si823x中文数据手册
Skyworks Si873x数据手册说明书
Si873x Data SheetLow Input Current LED Emulator, Logic Output IsolatorsThe Si873x isolators are pin-compatible, single-channel, drop-in replacements for pop-ular optocouplers with data rates up to 15 Mbps. These devices isolate high-speed digital signals and offer performance, reliability, and flexibility advantages not available with optocoupler solutions. The Si873x series is based on Skyworks' proprietary CMOS isolation technology for low-power and high-speed operation and are resistant to the wear-out effects found in optocouplers that degrade performance with increasing tem-perature, forward current, and device age. As a result, the Si873x series offer longer service life and dramatically higher reliability compared to optocouplers. Ordering op-tions include logic output with and without output enable options.Applications•Industrial automation systems •Motor controls and drives •Isolated switch mode power sup-plies •Isolated data acquisition•Test and measurement equipmentSafety Regulatory Approvals•UL 1577 recognized•Up to 2500 V RMS for 1 minute •CSA component notice 5 A appro-val •VDE certification conformity•VDE0884-10 (basic/reinforced insu-lation)•CQC certification approval•GB4943.1KEY FEATURES•High Speed: dc to 15 Mbps•2.5 to 5.5 V logic output•Pin-compatible, drop-in upgrades forpopular high-speed digital optocouplers•Performance and reliability advantages vs.optocouplers:•Resistant to temperature, age andforward current effects•10x lower FIT rate for longer service life•Lower power and forward input diodecurrent•1 channel diode emulator input•Propagation delay 30 ns•10 kV surge withstand capability•AEC-Q100 qualified•Wide operating temperature range: – 40 to+125 °C•RoHS-compliant packages: SOIC-8(Narrow body)OUTSi873x Data Sheet • Ordering Guide1. Ordering GuideTable 1.1. Si873x Ordering Guide1, 2, 3, 4Table of Contents1. Ordering Guide (2)2. Application Information (4)2.1 Theory of Operation (4)3. Functional Description (5)3.1 Device Behavior (5)3.2 Device Startup (5)3.3 Under Voltage Lockout (UVLO) (6)4. Applications (7)4.1 Input Circuit Design (7)4.2 Output Circuit Design and Power Supply Connections (8)5. Electrical Specifications (9)6. Pin Descriptions (SOIC-8) (16)7. Pin Descriptions (SOIC-8) with Output Enable (17)8. Package Outline: 8-Pin Narrow Body SOIC (18)9. Land Pattern: 8-Pin Narrow Body SOIC (20)10. Top Markings (21)10.1 Top Marking: 8-Pin Narrow Body SOIC (21)11. Revision History (22)2. Application Information2.1 Theory of OperationThe Si873x are pin-compatible, single-channel, drop-in replacements for popular optocouplers with data rates up to 15 Mbps. The operation of an Si873x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for the Si873x is shown in the figure below.A BFigure 2.1. Simplified Channel Diagram3. Functional Description3.1 Device BehaviorTruth tables for the Si873x are summarized in the table below.Table 3.1. Si873x Truth Table Summary3.2 Device StartupDuring startup-up, for the Si873x, Output V O is high until V DD rises above the UVLO+ threshold for a minimum time period of t START. Following this, the output is low when the current flowing from anode to cathode is > I F(ON). Device startup, normal operation, and shutdown behavior for the Si873x is shown in the figure below. Note that the figure below assumes that Enable is asserted and that the outputs are operating in their normal operating condition (inverting for the Si8736). See the table above for more details on the Enable function.I F VVIFigure 3.1. Si8736 Operating Behavior (I F > I F(MIN) when V F > V F(MIN))3.3 Under Voltage Lockout (UVLO)The UVLO circuit unconditionally drives V O to its default state when V DD is below the lockout threshold. Referring to the figure below,upon power up, the Si873x is maintained in UVLO until VDD rises above VDD UV+. During power down, the Si873x enters UVLO when VDD falls below the UVLO threshold plus hysteresis (i.e., VDD < VDD UV+ – VDD HYS ).O u t p u t V o l t a g e (V O )Supply Voltage (V DD - GND) (V)Figure 3.2. Si873x UVLO Response4. ApplicationsThe following sections detail the input and output circuits necessary for proper operation of the Si873x family.4.1 Input Circuit DesignOpto coupler manufacturers typically recommend the circuits shown in the figures below. These circuits are specifically designed to improve opto-coupler input common-mode rejection and increase noise immunity.Figure 4.1. Si873x Input CircuitFigure 4.2. High CMR Si873x Input CircuitThe optically-coupled circuit of Figure 4.1 Si873x Input Circuit on page 7 turns the LED on when the control input is high. However, internal capacitive coupling from the LED to the power and ground conductors can momentarily force the LED into its off state when the anode and cathode inputs are subjected to a high common-mode transient. The circuit shown in Figure 4.2 High CMR Si873x Input Circuit on page 7 addresses this issue by using a value of R1 sufficiently low to overdrive the LED, ensuring it remains on during an input common-mode transient. Q1 shorts the LED off in the low output state, again increasing common-mode transient immunity.Some opto coupler applications recommend reverse-biasing the LED when the control input is off to prevent coupled noise from energizing the LED. The Si873x input circuit requires less current and has twice the off-state noise margin compared to opto couplers. However, high CMR opto coupler designs that overdrive the LED (see Figure 4.2 High CMR Si873x Input Circuit on page 7) may require increasing the value of R1 to limit input current I F to its maximum rating when using the Si873x. In addition, there is no benefit in driving the Si873x input diode into reverse bias when in the off state. Consequently, opto coupler circuits using this technique should either leave the negative bias circuitry unpopulated or modify the circuitry (e.g., add a clamp diode or current limiting resistor) to ensure that the anode pin of the Si873x is no more than –0.3 V with respect to the cathode when reverse-biased.New designs should consider the input circuit configurations of Figure 4.3 Si873x Other Input Circuit Configurations on page 8, which are more efficient than those of the figures above. As shown, S1 and S2 represent any suitable switch, such as a BJT or MOSFET, analog transmission gate, processor I/O, etc. Also, note that the Si873x input can be driven from the I/O port of any MCU or FPGA capable of sourcing a minimum of 6 mA (see Figure 4.3 Si873x Other Input Circuit Configurations on page 8C). Additionally, note that the Si873x propagation delay and output drive do not significantly change for values of I F between I F(MIN) and I F(MAX).InputFigure 4.3. Si873x Other Input Circuit Configurations4.2 Output Circuit Design and Power Supply ConnectionsGND can be biased at, above, or below ground as long as the voltage on V DD with respect to GND is a maximum of 5.5 V. V DD decoupling capacitors should be placed as close to the package pins as possible. The optimum values for these capacitors depend on load current and the distance between the chip and its power source. It is recommended that 0.1 and 1 µF bypass capacitors be used to reduce high-frequency noise and maximize performance. Opto replacement applications should limit their supply voltages to 5.5 V or less.5. Electrical SpecificationsTable 5.1. Recommended Operating ConditionsTable 5.2. Electrical CharacteristicsV DD =5 V; GND=0 V; T A =–40 to +125 °C; typical specs at 25 °C1500 ΩFigure 5.1. Diode Emulator Model and I-V CurveFigure 5.2. Common Mode Transient Immunity Characterization CircuitTable 5.3. Regulatory InformationCSA (Pending)The Si873x is certified under CSA Component Acceptance Notice 5A. For more details, see File 232873.VDEThe Si873x is certified according to VDE0884. For more details, see File 5006301-4880-0001.VDE0884-10: Up to 630 V peak for reinforced insulation working voltage.UL (Pending)The Si873x is certified under UL1577 component recognition program. For more details, see File E257455.Rated up to 2500 V RMS isolation voltage for basic protection.CQC (Pending)The Si873x is certified under GB4943.1-2011. For more details, see certificate “pending” yet TBD.Rated up to 130 V RMS reinforced insulation working voltage; up to 600 V RMS basic insulation working voltage. Note: Regulatory Certifications apply to 2.5 kV RMS rated devices which are production tested to 3.0 kV RMS for 1 sec.For more information, see 1. Ordering Guide.Table 5.4. Insulation and Safety-Related SpecificationsTable 5.5. IEC 60664-1 (VDE 0884) RatingsTable 5.6. IEC 60747-5-2 (VDE 0884-10) Insulation CharacteristicsTable 5.7. IEC Safety Limiting ValuesTable 5.8. Thermal Characteristics40060080010001200w e r ‐P s ,I n p u t C u r r e n t ‐I sPs (mW)Is (mA)0200020406080100120140O u t p u t P o Ts ‐Case Temperature (°C)Figure 5.3. (SOIC-8) Thermal Derating Curve, Dependence of Safety Limiting Valueswith Case Temperature per VDE0884-10Table 5.9. Absolute Maximum Ratings6. Pin Descriptions (SOIC-8)NCANODE CATHODENCVDDNCVOSOIC-8Industry Standard PinoutGND Figure 6.1. Pin ConfigurationTable 6.1. Pin Descriptions (SOIC-8, DIP8)7. Pin Descriptions (SOIC-8) with Output EnableNCANODE CATHODENC VDD EN VOSOIC-8 with Output EnableIndustry Standard PinoutGNDFigure 7.1. Pin ConfigurationTable 7.1. Pin Descriptions (SOIC-8, DIP8) with Output EnableSi873x Data Sheet • Pin Descriptions (SOIC-8) with Output Enable8. Package Outline: 8-Pin Narrow Body SOICFigure 8.1 8-Pin Narrow Body SOIC Package on page 18 illustrates the package details for the Si873x in an 8-pin narrow-body SOIC package. Table 8.1 8-Pin Narrow Body SOIC Package Diagram Dimensions on page 18 lists the values for the dimensions shown in the illustration.Figure 8.1. 8-Pin Narrow Body SOIC PackageTable 8.1. 8-Pin Narrow Body SOIC Package Diagram Dimensions9. Land Pattern: 8-Pin Narrow Body SOICThe figure below illustrates the recommended land pattern details for the Si873x in an 8-pin narrow-body SOIC. The table below lists the values for the dimensions shown in the illustration.Figure 9.1. 8-Pin Narrow Body SOIC Land PatternTable 9.1. 8-Pin Narrow Body SOIC Land Pattern Dimensions10. Top Markings10.1 Top Marking: 8-Pin Narrow Body SOICThe figure below illustrates the top markings for the Si873x in an SOIC8 package. The table explains the top marks shown in theillustration.Table 10.1. SOIC8 Top Marking ExplanationLine 1 Marking:Customer Part Number Si87 = Base name of product seriesW = Isolator product series (1 or 2)X = Output configuration5/9 = no enable6 = enable, output high when active7/8 = enable, output Hi-z when active 0 = enable, output low when activeS = Performance Grade:A = 15 Mbps, 20 kV/μs minimum CMTIB = 15 Mbps, 35 kV/μs minimum CMTI V = Insulation ratingC = 3.75 kVLine 2 Marking:RTTTTT = Mfg Code Manufacturing Code from the Assembly Purchase Order form.“R” indicates revision.Line 3 Marking:Circle = 43 mils DiameterLeft-Justified“e4” Pb-Free SymbolYY = YearWW = Work WeekAssigned by the Assembly House. Corresponds to the yearand work week of the mold date.11. Revision HistoryRevision 1.0March, 2018•Initial revision.Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters.Skyworks, the Skyworks symbol, Sky5®, SkyOne ®, SkyBlue™, Skyworks Green™, Clockbuilder ®, DSPLL ®, ISOmodem ®, ProSLIC ®, and SiPHY ® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.PortfolioQuality/qualitySupport & Resources/support。
SST823资料
Source
Gate
Oxide
Drain
n+ p-
p
n+
Channel
Body
Figure 2. Cross Sectional View of an Idealized DMOS Structure
B
(a) Off State
B
(b) On State
Figure 3. Equivalent Circuits
recommended for the output. Since CGD < CGS this causes less charge injection noise on the load.
4. Other: -Digital switching -PCM distribution networks -UHF Amplifiers -VHF Modulators and Double-Balanced Mixers -High-speed inverters/drivers -Switched capacitor filters -Choppers
2. Audio routing (glitch- and noise-free): -High-speed switching -Audio switching systems using digitized remote control
3. Data acquisition (highspeed, low charge injection, low leakage): -High-speed sample-and-holds -Audio and communication A/D converters
G
S8232(中文版)
Rev.6.0_00
■ 特点
(1) 内置高精度电压检测电路 ▪ 过充电检测电压 3.85 V ±25 mV ~ 4.60 V ±25 mV 可以5 mV为单位进阶 ▪ 过充电解除电压 3.60 V ±50 mV ~ 4.60 V ±50 mV 可以5 mV为单位进阶 (过充电解除电压与过充电检测电压的差可在0 V ~ 0.3 V的范围内选择) ▪ 过放电检测电压 1.70 V ±80 mV ~ 2.60 V ±80 mV 可以50 mV为单位进阶 ▪ 过放电解除电压 1.70 V ±100 mV ~ 3.80 V ±100 mV 可以50 mV为单位进阶 (过放电解除电压与过放电检测电压的差可在0 V ~ 1.2 V的范围内选择) ▪ 过电流检测电压1 0.07 V ±20 mV ~ 0.30 V ±20 mV 可以5 mV为单位进阶 (2) 耐高圧元件： 绝对最大额定值 18 V (3) 宽工作电压范围： 2.0 V ~ 16 V (4) 可通过1个外接电容来设置过充电检测、过放电检测、过电流检测的延迟时间 (时间比各自为100:10:1) (5) 2段的过电流检测 (负载短路时的保护) (6) 内置过充电辅助检测电压电路(对过充电检测电压的故障保险) (7) 具有向0 V电池的充电功能 (也可以利用选项设置为禁止向0 V电池的充电) (8) 低消耗电流 ▪ 工作时 7.5 µA 典型值 14.2 µA 最大值 (−40°C~+85°C) ▪ 休眠时 0.2 nA 典型值 0.1 µA 最大值 (−40°C~+85°C) (9) 无铅，Sn 100%，无卤素*1 *1. 详情请参阅“ 产品型号的构成”。
4
精工电子有限公司
Rev.6.0_00
2节电池串联用电池保护IC S-8232系列
斯帕克斯 Skyworks Si82xx 隔离驱动器评估板用户指南说明书
UG506:Si82xx-EVBSi82XX E VALUATION B OARD U SER’S G UIDE1. IntroductionThe Si823x isolated driver family combines two independent isolated drivers into a single package. The Si8230/1/3/4 are high-side/low-side drivers, and the Si8232/5/6 are dual drivers. Versions with peak output currents of 0.5A (Si8230/1/2) and 4.0A (Si8233/4/5/6) are available. The Si8220/21 is a high-performance functional upgrade for opto-coupled drivers, such as the HCPL-3120 and the HPCL-0302 providing 2.5A of peak output current. These ISOdrivers utilize Skyworks' proprietary silicon isolation technology, which provides a choice of 2.5, 3.75, or 5.0kVrms withstand voltages. All drivers operate with a maximum output supply voltage of 24V. High integration, low propagation delay, small installed size, flexibility, and cost-effectiveness make the family ideal for a wide range of isolated MOSFET/IGBT gate drive applications.The Si82xx evaluation board allows designers to evaluate Skyworks’ family of ISOdrivers. The boards come populated with 5kVrms versions of the Si8220, Si8233, Si8234, and Si8235. The board includes land pads for common surface mount and through-hole packaged FET/IGBT power transistors. The board also includes patch area for additional prototyping that can be used to accommodate any load configuration a designer might need to evaluate. For more ISOdriver information, visit Skyworks web site at /products/isolation. The product data sheet and numerous application notes can be referenced to help facilitate designs.UG506:Si82xx-EVB2SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•2. Kit ContentsThe Si82xx Evaluation Kit contains the following items:⏹ Si82xx-based evaluation board (Si82xx-EVB) shown in Figure1.⏹ Si8220, Opto-input,2.5A, 5kV ISOdriver ⏹ Si8233, 2-input, 4A, 5kV, High-Side/Low-Side ISOdriver ⏹ Si8234, PWM-input, 4A, 5kV High-Side/Low-Side ISOdriver ⏹ Si8235, 2-input, 4A, 5kV Dual ISOdriverFigure 1.Si82xx Evaluation Board OverviewUG506:Si82xx-EVB 3. Si82xx ISOdriver Board OverviewThe Si82xx evaluation board is populated with the following ISOdrivers:⏹ Si8220 in wide-body SOIC-16 package, opto-input, 2.5A, 5kV ISOdriver⏹ Si8233 in wide-body SOIC-16 package, 2-input, 4A, 5kV High-Side/Low-Side ISOdriver⏹ Si8234 in wide-body SOIC-16 package, PWM-input, 4A, 5kV High-Side/Low-Side ISOdriver⏹ Si8235 in wide-body SOIC-16 package, 2-input, 4A, 5kV Dual ISOdriver⏹ High-side and low-side land pads for surface mount packaged FET/IGBT power transistors (not populated)⏹ High-side and low-side land pads for through-hole packaged FET/IGBT power transistors (not populated)⏹ Patch areaThe Si82xx board is four separate evaluation boards in one, with each section featuring a different ISOdriver (Si8220, Si8233, Si8234, or Si8235). Each section is isolated from the other sections and requires its own power supplies to power the given section's ISOdriver. Each section's ISOdriver is designed to be powered separately with input supplies for VDDI (5.5V, 500mA) and output supplies for VDDA, VDDB, or VDD up to 24V. The user is expected to connect their desired drive-trane topology and load to the outputs of the appropriate ISOdriver and the patch area. Figure2 shows a silkscreen overview of the board.Please note the voltage rating for the prepopulated components in the Si82xx BOM section of this document before applying power to the ISOdriver and customer specific driver-trane. Applying a voltage to a component that is higher than its rating can cause permanent device damage. If the install components do not meet the user's requirements, these components need to be replaced before proceeding. Moreover, if a user wants to evaluate an ISOdriver in a wide-body package other than the ones populated, this can be accomplished by removing the footprint-compatible device installed on the evaluation board and replacing it with the desired footprint-compatible ISOdriver.SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•3UG506:Si82xx-EVB4SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Figure 2.Si82xx Evaluation Board SilkscreenUG506:Si82xx-EVBSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 53.1. Si82xx ISOdriver Board TestFigure 3 illustrates the Si8234 with VDDI powered from 5V and VDDA and VDDB powered from 15V. A 10kHz signal is applied to the Si8234's PWM input. As shown, the Si8234 transmits a 10kHz signal to VOA and VOB (Channel 3 illustrates VOA output, and Channel 2 illustrates VOB output). Note that VOA and VOB are 180° out of phase, as would be expected of a PWM driver. In this setup, no drive-trane was connected