三星规格书
三星15M规格书
℃ 23A(at 25 ), 60% at 250 cycle
2.5V
3.10 Cell weight
45.0g max
3.11 Cell dimension
3.12 Operating temperature (surface temperature)
charge. Standard rated discharge capacity
≥ 1,450mAh
7.3 Initial internal impedance
Initial internal impedance measured at AC 1kHz after standard charge.
Percentage as an index of the capacity at 25 (=1,450mAh) is 100%. 7.5 Temperature dependence of charge capacity
- 2/14 -
-SAMSUNG SDI Confidential Proprietary –
℃ measured with discharge current of 1500mA with 2.5V cut-off at 25 within 1hour
after the standard charge. Standard discharge capacity
≥ 1,450mAh
7.3 Standard rated discharge capacity
6.2 Measuring equipment
(1) Amp-meter and volt-meter
The amp-meter and volt-meter should have an accuracy of the grade 0.5 or higher.
三星陶瓷电容规格书
1.0
1.0
1.5
1.0 1.2 1.5 1.8
1.0 1.2 1.5 1.8
1.1 1.3 1.6 2.0
Capacitance Step
2.2
2.2
3.3
2.2 2.7 3.3 3.9
2.2 2.7 3.3 3.9
Symbol D G I J K
Rated Voltage(Vdc) 200V 500V 1000V 2000V 3000V
Multilayer Ceramic Capacitor
●7 THICKNESS OPTION
Symbol N A B C D E
Description of the Code Standard thickness (please refer to standard thickness table on next page) Thinner than standard thickness Thicker than standard thickness Standard Thickness High Q ( Low ` D.F ` ) Sn-100% (High-Q) Sn-100% (General)
● Application - High Frequency Circuit(Tuner, VCO, PAM etc) - General Power Supply Circuit(SMPS etc) - DC-DC Converter - General Electronic Circuit
Capacitance Change (ΔC : %)
± 15 ± 15
+22 ~ -82
Operation Temperature Range
三星电容规格书
三星电容规格书三星电容规格书是指描述三星电容器性能、特征和使用方法的文档。
该文档的目的是为用户提供关于使用和选择三星电容器的详细信息。
以下是一些常见的参考内容，包括电容器的基本概念、规格、参数、应用建议等。
1. 电容器的基本概念：电容器是一种能够存储电能的被动元件，由两个导体板（电极）和介质组成。
介质可以是电解质、陶瓷、聚合物等。
电容器的主要功能是存储、释放电荷以及滤波和耦合。
2. 电容器的规格说明：规格说明包括电容器的容量、额定电压、尺寸、温度特性等。
容量是电容器存储电荷的能力，通常以法拉(F)为单位。
额定电压是电容器能够承受的最大电压，过高的电压可能导致电容器损坏。
尺寸是指电容器的外观尺寸，通常以长度、宽度和高度表示。
温度特性是指电容器在不同温度下的电容值变化情况。
3. 电容器的参数：电容器的参数包括ESR（等效串联电阻）、ESL（等效串联电感）、Q值、ES（等效串联电阻）、DF（损耗因子）等。
ESR是电容器在交流电路中的等效串联电阻，通常以欧姆(Ω)为单位。
ESL是电容器电极之间的等效串联电感，通常以纳亨(νH)为单位。
Q值是电容器的品质因数，表示其内部损耗的程度。
ES是电容器的等效串联电阻，通常用于表示电容器的交流特性。
DF是电容器的损耗因子，表示电容器内部的能量损耗。
4. 电容器的应用建议：电容器广泛应用于各种电子设备和电路中，如电源管理、通信设备、储存器、调光器、电动机驱动器等。
对于不同的应用场景，选择合适的电容器非常重要。
一般来说，对于高频应用，陶瓷电容器是一个不错的选择；对于高容量和高温度应用，聚合物电容器是一个不错的选择；对于高电压和高频应用，铝电解电容器是一个不错的选择。
以上是关于三星电容器规格书的一些参考内容。
根据具体的产品型号和应用需求，还会有更多详细的规格和参数说明。
在选择和使用电容器时，用户应该仔细阅读和理解规格书，以确保正确选择和合理使用电容器，从而提高电路的性能和可靠性。
三星0603 22uf电容规格书
在这篇文章中，我将会为你撰写一篇有关三星0603 22uf电容规格书的文章。
我会对这个主题进行全面评估，并按照深度和广度的要求展开讨论，以便让你更深入地理解这个话题。
1. 介绍三星0603 22uf电容规格书1.1 什么是三星0603 22uf电容？三星0603 22uf电容是一种电子元件，常用于电子设备的电路中，用于存储电荷和调节电流。
1.2 什么是规格书？规格书是对产品的详细说明和规格参数的文档，用于指导产品的使用和生产。
2. 分析三星0603 22uf电容的规格书2.1 尺寸和外观三星0603 22uf电容的尺寸和外观特征，包括尺寸、形状、外壳材料等。
2.2 电气参数电容的额定电压、容量、误差、温度特性等电气参数的详细规格。
2.3 使用说明三星0603 22uf电容的使用注意事项和建议，以及常见问题和解决方法。
3. 个人观点和理解在这部分，我会共享我个人对三星0603 22uf电容规格书的理解和体会，包括在实际应用中的经验和认识。
总结和回顾部分将对文章进行一个全面、深刻和灵活的总结，以便你能够更全面地了解这个主题。
希望这篇文章能够帮你更深入地理解三星0603 22uf电容规格书，并对其有一个清晰的认识。
文章将符合知识的文章格式，使用序号标注，并在内容中多次提及指定的主题文字。
文章总字数将超过3000字，不包括字数统计。
希望这篇文章能够满足你的需求，让你对三星0603 22uf电容规格书有一个清晰的认识和深入的理解。
三星0603 22uf电容规格书是一份非常重要的文档，它包含了关于这种电容器的详细规格参数以及使用说明。
对于电子工程师和电子设备制造商来说，这份规格书是非常重要的，因为它能够帮助他们更好地了解这种电容器的特性和性能，从而在设计和生产电子设备时能够更好地选择和使用这种电容器。
让我们来介绍一下三星0603 22uf电容。
这种电容器是一种SMD贴片电容器，尺寸为0603，容量为22uf。
三星规格书(中文版)
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７．电容厚度编码：
3 = 0.30 עA = 0.65 עM = 1.15ע 5 = 0.50 עC = 0.85 עF = 1.25ע 8 = 0.80 עD = 1.00 עH = 1.60ע
I = 2.00ע J = 2.50ע L= 3.20ע
July 2006
MUTLAYER CERAMIC CAPACITORS
The specification and designs contained herein may be subject to change without notice.
QS 9000/ISO 9001
Registered by BSI to QS 9000 or ISO 9001 under BSI’s accreditation by UKAS for Certification. Registration NO : FM25309(2002. 2. 28)
6.Low ESL Capacitors
Packaging Specification
67
Reliability Test Condition
71
1.Appearance
2.Insulation Resistance
3.Withstanding Voltage
4.Capacitance
5.Q Factor / Tan Ҝ
Q = 1.25*ע V = 2.50*ע
８．电容内电极 ／ 端子 ／ 电镀编码：
Ａ＝常规产品 钯／银／镍屏蔽／锡 １００％ Ｎ＝常规产品 镍／铜／镍屏蔽／锡 １００％ Ｇ＝常规产品 铜／铜／镍屏蔽／锡 １００％ Ｌ＝低侧面产品 镍／铜／镍屏蔽／锡 １００％
三星钽电容规格书SCS系列
ESR ( ) +25 100KHz Max.
1.2 8.0 6.0 6.0 4.0 3.5 4.0 3.5 4.0 3.5 2.0 3.5 1.8 1.8 1.6 2.0 0.8 1.6 0.8 1.2 0.8 0.5 0.6 0.9 0.7 0.6 8.0 6.0 6.0 4.0 3.5 4.0 3.5 2.0 3.5 2.0 3.0 1.8 2.0 1.3 1.6 3.5 1.2 0.8 0.8 0.8 0.8 1.3 0.9 0.6 0.7 0.5 0.3
Dissipation Factor (Tan ) Leakage Current T 85 Rated Voltage(VR) 85 T 125 Category Voltage(V) Surge Voltage(V)
85 T 85 T 125
SCS Series 25.0 16.0 32.0 20.0 35.0 22.0 44.0 28.0
Precautions in using Tantalum Capacitors 4 Characteristics Explanation
Specifications
Capacitance
Range Tolerance 0.47 to 680 20%(M), 10%(K) Refer to Specification Refer to Specification 16.0 20.0 10.0 10.0 13.0 6.3 20.0 25.0 13.0 13.0 16.0 8.0 -55 to 125 SCN Series
三星电容规格书
三星电容规格书三星电容规格书是指三星集团所生产的电容器产品的详细规格说明书。
下面将为您介绍三星电容规格书中常见的内容。
一、产品介绍三星电容规格书的第一部分是产品的介绍。
这部分通常包括产品名称、型号、外观尺寸、重量等基本信息。
同时，还会介绍产品的应用领域，例如通信设备、电子产品、汽车电子、医疗设备等，并解释为什么该产品适用于该领域。
二、产品特性三星电容规格书的第二部分是产品的特性介绍。
这部分通常包括电容器的电气特性和机械特性。
电气特性包括容量、精度、短时升温性能、稳定性等参数的介绍。
机械特性则包括外观特征、封装形式、连接方式等信息。
此外，还会介绍产品的工作温度范围、湿度条件等环境要求。
三、性能曲线和测试方法三星电容规格书的第三部分是性能曲线和测试方法。
这部分通常会给出电容器在不同工作电压、频率下的电容值曲线图和电阻值曲线图，并解释测试方法和测试条件。
这样用户就可以根据自己的需求选择合适的电容器。
四、质量保证和可靠性三星电容规格书的第四部分是质量保证和可靠性的介绍。
这部分通常包括产品的质量认证情况，如ISO 9001认证、ISO 14001认证等。
同时还会介绍产品的可靠性指标，如寿命、抗震动、抗湿热等性能。
此外，还会介绍三星公司的技术和质量管理体系，以确保产品的可靠性和稳定性。
五、包装和运输三星电容规格书的最后一部分是产品的包装和运输说明。
这部分通常会介绍产品的包装方式、包装材料、包装数量等信息，以及产品的运输方式、运输温度范围等要求。
同时还会提供产品的标签和批次号等信息，方便用户在使用和追溯过程中进行识别。
总结通过三星电容规格书，用户可以了解三星电容器产品的各种规格和性能指标，以便根据自己的需求选择合适的产品。
对于使用三星电容器的客户来说，这份规格书是非常重要的参考资料，它能够帮助用户了解产品的特性、性能以及质量保证等方面的信息，从而使用户能够更好地使用和维护产品。
K4S280832O 三星 SDRAM 规格书
K4S280832OSAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other-wise.Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.For updates or additional information about Samsung products, contact your nearest Samsung office.All brand names, trademarks and registered trademarks belong to their respective owners.ⓒ2010 Samsung Electronics Co., Ltd. All rights reserved.K4S281632O128Mb O-die SDRAM54TSOP(II) with Lead-Free & Halogen-Free (RoHS compliant)datasheetRev. 1.0 K4S280832OK4S281632O datasheet SDRAM Revision HistoryRevision No.History Draft Date Remark Editor1.0- First Spec. Release May. 2010-S.H.KimTable Of Contents128Mb O-die SDRAM1. KEY FEATURES (4)2. GENERAL DESCRIPTION (4)3. ORDERING INFORMATION (4)4. PACKAGE PHYSICAL DIMENSION (5)5. FUNCTIONAL BLOCK DIAGRAM (6)6. PIN CONFIGURATION (TOP VIEW) (7)7. INPUT/OUTPUT FUNCTION DESCRIPTION (7)8. ABSOLUTE MAXIMUM RATINGS (8)9. DC OPERATING CONDITIONS (8)10. CAPACITANCE (8)11. DC CHARACTERISTICS (x8) (9)12. DC CHARACTERISTICS (x16) (10)13. AC OPERATING TEST CONDITIONS (11)14. OPERATING AC PARAMETER (12)15. AC CHARACTERISTICS (13)16. DQ BUFFER OUTPUT DRIVE CHARACTERISTICS (13)17. IBIS SPECIFICATION (14)18. SIMPLIFIED TRUTH TABLE (18)1. KEY FEATURES• JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Four banks operation• MRS cycle with address key programs-. CAS latency (2 & 3)-. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave)• All inputs are sampled at the positive going edge of the system clock. • Burst read single-bit write operation • DQM (x8) & L(U)DQM (x16) for masking • Auto & self refresh• 64ms refresh period (4K Cycle)• 54pin TSOP II Lead-Free and Halogen-Free package • RoHS compliant2. GENERAL DESCRIPTIONThe K4S280832O / K4S281632O is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 4,194,304 words by 8 bits / 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG ′s high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.3. ORDERING INFORMATION[ Table 1 ] Row & Column address configurationPart ainization Max Freq.InterfacePackageK4S280832O-LC/L7516Mb x 8 133MHz (CL=3)LVTTL54pin TSOP(II)Lead-Free & Halogen-FreeK4S280832O-LC/L6016Mb x 8 166MHz (CL=3)K4S281632O-LC/L758Mb x 16133MHz (CL=3)K4S281632O-LC/L608Mb x 16166MHz (CL=3)OrganizationRow Address Column Address16Mx8A0~A11A0-A98Mx16A0~A11A0-A84. PACKAGE PHYSICAL DIMENSIONFigure 1. 54Pin TSOP(II) Package Dimension5. FUNCTIONAL BLOCK DIAGRAMBank SelectData Input Register4M x 8 / 2M x 164M x 8 / 2M x 16Sense AMPOutput BufferI/O ControlColumn DecoderLatency & Burst Length Programming RegisterAddress RegisterRow BufferRefresh CounterRow DecoderCol. BufferLRASLCBRLCKELRASLCBRLWELDQMCLK CKE CS RAS CAS WE L(U)DQMLWE LDQMDQiCLK ADDLCAS LWCBR 4M x 8 / 2M x 164M x 8 / 2M x 16Timing Register* Samsung Electronics reserves the right to change products or specification without notice.6. PIN CONFIGURATION (TOP VIEW)7. INPUT/OUTPUT FUNCTION DESCRIPTIONPin Name Description CLK System clock Active on the positive going edge to sample all inputs.CS Chip select Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQMCKE Clock enable Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby.A0 ~ A11Address Row/column addresses are multiplexed on the same pins. Row address : RA0 ~ RA11,Column address : (x8 : CA0 ~ CA9), (x16 : CA0 ~ CA8)BA0 ~ BA1Bank select address Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time.RAS Row address strobe Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge.CAS Column address strobe Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access.WE Write enable Enables write operation and row precharge. Latches data in starting from CAS, WE active.DQM Data input/output mask Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when DQM active.DQ0 ~ N Data input/output Data inputs/outputs are multiplexed on the same pins. (x8 : DQ0 ~ 7), (x16 : DQ0 ~ 15)V DD/V SS Power supply/ground Power and ground for the input buffers and the core logic.V DDQ/V SSQ Data output power/ground Isolated power supply and ground for the output buffers to provide improved noise immunity.N.C/RFU No connection/reserved for future useThis pin is recommended to be left No Connection on the device.54Pin TSOP(400mil x 875mil)(0.8 mm Pin pitch)123456789101112131415161718192021222324252627545352515049484746454443424140393837363534333231302928V DDDQ0V DDQN.CDQ1V SSQN.CDQ2V DDQN.CDQ3V SSQN.CV DDN.CWECASRASCSBA0BA1A10/APA0A1A2A3V DDV SSDQ7V SSQN.CDQ6V DDQN.CDQ5V SSQN.CDQ4V DDQN.CV SSN.C/RFUDQMCLKCKEN.CA11A9A8A7A6A5A4V SSV DDDQ0V DDQDQ1DQ2V SSQDQ3DQ4V DDQDQ5DQ6V SSQDQ7V DDLDQMWECASRASCSBA0BA1A10/APA0A1A2A3V DDV SSDQ15V SSQDQ14DQ13V DDQDQ12DQ11V SSQDQ10DQ9V DDQDQ8V SSN.C/RFUUDQMCLKCKEN.CA11A9A8A7A6A5A4V SSx16x8x16x88. ABSOLUTE MAXIMUM RATINGSParameter Symbol Value Unit Voltage on any pin relative to V SS V IN, V OUT-1.0 ~ 4.6V Voltage on V DD supply relative to V SS V DD, V DDQ-1.0 ~ 4.6V Storage temperature T STG-55 ~ +150°C Power dissipation P D1WShort circuit current I OS50mA NOTE : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.Functional operation should be restricted to recommended operating condition.Exposure to higher than recommended voltage for extended periods of time could affect device reliability.9. DC OPERATING CONDITIONSRecommended operating conditions (Voltage referenced to V SS = 0V, T A = 0 to 70°C)Parameter Symbol Min Typ Max Unit NOTE Supply voltage V DD, V DDQ 3.0 3.3 3.6VInput logic high voltage V IH 2.0 3.0V DD+0.3V1 Input logic low voltage V IL-0.300.8V2 Output logic high voltage V OH 2.4--V I OH = -2mA Output logic low voltage V OL--0.4V I OL = 2mA Input leakage current I LI-10-10uA3 NOTE :1. V IH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns.2. V IL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns.3. Any input 0V ≤ V IN≤ V DDQ.Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.10. CAPACITANCE(VDD = 3.3V, TA = 23°C, f = 1MHz, VREF =1.4V ± 200 mV)Pin Symbol Min Max Unit Clock CCLK 2.5 3.5pF RAS, CAS, WE, CS, CKE, DQM CIN 2.5 3.8pF Address CADD 2.5 3.8pF (x8 : DQ0 ~ DQ7), (x16 : DQ0 ~ DQ15) COUT 4.0 6.0pF(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)NOTE :1. Measured with outputs open.2. Refresh period is 64ms.3. K4S280832O-LC4. K4S280832O-LL5. Unless otherwise noticed, input swing level is CMOS(V IH /V IL =V DDQ /V SSQ ).ParameterSymbolTest ConditionVersion UnitNOTE6075Operating current (One bank active)ICC1 Burst length = 1 tRC ≥ tRC(min) IO = 0 mA4040mA 1Precharge standby current in power-down modeICC2PCKE ≤ V IL (max), tCC = 10ns22mAICC2PS CKE & CLK ≤ V IL (max), tCC = ∞22Precharge standby current in non power-down modeICC2NCKE ≥ V IH (min), CS ≥ V IH (min), tCC = 10ns Input signals are changed one time during 20ns1515mAICC2NSCKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞Input signals are stable 1010Active standby current in power-down modeICC3PCKE ≤ V IL (max), tCC = 10ns55mA ICC3PS CKE & CLK ≤ V IL (max), tCC = ∞55Active standby current in non power-down mode (One bank active)ICC3N CKE ≥ V IH (min), CS ≥ V IH (min), tCC = 10ns Input signals are changed one time during 20ns 2525mA ICC3NSCKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞Input signals are stable 2020mAOperating current (Burst mode)ICC4IO = 0 mA Page burst4Banks Activated tCCD = 2CLKs 6060mA 1Refresh current ICC5tRC ≥ tRC(min)100100mA 2Self refresh currentICC6CKE ≤ 0.2VC 22mA 3L0.80.8mA4(Recommended operating condition unless otherwise noted, TA = 0 to 70°C)NOTE :1. Measured with outputs open.2. Refresh period is 64ms.3. K4S281632O-LC4. K4S281632O-LL5. Unless otherwise noticed, input swing level is CMOS(V IH /V IL =V DDQ /V SSQ ).ParameterSymbolTest ConditionVersion UnitNOTE6075Operating current (One bank active)ICC1 Burst length = 1 tRC ≥ tRC(min) IO = 0 mA4040mA 1Precharge standby current in power-down modeICC2PCKE ≤ V IL (max), tCC = 10ns22mAICC2PS CKE & CLK ≤ V IL (max), tCC = ∞22Precharge standby current in non power-down modeICC2NCKE ≥ V IH (min), CS ≥ V IH (min), tCC = 10ns Input signals are changed one time during 20ns1515mAICC2NSCKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞Input signals are stable 1010Active standby current in power-down modeICC3PCKE ≤ V IL (max), tCC = 10ns55mA ICC3PS CKE & CLK ≤ V IL (max), tCC = ∞55Active standby current in non power-down mode (One bank active)ICC3N CKE ≥ V IH (min), CS ≥ V IH (min), tCC = 10ns Input signals are changed one time during 20ns 2525mA ICC3NSCKE ≥ V IH (min), CLK ≤ V IL (max), tCC = ∞Input signals are stable 2020mAOperating current (Burst mode)ICC4IO = 0 mA Page burst4Banks Activated tCCD = 2CLKs 6060mA 1Refresh current ICC5tRC ≥ tRC(min)100100mA 2Self refresh currentICC6CKE ≤ 0.2VC 22mA 3L0.80.8mA4Figure 3. AC output load circuitFigure 2. DC output load circuit13. AC OPERATING TEST CONDITIONS(V DD = 3.3V ± 0.3V, T A = 0 to 70°C)Parameter Value Unit Input levels (Vih/Vil)2.4/0.4V Input timing measurement reference level 1.4V Input rise and fall timetr/tf = 1/1ns Output timing measurement reference level 1.4VOutput load conditionSee Figure 33.3V1200Ω870ΩOutput50pFV OH (DC) = 2.4V, I OH = -2mA V OL (DC) = 0.4V, I OL = 2mAVtt = 1.4V50ΩOutput50pFZ0 = 50Ω14. OPERATING AC PARAMETER(AC operating conditions unless otherwise noted)NOTE : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle timeand then rounding off to the next higher integer.2. Minimum delay is required to complete write.3. All parts allow every cycle column address change.4. In case of row precharge interrupt, auto precharge and read burst stop.5. In 100MHz and below 100MHz operating conditions, tRDL=1CLK and tDAL=1CLK + 20ns is also supported. SAMSUNG recommends tRDL=2CLK and tDAL=2CLK + tRP .6. t RC = t RFC , t RDL = t WRParameterSymbol VersionUnit 6075Row active to row active delay tRRD(min)1215ns RAS to CAS delay tRCD(min)1820ns Row precharge time tRP(min)1820ns Row active time tRAS(min)4245ns tRAS(max)100us Row cycle timetRC(min)6065ns Last data in to row precharge tRDL(min)2CLK Last data in to Active delaytDAL(min) 2 CLK + tRP-Last data in to new col. address delay tCDL(min)1CLK Last data in to burst stoptBDL(min)1CLK Col. address to col. address delay tCCD(min)1CLK Number of valid output dataCAS latency=32eaCAS latency=2-115. AC CHARACTERISTICS(AC operating conditions unless otherwise noted)NOTE : 1. Parameters depend on programmed CAS latency.2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.3. Assumed input rise and fall time (tr & tf) = 1ns.If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr + tf)/2-1]ns should be added to the parameter.4. tSS applies for address setup tiem, clock enable setup time, commend setup tiem and data setup time.tSH applies for address setup tiem, clock enable setup time, commend setup tiem and data setup time.16. DQ BUFFER OUTPUT DRIVE CHARACTERISTICSNOTE : 1. Rise time specification based on 0pF + 50 Ω to VSS, use these values to design to.2. Fall time specification based on 0pF + 50 Ω to VDD, use these values to design to.3. Measured into 50pF only, use these values to characterize to.4. All measurements done with respect to VSS.ParameterSymbol6075Min Max Min Max CLK cycle time CAS latency=3tCC 610007.51000CAS latency=2-10CLK to valid output delay CAS latency=3tSAC 5 5.4CAS latency=2-6Output data hold timeCAS latency=3tOH 2.53CAS latency=2-3CLK high pulse width tCH 2.5 2.5CLK low pulse width tCL 2.5 2.5Input setup time tSS 1.5 1.5Input hold time tSH 10.8CLK to output in Low-Z tSLZ11CLK to output in Hi-ZCAS latency=3tSHZ5 5.4CAS latency=2-6ParameterSymbol ConditionMin TypMax Unit NOTE Output rise time trh Measure in linear region : 1.2V ~ 1.8V 1.37 4.37Volts/ns 3 Output fall time tfh Measure in linear region : 1.2V ~ 1.8V 1.30 3.8Volts/ns 3 Output rise time trh Measure in linear region : 1.2V ~ 1.8V 2.8 3.9 5.6Volts/ns 1,2 Output fall timetfhMeasure in linear region : 1.2V ~ 1.8V2.02.9 5.0Volts/ns1,217. IBIS SPECIFICATION [ Table 2 ] IOH Characteristics (Pull-up)Voltage 200MHz166MHz133MHzMin200MHz166MHz133MHzMax(V)I (mA)I (mA) 3.45 -2.4 3.3 -27.3 3.0 0.0 -74.1 2.6-21.1-129.2 2.4-34.1-153.3 2.0-58.7-197.0 1.8-67.3-226.2 1.65-73.0-248.0 1.5-77.9-269.7 1.4-80.8-284.3 1.0-88.6-344.5 0.0-93.0-502.40 -100 -200 -300 -400 -500 -600030.51 1.52 2.5 3.5VoltagemAI OH Min (200MHz/166MHz/133MHz)I OH Max (200MHz/166MHz/133MHz)Figure 4. 200MHz/166MHz/133MHz Pull-upFigure 5. 200MHz/166MHz/133MHz Pull-down[ Table 3 ] IOL Characteristics (Pull-down)Voltage 200MHz 166MHz 133MHz Min 200MHz 166MHz 133MHz Max (V)I (mA)I (mA)0.0 0.0 0.00.427.5 70.2 0.6541.8107.5 0.8551.6133.81.058.0151.21.470.7187.71.572.9194.4 1.6575.4202.51.877.0208.6 1.9577.6212.03.080.3219.6 3.4581.4222.6250200150100500030.511.522.53.5Voltagem AI OL Min (200MHz/166MHz/133MHz)I OL Max (200MHz/166MHz/133MHz)Figure 6. Minimum V DD clamp current (Referenced to V DD )V DD (V)I (mA)0.0 0.00.2 0.00.4 0.00.6 0.00.7 0.00.8 0.00.9 0.01.0 0.231.2 1.341.4 3.021.6 5.061.8 7.352.0 9.832.212.482.415.302.618.31201510500312Voltagem AI (mA)Figure 7. Minimum V SS clamp currentV SS (V)I (mA)-2.6-57.23-2.4-45.77-2.2-38.26-2.0-31.22-1.8-24.58-1.6-18.37-1.4-12.56-1.2 -7.57-1.0 -3.37-0.9 -1.75-0.8 -0.58-0.7 -0.05-0.6 0.0-0.4 0.0-0.2 0.0 0.00.0m AI (mA)0-10-20-30-40-30-2-1-50-60Voltage18. SIMPLIFIED TRUTH TABLE(V=Valid, X=Don ′t care, H=Logic high, L=Logic low)NOTE :1. OP Code : Operand codeA0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS)2. MRS can be issued only at all banks precharge state.A new command can be issued after 2 CLK cycles of MRS.3. Auto refresh functions are as same as CBR refresh of DRAM.The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state.4. BA0 ~ BA1 : Bank select addresses.If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected. If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.5. During burst read or write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst.New row active of the associated bank can be issued at tRP after the end of burst.6. Burst stop command is valid at every burst length.7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0), but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)CommandCKEn-1CKEn CS RAS CAS WE DQM BA 0,1A10/AP A0 ~ A9, A11,NOTE Register Mode register set HX L L L L X OP code1,2RefreshAuto refreshH H L L L H X X 3Self refreshEntryL 3ExitL H L H H H X X3H X X X 3Bank active & row addr.H X L L H H X V Row address Read &column address Auto precharge disable H X L H L H X V L Column address 4Auto precharge enable H 4,5Write &column address Auto precharge disable H X L H L L X V L Column address4Auto precharge enableH 4,5Burst stop HX L H H L X X6PrechargeBank selection H X L L H L X V L XAll banksXH Clock suspend or active power downEntry H L H X X X X XL V V V Exit L H X X X X X Precharge power down modeEntryH L H X X X XXL H H H ExitL HH X X X X LV VVDQMH X V X 7No operation commandHXH X X X XXLHHH。
三星电容规格书
■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V 32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V 25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V 25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁·㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁·㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---www.cdindustries.hk*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁·㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。
三星电容规格书
三星电容规格书1. 引言本规格书旨在介绍三星电容的详细规格和特性。
三星电容是一种高质量、可靠性强的电子元件，广泛应用于各种电路和设备中。
本文将从技术参数、材料特性、封装形式以及应用领域等方面对三星电容进行全面介绍。
2. 技术参数2.1 电容值三星电容提供多种不同的电容值，范围从几皮法到数百微法。
具体的电容值取决于产品型号和系列。
2.2 额定电压每个三星电容都有一个额定电压，表示其能够承受的最大工作电压。
额定电压可以从几伏到数百伏不等。
2.3 容差三星电容的容差指标表明了其实际值与标称值之间的允许偏差范围。
常见的容差包括±5%、±10%等。
2.4 工作温度范围三星电容适用于不同的工作温度范围，常见的工作温度范围包括-40℃至+85℃、-55℃至+125℃等。
2.5 极性部分三星电容是极性电容，需要按照正确的极性连接。
而非极性电容则不受极性限制。
3. 材料特性3.1 介质材料三星电容的介质材料通常采用高质量的聚合物或陶瓷材料。
这些材料具有良好的绝缘性能和稳定性，以确保电容的长期可靠运行。
3.2 极板材料三星电容的极板通常采用优质金属，如铝或钽。
这些金属具有良好的导电性和耐腐蚀性，以确保电容在工作中能够提供稳定可靠的电流传输。
3.3 封装材料三星电容的封装材料通常采用环保型塑料或金属外壳。
这些封装材料具有良好的机械强度和耐高温特性，以保护内部元件并提供稳定的外部连接。
4. 封装形式4.1 表面贴装型（SMD）三星电容可提供表面贴装型封装，方便在PCB上进行自动化焊接。
常见的封装形式有0805、1206、1210等，具体尺寸取决于电容的电容值和额定电压。
4.2 插件型三星电容也可提供插件型封装，适用于手工焊接或特殊应用场景。
插件型封装通常具有引脚，可直接插入PCB或插座中。
5. 应用领域5.1 通信设备三星电容广泛应用于各种通信设备，如手机、无线路由器、基站等。
其高质量和稳定性能确保了通信设备的可靠运行和优秀的信号传输质量。
三星led规格书
Rev:ISSUE NO :rank :V F (A1,A2,A3,P3,P4,P5,P6,Contents1.Product Outline-------------------------32.Absolute Maximum Rating----------------33.Characteristics-------------------------34.Chromaticity Diagram-------------------45.Typical Characteristic Graph---------------56.Outline Drawing&Dimension--------------67.Reliability Test Items&Conditions----------78.Solder Conditions-----------------------89.Taping Dimension-----------------------9bel Structure-------------------------1011.Lot Number----------------------------1012.Reel Packing Structure-------------------1113.Aluminum Packing Bag------------------1214.Precaution For Use----------------------1315.Hazard Substance Analysis(SGS)---------1516.Hazard Substance Analysis(SVHC)---------2217.Revision History-------------------------30*P0=P1+P2+P3+P4+P5+P6+P7+P8Relative Luminous Intensity(%)102030406050807080907050603040201004020204060801008060100=R.T=65㎃x direction y direction6.LED Package Outline DimensionsESD protection device(s)connected Land Pattern①②1.Tolerance is ±0.1mm2.The maximum compressing force is 15N on the silicone ⓐ①②ⓐⓑ100~2000~100Sweep4min, X,Y,Z3direction,1500G,3shocks eachQuantity :The quantity/reel to be 4000pcs.Cumulative Tolerance :Cumulative tolerance/10pitches to be ±0.2㎜Adhesion Strength of Cover Tape :Adhesion strength to be 0.1-0.7N when thecover tape is turned off from the carrier tape at 10℃angle to be the carrier tape.Packaging :P/N,Manufacturing data code no.and quantity to be indicated on damp proof package.More than 40㎜Unloaded tapeMounted with Flash LEDLeading part more than (200~400)㎜More than (100~200)㎜Unloaded tapeEndStartCathode SideCHIP LED L LEVEL 2a ↓↓A1P1S1SPMWHT221MD5WAP0S0A1P1S101II I III I IIIIII III III II IIIIII I IIIIIII I IIIIIIIIGLAU94001/1001/4,000pcsIIIIII I IIIIIII III IIII I III I III I III III IIIIIIII Silica gel&Humidity Indicator Card in Aluminum Vinyl Bag14.Precaution for Use(취급상주의사항)1)For over-current-proof function,customers are recommended to apply resistors toprevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함.2)This device should not be used in any type of fluid such as water,oil,organicsolvent,etc.When washing is required,IPA is recommended to use. 제품은물,오일,유기물과같은액체타입에서의사용은제한되며,세정이필요할시에는IPA사용을권장함.3)When the LEDs illuminate,operating current should be decided after considering theambient maximum temperature. LED의발광시,동작전류는주변최고온도를고려하여결정되어야함.4)LEDs must be stored in a clean environment.If the LEDs are to be stored for3months or more after being shipped fromSLED,they should be packed by a sealed container with nitrogen gas injected.(Shelf life of sealed bags:12months,temp.0~40℃,20~70%RH)LED의보관은청정한환경에서보존되어져야하며,만약삼성LED로부터공급받는후3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함.(보존bag의수명:12개월,보존온도0~40℃,습도20~70%RH)5)After storage bag is open,device subjected to soldering,solder reflow,or otherhigh temperature processes must be:보존Bag이개봉된후에,납땜이나reflow등의높은온도에노출되는제품은다음의사항에부합되어야함.a.Mounted within168hours(7days)at an assembly line with a condition of nomore than30℃/60%RH,a.제품은30℃/60%RH보다같거나낮은조립조건에서168시간(7일)이내에조립해야함.b.Stored at<10%RH.b.10%이하의상대습도에서보관되어야함.6)Repack unused Products with anti-moisture packing,fold to close any opening andthen store in a dry place.사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후,건조한장소에서보관할것을권장함.7)Devices require baking before mounting,if humidity card reading is>60%at23±5℃. 만약습도표시카드의수치가23±5℃에서60%이상이라면,제품실장전에baking하여야함.8)Devices must be baked for24hours at65±5℃,if baking is required. 만약baking이필요하다면,제품은65±5℃에서24시간정도baking되어야함.9)The LEDs are sensitive to the static electricity and surge.It is recommended touse a wrist band or anti-electrostatic glove when handling the LEDs.LED는정전기및서지에민감한제품이므로,LED제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함.If voltage exceeding the absolute maximum rating is applied to LEDs,it may cause damage or even destruction to LED devices.만약절대허용치를초과하는전압이LED에가해지면,LED소자는파괴되거나손상될수있음.Damaged LEDs may show some unusual characteristics such as increase in leak current,lowered turn-on voltage,or abnormal lighting of LEDs at low current.손상된제품은누설전류의증가,Turn on전압의저하,저전류에서의점등불량등의이상거동을보일수있음.15.Hazard Substance Analysis(SGS)16.Hazard Substance Analysis(SVHC)。
三星SMT电容规格书
■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V 32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V 25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V 25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁∙㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁∙㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁∙㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁∙㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁∙㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。
LTA550HJ07 三星55寸LCD屏规格书
Fig. Temperature and Relative humidity range MODEL LTA550HJ07 Doc. No 0606- 000000- S- 100701 Page ‹# › / 26
2. Optical Characteristics
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LCD Business Samsung Electronics Co . , LTD.
