moldflow 改善产品变形问题合集
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3. Analysis purpose & Process condition ------------------------------------------- 4 4. Part information, Runner and cooling system design ---------------------6~8 5. Analysis result--------------------------------------------------------------------------9~27 6. Conclusion & suggestion ------------------------------------------------------------- 28
case1
case2
2006-06-26
Reported: Bill.Bin
2-28
Material Property
ABS Polylac PA-737 Manufacturer : Chi Mei Corporation
1. Melt Density : 2. Solid Density :
0.96055g/cu.cm 8. Melt Temperature Maximum 240 deg.C 1.0494g/cu.cm 9. Mold Temperature Minimum 40deg.C
Move gate
case2 is reviser runner system (move gate )
2006-06-26
Reported: Bill.Bin
8-28
cLeabharlann Baiduse2
Fill Time
case1
case2
The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time.
.The fill time is about 5.6 second in the model . No racetrack effect occur. Air trap appear on the last filled area. Do set enough vent over there.
Reported: Bill.Bin
6-28
Runner system design
case1
Ø12mm
Ø10~2.8mm
Ø8mm
Ø2.8~8mm
Ø10mm
Case1 is base 2d mold design ，
2006-06-26
Reported: Bill.Bin
7-28
Runner system design
2006-06-26
Reported: Bill.Bin
1-28
Mold Flow Report
Mold NO：Ｂ１０２７４ Prepared by: Bill.Bin Cavity number:1*2 Analysis purpose : improve warpage。 Analysis Project: Cool +Fill +Pack + Warp Case1 is the 3D design. Case2 is revise mold design and modified the process condition.
3. Ejection Temperature
90 deg.C
4. Recommended Mold
60 deg.C
5. Recommended Melt Temperature 220deg.C
6. Filler
unfilled
7. Melt Temperature Minimum 200deg.C
3 g/10min(5kg/200.C))
P-V-T
2006-06-26
Reported: Bill.Bin
Viscosity vs Shear rate
3-28
case1
Process setting
Analysis purpose: improve warpage Analysis Project: Cooling + flow + Warpage Process setting
10. Mold Temperature Maximum 80deg.C
11. Maximum Shear Rate 12. Maximum Shear Stress
50000 1/s 0. 5 Mpa
13. Thermal conductivity
0.19(k)w/m.c
14. Measured MFR
Mold Temperature:60/65℃ Melt Temperature: 220℃ Fill Time: automatic Cooling time:60S V/P switch-over: 99% of filled volume pack
case2
80%V/P 10S
80%X0.3+0X1.5+6X60%+12X100%S
2006-06-26
Reported: Bill.Bin
4-28
Part infomatiom
Thickness distribution
2006-06-26
Reported: Bill.Bin
5-28
Cooling system design
2006-06-26
All case is base 2d mold design.
Mold Flow Report
1. Project Summary--------------------------------------------------------------------------2
2. Plastic material information ---------------------------------------------------------- 3
case1
case2
2006-06-26
Reported: Bill.Bin
2-28
Material Property
ABS Polylac PA-737 Manufacturer : Chi Mei Corporation
1. Melt Density : 2. Solid Density :
0.96055g/cu.cm 8. Melt Temperature Maximum 240 deg.C 1.0494g/cu.cm 9. Mold Temperature Minimum 40deg.C
Move gate
case2 is reviser runner system (move gate )
2006-06-26
Reported: Bill.Bin
8-28
cLeabharlann Baiduse2
Fill Time
case1
case2
The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time.
.The fill time is about 5.6 second in the model . No racetrack effect occur. Air trap appear on the last filled area. Do set enough vent over there.
Reported: Bill.Bin
6-28
Runner system design
case1
Ø12mm
Ø10~2.8mm
Ø8mm
Ø2.8~8mm
Ø10mm
Case1 is base 2d mold design ，
2006-06-26
Reported: Bill.Bin
7-28
Runner system design
2006-06-26
Reported: Bill.Bin
1-28
Mold Flow Report
Mold NO：Ｂ１０２７４ Prepared by: Bill.Bin Cavity number:1*2 Analysis purpose : improve warpage。 Analysis Project: Cool +Fill +Pack + Warp Case1 is the 3D design. Case2 is revise mold design and modified the process condition.
3. Ejection Temperature
90 deg.C
4. Recommended Mold
60 deg.C
5. Recommended Melt Temperature 220deg.C
6. Filler
unfilled
7. Melt Temperature Minimum 200deg.C
3 g/10min(5kg/200.C))
P-V-T
2006-06-26
Reported: Bill.Bin
Viscosity vs Shear rate
3-28
case1
Process setting
Analysis purpose: improve warpage Analysis Project: Cooling + flow + Warpage Process setting
10. Mold Temperature Maximum 80deg.C
11. Maximum Shear Rate 12. Maximum Shear Stress
50000 1/s 0. 5 Mpa
13. Thermal conductivity
0.19(k)w/m.c
14. Measured MFR
Mold Temperature:60/65℃ Melt Temperature: 220℃ Fill Time: automatic Cooling time:60S V/P switch-over: 99% of filled volume pack
case2
80%V/P 10S
80%X0.3+0X1.5+6X60%+12X100%S
2006-06-26
Reported: Bill.Bin
4-28
Part infomatiom
Thickness distribution
2006-06-26
Reported: Bill.Bin
5-28
Cooling system design
2006-06-26
All case is base 2d mold design.
Mold Flow Report
1. Project Summary--------------------------------------------------------------------------2
2. Plastic material information ---------------------------------------------------------- 3