to the outputs (VOA and VOB) of the Si8234. Nevertheless, the potentiometer, R35, can be adjusted to dynamically change the dead-time of the Si8234 if desired. Duplicating this setup is an excellent test to become familiar with the evaluation board. To repeat this test, perform the following steps:1.Install a shunting jumper to J12 (Position 1, 2).2.Install a shunting jumper to J14.3.Install a shunting jumper to J11.4.Install a shunting jumper to J13.5.Connect a 5Vp-p square wave to P7.6.Connect a 5V (100mA) supply to P9.7.Connect a 15V (100mA) supply to P14.8.Connect a 15V (100mA) supply to P15.9.Connect a scope probe to TP9 to view VOA.10.Connect a scope probe to TP11 to view VOB.Figure 3.Si8234 PWM OutputsUG506:Si82xx-EVB6SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•4. Si82xx Evaluation Board SchematicsFigure 4.Si82xx Evaluation Board Schematic (1 of 4)UG506:Si82xx-EVBSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 7Figure 5.Si82xx Evaluation Board Schematic (2 of 4)UG506:Si82xx-EVB8SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Figure 6.Si82xx Evaluation Board Schematic (3 of 4)UG506:Si82xx-EVBSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 9Figure 7.Si82xx Evaluation Board Schematic (4 of 4)UG506:Si82xx-EVB10SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 5. Si82xx Evaluation Board LayoutFigure 8.Si82xx Top LayerFigure9.Si82xx Bottom Layer6. Bill of MaterialsTable 1. Si82xx-EVB Bill of MaterialsItem Qty Ref Part Number Mfr Description110C1,C4–5,C8–9, C12,C22, C24,C26, C28311-1140-2-ND Digikey Cap, 0.1µF, X7R, Ceramic, 50V, 0805,±10%, or eq, RoHS22C7, C11PCC2249CT-ND Digikey Cap 1.0µF, X5R, Ceramic, 0805, 16V,±10%, or eq, RoHS31C3 PCC1893CT-ND Digikey Cap 1.0µF, X7R, Ceramic, 1206, 25V,±10%, or eq, RoHS43C2, C6, C20 490-1809-1-ND Digikey Cap 4.7µF, X7R, Ceramic, 1206, 25V,±10%, or eq, RoHS54C23, C25,C27, C29490-1809-1-ND Digikey Cap 4.7µF, X7R, Ceramic, 1206, 25V,±10%, or eq, RoHS, no-pop67C10,C14–19CAP 0805Digikey Cap, NO POP, 0805, or eq, RoHS77Q3–4,Q7–8,Q11–12,Q15D2-PAK-NO-POP D2-pak-no-pop D2-PAK-NO-POP or eq, RoHS84D1–3, D7US1K-FDICT-ND Digikey Diode, SW ULT FAST, 1A, 800V, SMA,RoHS925J2–7, J9–11, J13–17,J19–25,J56–57,J74–75S1011E-02-ND Digikey Stake Header, 1X2, 0.1"CTR, Gold,or eq, RoHS10112J26–55,J58–73,J76–78,J80–139,J168–169,J171NO-POP None No-pop, RoHS114J1, J8, J12,J18S2011E-02-ND Digikey Stake Header, 2X2, 0.1"CTR, Gold, OREq, RoHS122R23, R3592W-104LF-ND Digikey Pot, 100kΩ, Res, 3/8" SQ CERM SL,MT, TOP ADJ, ±10%, OR EQ, RoHS 131R42P100ACT-ND Digikey Res, 100Ω, SMT, 0805, 1/8W, ±5%, OREQ, RoHS143R1, R12, R24P10.0KCCT-ND Digikey Res, 10.0k Ω, SMT, 0805, 1/8W,±1%, or eq, RoHS 151R39311-237CRCT-ND Digikey Res 237Ω, SMT, 0805, 1/8W,±1%, or eq, RoHS 161R41311-330ARCT-ND Digikey Res, 330Ω, SMT, 0805, 1/8W,±5%, or eq, RoHS 175R9, R11, R20, R22, R32RHM470ACT-NDDigikeyRes, 470Ω, SMT, 0805, 1/8W,±5%, or eq, RoHS 186R8, R10, R19, R21, R31, R40P49.9CCT-ND DigikeyRes, 49.9Ω, SMT, 0805, 1/8W,±1%, or eq 1921R2–7, R13–18, R25–30, R36–38NO POP DigikeyRes, no pop, SMT, 0805, or eq, RoHS201U4Si8220BD-D-IS Skyworks IC, 2.5A, 5kV, ISOdrivers with OptoInput, RoHS 211U2Si8233BD-D-IS Skyworks 4.0A, 5kV, ISOdrivers, RoHS 221U3Si8234BD-D-IS Skyworks IC, 4.0A, 5kV, ISOdrivers, RoHS 231U1Si8235BD-D-IS Skyworks IC, 4.0A, 5kV, ISOdrivers, RoHS 244RF1–4SJ5744-0-ND Digikey Bumpon protective, bumper, Silicone, oreq, RoHS 2514TP1–11, TP13, TP15–16No PopDigikeyTest point, PC compact, no pop, or eq,RoHS267Q1–2, Q5–6, Q9–10, Q13TO220-NO-POP To220-no-popTO220-no-pop, or eq, RoHS2713P2–3, P5–15277-1236-ND Digikey Conn Term Block, 5.08mm ctrs, PCB,2 POS, RoHS 282P1, P4 277-1249-ND Digikey Conn Term Block, 5.08mm ctrs, PCB,4 POS, RoHS291Q14ZXM61N02FCT-NDDigikeyMosfet, N-Chan, 20V, 1.7A,SOT23-3, RoHSTable 1. Si82xx-EVB Bill of Materials (Continued)Item Qty Ref Part Number Mfr Description7. Ordering GuideTable 2. Si82xx Evaluation Board Ordering Guide Ordering Part Number (OPN)DescriptionSi82xx-KIT Si82xx CMOS ISOdriver evaluation board kitN OTES:Replace this page in the pdf version of this datasheet with the Skyworks copyright page(skyworks_lastpage_general.pdf).。
S-8231NCFN-CDC-T2资料
(The Overcharge release voltage can be selected within the range where the difference from
Overcharge detection voltage is 0 to 0.3 V) Overdischarge detection voltage Overdischarge release voltage 1.70 V ± 80 mV to 2.50 V ± 80 mV 50 mV- step 1.70 V ± 100 mV to 3.50 V ± 100 mV 50 mV - step (The overdischarge release voltage can be selected within the range where a difference from overdischarge detection voltage is 0 to 1.0V) Overcurrent detection voltage 1
(2) (3) (4) (5)
0.06 V ± 20 mV to 0.30 V ± 20 mV 5 mV-step
High input-voltage device (absolute maximum rating: 18 V) Wide operating voltage range: Wide operating range: 1.5 V to 16 V -40 to +85 °C
4.35V±25mV 4.10±50mV 2.30V±80mV 3.00V±100mV 0.250V±20mV 4.28V±25mV 4.05±50mV 2.30V±80mV 2.70V±100mV 0.130V±20mV 4.28V±25mV 4.05±50mV 2.30V±80mV 2.70V±100mV 0.130V±20mV
MAXIM MAX823 MAX824 MAX825 数据手册
________________General DescriptionThe MAX823/MAX824/MAX825* microprocessor (µP)supervisory circuits combine reset output, watchdog,and manual reset input functions in 5-pin SOT23 and SC70 packages. They significantly improve system relia-bility and accuracy compared to separate ICs or discrete components. The MAX823/MAX824/MAX825 are specifi-cally designed to ignore fast transients on V CC .Seven preprogrammed reset threshold voltages are available (see Reset Threshold Table ). All three devices have an active-low reset output, which is guaranteed to be in the correct state for V CC down to 1V. The MAX823also offers a watchdog input and manual reset input.The MAX824 offers a watchdog input and a comple-mentary active-high reset. The MAX825 offers a manual reset input and a complementary active-high reset. The S elector Guide explains the functions offered in this series of parts.________________________ApplicationsComputers and ControllersEmbedded Controllers Intelligent Instruments Automotive Systems Critical µP MonitoringPortable/Battery-Powered EquipmentFeatureso Precision Monitoring of +2.5V, +3V, +3.3V, and +5V Power Supplieso Operating Current:6µA (MAX823L/M) (SC70)2µA (MAX825T/S/R/Z/Y) (SC70)o Fully Specified Over Temperature o 140ms min Power-On Reseto Guaranteed RESET Valid to V CC = 1V o Power-Supply Transient Immunity o Watchdog Timer with 1.6s Timeout (MAX823/MAX824)o Manual Reset Input (MAX823/MAX825)o No External ComponentsMAX823/MAX824/MAX8255-Pin Microprocessor Supervisory Circuits WithWatchdog Timer and Manual Reset________________________________________________________________Maxim Integrated Products 1______________________Selector Guide19-0487; Rev 4; 7/01†Insert the desired suffix letter (from the Reset Threshold table) into the blank to complete the part number. All devices are available in tape-and-reel only. There is a 2500 piece minimum order increment.Typical Operating Circuit appears at end of data sheet.Marking Information appears at end of data sheet.Ordering InformationOrdering Information continued at end of data sheet.Reset Threshold TablePin Configurations*Patents PendingFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 823/M A X 824/M A X 8255-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual Reset 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +4.75V to +5.5V for MAX82_L, V CC = +4.5V to +5.5V for MAX82_M, V CC = +3.15V to +3.6V for MAX82_T, V CC = +3V to +3.6V for MAX82_S, V CC = +2.7V to +3.6V for MAX82_R, V CC = +2.38V to +2.75V for MAX82_Z, V CC = +2.25V to +2.75V for MAX82_Y, T A = T MIN to T MAX , T A = -40°C to +85°C (SC70), T A = -40°C to +125°C (SOT23), unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC ........................................................................-0.3V to +6.0V All Other Pins..............................................-0.3V to (V CC + 0.3V)Input Current, All Pins Except RESET and RESET ..............20mA Output Current, RESET, RESET ..........................................20mA Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C)...............247mW5-Pin SOT23 (derate 7.1mW/°C above +70°C).............571mW Operating Temperature RangeMAX82_EXK......................................................-40°C to +85°C MAX82_EUK...................................................-40°C to +125°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX823/MAX824/MAX8255-Pin Microprocessor Supervisory Circuits WithWatchdog Timer and Manual Reset_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +4.75V to +5.5V for MAX82_L, V CC = +4.5V to +5.5V for MAX82_M, V CC = +3.15V to +3.6V for MAX82_T, V CC = +3V to +3.6V for MAX82_S, V CC = +2.7V to +3.6V for MAX82_R, V CC = +2.38V to +2.75V for MAX82_Z, V CC = +2.25V to +2.75V for MAX82_Y, T = T to T , T = -40°C to +85°C (SC70), T = -40°C to +125°C (SOT23), unless otherwise noted. Typical valuesM A X 823/M A X 824/M A X 8255-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual Reset 4_______________________________________________________________________________________Note 2:The RESET short-circuit current is the maximum pullup current when RESET is driven low by a µP bidirectional reset pin.Note 3:WDI is internally serviced within the watchdog period if WDI is left unconnected.Note 4:The WDI input current is specified as the average input current when the WDI input is driven high or low. The WDI input is designed to drive a three-stated output device with a 10µA maximum leakage current and a maximum capacitive load of 200pF. This output device must be able to source and sink at least 200µA when active.ELECTRICAL CHARACTERISTICS (continued)(V CC = +4.75V to +5.5V for MAX82_L, V CC = +4.5V to +5.5V for MAX82_M, V CC = +3.15V to +3.6V for MAX82_T, V CC = +3V to +3.6V for MAX82_S, V CC = +2.7V to +3.6V for MAX82_R, V CC = +2.38V to +2.75V for MAX82_Z, V CC = +2.25V to +2.75V for MAX82_Y, T A = T MIN to T MAX , T A = -40°C to +85°C (SC70), T A = -40°C to +125°C (SOT23), unless otherwise noted. Typical values are at T A = +25°C.) (Note 1)MAX823/MAX824/MAX8255-Pin Microprocessor Supervisory Circuits WithWatchdog Timer and Manual Reset_______________________________________________________________________________________5__________________________________________Typical Operating CharacteristicsMAX823_, V CC = +5V, T A = +25°C, unless otherwise noted.)132654879-402040-206080100120TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )V CC SUPPLY CURRENT vs. TEMPERATURE250150-40-2040100RESET TIMEOUT PERIOD vs. TEMPERATURE170160180230240M A X 823/4/5 t o c 02TEMPERATURE (°C)R E S E T T I M E O U T P E R I O D (m s )20806021022019020030-40-2040100RESET COMPARATOR PROPAGATION DELAYvs. TEMPERATURE525TEMPERATURE (°C)P R O P A G A T I O N D E L A Y (µs )02080602010152.01.0-40-2040100WATCHDOG TIMEOUT PERIODvs. TEMPERATURE1.21.11.31.81.9M A X 823/4/5 t o c 04TEMPERATURE (°C)W A T C H D O G T I M E O U T P E R I O D (s )2080601.61.71.41.5 1.060.940.960.981.001.021.04-40-2040100NORMALIZED RESET THRESHOLD VOLTAGE vs. TEMPERATUREM A X 823/4/5 t o c 05TEMPERATURE (°C)N O R M A L I Z E D R E S E T T H R E S H O L D (V )0208060105201530253545405040608020100120140180160200RESET THRESHOLD OVERDRIVE (mV), V RST - V CCT R A N S I E N T D U R A T I O N (µs )MAXIMUM V CC TRANSIENT DURATION vs. RESET THRESHOLD OVERDRIVEM A X 823/M A X 824/M A X 8255-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual Reset 6_______________________________________________________________________________________Pin DescriptionFigure 1. Functional DiagramMAX823/MAX824/MAX8255-Pin Microprocessor Supervisory Circuits WithWatchdog Timer and Manual Reset_______________________________________________________________________________________7_______________Detailed DescriptionRESET OutputA microprocessor ’s (µP ’s) reset input starts the µP in a known state. The MAX823/MAX824/MAX825 µP super-visory circuits assert a reset to prevent code-execution errors during power-up, power-down, and brownout conditions. RESET is guaranteed to be a logic low for V CC down to 1V. Once V CC exceeds the reset thresh-old, an internal timer keeps RESET low for the specified reset timeout period (t RP ); after this interval, RESET returns high (Figure 2).If a brownout condition occurs (V CC dips below the reset threshold), RESET goes low. Each time RESET is asserted it stays low for the reset timeout period. Any time V CC goes below the reset threshold the internal timer restarts. RESET both sources and sinks current.RESET on the MAX824/MAX825 is the inverse of RESET .Manual Reset Input (MAX823/MAX825)Many µP-based products require manual reset capabili-ty, allowing the operator, a test technician, or external logic circuitry to initiate a reset. On the MAX823/MAX825, a logic low on MR asserts reset. Reset remains asserted while MR is low, and for t RP (200ms nominal)after it returns high. MR has an internal 52k Ωpullup resistor, so it can be left open if not used. This input can be driven with CMOS logic levels or with open-drain/collector outputs. Connect a normally open momentary switch from MR to GND to create a manual-reset func-tion; external debounce circuitry is not required. If MR is driven from long cables or the device is used in a noisy environment, connect a 0.1µF capacitor from MR to GND to provide additional noise immunity.Watchdog Input (MAX823/MAX824)In the MAX823/MAX824, the watchdog circuit monitors the µP ’s activity. If the µP does not toggle the watchdog input (WDI) within t WD (1.6s), reset asserts. The internal 1.6s timer is cleared by either a reset pulse or by tog-gling WDI, which detects pulses as short as 50ns.While reset is asserted, the timer remains cleared and does not count. As soon as reset is released, the timer starts counting (Figure 3).Disable the watchdog function by leaving WDI uncon-nected or by three-stating the driver connected to WDI.The watchdog input is internally driven low during the first 7/8 of the watchdog timeout period and high for the last 1/8 of the watchdog timeout period. When WDI is left unconnected, this internal driver clears the 1.6s timer every 1.4s. When WDI is three-stated or uncon-nected, the maximum allowable leakage current is 10µA and the maximum allowable load capacitance is 200pF.Applications InformationWatchdog Input CurrentThe MAX823/MAX824 WDI inputs are internally driven through a buffer and series resistor from the watchdog counter (Figure 1). When WDI is left unconnected, the watchdog timer is serviced within the watchdog timeout period by a low-high-low pulse from the counter chain.For minimum watchdog input current (minimum overall power consumption), leave WDI low for the majority of the watchdog timeout period, pulsing it low-high-low once within the first 7/8 of the watchdog timeout period to reset the watchdog timer. If WDI is externally driven high for the majority of the timeout period, up to 160µA can flow into WDI.Figure 2. Reset Timing Diagram Figure 3. MAX823/MAX824 Watchdog Timing RelationshipM A X 823/M A X 824/M A X 8255-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual Reset 8_______________________________________________________________________________________Interfacing to µPs with Bidirectional Reset PinsThe RESET output maximum pullup current is 800µA for L/M versions (400µA for T/S/R/Z/Y versions). This allows µPs with bidirectional resets, such as the 68H C11, to force RESET low when the MAX823/MAX824/MAX825are pulling RESET high (Figure 4).Negative-Going V CC TransientsThese supervisors are relatively immune to short-duration, negative-going V CC transients (glitches), which usually do not require the entire system to shut down.Resets are issued to the µP during power-up, power-down, and brownout conditions.The Typical Operating Characteristics show a graph of the MAX823_’s Maximum V CC Transient Duration vs.Reset Threshold Overdrive, for which reset pulses are not generated. The graph was produced using nega-tive-going V CC pulses, starting at 5V and ending below the reset threshold by the magnitude indicated (reset threshold overdrive). The graph shows the maximum pulse width that a negative-going V CC transient can typically have without triggering a reset pulse. As the amplitude of the transient increases (i.e., goes farther below the reset threshold), the maximum allowable pulse width decreases.An optional 0.1µF bypass capacitor mounted close to V CC provides additional transient immunity.Watchdog Software Considerations(MAX823/MAX824)One way to help the watchdog timer monitor software execution more closely is to set and reset the watchdog input at different points in the program, rather than pulsing the watchdog input high-low-high or low-high-low. This technique avoids a stuck loop, in which the watchdog timer would continue to be reset inside the loop, keeping the watchdog from timing out.Figure 5 shows an example of a flow diagram where the I/O driving the watchdog input is set high at the begin-ning of the program, set low at the beginning of every subroutine or loop, then set high again when the pro-gram returns to the beginning. If the program should hang in any subroutine, the problem would quickly be corrected, since the I/O is continually set low and the watchdog timer is allowed to time out, causing a reset or interrupt to be issued. As described in the Watchdog Input Current section, this scheme results in higher time average WDI input current than does leaving WDI low for the majority of the timeout period and periodically pulsing it low-high-low.Figure 4. Interfacing to µPs with Bidirectional Resets Figure 5. Watchdog Flow DiagramMAX823/MAX824/MAX8255-Pin Microprocessor Supervisory Circuits WithWatchdog Timer and Manual Reset9Typical Operating Circuit____________________Chip InformationTRANSISTOR COUNT: 607PROCESS TECHNOLOGY: BiCMOSOrdering Information (continued)†Insert the desired suffix letter (from the Reset Threshold table) intothe blank to complete the part number. All devices are available in tape-and-reel only. There is a 2,500 piece minimum order increment.Marking InformationM A X 823/M A X 824/M A X 8255-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual ResetMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.10__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©2001 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information。
Si86xx数字隔离器数据手册说明书
