规则检查中英对照

DXP规则检查中英文对照

Rule Violat ions Count

违反数

Short-Circuit Constraint (Allowed=No) (All),(All)

短路约束=不允许)(全部),(全部)

Un-Routed Net Constraint ( (All) ) 26

Un-Routed净约束(所有)26岁

Clearance Constraint (Gap=9mil) (A ll),(All)

间隙约束(间隙= 9 mil)(全部),(全部)

Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor

Width=10mil) (Air Gap=10mil) (Entries=4) (All)

功率平面连接规则(救济连接)(扩展= 20 mil)(导体宽= 10 mil)(气隙= 10 mil)(条目= 4)(全部)0

Width Constraint (Min=8mil) (Max=20mil) (Preferred=15mil) (All)

宽度约束(Min = 8 mil)( Max= 20 mil)(优先15例mil)(全部)

Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)

高度约束(Min = 0 mil)( Max = 1000 mil)(优先= 500 mil)(全部)

Hole Size Constraint (Min=1mil) (Max=150mil) (A ll)

孔尺寸约束(Min = 1 mil)( Max = 150 mil)(全部)

Hole To Hole Clearance (Gap=6mil) (A ll),(All)

洞孔间隙(间隙= 6 mil)(全部),(全部)

Minimum Solder Mask Sliver (Gap=1mil) (All),(All)

最低焊接面罩银(间隙= 1 mil)(全部),(全部)

Silkscreen Over Component Pads (Clearance=1mil) (All),(All)

丝网印刷在组件垫(许可= 1 mil)(全部),(全部)

Silk to Silk (Clearance=1mil) (All),(A ll)

丝印丝印(间隙= 1 mil)(全部),(全部)

Net Antennae (Tolerance=0mil) (All)

网络天线(耐受= 0 mil)(全部)

Clearance Constraint (Gap=6mil) (InComponent(U1)),(All)

间隙约束(间隙= 6 mil)(InComponent(U1)),(所有)