Upper Control Limit 管制（控制）上限130 USL: Upper Size Limit 规格上限131 Validation 确认132 Variable 计量值133 Verification 验证134 Version 版本135 VOC: Voice of Customer 客户需求136 VOE: Voice of Engineer 工程需求137 Inventory stock report:庫存清单报告138 Sales order report:出货报告质量人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 质量工程人员质量保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商质量评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收质量水平S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 质量/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它质量术语类QIT Quality Improvement Team 质量改善小组ZD Zero Defect 零缺点QI Quality Improvement 质量改善QP Quality Policy 目标方针TQM Total Quality Management 全面质量管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 质量工程(部)QA Quality Assurance 质量保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略质量保证DQA Design Quality Assurance 设计质量保证MQA Manufacture Quality Assurance 制造质量保证SSQA Sales and service Quality Assurance 销售及服务质量保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable专业词汇通用类president董事长operator作业员position职务general manager总经理special assistant 特助deputy manager |'depjuti| =vice manager副理deputy supervisor =vice supervisor副课长group leader组长line leader线长supervisor 课长responsible department负责单位Human Resources Department人力资源部Head count 人头数production department生产部门planning department企划部QC Section品管课stamping factory冲压厂painting factory烤漆厂molding factory成型厂administration/general affairs dept./总务部production unit生产单位meeting minutes会议记录distribution department分发单位subject主题conclusion结论decision items决议事项pre-fixed finishing date预定完成日Color management 颜色管理Visual management 目视管理production capacity生产力first count初盘first check初盘复棹second count 复盘second check复盘复核quantity of physical inventory second count 复盘点数量physical inventory盘点数量physical count quantity账面数量difference quantity差异量spare parts physical inventory list备品盘点清单cause analysis原因分析waste materials废料description品名specification 规格model机种work order工令revision版次remark备注registration登记registration card登记卡to control管制application form for purchase请购单consume, consumption消耗to notify通知to fill in填写to collect, to gather收集statistics统计cosmetic inspection standard 外观检验规范computer case 计算机外壳(组件)personal computer enclosure 计算机机箱产品front plate前板rear plate后板chassis |'∫æsi| 基座bezel panel面板Hood 上盖base pan 基座bezel 面板riser card 扩充卡flat cable 排线TOP driver cage 上磁架bottom driver cage 下磁架resin film 树脂膜raw materials原料materials物料steel plate钢板roll/coil material卷料spare parts =buffer备品plastic parts塑料件sheet metal parts/stamping parts 冲件material check list物料检查表finished product成品semi-finished product半成品good product/accepted goods/ accepted parts/good parts良品defective product/non-good parts不良品disposed goods处理品warehouse/hub仓库packing material包材basket蝴蝶竺plastic basket胶筐flow chart流程窗体production tempo生产进度现状lots of production生产批量manufacture procedure制程to revise, modify修订to switch over to, switch—to, switching over切换engineering bottleneck, project difficulty工程瓶颈glove(s)手套glove(s) with exposed fingers割手套Band-Aid创可贴Industrial alcohol工业酒精broom扫把mop拖把vacuum cleaner吸尘器rag 抹布garbage container灰箕garbage can垃圾箱garbage bag垃圾袋liaison联络单rags抹布lamp holder灯架to mop the floor拖地to clean a table擦桌子air pipe 气管delivery deadline交货期die worker模工production, to produce生产equipment设备resistance电阻beacon警示灯coolant冷却液crusher破碎机club car高尔夫球车plate电镀power button电源按键reset