Si86xx Data Sheet 1 Mbps, 2.5 kV RMS Digital IsolatorsSilicon Lab's family of ultra-low-power digital isolators are CMOS devices offering sub-stantial data rate, propagation delay, power, size, reliability, and external BOM advan-tages over legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges and throughout device service life for ease of design and highly uniform performance. All device versions have Schmitt trigger inputs for high noise immunity and only require VDD bypass capacitors.All products support Data rates up to 1 Mbps and Enable inputs which provide a single point control for enabling and disabling output drive. All products are safety certified by UL, CSA, VDE, and CQC and support withstand ratings up to 2.5 kV RMS.Automotive Grade is available for certain part numbers. These products are built using automotive-specific flows at all steps in the manufacturing process to ensure the robust-ness and low defectivity required for automotive applications.KEY FEATURES•High-speed operation•DC to 1 Mbps•No start-up initialization required•Wide Operating Supply Voltage•2.5 to 5.5 V•Up to 2500 V RMS isolation•60-year life at rated working voltage •High electromagnetic immunity•Ultra low power (typical)•5 V Operation: 1.6 mA per channel at 1Mbps•2.5 V Operation: 1.5 mA per channel at1 Mbps•Tri-state outputs with ENABLE •Schmitt trigger inputs•Transient Immunity 50 kV/µs•AEC-Q100 qualification•Wide temperature range•–40 to 125 °C•RoHS-compliant packages•SOIC-16 wide body•SOIC-16 narrow body•SOIC-8 narrow body•Automotive-grade OPNs available•AIAG compliant PPAP documentationsupport•IMDS and CAMDS listing supportIndustrial Applications•Industrial automation systems •Medical electronics•Isolated switch mode supplies •Isolated ADC, DAC•Motor control•Power inverters •Communication systemsSafety Regulatory Approvals•UL 1577 recognized•Up to 5000 V RMS for 1 minute •CSA component notice 5A approval •IEC 60950-1, 61010-1•VDE certification conformity•IEC 60747-5-2 (VDE0884 Part 2)•CQC certification approval•GB4943.1Automotive Applications•On-board chargers •Battery management systems •Charging stations •Traction inverters•Hybrid Electric Vehicles •Battery Electric Vehicles1. Ordering GuideTable 1.1. Ordering Guide for Valid OPNs1,2Automotive Grade OPNsAutomotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea-ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli-ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro-duction steps.Table 1.2. Ordering Guide for Automotive Grade OPNs1, 2, 4, 5Table of Contents1. Ordering Guide (2)2. Functional Description (5)2.1 Theory of Operation (5)3. Device Operation (6)3.1 Device Startup (8)3.2 Undervoltage Lockout (8)3.3 Layout Recommendations (8)3.3.1 Supply Bypass (8)3.3.2 Output Pin Termination (8)4. Electrical Specifications (9)5. Pin Descriptions (30)5.1 Pin Descriptions (Si861x/2x Narrow Body SOIC-8) (30)5.2 Pin Descriptions (Si863x) (31)5.3 Pin Descriptions (Si864x) (32)5.4 Pin Descriptions (Si8650/51/52) (33)5.5 Pin Descriptions (Si866x) (34)6. Package Outlines (35)6.1 Package Outline (16-Pin Wide Body SOIC) (35)6.2 Package Outline (16-Pin Narrow Body SOIC) (37)6.3 Package Outline (8-Pin Narrow Body SOIC) (39)7. Land Patterns (40)7.1 Land Pattern (16-Pin Wide-Body SOIC) (40)7.2 Land Pattern (16-Pin Narrow Body SOIC) (41)7.3 Land Pattern (8-Pin Narrow Body SOIC) (42)8. Top Markings (43)8.1 Top Marking (16-Pin Wide Body SOIC) (43)8.2 Top Marking (16-Pin Narrow Body SOIC) (44)8.3 Top Marking (8-Pin Narrow Body SOIC) (45)9. Revision History (46)Functional Description 2. Functional Description2.1 Theory of OperationThe operation of an Si86xx channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si86xx channel is shown in the figure below.Figure 2.1. Simplified Channel DiagramA channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the result to outputB via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and better immunity to magnetic fields. See the figure below for more details.Input SignalModulation SignalOutput SignalFigure 2.2. Modulation Scheme3. Device OperationDevice behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on page 8, where UVLO+ and UVLO- are the positive-going and negative-going thresholds respectively. Refer to the table below to determine outputs when power supply (VDD) is not present. Additionally, refer to Table 3.2 Enable Input Truth1on page 7for logic conditions when enable pins are used.Table 3.1. Si86xx Logic OperationTable 3.2. Enable Input Truth13.1 Device StartupOutputs are held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow the states of inputs.3.2 Undervoltage LockoutUndervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or exit UVLO independently. For example, Side A unconditionally enters UVLO when V DD1 falls below V DD1(UVLO–) and exits UVLO when V DD1 rises above V DD1(UVLO+). Side B operates the same as Side A with respect to its V DD2 supply.VVFigure 3.1. Device Behavior during Normal Operation3.3 Layout RecommendationsTo ensure safety in the end user application, high voltage circuits (i.e., circuits with >30 V AC) must be physically separated from the safety extra-low voltage circuits (SELV is a circuit with <30 V AC) by a certain distance (creepage/clearance). If a component, such as a digital isolator, straddles this isolation barrier, it must meet those creepage/clearance requirements and also provide a sufficiently large high-voltage breakdown protection rating (commonly referred to as working voltage protection). Table 4.5 Regulatory Information1 on page 25and Table 4.6 Insulation and Safety-Related Specifications on page 25detail the working voltage and creepage/clearance capabilities of the Si86xx. These tables also detail the component standards (UL1577, IEC60747, CSA 5A), which are readily accepted by certification bodies to provide proof for end-system specifications requirements. Refer to the end-system specification (61010-1, 60950-1, 60601-1, etc.) requirements before starting any design that uses a digital isolator.3.3.1 Supply BypassThe Si86xx family requires a 0.1 µF bypass capacitor between V DD1 and GND1 and V DD2 and GND2. The capacitor should be placed as close as possible to the package. To enhance the robustness of a design, the user may also include resistors (50–300 Ω ) in series with the inputs and outputs if the system is excessively noisy.3.3.2 Output Pin TerminationThe nominal output impedance of an isolator driver channel is approximately 50 Ω, ±40%, which is a combination of the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads where transmission line effects will be a factor, output pins should be appropriately terminated with controlled impedance PCB traces.4. Electrical SpecificationsTable 4.1. Recommended Operating ConditionsTable 4.2. Electrical Characteristics(V DD1 = 5 V±10%, V DD2 = 5 V±10%, T A = –40 to 125 °C)ENABLEOUTPUTSen1t en2Figure 4.1. ENABLE Timing DiagramInputOutputFigure 4.2. Propagation Delay TimingFigure 4.3. Common-Mode Transient Immunity Test CircuitTable 4.3. Electrical Characteristics(V DD1 = 3.3 V±10%, V DD2 = 3.3 V±10%, T A = –40 to 125 °C)Table 4.4. Electrical Characteristics (V DD1 = 2.5 V ±5%, V DD2 = 2.5 V ±5%, T A = –40 to 125 °C)Table 4.5. Regulatory Information1CSAThe Si86xx is certified under CSA Component Acceptance Notice 5A, IEC61010-1 and IEC60950-1. For more details, see File 232873.VDEThe Si86xx is certified according to IEC 60747-5-2. For more details, see File 5006301-4880-0001.ULThe Si86xx is certified under UL1577 component recognition program. For more details, see File E257455.CQCThe Si86xx is certified under GB4943.1-2011. For more details, see certificates CQC130******** and CQC130********.Note:1.Regulatory Certifications apply to2.5 kV RMS rated devices which are production tested to3.0 kV RMS for 1 sec.For more information, see 5.5 Pin Descriptions (Si866x).Table 4.6. Insulation and Safety-Related SpecificationsTable 4.7. IEC 60664-1 (VDE 0844 Part 2) RatingsTable 4.8. IEC 60747-5-2 Insulation Characteristics for Si86xxxx*Table 4.9. IEC Safety Limiting Values1Table 4.10. Thermal Characteristics200150100505004002001000Temperature (ºC)S a f e t y -L i m i t i n g C u r r e n t (m A )300Figure 4.4. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Valueswith Case Temperature per DIN EN 60747-5-2200150100505004002001000Temperature (ºC)S a f e t y -L i m i t i n g C u r r e n t (m A )300Figure 4.5. (NB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Valueswith Case Temperature per DIN EN 60747-5-2200150********2001000Case Temperature (ºC)S a f e t y -L i m i t i n g V a l u e s (m A )300Figure 4.6. (NB SOIC-8) Thermal Derating Curve, Dependence of Safety Limiting Valueswith Case Temperature per DIN EN 60747-5-2Table 4.11. Absolute Maximum Ratings 15. Pin Descriptions5.1 Pin Descriptions (Si861x/2x Narrow Body SOIC-8)V DD2 V DD1V DD2V DD2Figure 5.1. Si861x/2x Narrow Body SOIC-8 Pin DescriptionsTable 5.1. Si861x/2x Narrow Body SOIC-8 Pin DescriptionsPin DescriptionsVDD2VDD2Figure 5.2. Si863x Pin DescriptionsTable 5.2. Si863x Pin DescriptionsVDD2VDD2V DD2Figure 5.3. Si864x Pin DescriptionsTable 5.3. Si864x Pin Descriptions5.4 Pin Descriptions (Si8650/51/52)VDD2VDD2V DD2Figure 5.4. Si865x Pin DescriptionsTable 5.4. Si865x Pin Descriptions5.5 Pin Descriptions (Si866x)VVVVFigure 5.5. Si866x Pin DescriptionsTable 5.5. Si866x Pin Descriptions6. Package Outlines6.1 Package Outline (16-Pin Wide Body SOIC)The figure below illustrates the package details for the Si86xx Digital Isolator. The table below lists the values for the dimensions shown in the illustration.Figure 6.1. 16-Pin Wide Body SOICTable 6.1. Package Diagram Dimensions6.2 Package Outline (16-Pin Narrow Body SOIC)The figure below illustrates the package details for the Si86xx in a 16-pin narrow-body SOIC (SO-16). The table below lists the values for the dimensions shown in the illustration.Figure 6.2. 16-pin Small Outline Integrated Circuit (SOIC) PackageTable 6.2. Package Diagram Dimensions6.3 Package Outline (8-Pin Narrow Body SOIC)The figure below illustrates the package details for the Si86xx. The table below lists the values for the dimensions shown in the illustra-tion.Figure 6.3. 8-pin Small Outline Integrated Circuit (SOIC) PackageTable 6.3. Package Diagram Dimensions7. Land Patterns7.1 Land Pattern (16-Pin Wide-Body SOIC)The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin wide-body SOIC. The table below lists thevalues for the dimensions shown in the illustration.Figure 7.1. 16-Pin SOIC Land PatternTable 7.1. 16-Pin Wide Body SOIC Land Pattern DimensionsLand Patternsthe values for the dimensions shown in the illustration.Figure 7.2. 16-Pin Narrow Body SOIC PCB Land PatternTable 7.2. 16-Pin Narrow Body SOIC Land Pattern Dimensionsthe values for the dimensions shown in the illustration.Figure 7.3. PCB Land Pattern: 8-Pin Narrow Body SOICTable 7.3. PCM Land Pattern Dimensions (8-Pin Narrow Body SOIC)8. Top Markings8.1 Top Marking (16-Pin Wide Body SOIC)Figure 8.1. 16-Pin Wide Body SOICTable 8.1. Top Marking Explanation (16-Pin Wide Body SOIC)Line 1 Marking:Base Part NumberOrdering Options(See 1. Ordering Guide for more information).Si86 = Isolator product seriesXY = Channel ConfigurationX = # of data channels (5, 4, 3, 2, 1)Y = # of reverse channels (2, 1, 0)S = Speed Grade (max data rate) and operating mode:A = 1 Mbps (default output = low)B = 150 Mbps (default output = low)D = 1 Mbps (default output = high)E = 150 Mbps (default output = high)V = Insulation ratingA = 1 kV;B = 2.5 kV;C = 3.75 kV;D = 5.0 kVLine 2 Marking:YY = YearWW = Workweek Assigned by assembly subcontractor. Corresponds to the year and work week of the mold date.RTTTTT = Mfg Code Manufacturing code from assembly house“R” indicates revisionLine 3 Marking:Circle = 1.7 mm Diameter(Center-Justified)“e4” Pb-free symbolCountry of Origin ISO Code Abbreviation CC = Country of Origin ISO Code Abbreviation•TW = Taiwan•TH = ThailandFigure 8.2. 16-Pin Narrow Body SOICTable 8.2. Top Marking Explanation (16-Pin Narrow Body SOIC)Line 1 Marking:Base Part NumberOrdering Options(See 1. Ordering Guide for more information.)Si86 = Isolator product seriesXY = Channel ConfigurationX = # of data channels (5, 4, 3, 2, 1)Y = # of reverse channels (2, 1, 0)S = Speed Grade (max data rate) and operating mode:A = 1 Mbps (default output = low)B = 150 Mbps (default output = low)D = 1 Mbps (default output = high)E = 150 Mbps (default output = high)V = Insulation ratingA = 1 kV;B = 2.5 kV;C = 3.75 kVLine 2 Marking:Circle = 1.2 mm Diameter“e3” Pb-Free SymbolYY = YearWW = Work Week Assigned by the assembly subcontractor. Corresponds to the year and work week of the mold date.RTTTTT = Mfg Code Manufacturing code from assembly house“R” indicates revisionFigure 8.3. 8-Pin Narrow Body SOICTable 8.3. Top Marking Explanation (8-Pin Narrow Body SOIC)Line 1 Marking:Base Part NumberOrdering Options(See 1. Ordering Guide for more information).Si86 = Isolator Product Series XY = Channel ConfigurationS = Speed Grade (max data rate) V = Insulation ratingLine 2 Marking:YY = YearWW = Workweek Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date.R = Product RevisionT = First character of the manufacturing codeLine 3 Marking:Circle = 1.1 mm Diameter“e3” Pb-Free Symbol.TTTT = Last four characters of the manufactur-ing codeLast four characters of the manufacturing code.9. Revision HistoryRevision 1.02February 2018•Added SI8641AB-AS1 and SI8642AB-AS1 to Ordering Guide for Automotive-Grade OPN options Revision 1.01January 2018•Updated data sheet format.•Added new table to Ordering Guide for Automotive-Grade OPN options•Updated Table 4.5 Regulatory Information1 on page 25.•Added CQC certificate numbers.•Updated 1. Ordering Guide.•Removed references to moisture sensitivity levels.•Removed note 2.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASmart.Connected.Energy-Friendly .Products/productsQuality /qualitySupport and CommunityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. 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Monolithic Power Systems 隔离产品交叉参考指南说明书
ISOLATED PRODUCTSCROSS-REFERENCE GUIDEDesigned for Applications in:SOLAROPTIMIZATIONAC/DCCONVERSIONENERGY STORAGECHARGING STATIONSIntroductionMPS has a whole family of isolated solutions that are pin-to-pin compatible with existing solutions on the market. These products are designed to be compliant to both UL1577 and VDE-0884 standards. Visit /isolation for more information.2Why Do We Need Isolation?Product OfferingsAdvantages» Isolated Gate Drivers» Digital Isolators» Digital Isolators with Power» Isolated Power Modules» Pin-to-pin compatible with existing solutions to alleviate supply shortage » Wide driver bias range enables more flexibility with FET selection(SiC, GaN, IGBT)» Higher source and sink peak currents enable higher efficiencyIsolated Products Cross-Reference GuideQ4 2021Simple, Easy Solutions TMApplications3» Supports various isolation requirements to maximize system safety level » Industry-leading performance » Supports UL1577 certificationCharging StationsEnergy StorageMP18831/51/71MP18831-4CGY MP18851-A4CGY MP18851-A4CGSE MP18831-A4BGLU MP18851-A4BGLU MP18871-A4BGLUSi823x UCC20520UCC21520UCC21521Server PSUs Telecom PSUs Solar Inverters Energy Storage DCFC Charging Stations AC/DC Conversion Motor DrivesMP276xxMP27622GY-Z (2 in/2 out)MP27631GY-Z (3 in/1 out)MP27633GY-Z (3 in/3 out)ISO7741/ISO7641Si8641MAX14931Industrial Automation/PLC RS-485/422/CAN InterfacesPower Meters EV/BMSDUAL-CHANNEL ISOLATED GATE DRIVERSI S O L A T E D P R O D U C T S C R O S S -R E F E R E N C E G U I D EISOLATED POWER MODULESDual-Channel Isolated Gate DriverDigital Isolator + Isolated Power ModuleMID1W0505AMID1W0505AGY-3S5V to 5V isolated module,0.6W/1W options availableIsolated Digital Isolator Bias RS-485/422/CAN Interfaces Isolated Sensor Power SuppliesTelecom/Networking MID06W0505A MID06W0505AGY-3R5V to 5V isolated module,0.6W/1W options availableIsolated Digital Isolator Bias RS-485/422/CAN Interfaces Isolated Sensor Power SuppliesTelecom/NetworkingFamilyPart NumberP2P ReplacementApplicationsFamilyPart NumberP2P ReplacementApplicationsFamilyPart NumberP2P ReplacementApplicationsFamilyPart NumberDescriptionApplicationsDIGITAL ISOLATORS WITH INTEGRATED POWERDIGITAL ISOLATORS - NO INTEGRATED POWERMPQ278xxMPQ27831-HP-MGY-3MPQ27821-LP-MGY-3MPQ27811-HP-MGY-3ISOW784x ISOW7821Industrial Automation 5G RRU, Industrial CPE RS-485/422/CAN InterfacesPower Meters55Why Is CMTI Important?CMTI for Isolated ProductsMP18831/51/71MPQ27811/21/31MP27622/31/33MID1W0505A/MID06W0505A» Common-mode transient immunity (CMTI)» High slew rate transients cancorrupt data transmission across the iso-lation barrier» CMTI measures in kV/µs or V/ns » Especially