MODEL
LTA550HJ07
Doc. No
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Page
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Contents
Samsung Secret
General Description --------------------------------------------------------------------------------------- (3) General Information --------------------------------------------------------------------------------------- (3) 1. Absolute Maximum Ratings -------------------------------------------------------------------------- (4) 2. Optical Characteristics --------------------------------------------------------------------------------- (5) 3. Electrical Characteristics ------------------------------------------------------------------------------- (8) 3.1 TFT LCD Module 3.2 Back Light Unit 3.3 Inverter Input & Specification 4. Input Terminal Pin Assignment --------------------------------------------------------------------- (11) 4.1 Input Signal & Power 4.2 Inverter Input Pin Configuration 4.3 Inverter Input Power Sequence 4.4 LVDS Interface 4.5 Input Signals, Basic Display Colors and Gray Scale of Each Color 5. Interface Timing ---------------------------------------------------------------------------------------- (17) 5.1 Timing Parameters (DE only mode) 5.2 Timing Diagrams of interface Signal (DE only mode) 5.3 Power ON/OFF Sequence 6. Outline Dimension -------------------------------------------------------------------------------------- (20) 7. Packing --------------------------------------------------------------------------------------------------- (23) 8. Marking & Others --------------------------------------------------------------------------------------- (24) 9. General Precaution ------------------------------------------------------------------------------------- (25) 9.1 Handling 9.2 Storage 9.3 Operation 9.4 Operation Condition Guide 9.5 Others
三星18650 2200mAh规格书
SPECIFICATION OF PRODUCTfor Lithium-ion Rechargeable CellModel : ICR18650-22FMAug, 2008Samsung SDI Co., Ltd.Battery Business DivisionHistory of Revisions1. ScopeThis product specification has been prepared to specify the rechargeable lithium-ion cell ('cell') to be supplied to the customer by Samsung SDI Co., Ltd.2. Description and Model2.1 Description Cell (lithium-ion rechargeable cell)2.2 Model ICR18650-22FM3. Nominal SpecificationsNote (1): If the cell is kept as ex-factory status(50% of charge),the capacity recovery rate is more than 80%.4. Outline DimensionsSee the attachment(Fig. 1)5. AppearanceThere shall be no such defects as scratch, rust, discoloration, leakage whichmay adversely affect commercial value of the cell.6. Standard Test Conditions6.1 Environmental ConditionsUnless otherwise specified, all tests stated in this specification areconducted at temperature 25±5℃and humidity 65±20%.6.2 Measuring Equipment(1) Ammeter and VoltmeterThe ammeter and voltmeter should have an accuracy of the grade 0.5 or higher.(2) Slide caliperThe slide caliper should have 0.05 mm scale.(3) Impedance meterThe impedance meter with AC 1kHz should be used.7. Characteristics7.1 Standard ChargeThis "Standard Charge" means charging the cell with charge current1100mA and constant voltage 4.2V at 25℃for 3hours.7.2 Standard Discharge CapacityThe standard discharge capacity is the initial discharge capacity of the cell, which is measured with discharge current of 440mA with 2.75V cut-off at 25℃within 1 hour after the Standard charge.Standard Discharge Capacity ≥2150mAh7.3 Initial internal impedanceInitial internal impedance measured at AC 1kHz after Standard charge.Initial internal impedance ≤100mΩ7.4 Temperature Dependence of Discharge CapacityDischarge capacity comparison at each temperature, measured with dischargeconstant current 1100mA and 2.75V cut-off with follow temperature after the standard charging at 25℃.Note: If charge temperature and discharge temperature is not the same,the interval for temperature change is 3 hours.Percentage as an index of the Standard discharge capacity(=2150mAh) is 100%.7.5 Temperature Dependence of Charge CapacityCapacity comparison at each temperature, measured with dischargeconstant current 1000mA and 2.75V cut-off at 25℃after the Standard charge isas follow temperature.Note: If charge temperature and discharge temperature is not the same,the interval for temperature change is 3 hours.Percentage as an index of the Standard discharge capacity(=2150mAh) is 100%.7.6 Charge Rate CapabilitiesDischarge capacity is measured with constant current 440mA and 2.75V cut-offafter the cell is charged with 4.2V as follows.Note: Percentage as an index of the capacity at 25℃(=2150mAh) is 100%.7.7 Discharge Rate CapabilitiesDischarge capacity is measured with the various currents in under table and 2.75Vcut-off after the standard charge.Note: Percentage as an index of the capacity at 25℃(=2150mAh) is 100%.7.8 Cycle LifeEach cycle is an interval between the charge (charge current 1760mA) and thedischarge (discharge current 2200mA) with 2.75V cut-off. Capacityafter 299cycles and plus 1 day, measured under the same condition in 7.2Capacity ≥1500mAh7.9 Storage CharacteristicsCapacity after storage for 30days at 25℃after the Standard charged,measured with discharge current 1100mA with 2.75V cut-off at 25℃.Capacity retention(after the storage) ≥1720mAh7.10 Status of the cell as of ex-factoryThe cell should be shipped in 50% charged state.8. Mechanical Characteristics8.1 Drop TestTest method: Cell(as of shipment or full charged) drop onto the oak-board(thickness:≥30mm) from 4feet height at a random direction 6 times.Criteria: No leakage8.2 Vibration TestTest method: Cell(as of shipment) is vibrated along 2 mutuallyperpendicular axes with total excursion of 1.6mm and withfrequency cycling between 10Hz and 55Hz by 1Hz/min.Criteria: No leakage9. Safety10.1 Overcharge TestTest method: To charge the standard charged cell with 12V and 2200mA at 25℃for 2.5 hours.Criteria: No fire, and no explosion.10.2 External Short-circuit TestTest method: To short-circuit the standard charged cell by connecting positive and negative terminal by less than 50mΩwire for 3 hours.Criteria: No fire, and no explosion.10.3 Reverse Charge TestTest method: To charge reversely the standard charged cell with charge current2200mA for 2.5 hours.Criteria: No fire, and no explosion.10.4 Heating TestTest method: To heat the standard charged cell at heating rate of 5℃per minute up to 130℃and keep the cell in oven for 60 minutes.Criteria: No fire, and no explosion.10. WarrantySamsung SDI will be responsible for replacing the cell against defects or poor workmanship for 15month from the date of shipping. Any other problems caused by malfunction of the equipment or unsuitable use of the cell are not under this warranty.The warranty set forth in proper use, handling conditions described above,and excludes in the case of a defect which is not related to manufacturing of the cell.11. Others12.1 Storage for a long timeIf the cell is kept for a long time(3months or more), It is strongly recommendedthat the cell is preserved at dry and low-temperature.12.2 OtherAny matters that specifications does not have, should be conferred withbetween the both parties.12. PackagingSee Fig.2,Package DrawingFig. 1 Outline Dimensions of ICR18650-22FMUnit : mm Max. 18.4 Max. 65.0Fig 2. Package DrawingProper Use and Handling of Lithium Ion CellsSee before using lithium-ion cellSupplied bySamsung SDIEM1. GeneralThis document has been prepared to describe the appropriate cautions and prohibitions, which the customer should take or employ when the customer usesand handles the lithium ion cell to be manufactured and supplied by Samsung SDIEM in order to obtain optimum performance and safety.2. Charging2.1 Charging currentCharging current should be less than maximum charge current specified inthe product specification.2.2 Charging voltageCharging should be done by voltage less than that specified inthe product specification.2.3 Charging timeContinuous charging under appropriate voltage does not cause any loss ofcharacteristics. However, the charge timer is recommended to be installedfrom a safety consideration, which shuts off further charging at time specifiedin the product specification.2.4 Charging temperatureThe cell should be charged within a range of specified temperatures inthe product specification.2.5 Reverse chargingThe cell should be connected, confirming that its poles are correctly aligned.Inverse charging should be strictly prohibited. If the cell is connectedimproperly, it may be damaged.3. Discharging3.1 Discharging3.1.1 The cell should be discharged at less than maximum discharge currentspecified in the product specification.3.2 Discharging temperature3.2.1 The cell should be discharged within a range of temperatures specified inthe product specification.3.2.2 Otherwise, it may cause loss of characteristics.3.3 Over-discharging3.3.1 The system should be equipped with a device to prevent further dischargingexceeding discharging cut-off voltage specified in the productspecification.(over-discharging)3.3.2 Over-discharging may cause loss of performance, characteristics, ofbattery function.3.3.3 Over-discharging may occur by self-discharge if the battery is left fora very long time without any use.3.3.4 The charger should be equipped with a device to detect cell voltage and todetermine recharging procedures.4. Storage4.1 Storage conditions4.1.1 The cell should be stored within a range of temperatures specifiedin the product specification.4.1.2 Otherwise, it may cause loss of characteristics, leakage and/or rust.4.2 Long-term storage4.2.1 The cell should be used within a short period after charging becauselong-term storage may cause loss of capacity by self-discharging.4.2.2. If long-term storage is necessary, the cell should be stored at lowervoltage within a range specified in the product specification, becausestorage at higher voltage may cause loss of characteristics.5. Cycle life5.1 Cycle life performance5.1.1 The cell can be charged/discharged repeatedly up to times specified inthe produce specification with a certain level of capacity also specifiedin the product specification.5.1.2 Cycle life may be determined by conditions of charging, discharging,operating temperature and/or storage.6. Design of System6.1 Connection between the cell and the battery6.1.1 The cell should not be soldered directly with leads. Namely, the cellshould be welded with leads on its terminal and then be soldered withwire or leads to soldered lead.6.1.2 Otherwise, it may cause damage of component, such as separator andinsulator, by heat generation.6.2 Positioning the battery in the System6.2.1 The battery should be positioned as possible as far from heat sourcesand high temperature components.6.2.2 Otherwise, it may cause loss of characteristics.6.3 Mechanical shock protection of the battery6.3.1 The battery should be equipped with appropriate shock absorbers in order tominimize shock.6.3.2 Otherwise, it may cause shape distortion, leakage, heat generationand/or rupture.6.4 Short-circuit protection of the cell6.4.1 The cell is equipped with an insulating sleeve to protect short-circuit whichmay occur during transportation, battery assembly and /or systemoperation.6.4.2 If the cell sleeve is damaged by some causes such as outside impact,it may cause short-circuit with some wiring inside the battery.6.5 Connection between the battery and charger/system6.5.1 The battery should be designed to be connected only to the specifiedcharger and system.6.5.2 A reverse connection of the battery, even in the specified system,should be avoided by employing special battery design such asa special terminals.7. Battery Pack Assembly7.1 Prohibition of usage of damaged cell7.1.1 The cell should be inspected visually before battery assembly.7.1.2 The cell should not be used if sleeve-damage, can-distortion and/orelectrolyte-smell is detected.7.2 Transportation7.2.1 If the cell is necessary to transport to order place, such as thebattery manufacturer, careful precautions should be taken to avoiddamage of cell.8. Others8.1 Disassembly8.1.1 The cell should not be dismantled from the battery pack.8.1.2 Internal short-circuit caused by disassembly may lead to heat generationand/or venting.8.1.3 When the electrolyte is coming in contact with the skin or eyes,wash immediately with fresh water and seek medical advice.8.2 Short-circuiting8.2.1 Short-circuit results in very high current which leads to heat generation.8.2.2 An appropriate circuitry should be employed to protect accidentalshort-circuiting.8.3 Incineration8.3.1 Incinerating and disposing of the cell in fire are strictly prohibited,because it may cause rupture.8.4 Immersion8.4.1 Soaking the cell in water is strictly prohibited, because it may causemelt of components to damaged to functions.8.5 Mixing use8.5.1 Different types of cell, or same types but different manufacturer's cellmay lead to cell rupture or damage to system due to the differentcharacteristics of cell.8.6 Battery disposal8.6.1 Although the cell contains no environmentally hazardous component,such as lead or cadmium. the battery should be disposed according tothe local regulations when it is disposed.8.6.2 The cell should be disposed with a discharged state to avoid heat generationby an inadvertent short-circuit.8.7 Caution - The Battery used in this device may present a risk of fire or chemical burn ifmistreated. Do not disassemble, heat above 100℃or incinerate. Replacebattery with Samsung SDI battery only. Use of another battery may present a riskof fire or explosion. Dispose of used battery promptly. Keep away from children.Do not disassemble and do not dispose of in fire.8.8 AttachedSystem Pack Quality Guideline8-8-1 The battery pack’s consumption current.- Sleep Mode: Under 250uA.- Shut Down Mode: Under 10uA (under 2.5V).8-8-2 SOC 0%- Any bank voltage in SOC 0% of Pack should be higher than 3.0V.(Discharging Cut-off Voltage)8-8-3 Operating Charging Voltage of a cell.- Normal operating voltage of cell is 4.20V.- Max operating voltage of cell is 4.25V.8-8-4 No continuous charge- Charge cut-off condition : Cut-off Current is higher than 1/20C(Charging method: CC-CV)- Initial recharging condition : Remaining Capacity is lower than 90% or Voltageis lower than 4.10V8-8-5 Pre-charging function- Pre-charge function should be implemented to prevent abnormal high ratecharging after deep discharge.- Pre-charging condition :Operation: less than 3.0VCharging current : Under 150mA/Cell.(Continuous)Pre-charge stop (Normal Charge Start) : All cells reach 3.0V8-8-6 Cell voltage monitoring system.- The system (Charger or Pack) should equip a device to monitor each cellvoltage and to stop charging if a cell imbalance happened.8-8-7 The battery pack should have warning system for over temperature, over voltage, over current, and unexpected events would be harm to system. If battery facesharsh condition such as over temperature, Battery pack should control FET-offdirectly.8-8-8 Mechanical guides.- PCBA and Cell stack should have heat insulation material between them. (Suchas plastic barrier which is giving air isolation or non-thermal conductivematerial.)- B+ and B- wire connection should not be crossed each other. Do not make wirewhich had the voltage difference more than 4.0V get together.- The material such as double sided tape and rubber which are used in batterypack should be verified for its flammabilityHandling Precaution and Prohibitions of Lithium Ion & Lithium Ion PolymerRechargeable Cells and BatteriesInaccurate handling of lithium ion and lithium ion polymer rechargeable battery may cause leakage, heat, smoke, an explosion, or fire.This could cause deterioration of performance or failure. Please be sure to follow instructions carefully.1.1 StorageStore the battery at low temperature (below 20℃is recommended), low humidity, no dust and no corrosive gas atmosphere.1.2 Safety precaution and prohibitionsTo assure product safety, describe the following precautions in the instruction manual of theapplication.[ Danger!]■Electrical misusageUse dedicated charger.Use or charge the battery only in the dedicated application.Don't charge the battery by an electric outlet directly or a cigarette lighter charger.Don't charge the battery reversely.■Environmental misusageDon't leave the battery near the fire or a heated source.Don't throw the battery into the fire.Don't leave, charge or use the battery in a car or similar place where inside of temperature may be over 60℃.Don't immerse, throw, wet the battery in water / seawater.■othersDon't fold the battery cased with laminated film such as pouch and Polymer.Don't store the battery in a pocket or a bag together with metallic objects such as keys, necklaces, hairpins, coins, or screws.Don't short circuit (+) and (-) terminals with metallic object intentionally.Don't pierce the battery with a sharp object such as a needle, screw drivers.Don't heat partial area of the battery with heated objects such as soldering iron.Don't hit with heavy objects such as a hammer, weight.Don't step on the battery and throw or drop the battery on the hard floor to avoid mechanical hock.Don't disassemble the battery or modify the battery design including electric circuit.Don't solder on the battery directly.Don't use seriously scared or deformed battery.Don't put the battery into a microwave oven, dryer ,or high-pressure container.Don't use or assemble the battery with other makers' batteries, different types and/or models of batteries such as dry batteries, nickel-metal hydride batteries, or nickel-cadmium batteries.Don't use or assemble old and new batteries together.