button重置键forklift叉车Workshop traveler 天车trailer =long vehicle拖板车Hydraulic trolley手压车hydraulic hand jack油压板车casing = containerization装箱velocity速度patent专利coordinate坐标supply and demand供求career card履历卡barricade隔板carton box纸箱to pull and stretch拉深work cell/work shop工作间sub-line支线bottleneck 瓶颈模具工程类plain die简易模pierce die冲孔模forming die成型模progressive die连续模stage die工程模compound die复合模shearing die剪边模riveting die铆合模feature die公母模male die公模female die母模cavity型控母模core模心公模die change 换模to fix a die装模to repair a die修模punch set上模座punch pad上垫板punch holder上夹板stripper pad脱料背板up stripper上脱料板upper plate上模板lower plate下模板die pad下垫板die holder下夹板die set下模座bottom block下垫脚bottom plate下托板(底板)upper supporting blank上承板upper padding plate blank上垫板top plate上托板（顶板）top block上垫脚stripping plate内外打(脱料板) outer stripper外脱料板inner stripper内脱料板lower stripper下脱料板punch冲头insert入块(嵌入件)deburring punch压毛边冲子groove punch压线冲子stamped punch字模冲子round punch圆冲子special shape punch异形冲子bending block折刀roller滚轴baffle plate挡块located block定位块supporting block for location定位支承块air cushion plate气垫板air-cushion eject-rod气垫顶杆trimming punch切边冲子stiffening rib punch = stinger 加强筋冲子ribbon punch压筋冲子reel-stretch punch卷圆压平冲子guide plate定位板sliding block滑块sliding dowel block滑块固定块die locker锁模器pressure plate =plate pinch压板thickness gauge厚薄规cutting die, blanking die冲裁模die block模块folded block折弯块sliding block滑块location pin定位销lifting pin顶料销die plate, front board模板padding block垫块stepping bar垫条panel board镶块to load a die装上模具to unload a die 御模具active plate活动板lower sliding plate下滑块板upper holder block上压块upper mid plate上中间板spring box弹簧箱spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板bushing block衬套cover plate盖板guide pad导料块pilot导正筒trim剪外边pierce剪内边pocket for the punch head挂钩槽slug hole废料孔radius半径shim/wedge/heel/pad/spacer/gasket楔子torch-flame cut火焰切割set screw止付螺丝form block折刀round pierce punch =die button圆冲子shape punch =die insert异形子stock located block定位块metal plate钣金miller铣床grinder磨床tolerance公差score =groove压线sliding block滑块lathe车active plate活动板baffle plate挡块cover plate盖板groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板capability能力parameter参数factor系数driller钻床set up die架模height of die setting up架模高度analog-mode device类模器inner guiding post内导柱inner hexagon screw内六角螺钉dowel pin固定销coil spring弹簧lifter pin顶料销eq-height sleeves =spool等高套筒pin销lifter guide pin浮升导料销guide pin导正销wire spring圆线弹簧outer guiding post外导柱stop screw止付螺丝located pin定位销outer bush外导套press specification冲床规格die height闭模高度flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝stripper plate脱料板piston活塞handle mold手持式模具flash mold溢流式模具positive mold挤压式模具split mold分割式模具die lifter举模器top stop上死点bottom stop下死点one stroke一行程to continue, cont.连动to grip(material)吸料location lump, locating piece, location block定位块reset复位to file burr 锉毛刺embedded lump |in'bed| mp|镶块 |lstamping-missing漏冲to tight a bolt拧紧螺栓to loosen a bolt拧松螺栓punched hole冲孔to cut edge =side cut =side scrap 切边to bending折弯to pull, to stretch拉伸engraving, to engrave刻印stamping 油印to stake铆合designing, to design设计design modification 设计修改成gauge(or jig)治具pedal踩踏板stopper阻挡器flow board流水板torque扭矩spline =the multiple keys花键quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的forming成型(抽凸,冲凸)draw hole抽孔bending折弯emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线stamp letter冲字(料号)tick-mark nearside正面压印tick-mark farside反面压印冲压类punch, press冲punching machine 冲床hydraulic machine油压机jack升降机decoiler整平机manufacture management制造管理stamping, press冲压feeder送料机rack, shelf, stack料架taker取料机to reverse material 翻料to load material上料to unload material卸料to return material/stock to退料scraped |'skræpid|报废scrape ..v.