important in:-High-voltage applications-Fast transient devices (SiC, GaN)Coupling PathCoupled Noise• Up to 5kV RMS Isolation • CMTI > 100V/ns• 4A Source/4A Sink Peak Current• SOIC-16NB/WB and LGA-13 Package• P2P with the SI823x, UCC2x520 Families• Last 2 Digits Denote Number of I/O Channels • Input Range: 2.5V to 5.5V • Up to 150Mbps Data Rate • CMTI > 100V/ns• 13ns Propagation Delay • Available in an SOICW-16 Package• P2P with the ISO7741, Si8641, and MAX14931• Input Range: 4.5V to 5.5V • Integrated 1W Isolated Power• Up to 50Mbps Data Rate • 3kV RMS Isolation, CMTI > 100V/ns• Available in an SOICW-16 Package• P2P with the ISOW784x, ISOW7821, and MAX14931• Input Range: 4.5V to 5.5V • 5V Output Voltage• 0.6W/1W Output Options • 0.4% Load/1.5% Line Regulation• 3kV RMS Isolation• Available in an SOICW-16 PackageLearn more at:Isolated Dual-Channel Gate Driver2-Channel to 4-Channel Digital Isolator with Power4-Channel to 6-Channel Digital IsolatorIsolated Power ModuleABOUT MONOLITHIC POWER SYSTEMSWho we areWe are creative thinkers. We break boundaries. We take technology to new levels. As a leading international semiconductor company, Monolithic Power Systems (MPS) creates cutting-edge solutions to improve the quality of life with green, easy-to-use products.What we doWe make power design fun! With our innovative proprietary technology processes, we thrive on re-imagining and redefining the possibilities of high-performance power solutions in industrial applications, telecom infrastructures, cloud computing, automotive, and consumer applications.Where we come fromIt started with a vision. Michael Hsing, pioneering engineer and CEO, founded Monolithic Power Systems, Inc. in 1997 with the belief that an entire power system could be integrated onto a single chip. Under his leadership, MPS has succeeded not only in developing a monolithic power module that truly integrates an entire power system in a single package, but also it continues to defy industry expectations with its patented groundbreaking technologies.Our valuesWe cultivate creativity.As a company, we believe in creating an environment that encourages and challenges our employees to collaborate and think outside the box to excel beyond their preconceived capabilities.We do not accept the status quo.We do not believe in limitations. It is not about what is, but what can be. Possibilities are endless at MPS.We are passionate about sustainability.It’s about the future. From materials to finances, we are committed to conservation. We will not tolerate waste in an effort to improve and preserve the quality of life.We are committed to providing innovative products to our customers.Let us do the heavy lifting. We relentlessly strive to make system design versatile and effortless to meet our customers’ specific needs. We’ll do the work, so our customers can have the fun!Isolated Products Cross-Reference Guide6Q4 2021Simple, Easy Solutions TMOnline Order Support:1-408-826-0736eOrder@Want to order?Visit 77Regional HeadquartersMPS Seattle5808 Lake Washington Blvd. NE Kirkland, WA 98033, USA Tel: +1 425-296-9956MPS San Jose79 Great Oaks Blvd.San Jose, CA 95119, USA Tel: +1 408-826-0600MPS China Chengdu#8 Kexin Road West Park of Export Processing Zone West Hi-Tech Zone Chengdu, Sichuan, 611731 Tel: +86-28-8730-3000MPS China HangzhouFloor 6, Building A2, Xixi Center,No. 588 West Wenyi Road, Xihu District Hangzhou, Zhejiang, 310012Tel: +86-571-8981-8588MPS SwitzerlandRoute de Lully 5 A1131 Tolochenaz, Switzerland Tel: +41-21-805-0100MPS SpainAv. Josep Tarradellas 123, 5-A 08029 Barcelona, Spain Tel: +34-931-815-400MPS Investor RelationsTel: +1 408-826-0777CONTACT & ORDERINGAsia Sales OfficesMPS China Chengdu#8 Kexin Road West Park of Export Processing Zone West Hi-Tech Zone Chengdu, Sichuan, 611731Tel: +86-28-8730-3000MPS China ShanghaiFloor 27, Magnolia Plaza, No. 777, Hongqiao Road, Xuhui District Shanghai 20030Tel: +86-21-2225-1700MPS Singapore5 Tampines Central 6#03-38, Singapore 529482 Tel: +65-65918705MPS China HangzhouFloor 6, Building A2, Xixi Center,No. 588 West Wenyi Road, Xihu District Hangzhou, Zhejiang, 310012Tel: +86-571-8981-8588MPS China ShenzhenRoom 1401, Kingkey Riverfront Times Square Branch North,Binhe Avenue South, Futian District Shenzhen Guangdong, 518054 Tel: +86-755-3688-5818MPS JapanShinjuku Sumitomo Bldg. 31F 2-6-1 Nishishinjuku Shinjuku-ku, Tokyo 163-0231, Japan Tel: +81-3-5989-0885MPS KoreaC 403, 4F Pangyo Digital Center, Sampy-ong-dong 624 5pilgi, Bundang-gu, SeongNam-city, Kyunggi-do, Korea Tel: +82-2-598-2307MPS Taiwan29F, No. 97, Section 1, Xintai 5th Rd.Xizhi District, New Taipei City Tel: +886-2-86911600MPS IndiaUnit G-12, Prestige Towers,No 99 / 100, Residency Road,Bangalore 560025Tel: +91-80-4124-0312 / 20US Sales OfficesMPS US79 Great Oaks Blvd.San Jose, CA 95119, USA Tel: +1 408-826-0600MPS Detroit19499 Victor Parkway Livonia, MI 48152, USA Tel: +1 248-907-0222EU Sales OfficesMPS EuropeAlte Landstrasse 2585521 Ottobrunn, Germany Tel: +49-89-80913512-0MPS SpainAv. Josep Tarradellas 123, 5-A 08029 Barcelona, Spain Tel: +34-931-815-400MPS GermanyGutenbergstrasse 4,77955 Ettenheim, GermanyISOLATED PRODUCTS CROSS-REFERENCE GUIDEISOlATED PRODUCTSCROSS-REFERENCE GUIDE © 2021 Monolithic Power Systems, Inc. Patents Protected. All Rights Reserved.© 2018 Monolithic Power Systems, Inc.Patents Protected. All Rights Reserved.。
Si823Hx Gate Driver Board 用户指南说明书
UG475: Si823Hx Gate Driver Board User's GuideThe Si823Hx Gate Driver Board (GDB) is ideal for driving power modulesand discrete transistors. This two-channel isolated gate driver solution features a differential digital interface, optimized on-board isolated power supply, and user-configurable turn-on and turn-off gate resistors. Status indicator LEDs and test points make evaluation and prototyping easy.Ordering Information:•Si823H-AAWA-KIT - 1 Ω gate resistors •Si823H-ABWA-KIT - 4 Ω gate resistors •Si823H-ACWA-KIT - 0 Ω gate resistors Additional System Components:The Si823Hx GDB is highly versatile but must be combined with other compo-nents to form a complete system. You can choose various vendors' elements to complete your evaluation or prototyping system and tailor it to your specific needs.For example: Because the Si823Hx Gate Driver Board requires differential signal inputs, and most lab equipment only provides single-ended signals, it may prove helpful to use the Differential Transceiver Companion Tool, listed below, to provide that translation.Tested Components Include:•Half-Bridge Clamped Inductive Load (CIL) Test Fixture •Wolfspeed WolfPACK™ Power Module•Six-Pack Clamped Inductive Load (CIL) Test Fixture •Differential Transceiver Companion ToolTECHNICAL FEATURES•Two input, high-side/low-side gate driver •User programmable dead-time •Overlap protection•4 A symmetric peak output current•Available with 0 Ω, 1 Ω, or 4 Ω gate resistors •Independent control of turn on/turn off timing through gate resistor selection•Flexible isolated power supplies •5 kV RMS safety rated isolation•125 kV/µs common mode transient immunity (CMTI)•DC bus voltage up to 800 V•Reverse polarity protection for 12 V input supply •Differential inputs for increased noise immunity •Module temperature (NTC) output as frequency modulated digital signal •Reference design availableUG475: Si823Hx Gate Driver Board User's Guide • Electrical Specifications 1. Electrical Specifications2. Pin DescriptionsTable 2.1. Input Connectors3. Signal Descriptions•PWM Signals: High-side and low-side PWM are RS-422 compatible differential inputs. The termination impedance of the differential receiver is 360 Ω. Overlap protection is provided to prevent both the high-side and low-side gates from turning on simultaneously.The overlap protection should not be used as a dead time generator. Programmable dead time is provided by resistor selection. See section XXX.•RTD (NTC): RTD output is a differential signal that returns the resistance of the temperature sensor (NTC) integrated into some modules. The signal is a frequency modulated signal that encodes the resistance of the temperature sensor. The approximate temperature of the module can be determined from this resistance. See the section Temperature Feedback for further details.•PWM EN:This is a single-ended input that enables the PWM inputs for both channels. When this signal is pulled down, or left floating, the isolated drivers for both channels are disabled and the gates will both be pulled low through R G-OFF. All protection circuitry and power supplies will continue to operate including the RTD output.•Over-Voltage and Reverse Polarity Protection: Power input on pin 1 of the gate driver board input connector features a power management circuit to protect the gate driver from damage by connecting a power source that exceeds the voltage rating of the gate driver. There is a diode and MOSFET in-line with the power input to protect against connecting a power source with positive and negative polarity reversed.UG475: Si823Hx Gate Driver Board User's Guide • Truth Table 4. Truth TableUG475: Si823Hx Gate Driver Board User's Guide • Gate Driver Interface 5. Gate Driver Interface6. Function Block DiagramHS-P HS-N LS-P LS-N RTD-P RTD-NNTC 1NTC 2PWM ENHS GATELS GATELS SRCHS SRCV DCUG475: Si823Hx Gate Driver Board User's Guide • Function Block DiagramUG475: Si823Hx Gate Driver Board User's Guide • Temperature Feedback7. Temperature FeedbackMany power modules use a thermistor to provide temperature feedback of the power switching devices. If a thermistor is provided on the module, it can be connected to the driver board. The resistance of that sensor is converted to a 50% duty cycle square wave with a frequency that varies inversely with the resistance. The resistance to frequency relationship is displayed in the table below. The resistance measurement circuit is located on the low-side gate drive channel, and a digital isolator is used to transmit the frequency-encoded signal back to the primary side of the driver. For this reason, the temperature signal does not need any additional isolation, and can be included in the same cable as the rest of the gate driver's signals. The temperature reported by the sensor may differ from the junction temperature of the transistors used in the module.Figure 7.1. Thermistor Resistance vs. Output Frequency8. Connector Information8.1 Input Connector Information•16 Positions Header, 0.100” (2.54 mm) Pitch, Through Hole, Gold (SBH11-PBPC-D08-ST-BK)8.2 Suggested Mating Parts•16 Position Rectangular Header, IDC, Gold, 28 AWG (SFH210-PPPC-D08-ID-BK)•16 Position Header, 0.100” (2.54 mm) Pitch, Through Hole, Gold (SFH11-PBPC-D08-RA-BK)•16 Position Header, 0.100” (2.54 mm) Pitch, Through Hole, Right Angle, Gold (SFH11-PBPC-D08-RA-BK) 8.3 Output Connector Information• 4 Positions Header, 0.100” (2.54 mm) Pitch, Through Hole, Gold (Samtec® ESQ-102-33-L-D)9. User Configurable Options9.1 Dead TimeDead Time is a user selectable delay between the falling edge of the gate drive signal on one channel and the rising edge of the gate drive signal on the other channel. The value of this delay is programmable through the selection of a dead time resistor (R DT) on the Si823H2 driver. In this application, resistor R29 is that dead time resistor. The allowed range of the value of the dead time resistor is 6 kΩ to 100 kΩ. This provides a range of dead time between 20 nsec and 200 nsec. The relationship between dead time and the value of the dead time resistor is described by the equation:Dead Time ≈ 1.8 × R DT +12Where Dead Time is in nsec and R DT is in kΩ.To change the dead time value, the user would remove R29 and replace it with the calculated value based on the desired dead time. For additional information about dead time, refer to the Si823Hx data sheet.9.2 Series Gate ResistorsThe Si823Hx GDB is available in three orderable configurations: one with 0 Ω series gate resistors (Si823H-ACWA-KIT), one with 1Ω gate resistors (Si823H-AAWA-KIT), and another with 4 Ω gate resistors (Si823H-ABWA-KIT). These configurations have the same value of resistor in-series with the gate drive signal for both the high side and the low side channels. In addition, these resistor values are the same for both turn on (R G-ON) and turn off (R G-OFF).However, the user can select any value for turn on and turn off timing control independently. Resistors R37 and R38 control the turn on timing for the high side and low side channels respectively. Resistors R40 and R39 affect the turn off time for the high side and low side respectively. Resistors R40 and R39 are connected in the gate drive path through diodes D15 and D16 such that they will effectively be in parallel with the turn on time resistors (see the schematic for reference). This configuration provides the user with complete flexibility in tuning the turn on and turn off times for each channel.9.3 Negative Gate BiasThe default configuration of this driver board provides a gate drive signal that swings from +15 V to -3.5 V with respect to the source pin connection. The user can change this configuration using the solder bump jumpers J8 and J9 for the high side and J10 and J11 for the low side (OFF GATE BIAS). By removing the solder on J9 for the high side, or J10 for the low side, and adding solder to short the pads on J8 for the high side, or J11 for the low side, the output of the driver board will swing from +18.5 V to 0 V with respect to the source pin. To reduce the “on” state voltage in this configuration, the user will need to adjust the output of the isolated power supply converter as described in the next section.9.4 Isolated Driver Power Supply VoltageThe Si823Hx GDB uses a dc-dc converter integrated into the Si88421 digital isolator. This converter regulates the output of one secondary of the transformer used in the application. The design of the transformer provides regulation of the other secondary winding to provide separate, isolated power supplies for both the high side and low side driver. The default configuration provides a driver power supply that is regulated to roughly 19 V. Since the source pin of each channel is biased about 3.5 V above the converter’s reference, the gate will see a voltage swing from +15 V to -3.5 V when measured with respect to the source pin. As mentioned in the previous section, the board can be configured to eliminate the negative bias for the gate voltage by connecting the source pins directly to the converter’s reference. However, this will cause the gate voltage to swing to +18.5 V with respect to the source pin. To adjust this, the user can modify the voltage feedback resistor network (ISO SUPPLY ADJ). Resistors R12 and R13 provide a feedback path for the integrated dc-dc converter controller. By adjusting the ratio of these resistors, the output voltage of the converter can be adjusted.The converter expects the feedback divider to provide a sense voltage of 1.05 V on pin 13 of the Si88421 (VSNS). The output voltage can thus be described by the following equation:V OUT = SNSThis equation demonstrates that replacing R13 with a 10.9 kΩ resistor will provide a V out of close to 15 V.UG475: Si823Hx Gate Driver Board User's Guide • Supporting Links and Tools10. Supporting Links and Tools•Skyworks Si823Hx data sheet•Skyworks Si88x2x data sheet•Si823Hx Gate Driver Board Reference Designs:•Si823Hx-AAWA-KIT•Si823Hx-ABWA-KIT•Si823Hx-ACWA-KIT•AN892: Design Guide for Isolated DC-DC Using the Si882xx/883xx•AN901: Design Guide for Isolated DC-DC Using the Si884xx/886xx•AN1131: Design Guide for Reducing Radiated and Conducted Emissions in Isolated Systems Using Skyworks' Isolators •AN1167: Safety Considerations for Skyworks Series Capacitive IsolatorsUG475: Si823Hx Gate Driver Board User's Guide • Dimensions 11. DimensionsCopyright © 2022 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSL Y DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESUL T FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters.Skyworks, the Skyworks symbol, Sky5®, SkyOne®, SkyBlue™, Skyworks Green™, ClockBuilder®, DSPLL®, ISOmodem®, ProSLIC®, and SiPHY® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.SkyworksSolutions,Inc.|Nasdaq:SWKS|*********************| Portfolio Quality /quality Support & Resources/support。
Si4438中文数据手册
修订版 1.0 版权所有 © 2014 Silicon LaboratoriesSi4438-C特点应用说明Silicon Laboratories 的Si4438为高性能的低电流收发器，可覆盖从425至 525MHz 的次千兆赫频段。
Si4438 针对中国智能仪表市场，特别适合于智能电表。
该设备的覆盖区及引脚与 Si446x 无线电兼容，可为全世界的次千兆赫应用提供行业领先的性能。
无线电设备是 EZRadioPRO ®产品系列的一部分，包括全套发射器、接收器和收发器的产品线，涵盖各种应用。
所有零件都具有杰出的灵敏度—124dBm ，可同时实现极低的有效电流和待机电流消耗。
12.5kHz 通道 58dB 相邻通道选择性的间距确保了严苛 RF 条件下的可靠接收操作。
Si4438 可提供超常的高达 +20dBm 具有显著 TX 效率的输出功率。
高输出功率和灵敏度实现了业界领先的144dB 链路预算，实现了范围扩展和高度可靠的通信链路。