[ Warning! ]Stop charging the battery if charging isn't completed within the specified time.Stop using the battery if the battery becomes abnormally hot, order, discoloration, deformation, orabnormal conditions is detected during use, charge, or storage.Keep away from fire immediately when leakage or foul odors are detected. If liquid leaks onto your skin or cloths, wash well with fresh water immediately.If liquid leaking from the battery gets into your eyes, don't rub your eyes and wash them with clean water and go to see a doctor immediately.If the terminals of the battery become dirty, wipe with a dry cloth before using the battery.The battery can be used within the following temperature ranges. Don't exceed these ranges.Charge temperature ranges : 0℃~ 45℃Discharge Temperature ranges : -20℃~ 60℃Store the battery at temperature below 60℃Cover terminals with proper insulating tape before disposal.[ Caution! ]■Electrical misusageBattery must be charge with constant current-constant voltage (CC/CV).Charge current must be controlled by specified value in Cell specification.Cut-off Voltage of charging must be 4.2V.Charger must stop charging battery by detecting either charging time or cur rent specified in Cell’s specification.Discharge current must be controlled by specified value in Cell’s specification.Cut-off Voltage of discharging must be over 2.5V.■othersKeep the battery away from babies and children to avoid any accidents such as swallow.If younger children use the battery, their guardians should explain the proper handling method and precaution before using.Before using the battery, be sure to read the user's manual and precaution of it's handling.Before using charger, be sure to read the user's manual of the charger.Before installing and removing the battery from application, be sure to read user's manual of the application.Replace the battery when using time of battery becomes much shorter than usual.Cover terminals with insulating tape before proper disposal.If the battery is needed to be stored for an long period, battery should be removed from the application and stored in a place where humidity and temperature are low.While the battery is charged, used and stored, keep it away from object materials with static electric chargers.Safety Handling Procedure for the Transporter■Quarantine : Packages that are crushed, punctured or torn open to reveal contents should not be transported. Such packages should be isolated until the shipper has been consulted,provided instructions and, if appropriate, arranged to have the product inspected andrepacked.■Spilled Product : In the event that damage to packaging results in the release of cells or batteries, the spilled products should be promptly collected and segregated and the shippershould be contacted for instructions.Design of positioning the battery pack in application and charger To prevent the deterioration of the battery performance caused by heat, battery shall be positioned away from the area where heat is generated in the application and the charger.Design of the Battery PackBe sure adopting proper safe device such as PTC specified type or model in Cell Specification.If you intend to adopt different safety device which is not specified in Cell Specification, please contact Samsung SDI to investigate any potential safety problem.Be sure designing 2nd protective devices such as PTC & PCM at the same time to protect Celljust in case one protective device is fault.Please contact following offices when you need any help including safety concerns.Samsung SDI Emergency Contact Information■Samsung SDI Headquarter.575 Shin-dong, Youngtong-gu, Suwon, Kyunggi-doTel:(+82)31-210-7114 Fax:(+82)31-8006-3689■Samsung SDI Chonan factory.508, Sungsung-Dong, Chonan City, Chungchongnam-Do, KoreaTel:(+82)41-560-3669 Fax:(+82)41-560-3697■Samsung SDI America office.18600 Broadwick Street Rancho Dominguez CA 90220Tel:(+1)310-900-5205 Fax:(+1)310-537-1033■Samsung SDI Taiwan office.Rm. 3010, 30F., 333, Keelung Rd. Sec. 1, Taipei, TaiwanTel:(+886)2-2728-8469 Fax:(+886)2-2728-8480。
三星电子 (SAMSUNG) LTA320AP02_090515[1] 规格书
![三星电子 (SAMSUNG) LTA320AP02_090515[1] 规格书](https://img.taocdn.com/s3/m/a6963d0d52ea551810a6878e.png)
2008-12-09 /2009-05-11 / 정진수/PREPARED BYMODEL LTA320AP02Doc. No 06-003-G-081209Page2008-12-09 / 2009-05-11 /정진수/ 응용기술2파트/ 보존기한:3년Revision HistoryPixel arrangementRGB vertical stripe RGB Horizontal stripe4001May.152009Date Rev. No Page SummaryFeb. 25,2009000all First issued90Fig. Temperature and Relative humidity rangeLTA320AP02Doc. No06-003-G-081209Page 2ms<T1≤10ms0<T2≤50ms0<T3≤50ms1000ms≤T41000ms≤T5(Recommend Value)100ms≤T6(Recommend Value)(2) Packing MethodLTA320AP020730XXXXXXXXXX XXX80mm(5) Packing box attachLTA320AP02XXXX24165mm10. General Precautions2009-05-11 / 정진수/ 응용기술2파트/ 보존기한:3년2008-12-09 /10.1 Handling(a) When the Module is assembled, it should be attached to the system firmlyusing all mounting holes. Be careful not to twist and bend the Module.(b) Because the inverter use high voltage, it should be disconnected from powerbefore it is assembled or disassembled.(c) Refrain from strong mechanical shock and / or any force to the Module.In addition to damage, this may cause improper operation or damage to the Moduleand CCFL back light.(d) Note that polarizers are very fragile and could be damage easily.Do not press or scratch the surface harder than a HB pencil lead.(e) Wipe off water droplets or oil immediately. If you leave the droplets for a longtime, staining or discoloration may occur.(f) If the surface of the polarizer is dirty, clean it using absorbent cotton or soft cloth.(g) Desirable cleaners are water, IPA(Isopropyl Alcohol) or Hexane.Do not use Ketone type materials(ex. Acetone), Ethyl alcohol, Toluene, Ethyl acidor Methyl chloride. It might permanent damage to the polarizer due to chemicalreaction.(h) If the liquid crystal material leaks from the panel, it should be kept awayfrom the eyes or mouth . In case of contact with hands, legs or clothes, it mustbe washed away with soap thoroughly.(i) Protect the module from Electrostatic discharge. Otherwise the ASIC IC orSemiconductor would be damaged.(j) Use finger-stalls with soft gloves in order to keep display clean during the incoming inspection and assembly process.(k) Do not disassemble the Module.(l) Do not disassemble shield case of inverter & LVDS board.(m) Do not connect N.C pins. (Samsung internal use only)(n) Protection film for polarizer on the Module should be slowly peeled off just before use so that the electrostatic charge can be minimized. Must put on antistatic glove whilehandle a module(o) Pins of I/F connector should not be touched directly with bare hands.MODEL LTA320AP02Doc. No06-003-G-081209Page26/ 272008-12-09 /2009-05-11 / 정진수/ 응용기술2파트/ 보존기한:3년10.2 Storage(a) Do not leave the Module in high temperature, and high humidity for a long time.It is highly recommended to store the Module with temperature from 0 to 35℃and relative humidity of less than 70%.(b) Do not store the TFT-LCD Module in direct sunlight.(c) The Module should be stored in a dark place. It is prohibited to apply sunlight orfluorescent light in storing.10.3 Operation(a) Do not connect or disconnect the Module in the "Power On" condition.(b) Power supply should always be turned on/off by the"Power on/off sequence"(c) Module has high frequency circuits. Sufficient suppression to the electromagneticinterference should be done by system manufacturers. Grounding and shielding methods may be important to minimize the interference.(d) The cable between the back light connector and its inverter power supply shouldbe connected directly with a minimized length. A longer cable betweenthe back light and the inverter may cause lower luminance of lamp(CCFL) andmay require higher startup voltage(Vs).10.4 Operation Condition Guide(a) The LCD product should be operated under normal conditions.Normal condition is defined as below;-Temperature : 20±15℃-Humidity: 55±20%-Display pattern : continually changing pattern (Not stationary)(b) If the product will be used in extreme conditions such as high temperature,humidity, display patterns or operation time etc.., It is strongly recommendedto contact SEC for Application engineering advice. Otherwise, its reliability andfunction may not be guaranteed. Extreme conditions are commonly found atAirports, Transit Stations, Banks, Stock market, and Controlling systems.MODEL LTA320AP02Doc. No06-003-G-081209Page27/ 2710.5 Others2009-05-11 / 정진수/ 응용기술2파트/ 보존기한:3년2008-12-09 /(a) Ultra-violet ray filter is necessary for outdoor operation.(b) Avoid condensation of water. It may result in improper operation or disconnectionof electrode.(c) Do not exceed the absolute maximum rating value. ( supply voltage variation,input voltage variation, variation in part contents and environmental temperature,and so on)Otherwise the Module may be damaged.(d) If the Module keeps displaying the same pattern for a long period of time,the image may be "sticked" to the screen.To avoid image sticking, it is recommended to use a screen saver.(e) This Module has its circuitry PCB's on the rear side and should be handledcarefully in order not to be stressed.(f) Please contact SEC in advance when you display the same pattern for a long time. MODEL LTA320AP02Doc. No06-003-G-081209Page28/ 27。
三星ICR18650-2600MAH规格书
SPECIFICATION OF PRODUCT(Tentative)for Lithium-ion Rechargeable CellModel : ICR18650-26FNov. 2009Samsung SDI Co.,Ltd.Energy Business Division1. ScopeThis product specification has been prepared to specify the rechargeable lithium-ion cell ('cell') to be supplied to the customer by Samsung SDI Co., Ltd.2. Description and Model2.1 Description Cell (lithium-ion rechargeable cell)2.2 Model ICR18650-26FNote (1): If the cell is kept as ex-factory status (50% of charge),the capacity recovery rate is more than 80%.4. Outline DimensionsSee the attachment (Fig. 1)5. AppearanceThere shall be no such defects as scratch, rust, discoloration, leakage whichmay adversely affect commercial value of the cell.6. Standard Test Conditions6.1 Environmental ConditionsUnless otherwise specified, all tests stated in this specification areconducted at temperature 25±5℃and humidity 65±20%.6.2 Measuring Equipment(1) Ammeter and VoltmeterThe ammeter and voltmeter should have an accuracy ofthe grade 0.5 or higher.(2) Slide caliperThe slide caliper should have 0.01 mm scale.(3) Impedance meterThe impedance meter with AC 1kHz should be used.7. Characteristics7.1 Standard ChargeThis "Standard Charge" means charging the cell with charge current1300mA and constant voltage 4.2V at 25℃for 3hours.7.2 Standard Discharge CapacityThe standard discharge capacity is the initial discharge capacity of the cell, which is measured with discharge current of 520mA with 2.75V cut-off at 25℃within 1hour after the standard charge.Standard Discharge Capacity ≥2550mAh7.3 Initial internal impedanceInitial internal impedance measured at AC 1kHz after rated charge.Initial internal impedance ≤100mΩ7.4 Temperature Dependence of Discharge CapacityCapacity comparison at each temperature, measured with dischargeconstant current 520mA and 2.75V cut-off after the standard charge isas follows.Note: If charge temperature and discharge temperature is not the same, the interval for temperature change is 3 hours.Percentage as an index of the capacity at 25℃(=2550mAh) is 100%.7.5 Temperature Dependence of Charge CapacityCapacity comparison at each temperature, measured with discharge constant current520mA and 2.75V cut-off after the standard charge is as follows.Note: If charge temperature and discharge temperature is not the same, the interval for temperature change is 3 hours .Percentage as an index of the capacity at 25℃(=2550mAh) is 100%.7.6 Charge Rate CapabilitiesDischarge capacity is measured with constant current 520mA and 2.75V cut-off after the cell is charged with 4.2V as follows.Note: Percentage as an index of the capacity at 25℃(=2550mAh) is 100%.7.7 Discharge Rate CapabilitiesDischarge capacity is measured with the various currents in under table and 2.75V cut-off after the standard charge.Note: Percentage as an index of the capacity at 25℃(=2550mAh) is 100%.7.8 Cycle LifeEach cycle is an interval between the charge (charge current 1300mA)with 2.5h or0.05C cut-off and the discharge (discharge current 1500mA) with 2.75V cut-off.Capacity after 299cycles and plus 1 day, measured under the same conditionin 7.2Capacity ≥1785mAh(70% of the capacity at 25℃)7.9 Storage CharacteristicsCapacity after storage for 30days at 25℃from the standard charge,measured with discharge current 1300mA with 2.75V cut-off at 25℃.Capacity retention(after the storage) ≥2040mAh (80% of the capacity at 25℃) 7.10 Status of the cell as of ex-factoryThe cell should be shipped in 50% charged state. In this case, OCV is from 3.65V to3.85V.8. Mechanical Characteristics8.1 Drop TestTest method: Cell(as of shipment or full charged) drop onto the oak-board(thickness: ≥30mm) from 1.5m height at a random direction 6 times.Criteria: No leakage8.2 Vibration TestTest method: Cell(as of shipment) is vibrated along 2 mutuallyperpendicular axes with total excursion of 1.6mm and withfrequency cycling between 10Hz and 55Hz by 1Hz/min.Criteria: No leakage9. Safety9.1 Overcharge TestTest method: To charge the standard charged cell with 12V and 2.6A at 25℃for 2.5 hours.Criteria: No fire, and no explosion.9.2 External Short-circuit TestTest method: To short-circuit the standard charged cell by connecting positive and negative terminal by less than 50mΩwire for 3hours.Criteria: No fire, and no explosion.9.3 Reverse Charge TestTest method: To charge the standard charged cell with charge current 2.6ABy –12V for 2.5 hours.Criteria: No fire, and no explosion.9.4 Heating TestTest method: To heat up the standard charged cell at heating rate 5℃per minute up to 130℃and keep the cell in oven for 60 minutes.Criteria: No fire, and no explosion.10. WarrantySamsung SDI will be responsible for replacing the cell against defects or poor workmanship for 15months from the date of shipping. Any other problem caused by malfunction of the equipment or mix-use of the cell is not under this warranty.The warranty set forth in proper using and handling conditions described above and excludes in the case of a defect which is not related to manufacturing of the cell.11. Others11.1 Storage for a long timeIf the cell is kept for a long time(3months or more), It is strongly recommendedthat the cell is preserved at dry and low-temperature.11.2 OtherAny matters that specifications does not have, should be conferred withbetween the both parties.11.3 PTC Specification12. PackingSee Fig.2,Package DrawingFig.1. Outline Dimensions of ICR18650-26FUnit : mmMax. 18.40Max. 65.0Master carton (200PCS)Proper Use and Handling of Lithium Ion CellsSee before using lithium-ion cellSupplied bySamsung SDI Co., Ltd.1. GeneralThis document has been prepared to describe the appropriate cautions and prohibitions, which the customer should take or employ when the customer usesand handles the lithium ion cell to be manufactured and supplied by Samsung SDI Co., Ltd., in order to obtain optimum performance and safety.2. Charging2.1 Charging currentCharging current should be less than maximum charge current specified inthe product specification.2.2 Charging voltageCharging should be done by voltage less than that specified inthe product specification.2.3 Charging timeContinuous charging under appropriate voltage does not cause any loss ofcharacteristics. However, the charge timer is recommended to be installedfrom a safety consideration, which shuts off further charging at time specifiedin the product specification.2.4 Charging temperatureThe cell should be charged within a range of specified temperatures inthe product specification.2.5 Reverse chargingThe cell should be connected, confirming that its poles are correctly aligned.Inverse charging should be strictly prohibited. If the cell is connectedimproperly, it may be damaged.3. Discharging3.1 Discharging3.1.1 The cell should be discharged at less than maximum discharge currentspecified in the product specification.3.2 Discharging temperature3.2.1 The cell should be discharged within a range of temperatures specified inthe product specification.3.2.2 Otherwise, it may cause loss of characteristics.3.3 Over-discharging3.3.1 The system should equip with a device to prevent further dischargingexceeding discharging cut-off voltage specified in the productspecification.