刮;削robot机械手production line流水线packaging tool打包机packaging打包成型类well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleeve套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板guide pin导销eject rod (bar)（成型机）顶业捧subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口，直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆) slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口film gate薄膜浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口submarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口runner less无浇道sprue less 无射料管方式long nozzle延长喷嘴方式spur浇口;溶waste废料board广告牌sliding rack滑料架to impose lines压线to compress, compressing压缩character die字模to feed, feeding送料material change, stock change材料变更feature change 特性变更prepare for, make preparations for 准备rotating speed, revolution转速abnormal handling异常处理组装类Assembly line组装线Layout布置图Conveyer流水线运输带Rivet machine拉钉机Rivet gun拉钉枪Screw driver起子Electric screw driver电动起子Hydraulic machine 液压机Pneumatic screw driver气动起子automation自动化to stake, staking, riveting铆合add lubricant oil加润滑油argon welding氩焊cylinder油缸robot机械手conveying belt输送带transmission rack输送架to draw holes抽孔bolt螺栓nut 螺母screw 螺丝identification tag标示单screwdriver plug起子插座automatic screwdriver电动启子to move, to carry, to handle搬运be put in storage入库packing包装staker = riveting machine铆合机fit together组装在一起fasten锁紧(螺丝)fixture 夹具(治具)pallet/skid栈板barcode条形码barcode scanner条形码扫描仪fuse together熔合fuse machine/heat stake热熔机processing, to process加工delivery, to deliver 交货to return delivery to. to send delivery back to return of goods退货easily damaged parts易损件standard parts标准件to lubricate润滑spring 弹簧spare tools location/buffer手工备品仓spare molds location模具备品仓tox machine自铆机烤漆类phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂main manifold主集流脉organic solvent有机溶剂demagnetization去磁;消磁high-speed transmission高速传递heat dissipation热传rack上料volatile挥发性degrease脱脂rinse水洗alkaline etch龄咬desmot剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔scraped products报放品disposed products处理品dismantle the die折模auxiliary function辅助功能heater band 加热片thermocouple热电偶derusting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response =reaction =interaction感应ram连杆edge finder巡边器concave凸convex凹cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线grit沙砾granule =pellet =grain细粒sand blasting喷沙grit maker抽粒机。
Cpk(CapabilityofPrecisionAccuracy)(制程能力)(ppt49)合集
直方圖(五) :
• 如何制作直方圖之步驟 :
3. 制作次數分配表 : A. 收集數據(如下表) :
合理樣組 樣品數(n)之測定值(Xn) Xk Rk
Remarks
(K)
12 3 4 5
1 10.1 10.3 9.9 10.2 9.8 10.06 0.5 k : 6 n : 5 N : 30
2 10.0 10.0 9.8 10.1 10.2 10.02 0.4 X : 10.01
直方圖(十三)
• 如何制作直方圖之步驟 :
4. 繪制直方圖(九組) :
10 9 8 次7 6 數5 4 3 2 1
LSL
CSL CL
USL
9.73
9.87 10.01 10.15 10.29
9.80 9.94
10.08 10.22
N : 30 X(CL) : 10.01 : 0.15 R : 0.38 CSL : 10.0 USL : 10.3 LSL : 9.7 Ca : 0.02 Cp : 0.68 CpL : 0.70 CpU : 0.67 Cpk : 0.67
範圍和時期(二) :
• 工作方法變更時 . • 其他制造條件(因素)變更時 ,
例如 : 人員 / 環境 ……等 . • 某種制程發生不良時 , 對前道制程做系
列之評價 . • 客戶訂單有特殊要求時 .
權責 :
• 品工 : 1. Cpk數據資料之統計分析 . 2. 改善後數據資料之統計 .
• 其他相關單位 : 1. 協助品工進行Cpk分析 . 2. Cpk分析結果之檢討 / 執行及改善 .
將所收集的測定值(數據)之全距分為幾 個相等的區間作為橫軸 (X軸) ; 並將次 數作為縱軸 (Y軸) , 依各區間內之測定 值所出現之次數累積而成的面積 , 用柱 子排起來的圖形 .
