Panacol胶粘剂在电子组装中的应用

Panacol胶粘剂在电子组装中的应用

来自德国的胶粘剂专家Panacol(隶属Hoenle Group)，专注于胶粘技术的工业应用，自1976年成立以来在电子、汽车、医疗器械等领域获得广泛的认同。下面大致介绍一下Panacol胶粘剂在PCB电子组装中的应用。

∙Application Items 应用项目

- Conformal coating 保形涂层(三防漆)

- SMD adhesives 表面器件贴装胶粘剂

- Glop-top 包封胶

- Flip-chip underfill 倒装底填充胶

- Silicones 硅胶

- UV/UV LED lamps 紫外/紫外LED灯

- Dispensing device technology 点胶设备技术

- Heat sealing/Hot bar soldering/Heat staking 热封/热压焊/热熔焊技术

∙Advantages 优势

- Thermally and electrically conductive 可提供不同类型的导热和导电胶粘剂；

- UV and/or thermally curing 紫外固化和(或)热固化可选；

- Isotropic and anisotropic adhesives 可提供各向同性和各向异性的导电胶粘剂；

- Leading equipment technology 领先的设备技术水平；

- Expertise from a single source 一站式的专业服务。

∙Conductive adhesives, die bonding, anisotropic bonding

导电胶粘剂，芯片键合，各向异性导电接合

- Panacol-Elsol supplies a range of superior electrically and thermally conductive adhesives.

Their applications range from die bonding, antenna contacting,

flip-chip through anisotropic bonds and bonding of heatsinks to HF shielding and 3D-MID.

Panacol提供一系列性能优越的导电导热胶粘剂，其产品应用包括从芯片键合、天线连接、通过各向异性结合实现

的倒装、散热片贴合到高频屏蔽罩及三位模塑互连器件的应用。

- Typical products information 典型产品信息

Product No.产品型号Adhesive Types 胶粘剂类型Application Field应用领域

Elecolit® 6604

Therm. Conductive

导热胶measuring instrument sensors 测量仪器感应器

Vitralit® 6138

Therm. Conductive

导热胶die-attach, heatsink bonding 芯片贴合，散热片贴合

Elecolit® 3653

Electr. Conductive

导电胶flexible parts bonding 柔性部件的贴合

Elecolit® 3043 Electr. Conductive

antenna print, ceramic fuses

天线印刷，陶瓷保险丝

Elecolit® 3061

Anisotropic conductive

各向异性导电胶LCD, flexible circuits 液晶显示屏，柔性电路

Elecolit® 3063

Anisotropic conductive

各向异性导电胶UV-curing, for flexible circuits 可紫外固化，应用于柔性电路

∙SMD adhesives, flip-chip underfills

贴装元件胶粘剂, 倒装底填胶粘剂

- Panacol SMD adhesives are ideal for attaching both large and small components on printed circuit boards.

不管对于PCB板上的大器件还是小器件，Panacol贴片粘合剂都是非常是重视对大型和小型印刷电路板组件的理想

选择。

- Panacol underfillers are perfect choice for components such as FC CSPs and FC BGAs for ASICs. Panacol underfillers在用于ASIC的芯片级封装(CSP)、BGA封装等的贴装上有着非常出色的表现。

- Advantages: fast flow behaviour; spread readily under large chips; no cracking, even after thermal shock.

优点：流动迅速；大尺寸芯片下容易扩散；即使在热冲击之后也无裂痕。

- Typical products information 典型产品信息

Product No.产品型号Application Field应用领域

Vitralit® 6104VT

Mounting large components on PCBs, corner bonding

PCB大尺寸元件贴装，边角贴合

Structalit® 5604

SMD, fast curing, excellent adhesion

表面贴装器件，快干，出色的结合力

Vitralit® 2665

Flip-chip underfill, very low CTE, Nano-Filler

倒装底填充，非常低的膨胀系数，纳米级填料

Vitralit® 2675

Flip-chip underfill, high chemical/physical resist.

倒装底填充，出色的抗化学品及物理冲击能力

Vitralit® 2685Flip-chip underfill, very low shrinkage,

ideal for parts subjected to impact testing

倒装底填充，低收缩率，是需要进行冲击测试元件的理想选择

Conformal coating, glob-top, dam & fill

保形涂层(三防漆)，包封，围堰及填充

- To protect PCBs and chips from environmental factors, Panacol has developed special conformal coatings. These have already been proven in many applications in the automotive, electronics, medical systems and other industries. Our product expertise also covers glob-top sealants and dam& fill.

为了保护印刷电路板和各种chip元器件，Panacol开发了一系列具有针对性的保形涂层。经过多年的应用，Panacol的保形涂层产品已经在汽车、电子、医疗系统和其它行业获得广泛认同。另外，Panacol专长的产品