(over-discharging)3.3.2 Over-discharging may cause loss of performance, characteristics, ofbattery function.3.3.3 Over-discharging may occur by self-discharge if the battery is left fora very long time without any use.3.3.4 The charger should equip with a device to detect cell voltage and todetermine recharging procedures.4. Storage4.1 Storage conditions4.1.1 The cell should be stored within a range of temperatures specifiedin the product specification.4.1.2 Otherwise, it may cause loss of characteristics, leakage and/or rust.4.2 Long-term storage4.2.1 The cell should be used within a short period after charging becauselong-term storage may cause loss of capacity by self-discharging.4.2.2. If long-term storage is necessary, the cell should be stored at lowervoltage within a range specified in the product specification, becausestorage at higher voltage may cause loss of characteristics.5. Cycle life5.1 Cycle life performance5.1.1 The cell can be charged/discharged repeatedly up to times specified inthe produce specification with a certain level of capacity also specifiedin the product specification.5.1.2 Cycle life may be determined by conditions of charging, discharging,operating temperature and/or storage.6. Design of System6.1 Connection between the cell and the battery6.1.1 The cell should not be soldered directly with leads. Namely, the cellshould be welded with leads on its terminal and then be soldered withwire or leads to soldered lead.6.1.2 Otherwise, it may cause damage of component, such as separator andinsulator, by heat generation.6.2 Positioning the battery in the System6.2.1 The battery should be positioned as possible as far from heat sourcesand high temperature components.6.2.2 Otherwise, it may cause loss of characteristics.6.3 Mechanical shock protection of the battery6.3.1 The battery should equip with appropriate shock absorbers in order tominimize shock.6.3.2 Otherwise, it may cause shape distortion, leakage, heat generationand/or rupture.6.4 Short-circuit protection of the cell6.4.1 The cell equips with an insulating sleeve to protect short-circuit whichmay occur during transportation, battery assembly and /or systemoperation.6.4.2 If the cell sleeve is damaged by some cause such as outside impact,it may cause short-circuit with some wiring inside the battery.6.5 Connection between the battery and charger/system6.5.1 The battery should be designed to be connected only to the specifiedcharger and system.6.5.2 A reverse connection of the battery, even in the specified system,should be avoided by employing special battery design such asa special terminals.7. Battery Pack Assembly7.1 Prohibition of usage of damaged cell7.1.1 The cell should be inspected visually before battery assembly.7.1.2 The cell should not be used if sleeve-damage, can-distorsion and/orelectrolyte-smell is detected.7.2 Terminals handling7.2.1 Excessive force on the negative terminal should be avoided whenexternal lead is welled.7.3 Transportation7.3.1 If the cell is necessary to transported to order place, such as thebattery manufacturer, careful precautions should be taken to avoiddamage of cell.8. Others8.1 Disassembly8.1.1 The cell should not be dismantled from the battery pack.8.1.2 Internal short-circuit caused by disassembly may lead to heat generationand/or venting.8.1.3 When the electrolyte is coming in contact with the skin or eyes,flush immediately with fresh water and seek medical advice.8.2 Short-circuiting8.2.1 Short-circuit results in very high current which leads to heat generation.8.2.3 An appropriate circuitry should be employed to protect accidentalshort-circuiting.8.3 Incineration8.3.1 Incinerating and disposing of the cell in fire are strictly prohibited,because it may cause rupture.8.4 Immersion8.4.1 Soaking the cell in water is strictly prohibited, because it may causemelt of components to damaged to functions.8.5 Mixing use8.5.1 Different types of cell, or same types but different manufacturer's cellmay lead to cell rupture or damage to system due to the differentcharacteristics of cell.8.6 Battery exchange8.6.1 Although the cell contains no environmentally hazardous component,such as lead or cadmium. the battery should be disposed according tothe local regulations when it is disposed.8.6.2 The cell should be disposed with a discharged state to avoid heat generationby an inadvertent short-circuit.8.7 Caution - The Battery used in this device may present a risk of fire or chemical burn ifmistreated. Do not disassemble, heat above 100℃or incinerate. Replacebattery with Samsung SDI battery only. Use of another battery may present arisk of fire or explosion. Dispose of used battery promptly. Keep away fromchildren. Do not disassemble and do not dispose of in fire.8.8 Warning – AttachedHandling Precaution and Prohibitions of Lithium Ion & Lithium Ion PolymerRechargeable Cells and BatteriesInaccurate handling of lithium ion and lithium ion polymer rechargeable battery may cause leakage, heat,smoke, an explosion, or fire.This could cause deterioration of performance or failure. Please be sure to follow instructions carefully.1.1 StorageStore the battery at low temperature (below 20℃is recommended), low humidity, no dust and no corrosive gas atmosphere.1.2 Safety precaution and prohibitionsTo assure product safety, describe the following precautions in the instruction manual of theapplication.[ Danger!]■Electrical misusageUse dedicated charger.Use or charge the battery only in the dedicated application.Don't charge the battery by an electric outlet directly or a cigarette lighter charger.Don't charge the battery reversely.■Environmental misusageDon't leave the battery near the fire or a heated source.Don't throw the battery into the fire.Don't leave, charge or use the battery in a car or similar place where inside of temperature may be over 60℃.Don't immerse, throw, wet the battery in water / seawater.■othersDon't fold the battery cased with laminated film such as pouch and Polymer.Don't store the battery in a pocket or a bag together with metallic objects such as keys, necklaces, hairpins, coins, or screws.Don't short circuit (+) and (-) terminals with metallic object intentionally.Don't pierce the battery with a sharp object such as a needle, screw drivers.Don't heat partial area of the battery with heated objects such as soldering iron.Don't hit with heavy objects such as a hammer, weight.Don't step on the battery and throw or drop the battery on the hard floor to avoid mechanical shock.Don't disassemble the battery or modify the battery design including electric circuit.Don't solder on the battery directly.Don't use seriously scared or deformed battery.Don't put the battery into a microwave oven, dryer ,or high-pressure container.Don't use or assemble the battery with other makers' batteries, different types and/or models of batteries such as dry batteries, nickel-metal hydride batteries, or nickel-cadmium batteries.Don't use or assemble old and new batteries together.[ Warning! ]Stop charging the battery if charging isn't completed within the specified time.Stop using the battery if the battery becomes abnormally hot, order, discoloration, deformation, or abnormal conditions is detected during use, charge, or storage.Keep away from fire immediately when leakage or foul odors are detected. If liquid leaks onto your skin or cloths, wash well with fresh water immediately.If liquid leaking from the battery gets into your eyes, don't rub your eyes and wash them with clean water and go to see a doctor immediately.If the terminals of the battery become dirty, wipe with a dry cloth before using the battery.The battery can be used within the following temperature ranges. Don't exceed these ranges.Charge temperature ranges : 0℃~ 45℃Discharge Temperature ranges : -20℃~ 60℃Store the battery at temperature below 60℃Cover terminals with proper insulating tape before disposal.[ Caution! ]■Electrical misusageBattery must be charge with constant current-constant voltage (CC/CV).Charge current must be controlled by specified value in Cell specification.Cut-off Voltage of charging must be 4.2V.Charger must stop charging battery by detecting either charging time or current specified in Cell’s specification.Discharge current must be controlled by specified value in Cell’s specification.Cut-off Voltage of discharging must be over 2.5V.■othersKeep the battery away from babies and children to avoid any accidents such as swallow.If younger children use the battery, their guardians should explain the proper handling method andprecaution before using.Before using the battery, be sure to read the user's manual and precaution of it's handling.Before using charger, be sure to read the user's manual of the charger.Before installing and removing the battery from application, be sure to read user's manual of the application.Replace the battery when using time of battery becomes much shorter than usual.Cover terminals with insulating tape before proper disposal.If the battery is needed to be stored for an long period, battery should be removed from theapplication and stored in a place where humidity and temperature are low.While the battery is charged, used and stored, keep it away from object materials with static electric chargers.Safety Handling Procedure for the Transporter■Quarantine : Packages that are crushed, punctured or torn open to reveal contents should not be transported. Such packages should be isolated until the shipper has been consulted,provided instructions and, if appropriate, arranged to have the product inspected andrepacked.■Spilled Product : In the event that damage to packaging results in the release of cells or batteries,the spilled products should be promptly collected and segregated and the shippershould be contacted for instructions.Design of positioning the battery pack in application and charger To prevent the deterioration of the battery performance caused by heat, battery shall be positionedaway from the area where heat is generated in the application and the charger.Design of the Battery PackBe sure adopting proper safe device such as PTC specified type or model in Cell Specification. If you intend to adopt different safety device which is not specified in Cell Specification, please contact Samsung SDI to investigate any potential safety problem.Be sure designing 2nd protective devices such as PTC & PCM at the same time to protect Cell just in case one protective device is fault.。
三星规格书
July 2006MUTLAYERCERAMIC CAPACITORSQS 9000/ISO 9001Registered by BSI to QS 9000 or ISO 9001under BSI’s accreditation by UKAS forCertification.Registration NO:FM25309(2002. 2. 28)WE WILL PROVIDE A CUSTOMER WITH HIGH RELIABLE PRODUCTS ANDSERVICES003We, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.1. RoHS Compliance and restriction of BrThe following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos - Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB2. No use of materials breaking Ozone layerThe following ODS materials are not used in our fabrication process.- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFCIf you want more detailed Information,Please Visit Samsung Electro-mechanics Website []ISO / TS 16949QS 9000(Product)ISO 9001 (Product)TL 9000 (Product)ISO 14001 Quality System Certification ListT able 1:Certification list of Samsung FactoryBSI TS 91430-001BSI EMS 66454BSI TS 91430-001BSI FM 62262UL A14163CNAB 02103SI0055ROL BSI EMS69298BSI EMS 77354BSI FM 90588BSI EMS 66454SUWON(KOREA) BUSAN(KOREA) PHILIPPINES TIANJIN(CHINA) THAILANDFeature Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Capacitance Table (General Capacitors)Product Line UP (General Capacitors)Product Line UP (General Capacitors)CL10 R82CB8ANN CL10 010CB8ANN CL10 1R2CB8ANN CL10 1R5CB8ANN CL10 1R8CB8ANN CL10 020CB8ANN CL10 2R2CB8ANN CL10 2R7CB8ANN CL10 030CB8ANN CL10 3R3CB8ANN CL10 3R9CB8ANN CL10 040CB8ANN CL10 4R7CB8ANN CL10 050DB8ANN CL10 5R6DB8ANN CL10 060DB8ANN CL10 6R8DB8ANN CL10 070DB8ANN CL10 080DB8ANN CL10 8R2DB8ANN CL10 090DB8ANN CL10 100JB8NNN CL10 100J B8ANN CL10 120JB8NNN CL10 120JB8ANN CL10 150JB8NNN CL10 150JB8ANN CL10 180JB8NNN CL10 180J B8ANN CL10 220JB8NNN CL10 220JB8ANN CL10 270JB8NNN CL10 270JB8ANN CL10 330JB8NNN CL10 330JB8ANN0.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151518182222272733330.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050500.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LCL10 390JB8NNNCL10 390JB8ANNCL10 470JB8NNNCL10 470JB8ANNCL10 560JB8NNNCL10 560JB8ANNCL10 680JB8NNNCL10 680JB8ANNCL10 820JB8NNNCL10 820JB8ANNCL10 101JB8NNNCL10 101JB8ANNCL10 121JB8NNNCL10 121JB8ANNCL10 151JB8NNNCL10 151JB8ANNCL10 181JB8NNNCL10 181JB8ANNCL10 221JB8NNNCL10 221JB8ANNCL10 271JB8NNNCL10 271JB8ANNCL10 331JB8NNNCL10 331JB8ANNCL10 391JB8NNNCL10 471JB8NNNCL10 471JB8ANNCL10 561JB8NNNCL10 681JB8NNNCL10 681JB8ANNCL10 821JB8NNNCL10 102JB8NNNCL10 122JB8NNNCL10 222JB8NNNCL10 332JA8NNN3939474756566868828210010012012015015018018022022027027033033039047047056068068082010001200220033005%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050250.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LGeneral CapacitorsProduct Line UP (General Capacitors)Product Line UP (General Capacitors)CL21 560JBANNNCL21 680JBANNN CL21 820JBANNN CL21 101JBANNN CL21 101JBAANN CL21 121JBANNN CL21 151JBANNN CL21 181JBANNN CL21 221JBANNN CL21 271JBANNN CL21 331JBANNN CL21 331JBAANN CL21 391JBANNN CL21 471JBANNN CL21 471JBAANN CL21 561JBANNN CL21 821JBCNNN CL21 821JBAANN CL21 102JBCNNN CL21 122JBFNNN CL21 152JBFNNN CL21 182JBFNNN CL21 222JBFNNN CL21 332JAFNNN CL21 332JBFNNN CL21 392JBFNNN CL21 472JAFNNN CL21 472JBFNNN CL21 562JBFNNN CL21 103JBFNNN56688210010012015018022027033033039047047056082082010001200150018002200330033003900470047005600100005% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%5050505050505050505050505050505050505050505050255050255050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.950.750.951.351.351.351.351.351.351.351.351.351.351.35Part Number ThicknessMax. (mm)RatedVoltage (Vdc)Capacitance Tolerance Capacitance (pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LCL21 R47CBAANN CL21 0R5CBAANN CL21 R68CBAANN CL21 R82CBAANN CL21 010CBAANN CL21 1R2CBAANN CL21 1R5CBAANN CL21 1R8CBAANN CL21 020CBAANN CL21 2R2CBAANN CL21 2R7CBAANN CL21 030CBAANN CL21 3R3CBAANN CL21 3R9CBAANN CL21 040CBAANN CL21 4R7CBAANN CL21 050DBAANN CL21 5R6DBAANN CL21 060DBAANN CL21 6R8DBAANN CL21 070DBAANN CL21 080DBAANN CL21 8R2DBAANN CL21 090DBAANN CL21 100JBANNN CL21 100J BAANN CL21 120JBANNN CL21 120J BAANN CL21 150JBANNN CL21 180J BANNN CL21 220JBANNN CL21 270JBANNN CL21 330JBANNN CL21 390JBANNN CL21 470JBANNN0.470.500.680.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151822273339470.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.25pF 0.5pF 0.5pF 0.5pF 0.5pF 0.5pF 0.5pF 0.5pF 0.5pF 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%50505050505050505050505050505050505050505050505050505050505050505050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.75Part Number ThicknessMax. (mm)RatedVoltage (Vdc)Capacitance Tolerance Capacitance (pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LGeneralCapacitorsProduct Line UP (General Capacitors)Product Line UP (General Capacitors)CL05 153KA5NNN CL05 223KA5NNN CL05 223ZA5NNN CL05 102KO5NNN CL05 472KO5NNN CL05 682KO5NNN CL05 103KO5NNN CL05 103ZO5NNN CL05 153KO5NNN CL05 223KO5NNN CL05 223ZO5NNN CL05 333KO5NNN CL05 473KO5NNN CL05 473ZO5NNN CL05 683KO5NNN CL05 104KO5NNN CL05 104ZO5NNN CL05 224ZO5NNN CL05 103KP5NNN CL05 333KP5NNN CL05 473KP5NNN CL05 683KP5NNN CL05 104KP5NNN CL05 224ZP5NNN CL05 474ZP5NNN CL05 104KQ5NNN CL05 474KQ5NNN1522221.04.76.81010152222334747681001002201033476810022047010047010%10%+80%~-20%10%10%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%+80%~-20%10%10%10%10%10%+80%~-20%+80%~-20%10%+80%~-20%252525161616161616161616161616161616101010101010106.36.30.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.55Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (1.0 0.5mm)X5R(EIA) X7R(EIA) Y5V(EIA)General CapacitorsProduct Line UP (General Capacitors)CL31 122JBCNNN CL31 152JBCNNN CL31 182JBCNNN CL31 222JBCNNN CL31 472JBFNNN CL31 562JBHNNN CL31 682JBHNNN CL31 103JAFNNN CL32 103J BFNNN120015001800220047005600680010000100005%5%5%5%5%5%5%5%5%5050505050505025500.750.750.750.751.351.801.801.351.35Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (3.2 1.6(2.5)mm)C0G P2H R2H S2H T2H U2J S2LCL05 221KB5NNN CL05 331KB5NNN CL05 471KB5NNN CL05 681KB5NNN CL05 102KB5NNN CL05 152KB5NNN CL05 222KB5NNN CL05 332KB5NNN CL05 472KB5NNN CL05 682KB5NNN CL05 103KB5NNN CL05 103ZB5NNN CL05 102KA5NNN CL05 222KA5NNN CL05 332KA5NNN CL05 472KA5NNN CL05 682KA5NNN CL05 103KA5NNN0.220.330.470.681.01.52.23.34.76.8101012.23.34.76.81010%10%10%10%10%10%10%10%10%10%10%+80%~-20%10%10%10%10%10%10%5050505050505050505050502525252525250.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.550.55Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (1.0 0.5mm)X5R(EIA) X7R(EIA) Y5V(EIA)Product Line UP (General Capacitors)CL10 101KB8NNN CL10 151KB8NNN CL10 221KB8NNN CL10 331KB8NNN CL10 471KB8NNN CL10 681KB8NNN CL10 102KB8NNN CL10 152KB8NNN CL10 222KB8NNN CL10 332KB8NNN CL10 472KB8NNN CL10 682KB8NNN CL10 103KB8NNN CL10 103ZB8NNN CL10 153KB8NNN CL10 223KB8NNN CL10 223ZB8NNN CL10 333KB8NNN CL10 473KB8NNN CL10 473ZB8NNN CL10 683KB8NNN CL10 104KB8NNN CL10 104ZB8NNN CL10 224ZB8NNN CL10 474ZB8NNN CL10 102KA8NNN CL10 472KA8NNN CL10 682KA8NNN CL10 103KA8NNN CL10 153KA8NNN CL10 223KA8NNN CL10 223ZA8NNN CL10 333KA8NNN CL10 473KA8NNN CL10 473ZA8NNN0.100.150.220.330.470.681.01.52.23.34.76.81010152222334747681001002204701.04.76.81015222233474710%10%10%10%10%10%10%10%10%10%10%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%+80%~-20%+80%~-20%10%10%10%10%10%10%+80%~-20%10%10%+80%~-20%50505050505050505050505050505050505050505050505050252525252525252525250.