⏹频率范围=425–525MHz ⏹接收灵敏度=–124dBm ⏹调制● (G)FSK ● OOK⏹最大输出功率● +20dBm⏹低活动功耗● 14mA RX⏹超低电流断电模式● 30nA 关机，40nA 待机⏹数据传输率=100 bps 到 500kbps⏹前导探测模式● 6在 1.2kbps 时 mA 平均 Rx 电流⏹快速唤醒和跳数⏹电源=1.8 至 3.8V⏹出色的选择性能● 58dB 相邻通道● 1MHz 处阻断增益为 75dB⏹天线分集和 T/R 开关控制⏹高度可配置的分组处理程序⏹TX 和 RX64 字节 FIFO⏹自动频率控制 (AFC)⏹自动增益控制 (AGC)⏹低 BOM⏹低电量探测器⏹温度传感器⏹20 引脚 QFN 封装⏹IEEE 802.15.4g 就绪⏹适合中国调控（国家电网）⏹中国智能仪表专利申请中Si4438-C功能框图Product Freq. Range Max Output Power TX Current RX Current Si4438425–525MHz+20dBm75mA13.7mASi4438-C修订版 1.03目录章节页码1. 电气规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42. 功能描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113. 控制器接口 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.1. 串行外围接口 (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.2. 快速响应寄存器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.3. 工作模式和计时 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.4. 应用程序编程接口 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183.5. 中断 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183.6. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184. 调制和硬件配置选项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.1. 调制类型 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.2. 硬件配置选项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.3. 前导长度 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215. 内部功能块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.1. RX 链 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.2. RX 调制解调器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.3. 合成器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .255.4. 发送器（TX ） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .275.5. 晶体振荡器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .296. 数据处理和分组处理程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .316.1. RX 和 TX FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .316.2. 分组处理程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .327. RX 调制解调器配置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338. 辅助块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.1. 唤醒定时器和 32kHz 时钟源 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.2. 低占空比模式（自动 RX 唤醒） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.3. 温度、电池电压和辅助 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .348.4. 低电量探测器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .358.5. 天线分集 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .358.6. 前导探测模式 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .359. 引脚描述：Si4438-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3710. 订购信息 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3911. 封装外形：Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4012. PCB 焊盘图案：Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4113. 顶部标记 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4313.1. Si4438 顶部标记 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4313.2. 顶部标记说明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43联系信息 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44Si4438-C1. 电气规格Table 1. DC Characteristics *Parameter Symbol Test ConditionMin Typ Max Unit Supply Voltage RangeV DD 1.8 3.3 3.8V Power Saving ModesI Shutdown RC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF —30—nA I Standby Register values maintained and RCoscillator/WUT OFF —40—nA I SleepRC RC Oscillator/WUT ON and all register valuesmaintained, and all other blocks OFF —740—nA I SleepXO Sleep current using an external 32kHz crystal.— 1.7—µA I Sensor -LBD Low battery detector ON, register values maintained, and all other blocks OFF —1—µA I ReadyCrystal Oscillator and Main Digital Regulator ON,all other blocks OFF— 1.8—mA Preamble Sense Mode CurrentI psm Duty cycling during preamble search,1.2kbps, 4 byte preamble —6—mA I psmFixed 1s wakeup interval, 50kbps, 5 bytepreamble—10—µA TUNE Mode Current I Tune_RX RX Tune —7.6—mA I Tune_TX TX Tune —7.8—mA RX Mode Current I RXH —13.7—mA TX Mode Current (Si4438)I TX_+20+20dBm output power, class-E match, 490MHz,3.3V—75—mA*Note: All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltageand from –40 to +85°C unless otherwise stated. All typical values apply at VDD =3.3V and 25°C unless otherwise stated.Si4438-CTable 2. Synthesizer AC Electrical Characteristics1Parameter Symbol Test Condition Min Typ Max UnitF SYN425—525MHz Synthesizer FrequencyRange (Si4438)F RES-525425–525MHz—14.3—Hz Synthesizer FrequencyResolution2—50—µs Synthesizer Settling Time t LOCK Measured from exiting Ready mode withXOSC running to any frequency.Including VCO Calibration.Phase Noise Lφ(f M)∆F=10kHz, 460MHz—–109—dBc/Hz∆F=100kHz, 460MHz—–111—dBc/Hz∆F=1MHz, 460MHz—–131—dBc/Hz∆F=10MHz, 460MHz—–141—dBc/HzNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD=3.3V and 25°C unless otherwise stated.2. Default API setting for modulation deviation resolution is double the typical value specified.Si4438-CTable 3. Receiver AC Electrical Characteristics 1ParameterSymbol Test ConditionMin Typ Max Unit RX Frequency Range (Si4438)F RX 425—525MHz RX Sensitivity 2P RX_0.5(BER < 0.1%)(500bps, GFSK, BT =0.5,∆f =±250Hz)2—–124—dBmP RX_40(BER < 0.1%)(40kbps, GFSK, BT =0.5,∆f =±20kHz)2—–108—dBmP RX_100(BER < 0.1%)(100kbps, GFSK, BT =0.5,∆f =±50kHz)1—–104—dBmP RX_9.6(BER < 0.1%)(9.6kbps, GFSK, BT =0.5,∆f =±4.8kHz)2—–114—dBmP RX_OOK(BER < 0.1%, 4.8kbps, 350kHz BW,OOK, PN15 data)2—–108—dBm (BER < 0.1%, 40kbps, 350kHz BW,OOK, PN15 data)2—–102—dBm (BER < 0.1%, 120kbps, 350kHz BW,OOK, PN15 data)2—–98—dBm RX Channel Bandwidth BW 1.1—850kHz RSSI Resolution RES RSSI —±0.5—dB ±1-Ch Offset Selectivity, 450MHz 2C/I 1-CHDesired Ref Signal 3dB above sensitivity, BER < 0.1%. Interferer is CW, and desired is modulated with2.4kbps∆F =1.2kHz GFSK with BT =0.5, RXchannel BW =4.8kHz, channel spacing =12.5kHz —–60—dBBlocking 1MHz Offset 21M BLOCK Desired Ref Signal 3dB above sensitivity, BER =0.1%. Interferer is CW, and desired is modulated with2.4kbps,∆F =1.2kHz GFSK with BT =0.5,RX channel BW =4.8kHz —–77—dB Blocking 8MHz Offset 28M BLOCK—–84—dBImage RejectionIm REJRejection at the image frequency.IF =468kHz—40—dBNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD =3.3V and 25°C unless otherwise stated.2. Measured over 50000 bits using PN9 data sequence and data and clock on GPIOs. Sensitivity is expected to be betterif reading data from packet handler FIFO especially at higher data rates.Si4438-CTable 4. Transmitter AC Electrical Characteristics1Parameter Symbol Test Condition Min Typ Max Unit TX FrequencyRangeF TX425—525MHz(G)FSK Data Rate2DR FSK0.1—500kbps OOK Data Rate2DR OOK0.1—120kbps Modulation DeviationRange∆f525425–525MHz—750—kHz Modulation DeviationResolution3F RES-525425–525MHz—14.3—HzOutput Power Range4P TXTypical range at 3.3Vwith class E match optimized for bestPA efficiency.–20—+20dBmTX RF Output Steps∆PRF_OUT Using Class E match within 6dB of maxpower—0.25—dBTX RF Output LevelVariation vs. Temperature∆P RF_TEMP–40 to +85︒C— 2.3—dB TX RF Output LevelVariation vs. Frequency∆P RF_FREQ—0.6—dBTransmit ModulationFiltering B*T Gaussian Filtering Bandwith TimeProduct—0.5—Notes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD=3.3V and 25 °C unless otherwise stated.2. The maximum data rate is dependent on the XTAL frequency and is calculated as per the formula:Maximum Symbol Rate=Fxtal/60, where Fxtal is the XTAL frequency (typically 30MHz).3. Default API setting for modulation deviation resolution is double the typical value specified.4. Output power is dependent on matching components and board layout.Si4438-CTable 5. Auxiliary Block Specifications 1ParameterSymbol Test ConditionMin Typ Max Unit Temperature Sensor SensitivityTS S—4.5—ADC Codes/°C Low Battery Detector ResolutionLBD RES —50—mV Microcontroller ClockOutput Frequency Range 2F MCConfigurable to Fxtal or Fxtal divided by 2, 3, 7.5, 10, 15, or 30 where Fxtal is the reference XTAL frequency. In addition, 32.768kHz is also supported.32.768K—FxtalHzTemperature Sensor Conversion TEMP CT Programmable setting—3—ms XTAL Range 3XTAL Range25—32MHz 30MHz XTAL Start-Up Timet 30MUsing XTAL and board layout in reference design. Start-up time will vary with XTAL type andboard layout.—300—µs30MHz XTAL Cap Resolution30M RES —70—fF 32kHz XTAL Start-Up Time t 32k —2—sec 32kHz Accuracy using Internal RC Oscillator 32KRC RES—2500—ppm POR Reset Timet POR——6msNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at V DD =3.3V and 25°C unless otherwise stated.2. Microcontroller clock frequency tested in production at 1MHz, 30MHz, 32MHz, and 32.768kHz. Other frequenciestested in bench characterization.3. XTAL Range tested in production using an external clock source (similar to using a TCXO).Si4438-CTable 6. Digital IO Specifications (GPIO_x, SCLK, SDO, SDI, nSEL, nIRQ, SDN)1Parameter Symbol Test Condition Min Typ Max Unit Rise Time2,3T RISE0.1x V DD to 0.9x V DD,C L=10pF,DRV<1:0>=LL— 2.3—nsFall Time3,4T FALL0.9x V DD to 0.1x V DD,C L=10pF,DRV<1:0>=LL—2—nsInput Capacitance C IN—2—pF Logic High Level Input Voltage V IH V DD x0.7——V Logic Low Level Input Voltage V IL——V DD x0.3V Input Current I IN0<V IN< V DD–1—1µA Input Current If Pullup is Activated I INP V IL=0V1—4µADrive Strength for Output Low Level I OmaxLL DRV[1:0]=LL3— 6.66—mA I OmaxLH DRV[1:0]=LH3— 5.03—mA I OmaxHL DRV[1:0]=HL3— 3.16—mA I OmaxHH DRV[1:0]=HH3— 1.13—mADrive Strength for Output High Level I OmaxLL DRV[1:0]=LL3— 5.75—mA I OmaxLH DRV[1:0]=LH3— 4.37—mA I OmaxHL DRV[1:0]=HL3— 2.73—mA I OmaxHH DRV[1:0]=HH3—0.96—mADrive Strength for Output High Level for GPIO0I OmaxLL DRV[1:0]=LL3— 2.53—mA I OmaxLH DRV[1:0]=LH3— 2.21—mA I OmaxHL DRV[1:0]=HL3— 1.7—mA I OmaxHH DRV[1:0]=HH3—0.80—mALogic High Level Output Voltage V OH DRV[1:0]=HL V DD x0.8——V Logic Low Level Output Voltage V OL DRV[1:0]=HL——V DD x0.2V Notes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltageand from –40 to +85°C unless otherwise stated. All typical values apply at V DD=3.3V and 25°C unless otherwise stated.2. 6.7ns is typical for GPIO0 rise time.3. Assuming VDD=3.3V, drive strength is specified at Voh (min)=2.64V and Vol(max)=0.66V at room temperature.4. 2.4ns is typical for GPIO0 fall time.Si4438-CTable 7. Thermal Operating CharacteristicsParameterValue Unit Operating Ambient Temperature Range T A –40 to +85︒C Thermal Impedance θJA 25︒C /W Junction Temperature T JMAX +105︒C Storage Temperature Range T STG–55 to +150︒CTable 8. Absolute Maximum Ratings*ParameterValue Unit V DD to GND–0.3, +3.8V Instantaneous V RF-peak to GND on TX Output Pin –0.3, +8.0V Sustained V RF-peak to GND on TX Output Pin –0.3, +6.5V Voltage on Digital Control Inputs –0.3, V DD + 0.3 V Voltage on Analog Inputs–0.3, V DD + 0.3V Voltage on XIN Input when using a TCXO –0.7, V DD + 0.3V RX Input Power+10dBm*Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Theseare stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Power Amplifier may be damaged if switched on without proper load or termination connected. TX matching network design will influence TX V RF-peak on TX output pin. Caution: ESD sensitive device.2. 功能描述Si4438 设备为高性能低电流的无线 ISM 收发器，可覆盖次千兆赫波段。
Si4438中文数据手册
修订版 1.0 版权所有 © 2014 Silicon LaboratoriesSi4438-C特点应用说明Silicon Laboratories 的Si4438为高性能的低电流收发器，可覆盖从425至 525MHz 的次千兆赫频段。
Si4438 针对中国智能仪表市场，特别适合于智能电表。
该设备的覆盖区及引脚与 Si446x 无线电兼容，可为全世界的次千兆赫应用提供行业领先的性能。
无线电设备是 EZRadioPRO ®产品系列的一部分，包括全套发射器、接收器和收发器的产品线，涵盖各种应用。
所有零件都具有杰出的灵敏度—124dBm ，可同时实现极低的有效电流和待机电流消耗。
12.5kHz 通道 58dB 相邻通道选择性的间距确保了严苛 RF 条件下的可靠接收操作。
Si4438 可提供超常的高达 +20dBm 具有显著 TX 效率的输出功率。
高输出功率和灵敏度实现了业界领先的144dB 链路预算，实现了范围扩展和高度可靠的通信链路。
⏹频率范围=425–525MHz ⏹接收灵敏度=–124dBm ⏹调制● (G)FSK ● OOK⏹最大输出功率● +20dBm⏹低活动功耗● 14mA RX⏹超低电流断电模式● 30nA 关机，40nA 待机⏹数据传输率=100 bps 到 500kbps⏹前导探测模式● 6在 1.2kbps 时 mA 平均 Rx 电流⏹快速唤醒和跳数⏹电源=1.8 至 3.8V⏹出色的选择性能● 58dB 相邻通道● 1MHz 处阻断增益为 75dB⏹天线分集和 T/R 开关控制⏹高度可配置的分组处理程序⏹TX 和 RX64 字节 FIFO⏹自动频率控制 (AFC)⏹自动增益控制 (AGC)⏹低 BOM⏹低电量探测器⏹温度传感器⏹20 引脚 QFN 封装⏹IEEE 802.15.4g 就绪⏹适合中国调控（国家电网）⏹中国智能仪表专利申请中Si4438-C功能框图Product Freq. Range Max Output Power TX Current RX Current Si4438425–525MHz+20dBm75mA13.7mASi4438-C修订版 1.03目录章节页码1. 电气规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42. 功能描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113. 控制器接口 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.1. 串行外围接口 (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.2. 快速响应寄存器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.3. 工作模式和计时 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.4. 应用程序编程接口 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183.5. 中断 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183.6. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184. 调制和硬件配置选项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.1. 调制类型 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.2. 硬件配置选项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .194.3. 前导长度 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215. 内部功能块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.1. RX 链 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.2. RX 调制解调器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235.3. 合成器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .255.4. 发送器（TX ） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .275.5. 晶体振荡器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .296. 数据处理和分组处理程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .316.1. RX 和 TX FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .316.2. 分组处理程序 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .327. RX 调制解调器配置 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338. 辅助块 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.1. 唤醒定时器和 32kHz 时钟源 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.2. 低占空比模式（自动 RX 唤醒） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .338.3. 温度、电池电压和辅助 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .348.4. 低电量探测器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .358.5. 天线分集 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .358.6. 前导探测模式 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .359. 引脚描述：Si4438-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3710. 订购信息 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3911. 封装外形：Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4012. PCB 焊盘图案：Si4438 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4113. 顶部标记 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4313.1. Si4438 顶部标记 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4313.2. 顶部标记说明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43联系信息 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44Si4438-C1. 电气规格Table 1. DC Characteristics *Parameter Symbol Test ConditionMin Typ Max Unit Supply Voltage RangeV DD 1.8 3.3 3.8V Power Saving ModesI Shutdown RC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF —30—nA I Standby Register values maintained and RCoscillator/WUT OFF —40—nA I SleepRC RC Oscillator/WUT ON and all register valuesmaintained, and all other blocks OFF —740—nA I SleepXO Sleep current using an external 32kHz crystal.— 1.7—µA I Sensor -LBD Low battery detector ON, register values maintained, and all other blocks OFF —1—µA I ReadyCrystal Oscillator and Main Digital Regulator ON,all other blocks OFF— 1.8—mA Preamble Sense Mode CurrentI psm Duty cycling during preamble search,1.2kbps, 4 byte preamble —6—mA I psmFixed 1s wakeup interval, 50kbps, 5 bytepreamble—10—µA TUNE Mode Current I Tune_RX RX Tune —7.6—mA I Tune_TX TX Tune —7.8—mA RX Mode Current I RXH —13.7—mA TX Mode Current (Si4438)I TX_+20+20dBm output power, class-E match, 490MHz,3.3V—75—mA*Note: All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltageand from –40 to +85°C unless otherwise stated. All typical values apply at VDD =3.3V and 25°C unless otherwise stated.Si4438-CTable 2. Synthesizer AC Electrical Characteristics1Parameter Symbol Test Condition Min Typ Max UnitF SYN425—525MHz Synthesizer FrequencyRange (Si4438)F RES-525425–525MHz—14.3—Hz Synthesizer FrequencyResolution2—50—µs Synthesizer Settling Time t LOCK Measured from exiting Ready mode withXOSC running to any frequency.Including VCO Calibration.Phase Noise Lφ(f M)∆F=10kHz, 460MHz—–109—dBc/Hz∆F=100kHz, 460MHz—–111—dBc/Hz∆F=1MHz, 460MHz—–131—dBc/Hz∆F=10MHz, 460MHz—–141—dBc/HzNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD=3.3V and 25°C unless otherwise stated.2. Default API setting for modulation deviation resolution is double the typical value specified.Si4438-CTable 3. Receiver AC Electrical Characteristics 1ParameterSymbol Test ConditionMin Typ Max Unit RX Frequency Range (Si4438)F RX 425—525MHz RX Sensitivity 2P RX_0.5(BER < 0.1%)(500bps, GFSK, BT =0.5,∆f =±250Hz)2—–124—dBmP RX_40(BER < 0.1%)(40kbps, GFSK, BT =0.5,∆f =±20kHz)2—–108—dBmP RX_100(BER < 0.1%)(100kbps, GFSK, BT =0.5,∆f =±50kHz)1—–104—dBmP RX_9.6(BER < 0.1%)(9.6kbps, GFSK, BT =0.5,∆f =±4.8kHz)2—–114—dBmP RX_OOK(BER < 0.1%, 4.8kbps, 350kHz BW,OOK, PN15 data)2—–108—dBm (BER < 0.1%, 40kbps, 350kHz BW,OOK, PN15 data)2—–102—dBm (BER < 0.1%, 120kbps, 350kHz BW,OOK, PN15 data)2—–98—dBm RX Channel Bandwidth BW 1.1—850kHz RSSI Resolution RES RSSI —±0.5—dB ±1-Ch Offset Selectivity, 450MHz 2C/I 1-CHDesired Ref Signal 3dB above sensitivity, BER < 0.1%. Interferer is CW, and desired is modulated with2.4kbps∆F =1.2kHz GFSK with BT =0.5, RXchannel BW =4.8kHz, channel spacing =12.5kHz —–60—dBBlocking 1MHz Offset 21M BLOCK Desired Ref Signal 3dB above sensitivity, BER =0.1%. Interferer is CW, and desired is modulated with2.4kbps,∆F =1.2kHz GFSK with BT =0.5,RX channel BW =4.8kHz —–77—dB Blocking 8MHz Offset 28M BLOCK—–84—dBImage RejectionIm REJRejection at the image frequency.IF =468kHz—40—dBNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD =3.3V and 25°C unless otherwise stated.2. Measured over 50000 bits using PN9 data sequence and data and clock on GPIOs. Sensitivity is expected to be betterif reading data from packet handler FIFO especially at higher data rates.Si4438-CTable 4. Transmitter AC Electrical Characteristics1Parameter Symbol Test Condition Min Typ Max Unit TX FrequencyRangeF TX425—525MHz(G)FSK Data Rate2DR FSK0.1—500kbps OOK Data Rate2DR OOK0.1—120kbps Modulation DeviationRange∆f525425–525MHz—750—kHz Modulation DeviationResolution3F RES-525425–525MHz—14.3—HzOutput Power Range4P TXTypical range at 3.3Vwith class E match optimized for bestPA efficiency.