软硬结合板简介及关键参数介绍

用在較高階軟板製作上，例：軟硬複合板、COF。
＊以單面板為例 3L-FCCL
＊高尺寸安定需求 ＊高密度線路需求 ＊耐化性需求 ＊電氣特性需求 ＊耐燃性需求 ＊環保需求
COPPER Adhesive
PI
銅箔基板 (FCCL)
2L-FCCL
COPPER PI
銅箔基板 (FCCL)
4
Material Introduction
UMT Advanced
300um 200um 200um 200um 250um 300um
300um
200um 300um
Board edge Board edge
Flex Area
c
b
Board edge
Board edge
Flex Area
a
d Flex Area
e
Board edge
Board edge
Plated through hole (edge of pad) to board edge
7
b spacing
Non plated through hole to board edge spacing (no
8
b pad)
9
b Buried via (edge of pad) to board edge spacing
Non-flow or Low-flow PP
Epoxy & Glass fiber
Thickness:15um, 25um, 40um
Release paper Adhesive PET film
10
Material Introduction
EMI material 1.‧Silver film
Rigid-Flex Presentation
Content:
Material Introduction Design rule Standard Process Flow Open Discussion
2
Material Introduction
1.軟板基材薄膜種類
聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 –撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸的穩定
塗佈法 (Casting)
Production Method
Heater PAA
濺鍍法 (Sputtering)
壓合法 (Lamination)
Chill roll PI film PAA
Heater
Vaccum Chamber
Target
Copper foil
Cross-Section
Copper foil PAA
Adhesive type ● ●
● ●
●
Adhesiveless type ◎
●
● ● ● ● ●
● 表量產 ◎ 表小量產、試產或送樣中
資料來源：JMS；工研院IEK-ITIS計劃(20048/3)
Material Introduction
CVL Cover lay
Structure
Remark
Rigid section Rigid section
Before
After
Before
After 20
Design Rule
Mechanical design for flex radius:
Item
Design Issue
S1 Minimum "S1" bending to board edge distance
S2 minimum flexible area (edge of FPC) to board edge spacing
UMT Standard Guideline 1.00mm
Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex
UMT Standard 400um 300um 300um 300um 400um 400um
Rigid/Flex
400um
Rigid/Flex Rigid/Flex
300um 400um
0.70 17.78
0.70 17.78
0.80 20.32
1.00 25.4
PCB
B
PCB
C
C
A
PCB
PCB
Width X
* PCB with 1. G/F Design 2. Impedance coupon
MIN. C
Inch
mm
0.1
2.54
0.1
2.54
0.1
2.54
0.1
2.54
0.1
2.54
2.00mm
UMT Advanced Guideline 0.80mm
1.50mm
Rigid area S1
S2 Flexible area
19
Design Rule
Mechanical design for flex radius:
Punch with hard die requirement, UMT suggest to place radius 0.50mm. (Change from right angle to radius. Only UV laser cutting can make it right angle.)