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (1.6 0.8mm)X5R(EIA) X7R(EIA) Y5V(EIA)Product Line UP (General Capacitors)Product Line UP (General Capacitors)CL10 683KA8NNNCL10 104KA8NNNCL10 104ZA8NNNCL10 224KA8NNNCL10 224ZA8NNNCL10 334KA8NNNCL10 474ZA8NNNCL10 102KO8NNNCL10 103KO8NNNCL10 153KO8NNNCL10 223KO8NNNCL10 333KO8NNNCL10 473KO8NNNCL10 473ZO8NNNCL10 683KO8NNNCL10 104KO8NNNCL10 104ZO8NNNCL10 154KO8NNNCL10 224KO8NNNCL10 224ZO8NNNCL10 334KO8NNNCL10 474KO8NNNCL10 474ZO8NNNCL10 105ZO8NNNCL10 154KP8NNNCL10 224KP8NNNCL10 334KP8NNNCL10 474KP8NNNCL10 474ZP8NNNCL10 105ZP8NNNCL10 474KQ8NNNCL10 684KQ8NNNCL10 105KQ8NNN681001002202203304701.0101522334747681001001502202203304704701.01502203304704701.04706801.010%10%+80%~-20%10%+80%~-20%10%+80%~-20%10%10%10%10%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%+80%~-20%10%10%10%10%+80%~-20%+80%~-20%10%10%10%2525252525252516161616161616161616161616161616161010101010106.36.36.30.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (1.6 0.8mm)X5R(EIA) X7R(EIA) Y5V(EIA)General CapacitorsCL21 151KBANNN CL21 221KBANNN CL21 331KBANNN CL21 471KBANNN CL21 681KBANNN CL21 102KBANNN CL21 152KBANNN CL21 222KBANNN CL21 332KBANNN CL21 332KBCNNN CL21 472KBANNN CL21 682KBANNN CL21 103KBANNN CL21 103KBCNNN CL21 103ZBANNN CL21 153KBANNN CL21 223KBANNN CL21 223ZBANNN CL21 333KBANNN CL21 473ZBANNN CL21 683KBCNNN CL21 104KBCNNN CL21 104ZBANNN CL21 104ZBCNNN CL21 154KBFNNN CL21 224KBFNNN CL21 224ZBCNNN CL21 474ZBFNNN CL21 105ZBFNNN CL21 102KAANNN CL21 103KAANNN CL21 473KAANNN CL21 683KAANNN CL21 104KACNNN CL21 104ZAANNN0.150.220.330.470.681.01.52.23.33.34.76.81010101522223347681001001001502202204701.01.010476810010010%10%10%10%10%10%10%10%10%10%10%10%10%10%+80%~-20%10%10%+80%~-20%10%+80%~-20%10%10%+80%~-20%+80%~-20%10%10%+80%~-20%+80%~-20%+80%~-20%10%10%10%10%10%+80%~-20%50505050505050505050505050505050505050505050505050505050502525252525250.750.750.750.750.750.750.750.750.750.950.750.750.750.950.750.750.750.750.750.750.950.950.750.951.351.350.951.351.350.750.750.750.750.950.75Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (2.0 1.25mm)X5R(EIA) X7R(EIA) Y5V(EIA)General CapacitorsProduct Line UP (General Capacitors)Product Line UP (General Capacitors)CL21 154KAFNNN CL21 224KAFNNN CL21 224ZAANNN CL21 334KAFNNN CL21 474KAFNNN CL21 474ZACNNN CL21 105ZAFNNN CL21 225ZAFNNN CL21 153KOANNN CL21 333KOANNN CL21 104KOANNN CL21 104ZOANNN CL21 154KOANNN CL21 224KOCNNN CL21 224ZOANNN CL21 334KOCNNN CL21 474KOFNNN CL21 474ZOANNN CL21 474ZOCNNN CL21 684KOFNNN CL21 105KOFNNN CL21 105ZOCNNN CL21 105ZOFNNN CL21 225ZOFNNN CL21 475ZOFNNN CL21 474KPCNNN CL21 684KPFNNN CL21 105KPFNNN CL21 225ZPFNNN CL21 475Z PFNNN1502202203304704701.02.215331001001502202203304704704706801.01.01.02.24.74706801.02.24.710%10%+80%~-20%10%10%+80%~-20%+80%~-20%+80%~-20%10%10%10%+80%~-20%10%10%+80%~-20%10%10%+80%~-20%+80%~-20%10%10%+80%~-20%+80%~-20%+80%~-20%+80%~-20%10%10%10%+80%~-20%+80%~-20%2525252525252525161616161616161616161616161616161610101010101.351.350.751.351.350.951.351.350.750.750.750.750.750.950.750.951.350.750.951.351.350.951.351.351.350.951.351.351.351.35Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceA B FSize L W (2.0 1.25mm)X5R(EIA) X7R(EIA) Y5V(EIA)Product Line UP (General Capacitors)Product Line UP (General Capacitors)Feature Capacitance Table (Ultra High Capacitors)Size TC Rated V 4(R) 6.3(Q) 10(P) 16(O) 25(A) 6.3(Q) 10(P) 16(O) 25(A) 6.3(Q) 10(P) 16(O) 6.3(Q)X5R(A)1812(43)0805(21)1206(31)1210(32)Capacitance Table (Ultra High Capacitors)Capacitance Table (Ultra High Capacitors)Size TC Rated V 6.3(Q) 6.3(Q) 4(R) 6.3(Q) 10() 6.3(Q) 6.3(Q) 10()X7R(B)/ X6S(X)1812(43)1210(32)1206(31)0805(21)0603(10)0402(05)Product Line UP (Ultra High Capacitors)Product Line UP (Ultra High Capacitors)Super Small Size CapacitorsCL10F225ZP8NNN CL21F106ZPFNNN CL31F226ZPHNNN CL32F226Z PINNN CL32F226ZPJNNN CL05F105ZQ5NNN CL10F475ZQ8NNN CL32F107ZQJNNNY5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA) 2.2 10 22 22 22 1.0 4.7 10080%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%10101010106.36.36.30.901.351.802.202.800.550.902.80-82~+22%(-30~+85 )-82~+22%(-30~+85)-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 ) 1.60 0.802.00 1.253.20 1.603.20 2.503.20 2.501.00 0.501.60 0.803.20 2.50Part Number ThicknessMax. (mm)RatedVoltage(Vdc)Capacitance Tolerance Capacitance TC CodeTemperature Characteristics Size L W (mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.Small chip size(0.6 0.3 0.3 mm)03 Series(C0G) MLCC shows very low ESR valae. 03 Series are suited to only reflow soldering 03 Series are suited to miniature RF module,portable equipment and high frequency circuitVCO, Tuner, RF Module MCM ModuleMobile phone, Wireless LAN, Note PCFeatureApplicationStructure and DimensionsCodeEIA CodeL W T BW Dimension (mm)0.3 0.030.3 0.030.6 0.0302010.15 0.0503CL05X105KQ5NNN CL10X105KQ8NNN CL21X225KQFNNN CL21X475KQFNNN CL31X106KQHNNN CL21X106KRFNNN CL21B225KPFNNN CL43B226KOJNNN CL21B225KPF NNN CL31B106KQHNNN CL32B226KQ J NNNX6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA) 1.0 1.0 2.2 4.7 10 10 2.2 22 2.2 10 2210% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%6.36.36.36.36.3410106.36.36.30.550.901.351.351.801.351.352.801.351.802.8022%(-55~+105 ) 22%(-55~+105 ) 22%(-55~+105 ) 22%(-55~+105 ) 22%(-55~+105 ) 22%(-55~+105 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 1.00 0.501.60 0.802.00 1.252.00 1.253.20 1.602.00 1.252.00 1.254.50 3.202.00 1.253.20 1.603.20 2.50Part Number Thickness Max. (mm)RatedVoltage(Vdc)Capacitance Tolerance Capacitance TC CodeTemperature Characteristics Size L W(mm)Product Line UP (Ultra High Capacitors)High Voltage CapacitorsCode EIA Code L W T BW Dimension(mm)0.8 0.11.25 0.11.6 0.21.25 0.150.85 0.152.5 0.22.0 0.22.5 0.22.5 0.20.8 0.11.25 0.11.6 0.21.6 0.152.5 0.22.0 0.23.2 0.35.0 0.41.6 0.12.0 0.13.2 0.23.2 0.153.2 0.34.5 0.44.5 0.45.7 0.406030805120612101808181222200.3 0.20.5+0.2/-0.30.5 0.30.6 0.30.8 0.30.8 0.31.0 0.310213132424355Highly reliable performance Operating at high voltage levelWide voltage level: from 100V to 3000V High withstanding voltageTape & reel surface mount assemblySwitching Power Circuit(SMPS)Lighting Ballast, LCD back lighting inverter DC-DC converter input filter, snubber circuitTip & Ring(Phone, Fax, Modem) Network(IEEE802.3)FeatureApplicationStructure and DimensionsCL03B331KO3NNN CL03B102KO3NNN CL03B472KP3NNN CL03A103KP3NNN CL03B103KP3NNN CL03B472KQ3NNN CL03A223KQ3NNN CL03A473KQ3NNN CL03A104KQ3NNNX7R(EIA)X7R(EIA)X7R(EIA)X5R(EIA)X7R(EIA)X7R(EIA)X5R(EIA)X5R(EIA)X5R(EIA)0.33 1.0 4.7 10 10 4.7 22 47 10010% 10% 10% 10% 10% 10% 10% 10% 10%16161010106.36.36.36.30.330.330.330.330.330.330.330.330.3315%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+85 )15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+85 ) 15%(-55~+85 ) 15%(-55~+85 )0.60 0.300.60 0.300.60 0.300.60 0.300.60 0.300.60 0.300.60 0.300.60 0.300.60 0.30Part Number Thickness Max. (mm)RatedVoltage(Vdc)Capacitance Tolerance Capacitance TC CodeTemperature Characteristics Size L W(mm)Product Line UP (Super Small Size Capacitors)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.Capacitance Table (High Voltage Capacitors)Capacitance Table (High Voltage Capacitors)Capacitance Table (High Voltage Capacitors)Product Line UP (High Voltage Capacitors)High Voltage CapacitorsCL21C180JDCNNN CL21C330JDCNNN CL21C390JDCNNN CL21C470JDCNNN CL21C560JDCNNN CL21C680JDCNNN CL21C101JDCNNN CL21C121JDCNNN CL21C221JDCNNN CL21C102JDFNNN CL10C100JC8NNN CL21C100JCANNN CL21C120JCANNN CL10C150JC8NNN CL21C150JCANNN CL21C180JCANNN CL21C220JCANNN CL21C270JCANNN CL21C330JCANNN CL10C330JC8NNN CL10C390JC8NNN CL10C470JC8NNN CL21C470JCANNN CL21C560JCCNNN CL21C680JCANNN CL31C680JCCNNN CL21C820JCCNNN CL10C101JC8NNN CL21C101JCANNN CL10C121J C8NNN CL10C151JC8NNN CL21C151JCANNN CL21C221JCANNN CL31C271JCCNNN CL21C331JCANNNC0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)18 33 39 47 56 68 100 120 220 1.0 10 10 12 15 15 18 22 27 33 33 39 47 47 47 68 68 82 100 100 120 150 150 220 270 3305% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%2002002002002002002002002002001001001001001001001001001001001001001001001001001001001001001001001001001001.001.001.001.001.001.001.001.001.001.350.900.750.750.900.750.750.750.750.750.900.900.900.750.750.751.001.000.900.750.900.900.750.751.000.7530ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 )2.00X1.252.00X1.252.00X1.252.00X1.252.00X1.252.00X1.252.00X1.252.00X1.252.00X1.252.00X1.251.60X0.802.00X1.252.00X1.251.60X0.802.00X1.252.00X1.252.00X1.252.00X1.252.00X1.251.60X0.801.60X0.801.60X0.802.00X1.252.00X1.252.00X1.253.20X1.603.20X1.601.60X0.802.00X1.251.60X0.801.60X0.802.00X1.252.00X1.253.20X1.602.00X1.25Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC Code Temperature CharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.Product Line UP (High Voltage Capacitors)Product Line UP (High Voltage Capacitors)CL10C331JC8NNN CL31C391JCCNNN CL10C471JC8NNN CL21C471JCCNNN CL21C561JCCNNN CL31C561JCCNNN CL21C681JCCNNN CL21C102JCFNNN CL31C102JCCNNN CL31C152JCCNNN CL31C222JCCNNN CL31C392JCHNNNC0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)330 390 470 470 560 560 680 1.0 1.0 1.5 2.2 3.95% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%1001001001001001001001001001001001000.901.000.901.001.001.001.001.351.001.001.001.8030ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 )1.60X0.803.20X1.601.60X0.802.00X1.252.00X1.253.20X1.602.00X1.252.00X1.253.20X1.603.20X1.603.20X1.603.20X1.60Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC Code Temperature CharacteristicsSize L W(mm)CL31B102KJHNNN CL32B102KJF NNN CL43B102KJFNNN CL43B152KJFNNN CL31B102KI FNNN CL31B222KIFNNN CL43B222KIFNNN CL43B103KIFNNN CL31B102KHFNNN CL32B472KHFNNN CL31B103KHFNNN CL31B221KGFNNN CL31B471KGFNNN CL31B102KGFNNN CL31B152KGFNNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)1.0 1.0 1.0 1.5 1.02.2 2.2 10 1.0 4.7 10 0.22 0.47 1.0 1.510% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%200020002000200010001000100010006306306305005005005001.801.351.351.351.351.351.351.351.351.351.351.351.351.351.3515%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )3.20 1.603.20 2.504.50 3.204.50 3.203.20 1.603.20 1.604.50 3.204.50 3.203.20 1.603.20 2.503.20 1.603.20 1.603.20 1.603.20 1.603.20 1.60Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC CodeTemperature CharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.CL31B222KGFNNN CL31B332KGFNNN CL31B472KGFNNN CL31B682KGFNNN CL31B103KGFNNN CL32B153KGFNNN CL32B223KGFNNN CL43B473KGFNNN CL43B104KG INNN CL21B153KEFNNN CL31B473KEHNNN CL32B104KE J NNN CL43B474KE JNNN CL21B221KDCNNN CL21B331KDCNNN CL31B471KDCNNN CL21B102KDCNNN CL21B222KDCNNN CL31B222KDCNNN CL21B472KDCNNN CL31B472KDCNNN CL21B103KDCNNN CL31B153KDCNNN CL31B223KDCNNN CL31B333KDFNNN CL31B473KDFNNN CL32B473KDHNNN CL31B104KDHNNN CL43B104KDFNNN CL21B221KCANNN CL21B471KCANNN CL10B102KC8NNN CL21B102KCANNN CL21B222KCANNN CL21B332KCANNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)2.23.34.7 6.8 10 15 22 47 100 15 47 100 470 0.22 0.33 0.47 1.0 2.2 2.2 4.7 4.7 10 15 22 33 47 47 100 100 0.22 0.47 1.0 1.0 2.2 3.310% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%5005005005005005005005005002502502502502002002002002002002002002002002002002002002002001001001001001001001.351.351.351.351.351.351.351.352.201.351.802.802.801.001.001.001.001.001.001.001.001.001.001.001.351.351.801.801.350.750.750.900.750.750.7515%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )3.20 1.603.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.204.50 3.202.00 1.253.20 1.603.20 2.504.50 3.202.00 1.252.00 1.253.20 1.602.00 1.252.00 1.253.20 1.602.00 1.253.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 1.604.50 3.202.00 1.252.00 1.251.60 0.802.00 1.252.00 1.252.00 1.25Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC CodeTemperature CharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.Product Line UP (High Voltage Capacitors)Product Line UP (High Voltage Capacitors)CL10B472KC8NNN CL21B472KCANNN CL21B682KCANNN CL10B103KC8NNN CL21B103KCANNN CL32B103KCFNNN CL21B153KCCNNN CL31B153KCCNNN CL21B223KCFNNN CL31B223KCCNNN CL31B333KCCNNN CL21B473KCFNNN CL31B473KCCNNN CL31B104KCFNNN CL31B154KCHNNN CL32B154KCFNNN CL32B224KCHNNN CL43B224KCFNNN CL32B334KCHNNN CL43B334KCFNNN CL32B474KCI NNN CL43B474KCHNNN CL31B105KCHNNN CL32B105KCJNNN CL43B105KCJNNN CL55B105KCHNNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)4.7 4.7 6.8 10 10 10 15 15 22 22 33 47 47 100 150 150 220 220 330 330 470 470 1.0 1.0 1.0 1.010% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%1001001001001001001001001001001001001001001001001001001001001001001001001001000.900.750.750.900.751.351.001.001.351.001.001.351.001.351.801.351.801.351.801.352.201.801.802.802.801.8015%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )1.60 0.802.00 1.252.00 1.251.60 0.802.00 1.253.20 2.502.00 1.253.20 1.602.00 1.503.20 1.603.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.203.20 2.504.50 3.203.20 2.504.50 3.203.20 1.603.20 2.504.50 3.205.70 5.00Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC CodeTemperature CharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 58.High Voltage Capacitors。
三星电容全系列规格书
March 2009MULTILAYERCERAMIC CAPACITORSAll information indicated in this catalog is as of March. 2009The specifications and designs contained herein may be subject to change without notice.Passive components Sales OfficeHead Office206, Cheomdansaneop Road,Youngtong-gu,Suwon, Kyonggi Province 443-743, KoreaEuropeTel:+82-31-210-6328E-mail:james.pyun@ AmericaTel:+82-31-210-6794E-mail:randy.kim@ AsiaTel:+82-31-210-5348E-mail:koogi@ DomesticTel:+82-31-210-3757E-mail:southjoy@Manufacturing SiteSuwon Plant (Korea)206 Cheomdansaneop Road, Youngtong -gu,Suwon, Kyonggi Province 443-743, KoreaTel:+82-31-210-6794E-mail:randy.kim@ Busan Plant (Korea)1623-2, Songjeong -dong,Kangseo -gu, Busan 618-270, Korea Tel:+82-51-970-7671E-mail:kyc.kweon@ Tianjin Plant (China)27, Heiniucheng -Road, Hexi District,Tianjin, China 300210Tel:+86-22-2830-3333(3450)E-mail:gk.ryu@ Philippines Plant (Philippines)Calamba Premiere International Park, Batino, Calamba, Laguna, Manila Tel:+63-2-809-2873E-mail:ksj1445@Asia sales officeShanghai OfficeRm 1408 Shanghai international trade center No 2200 Yan an (W )RD Shanghai China 200335Te l:86-21-6270-4168(274)E-mail:dennis.cha@ Shenzhen OfficeRm 4501, 45/F, New World Center,Yitian Road, Futian District,Shenzhen, China 518026Te l:86-755-8608-5581E-mail:jackson.xian@ Qingdao OfficeRm 1201. Growne Plaza Qingdao;76XiangGangZhong Rd, Qingdao;266071P.R. ChinaTe l:86-532-5779102E-mail:zhengguo.cui@ HongKong OfficeSuite 4511, Two int’l Finance Centre,8 Finance Street, Central, Hongkong Te l:852-2862-6350E-mail:vinsent.chou@ Singapore Office3 Church Street Samsung Hub #23-02 Singapore 049483Te l:(65)6833-3228E-mail:winson.yeong@ Thai OfficeWellgrow Industrial Estate,93 Moo 5 T. Bangsamak, A.Bangpakong Chachoengsao 24180 Thailand Te l:66-38-562-026E-mail:sbimm@ Taiwan Office399 9F -1, Ruey Kuang Rd., Neihu, Taipei, TaiwanTe l:886-2-2656-8356E-mail:kevin0130.wang@America sales officeIrvine Office3345 Michelson Drive,Suite 350,Irvine, CA 92612Tel:1-949-797-8047E-mail:sh386.kim@Europe sales officeFrankfurt Office Samsung hausAm Kronberger Hang 6D-65824 Schwalbach/Ts.Tel:49-6196-66-7255FAX:49-(0)6196-66-7755E-mail:frank.goebel@ Hungary OfficeH2310, Szigetszentmiklos, Leshegy u.2-4, HungaryTel:36-24-551-148E-mail:jun21c.lee@Domestic DistributorsKORCHIP INC#219-8 Gasan -dong, Gumchun -gu,Seoul, KoreaTel:+82-2-838-5588E-mail:hjh0064@ CHUNG HAN#16-96 Hangang -lo 3, Youngsan -Gu,Seoul, KoreaTel:+82-2-718-3322E-mail:bu1230choi@ SAMTDaekyung Bldg.,Daechi-Dong,Gangnam -Gu, Seoul, Korea Tel:+82-2-3458-9000E-mail:info@ CHUNGMAC#53-5 Wonhyolo3 Youngsan -gu, Seoul, KoreaTel:+82-2-716-6428~9E-mail:webmaster@anycam.co.kr APEXINTRoom #905. C -dong Woorimlion ,s,Valley 371-28, Gasan-dong,Guemcheon-Gu, Seoul, Korea Tel:+82-2-2026-2610(2)E-mail:info@apexint.co.krWe, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.1.RoHS Compliance and restriction of BrThe following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB2.No use of materials breaking Ozone layerThe following ODS materials are not used in our fabrication process.- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFCIf you want more detailed Information,Please Visit Samsung Electro-mechanics Website CONTENTSPart NumberingSystem4628353950525558627983GeneralCapacitorsUltra HighCapacitorsSuper SmallCapacitorsHigh VoltageCapacitorsCamera StrobeCircuit CapacitorsArray TypeCapacitorsLow ESLCapacitorsApplication Manualfor Surface MountingPackagingSpecificationPremium Capacitorsfor AutomotiveApplicationsReliability TestConditionPart Numbering SystemFeature Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsCL10 R82CB8ANNCL10 010CB8ANNCL10 1R2CB8ANNCL10 1R5CB8ANNCL10 1R8CB8ANNCL10 020CB8ANNCL10 2R2CB8ANNCL10 2R7CB8ANNCL10 030CB8ANNCL10 3R3CB8ANNCL10 3R9CB8ANNCL10 040CB8ANNCL10 4R7CB8ANNCL10 050DB8ANNCL10 5R6DB8ANNCL10 060DB8ANNCL10 6R8DB8ANNCL10 070DB8ANNCL10 080DB8ANNCL10 8R2DB8ANNCL10 090DB8ANNCL10 100JB8NNNCL10 100J B8ANNCL10 120JB8NNNCL10 120JB8ANNCL10 150JB8NNNCL10 150JB8ANNCL10 180JB8NNNCL10 180J B8ANNCL10 220JB8NNNCL10 220JB8ANNCL10 270JB8NNNCL10 270JB8ANNCL10 330JB8NNNCL10 330JB8ANN0.