诺基亚企业资料新内部控制之制造能力控制(英文版)
• Stable Process: A process in which variation in outcomes arises only from common causes
USL
nominal value
LSL
• Unstable Process: A process in which variation is a result of both common and special causes
Process Capability (Cp / Cpk / Pp / Ppk)
Global Training Material
Creator
: Global Mechanics Process Manager
Function
: Mechanics
Approver
: Gary Bradley / Global Process Team
1 © NOKIA 2001 T0001801.PPT/ 21-Dec-2001 / Jim Christy
Company Confidential
Contents
Section
Heading / Description
1 Variation, Tolerances and Dimensional Control 2 Population, Sample and Normal Distribution 3 Cp and Cpk Concept 4 Use of the NMP Data Collection Spreadsheet 5 Confidence of Cpk
Company Confidential
The Sources of Process/System Variation
SMT生产常用英文
SMT生产常用英文2.3.1部门组织类DC (Document Center) 数据中心DCC (document control center) 文件管理中心Design Center 设计中心PCC (Product control center) 生产管制中心PMC (Production & Material Control) 生产和物料控制PPC (Production Plan Control) 生产计划控制SCM (supply chain management) 供应链MC Material Control 物料控制QCC (Quality Control Circle) 品质圈QIT (Quality Improvement Team) 品质改善小组MFG (manufacturing) 制造单位Manufacturing Dept = MD 制造部PD (Product Department) 生产部Logistical Dept 物流部Purchasing Dept 采购部Cost Management Dept 经管Material Control Dept 物管Personnel Dept 人事部Engineering Standard Dept 工标部Quality Assurance Dept 品保部R&D (Research & Design) 设计开发部Delivery Control Center 交管Planning Dept 企划部Administration/General Affairs Dept 总务部PM (project management) 专案管控LAB (Laboratory) 实验室QE (Quality Engineering) 品质工程(部) QA (Quality Assurance) 品质保证(处)QC (Quality Control) 品质管理(课) IE (Industrial Engineering) 工业工程ME (manufacture engineering) 制造工程PE (PRODUCTS ENGINEERING) 产品工程TE (TEST ENGINEERING) 测试工程EE (ELECTRONICS ENGINEERING) 电子工程2.3.2系统文件类ISO (International Standard Organization) 国际标准化组织ES (Engineering Standard) 工程标准IWS (International Workman Standard) 工艺标准GS (General Specification) 一般规格SIP (Standard Inspection Procedure) 标准检验规范SOP (Standard Operation Procedure) 制造作业规范IS (Inspection Specification) 成品检验规范POP (packing operation procedure) 包装操作规范BOM (Bill Of Material) 物料清单PS (Package Specification) 包装规范SPEC (Specification) 规格DWG (Drawing) 图面SWR (Special Work Request) 特殊工作需求APP (Approve) 核准,认可,承认CHK (Check) 确认ECO (Engineering Change Order) 工程改动要求PCN (Process Change Notice) 工序改动通知PMP (Product Management Plan) 生产管制计划CAR (Correction Action Report) 改善报告TPM (Total Production Maintenance) 全面生产保养MRP (Material Requirement Planning) 物料需计划OS (Operation System) 操作系统SSQA (standardized supplier quality audit) 合格供货商质量评估AVL (acceptable vendor list) 允许的供货商清单PDCS (process defect contact sheet) 制程异常联络单E(D)CN (Engineering(Design) change notice) 工程(设计)变更通知KPI (Key performance index) 主要绩效指标2.3.3生产工站类Computer 计算机Consumer Electronics 消费性电子产品Communication 通讯类电子产品OEM (Original Equipment Manufacture) 原设备制造PC Personal Computer 个人计算机5W1H (When, Where, Who, What, Why, How to)6M （Man, Machine, Material, Method, Measurement, Message）4MTH (Man, Material, Money, Method, Time, How)人力,物力,财务,技术,时间(资源)CP (capability index) 能力指数CPK (capability process index) 制程能力参数FMEA (failure model effectiveness analysis) 失效模式分析SMT (surface mount technology) 表面贴装技朮PTH (Plate Through hole) 镀层穿孔(手插件)PCBA (Printing circuit board Assembly) 组装印刷电路板PO (Purchasing Order) 采购订单MO (Manufacture Order) 生产单PC# (product code) 产品编码MM# (material master number) 主件料号AA# (altered assembly number) 成品料号PBA# (printed board assembly number) 半成品料号PPID (Product part Identification) 产品料号标识符L/N (Lot Number) 批号P/N (Part Number) 料号N/A (Not Applicable) 不适用S/N (serial number) 序列号CHK (check) 检查SPEC (specification) 规格ID: (Identify) 鉴别号码Barcode 条形码barcode scanner 条形码扫描仪WDR (Weekly Delivery Requirement) 周出货要求PPM (Percent Per Million) 百万分之一PCs (Pieces) 个(根,块等)PRS (Pairs) 双(对等)CTN (Carton) 卡通箱PAL (Pallet/skid) 栈板D/C (Date Code) 生产日期码ID/C (Identification Code) (供货商)标识符QTY (Quantity) 数量I/O (input/output) 输入/输出Flux 助焊剂Cleaning solvent 清洁剂Cleaning paper 擦拭纸Hand solder 烙铁Solder Paste 锡膏 Feeder 供料器Stencil 钢网 Nozzle 吸嘴PAD 焊垫 Squeegee 刮刀Pinter Machine 锡膏印刷机器Buffer Loader 收板机Material 物料Mounting Machine 贴片机器REFLOW Machine 回流焊炉Profile 回焊温度曲线图AOI (automatic optical inspection) 自动光学检测W/S (wave solder) 波峰焊ICT (in circuit test) 线路测试IFT (integrate function test) 功能测试FCT (Function check Test) 功能测试SMD (Surface Mounting Device) 贴装设备BGA Rework Station BGA维修站2.3.4零件认识类MSD (moisture sensitive device) 湿度敏感元件SMC (Surface Mount Component) 表面贴装元件SMD (Surface Mount Device) 表面贴装元器件Leads 元件脚Terminations 端头脚件Passive Component 无源器件Active Component 有源器件BIOS: (Basic Input Output System) 基本输入输出系统CMOS: (Complementary Metal-Oxide-Semiconductor Transistor) 互补型金属氧化物半导体Core 铁芯CPU: (Central Processing Unit) 中央处理器DMA: (Direct Memory Access) 直接记忆体存取IC: (Integrated Circuit) 集成电路SPS (Switching power supply) 电源箱AGP (Accelerated Graphic Port) 加速图形端口FDD (Floppy Disk Drive) 软式磁盘机HDD (Hard Disk Drive) 硬盘驱动器North Bridge 北桥South Bridge 南桥IDE: (Integrated Drive Electronics) 集成电路设备, 智能磁盘设备LAN: (Local Area Network) 网络, 局域网, 本地网MOSFET:(Metal-Oxide Semiconductor Field Effect Transistor) 金属氧化物半导体场效应晶体管PCI: (Peripheral Component Extended Interface) 周边元件扩展接口SCSI: (Small Computer System Interface) 小计算机系统的界面USB: (Universal Serial Bus) 通用串行总线SDRAM: (Synchronous Dynamic Random Access Memory) 同步动态随机存取存储器KEYBOARD 键盘CABLE LINE 扁平电缆HEADER 头/排针JACK 插头CABLE 电缆/扁平电缆TUNER 调频器2.3.5质量管理类QC (quality control) 品质管理人员FQC (final quality control) 终点品质管理人员IPQC (in process quality control) 制程中的品质管理人员OQC (output quality control) 最终出货品质管理人员IQC (incoming quality control) 进料品质管理人员TQC (total quality control) 全面品质管理PQC (passage quality