–20—+20dBmTX RF Output Steps∆PRF_OUT Using Class E match within 6dB of maxpower—0.25—dBTX RF Output LevelVariation vs. Temperature∆P RF_TEMP–40 to +85︒C— 2.3—dB TX RF Output LevelVariation vs. Frequency∆P RF_FREQ—0.6—dBTransmit ModulationFiltering B*T Gaussian Filtering Bandwith TimeProduct—0.5—Notes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at VDD=3.3V and 25 °C unless otherwise stated.2. The maximum data rate is dependent on the XTAL frequency and is calculated as per the formula:Maximum Symbol Rate=Fxtal/60, where Fxtal is the XTAL frequency (typically 30MHz).3. Default API setting for modulation deviation resolution is double the typical value specified.4. Output power is dependent on matching components and board layout.Si4438-CTable 5. Auxiliary Block Specifications 1ParameterSymbol Test ConditionMin Typ Max Unit Temperature Sensor SensitivityTS S—4.5—ADC Codes/°C Low Battery Detector ResolutionLBD RES —50—mV Microcontroller ClockOutput Frequency Range 2F MCConfigurable to Fxtal or Fxtal divided by 2, 3, 7.5, 10, 15, or 30 where Fxtal is the reference XTAL frequency. In addition, 32.768kHz is also supported.32.768K—FxtalHzTemperature Sensor Conversion TEMP CT Programmable setting—3—ms XTAL Range 3XTAL Range25—32MHz 30MHz XTAL Start-Up Timet 30MUsing XTAL and board layout in reference design. Start-up time will vary with XTAL type andboard layout.—300—µs30MHz XTAL Cap Resolution30M RES —70—fF 32kHz XTAL Start-Up Time t 32k —2—sec 32kHz Accuracy using Internal RC Oscillator 32KRC RES—2500—ppm POR Reset Timet POR——6msNotes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltage andfrom –40 to +85°C unless otherwise stated. All typical values apply at V DD =3.3V and 25°C unless otherwise stated.2. Microcontroller clock frequency tested in production at 1MHz, 30MHz, 32MHz, and 32.768kHz. Other frequenciestested in bench characterization.3. XTAL Range tested in production using an external clock source (similar to using a TCXO).Si4438-CTable 6. Digital IO Specifications (GPIO_x, SCLK, SDO, SDI, nSEL, nIRQ, SDN)1Parameter Symbol Test Condition Min Typ Max Unit Rise Time2,3T RISE0.1x V DD to 0.9x V DD,C L=10pF,DRV<1:0>=LL— 2.3—nsFall Time3,4T FALL0.9x V DD to 0.1x V DD,C L=10pF,DRV<1:0>=LL—2—nsInput Capacitance C IN—2—pF Logic High Level Input Voltage V IH V DD x0.7——V Logic Low Level Input Voltage V IL——V DD x0.3V Input Current I IN0<V IN< V DD–1—1µA Input Current If Pullup is Activated I INP V IL=0V1—4µADrive Strength for Output Low Level I OmaxLL DRV[1:0]=LL3— 6.66—mA I OmaxLH DRV[1:0]=LH3— 5.03—mA I OmaxHL DRV[1:0]=HL3— 3.16—mA I OmaxHH DRV[1:0]=HH3— 1.13—mADrive Strength for Output High Level I OmaxLL DRV[1:0]=LL3— 5.75—mA I OmaxLH DRV[1:0]=LH3— 4.37—mA I OmaxHL DRV[1:0]=HL3— 2.73—mA I OmaxHH DRV[1:0]=HH3—0.96—mADrive Strength for Output High Level for GPIO0I OmaxLL DRV[1:0]=LL3— 2.53—mA I OmaxLH DRV[1:0]=LH3— 2.21—mA I OmaxHL DRV[1:0]=HL3— 1.7—mA I OmaxHH DRV[1:0]=HH3—0.80—mALogic High Level Output Voltage V OH DRV[1:0]=HL V DD x0.8——V Logic Low Level Output Voltage V OL DRV[1:0]=HL——V DD x0.2V Notes:1.All minimum and maximum values are guaranteed across the recommended operating conditions of supply voltageand from –40 to +85°C unless otherwise stated. All typical values apply at V DD=3.3V and 25°C unless otherwise stated.2. 6.7ns is typical for GPIO0 rise time.3. Assuming VDD=3.3V, drive strength is specified at Voh (min)=2.64V and Vol(max)=0.66V at room temperature.4. 2.4ns is typical for GPIO0 fall time.Si4438-CTable 7. Thermal Operating CharacteristicsParameterValue Unit Operating Ambient Temperature Range T A –40 to +85︒C Thermal Impedance θJA 25︒C /W Junction Temperature T JMAX +105︒C Storage Temperature Range T STG–55 to +150︒CTable 8. Absolute Maximum Ratings*ParameterValue Unit V DD to GND–0.3, +3.8V Instantaneous V RF-peak to GND on TX Output Pin –0.3, +8.0V Sustained V RF-peak to GND on TX Output Pin –0.3, +6.5V Voltage on Digital Control Inputs –0.3, V DD + 0.3 V Voltage on Analog Inputs–0.3, V DD + 0.3V Voltage on XIN Input when using a TCXO –0.7, V DD + 0.3V RX Input Power+10dBm*Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Theseare stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Power Amplifier may be damaged if switched on without proper load or termination connected. TX matching network design will influence TX V RF-peak on TX output pin. Caution: ESD sensitive device.2. 功能描述Si4438 设备为高性能低电流的无线 ISM 收发器，可覆盖次千兆赫波段。
SI1023X_08资料
Vishay SiliconixSi1023XDual P-Channel 20-V (D-S) MOSFETFEATURES•Halogen-free Option Available•TrenchFET ® Power MOSFET: 1.8 V Rated •Very Small Footprint •High-Side Switching •Low On-Resistance: 1.2 Ω •Low Threshold: 0.8 V (typ.) •Fast Switching Speed: 14 ns • 1.8 V Operation•Gate-Source ESD Protected: 2000 VBENEFITS•Ease in Driving Switches •Low Offset (Error) Voltage •Low-Voltage Operation •High-Speed Circuits•Low Battery Voltage OperationAPPLICATIONS•Drivers: Relays, Solenoids, Lamps, Hammers, Displays,Memories •Battery Operated Systems •Power Supply Converter Circuits•Load/Power Switching Cell Phones, PagersPRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (mA)- 201.2 at V GS = - 4.5 V- 3501.6 at V GS = - 2.5 V - 3002.7 at V GS = - 1.8 V- 150Notes:a. Surface Mounted on FR4 board.b. Pulse width limited by maximum junction temperature.ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise notedParameterSymbol 5 sSteady State Unit Drain-Source Voltage V DS- 20VGate-Source VoltageV GS± 6Continuous Drain Current (T J = 150 °C)a T A = 25 °C I D - 390- 370mAT A = 85 °C- 280- 265Pulsed Drain Current bI DM - 650Continuous Source Current (Diode Conduction)a I S- 450- 380Maximum Power Dissipation aT A = 25 °C P D 280250mW T A = 85 °C145130Operating Junction and Storage Temperature Range T J , T stg - 55 to 150°C Gate-Source ESD Rating (HBM, Method 3015) ESD2000VVishay SiliconixSi1023XNotes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.b. Guaranteed by design, not subject to production testing.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.SPECIFICATIONS T J = 25 °C, unless otherwise notedParameter Symbol est Conditions Min.Typ.Max.UnitStaticGate Threshold Voltage V GS(th) V DS = V GS , I D = - 250 µA - 0.45 V Gate-Body LeakageI GSS V DS = 0 V , V GS = ± 4.5 V ± 1 ± 2µA Zero Gate Voltage Drain Current I DSS V DS = - 16 V , V GS = 0 V- 0.3- 100nA V DS = - 16 V , V GS = 0 V , T J = 85 °C- 5µAOn-State Drain Current a I D(on) V DS = - 5 V, V GS = - 4.5 V - 700mADrain-Source On-State Resistance aR DS(on) V GS = - 4.5 V, I D = - 350 mA 0.8 1.2ΩV GS = - 2.5 V, I D = - 300 mA 1.2 1.6V GS = - 1.8 V, I D = - 150 mA 1.8 2.7Forward T ransconductance a g fs V DS = - 10 V , I D = - 250 mA 0.4 S Diode Forward Voltage a V SDI S = - 150 mA, V GS = 0 V- 0.8- 1.2V Dynamic bTotal Gate Charge Q g V DS = - 10 V , V GS = - 4.5 V , I D = - 250 mA1500 pC Gate-Source Charge Q gs 150 Gate-Drain Charge Q gd 450Turn-On Time t d(on) V DD = -10 V , R L = 47 ΩI D ≅ - 200 mA, V GEN = - 4.5 V , R G = 10 Ω 14nsTurn-Off Timet d(off)46Output Characteristics Transfer CharacteristicsVishay SiliconixSi1023XTYPICAL CHARACTERISTICS T A = 25 °C, unless otherwise notedVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?71169.GSSGSSDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
MXT8234中文手册
1、特点z完美的立体声D/A转换系统：插值，D/A，模拟输出滤波z24位转换z96 dB动态范围z-88 dB的THD+Nz低时钟抖动灵敏度z单+5V电源供电z片上数字去加重功能z防冲击技术z功能上与CS4334兼容2、功能描述MXT8234系列是完美的立体声数模输出系统，在一个8脚封装中包含了插值、1位D/A转换和模拟输出滤波功能。
MXT8234支持主流的音频数据接口格式，并且不同器件的区别仅在于它们所支持的接口类型不同。
MXT8234是基于Delta-Sigma调制的转换器，其中的调制器输出用来控制一个超线性模拟低通滤波器的参考电压输入。
这种结构允许仅仅通过改变主时钟频率就可以在2kHz到100kHz范围内任意调节采样率。
MXT8234系列转换器均包含片上数字去加重功能。
片上去加重功能采用+5V电源供电，并且仅需要很少的支持电路。
这些特点对于置顶盒、DVD播放器、SVCD播放器和A/V接收机来说是非常理想的。
MXT8234功能框图3、特点和参数（在指定的工作条件下，所有的最小/最大值是有保证的。
典型性能指标是在理论工作电压和T A=25℃的条件下测试得到的。
）z指定工作条件（AGND=0V；所有电压都是相对于地的。
）参数 符号 最小 理论 最大 单位直流电源 VA 4.75 5.0 5.5 V工作环境温度（已加电） -KS -BS/-DS T A-10 - +70-40 - +85℃℃z极限工作条件（AGND=0V；所有电压都是相对于地的。
）参数 符号 最小 最大 单位 直流电源 VA -0.3 6.0 V 输入电流（除电源外） I in- ±10 mA 数字输入电压 V IND-0.3 VA+0.4 V 工作环境温度（已加电） T A-55 125 ℃ 存储温度 T stg-65 150 ℃● 模拟参数（满量程输出正弦波，997Hz；测试负载，RL＝10kΩ，CL＝10pF（见图1）。
MAX823SEXK中文资料
MAX823SExKRev. ARELIABILITY REPORTFORMAX823SExKPLASTIC ENCAPSULATED DEVICESAugust 2, 2003MAXIM INTEGRATED PRODUCTS120 SAN GABRIEL DR.SUNNYVALE, CA 94086Written byReviewed byJim Pedicord Bryan J. Preeshl Quality Assurance Quality Assurance Reliability Lab Manager Executive DirectorConclusionThe MAX823S successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.Table of ContentsI. ........Device Description V. ........Quality Assurance InformationII. ........Manufacturing Information VI. .......Reliability EvaluationIII. .......Packaging InformationIV. .......Die Information ......AttachmentsI. Device DescriptionA. GeneralThe MAX823S microprocessor (µP) supervisory circuit combines reset output, watchdog, and manual reset input functions in 5-pin SOT23 and SC70 packages. It significantly improve system reliability and accuracy compared to separate ICs or discrete components. The MAX823S is specifically designed to ignore fast transients on V CC.The MAX823S has a eset threshold voltage of 2.93V. The device has an active-low reset output, which is guaranteed to be in the correct state for V CC down to 1V. The MAX823 offers a watchdog input and manual reset input..B. Absolute Maximum RatingsItem RatingVCC -0.3V to +6.0VAll Other Pins -0.3V to (VCC + 0.3V)Input Current, All Pins Except RESET and RESET 20mAOutput Current, RESET, RESET 20mAOperating Temperature RangeMAX823SEXK. -40°C to +85°CMAX823SEUK -40°C to +125°CStorage Temperature Range -65°C to +150°CLead Temperature (soldering, 10s) +300°CContinuous Power Dissipation (TA = +70°C)5-Pin SOT23 571mW5-Pin SC70 247mWDerates above +70°C5-Pin SOT23 7.1mW/°C5-Pin SC70 3.1mW/°CII. Manufacturing InformationA. Description/Function: 5-Pin Microprocessor Supervisory Circuits With Watchdog Timer and Manual ResetB. Process: B12 (Standard 1.2 micron silicon gate CMOS)C. Number of Device Transistors: 607D. Fabrication Location: California, USAE. Assembly Location: Malaysia or ThailandF. Date of Initial Production: January, 1997III. Packaging InformationA. Package Type: 5-Lead SOT23 5-Lead SC70B. Lead Frame: Copper Alloy 42C. Lead Finish: Solder Plate Solder PlateD. Die Attach: Silver-Filled Epoxy Non-Conductive EpoxyE. Bondwire: Gold (1.0 mil dia.) Gold (1.0 mil dia.)F. Mold Material: Epoxy with silica filler Epoxy with silica fillerG. Assembly Diagram: Buildsheet # 05-1601-0010 Buildsheet # 05-1601-0111H. Flammability Rating: Class UL94-V0 Class UL94-V0I. Classification of Moisture Sensitivityper JEDEC standard JESD22-112: Level 1Level 1IV. Die InformationA. Dimensions: 42 x 36 milsB. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)C. Interconnect: Aluminum/Si (Si = 1%)D. Backside Metallization: NoneE. Minimum Metal Width: 1.2 microns (as drawn)F. Minimum Metal Spacing: 1.2 microns (as drawn)G. Bondpad Dimensions: 5 mil. Sq.H. Isolation Dielectric: SiO2I. Die Separation Method: Wafer SawV. Quality Assurance InformationA. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations)Bryan Preeshl (Executive Director)Kenneth Huening (Vice President)B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.0.1% For all Visual Defects.C. Observed Outgoing Defect Rate: < 50 ppmD. Sampling Plan: Mil-Std-105DVI. Reliability EvaluationA. Accelerated Life TestThe results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows:λ = 1 = 1.83 (Chi square value for MTTF upper limit)MTTFλ = 3.39 x 10-9λ = 3.39 F.I.T. (60% confidence level @ 25°C)This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5033) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1M).B. Moisture Resistance TestsMaxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85°C/85%RH testing is done per generic device/package family once a quarter.C. E.S.D. and Latch-Up TestingThe MS04-3 die type has been found to have all pins able to withstand a transient pulse of ±1500V per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA.Table 1Reliability Evaluation Test ResultsMAX823SExKTEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OFIDENTIFICATION PACKAGE SIZE FAILURES Static Life Test (Note 1)Ta = 135°C DC Parameters 320 0Biased & functionalityTime = 192 hrs.Moisture Testing (Note 2)Pressure Pot Ta = 121°C DC Parameters SOT23 77 0P = 15 psi. & functionality SC70 77 0RH= 100%Time = 168hrs.85/85 Ta = 85°C DC Parameters 77 0RH = 85% & functionalityBiasedTime = 1000hrs.Mechanical Stress (Note 2)Temperature -65°C/150°C DC Parameters 77 0Cycle 1000 Cycles & functionalityMethod 1010Note 1: Life Test Data may represent plastic DIP qualification lots.Note 2: Generic Package/Process dataAttachment #1TABLE II. Pin combination to be tested. 1/ 2/1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where V PS1 is V DD , V CC , V SS , V BB , GND, +V S, -V S , V REF , etc). 3.4 Pin combinations to be tested. a.Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V SS1, or V SS2 or V SS3 or V CC1, or V CC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open.c.Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except V PS1 3/ All V PS1 pins 2. All input and output pinsAll other input-output pinsMil Std 883DMethod 3015.7Notice 8TERMINAL BTERMINAL APROBE(NOTE 6) R = 1.5k Ω C = 100pf。
Si8239x隔离门驱动器用户指南说明书
UG505: Si8239x-EVB User's Guide The Si8239x isolated gate drivers are ideal for driving power switches used in a wide va-riety of power supply, inverter, and motor control applications, offering longer service life and dramatically higher reliability compared to opto-coupled gate drivers. The Si8239x isolated gate drivers utilize Skyworks' proprietary silicon isolation technology supporting up to 5 kVRMS withstand voltage per UL1577 and VDE0884. This technology enables industry-leading common-mode transient immunity (CMTI), tight timing specifications, reduced variation with temperature and age, better part-to-part matching, and very high reliability. It also offers unique features, such as driver shutdown on UVLO fault and precise dead time programmability. Driver outputs can be grounded to the same or separate grounds or connected to a positive or negative voltage.The extended range inputs (2.5 to 5.5 V) are available in individual control input(Si82390/1/5/6/7) or PWM input (Si82394/8) configurations. High integration, low propa-gation delay, small installed size, flexibility, and cost-effectiveness make the family ideal for a wide range of isolated MOSFET/IGBT gate drive applications.The Si8239x evaluation board allows designers to evaluate Skyworks' Si8239x family of ISOdrivers. Screw terminals are provided to allow for quick evaluation of the devices’key parameters. Test points are also included on each of the device’s pins to accommo-date direct connection to the designer’s end system. In addition, jumpers are included to allow for manual setting of the devices input as well as the boot strap circuitry on the output if desired. The boards come populated with the Si82394 version of the family. However, JP2 (VIB) is still provided should the user wish to replace the Si82394 with one of the dual input versions of the device. Visit Skyworks' Isolated Gate Drivers web page for more information. The product data sheet and numerous application notes can be referenced to help facilitate designs.KEY FEATURES•Screw terminals for easy connection to power supplies•Test points on each pin for easy connection to test equipment•Boot strap circuitry selectable by jumper •Jumpers for easy manual control of input signals1. Ordering GuideTable 1.1. Si8239x Evaluation Board Ordering Guide2. Kit ContentsThe Si8239x Evaluation Kit contains the following items:•Si8239x-based evaluation board shown in the figure below•Si82394, PWM input, 4 A, 5 kVrms High-Side/Low-Side ISOdriverFigure 2.1. Si8239x Evaluation Board FrontFigure 2.2. Si8239x Evaluation Board Back2.1 Required EquipmentThe following equipment is required to demonstrate the evaluation board:• 1 digital multimeter• 1 dc power supply 15 Vdc, 0–100 mA or equivalent)• 1 dc power supply 3.3 Vdc, 0–100 mA or equivalent)•Si8239x Evaluation Board (board under test)•Si8239x Evaluation Board Test Procedure (this document)UG505: Si8239x-EVB User's Guide • Si8239x ISOdriver Board Setup and Test3. Si8239x ISOdriver Board Setup and Test3.1 DC Supply Configuration1.Verify the 3.3 V power supply output before connecting to EVB. Disable supply output before connecting to evaluation board.2.Connect the positive rail of the3.3 V supply to J1 pin 1 (labeled VDDI) or to TP1.3.Connect the negative rail of the 3.3 V supply to J1 pin 2 (labeled GNDI) or TP4.4.Turn ON the 3.3 V supply.5.Verify the 15 V power supply output before connecting to EVB. Disable supply output before connecting to evaluation board.6.Connect the positive rail of the 15 V supply to J2 pin 3 (labeled VDDA) or to TP9.7.Connect the negative rail of the 15 V supply to J2 pin 1 (labeled GNDA) or TP11.8.Turn ON the 15 V supply.3.2 Test Channel A1.Add shunt between pins 1 and 2 on JP1 and JP3.ing the DMM verify a logic 1 on TP10 with respect to TP11 (POS on TP10, NEG on TP11).3.Move shunt to pins 2 and 3 on JP1.ing DMM, verify logic 0 on TP10 with respect to TP11.3.3 Test Channel B1.Turn off 15 V supply.2.Move the 15 V positive rail to J3 pin 3 or TP14.3.Move the 15 V negative rail to J3 pin 1 or TP15.4.Turn on 15 V supply.ing DMM, verify a logic 1 on TP13 with respect to TP15.6.Move the shunt on JP1 back to pins 1–2.ing DMM, verify a logic 0 on TP13 with respect to TP15.Note: A signal generator can be used to supply a clock signal to JP1 pin 2 instead of using the shunt.4. Si8239x-EVB Schematics, Silkscreens, and LayoutFigure 4.1. Si8239x Evaluation Board SchematicFigure 4.2. Si8239x-EVB Primary SilkscreenFigure 4.3. Si8239x-EVB Secondary SilkscreenFigure 4.4. Si8239x-EVB Primary SideFigure 4.5. Si8239x-EVB Layer 2 Ground PlaneFigure 4.6. Si8239x-EVB Layer 3 Power PlaneFigure 4.7. Si8239x-EVB Secondary SideUG505: Si8239x-EVB User's Guide • Bill of Materials5. Bill of MaterialsTable 5.1. Si8239x-EVB Bill of MaterialsCopyright © 2022 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by thecustomer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED,STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSL Y DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESUL T FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters.Skyworks, the Skyworks symbol, Sky5®, SkyOne®, SkyBlue™, Skyworks Green™, Clockbuilder®, DSPLL®, ISOmodem®, ProSLIC®, and SiPHY® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.SkyworksSolutions,Inc.|Nasdaq:SWKS|*********************|Portfolio Quality/qualitySupport & Resources/support。