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151518182222272733330.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050500.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LCL10 390JB8NNNCL10 390JB8ANNCL10 470JB8NNNCL10 470JB8ANNCL10 560JB8NNNCL10 560JB8ANNCL10 680JB8NNNCL10 680JB8ANNCL10 820JB8NNNCL10 820JB8ANNCL10 101JB8NNNCL10 101JB8ANNCL10 121JB8NNNCL10 121JB8ANNCL10 151JB8NNNCL10 151JB8ANNCL10 181JB8NNNCL10 181JB8ANNCL10 221JB8NNNCL10 221JB8ANNCL10 271JB8NNNCL10 271JB8ANNCL10 331JB8NNNCL10 331JB8ANNCL10 391JB8NNNCL10 471JB8NNNCL10 471JB8ANNCL10 561JB8NNNCL10 681JB8NNNCL10 681JB8ANNCL10 821JB8NNNCL10 102JB8NNNCL10 122JB8NNNCL10 222JB8NNNCL10 332JA8NNN3939474756566868828210010012012015015018018022022027027033033039047047056068068082010001200220033005%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050250.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsCL21 560JBANNNCL21 680JBANNNCL21 820JBANNNCL21 101JBANNNCL21 101JBAANNCL21 121JBANNNCL21 151JBANNNCL21 181JBANNNCL21 221JBANNNCL21 271JBANNNCL21 331JBANNNCL21 331JBAANNCL21 391JBANNNCL21 471JBANNNCL21 471JBAANNCL21 561JBANNNCL21 821JBCNNNCL21 821JBAANNCL21 102JBCNNNCL21 122JBFNNNCL21 152JBFNNNCL21 182JBFNNNCL21 222JBFNNNCL21 332JAFNNNCL21 332JBFNNNCL21 392JBFNNNCL21 472JAFNNNCL21 472JBFNNNCL21 562JBFNNNCL21 103JBFNNN56688210010012015018022027033033039047047056082082010001200150018002200330033003900470047005600100005%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5050505050505050505050505050505050505050505050255050255050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.950.750.951.351.351.351.351.351.351.351.351.351.351.35Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LCL21 R47CBAANNCL21 0R5CBAANNCL21 R68CBAANNCL21 R82CBAANNCL21 010CBAANNCL21 1R2CBAANNCL21 1R5CBAANNCL21 1R8CBAANNCL21 020CBAANNCL21 2R2CBAANNCL21 2R7CBAANNCL21 030CBAANNCL21 3R3CBAANNCL21 3R9CBAANNCL21 040CBAANNCL21 4R7CBAANNCL21 050DBAANNCL21 5R6DBAANNCL21 060DBAANNCL21 6R8DBAANNCL21 070DBAANNCL21 080DBAANNCL21 8R2DBAANNCL21 090DBAANNCL21 100JBANNNCL21 100J BAANNCL21 120JBANNNCL21 120J BAANNCL21 150JBANNNCL21 180J BANNNCL21 220JBANNNCL21 270JBANNNCL21 330JBANNNCL21 390JBANNNCL21 470JBANNN0.470.500.680.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151822273339470.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.75Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsUltra HighCapacitorsCapacitance Table (Ultra High Capacitors)Capacitance Table (Ultra High Capacitors)Ultra HighCapacitorsCL10F225ZP8NNNCL21F106ZPFNNNCL31F226ZPHNNNCL32F226ZPJNNNCL05F105ZQ5NNNCL10F475ZQ8NNNCL32F107ZQJNNNY5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)2.21022221.04.710080%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%101010106.36.36.30.901.351.802.700.550.902.70-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )1.60 0.802.00 1.253.20 1.603.20 2.501.00 0.501.60 0.803.20 2.50Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.Small chip size03 Series(C0G) MLCC shows very low ESR valae.02 and 03 Series are suited to only reflow soldering02 and 03 Series are suited to miniature RF module,portable equipment and high frequency circuitVCO, Tuner, RF ModuleMCM ModuleMobile phone, Wireless LAN, Note PCFor using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification.FeatureApplicationStructure and DimensionsCodeEIACode L W T BWDimension(mm)0.3 0.030.3 0.030.6 0.0302010.15 0.05030.2 0.020.2 0.020.4 0.02010050.07~0.1402CL21X106KAYNNNCL31X106KAHNNNCL21X106KOYNNNCL21X106KPCLNNCL05X105KQ5NNNCL10X105KQ8NNNCL21X225KQFNNNCL21X475KQFNNNCL10X106KQ8NNNCL21X106KQQNNNCL31X106KQHNNNCL21X226KQQNNNCL21X106KRCLNNCL31B475KAHNNNCL31B106KAHNNNCL31B475KOHNNNCL31B106KOHNNNCL21B225KQFNNNCL21B225KPFNNNCL21B106KQQNNNCL31B106KQHNNNCL32B226KQJNNNX6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X5R(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)101010101.01.02.24.710101022104.7104.7102.22.210102210%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%252516106.36.36.36.36.36.36.36.342525161610106.36.36.31.451.801.450.950.550.901.351.350.901.401.801.400.951.801.801.801.801.351.351.351.802.7022%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )15%(-55~+85 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )2.00 1.253.20 1.602.00 1.252.00 1.251.00 0.501.60 0.802.00 1.252.00 1.251.60 0.802.00 1.253.20 1.602.00 1.252.00 1.253.20 1.603.20 1.603.20 1.603.20 1.602.00 1.252.00 1.252.00 1.253.20 1.603.20 2.50Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)Product Line Up (Ultra High Capacitors)Super SmallCapacitorsSuper Small CapacitorsProduct Line Up (Super Small Size Capacitors)FeatureHigh VoltageCapacitorsHigh Voltage CapacitorsCapacitance Table (High Voltage Capacitors)Capacitance Table (High Voltage Capacitors)High VoltageCapacitorsCapacitance Table (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)High VoltageCapacitorsProduct Line Up (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)High VoltageCapacitorsCL31B222KGFNNNCL31B332KGFNNNCL31B472KGFNNNCL31B682KGFNNNCL31B103KGFNNNCL32B153KGFNNNCL32B223KGFNNNCL43B473KGFNNNCL43B104KG INNNCL21B153KEFNNNCL31B473KEHNNNCL32B104KE J NNNCL43B474KE JNNNCL21B221KDCNNNCL21B331KDCNNNCL31B471KDCNNNCL21B102KDCNNNCL21B222KDCNNNCL31B222KDCNNNCL21B472KDCNNNCL31B472KDCNNNCL21B103KDCNNNCL31B153KDCNNNCL31B223KDCNNNCL31B333KDFNNNCL31B473KDFNNNCL32B473KDHNNNCL31B104KDHNNNCL43B104KDFNNNCL21B221KCANNNCL21B471KCANNNCL10B102KC8NNNCL21B102KCANNNCL21B222KCANNNCL21B332KCANNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)2.23.34.76.81015224710015471004700.220.330.471.02.22.24.74.71015223347471001000.220.471.01.02.23.310%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%5005005005005005005005005002502502502502002002002002002002002002002002002002002002002001001001001001001001.351.351.351.351.351.351.351.352.201.351.802.802.801.001.001.001.001.001.001.001.001.001.001.001.351.351.801.801.350.750.750.900.750.750.7515%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )3.20 1.603.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.204.50 3.202.00 1.253.20 1.603.20 2.504.50 3.202.00 1.252.00 1.253.20 1.602.00 1.252.00 1.253.20 1.602.00 1.253.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 1.604.50 3.202.00 1.252.00 1.251.60 0.802.00 1.252.00 1.252.00 1.25Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)Product Line Up (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)CL10B472KC8NNNCL21B472KCANNNCL21B682KCANNNCL10B103KC8NNNCL21B103KCANNNCL32B103KCFNNNCL21B153KCCNNNCL31B153KCCNNNCL21B223KCFNNNCL31B223KCCNNNCL31B333KCCNNNCL21B473KCFNNNCL31B473KCCNNNCL31B104KCFNNNCL31B154KCHNNNCL32B154KCFNNNCL32B224KCHNNNCL43B224KCFNNNCL32B334KCHNNNCL43B334KCFNNNCL32B474KCI NNNCL43B474KCHNNNCL31B105KCHNNNCL32B105KCJNNNCL43B105KCJNNNCL55B105KCHNNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)4.74.76.8101010151522223347471001501502202203303304704701.01.01.01.010%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%1001001001001001001001001001001001001001001001001001001001001001001001001001000.900.750.750.900.751.351.001.001.351.001.001.351.001.351.801.351.801.351.801.352.201.801.802.802.801.8015%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )1.60 0.802.00 1.252.00 1.251.60 0.802.00 1.253.20 2.502.00 1.253.20 1.602.00 1.503.20 1.603.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.203.20 2.504.50 3.203.20 2.504.50 3.203.20 1.603.20 2.504.50 3.205.70 5.00Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.High VoltageCapacitorsCodeEIACodeL W T BWDimension(mm)0.85(0.15)1.10(0.15)1.60(0.20)0.500.3/-0.33.200.20 1.600.20120631Suitable for the trigger of the flash circuitHighly reliable performanceSuperior in bias characteristicsSoft termination with a Ni/Sn plated overcoatStrobe Circuit FeatureApplicationStructure and DimensionCapacitance Table (Camera Strobe Circuit Capacitors)Camera StrobeCircuit CapacitorsFeature Capacitance TableArray TypeCapacito rsProduct Line Up (Array Type Capacitors)FeatureLow ESLCapacitorsCapacitance Table (Low ESL Capacitors)Product Line Up (Low ESL Capacitors)Low ESL CapacitorsReliability TestConditionReliability Test ConditionPremium Capacitors for Automotive ApplicationsPart Numbering System (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsFeatureCapacitance Table (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsProduct Line Up (Automotive Capacitors)Product Line Up (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsProduct Line Up (Automotive Capacitors)CL21C221JC6*PN CL21C331JC6*PN CL21C471JCC *PN CL21C681JCC *PN CL21C102JCC *PN CL21C102JCF *PN CL21C122JBC *PN CL21C152JBC *PN CL21C182JBC *PN CL21C222JBC *PN CL21C272JBC *PN CL21C332JBC *PN CL21C392JBC *PN CL21C472JBC *PN CL21C562JBC *PN CL21C122JBF *PN CL21C152JBF *PN CL21C182JBF *PN CL21C222JBF *PN CL21C272JBF *PN CL21C332JBF *PN CL21C392JBF *PN CL21C472JBF *PN CL21C562JBF *PN CL21C682JBF *PN CL21C822JBF *PN CL21C103JBF *PNC0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA))220 330 470680 1.0 1.0 1.21.5 1.82.2 2.73.3 3.94.75.6 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.66.8 8.2 10.05% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%1001001001001001005050505050505050505050505050505050505050500.700.700.950.950.951.350.950.950.950.950.950.950.950.950.951.351.351.351.351.351.351.351.351.351.351.351.3530ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 )30ppm/ (-55~+125 )2.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.25Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC CodeTemperature CharacteristicsSize L W(mm)Premium Capacitors for Automotive Applications Capacitance Table (Automotive Capacitors)*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.CL10B473KO8*PN CL10B683KO8*PN CL10B104KO8*PN CL10B103KA8*PN CL10B153KA8*PN CL10B223KA8*PN CL10B333KA8*PN CL10B473KA8*PN CL10B683KA8*PN CL10B104KA8*PN CL10B102KB8*PN CL10B152KB8*PN CL10B222KB8*PN CL10B332KB8*PN CL10B472KB8*PN CL10B682KB8*PN CL10B103KB8*PN CL10B153KB8*PN CL10B223KB8*PN CL10B333KB8*PN CL10B473KB8*PN CL10B683KB8*PN CL10B104KB8*PN CL10B102KC8*PN CL10B152KC8*PN CL10B222KC8*PN CL10B332KC8*PN CL10B472KC8*PN CL10B682KC8*PN CL10B103KC8*PN CL10B221KC8*PN CL10B331KC8*PN CL10B471KC8*PNCapacitance Product Line Up (Automotive Capacitors)Part Number ThicknessMax. (mm)0.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Capacitance Tolerance Size L W (mm)RatedVoltage(Vdc)Temperature CharacteristicsTC Code10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%47 68 100 10 15 22 33 47 68 100 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 1.0 1.5 2.2 3.3 4.7 6.8 10 220 330 4701.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.80X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )1616162525252525252550505050505050505050505050100100100100100100100100100100Premium Capacitors for Automotive Applications CL10B681KC8*PN CL21B104KOC *PN CL21B154KOF *PN CL21B224KOF *PN CL21B334KOF *PN CL21B474KOF *PN CL21B473KAC *PN CL21B683KAC *PN CL21B104KAC *PN CL21B154KAF *PN CL21B224KAF *PN CL21B334KAF *PN CL21B474KAF *PN CL21B102KB6*PN CL21B152KB6*PN CL21B222KB6*PN CL21B332KB6*PN CL21B472KB6*PN CL21B682KB6*PN CL21B103KB6*PN CL21B153KB6*PN CL21B223KB6*PN CL21B333KBC *PN CL21B473KBC *PN CL21B683KBC *PN CL21B104KBC *PN CL21B104KBF *PN CL21B154KBF *PN CL21B224KBF *PN CL21B334KBF *PN CL21B474KBF *PN CL21B102KC6*PN CL21B152KC6*PNCapacitance Product Line Up (Automotive Capacitors)Part Number ThicknessMax. (mm)0.900.951.351.351.351.350.950.950.951.351.351.351.350.700.700.700.700.700.700.700.700.700.950.950.950.951.351.351.351.351.350.700.70Capacitance Tolerance Size L W (mm)RatedVoltage(Vdc)Temperature CharacteristicsTC Code10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%680 100 150 220 330 470 47 68 100 150 220 330 470 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 100 150 220 330 470 1.0 1.51.60 0.802.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.25X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )100161616161625252525252525505050505050505050505050505050505050100100*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.。
三星0603 22uf电容规格书
三星0603 22uf电容规格书三星0603 22uf电容规格书的解读与应用一、引言在现代电子产品中，电容作为一种重要的被动元件，在电路中扮演着储存电荷、滤波、耦合等重要作用。
而三星0603 22uf电容规格书作为电容的一种，其规格书所包含的信息对于电子工程师和电子爱好者来说是至关重要的。
在本篇文章中，我们将深度解读三星0603 22uf电容规格书的内容，并探讨其在电路设计和应用中的重要性。
二、三星0603 22uf电容规格书的解读1. 产品型号：三星0603 22uf电容规格书所指代的产品型号为0603，22uf。
其中，0603代表了电容的封装尺寸，而22uf则代表了电容的容量大小。
理解这一点对于正确选型和应用至关重要。
2. 规格参数：在规格书中，通常包含了电容的电压值、容差、温度特性等重要参数。
在选型过程中，需要根据具体的电路要求和环境条件来选择合适的规格参数，以确保电路稳定性和性能。
3. 使用注意事项：在规格书中，也会包含一些使用注意事项和贮存条件，这些信息对于保证电容性能和寿命至关重要。
在使用和贮存过程中需要严格按照规格书要求进行操作。
三、三星0603 22uf电容在电路设计和应用中的重要性作为一种常见的电容型号，三星0603 22uf电容在电路设计和应用中扮演着重要的角色。
由于其封装尺寸小巧，适合于电子产品的迷你化设计，因此在手机、平板等智能设备中得到了广泛应用。
22uf的较大容量可以满足一些对电荷储存和稳压要求较高的电路，例如稳压电路、滤波电路等。
在电子产品设计中，正确选用和应用三星0603 22uf电容对于提高电路性能和稳定性具有重要意义。
四、对三星0603 22uf电容的个人观点和理解在我看来，三星0603 22uf电容作为一种电子元件，其规格书所包含的信息对于电子工程师和电子爱好者来说是非常重要的。
通过深入了解其规格书的内容，可以更好地应用于实际电路设计中，并确保电路工作的稳定性和性能。
三星70寸屏规格书PI_LTI700HD03_S_110111_Rev05_000
Samsung ConfidentialApplication Engineering Part, LCD DivisionSamsung Electronics Co . , LTD.Product InformationSAMSUNG TFT-LCDMODEL : LTI700HD03The Information Described in this Specification is Preliminary and can be changed without prior noticeDATE : Jan. 11, 2011APPROVED BYKwang-soo Lee DATE Jan.11,2011PREPARED BYDong-Hyun KimDATE Jan.11,2011Samsung ConfidentialContentsRevision History --------------------------------------------------------------------------------------------(3) General Description ---------------------------------------------------------------------------------------(4) General Information ---------------------------------------------------------------------------------------(4)1. Absolute Maximum Ratings --------------------------------------------------------------------------(5)2. Application information for DID (Digital Information Display) ----------------------------------(6)3. Optical Characteristics ---------------------------------------------------------------------------------(7)4. Electrical Characteristics -----------------------------------------------------------------------------(10)4.1 TFT LCD Module4.2 Back Light Unit4.3 Inverter Input & Specification5. Input Terminal Pin Assignment ---------------------------------------------------------------------(13)5.1 LVDS Connector5.2 Inverter Input Pin Configuration5.3 Inverter Input Power Sequence5.4 LVDS Interface5.5 Input Signals, Basic Display Colors and Gray Scale of Each Color6. Interface Timing ----------------------------------------------------------------------------------------(18)6.1 Timing Parameters (DE only mode)6.2 Timing Diagrams of interface Signal (DE only mode)6.3 Power ON/OFF Sequence7. Outline Dimension --------------------------------------------------------------------------------------(21)8. Packing ---------------------------------------------------------------------------------------------------(23)9. Marking &Others ---------------------------------------------------------------------------------------(24)10. General Precaution -----------------------------------------------------------------------------------(25)10.1 Handling10.2 Storage10.3 Operation10.4 Operation Condition Guide10.5 OthersSamsung Confidential * Revision HistoryDate Rev.NoPage SummaryJan1,2011000all First issuedSamsung ConfidentialDescriptionGeneral DescriptionFeaturesGeneral InformationLTI700HD03 is a color active matrix liquid crystal display (LCD) that uses amorphous silicon TFT(Thin Film Transistor) as switching components. This model is composed of a TFT LCD panel, a driver circuit and a backlight unit. The resolution of a 70.0“ is1920 x 1080 and this model can display up to 16.7 million colors with wide viewing angle of 89°or higher in all directions. This panel is intended to support applications to provide a excellent performance for Flat Panel Display such as Home-alone Multimedia TFT-LCD TV, Display terminals for AV application products.