control) 段检人员QA (quality assurance) 品质保证人员OQA (output quality assurance) 出货品质保证人员QE (quality engineering) 品质工程人员QPA (Quality Process Audit) 制程品质稽核OQM (output quality measure) 出货品质检验SQA (Strategy Quality Assurance) 策略品质保证DQA (Design Quality Assurance) 设计品质保证MQA (Manufacture Quality Assurance) 制造品质保证SSQA (Sales and service Quality Assurance) 销售及服务品质保证SPC (Statistical Process Control) 统计制程管制SQC (Statistical Quality Control) 统计品质管理GRR (Gauge Reproductiveness & Repeatability) 量具之再制性及重测性判断量可靠与否8SClassification 整理 (sorting,organization)-seiriRegulation 整顿 (arrangement,tidiness)-seitonCleanliness 清扫 (sweeping, purity)-seiso Conservation 清洁(cleaning,cleanliness)-seiktsuCulture 教养 (discipline)-shitsuke Safety 安全Security 保密PDCA (Plan Do Check Action) 计划执行检查总结FAI (first article inspection) 新品首件检查FAA (first article assurance) 首件确认AQL (Acceptable Quality Level) 允收品质水准S/S (Sample size) 抽样检验样本大小FPIR (First Piece Inspection Report) 首件检查报告ACC (Accept) 允收REJ (Reject) 拒收CR (Critical) 极严重的MAJ (Major) 主要的MIN (Minor) 轻微的Q/R/S (Quality/Reliability/Service) 品质/可靠度/服务ZD (Zero Defect) 零缺点NG (Not Good) 不行,不合格QI (Quality Improvement) 品质改善QP (Quality Policy) 目标方针TQM (Total Quality Management) 全面品质管理RMA (Return Material Audit) 退料认可LRR (Lot Reject Rate) 批退率NDF (no defect found) 误判7QCT ools (7 Quality Control T ools) 品管七大手法ESD (Electric Static Discharge) 静电释放DPPM (Defective Percent Per Million) 每百万单位的产品不合格率2.3.6不良类型类Misalignment 偏位Tombstone 墓碑Missing parts 缺件Insufficient solder 少锡Solder ball 锡珠Short bridge 短路Open 空焊Part damaged 零件破损Cool solder 冷焊Wrong parts 错件。
内部资料之制程能力控制(英文版)
requires methods such as Design of Experiment (DOE), etc.
• Special Causes:
–Causes that are not present in the
process all the time and do not affect all outcomes, but arise because of specific circumstances
118.57 118.55
118.54 118.56
118.54 118.53
118.55 118.54
118.56 118.55
9th Subgroup 10th Subgroup 11th Subgroup 12th Subgroup
118.60
118.61
118.58
118.60
118.59 118.58 118.60 118.59
Two Types of Product Characteristics
Variable: A characteristic measured in physical units, e.g. millimetres, volts, amps, decibel and seconds.
Attribute: A characteristic that by comparison to some
• Process Capability is designated by Cp and Cpk
• Process Performance is a measure of the performance of a process to be able to consistently produce components that meet the required design specifications. Process Performance includes special causes of variation not present in Process Capability
SPC制程能力管控
以確保制程處于管制狀態(In-contorl),一旦 有任何非特殊原因形成導致制程改變成為失控 狀態(Out-of-contorl),也能及時偵測出來﹐ 甚至進一步找出其原因。
SPC要點
1．SPC是制程現狀特徵值與原制程能力的特徵 值進行比較，以判定制程是否出現異常。 2．SPC是預防為主的行動，其目的是為了有效 的使用資源採取改善行動。 3．SPC是套預防性技術，它不只是進行檢驗還 要對收集的資料進行統計分析和維護，以 提供制程能力許值及制程發展預測的依據。
F
特殊原因
R
E
UCL
Q
U
E
N
C
Y
LCL
特殊原因
時間
控制線從統計意義上將特殊原因造成的變差與普通原因造成的變差分開.