si823x中文数据手册
0.5 和 4.0 安 培 I S O D R I V E R （ 2. 5 和 5
特性
KVRMS）
一个封装内两个完全隔离的驱动 60 ns 传送延时 （最大） 器 独立 HS 和 LS 输入或 PWM 输入 最高 5 kVRMS 输入到输出隔离 版本 最高 1500 VDC 峰值驱动器到驱动 瞬态抑制 >45 kV/µs
宽体 SOIC-16 窄体 LGA-14
SOIC-16
应用
供电系统 电机控制系统 直流到直流隔离供电
照明控制系统 等离子显示器 太阳能和工业变换器
安全认证
UL 1577 认证
1
VDE 认证合规
60747-5-5 （VDE 0884 第 5 部分） EN 60950-1 （强化绝缘）
IEC
分钟内最多 5000 Vrms
CSA component notice 5A 认证
IEC
60950-1, 61010-1, 60601-1 CQC 认证 （强化绝缘） GB4943.1
描述
Si823x 隔离驱动器系列将两个独立、隔离的驱动器集成到一个封装内。 Si8230/1/3/4 是高侧 / 低侧驱动器，而 Si8232/5/6/7/8 是双驱动器。 还提 供峰值输出电流 0.5 A (Si8230/1/2/7) 和 4.0 A (Si8233/4/5/6/8) 的版本。 所有驱动器的最大供电电压为 24 V。 Si823x 驱 动 器 采 用 Silicon Labs 自 主 研 发 的 硅 隔 离 技 术，提 供 符 合 UL1577 的 5 kVRMS 耐受电压以及 60 ns 快速传送时间。 驱动器输出可连 接到相同或独立的地线进行接地，或者连接到正或负电压。 单个控制输入 (Si8230/2/3/5/6/7/8) 或 PWM 输入 (Si8231/4) 配置提供滞后 >400 mV 的 TTL 级兼容输入。 高度的集成、低传送延时、较小的外形及其灵活性和成 本效益性使 Si823x 系列非常适合 MOSFET/IGBT 门驱动器隔离应用。
Si875x数据手册说明书
Si8751/52 Data SheetIsolated FET Driver with Pin Control or Diode Emulator InputsThe Si875x enables new pathways to the creation of custom Solid State Relay (SSR) configurations. The Si875x integrates robust isolation technology with an SSR FET driver. A floating secondary side dc power supply is unnecessary as the product generates its own self-contained gate drive output voltage. When combined with a customer-selected external FET, a complete Solid State Relay is formed, allowing customers to optimize their system for cost, PCB area, power, On-Resistance, and thermal performance.Customers have a choice of digital input control (Si8751) or diode emulation control(Si8752) to best suit their application. The Si875x integrates versatile outputs that support driving AC or DC load configurations.The Si875x eliminates the need for bulky mechanical relays which can be difficult to assem-ble onto PCBs and add switching noise to the system.Traditional SSRs integrate optocoupler-style LED inputs, which limit the operating tempera-ture range of the solution. The Si875x experiences no such limitation and can support full industrial and automotive temperature ranges with increased stability and longer life.The Si875x drives FET gates with a nominal 10 V using as little as 1 mA input current. Increasing the input current to 10 mA enables turn-on times as fast as 94 μs. Input side voltages on the Si8751 are flexible from 2.25 V to 5.5 V supporting seamless connectionto low-power controllers. The Si875x devices provide an Active Miller Clamp to prevent the unintended turn-on of the external FET when a high dV/dt is present on the FET’s drain.The Si875x is qualified to the AEC-Q100 standard, making it suitable for automotive applica-tions. Further, its 2.5 KVrms isolation rating forms the basis for full certification to UL, CSA, VDE, and CQC.Applications include mechanical relay, photo switch, or SSR replacement in motor control, valve control, HVAC relay, automotive, charging, battery monitoring, ac mains line switching, and more.The Si8751 and Si8752 come in ROHS-compliant SOIC-8 packaging, providing a compact, industry-standard footprint and generous margin to creepage and clearance requirements.KEY FEATURES•Drives user-selected external FETs •Choice of digital input control (Si8751) or diode emulation control (Si8752)•Internally generated secondary side power supply•10 V output with 1 mA input current •As fast as 82 μs turn-on time and 46 us turn-off time•Active Miller Clamp to prevent unintended turn-on and reduce inductive chatter•Supports AC or DC load switching •2.5 KVrms isolation rating•UL, CSA, VDE, and CQC certifications •AEC-Q100 qualified•Industrial –40 to 105 °C or Automotive –40 to 125 °C temperature ranges •ROHS-compliant SOIC-8 PackageAPPLICATIONS•Motor Controls•Valve Controls•HVAC Relays•HEV/EV Automotive Charging •Battery Monitoring•AC Mains Line Switching1. Ordering GuideTable 1.1. Si8751/2 Ordering Guide2. System OverviewFigure 2.1. Si8751 Block DiagramFigure 2.2. Si8752 Block DiagramThe operation of an Si875x channel is analogous to that of an optocoupler and gate driver, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si875x channel is shown in the figure below.A BFigure 2.3. Simplified Channel DiagramA channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the result to outputB via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and better immunity to magnetic fields. See figure below for more details.Input SignalModulation SignalOutput SignalFigure 2.4. Modulation Scheme2.1 Device BehaviorThe following are truth tables for the Si875x family.Table 2.1. Si8751 Truth TableTable 2.2. Si8752 Truth Table2.2 Power Supply Connections (Si8751 Only)The Si8751 requires a 0.1 µF bypass capacitor between VDD and GND. The capacitor should be placed as close as possible to the package. To enhance the robustness of a design, the user may also include a 1 µf capacitor for bulk decoupling as well as a resistor (50–300 Ω) in series with the input if the system is excessively noisy.2.3 TT Pin Description (Si8751 Only)The Si8751 provides a pin to control how much current is consumed by the supply when the input pin is logic high. The more current consumed by the input supply, the faster the output can turn on the external FET. This allows the application designer to optimize the tradeoff between power consumption and switching time.Typically, this pin is connected to the supply ground through a resistor. The greater the value of the resistor, the less current is consumed by the input supply. Values can range from 0 Ω (shorted to ground) to open (TT not connected).In addition to a resistor, a capacitor, typically 0.1 µf, can be placed in parallel to the resistor. This allows the device to draw more current to switch the external FET on quickly yet draw less supply current in the steady state. Total power over time is reduced while maintaining fast switching of the FET.MCAP1GATESOURCEMCAP2Figure 2.5. Si8751 TT Example Figure 2.6. Drive Current vs. Time Using TT with Capacitor2.4 LED Emulator Input (Si8752 Only)Figure 2.8. Diode Emulator Model and I-V CurveThe Si8752 uses input current to achieve the development of power across the isolation barrier. Therefore, the more current provided to the input, the more power is developed on the isolated side of the device. This translates into a faster turn on time of the external FET.This benefit is limited to an input current of about 15 mA. Beyond that, increasing the input current has little effect on the switching time of the external FET.2.5 Output DescriptionThe output of the Si875x device develops a positive voltage on the GATE pin with respect to the SOURCE pin. This voltage is used to turn on a typical field effect transistor (FET). Because power is transmitted across the isolation barrier, no isolated supply is required. This can be used to drive a FET configured as a switch for a dc load. It can also be used to drive a pair of FETs configured as a switch for an ac load. See 3. Applications.2.6 Miller Clamp2.6.1 Miller Clamp DescriptionThe Si875x devices provide a clamping device to prevent unintended turn on of the external FET when a high dV/dt is present on the FET’s drain. To use this feature, a capacitor is connected between the drain(s) of the FET(s) and one of the MCAPx inputs. A sudden, positive slope on this pin will cause the clamp device within the Si875x to activate and provide a low impedance path between the gate and source pins. This will prevent the FET from being unintentionally turned on.The Si875x device provides two miller clamp input pins. This allows for both FET’s to be protected from unintended turn on when the device is used in an AC switch configuration. In this case each drain is connected to an MCAPx input through a capacitor.Connection to a MCAPx pin, and use of the Miller Clamp feature, is optional. The device will function as expected if these pins are left unconnected.2.6.2 Sizing Miller Clamp CapacitorsThe recommended value of the capacitor used to connect the drain of the external FET to the Si875x device is typically 10 pf. If the application has a very large dV/dt and the clamp is not adequately keeping the external FET off, then this capacitor value can be increased up to 100 pf. The voltage rating of the capacitor should be greater than or equal to the peak voltage expected at the drain of the FET. The relationship of the capacitor and the dV/dt is governed by the equation: C = I MC/(dV/dt); where: I MC is the Miller Clamp input current (6mA max, as specified in Electrical Tables), and dV/dt is the expected slew rate.3. ApplicationsThe following examples illustrate typical circuit configurations using the Si8751/52.3.1 DC SSR ExampleThe Si875x device can be used to control a dc load as shown in the following figure:INVDDTTGNDFigure 3.1. Driving an FET for DC Load Including Miller Clamp CapacitorIn this configuration, the Si8751 charges the gate of the external FET; turning it on. This switches on power, supplied by VDC, to the load. The output side circuitry is identical if using the Si8752.3.2 AC SSR ExampleThe Si875x can be used to control power to an ac load using the following circuit:INTTGNDFigure 3.2. Driving FETs for AC Load SwitchingIn this configuration, both FET’s are turned on by the charge delivered by the Si8751. This allows ac current to flow to the load. When the Si875x is turned off, charge is drained form the gates of both FET’s and the ac current is turned off. The output side circuitry is identical if using the Si8752.Si8751/52 Data Sheet • Applications4. Electrical SpecificationsTable 4.1. Electrical Specifications•Automotive: VDD=2.25 to 5.5V; GND=0V; T A=-40 to +125ºC; typical specs at 25ºC; T J=-40 to +150ºC •Industrial: VDD=2.25 to 5.5V; GND=0V; T A=-40 to +105ºC; typical specs at 25ºC; T J=-40 to +150ºC4.1 Test CircuitsThe following figure depicts a common-mode transient immunity test circuit:IsolatedSupplyFigure 4.1. Common-Mode Transient Immunity Test Circuit4.2 Regulatory InformationTable 4.2. Regulatory Information1,2CSAThe Si875x is certified under CSA Component Acceptance Notice 5A. For more details, see Master Contract Number 232873. 60950-1: Up to 125 V RMS reinforced insulation working voltage; up to 600 V RMS basic insulation working voltage.VDEThe Si875x is certified according to VDE 0884-10. For more details, see Certificate 40018443.VDE 0884-10: Up to 630 V peak for basic insulation working voltage.ULThe Si875x is certified under UL1577 component recognition program. For more details, see File E257455.Rated up to 2500 V RMS isolation voltage for basic protection.CQCThe Si875x is certified under GB4943.1-2011. For more details, see Certificate CQC17001177960.Rated up to 125 V RMS reinforced insulation working voltage; up to 600 V RMS basic insulation working voltage.1.Regulatory Certifications apply to2.5 kV RMS rated devices which are production tested to3.0 kV RMS for 1 sec.2.For more information, see 1. Ordering Guide.Table 4.3. Insulation and Safety-Related SpecificationsTable 4.4. IEC 60664-1 RatingsTable 4.5. VDE 0884 Insulation Characteristics1Table 4.6. IEC Safety Limiting Values1Table 4.7. Thermal CharacteristicsFigure 4.2. Thermal Derating Curve for Safety Limiting Current (Si8751)Figure 4.3. Thermal Derating Curve for Safety Limiting Current (Si8752)Table 4.8. Absolute Maximum Ratings14.3 Typical Operating CharacteristicsFigure 4.4. Si8751 Typical Gate Voltage vs. Temperatureand TT Figure 4.5. Si8752 Typical Gate Voltage vs. Temperatureand Anode CurrentFigure 4.6. Si8751 Typical Turn-On Time vs. Temperature and TT with 100 pF Load (50% of Output)Figure 4.7. Si8752 Typical Turn-On Time vs. Temperature and Anode Current with 100 pF Load (50% of Output)Figure 4.8. Si8751 Typical Turn-On Time vs. Temperature and TT with 100 pF Load (90% of Output)Figure 4.9. Si8752 Typical Turn-On Time vs. Temperature and Anode Current with 100 pF Load (90% of Output)Figure 4.10. Si8751 Typical Turn-On Time vs. Capacitanceand TT (50% of Output)Figure 4.11. Si8752 Typical Turn-On Time vs. Capacitance and Anode Current (50% of Output)Figure 4.12. Si8751 Typical Turn-On Time vs. Capacitanceand TT (90% of Output)Figure 4.13. Si8752 Typical Turn-On Time vs. Capacitance and Anode Current (90% of Output)5. Pin Descriptions5.1 Si8751 Pin Descriptions12345678SOURCEMCAP2MCAP1GATEGND TT VDD Si8751IN Figure 5.1. Pin Assignments Si8751Table 5.1. Si8751 Pin Descriptions5.2 Si8752 Pin Descriptions12345678GATEMCAP2MCAP1SOURCECATHODE ANODE NC Si8752NC Figure 5.2. Pin Assignments Si8752Table 5.2. Si8752 Pin Descriptions6. Package Outlines6.1 Package Outline: 8-Pin Narrow Body SOICThe figure below illustrates the package details for the Si875x in an 8-pin narrow-body SOIC package. The table below lists the values for the dimensions shown in the illustration.Figure 6.1. 8-Pin Narrow Body SOIC PackageTable 6.1. 8-Pin Narrow Body SOIC Package Diagram Dimensions7. Land Patterns7.1 Land Pattern: 8-Pin Narrow Body SOICThe figure below illustrates the recommended land pattern details for the Si875x in an 8-pin narrow-body SOIC. The table below lists the values for the dimensions shown in the illustration.Figure 7.1. 8-Pin Narrow Body SOIC Land PatternTable 7.1. 8-Pin Narrow Body SOIC Land Pattern Dimensions8. Top Markings8.1 8-Pin Narrow Body SOICTable 8.1. Top Marking ExplanationLine 1 Marking:Customer Part Number Si875 = ISOdriver product seriesX: 1 = Digital input, 2 = LED emulator inputA: ReservedV: B = 2.5 kV isolation ratingLine 2 Marking:TTTTTT = Mfg code Manufacturing Code from Assembly Purchase Order form.Line 3 Marking:YY = YearWW = Work week Assigned by the Assembly House. Corresponds to the year and workweek of the mold date.9. Revision HistoryRevision A, July 2022•Added Agile data sheet revision in footerRevision 1.0, December 2017•Significant edits with production electrical specifications and load switching diagram.Revision 0.5, September 2016•Significant edits with production electrical specifications.Revision 0.1, May 2016•Initial revision.Table of Contents1. Ordering Guide (2)2. System Overview (3)2.1 Device Behavior (4)2.2 Power Supply Connections (Si8751 Only) (5)2.3 TT Pin Description (Si8751 Only) (5)2.4 LED Emulator Input (Si8752 Only) (5)2.5 Output Description (6)2.6 Miller Clamp (6)2.6.1 Miller Clamp Description (6)2.6.2 Sizing Miller Clamp Capacitors (6)3. Applications (7)3.1 DC SSR Example (7)3.2 AC SSR Example (7)4. Electrical Specifications (8)4.1 Test Circuits (10)4.2 Regulatory Information (10)4.3 Typical Operating Characteristics (16)5. Pin Descriptions (19)5.1 Si8751 Pin Descriptions (19)5.2 Si8752 Pin Descriptions (20)6. Package Outlines (21)6.1 Package Outline: 8-Pin Narrow Body SOIC (21)7. Land Patterns (23)7.1 Land Pattern: 8-Pin Narrow Body SOIC (23)8. Top Markings (24)8.1 8-Pin Narrow Body SOIC (24)9. Revision History (25)Copyright © 2022 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. 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SI8420资料
2500 VRMS isolation Transient Immunity
3.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.2. Eye Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4. Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1. Supply Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.2. Input and Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.3. RF Radiated Emissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.4. RF Immunity and Common Mode Transient Immunity . . . . . . . . . . . . . . . . . . . . . . . 22 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7. Package Outline: 8-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
ADM823 ADM824 ADM825 数据手册说明书