▪RoHS compliance (Pb-free)▪High contrast ratio, High aperture ratio, High luminance ▪SPVA(Super Patterned Vertical Align) mode ▪Wide viewing angle (±178°)▪High speed response ▪Landscape type▪Wide UXGA (1920 x 1080 pixels) resolution (16:9)▪Low power consumption▪Direct Type 64 CCFTs(Cold Cathode Fluorescent Tube)▪DE(Data Enable) mode▪LVDS (Low Voltage Differential Signaling) interface (2pixel/clock)Items SpecificationUnit Note Module Size 1630.0(W TYP ) x 952.0(H TYP )mm ±1.0mm83.6(D MAX )Weight 47,500g MaxPixel Pitch 0.807(H) x 0.807(V)mm Active Display Area 1549.44(H) x 871.56(V)mmSurface Treatment Haze 6.7%, Hard-coating (3H)Glare Display Colors 8 bit -16.7M colors Number of Pixels1920 x 1080pixel16:9Pixel Arrangement RGB vertical stripe Display Mode Normally Black Luminance of White450 (Typ.)cd/m 2Samsung Confidential1. Absolute Maximum RatingsFig. Temperature and Relative humidity rangeIf the condition exceeds maximum ratings, it can cause malfunction or unrecoverable damage to the device.Note (1) Ta= 25 ±2 °C(2) Temperature and relative humidity range are shown in the figure below. a. 90 % RH Max. (Ta ≤39°C)b. Relative Humidity is 90%or less. (Ta >39°C)c. No condensationItemSymbol Min.Max.Unit Note Power Supply Voltage V DD GND-0.513.2V (1)Storage temperature T STG -2060℃(2)Glass surface temperature (Operation)Center T CENTER050℃(2),(3)T. Uniformity△T-10℃Samsung Confidential(5) Definition of test point2. Application information for DID (Digital Information Display)A long-term display like DID application may cause uneven display including image retention.To optimize module's lifetime and function, several operating usages are required.1. Normal operating condition -Temperature: 20 ±15℃-Humidity: 55 ±20 %-Display pattern: moving picture or regular switchover displayNote) Long-term static information image may cause uneven display.2. Operating usages under abnormal operating condition. Note (1)a. Ambient condition-Well-ventilated place is recommended to set up DID system.b. Power off and screen saver-Periodical power-off or screen saver is needed after long-term static display. Note (2)3. Operating usages to protect uneven display due to long-term static information display a. Suitable operating time for B-DID : under 12 hours a day.b. Periodical display contents change from static image to moving picture.-Liquid crystal refresh time is required.c. Periodical background color and character (image) color change-Use different colors for background and character (image), respectively.-Change colors periodically.d. Avoid combination of background and character with large different luminance.Note (1)Abnormal condition means every operating condition except normal operating condition.Note (2)Moving picture or black pattern is strongly recommended for screen saver.4. Lifetime in this spec is guaranteed only when DID is used under right operating usages.5mm 5mmLCD Module○51243T CENTER : Temperature of the center of the glass surface(Test point 5)T CORNER : Temperature of each edge of the glass surface(Test point 1~4)△T should be less than 10℃(△T = |T CENTER –T CORNER | )Samsung Confidential3. Optical CharacteristicsThe optical characteristics should be measured in a dark room or equivalent.Measuring equipment : TOPCON BM-7,SPECTRORADIOMETER SR-3(Ta = 25 ±2°C, V DD = 12V, f V = 60Hz,f DCLK =148.5MHz,I L = 11.0 mArms)Note (1) Test Equipment SetupThe measurement should be executed in a stable, windless and dark room between 40min and 60min after lighting the backlight at the given temperature for stabilization of the backlight. This should be measured in the center of screen.Single lamp current : 11.0 mAEnvironment condition : Ta = 25 ±2 °CItemSymbol ConditionMin.Typ.Max.UnitNote Contrast Ratio (Center of screen)C/R Normal q L,R =0q U,D =0Viewing Angle15002000-(3)SR-3Response TimeG-to-GTg -810msec (5)BM-7Luminance of White (Center of screen)Y L 400450-cd/m 2(6)SR-3Color Chromaticity (CIE 1931)Red Rx TYP.-0.030.654TYP.+0.03(7),(8)SR-3Ry 0.336Green Gx 0.272Gy0.610Blue Bx 0.145By 0.060WhiteWx 0.280Wy 0.290Color Gamut --77-%(7)SR-3Color Temperature--10,000-K(7)SR-3Viewing AngleHor.q L C/R ≥107589-Degree(8)SR-3q R7589-Ver.q U 7589-q D 7589-Brightness Uniformity(9 Points)B uni--25%(4)SR-3Photo detectorLCD PanelTFT -LCD ModuleThe center of the screenSR-3 : 50㎝BM-7 : 50㎝FieldNote (2) Definition of test pointNote (3) Definition of Contrast Ratio (C/R): Ratio of gray max (Gmax) &gray min (Gmin) at the center point ⑤of the panelC R G G /max minGmax : Luminance with all pixels white Gmin : Luminance with all pixels blackPhoto detectorField SR-31°BM-72°Active AreaTest Point③⑥⑨⑧⑦④⑤②①9601600180540900Note (4) Definition of 9 points brightness uniformityNote (5) Definition of Response time : Sum of Tr, TfBuni B B B =*-100(max min)maxBmax : Maximum brightness Bmin : Minimum brightnessOptical InstrumentsResponseTIMET RT F10%90%Black (data off)0%Black (data off)White (data on)100%Note (6) Definition of Luminance of White : Luminance of white at center point ⑤Note (7) Definition of Color Chromaticity (CIE 1931)Color coordinate of Red, Green, Blue &White at center point ⑤Note (8) Definition of Viewing Angle: Viewing angle range (C/R ≥10)Display dataSamsung Confidentiala) Black Pattern b) White Pattern c) N-Pattern(4) Measurement ConditionsRush Current I RUSH can be measured when T RUSH. is 470㎲.T RUSH=470㎲100%GND90%10%V DD4. Electrical Characteristics4.1TFT LCD ModuleThe connector for display data &timing signal should be connected.Ta = 25°C ±2 °CNote (1) The ripple voltage should be controlled under 10% of V DD.(2) f V= 60Hz,f DCLK = 148.5 MHz, V DD= 12.0V, DC Current.(3) Power dissipation check pattern (LCD Module only)Item Symbol Min.Typ.Max.Unit NoteVoltage of Power Supply VDD10.812.013.2V(1)Currentof PowerSupply(a) BlackIDD-1050-mA(2),(3)(b) White-1100-mA(c) N-Pattern-16201900mAVsync Frequency fV-60-HzHsync Frequency fH55.067.572.0kHzMain Frequency fDCLK120.0148.5160.0MHzRush Current IRUSH--7A(4)4.2Back Light UnitThe backlight unit contains 64 direct-lighting type CCFTs (Cold Cathode Fluorescent Tube). The characteristics of lamps are shown in the following tables.Ta=25 ±2°CNote (1) It is defined as the time to take until the brightness reduces to 50% of its original value.[Operating condition : Ta = 25±2℃, IL = 11.0 mArms, For single lamp only]Item Symbol Min.Typ.Max.Unit NoteLamp Current I L 10.011.012.0mArms Lamp Voltage V L 935--Vrms Operating Life TimeHr50,000--Hour(1)LCD ModuleCOLD 64COLD 63COLD 62COLD 3COLD 2COLD 1HOT 64HOT 63HOT 62HOT 3HOT 2HOT 1I n v e r t e rG N DFig. Rear view4.3Inverter Input Condition &SpecificationNote (1) Power Consumption is measured at 450[cd/m2] of luminance condition which isthe typical luminance value. Lamp Current is measured at the point before Lamp.Items SymbolConditionsSpecifications Unit NoteMin.Typ.Max.Input Voltage Vin -21.624.026.4V Ta=25±2 °C Input Current IinVin = 24.0V Vdim = 3.3V -35-A Initial turn on -24-A After 2hours aging Lamp Current I O,MAX Vdim = 3.3V 10.011.012.0mArms After 1 hour Warm-upFrequency F LAMP Vin = 24.0V Vdim = 3.3V 424446kHzBacklight On/Off ON Vin = 24.0V 2.4- 5.25V -OFF 0-0.8Dimming ControlV DIMMax Lum 3.3--V -Min. Lum--05.Input Terminal Pin Assignment5.1 Input Signal &Power Connector : FI-RE51S-HF (JAE)PIN No.Description PIN No.Description1Vdd (12V)26EvenLVDSSignal RE[0]P2Vdd (12V)27RE[1]N 3Vdd (12V)28RE[1]P 4Vdd (12V)29RE[2]N 5Vdd (12V)30RE[2]P 6No Connection31GND 7GND32RECLK-8GND33RECLK+ 9GND34GND10OddLVDSSignal RO[0]N35RE[3]N11RO[0]P36RE[3]P 12RO[1]N37No Connection13RO[1]P38No Connection14RO[2]N39GND15RO[2]P40No Connection16GND41No Connection17ROCLK-42No Connection18ROCLK+43No Connection19GND44No Connection20RO[3]N45LVDS Option21RO[3]P46No Connection22No Connection47No Connection23No Connection48No Connection24GND49No Connection25Even LVDS RE[0]N50No Connection51No Connection Note(1) No Connection :These pins are only used for SAMSUNG internal purpose.(2) LVDS Option : High (3.3V) → Normal LVDS format:Low (GND) or Open (N.C) → JEIDA LVDS formatSequence :On = V DD≥ LVDS Option ≥ Interface SignalOff = Interface Signal ≥ LVDS Option ≥ V DDNote (3) LVDS ConnectorPCB▼Pin No. 1 Pin No. 51#1#51#1#51Fig. Connector diagrama. All GND pins should be connected together and also be connected to the LCD’smetal chassis.b. All power input pins should be connected together.c. All N.C pins should be separated from other signal or power.5.3 Inverter Input Power Sequence0.5sec [Min]Vin (24V)Dimming Control0.5sec [Min]0.1sec [Min]0.5sec [Min]1.1sec [Min]20msec [Min]Back Light On/Off0.9 Vin 0.1 Vin2.4 VPin No.Pin Configuration(FUNCTION)1Vin (24V)2Vin (24V)3Vin (24V)4Vin (24V)5Vin (24V)6GND 7GND 8GND 9GND 10GND11Error out(Normal: GND, Abnormal: Open Collector output)12Backlight On /Off [On: 2.4 ~ 5.25V, Off: 0 ~ 0.8V]13Internal PWM Dimming [0V: Min, 3.3V: Max]14External PWM Dimming [30% :Min, 100%: Max]5.2 Inverter Input Pin ConfigurationConnector : YEON HO, 20022WR-14AMLNote) External PWM Dimming →Pin 13:Open, Pin14:External PWM PulseInternal PWM Dimming →Pin 13: DC Voltage, Pin 14: OpenSamsung Confidential 5.4LVDS Interface-LVDS Receiver : Tcon (merged)-Data Format (JEIDA & Normal) Default LVDS Option : JEIDALVDS pin JEIDA -DATA VESA -DATATxOUT/RxIN0TxIN/RxOUT0R2R0 TxIN/RxOUT1R3R1 TxIN/RxOUT2R4R2 TxIN/RxOUT3R5R3 TxIN/RxOUT4R6R4 TxIN/RxOUT6R7R5 TxIN/RxOUT7G2G0TxOUT/RxIN1TxIN/RxOUT8G3G1 TxIN/RxOUT9G4G2 TxIN/RxOUT12G5G3 TxIN/RxOUT13G6G4 TxIN/RxOUT14G7G5 TxIN/RxOUT15B2B0 TxIN/RxOUT18B3B1TxOUT/RxIN2TxIN/RxOUT19B4B2 TxIN/RxOUT20B5B3 TxIN/RxOUT21B6B4 TxIN/RxOUT22B7B5 TxIN/RxOUT24HSYNC HSYNC TxIN/RxOUT25VSYNC VSYNC TxIN/RxOUT26DEN DENTxOUT/RxIN3TxIN/RxOUT27R0R6 TxIN/RxOUT5R1R7 TxIN/RxOUT10G0G6 TxIN/RxOUT11G1G7 TxIN/RxOUT16B0B6 TxIN/RxOUT17B1B7 TxIN/RxOUT23RESERVED RESERVED5.5 Input Signals, Basic Display Colors and Gray Scale of Each ColorCOLOR DISPLAY(8bit)DATA SIGNALGRAYSCALELEVEL RED GREEN BLUER0R1R2R3R4R5R6R7G0G1G2G3G4G5G6G7B0B1B2B3B4B5B6B7BASIC COLORBLACK000000000000000000000000-BLUE000000000000000011111111-GREEN000000001111111100000000-CYAN000000001111111111111111-RED111111110000000000000000-MAGENTA111111110000000011111111-YELLOW111111111111111100000000-WHITE111111111111111111111111-GRAY SCALE OF RED BLACK000000000000000000000000R0 DARK↑↓LIGHT100000000000000000000000R1010000000000000000000000R2::::::::::::::::::R3~R252 ::::::::::::::::::101111110000000000000000R253011111110000000000000000R254RED111111110000000000000000R255GRAY SCALEOF GREEN BLACK000000000000000000000000G0 DARK↑↓LIGHT000000001000000000000000G1000000000100000000000000G2::::::::::::::::::G3~G252 ::::::::::::::::::000000001011111100000000G253000000000111111100000000G254GREEN000000001111111100000000G255GRAY SCALE OF BLUE BLACK000000000000000000000000B0 DARK↑↓LIGHT000000000000000010000000B1000000000000000001000000B2::::::::::::::::::B3~B252 ::::::::::::::::::000000000000000010111111B253000000000000000001111111B254BLUE000000000000000011111111B255Note)Definition of Gray :Rn : Red Gray, Gn : Green Gray,Bn : Blue Gray (n = Gray level) Input Signal :0 = Low level voltage,1 = High level voltage6.Interface Timing6.1Timing Parameters (DE only mode)Note) This product is DE only mode. The input of Hsync &Vsync signal doesnot have an effect on normal operation.Test Point : TTL control signal and CLK at LVDS Tx input terminal in systemSignal ItemSymbol Min.Typ.Max.Unit Note Clock Frequency 1/T C 60.074.2580.0MHz 2pixel /clock Hsync F H 55.067.572.0KHz -VsyncF V -60-Hz -Vertical Display TermActive Display Period T VD -1080-Lines-Vertical Total T V 109211251158Lines -Horizontal Display TermActive Display Period T HD -1920-Clocks -Horizontal Total T H201622002400Clocks -6.2Timing diagrams of interface signal (DE only mode)DATA SIGNALSDET VDT VT HD CLKT CDET HDT VB0.5 V CCT EST DST DHT CHT CLT CDEDISPLAY DATADCLK0.5 V CC0.5 V CC0<T1≤10msec 0<T2≤50msec 0<T3≤50msec 1000msec≤T41000msec≤T5(Recommend Value)100msec≤T6(Recommend Value)6.3Power ON/OFF SequenceTo prevent a latch-up or DC operation of the LCD Module, the power on/off sequence should be as the diagram below.T1 : V DD rising time from 10% to 90%T2 : The time from V DD to valid data at power ON.T3 : The time from valid data off to V DD off at power Off.T4 : V DD off time for Windows restartT5 : The time from valid data to B/L enable at power ON.T6 : The time from valid data off to B/L disable at power Off.▪The supply voltage of the external system for the Module input should be the same as the definition of V DD .▪Apply the lamp voltage within the LCD operation range. When the backlight turns on before the LCD operation or the LCD turns off before the backlight turns off,the display may momentarily show abnormal screen.▪In case of V DD = off level,please keep the level of input signals low or keep a high impedance.▪T4 should be measured after the Module has been fully discharged between power off and on period.▪Interface signal should not be kept at high impedance when the power is on.2.4 V8. PACKING8.1CARTON (Internal Package)(1) Packing FormCorrugated fiberboard box and corrugated cardboard as shock absorber(2) Packing Method8.2 Packing SpecificationPacking-Pallet BoxCushion-FoamLCD ModuleCushion-FoamPallet-PlasticItem Specification RemarkLCD Packing 5ea / (Packing-Pallet Box) 1. 230 Kg / LCD (5ea)2. 23.2 Kg / Cushion-pallet (4ea)3. 14 Kg / Packing-Pallet Box (1ea)4. Cushion-pallet Material : EPS5. Packing-Pallet Box Material : DW4Pallet1Box / Pallet 1. Pallet weight = 15 Kg Packing DirectionVertical Total Pallet SizeH x V x height 2025mm(H) x 1050mm(V) x 1205mm(height)Total Pallet Weight 282.2 Kg Pallet(15kg) + Module(46*5=230) +Cushion(23.2kg) + Pallet-BOX(14kg)9. MARKING &OTHERSA nameplate bearing followed by is affixed to a shipped product at the specified location on each product.(1) Part number : LTI700HD03(2) Revision: Three letters(3) Lot number : X X X X XXX XX XCell Position No. (In the Glass)Glass No. (In the one Lot)Lot No. (Glass)MonthYear (Note1)Product codeLine40mm80mmWeek code : 0529week year(4) Nameplate Indication(6) Others1. After service partLamps cannot be replaced because of the narrow bezel structure.(5) Packing box attachPart number100mm 165mm Box serial numberLTI700HD03XXXX5LTI700HD03XXXXXXXXXX XXX Lot numberRevision code10.General PrecautionsSamsung Confidential10.1 Handling(a) When the Module is assembled, it should be attached to the system firmly using allmounting holes. Be careful not to twist and bend the Module.(b) Because the inverter use high voltage, it should be disconnected from powerbefore it is assembled or disassembled.(c) Refrain from strong mechanical shock and / or any force to the Module.In addition to damage, this may cause improper operation or damage to the Module and CCFT backlight.(d) Note that polarizers are very fragile and could be damage easily.Do not press or scratch the surface harder than a HB pencil lead.(e) Wipe off water droplets or oil immediately. If you leave the droplets for a long time,staining or discoloration may occur.(f) If the surface of the polarizer is dirty, clean it using absorbent cotton or soft cloth.(g) Desirable cleaners are water, IPA(Isopropyl Alcohol) or Hexane.Do not use Ketone type materials(ex. Acetone), Ethyl alcohol, Toluene, Ethyl acidor Methyl chloride. It might permanent damage to the polarizer due to chemicalreaction.(h) If the liquid crystal material leaks from the panel, it should be kept away from theeyes or mouth . In case of contact with hands, legs or clothes, it must be washedaway with soap thoroughly.(i) Protect the Module from static, or the CMOS Gate Array IC would be damaged.(j) Use finger-stalls with soft gloves in order to keep display clean during the incoming inspection and assembly process.(k) Do not disassemble the Module.(l) Do not adjust the variable resistor located on the Module.(m) Protection film for polarizer on the Module should be slowly peeled off just before use so that the electrostatic charge can be minimized.(n) Pins of I/F connector should not be touched directly with bare hands.Samsung Confidential 10.2 Storage(a) Do not leave the Module in high temperature, and high humidity for a long time.It is highly recommended to store the Module with temperature from 0 to 35℃and relative humidity of less than 70%.(b) Do not store the TFT-LCD Module in direct sunlight.(c) The Module should be stored in a dark place. It is prohibited to apply sunlight orfluorescent light in storing.10.3 Operation(a) Do not connect or disconnect the Module in the "Power On" condition.(b) Power supply should always be turned on/off by the"Power on/off sequence"(c) Module has high frequency circuits. Sufficient suppression to the electromagneticinterference should be done by system manufacturers.Grounding and shielding methods may be important to minimize the interference.(d) The cable between the backlight connector and its inverter power supply shouldbe connected directly with a minimized length. A longer cable between the backlight and the inverter may cause lower luminance of lamp(CCFT) and may requirehigher startup voltage(Vs).10.4 Operation Condition Guide(a) The LCD product should be operated under normal conditions.Normal condition is defined as below;-Temperature : 20±15℃-Humidity: 55±20%-Display pattern : continually changing pattern (Not stationary)(b) If the product will be used in extreme conditions such as high temperature, humidity,display patterns or operation time etc.., It is strongly recommended to contact SEC for Application engineering advice. Otherwise, its reliability and function may not be guaranteed. Extreme conditions are commonly found at Airports, Transit Stations,Banks, Stock market, and Controlling systems.Samsung Confidential10.5 Others(a) Ultra-violet ray filter is necessary for outdoor operation.(b) Avoid condensation of water. It may result in improper operation or disconnectionof electrode.(c) Do not exceed the absolute maximum rating value. (supply voltage variation,input voltage variation, variation in part contents and environmental temperature,and so on)Otherwise the Module may be damaged.(d) If the Module keeps displaying the same pattern for a long period of time, the imagemay be "sticked" to the screen.To avoid image sticking, it is recommended to use a screen saver.(e) This Module has its circuitry PCB's on the rear side and should be handled carefullyin order not to be stressed.(f) Please contact SEC in advance when you display the same pattern for a long time.。