九.統計數據的類型
特性數據（Attribute Data，定性Qualitative)
等級（Categories） 是非 （Yes, No） 通止 （Go, No go） 個體（如 Machine 1, Machine 2, Machine 3 成敗（Pass/Fail） 好壞（Good/Defective）
.計數型資料
如好壞、合格與不合格、一級二級三級等計數 的數據又稱爲計數型數據。其數據分佈爲二項分 佈或泊松分佈。
不同的數據類型採用不同的控制方法。連續型 數據採用Xbar－R 、Xbar－S或X－MR Chart; 計 數型數據則採用p、np、c、u Chart。
連續數據的評價
• 平均值﹑中位數 • 標准偏差
SPC的发展方向
SPC將成為全員應知應會的方法，工程管 理人員的共同語言；
因應專業領域的需求，自動化/即時化的 資料收集及分析方式將得到廣泛利用；
制程能力(CPK PPK)
Process capability
制作： 2005.12.29
1
制程能力的概念 :
制程能力的意义 :
制程能力是指制程在管制状态下,制程符合规格 的能力，即在受控状态下实现过程目标的能力。
一般以下列的制程特性来衡量制程能力 :
• 准确度 (Capability of Accuracy )简称Ca • 精确度 (Capability of Precision )简称Cp
设产品规格为3.5mm0.1mm, 今在产线抽测5个 材料, 量测值如下 : 3.52, 3.53, 3.57, 3.54, 3.53, 则 Cp值计算如下 :
• T=3.6-3.4=0.2, =0.0192, Cp 0.2 1.73
0.0192 6
若本例中的5个抽测值为3.51, 3.53, 3.53, 3.52, 3.52, 则CP值是多少?
n 1
21
制程能力与不良率 :
准确度偏移后，不良率升高(CA偏大)
M
X
22
制程能力与不良率 :
精确度愈差，不良率愈高
CP小，不 良率高
CP大，不 良率高
23
制程能力与不良率 :
从别一观点， CPK所代表是规 格公差与自然差 的比值
由图可知，CPK 愈大，不良率愈 小
Cpk=1
20
制程性能指数
制程性能指数的计算，其 估计的标准差为总的标准 差，包含了组内变异以及 组间变异。
总变异=组内变异+组间 变异。
Pp
Su Sl
6ˆ
Ppk min( Ppu , Ppl )
Ppu
Su x
CPK生产制程能力管控
Z (x x) S
Z (SL x) S
此結果告訴我們流程平均數距離規格界限有幾個標準差
9 © 2003 Six Sigma Office
LITE ON
LITEON TECHNOLOGY CORP.
標準常態分配
YES
Process
Acceptable?
Analyze
NO
NO Analyze
Use “Common Cause Strategy” Establish X’s (Inputs) and Y’s
(Outputs) model Multi-Vari study DOE
Use “Special Cause Strategy” Search for the causes Take immediate actions
(位置的變異)
產品之間
(產品間的變異)
批量之間
(每批間的變異)
生產線別之間
(線與線間的變異)
不同時間
(時間的變異)
測量誤差
(重覆性與再現性)
4 © 2003 Six Sigma Office
LITE ON
LITEON TECHNOLOGY CORP.
解析流程能力
不當的測量 流程能力
所供應物料 的變異
2.5 2.0 1.5 1.0 0.5
1
© 2003 Six Sigma Office
A C DFSS
B
DMAIC
D
A: POOR TECHNOLOGY POOR CONTROL
B: MUST CONTROL TECH IS FINE
英文缩写——精选推荐
CPK：Complex Process Capability index 的缩写，是现代企业用于表示制程能力的指标。
制程能力是过程性能的允许最大变化范围与过程的正常偏差的比值。
制程能力研究在於确认这些特性符合规格的程度，以保证制程成品不符规格的不良率在要求的水准之上，作为制程持续改善的依据。
当我们的产品通过了GageR&R的测试之后，我们即可开始Cpk值的测试。
CPK值越大表示品质越佳。
CPK=min（（X-LSL/3s），（USL-X/3s））Cpk——过程能力指数CPK= Min[ (USL- Mu)/3s, (Mu - LSL)/3s]Cpk应用讲议1. Cpk的中文定义为：制程能力指数，是某个工程或制程水准的量化反应，也是工程评估的一类指标。
2. 同Cpk息息相关的两个参数：Ca , Cp.Ca: 制程准确度。
Cp: 制程精密度。
3. Cpk, Ca, Cp三者的关系：Cpk = Cp * ( 1 - ｜Ca｜)，Cpk是Ca及Cp两者的中和反应，Ca反应的是位置关系(集中趋势)，Cp反应的是散布关系(离散趋势)4. 当选择制程站别Cpk来作管控时，应以成本做考量的首要因素，还有是其品质特性对后制程的影响度。
5. 计算取样数据至少应有20~25组数据，方具有一定代表性。
6. 计算Cpk除收集取样数据外，还应知晓该品质特性的规格上下限(USL，LSL)，才可顺利计算其值。
7. 首先可用Excel的―STDEV‖函数自动计算所取样数据的标准差(σ)，再计算出规格公差(T)，及规格中心值(u). 规格公差＝规格上限－规格下限；规格中心值＝（规格上限+规格下限）/2；8. 依据公式：Ca=(X-U)/(T/2) ，计算出制程准确度：Ca值9. 依据公式：Cp =T/6 ，计算出制程精密度：Cp值10. 依据公式：Cpk=Cp(1-|Ca|) ，计算出制程能力指数：Cpk值11. Cpk的评级标准：（可据此标准对计算出之制程能力指数做相应对策）A++级Cpk≥2.0 特优可考虑成本的降低A+ 级2.0 ＞Cpk ≥ 1.67 优应当保持之A 级1.67 ＞Cpk ≥ 1.33 良能力良好，状态稳定，但应尽力提升为A＋级B 级1.33 ＞Cpk ≥ 1.0 一般状态一般，制程因素稍有变异即有产生不良的危险，应利用各种资源及方法将其提升为A级C 级1.0 ＞Cpk ≥ 0.67 差制程不良较多，必须提升其能力D 级0.67 ＞Cpk 不可接受其能力太差，应考虑重新整改设计制程。