Supervisory Circuits with Watchdog andManual Reset in 5-Lead SC70 and SOT-23 Data Sheet ADM823/ADM824/ADM825Rev. D Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, N orwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2004–2013 Analog Devices, Inc. All rights reserved. Technical Support FEATURESPrecision 2.5 V to 5 V power supply monitor7 reset threshold options: 2.19 V to 4.63 V140 ms (minimum) reset timeoutWatchdog timer with 1.6 sec timeout (ADM823, ADM824) Manual reset input (ADM823, ADM825)Push-pull output stagesRESET (ADM823)RESET, RESET (ADM824/ADM825)Low power consumption: 5 µAGuaranteed reset output valid to V CC = 1 VPower supply glitch immunitySpecified over automotive temperature range5-lead SC70 and SOT-23 packagesAPPLICATIONSMicroprocessor systemsComputersControllersIntelligent instrumentsPortable equipment FUNCTIONAL BLOCK DIAGRAM4534-1Figure 1.GENERAL DESCRIPTIONThe ADM823/ADM824/ADM825 are supervisory circuits that monitor power supply voltage levels and code execution integrity in microprocessor-based systems. In addition to providing power-on reset signals, an on-chip watchdog timer can reset the microprocessor if it fails to strobe within a preset timeout period. A reset signal can also be asserted by an external push-button, through a manual reset input. The three parts feature different combinations of watchdog input, manual reset input, and output stage configuration, as shown in Table 1. These parts are available in a choice of seven reset threshold options ranging from 2.19 V to 4.63 V. The reset and watchdog timeout periods are fixed at 140 ms (minimum) and 1.6 sec (typical), respectively.The ADM823/ADM824/ADM825 are available in 5-lead SC70 and SOT-23 packages and typically consume only 5 µA, making them suitable for use in low power, portable applications.ADM823/ADM824/ADM825Data SheetRev. D | Page 2 of 12TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Absolute Maximum Ratings ............................................................ 5 ESD Caution .................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ............................................. 7 Circuit Description ........................................................................... 9 Reset Output ..................................................................................9 Manual Reset Input .......................................................................9 Watchdog Input .............................................................................9 Applications Information .............................................................. 10 Watchdog Input Current ........................................................... 10 Negative-Going V CC Transients ................................................ 10 Ensuring Reset Valid to V CC = 0 V ........................................... 10 Watchdog Software Considerations ......................................... 10 Outline Dimensions ....................................................................... 11 Ordering Guide .. (11)REVISION HISTORY7/13—Rev. C to Rev. DChange to Figure 16 .......................................................................... 9 Updated Outline Dimensions ........................................................ 11 10/10—Rev. B to Rev. CUpdated Outline Dimensions ....................................................... 11 Changes to Ordering Guide .......................................................... 11 5/08—Rev. A to Rev. BChanges to General Description Section ...................................... 1 Changes to Table 4 ............................................................................ 6 Changes to Ordering Guide .......................................................... 11 2/07—Rev. 0 to Rev. AUpdated Format .................................................................. U niversal Changes to Ordering Guide .......................................................... 11 10/04—Revision 0: Initial VersionData Sheet ADM823/ADM824/ADM825 SPECIFICATIONSV CC = 4.75 V to 5.5 V for ADM82xL, V CC = 4.5 V to 5.5 V for ADM82xM, V CC = 3.15 V to 3.6 V for ADM82xT, V CC = 3 V to 3.6 Vfor ADM82xS, V CC = 2.7 V to 3.6 V for ADM82xR, V CC = 2.38 V to 2.75 V for ADM82xZ, V CC = 2.25 V to 2.75 V for ADM82xY,T A = T MIN to T MAX, unless otherwise noted.Rev. D | Page 3 of 12ADM823/ADM824/ADM825 Data SheetRev. D | Page 4 of 12Data SheetADM823/ADM824/ADM825Rev. D | Page 5 of 12ABSOLUTE MAXIMUM RATINGST A = 25°C, unless otherwise noted.Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ESD CAUTIONADM823/ADM824/ADM825Data SheetRev. D | Page 6 of 12PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONSV CCWDI04534-002V CCWDI04534-00304534-004Figure 2. ADM823 Pin Configuration Figure 3. ADM824 Pin ConfigurationFigure 4. ADM825 Pin ConfigurationData SheetADM823/ADM824/ADM825Rev. D | Page 7 of 12TYPICAL PERFORMANCE CHARACTERISTICS04534-005TEMPERATURE (°C)120–40–2020406080100I C C (µA )10.09.09.58.07.58.57.06.56.05.55.04.54.03.5Figure 5. Supply Current vs. Temperature04534-006V CC (V)5.50 2.01.51.00.52.53.0 3.54.0 4.55.0I C C (µA )80707560556550454035302010251550Figure 6. Supply Current vs. Supply Voltage04534-007TEMPERATURE (°C)120–4040200–206080100N O R M A L I Z E D R E S E T T H R E S H O LD (V )1.051.031.041.011.001.020.990.980.970.960.95Figure 7. Normalized Reset Threshold vs. Temperature 04534-008TEMPERATURE (°C)120–4040200–206080100V C C T O R E S E T D E L A Y (µs )100809060507040302010Figure 8. Reset Comparator Propagation Delay vs. Temperature (V CC Falling)04534-009TEMPERATURE (°C)120–4040200–206080100M A N U A L R E S E T T O R E S E T D E L A Y(n s )340300320260240280220200180160140120100Figure 9. Manual Reset to Reset Propagation Delay vs. Temperature(ADM823/ADM825)04534-010TEMPERATURE (°C)120–4040200–206080100R E S E T T I M E O U T P E R IO D (m s )250230240210200220190180170Figure 10. Reset Timeout Period vs. TemperatureADM823/ADM824/ADM825Data SheetRev. D | Page 8 of 1204534-011TEMPERATURE (°C)120–40–2020406080100W A T C H D O G T I M E O U T P E R I O D (s )2.01.61.81.41.20.81.00.60.40.2Figure 11. Watchdog Timeout Period vs. Temperature(ADM823/ADM824)04534-012OVERDRIVE VOD (mV)100010100M A X I M U M V C C T R A N S I E N T D U R A T I O N (µs )160120140100608040200Figure 12. Maximum V CC Transient Duration vs. Reset Threshold Overdrive04534-013TEMPERATURE (°C)100–5050M R M I N I M U M P U L S E W I D TH (n s )190160180170150130140120110100Figure 13. Manual Reset Minimum Pulse Width vs. Temperature(ADM823/ADM825)04534-014TEMPERATURE (°C)160–401011060M I N I M U M P U L S E W I D T H (ns )Figure 14. Watchdog Input Minimum Pulse Width vs. Temperature(ADM823/ADM824)Data SheetADM823/ADM824/ADM825Rev. D | Page 9 of 12CIRCUIT DESCRIPTIONThe ADM823/ADM824/ADM825 provide microprocessor supply voltage supervision by controlling the reset input of the microprocessor. Code execution errors are avoided duringpower-up, power-down, and brownout conditions by asserting a reset signal when the supply voltage is below a preset threshold. Errors are also avoided by allowing supply voltage stabilization with a fixed timeout reset pulse after the supply voltage rises above the threshold. In addition, problems with microprocessor code execution can be monitored and corrected with a watchdog timer (ADM823/ADM824). By including watchdog strobe instructions in microprocessor code, a watchdog timer candetect whether the microprocessor code breaks down or becomes stuck in an infinite loop. If this happens, the watchdog timer asserts a reset pulse that restarts the microprocessor in a known state. If the user detects a problem with the system’s operation, a manual reset input is available (ADM823/ADM825) to reset the microprocessor with an external push-button, for example.RESET OUTPUTThe ADM823 features an active low, push-pull reset output, and the ADM824/ADM825 feature dual active low and active high push-pull reset outputs. For active low and active high outputs, the reset signal is guaranteed to be logic low and logic high, respectively, for V CC ≥ 1 V .The reset output is asserted when V CC is below the resetthreshold (V TH ), when MR is driven low, or when WDI is not serviced within the watchdog timeout period (t WD ). Reset remains asserted for the duration of the reset active timeout period (t RP ) after V CC rises above the reset threshold, after MR transitions from low to high, or after the watchdog timer times out. Figure 15 illustrates the behavior of the reset outputs.VV V V CCRESETRESET04534-018Figure 15. Reset Timing DiagramMANUAL RESET INPUTThe ADM823/ADM825 feature a manual reset input (MR ) which, when driven low, asserts the reset output. When MR transitions from low to high, reset remains asserted for the duration of the reset active timeout period before deasserting. The MR input has a 52 kΩ internal pull-up so that the input is always high when unconnected. An external push-button switch can be connected between MR and ground so that the user can generate a reset. Debounce circuitry for this purpose is integrated on chip. Noise immunity is provided on the MR input and fast, negative-going transients of up to 100 ns (typical) are ignored. A 0.1 µF capacitor between MR and ground provides additional noise immunity.WATCHDOG INPUTThe ADM823/ADM824 feature a watchdog timer that monitors microprocessor activity. A timer circuit is cleared with every low-to-high or high-to-low logic transition on the watchdog input pin (WDI), which detects pulses as short as 50 ns. If the timer counts through the preset watchdog timeout period (t WD ), reset is asserted. The microprocessor is required to toggle the WDI pin to avoid being reset. Failure of the microprocessor to toggle WDI within the timeout period, therefore, indicates a code execution error, and the reset pulse generated restarts the microprocessor in a known state.In addition to logic transitions on WDI, the watchdog timer is also cleared by a reset assertion due to an undervoltage condi-tion on V CC or byMR being pulled low. When reset is asserted, the watchdog timer is cleared and does not begin counting again until reset is deasserted. The watchdog timer can be disabled by leaving WDI floating or by three-stating the WDI driver.V V V V CCWDIRESET04534-021Figure 16. Watchdog Timing DiagramADM823/ADM824/ADM825Data SheetRev. D | Page 10 of 12APPLICATIONS INFORMATIONWATCHDOG INPUT CURRENTTo minimize the watchdog input current (and minimize overall power consumption), leave WDI low for the majority of the watchdog timeout period. When driven high, WDI can draw as much as 160 µA. Pulsing WDI low-high-low at a low duty cycle reduces the effect of the large input current. When WDI is unconnected, a window comparator disconnects the watchdog timer from the reset output circuitry so that reset is not asserted when the watchdog timer times out.NEGATIVE-GOING V CC TRANSIENTSTo avoid unnecessary resets caused by fast power supplytransients, the ADM823/ADM824/ADM825 are equipped with glitch rejection circuitry. The typical performance characteristic in Figure 12 plots V CC transient duration vs. the transient mag-nitude. The curves show combinations of transient magnitude and duration for which a reset is not generated for 4.63 V and 2.93 V reset threshold parts. For example, with the 2.93 Vthreshold, a transient that goes 100 mV below the threshold and lasts 8 µs typically does not cause a reset, but if the transient is any larger in magnitude or duration, a reset is generated. An optional 0.1 µF bypass capacitor mounted close to V CC provides additional glitch rejection.ENSURING RESET VALID TO V CC = 0 VBoth active low and active high reset outputs are guaranteed to be valid for V CC as low as 1 V . However, by using an external resistor with push-pull configured reset outputs, valid outputs for V CC as low as 0 V are possible. For an active low reset output, a resistor connected between RESET and ground pulls the output low when it is unable to sink current. For an active high reset output, a resistor connected between RESET and V CC pulls the output high when it is unable to source current. A large resist-ance such as 100 kΩ should be used so that the reset output is not overloaded when V CC is above 1 V .04534-017Figure 17. Ensuring Reset Valid to V CC = 0 VWATCHDOG SOFTWARE CONSIDERATIONSIn implementing the microprocessor watchdog strobe code, quickly switching WDI low-to-high and then high-to-low(minimizing WDI high time) is desirable for current consumption reasons. However, a more effective way of using the watchdog function can be considered.A low-high-low WDI pulse within a given subroutine prevents the watchdog timing out. However, if the subroutine becomes stuck in an infinite loop, the watchdog cannot detect this cond-ition because the subroutine continues to toggle WDI. A more effective coding scheme for detecting this error involves using a slightly longer watchdog timeout. In the program that calls the subroutine, WDI is set high (see Figure 18). The subroutine sets WDI low when it is called. If the program executes without error, WDI is toggled high and low with every loop of the program. If the subroutine enters an infinite loop, WDI is kept low, the watchdog times out, and the microprocessor is reset.04534-020Figure 18. Watchdog Flow DiagramFigure 19. Typical Application CircuitData SheetADM823/ADM824/ADM825Rev. D | Page 11 of 12OUTLINE DIMENSIONSCOMPLIANT TO JEDEC STANDARDS MO-203-AA072809-A0.100.10Figure 20. 5-Lead Thin Shrink Small Outline Transistor Package [SC70](KS-5)Dimensions shown in millimetersCOMPLIANT TO JEDEC STANDARDS MO-178-AA1.301.150.150.050.200.08MIN11-01-2010-AFigure 21. 5-Lead Small Outline Transistor Package [SOT-23](RJ-5)Dimensions shown in millimetersORDERING GUIDEModel 1Reset Threshold (V) Temperature Range Quantity Package Description Package Option Branding ADM823LYKSZ-R7 4.63 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM823LYRJ-R7 4.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N07 ADM823LYRJZ-R7 4.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M4L ADM823MYKSZ-R7 4.38 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM823MYRJZ-R7 4.38 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M4L ADM823TYKSZ-R7 3.08 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM823TYRJ-R7 3.08 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N07 ADM823TYRJZ-R7 3.08 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M4L ADM823SYKSZ-R7 2.93 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM823SYRJ-R7 2.93 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N07 ADM823SYRJZ-R72.93−40°C to +125°C3k5-Lead SOT-23RJ-5M4LADM823/ADM824/ADM825Data SheetRev. D | Page 12 of 12Model 1Reset Threshold (V) Temperature Range Quantity Package Description Package OptionBranding ADM823RYRJZ-R7 2.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M4L ADM823ZYKSZ-R7 2.32 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM823YYKSZ-R7 2.19 −40°C to +125°C 3k 5-Lead SC70 KS-5 M4L ADM824LYRJZ-REEL7 4.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 L9M ADM824SYKSZ-REEL7 2.93 −40°C to +125°C 3k 5-Lead SC70 KS-5 M8G ADM824RYKSZ-REEL7 2.63 −40°C to +125°C 3k 5-Lead SC70 KS-5 M8G ADM824SYRJZ-REEL7 2.93 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M8G ADM825LYRJ-R7 4.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N09 ADM825LYRJZ-R7 4.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M8H ADM825MYRJ-R7 4.38 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N09 ADM825TYKSZ-R7 3.08 −40°C to +125°C 3k 5-Lead SC70 KS-5 M8H ADM825TYRJ-R7 3.08 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N09 ADM825TYRJZ-R7 3.08 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M8H ADM825SYKSZ-R7 2.93 −40°C to +125°C 3k 5-Lead SC70 KS-5 M8H ADM825SYRJ-R7 2.93 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N09 ADM825SYRJZ-R7 2.93 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M8H ADM825RYRJ-R7 2.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 N09 ADM825RYRJZ-R7 2.63 −40°C to +125°C 3k 5-Lead SOT-23 RJ-5 M8H ADM825ZYKSZ-R72.32−40°C to +125°C3k5-Lead SC70KS-5M8H1Z = RoHS Compliant Part.©2004–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04534-0-7/13(D)。
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目录
章节 页码
1. 顶层模块示意图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. 电气规格 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1. 测试电路 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3. 功能描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1. 典型工作特征 （0.5 安培） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.2. 典型工作特征 （4.0 安培） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3. 系列简介和启动过程中的逻辑运算 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.4. 供电连接 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.5。 功耗散注意事项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.6. 布局注意事项 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.7。 欠压锁定操作 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.8。 可编程死区时间和重叠保护 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 4. 应用 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.1。 高侧 / 低侧驱动器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.2. 双驱动器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.3。 双驱动器及热增强封装 (Si8236) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5. 引脚描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6. 订购指南 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7. 封装外形：16 引脚宽体 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 8. 焊盘图案：16 引脚宽体 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9. 封装外形：16 引脚窄体 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10. 焊盘图案： 16 引脚窄体 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 11. 封装外形： 14 LD LGA (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. 焊盘图案： 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 13. 封装外形： 14 LD LGA 及导热垫 (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 14. 焊盘图案： 14 LD LGA 及导热垫 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 15. 顶部标记 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 15.1. Si823x 顶部标记 （16 引脚宽体 SOIC） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 15.2. 顶部标记说明 （16 引脚宽体 SOIC） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 15.3. Si823x 顶部标记 （16 引脚窄体 SOIC） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 15.4. 顶部标记说明 （16 引脚窄体 SOIC） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 15.5. Si823x 顶部标记 （14 LD LGA） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 15.6. 顶部标记说明 （14 LD LGA） . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 文档修改列表 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 联系信息 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
宽体 SOIC-16 窄体 LGA-14
SOIC-16
应用
供电系统 电机控制系统 直流到直流隔离供电
照明控制系统 等离子显示器 太阳能和工业变换器
安全认证