0.80mm
Flex
2.00mm
Flex
1000um
Rigid/Flex
1.00mm
UMT Advanced
0.5Байду номын сангаасmm 1.00mm 500um 0.80mm
I
Rigid PCB
H G
Flex area
F
Rigid PCB
18
Design Rule
Mechanical design at transition zone:
優
生產性 基板透明性 成本
優 尚可(有改善空間)
低
生產廠商代表
Nippon Steel （新日鐵）
濺鍍法(Sputtering) 限ED
可自由控制厚度
相對容易 尚可 差 優 高
Sumitomo Metal (住友）
壓合法(Laminate) ED,RA
薄銅(<9um) 有良率問題
相對容易 優 尚可 優 中
1.Protect circuit 2.Isolation
PI film Adhesive Release paper
9
Material Introduction
Bonding material 1.‧PP Prepreg 1.‧BS Bonding sheet
Structure ◎PP
◎BS
Remark
FCCL: Flex Copper Clad Laminate CVL: Cover layer Stiffener: FR4/PI/Stainless base Reinforcement Low flow Prepreg: Resin scale flow lower than normal type BS: Bonding Sheet SF: Silver Foil (EMI shielding)
聚亞醯胺樹脂(Polymide,PI)熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不 錯電氣特性故最常使用。
3
Material Introduction
2.聚亞醯胺基材種類
依軟板結構分為兩大類
1.有接著劑三層軟板基材(3L FCCL) 2.無接著劑二層軟板基材(2L FCCL)
兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品， 2L
Structure
Ex: SF-PC5000
Remark
SF-PC1000(32um) SF-PC5000(22um) SF-PC5500(22um)
11
Content:
Material Introduction Design rule Standard Process Flow Open Discussion
Optimized. Array Size
16“X19.685” 17“X19.685” 18“X19.685”
4.4212“x4.6” (77%)
4.4212“x4.8” (76%)
4.4212“x5.1” (76%)
3.517“x4.6” (77%)
3.517“x4.8” (76%)
3.517“x5.1” (76%)
MIN. C *
Inch
mm
0.3~1.0
7.62~25.4
0.3~1.0
7.62~25.4
0.3~1.0
7.62~25.4
0.3~1.0
7.62~25.4
0.3~1.0
7.62~25.4
13
Optimized Panel Utilization Design Rule
Panel type Panel size
PCB (1 press) PCB (2 press) HDI (1 press) HDI (2 press) HDI (≧3 press)
MIN. A
Inch
mm
0.47 11.43
0.55 13.97
0.55 13.97
0.65 16.51
0.75 19.05
MIN. B
Inch
mm
0.65 16.51
16
Design Rule
Trace and component pad at transition zone:
1
e SMT pad (edge of pad) to board edge spacing
2
d Shield can (edge of ground) to board edge spacing
Plating Cu Sputter metal
PI film
Copper foil TPI
PI film
6
Material Introduction
3.2L-FCCL製造方式與比較
方法 銅箔選擇性 銅箔厚度
雙面板製造性 接著特性
塗佈法(Casting)
ED,RA 薄銅(<9um) 有良率問題 較複雜與困難
4.4212“x3.425” (77%)
4.4212“x3.675” (77%)
3.517“x2.72” (76%)
3.517“x2.92” (76%)
4.4212“x3.925” (78%)
3.517“x3.12” (77%)
14
Flex area Rigid Area
Design Rule
Transition Zone
17
Design Rule
Mechanical design at transition zone:
10
F Adhesive squeeze out
11
G Minimum flex width
12
H Flex outline radius
13
I Milling path
UMT Standard
Rigid/Flex
L1 NF Prepreg
L2 NF Prepreg
L3 FCCL
L4 NF Prepreg
L5 NF Prepreg
L6
Rigid Area
15
Terms & Definition:
Design Rule
Partial CVL
Plus II- stack via
FCCL
Component on flex Squeeze out (from Low flow Prepreg)
12
Design Rule
A. Working Panel Size
Popular Working Panel Size
18X20 inch 457.2 x 508 mm
Length Y
B. Usable area , Border (A, B) and Routing Path (C)
Structure type
2-1.聚亞醯胺薄膜簡介
聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族的雙酐類 及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。
2-2.品目型號說明
各家標示項目不盡相同， 以台虹3L-FCCL為例：
5
Material Introduction
3.2L-FCCL製造方式與比較
Ube (宇部興業)
7
Material Introduction
4.全球 FCCL廠商 3L FCCL / 2L FCCL概況
Manufacturer ARISAWA TORAY Nippon Steel(新日鐵) NIKKAN Nippon Mektron(NOK) UBE(宇部興產) Mitsui Chemical(三井化學) Dupont(杜邦) 3M THINFLEX(台虹)
3
d Ground plane to board edge spacing
4
d Power plane to board edge spacing
5
c Trace (edge of trace) to board edge spacing
6
a Micro-via (edge of pad) to board edge spacing