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ON
standard is judged “good” or “bad”, e.g. free from scratches
(visual quality). OFF
The Sources of Process/System Variation
Equipment
Methods
Environment
Jim Christy & Søren Lundsfryd
Comments
Approved for Global Use
NOTE – All comments and improvements should be addressed to the creator of this document.
Contents
Process
Customer Satisfaction
Operators
Material
• All processes have:
–Natural (random) variability
=> due to common causes
–Unnatural variability
=> due to special causes
Section
Heading / Description
1 Variation, Tolerances and Dimensional Control 2 Population, Sample and Normal Distribution 3 Cp and Cpk Concept 4 Use of the NMP Data Collection Spreadsheet 5 Confidence of Cpk
(NMP Alliance, Dallas, USA)
• Joni Laakso
(NMP R&D, Salo, Finland)
• Jim Christy
(NMP SRC, Southwood, UK)
Section 1
Variation, Tolerances and Dimensional Control
time and do not affect all outcomes, but arise because of specific circumstances
–Special causes can be identified using Statistical
Process Control (SPC)
Page
4 15 28 44 52
Process Capability - Evaluating Manufacturing Variation
Acknowledgements
• Benny Matthiassen (NMP CMT, Copenhagen, Denmark)
• Frank Adler
Shewhart (1931)
A tolerance is a allowed maximum variation of a dimension.
Rejected Part
Rejected Product
Acceptable part
Rejected Part
LSL (lower specification limit) 10,7
• Stable Process: A process in which variation in outcomes arises only from common causes
USL
nominal value
LSL
• Unstable Process: A process in which variation is a result of both common and special causes
Two Types of Product Characteristics
Variable: A characteristic measured in physical units, e.g. millimetres, volts, amps, decibel and seconds.
Attribute: A characteristic that by comparison to some
Process Capability (Cp / Cpk / Pp / Ppk)
Global Training Material
ቤተ መጻሕፍቲ ባይዱ
Creator
: Global Mechanics Process Manager
Function
: Mechanics
Approver Document ID
: Gary Bradley / Global Process Team : DMT00018-EN
Version / Status
: V.1.0 / Approved
Location
: Notes : \\…\ NMP \ DOCMANR4 \ PCP \ PC Process Library DocMan
Change History :
Issue Date
1.0
21st Dec’01
Handled By
USL
D
nominal value
LSL
USL Nominal value
LSL
Defect
USL nominal value
LSL
• Common Causes:
–Causes that are implemented in the process due
to the design of the process, and affect all outcomes of the process
–Identifying these types of causes requires
methods such as Design of Experiment (DOE), etc.
• Special Causes:
–Causes that are not present in the process all the
Nominal USL (upper specification limit) 10,80,1 10,9
In most cases we measure only one part per cavity for measurement report